U.S. patent application number 17/750709 was filed with the patent office on 2022-09-08 for photorelay.
The applicant listed for this patent is Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation. Invention is credited to Tatsuo Tonedachi.
Application Number | 20220285333 17/750709 |
Document ID | / |
Family ID | 1000006351554 |
Filed Date | 2022-09-08 |
United States Patent
Application |
20220285333 |
Kind Code |
A1 |
Tonedachi; Tatsuo |
September 8, 2022 |
PHOTORELAY
Abstract
A photorelay of an embodiment includes a polyimide substrate
having a first surface and a second surface on an opposite side of
the polyimide substrate from the first surface, the polyimide
substrate having a thickness equal to or more than 10 .mu.m and
equal to or less than 120 .mu.m, an input terminal provided on the
second surface, an output terminal provided on the second surface,
a light receiving element provided on the first surface, a light
emitting element provided on the light receiving element, and a
MOSFET provided on the first surface.
Inventors: |
Tonedachi; Tatsuo;
(Himeji-Shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Kabushiki Kaisha Toshiba
Toshiba Electronic Devices & Storage Corporation |
Tokyo
Tokyo |
|
JP
JP |
|
|
Family ID: |
1000006351554 |
Appl. No.: |
17/750709 |
Filed: |
May 23, 2022 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
17012487 |
Sep 4, 2020 |
11367715 |
|
|
17750709 |
|
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2924/1579 20130101;
H01L 25/167 20130101; H01L 2924/13091 20130101; H01L 2924/12041
20130101; H01L 23/49838 20130101; H01L 2924/12043 20130101; H01L
23/145 20130101; H01L 24/48 20130101; H03K 17/785 20130101; H01L
2224/48137 20130101; H01L 2924/07025 20130101; H01L 2224/48227
20130101 |
International
Class: |
H01L 25/16 20060101
H01L025/16; H01L 23/00 20060101 H01L023/00; H01L 23/14 20060101
H01L023/14; H01L 23/498 20060101 H01L023/498; H03K 17/785 20060101
H03K017/785 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 4, 2019 |
JP |
2019-219567 |
Claims
1. A photorelay comprising: a polyimide substrate having a first
surface and a second surface on an opposite side of the polyimide
substrate from the first surface, the polyimide substrate having a
thickness equal to or more than 10 .mu.m and equal to or less than
120 .mu.m; an input terminal provided on the second surface; an
output terminal provided on the second surface; a light receiving
element provided on the first surface; a light emitting element
provided on the light receiving element; and a MOSFET provided on
the first surface.
2. The photorelay according to claim 1, wherein the polyimide
substrate has a thickness equal to or more than 10 .mu.m and equal
to or less than 100 .mu.m.
3. The photorelay according to claim 1, wherein the input terminal
and the output terminal have a thickness equal to or more than 5
.mu.m and equal to or less than 20 .mu.m.
4. The photorelay according to claim 1, wherein the output terminal
is connected to the MOSFET via at least one via wiring provided
through the polyimide substrate, the via wiring having a diameter
equal to or more than 20 .mu.m and equal to or less than 150
.mu.m.
5. The photorelay according to claim 1, wherein the polyimide
substrate has a thickness equal to or more than 10 .mu.m and equal
to or less than 60 .mu.m.
6. The photorelay according to claim 1, wherein the polyimide
substrate has a thickness equal to or more than 10 .mu.m and equal
to or less than 30 .mu.m.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of U.S. application Ser.
No. 17/012,487 filed on Sep. 4, 2020 and is based upon and claims
the benefit of priority from Japanese Patent Application No.
2019-219567, filed on Dec. 4, 2019, the entire contents of which
are incorporated herein by reference.
FIELD
[0002] Embodiments described herein relate generally to a
photorelay.
BACKGROUND
[0003] A photorelay including an optically-coupled insulation
circuit is capable of converting an input electrical signal into an
optical signal using a light emitting element, receiving the
optical signal using a light receiving element, and then outputting
an electrical signal. Therefore, such a photorelay can transfer an
electrical signal in a state where input and output are isolated
from each other.
[0004] A large number of photorelays for AC load are used in a
semiconductor tester configured to inspect a semiconductor
integrated circuit or the like. In response to a demand for making
bandwidths of a dynamic random access memory (DRAM) and the like
wider, a photorelay allowing a high-frequency signal having a
frequency higher than several GHz to pass with low loss is
required.
[0005] Such a photorelay includes an output circuit
signal-switchable, using a MOSFET, in response to on/off of an
input electrical signal. Therefore, when a light emitting element,
a light receiving element, and a MOSFET are mounted on a mounting
substrate of the semiconductor tester, a photorelay exhibiting high
high frequency pass characteristics is required.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is a schematic perspective view of a photorelay
according to an embodiment;
[0007] FIG. 2 is a schematic cross-sectional view of the photorelay
according to the embodiment;
[0008] FIG. 3 is a structure diagram of the photorelay according to
the embodiment;
[0009] FIG. 4 is an example of a diagram of a measurement circuit
configured to measure transmission loss; and
[0010] FIG. 5 is a graph showing high frequency pass
characteristics with respect to a frequency.
DETAILED DESCRIPTION
[0011] A photorelay of an embodiment includes a polyimide substrate
having a first surface and a second surface on an opposite side of
the polyimide substrate from the first surface, the polyimide
substrate having a thickness equal to or more than 10 .mu.m and
equal to or less than 120 .mu.m, an input terminal provided on the
second surface, an output terminal provided on the second surface,
a light receiving element provided on the first surface, a light
emitting element provided on the light receiving element, and a
MOSFET provided on the first surface.
[0012] Hereinafter, embodiments of the present disclosure will be
described with reference to the drawings.
[0013] FIG. 1 is a schematic perspective view of a photorelay
according to an embodiment. FIG. 2 is a schematic cross-sectional
view of the photorelay according to the embodiment.
[0014] The photorelay 100 includes a packaging member 5, a MOSFET
70 (71) bonded to output terminal units 31, 32 of the packaging
member 5, a light receiving element 50 bonded to a die pad 41, the
light receiving element 50 having a light receiving surface on its
upper side, a light emitting element 60 configured to irradiate the
light receiving surface with light, an adhesive layer 52 having
light transparency and electrical insulation, the adhesive layer 52
causing the light emitting element 60 to be bonded to the upper
side of the light receiving element 50, and a first encapsulating
resin layer 90. As the light emitting element 60, for example, a
light emitting diode (LED) or the like may be used. Further, as the
light receiving element 50, a photodiode, a phototransistor, a
light receiving IC, or the like may be used.
[0015] In FIGS. 1 and 2, the MOSFET 70 (71) includes two elements
connected to each other via a common source. Note that the present
disclosure is not limited to such a structure, and only one MOSFET
may be provided. When a chip back surface of each of the MOSFETs 70
serves as a drain, the output terminal units 31, 32 are connected
to the respective drains of the MOSFETs.
[0016] The first encapsulating resin layer 90 covers the light
receiving element 50, the light emitting element 60, the MOSFETs 70
(71), and a first surface 10a of a polyimide substrate 10 to
protect the inside. The light emitting element 60 may be further
encapsulated in a second encapsulating resin 91.
[0017] The polyimide substrate 10 has the first surface 10a with a
rectangular shape and a second surface 10b on the opposite side of
the polyimide substrate 10 from the first surface 10a. Further, a
through hole 11 (11a, 11b, 11c, 11d) communicating from the first
surface 10a to the second surface 10b may be further provided.
[0018] The polyimide substrate 10 preferably has a thickness equal
to or more than 10 .mu.m and equal to or less than 120 .mu.m. The
use of such an ultra-thin polyimide substrate 10 makes it possible
to increase pass characteristics over a high frequency band such as
a band of from 15 GHz to 30 GHz. From the viewpoint of increasing
the pass characteristics over a high frequency band, it is more
preferable that the thickness of the polyimide substrate 10 be
equal to or more than 10 .mu.m and equal to or less than 100 .mu.m.
From the viewpoint of increasing the pass characteristics over a
high frequency band equal to or higher than 20 GHz, it is
preferable that the thickness of the polyimide substrate 10 be
equal to or more than 10 .mu.m and equal to or less than 60 .mu.m,
and more preferable that the thickness be equal to or more than 10
.mu.m and equal to or less than 30 .mu.m. It is preferable that
making the thickness of the polyimide substrate 10 thin, for
example, equal to or less than 60 .mu.m further increase the pass
characteristics over a higher frequency band. Since the polyimide
substrate 10 is thin, plating formed on the polyimide substrate 10
easily fills the through hole 11; therefore, the high frequency
pass characteristics can be increased in a manner that depends on
not only the characteristics of the substrate itself but also the
characteristics of wiring.
[0019] An input terminal unit 20 includes, for example, two input
terminal units 21, 22. The input terminal units 21, 22 preferably
have a thickness equal to or more than 5 .mu.m and equal to or less
than 50 .mu.m. The input terminal units 21, 22 have their
respective first conductive regions 21a, 22a provided on the first
surface 10a, the first conductive regions 21a, 22a being
respectively connected, via via wirings 21b, 22b provided in the
through holes 11a, 11b, to input terminals 21c, 22c provided on the
second surface 10b. The first conductive regions 21a, 22a are
so-called pads. The first conductive regions 21a, 22a preferably
have a thickness equal to or more than 5 .mu.m and equal to or less
than 50 .mu.m.
[0020] The output terminal unit includes, for example, two output
terminal units 31, 32. The output terminal units 31, 32 preferably
have a thickness equal to or more than 5 .mu.m and equal to or less
than 50 .mu.m. The output terminal units 31, 32 have their
respective second conductive regions 31a, 32a provided on the first
surface 10a, the second conductive regions 31a, 32a being
respectively connected, via via wirings 31b, 32b provided through
the through holes 11c, 11d, to output terminals 31c, 32c provided
on the second surface 10b. The second conductive regions 31a, 32a
are so-called pads. When the second conductive regions 31a, 32a
(pads) are too thick, the high frequency pass characteristics
deteriorate. The second conductive regions 31a, 32a preferably have
a thickness equal to or more than 5 .mu.m and equal to or less than
50 .mu.m.
[0021] The input terminal units 21, 22, the output terminal units
31, 32, and the die pad 41 are each made of a Cu foil provided on
the surface of the polyimide substrate 10 and a plating layer such
as Ni or Au laminated on the Cu foil. Further, when viewed from
above, the input terminal units 21, 22, the output terminal units
31, 32, and the die pad 41 are spaced apart and isolated from each
other on the polyimide substrate 10.
[0022] It is preferable that a plurality of the through holes 11c
(via wiring 31b) and a plurality of the through holes 11d (via
wiring 32b) be provided on the MOSFETs 70, 71 side. Providing the
plurality of through holes 11c and the plurality of through holes
11d makes it possible to increase the high frequency pass
characteristics.
[0023] The via wirings 31b, 32b provided in the through holes 11c,
11d on the MOSFETs 70, 71 side preferably have a diameter equal to
or more than 20 .mu.m and equal to or less than 150 .mu.m. Making
the diameter of the through holes 11c, 11d too large makes plating
difficult to be applied, thereby causing the via wirings 31b, 32b
to inadequacy fill the through holes 11c, 11d, which is not
preferable. More specifically, each of the via wirings 31b, 32b
which connects the output terminal units 31, 32 preferably includes
a plurality of via wirings having diameter equal to or more than 40
.mu.m and equal to or less than 60 .mu.m or single via wiring
having diameter equal to or more than 110 .mu.m and equal to or
less than 130 .mu.m. If the above conditions are met, the polyimide
substrate 10 has a plurality of through holes having diameter equal
to or more than 40 .mu.m and equal to or less than 60 .mu.m or
single through hole having diameter equal to or more than 110 .mu.m
and equal to or less than 130 .mu.m. If the polyimide substrate 10
has a thickness equal to or more than 40 .mu.m and equal to or less
than 60 .mu.m, each of the via wirings 31b, 32b which connects the
output terminal units 31, 32 more preferably includes a plurality
of via wirings having diameter equal to or more than 40 .mu.m and
equal to or less than 60 .mu.m or single via wiring having diameter
equal to or more than 110 .mu.m and equal to or less than 130
.mu.m. If the diameter of the via wirings 31b, 32b is equal to or
more than 110 .mu.m and equal to or less than 130 .mu.m, a
conformal via wiring can be used for the via wirings 31b, 32b.
[0024] The input terminal unit 21 is electrically connected to a
cathode pad 81f of the light emitting element 60 via a bonding wire
BW1.
[0025] The input terminal unit 22 is electrically connected to an
anode pad 81e of the light emitting element 60 via a bonding wire
BW2.
[0026] The light receiving element 50 is electrically connected to
gates and sources of the MOSFETs 70, 71 via bonding wires BW3, BW4,
BW6, BW7. Pads 81a, 81b, 81c, 81d of the light receiving element
are electrically connected to pads 81g, 81h, 81k, 811 of the
MOSFETs 70, 71 via the bonding wires BW3, BW4, BW6, BW7.
[0027] The MOSFET 70 (source) and the MOSFET 71 (source) are
electrically connected to each other via a bonding wire BW5
connecting the respective pads 81i, 81j of the MOSFETs 70, 71.
[0028] FIG. 3 is a structure diagram of the photorelay according to
the first embodiment.
[0029] The light receiving element 50 may further include a control
circuit 50a. The control circuit 50a is connected to both first and
second electrodes of a photodiode array 50b. This structure allows
a voltage to be applied to each gate of the MOSFETs 70 connected to
each other via a common source. Further, the control circuit 50a
includes a resistor or the like, allowing a discharge to occur when
the MOSFETs 70 make a transition from on to off to shorten the fall
time.
[0030] The MOSFETs 70, 71 may be, for example, of an re-channel
enhancement type. In FIG. 3, the gates G of the MOSFETs 70 are
connected to an anode of the photodiode array 50b. Their respective
sources S are connected to a cathode of the photodiode array 50b,
and their respective drains D are connected to the output terminal
units 31, 32.
[0031] When an optical signal is on, both the MOSFETs 70, 71 become
on to connect to an external circuit including a power supply and a
load via the output terminal units 31, 32. On the other hand, when
the optical signal is off, both the MOSFETs 70, 71 become off to
separate from the external circuit. The common-source connection
enables linear output and facilitates switching of a high-frequency
signal.
[0032] When the two MOSFETs 70, 71 connected to each other via a
common source are on, a high-frequency signal is supplied to the
load. For example, when the number of bonding wires connecting the
two source electrodes S is increased to two or more, source
inductance can be reduced. Further, when the two or more bonding
wires are made non-parallel to each other, the source inductance
can be further reduced. Further, when the bonding wires adjacent to
the MOSFETs 70, 71 are made larger in diameter than the bonding
wires adjacent to the light emitting element 60, wire inductance
can be reduced. This in turn makes it possible to reduce
transmission loss.
[0033] FIG. 4 shows an example of a measurement circuit configured
to measure transmission loss. For example, when the light emitting
element such as an LED is on in response to an input electrical
signal, the MOSFETs become on to allow a high-frequency signal to
flow from a high-frequency signal source 101 to a load 120. When
the MOSFETs have a vertical structure, a back side of the chip may
serve as a drain electrode. Therefore, parasitic (stray)
capacitance Cst is generated between each MOSFET and a
corresponding ground electrode in close proximity to each
other.
[0034] A part between the output terminal units 31, 32 of the
photorelay acts as a relay terminal. The transmission loss
corresponds to insertion loss when the relay is conducting. For
example, when an input power is denoted by P1, and an output power
is denoted by P2, the transmission loss is expressed by the
following equation.
Transmission loss (dB)=-10 log(P2/P1)
[0035] FIG. 5 is a graph showing high frequency pass
characteristics of the photorelay with respect to a frequency.
[0036] The vertical axis represents the insertion loss (dB), and
the horizontal axis represents the frequency (Hz). The solid line
represents high frequency pass characteristics of a photorelay
including the polyimide substrate 10 having a thickness of 25
.mu.m. The dotted line represents high frequency pass
characteristics of a photorelay including a glass epoxy substrate,
rather than the polyimide substrate 10, having a thickness of 400
.mu.m. The insertion loss is based on pass characteristics at 10
MHz. Around 10 GHz, there is no large difference between the
photorelay including the polyimide substrate 10 and the photorelay
including the glass epoxy substrate. However, the photorelay
including the glass epoxy substrate is large in loss of about -20
dB with 20 odd GHz as the largest, and the loss reaches -3 dB at
about 13 GHz. On the other hand, when the photorelay includes the
polyimide substrate 10, the loss gradually increases from 10 GHz to
30 GHz, showing that the photorelay has an extremely excellent high
frequency pass characteristics with -5 dB as the largest loss.
[0037] The photorelay 100 according to the embodiment can reduce
transmission loss. Therefore, high frequency pass characteristics
of semiconductor devices including ultra-high speed DRAMs based on
the next-generation standard can be measured with high accuracy and
at high speed.
[0038] Such photorelays are widely applicable to industrial
equipment including a semiconductor tester for inspecting ICs and
the like.
[0039] While certain embodiments have been described, these
embodiments have been presented by way of example only, and are not
intended to limit the scope of the inventions. Indeed, the novel
embodiments described herein may be embodied in a variety of other
forms; furthermore, various omissions, substitutions and changes in
the form of the embodiments described herein may be made without
departing from the spirit of the inventions. The accompanying
claims and their equivalents are intended to cover such forms or
modifications as would fall within the scope and spirit of the
inventions.
* * * * *