U.S. patent application number 16/975275 was filed with the patent office on 2022-07-21 for sensor, detection method, and sensor manufacturing method.
This patent application is currently assigned to MITSUI CHEMICALS, INC.. The applicant listed for this patent is MITSUI CHEMICALS, INC., TOHOKU UNIVERSITY. Invention is credited to Mai Kurihara, Takahito Ono, Masaya Toda.
Application Number | 20220228898 16/975275 |
Document ID | / |
Family ID | |
Filed Date | 2022-07-21 |
United States Patent
Application |
20220228898 |
Kind Code |
A2 |
Ono; Takahito ; et
al. |
July 21, 2022 |
SENSOR, DETECTION METHOD, AND SENSOR MANUFACTURING METHOD
Abstract
A sensor includes a body member, a volume change body, and a
detection member. The body member has a flat plate-like shape, a
first end in a first direction being supported, and a storage space
opening at at least one of both end faces in a thickness direction.
The volume change body, whose volume changes depending on an amount
of a target, is supported by the body member so that at least a
part of the volume change body is stored in the storage space. The
detection member is in contact with a second end in the first
direction of the body member, and detects stress caused by the
change in the volume of the volume change body.
Inventors: |
Ono; Takahito; (Sendai-shi,
Miyagi, JP) ; Toda; Masaya; (Sendai-shi, Miyagi,
JP) ; Kurihara; Mai; (Sodegaura-shi, Chiba,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MITSUI CHEMICALS, INC.
TOHOKU UNIVERSITY |
Minato-ku, Tokyo
Sendai-shi, Miyagi |
|
JP
JP |
|
|
Assignee: |
MITSUI CHEMICALS, INC.
Minato-ku, Tokyo
JP
TOHOKU UNIVERSITY
Sendai-shi, Miyagi
JP
|
Prior
Publication: |
|
Document Identifier |
Publication Date |
|
US 20200400478 A1 |
December 24, 2020 |
|
|
Appl. No.: |
16/975275 |
Filed: |
March 11, 2019 |
PCT Filed: |
March 11, 2019 |
PCT NO: |
PCT/JP2019/009577 PCKC 00 |
371 Date: |
August 24, 2020 |
International
Class: |
G01F 22/02 20060101
G01F022/02 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 29, 2018 |
JP |
2018-063978 |
Mar 29, 2018 |
JP |
2018-063987 |
Claims
1. A sensor comprising: a body member that has a flat plate-like
shape, a first end in a first direction being supported, and a
storage space opening at at least one of end faces in a thickness
direction; a volume change body, whose volume changes depending on
an amount of a target, that is supported by the body member so that
at least a part of the volume change body is stored in the storage
space; and a detection member that is in contact with a second end
in the first direction of the body member and detects stress caused
by the change in the volume of the volume change body.
2. The sensor according to claim 1, wherein the storage space opens
at both of the end faces in the thickness direction.
3. The sensor according to claim 1, wherein the storage space
includes a slit-like hole extending in a second direction
orthogonal to the first direction.
4. The sensor according to claim 3, wherein the storage space
includes a plurality of the holes, and the plurality of holes are
arranged along the first direction.
5. The sensor according to claim 1, wherein the detection member
includes: an extension member that extends from the second end to a
position different from a position in contact with the second end
in a second direction orthogonal to the first direction; and a
first supported member, whose tip is supported, that extends from a
tip portion of the extension member, and the detection member
detects the stress at the first supported member.
6. The sensor according to claim 5, wherein the first supported
member has a narrower width than a width of the extension
member.
7. (canceled)
8. The sensor according to claim 1, wherein the detection member
includes a first supported member, whose tip is supported, that
extends from the second end in the first direction, and the
detection member detects the stress at the first supported
member.
9. The sensor according to claim 8, wherein the first supported
member has a narrower width than a length of the body member in a
second direction orthogonal to the first direction.
10. (canceled)
11. The sensor according to claim 5, wherein a central portion of
the first supported member in an extension direction, in which the
first supported member extends, has a narrower width than a width
of each end portion of the first supported member in the extension
direction, and the detection member detects the stress at the
central portion of the first supported member.
12. The sensor according to claim 1, wherein the detection member
includes a supported member, whose tip is supported, that extends
from the second end in the first direction, and the detection
member detects the stress at the tip.
13. The sensor according to claim 12, wherein the supported member
has a narrower width than a length of the body member in a second
direction orthogonal to the first direction.
14. The sensor according to claim 1, wherein the volume change body
is made of material having a lower elastic modulus than an elastic
modulus of the body member.
15. The sensor according to claim 14, wherein the body member has
the elastic modulus larger than or equal to twice the elastic
modulus of the volume change body.
16. The sensor according to claim 14, wherein the volume change
body has a change in the elastic modulus before and after the
change in the volume larger than the body member.
17. The sensor according to claim 1, wherein the volume change body
includes a material that adsorbs, dissolves, or diffuses molecules
by interacting with the molecules.
18. The sensor according to claim 1, wherein the volume change body
includes a material that polymerizes by absorbing heat or
light.
19. The sensor according to claim 1, wherein the volume change body
includes a porous body, or a foam.
20. The sensor according to claim 1, wherein the storage space has
a corner portion having a curved shape or a chamfered shape.
21. A detection method including: changing a volume of a volume
change body depending on an amount of a target, the volume change
body being supported by a body member so that at least a part of
the volume change body is stored in a storage space, the body
member having a flat plate-like shape, a first end in a first
direction being supported, and the storage space opening at at
least one of end faces in a thickness direction; and detecting
stress caused by the change in the volume of the volume change body
in a detection member that is in contact with a second end in the
first direction of the body member.
22. A sensor manufacturing method including: forming a storage
space in a first member, the first member having a flat plate-like
shape and a first end in a first direction being supported, the
storage space opening at at least one of end faces in a thickness
direction, and providing an element in a second member in contact
with a second end in the first direction of the first member, the
element detecting stress; and storing at least a part of the volume
change body, whose volume changes depending on an amount of a
target, in the storage space so as to be supported by the first
member.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation application of
International Application PCT/JP2019/9577, filed on Mar. 11, 2019
and designated the U.S., the entire contents of which are
incorporated herein by reference.
FIELD
[0002] The present invention relates to a sensor, a detection
method, and a sensor manufacturing method.
BACKGROUND
[0003] One of the known sensors has a volume change body, whose
volume changes depending on the amount of a target (for example,
molecules that constitute a gas or a liquid), and detects stress
caused by the change in the volume of the volume change body. For
example, the sensor described in Patent Literature 1 has a body
member, the volume change body, and a detection member. The body
member has a flat plate-like shape. The volume change body changes
in the volume by receiving the target and covers both end faces in
the thickness direction of the body member. The detection member,
whose tip is supported, extends from the end of the body member.
The detection member includes a piezoresistive element and detects
the stress caused by the change in the volume of the volume change
body.
CITATION LIST
Patent Literature
[0004] Patent Literature 1: International Publication No.
WO2013/157581
SUMMARY
[0005] By the way, in the above sensor, the stress in the thickness
direction of the body member may be caused by, for example, the
variation in the amount of the target received by the volume change
body. In this case, the body member may be bent. As a result, there
is a possibility that the change in the volume of the volume change
body may not be reflected with high accuracy in the stress occurred
in the detection member. In other words, the sensor may not be able
to detect the target with high accuracy.
[0006] An object of the present invention is to detect the target
with high accuracy.
[0007] In one aspect, a sensor comprising: a body member that has a
flat plate-like shape, a first end in a first direction being
supported, and a storage space opening at at least one of end faces
in a thickness direction; a volume change body, whose volume
changes depending on an amount of a target, that is supported by
the body member so that at least a part of the volume change body
is stored in the storage space; and a detection member that is in
contact with a second end in the first direction of the body member
and detects stress caused by the change in the volume of the volume
change body.
[0008] In another aspect, a detection method including: changing a
volume of a volume change body depending on an amount of a target,
the volume change body being supported by a body member so that at
least a part of the volume change body is stored in a storage
space, the body member having a flat plate-like shape, a first end
in a first direction being supported, and the storage space opening
at at least one of end faces in a thickness direction; and
detecting stress caused by the change in the volume of the volume
change body in a detection member that is in contact with a second
end in the first direction of the body member.
[0009] In another aspect, a sensor manufacturing method including:
forming a storage space in a first member, the first member having
a flat plate-like shape and a first end in a first direction being
supported, the storage space opening at at least one of end faces
in a thickness direction, and providing an element in a second
member in contact with a second end in the first direction of the
first member, the element detecting stress; and storing at least a
part of the volume change body, whose volume changes depending on
an amount of a target, in the storage space so as to be supported
by the first member.
[0010] The target can be detected with high accuracy.
BRIEF DESCRIPTION OF DRAWING
[0011] FIG. 1 is a right front upper perspective view of a sensor
of a first embodiment;
[0012] FIG. 2 is a right front upper perspective view of the sensor
in a state where the sensor of the first embodiment is
disassembled;
[0013] FIG. 3 is a right side view of the sensor of the first
embodiment;
[0014] FIG. 4 is a plan view of the sensor of the first
embodiment;
[0015] FIG. 5 is a bottom view of the sensor of the first
embodiment;
[0016] FIG. 6 is a cross-sectional view of the sensor cut by a
plane represented by a VI-VI line of FIG. 4;
[0017] FIG. 7 is a cross-sectional view of the sensor cut by a
plane represented by a VII-VII line in FIG. 4;
[0018] FIG. 8 is a block diagram illustrating an electric circuit
to which the sensor of the first embodiment is connected;
[0019] FIGS. 9A-9D are explanatory diagrams illustrating a
manufacturing process of the sensor of the first embodiment;
[0020] FIGS. 10E-10G are explanatory diagrams illustrating the
manufacturing process of the sensor of the first embodiment;
[0021] FIG. 11 is a cross-sectional view of a sensor of a third
modified example of the first embodiment;
[0022] FIG. 12 is a cross-sectional view of a sensor of a fourth
modified example of the first embodiment;
[0023] FIG. 13 is a plan view of a sensor of a fifth modified
example of the first embodiment;
[0024] FIG. 14 is a plan view of a sensor of a sixth modified
example of the first embodiment;
[0025] FIG. 15 is a graph illustrating a responsiveness to humidity
of a sensor of a first example of the first embodiment;
[0026] FIG. 16 is a graph illustrating a responsiveness to humidity
of the sensor of the first example of the first embodiment;
[0027] FIG. 17 is a graph illustrating a responsiveness to humidity
of the sensor of the first example of the first embodiment;
[0028] FIG. 18 is a graph illustrating a responsiveness to hydrogen
sulfide of the sensor of the first example of the first
embodiment;
[0029] FIG. 19 is a graph illustrating a responsiveness to humidity
of a sensor of a second example of the first embodiment;
[0030] FIG. 20 is a graph illustrating a responsiveness to hydrogen
sulfide of the sensor of the second example of the first
embodiment;
[0031] FIG. 21 is a graph illustrating a responsiveness to hydrogen
sulfide of the sensor of the second example of the first
embodiment;
[0032] FIG. 22 is a graph illustrating a responsiveness to humidity
of a sensor of a third example of the first embodiment;
[0033] FIG. 23 is a graph illustrating a responsiveness to hydrogen
sulfide of the sensor of the third example of the first
embodiment;
[0034] FIG. 24 is a right front upper perspective view of a sensor
of a second embodiment;
[0035] FIG. 25 is a right front upper perspective view of the
sensor in a state where the sensor of the second embodiment is
disassembled;
[0036] FIG. 26 is a plan view of the sensor of the second
embodiment;
[0037] FIG. 27 is a cross-sectional view of the sensor cut by a
plane represented by an XVIII-XVIII line in FIG. 26;
[0038] FIG. 28 is a plan view of a sensor of a third modified
example of the second embodiment;
[0039] FIG. 29 is a plan view of a sensor of a fourth modified
example of the second embodiment;
[0040] FIG. 30 is a plan view of a sensor of a fifth modified
example of the second embodiment;
[0041] FIG. 31 is a plan view of a sensor of a sixth modified
example of the second embodiment;
[0042] FIG. 32 is a plan view of a sensor of a seventh modified
example of the second embodiment;
[0043] FIG. 33 is a right front upper perspective view of a sensor
of a third embodiment;
[0044] FIG. 34 is a right front upper perspective view of the
sensor of the third embodiment in a state where the sensor is
disassembled;
[0045] FIG. 35 is a plan view of the sensor of the third
embodiment;
[0046] FIG. 36 is a cross-sectional view of the sensor cut by a
plane represented by an XXXVI-XXXVI line of FIG. 35;
[0047] FIG. 37 is a plan view of a sensor of a ninth modified
example of the third embodiment.
DESCRIPTION OF EMBODIMENTS
[0048] Each of the embodiments relating to the sensor, detection
method, and sensor manufacturing method of the present invention
will be described below with reference to FIGS. 1 to 37.
First Embodiment
(Overview)
[0049] A sensor of a first embodiment includes a body member, a
volume change body, and a detection member.
[0050] The body member has a flat plate-like shape, a first end in
a first direction being supported, and a storage space opening at
at least one of both end faces in a thickness direction.
[0051] The volume change body, whose volume changes depending on an
amount of a target, is supported by the body member so that at
least a part of the volume change body is stored in the storage
space.
[0052] The detection member is in contact with a second end in the
first direction in the body member, and detects stress caused by
the change in the volume of the volume change body.
[0053] According to the sensor, since the volume change body is
stored in the storage space, the occurrence of stress in the
thickness direction of the body member can be suppressed even when
the volume of the volume change body changes. This can prevent the
body member from bending. Therefore, the occurrence of stress in
the thickness direction of the body member at the second end can be
suppressed. As a result, the change in the volume of the volume
change body can be reflected with high accuracy in the stress,
which occurs at the second end, in the direction along the body
member. In other words, the sensor can detect the target with high
accuracy.
[0054] Next, the sensor of the first embodiment will be described
in detail.
(Configuration)
[0055] Hereinafter, as illustrated in FIGS. 1 to 7, the sensor 1 of
the first embodiment will be described using a right-handed
orthogonal coordinate system having an x-axis, a y-axis, and a
z-axis. In this specification, the same coordinate system is used
in FIGS. 11 to 14 and FIGS. 24 to 37 described later.
[0056] The sensor 1 detects the target. For example, the target is
molecules that constitute a gas, a liquid, or a solid. Further, for
example, the target is molecules that constitute a mixture of at
least two of a gas, a liquid, and a solid. Further, for example,
the target is fine particles, temperature, humidity,
electromagnetic wave, or the like.
[0057] In this example, the x-axis direction, the y-axis direction,
and the z-axis direction may be represented as the left-right
direction of the sensor 1, the front-back direction of the sensor
1, and the up-down direction of the sensor 1, respectively. In this
example, the positive direction of the x-axis, the negative
direction of the x-axis, the positive direction of the y-axis, the
negative direction of the y-axis, the positive direction of the
z-axis, and the negative direction of the z-axis are the right
direction of the sensor 1, the left direction of sensor 1 the front
direction of the sensor 1, the back direction of the sensor 1, the
up direction of the sensor 1, and the down direction of the sensor
1, respectively.
[0058] FIG. 1 is a view of the sensor 1 from the position to right
of the sensor 1, in front of the sensor 1, and above the sensor 1
(in other words, right front upper perspective view). FIG. 2 is a
right front upper perspective view of the sensor 1 in a state where
the sensor 1 is disassembled. FIG. 3 is a view of the sensor 1 from
right side of the sensor 1 (in other words, right side view).
[0059] FIG. 4 is a view of the sensor 1 from above the sensor 1 (in
other words, a plan view). FIG. 5 is a view of the sensor 1 from
below the sensor 1 (in other words, a bottom view). FIG. 6 is a
view of the cross section of the sensor 1 cut by a plane
represented by a VI-VI line in FIG. 4 as viewed in the negative
direction of the x-axis. FIG. 7 is a view of the cross section of
the sensor 1 cut by a plane represented by a VII-VII line in FIG. 4
as viewed in the negative direction of the y-axis.
[0060] As illustrated in FIG. 1, the sensor 1 has a pillar-like
shape extending in the z-axis direction. In this example, the cross
section of the sensor 1 cut by the plane orthogonal to the z-axis
(in other words, an xy-plane) has a square-like shape. The cross
section of the sensor 1 cut by the xy-plane may have a shape (for
example, a circular-like, elliptical-like, or rectangular-like
shape) different from the square-like shape.
[0061] For example, the length of a side of the cross section of
the sensor 1 cut by the xy-plane is a length of 50 .mu.m to 5 mm.
In this example, the length of a side of the cross section of the
sensor 1 cut by the xy-plane is 500 .mu.m. For example, the sensor
1 may be manufactured using a technique called microfabrication or
nanofabrication.
[0062] The sensor 1 includes a first layered body 11, a second
layered body 12, a third layered body 13, and a volume change body
14. The first layered body 11, the second layered body 12, and the
third layered body 13 are laminated so as to be arranged in this
order in the z-axis direction. In other words, the second layered
body 12 is in contact with the first layered body 11, and the third
layered body 13 is in contact with the second layered body 12 at
the opposite side of the first layered body 11. In other words, the
second layered body 12 is sandwiched between the first layered body
11 and the third layered body 13.
[0063] For example, the first layered body 11 has a thickness of
0.5 .mu.m to 50 .mu.m, the second layered body 12 has a thickness
of 0.05 .mu.m to 5 .mu.m, and the third layered body 13 has a
thickness of 50 .mu.m to 5 mm. In this example, the thickness of
the first layered body 11 is 5 .mu.m, the thickness of the second
layered body 12 is 0.5 .mu.m, and the thickness of the third
layered body 13 is 500 .mu.m.
[0064] In this example, the first layered body 11 is made of
silicon. As illustrated in FIGS. 1 and 2, the first layered body 11
has a hollow pillar-like shape that extends in the z-axis direction
and opens at both end faces in the z-axis direction.
[0065] In this example, the second layered body 12 is made of
silicon dioxide. As illustrated in FIGS. 1 and 2, the second
layered body 12 has a flat plate-like shape. The second layered
body 12 has a hole that opens at both end faces in the z-axis
direction of the second layered body 12. In this example, the cross
section of the second layered body 12 cut by the xy-plane has the
same shape as the cross section of the first layered body 11 cut by
the xy-plane.
[0066] In this example, the third layered body 13 is made of
silicon. As illustrated in FIGS. 1 and 2, the third layered body 13
has a flat plate-like shape. In this example, the exposed surface
of the third layered body 13 is covered with an insulator thin film
(not illustrated).
[0067] The third layered body 13 includes a frame 131, a body
member 132, and a detection member 133.
[0068] The frame 131 has a hole that opens at both end faces in the
z-axis direction of the frame 131. In this example, the cross
section of the frame 131 cut by the xy-plane has the same shape as
the cross section of the first layered body 11 cut by the
xy-plane.
[0069] As illustrated in FIG. 4, the body member 132 has a
rectangular-like shape having long sides extending in the y-axis
direction and short sides extending in the x-axis direction. The
body member 132 may have a square-like shape. The length of the
body member 132 in the y-axis direction is shorter than the length
of the hole of the frame 131 in the y-axis direction. In this
example, the length of the body member 132 in the y-axis direction
is 367 .mu.m. The length of the body member 132 in the x-axis
direction is shorter than the length of the hole of the frame 131
in the x-axis direction. In this example, the length of the body
member 132 in the x-axis direction is 300 .mu.m. Both ends in the
x-axis direction of the body member 132 are separated from the
frame 131.
[0070] The body member 132 is in contact with the frame 131 at the
first end 1321 in the positive direction of the y-axis of the body
member 132. In other words, in the body member 132, the first end
1321 in the positive direction of the y-axis of the body member 132
is supported by the frame 131.
[0071] Both end portions in the x-axis direction of the second end
1322 in the negative direction of the y-axis of the body member 132
are in contact with the frame 131 through the detection member 133.
The central portion in the x-axis direction of the second end 1322
in the negative direction of the y-axis of the body member 132 is
separated from the frame 131.
[0072] The body member 132 has a space formation portion 1323 that
forms a storage space that opens at both end faces in the z-axis
direction (in other words, the thickness direction of the body
member 132) of the body member 132. The storage space includes
slit-like holes extending in the x-axis direction. In this example,
each hole included in the storage space is a through hole that
penetrates the body member 132 in the z-axis direction. In this
example, the holes in the storage space are arranged at equal
intervals along the y-axis direction.
[0073] For example, the length in the y-axis direction of each hole
included in the storage space is a length of 0.1 .mu.m to 10 .mu.m.
In this example, the length in the y-axis direction of each hole
included in the storage space is 1 .mu.m. For example, the interval
in the y-axis direction between the holes included in the storage
space has a length of 0.1 .mu.m to 10 .mu.m. In this example, the
interval in the y-axis direction between the holes included in the
storage space is 1 .mu.m. In this example, the number of the holes
included in the storage space is 133. Note that, in FIGS. 1 to 7,
the holes included in the storage space are illustrated in an
enlarged manner in the y-axis direction. Therefore, in FIGS. 1 to
7, the holes included in the storage space are illustrated in a
reduced number manner.
[0074] In this example, the length of the slit-like holes included
in the storage space in the x-axis direction is 280 .mu.m.
[0075] The detection member 133 includes a first supported member
1331, a second supported member 1332, a first wiring 1333, and a
second wiring 1334.
[0076] As illustrated in FIG. 4, the first supported member 1331
has a strip-like shape extending in the y-axis direction. The end
in the negative direction of the y-axis of the first supported
member 1331 is in contact with the frame 131. The end in the
positive direction of the y-axis of the first supported member 1331
is in contact with the end portion in the negative direction of the
x-axis of the second end 1322 of the body member 132. In other
words, the first supported member 1331 extends from the second end
1322 of the body member 132 to the negative direction of the
y-axis, and the tip of the first supported member 1331 is supported
by the frame 131.
[0077] The width of the first supported member 1331 (in other
words, the length of the first supported member 1331 in the x-axis
direction) is narrower than the width of the body member 132 (in
other words, the length of the body member 132 in the x-axis
direction). The width of the central portion of the first supported
member 1331 in an extension direction (the y-axis direction in this
example), in which the first supported member 1331 extends, is
narrower than the width of each of the end portions in the
extension direction of the first supported member 1331.
[0078] The first supported member 1331 includes a piezoresistive
element PZ located in the central portion in the extension
direction of the first supported member 1331. The piezoresistive
element PZ is an element whose electric resistance changes
depending on the stress applied to the piezoresistive element PZ.
In other words, the piezoresistive element PZ is an element having
a piezoresistive effect.
[0079] In this example, as illustrated in FIG. 7, the
piezoresistive element PZ is embedded in the first supported member
1331 so as to be exposed at the end face in the positive direction
of the z-axis of the first supported member 1331.
[0080] With such a configuration, the detection member 133 detects
the stress transmitted from the body member 132 in the central
portion in the extension direction of the first supported member
1331.
[0081] As illustrated in FIG. 4, the second supported member 1332
has a strip-like shape extending in the y-axis direction. The end
in the negative direction of the y-axis of the second supported
member 1332 is in contact with the frame 131. The end in the
positive direction of the y-axis of the second supported member
1332 is in contact with the end portion in the positive direction
of the x-axis of the second end 1322 of the body member 132. In
other words, the second supported member 1332 extends from the
second end 1322 of the body member 132 to the negative direction of
the y-axis, and the tip of the second supported member 1332 is
supported by the frame 131.
[0082] The width of the second supported member 1332 (in other
words, the length of the second supported member 1332 in the x-axis
direction) is narrower than the width of the body member 132. The
width of the central portion of the second supported member 1332 in
an extension direction (the y-axis direction in this example), in
which the second supported member 1332 extends, is narrower than
the width of each of the end portions of the second supported
member 1332 in the extension direction.
[0083] The first wiring 1333 and the second wiring 1334 are made of
conductor (aluminum in this example). The first wiring 1333 and the
second wiring 1334 are laid on the end face in the positive
direction of the z-axis of the third layered body 13.
[0084] For example, the thickness of the first wiring 1333 and the
second wiring 1334 (in other words, the length in the z-axis
direction of the first wiring 1333 and the second wiring 1334) is a
thickness of 10 nm to 1 .mu.m. In this example, the thickness of
the first wiring 1333 and the second wiring 1334 is 100 nm.
[0085] In this example, a part of the exposed surface of the first
wiring 1333 and the second wiring 1334 is covered with an oxide
thin film (not illustrated). For example, the other part, which is
not covered with the oxide thin film, of the exposed surface of the
first wiring 1333 and the second wiring 1334 may be used as
terminals for connection.
[0086] As illustrated in FIG. 4 and FIG. 6, one end portion of the
first wiring 1333 is in contact with the end portion in the
negative direction of the y-axis of the piezoresistive element PZ.
The other end portion of the first wiring 1333 is located at the
outer edge of the frame 131. The first wiring 1333 extends from the
end portion in the negative direction of the y-axis of the
piezoresistive element PZ to the outer edge of the frame 131
through the tip of the first supported member 1331 (in other words,
the end, which is in contact with the frame 131, of the first
supported member 1331). In other words, the first wiring 1333
connects the piezoresistive element PZ and the tip of the first
supported member 1331.
[0087] One end portion of the second wiring 1334 is in contact with
the end portion in the positive direction of the y-axis of the
piezoresistive element PZ. The other end portion of the second
wiring 1334 is located at the outer edge of frame 131. The second
wiring 1334 extends from the end portion in the positive direction
of the y-axis of the piezoresistive element PZ to the outer edge of
the frame 131 through the proximal end (in other words, the end,
which is in contact with the body member 132, of the first
supported member 1331) of the first supported member 1331, the end
portion in the negative direction of the y-axis of the body member
132, and the second supported member 1332.
[0088] In other words, the second wiring 1334 connects the
piezoresistive element PZ and the tip (in other words, the end,
which is in contact with the frame 131, of the second supported
member 1332) of the second supported member 1332 through the body
member 132.
[0089] The volume change body 14 is made of a sensing material
whose volume changes depending on the amount of the target. The
details of the sensing material will be described later. The volume
change body 14 may be represented as a sensing body or a sensory
body. In this example, the volume change body 14 increases the
volume of the volume change body 14 (in other words, expands) by
receiving (for example, adsorbing, absorbing, or sorbing) the
target. In this example, the volume change body 14 may be referred
to as a receptor. In this example, the volume of the volume change
body 14 increases as the amount of the received target increases.
The volume change body 14 may reduce the volume of the volume
change body 14 (in other words, shrink) by desorbing or detaching a
substance from the volume change body 14 depending on the amount of
the target.
[0090] The volume change body 14 is supported by the body member
132 so as to be stored in the storage space of the body member 132.
In this example, the volume change body 14 fills the storage space
of the body member 132. In this example, the volume change body 14
is fixed to the space formation portion 1323 of the body member
132.
[0091] In this example, the volume change body 14 is made of
material whose elastic modulus (for example, Young's modulus) is
lower than that of the body member 132. For example, the elastic
modulus of the body member 132 is preferably twice or more the
elastic modulus of the volume change body 14.
[0092] Also, in this example, the volume change body 14 has the
change in the elastic modulus before and after the change in the
volume of the volume change body 14 larger than the body member
132.
[0093] For example, the volume change body 14 includes a material
that adsorbs, dissolves, or diffuses certain molecules by
interacting with the molecules.
[0094] According to this, when the target is certain molecules, the
volume change body 14 adsorbs, dissolves, or diffuses the molecules
by interacting with the molecules. As a result, the volume of the
volume change body 14 changes. Therefore, the amount of the target
can be reflected in the change in the volume of the volume change
body 14 with high accuracy. As a result, the target can be detected
with high accuracy.
[0095] Further, for example, the volume change body 14 includes a
material, which will be described later, that polymerizes by
absorbing heat or light.
[0096] According to this, when the target is heat or light, the
volume of the volume change body 14 changes due to the
polymerization of the volume change body 14. As a result, the
amount of the target can be reflected in the change in the volume
of the volume change body 14 with high accuracy. As a result, the
target can be detected with high accuracy.
[0097] When the target is heat, at least a part of the space
formation portion 1323 of the body member 132 preferably has a
higher thermal conductivity than the other part of the body member
132. For example, when a part of the body member 132 other than the
space formation portion 1323 is made of silicon, at least a part of
the space formation portion 1323 may be made of gold, silver,
aluminum or copper.
[0098] According to this, the amount of heat absorbed by the volume
change body 14 can be increased. As a result, the amount of the
target can be reflected in the change in the volume of the volume
change body 14 with high accuracy. As a result, the target can be
detected with high accuracy.
[0099] When the target is light, at least a part of the space
formation portion 1323 of the body member 132 preferably has a
higher light transmittance than the other part of the body member
132. For example, when a part of the body member 132 other than the
space formation portion 1323 is made of silicon, at least a part of
the space formation portion 1323 is made of glass, polycarbonate
resin, polyvinyl chloride resin, polyvinyl acetate, polyvinyl
alcohol resin, fluorine resin, polystyrene elastomer, polyolefin
elastomer, or acrylic resin.
[0100] According to this, the amount of light absorbed by the
volume change body 14 can be increased. As a result, the amount of
the target can be reflected in the change in the volume of the
volume change body 14 with high accuracy. As a result, the target
can be detected with high accuracy.
[0101] Further, for example, the volume change body 14 includes a
porous body or a foam.
[0102] According to this, when the target is fine particles (for
example, pollen or particulate matter (for example, PM.sub.2.5
etc.)) or aerosol (for example, mist or smoke), the amount of the
target that is adsorbed or absorbed by the volume change body 14
can be increased by allowing the target to enter the pores or the
recesses of the volume change body 14. As a result, the amount of
the target can be reflected in the change in the volume of the
volume change body 14 with high accuracy. As a result, the target
can be detected with high accuracy.
[0103] Further, the first wiring 1333 and the second wiring 1334
are connected to an electric circuit not illustrated in FIGS. 1 to
7. As a result, the sensor 1 constitutes an electric circuit 100
illustrated in FIG. 8. The electric circuit 100 includes a first
power source 101, a second power source 102, a first resistor 103,
a second resistor 104, an amplifier 105, and a storage device
106.
[0104] The second power source 102, the first power source 101, the
first resistor 103, and the second resistor 104 are connected in
series in this order. The electric circuit 100 is grounded between
the first power source 101 and the second power source 102. The
amplifier 105 inputs the electric potential between the first
resistor 103 and the second resistor 104, amplifies the input
electric potential, and outputs the amplified electric potential to
the storage device 106. The storage device 106 stores the signal
represented by the electric potential input from the amplifier
105.
[0105] The voltage of the first power source 101 is +V.sub.A [V].
The voltage of the second power source 102 is -V.sub.B [V]. The
electric resistance of the first resistor 103 is R.sub.S [.OMEGA.].
The electric resistance of the second resistor 104 is R.sub.R
[.OMEGA.]. In this example, the piezoresistive element PZ of the
sensor 1 constitutes the first resistor 103. Therefore, the first
resistor 103 may be regarded as a variable resistor. Also, the
second resistor 104 may be regarded as a reference resistor.
[0106] With such a configuration, the storage device 106 stores a
signal depending on the difference between the electric resistance
of the first resistor 103 and the electric resistance of the second
resistor 104.
(Sensing Material)
[0107] Next, the sensing material will be described.
[0108] In this example, the sensing material has fluidity. For
example, in order to form the volume change body 14 by filling the
storage space with the sensing material, the sensing material
preferably has a low viscosity, good wettability with a wall
forming the storage space, ease of inflow into the storage space,
and ease of solidification without flowing out from the storage
space.
[0109] Therefore, the sensing material preferably has a viscosity
measured by a Brookfield type (in other words, B-type) viscosity
meter of 1000 [mPasec] or less, more preferably 500 [mPasec] or
less, furthermore preferably 250 [mPasec] or less, particularly
preferably 200 [mPasec] or less, and most preferably 100 [mPasec]
or less.
[0110] The optimum viscosity of the sensing material may vary
depending on the material constituting the third layered body 13,
the state of the wall surface forming the storage space, the shape
of the storage space, and the size of the storage space.
[0111] When the viscosity of the sensing material is less than 1
[mPasec], the concentration of solute contained in the sensing
material tends to be excessively low, so that the solute is likely
to be unevenly distributed in the storage space. Therefore, the
viscosity of the sensing material is preferably 1 [mPasec] or
more.
[0112] Further, when the viscosity of the sensing material is
larger than 1000 [mPasec], the fluidity of the sensing material
tends to be excessively low, which makes it difficult to fill the
storage space with the sensing material. Therefore, the viscosity
of the sensing material is preferably 1000 [mPasec] or less.
[0113] Accordingly, in this example, the sensing material has a
value of 1 [mPasec] to 1000 [mPasec] as the viscosity measured by
the B-type viscosity meter.
[0114] Further, for example, when a material constituting the wall
surface forming the storage space is mainly silicon and the sensing
material flows into the storage space due to a capillary
phenomenon, it is preferred that the solvent contained in the
sensing material has a sufficiently low surface tension. The
solvent may be represented as a flux.
[0115] Note that the optimum surface tension of the solvent may
vary depending on the filling method of the sensing material
described below.
[0116] The method of filling the storage space with the sensing
material, a technique called dipping method (in other words, dip
coating method or the like), spray coating method, or spin coating
method may be used. Alternatively, the sensing material may be
filled into the storage space using an inkjet printer or a needle
dispenser. For example, the dipping method is suitable for
increasing the efficiency of the operation of filling the storage
space with the sensing material.
[0117] The solvent contained in the sensing material may be able to
dissolve at least a part of the solute contained in the sensing
material. The solvent dissolves at least a part of the solute
contained in the sensing material to constitute a solution or a
suspension (for example, colloid solution or slurry liquid).
[0118] For example, the solvent may be water, alcoholic solvent
(for example, isopropyl alcohol, ethanol, or phenoxyethanol),
formamide-based solvent (for example, N,N-dimethylformamide),
ketone-based solvent (for example, acetone, cyclohexanone, or
2-butanone), ether-based solvent (for example, diethyl ether),
halogen-based solvent (for example, di-chloroform or chloroform),
polar solvent with cyclic compounds (for example, 2-pyrrolidone,
N-methyl-2-pyrrolidone, or tetrahydrofuran), or benzene-based
solvent (for example, toluene or xylene).
[0119] For example, the sensing material is synthetic polymer (for
example, thermoplastic polymer, thermosetting polymer, or
photocurable polymer), polymer originating from natural matter (for
example, biomolecule), inorganic material (for example, metal or
ceramics), carbon material, or composition including at least one
of the foregoing. Alternatively, for example, the sensing material
may include fine particles of inorganic material, carbon material,
low molecular compound, or polymer.
[0120] Note that the method of manufacturing the synthetic polymer,
for example, is disclosed in Non Patent Literature 1.
Non Patent Literature 1: "Practical Plastics Encyclopedia", edited
by Practical Plastics Encyclopedia Editorial Committee, Industrial
Research Committee, 1993
[0121] The sensing material may include one type of thermoplastic
polymer or may include two or more types of thermoplastic
polymers.
[0122] For example, the thermoplastic polymer may be polyolefin
resin (for example, polyethylene, polypropylene, polystyrene,
polyvinyl chloride, or polyvinyl alcohol), a polyolefin-based wax
(for example, polyethylene oligomer or polypropylene oligomer),
thermoplastic acrylic resin, polycarbonate resin, thermoplastic
polyester resin, polyamide resin, polyimide resin, acrylonitrile
butadiene styrene (ABS) resin, elastomer (for example,
polyolefin-based elastomer, hydrogenated styrene-based block
copolymer, or hydrogenated styrene-based random copolymer), super
engineering plastic (for example, polyphenylene sulfide, polyamide
imide, polyether sulfone, or polyether ether ketone), or
syndiotactic polystyrene.
[0123] For example, the thermosetting polymer or the photocurable
polymer is acrylic resin, unsaturated polyester resin, epoxy resin,
phenol resin, urea resin, polyurethane resin, melamine resin,
silicone resin, alkyd resin, or thermosetting polyimide. When the
sensing material contains the thermosetting polymer or the
photocurable polymer, monomer before curing and initiator may be
mixed, immediately after that, the mixture may be filled in the
storage space, and the mixture may be cured by heat or light to
form the volume change body 14.
[0124] For example, the polymer originating from natural matter is
polysaccharide originating from natural matter (for example,
cellulose, chitin, chitosan, hyaluronic acid, or xanthan gum),
polysaccharide derivative originating from natural matter, amino
acid polymer, amino acid polymer derivative, protein (for example,
gelatin or collagen), or protein derivative.
[0125] For example, the inorganic material is made of at least one
of materials selected from the group of glass fiber, carbon fiber,
and inorganic filler.
[0126] For example, the inorganic filler is amorphous filler (for
example, calcium carbonate, silica, kaolin, clay, titanium oxide,
barium sulfate, zinc oxide, hydroxide aluminum, alumina, or
magnesium hydroxide), a plate-like filler (for example, talc, mica,
or glass flake), needle-like filler (for example, wollastonite,
potassium titanate, basic magnesium sulfate, sepiolite, xonotlite,
or aluminum borate), conductive filler (for example, metal powder,
metal flake, carbon black, or carbon nanotube), glass bead, glass
powder, apatite, or zeolite.
[0127] The sensing material may include one type of inorganic
filler or may include two or more types of inorganic fillers.
Alternatively, the surface of the inorganic filler may be coated
with carbon or may be subjected to silane coupling treatment or the
like.
[0128] For example, the carbon material is made of at least one of
materials selected from the group of activated carbon, carbon
nanotube, and graphite.
[0129] For example, the sensing material may include synthesized
porous body such as metal organic framework (MOF). The metal
organic framework may be referred to as porous coordination
polymer. For example, the metal organic framework may be Basolite
(registered trademark) C300 (manufactured by BASF) or the like.
[0130] Alternatively, the sensing material may include an additive.
For example, the additive may be a flame retardant (for example,
brominated bisphenol, brominated epoxy resin, brominated
polystyrene, brominated polycarbonate, triphenyl phosphate,
phosphonamide, or red phosphorus), a flame retardant aid (for
example, antimony trioxide or sodium antimonate), a heat stabilizer
(for example, phosphate ester, or phosphite ester), an antioxidant
(for example, hindered phenol), a heat-resistant agent, a
weathering agent, a light stabilizer, a mold release agent, a flow
modifier, a colorant, a pigment, a lubricant, an antistatic agent,
a crystal nucleating agent, a plasticizer, a foaming agent, a
halogen catcher, or an anti-drip agent.
[0131] Alternatively, the sensing material may include spherical
particles. According to this, the sensing material including
spherical particles has a higher fluidity than the sensing material
including non-spherical particles so that the storage space can
easily be filled with the sensing material.
[0132] For example, when the target is a carbonic acid gas, the
sensing material may include potassium hydroxide. For example, when
the target is temperature, the sensing material may include
polyethylene. For example, when the target is humidity, the sensing
material may include nylon. For example, when the target is
electromagnetic wave, the sensing material may include black
carbon.
(Manufacturing Method)
[0133] Next, a method of manufacturing the sensor 1 of the first
embodiment (in other words, a sensor manufacturing method) will be
described.
[0134] In this example, the sensor 1 is manufactured according to
the process illustrated in FIGS. 9 and 10. Note that at least a
part of the sensor 1 may be manufactured according to a process
different from the process illustrated in FIGS. 9 and 10.
[0135] First, as illustrated in FIG. 9A, a silicon on insulator
(SOI) substrate is prepared. The SOI substrate consists of a first
silicon layer LA, an insulating layer LB in contact with the first
silicon layer LA, a second silicon layer LC in contact with the
insulating layer LB. In this example, the insulating layer LB is
made of silicon dioxide.
[0136] Next, as illustrated in FIG. 9B, boron is added to the
second silicon layer LC. In this example, a technique called doping
is used for the addition of boron. According to the second silicon
layer LCA to which boron is added, the contact resistance of the
conductor can be reduced.
[0137] Next, as illustrated in FIG. 9C, a thin film made of
aluminum is formed on the surface of the second silicon layer LCA
opposite to the insulating layer LB. In this example, a technique
called sputtering is used to form the thin film made of aluminum.
Furthermore, the first wiring 1333 and the second wiring 1334 are
formed by removing a part of the formed thin film. In this example,
a technique called metal etching is used to remove the part of the
thin film. In this example, the second silicon layer LCA
corresponds to the first member and the second member.
[0138] Next, as illustrated in FIG. 9D, the third layered body 13
is formed by removing a part of the second silicon layer LCA. In
this example, a technique called dry etching is used to remove the
part of the second silicon layer LCA.
[0139] Next, as illustrated in FIG. 10E, the first layered body 11
and the second layered body 12 are formed by removing a part of the
first silicon layer LA and a part of the insulating layer LB,
respectively. In this example, a technique called deep reactive ion
etching (deep RIE) and vapor hydrogen fluoride etching (Vapor HF
Etching) is used to remove the part of the first silicon layer LA
and the part of the insulating layer LB.
[0140] Next, as illustrated in FIG. 10F, an insulator thin film OL
is formed on the exposed surface of the third layered body 13, the
first wiring 1333, and the second wiring 1334. In this example, the
insulator thin film OL is made of aluminum oxide. In this example,
a technique called atomic layer deposition is used to form the
insulator thin film. For example, the insulator thin film has a
thickness of 5 nm to 50 nm. In this example, the thickness of the
insulator thin film is 20 nm.
[0141] Next, terminals for connection are formed by removing a part
of the insulator thin film OL formed on the surface of the first
wiring 1333 and a part of the insulator thin film OL formed on the
surface of the second wiring 1334. In this example, a technique
called ion milling is used to form the terminals for
connection.
[0142] Next, as illustrated in FIG. 10G, the volume change body 14
is formed by filling the storage space of the body member 132 with
the sensing material. In this example, a technique called dipping
method is used to form the volume change body 14. For example, the
sensing material is filled in the storage space of the body member
132 by immersing the body member 132 in a solution which is the
sensing material. The volume change body 14 is formed by drying the
filled sensing material at a temperature of 10 to 350.degree.
C.
[0143] In this way, the sensor 1 is manufactured.
(Operation)
[0144] Next, the operation of the sensor 1 of the first embodiment
will be described.
[0145] The case where the target exists near the sensor 1 is
assumed. In this case, the volume change body 14 receives the
target, so that the volume increases depending on the amount of the
target.
[0146] As a result, the volume change body 14 causes the stress
including the component in the negative direction of the y-axis at
the second end 1322 of the body member 132. The stress occurred at
the second end 1322 of the body member 132 is transmitted to the
detection member 133.
[0147] The electric resistance of the piezoresistive element PZ of
the detection member 133 changes depending on the stress
transmitted from the body member 132. The electric circuit 100
stores the signal in the storage device 106 depending on the
difference between the electric resistance (in this example, the
electric resistance of the first resistor 103) of the
piezoresistive element PZ of the detection member 133 and the
electric resistance of the second resistor 104.
[0148] In this way, the sensor 1 detects the target.
[0149] As described above, in the sensor 1 of the first embodiment,
the body member 132 has a flat plate-like shape, the first end 1321
in the first direction (the y-axis direction in this example) being
supported, and the storage space opening at at least one of both
end faces in the thickness direction of the body member 132.
Further, the volume change body 14, whose volume changes depending
on the amount of the target, is supported by the body member 132 so
that at least a part of the volume change body 14 is stored in the
storage space. Further, the detection member 133 is in contact with
the second end 1322 in the first direction of the body member 132,
and detects the stress caused by the change in the volume of the
volume change body 14.
[0150] According to this, since the volume change body 14 is stored
in the storage space, even if the volume of the volume change body
14 changes, the occurrence of stress in the thickness direction of
the body member 132 can be suppressed. This can prevent the body
member 132 from bending. Therefore, the occurrence of stress in the
thickness direction of the body member 132 at the second end 1322
can be suppressed. As a result, the change in the volume of the
volume change body 14 can be reflected with high accuracy in the
stress, which occurs at the second end 1322, in the direction along
the body member 132. In other words, the sensor 1 can detect the
target with high accuracy.
[0151] Further, in the sensor 1 of the first embodiment, the
storage space opens at both of the end faces in the thickness
direction of the body member 132.
[0152] According to this, when the volume of the volume change body
14 changes, the stress occurring in the thickness direction of the
body member 132 can be suppressed as compared with the case where
the storage space opens only at one end in the thickness direction
of the body member. Therefore, the change in the volume of the
volume change body 14 can be reflected with high accuracy in the
stress occurred at the second end 1322. As a result, the target can
be detected with high accuracy.
[0153] Furthermore, in the sensor 1 of the first embodiment, the
storage space includes a slit-like hole extending in the second
direction (the x-axis direction in this example) orthogonal to the
first direction (the y-axis direction in this example).
[0154] According to this, the volume change body 14 can be easily
stored in the storage space. In addition, the component in the
first direction in the stress caused by the change in the volume of
the volume change body 14 in the body member 132 can be increased.
Therefore, the change in the volume of the volume change body 14
can be reflected with high accuracy in the stress occurred at the
second end 1322. As a result, the target can be detected with high
accuracy.
[0155] Further, in the sensor 1 of the first embodiment, the
storage space includes a plurality of the holes, and the plurality
of holes are arranged along the first direction (the y-axis
direction in this example).
[0156] By the way, the larger the hole becomes, the more difficult
it becomes to support the volume change body 14 by the body member
132. Therefore, the amount of the volume change body 14 is unlikely
to increase.
[0157] On the other hand, according to the sensor 1, the amount of
the volume change body 14 can be easily increased by increasing the
number of the holes. In addition, since the plurality of holes are
arranged along the first direction, the component in the first
direction in the stress caused by the change in the volume of the
volume change body 14 in the body member 132 can be increased.
Therefore, the change in the volume of the volume change body 14
can be reflected with high accuracy in the stress occurring at the
second end 1322. As a result, the target can be detected with high
accuracy.
[0158] Further, in the sensor 1 of the first embodiment, the
detection member 133 includes the first supported member 1331. The
first supported member 1331, whose tip is supported, extends from
the second end 1322 to the first direction (the y-axis direction in
this example). The detection member 133 detects the stress caused
by the change in the volume of the volume change body 14 at the
first supported member 1331.
[0159] According to this, the compressive stress or the tensile
stress caused by the change in the volume of the volume change body
14 in the first supported member 1331 can be increased. Therefore,
the change in the volume of the volume change body 14 can be
reflected with high accuracy in the stress occurring in the first
supported member 1331. As a result, the target can be detected with
high accuracy.
[0160] Further, in the sensor 1 of the first embodiment, the first
supported member 1331 has a narrower width than a length of the
body member 132 in the second direction (the x-axis direction in
this example) orthogonal to the first direction (the y-axis
direction in this example).
[0161] According to this, the stress caused by the change in the
volume of the volume change body 14 in the first supported member
1331 can be larger than the stress occurring in the body member
132. Therefore, the change in the volume of the volume change body
14 can be reflected with high accuracy in the stress occurring in
the first supported member 1331. As a result, the target can be
detected with high accuracy.
[0162] Further, in the sensor 1 of the first embodiment, the
detection member 133 includes the second supported member 1332. The
second supported member 1332, whose tip is supported, extends from
the second end 1322 in the first direction (the y-axis direction in
this example). The detection member 133 has the piezoresistive
element PZ located in the first supported member 1331. The
detection member 133 includes the first wiring 1333 that connects
the piezoresistive element PZ and the tip of the first supported
member 1331, and the second wiring 1334 that connects the
piezoresistive element PZ and the tip of the second supported
member 1332 through the body member 132.
[0163] According to this, the leak current occurring between the
first wiring 1333 and the second wiring 1334 can be suppressed.
Therefore, the target can be detected with high accuracy.
[0164] Further, in the sensor 1 of the first embodiment, the
central portion in the extension direction, in which the first
supported member 1331 extends, of the first supported member 1331
has a narrower width than a width of each of the end portions in
the extension direction of the first supported member 1331. The
detection member 133 detects the stress caused by the change in the
volume of the volume change body 14 in the central portion in the
extension direction of the first supported member 1331.
[0165] According to this, the stress caused by the change in the
volume of the volume change body 14 in the central portion in the
extension direction of the first supported member 1331 can be
larger than the stress occurring in each end portion in the
extension direction of the first supported member 1331. Therefore,
the change in the volume of the volume change body 14 can be
reflected with high accuracy in the stress occurring in the central
portion. As a result, the target can be detected with high
accuracy.
[0166] Furthermore, in the sensor 1 of the first embodiment, the
volume change body 14 is made of material whose elastic modulus is
lower than that of the body member 132.
[0167] According to this, the stress distribution, which is caused
by the change in the volume of the volume change body 14, in the
volume change body 14 can be close to a uniform state. As a result,
the change in the volume of the volume change body 14 can be
reflected with high accuracy in the stress occurred in the body
member 132. As a result, the target can be detected with high
accuracy.
[0168] In the sensor 1 of the first embodiment, the volume change
body 14 may be made of material having an elastic modulus higher
than that of the body member 132.
[0169] In this case, the deformation of the body member 132 caused
by the change in the volume of the volume change body 14 can be
increased. As a result, the change in the volume of the volume
change body 14 can be reflected with high accuracy in the stress,
which occurs at the second end 1322, in the direction along the
body member 132. In other words, the sensor 1 can detect the target
with high accuracy.
[0170] Furthermore, in the sensor 1 of the first embodiment, the
volume change body 14 has the change in the elastic modulus before
and after the change in the volume of the volume change body 14
larger than that of the body member 132.
[0171] For example, when the reduction in the elastic modulus of
the volume change body 14 before and after the change in the volume
of the volume change body 14 is larger than that of the body member
132, the strength of the sensor 1 before the change in the volume
of the volume change body 14 can be increased. Further, in this
case, after the change in the volume of the volume change body 14,
the stress distribution, which is caused by the change in the
volume of the volume change body 14, in the volume change body 14
can be close to a uniform state. As a result, the change in the
volume of the volume change body 14 can be reflected with high
accuracy in the stress occurring in the body member 132. As a
result, the target can be detected with high accuracy.
[0172] Further, the method of manufacturing the sensor 1 of the
first embodiment includes filling the storage space with the
sensing material having fluidity and drying the filled sensing
material to form the volume change body 14.
[0173] According to this, the volume change body 14 filling the
storage space can be easily formed.
[0174] Furthermore, in the method of manufacturing the sensor 1 of
the first embodiment, the viscosity of the sensing material is a
value of 1 [mPasec] to 1000 [mPasec].
[0175] According to this, the fluidity of the sensing material is
sufficiently high so that the sensing material can easily fill the
storage space.
[0176] In the sensor 1 of the first embodiment, the volume change
body 14 is entirely stored in the storage space of the body member
132. In the sensor 1 of a first modified example of the first
embodiment, a part of the volume change body 14 may be stored in
the storage space, and the other part of the volume change body 14
may cover at least a part of both end faces in the thickness
direction of the body member 132. For example, the volume change
body 14 may cover an area in which the space formation portion 1323
exists in both end faces in the thickness direction of the body
member 132.
[0177] In the sensor 1 of the first embodiment, the body member 132
is in contact with the frame 131 at the second end 1322 through two
supported members consisting of the first supported member 1331 and
the second supported member 1332. In the sensor 1 of a second
modified example of the first embodiment, the body member 132 may
be in contact with the frame 131 at the second end 1322 through one
supported member, or through three or more supported members.
Alternatively, the body member 132 may be in contact with the frame
131 at the first end 1321 through one or more supported
members.
[0178] As illustrated in FIG. 6, in the sensor 1 of the first
embodiment, each hole included in the storage space formed by the
space formation portion 1323 of the body member 132 is a through
hole that penetrates the body member 132 in the thickness direction
of the body member 132. As illustrated in FIG. 11, in the sensor 1
of a third modified example of the first embodiment, each hole
included in the storage space formed by the space formation portion
1323A of the body member 132 may be a bottomed hole that opens at
the end face in the positive direction of the z-axis of the body
member 132.
[0179] Alternatively, as illustrated in FIG. 12, in the sensor 1 of
a fourth modified example of the first embodiment, each hole
included in the storage space formed by the space formation portion
1323B of the body member 132 may be a first hole that is bottomed
and opens at the end face in the positive direction of the z-axis
of the body member 132, or a second hole that is bottomed and opens
at the end face in the negative direction of the z-axis of the body
member 132. For example, as illustrated in FIG. 12, the holes
included in the storage space may be in such a manner that the
first hole and the second hole are alternately arranged along the
y-axis direction.
[0180] As illustrated in FIG. 4, in the sensor 1 of the first
embodiment, the number of holes included in the storage space
formed by the space formation portion 1323 of the body member 132
is 2 or more. As illustrated in FIG. 13, in the sensor 1 of a fifth
modified example of the first embodiment, the number of holes
included in the storage space formed by the space formation portion
1323C of the body member 132 may be one. For example, as
illustrated in FIG. 13, the space formation portion 1323C of the
body member 132 may have a comb teeth-like shape in the plan view
of the body member 132 (in other words, when the body member 132 is
viewed in the negative direction of the z-axis).
[0181] Alternatively, as illustrated in FIG. 4, in the sensor 1 of
the first embodiment, the storage space formed by the space
formation portion 1323 of the body member 132 includes the
slit-like holes. As illustrated in FIG. 14, in the sensor 1 of a
sixth modified example of the first embodiment, the space formation
portion 1323C of the body member 132 may have a mesh-like shape in
the plan view of the body member 132 (in other words, when the body
member 132 is viewed in the negative direction of the z-axis). For
example, as illustrated in FIG. 14, each hole included in the
storage space may be a regular hexagon in the plan view of the body
member 132. Each hole included in the storage space may have a
shape (circular, elliptical, or polygonal shape other than regular
hexagon) other than regular hexagon in the plan view of the body
member 132.
[0182] In the sensor 1 of the first embodiment, the corner portion
of the storage space formed by the space formation portion 1323 of
the body member 132 may have a curved shape or a chamfered
shape.
[0183] When the volume change body 14 is formed by filling the
storage space with the sensing material having fluidity and the
corner portion of the storage space forms a ridge, the sensing
material may unlikely spread over the corner portion. In other
words, the volume change body 14 may not fill the storage space. In
this case, the change in the volume of the volume change body 14
may not be reflected with high accuracy in the stress, which occurs
at the second end 1322, in the direction along the body member
132.
[0184] On the other hand, when the corner portion of the storage
space has a curved shape or a chamfered shape and the volume change
body 14 is formed by filling the storage space with the sensing
material having fluidity, the sensing material can spread over the
corner portion. Therefore, the volume change body 14 can fill the
storage space. As a result, the change in the volume of the volume
change body 14 can be reflected with high accuracy in the stress,
which occurs at the second end 1322, in the direction along the
body member 132. In other words, the target can be detected with
high accuracy.
[0185] The sensor 1 of the first embodiment may be applied to a
detecting device that detects each of different targets. In this
case, the detecting device preferably includes a plurality of the
sensors 1 having different sensing materials. For example, the
plurality of sensors 1 may be arranged in a grid pattern.
First Example
[0186] Next, a first example of the sensor 1 of the first
embodiment will be described.
[0187] In the sensor 1 of the first example, the sensing material
is a solution obtained by dissolving OLESTER (registered trademark)
Q517 (manufactured by Mitsui Chemicals, Inc.) as a solute in a
mixed solvent consisting of cyclohexanone and dimethylformamide. In
this example, the mixed solvent has a mixture ratio of
cyclohexanone to dimethylformamide of 2:1. In this example, the
weight ratio of the solute to the mixed solvent in the sensing
material is 1:7.
[0188] In this example, the sensing material has a viscosity of 2
[mPasec]. In this example, using a B-type rotating viscosity meter
(TV-35 type viscosity meter, manufactured by Toki Sangyo Co.,
Ltd.), 1 mL of solution is placed in a measurement container and
the viscosity is measured at 25.degree. C. and 50% relative
humidity (RH) after rotating for 60 seconds at a rotation speed of
50 rpm. The viscosity described below is also measured similarly to
this example.
[0189] In this example, the sensing material is filled in the
storage space of the body member 132 by dipping the body member 132
into the solution which is the sensing material. The filled sensing
material is dried at a room temperature for 8 to 12 hours to form
the volume change body 14.
[0190] In this example, the volume change body 14 has an elastic
modulus (in this example, Young's modulus) of 2.5 GPa. In this
example, using a micro hardness meter (DUH-W201S, manufactured by
Shimadzu Corporation), the elastic modulus is measured under the
condition where the test force is 0.5 mN, the load speed is 0.142
mN/sec, and the holding time is 5 sec. Note that the elastic
modulus described later is also measured similarly to this
example.
[0191] In this example, the ratio .DELTA.R/R.sub.S of the variation
.DELTA.R of the electric resistance R.sub.S of the first resistor
103 to the electric resistance R.sub.S of the first resistor 103 is
represented by Math. 1. Here, V.sub.OUT represents the electric
potential (in other words, the electric potential representing the
signal stored in the storage device 106) output from the amplifier
105. Further, G represents the amplification rate (in other words,
the ratio of the electric potential output from the amplifier 105
to the electric potential input to the amplifier 105) of the
amplifier 105. Further, I represents the current flowing through
the electric circuit illustrated in FIG. 8 as represented in Math.
2.
.DELTA. .times. R R S = V O .times. U .times. T G I R S [ Math .
.times. 1 ] I = V A + V B R S + R R [ Math . .times. 2 ]
##EQU00001##
[0192] As represented in Math. 1, the electric potential V.sub.OUT
representing the signal stored in the storage device 106 changes in
proportion to the ratio .DELTA.R/R.sub.S of the variation .DELTA.R
of the electric resistance R.sub.S of the first resistor 103 to the
electric resistance R.sub.S of the first resistor 103.
[0193] In a first operation example, the sensor 1 detects humidity
as the target. In a second operation example, the sensor 1 detects
hydrogen sulfide (H.sub.2S) as the target.
[0194] In both of the first operation example and the second
operation example, the sensor 1 is installed inside a gas chamber.
Further, in both of the first operation example and the second
operation example, a humidity sensor for measuring a reference
value of humidity is installed inside the gas chamber.
[0195] In the first operation example, a gas consisting of nitrogen
(in other words, nitrogen gas) is supplied into the gas chamber for
a certain period, and then a gas consisting of water and nitrogen
(in other words, a water mixed gas) is supplied into the gas
chamber for a certain period. Thus, the humidity inside the gas
chamber changes over time.
[0196] As illustrated in FIG. 15, the signal S11 stored in the
storage device 106 in the sensor 1 changes so as to follow the
reference signal S10 represented by the reference value measured by
the humidity sensor with sufficiently high accuracy.
[0197] Furthermore, in the first operation example, changing the
humidity inside the gas chamber over time, in which the nitrogen
gas is supplied into the gas chamber for a certain period, and then
the water mixed gas is supplied into the gas chamber for a certain
period, is repeated.
[0198] As illustrated in FIG. 16, the signal S21 stored in the
storage device 106 in the sensor 1 changes so as to follow the
reference signal S20 represented by the reference value measured by
the humidity sensor with sufficiently high accuracy even with
repeated changes in the humidity.
[0199] As illustrated in FIG. 17, the electric potential
represented by the signal stored in the storage device 106 in the
sensor 1 and the reference value measured by the humidity sensor
have a strong correlation (in this example, a linear
relationship).
[0200] Thus, according to the sensor 1 of the first example, the
humidity can be detected with high accuracy over a relatively wide
range of humidity.
[0201] In the second operation example, the nitrogen gas is
supplied into the gas chamber for a certain period, and then, a gas
consisting of nitrogen and hydrogen sulfide and having a hydrogen
sulfide concentration of 4.75 ppm (in other words, hydrogen sulfide
mixed gas) is supplied into the gas chamber for a certain period.
Thus, the concentration of hydrogen sulfide inside the gas chamber
changes over time. In this example, the concentration of hydrogen
sulfide (H.sub.2S) is measured by a gas detector tube (hydrogen
sulfide No. 4LB, manufactured by Gastec Corporation).
[0202] As illustrated in FIG. 18, after the time point t1 when the
gas supplied into the gas chamber is switched from the nitrogen gas
to the hydrogen sulfide mixed gas, the reference signal S30
represented by the reference value measured by the humidity sensor
represents the reference value decreasing with the passage of time.
On the other hand, after the time point t1, the signal S31 stored
in the storage device 106 of the sensor 1 represents the electric
potential increasing with the passage of time.
[0203] Therefore, the volume change body 14 of the sensor 1 is
estimated to interact with molecules (in this example, hydrogen
sulfide) other than humidity (for example, adsorb or sorb hydrogen
sulfide).
[0204] Thus, in the sensor 1, the volume of the volume change body
14 changes due to the interaction of the volume change body 14 with
the target. Therefore, the amount of the target can be reflected
with high accuracy in the change in the volume of the volume change
body 14. As a result, the target can be detected with high
accuracy.
Second Example
[0205] Next, a second example of the sensor 1 of the first
embodiment will be described.
[0206] In the sensor 1 of the second example, the sensing material
is a solution obtained by dissolving U-VAN (registered trademark)
20SE60 (manufactured by Mitsui Chemicals, Inc.) as a solute in a
solvent consisting of dimethylformamide. In this example, the
weight ratio of the solute to the mixed solvent in the sensing
material is 1:3. In this example, similarly to the first example,
the volume change body 14 is formed using the dipping method.
[0207] In the first operation example, similarly to the first
example, the sensor 1 detects humidity as the target. In the second
operation example, similarly to the first example, the sensor 1
detects hydrogen sulfide (H.sub.2S) as the target.
[0208] In the first operation example, the nitrogen gas is supplied
into the gas chamber for a certain period, and then the water-mixed
gas is supplied into the gas chamber for a certain period. Thus,
the humidity inside the gas chamber changes over time.
[0209] As illustrated in FIG. 19, the signal S41 stored in the
storage device 106 in the sensor 1 does not change to follow the
reference signal S40 represented by the reference value measured by
the humidity sensor. In other words, the responsiveness of the
sensor 1 of the second example to humidity is lower than that of
the sensor 1 of the first example.
[0210] In the second operation example, the hydrogen sulfide mixed
gas is supplied into the gas chamber for a certain period. Thus,
the concentration of hydrogen sulfide inside the gas chamber
changes over time.
[0211] As illustrated in FIG. 20 and FIG. 21, after the time point
t2 when the hydrogen sulfide mixed gas begins to be supplied into
the gas chamber, the reference signals S50, S60 represented by the
reference values measured by the humidity sensor represent the
reference values decreasing with the passage of time. On the other
hand, after the time point t2, the signals S51 and S61 stored in
the storage device 106 of the sensor 1 represent the electric
potentials increasing with the passage of time.
[0212] Therefore, the volume change body 14 of the sensor 1 is
estimated to interact with molecules (in this example, hydrogen
sulfide) other than humidity (for example, adsorb or sorb hydrogen
sulfide).
[0213] Thus, in the sensor 1, the volume of the volume change body
14 changes due to the interaction of the volume change body 14 with
the target. Therefore, the amount of the target can be reflected
with high accuracy in the change in the volume of the volume change
body 14. As a result, the target can be detected with high
accuracy.
Third Example
[0214] Next, a third example of the sensor 1 of the first
embodiment will be described.
[0215] In the sensor 1 of the third example, the sensing material
is a solution obtained by dissolving EPOKEY (registered trademark)
863 (manufactured by Mitsui Chemicals, Inc.) as a solute in a
solvent consisting of dimethylformamide. In this example, the
weight ratio of the solute to the mixed solvent in the sensing
material is 1:7. In this example, similarly to the first example,
the volume change body 14 is formed using the dipping method. In
this example, the elastic modulus (Young's modulus in this example)
of the volume change body 14 is 2.5 GPa.
[0216] In the first operation example, similarly to the first
example, the sensor 1 detects humidity as the target. In the second
operation example, similarly to the first example, the sensor 1
detects hydrogen sulfide (H.sub.2S) as the target.
[0217] In the first operation example, the nitrogen gas is supplied
into the gas chamber for a certain period, and then the water-mixed
gas is supplied into the gas chamber for a certain period. Thus,
the humidity inside the gas chamber changes over time.
[0218] As illustrated in FIG. 22, the signal S71 stored in the
storage device 106 in the sensor 1 changes to follow the reference
signal S70 represented by the reference value measured by the
humidity sensor with sufficiently high accuracy. In this example,
the responsiveness of the sensor 1 of the third example to humidity
is lower than that of the sensor 1 of the first example.
[0219] In the second operation example, the nitrogen gas is
supplied into the gas chamber for a certain period, and then the
hydrogen sulfide mixed gas is supplied into the gas chamber for a
certain period. Thus, the concentration of hydrogen sulfide inside
the gas chamber changes over time.
[0220] As illustrated in FIG. 23, after the time point t3 when the
gas supplied into the gas chamber is switched from the nitrogen gas
to the hydrogen sulfide mixed gas, the signal S81 stored in the
storage device 106 of the sensor 1 decreases, similarly to the
reference signal S80 represented by the reference value measured by
the humidity sensor, almost monotonically with the passage of
time.
[0221] Therefore, the volume change body 14 of the sensor 1 is
estimated to be unlikely to interact with molecules (in this
example, hydrogen sulfide) other than humidity (for example, adsorb
or sorb hydrogen sulfide).
[0222] The responsiveness of the sensor 1 in each example is
represented in Table 1. In Table 1, double circles indicate higher
responsiveness than circles, and circles indicate higher
responsiveness than triangles.
TABLE-US-00001 TABLE 1 RESPONSIVENESS RESPONSIVENESS TO HYDROGEN TO
HUMIDITY SULFIDE FIRST EXAMPLE .circleincircle. .circleincircle.
SECOND EXAMPLE .DELTA. .largecircle. THIRD EXAMPLE .largecircle.
.DELTA.
Second Embodiment
[0223] Next, a sensor of the second embodiment will be described.
The sensor of the second embodiment differs from the sensor of the
first embodiment in that the target is detected based on bending
stress. The difference will be mainly described below. In the
description of the second embodiment, the one with the same
reference sign as used in the first embodiment is the same or
substantially the same one.
[0224] As illustrated in FIGS. 24 to 27, similarly to the sensor 1
of the first embodiment, the sensor 1A of the second embodiment
includes a first layered body 11, a second layered body 12, a third
layered body 13, and a volume change body 14.
[0225] FIG. 24 is a right front upper perspective view of the
sensor 1A. FIG. 25 is a right front upper perspective view of the
sensor 1A in a state where the sensor 1A is disassembled. FIG. 26
is a plan view of the sensor 1A. FIG. 27 is a view of the cross
section of the sensor 1A cut by a plane represented by an
XVIII-XVIII line in FIG. 26 as viewed in the negative direction of
the x-axis.
[0226] As illustrated in FIG. 26, the third layered body 13
includes a frame 131, a body member 132, and a detection member
133. The detection member 133 includes an extension member 1335 in
addition to the first supported member 1331, the second supported
member 1332, the first wiring 1333, and the second wiring 1334
included in the detection member 133 of the first embodiment.
[0227] The frame 131 has a configuration similar to the frame 131
of the first embodiment.
[0228] The body member 132 has a rectangular-like shape having long
sides extending in the y-axis direction and short sides extending
in the x-axis direction. The body member 132 may have a square-like
shape. The length of the body member 132 in the y-axis direction is
shorter than the length of the hole of the frame 131 in the y-axis
direction. In this example, the length of the body member 132 in
the y-axis direction is 260 .mu.m. The length of the body member
132 in the x-axis direction is shorter than the length of the hole
of the frame 131 in the x-axis direction. In this example, the
length of the body member 132 in the x-axis direction is 240 .mu.m.
The end in the positive direction of the x-axis of the body member
132 is separated from the frame 131.
[0229] The body member 132 is in contact with the frame 131 at the
first end 1321 in the positive direction of the y-axis of the body
member 132. In other words, in the body member 132, the first end
1321 in the positive direction of the y-axis of the body member 132
is supported by the frame 131.
[0230] A part of the body member 132 other than the end portion in
the negative direction of the x-axis in the second end 1322 in the
negative direction of the y-axis is in contact with the extension
member 1335. The end portion in the negative direction of the
x-axis in the second end 1322 in the negative direction of the
y-axis of the body member 132 is separated from the frame 131.
[0231] The body member 132 is in contact with the frame 131 at the
third end 1324 in the negative direction of the x-axis of the body
member 132. In other words, in the body member 132, the third end
1324 in the negative direction of the x-axis of the body member 132
is supported by the frame 131.
[0232] The body member 132 has a space formation portion 1323. The
space formation portion 1323 forms the storage space opening at
both end faces in the z-axis direction (in other words, the
thickness direction of the body member 132) of the body member 132.
In this example, the storage space is a through hole that
penetrates the body member 132 in the z-axis direction.
[0233] The storage space includes slit portions, each of which has
a slit-like shape extending in the x-axis direction, and a
connection portion that connects two adjacent slit portions at the
central portion in the x-axis direction. In this example, the slit
portions included in the storage space are arranged at equal
intervals along the y-axis direction.
[0234] For example, the length in the y-axis direction of each slit
portion included in the storage space is a length of 1 .mu.m to 10
.mu.m. In this example, the length in the y-axis direction of each
slit portion included in the storage space is 5 .mu.m. For example,
the interval in the y-axis direction between the slit portions
included in the storage space is a length of 1 .mu.m to 10 .mu.m.
In this example, the interval in the y-axis direction between the
slit portions included in the storage space is 1 .mu.m. In this
example, the number of the slit portions included in the storage
space is 40. Note that in FIGS. 24 to 27, the slit portions
included in the storage space are illustrated in an enlarged manner
in the y-axis direction. Therefore, in FIGS. 24 to 27, the slit
portions included in the storage space are illustrated in a reduced
number manner.
[0235] In this example, the length in the x-axis direction of the
slit portions included in the storage space is 220 .mu.m.
[0236] As illustrated in FIG. 26, the extension member 1335 has a
rectangular-like shape having long sides extending in the x-axis
direction and short sides extending in the y-axis direction. The
end in the negative direction of the x-axis of the extension member
1335 is separated from the frame 131. The end in the negative
direction of the y-axis of the extension member 1335 is separated
from the frame 131.
[0237] A part of the extension member 1335 other than the end
portion in the positive direction of the x-axis in the end in the
positive direction of the y-axis is in contact with the second end
1322 of the body member 132. The end portion in the positive
direction of the x-axis in the end in the positive direction of the
y-axis of the extension member 1335 is separated from the frame
131.
[0238] In this way, the extension member 1335 extends from the
second end 1322 to a position (in this example, the position in the
positive direction of the x-axis relative to the position in
contact with the second end 1322) different from a position in
contact with the second end 1322 in the x-axis direction.
[0239] Both end portions in the y-axis direction in the end (in
other words, the tip of the extension member 1335) in the positive
direction of the x-axis of the extension member 1335 are in contact
with the frame 131 through the first supported member 1331 and the
second supported member 1332. The central portion in the y-axis
direction of the tip of the extension member 1335 is separated from
the frame 131.
[0240] The first supported member 1331 has a strip-like shape
extending in the x-axis direction. The end in the positive
direction of the x-axis of the first supported member 1331 is in
contact with the frame 131. The end in the negative direction of
the x-axis of the first supported member 1331 is in contact with
the end portion in the negative direction of the y-axis in the tip
of the extension member 1335. In other words, the first supported
member 1331 extends from the tip of the extension member 1335 to
the positive direction of the x-axis. The tip of the first
supported member 1331 is supported by the frame 131.
[0241] The width (in other words, the length of the first supported
member 1331 in the y-axis direction) of the first supported member
1331 is narrower than the width (in other words, the length of the
extension member 1335 in the y-axis direction) of the extension
member 1335.
[0242] The first supported member 1331 has a notch portion NT. In
this example, as a position in the x-axis direction approaches the
center from the end in the x-axis direction of the first supported
member 1331, a position of the end in the negative direction of the
y-axis of the notch portion NT changes toward the positive
direction of the y-axis. Therefore, the width of the central
portion in an extension direction (the x-axis direction in this
example), in which the first supported member 1331 extends, of the
first supported member 1331 is narrower than the width of each of
the end portions in the extension direction of the first supported
member 1331.
[0243] The first supported member 1331 includes a piezoresistive
element PZ located in the central portion in the extension
direction of the first supported member 1331. The piezoresistive
element PZ is an element whose electric resistance changes
depending on the stress applied to the piezoresistive element PZ.
In other words, the piezoresistive element PZ is an element having
a piezoresistive effect.
[0244] Similarly to the piezoresistive element PZ of the first
embodiment, the piezoresistive element PZ is embedded in the first
supported member 1331 so as to be exposed at the end face in the
positive direction of the z-axis of the first supported member
1331.
[0245] With such a configuration, the detection member 133 detects
the stress transmitted from the body member 132 in the central
portion in the extension direction of the first supported member
1331.
[0246] The second supported member 1332 has a strip-like shape
extending in the x-axis direction. The end in the positive
direction of the x-axis of the second supported member 1332 is in
contact with the frame 131. The end in the negative direction of
the x-axis of the second supported member 1332 is in contact with
the end portion in the positive direction of the y-axis of the tip
of the extension member 1335. In other words, the second supported
member 1332 extends from the tip of the extension member 1335 to
the positive direction of the x-axis. The tip of the second
supported member 1332 is supported by the frame 131.
[0247] The width (in other words, the length in the y-axis
direction of the second supported member 1332) of the second
supported member 1332 is narrower than the width of the extension
member 1335. The width of the central portion in an extension
direction (the x-axis direction in this example), in which the
second supported member 1332 extends, of the second supported
member 1332, is equal to the width of each of the end portions in
the extension direction of the second supported member 1332.
[0248] The first wiring 1333 and the second wiring 1334 have
similar configurations to the first wiring 1333 and the second
wiring 1334 of the first embodiment, respectively, except that the
positions are different.
[0249] [0249] In this example, one end portion of the first wiring
1333 is in contact with the end portion in the positive direction
of the x-axis of the piezoresistive element PZ. The other end
portion of the first wiring 1333 is located at the outer edge of
the frame 131. The first wiring 1333 extends from the end portion
in the positive direction of the x-axis of the piezoresistive
element PZ to the outer edge of the frame 131 through the tip (in
other words, the end, which is in contact with the frame 131, of
the first supported member 1331) of the first supported member
1331. In other words, the first wiring 1333 connects the
piezoresistive element PZ and the tip of the first supported member
1331.
[0250] One end portion of the second wiring 1334 is in contact with
the end portion in the negative direction of the x-axis of the
piezoresistive element PZ. The other end portion of the second
wiring 1334 is located at the outer edge of the frame 131. The
second wiring 1334 extends from the end portion in the negative
direction of the x-axis of the piezoresistive element PZ to the
outer edge of the frame 131 through the proximal end (in other
words, the end, which is in contact with the extension member 1335,
of the first supported member 1331) of the first supported member
1331, the end portion in the positive direction of the x-axis of
the extension member 1335, and the second supported member
1332.
[0251] In other words, the second wiring 1334 connects the
piezoresistive element PZ and the tip (in other words, the end,
which is in contact with the frame 131, of the second supported
member 1332) of the second supported member 1332 through the
extension member 1335.
[0252] Similarly to the volume change body 14 of the first
embodiment, the volume change body 14 is supported by the body
member 132 so as to be stored in the storage space of the body
member 132.
[0253] Furthermore, the first wiring 1333 and the second wiring
1334 are connected to a similar electric circuit to that of the
first embodiment.
[0254] As described above, according to the sensor 1A of the second
embodiment, operations and effects similar to those of the sensor 1
of the first embodiment are accomplished.
[0255] Further, in the sensor 1A of the second embodiment, the
extension member 1335 extends from the second end 1322 to a
position different from the position in contact with the second end
1322 in the second direction (the x-axis direction in this example)
orthogonal to the first direction (the y-axis direction in this
example). The first supported member 1331 extends from the tip of
the extension member 1335. The tip of the first supported member
1331 is supported. The detection member 133 detects the stress
caused by the change in the volume of the volume change body 14 in
the first supported member 1331.
[0256] According to this, the bending stress caused by the change
in the volume of the volume change body 14 in the first supported
member 1331 can be increased. Therefore, the change in the volume
of the volume change body 14 can be reflected with high accuracy in
the stress occurring in the first supported member 1331. As a
result, the target can be detected with high accuracy.
[0257] Further, in the sensor 1A of the second embodiment, the
width of the first supported member 1331 is narrower than the width
of the extension member 1335.
[0258] According to this, the stress caused by the change in the
volume of the volume change body 14 in the first supported member
1331 can be larger than the stress occurring in the extension
member 1335. Therefore, the change in the volume of the volume
change body 14 can be reflected with high accuracy in the stress
occurring in the first supported member 1331. As a result, the
target can be detected with high accuracy.
[0259] Further, in the sensor 1A of the second embodiment, the
detection member 133 includes the second supported member 1332,
whose tip is supported, that extends from the tip of the extension
member 1335. The detection member 133 has the piezoresistive
element PZ located in the first supported member 1331. The
detection member 133 includes the first wiring 1333 connecting the
piezoresistive element PZ and the tip of the first supported member
1331, and the second wiring 1334 connecting the piezoresistive
element PZ and the tip of the second supported member 1332 through
the extension member 1335.
[0260] According to this, the leak current occurring between the
first wiring 1333 and the second wiring 1334 can be suppressed.
Therefore, the target can be detected with high accuracy.
[0261] Further, in the sensor 1A of the second embodiment, the
width of the central portion in the extension direction, in which
the first supported member 1331 extends, of the first supported
member 1331 is narrower than the width of each of the end portions
in the extension direction of the first supported member 1331. The
detection member 133 detects the stress caused by the change in the
volume of the volume change body 14 in the central portion in the
extension direction of the first supported member 1331.
[0262] According to this, the stress caused by the change in the
volume of the volume change body 14 in the central portion in the
extension direction of the first supported member 1331 can be
larger than the stress occurring in each of the end portions in the
extension direction of the first supported member 1331. Therefore,
the change in the volume of the volume change body 14 can be
reflected with high accuracy in the stress occurring in the central
portion. As a result, the target can be detected with high
accuracy.
[0263] In the sensor 1A of the second embodiment, the volume change
body 14 is entirely stored in the storage space of the body member
132. In the sensor 1A of a first modified example of the second
embodiment, a part of the volume change body 14 may be stored in
the storage space, and the other part of the volume change body 14
may cover at least a part of both end faces in the thickness
direction of the body member 132. For example, the volume change
body 14 may cover an area in which the space formation portion 1323
exists in both end faces in the thickness direction of the body
member 132.
[0264] In the sensor 1A of the second embodiment, the extension
member 1335 is in contact with the frame 131 at the tip of the
extension member 1335 through two supported members consisting of
the first supported member 1331 and the second supported member
1332. Alternatively, in the sensor 1A of a second modified example
of the second embodiment, the extension member 1335 may be in
contact with the frame 131 at the tip of the extension member 1335
through one supported member, or through three or more supported
members.
[0265] Alternatively, as illustrated in FIG. 26, in the sensor 1A
of the second embodiment, the first supported member 1331 and the
second supported member 1332 extend from both end portions in the
y-axis direction in the end in the positive direction of the x-axis
of the extension member 1335 to the positive direction of the
x-axis, respectively. As illustrated in FIG. 28, in the sensor 1A
of a third modified example of the second embodiment, the first
supported member 1331J and the second supported member 1332J may
extend from the end portion in the positive direction of the x-axis
in the end in the negative direction of the y-axis of the extension
member 1335 to the negative direction of the y-axis,
respectively.
[0266] Alternatively, as illustrated in FIG. 29, in the sensor 1A
of a fourth modified example of the second embodiment, the first
supported member 1331K and the second supported member 1332K may
extend from the end portion in the positive direction of the x-axis
in the end in the positive direction of the y-axis of the extension
member 1335 to the positive direction of the y-axis, respectively.
In this case, the detection member 133 may include a connection
portion 1336 that connects the first supported member 1331K and the
second supported member 1332K to the frame 131.
[0267] As illustrated in FIG. 26, in the sensor 1A of the second
embodiment, the storage space formed by the space formation portion
1323 of the body member 132 is one hole including the slit
portions. Alternatively, as illustrated in FIG. 30, in the sensor
1A of a fifth modified example of the second embodiment, the
storage space formed by the space formation portion 1323L of the
body member 132 may include multiple slit-like holes extending in
the x-axis direction, similarly to the space formation portion 1323
of the first embodiment. In this case, each hole included in the
storage space may be a bottomed hole that opens at the end face in
the positive direction of the z-axis of the body member 132.
Alternatively, each hole included in the storage space may be a
first hole that is bottomed and opens at the end face in the
positive direction of the z-axis of the body member 132, or a
second hole that is bottomed and opens at the end face in the
negative direction of the z-axis of the body member 132.
[0268] As illustrated in FIG. 26, in the sensor 1A of the second
embodiment, the storage space formed by the space formation portion
1323 of the body member 132 includes the slit portions and the
connection portion that connects the slit portions at the central
portion. As illustrated in FIG. 31, in the sensor 1A of a sixth
modified example of the second embodiment, the space formation
portion 1323M of the body member 132 may have a comb teeth-like
shape in the plan view of the body member 132 (in other words, when
the body member 132 is viewed in the negative direction of the
z-axis).
[0269] Alternatively, as illustrated in FIG. 32, in the sensor 1A
of a seventh modified example of the second embodiment, the space
formation portion 1323N of the body member 132 may have a mesh-like
shape in the plan view of the body member 132 (in other words, when
the body member 132 is viewed in the negative direction of the
z-axis). For example, as illustrated in FIG. 32, each hole included
in the storage space may be a regular hexagon in the plan view of
the body member 132. Each hole included in the storage space may
have a shape (circular, elliptical, or polygonal shape other than
regular hexagon) other than regular hexagon in the plan view of the
body member 132.
[0270] The sensor 1A of the second embodiment may be applied to a
detecting device that detects each of different targets. In this
case, the detecting device preferably includes a plurality of the
sensors 1A having different sensing materials. For example, the
plurality of sensors 1A may be arranged in a grid pattern.
Third Embodiment
[0271] Next, a sensor of the third embodiment will be described.
The sensor of the third embodiment differs from the sensor of the
first embodiment in that the target is detected based on vibration.
The difference will be mainly described below. In the description
of the third embodiment, the one with the same reference sign as
used in the first embodiment is the same or substantially the same
one.
[0272] As illustrated in FIGS. 33 to 36, similarly to the sensor 1
of the first embodiment, the sensor 1B of the third embodiment
includes a first layered body 11, a second layered body 12, a third
layered body 13, and a volume change body 14.
[0273] FIG. 33 is a right front upper perspective view of the
sensor 1B. FIG. 34 is a right front upper perspective view of the
sensor 1B in a state where the sensor 1B is disassembled. FIG. 35
is a plan view of the sensor 1B. FIG. 36 is a view of the cross
section of the sensor 1B cut by a plane represented by an
XXXVI-XXXVI line of FIG. 35 as viewed in the negative direction of
the x-axis.
[0274] As illustrated in FIG. 35, the third layered body 13
includes a frame 131, a body member 132, and a detection member
133.
[0275] The frame 131 has a similar configuration to the frame 131
of the first embodiment.
[0276] The body member 132 has a rectangular-like shape having long
sides extending in the x-axis direction and short sides extending
in the y-axis direction. The body member 132 may have a square-like
shape. The length of the body member 132 in the y-axis direction is
shorter than the length of the hole of the frame 131 in the y-axis
direction. In this example, the length of the body member 132 in
the y-axis direction is a length of 1/3 to 2/3 of the length of the
hole of the frame 131 in the y-axis direction. For example, the
length of the body member 132 in the y-axis direction is 220
.mu.m.
[0277] The length of the body member 132 in the x-axis direction is
shorter than the length of the hole of the frame 131 in the x-axis
direction. In this example, the length of the body member 132 in
the x-axis direction is 300 .mu.m. Both ends in the x-axis
direction of the body member 132 are separated from the frame
131.
[0278] The body member 132 is in contact with the frame 131 at the
first end 1321 in the positive direction of the y-axis of the body
member 132. In other words, in the body member 132, the first end
1321 in the positive direction of the y-axis of the body member 132
is supported by the frame 131.
[0279] The central portion in the x-axis direction in the second
end 1322 in the negative direction of the y-axis of the body member
132 is in contact with the frame 131 through the detection member
133. A part of the body member 132 other than the central portion
in the x-axis direction in the second end 1322 in the negative
direction of the y-axis is separated from the frame 131.
[0280] The body member 132 has a space formation portion 1323 that
forms the storage space. The storage space opens at both end faces
in the z-axis direction (in other words, the thickness direction of
the body member 132) of the body member 132. The storage space
includes slit-like holes extending in the x-axis direction. In this
example, each hole included in the storage space is a through hole
that penetrates the body member 132 in the z-axis direction. In
this example, the holes included in the storage space are arranged
at equal intervals along the y-axis direction.
[0281] For example, the length in the y-axis direction of each hole
included in the storage space is a length of 0.1 .mu.m to 10 .mu.m.
In this example, the length in the y-axis direction of each hole
included in the storage space is 1 .mu.m. For example, the interval
in the y-axis direction between the holes included in the storage
space is a length of 0.1 .mu.m to 10 .mu.m. In this example, the
interval in the y-axis direction between the holes included in the
storage space is 1 .mu.m. In this example, the number of the holes
included in the storage space is 80. Note that in FIGS. 33 to 36,
the holes included in the storage space are illustrated in an
enlarged manner in the y-axis direction. Therefore, in FIGS. 33 to
36, the holes included in the storage space are illustrated in a
reduced number manner.
[0282] In this example, the length of the slit-like holes included
in the storage space in the x-axis direction is 280 .mu.m.
[0283] The detection member 133 includes a supported member 1337, a
first wiring 1338a, a second wiring 1338b, and a third wiring
1338c.
[0284] As illustrated in FIG. 35, the supported member 1337 has a
strip-like shape extending in the y-axis direction. The end in the
negative direction of the y-axis of the supported member 1337 is in
contact with the frame 131. The end in the positive direction of
the y-axis of the supported member 1337 is in contact with the
central portion in the x-axis direction in the second end 1322 of
the body member 132. In other words, the supported member 1337
extends from the second end 1322 of the body member 132 to the
negative direction of the y-axis. The tip of the supported member
1337 is supported by the frame 131.
[0285] The width (in other words, the length of the supported
member 1337 in the x-axis direction) of the supported member 1337
is narrower than the width of the body member 132 (in other words,
the length of the body member 132 in the x-axis direction). In this
example, the width of the supported member 1337 is 40 .mu.m.
[0286] The supported member 1337 includes a pair of piezoresistive
elements PZ1, PZ2 which are located in the end portion (in other
words, the portion supported by the frame 131) in the negative
direction of the y-axis of the supported member 1337. In this
example, each piezoresistive element PZ1, PZ2 extends to the end
portion in the positive direction of the y-axis of the frame 131.
The piezoresistive elements PZ1, PZ2 are separated from each other
in the x-axis direction.
[0287] Each piezoresistive element PZ1, PZ2 is an element whose
electric resistance changes depending on the stress applied to
respective piezoresistive element PZ1, PZ2. In other words, each
piezoresistive element PZ1, PZ2 is an element having a
piezoresistive effect.
[0288] As illustrated in FIG. 36, similarly to the piezoresistive
element PZ of the first embodiment, each piezoresistive element
PZ1, PZ2 is embedded in the supported member 1337 so as to be
exposed at the end face in the positive direction of the z-axis of
the supported member 1337.
[0289] Each of the first wiring 1338a, the second wiring 1338b, and
the third wiring 1338c is made of conductor (aluminum in this
example). As illustrated in FIGS. 35 and 36, the first wiring
1338a, the second wiring 1338b, and the third wiring 1338c are laid
on the end face in the positive direction of the z-axis of the
third layered body 13.
[0290] For example, the thickness (in other words, the length in
the z-axis direction of each of the first wiring 1338a, the second
wiring 1338b, and the third wiring 1338c) of each of the first
wiring 1338a, the second wiring 1338b, and the third wiring 1338c
is a thickness of 10 nm to 1 .mu.m. In this example, the thickness
of each of the first wiring 1338a, the second wiring 1338b, and the
third wiring 1338c is 100 nm.
[0291] In this example, a part of the exposed surface of the first
wiring 1338a, the second wiring 1338b, and the third wiring 1338c
is covered with an oxide thin film (not illustrated). For example,
the other part, which is not covered with the oxide thin film, of
the exposed surface of the first wiring 1338a, the second wiring
1338b, and the third wiring 1338c may be used as terminals for
connection.
[0292] As illustrated in FIG. 35, one end portion of the first
wiring 1338a is in contact with the end portion in the negative
direction of the y-axis of the piezoresistive element PZ1. The
other end portion of the first wiring 1338a is located at the outer
edge of the frame 131. In other words, the first wiring 1338a
extends from the end portion in the negative direction of the
y-axis of the piezoresistive element PZ1 to the outer edge of the
frame 131.
[0293] One end portion of the second wiring 1338b is in contact
with the end portion in the negative direction of the y-axis of the
piezoresistive element PZ2. The other end portion of the second
wiring 1338b is located at the outer edge of the frame 131. In
other words, the second wiring 1338b extends from the end portion
in the negative direction of the y-axis of the piezoresistive
element PZ2 to the outer edge of the frame 131.
[0294] One end portion of the third wiring 1338c is in contact with
the end portion in the positive direction of the y-axis of the
piezoresistive element PZ1. The other end portion of the third
wiring 1338c is in contact with the end portion in the positive
direction of the y-axis of the piezoresistive element PZ2. In other
words, the third wiring 1338c extends from the end portion in the
positive direction of the y-axis of the piezoresistive element PZ1
to the end portion in the positive direction of the y-axis of the
piezoresistive element PZ2.
[0295] Similarly to the volume change body 14 of the first
embodiment, the volume change body 14 is supported by the body
member 132 so as to be stored in the storage space of the body
member 132.
[0296] Furthermore, the first wiring 1338a and the second wiring
1338b are connected to an electric circuit similar to that of the
first embodiment.
[0297] As described above, according to the sensor 1B of the third
embodiment, operations and effects similar to those of the sensor 1
of the first embodiment are accomplished.
[0298] Further, in the sensor 1B of the third embodiment, the
detection member 133 includes the supported member 1337, whose tip
is supported, that extends from the second end 1322 to the first
direction (in this example, the y-axis direction). Further, the
detection member 133 detects the stress caused by the change in the
volume of the volume change body 14 at the tip of the supported
member 1337.
[0299] According to this, the supported member 1337 vibrates in the
thickness direction of the supported member 1337 (the z-axis
direction in this example) by bending.
[0300] By the way, the greater the compressive stress occurs in the
supported member 1337, the lower the resonance frequency of the
supported member 1337 becomes. Also, the greater the tensile stress
occurs in the supported member 1337, the higher the resonance
frequency of the supported member 1337 becomes. On the other hand,
the compressive stress or the tensile stress caused by the change
in the volume of the volume change body 14 in the supported member
1337 changes. Therefore, the resonance frequency of the supported
member 1337 changes due to the change in the volume of the volume
change body 14.
[0301] As described above, according to the sensor 1B, the change
in the volume of the volume change body 14 can be reflected with
high accuracy in the frequency of the vibration of the supported
member 1337.
[0302] Furthermore, according to the sensor 1B, the detection
member 133 can detect the change with time in the stress caused by
the vibration of the supported member 1337 at the tip (in other
words, the portion where the supported member 1337 is supported by
the frame 131) of the supported member 1337. Therefore, the
detection member 133 can detect the frequency of the vibration of
the supported member 1337. As a result, the target can be detected
with high accuracy.
[0303] Further, in the sensor 1B of the third embodiment, the width
of the supported member 1337 is narrower than the length of the
body member 132 in the second direction (the x-axis direction in
this example) orthogonal to the first direction.
[0304] According to this, the stress caused by the change in the
volume of the volume change body 14 in the supported member 1337
can be larger than the stress occurring in the body member 132.
Therefore, the change in the volume of the volume change body 14
can be reflected with high accuracy in the stress occurring in the
supported member 1337. Further, the vibration in the thickness
direction of the supported member 1337 can be larger than the
vibration in the thickness direction of the body member 132. As a
result, the target can be detected with high accuracy.
[0305] In the sensor 1B of the third embodiment, the volume change
body 14 is entirely stored in the storage space of the body member
132. In the sensor 1B of a first modified example of the third
embodiment, a part of the volume change body 14 may be stored in
the storage space, and the other part of the volume change body 14
may cover at least a part of both end faces in the thickness
direction of the body member 132. For example, the volume change
body 14 may cover an area in which the space formation portion 1323
exists in both end faces in the thickness direction of the body
member 132.
[0306] In the sensor 1B of the third embodiment, the body member
132 is in contact with the frame 131 through the supported member
1337 at the second end 1322. In the sensor 1B of a second modified
example of the third embodiment, the body member 132 may be in
contact with the frame 131 at the second end 1322 through multiple
supported members. Alternatively, the body member 132 may be in
contact with the frame 131 at the first end 1321 through one or
more supported members.
[0307] As illustrated in FIG. 36, in the sensor 1B of the third
embodiment, each hole included in the storage space formed by the
space formation portion 1323 of the body member 132 is a through
hole that penetrates the body member 132 in the thickness direction
of the body member 132. Alternatively, in the sensor 1B of a third
modified example of the third embodiment, each hole included in the
storage space formed by the space formation portion 1323 of the
body member 132 may be a bottomed hole that opens at the end face
in the positive direction of the z-axis of the body member 132.
[0308] Alternatively, in the sensor 1B of a fourth modified example
of the third embodiment, each hole included in the storage space
formed by the space formation portion 1323 of the body member 132
may be a first hole that is bottomed and opens at the end face in
the positive direction of the z-axis of the body member 132, or a
second hole that is bottomed and opens at the end face in the
negative direction of the z-axis of the body member 132. For
example, the holes included in the storage space may be in such a
manner that the first hole and the second hole are alternately
arranged along the y-axis direction.
[0309] As illustrated in FIG. 36, in the sensor 1B of the third
embodiment, the number of holes included in the storage space
formed by the space formation portion 1323 of the body member 132
is 2 or more. In the sensor 1B of a fifth modified example of the
third embodiment, the number of holes included in the storage space
formed by the space formation portion 1323 of the body member 132
may be one. For example, the space formation portion 1323 of the
body member 132 may have a comb teeth-like shape in the plan view
of the body member 132 (in other words, when the body member 132 is
viewed in the negative direction of the z-axis).
[0310] As illustrated in FIG. 35, in the sensor 1B of the third
embodiment, the storage space formed by the space formation portion
1323 of the body member 132 includes the slit-like holes.
Alternatively, in the sensor 1B of a sixth modified example of the
third embodiment, the space formation portion 1323 of the body
member 132 may have a mesh-like shape in the plan view of the body
member 132 (in other words, when the body member 132 is viewed in
the negative direction of the z-axis). For example, each hole
included in the storage space may be a regular hexagon in the plan
view of the body member 132. Each hole included in the storage
space may have a shape (circular, elliptical, or polygonal shape
other than regular hexagon) other than regular hexagon in the plan
view of the body member 132.
[0311] Alternatively, the sensor 1B of a seventh modified example
of the third embodiment may detect the vibration of the supported
member 1337 using light instead of stress. In this case, for
example, the sensor 1B may include a laser Doppler vibrometer and
may detect the vibration of the supported member 1337 using the
laser Doppler vibrometer.
[0312] Alternatively, the sensor 1B of an eighth modified example
of the third embodiment may include a mechanism or a device for
vibrating the supported member 1337.
[0313] In the sensor 1B of the third embodiment, when the volume of
the volume change body 14 increases, the compressive stress occurs
in the supported member 1337, while when the volume of the volume
change body 14 decreases, the tensile stress occurs in the
supported member 1337. Alternatively, as illustrated in FIG. 37,
the sensor 1B of a ninth modified example of the third embodiment
may be configured so that the tensile stress occurs in the
supported member 1337 when the volume of the volume change body 14
increases, and the compressive stress occurs in the supported
member 1337 when the volume of the volume change body 14
decreases.
[0314] In this case, as illustrated in FIG. 37, the body member
132P includes a pair of extension members 132a,132b and a
connection portion 132c.
[0315] Each extension member 132a,132b has a rectangular-like shape
having long sides extending in the y-axis direction and short sides
extending in the x-axis direction. Note that each extension member
132a,132b may have a square-like shape. The length in the y-axis
direction of each extension member 132a,132b is shorter than the
length in the y-axis direction of the hole of the frame 131. For
example, the length in the y-axis direction of each extension
member 132a,132b is 290 .mu.m.
[0316] The length in the x-axis direction of each extension member
132a,132b is shorter than half the length in the x-axis direction
of the hole of the frame 131. In this example, the length in the
x-axis direction of each extension member 132a,132b is 60
.mu.m.
[0317] The extension members 132a,132b are separated from each
other in the x-axis direction. The end in the negative direction of
the x-axis of the extension member 132a is separated from the frame
131. The end in the positive direction of the x-axis of the
extension member 132b is separated from the frame 131.
[0318] The extension members 132a,132b are in contact with the
frame 131 at the first end 1321 in the negative direction of the
y-axis of the extension members 132a,132b. In other words, the
extension members 132a,132b are supported by the frame 131 at the
first end 1321 in the negative direction of the y-axis of the
extension members 132a,132b, respectively.
[0319] Similarly to the body member 132 of the third embodiment,
each extension member 132a,132b has a space formation portion
1323.
[0320] The connection portion 132c has a rectangular-like shape
having long sides extending in the x-axis direction and short sides
extending in the y-axis direction. The end in the negative
direction of the x-axis of the connection portion 132c is in
contact with the end portion in the positive direction of the
y-axis in the end in the positive direction of the x-axis of the
extension member 132a. The end in the positive direction of the
x-axis of the connection portion 132c is in contact with the end
portion in the positive direction of the y-axis in the end in the
negative direction of the x-axis of the extension member 132b. Both
ends in the y-axis direction of the connection portion 132c are
separated from the frame 131.
[0321] With such a configuration, the connection portion 132c is in
contact with each second end 1322 in the positive direction of the
y-axis of the extension members 132a,132b.
[0322] The supported member 1337 extends in the y-axis direction
between the extension members 132a,132b. The end in the negative
direction of the y-axis of the supported member 1337 is in contact
with the frame 131. The end in the positive direction of the y-axis
of the supported member 1337 is in contact with the central portion
in the x-axis direction in the end in the negative direction of the
y-axis of the connection portion 132c. In other words, the
supported member 1337, whose tip is supported by the frame 131,
extends from the second end 1322 of the body member 132P to the
negative direction of the y-axis.
[0323] The width of the supported member 1337 (in other words, the
length in the x-axis direction of the supported member 1337) is
narrower than the width of each extension member 132a,132b (in
other words, the length in the x-axis direction of each extension
member 132a,132b). In this example, the width of the supported
member 1337 is 40 .mu.m.
[0324] The end in the negative direction of the x-axis of the
supported member 1337 is separated from the extension member 132a
in the x-axis direction. The end in the positive direction of the
x-axis of the supported member 1337 is separated from the extension
member 132b in the x-axis direction.
[0325] With such a configuration, according to the sensor 1B of the
ninth modified example of the third embodiment, operations and
effects similar to those of the sensor 1B of the third embodiment
are accomplished.
[0326] Furthermore, according to the sensor 1B of the ninth
modified example of the third embodiment, the supported member 1337
can be lengthened. As a result, the vibration of the supported
member 1337 can be detected with high accuracy. As a result, the
target can be detected with high accuracy.
[0327] In the sensor 1B of the third embodiment, the corner portion
of the storage space formed by the space formation portion 1323 of
the body member 132 may have a curved shape or a chamfered
shape.
[0328] Note that the sensor 1B of the third embodiment may be
applied to a detecting device that detects each of different
targets. In this case, the detecting device preferably includes a
plurality of the sensors 1B having different sensing materials. For
example, the plurality of sensors 1B may be arranged in a grid
pattern.
[0329] The present invention is not limited to the above
embodiments. For example, various modifications that can be
understood by those skilled in the art may be added to the above
embodiments without departing from the spirit of the present
invention.
[0330] The present invention is based upon and claims the benefit
of priority of the prior Japanese Patent application No. 2018-63978
filed on Mar. 29, 2018, and the prior Japanese Patent application
No. 2018-63987, filed on Mar. 29, 2018, the entire contents of
which are incorporated herein by reference.
* * * * *