U.S. patent application number 17/182564 was filed with the patent office on 2022-08-25 for advanced fluid connection design for multiple phase system.
The applicant listed for this patent is BAIDU USA LLC. Invention is credited to Tianyi GAO.
Application Number | 20220272874 17/182564 |
Document ID | / |
Family ID | |
Filed Date | 2022-08-25 |
United States Patent
Application |
20220272874 |
Kind Code |
A1 |
GAO; Tianyi |
August 25, 2022 |
ADVANCED FLUID CONNECTION DESIGN FOR MULTIPLE PHASE SYSTEM
Abstract
A cooling arrangement for an electronic rack of a data center
having a rack manifold with liquid supply line to receive first
cooling liquid from a cooling liquid source and liquid return line
to return first warmer liquid back to the cooling liquid source. A
plurality of server chassis are arranged in a stack, each server
chassis including one or more fluid cooling devices associated with
one or more information technology (IT) components. A plurality of
connector modules are attached to the servers, each providing fluid
connections between the fluid cooling devices and the cooling
liquid source on the racks; wherein each of the connector module
comprises a frame having mounts configured for attaching the frame
onto the server a plurality of channels formed in the frame to
accept the fluid connectors; and, a plurality of fluid connectors
slidably mounted in the channels.
Inventors: |
GAO; Tianyi; (San Jose,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BAIDU USA LLC |
Sunnyvale |
CA |
US |
|
|
Appl. No.: |
17/182564 |
Filed: |
February 23, 2021 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A connector module for an electronic rack, comprising: a frame
having mounts configured for attaching the frame onto the
electronic rack; a plurality of channels formed in the frame to
accept fluid connectors; and a plurality of fluid connectors
slidably mounted in the channels; and, wherein each of the fluid
connectors further comprises a locking mechanism affixing the fluid
connector in a fixed location within the channel.
2. The module of claim 1, further comprising an interconnector
attached to at least two fluid connectors thereby maintaining fixed
spatial orientation between the two fluid connectors.
3. (canceled)
4. The module of claim 1, wherein the locking mechanism comprises
tight fit of the fluid connector within a channel imparting motion
resistance of the fluid connector within a channel preventing free
slide.
5. The module of claim 1, wherein the locking mechanism comprises
arms extending from the fluid connector and engaging teeth within
the channel.
6. The module of claim 1, wherein the frame further comprises a
plurality of locators positioned at preset locations and configured
for locking the fluid connectors at the preset locations.
7. The module of claim 1 wherein each of the fluid connectors
comprises an interconnect kit configured for interconnecting each
of the fluid connector to another fluid connector to maintain fixed
spatial orientation.
8. An electronic rack of a data center, comprising: a rack manifold
having a rack liquid supply line to receive first cooling liquid
from a cooling liquid source and a rack liquid return line to
return first warmer liquid back to the cooling liquid source; a
plurality of server chassis arranged in a stack, each server
chassis including one or more fluid cooling devices associated with
one or more information technology (IT) components; and a plurality
of connector modules attached to the electronic rack, each
providing fluid connections between the fluid cooling devices and
the cooling liquid source; wherein each of the connector module
comprises: a frame having mounts configured for attaching the frame
onto the electronic rack, a plurality of channels formed in the
frame to accept the fluid connectors, and a plurality of fluid
connectors slidably mounted in the channels; and, a plurality of
interconnectors, each attached to at least two fluid connectors
thereby maintaining fixed spatial orientation between the two fluid
connectors.
9. The electronic rack of claim 8, wherein the fluid cooling
devices are selected from cooling plates and condensers.
10. The electronic rack of claim 8, wherein at least one of the
fluid cooling device comprises a riser gas line and a liquid return
line, and wherein the riser gas line is connected to a connector
mounted on a first connector module and the liquid return line is
connected to a connector mounted on a second connector module,
wherein the first connector module is mounted vertically higher
than the second connector module.
11. The electronic rack of claim 8, wherein at least one of the
fluid cooling devices comprises a hot liquid line and a cold liquid
line, and wherein the hot liquid line is connected to a first
connector mounted on a first channel and the cold liquid line is
connected to a second connector mounted on a second channel,
wherein the first connector is mounted at same vertical height as
the second connector.
12. The electronic rack of claim 8, wherein the plurality of fluid
connectors comprises a plurality of paired inlet and return
connectors, wherein a subset of the paired inlet and return
connectors are mounted at same vertical height and remainder of the
paired inlet connectors are mounted with the inlet at a higher
vertical height than the return connector.
13. (canceled)
14. The electronic rack of claim 8, wherein each of the fluid
connectors further comprises a locking mechanism affixing the fluid
connector in a fixed location within the channel.
15. The electronic rack of claim 14, wherein the locking mechanism
comprises one of: a tight fit of the fluid connector within a
channel imparting motion resistance of the fluid connector within a
channel preventing free slide; or arms extending from the fluid
connector and engaging teeth within the channel.
16. The electronic rack of claim 8, wherein the frame further
comprises a plurality of locators positioned at preset locations
and configured for locking the fluid connectors at the preset
locations.
17. A method for providing cooling fluid to an electronic rack of a
plurality of server chassis, comprising: mounting a frame with a
plurality of connector modules to the electronic rack using mounts,
each connector module provided with at least two channels;
attaching a plurality of fluid connectors to the connector modules
by attaching at least one fluid connector in each of the channels;
and for each of the server chassis, verifying spatial orientation
of inlet connector and outlet connector and sliding two of the
plurality of connectors to match the spatial orientation of the
inlet connector and outlet connector, and securing the two
connectors in the spatial orientation using a locking mechanism,
and then mounting the server chassis in the electronic rack by
engaging the two connectors with the inlet connector and outlet
connector.
18. The method of claim 17, wherein securing the two connectors
comprises positioning the two connectors in selected predefined
dedicated locations identified by pre-arranged locators applied to
the channels.
19. The method of claim 17, further comprising mounting a
multi-device chassis having multiple cooling devices by engaging
the multi-device chassis with multiple pairs of fluid
connectors.
20. The method of claim 19, wherein for each pair of fluid
connectors, affixing a riser connector at higher elevation than a
return connector.
Description
FIELD OF THE INVENTION
[0001] Embodiments of the present invention relate generally to
data center and electronics cooling. More particularly, embodiments
of the invention relate to modular fluid connection and hardware
design particularly beneficial for multiple phase systems.
BACKGROUND
[0002] Cooling is a prominent factor in a computer system and data
center design. The number of high performance electronics
components such as high performance processors packaged inside
servers has steadily increased, thereby increasing the amount of
heat generated and dissipated during the ordinary operations of the
servers. The reliability of servers used within a data center
decreases if the environment in which they operate is permitted to
increase in temperature over time. Maintaining a proper thermal
environment is critical for normal operations of these servers in
data centers, as well as the server performance and lifetime. It
requires more effective and efficient cooling solutions especially
in the cases of cooling these high performance servers.
[0003] The servers and different types of IT equipment, which can
be understood as different compute, storage and other functions
based systems include multiple connectors are provided in the rear
to deliver electrical communication, power, cooling fluids, etc.
Such connectors may be blind mate connectors, wherein the
male-female connection is done blindly by self-alignment of the
mating connectors, such that a user need not reach the back of the
unit to connect or disconnect the various connectors. To enable
such blind connections, the connectors must be located at a fixed
orientation to accept the mating connection. However, with the
incorporation of advanced multi-phase cooling systems, different
systems may require different arrangement for the fluid connectors,
thus exacerbating the design of fluid cooling connections.
[0004] The interoperability of different cooling elements is
important to accommodate different rack configurations, fluid
systems and rack level fluid port availabilities in actual
uses.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Embodiments of the invention are illustrated by way of
example and not limitation in the figures of the accompanying
drawings in which like references indicate similar elements.
[0006] FIG. 1 is a block diagram illustrating an example of a data
center facility according to one embodiment.
[0007] FIG. 2 is a block diagram illustrating an example of an
electronic rack according to one embodiment.
[0008] FIG. 3 is a block diagram illustrating an example of a cold
plate configuration according to one embodiment.
[0009] FIG. 4A is a general schematic illustrating a connector
module according to an embodiment, while FIG. 4B is a side view
thereof.
[0010] FIG. 5A is a general schematic illustrating a connector
module 500 according to an embodiment, while FIG. 5B is a general
schematic illustrating another embodiment without
interconnection.
[0011] FIG. 6A is a general schematic illustrating a connector
module 600 according to an embodiment, while FIG. 6B is a general
side-view schematic of the module and FIG. 6C is a side view
illustrating one of the connectors shown in FIG. 6A.
[0012] FIGS. 7A-7C illustrates embodiments for server-level
integration of the connector module.
[0013] FIG. 8 illustrates an embodiment for a rack level connector
module.
[0014] FIG. 9 illustrates an embodiment particularly suitable for
implementing closed loop thermosiphon cooling.
[0015] FIG. 10 is a general schematic illustrating embodiments of
the connector module employed in a section of heterogeneous
computing rack.
[0016] FIG. 11 is a flow chart illustrating a process according to
an embodiment.
DETAILED DESCRIPTION
[0017] Various embodiments and aspects of the inventions will be
described with reference to details discussed below, and the
accompanying drawings will illustrate the various embodiments. The
following description and drawings are illustrative of the
invention and are not to be construed as limiting the invention.
Numerous specific details are described to provide a thorough
understanding of various embodiments of the present invention.
However, in certain instances, well-known or conventional details
are not described in order to provide a concise discussion of
embodiments of the present inventions.
[0018] Reference in the specification to "one embodiment" or "an
embodiment" means that a particular feature, structure, or
characteristic described in conjunction with the embodiment can be
included in at least one embodiment of the invention. The
appearances of the phrase "in one embodiment" in various places in
the specification do not necessarily all refer to the same
embodiment.
[0019] Disclosed embodiments provide a flexible interface for
connectors in a computing system, especially suitable for blind
mate fluid connectors in systems that may use multiple phase fluid
cooling. In such systems fluid flow may rely on gravity and/or
fluid pressure, such that the locations of the connectors may
differ for each supply and return lines of each FRU within the
enclosure. Disclosed embodiments introduce an interface that
enables to easily rearrange the location of the blind mate
connectors for the fluids.
[0020] In disclosed embodiments the interface comprises a frame
mountable onto the computing enclosure and having a plurality of
channels or tracks. Each channel may slidably accept one or more
connectors, such that the connector may slide within the channel to
different positions within the channel. Preset positions may be
configured for each channel, such that each connector may be slide
to one of the preset position. Each pair of connectors may be
interconnected such that they move in unison, so as to maintain a
fixed spatial orientation there-between. Thus, moving one connector
would force the paired connector to move as well to maintain the
spatial orientation.
[0021] In one aspect, a connector module for electronic rack
includes a frame having mounts configured for attaching the frame
onto the electronic rack, a plurality of channels formed in the
frame to accept fluid connectors, and a plurality of fluid
connectors slidably mounted in the channels. The connector module
further includes an interconnector attached to at least two fluid
connectors thereby maintaining fixed spatial orientation between
the two fluid connectors. Each of the fluid connector further
comprises a locking mechanism affixing the fluid connector in a
fixed location within the channel. The locking mechanism comprises
tight fit of the fluid connector within the channel imparting
motion resistance of the fluid connector within the channel
preventing free slide. The locking mechanism includes arms
extending from the fluid connector and engaging teeth within the
channel. The frame further includes a plurality of locators
positioned at preset locations and configured for locking the fluid
connectors at the preset locations. Each of the fluid connector
includes an interconnect kit configured for interconnecting each of
the fluid connector to another fluid connector to maintain fixed
spatial orientation.
[0022] According to another aspect, an electronic rack includes a
rack manifold having a rack liquid supply line to receive first
cooling liquid from a cooling liquid source and a rack liquid
return line to return first warmer liquid back to the cooling
liquid source; a plurality of server chassis arranged in a stack,
each server chassis including one or more fluid cooling devices
associated with one or more information technology (IT) components;
and a plurality of connector modules attached to the electronic
rack, each providing fluid connections between the fluid cooling
devices and the cooling liquid source. Each connector module
includes components as described above.
[0023] According to a further aspect, a method for providing
cooling fluid to an electronic rack of a plurality of server
chassis includes mounting a plurality of connector modules to the
electronic rack, each connector module provided with at least two
channels; attaching a plurality of fluid connectors to the
connector modules by attaching at least one fluid connector in each
of the channels; and for each of the server chassis, verifying
spatial orientation of inlet connector and outlet connector and
sliding two of the plurality of connectors to match the spatial
orientation of the inlet connector and outlet connector, and
securing the two connectors in the spatial orientation, and then
mounting the server chassis in the electronic rack by engaging the
two connectors with the inlet connector and outlet connector.
[0024] The securing the two connectors comprises positioning the
two connectors in selected predefined dedicated locations
identified by pre-arranged locators applied to the channels. The
method further includes mounting a multi-device chassis having
multiple cooling devices by engaging the multi-device chassis with
multiple pairs of fluid connectors. The method further includes,
for each pair of fluid connectors, affixing a riser connector at
higher elevation than a return connector.
[0025] The following disclosure starts by providing background
information regarding the application of the disclosed embodiments,
and then proceeds to disclose specific embodiments. In this
context, the embodiments may refer simply to connectors, and such
reference is intended to include blind mate fluid connectors,
including such connectors that may be engaged and disengaged
without fluid leaks. Such connectors may include a valve that
closes when a mating connector is disconnected, so as to prevent
fluid from leaking.
[0026] FIG. 1 is a block diagram illustrating an example of a data
center or data center unit according to one embodiment. In this
example, FIG. 1 shows a top view of at least a portion of a data
center. Referring to FIG. 1, according to one embodiment, data
center system 100 includes one or more rows of electronic racks of
information technology (IT) components, equipment or instruments
101-102, such as, for example, computer servers or computing nodes
that provide data services to a variety of clients over a network
(e.g., the Internet). In this embodiment, each row includes an
array of electronic racks such as electronic racks 110A-110N.
However, more or fewer rows of electronic racks may be implemented.
Typically, rows 101-102 are aligned in parallel with frontends
facing towards each other and backends facing away from each other,
forming aisle 103 in between to allow an administrative person
walking therein. However, other configurations or arrangements may
also be applied. For example, two rows of electronic racks may back
to back face each other without forming an aisle in between, while
their frontends face away from each other. The backends of the
electronic racks may be coupled to the room cooling liquid
manifolds.
[0027] In one embodiment, each of the electronic racks (e.g.,
electronic racks 110A-110N) includes a housing to house a number of
IT components arranged in a stack operating therein. The electronic
racks can include a cooling liquid manifold, a number of server
slots (e.g., standard shelves or chassis configured with an
identical or similar form factor), and a number of server chassis
(also referred to as server blades or server shelves) capable of
being inserted into and removed from the server slots. Each server
chassis represents a computing node having one or more processors,
a memory, and/or a persistent storage device (e.g., hard disk),
where a computing node may include one or more servers operating
therein. At least one of the processors is attached to a liquid
cold plate (also referred to as a cold plate assembly) to receive
cooling liquid. In addition, one or more optional cooling fans are
associated with the server chassis to provide air cooling to the
computing nodes contained therein. Note that the cooling system 120
may be coupled to multiple data center systems such as data center
system 100.
[0028] In one embodiment, cooling system 120 includes an external
liquid loop connected to a cooling tower or a dry cooler external
to the building/housing container. The cooling system 120 can
include, but is not limited to evaporative cooling, free air,
rejection to large thermal mass, and waste heat recovery designs.
Cooling system 120 may include or be coupled to a cooling liquid
source that provide cooling liquid.
[0029] In one embodiment, each server chassis is coupled to the
cooling liquid manifold modularly, such that a server chassis can
be removed from the electronic rack without affecting the
operations of remaining server chassis in the electronic rack and
the cooling liquid manifold. In another embodiment, each server
chassis is coupled to the cooling liquid manifold through a
quick-release coupling assembly having a server liquid intake
connector and a server liquid outlet connector coupled to a
flexible hose to distribute the cooling liquid to the processors.
The server liquid intake connector is to receive cooling liquid via
a rack liquid intake connector from a cooling liquid manifold
mounted on a backend of the electronic rack. The server liquid
outlet connector is to emit warmer or hotter liquid carrying the
heat exchanged from the processors to the cooling liquid manifold
via a rack liquid outlet connector and then back to a coolant
distribution unit (CDU) within the electronic rack.
[0030] In one embodiment, the cooling liquid manifold disposed on
the backend of each electronic rack is coupled to liquid supply
line 132 (also referred to as a room supply manifold) to receive
cooling liquid from cooling system 120. The cooling liquid is
distributed through a liquid distribution loop attached to a cold
plate assembly on which a processor is mounted to remove heat from
the processors. A cold plate is configured similar to a heat sink
with a liquid distribution tube attached or embedded therein. The
resulting warmer or hotter liquid carrying the heat exchanged from
the processors is transmitted via liquid return line 131 (also
referred to as a room return manifold) back to cooling system
120.
[0031] Liquid supply/return lines 131-132 are referred to as data
center or room liquid supply/return lines (e.g., global liquid
supply/return lines), which supply cooling liquid to all of the
electronic racks of rows 101-102. The liquid supply line 132 and
liquid return line 131 are coupled to a heat exchanger of a CDU
located within each of the electronic racks, forming a primary
loop. The secondary loop of the heat exchanger is coupled to each
of the server chassis in the electronic rack to deliver the cooling
liquid to the cold plates of the processors.
[0032] In one embodiment, data center system 100 further includes
an optional airflow delivery system 135 to generate an airflow to
cause the airflow to travel through the air space of the server
chassis of the electronic racks to exchange heat generated by the
computing nodes due to operations of the computing nodes (e.g.,
servers) and to exhaust the airflow exchanged heat to an external
environment or a cooling system (e.g., air-to-liquid heat
exchanger) to reduce the temperature of the airflow. For example,
air supply system 135 generates an airflow of cool/cold air to
circulate from aisle 103 through electronic racks 110A-110N to
carry away exchanged heat.
[0033] The cool airflows enter the electronic racks through their
frontends and the warm/hot airflows exit the electronic racks from
their backends. The warm/hot air with exchanged heat is exhausted
from room/building or cooled using a separate cooling system such
as an air-to-liquid heat exchanger. Thus, the cooling system is a
hybrid liquid-air cooling system, where a portion of the heat
generated by a processor is removed by cooling liquid via the
corresponding cold plate, while the remaining portion of the heat
generated by the processor (or other electronics or processing
devices) is removed by airflow cooling. Moreover, the liquid
cooling may be multi-phase system wherein fluid flows in liquid or
gaseous phase.
[0034] FIG. 2 is block diagram illustrating an electronic rack
according to one embodiment. Electronic rack 200 may represent any
of the electronic racks as shown in FIG. 1, such as, for example,
electronic racks 110A-110N. Referring to FIG. 2, according to one
embodiment, electronic rack 200 includes, but is not limited to,
CDU 201, rack management unit (RMU) 202, and one or more server
chassis 203A-203E (collectively referred to as server chassis 203).
Server chassis 203 can be inserted into an array of server slots
(e.g., standard shelves) respectively from frontend 204 or backend
205 of electronic rack 200. Note that although there are five
server chassis 203A-203E shown here, more or fewer server chassis
may be maintained within electronic rack 200. Also note that the
particular positions of CDU 201, RMU 202, and/or server chassis 203
are shown for the purpose of illustration only; other arrangements
or configurations of CDU 201, RMU 202, and/or server chassis 203
may also be implemented. In one embodiment, electronic rack 200 can
be either open to the environment or partially contained by a rack
container, as long as the cooling fans can generate airflows from
the frontend to the backend.
[0035] In addition, for at least some of the server chassis 203, an
optional fan module (not shown) is associated with the server
chassis. Each of the fan modules includes one or more cooling fans.
The fan modules may be mounted on the backends of server chassis
203 or on the electronic rack to generate airflows flowing from
frontend 204, traveling through the air space of the sever chassis
203, and existing at backend 205 of electronic rack 200.
[0036] In one embodiment, CDU 201 mainly includes heat exchanger
211, liquid pump 212, and a pump controller (not shown), and some
other components such as a liquid reservoir, a power supply,
monitoring sensors and so on. Heat exchanger 211 may be a
liquid-to-liquid or multi-phase heat exchanger. Heat exchanger 211
includes a first loop with inlet and outlet ports having a first
pair of liquid connectors coupled to external liquid supply/return
lines 131-132 to form a primary loop. The connectors coupled to the
external liquid supply/return lines 131-132 may be disposed or
mounted on backend 205 of electronic rack 200. The liquid
supply/return lines 131-132, also referred to as room liquid
supply/return lines, may be coupled to cooling system 120 as
described above.
[0037] In addition, heat exchanger 211 further includes a second
loop with two ports having a second pair of liquid connectors
coupled to liquid manifold 225 (also referred to as a rack
manifold) to form a secondary loop, which may include a supply
manifold (also referred to as a rack liquid supply line or rack
supply manifold) to supply cooling liquid to server chassis 203 and
a return manifold (also referred to as a rack liquid return line or
rack return manifold) to return warmer liquid back to CDU 201. Note
that CDUs 201 can be any kind of CDUs commercially available or
customized ones. Thus, the details of CDUs 201 will not be
described herein.
[0038] Each of server chassis 203 may include one or more IT
components (e.g., central processing units or CPUs, general/graphic
processing units (GPUs), memory, and/or storage devices). Each IT
component may perform data processing tasks, where the IT component
may include software installed in a storage device, loaded into the
memory, and executed by one or more processors to perform the data
processing tasks. Server chassis 203 may include a host server
(referred to as a host node) coupled to one or more compute servers
(also referred to as computing nodes, such as CPU server and GPU
server). The host server (having one or more CPUs) typically
interfaces with clients over a network (e.g., Internet) to receive
a request for a particular service such as storage services (e.g.,
cloud-based storage services such as backup and/or restoration),
executing an application to perform certain operations (e.g., image
processing, deep data learning algorithms or modeling, etc., as a
part of a software-as-a-service or SaaS platform). In response to
the request, the host server distributes the tasks to one or more
of the computing nodes or compute servers (having one or more GPUs)
managed by the host server. The compute servers perform the actual
tasks, which may generate heat during the operations.
[0039] Electronic rack 200 further includes optional RMU 202
configured to provide and manage power supplied to servers 203, and
CDU 201. RMU 202 may be coupled to a power supply unit (not shown)
to manage the power consumption of the power supply unit. The power
supply unit may include the necessary circuitry (e.g., an
alternating current (AC) to direct current (DC) or DC to DC power
converter, battery, transformer, or regulator, etc.,) to provide
power to the rest of the components of electronic rack 200.
[0040] In one embodiment, RMU 202 includes optimization module 221
and rack management controller (RMC) 222. RMC 222 may include a
monitor to monitor operating status of various components within
electronic rack 200, such as, for example, computing nodes 203, CDU
201, and the fan modules. Specifically, the monitor receives
operating data from various sensors representing the operating
environments of electronic rack 200. For example, the monitor may
receive operating data representing temperatures of the processors,
cooling liquid, and airflows, which may be captured and collected
via various temperature sensors. The monitor may also receive data
representing the fan power and pump power generated by the fan
modules and liquid pump 212, which may be proportional to their
respective speeds. These operating data are referred to as
real-time operating data. Note that the monitor may be implemented
as a separate module within RMU 202.
[0041] Based on the operating data, optimization module 221
performs an optimization using a predetermined optimization
function or optimization model to derive a set of optimal fan
speeds for the fan modules and an optimal pump speed for liquid
pump 212, such that the total power consumption of liquid pump 212
and the fan modules reaches minimum, while the operating data
associated with liquid pump 212 and cooling fans of the fan modules
are within their respective designed specifications. Once the
optimal pump speed and optimal fan speeds have been determined, RMC
222 configures liquid pump 212 and cooling fans of the fan modules
based on the optimal pump speeds and fan speeds.
[0042] As an example, based on the optimal pump speed, RMC 222
communicates with a pump controller of CDU 201 to control the speed
of liquid pump 212, which in turn controls a liquid flow rate of
cooling liquid supplied to the liquid manifold 225 to be
distributed to at least some of server chassis 203. Similarly,
based on the optimal fan speeds, RMC 222 communicates with each of
the fan modules to control the speed of each cooling fan of the fan
modules, which in turn control the airflow rates of the fan
modules. Note that each of fan modules may be individually
controlled with its specific optimal fan speed, and different fan
modules and/or different cooling fans within the same fan module
may have different optimal fan speeds.
[0043] Note that the rack configuration as shown in FIG. 2 is shown
and described for the purpose of illustration only; other
configurations or arrangements may also be applicable. For example,
CDU 201 may be an optional unit. The cold plates of server chassis
203 may be coupled to a rack manifold, which may be directly
coupled to room manifolds 131-132 without using a CDU. Although not
shown, a power supply unit may be disposed within electronic rack
200. The power supply unit may be implemented as a standard chassis
identical or similar to a sever chassis, where the power supply
chassis can be inserted into any of the standard shelves, replacing
any of server chassis 203. In addition, the power supply chassis
may further include a battery backup unit (BBU) to provide battery
power to server chassis 203 when the main power is unavailable. The
BBU may include one or more battery packages and each battery
package include one or more battery cells, as well as the necessary
charging and discharging circuits for charging and discharging the
battery cells.
[0044] FIG. 3 is a block diagram illustrating a processor cold
plate configuration according to one embodiment. The processor/cold
plate assembly 300 can represent any of the processors/cold plate
structures of server chassis 203 as shown in FIG. 2. Referring to
FIG. 3, processor 301 is plugged onto a processor socket mounted on
printed circuit board (PCB) or motherboard 302 coupled to other
electrical components or circuits of a data processing system or
server. Processor 301 also includes a cold plate 303 attached to
it, which is coupled to a rack manifold that is coupled to liquid
supply line 132 and/or liquid return line 131 e.g., via blind mate
connectors. A portion of the heat generated by processor 301 is
removed by the cooling liquid via cold plate 303. The remaining
portion of the heat enters into an air space underneath or above,
which may be removed by an airflow generated by cooling fan
304.
[0045] The rack fluid distribution system may be equipped with
different types of connectors, positioned at different locations
and/or at different spacing and orientations, including different
integration locations such as parallel or staggered. This may
increase the difficulty for implementing liquid cooled server on
the rack, especially when accounting to multi-phase cooling
arrangements. Therefore, disclosed embodiments introduce an adapter
design, which may be used for adapting different server systems on
different rack fluid distribution hardware designs. The various
embodiments enable each configuration of blind mate connectors for
different connection requirements of the computing systems.
[0046] A beneficial feature of disclosed embodiments is that since
the connectors are movable to different locations, the rack side
may not need to integrate with many connectors. Since the fluid
connectors on the server side can be moved to provide different
fluid connection design, a smaller number of connectors are
required, thereby providing for cost reduction.
[0047] In addition, the different types of servers may require
different fluid systems for thermal management. Disclosed
embodiments of the connector adapter helps satisfy these different
requirements. Similarly, the rack configurations may be different
for different IT equipment and systems. The rack level distribution
may be designed in different manners, and/or the rack level fluid
ports may be in different availabilities, especially when servers
are already populated in the rack thus occupying some ports. The
individual servers may have different cooling modules designed and
implemented for them. Therefore, the fluid flowing directions may
be different and the difference in the fluid flowing direction,
e.g., using thermosiphon, may generate different performances.
Disclosed embodiments enable to easily change the locations of
fluid inlet and outlet based on different cooling module designs
and the rack liquid systems.
[0048] In the following, embodiments for fluid connection module,
especially beneficial for multi-phase cooling systems or
heterogeneous racks, are disclosed. The connection module may
function as an interface for multiple blind mate fluid connectors,
wherein internal channels or tracks enable adjusting the position
of the connectors. The entire unit can be an integrated unit on a
server chassis or a separate unit easily installed or disassembled
from the server chassis. The connectors are interconnected in an
embodiment for blind mating applications and the internal channels
are also being slidable for adjusting the locations of the
connectors. The flexible design ensures matching with different
rack level design specifications. In an embodiment, the connection
module may have two types of channels, one for the connectors and
the other one for the internal connection (intra-connection) of the
connectors. The variation in locations of the channels as well as
the connectors can be used for assembling different cooling fluid
operating requirements, either single phase or two phase fluid.
[0049] The ability to slide the fluid connectors within the
channels enable further advantages in various use cases. For
example, the rack ports may be occupied by other systems on an
existing rack, so the solution enables more possibilities to
utilize different rack ports which are available as well as
adjusting other systems connections to enable new system
installation. Also, the variation in the internal channel allows
for integrating multiple sets of connectors and sub-loops from a
server chassis.
[0050] FIG. 4A is a general schematic illustrating a connector
module 400 according to an embodiment, while FIG. 4B is a side view
thereof. The connector module 400 forms a housing or frame 405
having mounting points 410 for mounting the housing 405 to the
servers. In this embodiment the mounting point 410 is provided in
the middle of the connector module, so as to enable rotation of the
module, as illustrated by the curved arrow, to be placed in
different orientations as needed.
[0051] Connectors 422 and 424 are slidably mounted onto the housing
405. In this embodiment, connectors 422 and 424 are paired, in that
one serves as intake and one as return for one liquid cooling
element. Each of connectors 422 and 424 may slide in channel or
track 430 so as to change its position in the housing 405. In one
example, the channel 430 is formed to have tight fit to the
connectors, such that the connectors may slide by application of
force, but once placed in one position they remain in that
position. In this sense, tight fit means that the connectors do not
slide by force of gravity, but requires an additional application
of force to change elevation. In such embodiment, no mechanical
locking mechanism is needed to secure the connectors in a given
position, albeit a locking mechanism may be used in other
embodiments if desired.
[0052] Also, in order to easily blind mate to corresponding
connectors, e.g., of a serve chassis, the relative orientation of
the paired connectors 422 and 424 is maintained by use of an
interconnection 440. The interconnection 440 ensures that the
paired connectors 422 and 424 are maintained in relative
orientation that conforms to standard rack configuration. This
feature ensures that blind mating can be easily accomplished.
[0053] In disclosed embodiments the interconnection of the paired
connectors also assists the locking of the two connectors,
preventing any unintentional motion, e.g., from gravity. In one
embodiment, during the blind mating procedure, different directions
of forces may be loaded on the connectors 424 and 422 when mating
with the corresponding connectors on the rack level fluid
distribution. The interconnection also functions as additional
protection.
[0054] FIG. 4B illustrates a side view of the embodiment of FIG.
4A, showing the connector 422, which can be positioned in different
positions along channel 430. Also shown is interconnection 440,
which resides in and may slide within secondary channel 435 and
connects to a paired connector. In this way, when connector 422 is
moved, connector 424 moves with it to maintain the distance between
the paired connectors constant.
[0055] In one embodiment, the two channels maybe merged to one,
while two dedicated channels may provide additional structure
enhancement.
[0056] FIG. 5A is a general schematic illustrating a connector
module 500 according to an embodiment, while FIG. 5B is a general
schematic illustrating another embodiment without interconnection.
FIG. 5A illustrates an embodiment wherein multiple pairs of
connectors are mounted within the channel 530. As shown in this
example, connectors 522a and 524a are paired, and connectors 522b
and 524b are paired. Interconnections 540 are provided between the
connectors of each of the pairs, and between the two pairs, such
that the distance between each two connectors remain fixed
regardless of the position it is placed in within the channel 530.
Thus, while in this embodiment the connectors are movable inside
the channel 530, the distance between one inlet connector and
another inlet connector is fixed, the distance between one return
connector and another return connector is fixed, and the distance
between one inlet connector and its paired return connector is
fixed, all according to the rack configuration.
[0057] FIG. 5B, on the other hand, illustrates an embodiment
wherein no interconnections are provided between the connectors,
since the connectors are fixed within a track that is movable in
the channel. Since the connectors are affixed to the movable track,
as the track moves the distance between the connectors remains the
same, thus achieving the same function as in FIG. 5A. That is, the
movable track function to both move the connectors to different
position and as the interconnection between the connectors. The
tracks may move within the channel 530.
[0058] FIG. 6A is a general schematic illustrating a connector
module 600 according to an embodiment, while FIG. 6B is a general
schematic illustrating a side view of the embodiment of FIG. 6A.
FIG. 6C illustrates a side view of one of the connectors shown in
FIGS. 6A and 6B. As illustrated in FIG. 6A, connectors 622 and 624
may slide within channel 630. In this embodiment, each of the
connectors 622 and 624 incorporates engagement arms 628. Engagement
arms 628 are designed to engage space 631 formed between two
sections 633 and 636 of the module 630. In the illustration,
connector 624 is shown in its insertion orientation. Once it is
inserted into the channel 630, it is rotated 90 degrees, so that
the engagement arms 628 are inserted into space 631, thereby
engaged between sections 633 and 636 so as to be mounted within the
channel 630. The engaged orientation is illustrated by connector
622.
[0059] According to an optional feature, toothed tracks 626 are
provided within the space 631, so that when the connector is
rotated to an engaging position, illustrated by connector 622, the
engagement arms 628 engage the toothed track and affix the
connector in its position. Conversely, when the connector is
rotated as illustrated by connector 624, the connector is free to
slide within channel 630 to be positioned anywhere along the
channel 630. As illustrated in FIG. 6B, an interconnection kit 642
may also be fitted to each connector when it is desired to
interconnect the connector to maintain relative position of the
connectors.
[0060] FIGS. 7A-7C illustrates embodiments for server-level
integration of the connector module. As illustrated, multiple
modules 700 can be attached to the chassis and used to implement
various fluid connections, depending on the cooling requirements.
The ability to change elevation of each connector becomes
especially advantageous when the fluid flow design is assisted by
gravity or thermosiphon, for which difference in elevation may
create a motive force. For example, in FIG. 7A cooling element 703
may employ phase change cooling, wherein the "hot" line 702
delivers vapor to connector 722, while the return line 704 delivers
cooled liquid from connector 724. To assist in the circulation of
the fluid, connector 722 is positioned vertically higher than
connector 724, conforming to the natural thermosiphon flow.
[0061] In the example of FIG. 7B, two microchips 753 and 755 are
mounted on the PCB 760. Microchip 755 is cooled by cooling device
705 and microchip 753 is cooled by cooling device 703. Cooling
devices 703 and 705 may be the same or different type of cooling
devices and may operate using single or multiple phase cooling
cycle. Consequently, the lines 702, 704, 702' and 704' may require
different blind mate connectors to accommodate different
specifications. Therefore, each of the modules 700 is designed to
accommodate different types of blind mate connectors and the
channel enables positioning these connectors at any orientation, as
required by the design of the chassis.
[0062] The embodiment illustrated in FIG. 7C is similar to that of
FIG. 7B, except that each pair of connectors is fixed at the same
vertical elevation. For example, connectors 722 and 724 are at the
same vertical elevation and connectors 722' and 724' are at the
same vertical elevation. Such an arrangement would be more useful
when the motive force applied to the fluid may include mechanical
force, such as a pump.
[0063] it should be appreciated that the embodiments illustrated in
FIGS. 7A-7C also illustrate the beneficial use of the connector
module for different racks' port availabilities. That is,
regardless of the type of cooling employed, sometimes when a server
is to be installed in a rack, different rack ports configuration
may be available, either due to prior equipment being already
installed or due to a particular design of the rack. Thus, the
connector module can be tailored to mate with the specific ports
that are available on the rack.
[0064] FIG. 8 illustrates an embodiment for a rack level connector
module 800. The connector module 800 provides cooling fluid
connection to the rack manifold 864 in a similar manner as
illustrated in the other embodiments. Connectors 822 and 824 can
slide within channel 830 to be positioned at any location along the
channel 830. Optionally, locators 870 are provided to enable
affixing the connectors at predefined dedicated locations that
match different port mating scenarios according to the rack
manifold design. That is, the locators 870 are placed in elevations
that conform to different rack manifold designs and standards.
Locators 870 may comprise markings on the frame or may comprise
mechanical stops for positioning the connectors in preselected
locations within the channels.
[0065] FIG. 8 also illustrates how the connector module can be used
for different types of racks. For example, the width of the module
800 may be set according to the size of the rack manifold 864.
Similarly, the locators can be set according to the spacing of
different port arrangements on the rack. Also, as in prior
embodiments, the entire module 800 can be rotated about mounting
point 810 to fit different port arrangements.
[0066] FIG. 9 illustrates an embodiment particularly suitable for
implementing closed loop thermosiphon cooling. In FIG. 9 the
connector module 900 is employed in a dual-phase cooling system
wherein it is positioned for connecting a cooling device 903, e.g.,
an evaporator mounted onto microchip 953, to a heat exchanger 908,
e.g., a condenser. The flow of the fluid may be accomplished via
thermosiphon, so that line 902 serves as a riser which delivers
gaseous fluid to connector 922, which is positioned at a higher
vertical position or altitude than the liquid connector 924. Once
the gas condenses within the condenser 908 it is returned via the
liquid return line 904, which is connected to liquid connector 924
at a lower altitude than gaseous connector 922. Using the connector
module 900 the riser connector 922 can be raised to an optimal
location to enable hot and high pressure gas to rise, while the
liquid connector 924 can be positioned lower to provide gravity
assist for the liquid flow optimization. In this manner the
connector module 900 enables blind mate connection of the cooling
system's lines, while also enhancing the fluid flow within the
cooling system.
[0067] Incidentally, the callout in FIG. 9 illustrates one simple
example for forming the locators 970. In this non-limiting example,
the locators are formed as a simple ball and detent mechanism. Ball
972 is urged against the wall of the module 900 by spring 974. When
sliding against the flat wall the ball little friction, but the
connector can be easily moved. Conversely, when the ball enters
detent 976, which is provided in any of the locators positions 970,
a mechanical stoppage is generated. This mechanical stoppage can be
easily overcome by a user moving the connector, but it prevents the
connector from freely sliding by itself, especially due to
gravity.
[0068] FIG. 10 is a general schematic illustrating embodiments of
the connector module employed in a heterogeneous computing rack.
Standard computing racks are generally designed according to
spacing of rack space specifications. This unit of measure
typically defines the size of the rack frame and the size of the
equipment fitted inside the frame, such that the sizes are
expressed in terms of rack units and/or form factors, such as Us.
For example, a typical full size rack cage may be of 42U high, and
the size of each particular equipment mounted within the rack may
typically be of 1U, 2U, 3U or 4U.
[0069] A heterogeneous rack would have equipment mounted therein
having different U sizes. The embodiment of FIG. 10 illustrates how
connector modules can be used to provide different connection
arrangements to different units within the rack. Notably, although
all of the connector modules 111 have the same design, each enables
different connection configuration to accommodate different
requirements.
[0070] In FIG. 10 the rack is divided into sections of 4U each,
although the equipment within each section may be of different
size, e.g., two units of 2U within one space, one 1U unit and one
3U units, etc. Since the connectors can slide within the channel of
each connector module 111, the height of each connector within its
4U space can be selected to accommodate the equipment mounted
within that space. For example, in the bottom space connector 122
is positioned at the 3U height, while connector 124 is positioned
at the 1U height. This corresponds to, e.g., the embodiment
illustrated in FIG. 9. Conversely, in the second 4U space both
connectors 122 and 124 are positioned horizontally aligned at the
3U space, at the third 4U space they are aligned horizontally at
the 1U height, and at the top space they are aligned at the 4U
height.
[0071] FIG. 11 is a flow chart illustrating a process according to
an embodiment. The process provides fluid connections employing any
of the connector modules described herein. In block 1100 a
plurality of modules may be mounted onto the electronic rack. Each
of the modules has at least two channels. At block 1105 a plurality
of fluid connectors are attached to the connector modules, wherein
at least one connector is attached to each channel. Then for each
chassis to be mounted onto the electronic rack, at block 1110 the
chassis is inspected to identify the spatial orientation of the
fluid inlet and outlet connectors. Then, at block 1115 the
connectors in at least two channels are slid to align them to the
spatial orientation of the inlet and outlet connectors of the
chassis. In block 1120 the chassis is mounted by engaging the inlet
and outlet connectors to the fluid connectors of the connector
module. In this case, it is desired that the connectors are of the
blind mate type, thus FIG. 11 includes block 1123 for blind mate
connection with the rack. If in block 1125 it is determined that
there are more chassis to mount, the process reverts to block 1110.
Otherwise, the process ends.
[0072] In the foregoing specification, embodiments of the invention
have been described with reference to specific exemplary
embodiments thereof. It will be evident that various modifications
may be made thereto without departing from the broader spirit and
scope of the invention as set forth in the following claims. The
specification and drawings are, accordingly, to be regarded in an
illustrative sense rather than a restrictive sense.
* * * * *