U.S. patent application number 17/012077 was filed with the patent office on 2022-03-10 for memory device.
This patent application is currently assigned to Winbond Electronics Corp.. The applicant listed for this patent is Winbond Electronics Corp.. Invention is credited to Frederick Chen, Kuang-Chih Hsieh, Meng-Hung Lin, Ping-Kun Wang, Chien-Min Wu.
Application Number | 20220076744 17/012077 |
Document ID | / |
Family ID | 1000005091087 |
Filed Date | 2022-03-10 |
United States Patent
Application |
20220076744 |
Kind Code |
A1 |
Chen; Frederick ; et
al. |
March 10, 2022 |
MEMORY DEVICE
Abstract
A memory device includes: a resistive switching layer, a
conductive pillar, a barrier layer, a word line, a plurality of
resistive layers, and a plurality of bit lines. The resistive
switching layer is shaped as a cup and has an inner surface to
define an opening. The conductive pillar is disposed in the
opening. The barrier layer is disposed between the resistive
switching layer and the conductive pillar. The word line is
electrically connected to the conductive pillar. The resistive
layers are respectively distributed on an outer surface of the
resistive switching layer. The bit lines are electrically connected
to the resistive layers, respectively.
Inventors: |
Chen; Frederick; (San Jose,
CA) ; Wang; Ping-Kun; (Taichung City, TW) ;
Hsieh; Kuang-Chih; (Taichung City, TW) ; Wu;
Chien-Min; (Taichung City, TW) ; Lin; Meng-Hung;
(Taichung City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Winbond Electronics Corp. |
Taichung City |
|
TW |
|
|
Assignee: |
Winbond Electronics Corp.
Taichung City
TW
|
Family ID: |
1000005091087 |
Appl. No.: |
17/012077 |
Filed: |
September 4, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11C 13/0026 20130101;
G11C 13/0028 20130101; H01L 45/146 20130101 |
International
Class: |
G11C 13/00 20060101
G11C013/00; H01L 45/00 20060101 H01L045/00 |
Claims
1. A memory device, comprising: a memory structure comprising: a
resistive switching layer, shaped as a cup and having an inner
surface to define an opening; a conductive pillar, disposed in the
opening; and a barrier layer, disposed between the resistive
switching layer and the conductive pillar; a word line,
electrically connected to the conductive pillar; a plurality of
resistive layers respectively distributed on the outer surface of
the resistive switching layer, wherein a portion of the memory
structure connected to one of the plurality of resistive layers
constitutes a memory cell; and a plurality of bit lines,
electrically connected to the plurality of resistive layers,
respectively, wherein each resistive layer has a first sidewall and
a second sidewall opposite to each other, the first sidewall is in
direct contact with the resistive switching layer, and the second
sidewall is in direct contact with a corresponding bit line.
2. The memory device according to claim 1, wherein a resistance
value of the plurality of resistive layers is 1 KOhm to 3 KOhm.
3. The memory device according to claim 1, wherein a resistance
value of the plurality of resistive layers is greater than a
resistance value of the conductive pillar, a resistance value of
the word line, and a resistance value of the plurality of bit
lines.
4. The memory device according to claim 1, wherein a ratio of a
resistance value of the resistive switching layer to a resistance
value of the plurality of resistive layers is 2 to 100.
5. The memory device according to claim 1, wherein a length of the
plurality of resistive layers is 10 nanometers to 100
nanometers.
6. The memory device according to claim 1, wherein a material of
the plurality of resistive layers comprises TaN, TiN, or a
combination thereof.
7. The memory device according to claim 1, wherein the barrier
layer is conformally disposed in the opening to have a cup-shaped
structure, and a material of the barrier layer comprises
Al.sub.2O.sub.3, TiO.sub.x, or a combination thereof.
8. The memory device according to claim 1, wherein a material of
the conductive pillar comprises Ti, Ta, Al, W, or a combination
thereof.
9. The memory device according to claim 1, wherein a material of
the resistive switching layer comprises HfO.sub.2, ZrO.sub.2,
Ta.sub.2O.sub.5, TiO.sub.2, or a combination thereof.
10. A memory device, comprising: a memory structure comprising: a
resistive switching layer, shaped as a cup and having an inner
surface to define an opening; a conductive pillar, disposed in the
opening; and a barrier layer, disposed between the resistive
switching layer and the conductive pillar; a select transistor,
electrically connected to the conductive pillar; a plurality of
resistive layers respectively distributed on the outer surface of
the resistive switching layer, wherein a portion of the memory
structure connected to one of the plurality of resistive layers
constitutes a memory cell; and a plurality of bit lines comprising
a plurality of odd bit lines and a plurality of even bit lines,
wherein the plurality of odd bit lines are electrically connected
to each other and connected to corresponding resistive layers at a
first side of the conductive pillar, and the plurality of even bit
lines are electrically connected to each other and connected to
other corresponding resistive layers at a second side opposite to
the first side of the conductive pillar, wherein each resistive
layer has a first sidewall and a second sidewall opposite to each
other, the first sidewall is in direct contact with the resistive
switching layer, and the second sidewall is in direct contact with
a corresponding bit line.
Description
BACKGROUND
Technical Field
[0001] The disclosure relates to a memory device.
Description of Related Art
[0002] Recently, resistive random access memories (RRAMs),
characterized by advantages including simple crossbar array
structures and low-temperature manufacturing processes, have been
widely applied in the technical field of non-volatile memories.
Since the crossbar RRAM is designed according to the concept of a
resistive switching device (i.e., 1R), compared to a
1-transistor-1-resistor (1T1R) or a 1-selector-1-resistor (1S1R)
structure, the crossbar RRAM structure may theoretically have not
only a smaller cell size but also a lower operation voltage. In
other words, the crossbar RRAM may have high integration density
and may effectively reduce the operating voltage.
[0003] However, the crossbar RRAM still encounters certain issues,
e.g., sneak current and snapback during memory operation.
SUMMARY
[0004] The disclosure provides a memory device where resistive
layers having a specified resistance value are disposed between a
bit line and a resistive switching layer, so as to solve a snapback
problem (shorting of the bit line to an intersecting line by the
resistive switching layer) while the resistive switching layer is
transformed from an initially insulating layer into a switching
layer with much less resistance.
[0005] An embodiment of the disclosure provides a memory device
including a resistive switching layer, a conductive pillar, a
barrier layer, a word line, a plurality of resistive layers, and a
plurality of bit lines. The resistive switching layer is shaped as
a cup and has an inner surface to define an opening. The conductive
pillar is disposed in the opening. The barrier layer is disposed
between the resistive switching layer and the conductive pillar.
The word line is electrically connected to the conductive pillar.
The resistive layers are respectively distributed on an outer
surface of the resistive switching layer. The bit lines are
electrically connected to the resistive layers, respectively.
[0006] Several exemplary embodiments accompanied with figures are
described in detail below to further describe the disclosure in
details.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The accompanying drawings are included to provide a further
understanding of the disclosure, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the disclosure and, together with the description,
serve to explain the principles of the disclosure.
[0008] FIG. 1 is a schematic view illustrating a theoretical
formation state of a crossbar RRAM device.
[0009] FIG. 2 is a schematic view illustrating a formation state of
a crossbar RRAM device according to an embodiment of the
disclosure.
[0010] FIG. 3A to FIG. 3I are schematic three-dimensional views of
a manufacturing process of a memory device according to a first
embodiment of the disclosure.
[0011] FIG. 4A is a schematic three-dimensional view illustrating
the memory cell in FIG. 3I.
[0012] FIG. 4B is a schematic cross-sectional view illustrating the
memory cell in FIG. 4A.
[0013] FIG. 5 is a schematic three-dimensional view of a memory
device according to a second embodiment of the disclosure.
[0014] FIG. 6A to FIG. 6H are schematic three-dimensional views of
a manufacturing process of a memory device according to a third
embodiment of the disclosure.
[0015] FIG. 7A is a schematic three-dimensional view of a memory
device according to a fourth embodiment of the disclosure.
[0016] FIG. 7B is a schematic top view of FIG. 7A.
[0017] FIG. 8 is a schematic view illustrating an operation of the
memory device of FIG. 7A.
DESCRIPTION OF THE EMBODIMENTS
[0018] FIG. 1 is a schematic view illustrating a theoretical
formation state of a crossbar RRAM device. FIG. 2 is a schematic
view illustrating a formation state of a crossbar RRAM device
according to an embodiment of the disclosure.
[0019] With reference to FIG. 1, when a memory cell M1 is selected
for performing a forming operation, a forming voltage of 1 unit (1
Vf) is applied to a first bit line BL1, and 0 voltage is applied to
a second bit line BL2, a first word line WL1, and a second word
line WL2 (e.g., grounded). Under such circumstances, the memory
cell M1 is turned on and thus leads to a snapback, which is a
sudden and significant voltage drop between the intersecting first
bit line BL1 and first word line WL1. This pulls the voltage of the
first word line WL1 to be the same as the voltage of the first bit
line BL1, which in turn can cause the improper disturb or switching
of memory cell M2 with an opposite polarity voltage of 1 Vf.
[0020] An embodiment of the disclosure provides a crossbar RRAM
device 10 including a memory array. The memory array includes: a
first bit line BL1, a second bit line BL2, a first word line WL1, a
second word line WL2, a plurality of memory cells M1, M2, M3, and
M4, and a plurality of contact resistors Rc1, Rc2, Rc3, and Rc4.
Specifically, the memory cells M1, M2, M3, and M4 are located at
overlapping regions of the first bit line BL1, the second bit line
BL2, the first word line WL1, and the second word line WL2,
respectively. The contact resistors Rc1, Rc2, Rc3, and Rc4 are
respectively located between the memory cells M1, M2, M3, and M4
and the first bit line BL1 and the second bit line BL2. When the
memory cell M1 is selected for performing a formation operation, a
voltage of 1 unit (1 Vf) is applied to the first bit line BL1, and
0 voltage is applied to the second bit line BL2, the first word
line WL1, and the second word line WL2 (e.g., grounded). Under such
circumstances, the memory cell M1 is turned on, and almost all
voltages are loaded to the contact resistor Rc1 without being
transferred to the first word line WL1, thereby solving the issue
of possible disturb of memory cell M2 caused by snapback.
[0021] FIG. 3A to FIG. 3I are schematic three-dimensional views of
a manufacturing process of a memory device according to a first
embodiment of the disclosure. The memory device described in the
following embodiments may be a crossbar RRAM device, but the
disclosure is not limited thereto.
[0022] As shown in FIG. 3A, a substrate 102 is provided. In an
embodiment, the substrate 102 includes a semiconductor substrate,
e.g., silicon substrate. A conductive layer 104 is formed on the
substrate 102. In an embodiment, a method for forming the
conductive layer 104 includes forming a conductive material layer
and then patterning the conductive material layer to form an
opening 103 exposing the substrate 102. In this embodiment, as
shown in FIG. 3A, the conductive layer 104 may be shaped as a
letter H, but the disclosure is not limited thereto. In an
embodiment, the material of the conductive layer 104 includes Ta,
Ti W, Al, or a combination thereof. A thickness 104t of the
conductive layer 104 thickness may be within a range from 20 nm to
50 nm.
[0023] With reference to FIG. 3B, a dielectric layer 106 is formed
on the conductive layer 104. The dielectric layer 106 fills the
opening 103 and extends to cover a top surface of the dielectric
layer 106. In an embodiment, a method for forming the dielectric
layer 106 includes forming a dielectric material layer and then
planarizing the dielectric material layer. The material of the
dielectric layer 106 may include silicon oxide, silicon nitride,
silicon oxynitride, or a combination thereof. A thickness 106t of
the dielectric layer 106 on the conductive layer 104 may be within
a range from 10 nm to 50 nm. In alternative embodiments, the
dielectric layer 106 may also be selectively patterned to increase
the design flexibility of the memory device.
[0024] With reference to FIG. 3C, a conductive layer 108 is formed
on the dielectric layer 106. In an embodiment, a method for forming
the conductive layer 108 includes forming a conductive material
layer and then patterning the conductive material layer to form an
opening 107 that exposes the dielectric layer 106. In this
embodiment, as shown in FIG. 3C, the conductive layer 108 may be
shaped as a letter H and correspond to the pattern of the
conductive layer 104. In an embodiment, the material of the
conductive layer 108 includes Ta, Ti, W, Al, or a combination
thereof. A thickness 108t of the conductive layer 108 may be within
a range from 20 nm to 50 nm.
[0025] Next, the opening 107 is filled with the dielectric layer
110, and then a planarization process, e.g., a chemical-mechanical
planarization (CMP) process, is performed, so that the top surface
of the dielectric layer 110 and a top surface of the conductive
layer 108 are coplanar. In an embodiment, the material of the
dielectric layer 110 may include silicon oxide, silicon nitride,
silicon oxynitride, or a combination thereof. A thickness 110t of
the dielectric layer 110 may be within a range from 10 nm to 30
nm.
[0026] With reference to FIG. 3C and FIG. 3D, a mask pattern 112 is
formed on the conductive layer 108 and the dielectric layer 110. A
portion of the dielectric layer 110, a portion of the conductive
layer 108, a portion of the dielectric layer 106, and a portion of
the conductive layer 104 are removed with use of a mask pattern 112
as a mask to form a trench 114. The trench 114 exposes a top
surface of the substrate 102.
[0027] With reference to FIG. 3D and FIG. 3E, after the mask
pattern 112 is removed, another mask pattern 116 is formed on the
conductive layer 108. The mask pattern 116 has an opening 118. The
opening 118 exposes the trench 114, the top surface of the
dielectric layer 110, and the conductive layers 108 and 104
protruding between the dielectric layers 106 and 110. An etching
process is performed with use of the mask pattern 116 as a mask to
remove the conductive layers 108 and 104 protruding between the
dielectric layers 106 and 110 and to further form a gap 120. In an
embodiment, the etching process includes a wet etching process or
an isotropic etching process.
[0028] With reference to FIG. 3E and FIG. 3F, after the mask
pattern 116 is removed, a resistive material 122 is formed in the
gap 120, so that the resistive material 122 completely fills the
gap 120 and extends to cover a sidewall of the trench 114. In an
embodiment, the resistive material 122 includes a material of a
high resistance value, such as TaN, TiN, or a combination thereof.
A method of forming the resistive material 122 includes atomic
layer deposition (ALD), chemical vapor deposition (CVD), or a
combination thereof.
[0029] With reference to FIG. 3F and FIG. 3G, a mask pattern 124 is
formed on the conductive layer 108 and the dielectric layer 110. A
portion of the resistive material 122 exposed outside the trench
114 is removed with use of the mask pattern 124 as a mask. Under
such circumstances, the remaining portion of the resistive material
122 is sandwiched between the dielectric layers 106 and 110 and is
hereinafter referred to as resistive layers 126.
[0030] With reference to FIG. 3G and FIG. 3H, after the mask
pattern 124 is removed, a dielectric layer 128 is formed in the
trench 114. In an embodiment, the material of the dielectric layer
128 may include silicon oxide, silicon nitride, silicon oxynitride,
or a combination thereof. In this embodiment, the dielectric layers
128, 110, and 106 have the same dielectric material, such as
silicon oxide.
[0031] With reference to FIG. 3H and FIG. 3I, a memory structure
130 is formed in the dielectric layer 128 between two adjacent
resistive layers 126, thereby completing the memory device 100
provided in the first embodiment of the disclosure. Specifically,
the memory structure 130 includes a conductive pillar 132, a
barrier layer 134, and a resistive switching layer 136. In an
embodiment, a method for forming the memory structure 130 includes:
forming an opening 131 in the dielectric layer 128, wherein the
opening 131 exposes the top surface of substrate 102; conformally
forming the resistive switching layer 136 in the opening 131;
conformally forming the barrier layer 134 on the resistive
switching layer 136; forming the conductive pillar 132 on the
barrier layer 134. It can be known from FIG. 4B that the resistive
switching layer 136 is shaped as a cup and has an inner surface
136s1 to define an opening 135. The conductive pillar 132 is
disposed in the opening 135. The barrier layer 134 is also shaped
as a cup and is disposed between the resistive switching layer 136
and the conductive pillar 132. In an embodiment, the material of
the conductive pillar 132 includes Ti, Ta, or a combination
thereof, the material of the barrier layer 134 includes
Al.sub.2O.sub.3, TiO.sub.x or a combination thereof, and the
material of the resistive switching layer 136 includes HfO.sub.2,
ZrO.sub.2, Ta.sub.2O.sub.5, TiO.sub.2, or a combination
thereof.
[0032] With reference to FIG. 4A and FIG. 4B, the resistive layers
126 are respectively distributed on an outer surface 136s2 of the
resistive switching layer 136. In an embodiment, a length 126l of
the resistive layers 126 is 10 nm to 100 nm. The conductive layers
104 and 108 are shaped as bars and are respectively connected to
the resistive layers 126. In this embodiment, the bar-shaped
conductive layers 104 and 108 may be collectively referred to as
the bit lines BL. In addition, the conductive pillar 132 may also
be electrically connected to the word line WL. Here, each portion
of the memory structure 130 connected to one of the resistive
layers 126 may be regarded as a memory cell MC. As shown in FIG.
4A, the memory structure 130 is respectively connected to four
resistive layers 126, thereby forming four memory cells MC.
[0033] In an embodiment, a resistance value of the resistive layers
126 are greater than a resistance value of the conductive pillar
132, a resistance value of the bit lines BL, and a resistance value
of the word line WL. Under such circumstances, the resistive layers
126 may serve as contact resistors (as shown in FIG. 2) to hold the
voltage when the memory cells MC are turned on, so as to prevent
the damages to the caused by snapback. In some embodiments, the
resistance value of the resistive layers 126 may be expressed by
the following formula:
Rc/Rp.gtoreq.(Vf-Vr)/Vr=Vf/Vr-1,
where Rc is the resistance value of the resistive layers 126, Rp is
the resistance value of the peripheral circuit 20 (as shown in FIG.
2), Vr is the reset voltage, and Vf is the forming voltage. This is
to ensure that Rc rather than Rp takes the bulk of the voltage as a
result of snapback.
[0034] For instance, the resistance value of the resistive layer
126 is 1 KOhm to 3 KOhm; and the resistance value of the resistance
switching layer 136 is 5 KOhm to 100 KOhm. In some embodiments, the
a ratio of the resistance value of the resistive switching layer
136 to the resistance value of the resistive layer 126 is about 2
to 100.
[0035] FIG. 5 is a schematic three-dimensional view of a memory
device according to a second embodiment of the disclosure.
[0036] With reference to FIG. 5, the memory device 200 provided in
the second embodiment of the disclosure is similar to the memory
device 100 provided in the first embodiment of the disclosure, and
the main difference lies in that the memory device 200 has a memory
array. The memory array includes four memory structures 130a, 130b,
130c, and 130d, and the four memory structures 130a, 130b, 130c,
and 130d are electrically connected to the bar-shaped conductive
layers 104 and 108 (also referred to as the bit lines BL) through
the resistive layers 126, respectively.
[0037] FIG. 6A to FIG. 6H are schematic three-dimensional views of
a manufacturing process of a memory device according to a third
embodiment of the disclosure.
[0038] Specifically, as shown in FIG. 6A, a conductive layer 204, a
dielectric layer 206, and a conductive layer 208 are sequentially
formed on the substrate 102. In this embodiment, the conductive
layer 204, the dielectric layer 206, and the conductive layer 208
are all shaped as a letter H, and a forming method includes:
forming a stacked layer structure composed of a conductive material
layer, a dielectric material layer, and another conductive material
layer, and then patterning the stacked layer structure to form an
opening 203 exposing the substrate 102.
[0039] With reference to FIG. 6B, the opening 203 is backfilled
with a filling material 210. In FIG. 6C, the protruding portions of
the conductive layers 204 and 208 are etched with an isotropic
etch, forming a slot 214 while the line-shaped portions of 208 are
covered with a mask pattern 212. After the mask pattern 212 is
removed, as shown in FIG. 6D, another mask pattern 216 is formed on
the conductive layer 208. The mask pattern 216 has an opening 28.
The opening 218 exposes the slot 214, the top surface of the
dielectric layer 210, and the protruding portions of the conductive
layers 208 and 204. An etching process is performed with use of the
mask pattern 216 as a mask to remove the protruding portions of the
conductive layers 208 and 204 and to further form a gap 220. After
the mask pattern 216 is removed, a resistive material 222 is formed
in the gap 220, so that the resistive material 222 completely fills
the gap 220 and extends to cover a sidewall of the slot 214.
Afterwards, a mask pattern 224 is formed on the conductive layer
208 and the dielectric layer 210. A portion of the resistive
material 222 exposed outside the slot 214 is removed with use of
the mask pattern 224 as a mask. In the case, the remaining portion
of the resistive material 222 is sandwiched between the dielectric
layers 206 and 210 and is hereinafter referred to as resistive
layers 226. After the mask pattern 224 is removed, as shown in FIG.
6G, a dielectric layer 228 is formed in the slot 214. Thereafter, a
memory structure 130 is formed in the dielectric layer 228 between
two adjacent resistive layers 226, thereby completing the memory
device 300 provided in the third embodiment of the disclosure.
[0040] FIG. 7A is a schematic three-dimensional view of a memory
device according to a fourth embodiment of the disclosure. FIG. 7B
is a schematic top view of FIG. 7A. The memory structure described
in the following embodiments may be the memory structure 130 shown
in FIG. 4A, but the disclosure is not limited thereto.
[0041] With reference to FIG. 7A, a memory device 400 of the fourth
embodiment of the disclosure includes a select transistor 410, a
memory structure 130, a plurality of resistive layers 126, and a
plurality of bit lines BL. Specifically, the memory structure 130
includes a conductive pillar 132, a barrier layer 134, and a
resistive switching layer 136. The resistive switching layer 136 is
shaped as a cup and has an inner surface to define an opening. The
conductive pillar 132 is disposed in the opening. The barrier layer
134 is disposed between the resistive switching layer 136 and the
conductive pillar 132. The select transistor 410 is disposed over
the conductive pillar 132. However, the disclosure is not limited
thereto, in other embodiments, the select transistor 410 may also
be disposed below the conductive pillar 132. In some embodiments,
the select transistor 410 may be a metal oxide semiconductor field
effect transistor (MOSFET) including a gate, a source, and a drain.
The gate of the select transistor 410 is electrically connected to
the word line WL, and the word line WL may extend along a Y
direction. The source of the select transistor 410 is electrically
connected to the source line SL, and the source line SL may extend
along a X direction. The drain of the select transistor 410 is
electrically connected to the conductive pillar 132. The resistive
layers 126 are respectively distributed on the outer surface of the
resistive switching layer 136. The plurality of bit lines BL
include a first bit line (odd bit line) BL1 and a second bit line
(even bit line) BL2. As shown in FIG. 7A, the first bit line BL1
includes sub bit lines BL1a and BL1b vertically arranged along the
memory structure 130. The sub bit lines BL1a and BL1b are connected
to some resistive layers 126a1 and 126a2 at a first side S1 of the
memory structure 130. In some embodiments, the sub bit lines BL1a
and BL1b are electrically connected to each other. The second bit
line BL2 includes sub bit lines BL2a and BL2b vertically arranged
along the memory structure 130. The sub bit lines BL2a and BL2b are
connected to some resistive layers 126b1 and 126b2 at a second side
S2 of the memory structure 130. In some embodiments, the sub bit
lines BL2a and BL2b are electrically connected to each other.
[0042] With reference to FIG. 7B, the memory device 400 may include
a plurality of memory structures 130, a plurality of bit lines BL,
a plurality of select transistors 410, a plurality of source lines
SL, and a plurality of word lines WL. The plurality of memory
structures 130 are arranged as an array. The plurality of bit lines
BL includes a plurality of odd bit lines BL1, BL3, BL5 and a
plurality of even bit lines BL2, BL4. The odd bit lines BL1, BL3,
BL5 are respectively disposed at the first side S1 of the memory
structures 130, and the even bit lines BL2, BL4 are respectively
disposed at the second side S2 of the memory structures 130. In
some embodiments, the odd bit lines BL1, BL3, BL5 are electrically
connected to each other. In alternative embodiments, the even bit
lines BL2, BL4 are electrically connected to each other. The
plurality of select transistors 410 are respectively disposed over
the memory structures 130 and have the drains electrically
connected to the corresponding conductive pillars 132. The select
transistors 410 have the sources electrically connected to the
plurality of source lines SL including the source lines SL0, SL1,
SL2, SL3, respectively. In some embodiments, the source lines SL0,
SL1, SL2, SL3 are extending along the X direction and arranged
along the Y direction. The select transistors 410 have the gates
electrically connected to the plurality of word lines WL including
the word lines WL0, WL1, WL2, WL3, respectively. In some
embodiments, the word lines WL0, WL1, WL2, WL3 are extending along
the Y direction and arranged along the X direction.
[0043] FIG. 8 is a schematic view illustrating an operation of the
memory device of FIG. 7A.
[0044] With reference to FIG. 8, in one embodiment, when the memory
cell M1 is selected for performing a reset operation, a gate
voltage (Vg) is applied to the word line WL, a reset voltage (Vr)
is applied to the source line SL, 0 voltage is applied to the bit
line BL1a, and an open circuit voltage is applied to other bit
lines BL1b, BL2a, BL2b. The accumulated resistance across three
unselected memory cells such as M2, M3, M4 is able to minimize the
sneak currents and accidental cell disturbances. In the present
embodiment, the accumulated resistance is the total resistance of
three contact resistors plus the corresponding resistive switching
layers in series. The total resistance is approximately 5-6 times
the resistance of the contact resistor Rc1 of the selected memory
cell M1.
[0045] On the other hands, when the memory cell M1 is selected for
performing a set operation, a gate voltage (Vg) is applied to the
word line WL, 0 voltage is applied to the source line SL, a set
voltage (Vs) is applied to the bit line BL1a, and an open circuit
voltage is applied to other bit lines BL1b, BL2a, BL2b. In this
case, the memory cell M1 is selected for performing the set
operation, and adjacent memory cells M2, M3, M4 are able to
decrease the sneak currents and accidental cell disturbances.
[0046] Further, when the memory cells M1, M2, M3, and M4 along the
memory structure 130 are not selected for performing the operation,
0 voltage is applied to the word line WL, thereby turning off the
select transistor 410.
[0047] Moreover, under the large bias voltage conditions used in
forming, the transistor may suffer nonlinear increases in current.
The contact resistor of the present embodiment is able to mitigate
any adverse effects from this nonlinearity.
[0048] To sum up, in one or more embodiments of the disclosure, the
contact resistors with appropriate resistance value are disposed
between the bit lines and the memory cells to solve the problem of
the peripheral circuit damages caused by snapback during the
formation operation, thereby improving the reliability of the
memory device. In addition, one or more embodiments of the
disclosure provides the set operation and the reset operation of
the memory device to reduce the sneak current, thereby preventing
interference with the operation or interpretation of the memory
device.
[0049] It will be apparent to those skilled in the art that various
modifications and variations can be made to the disclosed
embodiments without departing from the scope or spirit of the
disclosure. In view of the foregoing, it is intended that the
disclosure covers modifications and variations provided they fall
within the scope of the following claims and their equivalents.
* * * * *