U.S. patent application number 17/172685 was filed with the patent office on 2022-08-11 for cooling system for an information handling system.
This patent application is currently assigned to Dell Products L.P.. The applicant listed for this patent is Dell Products L.P.. Invention is credited to Qinghong He, Allen B. McKittrick.
Application Number | 20220253113 17/172685 |
Document ID | / |
Family ID | 1000005414819 |
Filed Date | 2022-08-11 |
United States Patent
Application |
20220253113 |
Kind Code |
A1 |
McKittrick; Allen B. ; et
al. |
August 11, 2022 |
COOLING SYSTEM FOR AN INFORMATION HANDLING SYSTEM
Abstract
A compact and mobile information handling system, such as a
tablet, including a thermally-configured chassis having one or more
fans and one or more inlets for directing air flow directly across
components of the information handling system to cool such
components by convection. Such fans may additionally direct air
flow across a heat exchanger and/or heat pipe coupled to
heat-producing components like a central processing unit and/or
graphics processing unit. Components of the information handling
system may be positioned on the thermally-configured chassis and
used to efficiently direct the air flow throughout the chassis
without requiring additional space. The inlets and outlets may be
positioned on one or more sides of the information handling
system.
Inventors: |
McKittrick; Allen B.; (Cedar
Park, TX) ; He; Qinghong; (Austin, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dell Products L.P. |
Round Rock |
TX |
US |
|
|
Assignee: |
Dell Products L.P.
Round Rock
TX
|
Family ID: |
1000005414819 |
Appl. No.: |
17/172685 |
Filed: |
February 10, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 1/203 20130101;
G06T 1/20 20130101 |
International
Class: |
G06F 1/20 20060101
G06F001/20; G06T 1/20 20060101 G06T001/20 |
Claims
1. An apparatus, comprising: an information handling system chassis
having a top and a bottom, the top and bottom connected by a first
side; a first fan positioned between the top and bottom on the
information handling system chassis, the first fan configured to
receive a first quantity of air from outside the information
handling system chassis and deliver the first quantity of air to
components positioned on the information handling system chassis to
cool the components by convection; a first inlet positioned on the
first side, the first inlet configured to receive the first
quantity of air; a first gasket positioned between the top and
bottom on the information handling system chassis, the first gasket
defining a first passageway configured to direct the first quantity
of air from the first inlet to the first fan; and a first audio
system component positioned in the first passageway.
2. The apparatus of claim 1, wherein: the first fan is a dual
opposite outlet fan having a first air outlet configured to deliver
a first portion of the first quantity of air in a first direction
and a second first air outlet configured to deliver a second
portion of the first quantity of air in a second direction; and the
top of the information handling system chassis includes a
touchscreen such that the first fan is positioned between the
touchscreen and the bottom on the information handling system
chassis.
3. The apparatus of claim 1, further comprising a first antenna
component positioned between the top and bottom of the information
handling system chassis and positioned within a second passageway
that extends from the first fan to an outlet of the information
handling system chassis.
4. The apparatus of claim 1, further comprising: a second side
connecting the top and bottom, the second side adjacent to the
first side; and an outlet positioned on the second side, the outlet
configured to permit discharge of the first quantity of air from
the information handling system chassis.
5. The apparatus of claim 4, further comprising a first antenna
component adjacent to the outlet and between the top and bottom on
the information handling system chassis, the first antenna
configured to direct the first quantity of air from the first fan
to the outlet.
6. The apparatus of claim 1, further comprising: a second side
connecting the top and bottom; a second fan positioned between the
top and bottom on the information handling system chassis, the
second fan configured to receive a second quantity of air from
outside the information handling system chassis and deliver the
second quantity of air to components positioned on the information
handling system chassis to cool the components by convection; a
second inlet positioned on the second side, the second inlet
configured to receive the second quantity of air; and a second
gasket positioned between the top and bottom on the information
handling system chassis, the second gasket defining a second
passageway configured to direct the second quantity of air from the
second inlet to the second fan.
7. The apparatus of claim 6, where the second fan is a dual
opposite outlet fan.
8. The apparatus of claim 6, further comprising: a second audio
system component positioned in the second passageway; a third side
connecting the top and bottom, the third side connecting the first
side and the second side; an outlet positioned on the third side,
the outlet configured to permit discharge of the second quantity of
air from the information handling system chassis; and a second
antenna component positioned adjacent to the outlet and between the
top and bottom on the information handling system chassis, the
second antenna configured to direct the second quantity of air from
the second fan to the outlet.
9. The apparatus of claim 6, further comprising a central
processing unit component or a graphics processing unit component
positioned on the information handling system chassis between the
first fan and second fan and between the top and bottom, at least
one of the first and second fans configured to deliver a quantity
of air to the central processing unit or the graphics processing
unit to cool it by convection.
10. A method, comprising: receiving a first quantity of air through
a first inlet positioned on a first side of an information handling
system chassis, the first side connecting a top and a bottom of the
information handling system chassis; directing the first quantity
of air through a first passageway defined by a first gasket to a
first fan positioned on the information handling system chassis
between the top and bottom; and directing the first quantity of air
through a second passageway from the first fan to an outlet of the
information handling system chassis, a first antenna component
positioned in the first passageway; and discharging the first
quantity of air through the outlet.
11. The method of claim 10, further comprising directing with the
first fan the first quantity of air across components positioned on
the information handling system chassis to cool the components by
convection, where the first fan is a dual opposite outlet fan.
12. The method of claim 10, where the outlet is positioned on a
second side of the information handling system chassis, the second
side connecting the top and the bottom and being adjacent to the
first side.
13. The method of claim 10, further comprising directing a second
quantity of air through a third passageway defined by a second
gasket to a second fan positioned on the information handling
system chassis.
14. The method of claim 13, further comprising: receiving the
second quantity of air through a second inlet positioned on a third
side of the information handling system chassis, the third side
connecting the top and the bottom.
15. The method of claim 14, further comprising directing with the
second fan the second quantity of air across components positioned
on the information handling system chassis to cool the components
by convection.
16. The method of claim 14, further comprising discharging the
second quantity of air through an outlet positioned on a second
side of the information handling system chassis, the second side
connecting the top and the bottom and being adjacent to the first
side.
17. The method of claim 16, further comprising directing the second
quantity of air through a fourth passageway from the second fan to
the outlet, a second antenna component positioned in the fourth
passageway.
18. An information handling system, comprising: a chassis having a
top and a bottom, the top and bottom connected by a first side and
a second side, the first side adjacent to the second side; a first
fan positioned between the top and bottom on the chassis, the first
fan configured to receive a first quantity of air from outside the
chassis and deliver the first quantity of air to components of the
information handling system to cool the components by convection; a
second fan positioned between the top and bottom on the chassis,
the second fan configured to receive a second quantity of air from
outside the chassis and deliver the second quantity of air to
components of the information handling system to cool the
components by convection; a first inlet positioned on the first
side, the first inlet configured to receive the first quantity of
air; a first gasket positioned between the top and bottom on the
chassis, the first gasket configured to direct the first quantity
of air from the first inlet to the first fan; and a second gasket
positioned between the top and bottom on the chassis, the second
gasket configured to direct the second quantity of air from a
second inlet to the second fan.
19. The information handling system of claim 18, further
comprising: a third side connecting the top and the bottom, the
second side connecting the first side and the third side the second
inlet positioned on the third side and configured to receive the
second quantity of air; and an outlet positioned on the second
side, the outlet configured to permit discharge of the first
quantity of air from the chassis, where the outlet is further
configured to permit discharge of the second quantity of air from
the chassis.
20. The information handling system of claim 19, further comprising
a central processing unit or a graphics processing unit positioned
between the first fan and the second fan on the chassis, at least
one of the first and second fans configured to deliver a quantity
of air to the central processing unit or the graphics processing
unit to cool it by convection.
Description
FIELD OF THE DISCLOSURE
[0001] The instant disclosure relates to information handling
systems. More specifically, portions of this disclosure relate to a
cooling system for an information handling system.
BACKGROUND
[0002] As the value and use of information continues to increase,
individuals and businesses seek additional ways to process and
store information. One option available to users is information
handling systems. An information handling system generally
processes, compiles, stores, and/or communicates information or
data for business, personal, or other purposes thereby allowing
users to take advantage of the value of the information. Because
technology and information handling needs and requirements vary
between different users or applications, information handling
systems may also vary regarding what information is handled, how
the information is handled, how much information is processed,
stored, or communicated, and how quickly and efficiently the
information may be processed, stored, or communicated. The
variations in information handling systems allow for information
handling systems to be general or configured for a specific user or
specific use such as financial transaction processing, airline
reservations, enterprise data storage, or global communications. In
addition, information handling systems may include a variety of
hardware and software components that may be configured to process,
store, and communicate information and may include one or more
computer systems, data storage systems, and networking systems.
[0003] In recent years, information handling systems have been
created as lightweight, personal, portable devices, commonly known
as a tablet. As the popularity of such devices has risen, so has
the demand for increased capability of their information handling
system components, including, for example, processing speed,
connectivity, graphics, and displays. More powerful components
often generate more heat as a by-product of their increased
performance and consequently demand more robust thermal dissipation
solutions. However, tablets and other compact information handling
systems have limited space relative to larger, traditional mobile
information handling systems like laptop computers. In addition,
touchscreen devices like tablets are designed to be held by a user
during use and are therefore thermally constrained not only by the
thermal limits of the information handling system components but
also by the acceptable thermal limits of the user.
[0004] Shortcomings mentioned here are only representative and are
included to highlight problems that the inventors have identified
with respect to existing information handling systems and sought to
improve upon. Aspects of the information handling systems described
below may address some or all of the shortcomings as well as others
known in the art. Aspects of the improved information handling
systems described below may present other benefits, and be used in
other applications, than those described above.
SUMMARY
[0005] Unlike traditional methods of thermal dissipation for less
compact mobile information handling systems, like laptop computers,
a compact and mobile information handling system, such as a tablet,
may include a thermally-configured chassis having one or more fans
and one or more inlets for directing air flow directly across
components of the information handling system to cool such
components by convection. Such fan(s) may additionally direct air
flow across a heat exchanger and/or heat pipe coupled to
heat-producing components like a central processing unit and/or
graphics processing unit. For example, such a fan may be a dual
opposite outlet fan, as described in U.S. Pat. No. 10,584,717 ("DOO
fan"). Components of the information handling system may be
positioned on the thermally-configured chassis and used to
efficiently direct the air flow throughout the chassis without
requiring additional space. For example, an audio system speaker of
the information handling system may be positioned in the inlet air
path so that such path can be used not only for directing air to a
fan but also as a sound chamber for the speaker. In addition, the
chassis may be configured to meet thermal requirements unique to a
tablet. For example, the inlet(s) and outlet(s) may be positioned
on one or more sides of the tablet. Such inlet(s) and outlet(s)
cannot be practically positioned on the top of the tablet because
that surface is reserved for an interactive screen, such as an LCD
touchscreen. Likewise, the inlet(s) and the outlet(s) cannot be
practically positioned on the back of the tablet because such
inlet(s) and/or outlet(s) may be blocked if the back of the tablet
is placed on a flat surface during use. As another example, the
thermally-configured chassis may include a battery along its bottom
half and a fan near each of its upper corners such that those areas
of the chassis are kept cool relative to components of the
information handling system positioned in the upper-middle of the
tablet (i.e., where users rarely touch the information handling
system).
[0006] According to one embodiment, there is an information
handling system chassis having a top and a bottom connected by one
or more sides and one or more fans positioned between the top and
bottom. The fans may be configured to receive air from outside the
chassis and deliver the air to components of the information
handling system to cool them by convection. For example, the fans
may be DOO fans and/or may direct air across heat-producing
components like a CPU or GPU. The chassis may include one or more
inlets positioned on the side(s) for receiving the air for the
fan(s). The chassis may also include a gasket for directing the air
between the inlet(s) and the fan(s). One or more audio system
components, such as a speaker, may be positioned within the
gasket(s). Each fan may direct the air not only across components
of the information handling system, but also across a heat
exchanger and/or heat pipe coupled to heat-producing components
like a CPU or GPU before the air is discharged through one or more
outlet. The outlet(s) can be positioned on a side of the chassis.
Antenna components, such as those with WiFi or LTE functionality,
may be positioned adjacent to the outlet(s) and may be formed such
that the antenna components direct the air out of the chassis.
Buttons and other external components (e.g., ports) of the
information handling system may be of a low profile to permit space
for the inlet(s) and outlet(s). In some embodiments, there are two
fans, with one positioned generally in an upper right corner of the
chassis and the other positioned generally in an upper left corner
of the chassis such that these areas are kept relatively cool
compared to the upper-middle of the chassis (i.e., where users
touch the information handling system less often). In some
embodiments, significant heat-producing components, such as CPUs
and GPUs are positioned on the upper-middle of the chassis and, if
the chassis includes two fans as just provided, between the fans.
In some embodiments, a battery is positioned on the lower half of
the chassis between the top and bottom.
[0007] Some embodiments include a method for receiving and
directing air through the chassis and for discharging the air from
the chassis using the apparatus(es) just described. The method may
be embedded in a computer-readable medium as computer program code
comprising instructions that cause a processor to perform the steps
of the method.
[0008] As used herein, the term "coupled" means connected, although
not necessarily directly, and not necessarily mechanically; two
items that are "coupled" may be unitary with each other. The terms
"a" and "an" are defined as one or more unless this disclosure
explicitly requires otherwise. The term "substantially" is defined
as largely but not necessarily wholly what is specified (and
includes what is specified; e.g., substantially parallel includes
parallel), as understood by a person of ordinary skill in the
art.
[0009] The phrase "and/or" means "and" or "or". To illustrate, A,
B, and/or C includes: A alone, B alone, C alone, a combination of A
and B, a combination of A and C, a combination of B and C, or a
combination of A, B, and C. In other words, "and/or" operates as an
inclusive or.
[0010] Further, a device or system that is configured in a certain
way is configured in at least that way, but it can also be
configured in other ways than those specifically described.
[0011] The terms "comprise" (and any form of comprise, such as
"comprises" and "comprising"), "have" (and any form of have, such
as "has" and "having"), and "include" (and any form of include,
such as "includes" and "including") are open-ended linking verbs.
As a result, an apparatus or system that "comprises," "has," or
"includes" one or more elements possesses those one or more
elements, but is not limited to possessing only those elements.
Likewise, a method that "comprises," "has," or "includes," one or
more steps possesses those one or more steps, but is not limited to
possessing only those one or more steps.
[0012] The foregoing has outlined rather broadly certain features
and technical advantages of embodiments of the present invention in
order that the detailed description that follows may be better
understood. Additional features and advantages will be described
hereinafter that form the subject of the claims of the invention.
It should be appreciated by those having ordinary skill in the art
that the conception and specific embodiment disclosed may be
readily utilized as a basis for modifying or designing other
structures for carrying out the same or similar purposes. It should
also be realized by those having ordinary skill in the art that
such equivalent constructions do not depart from the spirit and
scope of the invention as set forth in the appended claims.
Additional features will be better understood from the following
description when considered in connection with the accompanying
figures. It is to be expressly understood, however, that each of
the figures is provided for the purpose of illustration and
description only and is not intended to limit the present
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0013] For a more complete understanding of the disclosed system
and methods, reference is now made to the following descriptions
taken in conjunction with the accompanying drawings. Elements
within each FIGURE are generally drawn to scale relative to other
elements in the same FIGURE.
[0014] FIG. 1 is a schematic block diagram of an example
information handling system according to some embodiments of the
disclosure.
[0015] FIG. 2 is a bottom perspective view of an example
information handling system having a fan and side inlet according
to some embodiments of the disclosure.
[0016] FIG. 3 is a cross-sectional top view of the information
handling system of FIG. 2.
[0017] FIG. 4 is a partial cross-sectional perspective view of a
portion of FIG. 2.
[0018] FIG. 5 is a partial cross-sectional perspective view along
the line 5-5 of FIG. 2.
[0019] FIG. 6 is a partial cross-sectional perspective view along
the line 6-6 of FIG. 2.
[0020] FIG. 7 is a representative thermal image plot of a top
perspective view of an information handling system according to
some embodiments of the disclosure.
[0021] FIG. 8 is a flow chart illustrating a method for cooling
components of an information handling system according to some
embodiments of the disclosure.
DETAILED DESCRIPTION
[0022] For purposes of this disclosure, an information handling
system may include any instrumentality or aggregate of
instrumentalities operable to compute, calculate, determine,
classify, process, transmit, receive, retrieve, originate, switch,
store, display, communicate, manifest, detect, record, reproduce,
handle, or utilize any form of information, intelligence, or data
for business, scientific, control, or other purposes. For example,
an information handling system may be a personal computer (e.g.,
desktop or laptop), tablet computer, mobile device (e.g., personal
digital assistant (PDA) or smart phone), server (e.g., blade server
or rack server), a network storage device, or any other suitable
device and may vary in size, shape, performance, functionality, and
price. The information handling system may include random access
memory (RAM), one or more processing resources such as a central
processing unit (CPU) or hardware or software control logic, ROM,
and/or other types of nonvolatile memory. Additional components of
the information handling system may include one or more disk
drives, one or more network ports for communicating with external
devices as well as various input and output (I/O) devices, such as
a keyboard, a mouse, touchscreen and/or a video display. The
information handling system may also include one or more buses
operable to transmit communications between the various hardware
components.
[0023] An information handling system may include a variety of
components to generate, process, display, manipulate, transmit, and
receive information. One example of an information handling system
100 is shown in FIG. 1. IHS 100 may include one or more central
processing units (CPUs) 102. In some embodiments, IHS 100 may be a
single-processor system with a single CPU 102, while in other
embodiments IHS 100 may be a multi-processor system including two
or more CPUs 102 (e.g., two, four, eight, or any other suitable
number). CPU(s) 102 may include any processor capable of executing
program instructions. For example, CPU(s) 102 may be processors
capable of implementing any of a variety of instruction set
architectures (ISAs), such as the x86, POWERPC.RTM., ARM.RTM.,
SPARC.RTM., or MIPS.RTM. ISAs, or any other suitable ISA. In
multi-processor systems, each of CPU(s) 102 may commonly, but not
necessarily, implement the same ISA.
[0024] CPU(s) 102 may be coupled to northbridge controller or
chipset 104 via front-side bus 106. The front-side bus 106 may
include multiple data links arranged in a set or bus configuration.
Northbridge controller 104 may be configured to coordinate I/O
traffic between CPU(s) 102 and other components. For example,
northbridge controller 104 may be coupled to graphics device(s) 108
(e.g., one or more video cards or adaptors, etc.) via graphics bus
110 (e.g., an Accelerated Graphics Port or AGP bus, a Peripheral
Component Interconnect or PCI bus, etc.). Northbridge controller
104 may also be coupled to system memory 112 via memory bus 114.
Memory 112 may be configured to store program instructions and/or
data accessible by CPU(s) 102. In various embodiments, memory 112
may be implemented using any suitable memory technology, such as
static RAM (SRAM), synchronous dynamic RAM (SDRAM),
nonvolatile/Flash-type memory, or any other type of memory.
[0025] Northbridge controller 104 may be coupled to southbridge
controller or chipset 116 via internal bus 118. Generally,
southbridge controller 116 may be configured to handle various of
IHS 100's I/O operations, and it may provide interfaces such as,
for instance, Universal Serial Bus (USB), audio, serial, parallel,
Ethernet, etc., via port(s), pin(s), and/or adapter(s) 132 over bus
134. For example, southbridge controller 116 may be configured to
allow data to be exchanged between IHS 100 and other devices, such
as other IHS s attached to a network. In various embodiments,
southbridge controller 116 may support communication via wired or
wireless data networks, such as any via suitable type of Ethernet
network, via telecommunications/telephony networks such as analog
voice networks or digital fiber communications networks, via
storage area networks such as Fiber Channel SANs, or via any other
suitable type of network and/or protocol.
[0026] Southbridge controller 116 may also enable connection to one
or more keyboards, keypads, touch screens, scanning devices, voice
or optical recognition devices, or any other devices suitable for
entering or retrieving data. Multiple I/O devices may be present in
IHS 100. In some embodiments, I/O devices may be separate from IHS
100 and may interact with IHS 100 through a wired or wireless
connection. As shown, southbridge controller 116 may be further
coupled to one or more PCI devices 120 (e.g., modems, network
cards, sound cards, video cards, etc.) via PCI bus 122. Southbridge
controller 116 may also be coupled to Basic I/O System (BIOS) 124,
Super I/O Controller 126, and Baseboard Management Controller (BMC)
128 via Low Pin Count (LPC) bus 130.
[0027] IHS 100 may be configured to access different types of
computer-accessible media separate from memory 112. Generally
speaking, a computer-accessible medium may include any tangible,
non-transitory storage media or memory media such as electronic,
magnetic, or optical media, including a magnetic disk, a hard
drive, a CD/DVD-ROM, and/or a Flash memory. Such mediums may be
coupled to IHS 100 through various interfaces, such as universal
serial bus (USB) interfaces, via northbridge controller 104 and/or
southbridge controller 116. Some such mediums may be coupled to the
IHS through a Super I/O Controller 126 which combines interfaces
for a variety of lower bandwidth or low data rate devices. Those
devices may include, for example, floppy disks, parallel ports,
keyboard and mouse and other user input devices, temperature
sensors, and/or fan speed monitoring.
[0028] BIOS 124 may include non-volatile memory having program
instructions stored thereon. The instructions stored on the BIOS
124 may be usable by CPU(s) 102 to initialize and test other
hardware components. The BIOS 124 may further include instructions
to load an Operating System (OS) for execution by CPU(s) 102 to
provide a user interface for the IHS 100, with such loading
occurring during a pre-boot stage. In some embodiments, firmware
execution facilitated by the BIOS 124 may include execution of
program code that is compatible with the Unified Extensible
Firmware Interface (UEFI) specification, although other types of
firmware may be used.
[0029] BMC controller 128 may include non-volatile memory having
program instructions stored thereon that are usable by CPU(s) 102
to enable remote management of IHS 100. For example, BMC controller
128 may enable a user to discover, configure, and/or manage BMC
controller 128. Further, the BMC controller 128 may allow a user to
setup configuration options, resolve and administer hardware or
software problems, etc. Additionally or alternatively, BMC
controller 128 may include one or more firmware volumes, each
volume having one or more firmware files used by the BIOS firmware
interface to initialize and test components of IHS 100.
[0030] One or more of the devices or components shown in FIG. 1 may
be absent, or one or more other components may be added. Further,
in some embodiments, components may be combined onto a shared
circuit board and/or implemented as a single integrated circuit
(IC) with a shared semiconductor substrate. For example,
northbridge controller 104 may be combined with southbridge
controller 116, and/or be at least partially incorporated into
CPU(s) 102. Accordingly, systems and methods described herein may
be implemented or executed with other computer system
configurations. In some cases, various elements shown in FIG. 1 may
be mounted on a motherboard and enclosed within a chassis of the
IHS 100.
[0031] FIG. 2 depicts a compact, mobile information handling system
with an interactive touchscreen, commonly referred to a tablet. IHS
1000 includes a chassis having bottom 1100 and a top 1200 (shown in
FIG. 7) that are connected by four sides 1300, 1400, 1500, and
1600. Side 1300 includes an inlet 1310. Inlet 1310 is positioned
only on a portion of side 1300 so that other external components of
IHS 1000 may also be positioned on side 1300. For example, as
shown, side 1300 includes a hinged stand 1320 (e.g., for supporting
IHS 1000 in an upright position on a surface), low profile audio
slots 1330 (e.g., for permitting sound from internal speakers to
exit the chassis), low profile port 1340 (e.g., a SIM card slot),
and port 1350 (e.g., a power port). Side 1300 is connected to side
1400. Side 1400 may include one or more outlets 1410, 1420, 1430
(alternatively, outlets 1410, 1420, and 1430 may be unitary). Like
inlet 1300, outlets 1410, 1420, 1430 may be positioned only on a
portion of side 1400 to permit positioning on side 1400 of other
external components of IHS 1000, such as button 1450 (e.g., a power
button). The inlets and outlets may be sealed at portions, for
example, at portion 1440 between inlet 1310 and outlet 1420 (and,
optionally, between outlets 1420 and 1410, and 1410 and 1430).
[0032] As shown more clearly in FIG. 3, side 1500 may be arranged
similarly to side 1300 and include an inlet 1510 along a similar
portion of side 1500. There are four primary sections of IHS 1000:
(a) a lower section comprised almost entirely of a battery 7000,
(b) an upper middle section comprising IHS processing components
6000, such as a CPU or GPU, and an outlet 1410, (c) an upper right
section comprising inlet 1310, gasket 1700a, audio component 3000a
(e.g., a speaker), fan 2000a, outlet 1420, and antenna component
5000 (e.g., an antenna with LTE functionality), and (d) an upper
left section comprising inlet 1510, gasket 1700b, audio component
3000b (e.g., a speaker), fan 2000b, outlet 1430, and antenna
component 4000 (e.g., an antenna with WiFi functionality).
[0033] In operation, inlet 1310 may receive a first quantity of air
8000 into the chassis that is directed to fan 2000a by gasket
1700a. Air 8000 is received through fan inlet 2010a (shown more
clearly in FIG. 4) and discharged by fan 2000a through the chassis
in two different directions 8010 and 8020. The portion of air 8000
discharged in direction 8010 flows directly across components 6000
of IHS 1000, such as a CPU and/or GPU, to cool them by convection.
Components of the IHS, such as battery 7000 may be positioned
within the chassis of IHS 1000 to direct the flow of this portion
of air. This portion of air 8000 is then discharged from the
chassis of IHS 1000 through outlet 1410. The portion of air 8000
discharged in direction 8020 flows across a heat pipe 6010a and/or
heat exchanger 6020a (shown more clearly in FIG. 6). Heat pipe
6010a is thermally coupled to heat-generating components of IHS
1000, such as a CPU and/or GPU, positioned in the upper middle of
the chassis. The portion of air 8000 discharged in direction 8020
is then discharged from the chassis of IHS 1000 through outlet
1420.
[0034] The components in the upper left section of IHS 1000
function similarly. Inlet 1510 may receive a first quantity of air
9000 into the chassis that is directed to fan 2000b by gasket
1700b. Air 9000 is received through fan inlet 2010b (not shown but
substantially the same as fan inlet 2010a) and discharged by fan
2000b through the chassis in two different directions 9010 and
9020. The portion of air 9000 discharged in direction 9010 flows
directly across components 6000 of IHS 1000, such as a CPU and/or
GPU, to cool them by convection. Components of the IHS, such as
battery 7000 may be positioned within the chassis of IHS 1000 to
direct the flow of this portion of air. This portion of air 9000 is
then discharged from the chassis of IHS 1000 through outlet 1410.
The portion of air 9000 discharged in direction 9020 flows across a
heat pipe 6010b and/or heat exchanger 6020b (not shown but
substantially the same as heat pipe 6010a and heat exchanger
6020b). Heat pipe 6010b is thermally coupled to heat-generating
components of IHS 1000, such as a CPU and/or GPU, positioned in the
upper middle of the chassis. The portion of air 9000 discharged in
direction 9020 is then discharged from the chassis of IHS 1000
through outlet 1430.
[0035] In the embodiment of IHS 1000, fans 2000a and 2000b are each
a DOO fan. As explained more fully in U.S. Pat. No. 10,584,717, a
DOO fan may improve efficiency by having many thin fan blades that
are relatively larger than the fan body. Additionally, DOO fans
include two outlets, rather than just one, which allows the fan to
include a large fan impeller. Further details of DOO fans may be
found in U.S. Pat. No. 10,584,717.
[0036] Gaskets 1700a and 1700b are shaped to not only direct
quantities of air 8000 and 9000 to fans 2000a, 2000b, respectively;
they also form sound chambers for audio components of IHS 1000,
such as speakers 3000a, 3000b. Similarly, antennas 4000 and 5000
are shaped to direct air from fans 2000b, 2000a to outlets 1420,
1430, respectively. These configurations allow the chassis of IHS
1000 to remain compact despite the inclusion of additional thermal
dissipation components, like a second fan and gaskets. As a result,
IHS 1000 can remain compact and mobile while including more
powerful, but also more heat-generating, components, such as more
powerful processing components 6000 and other components (such as
more powerful antennas 4000, 5000 and more powerful speakers 3000a,
3000b). The thermal configuration just described also provides a
better user experience. As shown in FIG. 7, the IHS 1000 has a
thermal profile (shown in contour lines) across four primary
sections W, X, Y, and Z that generally correspond to the lower,
upper middle, upper right, and upper left sections described above.
As a result of the thermal dissipation features just described, at
least sections X, Y, and Z (and in some cases section W) are
relatively cooler to the touch than they would be otherwise (i.e.,
as a result of the fans 2000a, 2000b discharging air across the IHS
components in the manner described above). It is particularly
advantageous to cool section Y and Z because these (in addition to
section W) are the areas of IHS 1000 that are most often touched by
a user during operation of IHS 1000 (in contrast to section X). If,
for example, fan 2000b were not included in IHS 1000, section X
would have a hotter heat profile than shown in FIG. 7 (because only
one fan would be directing cool air across it) and section Z would
have a profile similar to (or worse) than that of that section
X.
[0037] Turning now to FIG. 8, which is a flow chart illustrating a
method 200 of cooling components of an IHS, such as IHS 1000. In
step 204, the IHS operates a fan to intake a quantity of air
through an inlet positioned on the side of the IHS chassis (and, in
some embodiments, not on the top or bottom of the chassis). In step
208, the quantity of air is guided to the fan by an gasket on the
IHS chassis that is positioned between the inlet and the fan. In
step 212, the fan discharges a first portion of the quantity of air
into the chassis and across components of the chassis, such as
heat-producing components like a CPU and/or GPU, to cool such
components by convection. In step 216, the fan discharges a second
portion of the quantity of air across a heat pipe that is coupled
to components of the chassis, such as heat-producing components
likes a CPU and/or GPU, to cool the heat pipe (and/or a heat sink
coupled thereto). In step 220, the quantity of air is discharged,
after cooling the components and heat pipe, through one or more
outlets positioned on the a side of the IHS (and, in some
embodiments, not on the top or bottom of the chassis). In some
embodiments, this method is performed continuously while the IHS is
in operation. In some embodiments, a second, second inlet, and
second gasket are used in the IHS to perform this same method.
[0038] Although the present disclosure and certain representative
advantages have been described in detail, it should be understood
that various changes, substitutions and alterations can be made
herein without departing from the spirit and scope of the
disclosure as defined by the appended claims. Moreover, the scope
of the present application is not intended to be limited to the
particular embodiments of the process, machine, manufacture,
composition of matter, means, methods and steps described in the
specification. As one of ordinary skill in the art will readily
appreciate from the present disclosure, processes, machines,
manufacture, compositions of matter, means, methods, or steps,
presently existing or later to be developed that perform
substantially the same function or achieve substantially the same
result as the corresponding embodiments described herein may be
utilized. Accordingly, the appended claims are intended to include
within their scope such processes, machines, manufacture,
compositions of matter, means, methods, or steps.
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