U.S. patent application number 17/153532 was filed with the patent office on 2022-07-14 for localized fluid acceleration in immersed environment.
The applicant listed for this patent is Baidu USA LLC. Invention is credited to TIANYI GAO.
Application Number | 20220225539 17/153532 |
Document ID | / |
Family ID | 1000005390816 |
Filed Date | 2022-07-14 |
United States Patent
Application |
20220225539 |
Kind Code |
A1 |
GAO; TIANYI |
July 14, 2022 |
LOCALIZED FLUID ACCELERATION IN IMMERSED ENVIRONMENT
Abstract
A cooling system comprises an information technology (IT)
container including a plurality of IT chambers, a fluid supply
channel disposed at a bottom of the IT container to receive the
fluid from a cooling unit and to supply the fluid to the IT
chambers, a fluid return channel disposed on a top of the IT
chambers to return the fluid received from the IT chambers to the
cooling unit, a fluid acceleration channel disposed separately from
the fluid return channel to return at least some of the fluid to
the cooling unit in an accelerated manner, and one or more pumps
disposed between at least some of the IT chambers immerged in the
fluid environment and the fluid acceleration channel to increase a
flowrate of the fluid from the corresponding IT chambers to the
cooling unit via the fluid acceleration channel. For example, each
IT chamber to store fluid and to populate IT equipment submerged in
the fluid for immersion cooling. In an embodiment, the IT chamber
includes acceleration sections.
Inventors: |
GAO; TIANYI; (Sunnyvale,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Baidu USA LLC |
Sunnyvale |
CA |
US |
|
|
Family ID: |
1000005390816 |
Appl. No.: |
17/153532 |
Filed: |
January 20, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
63135349 |
Jan 8, 2021 |
|
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|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/2039 20130101;
H05K 7/20236 20130101; H05K 7/20781 20130101; H05K 7/20272
20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A cooling system, comprising: an information technology (IT)
container including a plurality of IT chambers, each IT chamber to
store fluid and to receive IT equipment submerged in the fluid for
immersion cooling; a fluid supply channel disposed at a bottom of
the IT container to receive the fluid from a cooling unit and to
supply the fluid to the IT chambers; a fluid return channel
disposed on a top of the IT chambers to return the fluid received
from the IT chambers to the cooling unit; a fluid acceleration
channel disposed separately from the fluid return channel to return
at least some of the fluid to the cooling unit in an accelerated
manner; and one or more pumps disposed between at least some of the
IT chambers and the fluid acceleration channel to increase a
flowrate of the fluid from the corresponding IT chambers to the
cooling unit via the fluid acceleration channel.
2. The cooling system of claim 1, wherein each of the one or more
pumps are configured to pump the fluid from the fluid supply
channel through the corresponding IT chamber to the fluid
acceleration channel.
3. The cooling system of claim 1, wherein at least one IT equipment
includes a regular section containing an IT component that
generates heat and an acceleration section containing a local heat
exchange element attached to the IT component, both the regular
section and the acceleration section integrated as one complete
system.
4. The cooling system of claim 3, wherein a pump associated with
the IT equipment is disposed in the acceleration section to
increase the flowrate of the fluid in the acceleration section.
5. The cooling system of claim 3, wherein the local heat exchange
element includes a heat sink elevated to the acceleration
section.
6. The cooling system of claim 1, wherein the fluid acceleration
channel is disposed on top of the fluid return channel.
7. The cooling system of claim 1, wherein the flowrate of the fluid
in an IT chamber is controlled by a corresponding pump based on a
local temperature of the fluid within the corresponding IT
chamber.
8. The cooling system of claim 1, wherein each pump is integrated
to the fluid acceleration channel and coupled to and removable from
the fluid return channel of the IT container.
9. The cooling system of claim 8, further comprising a lid, wherein
the fluid acceleration channel and the pumps are integrated to a
lid section including the lid, such that when the lid section is
lifted, the fluid acceleration channel and the pumps are lifted and
removed from the IT chambers.
10. The cooling system of claim 8, wherein the pumps are integrated
to the fluid acceleration channel attached to the lid, and wherein
the location of each pump is adjustable based on the corresponding
IT equipment.
11. An electronic rack of a data center, comprising: one or more
information technology (IT) equipment operating as one or more
servers; and a cooling system coupled to the IT equipment, the
cooling system including an IT container including a plurality of
IT chambers, each IT chamber to store fluid and to receive IT
equipment submerged in the fluid for immersion cooling; a fluid
supply channel disposed at a bottom of the IT container to receive
the fluid from a cooling unit and to supply the fluid to the IT
chambers; a fluid return channel disposed on a top of the IT
chambers to return the fluid received from the IT chambers to the
cooling unit; a fluid acceleration channel disposed separately from
the fluid return channel to return at least some of the fluid to
the cooling unit in an accelerated manner; and one or more pumps
disposed between at least some of the IT chambers and the fluid
acceleration channel to increase a flowrate of the fluid from the
corresponding IT chambers to the cooling unit via the fluid
acceleration channel.
12. The electronic rack of claim 11, wherein each of the one or
more pumps are configured to pump the fluid from the fluid supply
channel through the corresponding IT chamber to the fluid
acceleration channel.
13. The electronic rack of claim 11, wherein at least one IT
equipment includes a regular section containing an IT component
that generates heat and an acceleration section containing a local
heat exchange element attached to the IT component, both the
regular section and the acceleration section integrated as one
complete system.
14. The electronic rack of claim 13, wherein a pump associated with
the IT equipment is disposed in the acceleration section to
increase the flowrate of the fluid in the acceleration section.
15. The electronic rack of claim 13, wherein the local heat
exchange element includes a heat sink elevated to the acceleration
section.
16. The electronic rack of claim 13, wherein the fluid acceleration
channel is disposed on top of the fluid return channel.
17. The electronic rack of claim 11, wherein the flowrate of the
fluid in an IT chamber is controlled by a corresponding pump based
on a local temperature of the fluid within the corresponding IT
chamber.
18. The electronic rack of claim 11, wherein each pump is
integrated to the fluid acceleration channel and coupled to and
removable from the fluid return channel of the IT container.
19. The electronic rack of claim 18, further comprising a lid,
further comprising a lid, wherein the fluid acceleration channel
and the pumps are integrated to a lid section including the lid,
such that when the lid section is lifted, the fluid acceleration
channel and the pumps are lifted and removed from the IT
chambers.
20. A data center system, comprising: a plurality of electronic
racks, each electronic rack including one or more information
technology (IT) equipment operating as one or more servers; and a
cooling system coupled to the IT equipment to provide liquid
cooling to the servers, the cooling system including an information
technology (IT) container including a plurality of IT chambers,
each IT chamber to store fluid and to receive IT equipment
submerged in the fluid for immersion cooling; a fluid supply
channel disposed at a bottom of the IT container to receive the
fluid from a cooling unit and to supply the fluid to the IT
chambers; a fluid return channel disposed on a top of the IT
chambers to return the fluid received from the IT chambers to the
cooling unit; a fluid acceleration channel disposed separately from
the fluid return channel to return at least some of the fluid to
the cooling unit in an accelerated manner; and one or more pumps
disposed between at least some of the IT chambers and the fluid
acceleration channel to increase a flowrate of the fluid from the
corresponding IT chambers to the cooling unit via the fluid
acceleration channel.
Description
RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. provisional
patent application No. 63/135,349, filed Jan. 8, 2021, which is
incorporated by reference in its entirety.
FIELD OF THE INVENTION
[0002] Embodiments of the present invention relate generally to
data centers. More particularly, embodiments of the invention
relate to immersion cooling for data centers.
BACKGROUND
[0003] Heat removal is a prominent factor in a computer system and
data center design. The number of high performance electronics
components such as high performance processors packaged inside
servers have steadily increased, thereby increasing the amount of
heat generated and dissipated during the ordinary operations of the
servers. The reliability of servers used within a data center
decreases if the environment in which they operate is permitted to
increase in temperature over time. Maintaining a proper thermal
environment is critical for normal operations of these servers in
data centers, as well as the server performance and lifetime. It
requires more effective and efficient heat removal solutions
especially in the cases of cooling these high performance
servers.
[0004] Immersion cooling technology has brought many attentions
recently. Many efforts are focusing on the fluid selection,
information technology (IT) side design, material compatibilities,
test and verification, and so on. Most of the solutions utilize
existing cooling infrastructure (cooling water/chilled water) or
system. In some of the solutions, a coolant distribution unit (CDU)
is used to form an external cooling loop and an internal immersion
cooling fluid loop. The external cooling loop can be adapted to any
type of existing data center cooling infrastructures. These
solutions may not fully utilize the advantages of immersion
cooling.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] Embodiments of the invention are illustrated by way of
example and not limitation in the figures of the accompanying
drawings in which like references indicate similar elements.
[0006] FIG. 1 is a block diagram illustrating an example of a data
center system with immersion cooling according to one
embodiment.
[0007] FIG. 2 is a block diagram illustrating an example of a
portion of data center system with immersion cooling according to
another embodiment.
[0008] FIG. 3 is a block diagram illustrating an example of a
portion of data center system with immersion cooling according to
another embodiment.
[0009] FIG. 4 is a block diagram illustrating an example of a
portion of data center system with immersion cooling according to
another embodiment.
[0010] FIG. 5 is a block diagram illustrating an example of a
portion of data center system with immersion cooling according to
another embodiment.
[0011] FIG. 6 is a block diagram illustrating an example of a top
section of a data center system with immersion cooling according to
another embodiment.
[0012] FIG. 7 is a block diagram illustrating an example of a data
center system with immersion cooling according to another
embodiment.
[0013] FIG. 8 is a block diagram illustrating an example of a data
center system with immersion cooling under a normal operation mode
according to another embodiment.
[0014] FIG. 9 is a block diagram illustrating an example of a data
center system with immersion cooling under a single acceleration
mode according to another embodiment.
[0015] FIG. 10 is a block diagram illustrating an example of a data
center system with immersion cooling under a multiple acceleration
mode according to another embodiment
DETAILED DESCRIPTION
[0016] Various embodiments and aspects of the inventions will be
described with reference to details discussed below, and the
accompanying drawings will illustrate the various embodiments. The
following description and drawings are illustrative of the
invention and are not to be construed as limiting the invention.
Numerous specific details are described to provide a thorough
understanding of various embodiments of the present invention.
However, in certain instances, well-known or conventional details
are not described in order to provide a concise discussion of
embodiments of the present inventions.
[0017] Reference in the specification to "one embodiment" or "an
embodiment" means that a particular feature, structure, or
characteristic described in conjunction with the embodiment can be
included in at least one embodiment of the invention. The
appearances of the phrase "in one embodiment" in various places in
the specification do not necessarily all refer to the same
embodiment.
[0018] The IT Hardware industry is a critical market for many
reasons: it plays a crucial role in business competitiveness,
service quality and availability, and also plays a significant role
in the infrastructure TCO. IT Hardware is closely linked with the
profit of an organization. It is one of the core competencies of
the internet giant, cloud computing service providers, as well as
high performance computing and AI computing related business
service users and providers who build, operate, compute, store and
manage other IT hardware platforms and infrastructures. The
majority of the hyper-scale owners are customizing full-stacks of
these hardware systems. For instance, in the rapidly growing cloud
computing business, the performance and cost (both capital cost and
operation cost) of computing and storage hardware systems, clusters
and infrastructure, all require the service providers to create
customized systems that fit their individual needs the best. These
markets require continuous innovation. An efficient system design
and operation benefits the service providers in multiple aspects in
a long term. The key to this is to develop continuously with more
resilience, efficiency, and cost effective solutions and
architecture. By increasing the power density of the high end
processors, the power difference among the high power components
and low power components increases, thereby requiring the thermal
management industry to continuously provide both feasible and
efficient solutions.
[0019] The first problem the current solution aims to solve is the
high power density electronics' thermal management. With the
increasing power of the IT equipment and power density in the
system, thermal management becomes more and more challenging. The
traditional air cooling systems become a bottle neck for the
development and deployment of higher power computing and higher
performance computing based electronics, including chips.
[0020] The second focus on the current work is to increase the
operating efficiency and system capability of immersion cooling.
While immersion cooling may be a proper solution for the high power
density thermal management, however, the efficiency and capability
of a system with an immersion cooling system still falls short of
fulfilling the requirement. The current disclosure purposes to
change the internal fluid management and fluid dynamics to improve
the cooling system's performance and capability. Since the fluid is
more efficiently managed, the system capability will increase,
especially in the cases of high power density and low power
density, which are co-packages on the same system.
[0021] For immersion cooling solutions, the single phase solution
still requires an implementation of cooling hardware such as heat
sink, to extend and maximize the heat transfer area for the high
power density components. This is due to the nature of fluid
circulation in a purely immersed environment, where the circulation
may not sufficient for such high power density components' cooling
requirement. The solution proposed in the current invention enables
localized fluid acceleration and cooling enhancement for these
components.
[0022] Since immersion cooling is designed for high power systems,
it is common for some of the immersion tanks or containers to reach
a very high power density. In such high power systems (either tank
or container), the power distribution is greatly uniformly
distributed, which mean that the IT power dissipation as well as
thermal requirement are completely different. Advanced designs are
required for such scenarios.
[0023] Solution versatility and resilience are also key
requirements for modern IT hardware. The current work aims to
improve the solution versatility and resilience which may be
compatible for different cases as well as IT generation
upgrades.
[0024] The previous design for immersion cooling does not provide
efficient fluid management nor localized fluid management. The
previous solution predominantly characterizes a high performance
heat sink to solve back for the high power density challenge in an
immersion cooling environment. This solution is limited by the
power envelop of load and space, for implementing large heat sinks
and so on.
[0025] The current design introduces a localized precision cooling
enhancement for the IT, which proves to be especially useful for
high power density equipment. The design enables the following
features: Localized fluid management and acceleration for high heat
load regions, advanced control design for separate regions,
multi-layer fluid management and fluid dynamics in immersed
environments, hardware design for the IT and IT container, flexible
reconfigurable for different IT equipment and use cases for both
could data center and edge computation systems.
[0026] In an embodiment, a cooling system comprises an information
technology (IT) container including a plurality of IT chambers, a
fluid supply channel disposed at a bottom of the IT container to
receive the fluid from a cooling unit and to supply the fluid to
the IT chambers, a fluid return channel disposed on a top of the IT
chambers to return the fluid received from the IT chambers to the
cooling unit, a fluid acceleration channel disposed separately from
the fluid return channel to return at least some of the fluid to
the cooling unit in an accelerated manner, and one or more pumps
disposed between at least some of the IT chambers and the fluid
acceleration channel to increase a flowrate of the fluid from the
corresponding IT chambers to the cooling unit via the fluid
acceleration channel. For example, each IT chamber to store fluid
and to receive IT equipment submerged in the fluid for immersion
cooling.
[0027] In an embodiment, each of the one or more pumps are
configured to pump the fluid from the fluid supply channel through
the corresponding IT chamber to the fluid acceleration channel.
[0028] In an embodiment, at least one IT equipment includes a
regular section containing an IT component that generates heat and
an acceleration section containing a local heat exchange element
attached to the IT component, both the regular section and the
acceleration section integrated as one complete system.
[0029] In an embodiment, a pump associated with the IT equipment is
disposed in the acceleration section to increase the flowrate of
the fluid in the acceleration section.
[0030] In an embodiment, the local heat exchange element includes a
heat sink elevated to the acceleration section. For example, a
cooling system comprises cooling hardware such as a heat sink to
extend and maximize the heat transfer area for the high power
density components.
[0031] In an embodiment, the fluid acceleration channel is disposed
on top of the fluid return channel. In an embodiment, both
acceleration channel and fluid return channel are connected to one
return channel.
[0032] In an embodiment, the flowrate of the fluid in an IT chamber
is controlled by a corresponding pump based on a local temperature
of the fluid within the corresponding IT chamber.
[0033] In an embodiment, each pump is attached to the fluid
acceleration channel and coupled to and removable from the fluid
return channel of the IT container.
[0034] In an embodiment, the fluid acceleration channel and the
pumps are attached to the lid, such that when the lid is lifted,
the fluid acceleration channel and the pumps are lifted and removed
from the IT chambers. In an embodiment, when the pumps are
lifted/removed from the IT chambers, the main fluid recirculation
may still function. However, since the acceleration pumps are
lifted/removed from the fluid, there are no acceleration
functions.
[0035] FIG. 1 is a block diagram illustrating a data center system
according to one embodiment. Referring to FIG. 1, data center
immersion cooling system 100 is referred to as a data center system
with immersion cooling. In one embodiment, data center immersion
cooling system 100 includes data center or data center unit 101
coupled to external cooling unit102. External cooling unit 102 may
be an indirect evaporative cooling (IDEC) unit. Cooling unit 102
includes a heat exchanger 105, which may be a liquid-to-liquid heat
exchanger or an air-to-liquid heat exchanger. Typically, heat
exchanger 105 includes a primary loop 106 and a secondary loop 107.
Primary loop 106 is utilized to circulate external cooling source
such as external air or external liquid. Secondary loop 107 is
utilized to circulate internal cooling liquid to exchange heat with
the external cooling material of primary loop 106.
[0036] In one embodiment, data center 101 includes an immersion
tank 103 filled with the internal cooling liquid, i.e., immersion
cooling liquid. Although there is one immersion tank shown herein,
more immersion tanks can also be included within data center 101.
Immersion tank 103 contains one or more server systems 104 and each
server blade includes one or more IT components (e.g., processors,
memory, storage devices). Server systems 104 are submerged in the
internal cooling liquid. The internal cooling liquid is thermally
conductive dielectric liquid designed to extract the heat from the
server systems. Such cooling technique is referred to as immersion
cooling.
[0037] Server immersion cooling is a computer cooling practice by
which computer components or servers are submerged in a thermally
conductive dielectric liquid. For example, common dielectrics which
are suitable for immersion cooling are typically oil-based. Server
immersion cooling has the potential of becoming a popular server
cooling solution for green data centers, as it allows them to
drastically reduce their energy load, regardless of their PUE.
Servers and other IT hardware cooled by immersion cooling do not
require fans, thus these are removed.
[0038] Referring back to FIG. 1, according to one embodiment, data
center 101 includes a liquid supply line 111 and a liquid return
line 112 coupled to the secondary side of the heat exchanger 105 of
cooling system 102 to form the secondary loop. In addition, liquid
supply line 111 is coupled to an intake port of immersion tank 103
and liquid return line 112 is coupled to an outlet port of
immersion tank 103. Liquid supply line 111 is configured to receive
the cooling liquid from heat exchanger 105 and to distribute the
cooling liquid to immersion tank 103. Liquid return line 112 is
configured to receive the cooling liquid carrying the heat
exchanged from server blades 104 from immersion tank 103 and to
return the cooling liquid back to heat exchanger 105 for heat
exchange.
[0039] In addition, a liquid pump 115 may be disposed on liquid
return line 112 to pump and circulate the cooling liquid to flow
within the secondary loop. In addition, multiple pumps may be
designed in the system (on main supply line 111 or on main return
line 112 for redundant purpose. Note that if there are multiple
immersion tanks within data center 101, there will be multiple
pairs of liquid supply line and liquid return line to couple the
immersion tanks with heat exchanger 105 of cooling system 102.
Unlike conventional cooling systems, the secondary loop 107 via
liquid supply line 111, immersion tank 103, and liquid return line
112 is a single heat transfer loop without using a CDU in between.
Typically, a CDU also includes a heat exchanger having a primary
loop and a secondary loop therein, which will form multiple loops
between cooling system 102 and immersion tank 103. Also note that
liquid pump 115 may be disposed on liquid supply line 111 or
alternatively, there may be multiple liquid pumps, one disposed on
liquid supply line 111 and another one disposed on liquid return
line 112.
[0040] FIG. 2 is a block diagram illustrating an example of a data
center system 200 with immersion cooling according to another
embodiment. For example, FIG. 2 shows the system design view from
the front side. The immersion cooling system 200 may be utilized as
a part of cooling system 100 of data center 101 as shown in FIG. 1.
In an embodiment, the fluid supply channel 213 is designed on the
bottom of the container 209. In an embodiment, the fluid supply
channel 213 is the only source for supply fluid to the system in
this architecture. In an embodiment, the main section includes
multiple IT chambers (e.g., 209a, 209b). For example, the IT
chambers (e.g., 209a 209b) are filled with immersion cooling fluid
and it is used for populating IT equipment (e.g., 211a, 211b). In
FIG. 1, for example, IT equipment (e.g., 211a, 211b) are shown
populated and aligned in the IT chambers (e.g., 209a, 209b). In an
embodiment, the fluid return channel 207 is used for the main
system fluid return. In an embodiment, on the top of the IT
equipment (e.g., 211a, 211b) there is a section (e.g., 205a, 205b)
where a pump (e.g., 215a, 215b) is packaged. In an embodiment, the
pump (e.g., 215a, 215b) is the localized pump which is used for
accelerating the corresponding IT equipment (e.g., 211a, 211b) it
is designed and assembled for. In an embodiment, the localized
pumps (e.g., 215a, 215b) are connected to the fluid acceleration
channel 203. For example, the fluid acceleration channel 203 can be
understood as a channel or a loop. In an embodiment, the cooling
system 200 includes a lid on the top of the fluid acceleration
channel 203. For example, the lid is the very top cover of the
system 200.
[0041] FIG. 3 is a block diagram illustrating an example of a data
center system 300 with immersion cooling according to an
embodiment. FIG. 3 shows another system configuration according to
an embodiment. In an embodiment, this design is a highly combined
design with IT equipment 301. For example, it can be seen that the
basic sections are the same as shown in FIG. 2. However, the IT
equipment 301 are designed in two layers/sections 303, 305, even
though these two sections 303, 305 are both integrated together as
one complete system according to an embodiment. In an embodiment,
the acceleration section 305 can be understood as an extension of
the cooling area of portion 302. In an embodiment, in the
acceleration section 305, the major cooling device 309 such as heat
sinks are elevated to this section 305. In an embodiment, the other
section 303 is the regular section which packaged the electronics.
In an embodiment, since the system are designed in two sections
303, 305, it is more convenient to design and implement
acceleration section 305 for the IT equipment 301. In an
embodiment, only the acceleration section 305 is designed with
acceleration pump 307 accordingly. For example, the acceleration
sections 305 can be custom designed based on the IT populated in
the immersion system, and it also provides possibilities for system
design and operating efficiency.
[0042] In an embodiment, the acceleration pump 307 is dedicated for
the major cooling device 309 in the acceleration section 305. In
some embodiment, the location of the acceleration pump 307 is
adjustable connected with the acceleration channel 311. In some
embodiment, the acceleration pump 307 is coupled to and removable
from the regular return channel 313.
[0043] In an embodiment, the acceleration pump 307 can be
integrated to acceleration channel 311. In an embodiment, the
acceleration channel 311 is not in the main immersion environment,
and once the acceleration pump 307 is installed, it connects the
immersion fluid with the acceleration channel 311.
[0044] In an embodiment, the acceleration channel 311 includes a
fluid blind mating port such as male portion. In an embodiment, the
acceleration pump side may include female portion to connect with
male portion of the acceleration pump side for connections. In an
embodiment, connections are blind mating quick disconnections.
[0045] In an embodiment, it can be understood as that the
acceleration pump 307 is configured as a connecting component
between the main immersion environment and the acceleration channel
311.
[0046] In an embodiment, the acceleration pump 307 is packaged
within an additional channel 315, then the additional channel 315
is connected to the acceleration channel 311. In an embodiment, the
acceleration pump 307 within the additional channel 315 pumping the
fluid to accelerate the corresponding region 309. In an embodiment,
the additional channel 315 has the acceleration pump 307 packaged
inside. In an embodiment, one or more additional channels is
connected to the acceleration channel to form a complete
acceleration loop between the immersion tank to the converging
channel.
[0047] In an embodiment, the acceleration channel can be
individually dedicated connected to the converging channel. In an
embodiment, the acceleration channel 311 can be merged together and
parallel (in terms of fluid flowing) with the regular channel and
then converges to converging channel. For example, the fluid is
supplied from the main supply to the immersion system, and the
fluid will flow through the electronics and then return to the
converging channel before finally reaching the cooling unit. In an
embodiment, if there are one or more acceleration channels, a
portion of the fluid will be accelerated with a higher flow rate
and pass through its corresponding acceleration channel and then to
converge in the converging channel. This is an illustration of the
parallel concept.
[0048] FIG. 4 is a block diagram illustrating an example of a data
center system 400 with immersion cooling according to another
embodiment. FIG. 4 presents a side of design according to an
embodiment. It can be seen the main supply 411 and main return 417
of the system are designed at the bottom and left side on the top.
For example, it needs to be mentioned that these designs can be in
different locations in the system, and the main functions are
supply and return. In an embodiment, the localized pump 419 and the
corresponding channel 413 are located on the top of the server and
connected to the fluid acceleration channel 413. For example, it
needs to be noted that this may require some server chassis
optimization to have a better structural level adaption with the
localized pump section.
[0049] In an embodiment, the arrow 411, 413, 417 shows the fluid
flowing direction. For example, the current one shows that fluid
goes into the immersion container 411 through the supply channel
409 and pass the PCB 405 including all the chips 407 before leaving
the container. In an embodiment, the fluid 417 normally leaves the
container through the fluid return channel 415. Also, the fluid 413
can be localized accelerated by the pump 419 and leaves the
container faster through the fluid acceleration channel 403
according to an embodiment. In an embodiment, the lo
[0050] FIG. 5 is a block diagram illustrating an example of a data
center system 500 with immersion cooling according to another
embodiment. For example, FIG. 5 shows that one of the design that
integrate the acceleration channel 503 and acceleration pump/pumps
505 are integrated on the top lid 501 of the immersion
container/tank. In an embodiment, different lid 501 can be switched
with different acceleration configurations. For example, this can
be understood as the top section 501, 503, 505 of the system. In an
embodiment, the location of the acceleration pump 505 can be
changed to be coupled to channel 503 under lid 501. In some
embodiment, the acceleration pump 505, the acceleration channel
503, the top lid 501 and/or the entire top section can be
dynamically reconfigured.
[0051] FIG. 6 is a block diagram illustrating an example of a top
section 600 of a data center system with immersion cooling
according to another embodiment. For example, FIG. 6 shows that the
top section 600 can be flexible configured based on the IT
characteristics populated in the system. For example, the container
maybe populated with some GPU based high performance systems and
storage system. In an embodiment, only the dedicated spaces where
the GPU systems are populated are assembled with localized pumps
601, 603, 605. For example, the location of each acceleration pump
(e.g., 601, 603, 605) can be adjusted based on the corresponding
acceleration section. In an embodiment, acceleration pumps 601,
603, 605 are coupled to acceleration channel under lid. In some
embodiment, the acceleration pumps 601, 603, 605, the acceleration
channel, the top lid and/or the entire top section can be
dynamically reconfigured. In an embodiment, one or more
acceleration pumps (e.g., 601,603, 605) may be in idle based on the
need of cooling enhancement. In an embodiment, all acceleration
pumps may be in idle when no cooling enhancement is needed.
[0052] FIG. 7 is a block diagram illustrating an example of a data
center system 700 with immersion cooling according to another
embodiment. For example, FIG. 7 presents a schematic representation
of the system and the control design. In an embodiment, the
immersion tank 703 is connected to the cooling unit 701. In an
embodiment, the cooling unit 701 can be understood as any fluid
sources or cooling unit, either in a primary loop 725, 707 or
secondary loop 725, 709. In an embodiment, the system pump 705 is
used on the main supply loop 705 and the pump speed is controlled
by the immersion system power (e.g., 721), either the rated power
or actual operating power. In an embodiment, the pump speed can be
set as a constant speed based on the system characterization. In an
embodiment, one or more acceleration pumps 713, 715 are forming
separate loops 717, 719 form the immersion tank 703 and the coolant
unit 701. In an embodiment, it can be seen that the pumps 713, 715
pump fluid form the immersion tank 703 precisely from certain area
or locations, and the fluid 717, 719 pumped by these acceleration
pumps 713, 715 forming together in the fluid acceleration channel
711, 719. In an embodiment, the localized acceleration pump 713,
715 are controlled through the measurements of the localized
temperature (e.g., T 723) such as GPU temperatures or other high
power density electronics' temperatures. It needs to be motioned
that each individual acceleration pump (e.g., 713, 715) may be
connected to different sensors 723a, 723b, or input control signals
721.
[0053] FIG. 8 is a block diagram illustrating an example of a data
center system 800 with immersion cooling under a normal operation
mode according to an embodiment. For example, FIG. 8 shows the
fluid 801, 803 flowing manner during the normal operating mode. In
an embodiment, under the normal operating mode, the supply fluid
801 flows from the cooling unit 701 to the immersion tank 703 and
the return fluid 803 flows from the immersion tank 703 to the
cooling unit 701.
[0054] FIG. 9 is a block diagram illustrating an example of a data
center system 900 with immersion cooling under a single
acceleration mode according to another embodiment. For example,
FIG. 9 shows the fluid flowing diagram when one of the acceleration
907 functions. In an embodiment, under the single acceleration
mode, the supply fluid 901 flows from the cooling unit 701 to the
immersion tank 703, the return fluid 903 flows from the immersion
tank 703 to the cooling unit 701, and the first acceleration fluid
907, 905 also flows from the immersion tank 703 to the cooling unit
701.
[0055] FIG. 10 is a block diagram illustrating an example of a data
center system 1000 with immersion cooling under a multiple
acceleration mode according to another embodiment. For example,
FIG. 10 shows system fluid flowing diagram when multiple localized
fluid acceleration 1007, 1009 are in active mode. In an embodiment,
under the multiple acceleration mode, the supply fluid 1001 flows
from the cooling unit 701 to the immersion tank 703. In some
embodiment, the return fluid 1003 flows from the immersion tank 703
to the cooling unit 701. In an embodiment, he first acceleration
fluid 1007 and the second acceleration fluid 1009 flows from the
immersion tank 703 to the cooling unit 701 through acceleration
channel 1011, 1005.
[0056] In the foregoing specification, embodiments of the invention
have been described with reference to specific exemplary
embodiments thereof. It will be evident that various modifications
may be made thereto without departing from the broader spirit and
scope of the invention as set forth in the following claims. The
specification and drawings are, accordingly, to be regarded in an
illustrative sense rather than a restrictive sense.
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