U.S. patent application number 17/381874 was filed with the patent office on 2022-03-10 for ultrasound endoscope.
This patent application is currently assigned to FUJIFILM Corporation. The applicant listed for this patent is FUJIFILM Corporation. Invention is credited to Tatsuhiro IWAYA, Yasuhiko MORIMOTO.
Application Number | 20220071473 17/381874 |
Document ID | / |
Family ID | 1000005755445 |
Filed Date | 2022-03-10 |
United States Patent
Application |
20220071473 |
Kind Code |
A1 |
IWAYA; Tatsuhiro ; et
al. |
March 10, 2022 |
ULTRASOUND ENDOSCOPE
Abstract
Provided is an ultrasound endoscope capable of suppressing image
quality deterioration of an ultrasound image and achieving
reduction in diameter. An ultrasound endoscope includes an
insertion part that includes a distal end part having an ultrasound
transducer array in which a plurality of ultrasound transducers are
arranged, a cable that is inserted into the insertion part, and a
substrate that electrically connects the plurality of ultrasound
transducers and the cable, and is disposed in the distal end part.
The cable has a non-coaxial cable that includes a first cable
bundle consisting of a plurality of signal wires and a plurality of
ground wires, and a first shield layer with which the first cable
bundle is coated, and an outer coat with which a second cable
bundle consisting of a plurality of the non-coaxial cables is
coated. The substrate includes a plurality of electrode pads
connected to the plurality of ultrasound transducers, respectively.
Each first cable bundle is individually led out from the cable, and
each signal wire of the first cable bundle is led out and
electrically connected to the corresponding electrode pad of the
substrate. The plurality of ultrasound transducers are configured
in a plurality of drive units to be driven simultaneously. The
plurality of signal wires of each first cable bundle are connected
to a plurality of electrode pads in each drive unit to configure a
signal wire group, and the signal wire group includes at least two
kinds or more of signal wires different in length from a distal end
of the first cable bundle.
Inventors: |
IWAYA; Tatsuhiro;
(Ashigarakami-gun, JP) ; MORIMOTO; Yasuhiko;
(Ashigarakami-gun, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
FUJIFILM Corporation |
Tokyo |
|
JP |
|
|
Assignee: |
FUJIFILM Corporation
Tokyo
JP
|
Family ID: |
1000005755445 |
Appl. No.: |
17/381874 |
Filed: |
July 21, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A61B 1/0008 20130101;
A61B 1/00114 20130101; A61B 2562/182 20130101; A61B 8/4483
20130101 |
International
Class: |
A61B 1/00 20060101
A61B001/00; A61B 8/00 20060101 A61B008/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 8, 2020 |
JP |
2020-150293 |
Claims
1. An ultrasound endoscope comprising: an insertion part that
includes a distal end part having an ultrasound transducer array in
which a plurality of ultrasound transducers are arranged; a cable
that is inserted into the insertion part; and a substrate that
electrically connects the plurality of ultrasound transducers and
the cable, and is disposed in the distal end part, wherein the
cable has a non-coaxial cable that includes a first cable bundle
consisting of a plurality of signal wires and a plurality of ground
wires, and a first shield layer with which the first cable bundle
is coated, and an outer coat with which a second cable bundle
consisting of a plurality of the non-coaxial cables is coated, the
substrate includes a plurality of electrode pads connected to the
plurality of ultrasound transducers, respectively, each first cable
bundle is individually led out from the cable, and each signal wire
of the first cable bundle is led out and electrically connected to
the corresponding electrode pad of the substrate, the plurality of
ultrasound transducers are configured in a plurality of drive units
to be driven simultaneously, and the plurality of signal wires of
each first cable bundle are connected to a plurality of the
electrode pads in each drive unit to configure a signal wire group,
and the signal wire group includes at least two kinds or more of
signal wires different in length from a distal end of the first
cable bundle.
2. The ultrasound endoscope according to claim 1, wherein, in the
signal wire group, the signal wires in each first cable bundle have
an equal length, and the signal wires have two kinds or more of
lengths between the first cable bundles.
3. The ultrasound endoscope according to claim 1, wherein, in the
signal wire group, the signal wires in each first cable bundle have
two kinds or more of different lengths.
4. The ultrasound endoscope according to claim 3, wherein all the
signal wires in each first cable bundle have different lengths.
5. The ultrasound endoscope according to claim 1, wherein the
signal wire group includes at least one signal wire having a
different length.
6. The ultrasound endoscope according to claim 1, wherein the cable
includes a second shield layer with which the second cable bundle
is coated, inside the outer coat.
7. The ultrasound endoscope according to claim 6, wherein the cable
includes a resin layer with which the second cable bundle is
coated, between the second cable bundle and the second shield
layer.
8. The ultrasound endoscope according to claim 1, wherein the cable
includes a resin layer with which the second cable bundle is
coated, inside the outer coat.
9. The ultrasound endoscope according to claim 7, wherein the resin
layer is a fluorine-based resin layer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims priority under 35 U.S.C
.sctn. 119 to Japanese Patent Application No. 2020-150293 filed on
Sep. 8, 2020. The above application is hereby expressly
incorporated by reference, in its entirety, into the present
application.
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0002] The present invention relates to an ultrasound
endoscope.
2. Description of the Related Art
[0003] In recent years, an ultrasound endoscope that observes a
state inside a body of a subject by irradiating the inside of the
body with ultrasonic waves and receives reflected waves to capture
video has been used in medical practice.
[0004] For example, as disclosed in JP2019-054962A, such an
ultrasound endoscope comprises a distal end part that comprises
piezoelectric elements configuring ultrasound transducers, a
bending part and a flexible part connected to a proximal end of the
distal end part, a plurality of coaxial cables that are inserted
into the bending part and the flexible part, and a wiring substrate
that electrically connects the piezoelectric elements and the
coaxial cables.
SUMMARY OF THE INVENTION
[0005] Incidentally, a coaxial cable is formed by covering a shield
layer and an outer coat the periphery of one signal wire coated for
insulation. For this reason, the outside diameter of the coaxial
cable increases, and the ultrasound endoscope is hardly reduced in
diameter.
[0006] Accordingly, a case where an ultrasound endoscope is reduced
in diameter by applying a non-coaxial cable instead of the coaxial
cable is considered. However, in connection of a plurality of
signal wires included in the non-coaxial cable and the ultrasound
transducers, image quality deterioration (for example, unevenness)
may occur in an ultrasound image due to the length of the signal
wire.
[0007] The invention has been accomplished in view of such a
situation, and an object of the invention is to provide an
ultrasound endoscope capable of suppressing image quality
deterioration of an ultrasound image and achieving reduction in
diameter.
[0008] An ultrasound endoscope of a first aspect comprises an
insertion part that includes a distal end part having an ultrasound
transducer array in which a plurality of ultrasound transducers are
arranged, a cable that is inserted into the insertion part, and a
substrate that electrically connects the plurality of ultrasound
transducers and the cable, and is disposed in the distal end part.
The cable has a non-coaxial cable that includes a first cable
bundle consisting of a plurality of signal wires and a plurality of
ground wires, and a first shield layer with which the first cable
bundle is coated, and an outer coat with which a second cable
bundle consisting of a plurality of the non-coaxial cables is
coated. The substrate includes a plurality of electrode pads
connected to the plurality of ultrasound transducers, respectively.
Each first cable bundle is individually led out from the cable, and
each signal wire of the first cable bundle is led out and
electrically connected to the corresponding electrode pad of the
substrate. The plurality of ultrasound transducers are configured
in a plurality of drive units to be driven simultaneously. The
plurality of signal wires of each first cable bundle are connected
to a plurality of the electrode pads in each drive unit to
configure a signal wire group, and the signal wire group includes
at least two kinds or more of signal wires different in length from
a distal end of the first cable bundle.
[0009] In an ultrasound endoscope of a second aspect, in the signal
wire group, the signal wires in each first cable bundle have an
equal length, and the signal wires have two kinds or more of
lengths between the first cable bundles.
[0010] In an ultrasound endoscope of a third aspect, in the signal
wire group, the signal wires in each first cable bundle have two
kinds or more of different lengths.
[0011] In an ultrasound endoscope of a fourth aspect, all the
signal wires in each first cable bundle have different lengths.
[0012] In an ultrasound endoscope of a fifth aspect, the signal
wire group includes at least one signal wire having a different
length.
[0013] In an ultrasound endoscope of a sixth aspect, the cable
includes a second shield layer with which the second cable bundle
is coated, inside the outer coat.
[0014] In an ultrasound endoscope of a seventh aspect, the cable
includes a resin layer with which the second cable bundle is
coated, between the second cable bundle and the second shield
layer.
[0015] In an ultrasound endoscope of an eighth aspect, the cable
includes a resin layer with which the second cable bundle is
coated, inside the outer coat.
[0016] In an ultrasound endoscope of a ninth aspect, the resin
layer is a fluorine-based resin layer.
[0017] With the ultrasound endoscope according to the aspects of
the invention, it is possible to suppress image quality
deterioration of an ultrasound image and to achieve reduction in
diameter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] FIG. 1 is a schematic configuration diagram showing an
example of the configuration of an ultrasonography system.
[0019] FIG. 2 is a partial enlarged plan view showing a distal end
part of an ultrasound endoscope of FIG. 1 and the vicinity of the
distal end part.
[0020] FIG. 3 is a cross-sectional view taken along the line
III-III of FIG. 2.
[0021] FIG. 4 is a cross-sectional view taken along the line IV-IV
shown in FIG. 3.
[0022] FIG. 5 is a diagram showing a connection structure of a
substrate and non-coaxial cables.
[0023] FIG. 6 is a cross-sectional view of a non-coaxial cable
taken along the line VI-VI of FIG. 5.
[0024] FIG. 7 is a cross-sectional view of a cable taken along the
line VII-VII of FIG. 5.
[0025] FIG. 8 is a diagram illustrating a first embodiment of a
connection relationship between a plurality of ultrasound
transducers and a plurality of non-coaxial cables.
[0026] FIG. 9 is a diagram illustrating a second embodiment of a
connection relationship between a plurality of ultrasound
transducers and a plurality of non-coaxial cables.
[0027] FIG. 10 is a diagram illustrating a third embodiment of a
connection relationship between a plurality of ultrasound
transducers and a plurality of non-coaxial cables.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0028] Hereinafter, a preferred embodiment of an ultrasound
endoscope according to the invention will be described referring to
the accompanying drawings.
[0029] FIG. 1 is a schematic configuration diagram showing an
example of an ultrasonography system 10 that uses an ultrasound
endoscope 12 of an embodiment.
[0030] As shown in FIG. 1, the ultrasonography system 10 comprises
an ultrasound endoscope 12, an ultrasound processor device 14 that
generates an ultrasound image, an endoscope processor device 16
that generates an endoscope image, a light source device 18 that
supplies illumination light, with which the inside of a body cavity
is illuminated, to the ultrasound endoscope 12, and a monitor 20
that displays the ultrasound image and the endoscope image. The
ultrasonography system 10 comprises a water supply tank 21a that
stores cleaning water or the like, and a suction pump 21b that
sucks aspirates inside the body cavity.
[0031] The ultrasound endoscope 12 has an insertion part 22 that is
inserted into the body cavity of the subject, an operating part 24
that is consecutively provided in a proximal end portion of the
insertion part 22 and is used by an operator to perform an
operation, and a universal cord 26 that has one end connected to
the operating part 24.
[0032] In the operating part 24, an air and water supply button 28a
that opens and closes an air and water supply pipe line (not shown)
from the water supply tank 21a, and a suction button 28b that opens
and closes a suction pipe line (not shown) from the suction pump
21b are provided side by side. In the operating part 24, a pair of
angle knobs 29 and 29 and a treatment tool insertion port 30 are
provided.
[0033] In the other end portion of the universal cord 26, an
ultrasound connector 32a that is connected to the ultrasound
processor device 14, an endoscope connector 32b that is connected
to the endoscope processor device 16, and a light source connector
32c that is connected to the light source device 18 are provided.
The ultrasound endoscope 12 are attachably and detachably connected
to the ultrasound processor device 14, the endoscope processor
device 16, and the light source device 18 respectively through the
connectors 32a, 32b, and 32c. The connector 32c comprises an air
and water supply tube 34a that is connected to the water supply
tank 21a, and a suction tube 34b that is connected to the suction
pump 21b.
[0034] The insertion part 22 has, in order from a distal end side,
a distal end part 40 having an ultrasound observation part 36 and
an endoscope observation part 38, a bending part 42 that is
consecutively provided on a proximal end side of the distal end
part 40, and a flexible part 43 that couples a proximal end side of
the bending part 42 and the distal end side of the operating part
24.
[0035] The bending part 42 is remotely bent and operated by
rotationally moving and operating a pair of angle knobs 29 and 29
provided in the operating part 24. With this, the distal end part
40 can be directed in a desired direction.
[0036] The ultrasound processor device 14 generates and supplies an
ultrasound signal for making an ultrasound transducer array 50 of
an ultrasound transducer unit 46 (see FIG. 2) of the ultrasound
observation part 36 described below generate an ultrasonic wave.
The ultrasound processor device 14 receives and acquires an echo
signal reflected from an observation target part irradiated with
the ultrasonic wave, by the ultrasound transducer array 50 and
executes various kinds of signal processing on the acquired echo
signal to generate an ultrasound image that is displayed on the
monitor 20.
[0037] The endoscope processor device 16 receives and acquires a
captured image signal acquired from the observation target part
illuminated with illumination light from the light source device 18
in the endoscope observation part 38 and execute various kinds of
signal processing and image processing on the acquired image signal
to generate an endoscope image that is displayed on the monitor
20.
[0038] The ultrasound processor device 14 and the endoscope
processor device 16 are configured with two devices (computers)
provided separately. Note that the invention is not limited
thereto, and both the ultrasound processor device 14 and the
endoscope processor device 16 may be configured with one
device.
[0039] To image an observation target part inside a body cavity
using the endoscope observation part 38 to acquire an image signal,
the light source device 18 generates illumination light, such as
white light including light of three primary colors of red light,
green light, and blue light or light of a specific wavelength.
Light propagates through a light guide (not shown) and the like in
the ultrasound endoscope 12, and is emitted from the endoscope
observation part 38, and the observation target part inside the
body cavity is illuminated with light.
[0040] The monitor 20 receives video signals generated by the
ultrasound processor device 14 and the endoscope processor device
16 and displays an ultrasound image and an endoscope image. In
regard to the display of the ultrasound image and the endoscope
image, only one image may be appropriately switched and displayed
on the monitor 20 or both images may be displayed
simultaneously.
[0041] In the embodiment, although the ultrasound image and the
endoscope image are displayed on one monitor 20, a monitor for
ultrasound image display and a monitor for endoscope image display
may be provided separately. Alternatively, the ultrasound image and
the endoscope image may be displayed in a display form other than
the monitor 20, for example, in a form of being displayed on a
display of a terminal carried with the operator.
[0042] Next, the configuration of the distal end part 40 will be
described referring to FIGS. 2 to 4.
[0043] FIG. 2 is a partial enlarged plan view showing the distal
end part 40 shown in FIG. 1 and the vicinity thereof the distal end
part 40. FIG. 3 is a cross-sectional view taken along the line
shown in FIG. 2, and is a longitudinal sectional view of the distal
end part 40 taken along a center line thereof in a longitudinal
axis direction. FIG. 4 is a cross-sectional view taken along the
line Iv-Iv shown in FIG. 3, and is a cross-sectional view of the
ultrasound transducer array 50 of the ultrasound observation part
36 of the distal end part 40 taken along a center line of an arc
structure.
[0044] As shown in FIGS. 2 and 3, in the distal end part 40, the
ultrasound observation part 36 that acquires an ultrasound image is
mounted on the distal end side, and the endoscope observation part
38 that acquires an endoscope image is mounted on the proximal end
side. In the distal end part 40, a treatment tool lead-out port 44
is provided between the ultrasound observation part 36 and the
endoscope observation part 38.
[0045] The endoscope observation part 38 is configured with an
observation window 82, an objective lens 84, a solid-state imaging
element 86, illumination windows 88, a cleaning nozzle 90, a wiring
cable 92, and the like.
[0046] The treatment tool lead-out port 44 is connected to a
treatment tool channel 45 that is inserted into the insertion part
22. A treatment tool (not shown) inserted from the treatment tool
insertion port 30 of FIG. 1 is let out from the treatment tool
lead-out port 44 into the body cavity through the treatment tool
channel 45.
[0047] As shown in FIGS. 2 to 4, the ultrasound observation part 36
comprises the ultrasound transducer unit 46, an exterior member 41
that holds the ultrasound transducer unit 46, and a cable 100 that
is electrically connected to the ultrasound transducer unit 46
through a substrate 60. The exterior member 41 is made of a rigid
member, such as rigid resin, and configures a part of the distal
end part 40.
[0048] The ultrasound transducer unit 46 has the ultrasound
transducer array 50 that consists of a plurality of ultrasound
transducers 48, an electrode 52 that is provided on an end side of
the ultrasound transducer array 50 in a width direction (a
direction perpendicular to the longitudinal axis direction of the
insertion part 22), a backing material layer 54 that supports each
ultrasound transducer 48 from a lower surface side, the substrate
60 that is disposed along a side surface of the backing material
layer 54 in the width direction and is connected to the electrode
52, and a filler layer 80 with which an internal space 55 between
the exterior member 41 and the backing material layer 54 is
filled.
[0049] As long as the substrate 60 can electrically connect a
plurality of ultrasound transducers 48 and the cable 100, in
particular, the structure thereof is not limited.
[0050] It is preferable that the substrate 60 is configured with,
for example, a wiring substrate, such as a flexible substrate
(flexible print substrate (also referred to as a flexible printed
circuit (FPC)) having flexibility, a printed wiring circuit
substrate (also referred to as a printed circuit board (PCB)) made
of a rigid substrate having high rigidity with no flexibility, or a
printed wiring substrate (also referred to as a printed wired board
(PWB)).
[0051] The ultrasound transducer unit 46 has an acoustic matching
layer 76 laminated on the ultrasound transducer array 50, and an
acoustic lens 78 laminated on the acoustic matching layer 76. That
is, the ultrasound transducer unit 46 is configured as a laminate
47 having the acoustic lens 78, the acoustic matching layer 76, the
ultrasound transducer array 50, and the backing material layer
54.
[0052] The ultrasound transducer array 50 is configured with a
plurality of rectangular parallelepiped ultrasound transducers 48
arranged in a convex arc shape outward. The ultrasound transducer
array 50 is an array of 48 to 192 channels including 48 to 192
ultrasound transducers 48, for example. Each of the ultrasound
transducer 48 has a piezoelectric body 49.
[0053] The ultrasound transducer array 50 has the electrode 52. The
electrode 52 has an individual electrode 52a individually and
independently provided for each ultrasound transducer 48, and a
transducer ground 52b that is a common electrode common to all the
ultrasound transducers 48. In FIG. 4, a plurality of individual
electrodes 52a are disposed on lower surfaces of end portions of a
plurality of ultrasound transducers 48, and the transducer ground
52b is disposed on upper surfaces of the end portions of the
ultrasound transducers 48.
[0054] The substrate 60 has 48 to 192 wirings (not shown) that are
electrically connected to the individual electrodes 52a of the 48
to 192 ultrasound transducers 48, respectively, and a plurality of
electrode pads 62 that are connected to the ultrasound transducers
48 through the wirings, respectively.
[0055] The ultrasound transducer array 50 has a configuration in
which a plurality of ultrasound transducers 48 are arranged at a
predetermined pitch in a one-dimensional array as an example. The
ultrasound transducers 48 configuring the ultrasound transducer
array 50 are arranged at regular intervals in a convex bent shape
along an axial direction of the distal end part 40 (the
longitudinal axis direction of the insertion part 22) and are
sequentially driven based on drive signals input from the
ultrasound processor device 14 (see FIG. 1). With this, convex
electronic scanning is performed with a range where the ultrasound
transducers 48 shown in FIG. 2 are arranged, as a scanning
range.
[0056] The acoustic matching layer 76 is a layer that is provided
for taking acoustic impedance matching between the subject and the
ultrasound transducers 48.
[0057] The acoustic lens 78 is a lens that is provided for
converging the ultrasonic waves emitted from the ultrasound
transducer array 50 toward the observation target part. The
acoustic lens 78 is formed of, for example, silicon-based resin
(millable type silicon rubber, liquid silicon rubber, or the lie),
butadiene-based resin, or polyurethane-based resin. In the acoustic
lens 78, powder, such as titanium oxide, alumina, or silica, is
mixed as necessary. With this, the acoustic lens 78 can take
acoustic impedance matching between the subject and the ultrasound
transducers 48 in the acoustic matching layer 76, and can increase
the transmittance of the ultrasonic waves.
[0058] As shown in FIGS. 3 and 4, the backing material layer 54 is
disposed on an inside with respect to the arrangement surface of a
plurality of ultrasound transducers 48, that is, a rear surface
(lower surface) of the ultrasound transducer array 50. The backing
material layer 54 is made of a layer of a member made of a backing
material. The backing material layer 54 has a role of mechanically
and flexibly supporting the ultrasound transducer array 50 and
attenuating ultrasonic waves propagated to the backing material
layer 54 side among ultrasound signals emitted from a plurality of
ultrasound transducers 48 or reflected propagated from the
observation target. For this reason, the backing material is made
of a material having rigidity, such as hard rubber, and an
ultrasonic wave attenuation material (ferrite, ceramics, or the
like) is added as needed.
[0059] The filler layer 80 is a layer with which the internal space
55 between the exterior member 41 and the backing material layer 54
is filled, and has a role of fixing the substrate 60, the
non-coaxial cables 110, and various wiring portions. It is
preferable that the acoustic impedance of the filler layer 80
matches the acoustic impedance of the backing material layer 54
with given accuracy or higher such that the ultrasound signals
propagated from the ultrasound transducer array 50 to the backing
material layer 54 side are not reflected at a boundary surface
between the filler layer 80 and the backing material layer 54. It
is preferable that the filler layer 80 is made of a member having
heat dissipation to increase efficiency in dissipating heat
generated in a plurality of ultrasound transducers 48. In a case
where the filler layer 80 has heat dissipation, heat is received
from the backing material layer 54, the substrate 60, the
non-coaxial cables 110, and the like, and thus, heat dissipation
efficiency can be improved.
[0060] With the ultrasound transducer unit 46 configured as
described above, in a case where each ultrasound transducer 48 of
the ultrasound transducer array 50 is driven, and a voltage is
applied to the electrode 52 of the ultrasound transducer 48, the
piezoelectric body 49 vibrates to sequentially generate ultrasonic
waves, and the irradiation of the ultrasonic waves is performed
toward the observation target part of the subject. Then, as a
plurality of ultrasound transducers 48 are sequentially driven by
an electronic switch, such as a multiplexer, scanning with
ultrasonic waves is performed in a scanning range along a curved
surface on which the ultrasound transducer array 50 is disposed,
for example, a range of about several tens mm from the center of
curvature of the curved surface.
[0061] In a case where the echo signal reflected from the
observation target part is received, the piezoelectric body 49
vibrates to generate a voltage and outputs the voltage as an
electric signal corresponding to the received ultrasound echo to
the ultrasound processor device 14. Then, the electric signal is
subjected to various kinds of signal processing in the ultrasound
processor device 14 and is displayed as an ultrasound image on the
monitor 20.
[0062] In the embodiment, the substrate 60 shown in FIG. 4 has, at
one end, a plurality of electrode pads 62 that are electrically
connected to a plurality of individual electrodes 52a, and a ground
electrode pad 64 that is electrically connected to the transducer
ground 52b. In FIG. 4, the cable 100 is omitted.
[0063] Electrical bonding of the substrate 60 and the individual
electrodes 52a can be established by, for example, a resin material
having conductivity. Examples of the resin material include an
anisotropic conductive film (ACF) or an anisotropic conductive
paste (ACP) obtained by mixing thermosetting resin with fine
conductive particles and forming the mixture into a film.
[0064] As another resin material, for example, a resin material in
which a conductive filler, such as metallic particles, is dispersed
into binder resin, such as epoxy or urethane, and the filler forms
a conductive path after adhesion may be used. Examples of this
resin material include a conductive paste, such as a silver
paste.
[0065] As shown in FIG. 3, the cable 100 comprises a plurality of
non-coaxial cables 110, and an outer coat 102 with which a
plurality of non-coaxial cables 110 are coated. Signal wires
included in the non-coaxial cable 110 are electrically bonded to
the electrode pads 62 of the substrate 60.
[0066] Next, a connection structure of the substrate 60 and the
cable 100 will be described referring to the drawings.
[0067] FIG. 5 is an enlarged view of a portion including the
substrate 60 and the cable 100. FIG. 6 is a cross-sectional view
taken along the line VI-VI. FIG. 7 is a cross-sectional view taken
along the line VII-VII.
[0068] As shown in FIG. 5, the substrate 60 has a plurality of
electrode pads 62 disposed along a side 60a on a proximal end side,
and the ground electrode pad 64 disposed between a plurality of
electrode pads 62 and the side 60a. The ground electrode pad 64 is
disposed in parallel to the side 60a.
[0069] The cable 100 is disposed at a position facing the side 60a
of the substrate 60. The cable 100 comprises a plurality of
non-coaxial cables 110, and the outer coat 102 that covers a
plurality of non-coaxial cables 110. The electrode pads 62 and
signal wires 112 of the non-coaxial cables 110 are electrically
bonded. The non-coaxial cables 110 are disposed in parallel with a
side 60b and a side 60c perpendicular to the side 60a. Note that a
positional relationship between the substrate 60 and the
non-coaxial cables 110 is not particularly limited.
[0070] Next, the structure of the non-coaxial cables 110 will be
described. As shown in FIG. 6, each non-coaxial cable 110 has a
plurality of signal wires 112 and a plurality of ground wires 114.
Each signal wire 112 is made of, for example, a conductor 112a, and
an insulating layer 112b with which the periphery of the conductor
112a is coated. The conductor 112a is made of, for example, an
element wire, such as copper or copper alloy. The element wire is
subjected to, for example, plating processing, such as tin plating
or silver plating. The conductor 112a has a diameter of 0.03 mm to
0.04 mm.
[0071] The insulating layer 112b can be made of, for example, a
resin material, such as fluorinated-ethylene-propylene (FEP) or
perfluoroalkoxy (PFA). The insulating layer 112b has a thickness of
0.015 mm to 0.025 mm.
[0072] Each ground wire 114 is made of a conductor having the same
diameter as the signal wire 112. The ground wire 114 is made of an
element wire, such as copper or copper alloy, or a stranded wire
obtained by stranding a plurality of element wires, such as copper
or copper alloy.
[0073] A first cable bundle 116 is configured by stranding a
plurality of signal wires 112 and a plurality of ground wires
114.
[0074] Each non-coaxial cable 110 comprises a first shield layer
118 with which the periphery of the first cable bundle 116 is
coated. The first shield layer 118 can be made of an insulating
film obtained by laminating metallic foils through an adhesive. The
insulating film is made of a polyethylene terephthalate (PET) film.
The metallic foil is made of an aluminum foil or a copper foil.
[0075] The non-coaxial cable 110 is shielded by the first shield
layer 118 with a plurality of signal wires 112 as one set. The
signal wires 112 are handled in a unit of the non-coaxial cable
110.
[0076] As shown in FIG. 6, in the non-coaxial cable 110 of the
embodiment, the first cable bundle 116 is configured by stranding
seven wires in total of four signal wires 112 and three ground
wires. One signal wire 112 of the four signal wires 112 is disposed
at the center. The remaining three signal wires 112 and the three
ground wires 114 are disposed adjacently in the periphery of the
signal wire 112 at the center. Note that the number of signal wires
112, the number of ground wires 114, and the disposition of the
wires in the first cable bundle 116 are not limited to the
structure of FIG. 6.
[0077] Next, the structure of the cable 100 will be described. As
shown in FIG. 7, the cable 100 comprises a plurality of non-coaxial
cables 110. A second cable bundle 104 is configured with a
plurality of non-coaxial cables 110.
[0078] The second cable bundle 104 is coated with the outer coat
102. The outer coat 102 can be made of a fluorine-based resin
material, such as extruded and coated PFA, FEP, an
ethylene/ethylene tetrafluoride copolymer (ETFE), or polyvinyl
chloride (PVC). The outer coat 102 can be made of a wound resin
tape (PET tape). The coating of the second cable bundle 104 with
the outer coat 102 includes a case where the outside of the second
cable bundle 104 is coated directly and a case where the outside of
the second cable bundle 104 is coated indirectly. Indirect coating
includes disposing another layer between the outer coat 102 and the
second cable bundle 104.
[0079] The cable 100 of the embodiment comprises, in order from the
inside, a resin layer 106 and a second shield layer 108 between the
outer coat 102 and the second cable bundle 104. The second cable
bundle 104 is coated with the resin layer 106. The resin layer 106
can be made of, for example, the fluorine-based resin material or
the resin tape described above.
[0080] The second shield layer 108 may be configured by, for
example, braiding a plurality of element wires. The element wire is
made of a copper wire, a copper alloy wire, or the like subjected
to plating processing (tin plating or silver plating).
[0081] The cable 100 may not comprise both the resin layer 106 and
the second shield layer 108 other than the above-described
configuration or may comprise only one of the resin layer 106 or
the second shield layer 108.
[0082] The cable 100 of the embodiment includes 16 non-coaxial
cables 110, and includes 64 signal wires 112. The number of
non-coaxial cables 110 and the number of signal wires 112 are not
limited to the numerical values.
[0083] As described above, the non-coaxial cable 110 included in
the cable 100 does not comprise a shield layer and an outer coat
for each signal wire 112, unlike the coaxial cable in the related
art. In particular, in a case where the cable 100 is configured
with a plurality of non-coaxial cables 110, the cable 100 can be
reduced in diameter compared to the coaxial cable in the related
art. In a case where the outside diameter is the same as the
outside diameter of the coaxial cable, the cable 100 can comprise a
greater number of signal wires 112 than the coaxial cable in the
related art.
[0084] Next, a connection structure of the substrate 60 and the
non-coaxial cables 110 will be described in detail. As shown in
FIG. 5, on the proximal end side of the substrate 60, the resin
layer 106 (not shown), the second shield layer 108 (not shown), and
the outer coat 102 of the cable 100 are removed, and a plurality of
non-coaxial cables 110 are exposed. On the proximal end side of the
substrate 60, the first shield layer 118 of each non-coaxial cable
110 is removed, and the first cable bundle 116 is exposed.
[0085] The first shield layer 118 is positioned on the substrate
60, and the substrate 60 and the first shield layer 118 overlap at
least partially as viewed from a direction perpendicular to a
principal surface of the substrate 60 (hereinafter, in plan view).
The first cable bundle 116 is exposed only on the substrate 60, and
the substrate 60 and the first cable bundle 116 overlap only on the
substrate 60. The first cable bundle 116 does not protrude from the
substrate 60, and thus, the whole first cable bundle 116 is
superimposed on the substrate 60.
[0086] The substrate 60 and the first cable bundle 116 are fixed by
a fixing part 130, and the relative positions of the substrate 60
and each first cable bundle 116 are fixed. The fixing part 130
fixes the substrate 60 and the first cable bundle 116 in a state
overlapping the substrate 60. The first cable bundle 116 configured
with a stranded wire of a plurality of signal wires 112 and a
plurality of ground wires 114 is unstranded into the respective
signal wires 112 at a distal end 116a. Each unstranded signal wire
112 is electrically bonded to the electrode pad 62 disposed on the
substrate 60. The distal end 116a is a start position where each
signal wire 112 is unstranded. In some first cable bundles 116, the
fixing part 130 is omitted for ease of understanding.
[0087] As described above, each signal wire 112 of the non-coaxial
cable 110 is configured with the conductor 112a and the insulating
layer 112b, and a shield layer is not provided for each signal wire
112, unlike a coaxial cable. For this reason, the signal wires 112
are likely to be disconnected at the time of a wiring work of
electrically bonding the electrode pads 62 and the signal wires
112, subsequent handling, and an assembling step to the probe.
[0088] In the embodiment, preferably, the substrate 60 and the
first cable bundle 116 are fixed by the fixing part 130.
Accordingly, when stress is applied to the cable 100 or the
non-coaxial cable 110, stress is prevented from being transmitted
to a bonded portion of the electrode pad 62 and the signal wire
112, and disconnection of the signal wire 112 can be prevented.
[0089] The fixing part 130 is not particularly limited as long as
the relative positional relationship between the substrate 60 and
the first cable bundle 116 can be fixed, and for example, any one
of an adhesive, solder, or a clamp member, or a combination thereof
can be applied. The fixing part 130 can individually fix the
substrate 60 and the first cable bundle 116 or can fix the
substrate 60 and a plurality of first cable bundles 116 in a
lump.
[0090] The ground wires 114 of each first cable bundle 116 are
electrically bonded to the ground electrode pad 64 of the substrate
60. At least one ground wire 114 included in each first cable
bundle 116 is electrically bonded to the ground electrode pad 64. A
plurality of ground wires 114 are in contact with each other in the
first cable bundle 116. Accordingly, at least one ground wire 114
of each first cable bundle 116 is electrically bonded to the ground
electrode pad 64, where the ground potentials of a plurality of
first cable bundles 116 can be at the same potential. A region
occupied by the wires can be reduced by reducing the number of
ground wires 114 that are electrically bonded to the ground
electrode pad 64. As a result, it is possible to achieve reduction
in diameter of the distal end part 40.
[0091] In the connection structure shown in FIG. 5, the electrode
pads 62 corresponding to each non-coaxial cable 110 are
collectively disposed. That is, four electrode pads 62 that are
electrically bonded to the four signal wires 112 are collectively
disposed on the substrate 60. It is preferable that the electrode
pads 62 corresponding to the non-coaxial cable 110 are the
electrode pads 62 that are disposed in an extension direction of
the non-coaxial cable 110. It is preferable that the signal wires
112 of each non-coaxial cable 110 are not electrically bonded to
the electrode pads 62 of an adjacent non-coaxial cable 110. It is
possible to prevent stress from being applied to the signal wires
112.
[0092] In the connection structure shown in FIG. 5, the positions
of the electrode pads 62 connected to the signal wires 112 of the
non-coaxial cable 110 are different between adjacent non-coaxial
cables 110. In comparison of the electrode pads 62 corresponding to
the non-coaxial cable 110 closest to the side 60b with the
electrode pads 62 corresponding to the non-coaxial cable 110 second
closest to the side 60b, a distance L from the distal end 116a of
the first cable bundle 116 fixed by the fixing part 130 is
different. There are two kinds of distances L different between the
first cable bundles 116.
[0093] As a result, a plurality of electrode pads 62 corresponding
to the signal wires 112 of the non-coaxial cable 110 are disposed
in zigzags for every plurality of electrode pads 62 in plan view.
It is possible to narrow an interval between a plurality of
adjacent electrode pads 62, and to dispose a plurality of electrode
pads 62 with high density compared to a case where a plurality of
electrode pads 62 are not disposed in zigzags (a case where a
plurality of electrode pads 62 are disposed linearly along the side
60a).
[0094] In the embodiment, although the two kinds of distances L are
shown, two kinds or more of distances L can be set. It is possible
to dispose a plurality of electrode pads 62 with higher
density.
[0095] The lengths of the signal wires 112 are different between
the first cable bundles 116 of the non-coaxial cables 110
corresponding to the electrode pads 62 disposed in zigzags.
[0096] On the other hand, in a unit of the non-coaxial cables 110,
the distance L between the electrode pads 62 corresponding to a
plurality of signal wires 112 and the distal end 116a of the first
cable bundle 116 are equal.
[0097] Next, a first embodiment of a connection relationship
between a plurality of ultrasound transducers 48 and a plurality of
non-coaxial cables 110 will be described referring to FIG. 8. A
case where the ultrasound transducer array 50 includes, for
example, 64 ultrasound transducers 48 will be described.
[0098] As shown in FIG. 8, the 64 ultrasound transducers 48 are
configured in four drive units U1, U2, U3, and U4 to be driven
simultaneously. In the embodiment, one drive unit U1 includes 16
(16 channels of) ultrasound transducers 48 corresponding to P1, P2,
. . . , and P16. One ultrasound beam is formed by collectively
driving the 16 channels of ultrasound transducers 48. In this
manner, an ultrasound beam with desired intensity can be formed.
The drive unit U2 includes 16 (16 channels) ultrasound transducers
48 corresponding to P17 to P32 (not shown), the drive unit U3
includes 16 (16 channels) ultrasound transducers 48 corresponding
to P33 to P48 (not shown), and the drive unit U4 includes 16 (16
channels) ultrasound transducer 48 corresponding to P49, P50, . . .
, and P64.
[0099] As described above, in each signal wire 112 of the
non-coaxial cable 110, a shield layer is not provided for each
signal wire 112, unlike a coaxial cable. For this reason, the
length of the signal wire 112 has an influence on the magnitude of
electric capacity of the signal wire 112. As a length (distance L)
of the signal wire 112 from the distal end of the first cable
bundle 116 is longer, the electric capacity is greater, and as
length (distance L) of the signal wire 112 is shorter, the electric
capacity is smaller. The length of the signal wire 112 has an
influence on an attenuation amount of transmission and reception
sensitivity. As the length (distance L) of the signal wire 112 is
longer, the attenuation amount of the transmission and reception
sensitivity is greater, and there is an influence on the
transmission and reception sensitivity.
[0100] In the connection structure shown in FIG. 5, there are two
kinds of distances L. In this situation, for example, the signal
wires 112 having a short distance L are electrically connected to
all the 16 channels in the drive unit U1, and the signal wires 112
having a long distance L are electrically connected to all the 16
channels in the drive unit U4.
[0101] In this case, an ultrasound beam that is generated from the
ultrasound transducers 48 in the drive unit U4 is smaller than an
ultrasound beam that is generated from the ultrasound transducers
48 in the drive unit U1. In the drive unit U1 and the drive unit
U4, a difference in intensity of the generated ultrasound beam is
increased due to the lengths of the signal wires 112. As a result,
image quality deterioration (for example, unevenness) of an
ultrasound image occurs.
[0102] In the first embodiment, as shown in FIG. 8, a plurality of
signal wires 112 of the respective first cable bundles 116 are
connected to a plurality of electrode pads 62 electrically
connected to the drive unit U1 to configure a signal wire group G1.
In the first embodiment, a plurality of signal wires 112 in each
first cable bundle 116 have an equal length (distance L).
[0103] The signal wires 112 have two kinds of lengths between the
first cable bundles 116. That is, in a unit of the first cable
bundle 116, the signal wires 112 have an equal length. The signal
wire group G1 comprises two kinds of first cable bundles 116
including the signal wires 112 different in length (different in
distance L) from the distal end.
[0104] The signal wire groups G2, G3, and G4 connected to a
plurality of electrode pads 62 in the drive units U2, U3, and U4
similarly also include two kinds or more of signal wires 112
(having two kinds of distances L) different in length of the distal
end from the first cable bundle 116.
[0105] In the signal wire groups G1, G2, G3, and G4, the signal
wires 112 may have two kinds or more of lengths.
[0106] For example, the signal wire group G1 is configured with two
kinds of first cable bundles of the first cable bundle 116
including the short signal wires 112 and the first cable bundle 116
including the long signal wires 112.
[0107] Since each of the signal wire groups G1, G2, G3, and G4
includes the signal wires 112 having two kinds or more of lengths
(distances L), it is possible to reduce a difference in intensity
of the generated ultrasound beam among the drive units U1, U2, U3,
and U4. As a result, it is possible to suppress deterioration of
image quality of an ultrasound image.
[0108] Next, a second embodiment of a connection relationship
between a plurality of ultrasound transducers 48 and a plurality of
non-coaxial cables 110 will be described referring to FIG. 9. The
same configurations as those in the first embodiment are
represented by the same reference numerals, and description thereof
may not be repeated.
[0109] In a signal wire group G1 of the second embodiment, four
signal wires 112 in the first cable bundle 116 have different
lengths. All the four signal wires 112 of the first cable bundle
116 have different lengths. Similarly, in signal wire groups G2,
G3, and G4, all the four signal wires 112 of the first cable bundle
116 have different lengths. That is, in plan view, a plurality of
electrode pads 62 corresponding to the first cable bundle 116 are
disposed sequentially shifted along a longitudinal axis direction
(a direction along the side 60b) (not shown) of the cable. Note
that all the lengths of the signal wires 112 included in the first
cable bundle 116 of each of the signal wire groups G1, G2, G3, and
G4 do not need to be different, and the first cable bundle 116 may
include the signal wires 112 having at least two kinds of
lengths.
[0110] Since the signal wire groups G1, G2, G3, and G4 of the
second embodiment includes the signal wires 112 having two kinds or
more of lengths (distances L), as in the first embodiment, it is
possible to reduce a difference in intensity of the generated
ultrasound beam among the drive units U1, U2, U3, and U4. As a
result, it is possible to suppress deterioration of image quality
of an ultrasound image.
[0111] Next, a third embodiment of a connection relationship
between a plurality of ultrasound transducers 48 and a plurality of
non-coaxial cables 110 will be described referring to FIG. 10. The
same configurations as those in the first embodiment and the second
embodiment are represented by the same reference numerals, and
description thereof may not be repeated.
[0112] A signal wire group G1 of the third embodiment comprises a
plurality of first cable bundles 116, and one first cable bundle
116 comprises at least one signal wire 112 having a different
length. The signal wire group G1 comprises the signal wires 112
having the same length, excluding one signal wire 112 having a
different length. Similarly, the signal wire groups G2, G3, and G4
comprise a plurality of first cable bundles 116, and one first
cable bundle 116 comprises at least one signal wire 112 having a
different length. The signal wire group G1 includes the signal
wires 112 having at least two kinds of lengths.
[0113] Since the signal wire groups G1, G2, G3, and G4 of the third
embodiment includes the signal wires 112 having two kinds or more
of lengths (distances L), as in the first embodiment, it is
possible to reduce a difference in intensity of the generated
ultrasound beam among the drive units U1, U2, U3, and U4. As a
result, it is possible to suppress deterioration of image quality
of an ultrasound image.
[0114] Although the invention has been described, the invention is
not limited to the above-described example, and various
improvements or modifications may be of course made without
departing from the spirit and scope of the invention.
EXPLANATION OF REFERENCES
[0115] 10: ultrasonography system [0116] 12: ultrasound endoscope
[0117] 14: ultrasound processor device [0118] 16: endoscope
processor device [0119] 18: light source device [0120] 20: monitor
[0121] 21a: water supply tank [0122] 21b: suction pump [0123] 22:
insertion part [0124] 24: operating part [0125] 26: universal cord
[0126] 28a: air and water supply button [0127] 28b: suction button
[0128] 29: angle knob [0129] 30: treatment tool insertion port
[0130] 32a: connector [0131] 32b: connector [0132] 32c: connector
[0133] 34a: air and water supply tube [0134] 34b: suction tube
[0135] 36: ultrasound observation part [0136] 38: endoscope
observation part [0137] 40: distal end part [0138] 41: exterior
member [0139] 42: bending part [0140] 43: flexible part [0141] 44:
treatment tool lead-out port [0142] 45: treatment tool channel
[0143] 46: ultrasound transducer unit [0144] 47: laminate [0145]
48: ultrasound transducer [0146] 49: piezoelectric body [0147] 50:
ultrasound transducer array [0148] 52: electrode [0149] 52a:
individual electrode [0150] 52b: transducer ground [0151] 54:
backing material layer [0152] 55: internal space [0153] 56: coaxial
cable [0154] 60: substrate [0155] 60a: side [0156] 60b: side [0157]
60c: side [0158] 62: electrode pad [0159] 64: ground electrode pad
[0160] 76: acoustic matching layer [0161] 78: acoustic lens [0162]
80: filler layer [0163] 82: observation window [0164] 84: objective
lens [0165] 86: solid-state imaging element [0166] 88: illumination
window [0167] 90: cleaning nozzle [0168] 92: wiring cable [0169]
100: cable [0170] 102: outer coat [0171] 104: second cable bundle
[0172] 106: resin layer [0173] 108: second shield layer [0174] 110:
non-coaxial cable [0175] 112: signal wire [0176] 112a: conductor
[0177] 112b: insulating layer [0178] 114: ground wire [0179] 116:
first cable bundle [0180] 116a: distal end [0181] 118: first shield
layer [0182] 130: fixing part [0183] G1: signal wire group [0184]
G2: signal wire group [0185] G3: signal wire group [0186] G4:
signal wire group [0187] U1: drive unit [0188] U2: drive unit
[0189] U3: drive unit [0190] U4: drive unit
* * * * *