U.S. patent application number 17/376184 was filed with the patent office on 2022-07-28 for display apparatus.
This patent application is currently assigned to Au Optronics Corporation. The applicant listed for this patent is Au Optronics Corporation. Invention is credited to Cheng-Chuan Chen, Chih-Wei Chien, Chih-Ling Hsueh, Shau-Yu Tsai, Chih-Hsiang Yang.
Application Number | 20220238768 17/376184 |
Document ID | / |
Family ID | 1000005770847 |
Filed Date | 2022-07-28 |
United States Patent
Application |
20220238768 |
Kind Code |
A1 |
Chien; Chih-Wei ; et
al. |
July 28, 2022 |
DISPLAY APPARATUS
Abstract
A display apparatus including a circuit substrate, a plurality
of light-emitting elements, an optical film, and an adhesive layer
is provided. These light-emitting elements are electrically bonded
to the circuit substrate. The optical film overlaps the
light-emitting elements. The light-emitting elements are disposed
between the optical film and the circuit substrate. The adhesive
layer is disposed between the optical film and the circuit
substrate, and connects the light-emitting elements and the optical
film. A cavity is provided between the light-emitting elements, the
circuit substrate, and the adhesive layer.
Inventors: |
Chien; Chih-Wei; (Hsinchu,
TW) ; Yang; Chih-Hsiang; (Hsinchu, TW) ; Tsai;
Shau-Yu; (Hsinchu, TW) ; Chen; Cheng-Chuan;
(Hsinchu, TW) ; Hsueh; Chih-Ling; (Hsinchu,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Au Optronics Corporation |
Hsinchu |
|
TW |
|
|
Assignee: |
Au Optronics Corporation
Hsinchu
TW
|
Family ID: |
1000005770847 |
Appl. No.: |
17/376184 |
Filed: |
July 15, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2933/0091 20130101;
H01L 25/0753 20130101; H01L 33/58 20130101 |
International
Class: |
H01L 33/58 20060101
H01L033/58; H01L 25/075 20060101 H01L025/075 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 27, 2021 |
TW |
110103100 |
Claims
1. A display apparatus comprising: a circuit substrate; a plurality
of light-emitting elements electrically bonded to the circuit
substrate; an optical film overlapping the light-emitting elements,
and the light-emitting elements are disposed between the optical
film and the circuit substrate; and an adhesive layer disposed
between the optical film and the circuit substrate and connecting
the light-emitting elements and the optical film, wherein there is
a cavity between the light-emitting elements, the circuit substrate
and the adhesive layer.
2. The display apparatus according to claim 1, wherein a film
thickness of part of the adhesive layer that does not overlap the
light-emitting elements is greater than a film thickness of another
part of the adhesive layer that overlaps the light-emitting
elements.
3. The display apparatus according to claim 2, wherein the film
thickness of the part of the adhesive layer ranges from 0.02 mm to
1.0 mm.
4. The display apparatus according to claim 1, wherein the
light-emitting elements comprise an element surface, the element
surface comprises a height relative to a substrate surface of the
circuit substrate in a direction, the adhesive layer comprises a
surface facing the substrate surface, there is a distance between
the surface of the adhesive layer and the element surface of the
light-emitting elements in the direction, and a percentage value of
the distance to the height ranges from 1% to 70%.
5. The display apparatus according to claim 1, wherein the
light-emitting elements are disposed on the circuit substrate at a
first pitch and a second pitch in a first direction and a second
direction, respectively, each of the light-emitting elements
comprises a first width and a second width in the first direction
and the second direction, the first direction is perpendicular to
the second direction, and a percentage value of a product of the
first width and the second width to a product of the first pitch
and the second pitch ranges from 1% to 70%.
6. The display apparatus according to claim 1, wherein
transmittance of the adhesive layer is greater than or equal to
90%.
7. The display apparatus according to claim 6, wherein an optical
density of the adhesive layer ranges from 0 to 1.0.
8. The display apparatus according to claim 1, wherein the adhesive
layer comprises a plurality of scattering particles.
9. The display apparatus according to claim 1, wherein a Shore
hardness value of the adhesive layer ranges from A20 to D80.
10. The display apparatus according to claim 1, wherein the optical
film comprises a polarizing layer.
11. The display apparatus according to claim 10, wherein the
optical film further comprises a plurality of optical
microstructures disposed on a side of the polarizing layer away
from the light-emitting elements.
12. The display apparatus according to claim 1, wherein the optical
film comprises a surface treatment layer disposed on a side of the
adhesive layer away from the light-emitting elements, and the
surface treatment layer is an anti-glare layer, an anti-reflection
layer, an anti-glare low-reflection layer, and an anti-reflection
anti-glare layer, or a low-reflection layer.
13. The display apparatus according to claim 1, wherein a
reflecting layer is disposed on part of a surface of the circuit
substrate that does not overlap the light-emitting elements.
14. The display apparatus according to claim 1, wherein a plurality
of optical microstructures are disposed on an element surface of
the light-emitting elements away from the circuit substrate.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 110103100, filed on Jan. 27, 2021. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND
Technology Field
[0002] The disclosure relates to a display technology, and
particularly to a display apparatus.
Description of Related Art
[0003] Light-emitting diode (LED) panels include an active element
device substrate and a plurality of light-emitting diode elements
transferred on the active element device substrate. Inheriting the
characteristics of light-emitting diodes, a light-emitting diode
panel is expected to become the mainstream of the next generation
of display panels due to the advantages of power saving, high
efficiency, high brightness, and fast response time. Currently,
there are two main packaging methods for LED display panels. One is
a packaging method that uses a traditional package and is fixed
through a surface mounted device (SMD). The other is a packaging
method in which light-emitting diode elements are directly bonded
to the bonding pads of a chip on board (COB) and encapsulated with
epoxy.
[0004] Although the light-emitting diode panel adopting SMD
packaging method has better light extraction efficiency, color
uniformity, and reworkability, its light-emitting diode elements
are more susceptible to damage by external impact, and the
light-emitting diode panel has poor flatness of the overall display
surface. While the light-emitting diode panel adopting the other
COB packaging method can achieve better surface flatness, the
light-emitting diode panel has poor light extraction efficiency and
poor color uniformity, and repairing the light-emitting diode
elements causes great difficulties.
SUMMARY
[0005] The disclosure provides a display apparatus having better
reworkability and performance in the dark state.
[0006] The display apparatus of the disclosure includes a circuit
substrate, a plurality of light-emitting elements, an optical film,
and an adhesive layer. The light-emitting elements are electrically
bonded to the circuit substrate. The optical film overlaps the
light-emitting elements. The light-emitting elements are disposed
between the optical film and the circuit substrate. The adhesive
layer is disposed between the optical film and the circuit
substrate and connects the light-emitting elements and the optical
film. There is a cavity between the light-emitting elements, the
circuit substrate and the adhesive layer.
[0007] In an embodiment of the disclosure, in the display
apparatus, the film thickness of part of the adhesive layer that
does not overlap the light-emitting elements is greater than the
film thickness of another part of the adhesive layer that overlaps
the light-emitting elements.
[0008] In an embodiment of the disclosure, in the display
apparatus, the film thickness of the part of the adhesive layer
ranges from 0.02 mm to 1.0 mm.
[0009] In an embodiment of the disclosure, in the display
apparatus, the light-emitting elements have an element surface. The
element surface has a height relative to a substrate surface of the
circuit substrate in a direction. The adhesive layer has a surface
facing the substrate surface. There is a distance between the
surface of the adhesive layer and the element surface of the
light-emitting elements in the direction, and a percentage value of
the distance to the height ranges from 1% to 70%.
[0010] In an embodiment of the disclosure, in the display
apparatus, the light-emitting elements are disposed on the circuit
substrate at a first pitch and a second pitch in a first direction
and a second direction, respectively. Each of the light-emitting
elements has a first width and a second width in the first
direction and the second direction, the first direction is
perpendicular to the second direction, and a percentage value of a
product of the first width and the second width to a product of the
first pitch and the second pitch ranges from 1% to 70%.
[0011] In an embodiment of the disclosure, in the display
apparatus, transmittance of the adhesive layer is greater than or
equal to 90%.
[0012] In an embodiment of the disclosure, in the display
apparatus, an optical density of the adhesive layer ranges from 0
to 1.0.
[0013] In an embodiment of the disclosure, in the display
apparatus, the adhesive layer has a plurality of scattering
particles.
[0014] In an embodiment of the disclosure, in the display
apparatus, a Shore hardness value of the adhesive layer ranges from
A20 to D80.
[0015] In an embodiment of the disclosure, in the display
apparatus, the optical film includes a polarizing layer.
[0016] In an embodiment of the disclosure, in the display
apparatus, the optical film further includes a plurality of optical
microstructures disposed on a side of the polarizing layer away
from the light-emitting elements.
[0017] In an embodiment of the disclosure, in the display
apparatus, the optical film has a surface treatment layer disposed
on a side of the adhesive layer away from the light-emitting
elements, and the surface treatment layer is an anti-glare layer,
an anti-reflection layer, an anti-glare low-reflection layer, and
an anti-reflection anti-glare layer, or a low-reflection layer.
[0018] In an embodiment of the disclosure, in the display
apparatus, a reflecting layer is disposed on part of a surface of
the circuit substrate that does not overlap the light-emitting
elements.
[0019] In an embodiment of the disclosure, in the display
apparatus, a plurality of optical microstructures are disposed on
an element surface of the light-emitting elements away from the
circuit substrate.
[0020] In summary, in the display apparatus of an embodiment of the
disclosure, the optical film is connected to a plurality of
light-emitting elements through the adhesive layer. The
light-emitting elements disposed on the circuit substrate are
covered by the optical film to improve the surface flatness of the
display apparatus on one side of the display surface. On the other
hand, there is a cavity between the light-emitting elements between
part of the adhesive layer that is not connected to the
light-emitting elements and the circuit substrate. With the
configuration of the cavity, it is much easier for the optical film
to rework, the difficulty of repairing the light-emitting elements
is effectively reduced, and thereby the repair yield of the display
apparatus is improved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0021] FIG. 1 is a schematic top view of a display apparatus
according to a first embodiment of the disclosure.
[0022] FIG. 2 is a schematic cross-sectional view of the display
apparatus of FIG. 1.
[0023] FIG. 3 is a schematic cross-sectional view of a display
apparatus according to a second embodiment of the disclosure.
[0024] FIG. 4 is a schematic cross-sectional view of a display
apparatus according to a third embodiment of the disclosure.
[0025] FIG. 5 is a schematic cross-sectional view of a display
apparatus according to a fourth embodiment of the disclosure.
[0026] FIG. 6 is a schematic cross-sectional view of a display
apparatus according to a fifth embodiment of the disclosure.
[0027] FIG. 7 is a schematic cross-sectional view of a display
apparatus according to a sixth embodiment of the disclosure.
DESCRIPTION OF THE EMBODIMENTS
[0028] The term "about", "approximately", "essentially" or
"substantially" used herein includes the value and an average value
within an acceptable deviation range of specific values determined
by a person of ordinary skill in the art, taking into account
discussed measurements and a specific number of measurement-related
errors (i.e., limitations of a measuring system). For example, the
term "about" may mean being within one or more standard deviations
of the value, or within, for example, .+-.30%, .+-.20%, .+-.10%,
and .+-.5%. Moreover, the term "about", "approximately",
"essentially" or "substantially" used herein may mean selecting a
more acceptable deviation range or standard deviations according to
measurement properties, cutting properties or other properties,
without applying a single standard deviation to all properties.
[0029] In the drawings, for clarity, a thickness of each film,
layer, panel, region, and/or structure may be enlarged. It should
be understood that when a device such as a layer, film, region, or
substrate is referred to as being "on" or "connected to" another
device, it may be directly on or connected to another device, or
intervening devices may also be present. In contrast, when a device
is referred to as being "directly on" or "directly connected to"
another device, there are no intervening devices present. As used
herein, "connected" may mean being physically and/or electrically
connected. Furthermore, two elements being "electrically connected"
or "coupled" may mean that there are other elements between the two
elements.
[0030] Reference will now be made in detail to the exemplary
embodiments of the disclosure, examples of which are illustrated in
the accompanying drawings. Whenever possible, the same reference
numerals are used to represent the same or similar parts in the
accompanying drawings and description.
[0031] FIG. 1 is a schematic top view of a display apparatus
according to a first embodiment of the disclosure. FIG. 2 is a
schematic cross-sectional view of the display apparatus of FIG. 1.
Referring to FIG. 1 and FIG. 2, a display apparatus 10 includes a
circuit substrate 100, a plurality of light-emitting elements 120,
an adhesive layer 140, and an optical film 160. The light-emitting
elements 120 are dispersedly disposed on a substrate surface 100s
of the circuit substrate 100 and are electrically bonded to the
circuit substrate 100. For example, the light-emitting elements 120
may be disposed in multiple columns and multiple rows along the
direction X and the direction Y, respectively. The direction X is
perpendicular to the direction Y. That is, the light-emitting
elements 120 can be disposed in an array on the circuit substrate
100, but the disclosure is not limited thereto.
[0032] In the embodiment, the circuit substrate 100 is a printed
circuit substrate (PCB), for example, but the disclosure is not
limited thereto. In other embodiments, the circuit substrate 100
may also be a combination of a glass substrate and a pixel circuit
layer. The pixel circuit layer is formed on the glass substrate
using a semiconductor process, and the pixel circuit layer can
include active elements (e.g., thin film transistors) and various
signal lines (e.g., data lines, scan lines, or power lines), but
the disclosure is not limited thereto.
[0033] The light-emitting element 120 is a micro light-emitting
diode (micro LED), a mini light-emitting diode (mini LED), or other
sizes of light-emitting diodes, for example. According to different
types of structures, the light-emitting element 120 of the
embodiment can be a flip-chip type of light-emitting diode, a
vertical type of light-emitting diode, or a lateral type of
light-emitting diode. For example, the light-emitting elements 120
can be used to emit light of different colors, respectively. The
light can have different light intensities according to the image
data to be displayed, and the effect of color display is
achieved.
[0034] Note that the connection between the light-emitting element
120 and the circuit substrate 100 depends on the type of the
circuit substrate 100 and the light-emitting element 120, so the
drawings in the embodiment only schematically illustrate the
connection relationship of the light-emitting element 120 and the
circuit substrate 100. For example, in an embodiment not shown, the
circuit substrate 100 may have a plurality of bonding pads, the
light-emitting element 120 is a flip-chip light-emitting diode, and
the light-emitting element 120 is mutually bonded with two
corresponding bonding pads on the circuit substrate 100 through two
electrodes disposed on the same side of the epitaxial structure,
but the disclosure is not limited thereto. In another embodiment
not shown, the light-emitting element 120 may also be a vertical
light-emitting diode, and the electrode on the side of the
light-emitting element 120 away from the circuit substrate 100 is
electrically connected to the circuit substrate 100 through
connecting wires.
[0035] To improve the visual quality of the display apparatus 10 in
the dark state (e.g., the contrast in the dark state), an optical
film 160 is disposed on the side of the light-emitting elements 120
away from the circuit substrate 100, and the optical film 160 is
attached to the light-emitting elements 120 through the adhesive
layer 140. That is, the adhesive layer 140 is disposed between the
optical film 160 and the circuit substrate 100 and connects the
light-emitting elements 120 and the optical film 160. In the
embodiment, the optical film 160 is an overlapped structure of a
polarizing layer 161 and an anti-glare anti-reflection layer 162,
for example. The polarizing layer 161 is a circular polarizing
layer, for example, but the disclosure is not limited thereto. In
other embodiments, the polarizing layer 161 may also be a linear
polarizing layer. For example, the anti-glare anti-reflection layer
162 includes a plurality of surface microstructures and an
anti-reflection film plated on the surface microstructures, but the
disclosure is not limited thereto.
[0036] With the configuration of overlapping the optical film 160
and the light-emitting elements 120, the overall reflectivity of
the display apparatus 10 under ambient light irradiation can be
significantly reduced. In other words, the anti-glare and
anti-reflection characteristics of the display apparatus 10 in the
dark state can be effectively improved. Considering the process
variation, after each light-emitting element 120 is bonded to the
circuit substrate 100, the configuration relationship (e.g.,
parallel to each other or inclined to each other) between an
element surface 120s and the substrate surface 100s of the circuit
substrate 100 may be slightly different, resulting in poor surface
flatness of the display apparatus on the light emitting side.
Therefore, with the configuration of the optical film 160, the
surface flatness of the display apparatus 10 on the display surface
side can also be improved.
[0037] Note that the adhesive layer 140 connecting the element
surfaces 120s of the light-emitting elements 120 further extends
into the gaps between the light-emitting elements 120 and covers
part of the sidewall surfaces of the light-emitting elements 120.
In other words, in the normal direction (e.g., direction Z) of the
substrate surface 100s of the circuit substrate 100, a film
thickness t1 of part of the adhesive layer 140 that does not
overlap the light-emitting elements 120 is greater than a film
thickness t2 of another part of the adhesive layer 140 that
overlaps the light-emitting elements 120. For example, the film
thickness t1 of the adhesive layer 140 may range from 0.02 mm to
1.0 mm.
[0038] From another view, the element surface 120s of the
light-emitting element 120 has a height h relative to the substrate
surface 100s of the circuit substrate 100 in the direction Z, the
surface 140s of the adhesive layer 140 facing the substrate surface
100s and the element surface 120s of the light-emitting element 120
have a distance d in the direction Z, and the percentage value of
the distance d and the height h can range from 1% to 70%. That is,
the adhesive layer 140 does not fill the gaps between the
light-emitting elements 120, and the substrate surface 100s, part
of the sidewalls of the light-emitting elements 120, and the
surface 140s of the adhesive layer 140 can define a cavity CA
between the light-emitting elements 120. With the configuration of
the cavity CA, it is much easier for the optical film 160 to
rework, the difficulty of repairing the light-emitting elements 120
can be effectively reduced, and thereby the repair yield of the
display apparatus 10 is improved.
[0039] On the other hand, the light-emitting elements 120 are
disposed on the circuit substrate 100 at pitches Px and Py in the
direction X and the direction Y, respectively, and each
light-emitting element 120 has a width Wx and a width Wy in the
direction X and Y, respectively. To increase the light extraction
efficiency of the light-emitting elements 120 at the side viewing
angle to improve the light energy utilization rate of the display
apparatus 10, the percentage value of the product of the width Wx
and the width Wy to the product of the pitch Px and the pitch Py
can be set from 1% to 70%.
[0040] The material of the adhesive layer 140 includes optical
clear adhesives (OCAs), optical sensitive adhesives (PSAs),
silicone adhesives, polyurethane reactive (PUR) glue, polyurethane
(PU) glue, or other suitable optical-grade adhesive materials. In
particular, in the embodiment, the anti-reflection and anti-glare
performance of the display apparatus 10 is improved with the
configuration of the optical film 160, so the adhesive layer 140
can be selected from optical adhesives with higher transmittance
(e.g., optical transparent adhesives). For example, in the
embodiment, the transmittance of the adhesive layer 140 may be
greater than 90%, but the disclosure is not limited thereto.
[0041] Note that the Shore hardness value of the adhesive layer 140
can range from A20 to D80 to serve as a buffer layer for the
optical film 160 and the light-emitting elements 120. For example,
when the optical film 160 is impacted or squeezed by an external
force, the elastic adhesive layer 140 absorbs most of the external
force through contraction and deformation, and the light-emitting
element 120 is prevented from being damaged by the external
force.
[0042] In the embodiment, the display apparatus 10 may also
optionally include a side sealant 180. The material of the side
sealant 180 may include PUR glue, epoxy, silicon glue,
photosensitive glue material, or other suitable glue materials. The
side sealant 180 is disposed on the periphery of the circuit
substrate 100 and is disposed around the light-emitting elements
120. Specifically, the side sealant 180 connects the circuit
substrate 100, the adhesive layer 140, and the optical film 160 to
define a sealed chamber, and the light-emitting elements 120 are
disposed in the sealed chamber. With the configuration of the side
sealant 180, not only can the connection relationship between the
optical film 160 and the circuit substrate 100 be further
stabilized, but also foreign matters in the external environment
can be prevented from entering the cavity CA between the
light-emitting elements 120.
[0043] Other embodiments are provided below for explanation of the
disclosure in detail. The same reference numerals are used to
indicate the same elements, and the description of the same
technical content is omitted. For the description of the omitted
parts, reference may be made to the foregoing embodiments, and the
same content will not be iterated in the following embodiments.
[0044] FIG. 3 is a schematic cross-sectional view of a display
apparatus according to a second embodiment of the disclosure.
Referring to FIG. 3, the main difference between a display
apparatus 11 of the embodiment and the display apparatus 10 of FIG.
2 is that the composition of the optical film is different.
Specifically, an optical film 160A of the display apparatus 11 has
an overlapped structure of the polarizing layer 161, an anti-glare
adhesive layer 163, and a surface treatment layer 165. The
anti-glare adhesive layer 163 is disposed between the polarizing
layer 161 and the adhesive layer 140. The polarizing layer 161 is
disposed between the anti-glare adhesive layer 163 and the surface
treatment layer 165. In the embodiment, the anti-glare adhesive
layer 163 may include a glue material and a plurality of scattering
particles 163P doped in the glue material. For example, the glue
material is an optical pressure sensitive adhesive, and the
material of the scattering particles 163P includes silicone resin
or poly(methyl methacrylate) (PMMA), but the disclosure is not
limited thereto.
[0045] However, the disclosure is not limited thereto. In other
embodiments not shown, the optical film 160A can also be directly
attached to the light-emitting elements 120 through the anti-glare
adhesive layer 163. Therefore, the display apparatus requires no
configuration of the adhesive layer 140 of the foregoing
embodiment. In the embodiment, the surface treatment layer 165 is
formed by roughening the upper surface of the polarizing layer 161,
for example. That is, the surface treatment layer 165 may be a
surface roughness layer, but the disclosure is not limited
thereto.
[0046] FIG. 4 is a schematic cross-sectional view of a display
apparatus according to a third embodiment of the disclosure. FIG. 5
is a schematic cross-sectional view of a display apparatus
according to a fourth embodiment of the disclosure. Referring to
FIG. 4, the difference between a display apparatus 12 of the
embodiment and the display apparatus 10 of FIG. 2 is that the
compositions of the optical film and the adhesive layer are
different. In the embodiment, an adhesive layer 140A may also have
a plurality of light-absorbing particles 141, and the
light-absorbing particles 141 are adapted for absorbing ambient
light from the outside. The material of the light-absorbing
particles 141 may include carbon black or masterbatch pigment/dye.
For example, the optical density (OD) of the adhesive layer 140A
may range from 0 to 1.0.
[0047] By doping the light-absorbing particles 141 in the adhesive
layer 140A, the design flexibility of an optical film 160B can be
increased. In the embodiment, the optical film 160B may be an
anti-glare low-reflection layer or a low-reflection layer. However,
the disclosure is not limited thereto. Referring to FIG. 5, in
other embodiments, an optical film 160C of a display apparatus 13
may also be a surface treatment layer with a rough surface.
[0048] FIG. 6 is a schematic cross-sectional view of a display
apparatus according to a fifth embodiment of the disclosure.
Referring to FIG. 6, the difference between a display apparatus 14
of the embodiment and the display apparatus 10 of FIG. 2 is that
the composition of the optical film is different. Specifically, an
optical film 160D of the display apparatus 14 is an overlapped
structure of the polarizing layer 161, a refracting layer 164, and
a surface treatment layer 166, and the refracting layer 164 is
disposed between the surface treatment layer 166 and the polarizing
layer 161.
[0049] For example, in the embodiment, the refracting layer 164 may
have a plurality of optical microstructures 164MS. For example, the
optical microstructures 164MS are a plurality of microprisms and
adapted for deflecting light LB from the light-emitting element 120
to a specific light emitting range, and the light concentration of
the display apparatus 14 is increased. In the embodiment, the
surface treatment layer 166 is an anti-glare layer, an
anti-reflection layer, an anti-glare low-reflection layer, an
anti-reflection anti-glare layer, or a low-reflection layer, for
example, but the disclosure is not limited thereto.
[0050] FIG. 7 is a schematic cross-sectional view of a display
apparatus according to a sixth embodiment of the disclosure.
Referring to FIG. 7, the difference between a display apparatus 15
of the embodiment and the display apparatus 10 of FIG. 2 is that a
plurality of optical microstructures 120MS are disposed on the
element surface 120s of the light-emitting element 120A of the
display apparatus 15. The optical microstructures 120MS can
increase the roughness of the element surface 120s so that the
reflectivity of the element surface 120s to external ambient light
is reduced.
[0051] On the other hand, in the embodiment, a reflecting layer 110
is further disposed on part of the substrate surface 100s of the
circuit substrate 100 that does not overlap the light-emitting
elements 120. For example, the reflecting layer 110 is a white
paint or a mirror coating to further increase the light extraction
efficiency of the display apparatus 15. In particular, due to the
configuration of the optical film 160, even if the reflecting layer
110 is disposed on the substrate surface 100s of the circuit
substrate 100 to increase the light extraction efficiency, the
display apparatus 15 can still have anti-glare and anti-reflection
characteristics in the dark state.
[0052] In summary, in the display apparatus of an embodiment of the
disclosure, the optical film is connected to a plurality of
light-emitting elements through the adhesive layer. The
light-emitting elements disposed on the circuit substrate are
covered by the optical film to improve the surface flatness of the
display apparatus on one side of the display surface. On the other
hand, there is a cavity between the light-emitting elements between
part of the adhesive layer that is not connected to the
light-emitting elements and the circuit substrate. With the
configuration of the cavity, it is much easier for the optical film
to rework, the difficulty of repairing the light-emitting elements
is effectively reduced, and thereby the repair yield of the display
apparatus is improved.
* * * * *