U.S. patent application number 17/644929 was filed with the patent office on 2022-04-07 for abrasive article and method for forming.
The applicant listed for this patent is SAINT-GOBAIN ABRASIFS, SAINT-GOBAIN ABRASIVES, INC.. Invention is credited to Anton COTTRILL, Lucie FRAICHARD, Trent GRAHAM, Cecile O. MEJEAN, Lenny C. SALES.
Application Number | 20220105604 17/644929 |
Document ID | / |
Family ID | |
Filed Date | 2022-04-07 |
United States Patent
Application |
20220105604 |
Kind Code |
A1 |
SALES; Lenny C. ; et
al. |
April 7, 2022 |
ABRASIVE ARTICLE AND METHOD FOR FORMING
Abstract
An abrasive article including a substrate, a first bonding
material including metal overlying the substrate, abrasive
particles overlying the substrate and coupled to the first bonding
material, and a second bonding material including a metal and
phosphorus overlying at least a portion of the first bonding
material.
Inventors: |
SALES; Lenny C.; (Bradenton,
FL) ; GRAHAM; Trent; (Easley, SC) ; FRAICHARD;
Lucie; (Boston, MA) ; MEJEAN; Cecile O.;
(Acton, MA) ; COTTRILL; Anton; (Arlington,
MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAINT-GOBAIN ABRASIVES, INC.
SAINT-GOBAIN ABRASIFS |
Worcester
Conflans-Sainte-Honorine |
MA |
US
FR |
|
|
Appl. No.: |
17/644929 |
Filed: |
December 17, 2021 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
16519797 |
Jul 23, 2019 |
11213929 |
|
|
17644929 |
|
|
|
|
62702063 |
Jul 23, 2018 |
|
|
|
International
Class: |
B24D 3/06 20060101
B24D003/06; C09K 3/14 20060101 C09K003/14 |
Claims
1. An abrasive article comprising: a substrate; a first bonding
material comprising metal overlying the substrate; abrasive
particles overlying the substrate and coupled to the first bonding
material; and a second bonding material comprising a metal and
phosphorus and overlying at least a portion of the first bonding
material, wherein the first bonding material is a braze, and
wherein an average thickness of the second bonding material is at
least 10 microns and not greater than 80 microns.
2. The abrasive article of claim 1, wherein the first bonding
material is in form of a layer overlying an exterior surface of the
substrate.
3. The abrasive article of claim 1, wherein the first bonding
material comprises a metal alloy.
4. The abrasive article of claim 1, wherein the first bonding
material comprises at least one transition metal element.
5. The abrasive article of claim 1, wherein the first bonding
material comprises tin, copper, titanium, silver, tungsten, iron,
nickel chrome, or any combination thereof.
6. The abrasive article of claim 5, wherein the first bonding
material comprises tin, copper and titanium.
7. The abrasive article of claim 1, wherein the abrasive particles
have an average particle size (D50) of at least 500 microns.
8. The abrasive article of claim 1, wherein the abrasive particles
comprise an oxide, a carbide, a nitride, boride, diamond, or any
combination thereof.
9. The abrasive article of claim 1, wherein the abrasive particles
consist essentially of diamond.
10. The abrasive article of claim 1, wherein the second bonding
material includes an electroless plated material comprising nickel
and phosphorus.
11. The abrasive article of claim 1, wherein a content of
phosphorus in the second bonding material is at least 1 wt % and
not greater than 10 wt % based on the total weight of the second
bonding material.
12. The abrasive article of claim 1, wherein the content of
phosphorus is at least 5 wt % and not greater than 9 wt % based on
the total weight of the second bonding material.
13. The abrasive article of claim 1, wherein an average thickness
of the first bonding material is not greater than 50% of the
average particle size (D50) of the abrasive particles.
14. The abrasive article of claim 1, wherein a sum of the average
thickness of the first bonding material and of the average
thickness of the second bonding material define an average total
thickness, and wherein the average total thickness is at least 25%
and not greater than 60% of the average particle size of the
abrasive particles.
15. The abrasive article of claim 1, wherein the second bonding
material is an electroless plated nickel layer having a Vickers
hardness of at least 5.80 GPa.
16. The abrasive article of claim 6, wherein the first bonding
material comprises a ratio [C(Sn)/C(Cu)] of at least 0.1, wherein
C(Sn) is the weight percent of the tin for a total weight of the
first bonding material and C(Cu) is the weight percent of copper
for a total weight of the first bonding material, wherein the ratio
[C(Sn)/C(Cu)] is at least 0.13 and not greater than 1.
17. The abrasive article of claim 1, wherein the first bonding
material comprises a filler selected from the group consisting of a
particulate, a fiber, an inorganic material, or a combination
thereof.
18. The abrasive article of claim 17, wherein the filler comprises
a wear resistant particle.
19. The abrasive article of claim 17, wherein the filler comprises
a material selected from the group consisting of tungsten, iron,
titanium, diamond, a carbide, a nitride, a boride, an oxide, or any
combination thereof.
20. The abrasive article of claim 17, wherein the filler comprises
an average particle size (D50f) that is less than the average
particle size (D50) of the abrasive particles.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of U.S. patent
application Ser. No. 16/519,797, entitled "ABRASIVE ARTICLE AND
METHOD FOR FORMING," by Lenny C. Sales et al., filed Jul. 23, 2019,
which claims priority under 35 U.S.C. .sctn. 119(e) to U.S.
Provisional Patent Application No. 62/702,063, entitled "ABRASIVE
ARTICLE AND METHOD FOR FORMING," by Lenny C. Sales et al., filed
Jul. 23, 2018, of which both applications are assigned to the
current assignee hereof and incorporated herein by reference in
their entireties.
BACKGROUND
Field of the Disclosure
[0002] The following is directed to an abrasive article, and
particularly, to an abrasive article including a first bonding
material and a second bonding material.
Description of the Related Art
[0003] Abrasive articles, such as abrasive wheels, can be used for
cutting, grinding, or shaping various materials. The industry
continues to demand improved abrasive articles having improved
capabilities.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] The present disclosure may be better understood, and its
numerous features and advantages made apparent to those skilled in
the art by referencing the accompanying drawings.
[0005] FIG. 1 includes a flow chart illustrating a process of
forming an abrasive article according to an embodiment.
[0006] FIG. 2A includes an illustration of a cross-sectional
illustration of a portion of an abrasive article according to an
embodiment.
[0007] FIG. 2B includes an illustration or a cross-sectional
illustration of a portion of an abrasive article according to
another embodiment.
[0008] FIG. 3 is an optical microscope image of a cross cut of an
abrasive article according to one embodiment.
[0009] FIG. 4 includes a graph illustrating wear testing results of
different materials.
[0010] FIG. 5 includes a graph illustrating Differential Scanning
calorimetry (DSC) tests over a large temperature range of an
abrasive article according to one embodiment and of a comparative
abrasive article.
[0011] FIG. 6A includes a graph illustrating the temperature
increase during grinding in an EN-MSL wheel according to one
embodiment in comparison to an MSL wheel.
[0012] FIG. 6B includes a graph illustrating the temperature
increase during grinding in an EN-MSL wheel according to one
embodiment in comparison to an MSL wheel.
[0013] FIG. 7A includes a graph illustrating the grinding
performance of an abrasive article according to one embodiment and
of a comparative abrasive article.
[0014] FIG. 7B includes a drawing illustrating a cross-section of a
portion of an abrasive article according to one embodiment.
[0015] FIG. 7C includes and illustration illustrating a
cross-section or a portion of an abrasive article of a comparative
abrasive article.
DETAILED DESCRIPTION
[0016] The following description in combination with the figures is
provided to assist in understanding the teachings provided herein.
The following disclosure will focus on specific implementations and
embodiments of the teachings. This focus is provided to assist in
describing the teachings and should not be interpreted as a
limitation on the scope or applicability of the teachings. However,
other teachings can certainly be used in this application.
[0017] As used herein, the terms "comprises," "comprising,"
"includes," "including," "has," "having" or any other variation
thereof, are intended to cover a non-exclusive inclusion. For
example, a method, article, or apparatus that comprises a list of
features is not necessarily limited only to those features but may
include other features not expressly listed or inherent to such
method, article, or apparatus. Further, unless expressly stated to
the contrary, "or" refers to an inclusive-or and not to an
exclusive-or. For example, a condition A or B is satisfied by any
one of the following: A is true (or present) and B is false (or not
present), A is false (or not present) and B is true (or present),
and both A and B are true (or present).
[0018] Also, the use of "a" or "an" is employed to describe
elements and components described herein. This is done merely for
convenience and to give a general sense of the scope of the
invention. This description should be read to include one or at
least one and the singular also includes the plural, or vice versa,
unless it is clear that it is meant otherwise. For example, when a
single item is described herein, more than one item may be used in
place of a single item. Similarly, where more than one item is
described herein, a single item may be substituted for that more
than one item.
[0019] Unless otherwise defined, all technical and scientific terms
used herein have the same meaning as commonly understood by one of
ordinary skill in the art to which this invention belongs. The
materials, methods, and examples are illustrative only and not
intended to be limiting. To the extent that certain details
regarding specific materials and processing acts are not described,
such details may include conventional approaches, which may be
found in reference books and other sources within the manufacturing
arts.
[0020] The following is directed to abrasive articles suitable for
use in material removal operations. Notably, the abrasive articles
of the embodiments herein may be suitable for use in foundry
applications, including cutting and grinding of metal
materials.
[0021] FIG. 1 includes a flow chart providing a process for forming
an abrasive article according to an embodiment. The process begins
at step 101 by forming a first bonding material over a substrate.
The substrate may include an inorganic material, such as metal or
metal alloy. In one particular embodiment, the substrate can
consist of a metal or metal alloy. The substrate may have any
suitable shape for containing abrasive particles thereon, including
but not limited to, a disk, a wire, a rod, or even a substrate
having a complex shape with multiple different curvatures.
[0022] The first bonding material can be formed from a first
bonding precursor mixture that may be deposited on the substrate.
The first bonding precursor mixture can be a dry mixture or wet
mixture. The first bonding precursor mixture may be in the form of
a slurry, a paste, a tape, or the like. The first bonding precursor
mixture may be deposited selectively on certain portions of the
substrate where the abrasive particles are desired in the
finally-formed abrasive article. The first bonding precursor
mixture may be in the form of a single, continuous layer of
material overlying one or more surfaces of the substrate. In an
alternative embodiment, the first bonding precursor mixture may be
deposited in a plurality of discrete regions separated by gaps
where the underlying substrate is exposed and free of the first
bonding precursor mixture. The plurality of discrete regions may
define a discontinuous layer of the first bonding precursor
mixture.
[0023] The first bonding precursor mixture may include a mixture of
one or more powders contained in a liquid vehicle. The one or more
powders may include particulates of metal or metal alloys suitable
for forming the intended composition of the finally-formed first
bonding material. The liquid vehicle may be an organic or inorganic
material suitable for properly containing the one or more powders
in the mixture. In at least one embodiment, the liquid vehicle may
include a binder, such as a water-based organic binder, for
example, an alkaline gel including a xantham gum, a galactomannan
gum, glycerin, tripropylene glycol, a synthetic polymer, or any
combination thereof.
[0024] In one embodiment, the first bonding precursor material can
include at least one transition metal element. For example, the
first bonding precursor material can include at least one metal
selected from the group consisting of copper, tin, silver,
tungsten, iron, titanium, nickel, chrome, or any combination
thereof. In one particular embodiment, the first bonding precursor
material can include a powder material including tin, copper, and
titanium. The powder material can include a single prealloyed
particulate including tin, copper, and titanium. Alternatively, the
powder material can include three different powders of tin, copper,
and titanium mixed together in the desired amounts. In one
particular embodiment, the first bonding precursor material can be
a braze. In one aspect, the first bonding precursor material can be
a brazing paste comprising a prealloyed copper-tin powder and a
titanium hydride powder. Details regarding aspects of the
finally-formed first bonding material are provided in more detail
herein.
[0025] After depositing the first bonding material on the substrate
at step 101, the process can continue at step 102 by depositing
abrasive particles on the first bonding material. The abrasive
particles may include an oxide, a carbide, a nitride, a boride, a
superabrasive or any combination thereof. In one embodiment the
abrasive particles may include a superabrasive material, for
example, diamond particles or cubic boron nitride particles. In a
more particular embodiment, the abrasive particles may consist
essentially of diamond.
[0026] The abrasive particles may have a certain size that can
facilitate use of the abrasive article in certain applications.
Moreover, the average size of the diamonds may be related to the
first and second bonding materials, such that a suitable bond is
created to contain larger-sized abrasive particles. In one
embodiment, the abrasive particles may have an average particle
size (D50) of at least 500 microns, such as at least 525 microns or
at least 550 microns or at least 575 microns or at least 600
microns or at least 625 microns or at least 650 microns or at least
675 microns or at least 700 microns, or at least 750 microns, or at
least 800 microns. Still, in another non-limiting embodiment, the
abrasive particles may have an average particle size (D50) of not
greater than 5 mm or not greater than 4 mm or not greater than 3 mm
or not greater than 2 mm or not greater than 1.5 mm, or not greater
than 1.2 mm, or not greater than 1.0 mm. The abrasive particles may
have an average particle size (D50) within a range including any of
the minimum and maximum values noted above.
[0027] The first bonding material precursor may include one or more
fillers. The filler can be an optional additive included during the
deposition of the abrasive particles. Alternatively, the filler can
be included in the mixture of the first bonding material precursor.
The filler can be a particulate, a fiber, an inorganic material, or
a combination thereof. In one instance, the filler can include a
wear resistant particle. In another embodiment, the filler can
include a material selected from the group consisting of tungsten,
iron, titanium, diamond, a carbide, a nitride, a boride, an oxide,
or any combination thereof.
[0028] The filler may have a particular average particles size
relative to the average particle size of the abrasive particles.
For example, the filler can have an average particle size (D50f)
that is less than the average particle size (D50) of the abrasive
particles. More particularly, the filler and abrasive particles may
have a certain relationship to each other, which may be defined as
a ratio [(D50f)/(D50)]. In at least one instance, the ratio
[(D50f)/(D50)] can be not greater than 0.99, such as not greater
than 0.9 or not greater than 0.8 or not greater than 0.7 or not
greater than 0.6 or not greater than 0.5 or not greater than 0.4 or
not greater than 0.3 or not greater than 0.2 or not greater than
0.1 or not greater than 0.08 or not greater than 0.05 or not
greater than 0.02. Still, in one non-limiting embodiment, the ratio
[(D50f)/(D50)] can be at least 0.005 or at least 0.008 or at least
0.01 or at least 0.012 or at least 0.015 or at least 0.018 or at
least 0.02 or at least 0.025 or at least 0.03 or at least 0.035 or
at least 0.04 or at least 0.05 or at least 0.06 or at least 0.07 or
at least 0.08 or at least 0.09 or at least 0.1 or at least 0.15 or
at least 0.2 or at least 0.25. The ratio [(D50f)/(D50)] can be
within a range including any of the minimum and maximum values
noted above.
[0029] According to one aspect, the filler can have an average
particle size (D50f) of not greater than 10 microns, such as not
greater than 8 microns or not greater than 6 microns or not greater
than 4 microns or not greater than 2 microns or not greater than 1
micron or not greater than 0.8 microns or not greater than 0.5
microns. In other instances, the filler can have an average
particle size (D50f) of at least 0.01 microns or at least 0.05
microns or at least 0.08 microns or at least 0.1 micron or at least
0.2 microns or at least 0.5 microns or at least 0.8 microns or at
least 1 micron or at least 2 microns or at least 3 microns or at
least 5 microns. The average particle size of the filler (D50f) can
be within a range including any of the minimum and maximum values
noted above.
[0030] After depositing the abrasive particles on the first bonding
material precursor at step 102, the process can continue at step
103 by processing the first bonding material precursor. Processing
of the first bonding material precursor can include drying,
heating, melting or any combination thereof.
[0031] For example, in one embodiment, processing can include
drying the first bonding material precursor. Drying may be
conducted in a humidity-controlled environment for a duration of
between 1 to 24 hours. Drying may be conducted at a temperature
above room temperature but below the melting temperature of the
first bonding material precursor.
[0032] In one embodiment, processing may include treating the first
bonding material precursor at a suitable temperature to facilitate
melting of the first bonding material precursor to a state that
flows around the abrasive particles and secures them to the
substrate. Such a treatment may be conducted after an optional
drying process. In one embodiment, processing can include brazing
the first bonding material precursor comprising a braze to the
substrate. The brazing process can utilize a braze temperature to
suitably melt the braze material and secure the abrasive particles
in the braze and to the substrate. For example, a suitable braze
temperature can be at least 680.degree. C., or at least 700.degree.
C., or at least 720.degree. C., or at least 750.degree. C. In
another non-limiting embodiment, the braze temperature can be not
greater than 1000.degree. C., such as not greater than 950.degree.
C., not greater than 900.degree. C., not greater than 880.degree.
C., or not greater than 850.degree. C. It will be appreciated that
the braze temperature can be within a range including any of the
minimum and maximum values noted above.
[0033] It will be understood that reference to a braze temperature
is reference to the maximum temperature used to flow the first
bonding material precursor around the abrasive particles. Certain
embodiments may not necessarily use a braze material, but the braze
temperature may still represent the maximum temperature used to
form the first bonding material precursor into the first bonding
material.
[0034] Processing of the first bonding material precursor to form
the first bonding material can be conducted in a particular
atmosphere. For example, processing can be conducted in an inert
atmosphere or non-oxidizing atmosphere that can contain a suitable
amount of a gas such as argon, nitrogen, under vacuum, or the
like.
[0035] After processing the first bonding material precursor at
step 103 the process can continue at step 104 with electroless
plating of a second bonding material over the first bonding
material and abrasive particles. According to one embodiment,
electroless plating can include applying a second bonding material
as a layer via electroless plating. Electroless plating can include
the position of metals such as nickel, platinum, gold, chrome,
copper, silver, rhodium, zinc, tin, or cadmium. In one aspect, the
second bond material can be a nickel-phosphorous or nickel-boron
alloy.
[0036] After completing the process at step 104, an abrasive
article is formed. According to one aspect, the abrasive article
can include a substrate, a first bonding material comprising metal
overlying the substrate, abrasive particles overlying the substrate
and coupled to the first bonding material, and a second bonding
material comprising a metal and phosphorus overlying the abrasive
particles and first bonding material. In another aspect, the
abrasive article can include a substrate, a first bonding material
comprising metal overlying the substrate, abrasive particles
overlying the substrate and coupled to the first bonding material,
wherein the abrasive particles have an average particle size of at
least 500 microns, and a second bonding material comprising a metal
and overlying the abrasive particles and first bonding material. In
still another aspect, the abrasive article may include a substrate,
a first bonding material comprising a braze overlying the
substrate, abrasive particles overlying the substrate and coupled
to the first bonding material, and a second bonding material
comprising an electroless plated material and overlying the
abrasive particles and first bonding material.
[0037] FIG. 2A includes a cross-sectional illustration of an
abrasive article according to an embodiment. As illustrated, the
abrasive article 200 includes a substrate 201, a first bonding
material 202 overlying at least a portion of the substrate 201,
abrasive particles 203 contained in the first bonding material, and
a second bonding material 204 overlying at least portions of the
first bonding material 202. The second bonding material 204 may be
overlying at least a portion of the first bonding material 202 and
at least a portion of the abrasive particles 203.
[0038] The substrate 201 can have any of the features of the
embodiments described herein. While FIG. 2A includes a
cross-sectional illustration demonstrating the attachment of the
first bonding material 202 and the abrasive particles 203 to a
planar surface, it will be understood that the first bonding
material 202 may be applied to a curved surface of a substrate
201.
[0039] As illustrated in FIG. 2A, the first bonding layer 202 can
be in the form of a continuous layer of material overlying at least
a portion of the substrate 201. The first bonding layer 202 can be
directly attached to an exterior surface of the substrate 201.
According to one embodiment, the first bonding layer 202 can
overlie at least 50% of the exterior surface of the substrate 201,
such as at least 60% or at least 70% or at least 80% or at least
90% of the exterior surface of the substrate 201. In a particular
embodiment, the first bonding layer 202 can be a single, continuous
layer overlying essentially all of the exterior surface of the
substrate 201.
[0040] The first bonding material 202 can be formed from the first
bonding material precursor and include the composition of the first
bonding material precursor as defined in embodiments herein. For
example, the first bonding material 202 can include a metal or
metal alloy. The first bonding material 202 may include at least
one transition metal element. In certain instances, the first
bonding material 202 can include at least one metal selected from
the group of copper, tin, silver, tungsten, iron, titanium, nickel,
chrome, or any combination thereof. In one embodiment, the first
bonding material 202 may include tin, copper, and titanium, and in
more specific embodiments, may consist essentially of tin, copper,
and titanium. According to a particular example, the first bonding
material is a braze.
[0041] According to one embodiment, the first bonding material 202
can include a ratio [C(Sn)/C(Cu)] of at least 0.1, wherein C(Sn) is
the weight percent of the tin for a total weight of the first
bonding material 202 and C(Cu) is the weight percent of copper for
a total weight of the first bonding material 202. For example, the
ratio [C(Sn)/C(Cu)] can be at least 0.13 or at least 0.15 or at
least 0.18 or at least 0.2 or at least 0.23 or at least 0.25 or at
least 0.28 or at least 0.3 or at least 0.33 or at least 0.35 or at
least 0.38 or at least 0.4 or at least 0.43 or at least 0.45 or at
least 0.48 or at least 0.5 or at least 0.53. Still, in another
embodiment, the ratio [C(Sn)/C(Cu)] can be not greater than 1, such
as not greater than 0.9 or not greater than 0.8 or not greater than
0.7 or not greater than 0.6 or not greater than 0.5 or not greater
than 0.4 or not greater than 0.35 or not greater than 0.3 or not
greater than 0.25. It will be appreciated that the ratio
[C(Sn)/C(Cu)] can be within a range including any of the minimum
and maximum values noted above.
[0042] In another embodiment, the first bonding material 202 may
have a particular ratio [C(Ti)/C(Sn)] of at least 0.1, wherein
C(Ti) is the weight percent of titanium for a total weight of the
first bonding material 202 and C(Sn) is the weight percent of tin
for a total weight of the first bonding material 202. For example,
the ratio [C(Ti)/C(Sn)] can be at least 0.13, such as at least 0.15
or at least 0.18 or at least 0.2 or at least 0.23 or at least 0.25
or at least 0.28 or at least 0.3 or at least 0.33 or at least 0.35
or at least 0.38 or at least 0.4 or at least 0.43 or at least 0.45
or at least 0.48 or at least 0.5 or at least 0.53 or at least 0.55
or at least 0.6 or at least 0.65 or at least 0.7 or at least 0.75
or at least 0.8 or at least 0.9. Still, in one non-limiting
embodiment, the ratio [C(Ti)/C(Sn)] can be not greater than 1, such
as not greater than 0.9 or not greater than 0.8 or not greater than
0.7 or not greater than 0.6 or not greater than 0.5 or not greater
than 0.4 or not greater than 0.35 or not greater than 0.3 or not
greater than 0.25. It will be appreciated that the ratio
[C(Ti)/C(Sn)] can be within a range including any of the minimum
and maximum values noted above.
[0043] In yet another aspect, the first bonding material 202 can
have a ratio [C(Ti)/C(Cu)] of at least 0.01, wherein C(Ti) is the
weight percent of titanium for a total weight of the first bonding
material 202 and C(Cu) is the weight percent of copper for a total
weight of the first bonding material 202. For example, the ratio
[C(Ti)/C(Cu)] can be at least 0.02, such as at least 0.05 or at
least 0.08 or at least 0.1 or at least 0.12 or at least 0.15 or at
least 0.18 or at least 0.2 or at least 0.25 or at least 0.3. Still,
in another non-limiting embodiment, the ratio [C(Ti)/C(Cu)] can be
not greater than 1, such as not greater than 0.9 or not greater
than 0.8 or not greater than 0.7 or not greater than 0.6 or not
greater than 0.5 or not greater than 0.4 or not greater than 0.35
or not greater than 0.3 or not greater than 0.25 or not greater
than 0.2 or not greater than 0.18 or not greater than 0.15 or not
greater than 0.12 or not greater than 0.1. It will be appreciated
that the ratio [C(Ti)/C(Cu)] can be within a range including any of
the minimum and maximum values noted above.
[0044] In another embodiment, the first bonding material 202 may
include a particular content of copper that may facilitate improved
formation and performance. For example, the first bonding material
202 can have a content of copper of at least 30 wt % for a total
weight of the first bonding material 202, such as at least 40 wt %
or at least 50 wt % or at least 60 wt % or at least 70 wt % or at
least 80 wt %. Still, in another non-limiting embodiment, the first
bonding material 202 can have a content of copper of not greater
than 99 wt % for a total weight of the first bonding material 202,
such as not greater than 95 wt % or not greater than 93 wt % or not
greater than 90 wt % or not greater than 85 wt % or not greater
than 80 wt % or not greater than 75 wt % or not greater than 70 wt
% or not greater than 65 wt % or not greater than 60 wt % or not
greater than 55 wt %. It will be appreciated that the content of
copper in the first bonding material 202 can be within a range
including any of the minimum and maximum values noted above.
[0045] In another embodiment, the first bonding material 202 may
include a particular content of tin that may facilitate improved
formation and performance. For example, the first bonding material
202 can have a content of tin of at least 5 wt % for a total weight
of the first bonding material 202, such as at least 8 wt % or at
least 10 wt % or at least 12 wt % or at least 15 wt % or at least
18 wt % or at least 20 wt % or at least 22 wt % or at least 25 wt %
or at least 27 wt % or at least 30 wt %. Still, in another
non-limiting embodiment, the first bonding material 202 can have a
content of tin of not greater than 50 wt % for a total weight of
the first bonding material 202, such as not greater than 40 wt % or
not greater than 35 wt % or not greater than 30 wt % or not greater
than 28 wt % or not greater than 25 wt % or not greater than 22 wt
% or not greater than 20 wt % or not greater than 18 wt % or not
greater than 15 wt % or not greater than 12 wt %. It will be
appreciated that the content of tin in the first bonding material
202 can be within a range including any of the minimum and maximum
values noted above.
[0046] In another embodiment, the first bonding material 202 may
include a particular content of titanium that may facilitate
improved formation and performance. For example, the first bonding
material 202 can have a content of titanium of at least 0.5 wt %
for a total weight of the first bonding material 202 or at least
0.8 wt % or at least 1 wt % or at least 2 wt % or at least 6 wt %
or at least 8 wt % or at least 10 wt % or at least 12 wt % or at
least 15 wt % or at least 18 wt % or at least 20 wt %. Still, in
another non-limiting embodiment, the first bonding material 202 can
have a content of titanium of not greater than 30 wt % for a total
weight of the first bonding material 202, such as not greater than
20 wt % or not greater than 18 wt % or not greater than 15 wt % or
not greater than 12 wt % or not greater than 10 wt % or not greater
than 8 wt % or not greater than 6 wt %. It will be appreciated that
the content of titanium in the first bonding material 202 can be
within a range including any of the minimum and maximum values
noted above.
[0047] The abrasive particles 203 of the finally-formed abrasive
article 200 can have any of the features of embodiments herein,
including but not limited to, average particle size (D50),
composition, relative size to the filler, and the like. In
particular, the first bonding material 202 may have a particular
average thickness relative to the average particle size of the
abrasive particles 203, which may facilitate improved formation and
operation of the abrasive article 200. For example, the first
bonding material 202 may have an average thickness of not greater
than 50% of the average particles size (D50) of the abrasive
particles 203, such as not greater than 45% or not greater than 40%
or not greater than 35% or not greater than 30% or not greater than
25% or not greater than 20% or not greater than 10% of the average
particles size (D50) of the abrasive particles 203. Still, in one
non-limiting embodiment, the first bonding material 202 may have an
average thickness of at least 10% of the average particles size
(D50) of the abrasive particles 203, such as at least 20% or at
least 30% or at least 40% or at least 50% of the average particles
size (D50) of the abrasive particles 203. The average thickness of
the first bonding material 202 can be measured by taking at least
three randomly selected optical microscope images at a suitable
magnification (e.g., 50.times.). The area of the first bonding
material 202 in each image can be evaluated using a suitable
imaging analysis program, such as ImageJ. The total area of the
first bonding material 202 is divided by the length of the first
bonding material in the image to calculate the average thickness of
the first bonding material 202.
[0048] It will be appreciated that the filler described in
embodiments herein may be optionally included in the first bonding
material 202 or second bonding material 204 or both the first
bonding material 202 and the second bonding material 204.
[0049] As noted in embodiments herein, the second bonding material
204 can be an electroless plated material. According to one
embodiment, the second bonding material 204 can be in the form of a
thin, conformal layer overlying portions of the first bonding
material 202 and portions of the abrasive particles 203. The second
bonding material 204 may not completely bury the majority of the
tips of the abrasive particles 203, such that there is sufficient
exposure of the abrasive particles 203 above the upper surface of
the second bonding material 204 for suitable abrasive
capabilities.
[0050] According to one embodiment, the second bonding material 204
can include at least one metal element and phosphorus. The second
bonding material 204 may have a particular content of phosphorus
that facilitates improved formation and operation of the abrasive
article. For example, the second bonding material 204 can have a
content of phosphorus of not greater than 10 wt % for a total
weight of the second bonding material 204 or not greater than 9 wt
% or not greater than 8 wt % or not greater than 7 wt % or not
greater than 6 wt % or not greater than 5 wt % or not greater than
4 wt % or not greater than 3 wt % or not greater than 2 wt % or not
greater than 1 wt % for a total weight of the second bonding
material 204. In another non-limiting embodiment, the second
bonding material 204 may have a content of phosphorus of at least
0.1 wt % for a total weight of the second bonding material 204,
such as at least 1 wt % or at least 2 wt % or at least 3 wt % or at
least 4 wt % or at least 5 wt % or at least 6 wt % or at least 7 wt
% or at least 8 wt %. In a particular embodiment, the phosphorus
content can be at least 5 wt % and not greater than 9 wt %. The
content of phosphorus in the second bonding material 204 can be
within a range including any of the minimum and maximum values
noted above.
[0051] The at least one metal element of the second bonding
material 204 may include at least one transition metal element. For
example, the second bonding material 204 may include nickel. In
more particular instances, the second bonding material 204 may
include a certain content of nickel that may facilitate improved
formation and performance of the abrasive article. In certain
instance, the second bonding material 204 may include at least 50
wt % nickel for a total weight of the second bonding material 204,
such as at least 60 wt % or at least 70 wt % or at least 80 wt % or
at least 90 wt % or at least 95 wt % for a total weight of the
second bonding material 204. According to another non-limiting
embodiment, the second bonding material 204 may include not greater
than 99 wt % nickel for a total weight of the second bonding
material 204, such as not greater than 95 wt % or not greater than
93 wt % or not greater than 90 wt % for a total weight of the
second bonding material 204. The content of nickel in the second
bonding material 204 can be within a range including any of the
minimum and maximum values noted above.
[0052] According to another aspect, the second bonding material 204
may have a particular average thickness relative to the first
bonding material 202, which may facilitate improved formation and
operation of the abrasive article 200. For example, the second
bonding material 204 can have an average thickness not greater than
an average thickness of the first bonding material 202.
[0053] In other instances, the second bonding material 204 may have
a particular average thickness relative to the average particle
size (D50) of the abrasive particles 203, which may facilitate
improved formation and operation of the abrasive article 200. For
example, the second bonding material 204 may have an average
thickness of not greater than 40% of the average particles size
(D50) of the abrasive particles, such as not greater than 35% or
not greater than 30% or not greater than 25% or not greater than
20% or not greater than 15% or not greater than 12% or not greater
than 10% of the average particles size (D50) of the abrasive
particles 203. Still, in one non-limiting embodiment, the second
bonding material 204 may have an average thickness of at least 1%
of the average particles size (D50) of the abrasive particles 203,
such as at least 3%, or at least 5%, or at least 8%, or at least
10%, or at least 15%, or at least 20%, or at least 25%, or at least
30% of the average particles size (D50) of the abrasive particles
203. The average thickness of the second bonding material 204 can
be measured by taking at least three randomly selected optical
microscope images at a suitable magnification (e.g., 50X). The area
of the second bonding material 204 in each image can be evaluated
using a suitable imaging analysis program, such as ImageJ. The
total area of the second bonding material 204 is divided by the
length of the second bonding material 204 in the image to calculate
the average thickness of the second bonding material 204.
[0054] In one embodiment, the average thickness of the second
bonding material can be at least 10 microns, such as at least 15
microns, at least 20 microns, at least 30 microns, at least 40
microns, or at least 50 microns. In another embodiment, the average
thickness of the second bonding material may be not greater than
500 microns, such as not greater than 300 microns, or not greater
than 250 microns, or not greater than 200 microns, or not greater
than 150 microns, or not greater than 100 microns, or not greater
than 80 microns, or not greater than 60 microns, or not greater
than 50 microns, or not greater than 40 microns, or not greater
than 35 microns. The average thickness of the second bonding
material can be within a range including any of the minimum and
maximum values noted above. In a particular embodiment, the
thickness of the EN layer can be at least 20 microns and not
greater than 55 microns.
[0055] The average total thickness of the bonding materials can be
calculated from the sum of the average thickness of the first
bonding material 202 and the average thickness of the second
bonding material 204. The average total thickness may have a
certain relationship relative to the average particle size (D50) of
the abrasive particles that can facilitate improved formation and
operation of the abrasive article. For example, the average total
thickness of the combined first and second bonding materials may be
not greater than 80% of the average particles size (D50) of the
abrasive particles 203, such as not greater than 75% or not greater
than 70% or not greater than 65% or not greater than 60% or not
greater than 55% or not greater than 50%, or not greater than 47%,
or not greater than 45% of the average particles size (D50) of the
abrasive particles 203. Still, in one embodiment, the average total
thickness can be at least 30% of the average particles size (D50)
of the abrasive particles, such as at least 40% or at least 50% or
at least 60% or at least 70% of the average particles size (D50) of
the abrasive particles 203. In a particular aspect, the average
total thickness of the combined bonding materials can be at least
30% and not greater than 50% based on the average particle size
(D50) of the abrasive particles. The average total thickness of the
bonding materials may be within a range including any of the
minimum and maximum percentages noted above.
[0056] In one particular embodiment, the average total thickness of
the sum of the first and second bonding materials may be not
greater than 500 microns or not greater than 450 microns or not
greater than 400 microns or not greater than 350 microns or not
greater than 300 microns or not greater than 250 microns. According
to another non-limiting embodiment, the average total thickness of
the bonding materials can be at least 100 microns or at least 200
microns or at least 250 microns or at least 300 microns or at least
350 microns. The average total thickness of the bonding materials
may be within a range including any of the minimum and maximum
values noted above.
[0057] In a particular embodiment, the second bonding material can
be an electroless plated nickel layer having a Vickers hardness of
at least 5.50 GPa, such as at least 5.8 GPa, or at least 6.0 GPa,
or at least 6.2 GPa, or at least 6.4 GPa, or at least 6.5 GPa.
[0058] In a further certain embodiment, the second bonding material
can be an electroless plated nickel layer having a thickness of at
least 10 microns and not greater than 60 microns and a Vickers
hardness of at least 6 GPa.
[0059] FIG. 2B includes a cross-sectional illustration of an
abrasive article according to an alternative embodiment. As
illustrated, the abrasive article 250 includes a substrate 201, a
first bonding material 252 overlying at least a portion of the
substrate 201, abrasive particles 203 contained in the first
bonding material 252, and a second bonding material 204 overlying
at least portions of the first bonding material 252. The second
bonding material 204 may be overlying at least a portion of the
first bonding material 252 and at least a portion of the abrasive
particles 203. Notably, the first bonding material 252 can be a
discontinuous layer having discrete regions of the first bonding
material 252 separated by gap regions 253. The gap regions 253 can
be free of the first bonding material 252 and abrasive particles
203. The gap regions 253 may optionally include the second bonding
material 204 in direct contact with the substrate 201. However, it
will be appreciated in certain instances, the gap regions 253 may
be free of any bonding material and define a region where the
substrate 201 is exposed.
[0060] As further shown in the examples, abrasive articles with a
surprisingly high life time and grinding performance could be
produced by attaching diamond particles via a first bonding layer
to a steel support and covering the first bonding layer and diamond
particles with a thin electroless plated nickel layer. Not being
bound to theory, reasons for the exceptional grinding performance
can be a strong bonding of the diamond particles to the support by
the combination of the two bonding layers, which may allow a high
grain exposure for the grinding operation. The electroless nickel
(EN) layer can very evenly be applied on top of the first bonding
layer and the abrasive particles, and the EN layer can provide an
excellent heat shielding and oxidation protection with a thickness
of about only 50 microns or lower.
EMBODIMENTS
[0061] Embodiment 1. An abrasive article comprising: a substrate; a
first bonding material comprising metal overlying the substrate;
abrasive particles overlying the substrate and coupled to the first
bonding material; and a second bonding material comprising a metal
and phosphorus overlying at least a portion of the first bonding
material.
[0062] Embodiment 2. An abrasive article comprising: a substrate; a
first bonding material comprising metal overlying the substrate;
abrasive particles overlying the substrate and coupled to the first
bonding material, wherein the abrasive particles have an average
particle size of at least 500 microns; and a second bonding
material comprising a metal and overlying at least a portion of the
first bonding material.
[0063] Embodiment 3. An abrasive article comprising: a substrate; a
first bonding material comprising a braze overlying the substrate;
abrasive particles overlying the substrate and coupled to the first
bonding material; and a second bonding material comprising an
electroless plated material and overlying at least a portion of the
first bonding material.
[0064] Embodiment 4. The abrasive article of any one of Embodiments
1, 2, and 3, wherein the substrate comprises an inorganic
material.
[0065] Embodiment 5. The abrasive article of any one of Embodiments
1, 2, and 3, wherein the substrate comprises a metal or metal
alloy.
[0066] Embodiment 6. The abrasive article of any one of Embodiments
1, 2, and 3, wherein the substrate consists of a metal or metal
alloy.
[0067] Embodiment 7. The abrasive article of any one of Embodiments
1, 2, and 3, wherein the first bonding material is in the form of a
layer overlying an exterior surface of the substrate.
[0068] Embodiment 8. The abrasive article of any one of Embodiments
1, 2, and 3, wherein the first bonding material overlies at least
50% of the exterior surface of the substrate or at least 60% or at
least 70% or at least 80% or at least 90%.
[0069] Embodiment 9. The abrasive article of any one of Embodiments
1, 2, and 3, wherein the first bonding material is a single,
continuous layer overlying essentially all of the exterior surface
of the substrate.
[0070] Embodiment 10. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material
comprises a metal alloy.
[0071] Embodiment 11. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material
comprises at least one transition metal element.
[0072] Embodiment 12. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material
comprises at least one metal selected from the group consisting of
copper, tin, silver, tungsten, iron, titanium, nickel, chrome, or
any combination thereof.
[0073] Embodiment 13. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material
comprises tin, copper, and titanium.
[0074] Embodiment 14. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a ratio [C(Sn)/C(Cu)]
of at least 0.1, wherein C(Sn) is the weight percent of the tin for
a total weight of the first bonding material and C(Cu) is the
weight percent of copper for a total weight of the first bonding
material, wherein the ratio [C(Sn)/C(Cu)] is at least 0.13 or at
least 0.15 or at least 0.18 or at least 0.2 or at least 0.23 or at
least 0.25 or at least 0.28 or at least 0.3 or at least 0.33 or at
least 0.35 or at least 0.38 or at least 0.4 or at least 0.43 or at
least 0.45 or at least 0.48 or at least 0.5 or at least 0.53.
[0075] Embodiment 15. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a ratio [C(Sn)/C(Cu)]
of not greater than 1 or not greater than 0.9 or not greater than
0.8 or not greater than 0.7 or not greater than 0.6 or not greater
than 0.5 or not greater than 0.4 or not greater than 0.35 or not
greater than 0.3 or not greater than 0.25.
[0076] Embodiment 16. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a ratio [C(Ti)/C(Sn)]
of at least 0.1, wherein C(Ti) is the weight percent of titanium
for a total weight of the first bonding material and C(Sn) is the
weight percent of tin for a total weight of the first bonding
material, wherein the ratio [C(Ti)/C(Sn)] is at least 0.13 or at
least 0.15 or at least 0.18 or at least 0.2 or at least 0.23 or at
least 0.25 or at least 0.28 or at least 0.3 or at least 0.33 or at
least 0.35 or at least 0.38 or at least 0.4 or at least 0.43 or at
least 0.45 or at least 0.48 or at least 0.5 or at least 0.53 or at
least 0.55 or at least 0.6 or at least 0.65 or at least 0.7 or at
least 0.75 or at least 0.8 or at least 0.9.
[0077] Embodiment 17. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a ratio [C(Ti)/C(Sn)]
of not greater than 1 or not greater than 0.9 or not greater than
0.8 or not greater than 0.7 or not greater than 0.6 or not greater
than 0.5 or not greater than 0.4 or not greater than 0.35 or not
greater than 0.3 or not greater than 0.25.
[0078] Embodiment 18. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a ratio [C(Ti)/C(Cu)]
of at least 0.01, wherein C(Ti) is the weight percent of titanium
for a total weight of the first bonding material and C(Cu) is the
weight percent of copper for a total weight of the first bonding
material, wherein the ratio [C(Ti)/C(Cu)] is at least 0.02 or at
least 0.05 or at least 0.08 or at least 0.1 or at least 0.12 or at
least 0.15 or at least 0.18 or at least 0.2 or at least 0.25 or at
least 0.3.
[0079] Embodiment 19. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a ratio [C(Ti)/C(Cu)]
of not greater than 1 or not greater than 0.9 or not greater than
0.8 or not greater than 0.7 or not greater than 0.6 or not greater
than 0.5 or not greater than 0.4 or not greater than 0.35 or not
greater than 0.3 or not greater than 0.25 or not greater than 0.2
or not greater than 0.18 or not greater than 0.15 or not greater
than 0.12 or not greater than 0.1.
[0080] Embodiment 20. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a content of copper of
at least 30 wt % for a total weight of the first bonding material
or at least 40 wt % or at least 50 wt % or at least 60 wt % or at
least 70 wt % or at least 80 wt %.
[0081] Embodiment 21. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a content of copper of
not greater than 99 wt % for a total weight of the first bonding
material or not greater than 95 wt % or not greater than 93 wt % or
not greater than 90 wt % or not greater than 85 wt % or not greater
than 80 wt % or not greater than 75 wt % or not greater than 70 wt
% or not greater than 65 wt % or not greater than 60 wt % or not
greater than 55 wt %.
[0082] Embodiment 22. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a content of tin of at
least 5 wt % for a total weight of the first bonding material or at
least 8 wt % or at least 10 wt % or at least 12 wt % or at least 15
wt % or at least 18 wt % or at least 20 wt % or at least 22 wt % or
at least 25 wt % or at least 27 wt % or at least 30 wt %.
[0083] Embodiment 23. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a content of tin of
not greater than 50 wt % for a total weight of the first bonding
material or not greater than 40 wt % or not greater than 35 wt % or
not greater than 30 wt % or not greater than 28 wt % or not greater
than 25 wt % or not greater than 22 wt % or not greater than 20 wt
% or not greater than 18 wt % or not greater than 15 wt % or not
greater than 12 wt %.
[0084] Embodiment 24. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a content of titanium
of at least 0.5 wt % for a total weight of the first bonding
material or at least 0.8 wt % or at least 1 wt % or at least 2 wt %
or at least 6 wt % or at least 8 wt % or at least 10 wt % or at
least 12 wt % or at least 15 wt % or at least 18 wt % or at least
20 wt %.
[0085] Embodiment 25. The abrasive article of Embodiment 13,
wherein the first bonding material comprises a content of titanium
of not greater than 30 wt % for a total weight of the first bonding
material or not greater than 20 wt % or not greater than 18 wt % or
not greater than 15 wt % or not greater than 12 wt % or not greater
than 10 wt % or not greater than 8 wt % or not greater than 6 wt
%.
[0086] Embodiment 26. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material is a
braze.
[0087] Embodiment 27. The abrasive article of any one of
Embodiments 1 and 3, wherein the abrasive particles have an average
particle size (D50) of at least 500 microns.
[0088] Embodiment 28. The abrasive article of any one of
Embodiments 2 and 27, wherein the abrasive particles have an
average particle size (D50) of at least 525 microns or at least 550
microns or at least 575 microns or at least 600 microns or at least
625 microns or at least 650 microns or at least 675 microns or at
least 700 microns or at least 750 microns, or at least 800
microns.
[0089] Embodiment 29. The abrasive article of any one of
Embodiments 2 and 27, wherein the abrasive particles have an
average particles size (D50) of not greater than 5 mm or not
greater than 4 mm or not greater than 3 mm or not greater than 2 mm
or not greater than 1.5 mm or 1.2 mm or 1.0 mm.
[0090] Embodiment 30. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the abrasive particles comprise at
least one of an oxide, carbide, nitride, boride, superabrasive or
any combination thereof.
[0091] Embodiment 31. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the abrasive particles comprise
diamond.
[0092] Embodiment 32. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the abrasive particles consist
essentially of diamond.
[0093] Embodiment 33. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material
comprises a filler selected from the group consisting of a
particulate, a fiber, an inorganic material, or a combination
thereof.
[0094] Embodiment 34. The abrasive article of Embodiment 33,
wherein the filler comprises a wear resistant particle.
[0095] Embodiment 35. The abrasive article of Embodiment 33,
wherein the filler comprises a material selected from the group
consisting of tungsten, iron, titanium, diamond, a carbide, a
nitride, a boride, an oxide, or any combination thereof.
[0096] Embodiment 36. The abrasive article of Embodiment 33,
wherein the filler comprises an average particle size (D50f) that
is less than the average particle size (D50) of the abrasive
particles.
[0097] Embodiment 37. The abrasive article of Embodiment 36,
further comprising a ratio [(D50f)/(D50)] of not greater than 0.99
or not greater than 0.9 or not greater than 0.8 or not greater than
0.7 or not greater than 0.6 or not greater than 0.5 or not greater
than 0.4 or not greater than 0.3 or not greater than 0.2 or not
greater than 0.1 or not greater than 0.08 or not greater than 0.05
or not greater than 0.02.
[0098] Embodiment 38. The abrasive article of Embodiment 37,
wherein the ratio [(D50f)/(D50)] is at least 0.005 or at least
0.008 or at least 0.01 or at least 0.012 or at least 0.015 or at
least 0.018 or at least 0.02 or at least 0.025 or at least 0.03 or
at least 0.035 or at least 0.04 or at least 0.05 or at least 0.06
or at least 0.07 or at least 0.08 or at least 0.09 or at least 0.1
or at least 0.15 or at least 0.2 or at least 0.25.
[0099] Embodiment 39. The abrasive article of Embodiment 33,
wherein the filler comprises an average particle size (D50f) of not
greater than 10 microns or not greater than 8 microns or not
greater than 6 microns or not greater than 4 microns or not greater
than 2 microns or not greater than 1 micron or not greater than 0.8
microns or not greater than 0.5 microns.
[0100] Embodiment 40. The abrasive article of Embodiment 33,
wherein the filler comprises an average particle size (D50f) or at
least 0.01 microns or at least 0.05 microns or at least 0.08
microns or at least 0.1 micron or at least 0.2 microns or at least
0.5 microns or at least 0.8 microns or at least 1 micron or at
least 2 microns or at least 3 microns or at least 5 microns.
[0101] Embodiment 41. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material
comprises an average thickness of not greater than 50% of the
average particles size (D50) of the abrasive particles or not
greater than 45% or not greater than 40% or not greater than 35% or
not greater than 30% or not greater than 25% or not greater than
20% or not greater than 10%.
[0102] Embodiment 42. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the first bonding material
comprises an average thickness of at least 10% of the average
particles size (D50) of the abrasive particles or at least 20% or
at least 30% or at least 40% or at least 50%.
[0103] Embodiment 43. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the second bonding material
comprising a metal and phosphorus.
[0104] Embodiment 44. The abrasive article of any one of
Embodiments 1 and 43, wherein the second bonding material comprises
a content of phosphorus of not greater than 10 wt % for a total
weight of the second bonding material or not greater than 9 wt % or
not greater than 8 wt % or not greater than 7 wt % or not greater
than 6 wt % or not greater than 5 wt % or not greater than 4 wt %
or not greater than 3 wt % or not greater than 2 wt % or not
greater than 1 wt %.
[0105] Embodiment 45. The abrasive article of any one of
Embodiments 1 and 43, wherein the second bonding material comprises
a content of phosphorus of at least 0.1 wt % for a total weight of
the second bonding material or at least 1 wt % or at least 2 wt %
or at least 3 wt % or at least 4 wt % or at least 5 wt % or at
least 6 wt % or at least 7 wt % or at least 8 wt %.
[0106] Embodiment 46. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the second bonding material
comprises a transition metal element.
[0107] Embodiment 47. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the second bonding material
comprises nickel.
[0108] Embodiment 48. The abrasive article of Embodiment 47,
wherein the second bonding material comprises at least 50 wt %
nickel for a total weight of the second bonding material or at
least 60 wt % or at least 70 wt % or at least 80 wt % or at least
90 wt % or at least 95 wt %.
[0109] Embodiment 49. The abrasive article of Embodiment 47,
wherein the second bonding material comprises not greater than 99
wt % nickel or not greater than 95 wt % or not greater than 93 wt %
or not greater than 90 wt %.
[0110] Embodiment 50. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the second bonding material
comprises an average thickness of not greater than 40% of the
average particles size (D50) of the abrasive particles or not
greater than 35% or not greater than 30% or not greater than 25% or
not greater than 20% or not greater than 15% or not greater than
12% or not greater than 10%.
[0111] Embodiment 51. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the second bonding material
comprises an average thickness of at least 5% of the average
particles size (D50) of the abrasive particles or at least 8% or at
least 10% or at least 15% or at least 20% or at least 25% or at
least 30%.
[0112] Embodiment 52. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the second bonding material
comprises an average thickness not greater than an average
thickness of the first bonding material.
[0113] Embodiment 53. The abrasive article of any one of
Embodiments 1, 2, and 3, wherein the sum of the average thickness
of the first bonding material and the average thickness of the
second bonding material define an average total thickness, and
wherein the average total thickness is not greater than 80% of the
average particles size (D50) of the abrasive particles or not
greater than 75% or not greater than 70% or not greater than 65% or
not greater than 60% or not greater than 55% or not greater than
50%, or not greater than 45%, or not greater than 40%, or not
greater than 35%.
[0114] Embodiment 54. The abrasive article of Embodiment 53,
wherein the average total thickness is at least 25% of the average
particles size (D50) of the abrasive particles or at least 30% or
at least 35% or at least 40% or at least 50% or at least 60% or at
least 70%.
[0115] Embodiment 55. The abrasive article of Embodiment 53,
wherein the average total thickness is not greater than 500 microns
or not greater than 450 microns or not greater than 400 microns or
not greater than 350 microns or not greater than 300 microns or not
greater than 250 microns.
[0116] Embodiment 56. The abrasive article of Embodiment 53,
wherein the average total thickness is at least 100 microns or at
least 200 microns or at least 250 microns or at least 300 microns
or at least 350 microns.
[0117] Embodiment 57. The abrasive article of any one of
Embodiments 1 and 2, wherein the second bonding material comprising
an electroless plated material overlying the abrasive particles and
first bonding material.
[0118] Embodiment 58. The abrasive article of Embodiment 57,
wherein the second bonding material is an electroless plated nickel
layer having a thickness of at least 10 microns, or at least 15
microns, or at least 20 microns, or at least 30 microns, or at
least 40 microns, or at least 50 microns.
[0119] Embodiment 59. The abrasive article of Embodiment 57,
wherein the second bonding material is an electroless plated nickel
layer having a thickness of not greater than 150 microns, or not
greater than 100 microns, or not greater than 80 microns, or not
greater than 60 microns, or not greater than 50 microns.
[0120] Embodiment 60. The abrasive article of Embodiment 57,
wherein the second bonding material is an electroless plated nickel
layer having a Vickers hardness of at least 5.50 GPa, such as at
least 5.8 GPa, or at least 6.0 GPa, or at least 6.2 GPa, or at
least 6.4 GPa, or at least 6.5 GPa.
[0121] Embodiment 61. A method of forming an abrasive article
comprising: depositing a layer of a first bonding precursor mixture
on an exterior surface of a substrate; depositing abrasive
particles on to the layer of the first bonding precursor mixture;
forming a first bonding material by brazing the first bonding
precursor mixture to the substrate; and electroless plating a
second bonding material over at least portions of the first bonding
material and the abrasive particles.
[0122] Embodiment 62. The method of Embodiment 61, wherein brazing
comprises heating to a brazing temperature of at least 400.degree.
C., or at least 500.degree. C., or at least 600.degree. C., or at
least 700.degree. C., or at least 800.degree. C.
[0123] Embodiment 63. The method of Embodiment 61, wherein brazing
includes heating to a brazing temperature of not greater than
1000.degree. C., or not greater than 950.degree. C., or not greater
than 900.degree. C., or not greater than 850.degree. C.
[0124] Embodiment 64. The method of Embodiment 61, wherein the
braze material is a paste or tape comprising metal particles.
[0125] Embodiment 65. The method of Embodiment 61, wherein
electroless plating comprises depositing of nickel, platinum, gold,
chrome, copper, silver, rhodium, zinc, tin, cadmium.
[0126] Embodiment 66. The method of Embodiment 61, wherein
electroless plating comprises electroless nickel plating.
[0127] Embodiment 67. The method of Embodiment 61, wherein a
plating bath of the electroless nickel plating comprises a nickel
salt, a phosphite salt, and a reducing agent.
[0128] Embodiment 68. The method of any one of Embodiments 61 to
67, wherein the second bonding material comprises nickel and
phosphorus, and an amount of the phosphorus is at least 4 wt % and
not greater than 10 wt % based on the total weight of the second
bonding material.
[0129] Embodiment 69. The method of any one of Embodiments 61 to
68, wherein forming of the first bonding material includes
providing a brazing paste, wherein the brazing paste comprises a
prealloyed copper-tin powder and a titanium hydride powder.
EXAMPLES
Example 1
[0130] Preparing of Brazing Paste.
[0131] A prealloyed copper tin braze powder (77 wt % Cu--23 wt %
Sn) having a size of -325/+400 mesh in an amount of 2182 g (72.7 wt
%) was mixed together with 218 g (7.3 wt %) of a titanium hydride
powder also having a mesh size of -325 in a plastic container.
[0132] In a stainless steel container, a binder was prepared by
stirring together 90 g (3 wt %) of tripropylene glycol and 510 g
(17 wt %) of Vita-Gel binder. Thereafter, the powder mixture was
combined with the binder and mixed in a rotating paint shaker for
about 20 minutes. The braze paste was filled into 6 oz cartridges
and kept air tight to prevent drying until use.
Example 2
[0133] Manufacturing of Abrasive Wheel.
[0134] A round steel substrate with a diameter of 150 cm was
surface pretreated by sandblasting and washed with acetone.
Thereafter, a 1 mm thick layer of the brazing paste of Example 1
was evenly applied on the pretreated surface of the steel
substrate. The brazing paste (also called first bonding precursor
mixture herein) was applied to the upper surface of the steel
substrate by filling the space within the substrate surface and a
brazing template positioned above the substrate surface at a height
comparative to the thickness of the paste to be applied, while the
lathe was slowly turning.
[0135] Thereafter, the brazing template was removed and coarse
diamond particles having an average particle size of 852 microns
and a particle distribution between 601 microns to 1001 microns
(Element 6 from De Beers Group) were evenly deposited over the
applied brazing paste layer while slowly rotating the wheel. The
amount of diamond particles deposited on the brazing paste was 0.14
g/cm.sup.2. The applied brazing paste (i.e., first bonding
precursor mixture) was dried at a temperature of 20.degree. C. to
23.degree. C. for about 12 hours.
[0136] After drying, the wheel was subjected to a heat treatment
regime in a furnace under vacuum (non-oxidizing condition), as
summarized in Table 1.
[0137] During the heat treatment regime (brazing), the metal filler
of the brazing paste partially melted and densified and thereby
adhered the diamond particles to the steel surface.
[0138] After the heat treatment regime, the wheel surface was
cleaned from any lose particles.
[0139] As used herein, an abrasive article containing a metal
support, a brazing layer and diamond particles attached via the
brazing layer to the metal support, as described above, is called a
MSL (metal single layer) bonded article.
TABLE-US-00001 TABLE 1 Temperature regime during brazing Ramp Speed
and Holding Target[.degree. C.] Time Holding 71 0:00:20 Ramp 177
5.6 Holding 177 0:20:00 Ramp 443 5.5 Holding 443 0:00:30 Ramp 471
0.6 Holding 471 0:00:30 Ramp 700 8.8 Holding 700 0:20:00 Ramp 865
8.7 Holding 865 0.041 Ramp 82 43.5 Holding 82 0:00:30 Step 49 Free
cooling Holding 49 0:01:00
[0140] After the brazing, a second bonding material was applied
over the first bonding material and diamond particles (MSL wheel)
by electroless nickel plating. The electroless nickel plating was
conducted by placing the wheel after the brazing in a plating bath
including a nickel salt, a phosphite salt, and a reducing agent
(MetaPlate 6000 from MetalChem). The temperature of the plating
bath was about 90.degree. C., and the electroless plating was
conducted for about 120 minutes in order to deposit a nickel layer
of about 50 microns thickness and a phosphorous content of 7-8 wt %
on top of the brazed layer and the diamond particles.
[0141] An optical microscope image of a 50 times magnified
cross-cut of the manufactured abrasive wheel can be seen in FIG. 3.
The average thickness of the first bonding material (301) was about
300 microns, and the thickness of the second bonding material (302)
was about 55 microns, which corresponds to a calculated average
total thickness of layers (301) and (302) in relation to the
average size of the diamond particles (852 microns) of 41.5%. The
diamond particles (303) were strongly fixed to the steel support
(304) and partially surrounded by the first bonding material (301)
and the second bonding material (302). The electroless nickel
plated MSL wheel is hereinafter called EN-MSL wheel.
Example 3
[0142] Wear Performance.
[0143] The wear performance of different types of surface layers
was measured with a plint tester (TE 77 High Frequency Friction
Machine) according to ASTM G133-05(2016) at ambient temperature
(22.+-.3.degree. C.) without lubrication at varying force loads.
Sample 1 (S1) was a 100 microns thick electroless plated nickel
layer with a phosphorous content of about 8 wt % deposited on a 2
mm thick steel plate; Sample 2 (S2) was a 250 microns thick bronze
layer brazed on a 2 mm thick steel plate, and Sample 3 (S3) was a
250 microns thick bronze layer brazed on a 2 mm thick steel plate,
wherein the bronze layer of S3 was further subjected to oxidizing
conditions by treatment at 600.degree. C. for 1 hour in an oven
(with normal air).
[0144] The test results are illustrated in FIG. 4. It can be seen
that the electroless nickel plated layer (S1) had a much higher
wear resistance than the bronze layer (S2) or the oxidized bronze
layer (S3). At loads between 10 and 30 Newton, nearly no
electroless plated nickel was lost, and also at 50 Newton the
material loss during the wear exposure maintained below 5
.mu.m.sup.3. A much higher material loss, corresponding to a much
lower wear resistance, was observed with samples S2 and S3.
Example 4
[0145] Differential Scanning Calorimetry (DSC) Test Over Large
Temperature Range.
[0146] A sample of the EN-MSL wheel as produced in Example 2 was
subjected to DSC testing over a temperature range from 25.degree.
C. to 900.degree. C., with a temperature increase of 20.degree.
C./min, and an air flow of 100 ml/minute. As illustrated in FIG. 5,
it can be seen that until the melt peak between 800.degree. C. and
900.degree. C., the EN-MSL sample did not loose any weight, which
is an indication that the electroless nickel layer (EN) protected
very well the underneath lying MSL material. In contrast, if an MSL
wheel sample without EN layer was subjected to the same DSC test, a
loss of material was observed beginning at a temperature of about
150.degree. C., and reached the highest loss between 650.degree. C.
and 800.degree. C. The DSC comparison of the EN-MSL sample and the
MSL sample demonstrated that the electroless nickel layer can very
well protect the underneath lying MSL layer and thereby reduce the
degree of MSL oxidation and degradation when exposed to heat during
grinding.
Example 5
[0147] Simulation of Heat Transfer During Grinding.
[0148] Heat transfer simulations were conducted to investigate the
influence of an electroless nickel plated (EN) layer covering a MSL
layer in an EN-MSL wheel with regard to the protection of the MSL
against heat during a grinding operation. For the simulations,
"ANSYS Fluent" software was used, and standard form and finish
grinding heat partitioning rules were implemented to determine both
the heat generated at the interface of the wheel and workpiece and
the magnitude of fluxes into the different material types, as also
described in "Principles of Abrasive Processing," Milton C. Shaw,
Oxford Series on Advanced Manufacturing, 1996. The thermal
effusivities (which guide the partitioning of heat between the
workpiece and surface of the wheel) were determined experimentally
for the electroless nickel plated layer and the MSL layer. The
thermal effusivity value for the workpiece was obtained from
literature.
[0149] The following assumptions were made: a 12 inch diameter
wheel made of cast iron; a speed of 5000 RPM; a 100 microns thick
MSL layer; an electroless plated nickel (EN) layer with a
phosphorous contents of 8 wt %, and the material of the workpiece
being cast iron. The simulations were conducted for 4 different
thicknesses of the EN layer: 40 microns, 30 microns, 20 microns,
and 10 microns.
[0150] FIGS. 6A and 6B illustrate the temperature increase with the
grinding time for the layers of the EN-MSL wheel (specifically the
MSL layer and the EN layer), in comparison with the temperature
increase of an MSL layer having no protective overlying EN layer.
The temperature variations (variation in the y direction) shown in
FIGS. 6A and 6B corresponds to the change in temperature (T.sub.min
to T.sub.max) during one wheel rotation.
[0151] In FIG. 6A, the thickness of the EN layer was 40 microns,
and in FIG. 6B, the thickness of the EN layer was reduced by 50
percent to 20 microns.
[0152] It can be seen that the EN layers provided a good shield
against heat to the underlying MSL layers, for both, the 40 microns
and 20 microns thick EN layers. In contrast, the MSL layer in the
wheel not containing a protective EN layer had a much higher
temperature increase with the grinding time. In FIGS. 6A and 6B, a
certain minor overlapping of the temperature ranges is not
graphically shown. In order to demonstrate an exact comparison of
the temperature differences in each layer, the data for
T.sub.min-T.sub.max at 4 seconds and at 7 second grinding time are
shown in Tables 2 and 3.
TABLE-US-00002 TABLE 2 T.sub.min-T.sub.max after 4 seconds grinding
[.degree. C.] Thickness of EN layer [microns] 40 30 20 10 MSL (no
EN) 578-753 578-753 578-753 578-753 EN in EN-MSL 433-623 433-617
434-606 437-590 MSL in EN- 433-501 433-514 434-529 437-545 MSL
TABLE-US-00003 TABLE 3 T.sub.min-T.sub.max after 7 seconds grinding
[.degree. C.] Thickness of EN layer [microns] 40 30 20 10 MSL (no
EN) 763-938 763-938 763-938 763-938 EN in EN-MSL 569-757 572-753
570-742 569-723 MSL in EN- 569-638 572-651 570-666 569-682 MSL
[0153] The data in Tables 2 and 3 show that all EN layers could
provide a large heat shield towards the underneath lying MSL layer.
Not unexpected, the 40 microns thick EN layer provided the best
heat protection, however, even at 10 microns thickness of the EN
layer, the temperature in the EN protected MSL layer (MSL in
EN-MSL) was still about 100.degree. C. lower than the temperature
in the corresponding MSL layer without a protective EN layer
(MSL--no EN). Simulations were further conducted to evaluate how
even the EN layer can be applied in comparison to forming an
electroplated nickel layer (EP). The simulations assumed a 40
microns thick nickel layer deposited on a 100 microns thick MSL
layer on a steel support. For the electroless nickel plated layer
(EN), the standard deviation of the layer thickness was .+-.2.8
microns, while the standard deviation for the electroplated nickel
layer (EP) was .+-.11.6 microns. The much larger standard deviation
in the thickness of the EP layer has its cause in the nature of the
EP process. The EP process depends on the local current density of
the part to be coated, which is variable depending on the part
geometry, distance to anode and nickel ion flow.
Example 6
[0154] Dry Grinding Performance.
[0155] An abrasive EN-MSL wheel with an outer diameter of 14 inches
was prepared similarly as in Example 2, and used for dry grinding
ductile cast iron parts at a wheel speed of 10,000 to 14,000 SFPM,
and a feed rate of 31 IPM. The grinding performance of the EN-MSL
wheel was compared with the performance of a nickel electroplated
commercial grinding wheel, wherein the diamond particles were
attached to the steel support with an electroplated nickel layer
(EP-Comp). As illustrated in FIG. 7A, the EN-MSL wheel was able to
grind about 22,000 parts, while the comparative grinding wheel only
reached about 11,000 parts during its life time (all parts were
subjected to the same type of grinding/material removal).
[0156] Not being bound to theory, an explanation for the high
grinding performance of the EN-MSL wheel can be that a larger area
of the grains was available for grinding. The structure of
combining a braze layer and a thin electroless plated nickel layer
allowed a strong hold of the diamond particles and at the same time
a larger exposure of the abrasive diamond particles.
[0157] The two wheel structures used in Example 6 are illustrated
in FIGS. 7B and 7C. FIG. 7B illustrates a cross-section of an
EN-MSL wheel, wherein the abrasive particles (701) are attached to
the steel support (702) by a braze layer (703) and an electroless
plated nickel layer (704), and a large portion of the abrasive
diamond particles is exposed and available for the grinding
operation. The at least partial coating of the exposed portions of
the abrasive particles with the thin EN coating (704) can be easily
removed during the grinding operation. In FIG. 7C, the diamond
particles (701) are to a major part embedded in an electroplated
nickel layer (705), wherein the electroplated nickel layer provides
a mechanical hold of the abrasive particles (701) to the steel
support (702).
[0158] A further advantage of the EN layer in comparison to an
electroplated nickel layer (EP) can be the high hardness that may
be achieved with EN plating. While the tested Vickers hardness of
the EN layer (in EN-MSL) was 6.56.+-.0.30 GPa, the hardness of EP
layers are typically lower, and was measured in samples between
4.95 GPa and 5.29 GPa. The Vickers hardness was measured according
to ASTM E92-17.
[0159] The foregoing embodiments are directed to bonded abrasive
products, and particularly grinding wheels, which represent a
departure from the state-of-the-art.
[0160] Benefits, other advantages, and solutions to problems have
been described above with regard to specific embodiments. However,
the benefits, advantages, solutions to problems, and any feature(s)
that may cause any benefit, advantage, or solution to occur or
become more pronounced are not to be construed as a critical,
required, or essential feature of any or all the claims. Reference
herein to a material including one or more components may be
interpreted to include at least one embodiment wherein the material
consists essentially of the one or more components identified. The
term "consisting essentially" will be interpreted to include a
composition including those materials identified and excluding all
other materials except in minority contents (e.g., impurity
contents), which do not significantly alter the properties of the
material. Additionally, or in the alternative, in certain
non-limiting embodiments, any of the compositions identified herein
may be essentially free of materials that are not expressly
disclosed. The embodiments herein include range of contents for
certain components within a material, and it will be appreciated
that the contents of the components within a given material total
100%.
[0161] The specification and illustrations of the embodiments
described herein are intended to provide a general understanding of
the structure of the various embodiments. The specification and
illustrations are not intended to serve as an exhaustive and
comprehensive description of all of the elements and features of
apparatus and systems that use the structures or methods described
herein. Separate embodiments may also be provided in combination in
a single embodiment, and conversely, various features that are, for
brevity, described in the context of a single embodiment, may also
be provided separately or in any subcombination. Further, reference
to values stated in ranges includes each and every value within
that range. Many other embodiments may be apparent to skilled
artisans only after reading this specification. Other embodiments
may be used and derived from the disclosure, such that a structural
substitution, logical substitution, or another change may be made
without departing from the scope of the disclosure. Accordingly,
the disclosure is to be regarded as illustrative rather than
restrictive.
* * * * *