U.S. patent application number 17/118670 was filed with the patent office on 2022-06-16 for electroplate laminated structure and methods of fabricating the same.
This patent application is currently assigned to Honeywell International Inc.. The applicant listed for this patent is Honeywell International Inc.. Invention is credited to Joseph W. MINTZER, III, James PIASCIK, Glenn SKLAR, David WANG.
Application Number | 20220186394 17/118670 |
Document ID | / |
Family ID | |
Filed Date | 2022-06-16 |
United States Patent
Application |
20220186394 |
Kind Code |
A1 |
PIASCIK; James ; et
al. |
June 16, 2022 |
ELECTROPLATE LAMINATED STRUCTURE AND METHODS OF FABRICATING THE
SAME
Abstract
Corrosion-resistant laminated structures and methods of
fabricating laminated structures are disclosed. A method of
fabricating a laminated structure includes: providing an object in
an electroplating solution; forming a first layer on the object by
applying a first electric current, the first electric current being
associated with a first current density; and forming a second layer
on the first layer by applying a second electric current, the
second electric current being associated with a second current
density. Each of the first layer and the second layer includes, at
least in part, phosphorus. The first current density and the second
current density are different.
Inventors: |
PIASCIK; James; (Randolph,
NJ) ; WANG; David; (Morristown, NJ) ; SKLAR;
Glenn; (Randolph, NJ) ; MINTZER, III; Joseph W.;
(Pheonix, AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Honeywell International Inc. |
Charlotte |
NC |
US |
|
|
Assignee: |
Honeywell International
Inc.
|
Appl. No.: |
17/118670 |
Filed: |
December 11, 2020 |
International
Class: |
C25D 5/16 20060101
C25D005/16; C25D 5/10 20060101 C25D005/10; C25D 5/18 20060101
C25D005/18 |
Claims
1. A method of fabricating a laminated structure, the method
comprising: providing an object in an electroplating solution;
forming a first layer on the object by applying a first electric
current, the first electric current being associated with a first
current density; and forming a second layer on the first layer by
applying a second electric current, the second electric current
being associated with a second current density, wherein each of the
first layer and the second layer includes, at least in part,
phosphorus, and wherein the first current density and the second
current density are different.
2. The method of claim 1, wherein the first current density is
lower than the second current density.
3. The method of claim 1, wherein an amount of phosphorous in the
first layer is greater than the second layer.
4. The method of claim 1, further comprising: forming a third layer
on the second layer by applying a third electric current.
5. The method of claim 1, wherein the first layer is associated
with a first thickness and the second layer is associated with a
second thickness.
6. The method of claim 5, wherein the first thickness is greater
than the second thickness.
7. The method of claim 5, wherein the first thickness is equal to
the second thickness.
8. The method of claim 1, further comprising: agitating the
electroplating solution for a predetermined period of time.
9. The method of claim 1, further comprising: applying heat to the
laminated structure for a predetermined amount of time.
10. The method of claim 1, further comprising: applying the first
electric current for a first duration; and applying the second
electric current for a second duration.
11. A corrosion-resistant laminated structure comprising: an
object; a first layer formed on the object, the first layer having
a first thickness; and a second layer formed on the first layer,
the second layer having a second thickness, wherein the first layer
and the second layer are formed by applying a first electric
current and a second electric current, respectively, to the object
placed in an electroplating solution, a first current density
associated with the first electric current being different from a
second current density associated the second electric current, and
wherein each of the first layer and the second layer includes, at
least in part, phosphorus.
12. The structure of claim 11, wherein the first layer comprises a
greater amount of phosphorous than the second layer.
13. The structure of claim 11, wherein the first thickness is
greater than the second thickness.
14. The structure of claim 11, wherein the first thickness is equal
to the second thickness.
15. The structure of claim 11, further comprising: a third layer
formed on the second layer, the third layer having a third
thickness.
16. The structure of claim 15, wherein the first thickness, the
second thickness, and the third thickness are equal.
17. The structure of claim 15, wherein the first thickness is
greater than the second thickness or the third thickness.
18. A method of fabricating a laminated structure, the method
comprising: providing an object in an electroplating solution;
forming a first layer on the object by applying a first electric
current having a first current density; forming a second layer on
the first layer by applying a second electric current having a
second current density; and forming a third layer on the second
layer by applying a second electric current having the first
current density, wherein each of the first layer, the second layer,
and the third layer includes, at least in part, phosphorus.
19. The method of claim 18, wherein a thickness of the third layer
is different from a thickness of the first layer.
20. The method of claim 18, wherein the first layer comprises a
softer material than the second layer.
Description
TECHNICAL FIELD
[0001] Various embodiments of the present disclosure relate
generally to the field of electroplating and, more particularly, to
electroplated structures and methods of fabricating the same.
BACKGROUND
[0002] Various types of metal objects (e.g., machinery parts) are
electroplated in electroplating solution baths or chambers. A layer
of coating applied on a metal object via electroplating may provide
a protective barrier that improves, for example, the corrosion
resistance, strength, and durability of the metal object. However,
electroplated metal objects may become susceptible to damage during
assembly, handling, and/or use. Such damage may result in one more
cracks (or fissure or chips) in the coating, which may lead to
corrosion or rusting on the surfaces of the metal objects at or
near the locations of the cracks. As such, there is a need for an
efficient and cost effective solution to producing improved
corrosion resistant electroplated structures.
[0003] The present disclosure is directed to overcoming one or more
of these challenges. The background description provided herein is
for the purpose of generally presenting the context of the
disclosure. Unless otherwise indicated herein, the materials
described in this section are not prior art to the claims in this
application and are not admitted to be prior art, or suggestions of
the prior art, by inclusion in this section.
SUMMARY OF THE DISCLOSURE
[0004] According to certain aspects of the disclosure, an
electroplate laminated structure and methods of fabricating the
same for improving corrosion resistance of electroplated structures
are provided in this disclosure.
[0005] In one embodiment, a method of fabricating a laminated
structure is disclosed. The method may comprise: providing an
object in an electroplating solution; forming a first layer on the
object by applying a first electric current, the first electric
current being associated with a first current density; and forming
a second layer on the first layer by applying a second electric
current, the second electric current being associated with a second
current density. Each of the first layer and the second layer may
include, at least in part, phosphorus, and the first current
density and the second current density may be different.
[0006] In another embodiment, a corrosion-resistant laminated
structure is disclosed. The corrosion-resistant laminated structure
may comprise an object and a first layer may be formed on the
object. The first layer may have a first thickness. The
corrosion-resistant laminated structure may also comprise a second
layer formed on the first layer. The second layer may have a second
thickness. The first layer and the second layer may be formed by
applying a first electric current and a second electric current,
respectively, to the object placed in an electroplating solution. A
first current density associated with the first electric current
may be different from a second current density associated the
second electric current. Each of the first layer and the second
layer may include, at least in part, phosphorus.
[0007] In another embodiment, a method of fabricating a laminated
structure is disclosed. The method may comprise: providing an
object in an electroplating solution; forming a first layer on the
object by applying a first electric current having a first current
density; forming a second layer on the first layer by applying a
second electric current having a second current density; and
forming a third layer on the second layer by applying a second
electric current having the first current density. Each of the
first layer, the second layer, and the third layer includes, at
least in part, phosphorus.
[0008] Additional objects and advantages of the disclosed
embodiments will be set forth in part in the description that
follows, and in part will be apparent from the description, or may
be learned by practice of the disclosed embodiments. The objects
and advantages of the disclosed embodiments will be realized and
attained by means of the elements and combinations particularly
pointed out in the appended claims. As will be apparent from the
embodiments below, an advantage to the disclosed structures and
methods is that structures laminated with alternating hard and soft
electroplate layers improve the wear and corrosion resistance of
the electroplate laminated structures.
[0009] It is to be understood that both the foregoing general
description and the following detailed description are exemplary
and explanatory only and are not restrictive of the disclosed
embodiments, as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The accompanying drawings, which are incorporated in and
constitute a part of this specification, illustrate various
exemplary embodiments and together with the description, serve to
explain the principles of the disclosed embodiments.
[0011] FIG. 1 depicts an example electroplating system, according
to one or more aspect of the present disclosure.
[0012] FIGS. 2A and 2B illustrate an impact of a damaged
electroplate coating on the corrosion resistance of an
electroplated structure, according to one or more aspects of the
present disclosure.
[0013] FIGS. 3A and 3B depict a set of example electroplate
laminated structures, according to one or more aspect of the
present disclosure.
[0014] FIGS. 4A and 4B depict another set of example electroplate
laminated structures, according to one or more aspects of the
present disclosure.
[0015] FIGS. 5A and 5B depict yet another set of example
electroplate laminated structure, according to one or more aspects
of the present disclosure.
[0016] FIG. 6 depicts a corrosion-resistant property of an example
electroplate laminated structure, according to one or more aspects
of the present disclosure.
[0017] FIG. 7 depicts a flowchart of an example method for
fabricating an electroplate laminated structure, according to one
or more aspects of the present disclosure.
DETAILED DESCRIPTION OF EMBODIMENTS
[0018] The following embodiments describe electroplate laminated
structures and methods of fabricating electroplate laminated
structures.
[0019] As described above, there is a need in the electroplating
field and other related industries including, but not limited to,
the oil and gas industries, to prevent corrosion and rusting of
metal objects. For example, large machinery parts (e.g., mud motor
rotor) used in the oil and gas industries are typically coated with
hard, wear and corrosion resistant electroplating coatings, for
example, for strength, protection, and/or durability. However, such
hard, wear and corrosion resistant coatings are susceptible to
cracking during manufacturing, handling, and/or operation. As such,
the base metal of electroplated machinery parts may corrode or rust
at or near the locations of the cracks. Further, corrosion may
undercut the bonding between the electroplate coatings and the base
metal of the electroplated machinery parts, which may separate the
electroplate coatings from the base metal and render the machinery
parts ineffective or inoperable.
[0020] Accordingly, the following embodiments describe systems and
methods for fabricating electroplate laminated structures having
alternating hard and soft electroplate layers that improve the wear
and corrosion resistance of the electroplate laminated structures.
According to certain aspects of the present disclosure, an object
(e.g., a metallic machinery part) may be provided in an
electroplating solution. A first layer of electroplating material
may be formed on the object by applying a first electric current.
The first electric current may be associated with a first current
density. Further, a second layer of electroplating material may be
formed on the first layer by applying a second electric current.
The second electric current may be associated with a second current
density. In one embodiment, the first current density and the
second current density may be different. Each of the first layer
and the second layer may include, at least in part, phosphorus. The
amount of phosphorus content in the first layer may be lower or
greater than the amount of phosphorus content in the second layer.
In one embodiment, a plurality of layers with varying amounts of
phosphorous content may be formed by controlling the density of the
current being applied. The amount of phosphorus content in the
first layer and the second layer may determine the hardness or
ductility of the layers. For example, a first layer having a
relatively low amount of phosphorus content may form a relatively
soft layer on the object, and a second layer having a relatively
high amount of phosphorous content may form a relatively hard layer
on the first layer. Providing alternating, relatively soft and hard
layers of electroplate coatings on an object may terminate cracks
at one or more soft layers or may direct cracks to propagate
laterally instead of downward toward the object. Accordingly, the
electroplate laminated structures of the present disclosure may
significantly reduce or prevent the above-described corrosion or
rusting on objects formed of metal (e.g., three times or more
compared to a hard, single electroplate layer structure) by
providing alternating layers of soft and hard electroplate coatings
with varying amounts of phosphorous content.
[0021] The subject matter of the present description will now be
described more fully hereinafter with reference to the accompanying
drawings, which form a part thereof, and which show, by way of
illustration, specific exemplary embodiments. An embodiment or
implementation described herein as "exemplary" is not to be
construed as preferred or advantageous, for example, over other
embodiments or implementations; rather, it is intended to reflect
or indicate that the embodiment(s) is/are "example" embodiment(s).
Subject matter can be embodied in a variety of different forms and,
therefore, covered or claimed subject matter is intended to be
construed as not being limited to any exemplary embodiments set
forth herein; exemplary embodiments are provided merely to be
illustrative. Likewise, a reasonably broad scope for claimed or
covered subject matter is intended. Among other things, for
example, subject matter may be embodied as methods, devices,
components, or systems. Accordingly, embodiments may, for example,
take the form of hardware, software, firmware, or any combination
thereof (other than software per se). The following detailed
description is, therefore, not intended to be taken in a limiting
sense.
[0022] Throughout the specification and claims, terms may have
nuanced meanings suggested or implied in context beyond an
explicitly stated meaning. Likewise, the phrase "in one embodiment"
as used herein does not necessarily refer to the same embodiment
and the phrase "in another embodiment" as used herein does not
necessarily refer to a different embodiment. It is intended, for
example, that claimed subject matter include combinations of
exemplary embodiments in whole or in part.
[0023] The terminology used below may be interpreted in its
broadest reasonable manner, even though it is being used in
conjunction with a detailed description of certain specific
examples of the present disclosure. Indeed, certain terms may even
be emphasized below; however, any terminology intended to be
interpreted in any restricted manner will be overtly and
specifically defined as such in this Detailed Description section.
Both the foregoing general description and the following detailed
description are exemplary and explanatory only and are not
restrictive of the features, as claimed.
[0024] In this disclosure, the term "based on" means "based at
least in part on." The singular forms "a," "an," and "the" include
plural referents unless the context dictates otherwise. The term
"exemplary" is used in the sense of "example" rather than "ideal."
The term "or" is meant to be inclusive and means either, any,
several, or all of the listed items. The terms "comprises,"
"comprising," "includes," "including," or other variations thereof,
are intended to cover a non-exclusive inclusion such that a
process, method, or product that comprises a list of elements does
not necessarily include only those elements, but may include other
elements not expressly listed or inherent to such a process,
method, article, or apparatus. Relative terms, such as,
"substantially" and "generally," are used to indicate a possible
variation of .+-.10% of a stated or understood value.
[0025] Referring now to the appended drawings, FIG. 1 shows an
overview of an example electroplating system 100, according to one
or more aspects of the present disclosure. In one embodiment, the
system 100 may include an electroplating bath (or tank or
container) 102, a controller system 103, a variable power supply
104, one or more cathodes (or cathode electrodes) 106, one or more
anodes (or anode electrodes) 108, and a pump 112. In one
embodiment, the electroplating bath 102 may be configured to
receive and contain one or more electroplating solutions 114. For
example, an electroplating solution 114 may include water, a
hydrochloric acid (HCl) solution, a nickel (Ni) solution, a cobalt
(Co) solution, a phosphorous (P) solution, a cobalt phosphorous
(Co--P) solution, etc. Further, the electroplating bath 102 may be
configured to receive and contain one or more parts or work pieces
110 (e.g., a shaft, rod, beam, cylinder, bar, etc.) to be
electroplated. The size of the electroplating bath 102 may be
designed to be any size suitable for electroplating various parts
and work pieces.
[0026] Still referring to FIG. 1, the one or more cathodes 106 and
anodes 108 may be coupled to or placed in the electroplating bath
102. In one embodiment, the one or more cathodes 106 and anodes 108
may be arranged in the electroplating bath 102, so as to be in
contact, fully or partially, with the electroplating solution 114.
The one or more cathodes 106 and anodes 108 may provide various
levels of electric current necessary to facilitate electroplating
the one or more parts 110.
[0027] Still referring to FIG. 1, the controller system 103 may
include one or more timers, switches, sensors, controllers, etc.
(not shown in the figure for brevity and clarity) and may
facilitate the automatic or manual electroplating process of the
present disclosure. For example, the controller system 103 may be
configured to control the variable power supply 104 to apply
electric current to the electroplating bath 102 via the one or more
cathodes 106 and anodes 108. The variable power supply 104 may
include one or more rectifiers and may act as a current source.
Upon receiving a command or a signal from the controller system
103, the variable power supply 104 may provide electric current via
the one or more cathodes 106 and anodes 108. The electric current
may initiate a chemical reaction between the electroplating
solution 114 and the one or more parts 110 in the electroplating
bath 102. The electric current provided to the electroplating bath
102 may be controlled by the one or more rectifiers. In some
embodiments, the system 100 may be completely automated via the
controller system 103, by automatically monitoring various timers
and/or sensors coupled to the system 100. The manner in which
various components are arranged in FIG. 1 is merely exemplary. In
practice, there may be additional components, fewer components,
different components, or differently arranged components than those
shown in FIG. 1.
[0028] FIGS. 2A and 2B depict an example electroplated structure
210, according to one or more aspects of the present disclosure. In
particular, FIG. 2A illustrates an impact of a damaged electroplate
coating (e.g., a crack or crevice) on the corrosion resistance of
the structure 210. The structure 210 may comprise a metal object,
for example, one or more parts or work pieces (e.g., one or more
parts 110) of a device, a tool, equipment, a machine, etc. In one
embodiment, the structure 210 may comprise a base metal layer 212
(i.e., a substrate 212) and a coating layer 214. The base metal
layer 212 may be an outermost layer of a metal object (e.g., one or
more parts 110). The coating layer 214 may be formed on an outer
surface of the base metal layer 212 in accordance with an
electroplating process of the present disclosure. For example, the
metal object having the base metal layer 212 may be electrically
coupled to the cathode 106. The metal object may then be completely
or partially immersed in the electroplating solution 114 of the
electroplating bath 102. The variable power supply 104 may apply
electric current to the base metal layer 212 via the cathode 106
and the anode 108 for a predetermined period of time. The
application of electric current may facilitate a chemical reaction
between the electroplating solution 114 and the base metal layer
212, forming the coating layer 214. In one embodiment, the
controller system 103 may control the pump 112 to agitate the
electroplating solution 114 and keep electroplating particles in
suspension in order to remove materials from the outer surface of
the base metal layer 212 for efficient electroplating and
prevention of impurity build-up.
[0029] Still referring to FIG. 2A, the thickness (or amount) of the
coating layer 214 applied to the base metal layer 212 may be
determined based on various electroplating conditions and factors,
such as, for example, a current density, a current application
duration, an agitation rate, cathode 106 and anode 108 spacing,
etc. Further, the coating layer 214 may include an alloy (e.g.,
nickel phosphorus alloy, cobalt phosphorous alloy, etc.) with
varying element compositions. In one embodiment, the coating layer
214 may be hardened (e.g., precipitation hardening) by undergoing
one or more heat treatments. The hardness of a coating layer may
vary based on the composition of the coating layer. For example,
the hardness of a coating layer (e.g., cobalt phosphorous alloy)
comprising, for example, 7-8% phosphorous content may increase by
about 400 Vickers Pyramid Number (HV). That is, the hardness may
increase from about 600 HV to about 1000 HV after going through a
precipitation hardening heat treatment step. Alternatively, the
hardness of a coating layer (e.g., cobalt phosphorous alloy)
comprising, for example, below 6% phosphorous content, may increase
by only about 100 HV. As described above, although hard,
wear-resistant coatings may provide a stronger outer layer, they
may become susceptible to cracking during assembly, manufacturing,
handling, and/or operation. In the example of FIGS. 2A and 2B, the
coating layer 214 has a relatively high level of hardness (e.g.,
greater than about 1000 HV) and may be more susceptible to cracks
216 than a coating layer with a relatively lower level of hardness
(e.g., about 800 HV). Further, the cracks 216 on the hard coating
layer 214 may cause corrosion or rust on the base metal layer 212,
as further described in FIG. 2B.
[0030] During usage of the structure 210, debris, liquid, or
chemicals (e.g., chloride solution) that induce corrosion or
rusting may enter into the cracks 216. As shown in FIG. 2B,
corrosion or rusting may occur at locations 228 where the cracks
216 may propagate or grow all the way down to the base metal layer
212. The corrosion or rusting at the locations 228 may damage the
structure 210 and/or undercut between the coating layer 214 and the
base metal layer 212, which may separate the coating layer 214 from
the base metal layer 212, rendering the structure 210 unusable or
inoperable.
[0031] FIG. 3A depicts an example electroplate laminated structure
310 that reduces or prevents corrosion or rusting caused by cracks,
according to one or more aspects of the present disclosure. The
structure 310 may comprise a metal object, for example, one or more
parts or work pieces (e.g., one or more parts 110) of a device, a
tool, equipment, a machine, etc. In one embodiment, the structure
310 may comprise a base metal layer 312, a first coating layer 314,
and a second coating layer 316. The base metal layer 312 may be an
outermost layer of a metal object (e.g., one or more parts 110).
The first coating layer 314 may be formed on an exposed surface of
the base metal layer 312, in accordance with an electroplating
process of the present disclosure. For example, the metal object
having the base metal layer 312 may be physically and electrically
coupled to the cathode 106. The metal object may then be completely
or partially immersed in the electroplating solution 114 of the
electroplating bath 102. The controller system 103, by way of the
variable power supply 104, may apply a first electric current
having a first current density (e.g., 125 amps per foot squared
(ASF)) to the base metal layer 312 via the cathode 106 and the
anode 108 for a first predetermined period of time. The application
of the first electric current may facilitate a chemical reaction
between the electroplating solution 114 and the base metal layer
312, forming the first coating layer 314. Upon forming the first
coating layer 314, the variable power supply may 104 apply a second
electric current having a second current density (e.g., 25 ASF) to
the first coating layer 314 for a second predetermined period of
time. The application of the second electric current may facilitate
a chemical reaction between the electroplating solution 114 and the
first coating layer 314, forming the second coating layer 316. The
process of forming the first coating layer 314 and the second
coating layer 316 may be repeated so as to form multiple
alternating electroplate coating layers as shown in FIG. 3A. In the
example shown in FIG. 3A, the structure 310 includes twelve coating
layers. However, it should be noted that any number of alternating
coating layers may be formed using the electroplating method of the
present disclosure. In one embodiment, the pump 112 may agitate the
electroplating solution 114 and keep electroplating particles in
suspension in order to remove materials from the outer surface of
the base metal layer 312 for efficient electroplating and
prevention of impurity build-up.
[0032] Still referring to FIG. 3A, the thicknesses (or amount)
and/or hardness of the first and second coating layers 314, 316 may
be configured based on various electroplating conditions and
factors, such as, for example, a current density, a current
application duration, an agitation rate, cathode 106 and anode 108
spacing, etc. Further, the first and second coating layers 314, 316
may each include an alloy (e.g., nickel phosphorus alloy, cobalt
phosphorous alloy, etc.) with varying element compositions. In one
embodiment, the first coating layer 314 and the second coating
layer 316 may be hardened (e.g., precipitation hardening) by
undergoing one or more heat treatments. The hardness of the first
coating layer 314 and the second coating layer 316 may vary based
at least on the composition of the first coating layer 314 and the
second coating layer 316, as described above in reference to FIGS.
2A and 2B.
[0033] In one embodiment, the first coating layer 314 may comprise
a hardness level that is different from the hardness level of the
second coating layer 316. For example, the first coating layer 314
may comprise a relatively softer layer than the second coating
layer 316. In one embodiment, the first coating layer 314 may have,
for example, a hardness level of about 800 HV, and the second
coating layer 316 may have, for example, a hardness level of about
1000 HV. Of course, the specific levels of hardness of the first
and second coating layers 314, 316 may be varied depending on the
use case. In one embodiment, the hardness levels of the first
coating layer 314 and the second coating layer 316 may be
controlled based at least on the amount of phosphorous content.
Thus, a first coating layer 314 (e.g., cobalt phosphorous alloy)
comprising, for example, about 6% phosphorous content or less may
yield a hardness level that is lower than a second coating layer
316 comprising, for example, about 7-8% phosphorous content. As
described above, in accordance with FIGS. 2A and 2B, the hardness
of a coating layer (e.g., cobalt phosphorous alloy) comprising, for
example, 7-8% phosphorous content may increase by about 400 Vickers
Pyramid Number (HV). That is, the hardness may increase from about
600 HV to about 1000 HV after going through a precipitation
hardening heat treatment step. Alternatively, the hardness of a
coating layer (e.g., cobalt phosphorous alloy) comprising, for
example, about 6% phosphorous content or less, may increase by only
about 100 HV.
[0034] Still referring to FIG. 3A, the structure 310 may
significantly reduce or prevent the above-described corrosion or
rusting by forming alternating layers of coating with varying
phosphorous content amounts (e.g., phosphorous content ratios).
That is, the first coating layer 314 with a relatively low
phosphorous content (e.g., under 6%) may be formed on the base
metal layer 312. Subsequently, the second coating layer 316 with a
higher phosphorous content (e.g., equal to or greater than 7%) than
the first coating layer 314 may be formed. A relatively soft (e.g.,
about 800 HV) electroplating layer (e.g., first coating layer 314)
may have greater ductility or pliability compared to a relatively
hard (e.g., 1000 HV) electroplating layer (e.g., second coating
layer 316). As such, providing alternating layers of soft and hard
coatings on a base metal layer may terminate cracks at or near a
soft coating layer, or may direct cracks to propagate laterally
instead of downward (later shown in detail in FIG. 6). The ratio of
phosphorous content between the first coating layer 314 and the
second coating layer 316, the thickness of the coating layers,
and/or the number of electroplate coating layers (e.g., first and
second coating layers 314, 316) may affect the efficacy of the
structure 310 in preventing corrosion or rusting. As such, the
phosphorous content ratio, thickness, and/or number of the
electroplate coating layers may be adjusted depending on the use
case.
[0035] Still referring to FIG. 3A, the ratio of phosphorous content
between the first coating layer 314 and the second coating layer
316 may be adjusted by controlling the current density of the
electric current applied during the electroplating process of the
present disclosure. In one embodiment, the current density and the
current application duration may be controlled by the controller
system 103 by way of the variable power supply 104 either
automatically or manually by an operator. The controller system 103
may program the variable power supply 104 to control the rectifier
of the variable power supply 104 to apply electric current at
different densities during different time periods. Additionally or
alternatively, the current density and the current application
duration may be controlled by the variable power supply 104 by
manually programming the variable power supply 104 and/or by
manually changing the output of current at different time periods
by an operator. In this exemplary embodiment, the ratio of the
amount of phosphorous content between the first coating layer 314
and the second coating layer 316 may be 1 to 2. As such, the
structure 310 of FIG. 3A may comprise alternating soft and hard
coating layers, with the ratio of the amount of phosphorous content
therebetween being 1 to 2. Further, the total thickness of the
coating layers of the structure 310 may be about 10 millimeters. Of
course, the ratio of phosphorous content, the thickness of each
layer or the total thickness of all layers combined, and/or the
number of coating layers may be varied or adjusted depending on the
use case.
[0036] FIG. 3B depicts another example electroplate laminated
structure 320 that reduces or prevents corrosion or rusting caused
by cracks, according to one or more aspects of the present
disclosure. The structure 320 may comprise a metal object, for
example, one or more parts or work pieces (e.g., one or more parts
110) of a device, a tool, equipment, a machine, etc. In one
embodiment, the structure 320 may comprise a base metal layer 322,
a first coating layer 324, and a second coating layer 326. The base
metal layer 322 may be an outermost layer of a metal object (e.g.,
one or more parts 110). The first coating layer 324 and the second
coating layer 326 may be formed in the similar manner as described
in reference to FIG. 3A above. In the example of FIG. 3B, the first
coating layer 324 and the second coating layer 326 may comprise a
different thickness (e.g., smaller thickness) than the thickness of
the first coating layer 314 and the second coating layer 316 of
FIG. 3A. The thickness of each coating layer (first coating layer
324 or second coating layer 326) may be configured based on the
current density and/or the duration of current application during
the electroplating process of the present disclosure. For example,
applying about 125 ASF of electric current for about 0.167 hour
(approximately 10 minutes) may yield about 0.5 millimeters of
thickness. Alternatively, applying about 50 ASF of electric current
for about 1 hour may yield about 2 millimeters of thickness. Of
course, the thickness may vary based on other factors, such as, an
agitation rate, cathode 106 and anode 108 spacing, etc. Thus, based
on the characteristic and/or use of the structure 320, electroplate
coating layers having different thicknesses may be formed in
accordance with the present disclosure. In the embodiment of FIG.
3B, the first coating layer 324 and the second coating layer 326
may comprise the same thickness. However, the first coating layer
314 may comprise a higher phosphorous content than the second
coating layer 326. As such, the first coating layer 324 may be
relatively softer than the second coating layer 326. Accordingly,
the hardness as well as the thickness of electroplating coating
layers (e.g., first coating layer 324 and/or second coating layer
326) may be determined depending on the use case, the structure 320
having desired hardness and thickness may be formed by configuring
various parameters associated with those properties (e.g., current
density, current application duration, agitation rate, cathode 106
and anode 108 spacing, etc.).
[0037] FIG. 4A depicts yet another example electroplate laminated
structure 410 that reduces or prevents corrosion or rusting caused
by cracks, according to one or more aspects of the present
disclosure. The structure 410 may comprise a metal object, for
example, one or more parts or work pieces (e.g., one or more parts
110) of a device, a tool, equipment, a machine, etc. In one
embodiment, the structure 410 may comprise a base metal layer 412,
a first coating layer 414, a second coating layer 416, and a third
coating layer 418. The first coating layer 414, the second coating
layer 416, and the third coating layer 418 may be formed in the
similar manner as described in reference to FIGS. 3A-3B above. In
the example of FIG. 4A, the first coating layer 414 may comprise a
first thickness, the second coating layer 416 may comprise a second
thickness, and the third coating layer 418 may comprise a third
thickness. The thickness of each layer may be controlled using the
electroplating process described in FIG. 3B above.
[0038] Still referring to FIG. 4A, the first thickness of the first
coating layer 414 may be greater than the thickness of the second
coating layer 416 and the third coating layer 418. Further, the
first coating layer 414 and the third coating layer 418 may
comprise relatively soft layers compared to the second coating
layer 416. In some embodiments, electroplate laminated structure
with a relatively thick soft layer may yield an improved corrosion
or rust resistance because cracks tend to terminate at a relatively
soft layer. Thus, forming a relatively thicker soft layer as the
first coating layer as shown in FIG. 4A may improve the prevention
of cracks propagating through to the base metal layer 412 of the
structure 410.
[0039] FIG. 4B depicts yet another example electroplate laminated
structure 420 that reduces or prevents corrosion or rusting caused
by cracks, according to one or more aspects of the present
disclosure. The structure 420 may comprise a metal object, for
example, one or more parts or work pieces (e.g., one or more parts
110) of a device, a tool, equipment, a machine, etc. In one
embodiment, the structure 420 may comprise a base metal layer 422,
a first coating layer 424, a second coating layer 426, and a third
coating layer 428. The first coating layer 424, the second coating
layer 426, and the third coating layer 428 may be formed in the
similar manner as described in reference to FIGS. 3A-3B above. In
this exemplary embodiment, the first coating layer 424 may comprise
a first thickness, the second coating layer 426 may comprise a
second thickness, and the third coating layer 428 may comprise a
third thickness. Notably, FIG. 4B illustrates an example of varying
the thicknesses of the electroplate coating layers. For example,
the thickness of the second coating layer 426 and the third coating
layer 428 may be equal or substantially similar, while the
thickness of each of the second coating layer 426 and the third
coating layer 428 may be smaller than the thickness of the first
coating layer 424. Further, the thickness of the second and third
coating layers 426, 428 may be smaller than the thickness of the
second and third coating layers 416, 418 illustrated in FIG. 4A.
The thickness of the electroplate coating layers of the structure
420 may be controlled similarly in the manner described in
reference to FIG. 3B. As such, the exemplary embodiment of FIG. 4B
may include a relatively thick soft first coating layer 424,
similar to the first coating layer 414 in FIG. 4A, the second and
third coating layers 426, 428 being substantially thinner than the
first coating layer 424. In some embodiments, as described above,
an electroplate laminated structure with a relatively thick soft
layer may yield an improved corrosion or rust resistance because
cracks tend to terminate at a relatively soft layer. Thus, forming
a relatively thicker soft layer as the first coating layer as shown
in FIG. 4B may improve the prevention of cracks propagating through
to the base metal layer 422 of the structure 420.
[0040] FIG. 5A depicts yet another example electroplate laminated
structure 510 that reduces or prevents corrosion or rusting caused
by cracks, according to one or more aspects of the present
disclosure. The structure 510 may comprise a metal object, for
example, one or more parts or work pieces (e.g., one or more parts
110) of a device, a tool, equipment, a machine, etc. In one
embodiment, the structure 510 may comprise a base metal layer 512,
a first coating layer 514, and a second coating layer 516. The
first coating layer 514 and the second coating layer 516 may be
formed in the similar manner as described in reference to FIGS.
3A-3B and FIGS. 4A-4B above. In this exemplary embodiment, the
first coating layer 514 may comprise a first thickness and the
second coating layer 516 may comprise a second thickness. The first
thickness of the first coating layer 514 may be greater than the
second thickness of the second layer 516. For example, the ratio of
thickness between the first coating layer 514 and the second layer
516 may be 1 to 2. Of course, the thickness ratio between the first
and second coating layers 514, 516 may be varied based on the
design and/or use of the structure 510. In one embodiment, the
first coating layer 514 may comprise a relatively soft layer
compared to the second coating layer 516. As such, providing
alternating layers of relatively soft and hard coatings on a base
metal layer may terminate cracks or may direct cracks to propagate
laterally instead of downward (later shown in detail in FIG. 6). As
described above, an electroplate laminated structure with a
relatively thick soft layer may yield an improved corrosion or rust
resistance because cracks tend to terminate at the relatively soft
layer. Thus, laminating one or more relatively soft electroplate
coating layers with one or more relatively hard electroplate
coating layers in an alternating manner may improve the prevention
of cracks propagating through to the base metal layer 514 of the
structure 510.
[0041] FIG. 5B depicts yet another example electroplate laminated
structure 520 that reduces or prevents corrosion or rusting caused
by cracks, according to one or more aspects of the present
disclosure. The structure 520 may comprise a metal object, for
example, one or more parts or work pieces (e.g., one or more parts
110) of a device, a tool, equipment, a machine, etc. In one
embodiment, the structure 520 may comprise a base metal layer 522,
a first coating layer 524, a second coating layer 526, and a third
coating layer 528. The first coating layer 524, the second coating
layer 526, and the third coating layer 528 may be formed in the
similar manner as described in reference to FIGS. 3A-3B, 4A-4B, and
5A above. In the example of FIG. 5B, the first coating layer 524
may comprise a first thickness, the second coating layer 526 may
comprise a second thickness, and the third coating layer 528 may
comprise a third thickness. FIG. 5B illustrates an example of
forming the first coating layer 524 as the thickest layer compared
to the second coating layer 526 and the third coating layer 528.
After forming the first coating layer 524, multiple hard and soft
coating layers may be formed in an alternating manner, similar to
the structure 510 in FIG. 5A. For example, the ratio of thickness
between the second coating layer 526 and the third layer 528 may be
1 to 2. Of course, the thickness ratio between the second and third
coating layers 526, 528 may be varied based on the design and/or
use of the structure 520. The thickness of the electroplate coating
layers of the structure 520 may be controlled similarly in the
manner described in reference FIG. 3B. As such, the exemplary
embodiment of FIG. 5B may include the relatively thick soft first
coating layer 524, and the second and third coating layers 526, 528
that are thinner than the first coating layer 524. In some
embodiments, as described above, an electroplate laminated
structure with a relatively thick soft layer may yield an improved
corrosion or rust resistance because cracks tend to terminate at
the relatively soft layer. Thus, laminating one or more relatively
soft electroplate coating layers with one or more relatively hard
electroplate coating layers in an alternating manner may improve
the prevention of cracks propagating through to the base metal
layer 524 of the structure 520.
[0042] One skilled in the art will recognize that the scope of the
present disclosure is not limited to the specific embodiments
illustrated in FIGS. 3A-3B, 4A-4B, and 5A-5B. Rather, FIGS. 3A-3B,
4A-4B, and 5A-5B illustrate structures with varying dimensions and
specifications, in order to suggest that the number of alternating
relatively soft and hard layers, thickness of the layers, hardness
of the layers, and the manner by which soft and hard layers are
arranged (e.g., alternating or non-alternating, i.e., random) may
all be configured in various ways using the parameters discussed
above, such as the electroplating current density, current
application duration, agitation rate, cathode and anode spacing,
etc.
[0043] FIG. 6 illustrates a corrosion-resistant property of an
example electroplate laminated structure, in accordance with one or
more aspects of the present disclosure. The structure 610 may
comprise a metal object, for example, one or more parts or work
pieces (e.g., one or more parts 110) of a device, a tool,
equipment, a machine, etc. In one embodiment, the structure 610 may
comprise a base metal layer 612, a first coating layer 614 and a
second coating layer 616. The first coating layer 614 and the
second coating layer 616 may be formed in the similar manner as
described in reference to FIGS. 3A-3B, 4A-4B, and 5A-5B above. As
discussed above, providing alternating, relatively soft and hard
layers of electroplate coatings on a base metal layer may terminate
cracks or may direct cracks to propagate laterally instead of
downward. FIG. 6 shows cracks 618 propagating from the outermost
layer of the structure 610. By alternating soft and hard layers,
the propagation of the cracks 618 starting from a hard, outer layer
may be mitigated when the crack 618 reaches a soft layer. In some
embodiments, the soft layer may cause the cracks 618 to travel
relatively laterally across the soft layer rather than propagating
downward toward the base metal layer 612. As such, laminating soft
and hard coating layers in an alternating manner as shown FIGS.
3A-3B, 4A-4B, 5A-5B, and 6 may improve the efficacy of preventing
cracks from propagating through to the base metal layer of the
electroplate laminated structures of the present disclosure.
[0044] FIG. 7 depicts a flowchart of an exemplary method 700 for
fabricating an electroplate laminated structure (e.g., structure
310, 320, 410, 420, 510, 520, and/or 600), in accordance with one
or more aspects of the present disclosure. At step 702, an object
(e.g., one or more parts 110) may be provided (or immersed) in an
electroplating solution (e.g., electroplating solution 114). In one
embodiment, the electroplating solution may be agitated by the pump
112 for a predetermined period of time. At step 704, a first layer
(e.g., first coating layer 314, 324, 414, 424, 514, 524, or 614)
may be formed on the object by applying a first electric current by
the controller system 103 or the variable power supply 104. The
first electric current may be associated with a first current
density. At step 706, a second layer (e.g., second coating layer
316, 326, 416, 426, 516, 526, or 616) may be formed on the first
layer by applying a second electric current using the controller
system 103 or the variable power supply 104. The second electric
current may be associated with a second current density. The first
current density and the second current density may be the same or
different. In one embodiment, the first electric current may be
applied for a first duration, and the second electric current may
be applied for a second duration. The first duration and the second
duration may be the same or different. In one embodiment, steps 704
and 706 may be performed iteratively in order to form multiple
first layers and multiple second layers, each of the multiple
second layers formed on a corresponding one of the multiple first
layers, thereby forming alternating sets of first and second layers
as depicted in FIGS. 3A-3B, 4A-4B, 5A-5B, and 6 for example.
[0045] In some embodiments, a third layer may be formed on the
second layer by applying a third electric current. The third
electric current may be associated with a third current density.
The third current density and the first current density may be the
same or different. The third electric current may be applied for a
duration that is the same as or different from the first duration.
Furthermore, during or after the electroplating process, heat may
be applied to the laminated structured for a predetermined amount
of time.
[0046] In one embodiment, the first current density and the second
current density may be different. In one embodiment, the first
current density may be lower than the second current density.
Further, each of the first layer and the second layer may include,
at least in part, phosphorus. In one embodiment, the amount of
phosphorous in the first layer may be greater than the second
layer. In some embodiments, the first layer may comprise a first
thickness and the second layer comprises a second thickness. In
another embodiment, the first thickness may be greater than the
second thickness. In yet another embodiment, the first thickness
may be equal or substantially similar to the second thickness.
[0047] It should be appreciated that in the above description of
exemplary embodiments, various features are sometimes grouped
together in a single embodiment, figure, or description thereof for
the purpose of streamlining the disclosure and aiding in the
understanding of one or more of the various aspects. This method of
disclosure, however, is not to be interpreted as reflecting an
intention that the claimed embodiment requires more features than
are expressly recited in each claim. Thus, the claims following the
Detailed Description are hereby expressly incorporated into this
Detailed Description, with each claim standing on its own as a
separate embodiment of this disclosure.
[0048] Furthermore, while some embodiments described herein include
some but not other features included in other embodiments,
combinations of features of different embodiments are meant to be
within the scope of the disclosure, and form different embodiments,
as would be understood by those skilled in the art. For example, in
the following claims, any of the claimed embodiments can be used in
any combination.
[0049] Thus, while certain embodiments have been described, those
skilled in the art will recognize that other and further
modifications may be made thereto without departing from the spirit
of the disclosure, and it is intended to claim all such changes and
modifications as falling within the scope of the disclosure. For
example, functionality may be added or deleted from the block
diagrams and operations may be interchanged among functional
blocks. Steps may be added or deleted to methods described within
the scope of the present disclosure.
[0050] The above disclosed subject matter is to be considered
illustrative, and not restrictive, and the appended claims are
intended to cover all such modifications, enhancements, and other
implementations, which fall within the true spirit and scope of the
present disclosure. Thus, to the maximum extent allowed by law, the
scope of the present disclosure is to be determined by the broadest
permissible interpretation of the following claims and their
equivalents, and shall not be restricted or limited by the
foregoing detailed description. While various implementations of
the disclosure have been described, it will be apparent to those of
ordinary skill in the art that many more implementations and
implementations are possible within the scope of the disclosure.
Accordingly, the disclosure is not to be restricted.
* * * * *