U.S. patent application number 17/422241 was filed with the patent office on 2022-03-24 for touch pad device and portable computer comprising same.
The applicant listed for this patent is HiDeep Inc.. Invention is credited to Hyukjae CHOI, Bonkee KIM, Seyeob KIM.
Application Number | 20220091687 17/422241 |
Document ID | / |
Family ID | 1000006053317 |
Filed Date | 2022-03-24 |
United States Patent
Application |
20220091687 |
Kind Code |
A1 |
CHOI; Hyukjae ; et
al. |
March 24, 2022 |
TOUCH PAD DEVICE AND PORTABLE COMPUTER COMPRISING SAME
Abstract
The present disclosure relates to a touch pad device and a
portable computer including the same, and more particularly, to a
touch pad device capable of sensing an inputted push of an object,
and a portable computer including the same. A touch pad device
according to one embodiment includes: a touch pad cover; a
substrate disposed under the touch pad cover and including a
pressure sensor; and a frame configured to support the substrate,
in which a magnitude of a pressure inputted to the touch pad cover
is detected on the basis of a change in electrical characteristics
outputted from the pressure sensor in response to bending of the
substrate.
Inventors: |
CHOI; Hyukjae; (Seongnam-si,
Gyeonggi-do, KR) ; KIM; Seyeob; (Seongnam-si,
Gyeonggi-do, KR) ; KIM; Bonkee; (Seongnam-si,
Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HiDeep Inc. |
Seongnam-si, Gyeonggi-do |
|
KR |
|
|
Family ID: |
1000006053317 |
Appl. No.: |
17/422241 |
Filed: |
January 21, 2020 |
PCT Filed: |
January 21, 2020 |
PCT NO: |
PCT/KR2020/000979 |
371 Date: |
July 12, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01L 1/22 20130101; G06F
1/169 20130101; G06F 3/03547 20130101 |
International
Class: |
G06F 3/0354 20060101
G06F003/0354; G06F 1/16 20060101 G06F001/16; G01L 1/22 20060101
G01L001/22 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 11, 2019 |
KR |
10-2019-0015327 |
Claims
1. A touch pad device comprising: a touch pad cover; a substrate
disposed under the touch pad cover and comprising a pressure
sensor; and a frame configured to support the substrate, wherein a
magnitude of a pressure inputted to the touch pad cover is detected
on the basis of a change in electrical characteristics outputted
from the pressure sensor in response to bending of the
substrate.
2. The touch pad device of claim 1, wherein the substrate has a
multilayered structure, and the substrate having the multilayered
structure comprises: a touch sensor layer disposed under the touch
pad cover and comprising a touch sensor; a pressure sensor layer
disposed under the touch sensor layer and comprising the pressure
sensor; and a shield layer disposed between the touch sensor layer
and the pressure sensor layer and configured to form an electric
shield between the touch sensor and the pressure sensor.
3. The touch pad device of claim 2, wherein the pressure sensor
layer is disposed at a lowermost end of the substrate having the
multilayered structure, and a touch IC is disposed on a lower
surface of the pressure sensor layer.
4. The touch pad device of claim 2, further comprising: a wiring
layer disposed between the shield layer and the touch sensor
layer.
5. The touch pad device of claim 2, further comprising: a
conductive layer disposed under the substrate, spaced apart from
the pressure sensor at a predetermined interval, and accommodated
in the frame; and a conductive cushion disposed between the
substrate and the conductive layer.
6. The touch pad device of claim 5, wherein the conductive layer
has ground potential, the pressure sensor layer comprises a ground
pad, and the conductive cushion electrically connects the ground
pad and the conductive layer.
7. The touch pad device of claim 5, wherein the conductive layer
has a potential value that varies over time.
8. The touch pad device of claim 1, wherein at least the plurality
of pressure sensors is disposed on a lower surface of the
substrate, and the plurality of pressure sensors constitutes at
least two or more channels.
9. The touch pad device of claim 1, wherein the frame comprises: a
base frame; a side frame extending upward from an edge region of
the base frame; and an edge frame extending laterally from an end
of the side frame, and wherein an edge region of the substrate is
disposed on the side frame.
10. The touch pad device of claim 2, wherein the pressure sensor
comprises one or multiple strain gauges.
11. A portable computer comprising: a display part having a screen
on which a pointer is displayed; a main body part comprising a
keyboard and a deck disposed at one side of the keyboard and having
an opening; and a touch pad device disposed on the main body part,
wherein the touch pad device comprises: a touch pad cover disposed
in the opening of the deck; a substrate disposed under the touch
pad cover and comprising a pressure sensor; and a frame configured
to support the substrate, and wherein a magnitude of a pressure
inputted to the touch pad cover is detected on the basis of a
change in electrical characteristics outputted from the pressure
sensor in response to bending of the substrate.
12. The portable computer of claim 11, wherein the substrate is
disposed in the opening of the deck and has a multilayered
structure, and the substrate having the multilayered structure
comprises: a touch sensor layer disposed under the touch pad cover
and comprising a touch sensor; a pressure sensor layer disposed
under the touch sensor layer and comprising the pressure sensor;
and a shield layer disposed between the touch sensor layer and the
pressure sensor layer and configured to form an electric shield
between the touch sensor and the pressure sensor.
13. The portable computer of claim 12, wherein the pressure sensor
layer is disposed at a lowermost end of the substrate having the
multilayered structure, and a touch IC is disposed on a lower
surface of the pressure sensor layer.
14. The portable computer of claim 12, further comprising: a wiring
layer disposed between the shield layer and the touch sensor
layer.
15. The portable computer of claim 12, further comprising: a
conductive layer disposed under the substrate, spaced apart from
the pressure sensor at a predetermined interval, and accommodated
in the frame; and a conductive cushion disposed between the
substrate and the conductive layer.
16. The portable computer of claim 15, wherein the conductive layer
has ground potential, the pressure sensor layer comprises a ground
pad, and the conductive cushion electrically connects the ground
pad and the conductive layer.
17. The portable computer of claim 15, wherein the conductive layer
has a potential value that varies over time.
18. The portable computer of claim 11, wherein at least the
plurality of pressure sensors is disposed on a lower surface of the
substrate, and the plurality of pressure sensors constitutes at
least two or more channels.
19. The portable computer of claim 11, further comprising: a base
member configured to support the touch pad device, wherein the
frame comprises: a base frame fixed to the base member; a side
frame extending upward from an edge region of the base frame; and
an edge frame extending laterally from an end of the side frame and
coupled to a lower surface of the deck by a fastening part, and
wherein an edge region of the substrate is disposed on the side
frame.
20. The portable computer of claim 12, wherein the pressure sensor
comprises one or multiple strain gauges.
Description
TECHNICAL FIELD
[0001] The present disclosure relates to a touch pad device and a
portable computer including the same, and more particularly, to a
touch pad device capable of sensing an inputted push or pressure of
an object, and a portable computer including the same.
BACKGROUND ART
[0002] In the case of a laptop computer, portability of which is
critical, because it is inconvenient to carry a mouse separately, a
pointing device integrated with a main body to serve as a mouse is
required to be provided on the laptop computer.
[0003] Therefore, a touch pad, which may be substituted for the
mouse and configured to control a pointer, is widely used. When a
finger comes into contact with the touch pad, a sensor detects the
contact portion and transfers information on the contact portion to
the laptop computer, thereby moving a cursor of the mouse to a
designated position. Further, a click button is provided at a lower
end of the touch pad, such that when a user pushes the click
button, it is possible to obtain an effect similar to that obtained
by clicking a button of the mouse.
[0004] Among some laptop computers in the related art, there is a
laptop computer in which a touch pad and a click button are
integrated. A surface of the click button of the laptop computer
also serves as a touch pad, and thus the laptop computer is
advantageous in that a wider touch pad may be used in comparison
with the case in which the touch pad and the click button are
separated. However, because the cursor of the mouse is moved even
in a case in which the user touches the surface of the click
button, a malfunction such as a movement of the cursor of the mouse
in an inadvertent direction or inappropriate clicking may occur
when the user moves the cursor and clicks the button at the same
time.
[0005] In addition, among the laptop computers in the related art,
there is a laptop computer in which a click button of a mouse is
implemented as a dome switch. The dome switch is provided with a
predetermined sealing member, and the sealing member may be used to
prevent moisture and other contaminants from permeating into the
dome switch. Because the dome switch is made of a flexible
material, performance of the dome switch may deteriorate due to
frequent use, and the sealing member may also be damaged due to
frequent use. For this reason, there is a problem in that
contaminants permeate into the dome switch due to the damage to the
sealing member and the dome switch does not properly operate.
DISCLOSURE
Technical Problem
[0006] An object of the present disclosure is to provide a touch
pad device capable of sensing a push or pressure of an object
inputted to a touch pad cover, and a portable computer including
the same.
Technical Solution
[0007] A touch pad device according to one embodiment includes: a
touch pad cover; a substrate disposed under the touch pad cover and
including a pressure sensor; and a frame configured to support the
substrate, in which a magnitude of a pressure inputted to the touch
pad cover is detected on the basis of a change in electrical
characteristics outputted from the pressure sensor in response to
bending of the substrate.
[0008] A portable computer according to another embodiment
includes: a display part having a screen on which a pointer is
displayed; a main body part including a keyboard and a deck
disposed at one side of the keyboard and having an opening; and a
touch pad device disposed on the main body part, in which the touch
pad device includes: a touch pad cover disposed in the opening of
the deck; a substrate disposed under the touch pad cover and
including a pressure sensor; and a frame configured to support the
substrate, and in which a magnitude of a pressure inputted to the
touch pad cover is detected on the basis of a change in electrical
characteristics outputted from the pressure sensor in response to
bending of the substrate.
Advantageous Effects
[0009] The use of the touch pad device according to the embodiment
of the present disclosure is advantageous in sensing a push or
pressure of an object inputted to the touch pad cover. Therefore,
there is an advantage in that there is no need for a separate
component, for example, a dome switch for sensing a push of an
object. Further, there is an advantage in that manufacturing costs
may be reduced.
DESCRIPTION OF DRAWINGS
[0010] FIG. 1 is a perspective view illustrating an example of a
portable computer including a touch pad device according to an
embodiment of the present disclosure.
[0011] FIG. 2 is a cross-sectional view of the portable computer
100 taken along line A-A' in FIG. 1.
[0012] FIG. 3 is a cross-sectional view illustrating an example of
the touch pad device according to the embodiment of the present
disclosure.
[0013] FIG. 4 is a top plan view illustrating a frame 220
illustrated in FIG. 3 when viewed from above.
[0014] FIG. 5 is a top plan view illustrating a substrate 210'
illustrated in FIG. 3 when viewed from below.
[0015] FIG. 6 is a top plan view illustrating a modified example of
FIG. 5, that is, a modified example of the substrate 210'
illustrated in FIG. 3 when viewed from below.
[0016] FIG. 7A is a view illustrating the touch pad device
according to the embodiment of the present disclosure illustrated
in FIG. 3, and FIG. 7B is a view illustrating a case in which a
touch pad cover 250 illustrated in FIG. 7A is pressed by a
predetermined object.
[0017] FIGS. 8A to 8C are views illustrating modified examples of a
pressure sensor 212 in a case in which the pressure sensor 212
illustrated in FIGS. 3 and 5 is configured as a strain gauge.
DESCRIPTION OF MAIN REFERENCE NUMERALS OF DRAWINGS
[0018] 100: Portable computer [0019] 110: Main body part [0020]
170: Display part [0021] 190: Hinge part [0022] 250: Touch pad
cover
MODE FOR INVENTION
[0023] The following detailed description of the present disclosure
will be made with reference to the accompanying drawings
illustrating specific embodiments for carrying out the present
disclosure. These embodiments will be described in detail enough to
carry out the present disclosure by those skilled in the art. It
should be understood that various embodiments of the present
disclosure are different from one another but need not be mutually
exclusive. For example, particular shapes, structures, and
characteristics described herein in respect to one embodiment may
be implemented in other embodiments without departing from the
spirit and scope of the present disclosure. In addition, it should
be understood that the position or arrangement of each constituent
element in the respective disclosed embodiments may be changed
without departing from the spirit and scope of the present
disclosure. Therefore, the following detailed description is not
considered as having limited meanings, and the scope of the present
disclosure, if adequately explained, is limited only by the
appended claims as well as all the scopes equivalent to the
appended claims. Like reference numerals in the drawings refer to
the same or similar functions throughout several aspects.
[0024] FIG. 1 is a perspective view illustrating an example of a
portable computer including a touch pad device according to an
embodiment of the present disclosure.
[0025] Referring to FIG. 1, a portable computer 100 according to an
embodiment of the present disclosure includes a main body part 110,
and a display part 170 rotatably connected to the main body part
110 and having a display panel on which a screen is displayed. The
portable computer 100 may further include a hinge part 190
configured to hingedly connect the main body part 110 and the
display part 170.
[0026] The main body part 110 may have, on an upper surface
thereof, a keyboard 111 to which a predetermined instruction is
inputted by a user, and a deck 113 provided at one side of the
keyboard 111.
[0027] An LCD panel or an OLED panel may be used as the display
panel of the display part 170, but the present disclosure is not
limited thereto, and various panels may be applied.
[0028] The display part 170 may be rotatably operated about the
hinge part 190, such that the display part 170 may be in close
contact with the upper surface of the main body part 110 or
unfolded.
[0029] Each of the main body part 110 and the display part 170 may
be provided in the form of an approximately flat hexahedral plate.
At the time of use of the portable computer 100, a bottom surface
of the main body part 110 is placed on the floor.
[0030] Various types of electronic components and electronic
devices, such as a main board, a memory, and a hard disc drive, may
be provided in the main body part 110.
[0031] The portable computer 100 according to the embodiment of the
present disclosure includes a touch pad device. The touch pad
device includes a touch pad cover 250 illustrated in FIG. 1 and may
further include various types of components disposed in the main
body part 110.
[0032] The touch pad cover 250, which is an additional input means
different from the keyboard 111, is disposed on a part of the deck
113 of the main body part 110. The touch pad cover 250 may be
disposed in an opening formed in the deck 113.
[0033] An object such as a user's finger may come into contact with
the touch pad cover 250. The touch pad device according to the
embodiment of the present disclosure includes the touch pad cover
250, and a pointer displayed on the screen may be controlled by the
touch pad device. In addition, the touch pad device may sense a
pressure inputted to the touch pad cover 250 by an object.
[0034] As described above, the touch pad cover 250 and several
components, which are disposed in the main body part 110 but not
illustrated in FIG. 1, constitute the `touch pad device`. The
portable computer 100 according to the embodiment of the present
disclosure, which has the touch pad device, may sense (detect)
contact, a movement, and a predetermined pressure (or force) of the
object inputted to the touch pad cover 250. Further, a specific
function may be performed on the basis of a pressure sensed at a
specific position.
[0035] In this case, the specific positions may include an upper
left position, an upper right position, a lower left position, and
a lower right position of the touch pad cover 250. Furthermore, the
specific position may be a central portion of the touch pad cover
250. In addition, the specific position may be any position on the
touch pad cover 250. Meanwhile, the specific function may be, but
not limited to, a function corresponding to a left button or a
right button of the mouse, for example, and a predetermined
function may be determined depending on the user's setting.
[0036] With reference to FIG. 2, the configuration in the main body
part 110 will be more specifically described, and the touch pad
device will be specifically described.
[0037] FIG. 2 is a cross-sectional view of the portable computer
100 taken along line A-A' in FIG. 1.
[0038] Referring to FIGS. 1 and 2, the portable computer 100
according to the embodiment of the present disclosure includes the
touch pad device.
[0039] The touch pad device according to the embodiment of the
present disclosure may include a substrate 210, a first bonding
layer 230, the touch pad cover 250, a frame 220, a conductive layer
240, a gap part 260, a second bonding layer 270, a base member 280,
and a fastening part 290.
[0040] For convenience of description, the base member 280 will be
described first.
[0041] The base member 280 supports the frame 220 from below and is
disposed in the portable computer 100 illustrated in FIG. 1.
[0042] The frame 220 is disposed on the base member 280 and may be
mechanically fixed securely to the base member 280.
[0043] The frame 220 may be made of a non-conductive material. For
example, the frame 220 may be a plastic frame.
[0044] The frame 220 has a structure capable of accommodating the
conductive layer 240 therein. An edge portion of the frame 220 may
be securely fixed to a bottom surface of the deck 113 by means of
the fastening part 290.
[0045] The conductive layer 240 is made of a conductive material.
The conductive layer 240 may electrically have predetermined
potential. For example, the conductive layer 240 may have, but not
limited to, ground potential, or the conductive layer 240 may have
specific potential instead of the ground potential. In this case,
the specific potential may be set to, but not limited to, one
specific potential value, or for example, the specific potential
may have a variable value like a driving signal having a potential
value that varies over time.
[0046] In the case in which the conductive layer 240 has the ground
potential, the conductive layer 240 may form magnetic capacitance
together with a pressure sensor included in the substrate 210. The
magnetic capacitance, which is formed on the basis of a distance
between the conductive layer 240 and the pressure sensor, may be
changed by the pressure of the object inputted to the touch pad
cover 250. Further, an electrical signal including information on
the amount of change in magnetic capacitance may be outputted from
the pressure sensor and inputted to a touch IC 216. On the basis of
the inputted electrical signal, the touch IC 216 may output a
predetermined value corresponding to the pressure of the object
inputted to the touch pad cover 250.
[0047] Meanwhile, in the case in which the conductive layer 240 has
the specific potential instead of the ground potential, the
conductive layer 240 may form mutual capacitance together with the
pressure sensor included in the substrate 210. The mutual
capacitance, which is an electrical characteristic formed on the
basis of the distance between the conductive layer 240 and the
pressure sensor, may be changed by the pressure of the object
inputted to the touch pad cover 250. Further, an electrical signal
including information on the amount of change in mutual capacitance
may be outputted from the pressure sensor or the conductive layer
240 and inputted to the touch IC 216. On the basis of the inputted
electrical signal, the touch IC 216 may output a predetermined
value corresponding to the pressure of the object inputted to the
touch pad cover 250.
[0048] When the information including the amount of change in
capacitance in accordance with the change in distance between the
pressure sensor and the conductive layer 240 is outputted, as a
predetermined electrical signal, from the pressure sensor or the
conductive layer 240 and inputted to the touch IC 216 as described
above, the touch IC 216 may detect a magnitude of the pressure of
the object inputted to the touch pad cover 250 on the basis of the
inputted electrical signal.
[0049] The conductive layer 240 is disposed on the frame 220 and
may be disposed to be spaced apart, at a predetermined distance,
from the pressure sensor included in the substrate 210. The
information on the amount of change in capacitance in accordance
with the change in distance between the pressure sensor and the
conductive layer 240 may be outputted, as a predetermined
electrical signal, from the pressure sensor or the conductive layer
240. The outputted electrical signal may be inputted to the touch
IC 216, and the touch IC 216 may sense the pressure on the basis of
the inputted electrical signal.
[0050] The gap part 260 may be formed between the conductive layer
240 and the substrate 210. The gap part 260 may be filled with air
or a cushion. In addition, a part of the gap part 260 may be filled
with the cushion, and the remaining part of the gap part 260 may be
filled with the air.
[0051] Meanwhile, the conductive layer 240 may not be necessary in
a case in which the pressure sensor is a strain gauge. Therefore,
it should be noted that the conductive layer 240 may not be an
essential component of the touch pad device according to the
embodiment of the present disclosure. In the case in which the
pressure sensor is a strain gauge, the strain gauge is deformed as
the substrate 210 is bent or pushed, and a resistance value, which
is an electrical characteristic of the strain gauge, may be changed
in accordance with the deformation of the strain gauge. The
magnitude of the pressure may be calculated on the basis of the
change in resistance value.
[0052] The substrate 210 is disposed on the frame 220 and may
include a touch sensor (or a 2D sensor). The touch sensor included
in the substrate 210 may be disposed on, but not limited to, an
upper surface of the substrate 210. In the case in which the
substrate 210 has a multilayered structure, the touch sensor may be
disposed on any one of upper and lower surfaces of any one of the
multiple layers.
[0053] The substrate 210 may have a single layered structure or a
multilayered structure, and the touch IC 216 and an electronic
component 218 may be mounted on a lower surface of the substrate
210.
[0054] The substrate 210 may include the pressure sensor (a 3D
sensor). The pressure sensor included in the substrate 210 may be
disposed on, but not limited to, the lower surface of the substrate
210, or the pressure sensor may also be disposed on the upper
surface of the substrate 210. In addition, in the case in which the
substrate 210 has the multilayered structure, the pressure sensor
may be disposed on any one of upper and lower surfaces of any one
of the multiple layers.
[0055] The touch IC 216 and the electronic component 218 may be
mounted on the substrate 210. The touch IC 216 and the electronic
component 218 may be mounted on the lower surface of the substrate
210.
[0056] The touch pad cover 250 is disposed on the substrate 210. An
upper surface of the touch pad cover 250 is exposed to the outside.
The touch pad cover 250 is disposed in the opening (not
illustrated) formed in the deck 113.
[0057] In this case, the substrate 210, together with the touch pad
cover 250, may be disposed in the opening (not illustrated) formed
in the deck 113.
[0058] The first bonding layer 230 may be disposed between the
substrate 210 and the touch pad cover 250. The first bonding layer
230 may be disposed between the substrate 210 and the touch pad
cover 250 to the extent that the substrate 210 and the touch pad
cover 250 are not separated from each other. Therefore, the first
bonding layer 230 may be disposed at a specific portion such as an
edge.
[0059] The second bonding layer 270 may be disposed between the
substrate 210 and the frame 220. The second bonding layer 270 may
be disposed on a part or the entirety of an edge portion of the
substrate 210.
[0060] Hereinafter, an example of the touch pad device according to
the embodiment of the present disclosure will be described with
reference to FIGS. 3 to 5.
[0061] FIG. 3 is a cross-sectional view illustrating an example of
the touch pad device according to the embodiment of the present
disclosure, FIG. 4 is a top plan view illustrating the frame 220
illustrated in FIG. 3 when viewed from above, and FIG. 5 is a top
plan view illustrating a substrate 210' illustrated in FIG. 3 when
viewed from below.
[0062] In FIGS. 3 to 5, a component identical to the component
illustrated in FIG. 2 is denoted by the same reference numeral.
Therefore, for convenience of description, a specific description
of the component denoted by the same reference numeral is
substituted with the above-mentioned description.
[0063] Referring to FIGS. 3 and 4, the frame 220 may include a base
frame 220a, a side frame 220b, and an edge frame 220c.
[0064] The base frame 220a is disposed on the base member 280. A
lower surface of the base frame 220a may be in contact with an
upper surface of the base member 220, and the conductive layer 240
may be disposed on an upper surface of the base frame 220a.
[0065] As illustrated in FIG. 4, the base frame 220a may have an
opening portion 220a-h. Therefore, the conductive layer 240 may
also have an opening portion corresponding to the opening portion
220a-h. The touch IC 216 and the electronic component 218 mounted
on the lower surface of the substrate 210' may be disposed in the
opening portion 220a-h.
[0066] The conductive layer 240 is disposed on the base frame 220a,
and the conductive layer 240 may have ground potential. In order
for the conductive layer 240 to have the ground potential, the
conductive layer 240 may be electrically connected to a ground pad
214 of the substrate 210' through a conductive cushion 260c so as
to have the ground potential. However, the present disclosure is
not limited thereto, the conductive layer 240 may be electrically
connected to other external components in the portable computer 100
so as to have the ground potential.
[0067] The side frame 220b may extend upward from an edge portion
of the base frame 220a. A space capable of accommodating the
conductive layer 240 may be provided in the frame 220 by the side
frame 220b. An extension length of the side frame 220b is greater
than a thickness of the conductive layer 240. A predetermined
spacing distance may be formed between the conductive layer 240 and
the substrate 210' by the side frame 220b.
[0068] The edge frame 220c may extend outward from the side frame
220b. As illustrated in FIG. 4, the edge frame 220c may extend
outward or in a horizontal direction from a plurality of portions
of the side frame 220b.
[0069] The edge frame 220c is coupled to the bottom surface of the
deck 113. To this end, the edge frame 220c may have fastening holes
220c-h. The fastening part 290 such as a screw is fitted into the
fastening hole 220c-h, and the fastening part 290 is thread-coupled
to the bottom surface of the deck 113, such that the edge frame
220c may be securely coupled to the deck 113.
[0070] The substrate 210' is disposed on the frame 220. An edge
region of the bottom surface of the substrate 210' may be disposed
on the side frame 220b of the frame 220. In this case, in some
instances, the edge region of the bottom surface of the substrate
210' may also be disposed on the edge frame 220c of the frame
220.
[0071] The second bonding layer 270 may be disposed between the
frame 220 and the edge region of the bottom surface of the
substrate 210'. The second bonding layer 270 may be a double-sided
adhesive tape (DAT). The second bonding layer 270 may be disposed
on the side frame 220b of the frame 220. In some instances, the
second bonding layer 270 may also be disposed on a part of the base
frame 220a or a part of the edge frame 220c.
[0072] The substrate 210' is disposed in the opening (not
illustrated) formed in the deck 113. Therefore, a size and a shape
of the substrate 210' may correspond to a size and a shape of the
opening (not illustrated) of the deck 113. In order to ensure
design tolerance, the size of the substrate 210' may be slightly
smaller than the size of the opening (not illustrated) of the deck
113.
[0073] The touch IC 216 and the electronic component 218 may be
mounted on the bottom surface of the substrate 210'. The second
bonding layer 270 may be disposed on the edge region of the bottom
surface of the substrate 210', and the second bonding layer 270 may
also be disposed on a part of the edge region of the bottom surface
of the substrate 210'.
[0074] The touch pad cover 250 may be disposed on the substrate
210'. The first bonding layer 230 may be disposed between the upper
surface of the substrate 210' and a lower surface of the touch pad
cover 250. In this case, the first bonding layer 230 may be a
double-sided adhesive tape (DAT).
[0075] The touch pad cover 250 is disposed in the opening (not
illustrated) formed in the deck 113. Therefore, a size and a shape
of the touch pad cover 250 may correspond to the size and the shape
of the opening (not illustrated) of the deck 113. In order to
ensure design tolerance, the size of the touch pad cover 250 may be
slightly smaller than the size of the opening (not illustrated) of
the deck 113. In order to allow the user to easily recognize a
position of the touch pad cover 250, the upper surface of the touch
pad cover 250 may be disposed to be higher or lower than the upper
surface of the deck 113.
[0076] The substrate 210' includes the touch sensor (or the 2D
sensor) configured to detect that the object is in contact with the
touch pad cover 250. The touch sensor may be, but not limited to, a
capacitive touch sensor, or the touch sensor may be a
pressure-sensitive touch sensor. The electrical signal outputted
from the touch sensor is inputted to the touch IC 216, and the
touch IC 216 may detect whether a touch is made and a motion of the
touch. Information on whether a touch is made and the motion of the
touch, which are detected, is transferred to a control unit (not
illustrated) of the portable computer 100, and the control unit
(not illustrated) may control the pointer displayed on the screen
on the basis of the transferred information.
[0077] The substrate 210' includes the pressure sensor (or the 3D
sensor) configured to detect a pressure (or force) applied to the
touch pad cover 250 by an object. The pressure sensor outputs an
electrical signal including information on the amount of change in
capacitance in accordance with the change in distance from the
conductive layer 240. The outputted electrical signal is inputted
to the touch IC 216, and the touch IC 216 may output information on
the pressure. The outputted information on the pressure is
transferred to the control unit (not illustrated) of the portable
computer 100, and the control unit (not illustrated) may control
and allow a specific function to be performed at the position of
the pointer displayed on the screen on the basis of the transferred
information.
[0078] The substrate 210' has a multilayered structure. More
specifically, the substrate 210' may include first to fourth layers
211, 213, 215, and 217. The first to fourth layers 211, 213, 215,
and 217 may have a function of a wiring layer in common.
Hereinafter, the respective layers will be described more
specifically.
[0079] The first layer 211 has a touch pattern for the touch
sensor. Therefore, the first layer 211 may also be named a touch
sensor layer having a touch pattern. The first layer 211 may be a
layer disposed at an upper end of the substrate 210'. The first
layer 211 may be a layer having an upper surface being in contact
with the first bonding layer 230.
[0080] The second layer 213 is disposed under the first layer 211.
The second layer 213 may be a wiring layer having one or multiple
wires. The second layer 213 may also be named a wiring layer.
[0081] The third layer 215 is disposed under the second layer 213.
The third layer 215 may be a ground layer having ground potential
and a function of the wiring layer having one or multiple wires.
The reason why the third layer 215 has the ground potential is to
implement an electric shield between the first layer 211 including
the touch sensor and the fourth layer 217 including the pressure
sensor 212. The third layer 215 may also be named a shield
layer.
[0082] The fourth layer 217 is disposed under the third layer 215.
The fourth layer 217 may be a layer disposed at a lower end of the
substrate 210'. The touch IC 216 and the electronic component 218
such as an active or passive element may be mounted on a lower
surface of the fourth layer 217. In addition, the fourth layer 217
may also serve as a wiring layer having predetermined wires
219.
[0083] The pressure sensor 212 may be mounted on the fourth layer
217. The plurality of pressure sensors 212 may be provided, and the
plurality of pressure sensors 212 may be disposed on the lower
surface of the fourth layer 217. Therefore, the fourth layer 217
may be named a pressure sensor layer.
[0084] Referring to FIG. 5, the plurality of pressure sensors 212
may be disposed on the lower surface of the fourth layer 217. In
particular, the plurality of pressure sensors 212 may be disposed
to be adjacent to respective edge portions of the lower surface of
the fourth layer 217. However, the present disclosure is not
limited thereto, and one or multiple pressure sensors 212 may be
disposed on a central portion or any portion of the fourth layer
217 in accordance with design.
[0085] The pressure sensor 212 may be included in the fourth layer
217 of the substrate 210', but the present disclosure is not
limited thereto. For example, the pressure sensor 212 may be formed
on the lower surface of the substrate 210' or the lower surface of
the fourth layer 217.
[0086] The pressure sensor 212 may be a predetermined conductive
pattern formed directly on the lower surface of the fourth layer
217, or the pressure sensor 212 may be a sheet having an insulating
layer formed on one surface or both surfaces of the conductive
pattern.
[0087] The pressure sensor 212 may be electrically connected to the
touch IC 216 through the wire in the substrate 210' and provided
with a driving signal. In addition, the pressure sensor 212 is
electrically connected to the touch IC 216 through the wire in the
substrate 210' and may output a detection signal to the touch IC
216. In this case, in the case in which the conductive layer 240
has the ground potential, the pressure sensor 212 may be supplied
with the driving signal in a first time section and may output the
detection signal to the touch IC 216 in a second time section
different from the first time section.
[0088] Meanwhile, although not illustrated separately in the
drawing, in a case in which the conductive layer 240 has the
specific potential instead of the ground potential, the pressure
sensor 212 may be electrically connected to the touch IC 216
through the wire in the substrate 210' and provided with the
driving signal, and thus the pressure sensor 212 may serve as a
driving electrode. Alternatively, the pressure sensor 212 may be
electrically connected to the touch IC 216 through the wire in the
substrate 210' and may serve as a receiving electrode that outputs
the detection signal to the touch IC 216.
[0089] Meanwhile, the pressure sensor 212 may be a strain gauge.
The strain gauge is a device having an electrical resistance that
varies in proportion to the amount of strain, and in general, a
metal-coupled strain gauge may be used. A material, which may be
used for the strain gauge, is a transparent material, and
conductive polymer, polyethylenedioxythiophene (PEDOT), indium tin
oxide (ITO), antimony tin oxide (ATO), carbon nanotubes (CNT),
graphene, gallium zinc oxide, indium gallium zinc oxide (IGZO), tin
oxide (SnO.sub.2), indium oxide (In.sub.2O.sub.3), zinc oxide
(ZnO), gallium oxide (Ga.sub.2O.sub.3), cadmium oxide (CdO), other
doped metal oxide, piezoresistive elements, piezoresistive
semiconductor materials, piezoresistive metal materials, silver
nanowires, platinum nanowires, nickel nanowires, other metal
nanowires, or the like may be used. As an opaque material, silver
ink, copper, nano silver, carbon nanotubes (CNT), constantan alloy,
karma alloy, doped polycrystalline silicon, doped amorphous
silicon, doped single crystal silicon, other doped semiconductor
materials, and the like may be used.
[0090] FIGS. 8A to 8C are views illustrating modified examples of
the pressure sensor 212 in a case in which the pressure sensor 212
illustrated in FIGS. 3 and 5 is configured as a strain gauge.
[0091] Because a strain gauge 212' illustrated in FIG. 8A has a
trace 212'a aligned in a horizontal direction, a length of the
trace 212'a is greatly changed in response to horizontal
deformation, such that the sensitivity to the horizontal
deformation is high. However, because a length of the trace 212'a
is relatively slightly changed in response to vertical deformation,
such that the sensitivity to the vertical deformation is low.
[0092] As illustrated in FIG. 8B, the strain gauge 212' may include
a plurality of fine regions, and directions in which the traces
212'a included in the respective fine regions are aligned may be
different. Since the strain gauge 212' is configured to include the
traces 212'a aligned in different directions, it is possible to
reduce a difference in sensitivity of the strain gauges 212' to the
deformation direction.
[0093] As illustrated in FIGS. 8A and 8B, a pressure sensor having
a single channel may be implemented by the single strain gauge
212', or as illustrated in FIG. 8C, a pressure sensor having a
plurality of channels may be implemented by the plurality of strain
gauges 212'. By using the pressure sensor including the plurality
of channels, it is possible to sense magnitudes of a plurality of
pressures applied by a plurality of touches at the same time.
[0094] Referring back to FIG. 5, in the case in which the pressure
sensor 212 is implemented by the strain gauge 212' illustrated in
FIGS. 8A to 8C, the strain gauge is deformed as the substrate 210'
is bent or pressed, and as a result, a resistance value, which is
an electrical characteristic of the strain gauge, may be changed.
The touch IC 216 may receive the change in resistance value, and
the touch IC 216 may read out the received change in resistance
value, thereby calculating the magnitude of the pressure. In this
case, the conductive layer 240 may be excluded.
[0095] The fourth layer 217 may include the ground pad 214. For
example, the ground pad 214 may be formed by selectively opening a
part of a cover-lay layer of the substrate 210' so that a part of a
conductive thin film, which is covered by the cover-lay layer, is
exposed to the outside.
[0096] The ground pad 214 may be electrically connected to the
conductive layer 240 by the conductive cushion 260c. That is, the
conductive cushion 260c is disposed between the ground pad 214 and
the conductive layer 240, such that the ground pad 214 and the
conductive layer 240 may have equipotential. That is, the
conductive layer 240 may have the ground potential.
[0097] The conductive cushion 260c may be disposed in the gap layer
260. In this case, the gap part 260 may be a gap filled with air.
The conductive cushion 260c is made of a conductive material and
disposed between the conductive layer 240 and the ground pad 214 of
the substrate 210' to electrically connect the ground pad 214 and
the conductive layer 240.
[0098] The conductive cushion 260c has a predetermined restoring
force. When the substrate 210' is pressed by a pressure inputted to
the touch pad cover 250, the substrate 210' is bent as the touch
pad cover 250 is bent, and the conductive cushion 260c may be
compressed corresponding to the bending of the substrate 210'. In
this case, the conductive cushion 260c may mitigate impact applied
to the substrate 210' by the pressure, thereby protecting the
substrate 210'. Meanwhile, when the pressure to be inputted to the
touch pad cover 250 is decreased or eliminated, the conductive
cushion 260c generates restoring force for restoration to the
original state, and the generated restoring force may assist in
restoring the substrate 210' to the original state.
[0099] FIG. 6 is a top plan view illustrating a modified example of
FIG. 5, that is, a modified example of the substrate 210'
illustrated in FIG. 3 when viewed from below.
[0100] Referring to FIG. 6, the touch IC 216, electronic components
218a and 218b, a plurality of pressure sensors 212-1, 212-2, . . .
, and 212-10, and a plurality of ground pads 214 may be mounted or
disposed on a substrate 210''.
[0101] The substrate 210'' may include a bottom surface on which
the touch IC 216 and the electronic components 218a and 218b are
mounted. In this case, the bottom surface of the substrate 210''
may be the lower surface of the pressure sensor layer 217 including
the pressure sensors.
[0102] The plurality of pressure sensors 212-1, 212-2, . . . , and
212-10 may be disposed on the bottom surface of the substrate
210''. The plurality of pressure sensors 212-1, 212-2, . . . , and
212-10 may be connected to the touch IC 216 by wires formed on the
substrate 210''.
[0103] The plurality of pressure sensors 212-1, 212-2, . . . , and
212-10 may constitute a plurality of channels. For example, among
the plurality of pressure sensors 212-1, 212-2, . . . , and 212-10,
the first to fourth pressure sensors 212-1, 212-2, 212-3, and
212-4, which are disposed at respective edge portions of the bottom
surface of the substrate 210'', may independently constitute four
channels, and the remaining pressure sensors 212-5, . . . , and
212-10 may be electrically connected to one another by the wires to
constitute a single channel. In this case, the remaining pressure
sensors 212-5, . . . , and 212-10 may constitute two or more
channels in accordance with design. Therefore, the plurality of
pressure sensors 212-1, 212-2, . . . , and 212-10 may constitute at
most ten channels. The number of channels may further increase in
accordance with the number of pressure sensors 212-1, 212-2, . . .
, and 212-10.
[0104] The plurality of pressure sensors 212-1, 212-2, . . . , and
212-10 may have an equal size or shape or have different sizes or
shapes. Alternatively, some of the pressure sensors may have an
equal size or shape, and the remaining pressure sensors may have
different sizes or shapes.
[0105] The plurality of ground pads 214 may be formed on the bottom
surface of the substrate 210''. For example, the ground pad 214 may
be formed by selectively opening a part of a cover-lay layer of the
substrate 210'' so that a part of a conductive thin film, which is
covered by the cover-lay layer, is exposed to the outside.
[0106] The ground pad 214 may be electrically connected to the
conductive layer 240 illustrated in FIGS. 3 and 4 by the conductive
cushion 260c illustrated in FIGS. 3 and 4. That is, the conductive
cushion 260c is disposed between the ground pad 214 and the
conductive layer 240, such that the ground pad 214 and the
conductive layer 240 may have equipotential. That is, the
conductive layer 240 may have the ground potential.
[0107] The plurality of ground pads 214 may be disposed between the
plurality of pressure sensors 212-1, 212-2, . . . , and 212-10,
respectively, and may have an equal size or shape or different
sizes or shapes.
[0108] FIG. 7A is a view illustrating the touch pad device
according to the embodiment of the present disclosure illustrated
in FIG. 3, and FIG. 7B is a view illustrating a case in which the
touch pad cover 250 illustrated in FIG. 7A is pressed by a
predetermined object.
[0109] Referring to FIG. 7B, when a specific portion of the touch
pad cover 250 is pressed by a predetermined object, the touch pad
cover 250 is bent downward about a portion to which a force is
applied. Therefore, the substrate 210' attached to the touch pad
cover 250 by the first bonding layer 230 is also bent. In this
case, for convenience of description, FIG. 7B illustrates that the
object presses the central portion of the touch pad cover 250.
However, the present disclosure is not limited thereto, and the
object may press one side of the touch pad cover 250.
[0110] As the substrate 210' is bent, a distance d between the
conductive layer 240 and the pressure sensor 212 included in the
substrate 210' illustrated in FIG. 7A is changed to as illustrated
in FIG. 7B.
[0111] When the distance between the pressure sensor 212 and the
conductive layer 240 is changed, capacitance between the pressure
sensor 212 and the conductive layer 240 is changed, and a
predetermined electrical signal including information on the amount
of change in capacitance is outputted from the pressure sensor 212.
The outputted electrical signal is inputted to the touch IC 216,
and the touch IC 216 may output a predetermined value corresponding
to the inputted electrical signal.
[0112] Meanwhile, in the case in which the pressure sensor 212 is a
strain gauge, the pressure sensor 212 is deformed by the bending of
the substrate 210', and a predetermined electrical signal including
information on the amount of change in resistance value in
accordance with the deformation of the pressure sensor 212 is
outputted from the pressure sensor 212. The outputted electrical
signal is inputted to the touch IC 216, and the touch IC 216 may
output a predetermined value corresponding to the inputted
electrical signal.
[0113] The predetermined value outputted from the touch IC 216 may
be a digital value. The predetermined digital value outputted from
the touch IC 216 may be provided to the control unit of the
portable computer 100. Meanwhile, when the outputted digital value
is equal to or larger than a preset reference value (or larger than
a reference value), the touch IC 216 may determine a touch of an
object inputted to the touch pad cover 250 as a pressure touch.
Further, information on whether a touch is determined as a pressure
touch (hereinafter, referred to as `pressure touch information`)
may be provided to the control unit of portable computer 100.
[0114] On the basis of the pressure touch information or the
digital value inputted from the touch IC 216, the control unit of
the portable computer 100 may control and perform a predetermined
specific function at a corresponding position of the pointer
displayed on the screen of the portable computer 100. For example,
the function, which is performed when the left or right button of
the mouse is pressed, may be performed.
[0115] The features, structures, effects, and the like described
above in the embodiments are included in one embodiment of the
present disclosure, but the present disclosure is not necessarily
limited to one embodiment. Furthermore, the features, structures,
effects, and the like described in the respective embodiments may
be combined or modified and then carried out by those skilled in
the art as other embodiments. It should be interpreted that the
combination and modification are included in the scope of the
present disclosure.
[0116] In addition, the embodiments have been described above, but
the embodiments are just illustrative and not intended to limit the
present disclosure. It can be appreciated by those skilled in the
art that various modifications and alterations, which are not
described above, may be made without departing from the intrinsic
features of the present disclosure. For example, the respective
constituent elements specifically described in the embodiments may
be modified and then carried out. Further, it should be interpreted
that the differences related to the modifications and alterations
are included in the scope of the present disclosure defined by the
appended claims.
* * * * *