U.S. patent application number 17/649361 was filed with the patent office on 2022-05-12 for loudspeaker apparatus.
This patent application is currently assigned to SHENZHEN SHOKZ CO., LTD.. The applicant listed for this patent is SHENZHEN SHOKZ CO., LTD.. Invention is credited to Zhuyang JIANG, Chaowu LI, Fen YOU.
Application Number | 20220150616 17/649361 |
Document ID | / |
Family ID | |
Filed Date | 2022-05-12 |
United States Patent
Application |
20220150616 |
Kind Code |
A1 |
LI; Chaowu ; et al. |
May 12, 2022 |
LOUDSPEAKER APPARATUS
Abstract
The present disclosure discloses a loudspeaker apparatus,
including an earphone core housing configured to accommodate an
earphone core; and a circuit housing including an accommodating
body and a cover. The accommodating body may include a cavity with
an opening at one end, and the cover may be disposed on the opening
for sealing the cavity. The circuit housing may accommodate a
control circuit. The control circuit may drive the earphone core to
vibrate to generate sound. The loudspeaker apparatus may further
include an ear hook configured to connect the earphone core housing
and the circuit housing, and a button disposed at a button hole on
the circuit housing. The button may move relative to the button
hole to generate a control signal for the control circuit. The
loudspeaker apparatus may further include an elastic pad disposed
between the button and the button hole. The elastic pad may hinder
a movement of the button toward the button hole. In the present
disclosure, a waterproof effect of the loudspeaker apparatus may be
improved and a space occupied by a button may be reduced by
providing an elastic pad between the button and the button
hole.
Inventors: |
LI; Chaowu; (Shenzhen,
CN) ; JIANG; Zhuyang; (Shenzhen, CN) ; YOU;
Fen; (Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SHENZHEN SHOKZ CO., LTD. |
Shenzhen, Guangdong |
|
CN |
|
|
Assignee: |
SHENZHEN SHOKZ CO., LTD.
Shenzhen, Guangdong
CN
|
Appl. No.: |
17/649361 |
Filed: |
January 29, 2022 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
17030484 |
Sep 24, 2020 |
|
|
|
17649361 |
|
|
|
|
PCT/CN2019/102387 |
Aug 24, 2019 |
|
|
|
17030484 |
|
|
|
|
International
Class: |
H04R 1/10 20060101
H04R001/10; H04R 1/02 20060101 H04R001/02; H04R 1/28 20060101
H04R001/28 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 5, 2019 |
CN |
201910009887.3 |
Claims
1. A loudspeaker apparatus, comprising: an earphone core housing
configured to accommodate an earphone core; a circuit housing
including an accommodating body and a cover, the accommodating body
including a cavity with an opening at one end, and the cover being
disposed on the opening for sealing the cavity, the circuit housing
accommodating a control circuit, the control circuit driving the
earphone core to vibrate to generate sound; an ear hook configured
to connect the earphone core housing and the circuit housing, the
ear hook being fixed to the circuit housing in a plug-in manner,
and the ear hook being injection-molded with a housing protective
sleeve; a button disposed at a button hole on the circuit housing,
the button moving relative to the button hole to generate a control
signal for the control circuit, and the housing protective sleeve
covering a periphery of the circuit housing and the button in a
sleeve manner; and an elastic pad disposed between the button and
the button hole, the elastic pad hindering a movement of the button
toward the button hole.
2. The loudspeaker apparatus of claim 1, wherein the circuit
housing further includes a main side wall and an auxiliary side
wall connected to the main side wall; and wherein an outer surface
of the auxiliary side wall includes a first recess region.
3. The loudspeaker apparatus of claim 2, wherein the elastic pad is
placed in the first recess region, the elastic pad including a
second recess region corresponding to the button hole, and the
second recess region extending into the button hole.
4. The loudspeaker apparatus of claim 3, wherein the button
includes a button body and a button contact, the button contact
extending into the second recess region, and the button body being
placed on a side of the button contact away from the elastic
pad.
5. The loudspeaker apparatus of claim 4, wherein the circuit
housing further accommodates a button circuit board, the button
circuit board including a button switch corresponding to the button
hole to allow the button contact to contact and trigger the button
switch when a user presses the button.
6. The loudspeaker apparatus of claim 4, wherein the button
includes at least two button monomers spaced from each other and a
connecting part for connecting the button monomers, wherein each of
the button monomers is provided with one button contact, and the
elastic pad further includes an elastic convex for supporting the
connecting part.
7. The loudspeaker apparatus of claim 3, wherein the loudspeaker
apparatus further includes a rigid pad disposed between the elastic
pad and the circuit housing, and the rigid pad includes a through
hole that allows the second recess region to pass through.
8. The loudspeaker apparatus of claim 7, wherein the elastic pad
and the rigid pad are closely fixed with each other.
9. The loudspeaker apparatus of claim 1, wherein the housing
protective sleeve is a bag-like structure with an opening at one
end, such that the circuit housing and the button enter the inside
of the housing protective sleeve through an opening end of the
housing protective sleeve.
10. The loudspeaker apparatus of claim 9, wherein the opening end
of the housing protective sleeve is disposed with a collar flange
protruding inward, an end of the circuit housing away from the ear
hook is stepped/in a step shape, thereby forming a circular table,
when the housing protective sleeve covers the periphery of the
circuit housing, the collar flange abuts the circular table.
11. The loudspeaker apparatus of claim 10, wherein a sealant is
applied to a connection region between the collar flange and the
circular table so as to seal and connect the housing protective
sleeve and the circuit housing.
12. The loudspeaker apparatus of claim 5, wherein the loudspeaker
apparatus further includes an auxiliary film including a board and
a pressing foot protruding from the board, and the pressing foot
being used to press the button circuit board on an inner surface of
the auxiliary side wall.
13. The loudspeaker apparatus of claim 12, wherein the main side
wall of the circuit housing includes at least one mounting hole,
and the loudspeaker apparatus further includes a conductive column
inserted into the mounting hole; and the board includes a hollow
region, wherein the board is disposed on an inner surface of the
main side wall, and the mounting hole is located inside the hollow
region, such that a glue tank is formed on a periphery of the
conductive column.
14. The loudspeaker apparatus of claim 13, wherein the hollow
region includes a notch, the inner surface of the main side wall is
integrated with a striped convex rib corresponding to the notch,
such that the striped convex rib and the auxiliary film are
combined to make the glue tank closed.
15. The loudspeaker apparatus of claim 13, wherein the conductive
column includes a columnar body inserted into the mounting hole, an
outer peripheral surface of the columnar body includes a locating
boss, the locating boss being clamped to the main side wall,
thereby fixing the conductive column to the mounting hole.
16. The loudspeaker apparatus of claim 1, wherein the cover
includes a bracket and a cover layer injection-molded integrally on
a surface of the bracket, the bracket being used to physically
connect the accommodating body, and the cover layer being used to
seal the cavity after the bracket is connected to the accommodating
body.
17. The loudspeaker apparatus of claim 16, wherein a shape of a
side of the bracket facing toward the accommodating body matches
the opening so as to snap onto the opening, and the cover layer
covers an outer surface of the bracket away from the accommodating
body.
18. The loudspeaker apparatus of claim 17, wherein, the bracket
includes an insertion part and a cover part, the cover part being
disposed on the opening, the insertion part being disposed on one
side of the cover part and extending into the cavity along an inner
wall of the cavity, so as to fix the cover part on the opening.
19. The loudspeaker apparatus of claim 18, wherein the
accommodating body includes an opening edge defining the opening,
the cover part is pressed on an inner region of the opening edge
near the opening, the cover layer covers an outer surface of the
cover part away from the accommodating body, and is pressed on an
outer region outside the inner region of the opening edge, thereby
sealing the cover layer and the opening edge.
20. The loudspeaker apparatus of claim 17, wherein a cavity of the
accommodating body includes a circuit component, the circuit
component including a switch; and the bracket includes a switch
hole corresponding to the switch, the cover layer covering the
switch hole and including a pressing part at a position
corresponding to the switch hole, the pressing part extending
toward the inside of the cavity through the switch hole; when a
corresponding position of the cover layer is pressed, the pressing
part pressing the switch on the circuit component, thereby
triggering the circuit component to perform a preset function.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser.
No. 17/030,484, filed on Sep. 24, 2020, which is a continuation of
International Application No. PCT/CN2019/102387 filed on Aug. 24,
2019, which claims priority of Chinese Patent Application No.
201910009887.3 filed on Jan. 5, 2019, the contents of each of which
are incorporated herein by reference.
TECHNICAL FIELD
[0002] The present disclosure relates to a loudspeaker apparatus,
and more particularly, relates to a loudspeaker apparatus having a
waterproof function.
BACKGROUND
[0003] In general, people can hear sound due to that vibrations are
transmitted to the eardrum through external ear canals through the
air, and vibrations formed by the eardrum drive the human auditory
nerve to perceive the vibrations of sound. At present, earphones
have been widely used in people's lives. For example, a user may
use earphones to play music, answer calls, etc. Earphones have
become an important item in people's daily lives. Ordinary
earphones can no longer meet the normal requirement of a user in
some special scenarios. For example, the user may need to control
the earphones through a button in a swimming scenario, a rainy
outdoor scenario, or the like. Earphones with waterproof function
and better sound quality are more favored by consumers. Therefore,
it is necessary to provide a loudspeaker apparatus with a
waterproof function.
SUMMARY
[0004] An embodiment of the present specification provides a
loudspeaker apparatus. The loudspeaker apparatus may include an
earphone core housing configured to accommodate an earphone core; a
circuit housing including an accommodating body and a cover. The
accommodating body may include a cavity with an opening at one end,
and the cover may be disposed on the opening for sealing the
cavity; the circuit housing may accommodate a control circuit, and
the control circuit may drive the earphone core to vibrate to
generate sound. The loudspeaker apparatus may further include an
ear hook configured to connect the earphone core housing and the
circuit housing; and a button disposed at a button hole on the
circuit housing, which may move relative to the button hole to
generate a control signal for the control circuit. And the
loudspeaker apparatus may further include an elastic pad disposed
between the button and the button hole. The elastic pad may hinder
a movement of the button toward the button hole.
[0005] In some embodiments, the circuit housing may further include
a main side wall and an auxiliary side wall connected to the main
side wall, wherein an outer surface of the auxiliary side wall may
include a first recess region. The elastic pad may be placed in the
first recess region. The elastic pad may include a second recess
region corresponding to the button hole. And the second recess
region may extend into the button hole.
[0006] In some embodiments, the button may include a button body
and a button contact. The button contact may extend into the second
recess region. And the button body may be placed on a side of the
button contact away from the elastic pad.
[0007] In some embodiments, the circuit housing may further
accommodate a button circuit board. The button circuit board may
include a button switch corresponding to the button hole to allow
the button contact to contact and trigger the button switch when a
user presses the button.
[0008] In some embodiments, the button may include at least two
button monomers spaced from each other and a connecting part for
connecting these button monomers, wherein each of the button
monomers may be provided with one button contact. And the elastic
pad may further include an elastic convex for supporting the
connecting part.
[0009] In some embodiments, the loudspeaker apparatus may further
include a rigid pad disposed between the elastic pad and the
circuit housing. The rigid pad may include a through hole that
allows the second recess region to pass through.
[0010] In some embodiments, the elastic pad and the rigid pad may
be closely fixed with each other.
[0011] In some embodiments, the ear hook may be fixed to the
circuit housing in a plug-in manner. The ear hook may be
injection-molded with a housing protective sleeve, wherein the
housing protective sleeve may cover a periphery of the circuit
housing and the button in a sleeve manner.
[0012] In some embodiments, the housing protective sleeve may be a
bag-like structure with an opening at one end, such that the
circuit housing and the button may enter the inside of the housing
protective sleeve through an opening end of the housing protective
sleeve.
[0013] In some embodiments, the opening end of the housing
protective sleeve may be disposed with a collar flange protruding
inward. The end of the circuit housing away from the ear hook may
be stepped/in a step shape, thereby forming a circular table. When
the housing protective sleeve covers the periphery of the circuit
housing, the collar flange may abut the circular table.
[0014] In some embodiments, a sealant may be applied to a
connection region between the collar flange and the circular table
so as to seal and connect the housing protective sleeve and the
circuit housing.
[0015] In some embodiments, the loudspeaker apparatus may further
include an auxiliary film including a board and a pressing foot
protruding from the board. The pressing foot may be used to press
the button circuit board on an inner surface of the auxiliary side
wall.
[0016] In some embodiments, the main side wall of the circuit
housing may include at least one mounting hole. And the loudspeaker
apparatus may further include a conductive column inserted into the
mounting hole. The board may include a hollow region, wherein the
board may be disposed on an inner surface of the main side wall,
and the mounting hole may be located inside the hollow region, such
that a glue tank may be formed on a periphery of the conductive
column.
[0017] In some embodiments, the hollow region may include a notch.
The inner surface of the main side wall may be integrated with a
striped convex rib corresponding to the notch, such that the
striped convex rib and the auxiliary film may be combined to make
the glue tank closed.
[0018] In some embodiments, the conductive column may include a
columnar body inserted into the mounting hole. An outer peripheral
surface of the columnar body may include a locating boss. The
locating boss may be clamped to the main side wall, thereby fixing
the conductive column to the mounting hole.
[0019] In some embodiments, the columnar body may be divided into a
first columnar body and a second columnar body along an insertion
direction of the columnar body with respect to the mounting hole. A
cross-section of the first columnar body perpendicular to the
insertion direction may be larger than a cross-section of the
second columnar body perpendicular to the insertion direction. The
locating boss may be placed on the second columnar body. The
mounting hole may be divided into a first hole section and a second
hole section with cross-sections corresponding to the first
columnar body and the second columnar body along the insertion
direction respectively, such that a circular table may be formed at
a junction of the first hole section and the second hole section.
When the columnar body is inserted into the mounting hole, the
first columnar body may be supported on the circular table, and the
locating boss may be clamped to the inner surface of the main side
wall.
[0020] In some embodiments, the columnar body may include an
accommodating chamber along an axial direction. An opening end of
the accommodating chamber may be on an end surface of the second
columnar body facing toward the inside of the circuit housing. And
the conductive column may further include a spring and a conductive
contact inside the accommodating chamber. One end of the conductive
contact may abut the spring, and another end may be exposed from
the opening end of the accommodating chamber. The loudspeaker
apparatus may further include a main control circuit board disposed
inside the circuit housing. The main control circuit board may
include a contact corresponding to a position of the conductive
column, and the spring may elastically press the conductive contact
on the contact.
[0021] In some embodiments, a main surface of the main control
circuit board may be axial vertically set respect to the conductive
column.
[0022] In some embodiments, the cover may include a bracket and a
cover layer injection-molded integrally on a surface of the
bracket. The bracket may be used to physically connect to the
accommodating body, and the cover layer may be used to seal the
cavity after the bracket is connected to the accommodating
body.
[0023] In some embodiments, a shape of a side of the bracket facing
toward the accommodating body may match the opening so as to snap
onto the opening, and the cover layer may cover an outer surface of
the bracket away from the accommodating body.
[0024] In some embodiments, the bracket may include an insertion
part and a cover part. The cover part may be disposed on the
opening. The insertion part may be disposed on one side of the
cover part and extending into the cavity along an inner wall of the
cavity, so as to fix the cover part on the opening.
[0025] In some embodiments, the accommodating body may include an
opening edge defining the opening. The cover part may be pressed on
an inner region of the opening edge near the opening. The cover
layer may cover an outer surface of the cover part away from the
accommodating body, and may be pressed on an outer region outside
the inner region of the opening edge, thereby sealing the cover
layer and the opening edge.
[0026] In some embodiments, in a snapped state, a contact end
surface between the cover part and the opening edge may be flush
with a contact end surface between the cover layer and the opening
edge. Or the cover layer may further extend between the cover part
and the opening edge, and may be pressed on the inner region of the
opening edge by the cover part.
[0027] In some embodiments, a cavity of the accommodating body may
include a circuit component. The circuit component may include a
switch. The bracket may include a switch hole corresponding to the
switch. The cover layer may cover the switch hole and include a
pressing part at a position corresponding to the switch hole. The
pressing part may extend toward the inside of the cavity through
the switch hole. When a corresponding position of the cover layer
is pressed, the pressing part may press the switch on the circuit
component, thereby triggering the circuit component to perform a
preset function.
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The present disclosure is further illustrated in terms of
exemplary embodiments. These exemplary embodiments are described in
detail with reference to the drawings. These embodiments are
non-limiting exemplary embodiments, in which a same number may
indicate a same structure throughout the several views of the
drawings, and wherein:
[0029] FIG. 1 is a schematic diagram illustrating a process in
which a loudspeaker apparatus causes auditory senses in a human
ear;
[0030] FIG. 2 is a schematic diagram illustrating the structure of
a loudspeaker apparatus according to some embodiments of the
present disclosure;
[0031] FIG. 3 is a schematic diagram illustrating a partial
structure of an ear hook in an MP3 player according to some
embodiments of the present disclosure;
[0032] FIG. 4 is a schematic diagram illustrating a partial
cross-section view of an MP3 player according to some embodiments
of the present disclosure;
[0033] FIG. 5 is a schematic diagram illustrating a partially
enlarged view of a part E in FIG. 2 according to some embodiments
of the present disclosure;
[0034] FIG. 6 is a schematic diagram illustrating an exploded view
of a circuit housing and a button mechanism according to some
embodiments of the present disclosure;
[0035] FIG. 7 is a schematic diagram illustrating partial
cross-section views of a circuit housing, a button mechanism, and
an ear hook according to some embodiments of the present
disclosure;
[0036] FIG. 8 is a schematic diagram illustrating a partially
enlarged view of a part G in FIG. 7 according to some embodiments
of the present disclosure;
[0037] FIG. 9 is a schematic diagram illustrating an exploded view
of partial structures of a circuit housing and an auxiliary film
according to some embodiments of the present disclosure;
[0038] FIG. 10 is a schematic diagram illustrating partial
structures of a circuit housing and an auxiliary film according to
some embodiments of the present disclosure;
[0039] FIG. 11 is a schematic diagram illustrating cross-section
views of a circuit housing, a conductive column, and a main control
circuit board according to some embodiments of the present
disclosure;
[0040] FIG. 12 is a schematic diagram illustrating a partially
enlarged view of part H in FIG. 11 according to some embodiments of
the present disclosure;
[0041] FIG. 13 is a schematic diagram illustrating the structure of
a conductive column according to some embodiments of the present
disclosure;
[0042] FIG. 14 is a schematic diagram illustrating an exploded view
of structures of an electronic component according to some
embodiments of the present disclosure;
[0043] FIG. 15 is a schematic diagram illustrating a partial
cross-section view of an electronic component according to some
embodiments of the present disclosure;
[0044] FIG. 16 is a schematic diagram illustrating an enlarged view
of a part A in FIG. 15 according to some embodiments of the present
disclosure;
[0045] FIG. 17 is a schematic diagram illustrating a cross-section
view of an electronic component in an assembled state along an A-A
axis in FIG. 14 of the present disclosure;
[0046] FIG. 18 is a schematic diagram illustrating an enlarged view
of a part B in FIG. 17 according to some embodiments of the present
disclosure;
[0047] FIG. 19 is a schematic diagram illustrating a partial
cross-section view of an electronic component according to some
embodiments of the present disclosure;
[0048] FIG. 20 is a schematic diagram illustrating a cross-section
view of an electronic component in an assembled state along a B-B
axis in FIG. 14 of the present disclosure;
[0049] FIG. 21 is a schematic diagram illustrating a cross-section
view of an electronic component in an assembled state along a C-C
axis in FIG. 14 of the present disclosure;
[0050] FIG. 22 is a schematic diagram illustrating transmitting
sound through air conduction according to some embodiments of the
present disclosure.
DETAILED DESCRIPTION
[0051] In order to illustrate the technical solutions related to
the embodiments of the present disclosure, the drawings used to
describe the embodiments are briefly introduced below. Obviously,
the drawings described below are only some examples or embodiments
of the present disclosure. Those skilled in the art may apply the
present disclosure to other similar scenarios without further
creative efforts according to these drawings. It should be
understood that the exemplary embodiments are provided merely for
better comprehension and application of the present disclosure by
those skilled in the art, and not intended to limit the scope of
the present disclosure. Unless obvious from the context or
illustrated in the context, the same numeral in the drawings refers
to the same structure or operation.
[0052] As used in the specification and the claims, the singular
forms "a," "an," and "the" may include the plural forms as well,
unless the context clearly indicates otherwise. In general, the
terms "comprise" and "include" may merely specify the presence of
stated steps, operations and elements, and these operations and
elements may not constitute an exclusive listing. The method or the
device may also include other operations and elements. The term
"based on" refers to "based at least in part on." The term "one
embodiment" refers to "at least one embodiment"; the term "another
embodiment" refers to "at least one other embodiment." The
definitions related to other terms will be given in the following
description. In the following, without loss of generality, in the
description of sound conduction related technologies in the present
disclosure, "player," "loudspeaker apparatus," or "loudspeaker"
will be used. These terms are only one form of sound conduction
application. For those skilled in the art, "player," "playing
apparatus," "speaking apparatus," "loudspeaker apparatus," or
"hearing aid" can also be replaced by other similar words. In fact,
the various implementations in the present disclosure may be easily
applied to hearing devices other than the loudspeaker. For example,
for those skilled in the art, after understanding the basic
principles of loudspeaker, it is possible to make various
modifications and changes in the form and details of the specific
methods and steps for implementing the loudspeaker without
departing from this principle. In particular, an ambient sound
pickup and processing function may be added to the loudspeaker
apparatus, such that the loudspeaker apparatus may realize the
function of a hearing aid. For example, in the case of using the
bone conduction loudspeaker, by adding a sound transmission device
like a microphone that may pick up ambient sound surroundings a
user/wearer, the ambient sound may be processed according to a
certain algorithm(or a generated electrical signal) and transmitted
to the bone conduction loudspeaker. That is, the bone conduction
loudspeaker may be modified to include a function of picking up the
ambient sound. The ambient sound may be may be processed and
transmitted to the user/wearer through the bone conduction
loudspeaker after certain signal processing, thereby realizing a
function of the bone conduction hearing aid. As an example, the
algorithm mentioned here may include a noise cancellation, an
automatic gain control, an acoustic feedback suppression, a wide
dynamic range compression, an active environment recognition, an
active noise reduction, a directional processing, a tinnitus
processing, a multi-channel wide dynamic range compression, an
active howling suppression, a volume control, or the like, or any
combination thereof.
[0053] FIG. 1 is a schematic diagram illustrating a process in
which a loudspeaker apparatus causes auditory senses in a human
ear. The loudspeaker apparatus may transmit sound to an auditory
system in a way of bone conduction or air conduction through its
built-in loudspeaker, thereby generating auditory senses. As shown
in FIG. 1, the process in which the loudspeaker apparatus causes
auditory senses in the human ear may mainly include the following
steps.
[0054] In step 101, the loudspeaker apparatus may acquire or
generate a signal containing sound information. In some
embodiments, the sound information may refer to a video or audio
file in a specific data format, and may also refer to data or files
in general that may be eventually converted into sound in a
specific way. In some embodiments, the signal containing the sound
information may be from a storage unit of the loudspeaker
apparatus, or an information generation, storage, or transmission
system other than the loudspeaker apparatus. The sound signal used
herein is not limited to an electrical signal, and may also include
other forms of signal, such as an optical signal, a magnetic
signal, a mechanical signal, etc. In principle, as long as the
signal contains information that may be used to generate sound by
the loudspeaker apparatus, it may be processed as a sound signal.
In some embodiments, the sound signal is not limited to one signal
source, but a plurality of signal sources. The plurality of signal
sources may be related or not related to each other. In some
embodiments, a method for transmitting or generating a sound signal
may be wired or wireless, and may be real-time or delayed. For
example, the loudspeaker apparatus may receive an electrical signal
containing sound information in a wired or wireless way, and may
also obtain data directly from a storage medium to generate the
sound signal. Taking a bone conduction technology as an example, a
component with a sound collection function may be added to a bone
conduction loudspeaker. The component with the sound collection
function may pick up ambient sound, and convert a mechanical
vibration of the ambient sound into an electrical signal. The
electrical signal may be processed by an amplifier to satisfy a
specific requirement. Wherein, a wired connection may include but
not limited to a metal cable, an optical cable, or a hybrid cable
of metal and optical, such as a coaxial cable, a communication
cable, a flexible cable, a spiral cable, a nonmetallic sheathed
cable, a metal-sheathed cable, a multi-core cable, a twisted pair
cable, a ribbon cable, a shielded cable, a telecommunication cable,
a double-stranded cable, a parallel twin-core wire, and a twisted
pair. The examples described above are only for the convenience of
illustration. The medium of the wired connection may also include
other types, such as other electrical or optical signal
transmission carriers.
[0055] A storage device/storage unit herein may include a storage
device on a storage system, such as a direct-attached storage, a
network-attached storage, and a storage area network, or the like.
The storage device may include but is not limited to a common
storage device, such as a solid-state storage device (e.g., a
solid-state disk, a hybrid hard disk, etc.), a mechanical hard
disk, a USB flash memory, a memory stick, a memory card (e.g., CF,
SD), other drivers (e. g. CD, DVD, HD DVD, Blu-ray), a random
access memory (RAM), and a read-only memory (ROM), etc. The RAM may
include but is not limited to a dekatron, a selectron, a delay line
memory, a Williams tube, a dynamic random access memory (DRAM), a
static random access memory (SRAM), a thyristor random access
memory (T-RAM), a zero capacitor random access memory (Z-RAM), etc.
The ROM may include but is not limited to a bubble memory, a
twistor memory, a film memory, a plated wire memory, a
magnetic-core memory, a drum memory, a CD-ROM, a hard disk, a tape,
a non-volatile random access memory (NVRAM), a phase-change memory,
a magneto-resistive random access memory, a ferroelectric random
access memory, a non-volatile SRAM, a flash memory, an electrically
erasable programmable read-only memory, an erasable programmable
read-only memory, a programmable read-only memory, a mask ROM, a
floating gate random access memory, a Nano random access memory, a
racetrack memory, a resistive random access memory, a programmable
metallization unit, etc. The storage device/storage unit mentioned
above is a list of examples. Storages used in the storage
device/storage unit are not limited thereto.
[0056] In step 102, the loudspeaker apparatus may convert the
signal containing sound information into a vibration to generate
sound. The generation of vibration is accompanied by an energy
conversion. The loudspeaker apparatus may use a specific transducer
apparatus to convert the signal into a mechanical vibration. The
energy conversion may include a coexistence and a conversion of
many different types of energy. For example, an electrical signal
may be directly converted into the mechanical vibration by a
transducer to generate sound. In another example, the sound
information may be included in an optical signal. A specific
transducer may convert the optical signal into a vibration signal.
Other types of energy that may coexist and be converted during an
operation of the transducer may include thermal energy, magnetic
field energy, or the like. In some embodiments, an energy
conversion type of the transducer may include, but is not limited
to, a moving-coil type, an electrostatic type, a piezoelectric
type, a moving-iron type, a pneumatic type, an electromagnetic
type, or the like. A frequency response range and sound quality of
the loudspeaker apparatus may be affected by the different energy
conversion types and performance of various physical components in
the transducer. For example, in a moving-coil transducer, a wound
cylindrical coil may be connected to a vibration plate. The wound
cylindrical coil driven by a signal current may drive the vibration
plate to generate sound in a magnetic field. An expansion and a
contraction of material, a deformation of folds, a size, a shape
and a fixing method of the vibration plate, a magnetic density of a
permanent magnet, or the like, may greatly affect final sound
quality of the loudspeaker apparatus.
[0057] It should be understood that the term "sound quality" used
herein indicates the quality of the sound, which refers to fidelity
of audio after processing, transmission, or the like. In a sound
device, the sound quality may usually include an intensity, an
amplitude, a frequency, an overtone, a harmonic component of the
audio. When evaluating the sound quality, there may be both a
measurement method and an evaluation criterion for objectively
evaluating the sound quality, and a method for evaluating various
attributes of the sound quality by combining different elements of
the sound and a subjective feeling. Therefore, the generation,
transmission, and receiving of the sound may affect the sound
quality of the sound to a certain extent.
[0058] In step 103, the sound may be transmitted through a
transmission system. In some embodiments, the transmission system
may refer to a substance that transmits the vibration signal
containing sound information, such as a skull, a bone labyrinth,
inner ear lymph fluid, and a spiral organ of a human and/or an
animal having an auditory system. As another example, the
transmission system may include a medium that transmits sound
(e.g., air, liquid). Merely to illustrate a process of transmitting
the sound information through the transmission system, a bone
conduction loudspeaker is taken as an example. The bone conduction
loudspeaker may directly transmit a sound wave (a vibration signal)
converted from an electrical signal through a bone to an auditory
center. In addition, the sound wave may also be transmitted to the
auditory center by means of air conduction. More descriptions
regarding the air conduction may be found elsewhere in the present
disclosure.
[0059] In step 104, the sound information may be transmitted to a
sensing terminal. Specifically, the sound information may be
transmitted to the sensing terminal through the transmission
system. In a working scenario, the loudspeaker apparatus may pick
up or generate a signal containing sound information, convert the
sound information into a sound vibration by the transducer, and
transmit the sound to the sensing terminal through the transmission
system, finally enabling the sound to be heard. Without loss of
generality, a subject having the abovementioned sensing terminal,
the auditory system, a sensory organ, or the like, may be a human,
or an animal with an auditory system. It should be noted that the
following descriptions regarding the use of the loudspeaker
apparatus by the human are not limited to a usage scenario of the
loudspeaker apparatus. Similar descriptions may also be applied to
other animals.
[0060] The above descriptions regarding a general process of the
loudspeaker apparatus are only a specific embodiment, and should
not be regarded as the only feasible implementation solution.
Obviously, for those skilled in the art, after understanding a
basic principle of the loudspeaker apparatus, it is possible to
make multiple variations and modifications in the form and details
of the specific manners and steps for implementing the loudspeaker
apparatus, without departing from this principle. However, those
variations and modifications do not depart from the scope of the
present disclosure.
[0061] The loudspeaker apparatus in the present disclosure may be a
headset, an MP3 player, a hearing aid, or other apparatus having a
speaker function. In the following embodiments of the present
disclosure, an MP3 player is taken as an example to specifically
illustrate the loudspeaker apparatus. FIG. 2 is a schematic diagram
illustrating an exploded view of structures of an MP3 player
according to some embodiments of the present disclosure. As shown
in FIG. 2, in some embodiments, the MP3 player may include an ear
hook 10, an earphone core housing 20, a circuit housing 30, a rear
hook 40, an earphone core 50, a control circuit 60, and a battery
70. The earphone core housing 20 and the circuit housing 30 may be
placed at two ends of the ear hook 10, respectively. The rear hook
40 may be disposed at an end of the circuit housing 30 far from the
ear hook 10, respectively. There may be two earphone core housings
20, which are used to accommodate the earphone core 50,
respectively. There may be two circuit housings 30, which are used
to accommodate the control circuit 60 and the battery 70,
respectively. Two ends of the rear hook 40 may be connected to the
corresponding circuit housing 30, respectively.
[0062] FIG. 3 is a schematic diagram illustrating a partial
structure of an ear hook in an MP3 player according to some
embodiments of the present disclosure. FIG. 4 is a schematic
diagram illustrating a partial cross-section view of an MP3 player
according to some embodiments of the present disclosure. According
to FIGS. 2-4, in some embodiments, the ear hook 10 may include an
elastic wire 11, a wire 12, a fixed sleeve 13, a plug end 14, and a
plug end 15. A plug end 14, and a plug end 15 may be placed at two
ends of the elastic wire 11. In some embodiments, the ear hook 10
may also include a protective sleeve 16 and a housing protective
sleeve 17 integrated with the protective sleeve 16. The protective
sleeve 16 may be injection-molded on a periphery of the elastic
wire 11, the wire 12, the fixed sleeve 13, the plug end 14, and the
plug end 15, such that the protective sleeve 16 may be connected
and fixed to the elastic wire 11, the wire 12, the fixed sleeve 13,
the plug end 14, and the plug end 15, respectively. In this case,
there is no need to form the protective sleeve 16 separately by
means of injection molding and use the protective sleeve 16 to
cover the periphery of the elastic wire 11, the plug end 14, and
the plug end 15, which may simplify a manufacturing and assembly
process, and make the fixing of the protective sleeve 16 more
reliable and stable.
[0063] In some embodiments, when the protective sleeve 16 is
molded, the housing protective sleeve 17 may be integrated with the
protective sleeve 16 and placed on a side close to the plug end 15.
In some embodiments, the housing protective sleeve 17 may be
integrated with the protective sleeve 16 as a whole. The circuit
housing 30 may be connected to one end of the ear hook 10 via a
plug connection with the plug end 15. A jack 22 of the earphone
core housing 20 may be connected to the other end of the ear hook
10 via a plug connection with the plug end 14. The housing
protective sleeve 17 may cover a periphery of the circuit housing
30 in a sleeve manner. In some embodiments, the protective sleeve
16 and the housing protective sleeve 17 may be made of a soft
material having a certain elasticity, such as soft silicone,
rubber, or the like. In some embodiments, the housing protective
sleeve 17 may be a bag-like structure with an opening at one end,
such that the circuit housing 30 may enter the inside of the
housing protective sleeve 17 through an opening end of the housing
protective sleeve 17. Specifically, the opening end of the housing
protective sleeve 17 may be an end of the housing protective sleeve
17 away from the protective sleeve 16, such that the circuit
housing 30 may enter the inside of the housing protective sleeve 17
from an end of the housing protective sleeve 17 away from the
protective sleeve 16, so as to be covered by the housing protective
sleeve 17.
[0064] FIG. 5 is a schematic diagram illustrating a partially
enlarged view of a part E in FIG. 2 according to some embodiments
of the present disclosure. According to FIG. 2 and FIG. 5, the
opening end of the housing protective sleeve 17 may be disposed
with a collar flange 171 protruding inward. An end of the circuit
housing 30 away from the ear hook 10 may be stepped/in a step
shape, thereby forming a circular table 37. When the housing
protective sleeve 17 covers the periphery of the circuit housing
30, the collar flange 171 may abut the circular table 37. An inner
wall surface of the opening end of the housing protective sleeve 17
may protrude toward the inside of the housing protective sleeve 17
with a certain thickness to form the collar flange 171. The collar
flange 171 may include a flange surface 172 facing toward the ear
hook 10. The circular table 37 may be opposite to the flange
surface 172, and face a direction of the circuit housing 30 away
from the ear hook 10. A height of the flange surface 172 of the
collar flange 171 may be not greater than a height of the circular
table 37, such that when the flange surface 172 of the collar
flange 171 abuts the circular table 37, the inner wall surface of
the housing protective sleeve 17 may fully abut a sidewall surface
of the circuit housing 30. In this way, the housing protective
sleeve 17 may tightly cover the periphery of the circuit housing
30. In some embodiments, a sealant may be applied to a connection
region between the collar flange 171 and the circular table 37.
Specifically, when sleeving the housing protective sleeve 17, the
sealant may be applied on the circular table 37, thereby sealing
and connecting the housing protective sleeve 17 and the circuit
housing 30.
[0065] In some embodiments, the circuit housing 30 may further
include a locating block 38. The locating block 38 may be placed on
the circular table 37, and extend along a direction of the circuit
housing 30 away from the ear hook 10. Specifically, the locating
block 38 may be placed on an auxiliary side wall 34 of the circuit
housing 30, and a protrusion thickness of the locating block 38 on
the auxiliary side wall 34 may be consistent with the height of the
circular table 37. One or more locating blocks 38 may be provided
according to needs. Correspondingly, the collar flange 171 of the
housing protective sleeve 17 may include a locating groove 173
corresponding to the locating block 38, such that when the housing
protective sleeve 17 covers the periphery of the circuit housing
30, the locating groove 173 covers at least part of the locating
block 38.
[0066] FIG. 6 is a schematic diagram illustrating an exploded view
of a circuit housing and a button mechanism according to some
embodiments of the present disclosure. FIG. 7 is a schematic
diagram illustrating partial cross-section views of a circuit
housing, a button mechanism, and an ear hook according to some
embodiments of the present disclosure. FIG. 8 is a schematic
diagram illustrating a partially enlarged view of a part G in FIG.
7 according to some embodiments of the present disclosure.
According to FIG. 2, and FIGS. 6-8, in some embodiments, the MP3
player may further include the button mechanism. In this
embodiment, circuit housing 30 may be flat. Two opposite sidewalls
of the circuit housing 30 with larger areas may be main side walls
33, and two opposite sidewalls with smaller areas that connect the
two main side wall 33 may be auxiliary side walls 34. An outer
surface of an auxiliary side wall 34 of the circuit housing 30 may
include a first recess region 341. The first recess region 341 may
include a button hole 342 connecting the outer surface and an inner
surface of the auxiliary side wall 34. The auxiliary side walls 34
of the circuit housing 30 may include an auxiliary side wall 34
facing toward a rear side of a user's head when the user wears the
MP3 player, and may also include an auxiliary side wall 34 facing
toward a lower side of the user's head when the user wears the MP3
player. There may be one or more first recess regions 341 each of
which may include one or more button holes 342. A count of the
button holes 342 may be determined according to actual needs, and
is not specifically limited here.
[0067] In some embodiments, the MP3 player may further include an
elastic pad 82 and a button 83, and the control circuit 60 may
include a button circuit board 61. The elastic pad 82 may be placed
in the first recess region 341, and may be specifically fixed on an
outer surface of an auxiliary side wall 34 corresponding to the
first recess region 341, so as to cover a periphery of the button
hole 342, and prevent external liquid from entering the inside of
the circuit housing 30 through the button hole 342, thereby playing
a role of sealing and waterproofing. In some embodiments, the
elastic pad 82 may include a second recess region 821 corresponding
to the button hole 342, and the second recess region 821 may extend
into the button hole 342. In some embodiments, the elastic pad 82
may be made of a soft material, such as soft silicone or rubber. In
addition, the elastic pad 82 may be relatively thin, which makes it
difficult to bond the elastic pad 82 firmly to the outer surface of
the auxiliary side wall 34 when directly bonding the elastic pad 82
to the outer surface of the auxiliary side wall 34. Since the
elastic pad 82 is placed between the button 83 and the button hole
342, when a user presses the button, the elastic pad 82 may
generate a force opposite to a pressing direction due to its
deformation, which hinders a movement of the button relative to the
button hole 342.
[0068] In some embodiments, a rigid pad 84 may be disposed between
the elastic pad 82 and the circuit housing 30. The rigid pad 84 and
the elastic pad 82 may be closely fixed with each other,
specifically, by means of lamination, bonding, injection molding,
etc. Further, the rigid pad 84 may be bonded to the auxiliary side
wall 34, specifically, by using a double-sided adhesive, so as to
form an adhesive layer between the rigid pad 84 and the auxiliary
side wall 34. In this way, the elastic pad 82 may be firmly fixed
on the outer surface of the auxiliary side wall 34. Moreover, since
the elastic pad 82 is soft and thin, it may be difficult for the
elastic pad 82 to maintain a flat state when a user presses the
button. By closely fixing with the rigid pad 84, the elastic pad 82
may maintain flat.
[0069] In some embodiments, the rigid pad 84 may include a through
hole 841 that allows the second recess region 821 to pass through,
such that the second recess region 821 of the elastic pad 82 may
further extend into the button hole 342 through the through hole
841. In some embodiments, the rigid pad 84 may be made of stainless
steel, or other steel materials, such as a hard material like
plastic. The rigid pad 84 may be closely fixed with the elastic pad
82 by means of one-piece molding.
[0070] In some embodiments, the button 83 may include a button body
831 and a button contact 832 protruding from one side of the button
body 831. The button body 831 may be placed on a side of the
elastic pad 82 away from the circuit housing 30, and the button
contact 832 may extend into the second recess region 821 to extend
into the button hole 342 along with the second recess region 821.
Since the MP3 player in this embodiment is relatively thin and
light, a pressing stroke of the button 83 may be short. If a soft
button is used, the user's pressing feeling may be affected,
thereby resulting in a bad experience. In this embodiment, the
button 83 may be made of hard plastic material, such that the user
may have a good feeling when pressing the button 83.
[0071] The button circuit board 61 may be placed inside the circuit
housing 30. The button circuit board 61 may include a button switch
611 corresponding to the button hole 342. Thus, when the user
presses the button 83, the button contact 832 may contact and
trigger the button switch 611 to further implement a corresponding
function.
[0072] In this embodiment, the second recess region 821may be
disposed on the elastic pad 82. In this way, on the one hand, the
second recess region 821 may cover the entire button hole 342,
which improves a waterproof effect at the same time; on the other
hand, in a natural state, the button contact 832 may extend into
the button hole 342 through the second recess region 821, which
shortens the pressing stroke of the button 83 to reduce a space
occupied by the button structure. Thus, the MP3 player may not only
have good waterproof performance, but also take up less space.
[0073] In some embodiments, the button 83 may include a button
monomer 833, and there may be one or more button monomers 833. In
an application scenario, the button 83 may include at least two
button monomers 833 spaced from each other and a connecting part
834 for connecting the button monomers 833. A plurality of button
monomers 833 may be integrated with the connecting part 834.
Correspondingly, each button monomer 833 may be provided with one
button contact 832, and further correspond to a button hole 342 and
a button switch 611. Each first recess region 341 may include a
plurality of button monomers 833, and the user may trigger
different button switches 611 by pressing different button monomers
833, and then realize multiple functions.
[0074] In some embodiments, the elastic pad 82 may include an
elastic convex 822 for supporting the connecting part 834. Since
the button 83 may include the plurality of button monomers 833
connected to each other, the elastic convex 822 may enable one of
the button monomer 833 to be pressed separately when the user
presses the corresponding button monomer 833, thereby avoiding that
other button monomers 833 are pressed due to a linkage between the
plurality of button monomers 833. In this way, the corresponding
button switch 611 may be triggered accurately. It should be noted
that the elastic convex 822 is not necessary. For example, the
elastic convex 822 may be a protruding structure without
elasticity, or the protruding structure may be removed. The elastic
convex 822 may be set according to actual conditions. In some
embodiments, the inner wall of the housing protective sleeve 17 may
include a concave 174 corresponding to the button 83, such that the
periphery of the circuit housing 30 and the button 83, may be
covered in a sleeve manner.
[0075] FIG. 9 is a schematic diagram illustrating an exploded view
of partial structures of a circuit housing and an auxiliary film
according to some embodiments of the present disclosure. FIG. 10 is
a schematic diagram illustrating partial structures of a circuit
housing and an auxiliary film according to some embodiments of the
present disclosure. According to FIG. 2, FIG. 9, and FIG. 10, in
some embodiments, the MP3 player may further include an auxiliary
film 86 located inside the circuit housing 30. The auxiliary film
86 may include a board 861. The board 861 may include a hollow
region 8611. The board 861 may be disposed on an inner surface of
the main side wall 33 by means of hot melting or hot pressing,
bonding, etc. The mounting hole 331 on the main side wall 33 may be
located inside the hollow region 8611. Specifically, a board
surface of the board 861 may abut against the inner surface of the
main side wall 33 in parallel. The auxiliary film 86 may have a
certain thickness. After the auxiliary film 86 is placed on the
inner surface of the main side wall 33, an inner sidewall of the
hollow region 8611 of the auxiliary film 86 and the main side wall
33 may form a glue tank 87 located on a periphery of a conductive
column 85 inserted in the mounting hole 331.
[0076] In some embodiments, a sealant may be applied in the glue
tank 87, such that mounting hole 331 may be sealed from the inside
of circuit housing 30 to improve the tightness of the circuit
housing 30, thereby improving the waterproof performance of the
bone conduction MP3 player.
[0077] In some embodiments, a material of the auxiliary film 86 may
be the same as that of the circuit housing 30, and may be formed
separately from the circuit housing 30. It should be noted that,
during a molding stage of the circuit housing 30, there may be
other structures near the mounting hole 331, such as the button
hole 342 to be molded, etc. Molds corresponding to these structures
during molding may need to be withdrawn from the inside of the
circuit housing 30. At this time, if the glue tank 87 corresponding
to the mounting hole 331 is integrated directly inside the circuit
housing 30, a convex of the glue tank 87 may hinder a smooth
withdrawal of the molds corresponding to these structures, thereby
causing inconvenience to production. In this embodiment, the
auxiliary film 86 and the circuit housing 30 may be independent
structures. After forming the two structures separately, the
auxiliary film 86 may be installed inside the circuit housing 30 to
form the glue tank 87 together with the main side wall 33 of the
circuit housing 30. In this way, during the molding stage of
circuit housing 30, the molds of a portion of the structures may
not be hindered from withdrawing from the inside of the circuit
housing 30, which may be beneficial to smooth production.
[0078] In some embodiments, when molding the circuit housing 30,
the withdrawal of the molds may only take up part of the space
occupied by the glue tank 87. Without affecting the withdrawal of
the molds, part of the glue tank 87 may be integrated on an inner
surface of the main side wall 33, and the other part of the glue
tank 87 may still be formed by the auxiliary film 86.
[0079] In some embodiments, the inner surface of the main side wall
33 may be integrated with a first striped convex rib 332. A
location of the first striped convex rib 332 may not affect the
withdrawal of the mold of the circuit housing 30. The hollow region
8611 of the auxiliary film 86 may include a notch 8612. The first
striped convex rib 332 may correspond to the notch 8612. After the
circuit housing 30 and the auxiliary film 86 are formed
respectively, the auxiliary film 86 may be placed on the inner
surface of the main side wall 33, such that the first striped
convex rib 332 may be at least partially fitted to the notch 8612.
And the first striped convex rib 332 and the auxiliary film 86 may
be combined to make the glue tank 87 closed.
[0080] In this embodiment, since the first striped convex rib 332
does not hinder the withdrawal of the mold, a sidewall of the glue
tank 87 may be formed by the first striped convex rib 332 and
auxiliary film 86. The first striped convex rib 332 may be
integrally formed on the inner surface of the main side wall
33.
[0081] In some embodiments, the first striped convex rib 332 may
further extend to abut against a side edge 8613 of the board 861,
thereby locating the board 861. The first striped convex rib 332
may include a rib body 3321 and a locating arm 3322. The rib body
3321 may be used to match with and fit with the notch 8612 of the
hollow region 8611, thereby forming a sidewall of the glue tank 87.
The locating arm 3322 may be formed by a further extension of one
end of the rib body 3321, and may extend to a side edge 8613 of the
board 861 to abut against the side edge 8613, such that the board
861 may be located at the side edge 8613.
[0082] In some embodiments, a protrusion height of the first
striped convex rib 332 on the inner surface of the main side wall
33 may be greater than, smaller than, or equal to a thickness of
the auxiliary film 86, as long as it can form the glue tank 87
together with the auxiliary film 86, and position the board 861 of
the auxiliary film 86. The protrusion height of the first striped
convex rib 332 will not be specifically limited herein.
[0083] In some embodiments, the board 861 may include a locating
hole 8614, and the locating hole 8614 may penetrate through a main
board surface of the board 861. The inner surface of the main side
wall 33 may be integrated with a locating post 333 corresponding to
the locating hole 8614. After the auxiliary film 86 is placed on
the inner surface of the main side wall 33, the locating post 333
may be inserted into the locating hole 8614, thereby further
locating the auxiliary film 86. A count of the locating holes 8614
may be equal to a count of the locating posts 333. In this
embodiment, the counts of both may be two.
[0084] In an application scenario, at least two lugs 8615 may be
formed on a side edge 8613 of the board 861, and two locating holes
8614 may be placed on corresponding lugs 8615, respectively. The
inner surface of the main side wall 33 may be integrated with a
second striped convex rib 334. The second striped convex rib 334
may extend in a direction toward the auxiliary side wall 34, and
may be perpendicular to an extending direction of the locating arm
3322 of the first striped convex rib 332. The board 861 may also
include a bar-shaped locating groove 8616 corresponding to the
second striped convex rib 334. The bar-shaped locating groove 8616
may be recessed along a direction away from the main side wall 33,
and one end of the bar-shaped locating groove 8616 may be connected
to the side edge 8613 of the board 861 and may be perpendicular to
the side edge 8613.
[0085] In an application scenario, the bar-shaped locating groove
8616 may be formed only by a recession of a surface of the board
861 that abuts against the main side wall 33. A depth of the
bar-shaped locating groove 8616 may be less than the thickness of
the board 861. In such cases, a surface of the board 861 opposite
to the recessed surface of the board 861 may not be affected by the
bar-shaped locating groove 8616. In another application scenario,
the depth of the bar-shaped locating groove 8616 may be greater
than the depth of the board 861, such that when a surface of the
board 861 closed to the main side wall 33 is recessed, the other
opposite surface of the board 861 may protrude toward a recessed
direction, thereby forming the bar-shaped locating groove 8616.
After the auxiliary film 86 is placed on the inner surface of the
main side wall 33, the second striped convex rib 334 may be
embedded in the bar-shaped locating groove 8616 to further position
the board 861.
[0086] According to FIG. 2, FIG. 5 and FIG. 6, in some embodiments,
the housing protective sleeve 17 may include an exposed hole 175
corresponding to the conductive column 85. After the housing
protective sleeve 17 over the periphery of the circuit housing 30,
one end of the conductive column 85 located outside the circuit
housing 30 may be exposed through the exposed hole 175, and then
connected to an external circuit of the MP3 player, such that the
MP3 player may provide power supply or data transmission through
the conductive column 85.
[0087] In some embodiments, the outer surface of the circuit
housing 30 may be recessed with a glue tank 39 surrounding a
plurality of mounting holes 331. Specifically, the glue tank 39 may
be in a shape of an oval ring. The plurality of mounting holes 331
may be respectively placed on the circuit housing 30 surrounded by
the oval ring glue tank 39. A sealant may be applied to the glue
tank 39. After the housing protective sleeve 17 and the circuit
housing 30 are assembled, the housing protective sleeve 17 may be
sealed and connected to the circuit housing 30 on a periphery of
the mounting hole 331 via the sealant. In this way, when external
liquid enters the inside of the housing protective sleeve 17
through the exposed hole 175, the housing protective sleeve 17 may
be protected from sliding around the periphery of the circuit
housing 30, and the mounting hole 331 may be further sealed from
the outside of the circuit housing 30, which may further improve
the tightness of circuit housing 30, thereby improving the
waterproof performance of the MP3 player.
[0088] It should be noted that the above descriptions regarding the
MP3 player are only embodiments, and should not be considered as
the only feasible implementation solution. Obviously, for those
skilled in the art, after understanding the basic principle of an
MP3 player, multiple variations and modifications may be made in
the form and details of the specific manners and steps for
implementing the loudspeaker apparatus, without departing from this
principle. However, those variations and modifications do not
depart from the scope of the present disclosure. For example, there
may be one or more first recess regions 341. One or more button
holes 342 may be correspondingly provided for each of the first
recess regions 341, which is not limited herein. All these
variations are within the scope of the present disclosure.
[0089] FIG. 11 is a schematic diagram illustrating cross-section
views of the circuit housing 30, a conductive column 85, and a main
control circuit board 62 according to some embodiments of the
present disclosure. FIG. 12 is a schematic diagram illustrating a
partially enlarged view of part H in FIG. 11. FIG. 13 is a
schematic diagram illustrating the conductive column 85 according
to some embodiments of the present disclosure.
[0090] As shown in FIG. 11, in some embodiments, the MP3 player may
further include at least one conductive column 85. The control
circuit accommodated inside the circuit housing 30 may include a
main control circuit board 62. The conductive column 85 may be used
to connect the main control circuit board 62 inside the circuit
housing 30, a charging circuit and/or a data transmission line
outside the circuit housing 30, so as to charge and/or communicate
data with the MP3 player.
[0091] According to FIGS. 11-13, in some embodiments, the main side
wall 33 of the circuit housing 30 may include at least one mounting
hole 331, and the conductive column 85 may be inserted into the
corresponding mounting hole 331. The conductive column 85 may
correspond to the mounting hole 331 one to one. In this embodiment,
there may be four conductive columns 85 and four mounting holes
331. The four conductive columns 85 may be respectively inserted
into the corresponding mounting holes 331, and may be arranged side
by side in a straight line at even intervals. Two conductive
columns 85 located at outer sides may be used as charging
interfaces, and two conductive columns 85 located in the middle may
be used as data transmission interfaces.
[0092] In some embodiments, the conductive column 85 may include a
columnar body 851 inserted into a mounting hole 331. In some
embodiments, an outer peripheral surface of the columnar body 851
may include a locating boss 852. The locating boss 852 may be
clamped to the inner surface of the main side wall 33, thereby
fixing the conductive column 85 to the mounting hole 331.
Specifically, the locating boss 852 may be arranged in a circle
circumferentially around the columnar body 851. A side of the
annular locating boss 852 facing toward the inside of the circuit
housing 30 may include an extended slope 853 connecting an outer
peripheral surface of the columnar body 851 and the locating boss
852. When installing the conductive column 85, the conductive
column 85 may be gradually inserted into the mounting hole 331 from
the outside of the circuit housing 30 along the extended slope 853,
enter into the interior of the circuit housing 30, and further pass
the locating boss 852. After the locating boss 852 completely
passes through the mounting hole 331, a surface of the locating
boss 852 facing toward the outside of the circuit housing 30 may be
clamped to the inner surface of the main side wall 33, such that
the conductive column 85 may be fixed in the mounting hole 331.
[0093] In the embodiment, in the assembly process assembled, the
locating boss 852 may enable the conductive column 85 to be
inserted into the mounting hole 331 from the outer surface of the
main side wall 33 of the circuit housing 30, and the locating boss
852 may be pressed into the mounting hole 331 by being pressed.
Thus, the locating boss 852 may be clamped to the inner surface of
the main side wall 33 of the circuit housing 30, which eliminates
the need to install the conductive column 85 from the inside of the
circuit housing 30, thereby making the assembly of the MP3 player
more convenient and improving production assembly efficiency.
Further, in the assembly process, the extended slope 853 may enable
the locating boss 852 to pass through the mounting hole 331 more
smoothly. When the conductive column 85 enters the mounting hole
331, the locating boss 852 may enable the conductive column 85 to
be clamped to the inner surface of the main side wall 33, and may
not be easily drawn out from the conductive hole, thereby fixing
the conductive column 85 firmly in the mounting hole 331.
[0094] In some embodiments, the columnar body 851 may be divided
into a first columnar body 8511 and a second columnar body 8512
along an insertion direction of the columnar body 851 with respect
to the mounting hole 331. The first column body and the second
column body may be integrally made of a conductive metal material
such as copper, silver, or an alloy into an integrated structure.
In the insertion direction of the mounting hole 331 perpendicular
to the conductive column 85, a cross-section of the first columnar
body 8511 may be larger than a cross-section of the second columnar
body 8512. The locating boss 852 may be placed on the second
columnar body 8512.
[0095] In some embodiments, the mounting hole 331 may be divided
into a first hole section 3311 and a second hole section 3312 with
cross sections corresponding to the first columnar body 8511 and
the second columnar body 8512 along the insertion direction.
Further, a circular table 3313 may be formed at the junction of the
first hole section 3311 and the second hole section 3312. The
circular table 3313 may contact with the outer surface of the main
side wall 33. When the columnar body 851 is inserted into the
mounting hole 331, a side of the first columnar body 8511 facing
toward the second columnar body 8512 may be supported on the
circular table 3313. At the same time, a side of the locating boss
852 on the peripheral surface of the second columnar body 8512
facing toward the first columnar body 8511 may be clamped to the
inner surface of the main side wall 33. Further, the conductive
column 85 may be simultaneously clamped to the inner and outer
sides of the main side wall 33 around the mounting hole 331,
thereby fixing the conductive column 85 in the mounting hole
331.
[0096] In some embodiments, the columnar body 851 may include an
accommodating chamber 8513 along an axial direction, and an opening
end of the accommodating chamber 8513 may be on an end surface of
the second columnar body 8512 facing toward the inside of the
circuit housing 30. In some embodiments, the accommodating chamber
8513 may pass through a portion of the second columnar body 8512
located on the inner side of the circuit housing 30 along a
direction parallel to the insertion direction, and terminate before
reaching the locating boss 852. In other embodiments, a location of
the accommodating chamber 8513 may be determined according to
needs.
[0097] In some embodiments, the conductive column 85 may also
include a spring 854 and a conductive contact 855 placed in the
accommodating chamber 8513. One end of the conductive contact 855
may be in contact with the spring 854 inside the accommodating
chamber 8513, and the other end may be exposed from the opening end
of the accommodating chamber 8513 inside the circuit housing 30. In
some embodiments, the material of conductive contact 855 may be the
same as that of the columnar body 851. The spring 854 may be
connected to the second columnar body 8512 and the conductive
contact 855 by means such as bonding, welding, etc. Or the spring
854 may also be placed directly inside the accommodating chamber
8513, and elastically clamped inside the accommodating chamber
8513, by an engagement between the columnar body 851 and the main
side wall 33 of the circuit housing 30, and the abutting of the
conductive contact 855 and the main control circuit board 62.
[0098] In some embodiments, the main control circuit board 62
inside the circuit housing 30 may include a contact corresponding
to a position of the conductive column 85. In some embodiments, the
main control circuit board 62 may include a main surface 622 with a
larger area and a side surface 623 with a smaller area connecting
the main surface 622. The main surface 622 of the main control
circuit board 62 may be parallel or approximately parallel to the
main side wall 33 of the circuit housing 30, and the contact may
correspond to the main surface 622 of the main control circuit
board 62.
[0099] The insertion direction of the conductive column 85 into the
mounting hole 331 may be parallel to the axial direction of the
conductive column 85, perpendicular to the main side wall 33, and
then perpendicular to the main surface 622 of the main control
circuit board 62. After mounting the conductive column 85 in the
mounting hole 331, the spring 854 may be clamped by the conductive
contact 855 and the columnar body 851 to produce elastic
deformation, so as to elastically press the conductive contact 855
on the corresponding contact, thereby achieving an electrical
connection between the conductive column 85 and the main control
circuit board 62.
[0100] It should be noted that the above description regarding the
MP3 player is only a specific example and should not be considered
as the only feasible implementation solution. Obviously, for those
skilled in the art, after understanding the basic principles of MP3
players, multiple variations and modifications may be made in the
form and details of the specific manners and steps for implementing
the loudspeaker apparatus, without departing from this principle.
However, those variations and modifications do not depart from the
scope of the present disclosure. For example, the conductive column
85 and the mounting hole 311 may be not limited to the horizontal
distribution shown in the figures, but may also be arranged
according to other arrangements, such as a vertical arrangement, a
matrix arrangement, a circular arrangement, or the like, or an
irregular arrangement. All such variations are within the
protection scope of the present disclosure.
[0101] FIG. 14 is a schematic diagram illustrating an exploded view
of structures of an electronic component according to some
embodiments of the present disclosure. FIG. 15 is a schematic
diagram illustrating a partial cross-section view of an electronic
component according to some embodiments of the present disclosure.
FIG. 16 is a schematic diagram illustrating an enlarged view of a
part A in FIG. 15 according to some embodiments of the present
disclosure. The electronic component in the present disclosure may
be applied to an electronic device. The electronic device may be
any electronic device with internal structures to be sealed, such
as an earphone, an MP3 player, a hearing aid, a mobile phone, a
tablet computer, or glasses with a circuit component and the
electronic device, etc., which are not specifically limited herein.
In some embodiments, the electronic component may include the
circuit housing 30 in FIG. 2 and internal circuit of the circuit
housing 30. In some embodiments, the electronic component may also
be referred to as a circuit housing.
[0102] According to FIGS. 14-16, in some embodiments, the
electronic component (or the circuit housing) may include an
accommodating body 110 and a cover 120. The accommodating body 110
may include a cavity 111 with an opening 112 at one end, and the
cover 120 may be placed on the opening 112 of the cavity 111 for
sealing the cavity 111.
[0103] In some embodiments, the accommodating body 110 may be at
least part of the electronic device. The accommodating body 110 in
this embodiment may specifically be a structure for holding, for
example, a circuit board, a battery, and an electronic component in
the electronic device, such as a whole or a part of the circuit
housing 30 of the MP3 player. In some embodiments, the
accommodating body 110 may include the cavity 111 having an opening
112 to accommodate the circuit board, the battery and the
electronic component.
[0104] A shape of the cover 120 may at least partially match the
opening 112, such that the cover 120 may be placed on the opening
112 to seal the cavity 111. The material of cover 120 may be
different from or partially the same as the accommodating body 110.
In some embodiments, the cover 120 may include a hard bracket 121
and a soft cover layer 122. The bracket 121 may be used to
physically connect to the accommodating body 110. The cover layer
122 may be integrated on the surface of the bracket 121 to seal the
cavity 111 after the bracket 121 is connected to the accommodating
body 110.
[0105] In some embodiments, the material of the bracket 121 may be
rigid plastic, and the material of the cover layer 122 may be soft
silicone or rubber. A shape of the side of the bracket 121 facing
toward the accommodating body 110 may match the opening 112, and
fixed to the opening 112 of the cavity 111 by means of plugging,
buckling, etc., so as to physically connect to the accommodating
body 110. A gap may be easily formed at a physical connection
portion between the rigid bracket 121 and the accommodating body
110, which may reduce a sealing effect of the cavity 111. Further,
the soft cover layer 122 may be injection molded integrally on an
outer surface of the bracket 121 away from the accommodating body
110, which may further cover the physical connection portion
between the bracket 121 and the accommodating body 110, thereby
sealing the cavity 111.
[0106] In some embodiments, the cover 120 may include a rigid
bracket 121 and a soft cover layer 122 injection-molded integrally
on a surface of the rigid bracket 121. The bracket 121 may be used
to physically connect to the accommodating body 110. The cover
layer 122 may further seal the cavity 111 after the bracket 121 is
connected to the accommodating body 110. The soft cover layer 122
may be more conducive to fit the gap between the bracket 121 and
the accommodating body 110, so as to further improve the sealing
effect of the electronic component, thereby improving the
waterproof performance of the electronic component. At the same
time, bracket 121 and cover layer 122 may be injection molded
integrally, which can simplify an assembly process of electronic
components.
[0107] In some embodiments, the bracket 121 may include an
insertion part 1211 and cover part 1212. The cover part 1212 may be
placed on the opening 112, and the insertion part 1211 may be
placed on one side of the cover part 1212 and extend into the
cavity 111 along an inner wall of the cavity 111 to fix the cover
part 1212 on the opening 112.
[0108] In some embodiments, the insertion part 1211 may not be
inserted through the inner wall of cavity 111. For example, a
plug-in part matching a shape of the insertion part 1211 of the
bracket 121 may also be placed inside the cavity 111, such that the
insertion part 1211 may be engaged with the plug-in part to fix the
plug-in part inside the cavity 111. For example, the shape of
insertion part 1211 may be a cylinder. In such cases, a plug-in
part may be a cylindrical ring that surrounds the insertion part
1211 of the shape of the cylinder. An inner diameter of the plug-in
part of the cylindrical ring may be appropriately less than an
outer diameter of the plug-in part of the cylindrical body. In such
cases, when inserting the insertion part 1211 in the plug-in part,
an interference fit with the plug-in part may make the bracket 121
be stably connected to the cavity 111. Of course, other insertion
methods may also be used, as long as the insertion part 1211 may be
inserted into the cavity 111 and fixed with the cavity 111.
[0109] The cover part 1212 may be placed on a side of the insertion
part 1211 facing away from the cavity 111, and cover the opening
112 after the insertion part 1211 is inserted into the cavity 111.
The cover part 1212 may be a complete structure, or may further
include some holes according to needs, so as to achieve a certain
function.
[0110] FIG. 17 is a schematic diagram illustrating a cross-section
view of an electronic component in an assembled state along an A-A
axis in FIG. 14 according to some embodiments of the present
disclosure. According to FIG. 14 and FIG. 17, in some embodiments,
the accommodating body 110 may include an opening edge 113 for
defining the opening 112. A cover part 1212 may be pressed on an
inner region 1131 of the opening edge 113 near the opening 112. The
cover layer 122 may cover an outer surface of the cover part 1212
away from the accommodating body 110, and may be pressed on an
outer region 1132 outside the inner region 1131 of the opening edge
113, thereby sealing the cover layer 122 and the opening edge
113.
[0111] The inner region 1131 and the outer region 1132 of the
opening edge 113 may both belong to the opening edge 113, and may
be not other regions than the opening edge 113. The inner region
1131 of the opening edge 113 may be a region near the opening 112
of the opening edge 113, and the outer region 1132 of the opening
edge 113 may be a region away from the opening 112 of the opening
edge 113.
[0112] In some embodiments, the cover part 1212 of the bracket 121
may be pressed on the inner region 1131 of the opening edge 113
near the opening 112, which causes the cover part 1212 to initially
seal the opening edge 113. However, since the accommodating body
110 and the bracket 121 are made of hard materials, a connection
therebetween and a further coverage of the connection by the cover
part 1212 may not achieve a good sealing effect. At an end where
the cover part 1212 is pressed on the opening edge 113 and away
from the opening 112, a gap between the end and the opening edge
113 may be easily generated. The end may further penetrate the
cavity 111 through the gap, thereby reducing the sealing
effect.
[0113] According to the descriptions above, in the embodiment of
the present disclosure, the cover layer 122 may cover the outer
surface of the cover part 1212 away from the accommodating body
110, and may be further pressed on the outer region 1132 outside
the inner region 1131 of the opening edge 113, such that the gap
between the cover part 1212 of the bracket 121 and the opening edge
113 may be further covered. Since the cover layer 122 is made of a
soft material, it can further improve the sealing effect of the
electronic component and make the electronic component more
waterproof.
[0114] FIG. 18 is a schematic diagram illustrating an enlarged view
of a part B in FIG. 17 according to some embodiments of the present
disclosure. According to FIG. 14, FIG. 17, and FIG. 18, in some
embodiments, in a snapped state of the cover 120, a periphery of
the cover part 1212 may cover the inner region 1131 of the opening
edge 113 and contact the inner region 1131 of the opening edge 113.
The cover layer 122 may be placed on a side of the cover part 1212
away from the accommodating body 110, such that the cover part 1212
of the inner region 1131 located at the opening edge 113 may be
sandwiched between the inner region 1131 and the cover layer 122 of
the opening edge 113. The cover layer 122 may further extend toward
the cover part 1212 away from the opening 112, and toward the
opening edge 113, until it contacts the outer region 1132 of the
opening edge 113. Therefore, a contact end surface between the
cover part 1212 and the opening edge 113 and a contact end surface
between the cover layer 122 and the opening edge 113 may be flush
with each other, so as to form an "opening edge 113-cover part
1212-cover layer 122" structure on the inner region 1131 of the
opening edge 113.
[0115] FIG. 19 is a schematic diagram illustrating a partial
cross-section view of an electronic component according to some
embodiments of the present disclosure. According to FIG. 14, FIG.
16 and FIG. 19, in some embodiments, after the cover layer 122
extends to contact the outer region 1132 of the opening edge 113,
the cover layer 122 may further extend along a region between the
cover part 1212 and the opening edge 113 to the inner region 1131
of the opening edge 113. It is further assumed that, the cover part
1212 may be pressed on the inner region 1131 of the opening edge
113 to form an "opening edge 113-cover layer 122-cover part
1212-cover layer 122" structure between the inner region 1131 of
the opening edge 113 and the cover part 1212. In some embodiments,
the soft cover layer 122 may extend between the bracket 121 and the
opening edge 113 after covering the cover part 1212 of the hard
bracket 121, thereby further improving the sealing effect between
the cavity 111 and the cover 120, and further improving the
waterproof effect of the electronic component.
[0116] In some embodiments, the electronic component may further
include a circuit component 130 placed in the cavity 111, and the
circuit component 130 may include a switch 1311. In some
embodiments, the circuit component 130 may include a first circuit
board 131, and the switch 1311 may be placed on an outer side of
the first circuit board 131 facing toward the opening 112 of the
cavity 111.
[0117] Correspondingly, the bracket 121 may include a switch hole
1213 corresponding to the switch 1311. The cover layer 122 may
further cover the switch hole 1213 and may include a pressing part
1221 at a position corresponding to the switch hole 1213. The
pressing part 1221 may extend toward the inside of the cavity 111
through the switch hole 1213. When a corresponding position of the
cover layer 122 is pressed, the pressing part 1221 may press the
switch 1311 on the circuit component 130, thereby triggering the
circuit component 130 to perform a preset function.
[0118] The pressing part 1221 on the cover layer 122 may be formed
by protruding a side of the cover layer 122 facing toward the
bracket 121 toward the switch hole 1213 and the switch 1311. A
shape of the pressing part 1221 may match a shape of the switch
hole 1213. In this way, when the corresponding position of the
cover layer 122 is pressed, the pressing part 1221 may pass through
the switch hole 1213 and reach the corresponding switch 1311 on the
first circuit board 131. At the same time, a length of the pressing
part 1221 along a direction of the switch 1311 may be set such that
the switch 1311 is not pressed when the corresponding position of
the cover layer 122 is not pressed, and the corresponding switch
1311 is pressed when the corresponding position of the cover layer
122 is pressed.
[0119] In some embodiments, a position corresponding to the
pressing part 1221 on the cover layer 122 may further be protruded
toward a side facing away from the bracket 121, so as to form a
convex pressing part 1222. In this way, a user may clarify a
position of the switch 1311, and trigger the circuit component 130
to perform a corresponding function by pressing the corresponding
convex pressing part 1222.
[0120] FIG. 20 is a schematic diagram illustrating a cross-section
view of an electronic component in an assembled state along a B-B
axis in FIG. 14 according to some embodiments of the present
disclosure. According to FIG. 14 and FIG. 20, the electronic
component may include a first microphone element 1312. In some
embodiments, the first microphone element 1312 may be placed on the
first circuit board 131 of the circuit component 130 to be
accommodated in the cavity 111. For example, the first microphone
element 1312 may be placed on the first circuit board 131 at
intervals from the switch 1311 in the embodiment. The first
microphone element 1312 may be used to receive a sound signal from
the outside of the electronic component, and convert the sound
signal into an electrical signal for analysis and processing.
[0121] In some embodiments, the bracket 121 may include a
microphone hole 1214 corresponding to the first microphone element
1312. The cover layer 122 may include a first sound guiding hole
1223 corresponding to the microphone hole 1214, and may include a
first sound blocking member 1224 at a position corresponding to the
microphone hole 1214. The first sound blocking member 1224 may
extend inside the cavity 111 through the microphone hole 1214, and
define a sound guiding channel 12241. One end of the sound guiding
channel 12241 may be in communication with the first sound guiding
hole 1223 on the cover layer 122. The first microphone element 1312
may be inserted into the sound guiding channel 12241 from the other
end of the sound guiding channel 12241.
[0122] In some embodiments, the electronic component may also
include the switch 1311 described above. The switch hole 1213 and
the microphone hole1214 may be placed on the bracket 121 at
intervals.
[0123] In some embodiments, the first sound guiding hole 1223 may
be placed through the cover layer 122 and correspond to a position
of the first microphone element 1312. The first sound guiding hole
1223 may correspond to the microphone hole 1214 on the bracket 121,
and further communicate the first microphone element 1312 with the
outside of the electronic component, such that sound outside the
electronic component may be received by the first microphone
element 1312 through the first sound guiding hole 1223 and the
microphone hole 1214.
[0124] The first sound guiding hole 1223 may be in any shape, as
long as it can receive sound from the outside of the electronic
component. In some embodiments, the first sound guiding hole 1223
may be a circular hole with a relatively small size, and may be
placed in a region of the cover layer 122 corresponding to the
microphone hole 1214. The small first sound guiding hole 1223 may
reduce the communication between the first microphone element 1312
or the like in the electronic component with the outside, thereby
improving the sealing effect of the electronic component.
[0125] In some embodiments, the first sound blocking member 1224
may extend from the cover layer 122, to a periphery of the first
sound guiding hole 1223, through the microphone hole 1214, inside
the cavity 111, to a periphery of the first microphone element
1312, to form a sound guiding channel 12241 from the first sound
guiding hole 1223 to the first microphone element 1312. Thus, the
sound signal of the electronic component entering the sound guiding
hole may directly reach the first microphone element 1312 through
the sound guiding channel 12241.
[0126] In some embodiments, a shape of a cross section of the sound
guiding channel 12241 perpendicular to a length direction thereof
may be the same as or different from a shape of the microphone hole
1214 or the first microphone element 1312. In some embodiments,
shapes of cross sections of the microphone hole 1214 and the first
microphone element 1312 in a direction perpendicular to the bracket
121 facing toward the cavity 111 may be square. A size of the
microphone hole 1214 may be slightly larger than an outside size of
the sound guiding channel 12241. An inside size of the sound
guiding channel 12241 may be not smaller than the outside size of
the first microphone element 1312, such that the sound guiding
channel 12241 may pass through the first sound guiding hole 1223 to
reach the first microphone element 1312 and cover the periphery of
the first microphone element 1312.
[0127] In this way, the cover layer 122 of the electronic component
may include a first sound guiding hole 1223 and a sound guiding
channel 12241. The sound guiding channel 12241 may pass from the
periphery of the first sound guiding hole 1223, through the
microphone hole 1214 to reach the first microphone element 1312,
and cover the periphery of the first microphone element 1312. The
sound guiding channel 12241 may make the sound signal entering from
the first sound guiding hole 1223 reach the first microphone
element 1312 through the first sound guiding hole 1223, and may be
received by the first microphone element 1312, which may reduce
leakage of the sound signal in a propagation process, thereby
improving the efficiency of receiving electronic signals of the
electronic components.
[0128] In some embodiments, the electronic component may further
include a waterproof mesh 140 placed in the sound guiding channel
12241. The waterproof mesh 140 may abut a side of the cover layer
122 facing toward the microphone element by the first microphone
element 1312, and cover the first sound guiding hole 1223.
[0129] In some embodiments, the bracket 121 in the sound guiding
channel 12241 close to the first microphone element 1312 may form a
convex surface corresponding to the first microphone element 1312,
such that the waterproof mesh 140 may be sandwiched between the
first microphone element 1312 and the convex surface. The
waterproof mesh 140 may also be directly bonded to a periphery of
the first microphone element 1312, and the setting manner thereof
is not limited here.
[0130] In addition to waterproofing the first microphone element
1312, the waterproof mesh 140 in this embodiment may also have
effects such as sound transmission, so as to avoid affecting a
sound receiving performance of a sound receiving region 13121 of
the first microphone element 1312.
[0131] In some embodiments, the cover 120 may be in a bar shape. A
main axis of the first sound guiding hole 1223 and a main axis of
the sound receiving region 13121 of the first microphone element
1312 may be spaced from each other in a width direction of the
cover 120. The main axis of the sound receiving region 13121 of the
first microphone element 1312 may refer to a main axis of the sound
receiving region 13121 of the first microphone element 1312 in the
width direction of the cover 120, such as the axis n in FIG. 20.
The main axis of the first sound guiding hole 1223 may be the axis
m in FIG. 20.
[0132] It should be noted that, due to a setting need for the
circuit component 130, the first microphone element 1312 may be
placed at a first position of the first circuit board 131. When the
first sound guiding hole 1223 is disposed, the first sound guiding
hole 1223 may be placed at a second position of the cover 120 due
to requirements of beauty and convenience. In this embodiment, the
first position and the second position may not correspond to each
other along the width direction of the cover 120, such that the
main axis of the first sound guiding hole 1223 and the main axis of
the sound receiving region 13121 of the first microphone element
1312 may be spaced from each other in the width direction of the
cover 120. Therefore, the sound entering from the first sound
guiding hole 1223 may not be able to reach the sound receiving
region 13121 of the first microphone element 1312 in a straight
line.
[0133] In some embodiments, in order to guide the sound signal
entering from the first sound guiding hole 1223 to the first
microphone element 1312, the sound guiding channel 12241 may be set
to be curved.
[0134] In some embodiments, the main axis of the first sound
guiding hole 1223 may be placed in the middle of the cover 120 in
the width direction of the cover 120.
[0135] In some embodiments, the cover 120 may be part of a housing
of the electronic device. In order to meet an overall aesthetic
requirement of the electronic device, the first sound guiding hole
1223 may be placed in the middle of the cover 120 in the width
direction, such that the first sound guiding hole 1223 may look
more symmetrical and meet visual needs of people.
[0136] In some embodiments, the corresponding sound guiding channel
12241 may be disposed stepped/in a step shape along a cross-section
along the B-B axis in FIG. 14, such that the sound signal
introduced by the first sound guiding hole 1223 may be transmitted
to the first microphone element 1312 through the sound guiding
channel 12241 in the step shape and received by the first
microphone element 1312.
[0137] FIG. 21 is a schematic diagram illustrating a cross-section
view of an electronic component in an assembled state along a C-C
axis in FIG. 14 according to some embodiments of the present
disclosure. According to FIG. 14 and FIG. 21, in some embodiments,
the electronic component may further include a light emitting
element 1313. The light emitting element 1313 may be placed on the
first circuit board 131 of the circuit component 130 to be
accommodated in the cavity 111. For example, the light emitting
element 1313 may be placed on the first circuit board 131 in a
certain arrangement together with the switch 1311 and the first
microphone element 1312 in the embodiment.
[0138] In some embodiments, the bracket 121 may include a light
emitting hole 1215 corresponding to the light emitting element
1313. The cover layer 122 may cover the light emitting hole 1215,
and a thickness of a region corresponding to the light emitting
hole 1215 of the cover layer 122 may be set to allow light
generated by the light emitting element 1313 to be transmitted
through the cover layer 122.
[0139] In this embodiment, the cover layer 122 may still transmit
light emitted from the light emitting element 1313 to the outside
of the electronic component, by covering the light emitting hole
1215 with a certain means.
[0140] In some embodiments, a thickness of an entire region or part
region of the cover layer 122 corresponding to the light emitting
hole 1215 may be less than a thickness of a region of the cover
layer 122 corresponding to a periphery of the light emitting hole
1215, such that the light emitted by the light emitting element
1313 may pass through the light emitting hole 1215 and may be
transmitted through the cover layer 122. Of course, the region of
the cover layer 122 covering the light emitting hole 1215 may
transmit light through other means, which is not specifically
limited here.
[0141] In some embodiments, the cover layer 122 may cover the light
emitting hole 1215 of the corresponding light emitting element
1313, and may allow light emitted by the light emitting element
1313 to be transmitted from the cover layer 122 to the outside of
the electronic component. Thus, the light-emitting element 1313 may
be sealed by the cover layer 122 without affecting the
light-emitting function of the electronic component, so as to
improve the sealing effect and waterproof performance of the
electronic component.
[0142] It should be noted that the above description regarding the
electronic components is only a specific example, and should not be
considered as the only feasible implementation. Obviously, for
those skilled in the art, after understanding a basic principle of
the loudspeaker apparatus, multiple variations and modifications
may be made in the form and details of the specific manners and
steps for implementing the loudspeaker apparatus, without departing
from this principle. However, those variations and modifications do
not depart from the scope of the present disclosure. For example,
there may be one or more openings, which is not limited here. As
another example, in some embodiments, there may be one or more
switches. When there are a plurality of switches, the switches may
be arranged on the first circuit board at intervals. All such
variations are within the protection scope of the present
disclosure.
[0143] In some embodiments, the loudspeaker apparatus (for example,
an MP3 player) described above may transmit sound to a user through
air conduction. When transmitting sound through air conduction, the
loudspeaker apparatus may include one or more sound sources. The
sound sources may be located at a specific position of the user's
head, for example, a top of head, a forehead, a cheek, a cheek
horn, an auricle, a back of auricle, etc., without blocking or
covering the ear canal. For the purpose of description, FIG. 22 is
a schematic diagram illustrating transmitting sound through air
conduction according to some embodiments of the present
disclosure.
[0144] As shown in FIG. 22, a sound source 2210 and a sound source
2220 may generate sound waves with opposite phases ("+" and "-" in
the figure indicate opposite phases). For simplicity, the sound
sources mentioned here may refer to sound output holes on the
loudspeaker apparatus. For example, the sound source 2210 and the
sound source 2220 may be two sound outlet holes respectively
located at specific positions on the loudspeaker apparatus (e.g.,
the earphone core housing 20, or the circuit housing 30).
[0145] In some embodiments, the sound source 2210 and the sound
source 2220 may be generated by a same vibration apparatus 2201.
The vibration apparatus 2201 may include a vibration diaphragm (not
shown in the figure). When the vibration diaphragm is driven by an
electric signal to vibrate, a front side of the vibration diaphragm
may drive air to vibrate, vibrations may pass through the sound
guiding channel 12241 to form the sound source 2210. A back side of
the vibration diaphragm may drive air to vibrate, vibrations may
pass through the sound guiding channel 12241 to form the sound
source 2220. The sound guiding channel 12241 may refer to a sound
propagation route from the vibration diaphragm to the corresponding
sound hole. In some embodiments, the sound guiding channel 12241
may be a route surrounded by a specific structure (for example, the
earphone core housing 20 or the circuit housing 30) on a
loudspeaker apparatus. It should be noted that, in some alternative
embodiments, the sound source 2210 and the sound source 2220 may
also be generated by different vibration apparatus, respectively,
through different diaphragm vibrations.
[0146] In the sound generated by the sound source 2210 and the
sound source 2220, a part of the sound may be transmitted to the
user's ear to form sound heard by the user, and the other part may
be transmitted to the environment to form leaked sound. Considering
that the sound source 2210 and the sound source 2220 are closer to
the user's ear, for the convenience of description, the sound
transmitted to the user's ear may be referred to as near-field
sound, and the leaked sound transmitted to the environment may be
referred to as far-field sound. In some embodiments, the
near-field/far-field sound of different frequencies generated by
the loudspeaker apparatus may be related to a distance between the
sound source 2210 and the sound source 2220. Generally speaking,
the near-field sound generated by the loudspeaker apparatus may
increase as the distance between the two sound sources increases,
and the far-field sound (leaked sound) generated may increase as
the frequency thereof increases.
[0147] For sound of different frequencies, the distance between the
sound source 2210 and the sound source 2220 may be designed
separately, such that low-frequency near-field sound (for example,
sound with a frequency less than 800 Hz) generated by the
loudspeaker apparatus may be as large as possible, and
high-frequency far-field sound (for example, sound with a frequency
greater than 2000 Hz) may be as small as possible. In order to
achieve the above purpose, the loudspeaker apparatus may include
two or more sets of two-point sound sources. Each set of two-point
sound sources may include two sound sources similar to the sound
source 2210 and the sound source 2220, and may generate sound with
specific frequencies, respectively. Specifically, the first set of
two-point sound sources may be used to generate low-frequency
sound, and the second set of two-point sound sources may be used to
generate high-frequency sound. In order to obtain large
low-frequency near-field sound, a distance between two sound
sources in the first set of two-point sound sources may be a larger
value. Since the low-frequency signal has a longer wavelength, a
larger distance between the two sound sources may not cause an
excessive phase difference in the far-field, and may not form too
much sound leakage in the far-field. In order to make the
high-frequency far-field sound smaller, a distance between two
sound sources in the second set of two-point sound sources may be a
smaller value. Since the high-frequency signal has a shorter
wavelength, a smaller distance between the two sound sources may
avoid a formation of a large phase difference in the far-field,
thus avoiding a formation of large sound leakage. The distance
between the second set of two-point sound sources may be less than
the distance between the first set of two-point sound sources.
[0148] The beneficial effects of the embodiments in the present
disclosure may include but are not limited to: (1) the circuit
housing may be tightly covered by the housing protective sleeve,
and the circuit housing and the housing protective sleeve may be
sealed and connected, which may improve the waterproof performance
of the loudspeaker apparatus; (2) the elastic pad may cover the
outside of the button hole, which may prevent external liquid from
entering the inside of the circuit housing through the button hole,
thereby achieving the waterproof performance of the button
mechanism; (3) the outer surface of the circuit housing may be
recessed with a glue tank surrounding a plurality of mounting
holes, and a sealant may be applied in the glue tank, so as to seal
and connect the housing protective sleeve and the circuit housing
at the periphery of the mounting hole through the sealant, thereby
preventing external liquid from entering the housing protective
sleeve through the exposed hole, and further improving the
waterproof performance of the loudspeaker apparatus; (4) the soft
cover layer may be beneficial to fit the gap between the bracket
and the accommodating body, so as to further improve the sealing
effect of the electronic component, thereby improving the
waterproof performance of the electronic component. It should be
noted that different embodiments may have different beneficial
effects. In different embodiments, the possible beneficial effects
may be one or more of the above, or any combination thereof, or any
other beneficial effects that may be achieved.
[0149] The basic concepts have been described above. Obviously, for
those skilled in the art, the disclosure of the invention is merely
by way of example, and is not limiting. Although not expressly
stated here, those skilled in the art may make various
modifications, improvements, and amendments to the present
disclosure. These alterations, the improvements and modifications
are intended to be suggested by this disclosure, and are within the
spirit and scope of the exemplary embodiments of this
disclosure.
[0150] Moreover, certain terminology has been used to describe
embodiments of the present disclosure. For example, the terms "one
embodiment," "an embodiment," and/or "some embodiments" mean that a
particular feature, structure or characteristic described in
connection with the embodiment in connection with at least one
embodiment of the present disclosure. Therefore, it is emphasized
and should be appreciated that two or more references to "an
embodiment" or "one embodiment" or "an alternative embodiment" in
various parts of this specification are not necessarily all
referring to the same embodiment. Furthermore, some features,
structures, or features in the present disclosure of one or more
embodiments may be appropriately combined.
[0151] Further, it will be appreciated by one skilled in the art,
aspects of the present disclosure may be illustrated and described
herein in any of a number of patentable classes or context
including any new and useful process, machine, manufacture, or
composition of matter, or any new and useful improvement thereof.
Accordingly, aspects of the present disclosure may be implemented
entirely hardware, entirely software (including firmware, resident
software, micro-code, etc.) or combining software and hardware
implementation that may all generally be referred to herein as a
"unit," "module," or "system." Furthermore, aspects of the present
disclosure may take the form of a computer program product embodied
in one or more computer-readable media having computer readable
program code embodied thereon.
[0152] Furthermore, the recited order of processing elements or
sequences, or the use of numbers, letters, or other designations,
therefore, is not intended to limit the claimed processes and
methods to any order except as may be specified in the claims.
Although the above disclosure discusses through various examples
what is currently considered to be a variety of useful embodiments
of the disclosure, it is to be understood that such detail is
solely for that purpose, and that the appended claims are not
limited to the disclosed embodiments, but, on the contrary, are
intended to cover modifications and equivalent arrangements that
are within the spirit and scope of the disclosed embodiments. For
example, although the implementation of various components
described above may be embodied in a hardware device, it may also
be implemented as a software only solution, e.g., an installation
on an existing server or mobile device.
[0153] Similarly, it should be appreciated that in the foregoing
description of embodiments of the present disclosure, various
features are sometimes grouped together in a single embodiment,
figure, or description thereof for the purpose of streamlining the
disclosure aiding in the understanding of one or more of the
various embodiments. However, this disclosure method does not mean
that the present disclosure object requires more features than the
features mentioned in the claims. Rather, claimed subject matter
may lie in less than all features of a single foregoing disclosed
embodiment.
[0154] In some embodiments, the numbers expressing quantities of
ingredients, properties, and so forth, used to describe and claim
certain embodiments of the application are to be understood as
being modified in some instances by the term "about,"
"approximate," or "substantially" and etc. Unless otherwise stated,
"about," "approximate," or "substantially" may indicate .+-.20%
variation of the value it describes. Accordingly, in some
embodiments, the numerical parameters set forth in the description
and attached claims are approximations that may vary depending upon
the desired properties sought to be obtained by a particular
embodiment. In some embodiments, numerical data should consider the
specified significant digits and use a method reserved for general
digits. Notwithstanding that the numerical ranges and parameters
configured to illustrate the broad scope of some embodiments of the
present disclosure are approximations, the numerical values in
specific examples may be as accurate as possible within a practical
scope.
[0155] At last, it should be understood that the embodiments
described in the present application are merely illustrative of the
principles of the embodiments of the present application. Other
modifications that may be employed may be within the scope of the
application. Thus, by way of example, but not of limitation,
alternative configurations of the embodiments of the application
may be utilized in accordance with the teachings herein.
Accordingly, embodiments of the present disclosure are not limited
to the embodiments that are expressly introduced and described
herein.
* * * * *