U.S. patent application number 17/504184 was filed with the patent office on 2022-07-07 for unsaturated polyester resin system for cured in-place piping.
The applicant listed for this patent is Interplastic Corporation. Invention is credited to Benjamin R. Hazen, David J. Herzog, Louis R. Ross, Joel R. Weber.
Application Number | 20220213294 17/504184 |
Document ID | / |
Family ID | |
Filed Date | 2022-07-07 |
United States Patent
Application |
20220213294 |
Kind Code |
A1 |
Hazen; Benjamin R. ; et
al. |
July 7, 2022 |
UNSATURATED POLYESTER RESIN SYSTEM FOR CURED IN-PLACE PIPING
Abstract
A process to use an unsaturated polyester resin system
comprising preparing a curable cumene-quat curing system. The
cumene-quat curing system can comprise an unsaturated polyester
resin, a peroxide initiator, a quaternary ammonium salt component,
a 2,4-pentanedione component, and an inhibitor component. The
peroxide initiator can comprise a cumene hydroperoxide component.
The process can further comprise applying the curable cumene-quat
curing system in a cured-in-place pipe rehabilitation process.
Inventors: |
Hazen; Benjamin R.;
(Roseville, MN) ; Herzog; David J.; (Maple Grove,
MN) ; Ross; Louis R.; (Cincinnati, OH) ;
Weber; Joel R.; (Moundsview, MN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Interplastic Corporation |
St. Paul |
MN |
US |
|
|
Appl. No.: |
17/504184 |
Filed: |
October 18, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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16163139 |
Oct 17, 2018 |
11180632 |
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17504184 |
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15850486 |
Dec 21, 2017 |
10131766 |
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16163139 |
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62489318 |
Apr 24, 2017 |
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International
Class: |
C08K 5/3415 20060101
C08K005/3415; C08K 5/07 20060101 C08K005/07; C08K 3/36 20060101
C08K003/36; C08K 5/098 20060101 C08K005/098; C08K 3/08 20060101
C08K003/08; C08K 5/14 20060101 C08K005/14; C08K 5/19 20060101
C08K005/19 |
Claims
1-20. (canceled)
21. A process comprising: preparing a curable cumene-quat curing
system, wherein the cumene-quat curing system comprises an
unsaturated polyester resin, a liquid initiator, and an inhibitor
component, and wherein the curable cumene-quat curing system has a
pot-life of greater than about 18 hours around 25.degree. C.;
applying the curable cumene-quat curing system to a cured-in-place
pipe; curing the cured-in-place pipe in a cured-in-place pipe
rehabilitation process.
22. The process according to claim 21, further comprising storing
the prepared curable cumene-quat curing system at 25.degree. C. for
greater than 24 hours before applying the curable cumene-quat
curing system to a cured-in-place pipe.
23. The process according to claim 21, further comprising storing
the prepared curable cumene-quat curing system for two weeks in a
refrigerated area before applying the curable cumene-quat curing
system to a cured-in-place pipe.
24. The process according to claim 21, wherein the liquid initiator
comprises a cumene hydroperoxide component.
25. The process according to claim 21, wherein the curable
cumene-quat curing system further comprises a 2,4-pentanedione
component
26. The process according to claim 25, wherein the 2,4-pentanedione
component comprises more than 2500 ppm of the curable cumene-quat
curing system.
27. The process according to claim 21, wherein the inhibitor
component comprises a 4-hydroxy-TEMPO solution.
28. The process according to claim 27, wherein the 4-hydroxy-TEMPO
solution comprises more than 1000 ppm of the curable cumene-quat
curing system.
29. The process according to claim 22, wherein the inhibitor
component comprises more than 1000 ppm of the curable cumene-quat
curing system.
30. The process of claim 21, wherein the curable cumene-quat curing
system further comprises a metal.
31. The process of claim 21, wherein the liquid initiator comprises
a single component.
32. The process of claim 21, wherein the cured-in-place pipe is
cured at 140 F in less than 15 minutes.
33. A process comprising: preparing a resin curing system, wherein
the resin curing system comprises a resin, a liquid initiator, and
an inhibitor component and wherein the resin curing system has a
pot-life of greater than about 18 hours around 25.degree. C.;
applying the resin curing system in a cured-in-place pipe; curing
the cured-in-place pipe in a cured-in-place pipe rehabilitation
process.
34. The process according to claim 33, further comprising storing
the prepared curable cumene-quat curing system at 25.degree. C. for
greater than 24 hours before applying the curable cumene-quat
curing system to a cured-in-place pipe.
35. The process according to claim 33, further comprising storing
the prepared curable cumene-quat curing system for two weeks in a
refrigerated area before applying the curable cumene-quat curing
system to a cured-in-place pipe.
36. The process according to claim 33, wherein the liquid initiator
comprises a cumene hydroperoxide component.
37. The process according to claim 33, wherein the inhibitor
component comprises a 4-hydroxy-TEMPO solution.
38. The process according to claim 37, wherein the 4-hydroxy-TEMPO
solution comprises more than 1000 ppm of the curable cumene-quat
curing system.
39. The process of claim 33, wherein the curable cumene-quat curing
system further comprises a metal.
40. The process of claim 33, wherein the cured-in-place pipe is
cured at 140 F in less than 15 minutes.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser.
No. 16/163,139, filed 17 Oct. 2018 (the '139 application), which is
a continuation of U.S. application Ser. No. 15/850,486, filed 21
Dec. 2017 (the '486 application), which claims the benefit of U.S.
application No. 62/489,318, filed 24 Apr. 2017 (the '318
application). The '139 application, the '486 application and the
'318 application are both hereby incorporated by reference as
though fully set forth herein.
FIELD
[0002] Embodiments of the present disclosure generally relate to a
system, method, and apparatus for using an unsaturated polyester
resin system with cured in-place piping to repair conduits or
pipelines.
BACKGROUND
[0003] Conduits or pipelines, particularly underground pipes, such
as sewer pipes, water lines and gas lines are employed for
conducting fluids and frequently require repair due to fluid
leakage. The leakage from the conduits or pipelines can move in to
the pipe from the environment. Also, the leakage can move outward
from the inner portion of the pipe to the surrounding environment.
It is desirable to avoid leakage in either case.
[0004] Pipe leakage can occur for a variety of reasons. In one
instance, the pipe leakage can occur due to improper installation
of the original pipe. In another instance, the pipe leakage can
occur due to deterioration of the pipe itself as a result of normal
aging or the effects of conveying corrosive or abrasive material
through the pipeline. Further, cracks can be caused at or near pipe
joints from environmental conditions. These environmental
conditions can include situations ranging from earthquakes to the
movement of large vehicles on the overhead surface or other natural
or manmade vibrations. Leaks from conduits or pipelines as
described above are undesirable and can result in waste of the
fluid being conveyed within the pipeline, or result in damage to
areas surrounding the pipeline including possible dangerous health
hazards. If the pipeline continues to leak and is not repaired,
structural failure of the existing conduit can occur due to soil
loss and support of the conduit.
BRIEF SUMMARY
[0005] The present disclosure relates to a system and method for
the lining of pipelines or passageways, using flexible tubular
materials. In particular, the instant disclosure relates to a
system and method using flexible tubular materials which are
impregnated with a curable unsaturated polyester resin system.
[0006] In one embodiment, a process to use an unsaturated polyester
resin system comprising preparing a curable cumene-quat curing
system can comprise an unsaturated polyester resin, a peroxide
initiator, a quaternary ammonium salt component, a 2,4-pentanedione
component, and an inhibitor component. The peroxide initiator can
comprise a cumene hydroperoxide component. The process can further
comprise applying the curable cumene-quat curing system in a
cured-in-place pipe rehabilitation process.
[0007] In another embodiment, a process can comprise preparing a
curable cumene-quat curing system. The cumene-quat curing system
can comprise a resin, a peroxide initiator, a quaternary ammonium
salt component, a 2,4-pentanedione component, and an inhibitor
component. The process can further comprise applying the curable
cumene-quat curing system in a cured-in-place pipe rehabilitation
process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 depicts a diagram of the CIPP process.
[0009] FIG. 2 depicts a graph of the cure properties of one
embodiment of an unsaturated polyester resin system with varying
levels of 4-hydroxy TEMPO.
[0010] FIG. 3 depicts a graph of the temperature time curves of one
embodiment of an unsaturated polyester resin system with varying
levels of 4-hydroxy TEMPO.
DETAILED DESCRIPTION
[0011] In one embodiment, this disclosure relates to the lining of
pipelines or passageways, using flexible tubular materials which
are impregnated with a curable unsaturated polyester resin system
which can be placed in a position lining the pipeline or passageway
and can be held by fluid pressure against the pipeline or
passageway surface until the unsaturated polyester resin system
cures to a hard condition leaving a hard lining on the interior of
the pipeline or passageway surface. In other embodiments, the
unsaturated polyester resin system can be used in other methods or
processes using curable resins. This process is known to one of
ordinary skill in the art as Cured In-Place Piping (CIPP). A subset
of the unsaturated polyester resin can comprise a vinyl ester
resin.
[0012] Pot-life is the time it takes for a viscosity of a mixed
system to increase by a pre-set number. In many cases the pot-life
is the amount of time it takes for the viscosity to double.
However, in other cases, where the viscosity of the mixed system is
very low, the pot-life can be used to state the amount of time it
takes for the mixed system to triple, quadruple, or more in
viscosity. In one embodiment, the pot-life comprises the amount of
time it takes for the viscosity to double. In other embodiments,
the pot-life comprises the amount of time it takes for the
viscosity to triple, quadruple, or otherwise increase in viscosity.
Further, a working time is the amount of time from the point when
component A and component B are mixed together to the point when
the resulting formulation is no longer usable. Pot-life or an end
of a pot-life is often defined as the point at which the viscosity
increases significantly due to the reaction between component A and
component B. The high viscosity will make it difficult to
successfully complete the CIPP process.
[0013] One method of using an unsaturated polyester resin system as
described herein is to impregnate linings as is disclosed in
British Patent No. 1449455, filed 8 Dec. 1972, and issued 15 Sep.
1976, which is hereby incorporated by reference as though fully set
forth herein. The impregnated lining can be applied to the pipeline
or passageway surface by eversion of same into the pipeline or
passageway, using fluid pressure. In various embodiments, the fluid
pressure can comprise a heated steam or liquid. In other
embodiments, other heated fluids can be used in the curing
process.
[0014] FIG. 1 illustrates one method of installing cured in place
piping. FIG. 1 depicts a truck 101, a winch 103, a first access
shaft 105, a second access shaft 107, a pull wire 109, a previously
installed pipe 111, and a CIPP liner 113. The CIPP liner 113 can be
stored within the truck 101. In some embodiments, the truck 101 can
be refrigerated. By storing the CIPP liner 113 in a truck 101 that
can refrigerate the CIPP liner 113, the pot-life of the CIPP liner
113 can be increased. The pull wire 109 can be coupled to the winch
103 and to the CIPP liner 113. The winch 103 can be used to tension
the pull wire 109 and to pull one end of the CIPP liner 113 from
the truck 101 through the first access shaft 105, and through the
previously installed pipe 111.
[0015] In previous resins used in the processes described herein,
and those used commercially today, a cold storage initiator system
can be required. For example, the initiator can comprise a peroxide
that requires cold storage. An initiator that requires cold storage
can comprise an organic peroxide. The organic peroxide can comprise
bis(tert-butylcyclohexyl) peroxydicarbonate (aka
di(4-tert-butylcyclohexyl) peroxydicarbonate AkzoNobel's "Perkadox
16" and United Initiator's "BCHPC") and dimyristyl
peroxydicarbonate (akzo's "Perkadox 26" and UI's "MYPC"). Perk 16
is the least stable and has caused several shop fires due to
inadequate refrigeration or from aged dispersions which were not
added to the resin in time The initiators require cold storage to
minimize hazard risks and for the initiator to maintain full
effectiveness for a desired period of time. Further, the most
commonly used initiators are heat activated initiators and are
solid materials. The solid initiators must be put into solution
immediately before use. The process of adding the initiator in this
manner can be a messy and potentially hazardous process. Further, a
second initiator, which is usually a liquid initiator, must be
added to the process. In other embodiments three initiators, four
initiators, or more can be used. As regulations on shipping and
storage of initiators used during the processes described herein
increase, a new formulation of a curable resin can offer
significant advantages. The unsaturated polyester resin system
described herein comprises several distinct advantages over those
currently in use. In one embodiment, the unsaturated polyester
resin system can comprise a single component, liquid initiator. In
another embodiment, the unsaturated polyester resin system can
comprise a single component, solid initiator. The unsaturated
polyester resin system can further comprise an initiator that does
not require cold storage and that can be less expensive than
initiators currently used. The initiator of the disclosure herein
is also readily available in more markets throughout the world and
can be shipped without worries of fire or other potentially
dangerous incidents as can currently be the case. In one
embodiment, when kept refrigerated, the catalyzed unsaturated
polyester resin system comprises a pot-life that is similar or
substantially similar to those present within the market. In one
embodiment, the unsaturated polyester resin system described herein
can minimize the risk of hot spots in a CIPP liner while the CIPP
liner is curing. In some embodiments, hot spots can be due to
peroxide-rich regions within the wet out liner due to inadequately
dissolved solid peroxide/catalyst. Further, in one embodiment, the
unsaturated polyester resin system used in the CIPP process
described herein can exhibit the same mechanical and corrosion
resistant properties in the cured product as is found in the
currently used commercial systems. In one embodiment, another
advantage of the unsaturated polyester resin system described
herein is that the cost of the resin is the same or lower than
resin systems traditionally used and the requirements for storing
the initiator used in the unsaturated polyester resin system is
less cumbersome and onerous than initiators that are traditionally
used. Further still, in one embodiment, the disclosed unsaturated
polyester resin system can exhibit a lower cure exotherm than those
found in resin systems that are traditionally used in the CIPP
process.
[0016] In other embodiments, the unsaturated polyester resin system
can comprise an initiator with more than one component, or at least
one or more of the components can comprise a non-liquid
portion.
[0017] The formulations described herein can offer a lower cost and
safer system. The unsaturated polyester resin systems described
herein can be cured with steam, hot water, or through other
processes as would be known to one of ordinary skill in the art.
Further, the unsaturated polyester resin systems described herein
will cure a CIPP liner wet out with polyester or vinyl ester resin
yet still maintain sufficient pot-life. The current industry
standard uses "low temperature" peroxides such as Perkadox 16 or
Perkadox 26. Both of these low temperature peroxides can be more
expensive than the peroxides described herein, and further require
sub-ambient storage temperatures. Perkadox 16 or Perkadox 26 are
both solid, which require a predispersion process to be performed
in a diluent and further incorporation into the resin. If the
dispersed peroxide/reactive diluent mixture is stored for too long,
which can be as little as a 2-3 hours, fires can be started by the
dispersed peroxide/reactive diluent mixture. Further, if the
refrigerated storage were to fail or otherwise stop, the dispersed
peroxide/diluent mixture can self-combust and start a fire. Further
still, the peroxide itself can self-combust.
[0018] The unsaturated polyester resin systems described herein can
comprise a variety of compounds. In some embodiments, the
unsaturated polyester resin system can comprise a Cumene-quat
curing system for polyester and vinyl ester resins. The cumene-quat
curing system can comprise a redox catalyzed peroxide decomposition
which can initiate free radical polymerization. Similar chemistry
is further described in U.S. Pat. Nos. 2,740,765, 2,946,770, and
3,080,351. In one embodiment, the Cumene-quat curing system can
comprise cumene hydroperoxide, CHP, and quaternary ammonium salts.
In this embodiment, the CHP can act as a peroxide initiator for the
unsaturated polyester resin system. In another embodiment,
tert-butyl hydroperoxide can be used. In yet other embodiments, the
peroxide initiator can comprise other compounds as would be known
to one of ordinary skill in the art. The Cumene-quat curing system
can further comprise 2,4-pentanedione and a high level of
inhibitors. In some embodiments, the 2,4-pentanedione can be used
at high levels. In one embodiment the 2,4-pentanedione can be used
in a range of 1000-6000 ppm. In another embodiment, the
2,4-pentanedione can be used in a range of 3000-5000 ppm. In yet
another embodiment, the 2,4-pentanedione can be used in a range of
3500-4000 ppm. In yet another embodiment, the 2,4-pentanedione can
comprise more than 3500 ppm of the cumene-quat curing system. In
yet other embodiments, other ranges or concentrations can be used.
In other embodiments, the Cumene-quat curing system can comprise
dimethyl acetoacetamide, ethyl acetoacetate, methyl acetoacetate,
and/or AAA. Further, any other compounds can be used which have
similar diketone-forming-enol functionality. Similar chemistry is
further described in U.S. Pat. No. 3,584,076. In another
embodiment, the inhibitor can comprise a level of over 1000 ppm in
the unsaturated polyester resin. In some embodiments, the inhibitor
can comprise 4-hydroxy TEMPO and/or Arkema's BlocBuilder type
inhibitors. In other embodiments, traditional inhibitors used in
the art such as hydroquinione, para-benzoquinone, and
tert-butylcatechol can be used. Additionally, further inhibitors
would be known to one of ordinary skill in the art. In one
embodiment, the inhibitor can comprise more than 500 ppm. In
another embodiment, the inhibitor can comprise more than 750 ppm.
In yet another embodiment, the inhibitor can comprise more than
1000 ppm. In yet another embodiment, the inhibitor can comprise
between 1000 and 4000 ppm. In yet other embodiments, the inhibitor
can comprise more than 4000 ppm. In some embodiments, the inhibitor
can comprise a Nitroxide. In yet other embodiments, the inhibitor
can comprise other similar components as would be known to one of
ordinary skill in the art. In yet another embodiment, the
cumene-quat curing system can further comprise a metal. In some
embodiments this metal can comprise copper and/or zinc. In another
embodiment, the metal can comprise iron. In other embodiments, the
cumene-quat curing system can comprise other metals as would be
known to one of ordinary skill in the art. In various embodiments,
the cumene-quat curing system can comprise one or more different
metals in varying concentrations as described herein.
[0019] An unsaturated polyester resin system as described herein
can have a pot-life of over 24 hours at 77.degree. F. Further, the
unsaturated polyester resin system can have a pot-life of several
weeks when stored in refrigerated area.
[0020] Table 1 illustrates the cure properties of an unsaturated
polyester resin at 140 F with different concentrations of 4-hydroxy
TEMPO to determine the effects on gel and cure characteristics. The
unsaturated polyester resin is combined with CHP and at least one
quaternary ammonium salt. The composition comprises an unsaturated
polyester resin at 140 F with 500 ppm benzyltrimethylammonium
(BTMAC), 500 ppm tetrabutyl ammonium bromide (TBABr), and 1% CHP
(K-90) and the ppm of 4-hydroxy TEMPO (4-HT) listed. In another
embodiment, the composition can further comprise 40 ppm copper
naphthenate.
TABLE-US-00001 TABLE 1 Cure Properties of unsaturated polyester
resin with 4-HT concentration varied. The cure system was at 140
F., 500 ppm BTMAC, 500 ppm TBABr, and 1% CHP (K-90). 4HT Gel Peak
Gel to Cure Pot-life ppm Times Exo Peak Times (hrs) 1000 1.5 374
1.72 3.41 <24 1100 1.94 363.2 1.03 4.07 <24 2000 4.54 371.29
1.47 6.78 <24 2500 5.23 359.5 2.68 7.91 <24 3000 9.06 363.4
3.08 12.15 24 3100 12.83 351.1 3.93 16.74 >24 3200 14.88 338.2
3.93 18.81 >24 3500 18.33 329.3 4.41 22.74 >48
[0021] While the above table shows benzyltrimethylammonium and
tetrabutyl ammonium bromide used in the polyester resin system,
other quaternary ammonium salts can be used. Other quaternary
ammonium salts can comprise one or more of Acetylcarnitine,
Acetylcholine, Aclidinium bromide, Acriflavine, Agelasine, Aliquat
336, Ambenonium chloride, Ambutonium bromide, Aminosteroid,
ANNINE-6plus, Atracurium besilate, Benzalkonium chloride,
Benzethonium chloride, Benzilone, Benzododecinium bromide,
Benzoxonium chloride, Benzyltrimethylammonium fluoride,
Benzyltrimethylammonium hydroxide, Bephenium hydroxynaphthoate,
Berberine, Betaine, Bethanechol, Bevonium, Bibenzonium bromide,
Bis-choline tetrathiomolybdate, Bretylium, Bufothionine, Burgess
reagent, Butyrylcholine, Califomidine, Candicine, Candocuronium
iodide, Carbachol, Carbethopendecinium bromide, Carnitine,
Cefluprenam, Cetalkonium chloride, Cetrimonium, Cetrimonium
bromide, Cetrimonium chloride, Cetylpyridinium chloride,
Chelerythrine, Chlorisondamine, Chlormequat, Choline, Choline
chloride, Cimetropium bromide, Cisatracurium besilate, Citicoline,
Clidinium bromide, Clofilium, Cocamidopropyl betaine,
Cocamidopropyl hydroxysultaine, Complanine, Coptisine, Cyanine,
Cyclobis(paraquat-p-phenylene), Decamethonium, 3-Dehydrocarnitine,
Demecarium bromide, Denatonium, Dequalinium,
Didecyldimethylammonium chloride, Dihydrochandonium,
Dimethyldioctadecylammonium chloride, Dimethylphenylpiperazinium,
Dimethyltubocurarinium chloride, DiOC6, Diphemanil metilsulfate,
Diphthamide, Diquat, Distigmine, Dithiazanine iodide, Domiphen
bromide, Doxacurium chloride, Echothiophate, Edelfosine,
Edrophonium, Emepronium bromide, Ethidium bromide, Ethyl Green,
Euflavine, Fenpiverinium, Fentonium, Fluorocholine, Gallamine
triethiodide, Gantacurium chloride, GelGreen, GelRed, Glycine
betaine aldehyde, Glycopyrronium bromide, Guar
hydroxypropyltrimonium chloride, Hemicholinium-3, Hexafluronium
bromide, Hexamethonium, Hexocyclium, Hydroxyethylpromethazine,
Hyoscine butylbromide, Indacaterol/glycopyrronium bromide,
Ipratropium bromide, Isometamidium chloride, Isopropamide,
Jatrorrhizine, Laudexium metilsulfate, Lucigenin, Meldonium,
Mepenzolate, Methacholine, Methantheline, Methiodide,
Methylatropine, Methylhomatropine, Methylnaltrexone,
Methylscopolamine bromide, Metocurine, Miltefosine, Morphine
methylbromide, Muscarine, Neurine, Obidoxime, Octatropine
methylbromide, Octenidine dihydrochloride, Otilonium bromide,
Oxapium iodide, Oxitropium bromide, Oxyphenonium bromide,
Pahutoxin, Palmatine, Pancuronium bromide, Pararosaniline,
Pentamine, Penthienate, Pentolinium, Perifosine, Phellodendrine,
Phosphocholine, Pinaverium, Pipecuronium bromide, Pipenzolate
bromide, Poldine, PolyDADMAC, Polyquaternium, Polyquaternium-7,
Pralidoxime, Prifinium bromide, Propantheline bromide, Prospidium
chloride, Pyridostigmine, Pyrvinium, Quatemium-15, Quinapyramine,
Rapacuronium, Rhodamine B, Rimazolium, Rocuronium bromide,
Safranin, Sanguinarine, Silane quats, Sinapine, Stearalkonium
chloride, Succinylmonocholine, Suxamethonium chloride, Suxethonium
chloride, Tetra-n-butylammonium bromide, Tetra-n-butylammonium
fluoride, Tetrabutylammonium, Tetrabutylammonium
hexafluorophosphate, Tetrabutylammonium hydroxide,
Tetrabutylammonium tribromide, Tetraethylammonium,
Tetraethylammonium bromide, Tetraethylammonium chloride,
Tetraethylammonium iodide, Tetramethylammonium, Tetramethylammonium
chloride, Tetramethylammonium hydroxide, Tetramethylammonium
pentafluoroxenate, Tetraoctylammonium bromide, Tetrapropylammonium
perruthenate, Thiazinamium metilsulfate, Thioflavin, Thonzonium
bromide, Tibezonium iodide, Tiemonium iodide, Timepidium bromide,
Trazium, Tridihexethyl, Triethylcholine, Trigonelline, Trimethyl
ammonium compounds, Trimethylglycine, Trolamine salicylate,
Trospium chloride, Tubocurarine chloride, Umeclidinium bromide, and
Vecuronium bromide. Further, similar chemistry can occur with
phosphonium salts or other onium salts.
[0022] FIG. 2 illustrates a graph of the cure properties of one
embodiment of an unsaturated polyester resin system with varying
levels of 4-hydroxy TEMPO. The graph illustrates the time for
different concentrations to reach peak exo 201, the time for
different concentrations to gel 203, the time for different
concentrations to cure 205, and the time for different
concentrations to gel to peak 207. As seen in FIG. 2, the peak exo
line 201 follows a linear progression, the gel time line 203
follows an exponential progression, the cure time line 205 follows
an exponential progression, and the gel to peak line 207 follows a
linear progression.
[0023] FIG. 3 illustrates a graph of the temperature time curves of
one embodiment of an unsaturated polyester resin system with
varying levels of 4-hydroxy TEMPO. The graph illustrates the cure
profile for 1000 ppm 4-hydroxy TEMPO 301, 1100 ppm 4-hydroxy TEMPO
303, 2000 ppm 4-hydroxy TEMPO 305, 2500 ppm 4-hydroxy TEMPO 307,
3000 ppm 4-hydroxy TEMPO 309, 3100 ppm 4-hydroxy TEMPO 311, 3200
ppm 4-hydroxy TEMPO 313, and 3500 ppm 4-hydroxy TEMPO 315. As seen
in FIG. 3, the curing profile of the unsaturated polyester resin
system can be changed based on the concentration of 4-hydroxy TEMPO
used within the resin. In general, the gel time lengthens as the
concentration of 4-hydroxy TEMPO increases. Further, there is some
decrease in exotherm temperatures as well, and the gel to peak time
also increases with increasing concentrations of 4-hydroxy TEMPO.
As shown in FIGS. 2 and 3, quaternary ammonium salts in combination
with CHP can gel and cure at 140 F in less than 15 minutes, with
exotherms reasonably high, and stability greater than 24 hours.
[0024] While the composition used in table 1 comprises two
quaternary ammonium salts, one or more quaternary ammonium salts
can be used. Further, while benzyltrimethylammonium chloride and
tetrabutyl ammonium bromide are used above, other quaternary
ammonium salts can be used. In some embodiments a single quaternary
ammonium salt can be used. In other embodiments, a plurality of
quaternary ammonium salts can be used.
EXAMPLES
Example 1
[0025] An unsaturated polyester resin system (Example 1)
comprising
TABLE-US-00002 Product Weight % UNSATURATED POLYESTER RESIN 62.407
GLYCERINE 0.075 TWEEN 20 TYPE SURFACTANT 0.075 CAB-O-SIL 1.3 AIR
RELEASE ADDITIVE 0.3 STYRENE 7.7085 ATH, SURFACE MODIFIED 25.8 10%
TERTIARY BUTYL CATECHOL IN STYRENE 0.85 QUATERNARY AMMONIUM
COMPOUND 0.35 2,4-PENTANEDIONE 0.4 8% COPPER NAPHTHENATE 0.0045
ZINC OCTOATE 8% 0.03 10% 4-HYDROXY-TEMPO IN STYRENE 0.7
Example 2
[0026] An unsaturated polyester resin system (Example 2)
comprising
TABLE-US-00003 Product Weight % UNSATURATED POLYESTER RESIN 62.407
GLYCERINE 0.075 TWEEN 20 TYPE SURFACTANT 0.075 CAB-O-SIL 1.3 AIR
RELEASE ADDITIVE 0.3 STYRENE 7.5894 ATH, SURFACE MODIFIED 25.8 10%
TERTIARY BUTYL CATECHOL IN STYRENE 0.6 QUATERNARY AMMONIUM COMPOUND
0.4 2,4-PENTANEDIONE 0.4 8% COPPER NAPHTHENATE 0.0036 ZINC OCTOATE
8% 0.05 BlocBuilder RC-50 1
[0027] Additional embodiments comprises a styrenated vinyl ester.
The styrenated vinyl ester embodiments can achieve the necessary
gel time reactivity while maintaining greater than 24 hours of
stability at 77.degree. F. Further, the embodiments comprising a
styrenated vinyl ester require a relatively small amount of
inhibitor to increase the stability to greater than 24 hours. While
the below examples comprise a 10% 4-hydroxy TEMPO solution in
styrene as an inhibitor, other inhibitors can be used as discussed
throughout the application, and as would be known to one of
ordinary skill in the art.
[0028] Further, an unsaturated polyester resin as described herein
can be more reactive than other formulations and, as a result,
lower water bath temperatures can be used for curing. In some
embodiments, a water bath temperature of 140.degree. F. can be
used. In other embodiments, a water bath temperature of 150.degree.
F. can be used. In yet other embodiments, other water bath
temperatures can be used. The embodiments of the unsaturated
polyester resin as described herein can comprise a faster
gelling/curing time, but still be stable for extended periods of
time at 77.degree. F. when catalyzed. Some embodiments can further
comprise 2,4-pentanedione
Example 3
[0029] A styrenated vinyl ester (Example 3) comprising
TABLE-US-00004 Product Weight % CORROSION RESISTANT UNSATURATED
62.407 POLYESTER BASE RESIN SURFACTANTS 0.45 FUMED SILICA 1.3
STYRENE 7.5894 ALUMINUM TRIHYDRATE 25.8 10% TERTIARY BUTYL CATECHOL
IN STYRENE 0.85 75% DICOCO DIMETHYL AMMONIUM 0.35 CHLORIDE IN
ISOPROPYL ALCOHOL 2,4-PENTANEDIONE 0.4 8% COPPER NAPHTHENATE 0.0045
8% ZINC OCTOATE 0.03 BlocBuilder RC-50 1
Example 4
[0030] A styrenated vinyl ester (Example 4) comprising
TABLE-US-00005 Product Weight % BASE RESIN 87.16 FUMED SILICA 01.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.86 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.38
[0031] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 4 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
4 are for illustrative purposes.
Example 5
[0032] A styrenated vinyl ester (Example 5) comprising
TABLE-US-00006 Product Weight % BASE RESIN 87.80 FUMED SILICA 1.28
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.93 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 0.55 10% ORGANIC ZINC in MONOMER
0.19
[0033] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 5 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
5 are for illustrative purposes.
Example 6
[0034] A styrenated vinyl ester (Example 6) comprising
TABLE-US-00007 Product Weight % BASE RESIN 86.33 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.78 INHIBITOR 0.95
QUAT SALT 0.45 1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC
in MONOMER 0.38
[0035] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the inhibitor
can comprise a 10% 4-hydroxy TEMPO solution in styrene, the quat
salt can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 6 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
6 are for illustrative purposes.
Example 7
[0036] A styrenated vinyl ester (Example 7) comprising
TABLE-US-00008 Product Weight % BASE RESIN 86.74 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.82 INHIBITOR 0.48
QUAT SALT 0.45 1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC
in MONOMER 0.38
[0037] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the inhibitor
can comprise a 10% 4-hyrdoxy TEMPO solution in styrene, the quat
salt can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 7 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
7 are for illustrative purposes.
Example 8
[0038] A styrenated vinyl ester (Example 8) comprising
TABLE-US-00009 Product Weight % BASE RESIN 87.36 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.89 QUAT SALT 0.22
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.38
[0039] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 8 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
8 are for illustrative purposes.
Example 9
[0040] A styrenated vinyl ester (Example 9) comprising
TABLE-US-00010 Product Weight % BASE RESIN 86.45 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.90 10% ORGANIC ZINC in MONOMER
0.38
[0041] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 9 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
9 are for illustrative purposes.
Example 10
[0042] A styrenated vinyl ester (Example 10) comprising
TABLE-US-00011 Product Weight % BASE RESIN 86.82 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.83 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.76
[0043] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 10 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
10 are for illustrative purposes.
Example 11
[0044] A styrenated vinyl ester (Example 11) comprising
TABLE-US-00012 Product Weight % BASE RESIN 86.41 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC in MONOMER 0.76
Trigonox C 0.47
[0045] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc, and Trigonox C comprises a peroxide comprising TBPB. The
Trigonox C can be added to the styrenated vinyl ester during the
curing process along with % CHP (K-90).
[0046] The product can be cured using 1% CHP (K-90). The weights
used in Example 11 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
11 are for illustrative purposes.
Example 12
[0047] A styrenated vinyl ester (Example 12) comprising
TABLE-US-00013 Product Weight % BASE RESIN 86.80 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 0.10 QUAT SALT 0.86
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.38
[0048] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 12 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
12 are for illustrative purposes.
Example 13
[0049] A styrenated vinyl ester (Example 13) comprising
TABLE-US-00014 Product Weight % BASE RESIN 86.39 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC in MONOMER 0.38
Trigonox C 0.47
[0050] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc, and Trigonox C comprises a peroxide comprising TBPB. The
Trigonox C can be added to the styrenated vinyl ester during the
curing process along with % CHP (K-90). The product can be cured
using 1% CHP (K-90). The weights used in Example 13 can vary
depending on the size of resulting product that is desired. As a
result, the weights listed in Example 13 are for illustrative
purposes.
Example 14
[0051] A styrenated vinyl ester (Example 14) comprising
TABLE-US-00015 Product Weight % BASE RESIN 86.09 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.76 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.89 10% ORGANIC ZINC in MONOMER
0.38
[0052] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 14 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
14 are for illustrative purposes.
Example 15
[0053] A styrenated vinyl ester (Example 15) comprising
TABLE-US-00016 Product Weight % BASE RESIN 85.93 FUMED SILICA 1.25
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.74 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.89 10% ORGANIC ZINC in MONOMER 0.38
ACCELERATOR 0.19
[0054] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, the organic zinc can comprise 8% elemental zinc,
and the accelerator can comprise a copromoter which can comprise
2,4-pentanedione. The product can be cured using 1% CHP (K-90). The
weights used in Example 15 can vary depending on the size of
resulting product that is desired. As a result, the weights listed
in Example 15 are for illustrative purposes.
Example 16
[0055] A styrenated vinyl ester (Example 16) comprising
TABLE-US-00017 Product Weight % BASE RESIN 86.42 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.90
[0056] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, and the organic copper can comprise 8%
elemental copper. The product can be cured using 1% CHP (K-90).
[0057] The weights used in Example 16 can vary depending on the
size of resulting product that is desired. As a result, the weights
listed in Example 16 are for illustrative purposes.
Example 17
[0058] A styrenated vinyl ester (Example 17) comprising
TABLE-US-00018 Product Weight % BASE RESIN 85.23 FUMED SILICA 1.24
#1 SURFACTANT 0.67 #2 SURFACTANT 0.09 MONOMER 8.67 QUAT SALT 0.44
1% ORGANIC COPPER in MONOMER 3.27 10% ORGANIC ZINC in MONOMER
0.37
[0059] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 17 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
17 are for illustrative purposes.
Example 18
[0060] A styrenated vinyl ester (Example 18) comprising
TABLE-US-00019 Product Weight % BASE RESIN 84.05 FUMED SILICA 1.23
#1 SURFACTANT 0.66 #2 SURFACTANT 0.09 MONOMER 8.55 QUAT SALT 0.43
1% ORGANIC COPPER in MONOMER 4.61 10% ORGANIC ZINC in MONOMER
0.37
[0061] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 18 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
18 are for illustrative purposes.
Example 19
[0062] A styrenated vinyl ester (Example 19) comprising
TABLE-US-00020 Product Weight % BASE RESIN 85.83 FUMED SILICA 1.25
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.73 QUAT SALT 0.22
1% ORGANIC COPPER in MONOMER 2.83 10% ORGANIC ZINC in MONOMER
0.38
[0063] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 19 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
19 are for illustrative purposes.
Example 20
[0064] A styrenated vinyl ester (Example 20) comprising
TABLE-US-00021 Product Weight % BASE RESIN 83.47 FUMED SILICA 1.22
#1 SURFACTANT 0.66 #2 SURFACTANT 0.09 MONOMER 8.49 QUAT SALT 0.21
1% ORGANIC COPPER in MONOMER 5.50 10% ORGANIC ZINC in MONOMER
0.37
[0065] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 20 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
20 are for illustrative purposes.
Example 21
[0066] A styrenated vinyl ester (Example 21) comprising
TABLE-US-00022 Product Weight % BASE RESIN 86.75 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.82 QUAT SALT 0.48
1% ORGANIC COPPER in MONOMER 1.52 10% ORGANIC ZINC in MONOMER
0.38
[0067] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 21 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
21 are for illustrative purposes.
Example 22
[0068] A styrenated vinyl ester (Example 22) comprising
TABLE-US-00023 Product Weight % BASE RESIN 87.08 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.86 QUAT SALT 0.48
1% ORGANIC COPPER in MONOMER 1.53
[0069] The base resin can comprise bisphenol-A epoxy based vinyl
ester resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the
#1 surfactant can comprise BYK R-605, the #2 surfactant can
comprise BYK A-555, the monomer can comprise styrene, the quat salt
can comprise Adogen 462, and the organic copper can comprise 8%
elemental copper. The product can be cured using 1% CHP (K-90). The
weights used in Example 22 can vary depending on the size of
resulting product that is desired. As a result, the weights listed
in Example 22 are for illustrative purposes.
[0070] As described above all of the Examples discussed throughout
this application can be cured at various temperatures. In some
embodiments, a water bath temperature of 140.degree. F. can be
used. In other embodiments, a water bath temperature of 150.degree.
F. can be used. In yet other embodiments, other water bath
temperatures can be used. Further, other methods of curing can be
used with the above compounds as would be known to one of ordinary
skill in the art.
[0071] Embodiments are described herein of various apparatuses,
systems, and/or methods. Numerous specific details are set forth to
provide a thorough understanding of the overall structure,
function, manufacture, and use of the embodiments as described in
the specification and illustrated in the accompanying drawings. It
will be understood by those skilled in the art, however, that the
embodiments may be practiced without such specific details. In
other instances, well-known operations, components, and elements
have not been described in detail so as not to obscure the
embodiments described in the specification. Those of ordinary skill
in the art will understand that the embodiments described and
illustrated herein are non-limiting examples, and thus it can be
appreciated that the specific structural and functional details
disclosed herein may be representative and do not necessarily limit
the scope of the embodiments, the scope of which is defined solely
by the appended claims.
[0072] Reference throughout the specification to "various
embodiments," "some embodiments," "one embodiment," or "an
embodiment", or the like, means that a particular feature,
structure, or characteristic described in connection with the
embodiment(s) is included in at least one embodiment. Thus,
appearances of the phrases "in various embodiments," "in some
embodiments," "in one embodiment," or "in an embodiment," or the
like, in places throughout the specification, are not necessarily
all referring to the same embodiment. Furthermore, the particular
features, structures, or characteristics may be combined in any
suitable manner in one or more embodiments. Thus, the particular
features, structures, or characteristics illustrated or described
in connection with one embodiment may be combined, in whole or in
part, with the features, structures, or characteristics of one or
more other embodiments without limitation given that such
combination is not illogical or non-functional.
[0073] It will be further appreciated that for conciseness and
clarity, spatial terms such as "vertical," "horizontal," "up," and
"down" may be used herein with respect to the illustrated
embodiments. However, these terms are not intended to be limiting
and absolute.
[0074] Although at least one embodiment for an unsaturated
polyester resin system for cured in-place piping system, method,
and apparatus has been described above with a certain degree of
particularity, those skilled in the art could make numerous
alterations to the disclosed embodiments without departing from the
spirit or scope of this disclosure. All directional references
(e.g., upper, lower, upward, downward, left, right, leftward,
rightward, top, bottom, above, below, vertical, horizontal,
clockwise, and counterclockwise) are only used for identification
purposes to aid the reader's understanding of the present
disclosure, and do not create limitations, particularly as to the
position, orientation, or use of the devices. Joinder references
(e.g., affixed, attached, coupled, connected, and the like) are to
be construed broadly and can include intermediate members between a
connection of elements and relative movement between elements. As
such, joinder references do not necessarily infer that two elements
are directly connected and in fixed relationship to each other. It
is intended that all matter contained in the above description or
shown in the accompanying drawings shall be interpreted as
illustrative only and not limiting. Changes in detail or structure
can be made without departing from the spirit of the disclosure as
defined in the appended claims.
[0075] Any patent, publication, or other disclosure material, in
whole or in part, that is said to be incorporated by reference
herein is incorporated herein only to the extent that the
incorporated materials does not conflict with existing definitions,
statements, or other disclosure material set forth in this
disclosure. As such, and to the extent necessary, the disclosure as
explicitly set forth herein supersedes any conflicting material
incorporated herein by reference. Any material, or portion thereof,
that is said to be incorporated by reference herein, but which
conflicts with existing definitions, statements, or other
disclosure material set forth herein will only be incorporated to
the extent that no conflict arises between that incorporated
material and the existing disclosure material.
* * * * *