U.S. patent application number 17/565907 was filed with the patent office on 2022-07-07 for electronic device and method for managing memory using the same.
The applicant listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Kwanhee JEONG, Hyojong KIM, Myungah KIM, Hongjung SON.
Application Number | 20220214809 17/565907 |
Document ID | / |
Family ID | |
Filed Date | 2022-07-07 |
United States Patent
Application |
20220214809 |
Kind Code |
A1 |
JEONG; Kwanhee ; et
al. |
July 7, 2022 |
ELECTRONIC DEVICE AND METHOD FOR MANAGING MEMORY USING THE SAME
Abstract
According to certain embodiments, an electronic device
comprises: a memory; and a processor operatively coupled to the
memory, wherein the processor is configured to: identify a
remaining capacity of the memory, and when the remaining capacity
of the memory is less than a specified ratio of a total capacity of
the memory, block compilation using a profile of an application, or
delete an artifact created through compilation using the profile of
the application.
Inventors: |
JEONG; Kwanhee;
(Gyeonggi-do, KR) ; SON; Hongjung; (Gyeonggi-do,
KR) ; KIM; Myungah; (Gyeonggi-do, KR) ; KIM;
Hyojong; (Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Gyeonggi-do |
|
KR |
|
|
Appl. No.: |
17/565907 |
Filed: |
December 30, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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PCT/KR2021/019732 |
Dec 23, 2021 |
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17565907 |
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International
Class: |
G06F 3/06 20060101
G06F003/06 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 6, 2021 |
KR |
10-2021-0001428 |
Claims
1. An electronic device comprising: a memory; and a processor
operatively coupled to the memory, wherein the processor is
configured to: identify a remaining capacity of the memory, and
when the remaining capacity of the memory is less than a specified
ratio of a total capacity of the memory, block compilation using a
profile of an application, or delete an artifact created through
compilation using the profile of the application.
2. The electronic device of claim 1, wherein the specified ratio
comprises a first specified ratio, a second specified ratio, and a
third specified ratio, and wherein the processor is further
configured to: when determining that the remaining capacity of the
memory is between the first specified ratio and the second
specified ratio that is smaller than the first specified ratio,
identify the profile for a method of a frequently used application,
and block execution of compilation using the profile for the method
of the frequently used application.
3. The electronic device of claim 2, wherein the processor is
further configured to: when the remaining capacity of the memory is
between the second specified ratio, and the third specified ratio
that is smaller than the second ratio, identify a path of a system
package that is not in use by performing an update, and delete an
artifact generated by performing compilation of the system package
located in the identified path.
4. The electronic device of claim 3, wherein the processor is
further configured to: when determining that the remaining capacity
of the memory is less than the third specified ratio, obtain a list
of packages of applications installed in the electronic device,
identify a package of at least one application that is not in use
for a specified period from the obtained list, identify information
including at least one of information of an instruction set
architecture or an installation path of the package of at least one
application that is not in use for the specified period, based on
the obtained at least one of the installation path of the package
of the at least one application that is not in use for the
specified period or the information of the instruction set
architecture, identify the path in which an artifact of the package
of the at least one application that is not in use is located, and
delete the artifact located in the path.
5. The electronic device of claim 4, wherein the processor is
further configured to: identify whether icons of each of the
applications included in the list exist, if an icon for each of the
applications exists, based on whether an event of execution of each
application, a sharing event using each application, a pop-up
message event of each application, and an event of installing a
widget of each application occur, and whether each of the
applications is set to a specific function, identify an unused
period of each application, and add at least one application whose
unused period exceeds the specified period to a list of artifacts
to be deleted.
6. The electronic device of claim 5, wherein the processor is
further configured to: if the icon of each of the applications does
not exist, identify a time when an application component
constituting a package of each application was last used, based on
the last time the application component was used, identify the
unused period of the application component, and add at least one
application component whose unused period exceeds a specified
period to the list to delete the artifact.
7. The electronic device of claim 4, wherein the processor is
further configured to: after deleting the artifact, compile the
package from which the artifact was deleted when determining that
the remaining capacity of the memory is greater than or equal to
the third specified ratio.
8. The electronic device of claim 4, wherein the processor is
further configured to: after deleting the artifact, when
determining that the remaining capacity of the memory is greater
than or equal to the second specified ratio, restore the deleted
artifact through recompilation using the profile of the
application.
9. The electronic device of claim 8, wherein the processor is
further configured to: when determining that the remaining capacity
of the memory is greater than or equal to the second specified
ratio, perform the recompilation based on a Java code file and the
profile of the application.
10. The electronic device of claim 4, wherein the processor is
further configured to: after deleting the artifact, when
determining that the remaining capacity of the memory is greater
than or equal to the third specified ratio, by performing
compilation based on a Java code file, restore a basic function of
the application, and when determining that the remaining capacity
of the memory is greater than or equal to the second specified
ratio greater than the third specified ratio, by performing
compilation based on the profile of the application, restore to a
point of use of the application.
11. A method for managing a memory of an electronic device, the
method comprising: identifying a remaining capacity of the memory;
and when determining that the remaining capacity of the memory is
less than a specified ratio of a total capacity of the memory,
blocking compilation using a profile of an application, or deleting
an artifact created by performing the compilation using the profile
of the application.
12. The method of claim 11, wherein the specified ratio includes a
first specified ratio, a second specified ratio, and a third
specified ratio, and wherein the deleting the artifact comprises:
when determining that the remaining capacity of the memory is
between the first specified ratio and the second specified ratio,
the second specified ratio less than the first specified ratio,
identifying the profile for a method of a frequently used
application; and blocking execution of compilation using the
profile for the method of the frequently used application.
13. The method of claim 12, wherein the deleting the artifact
comprises: when determining that the remaining capacity of the
memory is between the second specified ratio and the third
specified ratio, the third specified ratio smaller than the second
specified ratio, identifying a path of an unused system package by
performing an update; and deleting an artifact generated by
performing compilation of a system package located in the
identified path.
14. The method of claim 13, wherein the deleting the artifact
comprises: when the remaining capacity of the memory is less than
the third specified ratio that is smaller than the second specified
ratio, obtaining a list of packages of applications installed in
the electronic device; identifying a package of at least one
application that is not in use for a specified period from the
obtained list; identifying information including at least one of
information of an instruction set architecture of an installation
path of the package of at least one application that is not in use
for the specified period; based on the obtained at least one of the
installation path of the package of the at least one application
that is not in use for the specified period or the information of
an instruction set architecture information, identifying the path
in which the artifact of the package of the at least one
application that is not in use is located; and deleting the
artifact located in the path.
15. The method of claim 14, wherein the identifying the package of
the at least one application that is not in use comprises:
identifying whether an icon of each of the applications included in
the list exists; if an icon for each of the applications exists,
based on whether an event of execution of each application, a
sharing event using each application, a pop-up message event of
each application, and an event of installing a widget of each
application occur, and whether each application is set to a
specific function, identifying an unused period of each
application; and adding at least one application for which the
unused period exceeds a specified period to a list of artifacts to
be deleted.
16. The method of claim 15, further comprising: if the icon of each
of the applications does not exist, identifying when an application
component constituting a package of each application was last used;
based on when the application component was last used, identifying
an unused period of the application component; and adding at least
one application component for which the unused period exceeds a
specified period to the list of artifacts to be deleted.
17. The method of claim 14, further comprising: after deleting the
artifact, when determining that the remaining capacity of the
memory is greater than or equal to the third specified ratio,
compiling the package from which the artifact has been deleted.
18. The method of claim 14, further comprising: after deleting the
artifact, when determining that the remaining capacity of the
memory is greater than or equal to the second specified ratio,
restoring the deleted artifact through recompilation using the
profile of the application.
19. The method of claim 18, wherein the restoring the deleted
artifact through the recompilation comprises: when determining that
the remaining capacity of the memory is greater than or equal to
the second specified ratio, performing the recompilation based on a
Java code file and the profile of the application.
20. The method of claim 14, further comprising: after deleting the
artifact, when determining that the remaining capacity of the
memory is greater than or equal to the third specified ratio,
restoring a basic function of the application by performing
compilation based on a Java code file; and when determining that
the remaining capacity of the memory is greater than or equal to
the second specified ratio greater than the third specified ratio,
by performing compilation based on the profile of the application,
restoring to a point of use of the application.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a Continuation of and based on and
claims priority under 35 U.S.C. .sctn. 120 to PCT International
Application No. PCT/KR2021/019732, which was filed on Dec. 23,
2021, and claims priority to Korean Patent Application No.
10-2021-0001428, filed on Jan. 6, 2021, in the Korean Intellectual
Property Office, the disclosures of which are incorporated by
reference herein their entirety.
BACKGROUND
Technical Field
[0002] Certain embodiments of the disclosure relate to an
electronic device and method for managing a memory using the
same.
Description of Related Art
[0003] As an electronic device performs many functions within a
limited memory capacity, a memory shortage situation may occur. For
example, when the remaining capacity of the memory becomes less
than a certain amount, the electronic device may provide a
notification. The notification may notify the user of the need to
free up available space of the memory. In order to free up space in
the memory, the user may delete files, packages, data of packages,
and cache files stored in the electronic device.
SUMMARY
[0004] As an application package is installed, artifacts may be
created. Even though some artifacts are not used for a long time,
there appears to be no method to delete them. Also, the
notification of the need to free up available space of the memory
might only be provided when the remaining capacity of a memory is
less than or equal to a specified capacity. As a differential
operation for securing available memory space (a backup where all
changes since the most recent full backup are backed up) is not
provided, not only input or output processing is delayed, but also
the usability of an electronic device may deteriorate.
[0005] The electronic device according to certain embodiments of
the disclosure may block compilation using an application profile,
or may selectively delete artifacts created by compilation, based
on the remaining capacity of the memory being less than a specified
ratio.
[0006] The electronic device according to certain embodiments of
the disclosure, may restore the deleted artifact by compiling the
package from which the artifact was deleted, or by recompiling
using the application profile when the remaining capacity of the
memory is greater than or equal to a specified capacity.
[0007] According to certain embodiments, an electronic device
comprises: a memory; and a processor operatively coupled to the
memory, wherein the processor is configured to: identify a
remaining capacity of the memory, and when the remaining capacity
of the memory is less than a specified ratio of a total capacity of
the memory, block compilation using a profile of an application, or
delete an artifact created through compilation using the profile of
the application.
[0008] According to certain embodiments, a method for managing a
memory of an electronic device comprises: identifying a remaining
capacity of the memory; and when determining that the remaining
capacity of the memory is less than a specified ratio of a total
capacity of the memory, blocking compilation using a profile of an
application, or deleting an artifact created by performing the
compilation using the profile of the application.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a block diagram illustrating an electronic device
in a network environment according to certain embodiments of the
disclosure.
[0010] FIG. 2 is a block diagram illustrating an electronic device
according to certain embodiments of the disclosure.
[0011] FIG. 3 is a flowchart illustrating a method of managing a
memory based on the remaining capacity of the memory, according to
certain embodiments of the disclosure.
[0012] FIG. 4 is a flowchart for explaining operation 315 of FIG.
3, according to certain embodiments.
[0013] FIG. 5 is a flowchart for explaining operation 440 of FIG. 4
according to certain embodiments.
[0014] FIG. 6 is a flowchart illustrating a method of managing a
memory based on the remaining capacity of the memory, according to
certain embodiments.
DETAILED DESCRIPTION
[0015] The electronic device according to certain embodiments of
the disclosure, based on the remaining capacity of the memory,
blocks compilation using the profile of an application or by
selectively deleting an artifact generated through compilation. The
foregoing not only systematically secures the available space of
the memory, but also prevents input or output performance
degradation that may occur due to the limitation of the available
space of the memory.
[0016] The electronic device according to certain embodiments of
the disclosure, when the remaining capacity of the memory is
secured to be greater than or equal to a specified capacity, by
compiling the package from which the artifact has been deleted, or
by restoring the artifact deleted through recompilation using the
application profile, may prevent performance degradation when using
the application.
[0017] FIG. 1 is a block diagram of an electronic device which
systematically frees up available space of the memory, and prevents
input or output performance degradation due to the limitation of
the available space of the memory. The electronic device, based on
the remaining capacity of the memory, blocks compilation of an
application using a profile of the application or selectively
deletes an artifact generated through compilation.
[0018] The electronic device 101 identifies a remaining capacity of
a memory 130, and when determining that the remaining capacity of
the memory 130 is below a specified ratio, either blocks
complication of an application using the profile of the
application, or deletes an artifact created by performing
complication using a profile of an application.
[0019] FIG. 1 is a block diagram illustrating an electronic device
101 in a network environment 100 according to certain embodiments
of the disclosure.
[0020] Referring to FIG. 1, an electronic device 101 in a network
environment 100 may communicate with an electronic device 102 via a
first network 198 (e.g., a short-range wireless communication
network), or at least one of an electronic device 104 or a server
108 via a second network 199 (e.g., a long-range wireless
communication network). According to an embodiment, the electronic
device 101 may communicate with the electronic device 104 via the
server 108. According to an embodiment, the electronic device 101
may include a processor 120, memory 130, an input module 150, a
sound output module 155, a display module 160, an audio module 170,
a sensor module 176, an interface 177, a connection terminal 178, a
haptic module 179, a camera module 180, a power management module
188, a battery 189, a communication module 190, a subscriber
identification module (SIM) 196, or an antenna module 197. In some
embodiments, at least one of the components (e.g., the connection
terminal 178) may be omitted from the electronic device 101, or one
or more other components may be added in the electronic device 101.
In some embodiments, some of the components (e.g., the sensor
module 176, the camera module 180, or the antenna module 197) may
be implemented as a single component (e.g., the display module
160).
[0021] The processor 120 may execute, for example, software (e.g.,
a program 140) to control at least one other component (e.g., a
hardware or software component) of the electronic device 101
coupled with the processor 120, and may perform various data
processing or computation. According to one embodiment, as at least
part of the data processing or computation, the processor 120 may
store a command or data received from another component (e.g., the
sensor module 176 or the communication module 190) in volatile
memory 132, process the command or the data stored in the volatile
memory 132, and store resulting data in non-volatile memory 134.
According to an embodiment, the processor 120 may include a main
processor 121 (e.g., a central processing unit (CPU) or an
application processor (AP)), or an auxiliary processor 123 (e.g., a
graphics processing unit (GPU), a neural processing unit (NPU), an
image signal processor (ISP), a sensor hub processor, or a
communication processor (CP)) that is operable independently from,
or in conjunction with, the main processor 121. For example, when
the electronic device 101 includes the main processor 121 and the
auxiliary processor 123, the auxiliary processor 123 may be adapted
to consume less power than the main processor 121, or to be
specific to a specified function. The auxiliary processor 123 may
be implemented as separate from, or as part of the main processor
121. The term "processor" shall be understood to refer to both the
singular and plural context in this document.
[0022] The auxiliary processor 123 may control at least some of
functions or states related to at least one component (e.g., the
display module 160, the sensor module 176, or the communication
module 190) among the components of the electronic device 101,
instead of the main processor 121 while the main processor 121 is
in an inactive (e.g., sleep) state, or together with the main
processor 121 while the main processor 121 is in an active state
(e.g., executing an application). According to an embodiment, the
auxiliary processor 123 (e.g., an image signal processor or a
communication processor) may be implemented as part of another
component (e.g., the camera module 180 or the communication module
190) functionally related to the auxiliary processor 123. According
to an embodiment, the auxiliary processor 123 (e.g., the neural
processing unit) may include a hardware structure specified for
artificial intelligence model processing. An artificial
intelligence model may be generated by machine learning. Such
learning may be performed, e.g., by the electronic device 101 where
the artificial intelligence is performed or via a separate server
(e.g., the server 108). Learning algorithms may include, but are
not limited to, e.g., supervised learning, unsupervised learning,
semi-supervised learning, or reinforcement learning. The artificial
intelligence model may include a plurality of artificial neural
network layers. The artificial neural network may be a deep neural
network (DNN), a convolutional neural network (CNN), a recurrent
neural network (RNN), a restricted boltzmann machine (RBM), a deep
belief network (DBN), a bidirectional recurrent deep neural network
(BRDNN), deep Q-network or a combination of two or more thereof but
is not limited thereto. The artificial intelligence model may,
additionally or alternatively, include a software structure other
than the hardware structure.
[0023] The memory 130 may store various data used by at least one
component (e.g., the processor 120 or the sensor module 176) of the
electronic device 101. The various data may include, for example,
software (e.g., the program 140) and input data or output data for
a command related thereto. The memory 130 may include the volatile
memory 132 or the non-volatile memory 134. The non-volatile memory
134 may include an internal memory 136 and/or an external memory
138.
[0024] The program 140 may be stored in the memory 130 as software,
and may include, for example, an operating system (OS) 142,
middleware 144, or an application 146.
[0025] The input module 150 may receive a command or data to be
used by another component (e.g., the processor 120) of the
electronic device 101, from the outside (e.g., a user) of the
electronic device 101. The input module 150 may include, for
example, a microphone, a mouse, a keyboard, a key (e.g., a button),
or a digital pen (e.g., a stylus pen).
[0026] The sound output module 155 may output sound signals to the
outside of the electronic device 101. The sound output module 155
may include, for example, a speaker or a receiver. The speaker may
be used for general purposes, such as playing multimedia or playing
record. The receiver may be used for receiving incoming calls.
According to an embodiment, the receiver may be implemented as
separate from, or as part of the speaker.
[0027] The display module 160 may visually provide information to
the outside (e.g., a user) of the electronic device 101. The
display module 160 may include, for example, a display, a hologram
device, or a projector and control circuitry to control a
corresponding one of the display, hologram device, and projector.
According to an embodiment, the display module 160 may include a
touch sensor adapted to detect a touch, or a pressure sensor
adapted to measure the intensity of force incurred by the
touch.
[0028] The audio module 170 may convert a sound into an electrical
signal and vice versa. According to an embodiment, the audio module
170 may obtain the sound via the input module 150, or output the
sound via the sound output module 155 or a headphone of an external
electronic device (e.g., an electronic device 102) (e.g., speaker
or headphone) directly (e.g., wiredly) or wirelessly coupled with
the electronic device 101.
[0029] The sensor module 176 may detect an operational state (e.g.,
power or temperature) of the electronic device 101 or an
environmental state (e.g., a state of a user) external to the
electronic device 101, and then generate an electrical signal or
data value corresponding to the detected state. According to an
embodiment, the sensor module 176 may include, for example, a
gesture sensor, a gyro sensor, an atmospheric pressure sensor, a
magnetic sensor, an acceleration sensor, a grip sensor, a proximity
sensor, a color sensor, an infrared (IR) sensor, a biometric
sensor, a temperature sensor, a humidity sensor, or an illuminance
sensor.
[0030] The interface 177 may support one or more specified
protocols to be used for the electronic device 101 to be coupled
with the external electronic device (e.g., the electronic device
102) directly (e.g., through wires) or wirelessly. According to an
embodiment, the interface 177 may include, for example, a
high-definition multimedia interface (HDMI), a universal serial bus
(USB) interface, a secure digital (SD) card interface, or an audio
interface.
[0031] The connection terminal 178 may include a connector via
which the electronic device 101 may be physically connected with
the external electronic device (e.g., the electronic device 102).
According to an embodiment, the connection terminal 178 may
include, for example, an HDMI connector, a USB connector, an SD
card connector, or an audio connector (e.g., a headphone
connector).
[0032] The haptic module 179 may convert an electrical signal into
a mechanical stimulus (e.g., a vibration or a movement) or
electrical stimulus which may be recognized by a user via his
tactile sensation or kinesthetic sensation. According to an
embodiment, the haptic module 179 may include, for example, a
motor, a piezoelectric element, or an electric stimulator.
[0033] The camera module 180 may capture a still image or moving
images. According to an embodiment, the camera module 180 may
include one or more lenses, image sensors, image signal processors,
or flashes.
[0034] The power management module 188 may manage power supplied to
the electronic device 101. According to one embodiment, the power
management module 188 may be implemented as at least part of, for
example, a power management integrated circuit (PMIC).
[0035] The battery 189 may supply power to at least one component
of the electronic device 101. According to an embodiment, the
battery 189 may include, for example, a primary cell which is not
rechargeable, a secondary cell which is rechargeable, or a fuel
cell.
[0036] The communication module 190 may support establishing a
direct (e.g., wired) communication channel or a wireless
communication channel between the electronic device 101 and the
external electronic device (e.g., the electronic device 102, the
electronic device 104, or the server 108) and performing
communication via the established communication channel. The
communication module 190 may include one or more communication
processors that are operable independently from the processor 120
(e.g., an application processor (AP)) and supports a direct (e.g.,
wired) communication or a wireless communication. According to an
embodiment, the communication module 190 may include a wireless
communication module 192 (e.g., a cellular communication module, a
short-range wireless communication module, or a global navigation
satellite system (GNSS) communication module) or a wired
communication module 194 (e.g., a local area network (LAN)
communication module or a power line communication (PLC) module). A
corresponding one of these communication modules may communicate
with the external electronic device via the first network 198
(e.g., a short-range communication network, such as Bluetooth.TM.,
Wi-Fi direct, or infrared data association (IrDA)) or the second
network 199 (e.g., a long-range communication network, such as a
legacy cellular network, a fifth generation (5G) network, a
next-generation communication network, the Internet, or a computer
network (e.g., LAN or wide area network (WAN))). These various
types of communication modules may be implemented as a single
component (e.g., a single chip), or may be implemented as multi
components (e.g., multi chips) separate from each other. The
wireless communication module 192 may identify and authenticate the
electronic device 101 in a communication network, such as the first
network 198 or the second network 199, using subscriber information
(e.g., international mobile subscriber identity (IMSI)) stored in
the subscriber identification module 196.
[0037] The wireless communication module 192 may support a 5G
network, after a 4G network, and next-generation communication
technology, e.g., new radio (NR) access technology. The NR access
technology may support enhanced mobile broadband (eMBB), massive
machine type communications (mMTC), or ultra-reliable and
low-latency communications (URLLC). The wireless communication
module 192 may support a high-frequency band (e.g., the mmWave
band) to achieve, e.g., a high data transmission rate. The wireless
communication module 192 may support various technologies for
securing performance on a high-frequency band, such as, e.g.,
beamforming, massive multiple-input and multiple-output (massive
MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog
beam-forming, or large-scale antenna. The wireless communication
module 192 may support various requirements specified in the
electronic device 101, an external electronic device (e.g., the
electronic device 104), or a network system (e.g., the second
network 199). According to an embodiment, the wireless
communication module 192 may support a peak data rate (e.g., 20
Gbps or more) for implementing eMBB, loss coverage (e.g., 164 dB or
less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or
less for each of downlink (DL) and uplink (UL), or a round trip of
1ms or less) for implementing URLLC.
[0038] The antenna module 197 may transmit or receive a signal or
power to or from the outside (e.g., the external electronic device)
of the electronic device 101. According to an embodiment, the
antenna module 197 may include an antenna including a radiating
element composed of a conductive material or a conductive pattern
formed in or on a substrate (e.g., a printed circuit board (PCB)).
According to an embodiment, the antenna module 197 may include a
plurality of antennas (e.g., array antennas). In such a case, at
least one antenna appropriate for a communication scheme used in
the communication network, such as the first network 198 or the
second network 199, may be selected, for example, by the
communication module 190 (e.g., the wireless communication module
192) from the plurality of antennas. The signal or the power may
then be transmitted or received between the communication module
190 and the external electronic device via the selected at least
one antenna. According to an embodiment, another component (e.g., a
radio frequency integrated circuit (RFIC)) other than the radiating
element may be additionally formed as part of the antenna module
197.
[0039] According to certain embodiments, the antenna module 197 may
form mmWave antenna module. According to an embodiment, the mmWave
antenna module may include a printed circuit board, a RFIC disposed
on a first surface (e.g., the bottom surface) of the printed
circuit board, or adjacent to the first surface and capable of
supporting a designated high-frequency band (e.g., an mmwave band),
and a plurality of antennas (e.g., array antennas) disposed on a
second surface (e.g., the top or a side surface) of the printed
circuit board, or adjacent to the second surface and capable of
transmitting or receiving signals of the designated high-frequency
band.
[0040] At least some of the above-described components may be
coupled mutually and communicate signals (e.g., commands or data)
therebetween via an inter-peripheral communication scheme (e.g., a
bus, general purpose input and output (GPIO), serial peripheral
interface (SPI), or mobile industry processor interface
(MIPI)).
[0041] According to an embodiment, commands or data may be
transmitted or received between the electronic device 101 and the
external electronic device 104 via the server 108 coupled with the
second network 199. Each of the electronic devices 102 or 104 may
be a device of a same type as, or a different type, from the
electronic device 101. According to an embodiment, all or some of
operations to be executed at the electronic device 101 may be
executed at one or more of the external electronic devices 102,
104, or 108. For example, if the electronic device 101 should
perform a function or a service automatically, or in response to a
request from a user or another device, the electronic device 101,
instead of, or in addition to, executing the function or the
service, may request the one or more external electronic devices to
perform at least part of the function or the service. The one or
more external electronic devices receiving the request may perform
the at least part of the function or the service requested, or an
additional function or an additional service related to the
request, and transfer an outcome of the performing to the
electronic device 101. The electronic device 101 may provide the
outcome, with or without further processing of the outcome, as at
least part of a reply to the request. To that end, a cloud
computing, distributed computing, mobile edge computing (MEC), or
client-server computing technology may be used, for example. The
electronic device 101 may provide ultra low-latency services using,
e.g., distributed computing or mobile edge computing. In another
embodiment, the external electronic device 104 may include an
internet-of-things (IoT) device. The server 108 may be an
intelligent server using machine learning and/or a neural network.
According to an embodiment, the external electronic device 104 or
the server 108 may be included in the second network 199. The
electronic device 101 may be applied to intelligent services (e.g.,
smart home, smart city, smart car, or healthcare) based on 5G
communication technology or IoT-related technology. As the memory
130 becomes consumed, the electronic device 101 frees up available
memory space, thereby avoiding degradation of performance.
[0042] FIG. 2 is a block diagram 200 illustrating an electronic
device 201, according to certain embodiments.
[0043] With reference to FIG. 2, the electronic device 201 (e.g.,
the electronic device 101 of FIG. 1) may include a communication
circuit 210 (e.g., communication module 190 of FIG. 1), a memory
220 (e.g., memory 130 in FIG. 1), a touch screen display 230 (e.g.,
display module 160 of FIG. 1), and a processor 240 (e.g., processor
120 of FIG. 1).
[0044] The communication circuit 210 (e.g., the communication
module 190 of FIG. 1) may establish a communication channel with an
external electronic device (e.g., the electronic devices 102 and
104, the server 108 of FIG. 1), and with the external electronic
device it may support various data being transmitted and
received.
[0045] In one embodiment, the communication circuit 210, under the
control of the processor 240, may receive (or download) an update
file (e.g., an installation file (e.g., apk (android application
package) file)) from a server (e.g., App Store).
[0046] The memory 220 (e.g., the memory 130 of FIG. 1) may store
instructions for differentially performing different operations for
securing an available space of the memory 220 based on the
remaining capacity of the memory 220. The memory 220 may store
instructions for performing different operations for restoring
differentially deleted artifacts when the remaining capacity of the
memory 220 is secured at a specified ratio or more.
[0047] The touch screen display 230 (e.g., the display module 160
of FIG. 1) may be integrally configured including the display 231
and the touch panel 233.
[0048] In one embodiment, the touch screen display 230, under the
control of the processor 240, may display a user interface. The
user interface can include a notification for of the need to free
up available space of the memory 220.
[0049] The processor 240 (e.g., the processor 120 of FIG. 1) may
include, for example, a microcontroller unit (MCU) and may control
a plurality of hardware components connected to the processor 240
by driving an operating system (OS) or embedded software program.
The processor 240 may control a plurality of hardware components
according to, for example, instructions stored in the memory 220
(e.g., the program 140 of FIG. 1).
[0050] The processor 240 may identify (e.g., check) the remaining
capacity of the memory 220. For example, the processor 240 may
receive capacity information corresponding to a ratio of the usable
capacity of the memory 220 through the storage manager 241.
[0051] The processor 240 may identify the remaining capacity of the
memory 220 based on detecting a request to delete a specified time
interval or artifact. The artifact may include a native file (or
native code) such as *.vdex, *.odex, or *.oat or an initialization
image for application class information such as *.art.
[0052] The processor 240 may identify whether the remaining
capacity of the memory 220 to the total capacity of the memory, is
less than a specified ratio. The specified ratio may include a
ratio of available capacity among the total capacity of the memory
220. A specified ratio may be a plurality of specified ratios.
[0053] When the remaining capacity of the memory 220 is less than
the specified ratio, the processor 240 may block compilation using
the profile of the application, or it may delete the created
artifact by performing compilation using the profile of the
application. For example, if it is confirmed that the remaining
capacity of the memory 220 is between a first specified ratio and a
second specified ratio, the processor 240 may block compilation
using the profile of the application executed through the
background manager 243.
[0054] When the remaining capacity of the memory 220 is between the
second specified ratio and third specified ratio, the processor 240
deletes an artifact. The processor 240 identifies a path, through
the package manager 245. The path is the one where the artifact
generated by the unused system package is located as the update is
completed. The processor 240 can delete the artifact located in the
path.
[0055] When the remaining capacity of the memory 220 is confirmed
to be less than a third specified ratio, the processor 240 may
identify a list of packages of applications installed in the
electronic device 201. The processor 240 may identify the list
through the package manager 245. The processor 240 may identify the
package of an application not in use for a specified period through
the activity manager 247. The processor 240 may delete an artifact
generated by performing compilation using a profile of a package of
an application that is not in use for a specified period.
[0056] The processor 240 determines (e.g., identifies, checks)
whether the remaining capacity of the memory 220 is greater than or
equal to a specified ratio. Based on the confirmation of the
specified ratio or more, it may restore the deleted artifact by
compiling the package from which the artifact was deleted, or by
recompiling using the application profile.
[0057] For example, if the remaining capacity of the memory 220 is
determined to be greater than or equal to the third specified
ratio, the processor 240 may compile the package from which the
artifact was deleted. If the remaining capacity of the memory 220
is determined to be greater than or equal to the second specified
ratio, the processor 240 may restore the deleted artifact through
recompilation using the profile of the application.
[0058] FIG. 3 is a flowchart 300 for explaining a method of
managing the memory 220 based on the remaining capacity of the
memory 220, according to certain embodiments.
[0059] With reference to FIG. 3, in operation 305, the processor
(e.g., the processor 240 of FIG. 2) of the electronic device (e.g.,
the electronic device 201 of FIG. 2) may identify (e.g., check) the
remaining capacity of a memory (e.g., the memory 220).
[0060] The operation of identifying the remaining capacity of the
memory 220 of operation 305 described above according to certain
embodiments may be performed at a specified time interval. But it
is not limited to this. For example, based on detecting an input
requesting deletion of an artifact (e.g., an input requesting
execution of a service to delete artifacts) generated through
compilation using an application profile, the processor 240 may
perform an operation to identify the remaining capacity of the
memory 220 in operation 305 described above.
[0061] In certain embodiments, the artifact may include a native
file (or native code) such as either or both *.vdex, *.odex, or
*.oat and initialization image of an application class information
such as *.art.
[0062] In one embodiment, the processor 240, based on the
application update, through a communication circuit (e.g., the
communication circuit 210 of FIG. 2), may receive (or download) an
update file (e.g., installation file (e.g. apk (android application
package) file)) from a server (e.g., App Store). For example, an
application may be developed in a specific programming language
(e.g., Java language), and resource files (e.g., Java source code,
layout xml file, image file, audio file, animation, menu, style,
and color) may be created as update files (e.g. apk files) by a
software development key (SDK). The update file indicates an
Android package, and the extension can be expressed as ".apk." For
example, one apk file may represent one application and may be a
file installed in the electronic device 201.
[0063] In one embodiment, *.vdex may include an uncompressed
bytecode (e.g., dex code) of an update file (e.g., apk (android
application package)) of the aforementioned application. Either or
both*.odex or .oat may include a compiled (e.g. ahead of time (AOT)
compile) code for methods defined in executable files (e.g. .dex)
of the aforementioned application's update files (e.g. installation
files (e.g. .apk)). Also, *.art may include the ART (android
runtime) internal representation of some strings and classes listed
in the executable file (e.g., .dex) in the update file (e.g., apk)
of the aforementioned application.
[0064] In operation 310, the processor 240 may identify (e.g.,
determine) whether the remaining capacity of the memory 220 is less
than a specified ratio. For example, the processor 240 may transmit
the specified ratio to the storage manager (e.g., the storage
manager 241 of FIG. 2) as a parameter. The storage manager 241 may
transmit capacity information of the memory 220 corresponding to
the specified ratio to the processor 240. The processor 240 may
identify whether the remaining capacity of the memory 220 is less
than the capacity of the memory 220 corresponding to a specified
ratio received from the storage manager 241.
[0065] The specified ratio may include a ratio of usable capacity
among the total capacity of the memory 220. The specified ratio may
be a plurality of specified ratios. The plurality of specified
ratios may include a first specified ratio, a second specified
ratio, and a third specified ratio. But it is not limited to
this.
[0066] The first specified ratio may be greater than the second
specified ratio, and the second specified ratio may be greater than
the third specified ratio. For example, the first specified ratio
may represent a case in which the usable capacity among the total
capacity of the memory 220 is 8%. The second specified ratio may be
5%. The third specified ratio be 1%. The foregoing are provided by
way of example, and not limitation.
[0067] The first to third specified ratios may be predetermined by
the manufacturer, or may be changeable settings.
[0068] The numerical values of the first specified ratio to the
third specified ratio are for ease of explanation, and they are not
limited to the numerical values of the aforementioned ratios.
[0069] The processor 240, in operation 315, may block the execution
of compilation using the profile of the application, or delete the
artifact created by performing the compilation using the profile of
the application based on the identification that the remaining
capacity of the memory 220 is less than a specified ratio.
[0070] For example, if it is confirmed that the remaining capacity
of the memory 220 is between the first specified ratio (e.g., 8%)
and the second specified ratio (e.g., 5%) (or less than the first
specified ratio, but greater than the second specified ratio), the
processor 240 may block compilation using the profile of the
application. By blocking the execution of compilation using the
profile of the application, it is possible to prevent the artifact
from being generated.
[0071] As another example, if it is confirmed that the remaining
capacity of the memory 220 is between the second specified ratio
(e.g., 5%) and the third specified ratio (e.g., 1%) (or less than
the second specified ratio, but greater than the third specified
ratio), the processor 240 may delete the artifact generated by
performing compilation using the profile of the application. For
example, an artifact may be generated by performing an application
update; and, as the update is completed, a system package for
application update might not be used. The processor 240 may delete
artifacts generated by unused system packages as the update is
completed.
[0072] As another example, if it is confirmed that the remaining
capacity of the memory 220 is less than the third specified ratio
(e.g., 1%), the processor 240 may obtain a list of packages of
applications installed in the electronic device 201. The processor
240 may delete an artifact generated by performing compilation
using a profile of a package of an application that satisfies a
specified condition from the acquired list. For example, an
application that satisfies the specified condition may include an
application that has not been used for a specified period. This can
be determined based on whether an application icon exists, whether
an event related to the use of the application occurs, and whether
a function supported by the application is activated.
[0073] In connection with operation 315 of FIG. 3 described above
according to certain embodiments, certain embodiments will be
described with reference to FIG. 4 to be described later.
[0074] FIG. 4 is a flowchart 400 for explaining operation 315 of
FIG. 3, according to certain embodiments.
[0075] With reference to FIG. 4, in operation 405, the processor
(e.g., the processor 240 of FIG. 2) of the electronic device (e.g.,
the electronic device 201 of FIG. 2) may determine (e.g., identify)
whether the remaining capacity of the memory 220 is between the
first specified ratio and the second specified ratio (or less than
the first specified ratio, but greater than the second specified
ratio). According to certain embodiments, the first specified ratio
may be 8% of the total capacity of the memory 220 and the second
specified ration may be 5%. The foregoing is provided by way of
example, and not limitation.
[0076] If the remaining capacity of the memory 220 is between the
first specified ratio and the second specified ratio (e.g., YES in
operation 405), the processor 240 in operation 410, may identify
the profile for the method of the frequently used application. For
example, the processor 240 may identify a profile for a method of a
frequently used application through a background manager (e.g., the
background manager 243 of FIG. 2).
[0077] In an embodiment, the processor 240 may block in operation
415 compilation using a profile of a frequently used
application.
[0078] The operation of blocking compilation performance according
to certain embodiments may include an operation of blocking
compilation execution based on the updated profile. For example,
the background manager 243 of the processor 240 may compile
executable files (e.g., .dex files) in the package of the
application using a designated converter tool (e.g., dex2oat tool)
in the background based on a profile generated while the user uses
the electronic device 201. An artifact, for example, either or both
an .oat or .art file may be regenerated by compilation, and the
performance of the application may vary depending on either or both
the compiled method or class. For example, the background dex
optimization may create a new .oat and .art file that is optimized
when a condition specified in jobscheduler (e.g., charging, idle
state, or once a day) is satisfied. The processor 240, through
runtime, using a specified compilation method (e.g., ahead of time
(AOT) compilation) for the new profile, may create a native code
(e.g., either or both *.odex or *.oat) and an initialization image
(e.g. *.art) for application class information. In one embodiment,
the native code may represent compiled code for byte code, and it
may include compiled machine code.
[0079] In certain embodiments, the processor 240 may block
execution of compilation based on the profile of the application
that may be executed by the background manager 243 described above.
As the compilation using the profile of the above-described
application is blocked, an artifact by compilation may not be
generated. As an artifact by compiling is not generated, the
available space of the memory 220 may be secured.
[0080] The operation of blocking compilation may include an
operation of blocking compilation from being performed on a package
of a deleted application when the electronic device 201 is
rebooted. For example, the processor 240 may block compilation
based on a profile that may be performed through the background
manager 243 when the electronic device 201 is rebooted. By blocking
the execution of compilation using the profile of the application,
it is possible to prevent the artifact from being generated.
[0081] In certain embodiments, when installing an application, it
may be set so that an artifact can be generated by performing
compilation using the profile of the application up to a specified
capacity (e.g., 500 MB).
[0082] In one embodiment, if the remaining capacity of the memory
220 is not between the first specified ratio and the second
specified ratio (e.g., NO in operation 405), the processor 240, in
operation 420, may determine (e.g., identify) whether the remaining
capacity of the memory 220 is between the second specified ratio
and a third specified ratio (less than the second specified ratio,
but higher than the third specified ratio). According to certain
embodiments, the second specified ratio may be 5% and the third
specified ratio may be 1%. The foregoing are provided by way of
example and not limitation.
[0083] If the remaining capacity of the memory 220 is between the
second specified ratio and third specified ratio (e.g., YES in
operation 420), the processor 240 in operation 425, may identify
the path of the system package not used to perform the update. The
processor 240 may identify the set installation path (e.g.,
/data/dalvik-cache) of the updated system package through a package
manager (e.g., the package manager 245 of FIG. 2) in order to
delete an artifact generated based on the updated system
package.
[0084] In operation 430, the processor 240 may delete an artifact
generated through compilation of a system package located in the
confirmed path. For example, the processor 240 may delete artifacts
(e.g., either or both odex, vdex, or art) located in the
installation path (e.g., /data/dalvik-cache) confirmed through the
package manager 245.
[0085] As the update is completed, the system package for the
application update may not be used, and the available space of the
memory 220 may be secured by deleting the artifact generated by the
unused system package.
[0086] When the remaining capacity of the memory 220 is not between
the second specified ratio and the third specified ratio (e.g., NO
in operation 420), the processor 240 may determine (e.g., identify)
in operation 435 whether the remaining capacity of the memory 220
is less than the third specified ratio.
[0087] If the remaining capacity of the memory 220 is less than the
third specified ratio (e.g., YES in operation 435), the processor
240, in operation 440, may identify the package of at least one
application that is not in use for a specified period based on the
list of packages of applications installed in the electronic device
201.
[0088] The processor 240 may receive a list of packages of
applications installed in the electronic device 201 through the
package manager 245. The processor 240 may identify an application
that satisfies a specified condition from the list of packages of
applications. For example, an application that satisfies a
specified condition may include applications that have not been
used for a specified period of time (e.g. 32 days) based on whether
an application icon exists (e.g., an application executable icon
exists on either or both the home screen or menu screen), whether
an event related to the use of the application occurs, or whether
the application is set to a specific function.
[0089] When an application icon exists, the processor 240 may
identify whether an event related to the use of the application
occurs. For example, when occurrence of an event related to the use
of an application is detected through an activity manager (e.g.,
the activity manager 247 of FIG. 2), the processor 240 may record
the usage time of the application. The processor 240 may identify
the usage time of the application based on the recorded usage time
of the application.
[0090] When an application icon exists, the processor 240 may
identify whether the application is set to a specific function. For
example, the processor 240 registers an observer and, when an
application is set to a specific function, records it to identify
the usage time of the application. For example, when the
application is set as a mobile device management (MDM) function, an
accessibility service, or a default application, the processor 240
may determine that the application is set to a specific function.
When the application is set to either or both a wallpaper function
or a launcher function, the processor 240 may determine that the
application is set to a specific function.
[0091] In one embodiment, for example, when an event related to the
use of the application does not occur for a specified period and
the state in which the application is not set to a specific
function is maintained for the specified period, the processor 240
may determine the corresponding application as an unused
application.
[0092] When the application icon does not exist, the processor 240
may identify the last used time of the application component
recorded in the package manager 245. The processor 240 may
determine an application that is not used for a specified period
(e.g., 32 days) as an unused application based on the last used
time.
[0093] In connection with operation 440 of FIG. 4 described above
according to certain embodiments, certain embodiments will be
described with reference to FIG. 5 to be described later.
[0094] In operation 445, the processor 240 may identify information
on the package of at least one application that is not in use for a
specified period. The information on the package of the application
may include either or both an installation path of the package of
the application or information of an instruction set architecture
(e.g., 32-bit, 64-bit).
[0095] In operation 450, the processor 240 may delete generated
artifacts by performing compilation using a package of at least one
application that is not in use, based on information on the package
of at least one application that is not in use for a specified
period. For example, the processor 240 may delete artifacts (e.g.,
either or both odex, vdex, or art) located in the corresponding
path, based on the installation path of the application package and
information on the instruction set structure.
[0096] In certain embodiments, although not shown, the processor
240 may prevent the artifact of the package of the application
included in the block list from being deleted. For example, the
block list may be located in the system space and may include a
preload application.
[0097] In certain embodiments, although not shown, the processor
240 generates a list including applications that affect performance
when using the electronic device 201, and it may prevent the
artifact of the application package included in the list being
deleted.
[0098] In certain embodiments, based on the remaining capacity of
the memory 220, it is possible to systematically secure the
available space of the memory 220, for example, by performing an
operation of blocking execution of compilation using the profile of
the application or by performing an operation of deleting an
artifact generated through execution of compilation using the
profile of the application.
[0099] FIG. 5 is a flowchart 500 for explaining operation 440 of
FIG. 4, according to certain embodiments.
[0100] With reference to FIG. 5, in operation 505, a processor
(e.g., processor 240 of FIG. 2) of an electronic device (e.g.,
electronic device 201 of FIG. 2) may determine whether an
application icon exists. For example, the processor 240 may
identify whether the application icon exists on either or both the
home screen or menu screen of the electronic device 201.
[0101] If the application icon exists (e.g., YES in operation 505),
the processor 240 may identify the period that the application is
unused during operation 510.
[0102] For example, the processor 240 may identify whether an event
related to the use of the application occurs. For example, the
event related to the use of the application includes an application
execution event (e.g., an event that the application is executed
based on an input of selecting an application icon), a sharing
event using the application (e.g., based on an input of selecting a
share button shares content through an application), a pop-up
message event (for example, an event for outputting either or both
a notification or a message through a toast message), and an event
for installing a widget of the application. The processor 240 may
identify the unused period of the application based on whether an
event related to the use of the application occurs.
[0103] The processor 240 may identify whether the application is
set to a specific function. For example, when the application is
set as a mobile device management (MDM) function, an accessibility
service, or a default application, the processor 240 may determine
that the application is set to a specific function. When the
application is set to either or both a wallpaper function or a
launcher function, the processor 240 may determine that the
application is set to a specific function. The processor 240 may
identify the unused period of the application based on whether the
application is set to a specific function.
[0104] In operation 515, the processor 240 may identify whether the
unused period of the application exceeds a specified period (e.g.,
32 days). For example, the processor 240 may identify whether a
period in which an event related to the use of an application does
not occur exceeds a specified period, and whether a period in which
the application is not set as a specific function exceeds a
specified period.
[0105] When the unused period of the application exceeds the
specified period (e.g., YES in operation 515), the processor 240
may add the application to the list of artifacts to be deleted in
operation 520. For example, the processor 240 adds an application
that is not in use for a specified period to the list to delete an
artifact; and, based on information on the package of at least one
application that is not in use for the specified period of
operations 445 and 450 of FIG. 4 described above, it may delete an
artifact generated by performing compilation using at least one
application package that is not in use.
[0106] When the unused period of the application does not exceed
the specified period (e.g., NO in operation 515), the processor 240
may perform operation 510 for identifying the unused period of the
application. The disclosure is not limited to such an embodiment.
For example, when the unused period of the application does not
exceed the specified period (e.g., NO in operation 515), the
processor 240 may end the process.
[0107] If the application icon does not exist (e.g., NO in
operation 505), the processor 240 may identify, in operation 525,
the time when the application components constituting the package
of the application were last used. For example, in the case of an
application that does not have an icon, it may be executed by
another application or may be executed implicitly when using a
specific function. In this case, the processor 240 may identify the
last used time of the application component (e.g., building blocks
constituting the package) recorded in the package manager (e.g.,
the package manager 245 of FIG. 2).
[0108] In an embodiment, in operation 530, the processor 240 may
identify an unused period of the application component based on the
last time the application component was used. In operation 535, the
processor 240 may identify whether the unused period of the
application component exceeds a specified period.
[0109] In an embodiment, when the unused period of the application
component exceeds the specified period (e.g., YES in operation
535), the processor 240 may add the application to the list of
artifacts to be deleted in operation 520.
[0110] In an embodiment, when the unused period of the application
component does not exceed the specified period (e.g., NO in
operation 535), the processor 240 may perform operation 530 to
identify the unused period of the application component based on
the usage time of the application component. The disclosure is not
limited to such an embodiment. For example, the unused period of
the application component does not exceed the specified period
(e.g., NO in operation 535), the processor 240 may end the
process.
[0111] FIG. 6 is a flowchart 600 for explaining a method of
managing the memory 220 based on the remaining capacity of the
memory 220, according to certain embodiments.
[0112] Operations of FIG. 6 according to certain embodiments may be
additional operations of operation 450 of FIG. 4 described
above.
[0113] With reference to FIG. 6, in operation 605, the processor
(e.g., the processor 240 of FIG. 2) of the electronic device (e.g.,
the electronic device 201 of FIG. 2) identifies (e.g., checks) the
remaining capacity of a memory (e.g., the memory 220 of FIG.2);
and, in operation 610, it may identify (e.g., determine) whether
the remaining capacity of the memory 220 is greater than or equal
to a specified ratio.
[0114] In certain embodiments, as shown in FIG. 3, the specified
ratio may include a ratio of available capacity among the total
capacity of the memory 220. The specified ratio may include a
plurality of specified ratios, such as a first specified ratio
(e.g., 8%), a second specified ratio (e.g., 5%), and a third
specified ratio (e.g., 1%). The foregoing are provided by way of
example, and not limitation.
[0115] In one embodiment, the processor 240, in operation 615,
based on the identification that the remaining capacity of the
memory 220 is greater than or equal to a specified ratio, may
restore the deleted artifact by compiling the package from which
the artifact was deleted, or by recompiling using the application
profile.
[0116] For example, if the remaining capacity of the memory 220 is
identified to be greater than or equal to the third specified
ratio, the processor 240 may compile the package from which the
artifact is deleted. The artifact of a compiled package can be
generated. In certain embodiments, when the remaining capacity of
the memory 220 is secured to be greater than or equal to the third
specified ratio, it is supported to immediately compile the package
from which the artifact has been deleted, and result of performance
degradation in using the application may be avoided.
[0117] As another example, if the remaining capacity of the memory
220 is confirmed to be greater than or equal to the second
specified ratio, the processor 240 may restore the deleted artifact
through recompilation using the profile of the application. For
example, the processor 240 may perform recompilation based on the
Java code file and the profile of the application. The processor
240 may restore the deleted artifact by performing recompilation.
In this case, the processor 240 may restore the application usage
point.
[0118] In certain embodiments, when the profile of the application
does not exist, the processor 240 may restore the application to
the point in time when the application is installed using a Java
code file.
[0119] In another embodiment, when the remaining capacity of the
memory 220 is confirmed to be greater than or equal to the third
specified ratio, the processor 240 may compile, based on the Java
code file, to restore only the basic function of the application.
If it is confirmed that the remaining capacity of the memory 220 is
greater than or equal to the second specified ratio greater than
the third specified ratio, the processor 240 may compile based on
the profile of the application and restore the application to the
point of use.
[0120] In certain embodiments, when the remaining capacity of the
memory 220 is secured at a specified ratio or more, the processor
240 performs an operation for restoring the differentially deleted
product. For example, the performance degradation of the
application may be prevented by compiling the package from which
the artifact is deleted or by performing recompilation using the
profile of the application.
[0121] The electronic device according to certain embodiments may
be one of various types of electronic devices. The electronic
devices may include, for example, a portable communication device
(e.g., a smartphone), a computer device, a portable multimedia
device, a portable medical device, a camera, a wearable device, or
a home appliance. According to an embodiment of the disclosure, the
electronic devices are not limited to those described above.
[0122] It should be appreciated that certain embodiments of the
disclosure and the terms used therein are not intended to limit the
technological features set forth herein to particular embodiments
and include various changes, equivalents, or replacements for a
corresponding embodiment. With regard to the description of the
drawings, similar reference numerals may be used to refer to
similar or related elements. It is to be understood that a singular
form of a noun corresponding to an item may include one or more of
the things, unless the relevant context clearly indicates
otherwise. As used herein, each of such phrases as "A or B," "at
least one of A and B," "at least one of A or B," "A, B, or C," "at
least one of A, B, and C," and "at least one of A, B, or C," may
include any one of, or all possible combinations of the items
enumerated together in a corresponding one of the phrases. As used
herein, such terms as "1st" and "2nd," or "first" and "second" may
be used to simply distinguish a corresponding component from
another, and does not limit the components in other aspect (e.g.,
importance or order). It is to be understood that if an element
(e.g., a first element) is referred to, with or without the term
"operatively" or "communicatively," as "coupled with," "coupled
to," "connected with," or "connected to" another element (e.g., a
second element), it means that the element may be coupled with the
other element directly (e.g., through wires), wirelessly, or via a
third element.
[0123] As used in connection with certain embodiments of the
disclosure, the term "module" may include a unit implemented in
hardware, software, or firmware, and may interchangeably be used
with other terms, for example, "logic," "logic block," "part," or
"circuitry." A module may be a single integral component, or a
minimum unit or part thereof, adapted to perform one or more
functions. For example, according to an embodiment, the module may
be implemented in a form of an application-specific integrated
circuit (ASIC).
[0124] Various embodiments as set forth herein may be implemented
as software (e.g., the program 140) including one or more
instructions that are stored in a storage medium (e.g., internal
memory 136 or external memory 138) that is readable by a machine
(e.g., the electronic device 101). For example, a processor (e.g.,
the processor 120) of the machine (e.g., the electronic device 101)
may invoke at least one of the one or more instructions stored in
the storage medium, and execute it, with or without using one or
more other components under the control of the processor. This
allows the machine to be operated to perform at least one function
according to the at least one instruction invoked. The one or more
instructions may include a code generated by a complier or a code
executable by an interpreter. The machine-readable storage medium
may be provided in the form of a non-transitory storage medium.
Wherein, the term "non-transitory" simply means that the storage
medium is a tangible device, and does not include a signal (e.g.,
an electromagnetic wave), but this term does not differentiate
between where data is semi-permanently stored in the storage medium
and where the data is temporarily stored in the storage medium.
[0125] According to an embodiment, a method according to certain
embodiments of the disclosure may be included and provided in a
computer program product. The computer program product may be
traded as a product between a seller and a buyer. The computer
program product may be distributed in the form of a
machine-readable storage medium (e.g., compact disc read only
memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)
online via an application store (e.g., PlayStore.TM.), or between
two user devices (e.g., smart phones) directly. If distributed
online, at least part of the computer program product may be
temporarily generated or at least temporarily stored in the
machine-readable storage medium, such as memory of the
manufacturer's server, a server of the application store, or a
relay server.
[0126] According to certain embodiments, each component (e.g., a
module or a program) of the above-described components may include
a single entity or multiple entities, and some of the multiple
entities may be separately disposed in different components.
According to certain embodiments, one or more of the
above-described components may be omitted, or one or more other
components may be added. Alternatively or additionally, a plurality
of components (e.g., modules or programs) may be integrated into a
single component. In such a case, according to certain embodiments,
the integrated component may still perform one or more functions of
each of the plurality of components in the same or similar manner
as they are performed by a corresponding one of the plurality of
components before the integration.
[0127] According to certain embodiments, operations performed by
the module, the program, or another component may be carried out
sequentially, in parallel, repeatedly, or heuristically, or one or
more of the operations may be executed in a different order or
omitted, or one or more other operations may be added.
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