U.S. patent application number 17/177163 was filed with the patent office on 2022-08-04 for crossflow air deflector for high density independent airflow control.
The applicant listed for this patent is Western Digital Technologies, Inc.. Invention is credited to Steven Cheng, Nicholas Maris, Joe Paul Moolanmoozha, Shailesh R. Nayak, Erik Silaprasay.
Application Number | 20220244763 17/177163 |
Document ID | / |
Family ID | |
Filed Date | 2022-08-04 |
United States Patent
Application |
20220244763 |
Kind Code |
A1 |
Nayak; Shailesh R. ; et
al. |
August 4, 2022 |
CROSSFLOW AIR DEFLECTOR FOR HIGH DENSITY INDEPENDENT AIRFLOW
CONTROL
Abstract
A crossflow air deflector part for directing airflow includes a
front central spine, a first arcuate wall extending from the spine
to a first back lateral edge of the airflow deflector, and a second
arcuate wall extending from the spine to a second back lateral edge
of the airflow deflector opposing the first back lateral edge. Such
an airflow deflector can be implemented into a storage server,
positioned between a laterally adjacent pair of data storage device
(DSD) chambers and a pair of vertically stacked fans, such that the
crossflow air deflector functions to direct airflow from one of the
lateral DSD chambers into the lower fan and to direct airflow from
the other lateral DSD chamber into the upper fan. Independent
airflow control for each DSD chamber and each corresponding DSD is
thereby provided.
Inventors: |
Nayak; Shailesh R.;
(Bangalore, IN) ; Moolanmoozha; Joe Paul;
(Bangalore, IN) ; Cheng; Steven; (Sunnyvale,
CA) ; Silaprasay; Erik; (San Jose, CA) ;
Maris; Nicholas; (Union City, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Western Digital Technologies, Inc. |
San Jose |
CA |
US |
|
|
Appl. No.: |
17/177163 |
Filed: |
February 16, 2021 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
63144247 |
Feb 1, 2021 |
|
|
|
International
Class: |
G06F 1/20 20060101
G06F001/20; G05B 19/404 20060101 G05B019/404; H05K 7/20 20060101
H05K007/20 |
Claims
1. A data storage device (DSD) assembly having a lateral width
direction, a vertical height direction, and a proximal end and a
distal end along a longitudinal length direction, the DSD assembly
comprising: a first DSD chamber extending along the longitudinal
direction for housing a first data storage device; a second DSD
chamber extending along the longitudinal direction, adjacent to the
first DSD chamber along the lateral direction, for housing a second
data storage device; a lower first fan positioned at the distal end
of and spanning the lateral width of the assembly; an upper second
fan positioned at the distal end of and spanning the lateral width
of the assembly and above the first fan along the vertical
direction; and a crossflow air deflector positioned between a
distal end of the first and second DSD chambers and the first and
second fans.
2. The DSD assembly of claim 1, wherein the crossflow air deflector
is configured to direct airflow from the first DSD chamber into the
lower first fan and to direct airflow from the second DSD chamber
into the upper second fan.
3. The DSD assembly of claim 2, wherein the crossflow air deflector
comprises: a proximal central spine extending in the vertical
direction and positioned between the first and second DSD chambers;
a first panel extending in the longitudinal direction from the
spine to a first distal lateral corner; and a second panel
extending in the longitudinal direction from the spine to a second
distal lateral corner opposing the first distal lateral corner.
4. The DSD assembly of claim 1, wherein the crossflow air deflector
comprises: a proximal central spine extending in the vertical
direction and positioned between the first and second DSD chambers;
a first deflection panel extending in the longitudinal direction
from the spine to a first distal lateral corner; and a second
deflection panel extending in the longitudinal direction from the
spine to a second distal lateral corner opposing the first distal
lateral corner.
5. The DSD assembly of claim 1, further comprising: a plurality of
data storage devices each housed in a corresponding first or second
DSD chamber; wherein each DSD chamber has a lateral width providing
a gap between an outer panel of the DSD chamber and the
corresponding data storage device.
6. The DSD assembly of claim 1, further comprising a plurality of
adjacent pairs of first and second DSD chambers.
7. The DSD assembly of claim 6, wherein the DSD assembly is a data
storage system comprising a plurality of data storage devices each
housed in a corresponding first or second DSD chamber.
8. The DSD assembly of claim 6, wherein the DSD assembly is a data
storage system comprising a plurality of solid-state drives (SSDs)
each housed in a corresponding first or second DSD chamber.
9. The DSD assembly of claim 6, wherein the DSD assembly is a data
storage device test system comprising a plurality of data storage
devices each housed in a corresponding first or second DSD chamber,
the DSD assembly further comprising: means for heating positioned
between the first and second DSD chambers.
10. The DSD assembly of claim 6, wherein the DSD assembly is a data
storage device test system comprising a plurality of data storage
devices each housed in a corresponding first or second DSD chamber,
the DSD assembly further comprising: first means for heating
positioned adjacent to the first DSD chamber; and second means for
heating positioned adjacent to the second DSD chamber.
11. (canceled)
12. (canceled)
13. (canceled)
14. (canceled)
15. (canceled)
16. (canceled)
17. A method for controlling airflow in a data storage device (DSD)
assembly having a lateral width direction, a vertical height
direction, and a proximal end and a distal end along a longitudinal
length direction, the method comprising: drawing a first airflow
through a first DSD chamber, at a first lateral position,
configured for housing a first data storage device; drawing a
second airflow through a second DSD chamber, at a second lateral
position adjacent to the first DSD chamber, configured for housing
a second data storage device; deflecting the first airflow from the
first lateral position to a lower fan positioned at the distal end
and spanning the lateral width; and deflecting the second airflow
from the second lateral position to an upper fan positioned at the
distal end and spanning the lateral width over the lower fan; and
wherein deflecting the first airflow and the second airflow is via
a crossflow air deflector positioned between a distal end of the
first and second DSD chambers and the lower and upper fans.
18. The method of claim 17, wherein: drawing the first airflow
through the first DSD chamber includes drawing the first airflow
across an outer surface of the first data storage device; and
drawing the second airflow through the second DSD chamber includes
drawing the second airflow across an outer surface of the second
data storage device.
19. The method of claim 17, wherein: drawing the first airflow
through the first DSD chamber includes drawing the first airflow
across a first heater corresponding to the first data storage
device; and drawing the second airflow through the second DSD
chamber includes drawing the second airflow across a second heater
corresponding to the second data storage device.
20. The method of claim 17, wherein: drawing the first airflow
through the first DSD chamber includes drawing the first airflow
across an outer surface of the first data storage device and across
a first heater corresponding to the first data storage device; and
drawing the second airflow through the second DSD chamber includes
drawing the second airflow across an outer surface of the second
data storage device and across a second heater corresponding to the
second data storage device.
21. The DSD assembly of claim 1, wherein the crossflow air
deflector comprises: a proximal central spine; a first arcuate wall
extending from the spine to a first distal lateral edge of the
airflow deflector; and a second arcuate wall extending from the
spine to a second distal lateral edge of the airflow deflector
opposing the first distal lateral edge.
22. The DSD assembly of claim 21, wherein the crossflow air
deflector further comprises: a closeout cover with which the spine
and the first arcuate wall are coupled; and a closeout base with
which the spine and the second arcuate wall are coupled.
23. The DSD assembly of claim 21, wherein the first and second
arcuate walls are configured to direct airflow from a first lateral
position to a lower vertical position and to direct airflow from a
second lateral position to an upper vertical position.
24. The method of claim 17, wherein the crossflow air deflector
comprises: a proximal central spine; a first arcuate wall extending
from the spine to a first distal lateral edge of the airflow
deflector; and a second arcuate wall extending from the spine to a
second distal lateral edge of the airflow deflector opposing the
first distal lateral edge.
25. The method of claim 17, wherein the crossflow air deflector
further comprises: a closeout cover with which the spine and the
first arcuate wall are coupled; and a closeout base with which the
spine and the second arcuate wall are coupled.
26. The method of claim 17, wherein the first and second arcuate
walls are configured to direct airflow from a first lateral
position to a lower vertical position and to direct airflow from a
second lateral position to an upper vertical position.
Description
FIELD OF EMBODIMENTS
[0001] Embodiments of the invention may relate generally to
electronics cooling, and particularly to a crossflow air deflector
for independent airflow control.
BACKGROUND
[0002] As networked computer systems grow in numbers and
capability, there is a need for more storage system capacity. Cloud
computing and large-scale data processing further increase the need
for digital data storage systems that are capable of transferring
and holding significant amounts of data. Data centers typically
include many rack-mountable storage units that are used to store
the large amounts of data.
[0003] One approach to providing sufficient data storage in
datacenters is the use of arrays of data storage devices. Many data
storage devices can be housed in an electronics enclosure
(sometimes referred to as a "rack"), which is typically a modular
unit that can hold and operate independent data storage devices in
an array, computer processors, routers and other electronic
equipment. The data storage devices are often mounted in close
proximity to each other within the electronics enclosure, i.e.,
densely packed or "high-density" systems, so that many data storage
devices can fit into a defined volume. Operating many data storage
devices within close proximity within the electronics enclosure can
create heat issues, which can in turn lead to premature failure of
the data storage devices. Rack systems typically include fans or
other cooling devices. Thus, with rack-mounted devices that utilize
forced air convection for cooling, controlling the airflow
throughout the system is of utmost importance. Similarly, but in
contrast with rack storage systems, in storage device testing
systems, controlling the airflow throughout the system may also be
beneficial in view of controlling the heating of the devices in the
context of high temperature testing procedures.
[0004] Any approaches described in this section are approaches that
could be pursued, but not necessarily approaches that have been
previously conceived or pursued. Therefore, unless otherwise
indicated, it should not be assumed that any of the approaches
described in this section qualify as prior art merely by virtue of
their inclusion in this section.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Embodiments are illustrated by way of example, and not by
way of limitation, in the figures of the accompanying drawings and
in which like reference numerals refer to similar elements and in
which:
[0006] FIG. 1 is a diagram illustrating a conventional
high-availability storage server arrangement;
[0007] FIG. 2 is a diagram illustrating a storage server
arrangement including crossflow air deflectors, according to an
embodiment;
[0008] FIG. 3 is a perspective view illustrating a crossflow air
deflector, according to an embodiment;
[0009] FIGS. 4A-4B are orthographic views and FIG. 4C is a
cross-sectional view illustrating the crossflow air deflector of
FIG. 3, according to an embodiment;
[0010] FIG. 5A is a first perspective view illustrating a pair of
drive chambers, according to an embodiment;
[0011] FIG. 5B is a second perspective view illustrating the pair
of drive chambers of FIG. 5A, according to an embodiment;
[0012] FIG. 6 is an exploded view of a drive testing unit,
according to an embodiment; and
[0013] FIG. 7 is a flow diagram illustrating a method for
controlling airflow in a data storage device assembly, according to
an embodiment.
DETAILED DESCRIPTION
[0014] Generally, approaches to managing airflow within an
electronics enclosure, such as within a data storage system or
storage server, are described. In the following description, for
the purposes of explanation, numerous specific details are set
forth to provide a thorough understanding of the embodiments of the
invention described herein. It will be apparent, however, that the
embodiments of the invention described herein may be practiced
without these specific details. In other instances, well-known
structures and devices are shown in block diagram form to avoid
unnecessarily obscuring the embodiments of the invention described
herein.
INTRODUCTION
Terminology
[0015] References herein to "an embodiment", "one embodiment", and
the like, are intended to mean that the particular feature,
structure, or characteristic being described is included in at
least one embodiment of the invention. However, instances of such
phrases do not necessarily all refer to the same embodiment,
[0016] The term "substantially" will be understood to describe a
feature that is largely or nearly structured, configured,
dimensioned, etc., but with which manufacturing tolerances and the
like may in practice result in a situation in which the structure,
configuration, dimension, etc. is not always or necessarily
precisely as stated. For example, describing a structure as
"substantially vertical" would assign that term its plain meaning,
such that the sidewall is vertical for all practical purposes but
may not be precisely at 90 degrees throughout.
[0017] While terms such as "optimal", "optimize", "minimal",
"minimize", "maximal", "maximize", and the like may not have
certain values associated therewith, if such terms are used herein
the intent is that one of ordinary skill in the art would
understand such terms to include affecting a value, parameter,
metric, and the like in a beneficial direction consistent with the
totality of this disclosure. For example, describing a value of
something as "minimal" does not require that the value actually be
equal to some theoretical minimum (e.g., zero), but should be
understood in a practical sense in that a corresponding goal would
be to move the value in a beneficial direction toward a theoretical
minimum.
Data Storage System Context
[0018] Recall that with high-density data storage systems or
storage servers, as well as with high density storage device test
systems, that utilize forced air convection for cooling,
controlling the airflow throughout the system is important. Such
systems typically lack independent airflow control for each storage
device (generally, each "drive"). To accommodate an individual
cooling fan per drive to implement independent airflow control, the
slot width would need to be increased undesirably. Specific to the
context of test systems, dual-side heating of the devices such as
solid-state drives (SSDs) for higher temperature testing is
typically not implemented because of space constraints and the use
of radial fans, for example, and therefore the temperature and
airflow may be less controlled than desired.
[0019] FIG. 1 is a diagram illustrating a conventional
high-availability storage server arrangement. Storage server 100
comprises a plurality of data storage devices ("DSDs") 102 (e.g.,
solid-state drives, or "SSDs") for storing digital data, and a
plurality of adjacent cooling fans 104 (e.g., radial fans) that
operate to cool at least the DSDs 102. A storage server such as
storage server 100 may further comprise one or more power supply
units ("PSUs") 106 and one or more compute nodes 108, where the
PSUs 106 operate to supply power to the powered components
constituent to the storage server 100 (e.g., the DSDs 102, compute
node 108), and the compute node(s) 108 are typically configured to
perform the computational processing, storage/memory (e.g., JBOF,
or "Just a Bunch of Flash") management, network/switch fabric, and
the like, in the storage server 100. Here, in a high-density
storage system 100, the number of DSDs 102 is shown to be greater
than the number of fans 104 and, therefore, each DSD 102 is not
matched with a corresponding fan 104 providing independent airflow
for each DSD 102, i.e., the fans 104 are shared or common.
Furthermore, the fans 104 need to be high CFM (cubic feet per
minute) to cool high-power SSDs, for example, and need to operate
at a relatively high speed even if all DSDs 102 are not operating
simultaneously at all times. Thus, these fans 104 typically consume
a relatively high amount of power and may be undesirably noisy.
Still further, the power requirement of high-power DSDs/SSDs is
only expected to increase over time and, therefore, shared (or even
independent) radial fans providing relatively low airflow are more
likely unable to adequately cool the array of DSDs 102.
Crossflow Air Deflector
[0020] In view of the foregoing issues, a storage server having
increased DSD drive density, with independent airflow control per
drive, may be desirable. Generally, and according to an embodiment,
one approach to such a goal involves designing the system
architecture arrangement such that the drives are positioned
adjacent to one another in a horizontal direction (e.g., vertically
positioned in a horizontally adjacent arrangement) and a pair of
fans serving a corresponding pair of drives is positioned
vertically adjacent to one another, an arrangement that is
illustrated and described in more detail elsewhere herein. A
facilitating component of such an arrangement is referred to herein
as a "crossflow air deflector", which achieves a crossflow of
airflows that enter into the storage system horizontal to one
another and exit out of the system vertical to one another.
[0021] FIG. 2 is a diagram illustrating a storage server
arrangement including crossflow air deflectors, according to an
embodiment. Storage server 200 is configured largely similarly to
the storage system 100 of FIG. 1, comprising a plurality of data
storage devices ("DSDs") 202 (e.g., solid-state drives, or "SSDs")
for storing digital data, a plurality of adjacent cooling fans 204
(e.g., axial fans) that operate to cool at least the DSDs 202.
Likewise, a storage server such as storage server 200 may further
comprise one or more power supply units ("PSUs") 206 and one or
more compute nodes 208. Here, in this high-density storage system
200, the number of fans 204 is equal to the number of DSDs 202 and,
therefore, each DSD 202 is matched with a corresponding fan 204 to
provide independent airflow for each DSD 202. As discussed, this is
facilitated by use of a plurality of crossflow air deflectors 203
(or simply "air deflector 203") positioned between the DSDs 202 and
the fans 204, e.g., one air deflector 203 per pair of DSDs 202 and
pair of corresponding fans 204 as depicted.
[0022] FIG. 3 is a perspective view illustrating a crossflow air
deflector, and FIGS. 4A-4B are orthographic views and FIG. 4C is a
cross-sectional view (A-A) illustrating the crossflow air deflector
of FIG. 3, according to an embodiment. Crossflow air deflector 300
(or simply "air deflector 300") represents an implementation
embodiment of the air deflectors 203 of storage system 200 of FIG.
2, configured for directing airflow. For a frame of reference and
explanatory purposes and by way of example, the left-facing portion
of air deflector 300 of FIG. 3 (and the face viewed in FIG. 4B and
right-facing in FIG. 4A) is referred to as proximal, where the
opposing right-facing portion of air deflector 300 of FIG. 3 (and
the face left-facing in FIG. 4A) is referred to as distal.
[0023] According to an embodiment, crossflow air deflector 300
comprises a proximal central spine 302, a first arcuate wall 304a
(or "deflection panel") extending from the spine 302 to a first
distal lateral edge 305a of the airflow deflector 300, and a second
arcuate wall 304b (or "deflection panel") extending from the spine
302 to an opposing second distal lateral edge 305b of the airflow
deflector 300. While employing arcuate or curve-shaped walls 304a,
304b augments the directing of the airflow in desired respective
crossflow directions, other shapes of walls 304a, 304b or panels
may be implemented and still fall within the scope of embodiments.
According to an embodiment, airflow deflector 300 further comprises
a closeout cover 306, with which the spine 302 and the first
arcuate wall 304a are coupled, and a closeout base 308, with which
the spine 302 and the second arcuate wall 304b are coupled. As
illustrated, the first and second arcuate walls 304a, 304b are
configured to direct airflow from a first lateral (e.g.,
horizontal) position to a lower vertical position and to direct
airflow from a second lateral position to an upper vertical
position, which is illustrated and described in more detail
elsewhere herein such as in reference to FIGS. 5A-5B.
Data Storage Drive Chamber
[0024] FIG. 5A is a first perspective view illustrating a pair of
drive chambers, and FIG. 5B is a second perspective view
illustrating the pair of drive chambers of FIG. 5A, according to an
embodiment. Stated otherwise, FIGS. 5A-5B illustrate a pair of data
storage device chambers, or a chamber assembly, for housing DSDs
for any number of purposes, such as for installation into a data
storage system or a data storage device test system, and the like.
As described hereafter and according to an embodiment, a single
chamber may house a single DSD, whereby multiple chambers (two
adjacent chambers depicted here) and pairs of chambers may be
assembled/installed together (as well as expanded DSD/fan arrays in
the lateral and vertical directions, such as 3.times.3, 4.times.4,
etc. configurations) into one or more racks of a system enclosure
to meet particular needs. For a frame of reference and explanatory
purposes and by way of example, a coordinate system is illustrated,
in which an x-direction is along the width of the chamber and
referred to as "lateral", a y-direction is along the length of the
chamber from a proximal end to a distal end and referred to as
"longitudinal", and a z-direction is along the height of the
chamber and referred to as "vertical". However, in practice and
according to embodiments a chamber may be positioned in alternative
configurations in any given system while operating similarly to as
described, but for purposes of explanation the forgoing coordinate
system is employed in reference to FIGS. 5A-5B.
[0025] In reference to FIG. 5A, drive chamber assembly 500 is
depicted in a right-side perspective view, representing a first
data storage device (DSD) chamber 502a extending along the
longitudinal direction for housing a first DSD 504a (e.g., a SSD,
for a non-limiting example), and a second data storage device (DSD)
chamber 502b extending along the longitudinal direction adjacent to
the first DSD chamber 502a and for housing a second DSD 504b (e.g.,
a SSD, for a non-limiting example). Chamber assembly 500 further
comprises a lower first fan 506a positioned at the distal end of
and spanning the lateral width of the chamber assembly 500, an
upper second fan 506b positioned at the distal end of and spanning
the lateral width of the chamber assembly 500 and above the first
fan 506a along the vertical direction, and a crossflow air
deflector 300 positioned between a distal end or portion of the
first and second DSD chambers 502a, 502b and the first and second
fans 506a, 506b.
[0026] As depicted in FIGS. 5A-5B and according to an embodiment,
the air deflector 300 is configured and positioned to direct
airflow 508a (depicted by arrows in FIG. 5B) entering and from the
first (left) chamber 502a and flowing along the length of the first
DSD 504a into the lower first fan 506a, and to direct airflow 508b
(depicted by arrows in FIG. 5A) entering and from the second
(right) chamber 502b and flowing along the length of the second DSD
504b into the upper second fan 506b, thereby achieving cross-air
flow. According to an embodiment, each DSD chamber 502a, 502b has a
lateral width that provides a gap between an inner and/or outer
surface or panel of the DSD chamber 502a, 502b (outer panels
removed in FIGS. 5A-5B) and its corresponding DSD 504a, 504b,
thereby facilitating the respective airflows 508a, 508b along
(e.g., the length) of each DSD 504a, 504b. According to an
embodiment, air deflector 300 is configured and positioned to
direct the respective airflows 508a, 508b in the foregoing manner
while also prohibiting or inhibiting the left-side airflow 508a
from flowing to and entering the upper second fan 506b and
prohibiting or inhibiting the right-side airflow 508b from flowing
to and entering the lower first fan 506a. Note that the
configuration of the air deflector 300 may be reversed, whereby the
air deflector 300 is configured and positioned to direct airflow
508a entering the first (left) chamber 502a and flowing along the
length of the first DSD 504a into the upper second fan 506b, and to
direct airflow 508b entering the second (right) chamber 502b and
flowing along the length of the second DSD 504b into the lower
first fan 506a, thereby still achieving desired cross-air flow and
independent cooling airflow per drive.
[0027] Consequently, each DSD 504a, 504b is effectively cooled
independent of the other by way of its corresponding airflow 508a,
508b through the DSD chamber 502a, 502b being directed by the
crossflow air deflector 300 to its corresponding individual (e.g.,
unshared) cooling fan 506a, 506b. Thus, the chamber assembly 500
can effectively be "tuned" according to the individual cooling
needs of the respective DSDs 504a, 504b at any given time and/or
performance level (e.g., based on temperature sensor feedback), to
optimize the amount of power dissipated (e.g., in terms of
dissipated heat) based on the amount of heat generated by each
respective DSD 504a, 504b. That is, the lower the amount of DSD
504a, 504b power/heat dissipation needed then the lower fan 506a,
506b speed needed and the system power needs can be effectively
minimized/optimized and fan noise lessened. Furthermore,
high-density storage device systems or storage servers are
facilitated by using pairs of vertically stacked, independently
functioning cooling fans each matched to a respective DSD (with
minimal, negligible, no airflow mixing) to direct airflows incoming
from different lateral directions, so high-power DSDs/SSDs can be
accommodated without compromising drive density. Further still,
more readily-available and higher CFM axial fans may be implemented
because, with the use of the air deflector 300, the width of each
fan unit can now essentially span the width of a pair of DSD
chambers 502a, 502b rather than only spanning the width of a single
drive chamber such as is the case with the geometrical/spatial
constraints that result in the need to use radial fans in the
absence of the air deflector 300. Thus, a wider
commercially-available selection of fans (i.e., axial) is available
for implementation into the system, while the width of a system
that would otherwise employ radial fans is also decreased or at
least maintained. According to an embodiment, dual-rotor counter
rotating (CR) fans (e.g., two axial fans in series) may be
implemented for use as the fans 506a, 506b, such as to mitigate
problems associated with a single fan failure which could cause a
corresponding drive failure in the case of a single fan
configuration.
[0028] According to an embodiment, the air deflector 300 of chamber
assembly 500 comprises a spine such as the proximal central spine
302 (FIG. 3) extending in the vertical direction and positioned
between the first and second chambers 502a, 502b, a first panel
such as the first wall 304a (FIG. 3) extending in the longitudinal
direction from the spine 302 to a first distal lateral corner such
as the first lateral edge 305a (FIG. 3), and a second panel such as
the second wall 304b (FIG. 3) extending in the longitudinal
direction from the spine 302 to a second distal lateral corner such
as the second lateral edge 305b (FIG. 3).
Data Storage Device Test System
[0029] As discussed, with high density storage device test systems
that utilize forced air convection for cooling, controlling the
airflow throughout the system is important, and such test systems
typically lack independent airflow control for each storage device
(generally, each "drive"). As with storage servers discussed
elsewhere herein, to accommodate an individual cooling fan per
drive to implement independent airflow control, the slot width
would need to be increased undesirably. Furthermore, and specific
to the context of test systems, dual-side heating of the devices
such as solid-state drives (SSDs) for higher temperature testing is
typically not employed because of space constraints and therefore
the temperature and airflow may be less controlled than
desired.
[0030] FIG. 6 is an exploded view of a drive testing unit,
according to an embodiment. Stated otherwise, FIG. 6 illustrates a
pair of data storage device chambers, or a chamber assembly, for
housing DSDs for installation into a data storage device test
system. As described hereafter and according to an embodiment, a
single chamber may house a single DSD, whereby multiple chambers
(two adjacent chambers depicted here) and pairs of chambers may be
assembled/installed together (as well as expanded DSD/fan arrays in
the lateral and vertical directions, such as 3.times.3, 4.times.4,
etc. configurations) into one or more racks of a system enclosure
to meet particular needs. For a frame of reference and explanatory
purposes and by way of example, the coordinate system described in
reference to the DSD chamber assembly 500 of FIGS. 5A-5B is
likewise applicable here.
[0031] Similar to the DSD chamber 500 of FIG. 5A, drive test
chamber assembly 600 is depicted in a right-side perspective view,
representing a first data storage device (DSD) chamber 602a
extending along the longitudinal direction for housing a first DSD
604a (e.g., a SSD, for a non-limiting example), and a second data
storage device (DSD) chamber 602b extending along the longitudinal
direction adjacent to the first DSD chamber 602a and for housing a
second DSD 604b (e.g., a SSD, for a non-limiting example). Drive
test chamber assembly 600 further comprises a lower first fan 606a
positioned at the distal end of and spanning the lateral width of
the drive test chamber assembly 600, an upper second fan 606b
positioned at the distal end of and spanning the lateral width of
the drive test chamber assembly 600 and above the first fan 606a
along the vertical direction, and a crossflow air deflector 300
positioned between a distal end or portion of the first and second
DSD chambers 602a, 602b and the first and second fans 606a,
606b.
[0032] Similar to the DSD chamber 500 of FIGS. 5A-5B and according
to an embodiment, the air deflector 300 is configured and
positioned to direct airflow entering and from the first (left)
chamber 602a and flowing along the length of the first DSD 604a
into the lower first fan 606a, and to direct airflow entering and
from the second (right) chamber 602b and flowing along the length
of the second DSD 604b into the upper second fan 606b, thereby
achieving cross-air flow. According to an embodiment, air deflector
300 is configured and positioned to direct the respective airflows
in the foregoing manner while also prohibiting or inhibiting the
left-side airflow from flowing to and entering the upper second fan
606b and prohibiting or inhibiting the right-side airflow from
flowing to and entering the lower first fan 606a. Likewise, the
configuration of the air deflector 300 may be reversed, whereby the
air deflector 300 is configured and positioned to direct airflow
entering the first (left) chamber 602a and flowing along the length
of the first DSD 604a into the lower first fan 606a, and to direct
airflow entering the second (right) chamber 602b and flowing along
the length of the second DSD 604b into the upper second fan 606b,
thereby still achieving desired cross-air flow and independent
airflow per drive.
[0033] According to an embodiment, drive test chamber assembly 600
further comprises means for heating 610b, such as a heater-embedded
printed circuit board (PCB), positioned between the first DSD
chamber 602a and the second DSD chamber 602b. According to an
embodiment, drive test chamber assembly 600 comprises first means
for heating 610a (a heater-embedded PCB according to an embodiment)
positioned adjacent to the first DSD chamber 602a, and a second
means for heating 610c (a heater-embedded PCB according to an
embodiment) positioned adjacent to the second DSD chamber 602b.
Thus, surface temperature control and management for each DSD 604a,
604b, including the management of applied heat from the heating
means for high-temperature testing purposes, is effectively
independent of the other by way of its corresponding airflow
through the DSD chamber 602a, 602b being directed by the crossflow
air deflector 300 to its corresponding individual (e.g., unshared)
temperature control fan 606a, 606b. Similar to the DSD chamber 500
of FIGS. 5A-5B, the drive test chamber assembly 600 can be utilized
for individualized temperature control and management (e.g.,
heating) according to individual testing goals for each of the
respective DSDs 604a, 604b. For example, the individual DSDs can be
tested at different temperatures in a common drive testing system
during testing.
Method for Controlling Airflow in a Data Storage Device
Assembly
[0034] FIG. 7 is a flow diagram illustrating a method for
controlling airflow in a data storage device assembly, according to
an embodiment. The method of FIG. 7 may be implemented in
conjunction with each of the systems described in reference to
FIGS. 5A-5B and in reference to FIG. 6, according to respective
embodiments.
[0035] At block 702, a first airflow is drawn through a first data
storage device (DSD) chamber, at a first lateral position,
configured for housing a first DSD. For example, airflow 508a (FIG.
5B) is drawn, directed, pulled, sucked through the first DSD
chamber 502a (FIG. 5B) configured for housing the first DSD 504a
(FIG. 5B), at or along the left-hand side of the chamber assembly
500 (FIGS. 5A-5B). According to an embodiment, drawing the first
airflow includes drawing the first airflow (e.g., airflow 508a)
across an outer surface of the first DSD (e.g., first DSD 504a),
such as for cooling purposes. According to an embodiment, drawing
the first airflow includes drawing the first airflow (e.g., airflow
508a) across a first heater (e.g., first means for heating 610a)
corresponding to the first DSD (e.g., first DSD 504a), such as for
heating purposes.
[0036] At block 704, a second airflow is drawn through a second
data storage device (DSD) chamber, at a second lateral position
adjacent to the first DSD chamber, configured for housing a second
DSD. For example, airflow 508b (FIG. 5A) is drawn, directed,
pulled, sucked through the second DSD chamber 502b (FIG. 5A)
configured for housing the second DSD 504b (FIG. 5A), at or along
the right-hand side of the chamber assembly 500. According to an
embodiment, drawing the second airflow includes drawing the second
airflow (e.g., airflow 508b) across an outer surface of the second
DSD (e.g., second DSD 504b), such as for cooling purposes.
According to an embodiment, drawing the second airflow includes
drawing the second airflow (e.g., airflow 508b) across a second
heater (e.g., second means for heating 610c) corresponding to the
second DSD (e.g., first DSD 504b), such as for heating
purposes.
[0037] At block 706, the first airflow is deflected from the first
lateral position to a lower vertical position. For example, airflow
508a is deflected by crossflow air deflector 300 (FIGS. 3-6) from
the left-hand side of the chamber assembly 500 to the lower
vertical position of the first fan 506a (FIGS. 5A-5B).
[0038] At block 708, the second airflow is deflected from the
second lateral position to an upper vertical position over the
lower vertical position. For example, airflow 508b is deflected by
crossflow air deflector 300 from the right-hand side of the chamber
assembly 500 to the upper vertical position of the second fan 506b
(FIGS. 5A-5B).
Extensions and Alternatives
[0039] In the foregoing description, embodiments of the invention
have been described with reference to numerous specific details
that may vary from implementation to implementation. Therefore,
various modifications and changes may be made thereto without
departing from the broader spirit and scope of the embodiments.
Thus, the sole and exclusive indicator of what is the invention,
and is intended by the applicants to be the invention, is the set
of claims that issue from this application, in the specific form in
which such claims issue, including any subsequent correction. Any
definitions expressly set forth herein for terms contained in such
claims shall govern the meaning of such terms as used in the
claims. Hence, no limitation, element, property, feature, advantage
or attribute that is not expressly recited in a claim should limit
the scope of such claim in any way. The specification and drawings
are, accordingly, to be regarded in an illustrative rather than a
restrictive sense.
[0040] In addition, in this description certain process steps may
be set forth in a particular order, and alphabetic and alphanumeric
labels may be used to identify certain steps. Unless specifically
stated in the description, embodiments are not necessarily limited
to any particular order of carrying out such steps. In particular,
the labels are used merely for convenient identification of steps,
and are not intended to specify or require a particular order of
carrying out such steps.
* * * * *