U.S. patent application number 17/518311 was filed with the patent office on 2022-06-02 for probe card and manufacturing method thereof.
This patent application is currently assigned to MPI Corporation. The applicant listed for this patent is MPI Corporation. Invention is credited to Chien-Kai Hung, Che-Wei Lin, Chin-Yi Lin, Ting-Ju Wu.
Application Number | 20220170961 17/518311 |
Document ID | / |
Family ID | |
Filed Date | 2022-06-02 |
United States Patent
Application |
20220170961 |
Kind Code |
A1 |
Lin; Chin-Yi ; et
al. |
June 2, 2022 |
PROBE CARD AND MANUFACTURING METHOD THEREOF
Abstract
A probe card and a manufacturing method of a probe card are
provided. The probe card includes a probe head, first and second
substrates, a first elastic component, and a first adhesive member.
The second substrate is disposed between the probe head and the
first substrate, and is disposed on the first substrate. The second
substrate faces the first substrate and includes second contacts.
The second contacts are electrically connected to first contacts of
the first substrate. The first elastic component is disposed
between the first substrate and the second substrate, and disposed
at an outer side of the second contacts. The first adhesive member
is disposed on the first substrate, annularly arranged on the side
surface of the second substrate, and disposed at an outer side of
the first elastic component.
Inventors: |
Lin; Chin-Yi; (Hsinchu
County, TW) ; Lin; Che-Wei; (Hsinchu County, TW)
; Wu; Ting-Ju; (Hsinchu County, TW) ; Hung;
Chien-Kai; (Hsinchu County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MPI Corporation |
Hsinchu County |
|
TW |
|
|
Assignee: |
MPI Corporation
Hsinchu County
TW
|
Appl. No.: |
17/518311 |
Filed: |
November 3, 2021 |
International
Class: |
G01R 3/00 20060101
G01R003/00; G01R 1/073 20060101 G01R001/073 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 30, 2020 |
TW |
109142123 |
Claims
1. A probe card, comprising: a probe head; a first substrate
comprising an upper surface, wherein the upper surface comprises a
plurality of first contacts; a second substrate disposed between
the probe head and the first substrate, and disposed on the upper
surface of the first substrate, wherein the second substrate
comprises a lower surface and a side surface; the lower surface of
the second substrate faces the upper surface of the first
substrate, the lower surface of the second substrate comprises a
plurality of second contacts, and each of the second contacts is
electrically connected to a corresponding first contact; a first
elastic component disposed between the upper surface of the first
substrate and the lower surface of the second substrate, and
disposed at an outer side of the second contacts of the second
substrate; and a first adhesive member disposed on the upper
surface of the first substrate and annular arranged on the side
surface of the second substrate, wherein the first adhesive member
is disposed at an outer side of the first elastic component.
2. The probe card according to claim 1, wherein, the second
substrate further comprises an upper surface and an inner wire, and
the upper surface of the second substrate comprises a plurality of
fourth contacts; the probe card further comprises: a third
substrate disposed between the probe head and the second substrate
and disposed on the upper surface of the second substrate, wherein
the third substrate comprises a lower surface and a side surface;
the lower surface of the third substrate faces the upper surface of
the second substrate, the lower surface of the third substrate
comprises a plurality of third contacts, and the internal wire is
electrically connected to each of the first contacts, a
corresponding second contact, a corresponding third contact, and a
corresponding fourth contact; a second elastic component disposed
on the upper surface of the second substrate and the lower surface
of the third substrate, and disposed at an outer side of the third
contacts of the third substrate; and a second adhesive member
disposed on the upper surface of the second substrate and annularly
arranged on the side surface of the third substrate, wherein the
second adhesive member is disposed at an outer side of the second
elastic component.
3. The probe card according to claim 2, wherein the first adhesive
member and the second adhesive member are connected to each other
to form a third adhesive member.
4. The probe card according to claim 1, wherein the first elastic
component comprises at least one first through hole, and through
the at least one first through hole, an atmosphere is in
communication with a space between the first substrate and the
second substrate.
5. The probe card according to claim 4, wherein the first adhesive
member is adjacently connected to the first elastic component and
comprises at least one second through hole opposite to the at least
one first through hole, and a hole diameter of the at least one
second through hole is greater than or equal to a hole diameter of
the at least one first through hole.
6. The probe card according to claim 5, wherein the second
substrate comprises a plurality of side surfaces, the first
adhesive member comprises the at least one second through hole
corresponding to each of the plurality of side surfaces of the
second substrate.
7. The probe card according to claim 1, wherein the first adhesive
member is attached to the side surface of the second substrate, and
a height of the first adhesive member is greater than or equal to
one-fourth of a height of the side surface of the second substrate
and is less than or equal to a height of the upper surface of the
second substrate.
8. The probe card according to claim 7, wherein the first adhesive
member is attached to the side surface of the second substrate, and
the height of the first adhesive member is greater than or equal to
one-second of the height of the side surface of the second
substrate and is less than or equal to the height of the upper
surface of the second substrate.
9. The probe card according to claim 1, wherein the first elastic
component has a first expansion coefficient, the first adhesive
member has a second expansion coefficient, and the first expansion
coefficient is less than the second expansion coefficient.
10. The probe card according to claim 1, wherein a first adhesive
force is between the first elastic component and the second
substrate, a second adhesive force is between the first adhesive
member and the second substrate, and the first adhesive force is
less than the second adhesive force.
11. A manufacturing method of a probe card, wherein the probe card
comprises a first substrate, a second substrate, and a probe head,
an upper surface of the first substrate comprises a plurality of
first contacts, and a lower surface of the second substrate
comprises a plurality of second contacts, wherein the manufacturing
method comprises: disposing the second substrate on the upper
surface of the first substrate, wherein each of the second contacts
is electrically connected to a corresponding first contact;
disposing a first elastic component between the first substrate and
the second substrate, wherein the first elastic component is at an
outer side of the second contacts of the second substrate;
disposing a first adhesive member on the upper surface of the first
substrate, wherein the first adhesive member is annularly arranged
on a side surface of the second substrate and an outer side of the
first elastic component; and solidifying the first adhesive
member.
12. The manufacturing method according to claim 11, wherein, the
step of disposing the first elastic component further comprises
providing a first through hole on the first elastic component; and
the step of disposing the first adhesive member further comprises
providing a second through hole on the first adhesive member, so
that the second through hole of the first adhesive member is in
communication with the first through hole of the first elastic
component.
13. The manufacturing method according to claim 11, wherein the
probe card further comprises a third substrate, a lower surface of
the third substrate comprises a plurality of third contacts, and an
upper surface of the second substrate comprises a plurality of
fourth contacts, wherein the manufacturing method further
comprises: disposing the third substrate on the upper surface of
the second substrate, wherein each of the third contacts is
electrically connected to a corresponding fourth contact; disposing
a second elastic component between the second substrate and the
third substrate, wherein the second elastic component is at an
outer side of the third contacts of the third substrate; disposing
a second adhesive member on the upper surface of the second
substrate, wherein the second adhesive member is annularly arranged
on a side surface of the third substrate and an outer side of the
second elastic component; and solidifying the second adhesive
member.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This non-provisional application claims priority under 35
U.S.C. .sctn. 119(a) to Patent Application No. 109142123 in Taiwan,
R.O.C. on Nov. 30 2020, the entire contents of which are hereby
incorporated by reference.
BACKGROUND
Technical Field
[0002] The instant disclosure relates to a probe card and a
manufacturing method of probe card.
Related Art
[0003] Probe card is a signal transmission interface between the
testing device and the device under test (DUT). For some of the
probe card products involving soldering procedures, when the probe
of the probe head of the probe card contacts the device under test,
the probe head suffers the normal force generated on the contact
surface. As a result, the soldering contacts on the substrate of
the probe card is broken. FIG. 1A illustrates a schematic static
view of a probe card known to the inventor. As shown, the probe
card manufactured by a soldering procedure known to the inventor
includes a testing circuit board 7, a substrate 2, and a probe head
11. The substrate 2 is soldered on the testing circuit board 7
through solder balls to form a plurality of soldering contacts 4.
FIG. 1B illustrates a schematic operational view of the probe card
known to the inventor. As shown in FIG. 1B, when the probe of the
probe head 11 contacts the device under test to suffer the normal
force 5, the substrate 2 connected to the probe head 11 is bent, so
that the soldering contacts 4 at a periphery of the substrate 2
suffer an extension stress along a vertical direction as shown in
the figure. Accordingly, the soldering contacts 4 at the periphery
of the substrate 2 will be broken, thereby making the signal
transmission loop be short-circuited.
SUMMARY
[0004] FIG. 2A illustrates an enlarged partial view of the enclosed
portion of the probe card shown in FIG. 1A. In order to solve the
issue that the soldering contacts 4 at the periphery of the
substrate 2 are prone to get broken, the inventor tried to use an
adhesive 3 to position the periphery of the substrate 2. FIG. 2B
illustrates a schematic view showing that the probe card shown in
FIG. 1A is applied with adhesive. As shown in FIG. 2B, the adhesive
3 is adhered to the periphery of the substrate 2 to prevent the
soldering contacts 4 from being broken. The function of the
adhesive 3 is to fill the vertical gap between the periphery of the
substrate 2 and the testing circuit board 7 to prevent the
soldering contacts 4 from having cracks or being broken upon the
substrate 2 is deformed. However, the adhesive 3 is prone to flow
into the space between the substrate 2 and the testing circuit
board 7 to enclose some of the soldering contacts 4. Therefore, in
the case that the probe card is to be repaired as well as that the
substrate 2 and the probe head have to be unsoldered and detached
from each other, if some of the soldering contacts 4 are already
enclosed and secured by the adhesive 3, the difficulty for the
detaching procedure and the possibility for damaging the contacts
are both increased, thus causing waste of resources and increased
manufacturing costs.
[0005] In view of this, a probe card is provided. In one
embodiment, the probe card comprises a probe head, a first
substrate, a second substrate, a first elastic component, and a
first adhesive member. The first substrate comprises an upper
surface and the upper surface comprises a plurality of first
contacts. The second substrate is disposed between the probe head
and the first substrate, and is disposed on the upper surface of
the first substrate. The second substrate comprises a lower surface
and a side surface. The lower surface of the second substrate faces
the upper surface of the first substrate. The lower surface of the
second substrate comprises a plurality of second contacts. Each of
the second contacts is electrically connected to a corresponding
first contact. The first elastic component is disposed between the
upper surface of the first substrate and the lower surface of the
second substrate, and the first elastic component is disposed at an
outer side of the second contacts of the second substrate. The
first adhesive member is disposed on an upper surface of the first
substrate, annularly arranged on the side surface of the second
substrate, and disposed at an outer side of the first elastic
component.
[0006] Moreover, a manufacturing method of a probe card is also
provided. In one embodiment, the probe card comprises a first
substrate, a second substrate, and a probe head. An upper surface
of the first substrate comprises a plurality of first contacts. A
lower surface of the second substrate comprises a plurality of
second contacts. The manufacturing method comprises disposing the
second substrate on the upper surface of the first substrate,
wherein each of the second contacts is electrically connected to a
corresponding first contact. The manufacturing method further
comprises disposing a first elastic component between the first
substrate and the second substrate, wherein the first elastic
component is at an outer side of the second contacts of the second
substrate. the manufacturing method further comprises disposing a
first adhesive member on the upper surface of the first substrate,
wherein the first adhesive member is annularly arranged on a side
surface of the second substrate and is on an outer side of the
first elastic component. Moreover, the manufacturing method further
comprises solidifying the first adhesive member.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The disclosure will become more fully understood from the
detailed description given herein below for illustration only, and
thus not limitative of the disclosure, wherein:
[0008] FIG. 1A illustrates a schematic static view of a probe card
known to the inventor;
[0009] FIG. 1B illustrates a schematic operational view of the
probe card known to the inventor;
[0010] FIG. 2A illustrates an enlarged partial view of the enclosed
portion of the probe card shown in FIG. 1A;
[0011] FIG. 2B illustrates a schematic view showing that the probe
card shown in FIG. 1A is applied with adhesive;
[0012] FIG. 3A illustrates a schematic view of a probe card
according an exemplary embodiment of the instant disclosure;
[0013] FIG. 3B illustrates an enlarged partial view of the enclosed
portion of the probe card shown in FIG. 3A;
[0014] FIG. 4 illustrates a schematic view of a probe card
according to another exemplary embodiment of the instant
disclosure;
[0015] FIG. 5 illustrates a schematic view showing an exemplary
configuration of a third adhesive member of a probe card according
to an exemplary embodiment of the instant disclosure;
[0016] FIG. 6 illustrates a schematic view showing an exemplary
configuration of a first elastic component and a first adhesive
member of a probe card according to an exemplary embodiment of the
instant disclosure;
[0017] FIG. 7 illustrates a schematic view showing another
exemplary configuration of the first elastic component and the
first adhesive member of the probe card according to the exemplary
embodiment of the instant disclosure;
[0018] FIG. 8 illustrates a flowchart of a manufacturing method of
probe card according to an exemplary embodiment of the instant
disclosure; and
[0019] FIG. 9 illustrates a flowchart of a manufacturing method of
probe card according to another exemplary embodiment of the instant
disclosure.
DETAILED DESCRIPTION
[0020] FIG. 3A illustrates a schematic view of a probe card
according an exemplary embodiment of the instant disclosure. As
shown in FIG. 3A, in this embodiment, the probe card 10 comprises a
probe head 11, a first substrate 12, a second substrate 13, a first
elastic component 14, and a first adhesive member 15. The first
substrate 12 comprises an upper surface 121. The upper surface 121
comprises a plurality of first contacts 1211. The second substrate
13 is disposed between the probe head 11 and the first substrate
12, and is disposed on the upper surface 121 of the first substrate
12. The second substrate 13 comprises a lower surface 132 and a
side surface 133. The lower surface 132 of the second substrate 13
faces the upper surface 121 of the first substrate 12. The lower
surface 132 of the second substrate 13 comprises a plurality of
second contacts 1321. Each of the second contacts 1321 is
electrically connected to a corresponding first contact 1211. The
first elastic component 14 is disposed between the upper surface
121 of the first substrate 12 and the lower surface 132 of the
second substrate 13, and the first elastic component 14 is disposed
at an outer side of the second contacts 1321 of the second
substrate 13. The first adhesive member 15 is disposed on the upper
surface 121 of the first substrate 12, annularly arranged on the
side surface 133 of the second substrate 13, and disposed at an
outer side of the first elastic component 14.
[0021] The probe head 11 are provided with several probes 111. The
probe 111 is adapted to transmit the testing signal from the
testing device to the device under test and transmit the measured
result feedbacked by the device under test back to the testing
device. The electrical connection between the electrical contact of
the probe head 11 and the electrical contact of the second
substrate 13 may be, but not limited to, achieved by physically
contacting, soldering, or wiring, so that the electrical signals
can be transmitted between the probe head 11 and the second
substrate 13. According to some embodiments, the probe head 11 is
fixed on the first substrate 12 through a fixation base 19.
[0022] According to some embodiments, the first substrate 12 is a
printed circuit board. The first substrate 12 comprises the upper
surface 121, and the upper surface 121 comprises the first contacts
1211. According to some embodiments, the first substrate comprises
a wire, and the wire is adapted to allow the signals to be
transmitted between the probe card 10 and the testing device. The
first contacts 1211 are in conduction with the wire. The second
substrate 13 is disposed between the probe head 11 and the first
substrate 12, and is disposed on the upper surface 121 of the first
substrate 12, so that a multi-layer structure is formed. The second
substrate 13 may be, but not limited to, a printed circuit board, a
multilayer organic substrate (Multilayer Organ, MLO), or a
multilayer ceramic substrate (Multilayer Polymider Ceramic, MLC).
The second substrate 13 comprises the lower surface 132 and the
side surface 133. The lower surface 132 of the second substrate 13
faces the upper surface 121 of the first substrate 12. The lower
surface 132 of the second substrate 13 comprises a plurality of
second contacts 1321. The second contact 1321 of the second
substrate 13 is electrically connected to the first contact 1211 of
the first substrate 12. In one embodiment, the second substrate 13
may be an MLC substrate with a higher rigidity. Therefore, during
the testing, the bending of the second substrate 13 can be reduced,
thus decreasing the possibility of the breaking between the second
contact 1321 at the periphery of the second substrate 13 and the
first contact 1211. The electrical connection between the first
contact 1211 and the second contact 1321 may be, but not limited
to, achieved by physically contacting, soldering, reflow soldering,
or wiring. Moreover, the electrical connection is not limited to be
direct connection or indirect connection through other
components.
[0023] The first elastic component 14 may be, but not limited to
made of rubber, silicone, plastic, organic material, or combination
of the materials. According to some embodiments, the first elastic
component 14 is formed by solidifying an adhesive. The first
elastic component 14 is disposed between the upper surface 121 of
the first substrate 12 and the lower surface 132 of the second
substrate 13. According to some embodiments, the first elastic
component 14 is completely in the space between the first substrate
12 and the second substrate 13. According to some embodiments,
parts of the first elastic component 14 are in the space between
the first substrate 12 and the second substrate 13. The first
elastic component 14 is disposed at an outer side of the second
contacts 1321 of the second substrate 13. According to some
embodiments, the first elastic component 14 is disposed at the
outer side of all of the second contacts 1321 of the second
substrate 13. In this embodiment, the sentence that "the first
elastic component 14 is disposed at the outer side of the second
contacts 1321" indicates that, the first elastic component 14 is
not located between any of two assigned second contacts 1321. In
other words, in this embodiment, the connection line of the two
second contacts 1321 does not pass through the first elastic
component 14. For example, in some embodiments, the second contacts
1321 are near the middle portion of the substrate, and the first
elastic component is near the periphery of the outer side of the
second substrate 13. Therefore, all the second contacts 1321 are
surrounded by the first elastic component 14. In this embodiment,
the first elastic component 14 has a first elasticity, the first
adhesive member 15 has a second elasticity, and the first
elasticity is greater than the second elasticity.
[0024] In some embodiments, the upper surface of the first elastic
component 14 abuts against the lower surface 132 of the second
substrate 13, and the lower surface of the first elastic component
14 abuts against the upper surface 121 of the first substrate 12,
respectively. The first elastic component 14 is positioned between
the upper surface 121 of the first substrate 12 and the lower
surface 132 of the second substrate 13 through the friction between
the first elastic component 14 and the first substrate 12 as well
as the friction between the first elastic component 14 and the
second substrate 13.
[0025] According to some embodiments, the first elastic component
14 is provided as a support for the second substrate 13 to prevent
the deformation of the second substrate 13 upon the second
substrate 13 is applied with an external force.
[0026] The first adhesive member 15 is disposed on the upper
surface 121 of the first substrate 12 and is annularly arranged on
the side surface 133 of the second substrate 13. Therefore, the
first substrate 12 and the third substrate 13 can be relatively
positioned with each other through the first adhesive member 15.
The term "annularly arranged" may indicate to dispose around the
periphery of the substrate, but not limited to, continuously
arranged, arranged with a fixed interval, or arranged with unfixed
intervals. The first adhesive member 15 is disposed at an outer
side of the first elastic component 14. According to some
embodiments, the first adhesive member 15 is adjacently connected
to the first elastic component 14. According to some embodiments,
the first adhesive member 15 completely covers the first elastic
component 14. According to some embodiments, the first adhesive
member 15 covers parts of the first elastic component 14. According
to some embodiments, when the first adhesive member 15 is in the
fluid state (before being solidifying), the fluid-state first
adhesive member 15 is blocked by the first elastic component 14 and
cannot flow close to the second contacts 1321 (or the first
contacts 1211) between the first substrate 12 and the second
substrate 13. Therefore, the first adhesive member 15 can be
prevented from flowing into the position near the first contacts
1211 or the position near the second contacts 1321. It is
understood that, once the adhesive flows into the portion near the
contacts, the unsoldering and detaching procedure for the first
substrate 12 and the second substrate 13 will be difficult, and the
first contacts 12111 or the second contacts 1321 will have apparent
damages. According to some embodiments, the first elastic component
14 has a first expansion coefficient, the first adhesive member 15
has a second expansion coefficient, and the first expansion
coefficient is less than or equal to the second expansion
coefficient. Accordingly, in this embodiment, in the temperature
rising process for the testing environment, the probe card 10 will
not have excessive deformation to lift up the second substrate 13.
With the consideration that the first adhesive member 15 is
attached to the second substrate 13, the first adhesive member 15
should have a proper affinity to the surface of the first substrate
12 or the second substrate 13; further, the first adhesive member
15 should have a lower flowability to allow the first adhesive
member 15 to form an inclined plane before being solidified, so
that the first adhesive member 15 can be properly attached to the
first substrate 12 or the second substrate 13. Therefore, according
to some embodiments, a first adhesive force is between the first
elastic component 14 and the second substrate 13, a second adhesive
force is between the first adhesive member 15 and the second
substrate 13, and the first adhesive force is less than the second
adhesive force. Furthermore, as described in the foregoing
embodiments, the first elastic component 14 may be formed by
solidifying an adhesive. Therefore, the first elastic component has
a first adhesive force. When the first elastic component 14 is
disposed between the first substrate 12 and the second substrate
13, the first elastic component 14 is adhered to the upper surface
121 of the first substrate 12 and the lower surface 132 of the
second substrate 13, indicating that there is no gap between the
first substrate 12 and the first elastic component 14, and between
the second substrate 13 and the first elastic component 14. Hence,
during the disposing the first adhesive member 15 on the first
substrate 12, the first adhesive member 15 is blocked by the first
elastic component 14 and does not flow into or flow into the space
formed between the first substrate 12 and the second substrate 13.
In order to ensure that the first adhesive member 15 is adhered to
the second substrate 13 to prevent the deformation of the second
substrate 13 upon the second substrate 13 is applied with an
external force, the second adhesive force should be large enough.
Moreover, in order to allow the first substrate 12 and the second
substrate 13 to be detached from each other for repairment (for
example, to allow the first substrate 12 and the second substrate
13 to be detached from each other by unsoldering procedures), the
first adhesive force between the first elastic component 14 and the
second substrate 13 should be small enough to reduce the difficulty
for the detaching procedure and to prevent the first substrate 12
or the second substrate 13 from getting damaged.
[0027] FIG. 4 illustrates a schematic view of a probe card
according to another exemplary embodiment of the instant
disclosure. As shown in FIG. 4, in this embodiment, the probe card
20 comprises a probe head 11, a first substrate 12, a second
substrate 13, a third substrate 16, a first elastic component 14, a
second elastic component 17, a first adhesive member 15, and a
second adhesive member 18. The second substrate 13 comprises an
upper surface 131, a lower surface 132, a side surface 133, and
internal wires 134. The upper surface 131 of the second substrate
13 comprises a plurality of fourth contacts 1311. The third
substrate 16 is disposed between the probe head 11 and the second
substrate 13, and is disposed on the upper surface 131 of the
second substrate 13. Therefore, in this embodiment, a multilayered
structure comprising the first substrate 12, the second substrate
13, the third substrate 16, and the probe head 11 is formed. The
third substrate 16 may be, but not limited to, a printed circuit
board, an MLO, or an MLC. The third substrate 16 comprises an upper
surface 161, a lower surface 162, and a side surface 163, and the
lower surface 162 of the third substrate 16 faces the upper surface
131 of the second substrate 13. The lower surface 162 of the third
substrate 16 comprises a plurality of third contacts 1621, and
third contact 1621 of the third substrate 16 is electrically
connected to the fourth contact 1311 of the second substrate 13.
The internal wire 134 of the second substrate 13 is electrically
connected to the second contact 1321 of the second substrate 13 and
the fourth contact 1311 of the second substrate 13. Therefore, the
first contact 1211 of the first substrate 12, the second contact
1321 of the second substrate 13, the fourth contact 1311 of the
second substrate 13, and the third contact 1621 of the third
substrate 16 are in conduction with each other to transmit
electrical signals. According to some embodiments, two internal
wires 134 in the second substrate 13 are in conduction with two
second contacts 1321 and two fourth contacts 1311 separately, and
the spacing between the two adjacent second contacts 1321 is
greater than the spacing between the two adjacent fourth contacts
1311. Therefore, through spacing adjustment, the original spacing
between the probes 111 can be enlarged to correspond to the spacing
of the first contacts 1211 of the first substrate 12 of the probe
card 20. According to some embodiment, the spacing between the two
adjacent second contacts 1321 of the second substrate 13 is greater
than the spacing between the two adjacent fourth contacts 1311 of
the second substrate 13. According to some embodiments, the third
substrate 16 is electrically connected to the probe head 11, and
the third substrate 16 also has internal wires for adjusting the
spacing between contacts. Therefore, the third substrate 16 can be
provided for rearranging the contacts.
[0028] The second elastic component 17 may be, but not limited to
made of rubber, silicone, plastic, organic material, or combination
of the materials. According to some embodiments, the second elastic
component 17 is formed by solidifying an adhesive. The second
elastic component 17 is disposed between the upper surface 131 of
the second substrate 13 and the lower surface 162 of the third
substrate 16. According to some embodiments, the second elastic
component 17 is completely in the space formed between the second
substrate 13 and the third substrate 16. According to some
embodiments, parts of the second elastic component 17 is in the
space formed between the second substrate 13 and the third
substrate 16. The second elastic component 17 is disposed at an
outer side of the third contacts 1621 of the third substrate 16.
According to some embodiments, the second elastic component 17 is
disposed at the outer side of all of the third contacts 1621 of the
third substrate 16.
[0029] In some embodiments, the upper surface of the second elastic
component 17 abuts against the lower surface 162 of the third
substrate 16, and the lower surface of the second elastic component
17 abuts against the upper surface 131 of the second substrate 13,
respectively. The second elastic component 17 is positioned between
the upper surface 131 of the second substrate 13 and the lower
surface 162 of the third substrate 16 through the friction between
the second elastic component 17 and the second substrate 13 as well
as the friction between the second elastic component 17 and the
third substrate 16.
[0030] According to some embodiments, the second elastic component
17 is provided as a support for the third substrate 16 to prevent
the deformation of the third substrate 16 upon the third substrate
16 is applied with an external force.
[0031] The second adhesive member 18 is disposed on the upper
surface 131 of the second substrate 13 and is annularly arranged on
the side surface 163 of the third substrate 16. Therefore, the
second substrate 13 and the third substrate 16 can be relatively
positioned with each other through the second adhesive member 18.
According to some embodiments, the second adhesive member 18 is
adjacently connected to the second elastic component 17. According
to some embodiments, the second adhesive member 18 completely
covers the second elastic component 17. According to some
embodiments, the second adhesive member 18 covers parts of the
second elastic component 17. FIG. 5 illustrates a schematic view
showing an exemplary configuration of a third adhesive member of a
probe card according to an exemplary embodiment of the instant
disclosure. as shown in FIG. 5, according to the probe card 30 of
some embodiments, the first adhesive member 15 and the second
adhesive member 18 are made of the same material, and the first
adhesive member 15 is connected to the second adhesive member 18 to
form a third adhesive member 181.
[0032] FIG. 6 illustrates a schematic view showing an exemplary
configuration of a first elastic component and a first adhesive
member of a probe card according to an exemplary embodiment of the
instant disclosure. As shown in FIG. 6, the first elastic component
14 comprises a first through hole 141, and the atmosphere is in
communication with the space formed between the first substrate 12
and the second substrate 13. According to some embodiments, in
order to allow the probe card 10 to be disassembled for repairment,
the first elastic component 14 blocks the first adhesive member 15
from flowing into the space formed between the first substrate 12
and the second substrate 13. However, since the first adhesive
member 15 cannot be filled into the space formed between the first
substrate 12 and the second substrate 13, gas exists in the space
between the first substrate 12 and the second substrate instead.
Hence, when the probe card 10 is tested from one condition to
another condition involving different temperatures (room
temperature, high temperature, or low temperature), the expansion
and contraction of the gas may cause the breaking of the contacts
between the first substrate 12 and the second substrate 13 owing to
the material fatigue of the contacts. Therefore, according to some
embodiments, the first through hole 141 is provided as a channel
for gas communication to prevent the contacts between the first
substrate 12 and the second substrate 13 from suffering the
pressure caused by the gas. According to some embodiments, the
first adhesive member 15 comprises a second through hole 151, and
the second through hole 151 is in communication with the first
through hole 141. The first through hole 141 and the second through
hole 151 may be not limited to a circular shape, and also may be
not limited to be of a regular shape or an irregular shape.
According to some embodiments, the hole diameter of the through
hole may be the minimum internal diameter, the maximum internal
diameter, or the average internal diameter. According to some
embodiments, the hole diameter of the first through hole 141 may be
great enough to allow the first elastic component 14 to break into
separated parts.
[0033] According to some embodiments, the first elastic component
14 comprises a plurality of first through holes 141. FIG. 7
illustrates a schematic view showing another exemplary
configuration of the first elastic component and the first adhesive
member of the probe card according to the exemplary embodiment of
the instant disclosure. As shown in FIG. 7, the first elastic
component 14 comprises fourth first through holes 141, the first
adhesive member 15 comprises four second through holes 151, and
each of the first through holes 141 corresponds to and is in
communication with a corresponding second through hole 151.
According to some embodiments, the first adhesive member 15
comprises at least one second through hole 151 corresponding to
each of the sides surfaces 133 of the second substrate 13. For
example, as shown in FIG. 7, the second substrate 13 in a square
shape has four sides 133, the first adhesive member 15 is annularly
arranged on the four sides 133 of the second substrate 13, and the
first adhesive member 15 has one second through hole 151
corresponding to each of the side surfaces 133 of the second
substrate 13. According to some embodiments, the hole diameter 1511
of the second through hole 151 is greater than or equal to the hole
diameter 1411 of the first through hole 141. Therefore, before the
first adhesive member 15 is solidified, the unsolidified first
adhesive member 15 can be prevented from flowing through the first
through hole 141 to enter into the space formed between the first
substrate 12 and the second substrate 13.
[0034] According to some embodiments, the first adhesive member 15
is attached to the side surface 133 of the second substrate 13, and
a height of the first adhesive member 15 is greater than or equal
to one-fourth of a height of the side surface 133 of the second
substrate 13 and is less than or equal to a height of the upper
surface 131 of the second substrate 13. Therefore, it is ensured
that the first adhesive member 15 can be firmly attached to the
second substrate 13, without causing the first adhesive member 15
to be expanded to the upper surface 131 of the second substrate 13
and to be attached to the fourth contacts 1311 on the upper surface
131 of the second substrate 13. In one embodiment, the height of
the first adhesive member 15 is greater than or equal to one-second
of the height of the side surface 133 of the second substrate 13
and is less than or equal to the height of the upper surface 131 of
the second substrate 13. FIG. 3B illustrates an enlarged partial
view of the enclosed portion of the probe card shown in FIG. 3A. As
shown in FIG. 3B, the height of the first adhesive member 15, from
the upper surface 131 of the first substrate 12, extends toward the
top portion of the first adhesive member 15 at the side surface 133
of the second substrate 13. According to some embodiments, the
range 6 of the top portion of the first adhesive member 15 is
greater than or equal to one-fourth of the height of the side
surface 133 of the second substrate 13 (indicated as position 1331)
but does not exceed the range of the upper surface 131 of the
second substrate 13. For example, as shown in FIG. 3B, if the
distance between the lower surface 132 of the second substrate 13
and the upper surface 121 of the first substrate 12 is 100 unit,
and the height of the second substrate 13 is 100 unit, then the
distance between the top portion of the first adhesive member 15
and the upper surface 121 of the first substrate 12 may be in a
range between 125 and 200 unit. In one embodiment, the range 6 of
the top portion of the first adhesive member 15 is greater than or
equal to one-second of the side portion 133 of the second substrate
13 but does not exceed the range of the upper surface 131 of the
second substrate. For example, as shown in FIG. 3B, if the distance
between the lower surface 132 of the second substrate 13 and the
upper surface 121 of the first substrate 12 is 100 unit, and the
height of the second substrate 13 is 100 unit, then the distance
between the top portion of the first adhesive member 15 and the
upper surface 121 of the first substrate 12 may be in a range
between 150 and 200 unit.
[0035] FIG. 8 illustrates a flowchart of a manufacturing method of
probe card according to an exemplary embodiment of the instant
disclosure. In this embodiment, the manufacturing method comprises
following steps. Firstly, disposing the second substrate 13 on the
upper surface 121 of the first substrate 12 (the step S01). Then,
electrically connecting the second contact 1311 of the second
substrate 13 to the first contact 1211 of the first substrate. The
electrical connection may be for example, but not limited to,
physical contacting, soldering, reflow soldering, or wiring. Then,
disposing the first elastic component 14 between the first
substrate 12 and the second substrate 13, and the first elastic
component 14 is disposed at the outer side of the second contacts
1321 of the second substrate 13 (the step S02). Then, disposing the
first adhesive member 15 on the upper surface 121 of the first
substrate 12 and annularly arranging the first adhesive member 15
on the side surface 133 of the second substrate 13 and at the outer
side of the first elastic component 14 (the step S03). Therefore,
the first adhesive member 15 can be blocked by the first elastic
component 14 and prevented from flowing into the position near the
second contacts 1321 between the first substrate 12 and the second
substrate 13. Last, solidifying the first adhesive member 15 (the
step S04).
[0036] According to some embodiments, the step of disposing the
first elastic component 14 (the step S02) further comprises
providing a first through hole 141 on the first elastic component
14. Moreover, the step of disposing the first adhesive component 15
(the step S03) further comprises providing a second through hole
151 on the first elastic component 15, so that the second through
hole 151 of the first adhesive member 15 is in communication with
the first through hole 141 of the first elastic component 14.
According to some embodiments, the formation of the first through
hole 141 may be achieved by choosing the first elastic component 14
whose length is less than the perimeter of the second substrate 13.
Therefore, when the first elastic component 14 is disposed between
the first substrate 12 and the second substrate 13 along the
periphery of the second substrate 13, the first through hole 141 as
shown in FIG. 6 can be formed accordingly. In some embodiments, for
forming two first through holes 141, two first elastic components
14 can be chosen. When the two first elastic components 14 are
disposed between the first substrate 12 and the second substrate 13
along the periphery of the second substrate 13, the two first
elastic components 14 are spaced from each other, and two first
through holes 141 can be formed accordingly. Similarly, for forming
four first through holes 141 as shown in FIG. 7, four elastic
components 14 can be chosen. When the four first elastic component
14 are disposed between the first substrate 12 and the second
substrate 13 along the periphery of the second substrate 13, the
four first elastic components 14 are spaced from one another, and
four first through holes 141 can be formed accordingly.
Consequently, for forming different number of the second through
holes 151, in the subsequent steps, the first adhesive member 15 is
applied at the outer side of the first elastic component 14 without
overlapping the first through hole 141. Therefore, one or two or
four second through holes 151 corresponding to the first through
hole 141 can be formed accordingly.
[0037] FIG. 9 illustrates a flowchart of a manufacturing method of
probe card according to another exemplary embodiment of the instant
disclosure. In this embodiment, the manufacturing method comprises
following steps. Firstly, disposing the second substrate 13 on the
upper surface 121 of the second substrate 12 (the step S11). Then,
electrically connecting the second contact 1321 of the second
substrate 13 to the first contact 1211 of the first substrate 12.
The electrical connection may be for example, but not limited to,
physical contacting, soldering, reflow soldering, or wiring. Then,
disposing the first elastic component 14 between the first
substrate 12 and the second substrate 13, and the first elastic
component 14 is disposed at the outer side of the second contacts
1321 of the second substrate 13 (the step S12). Then, disposing the
first adhesive member 15 on the upper surface 121 of the first
substrate 12 and annularly arranging the first adhesive member 15
on the side surface 133 of the second substrate 13 and at the outer
side of the first elastic component 14 (the step S13). Therefore,
the first adhesive member 15 can be blocked by the first elastic
component 14 and prevented from flowing into the position near the
second contacts 1321 between the first substrate 12 and the second
substrate 13.
[0038] Then, solidifying the first adhesive member 15 (the step
S14). Disposing the third substrate 16 on the upper surface 131 of
the second substrate 13 (the step S15), and electrically connecting
the third contact 1621 of the third substrate 16 to the fourth
contact 1311 of the second substrate 13. The electrical connection
may be for example, but not limited to, physical contacting,
soldering, reflow soldering, or wiring. Then, disposing the second
elastic component 17 between the second substrate 13 and the third
substrate 16, and the second elastic component 17 is disposed at
the outer side of the third contacts 1621 of the third substrate 16
(the step S16). Next, disposing the second adhesive member 18 on
the upper surface 131 of the second substrate 13, and annularly
arranging the second adhesive member 18 on the side surface 163 of
the third substrate and at the outer side of the second elastic
component 17 (the step S17). Therefore, the second adhesive member
18 can be blocked by the second elastic component 17 and prevented
from flowing into the position near the third contacts 1621 between
the second substrate 13 and the third substrate 16. Last,
solidifying the second adhesive member 18 (the step S18). It is
understood that, the steps are not necessarily executed in order.
For example, in one embodiment, the steps S15 to S18 may be
executed firstly, and then the steps S11 to S14 are executed.
[0039] While the instant disclosure has been described by the way
of example and in terms of the preferred embodiments, it is to be
understood that the invention need not be limited to the disclosed
embodiments. On the contrary, it is intended to cover various
modifications and similar arrangements included within the spirit
and scope of the appended claims, the scope of which should be
accorded the broadest interpretation so as to encompass all such
modifications and similar structures.
* * * * *