U.S. patent application number 17/020952 was filed with the patent office on 2022-03-17 for touch panel and device thereof.
The applicant listed for this patent is TPK Advanced Solutions Inc.. Invention is credited to Kuolung Fang, Ya Ting Hsu, Bao Lin Liu, Qi Bin Liu, You Zhi She, Yong Jin Wu, Pei Qin Xu.
Application Number | 20220083170 17/020952 |
Document ID | / |
Family ID | |
Filed Date | 2022-03-17 |
United States Patent
Application |
20220083170 |
Kind Code |
A1 |
Liu; Qi Bin ; et
al. |
March 17, 2022 |
TOUCH PANEL AND DEVICE THEREOF
Abstract
The present disclosure relates to the field of touch technology,
and provides a touch display module including a substrate, a
transparent conductive layer, a moisture barrier layer, and a
display element. The transparent conductive layer is disposed on
the substrate. The moisture barrier layer extends laterally on the
transparent conductive layer and covers the transparent conductive
layer, and the moisture barrier layer includes inorganic materials.
The display element is disposed on the moisture barrier layer. The
touch display module of the present disclosure can avoid or slow
down the water vapor/humidity intrusion from the environment,
thereby meeting the specification requirements for improving
product reliability test.
Inventors: |
Liu; Qi Bin; (Fujian
Province, CN) ; Fang; Kuolung; (Zhudong Township,
TW) ; She; You Zhi; (Putian City, CN) ; Hsu;
Ya Ting; (Lunbei Township, TW) ; Liu; Bao Lin;
(Xiamen City, CN) ; Wu; Yong Jin; (Jian'ou City,
CN) ; Xu; Pei Qin; (Fujian Province, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TPK Advanced Solutions Inc. |
Xiamen |
|
CN |
|
|
Appl. No.: |
17/020952 |
Filed: |
September 15, 2020 |
International
Class: |
G06F 3/044 20060101
G06F003/044 |
Claims
1. (canceled)
2. (canceled)
3. A touch panel, comprising: a substrate; a bottom coating
disposed on the substrate; an electrode disposed on the bottom
coating; a first top coating disposed on the substrate and having
at least a moisture intrusion interface, wherein the moisture
intrusion interface wraps around and makes contact with a light
shielding layer; and a barrier layer covering the moisture
intrusion interface, wherein a saturated water absorption of the
barrier layer is between 0.08 wt. % and 0.40 wt. %.
4. A touch panel, comprising: a substrate; a bottom coating
disposed on the substrate; an electrode disposed on the bottom
coating; a first top coating disposed on the substrate and having
at least a moisture intrusion interface, wherein the moisture
intrusion interface wraps around and makes contact with a light
shielding layer; and a barrier layer covering the moisture
intrusion interface, wherein a water vapor permeability of the
barrier layer is between 10 g/(m.sup.2*day) and 5000
g/(m.sup.2*day).
5. A touch panel, comprising: a substrate; a bottom coating
disposed on the substrate; an electrode disposed on the bottom
coating; a first top coating disposed on the substrate and having
at least a moisture intrusion interface, wherein the moisture
intrusion interface wraps around and makes contact with a light
shielding layer; and a barrier layer covering the moisture
intrusion interface, wherein a dielectric constant of the barrier
layer is between 2.24 and 2.30, a saturated water absorption is
about 0.1 wt. %, and a water vapor permeability is below 100
g/(m.sup.2*day).
6. The touch panel of claim 3, further comprising an adhesive layer
and at least a second top coating disposed between the first top
coating and the adhesive layer.
7. The touch panel of claim 6, wherein the moisture intrusion
interface is covered by the second top coating.
8. The touch panel of claim 3, wherein the electrode is made of a
composite structure having metal nanowires and the first top
coating.
9. The touch panel of claim 3, further comprising at least an
outermost peripheral wire, wherein the moisture intrusion interface
is defined by at least one side of the outermost peripheral
wire.
10. A device comprising the touch panel of claim 3.
11. The device of claim 10, wherein the device comprises an antenna
structure, a coil, an electrode plate, a display, a portable phone,
a tablet computer, a wearable device, a car device, a notebook
computer, or a polarizer.
12. The touch panel of claim 6, wherein the barrier layer is formed
by extending the adhesive layer.
13. The touch panel of claim 4, further comprising an adhesive
layer and at least a second top coating disposed between the first
top coating and the adhesive layer.
14. The touch panel of claim 13, wherein the moisture intrusion
interface is covered by the second top coating.
15. The touch panel of claim 4, wherein the electrode is made of
metal nanowires.
16. The touch panel of claim 13, wherein the barrier layer is
formed by extending the adhesive layer.
17. The touch panel of claim 4, wherein the electrode is made of a
composite structure having metal nanowires and the first top
coating.
18. The touch panel of claim 5, further comprising an adhesive
layer and at least a second top coating disposed between the first
top coating and the adhesive layer.
19. The touch panel of claim 18, wherein the moisture intrusion
interface is covered by the second top coating.
20. The touch panel of claim 5, wherein the electrode is made of
metal nanowires.
21. The touch panel of claim 18, wherein the barrier layer is
formed by extending the adhesive layer.
22. The touch panel of claim 5, wherein the electrode is made of a
composite structure having metal nanowires and the first top
coating.
Description
BACKGROUND
Field of Disclosure
[0001] The present disclosure relates to the field of touch
technology, and in particular to a touch panel with high water
resistance and a device thereof.
Description of Related Art
[0002] In recent years, with the continuous development of touch
technology, transparent conductors can simultaneously allow light
to pass through and provide appropriate conductivity. Therefore,
transparent conductors are often used in many display or
touch-related devices. Generally speaking, transparent conductors
can be various metal oxides, such as indium tin oxide (ITO), indium
zinc oxide (IZO), cadmium tin oxide (CTO), or aluminum-doped zinc
oxide (AZO). However, films made of these metal oxides cannot meet
the flexibility requirements of display devices. Therefore, a
variety of flexible transparent conductors have been developed
today, such as those made of metal nanowires and other
materials.
[0003] However, the displays or touch devices made of metal
nanowires still have many problems that need to be solved. For
example, if producing touch electrodes by using metal nanowires, a
polymer film may be used with the metal nanowires. However, the
polymer film is often made of organic materials, and the polymer
film often extends to a peripheral region of the device, resulting
in leakage. Therefore, the water vapor/humidity in the environment
easily invades from the polymer film layer, resulting in
insufficient reliability of metal nanowires.
SUMMARY
[0004] In order to overcome the problem of electromigration of
metal nanowires caused by the rapid intrusion of the water vapor,
the present disclosure provides a touch display module with a
moisture barrier layer and/or an adhesive layer of suitable
material. The moisture barrier layer and/or the adhesive layer of
suitable material can reduce water vapor intrusion to avoid
electromigration of metal nanowires or slow down the time of
electromigration of metal nanowires, thereby meeting the
requirements of improving product reliability test.
[0005] The technical solution adopted by the present disclosure
includes a touch panel including a substrate, an electrode, a first
top coating, and a barrier layer. The electrode is disposed on the
substrate. The first top coating is disposed on the substrate and
has at least a moisture intrusion interface. The moisture intrusion
interface is covered by the barrier layer.
[0006] In some embodiments, the barrier layer is formed by
extending an adhesive layer. The barrier layer and the adhesive
layer are integrally formed.
[0007] In some embodiments, a saturated water absorption of the
barrier layer can be between 0.08 wt. % and 0.40 wt. %.
[0008] In some embodiments, a water vapor permeability of the
barrier layer can be between 10 g/(m.sup.2*day) and 5000
g/(m.sup.2*day).
[0009] In some embodiments, a dielectric constant of the barrier
layer is between 2.24 and 2.30, a saturated water absorption is
about 0.1 wt. %, and a water vapor permeability is below 100
g/(m.sup.2*day).
[0010] In some embodiments, the touch panel further includes at
least a second top coating disposed between the first top coating
and the adhesive layer.
[0011] In some embodiments, the moisture intrusion interface is
covered by the second top coating.
[0012] In some embodiments, the electrode is made of metal
nanowires.
[0013] In some embodiments, the touch panel further includes at
least an outermost peripheral wire. The moisture intrusion
interface is defined by at least one side of the outermost
peripheral wire.
[0014] The technical solution adopted by the present disclosure is
a device including the touch panel.
[0015] In some embodiments, the device includes a touch panel, an
antenna structure, a coil, an electrode plate, a display, a
portable phone, a tablet computer, a wearable device, a car device,
a notebook computer, or a polarizer.
[0016] The technical solution adopted by the present disclosure is
a touch display module including a substrate, a transparent
conductive layer, a moisture barrier layer, and a display device.
The transparent conductive layer is disposed on the substrate. The
moisture barrier layer extends laterally on the transparent
conductive layer and covers the transparent conductive layer, and
the moisture barrier layer includes inorganic materials. The
display device is disposed on the moisture barrier layer.
[0017] In some embodiments, inorganic materials include silicon
nitrogen compounds, silicon oxide compounds, or a combination
thereof.
[0018] In some embodiments, the thickness of the moisture barrier
layer is between 30 nm and 110 nm.
[0019] In some embodiments, the moisture barrier layer extends
along the sidewall of the transparent conductive layer to an inner
surface of the substrate.
[0020] In some embodiments, the transparent conductive layer
includes a matrix and a metal nanostructure is distributed in the
matrix.
[0021] In some embodiments, the touch display module further
includes a coating disposed between the moisture barrier layer and
the transparent conductive layer.
[0022] In some embodiments, the moisture barrier layer extends
along the sidewall of the coating to cover the coating.
[0023] In some embodiments, the touch display module further
includes a light shielding layer disposed between the transparent
conductive layer and the substrate.
[0024] In some embodiments, the moisture barrier layer extends
along the sidewall of the light shielding layer to cover the light
shielding layer.
[0025] In some embodiments, the touch display module further
includes an adhesive layer disposed between the moisture barrier
layer and the transparent conductive layer. The saturated water
absorption of the adhesive layer is between 0.08 wt. % and 0.40 wt.
%.
[0026] Another technical solution adopted by the present disclosure
is a touch display module including a substrate, a transparent
conductive layer, an adhesive layer, and a display device. The
transparent conductive layer is disposed on the substrate. The
adhesive layer extends laterally on the transparent conductive
layer. The saturated water absorption of the adhesive layer is
between 0.08 wt. % and 0.40 wt. %, and the water vapor permeability
is between 37 g/(m.sup.2*day) and 1650 g/(m.sup.2*day). The display
device is disposed on the adhesive layer.
[0027] In some embodiments, the dielectric constant value of the
adhesive layer is between 2.24 and 4.30.
[0028] In some embodiments, the thickness of the adhesive layer is
between 150 .mu.m and 200 .mu.m.
[0029] In some embodiments, the adhesive layer extends along the
sidewall of the transparent conductive layer to an inner surface of
the substrate.
[0030] In some embodiments, the touch display module further
includes a coating disposed between the adhesive layer and the
transparent conductive layer.
[0031] In some embodiments, the adhesive layer extends along the
sidewall of the coating to cover the coating.
[0032] In some embodiments, the touch display module further
includes a light shielding layer disposed between the transparent
conductive layer and the substrate.
[0033] In some embodiments, the adhesive layer extends along the
sidewall of the light shielding layer to cover the light shielding
layer.
[0034] In some embodiments, the adhesive layer extends along the
sidewall of the transparent conductive layer to an inner surface of
the light shielding layer.
[0035] In some embodiments, the touch display module further
includes a moisture barrier layer disposed between the adhesive
layer and the transparent conductive layer, in which the moisture
barrier layer includes inorganic materials.
[0036] The present disclosure provides a touch display module with
a moisture barrier layer and/or an adhesive layer of suitable
material. The moisture barrier layer and/or the adhesive layer of
suitable material can reduce moisture intrusion, and the adhesive
layer of suitable material also can lower the moisture transfer
speed and the migration speed of metal ions produced by the metal
nanowires. This can avoid electromigration of metal nanowires or
slow down the time of electromigration of metal nanowires, thereby
meeting the requirements of improving product reliability test. The
moisture barrier layer and/or the adhesive layer has higher
resistance from the moisture/water vapor.
BRIEF DESCRIPTION OF THE DRAWINGS
[0037] The various aspects of the content of the present disclosure
can be best understood from the following detailed description when
read together with the accompanying drawings. It is worth noting
that, according to common practice in the industry, the various
features are not drawn to scale. In fact, in order to clearly
illustrate and discuss, the size of each feature may be arbitrarily
increased or decreased.
[0038] FIG. 1 is a schematic side view of a touch display module
according to some embodiments of the present disclosure.
[0039] FIG. 2 is a schematic side view of a touch display module
according to other embodiments of the present disclosure.
[0040] FIG. 3 is a schematic side view of a touch display module
according to other embodiments of the present disclosure.
[0041] FIG. 4 is a schematic side view of a touch display module
according to other embodiments of the present disclosure.
[0042] FIG. 5 is a schematic side view of a touch display module
according to other embodiments of the present disclosure.
[0043] FIG. 6 is a schematic side view of a touch display module
according to other embodiments of the present disclosure.
[0044] FIG. 7 is a schematic side view of a touch panel according
to other embodiments of the present disclosure.
[0045] FIG. 8 is a schematic side view of a touch panel according
to other embodiments of the present disclosure.
[0046] FIG. 9 is a schematic side view of a touch panel according
to other embodiments of the present disclosure.
[0047] FIG. 10A is a schematic side view of a touch panel according
to other embodiments of the present disclosure.
[0048] FIG. 10B is a schematic side view of a touch panel according
to other embodiments of the present disclosure.
[0049] FIG. 11A to FIG. 110 are schematic views of a manufacturing
method of a touch panel according to other embodiments of the
present disclosure.
[0050] FIG. 12 is a schematic top view of a touch panel according
to other embodiments of the present disclosure.
[0051] FIG. 12A is a cross-sectional view of A-A in FIG. 12.
[0052] FIG. 12B is a cross-sectional view of B-B in FIG. 12.
[0053] FIG. 13 is a schematic side view of a touch panel according
to other embodiments of the present disclosure.
[0054] FIG. 14 is a schematic side view of a touch panel according
to other embodiments of the present disclosure.
[0055] FIG. 15 is a schematic top view of a touch panel according
to other embodiments of the present disclosure.
[0056] FIG. 16 is a schematic top view of a touch panel according
to other embodiments of the present disclosure.
[0057] FIG. 17 is a schematic top view of a touch panel according
to other embodiments of the present disclosure.
[0058] FIG. 17A is a cross-sectional view of A-A in FIG. 17.
[0059] FIG. 18 is a graph of dielectric constant value--reliability
test results drawn according to the examples in Table 1.
[0060] FIG. 19 is a graph of saturated water
absorption--reliability test results drawn according to the
examples in Table 1.
[0061] FIG. 20 is a schematic side view of a touch display module
according to other embodiments of the present disclosure.
DETAILED DESCRIPTION
[0062] In the following, multiple embodiments of the present
disclosure will be disclosed with the accompanying drawings. Many
practical details will be described in the following description
for clarity. However, it should be understood that these practical
details should not be used to limit the present disclosure. That is
to say, in some embodiments of the present disclosure, these
practical details are unnecessary, and therefore should not be used
to limit the present disclosure. In addition, in order to simplify
the drawings, some conventionally used structures and elements are
shown in the drawings in a simple schematic manner. Besides, for
the convenience of readers, the size of each element in the
drawings is not drawn according to actual scale.
[0063] Furthermore, relative terms such as "lower" or "bottom" and
"upper" or "top" may be used herein to describe the relationship
between one element and another element, as shown in the figures.
It should be understood that relative terms are intended to include
different orientations of the device other than the orientation
shown in the figure. For example, if the device in one figure is
turned over, the components described as being on the "lower" side
of other components will be oriented on the "upper" side of other
components. Therefore, the exemplary term "lower" may include an
orientation of "lower" and "upper", depending on the specific
orientation of the drawing. Similarly, if the device in one figure
is turned over, elements described as "below" or "lower" other
elements will be oriented "above" the other elements. Thus, the
exemplary terms "below" or "lower" could include an orientation of
above and below.
[0064] Please refer to FIG. 1, which is a schematic side view of a
touch display module 100 according to an embodiment of the present
disclosure. The touch display module 100 includes a substrate 110,
a first conductive layer 120, a second conductive layer 130, a
moisture barrier layer 140, and a display device 150. The first
conductive layer 120, the second conductive layer 130, the moisture
barrier layer 140, and the display device 150 are sequentially
stacked on the substrate 110. The touch display module 100 further
includes a plurality of coatings 160. The coatings 160 can be
disposed, for example, between the substrate 110 and the first
conductive layer 120, between the first conductive layer 120 and
the second conductive layer 130, and between the second conductive
layer 130 and the display device 150. In addition, the touch
display module 100 has a display region DR and a peripheral region
PR. The peripheral region PR can be provided with a light shielding
layer 170 for shading, which can be made of, for example, a dark
photoresist material or other opaque metal materials. The
peripheral region PR of the touch display module 100 has at least
one side 101 as a moisture intrusion surface. The present
disclosure achieves the effect of extending the path and time of
moisture intrusion by the inclusion of the moisture barrier layer
140, so as to achieve the purpose of protecting various electrodes
(for example, the first conductive layer 120 and the second
conductive layer 130) in the touch display module 100, thereby
meeting the specification requirements for improving product
reliability test. In the following description, a more detailed
description will be given.
[0065] In some embodiments, the first conductive layer 120 can be
disposed along the first axis (for example, the x-axis) to transmit
the touch sensing signal of the touch display module 100 in the
first axis to the peripheral region PR for the subsequent
processing. In other words, the first conductive layer 120 can be
used as a horizontal touch sensing electrode. In some embodiments,
the first conductive layer 120 can be, for example, an indium tin
oxide conductive layer. In other embodiments, the first conductive
layer 120 can be, for example, an indium zinc oxide, cadmium tin
oxide, or aluminum-doped zinc oxide conductive layer. Since the
above-mentioned materials all have excellent light transmittance,
the above-mentioned materials will not affect the optical
properties of the touch display module 100 (for example, optical
transmittance, and clarity).
[0066] In some embodiments, the second conductive layer 130 can be
disposed along the second axis (for example, the y-axis) to
transmit the touch sensing signal of the touch display module 100
in the second axis to the peripheral region PR for the subsequent
processing. In other words, the second conductive layer 130 can be
used as a vertical touch sensing electrode. In some embodiments,
the second conductive layer 130 can include a matrix and a
plurality of metal nanowires (also referred to as a metal
nanostructure) distributed in the matrix. The matrix can include a
polymer or a mixture thereof, thereby imparting specific chemical,
mechanical, and optical properties to the second conductive layer
130. For example, the matrix can provide good adhesion between the
second conductive layer 130 and other layers. For another example,
the matrix can also provide good mechanical strength for the second
conductive layer 130. In some embodiments, the matrix can include a
specific polymer, so that the second conductive layer 130 has
additional surface protection against scratches and abrasion,
thereby enhancing the surface strength of the second conductive
layer 130. The above-mentioned specific polymer can be, for
example, polyacrylate, epoxy resin, polyurethane, polysiloxane,
polysilane, poly(silicon-acrylic acid), or any combination of the
above. In some embodiments, the matrix can further include a
surfactant, a crosslinker, a stabilizer (for example, including but
not limitation, an antioxidant or an ultraviolet light stabilizer),
a polymerization inhibitor, or a combination of any of the above,
thereby enhancing the ultraviolet (UV) performance of the second
conductive layer 130 and extending its service life.
[0067] In some embodiments, metal nanowires can include, but are
not limited to, silver nanowires, gold nanowires, copper nanowires,
nickel nanowires, or any of the foregoing combinations. In more
detail, "metal nanowires" in the present application is a
collective noun, which refers to a collection of metal wires
including multiple metal elements, metal alloys, or metal compounds
(including metal oxides). In addition, the number of metal
nanowires included in the second conductive layer 130 is not used
to limit the present disclosure. The metal nanowires of the present
disclosure have excellent light transmittance, and therefore can
provide good conductivity for the second conductive layer 130
without affecting the optical properties of the touch display
module 100.
[0068] In some embodiments, the cross-sectional size (i.e., the
diameter of the cross-section) of a single metal nanowire can be
less than 500 nm, preferably less than 100 nm, and more preferably
less than 50 nm, so that the second conductive layer 130 has a
lower haze. In detail, if the cross-sectional size of a single
metal nanowire is greater than 500 nm, the single metal nanowire
would be too thick, resulting in the haze of the second conductive
layer 130 being too high, thereby affecting the visual clarity of
the display region DR. In some embodiments, the aspect ratio
(length:diameter) of a single metal nanowire can be between 10 and
100,000, so that the second conductive layer 130 can have a lower
resistivity, a higher light transmittance, and a lower haze. In
detail, if the aspect ratio of a single metal nanowire is less than
10, the conductive network may not be formed well, resulting in
excessively high resistivity of the second conductive layer 130.
Therefore, the metal nanowires may be distributed in the matrix
with a greater arrangement density (that is, the number of metal
nanowires included in the second conductive layer 130 per unit
volume) in order to increase the conductivity of the second
conductive layer 130. However, the greater density may result in
low light transmittance of the second conductive layer 130 and high
haze. It should be understood that other terms such as silk, fiber,
or tube can also have the above-mentioned cross-sectional
dimensions and aspect ratios, and are also within the scope of the
present disclosure.
[0069] As mentioned above, the coating 160 can be disposed between
the substrate 110 and the first conductive layer 120, between the
first conductive layer 120 and the second conductive layer 130, and
between the second conductive layer 130 and the display device 150
to achieve the effect of protection, insulation, or adhesion. In
some embodiments, the coating 160 disposed between the substrate
110 and the first conductive layer 120 can also be referred to as a
bottom coating 160a, the coating 160 disposed between the first
conductive layer 120 and the second conductive layer 130 can also
be referred to as a middle coating 160b, and the coating 160
disposed between the second conductive layer 130 and the display
device 150 can also be referred to as a top coating (such as a
first top coating 160c). In some embodiments, the bottom coating
160a and/or the first top coating 160c can further extend to an
inner surface 171 of the light shielding layer 170 located in the
peripheral region PR (that is, the surface of the light shielding
layer 170 facing away from the substrate 110). In some embodiments,
the first top coating 160c can extend laterally and cover the
entire second conductive layer 130. In some embodiments, the top
coating can have more than two layers, such as the two layers
depicted in FIG. 1. The layer contacting with the second conductive
layer 130 can be referred to as the first top coating 160c, and the
layer contacting with the moisture barrier layer 140 can be
referred to as a second top coating 160d, but the present
disclosure is not limited to this. In some embodiments, the second
top coating 160d located at the top can further extend along the
sidewall of each layer (for example, the sidewalls of the first top
coating 160c and the bottom coating 160a) to the inner surface 171
of the light shielding layer 170. Therefore, the touch display
module 100 is protected from the side of touch display module 100.
In some embodiments, the touch display module 100 can further
include a peripheral wire 180 located in the peripheral region PR
and between the first top coating 160c and the bottom coating 160a.
The peripheral wire 180 can electrically connect to the second
conductive layer 130 and a flexible circuit board (not shown) to
further transmit the touch sensing signal generated by the second
conductive layer 130 to an external integrated circuit for the
subsequent processing. The second top coating 160d at the top can
further extend along the sidewall of the peripheral wire 180 to the
inner surface 171 of the light shielding layer 170. In some
embodiments, the thickness of the coating 160 (such as the
thickness H1 of the bottom coating 160a) can be between 20 nm and
10 .mu.m, between 50 nm and 200 nm, or between 30 nm and 100 nm,
thereby achieving good protection, insulation, or adhesion, and
avoiding excessive thickness of the touch display module 100. In
detail, if the thickness of the coating 160 is less than the above
lower limit, it may cause the coating 160 to fail to provide good
protection, insulation, or adhesion functions. If the thickness of
the coating 160 is greater than the above upper limit, it may cause
the overall thickness of the touch display module 100 to be too
large, which is not conducive to the process and seriously affects
the appearance.
[0070] In some embodiments, the first top coating 160c and/or the
second top coating 160d can form a composite structure with the
second conductive layer 130, and the composite structure has
certain specific chemical, mechanical, and optical properties. For
example, the first top coating 160c can provide good adhesion
between the composite structure and other layers. For another
example, the first top coating 160c can provide good mechanical
strength for the composite structure. In some embodiments, the
first top coating 160c can include a specific polymer, so that the
composite structure has additional surface protection against
scratches and abrasion, thereby enhancing the surface strength of
the composite structure. The above-mentioned specific polymer can
be, for example, polyacrylate, polyurethane, epoxy resin,
polysiloxane, polysilane, poly(silicon-acrylic acid), or any
combination of the above. It is worth noting that the drawings
herein show the first top coating 160c and the second conductive
layer 130 as different layers. However, in some embodiments, the
material used to make the first top coating 160c can penetrate
between the metal nanowires of the second conductive layer 130
before being cured or in a pre-cured state to form a filler.
Therefore, when the first top coating 160c is cured, the metal
nanowires can also be embedded in the first top coating 160c.
[0071] In some embodiments, the material of the coating 160 can be,
for example, insulating (non-conductive) resin or other organic
materials. For example, the coating 160 can include polyethylene,
polypropylene, polyvinyl butyral, polycarbonate,
acrylonitrile-butadiene-styrene copolymer,
poly(3,4-ethylenedioxythiophene), poly(styrene sulfonic acid),
ceramic, or any combination of the above. In some embodiments,
coating 160 can also include, but is not limited to, any of the
following polymers: polyacrylic resin (for example,
polymethacrylate, polyacrylate, and polyacrylonitrile); polyvinyl
alcohol; polyester (for example, polyethylene terephthalate,
polyester naphthalate and polycarbonate); polymer with high
aromaticity (for example, phenolic resin or cresol-formaldehyde,
polyvinyl toluene, polyvinyl xylene, polysulfone, polysulfide,
polystyrene, polyimide, polyamide, polyamideimide, polyetherimide,
polyphenylene and polyphenyl ether); polyurethane; epoxy resin;
polyolefin (for example, polypropylene, polymethylpentene, and
cycloolefin); polysiloxanes and other silicon-containing polymers
(for example, polysilsesquioxane and polysilane); synthetic rubber
(for example, ethylene-propylene-diene monomer, ethylene propylene
rubber and styrene butadiene rubber; fluoropolymer (for example,
polyvinylidene fluoride, polytetrafluoroethylene and
polyhexafluoropropylene); cellulose; polyvinyl chloride;
polyacetate; norbornene; and copolymers of fluoro-olefin and
hydrocarbon olefin.
[0072] As mentioned above, since the material of the coating 160 is
a resin or organic material with good hydrophilicity, and the
coating 160 extends to the peripheral region PR, the peripheral
region PR of the touch display module 100 has at least one side 101
function as the moisture intrusion surface. In detail, the moisture
intrusion surface of the touch display module 100 shown in FIG. 1
is a sidewall 161d of the second top coating 160d. In other
embodiments, in the case that the topmost second top coating 160d
does not extend along the sidewall of each layer to the inner
surface 171 of the light shielding layer 170, the moisture
intrusion surface can be the sidewalls of the first top coating
160c, the peripheral wire 180, and the bottom coating 160a.
[0073] In some embodiments, the moisture barrier layer 140 extends
laterally on the topmost second top coating 160d and covers the
entirely topmost second top coating 160d. In addition, the moisture
barrier layer 140 further extends along the sidewall 161d of the
topmost second top coating 160d to the inner surface 171 of the
light shielding layer 170 to cover the sidewall 161d of the topmost
second top coating 160d. Therefore, the moisture in the environment
is prevented from invading and attacking the electrode (for
example, the second conductive layer 130) from the moisture
intrusion surface. In this way, it is possible to prevent the metal
nanowires in the second conductive layer 130 from gathering or even
chemical reactions to precipitate metal ions or electrons, and to
prevent the short circuit of the peripheral wire 180, thereby
enhancing the electrical sensitivity of the second conductive layer
130. In some embodiments, the moisture barrier layer 140 can be,
for example, conformally formed on the surface of the topmost
second top coating 160d and the sidewall 161d. In some embodiments,
the moisture barrier layer 140 can, for example, include inorganic
materials including silicon nitride, silicon oxide, or a
combination thereof. For example, the silicon nitride compound can
be silicon nitride (Si.sub.3N), and the silicon oxide compound can
be silicon dioxide (SiO.sub.2). In other embodiments, the moisture
barrier layer 140 can be, for example, mullite, alumina, silicon
carbide, carbon fiber, MgO--Al.sub.2O.sub.3--SiO.sub.2,
Al.sub.2O.sub.3--SiO.sub.2,
MgO--Al.sub.2O.sub.3--SiO.sub.2--Li.sub.2O, or a combination of
inorganic materials. Compared with resins or organic materials,
inorganic materials have lower hydrophilicity, so they can
effectively prevent moisture in the environment from invading and
attacking the electrode.
[0074] In some embodiments, the thickness H2 of the moisture
barrier layer 140 can be between 30 nm and 110 nm to achieve a good
water blocking effect and prevent the overall thickness of the
touch display module 100 from being too large. In detail, if the
thickness H2 of the moisture barrier layer 140 is less than 30 nm,
the moisture in the environment may not be effectively isolated. If
the thickness H2 of the moisture barrier layer 140 is greater than
110 nm, the overall thickness of the touch display module 100 may
be too large, which is not conducive to the process and seriously
affects the appearance. In addition, the selection of the inorganic
materials of the moisture barrier layer 140 and the combination of
the thickness H2 of the moisture barrier layer 140 can make the
moisture barrier layer 140 achieve a better water blocking effect.
For example, if a silicon nitride compound is used alone as the
inorganic material of the moisture barrier layer 140, the thickness
H2 of the moisture barrier layer 140 can be set to about 30 nm. For
another example, if a silicon nitride compound and a silicon oxide
compound are used as the inorganic material of the moisture barrier
layer 140, the thickness H2 of the moisture barrier layer 140 can
be set between 40 nm and 110 nm, in which the silicon nitride
compound and the silicon oxide compound can be stacked in layers.
The thickness of the silicon nitride compound layer can be between
10 nm and 30 nm, and the thickness of the silicon oxide compound
layer can be between 30 nm and 80 nm.
[0075] In some embodiments, apart from the aforementioned touch
panel components, the touch display module 100 can further include
an optically clear adhesive (OCA) layer 190 disposed between the
display device 150 and the moisture barrier layer 140. The
optically clear adhesive layer 190 can attach the display device
150 onto the moisture barrier layer 140, so that the display device
150 and the substrate 110 can jointly sandwich each functional
layer (for example, the first conductive layer 120, the second
conductive layer 130, the moisture barrier layer 140, the coating
160, the light shielding layer 170, the peripheral wire 180, and
the adhesive layer 190) of the touch panel between them. In some
embodiments, the adhesive layer 190 can include an insulating
material such as rubber, acrylic, or polyester.
[0076] In some embodiments, the adhesive layer 190 can extend to
the peripheral region PR and form at least one moisture intrusion
surface in the peripheral region PR. In some embodiments, the
thickness H3 of the adhesive layer 190 can be between 150 .mu.m and
200 .mu.m. The thickness H3 of the adhesive layer 190 can affect
the path that the moisture in the environment travels when the
moisture passes through the adhesive layer 190. The path and time
of the moisture passing through the adhesive layer 190 can be
increased by setting the thickness H3 of the adhesive layer 190
between 150 .mu.m and 200 .mu.m. In this way, the moisture
intrusion from the environment can effectively be slowed down,
thereby reducing the possibility of electromigration of the metal
nanowires, and avoiding the overall thickness of the touch display
module 100 from being too large. In detail, if the thickness H3 of
the adhesive layer 190 is less than 150 .mu.m, the time it takes
for the moisture in the environment to pass through the adhesive
layer 190 may be too short, so the moisture in the environment can
easily invade and attack the electrode. If the thickness H3 of 190
is greater than 150 .mu.m, the overall thickness of the touch
display module 100 may be too large, and this is not conducive to
the manufacturing process and seriously affects the appearance.
[0077] In summary, the touch panel/touch display module 100 of the
present disclosure can achieve a good moisture barrier effect,
thereby meeting the specification requirements for improving the
product reliability test. In some embodiments, the touch display
module 100 can pass an electrical test lasting about 504 hours
under specific test conditions (for example, a temperature of
65.degree. C., a relative humidity of 90%, and a voltage of 11
volts). This shows that the touch display module 100 can have good
reliability test results.
[0078] Please refer to FIG. 2, which is a schematic side view of a
touch display module 200 according to an embodiment of the present
disclosure. At least one difference between the touch display
module 200 in FIG. 2 and the touch display module 100 in FIG. 1 is
that the moisture barrier layer 240 of the touch display module 200
further extends along the sidewall 273 of the light shielding layer
270 to the inner surface 211 of the substrate 210, and covers the
sidewall 273 of the light shielding layer 270. In some embodiments,
the moisture barrier layer 240 can further extend laterally on the
inner surface 211 of the substrate 210 and cover a part of the
inner surface 211 of the substrate 210. For example, the moisture
barrier layer 240 can be conformally formed on the surface and the
sidewall of each layer (for example, the coating 260, the light
shielding layer 270, and the substrate 210). In this way, the
moisture barrier layer 240 can more completely protect the touch
display module 200 from the side of the touch display module 200,
so as to better prevent or slow down the moisture intrusion from
the environment and attack the electrode. In some embodiments, the
touch display module 200 can pass an electrical test lasting about
504 hours under specific test conditions (for example, a
temperature of 65.degree. C., a relative humidity of 90%, and a
voltage of 11 volts). This shows that the touch display module 200
can have good reliability test results.
[0079] Please refer to FIG. 3, which is a schematic side view of a
touch display module 300 according to an embodiment of the present
disclosure. At least one difference between the touch display
module 300 in FIG. 3 and the touch display module 100 in FIG. 1 is
that the moisture barrier layer 340 in the touch display module 300
replaces the topmost top coating 160c shown in FIG. 1. In other
words, the touch display module 300 in FIG. 3 has only one layer of
top coating 360c. The top coating 360c is the topmost top coating
360c of the touch display module 300, and the moisture barrier
layer 340 directly covers the surface of the top coating 360c. In
addition, the moisture barrier layer 340 further extends along the
sidewalls of the top coating 360c, the peripheral wire 380, and the
bottom coating 360a to the inner surface 371 of the light shielding
layer 370, and covers the sidewalls of the top coating 360c, the
peripheral wire 380, and the bottom coating 360a. In this way, the
moisture barrier layer 340 can protect the touch display module 300
from the side of the touch display module 300, thereby effectively
avoiding or slowing down the moisture intrusion from the
environment and attacking the electrode. In addition, since the
touch display module 300 in FIG. 3 eliminates a layer of top
coating 160c compared to the touch display module 100 in FIG. 1,
the touch display module 300 in FIG. 3 can have a smaller thickness
than the touch display module 100 in FIG. 1, thereby meeting the
requirements of thinner products. In some embodiments, the touch
display module 300 can pass an electrical test lasting about 504
hours under specific test conditions (for example, a temperature of
65.degree. C., a relative humidity of 90%, and a voltage of 11
volts). This shows that the touch display module 300 can have good
reliability test results.
[0080] Please refer to FIG. 4, which is a schematic side view of a
touch display module 400 according to an embodiment of the present
disclosure. At least one difference between the touch display
module 400 in FIG. 4 and the touch display module 300 in FIG. 3 is
that the moisture barrier layer 440 of the touch display module 400
extends further along the sidewall 473 of the light shielding layer
470 to an inner surface 411 of the substrate 410, and covers the
sidewall 473 of the light shielding layer 470. In some embodiments,
the moisture barrier layer 440 can further extend laterally on the
inner surface 411 of the substrate 410 and cover a part of the
inner surface 411 of the substrate 410. In some embodiments, the
moisture barrier layer 440 can be, for example, conformally formed
on the surface and the sidewall of each layer (for example, a
coating 460, a peripheral wire 480, the light shielding layer 470,
and substrate 410). In this way, the moisture barrier layer 440 can
more completely protect the touch display module 400 from the side
of the touch display module 400, so as to better prevent or slow
down the moisture intrusion from the environment and attack the
electrode. In some embodiments, the touch display module 400 can
pass an electrical test lasting about 504 hours under specific test
conditions (for example, a temperature of 65.degree. C., a relative
humidity of 90%, and a voltage of 11 volts). This shows that the
touch display module 400 can have good reliability test
results.
[0081] Please refer to FIG. 5, which is a schematic side view of a
touch display module 500 according to an embodiment of the present
disclosure. At least one difference between the touch display
module 500 in FIG. 5 and the touch display module 300 in FIG. 3 is
that the moisture barrier layer 540 in the touch display module 500
replaces the topmost top coating 360c shown in FIG. 3. In other
words, the touch display module 500 in FIG. 5 does not have any top
coating, and a moisture barrier layer 540 directly extends
laterally on the surfaces of a second conductive layer 530 and a
peripheral wire 580, and covers the second conductive layer 530 and
the peripheral wire 580. In addition, the moisture barrier layer
540 further extends along the sidewalls of the peripheral wire 580
and a bottom coating 560a to an inner surface 571 of a light
shielding layer 570, and covers the sidewalls of the peripheral
wire 580 and the bottom coating 560a. In this way, the moisture
barrier layer 540 can protect the touch display module 500 from the
side of the touch display module 500, thereby effectively avoiding
or slowing down the moisture intrusion from the environment and
attacking the electrode. In addition, since the touch display
module 500 in FIG. 5 does not have any top coating, the touch
display module 500 in FIG. 5 can have a smaller thickness than the
touch display module 300 in FIG. 3, thereby achieving the
requirement of thinner products. In some embodiments, the touch
display module 500 can pass an electrical test lasting about 504
hours under specific test conditions (for example, a temperature of
65.degree. C., a relative humidity of 90%, and a voltage of 11
volts). This shows that the touch display module 500 can have good
reliability test results.
[0082] Please refer to FIG. 6, which is a schematic side view of a
touch display module 600 according to an embodiment of the present
disclosure. At least one difference between the touch display
module 600 in FIG. 6 and the touch display module 500 in FIG. 5 is
that a moisture barrier layer 640 of the touch display module 600
extends further along a sidewall 673 of the light shielding layer
670 to an inner surface 611 of a substrate 610, and covers the
sidewall 673 of the light shielding layer 670. In some embodiments,
the moisture barrier layer 640 can further extend laterally on the
inner surface 611 of the substrate 610 and cover a part of the
inner surface 611 of the substrate 610. In some embodiments, the
moisture barrier layer 640 can be formed conformally on the surface
and sidewall of each layer (for example, a coating 660, a
peripheral wire 680, the light shielding layer 670, and the
substrate 610). In this way, the moisture barrier layer 640 can
more completely protect the touch display module 600 from the side
of the touch display module 600, so as to better prevent or slow
down the moisture intrusion from the environment and attack the
electrode. In some embodiments, the touch display module 600 can
pass an electrical test lasting about 504 hours under specific test
conditions (for example, a temperature of 65.degree. C., a relative
humidity of 90%, and a voltage of 11 volts). This shows that the
touch display module 600 has good reliability test results.
[0083] In addition to avoiding or slowing down the moisture
intrusion from the environment and attacking the electrode by the
setting of the moisture barrier layer, in some embodiments, the
selection of material characteristics and/or the setting of the
structure can also be used to avoid inducing electromigration or
slowing down the time of electromigration of metal nanowires,
thereby meeting the specification requirements for improving the
product reliability test.
[0084] Please refer to FIG. 7 first, which is a schematic partial
cross-sectional view of a touch panel 1000 according to some
embodiments of the present disclosure. The touch panel 1000 in FIG.
7 includes the substrate 110 and a plurality of functional
layers/structural layers on the substrate 110, in which at least
one of the functional layers on the substrate 110 is a polymer
layer, and which has at least one moisture Intrusion interface. For
example, the first top coating 160c on the substrate 110 is made of
polymer/resin material, and the first top coating 160c has a side
in the peripheral region PR (the left side depicted in FIG. 7 is
the extended surface in the thickness direction of the polymer
layer). Since the left side is close to the outside of the device
and exposed to the environment, the water vapor/moisture in the
atmosphere can easily enter the first top coating 160c from the
left side, and then affect the reliability of the entire touch
panel 1000. In some embodiments of the present disclosure, the
barrier layer 191 is disposed on the moisture intrusion interface
(that is, the aforementioned side) to avoid the exposure of the
moisture intrusion interface and to also achieve the effect of
extending the path of moisture intrusion, so that the touch panel
1000 can be protected. The purpose of this, in particular, is to
slow down the water vapor/moisture attack on the electrode. In one
example, the electrode of the touch panel 1000 (such as the
aforementioned second conductive layer 130) is made of a metal
nanowire layer NWL including at least a metal nanowire (metal
nanowires) NW. After passing through specific test conditions
(65.degree. C., humidity 90%, 11 volt voltage), the electrical test
can pass the test time of 504 hours. It is worth noting that, for
the sake of simplicity, the actual state is not drawn on the right
side in FIG. 7. If the aforementioned moisture intrusion interface
(such as the right side of the first top coating 160c) also appears
on the actual product, the barrier layer 191 can also be set on the
side.
[0085] In one example, the barrier layer 191 is made of a material
with low water permeability (WVTR, or water vapor transmission
rate), and its width is about 10 to 500 .mu.m. In other words, the
water vapor/moisture in the atmosphere needs to pass through the
barrier layer 191 before it comes into contact with the
above-mentioned moisture intrusion interface. The barrier layer
provides at least a 10 to 500 .mu.m path to delay the time before
the electrode of the touch panel 1000 is attacked and to cause
invalidation. The low water permeability referred to in this
example refers to water permeability below 1500 (g/m.sup.2*day)
(the water permeability can be measured under the
temperature/humidity condition of 50.degree. C./90% or 65.degree.
C./90%). The barrier layer 191 at least uses the low water
permeability and/or thickness (that is, the distance passed through
by water vapor/moisture) and so on to delay the time before for the
electrode of the touch panel 1000 is attacked.
[0086] As shown in FIG. 7, the substrate 110 can further include
the bottom coating 160a. The bottom coating 160a is located between
the substrate 110 and the metal nanowire layer NWL. The
characteristics of the bottom coating 160a can be similar to the
first top coating 160c, so that the barrier layer 191 is disposed
and covers the side of the bottom coating 160a to extend the time
for water vapor to enter from the side of the bottom coating 160a
and enter the inner device along the bottom coating 160a. In other
words, the barrier layer 191 can cover two or more moisture
intrusion interfaces.
[0087] In one example, the multiple functional layers/structural
layers on the substrate 110 can include the peripheral wire 180,
the coating (such as the first top coating 160c, the bottom coating
160a, etc.), the touch sensing electrode TE, and so on. The
peripheral wire 180 can be formed by the conductive layer ML, for
example, by a patterning process.
[0088] Please refer to FIG. 8, the touch panel 1000 can be
assembled with the adhesive layer 190 and the display device 150 to
form a display having a touch function. In one example, the
adhesive layer 190 can be optically clear adhesive (OCA) or the
like. In one example, an optically clear adhesive with low water
permeability can be selected, such as acrylic or rubber series
material. The optically clear adhesive is not only coated on the
front surface of the touch panel 1000 (that is, the surface where
the display device 150 is bonded and assembled), but also can be
extended into an L-shaped structure (viewed in a cross-sectional
view). The extended part can be set on the moisture intrusion
interface (that is, the aforementioned side) to form a barrier
layer 191. In other words, the adhesive layer 190 and the barrier
layer 191 can be coated and molded at one time by using the
optically clear adhesive, and the thickness of the adhesive layer
190 and the barrier layer 191 would be substantially the same. In
one example, the adhesive layer 190 and the barrier layer 191 can
be made of different optically clear adhesive materials, and the
thickness of the adhesive layer 190 and the barrier layer 191 can
be the same or different.
[0089] Please refer to the following table. In this example, two
optically clear adhesives are provided to make the adhesive layer
190 and the barrier layer 191.
TABLE-US-00001 Characteristics of optically clear adhesive Example
1 Example 2 Thickness (.mu.m) 150 200 Moisture sorption rate (%)
0.1 0.2 Dk 2.56 2.85 Water vapor permeability 42 (measured at
50.degree. 1350 (measured at 65.degree. (g/m.sup.2*day) C./90%
condition) C./90% condition)
[0090] In one example, the used adhesive layer 190/barrier layer
191 can have a low moisture absorption rate, for example, below
0.5%, below 0.2%, or below 0.1%.
[0091] Please refer to FIG. 9. The touch panel 1000 can include a
second top coating 160d. The second top coating 160d is disposed on
the first top coating 160c, which also has a moisture intrusion
interface. Therefore, the barrier layer 191 of the example of the
present disclosure can be covered on the side (that is, the
moisture intrusion interface) of the second top coating 160d to
achieve the effect of slowing down the attack of water
vapor/moisture on the electrode. In the present example, the second
top coating 160d has an L-shaped structure, which covers the first
top coating 160c and covers the side of the multiple functional
layers/structure layers between the second top coating 160d and the
substrate 110. In other words, the side (that is, the moisture
intrusion interface) of the first top coating 160c described above
would be covered by the second top coating 160d, and the barrier
layer 191 would cover the side of the second top coating 160d. From
the perspective of water vapor intrusion, the barrier layer 191 and
the second top coating 160d are formed sequentially (from the
outside to the inside). The second top coating 160d can be made of
hydrophobic polymer materials with a water blocking function (for
example, 100 to 500 g/m.sup.2*day water permeability (measured at
65.degree. C./90% condition)), and so the second top coating 160d
can also delay the time before the electrode of the touch panel
1000 is attacked. In one example, the thickness of the second top
coating 160d is about 1/10 to 1/1000 of the thickness of the
adhesive layer 190. In one embodiment, the thickness of the second
top coating 160d is about 1/100 to 1/500 of the thickness of the
adhesive layer 190.
[0092] Please refer to FIGS. 10A and 10B. In one example, the
substrate 110 has a light shielding layer 170 formed in the
peripheral region PR. One side of the barrier layer 191 can be in
contact with the side of multiple functional layers/structural
layers on the substrate 110 (for example, the aforementioned
moisture intrusion interface). The barrier layer 191 and the light
shielding layer 170 form a front edge that is aligned with each
other, and the barrier layer 191 does not in contact with the
substrate 110 (as shown in FIG. 10A). Or, the barrier layer 191 can
cover the side of multiple functional layers/structural layers on
the substrate 110 (such as the aforementioned moisture intrusion
interface) and the side of the light shielding layer 170, and the
barrier layer 191 contacts the substrate 110 (FIG. 10B).
[0093] Please refer to FIGS. 11A to 11C, the touch panel 1000 in
the embodiment of the present disclosure can be manufactured in the
following manner. Firstly, a substrate 110 is provided, which has
the pre-defined peripheral region PR and the pre-defined display
region DR. Next, a metal layer ML is on the peripheral region PR
(as shown in FIG. 11A); then a metal nanowire (metal nanowires)
layer NWL is formed on the peripheral region PR and the display
region DR (as shown in FIG. 11B); then the patterned layer PL is
formed on the metal nanowire layer NWL (as shown in FIG. 11C); then
patterning is performed according to the patterned layer PL to form
a patterned metal layer ML and a patterned metal nanowire layer
NWL. A more detailed description is given below.
[0094] Please refer to FIG. 11A. The metal layer ML is formed on
the peripheral region PR of the substrate 110. The metal layer ML
can be patterned to become the peripheral wire 180. In detail, in
some embodiments of the present disclosure, the metal layer ML can
be made of metal with better conductivity, preferably a
single-layer metal structure, such as a silver layer, a copper
layer, etc.; or a multi-layer conductive structure, such as
molybdenum/aluminum/molybdenum, copper/nickel,
titanium/aluminum/titanium, molybdenum/chromium, etc. The
above-mentioned metal structure is preferably opaque, for example,
the light transmittance of visible light (such as wavelength
between 400 nm to 700 nm) is less than about 90%.
[0095] In this example, the aforementioned metal can be formed on
the substrate 110 by a sputtering method (such as, but not limited
to, a physical sputtering, a chemical sputtering, etc.) to form a
metal layer ML.
[0096] In one example, the copper layer is deposited on the
peripheral region PR of the substrate 110 by electroless plating.
Electroless plating means that the metal ions in the plating
solution are catalyzed and reduced to metal, and then plated on
surfaces, in which the metal ions are catalyzed by the metal
catalyst with the help of a suitable reducing agent without
external current. This process is called electroless plating, or
also called chemical plating or autocatalytic plating. Therefore,
the metal layer ML of the embodiment can be called electroless
plating, electroless plating, or autocatalytic plating.
Specifically, for example, copper sulfate can be used for the main
component of the plating solution. The plating solution's
composition can be, but is not limited to, copper sulfate with a
concentration of 5 g/L, ethylenediaminetetraacetic acid with a
concentration of 12 g/L, or formaldehyde with a concentration of 5
g/L. The pH of the electroless copper plating solution is adjusted
to about 11 to 13 with sodium hydroxide, the bath temperature is
about 50 to 70.degree. C., and the reaction time of immersion is
about 1 to 5 minutes. In one example, a catalytic layer (not shown)
can be formed on the peripheral region PR of the substrate 110
first. Since there is no catalytic layer in the display region DR,
the copper layer is only deposited on the peripheral region PR and
not formed on the display region DR. During the electroless plating
reaction, the copper material can nucleate on the catalytic layer
with catalytic/activation ability, and then the copper material
continues to grow the copper film by the self-catalysis of
copper.
[0097] The metal layer ML can be selectively formed in the
peripheral region PR instead of the display region DR.
Alternatively, the metal layer ML can be formed in the peripheral
region PR and the display region DR first, and then the metal layer
ML in the display region DR is removed by etching and other
steps.
[0098] In one example, the bottom coating 160a can be provided on
the substrate 110. The bottom coating 160a can be used to adjust
the surface characteristics of the substrate 110 to facilitate the
subsequent coating process of the metal nanowires NW and also to
improve the adhesion between the metal nanowires NW and the
substrate 110. The step of disposing the bottom coating 160a can be
performed before or after the metal layer ML is manufactured.
[0099] Next, please refer to FIG. 11B. It includes at least the
metal nanowire layer NWL of metal nanowires NW, such as silver
nanowire(s) layer, gold nanowire(s) layer, or copper nanowire(s)
layer, coated in the peripheral region PR and the display region
DR. The first part of the metal nanowire layer NWL is located in
the display region DR. The first part is mainly formed on the
substrate 110, and the second part in the peripheral region PR is
mainly formed on the metal layer ML. The specific method in the
example is as follows. A dispersion or ink with metal nanowires is
formed on the substrate 110 by a coating method, and the metal
nanowires are dried to cover the surfaces of the substrate 110 and
the aforementioned metal layer ML, thereby forming the metal
nanowire layer NWL on the substrate 110 and the aforementioned
metal layer ML. After the above curing/drying step, the solvent and
other substances are volatilized, and the metal nanowires NW are
randomly distributed on the surfaces of the substrate 110 and the
aforementioned metal layer ML. Preferably, the metal nanowires NW
will be fixed on the surfaces of the substrate 110 and the
aforementioned metal layer ML without falling off to form the metal
nanowire layer NWL. The metal nanowires NW can contact each other
to provide a continuous current path, thereby forming a conductive
network that makes the metal nanowire layer NWL form a conductive
layer.
[0100] In the example of the present disclosure, the
above-mentioned dispersion liquid can be water, alcohol, ketone,
ether, hydrocarbon, or aromatic solvent (benzene, toluene, xylene,
etc.). The above-mentioned dispersion liquid can also include
additives, surfactants, or adhesives, such as carboxymethyl
cellulose (CMC), 2-hydroxyethyl cellulose (HEC), hydroxypropyl
methylcellulose (HPMC), sulfonate, and sulfate, disulfonate,
sulfosuccinate, phosphate or fluorine-containing interfacial
surfactant, etc. The dispersion or slurry including metal nanowires
NW can be molded on the surface of substrate 110 and the
aforementioned metal layer ML in any manner. For example, but not
limitation, a screen printing, a nozzle coating, a roller coating,
etc. In one example, a roll-to-roll (RTR) process can be used to
coat the dispersion or slurry including metal nanowires on the
continuously supplied substrate 110 and the surface of the
aforementioned metal layer ML.
[0101] In addition, the first/second top coating 160c, 160d can be
disposed on the metal nanowire layer NWL (FIG. 11B only shows the
first top coating 160c). The first/second top coating 160c, 160d
can form a composite structure with the metal nanowire layer NWL
and has certain specific chemical, mechanical, and optical
properties. For example, the adhesion or better physical-mechanical
strength of the metal nanowire layer NWL and the substrate 110 is
provided, so the first/second top coatings 160c, 160d can also be
called a matrix layer. The composite structure can be regarded as a
conductor, which can be used to make electrodes transmit electrical
signals. On the other hand, some specific polymers are used to make
the first/second top coatings 160c, 160d, so that the touch sensing
electrode TE made of metal nanowire layer NWL or other electrodes
have additional surface protection against scratches and abrasion.
In this case, the first/second top coatings 160c, 160d can also be
called the external coating. For example, polyacrylate, epoxy
resin, polyurethane, polysilane, polysiloxane,
poly(silicon-acrylic), etc. is used to make the touch sensing
electrode TE have a higher surface strength to improve scratch
resistance. However, the above is only to illustrate the
possibility of other additional functions/names of the top coatings
160c, 160d, and is not intended to limit the present disclosure. It
is worth noting that, in the drawings of the present disclosure,
the first/second top coatings 160c, 160d and metal nanowire layer
NWL are drawn as different layer structures, but in one example,
the polymer/polymeric material used to make the first/second top
coatings 160c, 160d can penetrate into metal nanowires NW to form
the filler before being cured or in a pre-cured state. When the
polymer is cured, the metal nanowires NW would be embedded in the
first/second top coatings 160c, 160d. That is, the present
disclosure does not limit the structure between the first/second
top coatings 160c, 160d and the metal nanowire layer NWL (for
example, the touch sensing electrode TE).
[0102] Then a patterning process is performed, as shown in FIG.
11C. A patterned layer PL can be formed on the metal nanowire layer
NWL. In one example, the patterned layer PL uses flexography
technology to directly form a patterned structure on the metal
nanowire layer NWL. In one example, after the material to be
printed is printed on the metal nanowire layer NWL, a curing step
can be performed according to the characteristics of the material.
In one example, the patterned layer PL uses a relief printing, a
gravure printing, or a screen printing to transfer the material to
be printed to the metal nanowire layer NWL according to a specific
pattern. In one example, after coating the photoresist, the
patterned layer PL can be formed by a photolithography process.
[0103] The patterned layer PL can be formed in the peripheral
region PR according to the aforementioned method, and can also be
formed in the peripheral region PR and the display region DR. The
patterned layer PL (also referred to as the second patterned layer)
located in the peripheral region PR is mainly used as an etching
mask for the peripheral region PR in order to pattern the metal
nanowire layer NWL and metal layer ML of the peripheral region PR
in the following steps. The patterned layer PL (also referred to as
the first patterned layer) located in the display region DR is
mainly used as an etching mask for the display region DR in order
to pattern the metal nanowire layer NWL of the display region DR in
the following steps.
[0104] The example of the present disclosure does not limit the
material of the patterned layer PL (i.e., the aforementioned
material to be printed). For example, polymer materials include the
following: various photoresist materials, bottom coating materials,
outer coating materials, protective layer materials, insulating
layer materials, etc. The polymer material can be phenolic resin,
epoxy resin, acrylic resin, PU resin, ABS resin, amino resin,
silicone resin, etc. In terms of material properties, the material
of the patterned layer PL can be photocurable material or thermal
curing material. In one example, the material of the patterned
layer PL has a viscosity of about 200 to 1500 cps and a solid
content of about 30 to 100 wt. %.
[0105] Then, the pattern of the patterned layer PL is transferred
to the aforementioned metal nanowire layer NWL, metal layer ML,
bottom coating 160a, first/second top coatings 160c, 160d and other
structural layers, and the barrier layer 191 is disposed to cover
the side of the aforementioned structural layer. FIGS. 12 to 12B
show an electrode structure manufactured by the method of the
present example, for example, a sensing electrode for sensing touch
signals.
[0106] In one example, the patterning includes using an etching
solution that can simultaneously etch multiple functional
layers/structural layers (such as the metal nanowire layer NWL and
the metal layer ML) in the peripheral region PR. The etching mask
formed in conjunction with the patterned layer PL (also called the
second patterned layer) is used to produce the patterned metal
layer ML and the patterned metal nanowire layer NWL in the same
process. As shown in FIG. 12 and FIG. 12B, the patterned metal
layer ML produced in the peripheral region PR is the peripheral
wire 180, and the patterned metal nanowire layer NWL is the etching
layer. Because the etching layer of the example is located on the
peripheral wire 180, it can also be called a first covering C1. In
other words, after the patterning step, the peripheral region PR
has the first covering C1 formed by the second part of the metal
nanowire layer NWL and the peripheral wires formed by the metal
layer ML. The two layers are stacked to form a signal transmission
path for the peripheral region PR. As mentioned above, the first
top coating 160c can form a composite conductive layer with the
metal nanowire layer NWL, and the composite conductive layer forms
electrical conduction with the peripheral wire 180 formed by the
metal layer ML to transmit signals. In another example, an etching
layer including the second part of the metal nanowire layer NWL and
the peripheral wire 180 including the metal layer ML and the mark
ALM can be manufactured in the peripheral region PR (please refer
to FIG. 12). The etching layer can include the first covering C1
and a second covering C2. The first covering C1 is disposed on the
corresponding peripheral wire 180, and the second C2 is disposed on
a corresponding mark ALM. In one example, the metal nanowire layer
NWL and the metal layer ML can be etched at the same time means
that the etching rate ratio of the metal nanowire layer NWL to the
metal layer ML is about 0.1 to 10 or 0.01 to 100.
[0107] According to a specific example, if the metal nanowire layer
NWL is a silver nanowire layer and the metal layer ML is a copper
layer, the etching solution can be used to etch copper and silver.
For example, the main component of the etching solution is
H.sub.3PO.sub.4 (the ratio is about 55 vol. % to 70 vol. %) and
HNO.sub.3 (the ratio is about 5 vol. % to 15 vol. %) to remove the
copper and silver materials in the same process. In another
specific example, additives can be added to the main component of
the etching solution, such as an etching selection ratio adjuster,
to adjust the rate of etching copper and silver. For example, about
5% to 10% benzotriazole (BTA) is added to the main component of
H.sub.3PO.sub.4 (the ratio is about 55 vol. % to 70 vol. %) and
HNO.sub.3 (the ratio is about 5 vol. % to 15 vol. %) to solve the
problem of copper over-etching. In another specific example, the
main component of the etching solution is ferric chloride/nitric
acid or phosphoric acid/hydrogen peroxide.
[0108] In one example, the metal nanowire layer NWL located in the
display region DR and the peripheral region PR can be patterned by
different etching steps (that is, using different etching
solutions). For example, the metal nanowire layer NWL is a nano
silver layer. If the metal layer ML is a copper layer, the etching
solution used in the display region DR can be an etching solution
that can only etch silver. In other words, the etching rate of
silver by the etching solution is about 100 times, about 1000
times, or about 10000 times greater than that of copper.
[0109] The barrier layer 191 can be coated after or before the
patterning step to cover the side of the aforementioned structural
layer (such as the bottom coating 160a, the first top coating 160c,
the first covering C1, or the peripheral wire 180, etc.). As
described above, the barrier layer 191 can slow down the attack of
water vapor/moisture in the environment on the electrode. The
method of disposing the barrier layer 191 can directly coat the
material with lower water absorption on the side of the
aforementioned structural layer. Alternatively, the optically clear
adhesive (OCA) with lower water absorption can be coated on the
front and side of the aforementioned structural layer to form an
L-shaped structure (please refer to the cross-sectional view shown
in FIG. 12A). One arm of the L-shaped structure can be used as the
adhesive layer 190 to fit the display device 150 (please refer to
FIG. 8), and the other arm of the L-shaped structure can be used as
the barrier layer 191 to slow down the attack of water
vapor/moisture in the environment on the electrode. In one
embodiment, the touch panel 1000 can be assembled by using the
adhesive layer 190 and an optical film, such as a polarizer,
etc.
[0110] Accordingly, the touch panel 1000 as shown in FIG. 12 can be
produced. To keep the diagram concise, the barrier layer 191 is not
drawn in FIG. 12.
[0111] FIG. 12 shows a schematic top view of the touch panel 1000
according to an embodiment of the present disclosure. FIG. 12A and
FIG. 12B are cross-sectional views taken along the lines A-A and
B-B of FIG. 6, respectively. Please refer to FIG. 12A first. As
shown in FIG. 12A, the peripheral wire 180 is disposed in the
peripheral region PR. The first covering C1 is formed and covers
the upper surface of the peripheral wire 180. The barrier layer 191
is disposed in the peripheral region PR and covers the sides of the
bottom coating 160a, the first top coating 160c, the first covering
C1, or the peripheral wire 180. The adhesive layer 190 covers the
first top coating 160c. In some embodiments of the present
disclosure, the metal nanowires NW can be silver nanowires, and the
barrier layer 191 is disposed in the peripheral region PR and
covers at least one side of the outermost peripheral wire 180, such
as the outer side (that is, a side far from the display region DR).
Specifically, the barrier layer 191 would cover the outer side
(that is, the moisture intrusion interface) of the bottom coating
160a, the first top coating 160c, etc. in the outermost peripheral
wire 180 to prevent water vapor/moisture from entering the touch
panel 1000 along the path formed by the bottom coating 160a and the
first top coating 160c.
[0112] The touch panel 1000 includes the substrate 110, the
peripheral wire 180, the first covering C1, and the touch sensing
electrode TE. Refer to FIG. 12, the substrate 110 has the display
region DR and the peripheral region PR. The peripheral region PR is
disposed on the side of the display region DR. For example, the
peripheral region PR can be disposed around the display region DR
(that is, covering the right, left, upper, and lower sides). But in
other examples, the peripheral region PR can be an L-shaped region
disposed on the left and lower sides of the display region DR. As
shown in FIG. 12, the present example has a total of eight sets of
peripheral wires 180 and the first covering C1 corresponding to the
peripheral wires 180 are disposed in the peripheral region PR of
the substrate 110. The touch sensing electrode TE is roughly
disposed in the display region DR of the substrate 110.
[0113] By placing the first covering C1 on the upper surface of the
peripheral wire 180, the first covering C1 and the peripheral wire
180 can be formed in a predetermined position without the need for
alignment of the upper and lower layers of materials, so that
alignment bit error area can be reduced or avoided in the
manufacturing process. In this way, the width of the peripheral
region PR can be reduced, thereby achieving the narrow bezel
requirement of displays.
[0114] The touch panel 1000 further includes the mark ALM and the
second covering C2. In this example, two sets of mark ALM and the
second covering C2 corresponding to the mark ALM are disposed in
the peripheral region PR of the substrate 110. The number of the
above-mentioned peripheral wires 180, marks ALM, first coverings
C1, second coverings C2, and touch sensing electrodes TE can be one
or more, and the numbers drawn in the following specific
embodiments and drawings are for illustrative purposes only, and
not intended to limit the present disclosure.
[0115] In the present example, the mark ALM is disposed in the
bonding area BA of the peripheral region PR (as shown in FIG. 12).
The mark ALM is the docking bit mark, in which, in the step of
connecting an external circuit board, such as the flexible circuit
board to the touch panel 1000 (that is, the bonding step), the mark
ALM is used to mark the position of the flexible circuit board and
the touch panel 1000. The mark ALM can be produced by the metal
layer ML through an etching process. In terms of structure, the
mark ALM has the second covering C2 made of metal nanowires.
However, the present disclosure does not limit the position or
function of the mark ALM. For example, the mark ALM can be any
check mark, pattern, or label required in the manufacturing
process, which is within the scope of protection of the present
disclosure. The mark ALM can have any possible shape, such as a
circle, a quadrilateral, a cross, an L-shape, a T-shape, and so on.
In some embodiments of the present disclosure, the barrier layer
191 is disposed in the peripheral region PR and covers at least one
side of the mark ALM, such as the outer side (that is, a side far
from the display region DR). Specifically, the barrier layer 191
can cover the outer side of the bottom coating 160a, the first top
coating 160c, etc. in the mark ALM to prevent moisture
vapor/moisture from intruding into the interior of the touch panel
1000 along the path formed by the bottom coating 160a, the first
top coating 160c, etc.
[0116] As shown in FIG. 12B, in the peripheral region PR, there is
a non-conductive area 136 between adjacent peripheral wires (that
is, the combination of the peripheral wire 180 and the first
covering C1) to electrically block the adjacent peripheral wires to
avoid short circuits. In this example, the non-conductive area 136
is a gap to isolate adjacent peripheral wires. The aforementioned
gap can be made by etching, so the side of the peripheral wire 180
and the side of the first covering C1 are a common etching surface
and are aligned with each other. That is to say, using the printed
side of the patterned layer PL as a reference, the side of the
peripheral wire 180 and the side of the first covering C1 are
formed in the same etching step according to the printed side of
the patterned layer PL. Therefore the printed side and the common
etching surface are aligned with each other. Similarly, the side of
the mark ALM and the side of the second covering C2 are a common
etching surface and are aligned with each other, and the printed
side of the patterned layer PL is also aligned with the common
etching surface. In one embodiment, the peripheral wire 180 and the
first covering C1 would have the same or similar patterns and
dimensions, such as long and straight patterns, and the same or
similar width. The mark ALM and the second covering C2 also have
the same or similar patterns and dimensions, such as circles with
the same or similar radii, quadrilaterals with the same or similar
side lengths, the same or similar crosses, L-shaped, T-shaped, and
other patterns. In the present example, the non-conductive area 136
is filled with the aforementioned low water absorption material,
for example, an optically clear adhesive (OCA) with low water
absorption can be filled in the non-conductive area 136.
[0117] Similarly, in the display region DR, there is the
non-conductive area 136 between the adjacent touch sensing
electrodes TE to electrically block the adjacent touch sensing
electrodes TE to avoid short circuits. In other words, there is the
non-conductive area 136 between the sidewalls of the adjacent touch
sensing electrodes TE. In this example, the non-conductive area 136
is a gap to isolate the adjacent touch sensing electrodes TE. In
one example, the above-mentioned etching method can be used to form
the gap between the adjacent touch sensing electrodes TE. In the
present example, the touch sensing electrode TE and the first
covering C1 can be made by using the same layer of metal nanowire
layer NWL (such as a silver nanowire layer). Therefore, at the
junction of the display region DR and the peripheral region PR, the
metal nanowire layer NWL would form a climbing structure to
facilitate the formation of the metal nanowire layer NWL and cover
the upper surface of the peripheral wire 180, thereby forming the
first covering C1. In one embodiment, the non-conductive area 136
includes the aforementioned gap and the non-conductive material
(such as the aforementioned coating 160 material) filled
therein.
[0118] In the present embodiment, the touch sensing electrode TE is
disposed in a non-staggered arrangement. For example, the touch
sensing electrode TE is an elongated electrode extending along the
first direction D1 and having a width in the second direction D2,
and the touch sensing electrodes TE do not intersect each other.
However, in other embodiments, the touch sensing electrode TE can
have an appropriate shape, which should not limit the scope of the
present disclosure. In the present embodiment, the touch sensing
electrode TE adopts a single-layer configuration, in which the
touch position can be obtained by detecting the change in the
capacitance value of each touch sensing electrode TE. In another
embodiment, the touch sensing electrode TE is an elongated
electrode extending along the first direction D1 and having the
same width in the second direction D2, and the touch sensing
electrodes TE do not cross each other.
[0119] In some embodiments of the present disclosure, the first
covering C1 of the touch panel 1000 is disposed on the upper
surface of the peripheral wire 180, and the first covering C1 and
the peripheral wire 180 are formed in the same etching process.
Therefore, it is possible to reduce or avoid the need for setting
the alignment bit error area in the process. In this way, the width
of the peripheral region PR can be reduced, thereby meeting the
narrow bezel requirement of the display. Specifically, in some
embodiments of the present disclosure, the width of the peripheral
wire 180 of the touch panel 1000 is about 5 .mu.m to 30 .mu.m, and
the distance between the adjacent peripheral wires 180 is about 5
.mu.m to 30 .mu.m. Or, the width of the peripheral wire 180 of the
touch panel 1000 is about 3 .mu.m to 20 .mu.m, and the distance
between the adjacent peripheral wires 180 is about 3 .mu.m to 20
.mu.m. The width of the peripheral region PR can also reach a size
of less than 2 mm, in which the border size is reduced by about 20%
or more compared to traditional touch panel products.
[0120] In some embodiments of the present disclosure, the touch
panel 1000 further has the second covering C2 and the mark ALM. The
second covering C2 is disposed on the upper surface of the mark
ALM, and the second covering C2 and mark ALM are formed in the same
etching process.
[0121] FIG. 13 shows another embodiment of the touch panel 1000 of
the present disclosure. Compared with FIG. 12A, the present
embodiment includes at least the second top coating 160d, and the
second top coating 160d is disposed on the first top coating 160c.
For the description of the second top coating 160d, please refer to
the foregoing content, which will not be repeated here.
[0122] The touch panel in another embodiment of the present
disclosure can be manufactured in the following manner. First, the
substrate 110 is provided, which has the predefined peripheral
region PR and the predefined display region DR. Next, the metal
nanowire layer NWL is formed on the peripheral region PR and the
display region DR. Then a metal layer ML is formed on the
peripheral region PR. Then a patterned layer PL is formed on the
metal nanowire layer NWL. Then, patterning is performed according
to the patterned layer PL to form the patterned metal layer ML and
the metal nanowire layer NWL, and the barrier layer 191 is disposed
to cover the side of the aforementioned structure layer. The
difference between the present example and the previous example is
at least in the forming sequence of the metal layer ML and the
metal nanowire layer NWL. In other words, this example firstly
produces the metal nanowire layer NWL, and then produces the metal
layer ML. As such, the peripheral wire 180/mark ALM is formed on
the metal nanowire NW. The metal nanowire layer NWL is patterned to
form a second interlayer M2/first interlayer M1 (as shown in FIG.
14). For the specific details of this step and other related
descriptions, for example, the steps of forming the barrier layer
191, please refer to the foregoing content.
[0123] Please refer to FIG. 14, which shows the touch panel 1000
completed in the above examples. The barrier layer 191 is disposed
on the moisture intrusion interface (that is, the side of the first
top coating 160c/bottom coating 160a/second top coating 160d (not
shown)). The barrier layer 191 can avoid the exposure of the
moisture intrusion interface and achieve the effect of extending
the path of moisture intrusion. Therefore, the purpose of
protecting the touch panel 1000, especially to slow down the water
vapor/moisture from attacking the electrode, can be achieved. The
detailed description of the structure of this example can refer to
the foregoing content.
[0124] The present disclosure can also apply the above method to
the double-sided substrate 110 to produce a double-sided touch
panel 1000 (as shown in FIG. 15). For example, the double-sided
touch panel 1000 can be produced in the following manner. First,
the substrate 110 is provided, which has the predefined peripheral
region PR and the predefined display region DR. Next, the metal
layers ML is formed on the opposite first and second surfaces of
the substrate 110 (such as the upper surface and the lower
surface), and the metal layers ML is located in the peripheral
region PR. Then, the metal nanowire layers NWL are formed in the
peripheral regions PR of the first and second surfaces and display
region DR, respectively. Then, the patterned layers PL are formed
on metal nanowire layer NWL of the first and second surfaces,
respectively. Then, the first and second surfaces are patterned
according to the patterned layer PL to form the touch sensing
electrode TE and the peripheral wire 180 on the first and second
surfaces, respectively, and the first covering C1 would cover the
peripheral wire 180. Then, the barrier layer 191 is disposed to
cover the side of the aforementioned structural layer. In this
step, the patterned layer PL can be formed by using a flexographic
printing process to form the patterned layers PL on the metal
nanowire layer NWL of the first and second surfaces, respectively.
Since the present example does not need to go through the
photolithography process (exposure and development, etc.), there is
no problem of mutual influence/interference between the
double-sided process, which is beneficial to simplify the process
and improve the yield. For the specific embodiment of this example,
for example, the step of setting the first top coating 160c/bottom
coating 160a/second top coating 160d, please refer to the foregoing
content, which will not be repeated herein. In one example, the
photolithography process (exposure and development, etc.) can also
be used with a light-shielding layer (not shown) to prevent the
mutual influence/interference of the double-sided photolithography
process.
[0125] FIG. 15 is the double-sided touch panel 1000 according to
the example of the present disclosure. It includes the substrate
110 and the touch sensing electrode TE formed on the upper and
lower surfaces of the substrate 110 (that is, the first touch
sensing electrode TE1 and second touch sensing electrode TE2 formed
by the metal nanowire layer NWL) and the peripheral wire 180 formed
on the upper and lower surfaces of the substrate 110. For the sake
of simplicity, the barrier layer 191, the first top coating 160c,
the bottom coating 160a, etc. are not shown in FIG. 15. Viewing
from the upper surface of the substrate 110, the first touch
sensing electrode TE1 of the display region DR and the peripheral
wire 180 of the peripheral region PR are electrically connected to
each other to transmit signals. Similarly, viewing from the lower
surface of the substrate 110, the second touch sensing electrode
TE2 of the display region DR and the peripheral wire 180 of the
peripheral region PR are electrically connected to each other to
transmit signals. In addition, as in the previous embodiment, the
barrier layer 191 is disposed in the peripheral region PR and
covers at least one side of the outermost peripheral wire 180, such
as the outer side (that is, a side far from the display region DR).
Specifically, the barrier layer 191 covers the bottom coating 160a,
the first top coating 160c, etc. in the outermost peripheral wire
180 to prevent water vapor/moisture from invading inside the touch
panel 1000 along the path formed by the bottom coating 160a and the
first top coating 160c/second top coating 160d. Please refer to the
previous content for details.
[0126] Please refer to FIG. 15, the first touch sensing electrode
TE1 is roughly located in the display region DR, which can include
a plurality of long and straight sensing electrodes extending in
the same direction (such as the first direction D1), and the
etching removal area can be defined as the non-conductive area 136,
which electrically blocks adjacent sensing electrodes. Similarly,
the second touch sensing electrode TE2 is roughly located in the
display region DR, which can include a number of long and straight
sensing electrodes extending in the same direction (such as the
second direction D2), and the etching removal area can be defined
as the non-conductive area 136, which electrically blocks adjacent
sensing electrodes. The first touch sensing electrode TE1 and the
second touch sensing electrode TE2 are interlaced in the structure,
and the first touch sensing electrode TE1 and the second touch
sensing electrode TE2 can form the touch sensing electrode TE. The
first touch sensing electrode TE1 and the second touch sensing
electrode TE2 can be used to transmit control signals and receive
touch sensing signals, respectively. As such, the touch position
can be obtained by detecting the signal change (for example,
capacitance change) between the first touch sensing electrode TE1
and the second touch sensing electrode TE2. With this
configuration, the user can perform touch sensing at each point on
the substrate 110.
[0127] In one example, the optically clear adhesive (OCA) can be
coated on the upper or lower surface of the substrate 110 to form
the aforementioned barrier layer 191 and the adhesive layer 190.
The touch panel 1000 can be assembled by using the adhesive layer
190 and the display device 150 to form a display with touch
function. In one embodiment, the optically clear adhesive (OCA) can
be coated on the upper or lower surface of the substrate 110 to
form the aforementioned barrier layer 191 and the adhesive layer
190, and the touch panel 1000 can be bonded assembly by the
adhesive layer 190 and the polarizing plate.
[0128] In one example, the first optically clear adhesive (OCA) can
be coated on the upper surface of the substrate 110 to form the
barrier layer 191 and the first adhesive layer, and the touch panel
1000 can be assembled by using the first adhesive layer and the
display device 150 to form a display with touch function (i.e.,
touch display module). The barrier layer 191 is disposed in the
peripheral region PR and covers at least one side of the outermost
peripheral wire 180 on the upper surface of the substrate 110, such
as the outer side (i.e., a side far from the display region DR).
Specifically, the barrier layer 191 would cover the bottom coating
160a, the first top coating 160c/second top coating 160d, etc. of
the outermost peripheral wire 180 to prevent water vapor/moisture
from invading the first touch sensing electrode TE1 along the path
formed by the bottom coating 160a and the first top coating
160c/second top coating 160d. Please refer to the previous content
for details. Similarly, the second optically clear adhesive (OCA)
can be coated on the lower surface of the substrate 110 to form a
second barrier layer and a second adhesive layer. The touch panel
1000 can be assembled by using the second adhesive layer and an
outer cover or a polarizing plate, etc. The second barrier layer is
disposed on the peripheral region PR and covers at least one side
of the outermost peripheral wire 180 on the bottom surface of the
substrate 110, such as the outer side (i.e., a side far from the
display region DR). Specifically, the second barrier layer would
cover the outer side of the bottom coating 160a, the first top
coating 160c/second top coating 160d, etc. in the outermost
peripheral wire 180 to prevent water vapor/moisture from invading
the second touch sensing electrode TE2 along the path formed by the
bottom coating 160a, the first top coating 160c/second top coating
160d, etc.
[0129] The double-sided touch panel 1000 in the embodiment of the
present disclosure can also be manufactured in the following
manner. First, the substrate 110 is provided, which has the
predefined peripheral region PR and the predefined display region
DR. Next, the metal nanowire layer NWL is formed on the opposite
first and second surfaces of the substrate 110 (such as the upper
surface and the lower surface) in the peripheral region PR and the
display region DR of the first and second surfaces, respectively.
Then, the metal layer ML is formed, and the metal layer ML is
located in the peripheral region PR. Then, the patterned layer PL
is formed on the metal nanowire layer NWL and metal layer ML on the
first and second surfaces, respectively. Then, the first and second
surfaces are patterned according to the patterned layer PL to form
the first touch electrode TE1, the second touch electrode TE2, and
the peripheral wire 180 on the first and second surfaces, and the
peripheral wire 180 would cover the first interlayer M1. The
embodiment of the present disclosure can further include steps of
setting the first top coating 160c/bottom coating 160a/second top
coating 160d, etc. Please refer to the foregoing content for
details, which will not be repeated herein.
[0130] Similar to the foregoing example, any surface (such as the
upper surface or the lower surface) of the substrate 110 can
further include the mark ALM and the second interlayer M2/second
covering layer C2. The side of the mark ALM can also be covered by
the barrier layer 191 to prevent water vapor/moisture from invading
the touch panel 1000 along the path formed by the bottom coating
160a, the first top coating 160c, and the second top coating
160d.
[0131] FIG. 16 is a schematic top view of a touch panel 1000
according to some embodiments of the present disclosure. This
embodiment is similar to the previous embodiments. The main
difference is described in the following. In this embodiment, the
touch panel 1000 further includes a shielding lead SL disposed in
the peripheral region PR. The shielding lead SL mainly surrounds
the touch sensing electrode TE and the peripheral wire 180. The
shielding lead SL extends to the bonding area BA and is
electrically connected to the ground terminal of the flexible
circuit board, so the shielding lead SL can shield or eliminate
signal interference or can provide electrostatic discharge (ESD)
protection, especially for small current changes caused by human
hands touching the connecting wires around the touch device. For
the sake of simplicity, FIG. 16 does not show the barrier layer
191, the first top coating 160c, the bottom coating 160a, and so
on.
[0132] According to the aforementioned manufacturing method, the
shielding lead SL and the peripheral wire 180 can be made of the
same layer of metal layer ML (that is, both are made of the same
metal material, such as the aforementioned electroless copper
layer), on which the metal nanowire layer NWL is stacked (or the
third covering layer); or the shielding lead SL is on the metal
nanowire layer NWL (or the third intermediate layer). In addition,
the shielding lead SL is closer to the external environment than
the peripheral wire 180, so a side of the shielding lead SL can be
covered by the barrier layer 191 to prevent water vapor/moisture
from invading the touch panel 1000 along the path formed by the
bottom coating 160a, the first top coating 160c, and the second top
coating 160d in shielding lead SL. In this example, the side of the
peripheral wire 180 can have the barrier layer 191 or no barrier
layer 191.
[0133] FIG. 17 shows another embodiment of the single-sided touch
panel 1000 of the present disclosure, which is a single-sided
bridge touch panel. The difference between this example and the
above examples is at least the following. The transparent
conductive layer (i.e., the metal nanowire layer NWL) formed on the
substrate 110 forms the touch sensing electrode TE after the above
patterning step. The touch sensing electrode TE can include the
first touch sensing electrode TE1 arranged along the first
direction D1, the second touch sensing electrode TE2 arranged along
the second direction D2, and the connecting electrode CE
electrically connecting two adjacent first touch sensing electrodes
TE1. In other words, the first touch sensing electrode TE1, the
second touch sensing electrode TE2, and the connecting electrode CE
are made of metal nanowires. In addition, an insulating block 164
(for example, a middle coating 760b) can be disposed on the
connecting electrode CE, for example, the insulating block 164 is
formed of silicon dioxide. The bridging wire 720 is then disposed
on the insulating block 164. For example, the bridging wire 720 is
formed of copper, ITO, metal nanowires, or other materials, and the
bridging wire 720 is connected to two adjacent second touch sensing
electrodes TE2 in the second direction D2. The insulating block 164
is located between the connecting electrode CE and the bridging
wire 720 to electrically isolate the connecting electrode CE and
the bridging wire 720, so that the first touch sensing electrodes
TE1 in the first direction D1 and the second touch sensing
electrode TE2 in the second direction D2 are electrically isolated
from each other.
[0134] Alternatively, the example of the single-sided bridge touch
panel 1000 of the present disclosure can be fabricated in the
following manner. The bridging wire 720 is formed on the substrate
110. The insulating block 164 is formed on the bridging wire 720.
The transparent conductive layer (i.e., the metal nanowire layer
NWL) formed on the substrate 110 forms the touch sensing electrode
TE after the abovementioned patterning step. The touch sensing
electrode TE can include the first touch sensing electrode TE1
arranged along the first direction D1, the second touch sensing
electrode TE2 arranged along the second direction D2, and the
connecting electrode CE that electrically connects two adjacent
first touch sensing electrodes TE1. The connecting electrode CE
corresponds to the insulating block 164.
[0135] In FIG. 17A, it can be seen that the optically clear
adhesive (OCA) constitutes the structure where a barrier layer 791
covers the side of each structural layer, so the effect is the same
as the aforementioned description. For the specific embodiment of
the present example, for example, the steps of setting the first
top coating 760c/bottom coating 760a/second top coating 760d can
refer to the foregoing content, and will not be repeated herein. In
addition, referring to the previous content, the optically clear
adhesive (OCA) is formed on the upper surface of the substrate 110,
and then the aforementioned barrier layer 791 and the
aforementioned adhesive layer 790 are formed. The touch panel 1000
can be assembled with an adhesive layer 790 and other optical
films, such as the display device 750 or a polarizer. The barrier
layer 791 is disposed in the peripheral region PR and covers the
outer side of the bottom coating 760a, the first top coating 760c,
etc. in the outermost peripheral wire 180 of the substrate 110 to
prevent water vapor/moisture from entering the electrode along the
path formed by the bottom coating 760a and the first top coating
760c.
[0136] Please refer to FIG. 17A, which is a schematic side view of
a touch display module 700 according to an embodiment of the
present disclosure. At least one difference between the touch
display module 700 in FIG. 17A and the touch display module 100 in
FIG. 1 is described in the following. The touch display module 700
in FIG. 17A does not have a moisture barrier layer 140, and the
adhesive layer 790 formed by the optically clear adhesive directly
extends laterally on the topmost second top coating 760d and covers
the topmost second top coating 760d. In addition, the adhesive
layer 790 can further extend along a sidewall 761d of the topmost
second top coating 760d to an inner surface 771 of the light
shielding layer 770, to form the barrier layer 791 to cover a
sidewall 761c of the topmost second top coating 760d. Specifically,
it is possible to adjust the dielectric constant value, saturated
water absorption, and/or water vapor permeability of the adhesive
layer 790/barrier layer 791 (i.e., the optically clear adhesive) of
the present disclosure and/or the structural characteristics (such
as thickness H3) of the adhesive layer 790/barrier layer 791 to
achieve the above effects. In the following description, a more
detailed description will be given.
[0137] In some embodiments, the adhesive layer 790 can include an
insulating adhesive material such as rubber, acrylic, or polyester.
In some embodiments, the dielectric constant value of the adhesive
layer 790 can be between 2.0 and 5.0. In some embodiments, the
dielectric constant value of the adhesive layer 790 can be between
2.24 and 4.30. Because the metal ions (for example, silver ions)
generated by the metal nanowires NW in the second conductive layer
730 (for example, the first touch sensing electrode TE1 or the
connecting electrode CE) migrate into the adhesive layer 790, the
dielectric constant value of the adhesive layer 790 can affect the
migration rate of the metal ions. Therefore, by choosing a material
with a dielectric constant value between 2.24 and 4.30 to make the
adhesive layer 790, the mobility of metal ions in the adhesive
layer 790 can be reduced, thereby reducing the possibility of
electromigration of the metal nanowires NW. In detail, if the
dielectric constant value of the adhesive layer 790 is less than
2.24, the metal nanowires NW may have a greater tendency to migrate
to the adhesive layer 790, which greatly increases the possibility
of electromigration of the metal nanowires NW.
[0138] In some embodiments, the saturated water absorption of the
optically clear adhesive (i.e., the adhesive layer 790/barrier
layer 791) can be between 0.08 wt. % and 0.40 wt. %. The saturated
water absorption of the adhesive layer 790 can affect the rate at
which the adhesive layer 790 absorbs the moisture in the
environment. Therefore, by choosing a material with saturated water
absorption between 0.08 wt. % and 0.40 wt. % to make the adhesive
layer 790, the rate at which the water vapor in the environment
enters the adhesive layer 790 can be effectively reduced to avoid
or slow down the water vapor in the environment from invading and
attacking the electrode, thereby reducing the possibility of
electromigration of metal nanowires NW. In detail, if the saturated
water absorption of the adhesive layer 790 is greater than 0.40 wt.
%, it may cause the optically clear adhesive (i.e., the adhesive
layer 790/barrier layer 791) to absorb too much moisture in the
environment. This makes the metal nanowires to be in a state which
tends to result in electromigration, resulting in failure of the
component. In some embodiments, the saturated water absorption of
the adhesive layer 790 can be measured by, for example, immersing
the dried adhesive layer 790 in water after weighing and taking out
the adhesive layer 790 for weighing every 24 hours. The above steps
can be repeated until the weight of the adhesive layer 190 does not
change anymore, and the water absorption rate of the adhesive layer
790 at this time is the saturated water absorption.
[0139] In some embodiments, the water vapor permeability of the
optically clear adhesive (i.e., the adhesive layer 790/barrier
layer 791) can be between 10 g/(m.sup.2*day) and 5000
g/(m.sup.2*day). The water vapor permeability of the adhesive layer
790 can affect the rate that moisture in the environment passes
through the adhesive layer 790. In one embodiment, the adhesive
layer 790 is made by choosing the material with water vapor
permeability between 37 g/(m.sup.2*day) and 1650 g/(m.sup.2*day),
and the rate of moisture in the environment is reduced through the
adhesive layer 790. This effectively avoids or slows down the
invasion of water vapor in the environment and attack on the
electrode, thereby reducing the possibility of electromigration of
metal nanowires. In particular, if the water vapor permeability of
the barrier layer 791 is greater than 1650 g/(m.sup.2*day), it may
cause the water vapor in the environment to pass through the
barrier layer 791 too quickly. The water vapor may easily enter the
aforementioned moisture intrusion interface, causing the water
vapor in the environment to invade and attack the electrode, which
significantly increases the possibility of electromigration of
metal nanowires. It should be understood that the above water vapor
permeability is defined as the weight of water vapor that can pass
through an optically clear adhesive per unit area per 24 hours.
[0140] In some embodiments, the thickness H3 of the adhesive layer
790 can be between 150 .mu.m and 200 .mu.m. The thickness H3 of the
adhesive layer 790 can affect the path that the moisture in the
environment travels when the moisture passes through the adhesive
layer 790, and therefore by setting the thickness H3 of the
adhesive layer 790 to be between 150 .mu.m and 200 .mu.m, the time
for the moisture in the environment to pass through the adhesive
layer 790 can be increased. In this way, the invasion of water
vapor in the environment and attack on the electrode can be
effectively slowed down, thereby reducing the possibility of
electromigration of metal nanowires and avoiding the overall
thickness of the touch display module 700 from being too large. In
detail, if the thickness H3 of the adhesive layer 790 is less than
150 .mu.m, the time for the water vapor in the environment to pass
through the adhesive layer 790 may be too short, so the water vapor
in the environment can easily invade and attack the electrode. If
the thickness H3 of 790 is greater than 150 .mu.m, the overall
thickness of the touch display module 700 may be too large, which
is not conducive to the manufacturing process and seriously affects
the appearance. In addition, the size of the barrier layer 791 in
the horizontal direction (illustrated in the direction of FIG. 17A)
is related to the thickness H3 of the adhesive layer 790. For
example, the size of the barrier layer 791 in the horizontal
direction is 0.3 to 1.0 times the thickness H3. In one example, the
width of the barrier layer 791 (i.e., the size in the horizontal
direction) is about 10 to 200 .mu.m. In other words, the water
vapor/moisture in the atmosphere needs to pass through the barrier
layer 191 before it touches the above-mentioned moisture intrusion
interface, and the barrier layer provides at least a 10 to 200
.mu.m path to delay the time before the electrode of the touch
panel 1000 is attacked and causes invalidation.
[0141] In detail, for the selection of the material properties of
the above-mentioned optically clear adhesive and the setting of the
thickness H3 of the optically clear adhesive, please refer to Table
1, which specifically lists various embodiments of the optically
clear adhesive of the present disclosure and reliability test
results of the manufactured products (for example, the touch
display module 700).
TABLE-US-00002 TABLE 1 Example 1 Example 2 Example 3 Example 4
Example 5 Example 6 Material Rubber Rubber Rubber Acrylic Acrylic
Acrylic Dielectric 2.56 2.24 2.30 2.85 4.30 2.90 constant value
Saturated water 0.10 0.11 0.08 0.20 1.10 0.40 absorption (%) Water
vapor 42 84 37 1350 1650 482 permeability g/(m.sup.2*day) Thickness
(.mu.m) 150 200 200 200 150 200 Reliability test 504 300 504 300
168 216 results (hr)
[0142] First of all, please refer to Table 1 and FIG. 18 at the
same time. FIG. 18 is a graph of the dielectric constant
value--reliability test results drawn according to various examples
in Table 1. It can be seen from FIG. 18 that, in the case that the
dielectric constant value of the adhesive layer 790/barrier layer
791 made of the optically clear adhesive is large, the reliability
test results of the touch display module 700 made using the
optically clear adhesive are better. Taking Example 3 as an
example. The dielectric constant value of the adhesive layer
790/barrier layer 791 made of the optically clear adhesive is about
2.30, and the touch display module 700 made using the optically
clear adhesive has been subjected to specific test conditions (for
example, a temperature of 65.degree. C., a relative humidity of
90%, a voltage of 11 volts). The touch display module 700 can pass
the electrical test lasting about 504 hours and shows good
reliability test results. Taking Examples 2 and 3 as examples. The
adhesive layer 790/barrier layer 791 made of the optically clear
adhesive has the same thickness (200 .mu.m), dielectric constant
between 2.24 to 2.30, and saturated water absorption about 0.1 wt.
%. The touch display module 700 which is made of materials with
water vapor permeability of less than 100 g/(m.sup.2*day) has been
subjected to specific test conditions (for example, a temperature
of 65.degree. C., a relative humidity of 90%, and a voltage of 11
volts). The touch display module 700 can pass the electrical test
lasting more than 300 hours and shows good reliability test
results.
[0143] Next, please refer to Table 1 and FIG. 19 at the same time.
FIG. 19 is a graph of saturated water absorption--reliability test
results drawn according to the examples in Table 1. It can be seen
from FIG. 19 that, in the case that the saturated water absorption
of the adhesive layer 790/barrier layer 791 made of the optically
clear adhesive is small, the reliability test results of the touch
display module 700 made using the optically clear adhesive shows
better. Taking Example 3 as an example. The saturated water
absorption of the adhesive layer 790/barrier layer 791 made of
optically clear adhesive is about 0.08%, and the touch display
module 700 made by the optically clear adhesive has been subjected
to specific test conditions (for example, a temperature of
65.degree. C., a relative humidity of 90%, and a voltage of 11
volts). The touch display module 700 can pass the electrical test
lasting about 504 hours and shows good reliability test
results.
[0144] Please refer to FIG. 20, which is a schematic side view of a
touch display module 800 according to an embodiment of the present
disclosure. At least one difference between the touch display
module 800 in FIG. 20 and the touch display module 700 in FIG. 17A
is that the optically clear adhesive further extends along the
sidewall of the light shielding layer 870 to the inner surface 811
of the substrate 810 to form a barrier layer 891 to cover the
sidewall of the light shielding layer 870. In some embodiments, the
barrier layer 891 can further extend laterally on the inner surface
811 of the substrate 810 and cover a part of the inner surface 811
of the substrate 810. In some embodiments, the optically clear
adhesive can be conformally formed on the surface and sidewall of
each layer (for example, the coating 860, and the light shielding
layer 870). In this way, the optically clear adhesive can more
completely protect the touch display module 800 from the side of
the touch display module 800, thereby better preventing or slow
down the intrusion of the moisture in the environment and attack on
the electrode. In some embodiments, the touch display module 800
can pass the electrical test lasting about 504 hours under specific
test conditions (for example, a temperature of 65.degree. C., a
relative humidity of 90%, and a voltage of 11 volts). This shows
that the touch display module 800 of the present disclosure has
good reliability test results.
[0145] It should be understood that the touch display modules 100
to 600 shown in FIGS. 1 to 6 can also use the adhesive layers 790
to 890 shown in FIG. 17A or FIG. 20. Therefore, the touch display
modules 100 to 600 shown in FIGS. 1 to 6 are not only protected by
the moisture barrier layers 140 to 640, but also protected by the
optically clear adhesive with specific material properties, thereby
achieving better water blocking effect.
[0146] On the other hand, the touch display module of the present
disclosure can be, for example, a touch display module that has
improved flexibility and can reduce cracks when bent. In other
words, the substrate and adhesive layer of the touch display module
of the present disclosure can have a certain degree of flexibility.
The flexibility of the substrate can be achieved by adjusting the
tensile modulus of the substrate, and the flexibility of the
adhesive layer can be achieved by adjusting the storage modulus of
the adhesive layer. In the following description, the touch display
module 100 shown in FIG. 1 will be taken as an example for a more
detailed description.
[0147] In some embodiments, the tensile modulus of the substrate
110 can be between 2000 MPa and 7500 MPa, and improved flexibility
can also be obtained when the substrate 110 is used together with
the adhesive layer 190. In detail, if the tensile modulus is less
than 2000 MPa, the touch display module 100 may not be able to
recover after bending. If the tensile modulus is greater than 7500
MPa, the adhesive layer 190 may not be able to fully reduce the
excessive strength of the touch display module 100, thereby causing
cracks of the touch display module 100 after bending. In some
embodiments, the tensile modulus of the substrate 110 can be
adjusted by controlling the resin type, thickness, curing degree,
and molecular weight of the substrate 110.
[0148] The substrate 110 can include a material having a tensile
modulus in the above range. For example, the substrate 110 can
include polyester-based films of polyethylene terephthalate,
polyethylene isophthalate, and polybutylene terephthalate; for
example, cellulose-based films of diacetyl cellulose and triacetyl
cellulose; polycarbonate-based films; for example, acrylic
acid-cased films of poly(methyl) methacrylate and poly(ethyl)
methacrylate; for example, styrene-based films of polystyrene and
acrylonitrile-styrene copolymer; for example, polyolefin-based
films of polyethylene, polypropylene, cycloolefin, cycloolefin
copolymer, polynorbornene, and ethylene-propylene copolymer;
polyvinyl chloride-based films; for example, polyamide-based films
of nylon and aromatic polyamide; imine-based films; sulfone-based
films; polyether ketone-based films; polyphenylene sulfide-based
films; vinyl alcohol-based films; vinylidene chloride-based films;
vinyl butyral-based films; allyl-based film; polyformaldehyde-based
films; urethane-based films; epoxy-based films; and silicon-based
film. In addition, the thickness of the substrate 110 can be
appropriately adjusted within the above-mentioned tensile modulus
range. For example, the thickness of the substrate 110 can be
between 10 .mu.m and about 200 .mu.m.
[0149] In some embodiments, the storage modulus of the adhesive
layer 190 at a temperature of about 25.degree. C. can be less than
100 kPa. If the adhesive layer 190 is used together with the
substrate 110 having the above tensile modulus range, the stress
during bending can be reduced to reduce cracks. In a preferred
embodiment, the storage modulus of the adhesive layer 190 at a
temperature of about 25.degree. C. can be between 10 kPa and 100
kPa. In addition, since the touch display module 100 can be used in
various environments, its flexibility in a lower temperature
environment also needs to be improved. In some embodiments, the
storage modulus of the adhesive layer 190 at a temperature of about
-20.degree. C. can be less than or equal to 3 times of storage
modulus at a temperature of about 25.degree. C., so that the
adhesive layer 190 can also have improved flexibility at low
temperature. In some embodiments, the adhesive layer 190 can be,
for example, a methacrylic transparent adhesive layer, an
ethylene/vinyl acetate copolymer transparent adhesive layer, a
silicon transparent adhesive layer (for example, a copolymer of
silicon resin and silicon resin), a polyurethane transparent
adhesive layer, a natural rubber transparent adhesive layer, or a
styrene-isoprene-styrene block copolymer transparent adhesive
layer. In some embodiments, it is possible to increase the
proportion of monomers with a low glass transition temperature (for
example, below -40.degree. C.) among all monomers in the material
of the adhesive layer 190, or to increase the proportion of the
low-functionality resin (for example, below 3) among all resins in
the material of the adhesive layer 190, to make the storage modulus
of the adhesive layer 190 at a temperature of about 25.degree. C.
and about -20.degree. C. within the above range.
[0150] It should be understood that the connection relationships,
materials, and effects of the components that have been described
will not be repeated. In the following description, the touch
display module 100 shown in FIG. 1 will be taken as an example to
further describe the manufacturing method of the touch display
module 100.
[0151] First, a substrate 110 with the predefined display region DR
and the predefined peripheral region PR is provided, and the light
shielding layer 170 is formed in the peripheral region PR of the
substrate 110 to shield the peripheral wires (for example, the
peripheral wire 180) formed later. Subsequently, the bottom coating
160a is formed on the substrate 110, and the bottom coating 160a is
further extended to the inner surface 171 of the light shielding
layer 170 to cover a part of the light shielding layer 170. In one
embodiment, the bottom coating 160a can be used to adjust the
surface characteristics of the substrate 110 to facilitate the
subsequent coating process of the metal nanowire layer (for
example, the second conductive layer 130), and to improve the
adhesion between the metal nanowire layer and the substrate 110.
Next, a transparent conductive material (for example, indium tin
oxide, indium zinc oxide, cadmium tin oxide, or aluminum-doped zinc
oxide) is formed on the bottom coating 160a to obtain the first
conductive layer 120 located in the display region DR after
patterning, in which the first conductive layer 120 is used as a
conductive electrode. Subsequently, the middle coating 160b is
formed to cover the first conductive layer 120, so that the first
conductive layer 120 and the second conductive layer 130 formed
subsequently can be insulated from each other.
[0152] Next, a metal material is formed on the bottom coating 160a,
and the peripheral wire 180 located in the peripheral region PR is
obtained after patterning. In some embodiments, the metal material
can be directly selectively formed in the peripheral region PR
without being formed in the display region DR. In other
embodiments, the metal material can be entirely formed in the
peripheral region PR and the display region DR first, and then the
metal material in the display region DR can be removed by steps
such as photolithography. In some embodiments, the metal material
can be deposited in the peripheral region PR of the substrate 110
by electroless plating. Electroless plating is used to reduce the
metal ions in the plating solution to metal under the catalysis of
a metal catalyst with the help of a suitable reducing agent under
the condition of no external current, and plate the metal on the
surface. This process can also be called autocatalytic plating. In
some embodiments, the catalytic material can be firstly formed in
the peripheral region PR of the substrate 110 without forming in
the display region DR of the substrate 110. Since the display
region DR does not include the catalytic material, the metal
material is only deposited in the peripheral region PR without
forming in the display region DR. During the electroless plating
reaction, the metal material can nucleate on the catalytic material
with catalytic/activation ability, and then continue to grow into a
metal film by the self-catalysis of the metal material. The
peripheral wire 180 of the present disclosure can include a metal
material with better conductivity, preferably a single-layer metal
structure, such as a silver layer, a copper layer, etc.; or the
peripheral wire 180 can be a multilayer metal structure, such as a
molybdenum/aluminum/molybdenum layer, titanium/aluminum/titanium
layer, copper/nickel layer, or molybdenum/chromium layer, but is
not limited to these. The above-mentioned metal structure is
preferably opaque, for example, the light transmittance of visible
light (such as a wavelength between 400 nm and 700 nm) is less than
about 90%, but the size of the metal structure is small enough to
be invisible to human eyes.
[0153] Subsequently, the second conductive layer 130 used as a
conductive electrode is formed on the bottom coating 160a, the
middle coating 160b, and the peripheral wire 180. Specifically, the
first part of the second conductive layer 130 is located in the
display region DR and attached to the surfaces of the bottom
coating 160a and the middle coating 160b. The second part of the
second conductive layer 130 is located in the peripheral region PR
and attached to the surfaces of the bottom coating 160a and the
peripheral wire 180. In some embodiments, the second conductive
layer 130 can be formed by using a dispersion or slurry including
metal nanowires through the steps of coating, curing, drying and
molding, and photolithography. In some embodiments, the dispersion
liquid can include a solvent, thereby uniformly dispersing the
metal nanowires therein. Specifically, the solvent can be, for
example, water, alcohol, ketone, ether, hydrocarbon, aromatic
solvents (benzene, toluene, or xylene), or any combination of the
above. In some embodiments, the dispersion can further include an
additive, a surfactant, and/or a binder to improve the
compatibility between the metal nanowires and the solvent and the
stability of the metal nanowires in the solvent. Specifically, the
additive, the surfactant, and/or the binder can be, for example,
disulfonate, carboxymethyl cellulose, hydroxyethyl cellulose,
hydroxypropyl methylcellulose, sulfonate, sulfate, phosphate,
sulfosuccinate, a fluorine-containing surfactant, or any
combination of the above.
[0154] In some embodiments, the coating step can include, but is
not limited to, a process such as a screen printing, a nozzle
coating, or a roller coating. In some embodiments, a roll-to-roll
process can be used to uniformly coat the dispersion including
metal nanowires onto the surfaces of the continued supply of the
bottom coating 160a, the middle coating 160b, and the peripheral
wire 180. In some embodiments, the curing and drying steps can
volatilize the solvent and make the metal nanowires randomly
distributed on the surfaces of the bottom coating 160a, the middle
coating 160b, and the peripheral wire 180. In a preferred
embodiment, the metal nanowires can be fixed on the surfaces of the
bottom coating 160a, the middle coating 160b, and the peripheral
wire 180 without falling off, and metal nanowires can contact each
other to provide a continuous current path, thereby forming a
conductive network.
[0155] In some embodiments, the metal nanowires can be further
subjected to post-treatment to increase their conductivity. The
post-treatment includes, but is not limited to, steps such as
heating, plasma, corona discharge, ultraviolet light, ozone, or
pressure. In some embodiments, one or more rollers can be used to
apply pressure on the metal nanowires. In some embodiments, the
pressure applied can be between 50 psi and 3400 psi. In some
embodiments, the metal nanowires can be heated and pressurized
simultaneously. In some embodiments, the temperature of the roller
can be heated to between 70.degree. C. and 200.degree. C. In a
preferred embodiment, the metal nanowires can be exposed to a
reducing agent for post-treatment. For example, if metal nanowires
are silver nanowires, they can be exposed to a silver reducing
agent for post-processing. In some embodiments, the silver reducing
agent can include a borohydride such as sodium borohydride, a boron
nitride compound such as dimethylamine borane, or a gaseous
reducing agent such as hydrogen. In some embodiments, the exposure
time can be between 10 seconds and 30 minutes.
[0156] Then, at least one top coating 160c is formed to cover the
second conductive layer 130. In some embodiments, the material of
the top coating 160c can be formed on the surface of the second
conductive layer 130 by coating. In some embodiments, the material
of the top coating 160c can further penetrate between the metal
nanowires of the second conductive layer 130 to form a filler and
then be cured to form a composite structure layer with the metal
nanowires. In some embodiments, heating and baking can be used to
dry and cure the material of the top coating 160c. In some
embodiments, the temperature of heating and baking can be between
60.degree. C. and 150.degree. C. It should be understood that the
physical structure between the top coating 160c and the second
conductive layer 130 does not limit the present disclosure.
Specifically, the top coating 160c and the second conductive layer
130 can be a stack of two layers, or they can be mixed with each
other to form a composite structure layer. In a preferred
embodiment, the metal nanowires in the second conductive layer 130
are embedded in the top coating 160c to form a composite structure
layer.
[0157] Subsequently, the structure (semi-product) including the
substrate 110, the first conductive layer 120, the second
conductive layer 130, and the coating 160 is placed in a vacuum
coating equipment for vacuum coating, thereby forming the moisture
barrier layer 140 on the surface and the sidewall 161c of the top
coating 160c. Since the moisture barrier layer 140 is plated on the
surface and the sidewall 161c of the top coating 160c in a vacuum
environment, the bonding between the moisture barrier layer 140 and
the surface and the sidewall 161c of the top coating 160c can be
closer, thereby ensuring no any gap between the moisture barrier
layer 140 and the top coating 160c to improve the product yield. In
addition, the moisture barrier layer 140 formed in the vacuum
environment can have a relatively compact structure, so as to
better prevent moisture in the environment from intruding and
attacking the electrode. Placing the structure including the
substrate 110, the first conductive layer 120, the second
conductive layer 130, and the coating 160 in vacuum coating
equipment can also make the above layers more closely stacked,
thereby reducing the impedance between layers. In detail, please
refer to Table 2, which specifically lists the measured impedance
values of the touch display module 100 of each example of the
present disclosure before and after vacuum coating.
TABLE-US-00003 TABLE 2 Example 1 Example 2 Example 3 Example 4
Example 5 Example 6 Example 7 Impedance 28.32 28.31 35.11 36.96
25.68 31.06 26.31 value before vacuum coating (.OMEGA.) Impedance
22.83 27.03 31.01 22.09 21.26 28.07 25.05 value after vacuum
coating (.OMEGA.) Rate of 19.39 4.52 11.68 18.06 17.21 9.63 4.79
change of impedance value (%)
[0158] It can be seen from Table 2, the impedance value of the
touch display module 100 of each example of the present disclosure
measured after the vacuum coating is significantly lower than the
impedance value measured before the vacuum coating. Taking Example
1 as an example, the rate of change of the impedance value before
and after the vacuum coating can be up to about 19.39%, which shows
that the above vacuum coating method can indeed effectively reduce
the resistance value of the touch display module 100.
[0159] Next, the adhesive layer 190 is formed on the moisture
barrier layer 140, thereby fixing the display device 150 by the
adhesive layer 190. In some embodiments, the material of the
adhesive layer 190 can be formed on the surface of the moisture
barrier layer 140 by coating. In other embodiments, the
aforementioned vacuum coating method can also be used to form the
adhesive layer 190 material on the surface of the moisture barrier
layer 140, so that the bonding between the adhesive layer 190 and
the moisture barrier layer 140 is closer to improve the yield of
the product. After forming the adhesive layer 190 and fixing the
display device 150, the touch display module 100 shown in FIG. 1
can be obtained.
[0160] The touch panel of the examples of the present disclosure
can be assembled with other electronic devices, such as a display
having touch function, and the substrate 110 can be attached to a
display device, a liquid crystal display device, or an organic
light-emitting diode (OLED) display device. An optical adhesive or
other similar adhesives can be used for bonding between them. The
touch sensing electrode TE can also be bonded with the outer cover
layer (such as protective glass) by using an optical adhesive. The
touch panel, antenna, and so on in the examples of the present
disclosure can be applied to electronic devices, such as portable
phones, tablet computers, notebook computers, and so on, and can
also be applied to flexible products. The electrode of the examples
of the present disclosure can also be fabricated on a polarizer.
The electrode of the examples of the present disclosure can also be
made on wearable devices (such as watches, glasses, smart clothes,
smart shoes, etc.), automotive devices (such as dashboards, driving
recorders, car rearview mirrors, car windows, etc.).
[0161] In summary, the present disclosure provides a touch display
module with a moisture barrier layer and/or an adhesive layer of
suitable material. The moisture barrier layer and/or the adhesive
layer of suitable material can reduce the moisture intrusion from
the environment, and the adhesive layer of suitable material can
also reduce the speed of moisture transfer and the migration speed
of metal ions produced by metal nanowires. In this way
electromigration of metal nanowires can be avoided or the time of
electromigration of metal nanowires can be slowed down, thereby
meeting the requirements of improving product reliability test.
[0162] The above descriptions are only the preferred embodiments of
the present disclosure and are not intended to limit the present
disclosure. Any modification, equivalent replacement, improvement,
etc., made within the spirit and principle of the present
disclosure shall be included in the protection scope of the present
disclosure.
* * * * *