U.S. patent application number 17/385086 was filed with the patent office on 2022-06-16 for method for manufacturing high temperature-resistant polyvinyl chloride adhesive tape.
The applicant listed for this patent is Hebei YongLe Tape Co. Ltd.. Invention is credited to Chunming JIN, Shuang LI, Shuqin QI, Feng WANG, Yukun YANG.
Application Number | 20220186084 17/385086 |
Document ID | / |
Family ID | |
Filed Date | 2022-06-16 |
United States Patent
Application |
20220186084 |
Kind Code |
A1 |
WANG; Feng ; et al. |
June 16, 2022 |
METHOD FOR MANUFACTURING HIGH TEMPERATURE-RESISTANT POLYVINYL
CHLORIDE ADHESIVE TAPE
Abstract
The present invention relates to a method for manufacturing a
high temperature-resistant polyvinyl chloride adhesive tape, and
more particularly to a method and a production process for
manufacturing a high temperature-resistant adhesive tape by
applying a UV-crosslinkable hot-melt pressure-sensitive adhesive to
a high temperature-resistant polyvinyl chloride film. The high
temperature-resistant polyvinyl chloride film is a high
temperature-resistant material containing a liquid polymeric
plasticizer, a solid polymeric plasticizer, and a heat stabilizer.
The hot-melt pressure-sensitive adhesive can be directly coated
onto the high temperature-resistant polyvinyl chloride film at
130-150.degree. C.; and then crosslinked and cured by UV
irradiation, to make a high temperature-resistant polyvinyl
chloride adhesive tape. Compared with conventional polyvinyl
chloride adhesive tapes, the high temperature-resistant polyvinyl
chloride adhesive tape manufactured using the method for
manufacturing a novel high temperature-resistant polyvinyl chloride
adhesive tape provided in the present invention has the advantages
of non-volatility and resistance to high temperature and is highly
environmentally friendly.
Inventors: |
WANG; Feng; (Baoding,
CN) ; QI; Shuqin; (Baoding, CN) ; JIN;
Chunming; (Baoding, CN) ; LI; Shuang;
(Baoding, CN) ; YANG; Yukun; (Baoding,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Hebei YongLe Tape Co. Ltd. |
Boading |
|
CN |
|
|
Appl. No.: |
17/385086 |
Filed: |
July 26, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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16074965 |
Aug 2, 2018 |
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PCT/CN2016/081923 |
May 12, 2016 |
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17385086 |
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International
Class: |
C09J 7/38 20060101
C09J007/38; C09J 7/20 20060101 C09J007/20; C09J 133/08 20060101
C09J133/08; C09J 7/24 20060101 C09J007/24; C09J 7/35 20060101
C09J007/35; C09J 11/06 20060101 C09J011/06; C09J 11/08 20060101
C09J011/08; H01B 3/44 20060101 H01B003/44 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 3, 2016 |
CN |
201610073413.1 |
Claims
1. A method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape, comprising: coating, as a hot
melt, a UV-crosslinkable hot-melt pressure-sensitive adhesive onto
a high temperature-resistant polyvinyl chloride film at a
temperature of 130-150.degree. C., and then crosslinking by UV
irradiation with a set of UV lamps, wherein the high
temperature-resistant polyvinyl chloride film comprises a liquid
polymeric plasticizer, a solid polymeric plasticizer, and a heat
stabilizer; wherein the high temperature-resistant polyvinyl
chloride film is protected by cooling during the coating
process.
2. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 1, wherein the
UV-crosslinkable hot-melt pressure-sensitive adhesive comprises a
copolymer of one or more polymerizable photoinitiators and an
acrylate monomer, or a mixture of an oligomer containing one or
more polymerizable photoinitiators and an acrylate polymer.
3. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 2, wherein the
UV-crosslinkable hot-melt pressure-sensitive adhesive further
comprises a heat stabilizer, a photostabilizer, a tackifying resin,
and a plasticizer.
4. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 1, wherein the
liquid polymeric plasticizer is at least one selected from the
group consisting of liquid polyethylene glycol adipate and liquid
polypropylene glycol adipate.
5. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 1, wherein the
solid polymeric plasticizer is at least one selected from the group
consisting of an ethylene-vinyl acetate copolymer, an
ethylene-methyl acrylate copolymer, an ethylene-ethyl acrylate
copolymer, an ethylene-butyl acrylate copolymer, a nitrile
butadiene rubber powder, and chlorinated polyethylene.
6. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 1, wherein the
heat stabilizer is at least one selected from the group consisting
of a non-lead liquid or a solid barium/zinc stabilizer, a
cadmium/barium/zinc stabilizer, a calcium/zinc stabilizer, and an
organotin stabilizer.
7. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 2, wherein the
polymerizable photoinitiator is an acetophenone or benzophenone
derivative containing a methacryloyloxy group or an acryloyloxy
group.
8. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 1, wherein the
amount coated of the UV-crosslinkable hot-melt pressure-sensitive
adhesive in hot melt coating is 10-35 g/cm.sup.2.
9. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 1, wherein the
UV lamp is a high-pressure mercury lamp, a medium-to-low pressure
mercury lamp or an LED lamp, having a UV irradiation energy of at
least 10 mJ/cm.sup.2.
10. The method for manufacturing a high temperature-resistant
polyvinyl chloride adhesive tape according to claim 1, wherein the
coating is carried out by means of slot-die coating, bar coating or
extrusion laminating.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application is a continuation of U.S. patent
application Ser. No. 16/074,965 filed Aug. 2, 2018, which is a 371
of International Application No. PCT/CN2016/081923, which was
published in Chinese on Aug. 10, 2017, and claims the benefit of
Chinese Patent Application No. 201610073413.1 filed Feb. 3, 2016,
all of which are incorporated herein by reference in their
entireties.
TECHNICAL FIELD
[0002] The present invention relates to the field of chemical
technologies and chemical industry, particularly to a method for
manufacturing a high temperature-resistant polyvinyl chloride
adhesive tape, and more particularly to a method and a production
process for manufacturing an adhesive tape by applying a
UV-crosslinkable hot-melt pressure-sensitive adhesive to a high
temperature-resistant polyvinyl chloride film. The high
temperature-resistant polyvinyl chloride film is a high
temperature-resistant material containing a liquid polymeric
plasticizer, a solid polymeric plasticizer, and a heat stabilizer.
The hot-melt pressure-sensitive adhesive can be directly coated
onto the high temperature-resistant polyvinyl chloride film at
130-150.degree. C.; and then crosslinked by UV irradiation, to make
a polyvinyl chloride adhesive tape.
BACKGROUND ART
[0003] The electrical pressure-sensitive adhesive tape having a
soft polyvinyl chloride (SPVC) film as a substrate is widely used
in automobiles, machinery manufacturing, instruments and household
appliances because of its excellent mechanical properties, flame
retardancy, electrical insulation properties, heat deformation
resistance and superior processability. However, the polyvinyl
chloride film substrate contains low-molecular weight plasticizers
such as dioctyl phthalate (DOP), dibutyl phthalate (DBP) and
tri-n-butyl phosphate (TBP), etc. and has poor temperature
resistance. Moreover, these low-molecular weight plasticizers may
migrate into the adhesive layer and decrease the adhesion powder of
the adhesive tape, thus failing to meet the requirements in
industrial application. The conventional polymeric polyvinyl
chloride improves the high-temperature resistance, but cannot be
coated at temperatures above 120.degree. C.
[0004] At present, the soft polyvinyl chloride adhesive tape
products in the industry are produced by directly coating a
solvent-type rubber-based pressure-sensitive adhesive on a soft
polyvinyl chloride film. The solvent-type rubber-based
pressure-sensitive adhesive contains a large amount of organic
solvent, generally toluene. During the coating process, the organic
solvent may be partially volatilized into the atmosphere to cause
environmental pollution. The obtained polyvinyl chloride adhesive
tape also contains solvent residues, which will be slowly released
during use and cause the pollution of the environment of use, such
as the indoor environment of an automobile, thus failing to meet
the requirements of Restriction of Hazardous Substances Directive
(RoHS Directive) in electrical and electronic equipment issued by
European Commission. Moreover, the coating process of the
solvent-type rubber-based pressure-sensitive adhesive has the
disadvantages of high energy consumption, large floor area occupied
by the coating equipment, and thus high production cost.
[0005] The UV-crosslinked hot-melt pressure-sensitive adhesive is
environmentally friendly, and requires small equipment, low energy
consumption, and thus low production cost. More importantly, such a
pressure-sensitive adhesive has better plasticizer resistance, and
the migration of polymeric plasticizers does not significantly
decrease the performance of the adhesive tape. Therefore, this type
of hot-melt pressure-sensitive adhesives can meet a wide range of
needs in the industry. However, the polyvinyl chloride film
plasticized with a low-molecular weight plasticizer and a
conventional polymeric plasticizer has insufficient temperature
resistance. In order to prevent thermal damage of the polyvinyl
chloride film during coating, the temperature at the time of
coating has to be lowered, and an ultraviolet lamp having a lower
energy is used. When the coating temperature is lowered, the
viscosity of the adhesive is increased, and the flowability is
deteriorated, which leads to an uneven coating. This limits the
speed of coating and reduces the production efficiency. The
applicant described the use of an emulsion-type pressure-sensitive
adhesive on a polyvinyl chloride film in Chinese Invention Patent
No. CN 101372607 B, but the adhesive still needs to be further
improved in terms of the high-temperature resistance.
SUMMARY OF THE INVENTION
[0006] In order to solve the above problems existing in the prior
art, the present invention provides a method for manufacturing a
novel high temperature-resistant polyvinyl chloride adhesive tape.
The UV-crosslinked hot-melt adhesive has better high-temperature
resistance. The method comprises: directly coating a
UV-crosslinkable hot-melt pressure-sensitive adhesive onto a high
temperature-resistant polyvinyl chloride film substrate at a
temperature of 130-150.degree. C., and then crosslinking by UV
irradiation to make a novel high temperature-resistant polyvinyl
chloride adhesive tape.
[0007] According to the present invention, a method for
manufacturing a high temperature-resistant polyvinyl chloride
adhesive tape is provided, which comprises:
[0008] coating, as a hot melt, a UV-crosslinkable hot-melt
pressure-sensitive adhesive onto a high temperature-resistant
polyvinyl chloride film at a temperature of 130-150.degree. C., and
then crosslinking by UV irradiation with a set of UV lamps, wherein
the high temperature-resistant polyvinyl chloride film comprises a
liquid polymeric plasticizer, a solid polymeric plasticizer, and a
heat stabilizer.
[0009] Further, the high temperature-resistant polyvinyl chloride
film is protected by cooling during the coating process to prevent
the high temperature-resistant polyvinyl chloride film from being
damaged during coating and upon UV irradiation.
[0010] Optionally, the UV-crosslinkable hot-melt pressure-sensitive
adhesive comprises a copolymer of one or more polymerizable
photoinitiators and an acrylate monomer, or a mixture of an
oligomer containing one or more polymerizable photoinitiators and
an acrylate polymer, wherein the acrylate refers to all kinds of
acrylate esters, for example, n-butyl acrylate (BA), methyl
methacrylate (MMA) and the like.
[0011] Further, the UV-crosslinkable hot-melt pressure-sensitive
adhesive also contains a heat stabilizer, a photostabilizer, a
tackifying resin, and a plasticizer.
[0012] Optionally, the liquid polymeric plasticizer is at least one
selected from the group consisting of liquid polyethylene glycol
adipate and liquid polypropylene glycol adipate.
[0013] Optionally, the solid polymeric plasticizer is at least one
selected from the group consisting of an ethylene-vinyl acetate
copolymer, an ethylene-methyl acrylate copolymer, an ethylene-ethyl
acrylate copolymer, an ethylene-butyl acrylate copolymer, a nitrile
butadiene rubber powder, and chlorinated polyethylene.
[0014] Optionally, the heat stabilizer is at least one selected
from the group consisting of a non-lead liquid or a solid
barium/zinc stabilizer, a cadmium/barium/zinc stabilizer, a
calcium/zinc stabilizer, and an organotin stabilizer.
[0015] Optionally, the polymerizable photoinitiator is an
acetophenone or benzophenone derivative containing a
methacryloyloxy group or an acryloyloxy group.
[0016] Optionally, the amount coated of the UV-crosslinkable
hot-melt pressure-sensitive adhesive in hot melt coating is 10-35
g/cm.sup.2.
[0017] Optionally, the UV lamp is a high-pressure mercury lamp, a
medium-to-low pressure mercury lamp or an LED lamp, having a UV
irradiation energy of at least 10 mJ/cm.sup.2.
[0018] Further, the coating is carried out by means of slot-die
coating, bar coating or extrusion laminating.
[0019] In the method for manufacturing a novel high
temperature-resistant polyvinyl chloride adhesive tape provided in
the present invention, a high temperature-resistant polyvinyl
chloride film is used as a substrate. In addition to the main
polyvinyl chloride resin, the high temperature-resistant polyvinyl
chloride film also contains a liquid polymeric plasticizer, a solid
polymeric plasticizer and a heat stabilizer. The liquid polymeric
plasticizer used in the present invention is a liquid polyethylene
glycol adipate plasticizer and a liquid polypropylene glycol
adipate plasticizer. The solid polymeric plasticizer used is an
ethylene-vinyl acetate (EVA) copolymer, an ethylene-methyl acrylate
(EMA) copolymer, an ethylene-ethyl acrylate (EEA) copolymer, an
ethylene-butyl acrylate (EBA) copolymer, a nitrile butadiene rubber
(NBR) powder, and chlorinated polyethylene (CPE), etc. The heat
stabilizer used is a non-lead liquid or a solid barium/zinc
stabilizer, a cadmium/barium/zinc stabilizer, a calcium/zinc
stabilizer, or an organotin stabilizer. In addition, some colorants
and fillers are further used as needed.
[0020] The use of the high temperature-resistant polyvinyl chloride
film substrate can increase the hot melt coating temperature for
the adhesive tape to 150.degree. C., thereby speeding up the
coating and increasing the production efficiency. In addition, a
polymeric plasticizer is added to the polyvinyl chloride film to
reduce the migration of the plasticizer in the film to the adhesive
layer. That is to say, during the storage and use of the adhesive
tape, or after baking at a high temperature of 60-80.degree. C.,
although the migration of a small amount of plasticizer from the
substrate to the adhesive layer may occur, the performance of the
adhesive tape can still be retained to meet the requirements for
application in the industry. Therefore, the polyvinyl chloride
adhesive tape produced using the production method of the present
invention is environmentally friendly, and has high-temperature
resistance, low VOC, and other excellent performances.
[0021] It is well known that the UV cross-linked hot-melt
pressure-sensitive adhesive does not contain a solvent, so a
solvent recovery system is not required in the coating process,
thus having the advantages of environmental protection and energy
saving. The hot-melt pressure-sensitive adhesive is commonly coated
by slot-die coating, bar coating or extrusion laminating. Compared
with a coating equipment for the conventional aqueous and
solvent-type pressure-sensitive adhesives, the coating equipment
for the hot-melt pressure-sensitive adhesive occupies a small floor
area and requires less labor for operation, and thereby the
production efficiency can be greatly improved. The melt viscosity
of the hot-melt pressure-sensitive adhesive is a very important
parameter, and the magnitude of the melt viscosity has a direct
influence on the coating speed. At present, the rubber-based
hot-melt pressure-sensitive adhesive used in the industry generally
has a relatively large melt viscosity. When a soft polyvinyl
chloride (SPVC) film is coated to manufacture a SPVC adhesive tape,
a complicated transfer coating method has to be used (i.e., a
method in which a release paper is coated and dried, and then the
adhesive layer is transferred to a SPVC film), and a simple direct
coating method cannot be used. Since during a direct coating
process, in order to increase the coating speed, it is necessary to
raise the temperature of the rubber-based hot-melt
pressure-sensitive adhesive to 150.degree. C. or more to lower the
viscosity, so that coating can be carried out normally (the most
common method). However, the increase in the temperature of the
adhesive during coating will have many negative effects, such as
the destruction to substrates that cannot stand high temperature
(especially SPVC substrates) to cause thermal deformation or even
thermal degradation and also increased instability of the adhesive.
The UV-crosslinkable hot-melt pressure-sensitive adhesive used in
the present invention has a lower melt viscosity than that of the
rubber-based hot-melt pressure-sensitive adhesive and can be
directly coated on a SPVC substrate at a low temperature
(130-150.degree. C.), without destroying the soft polyvinyl
chloride film substrate. In the present invention, the SPVC
substrate is also cooled during the coating process to achieve the
purpose of further protection.
[0022] The main component in known UV-crosslinkable hot-melt
pressure-sensitive adhesive is a mixture of acrylate monomers and
their copolymers. Among the acrylate monomers, in addition to the
commonly used n-butyl acrylate, isooctyl acrylate, acrylic acid,
methacrylic acid, hydroxyethyl acrylate, and hydroxypropyl
acrylate, special monomers such as methacrylamide, N-hydroxy
methacrylamide, N-butoxyacrylamide, and .beta.-CEA, may also be
used. Other special soft monomers, such as n-octyl acrylate,
dibutyl maleate, dioctyl maleate and norbornyl acrylate or mixtures
thereof, may also be used sometimes. In order to increase the
adhesion power, a tackifying resin such as a rosin resin, a terpene
resin, a petroleum resin or its corresponding hydrogenated or
esterified modified resin or the like may be used. In order to
prevent the aging of the adhesive, an appropriate amount of an
antioxidant is usually added. The UV-crosslinkable hot-melt
pressure-sensitive adhesive needs to further contain one or more
photoinitiators. The most commonly used photoinitiators include
derivatives of acetophenone and benzophenone. The photoinitiator
generates a radical group under the irradiation of ultraviolet
light, more specifically under the irradiation of UVC, to further
polymerize the acrylate monomers in the adhesive and crosslink the
acrylate polymers for curing.
[0023] In the composition of the UV-crosslinkable hot-melt
pressure-sensitive adhesive used in the present invention, in
addition to the above components, a copolymer of one or more
polymerizable photoinitiators and an acrylate monomer, or a mixture
of an oligomer containing one or more polymerizable photoinitiators
and an acrylate polymer may be further contained. The polymerizable
photoinitiator is an acetophenone or benzophenone derivative
containing a methacryloyloxy group or an acryloyloxy group, for
example, 2-hydroxy-4-(methacryloyloxy) benzophenone. Therefore, the
oligomer containing a polymerizable photoinitiator can lower the
viscosity of the hot-melt adhesive, thereby reducing the coating
temperature to provide a better protection for the polyvinyl
chloride substrate. The use of a high molecular-weight
photoinitiator in the composition of the UV-crosslinkable hot-melt
pressure-sensitive adhesive can further reduce the volatility of
the adhesive layer, such that the adhesive tape can well meet the
requirement of environmental protection.
[0024] The method for preparing a novel high temperature-resistant
polyvinyl chloride adhesive tape provided in the present invention
is implemented by a hot melt coater in a slot-die coating, a bar
coating or an extrusion laminating process. The high
temperature-resistant polyvinyl chloride film substrate is mounted
on an unwinding roller and led to a winding roller. The temperature
of the adhesive melting oven is set to 130-140.degree. C., the
temperature of the coating head is set to 130-150.degree. C., and
the ratio of the rotational speed of the adhesive pump to the speed
of the main machine is adjusted according to the weight of the
adhesive to be applied. The winding tension and unwinding tension
are set and a cooling unit is started. The speed of the main
machine is adjusted, and the coating head is moved slowly close to
the surface of the polyvinyl chloride film. The adhesive pump is
opened and the coating is initiated. The gap distance between the
coating head and the substrate is adjusted, and the speed of the
coater is adjusted for coating. In the present invention, the
hot-melt adhesive is coated in an amount of 10-35 g/cm.sup.2. The
adhesive layer is cross-linked and cured by UV irradiation with a
set of UV lamps. The UV lamp used in the present invention is a
high-pressure mercury lamp, a medium-to-low pressure mercury lamp
or an LED lamp, having a minimum UV irradiation energy reaching 10
mJ/cm.sup.2. The crosslinked and cured adhesive tape is wound and
cut to obtain the high temperature-resistant polyvinyl chloride
adhesive tape product. In order to prevent the polyvinyl chloride
film substrate from being damaged during UV irradiation during the
coating process, the polyvinyl chloride film should be protected by
cooling. The cooling method adopted in the present invention may be
water cooling or air cooling, or both water cooling and air cooling
may be used at the same time.
[0025] Performance test: The prepared UV-crosslinkable hot-melt
pressure-sensitive adhesive is coated as a hot melt to a polyvinyl
chloride film substrate having a thickness of 0.15 mm by the above
method, and a small roll of an electrical pressure-sensitive
adhesive tape with an adhesive layer having a thickness of 20 am is
obtained. After aging at 60.degree. C. for 8 hrs, the adhesion
properties are tested according to the following criteria: 1) The
peel strength at 180.degree. is tested according to the National
Standard of the People's Republic of China GB/T 2792-1998; 2) The
initial adhesion performance of the adhesive tape is tested
according to the National Standard of the People's Republic of
China GB/4852-1984; 3) The high-temperature resistance level is
evaluated according to VW60360 (LV312); and 4) The maintenance of
the adhesion power of the adhesive tape is tested according to the
National Standard of the People's Republic of China
GB/T4581-1988.
DETAILED DESCRIPTION
[0026] The illustrative and comparative examples of the present
invention are described in detail below. The illustrative examples
are provided for making the present invention clearer to those
skilled in the art and making the present invention implementable
based on the description herein. The specific examples are not
intended to limit the present invention, and the scope of the
present invention is defined by the appended claims.
[0027] In the examples and comparative examples provided in the
present invention, the following polyvinyl chloride films are used
respectively:
[0028] 1. High temperature-resistant polyvinyl chloride film having
a composition comprising, in percent by weight:
TABLE-US-00001 SG-3 polyvinyl chloride resin 57.5%.sup. Ethylene
glycol adipate plasticizer 25% Ethylene-methacrylate-carbonyl
polymer 4% Nitrile butadiene rubber powder 1.5% Liquid barium/zinc
stabilizer 2% Calcium carbonate 10%
[0029] The raw materials are mixed, and then mixed by a high-speed
mixer, milled in an open mill at a high temperature, extruded by an
extruder, and rolled at high temperature by a three-roll or a
four-roll calender to prepare a polyvinyl chloride film.
[0030] 2. Polyvinyl chloride films containing a DOP plasticizer are
generally available from the market.
Example 1
[0031] An acrylate copolymer of n-butyl acrylate, isooctyl
acrylate, methyl acrylate, and acrylic acid with a copolymerizable
photoinitiator was applied to the above-mentioned high
temperature-resistant polyvinyl chloride film through a process as
described above to prepare a polyvinyl chloride adhesive tape. The
coating temperature was 140.degree. C.
Example 2
[0032] An acrylate copolymer of n-butyl acrylate and acrylic acid
with a copolymerizable photoinitiator was applied to the
above-mentioned high temperature-resistant polyvinyl chloride film
through a process as described above, to prepare a polyvinyl
chloride adhesive tape. The coating temperature was 140.degree.
C.
Example 3
[0033] A mixture comprising 20% of an oligomer of n-butyl acrylate
and acrylic acid with a copolymerizable photoinitiator and 80% of
an acrylate polymer was applied to the above-mentioned high
temperature-resistant polyvinyl chloride film through a process as
described above, to prepare a polyvinyl chloride adhesive tape. The
coating temperature was 130.degree. C.
Comparative Example 1
[0034] If an acrylate copolymer of n-butyl acrylate, isooctyl
acrylate, methyl acrylate, and acrylic acid with a copolymerizable
photoinitiator was directly applied to a polyvinyl chloride film
containing a DOP plasticizer, the film wound be destroyed.
Therefore, in this comparative example, transfer coating was
employed, that is, the acrylate copolymer was coated onto a release
paper first, and then transferred to a polyvinyl chloride film
containing a DOP plasticizer. The coating temperature was
140.degree. C.
Comparative Example 2
[0035] The polyvinyl chloride adhesive tape for use in wiring
harness for automobile currently used in the industry is Huaxia
adhesive tape FC110 (high temperature-resistant PVC adhesive tape
for use in wiring harness for automobile, manufactured by Hebei
Huaxia Enterprise Co., Ltd.). The adhesive used is a solvent-type
rubber-based system, and the polyvinyl chloride film used is a high
temperature-resistant polyvinyl chloride film.
Comparative Example 3
[0036] The polyvinyl chloride adhesive tape for use in wiring
harness for automobile currently used in the industry is Huaxia
adhesive tape UD110 (PVC adhesive tape for use in wiring harness
for automobile, manufactured by Hebei Huaxia Enterprise Co., Ltd.).
The adhesive used is a solvent-type rubber-based system, and the
polyvinyl chloride film used is a polyvinyl chloride film a
containing a DOP plasticizer.
TABLE-US-00002 TABLE 1 Performance data of adhesive tapes
manufactured Comparative Comparative Comparative Example 1 Example
2 Example 3 Example 1 Example 2 Example 3 Peel strength at
180.degree. 1.3 1.7 1.5 Serious "adhesive 1.5 1.2 from steel plate,
N/cm loss" occurs upon Initial adhesion 17 19 18 unrolling of the
16 16 power, number of ball adhesive tape, and Maintenance of 240
300 270 various 200 180 adhesion power, min performances are failed
to be tested Temperature 125 125 125 -- 105 80 resistance level,
.degree. C. Aging test at 60.degree. C. for No No No -- No adhesive
No adhesive 8 hrs adhesive adhesive adhesive loss occurs loss
occurs loss loss loss upon upon occurs occurs occurs unrolling
unrolling upon upon upon unrolling unrolling unrolling
[0037] From the performance data of Examples 1-3 in Table 1, it can
be seen that the UV-crosslinkable hot-melt pressure-sensitive
adhesive can significantly improve the high-temperature resistance
of the polyvinyl chloride adhesive tape, reaching a temperature
resistance level of 125.degree. C. The adhesive tape prepared with
a solvent-type rubber has a high-temperature resistance level of
105.degree. C. (Comparative Example 2). As can be known from the
test results of Comparative Examples 1 and 3, UV-crosslinkable
hot-melt pressure-sensitive adhesive has a resistance to
low-molecular weight plasticizers that is not as good as that of
the solvent-type rubber. In general, the UV-crosslinkable hot-melt
pressure-sensitive adhesive is suitable for application to a high
temperature-resistant polyvinyl chloride film containing a
polymeric plasticizer, and the manufactured adhesive tape meets the
industrial application specifications. In addition, the adhesive
tape has excellent high-temperature resistance, is suitable for the
wrapping and bundling of cable bundles, and especially suitable for
the wrapping and bundling of cable bundles in automobile
bodies.
* * * * *