U.S. patent application number 16/651870 was filed with the patent office on 2022-01-13 for wafer-level package assembly handling.
The applicant listed for this patent is Rudolph Technologies, Inc.. Invention is credited to Kevin Barr, Edward Condon.
Application Number | 20220012261 16/651870 |
Document ID | / |
Family ID | 1000006048745 |
Filed Date | 2022-01-13 |
United States Patent
Application |
20220012261 |
Kind Code |
A2 |
Barr; Kevin ; et
al. |
January 13, 2022 |
WAFER-LEVEL PACKAGE ASSEMBLY HANDLING
Abstract
A chuck assembly includes an upper surface configured to support
a wafer-level package assembly and a clamping mechanism securing
the wafer-level package assembly to the upper surface.
Inventors: |
Barr; Kevin; (Bloomington,
MN) ; Condon; Edward; (Sandown, NH) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Rudolph Technologies, Inc. |
Wilmington |
MA |
US |
|
|
Prior
Publication: |
|
Document Identifier |
Publication Date |
|
US 20200257699 A1 |
August 13, 2020 |
|
|
Family ID: |
1000006048745 |
Appl. No.: |
16/651870 |
Filed: |
September 28, 2018 |
PCT Filed: |
September 28, 2018 |
PCT NO: |
PCT/US2018/053300 PCKC 00 |
371 Date: |
March 27, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62564400 |
Sep 28, 2017 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 16/288 20190101;
G06F 16/258 20190101; G06F 16/26 20190101; G06F 16/176
20190101 |
International
Class: |
G06F 16/25 20060101
G06F016/25; G06F 16/176 20060101 G06F016/176; G06F 16/26 20060101
G06F016/26; G06F 16/28 20060101 G06F016/28 |
Claims
1. A wafer-level package handling system, comprising: a chuck
assembly defining an upper surface configured to support a
wafer-level package assembly; a clamping mechanism securing the
wafer-level package assembly to the upper surface.
2. The handling system of claim 1, wherein the clamping mechanism
includes a central opening aligned with the wafer-level package
assembly.
3. The handling system of claim 1, wherein the clamping mechanism
includes a latch mechanism extending around a side edge of the
chuck assembly and applying pressure between the clamping mechanism
and the wafer-level package assembly.
4. The handling system of claim 1, wherein the latch mechanism is
spring loaded.
5. The handling system of claim 1, wherein the upper surface
includes an elastomeric ring configured to create a seal between
the clamping mechanism and the upper surface and a vacuum to apply
pressure to the wafer-level package assembly toward the upper
surface.
6. The handling system of claim 1, further comprising an optical
system used to inspect the wafer-level package assembly.
7. The handling system of claim 1, further comprising a placement
mechanism configured to position the clamping mechanism relative to
the wafer-level package assembly.
8. The handling system of claim 7, further comprising an actuator
configured to operate a latch mechanism to secure the clamping
mechanism to the chuck assembly.
9. A method of handling a package assembly of a semiconductor
device, comprising: loading the package assembly on a surface of a
chuck assembly; positioning a cover over the package assembly;
applying pressure to the cover to secure the package assembly to
the surface; and inspecting the package assembly.
10. The method of claim 9, further comprising: aligning an aperture
of the cover with the package assembly.
11. The method of claim 9, wherein applying pressure includes
operating a latching mechanism around an edge of the chuck
assembly.
12. The method of claim 11, further comprising: operating a
placement mechanism to position the cover with respect to the
package assembly.
13. The method of claim 12, further comprising: using an arm of the
placement mechanism to operate the latching mechanism.
14. The method of claim 11, further comprising: operating the
placement mechanism to remove the cover from the chuck
assembly.
15. The method of claim 13, further comprising: loading a second
package assembly onto the chuck assembly; operating the placement
mechanism to position the cover with respect to the second package
assembly; and applying pressure to the cover to secure the second
package assembly to the chuck assembly.
16. The method of claim 11, wherein the latching mechanism is
spring loaded.
17. The method of claim 11, wherein the latching mechanism extends
through a bore in the cover, the latching mechanism including a
finger operable from a first position in which the finger engages
the chuck assembly to secure the cover to the chuck assembly to a
second position in which the finger engages the cover to lift the
cover relative to the chuck assembly.
18. The method of claim 9, further comprising: using an optical
system to inspect the package assembly.
19. The method of claim 18, further comprising: moving the chuck
assembly relative to the optical system.
20. A wafer-level package assembly formed according to the method
of claim 9.
Description
BACKGROUND
[0001] Wafer-level package assemblies can be formed in various
shapes and sizes, making handling of wafer-level package assemblies
difficult when inspecting and providing various processing tasks
such as inspecting and depositing redistribution layers.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] FIG. 1A is a schematic top plan view of a chuck assembly
supporting a wafer-level package assembly.
[0003] FIG. 1B is a schematic side view of the chuck assembly of
FIG. 1A.
[0004] FIG. 1C is a schematic sectional view of an actuator pin and
elastomeric seal on a support surface of a chuck assembly.
[0005] FIG. 1D is a schematic sectional view of a vacuum source and
elastomeric seal on a support surface of a chuck assembly.
[0006] FIG. 2A is a top plan view of a material handling system
supporting a wafer-level package assembly with a clamping mechanism
securing the wafer-level package assembly to the chuck
assembly.
[0007] FIG. 2B is a schematic side view of the material handling
system of FIG. 2A.
[0008] FIG. 2C is a schematic side view of an alternative latch
mechanism in the material handling system of FIG. 2A.
[0009] FIG. 3 is a schematic side view of a material handling
system having a placement tool.
[0010] FIG. 4 is schematic top plan view of an alternative chuck
assembly with a wafer-level package assembly supported thereon.
[0011] FIG. 5 is a schematic side view of a gripping member.
[0012] FIG. 6 is a schematic view showing a path of travel for a
gripping member.
[0013] FIG. 7 is a schematic side view of a path of travel for a
gripping member.
DESCRIPTION
[0014] FIGS. 1A and 1B illustrate an example chuck assembly 10
supporting a wafer-level package assembly 12 on a planar support
surface 14. The planar support surface 14 is bound by a side edge
surface 16 extending generally perpendicular to the surface 14. As
illustrated, the side edge surface 16 is a continuous edge such
that the support surface 14 forms a stadium shape. The support
surface 14 can form other shapes as desired, such as rectangle,
rounded rectangle, circle, irregular and others. In addition, the
support surface can be formed of various materials (e.g., metal)
utilized in material handling systems.
[0015] In one embodiment, the surface 14 can include an elastomeric
ring 17 (see FIGS. 1C and 1D) positioned thereon that can be used
to create a vacuum seal between assembly 12 and surface 14. The
chuck assembly 10 further includes a lower surface 18 and a
pedestal 20. In one embodiment, the wafer-level package assembly 12
is a reconstituted wafer that includes a plurality of individual
electronic devices (e.g., silicon dies) arranged within a molded
material. Chuck assembly 10 can be used to assist in inspecting the
wafer-level package assembly 12, for example using an inspection
tool. Inspection of the wafer-level package assembly 12 can be
performed prior to, during and/or after application of a
redistribution layer (RDL) that is used to connect devices in the
wafer-level package assembly 12.
[0016] The pedestal 20 can be used to translate the chuck assembly
10 during inspection of the wafer-level package assembly 12. In
addition, as shown in FIGS. 1C and 1D, the pedestal 20 can be
configured to house various components. For example, the pedestal
20 can include one or more conduits 24 for operation of push pins
26 that actuate wafer-level package assembly 12 vertically with
respect to the top surface 14. Alternatively, or in addition to, a
vacuum source 28 can be coupled with a conduit 24 for applying
negative pressure to a bottom surface of a package assembly 12 when
the package assembly 12 is positioned on surface 14 and sealed
against surface 14 with seal 17.
[0017] FIGS. 2A and 2B illustrate a material handling system 100
that utilizes chuck assembly 10 during inspection of wafer-level
package assembly 12. In order to secure the wafer-level package
assembly 12 to the chuck assembly 10 during an inspection process,
system 100 includes a clamping mechanism 30. The clamping mechanism
30 includes a cover or collar 31 defining a central aperture 32
that exposes a top surface of the wafer-level package assembly 12
during inspection. As illustrated, the cover 31 and central
aperture 32 are rectangular, although other shapes for cover 31
and/or central aperture 32 (e.g., square, circle, ellipse, stadium,
irregular) can be used as desired.
[0018] In one embodiment related to a method of inspection, package
12 is positioned or loaded on surface 14. The elastomeric ring 17
creates a seal and a vacuum source 28 is used to urge the panel 12
toward the surface 14. Once vacuum pressure is applied, the
clamping mechanism 30 is positioned over the wafer-level package 12
and top surface 14. In one embodiment, the clamping mechanism 30
can include an elastomeric ring (not shown) about the perimeter of
aperture 32 to prevent damage to the package 12. One or more latch
mechanisms 34 (schematically illustrated) can be used to extend
around edge surface 16 and clamp on to lower surface 18 so as to
apply pressure in order to secure the wafer-level package assembly
12 to the chuck assembly 10. Once the wafer-level package assembly
12 is secured, translation and/or inspection of the wafer-level
package assembly 12 can be facilitated. In one example, an
inspection tool 102 such as an optical system (e.g., a camera) or
other device can be used to inspect the assembly 12.
[0019] The latch mechanisms 34 can take a variety of different
forms and operate in different ways (e.g., rotationally, linearly)
to secure clamping mechanism 30 to chuck assembly 10. In one
embodiment, the latch mechanisms 34 form an `L` shape as
illustrated in FIG. 2B and are attached to the cover 31 with spring
loaded hinges 36. In this embodiment, each latch mechanism 34 is
adjustable from a first, open position, to a second, closed
position. A top portion of the `L` is attached to cover 31 through
hinge 36, where the spring of the hinge 36 biases the latch
mechanism to the closed position, where the lower portion of the
`L` engages the lower surface 18 of chuck assembly 10. In the open
position, the lower portion of the `L` is moved away from the lower
surface 18 such that the clamping mechanism 30 can be removed from
the chuck assembly 10 (e.g., by lifting the clamping mechanism
vertically away from the chuck assembly 10).
[0020] Another latch mechanism 34' is illustrated in FIG. 2C, which
is coupled with a shaft 40 that extends through a corresponding
bore 42 in the cover 31. Latch mechanisms 34' are `L` shaped, with
an upper portion of the `L` attached to the shaft 40 and a lower
portion of the `L` configured to engage the surface 18 in a closed
position (as shown on the right side of FIG. 2C). In one
embodiment, a locking mechanism (e.g., a nut, clamp or other
apparatus) can be coupled with shaft 40 to secure latch mechanism
34' to the surface 18 and thus secure clamping mechanism 30 to
chuck assembly 10. To disengage the latch mechanism 34' from the
surface 18, shaft 40 can be adjusted such that the lower portion of
the `L` of the latch mechanism 34' is spaced from surface 18 (as
shown on the left side of FIG. 2C). The shafts 40 can then be
lifted vertically to release the clamping mechanism 30 from the
chuck assembly 10 as the latch mechanisms 34' are disengaged from
surface 18.
[0021] In the embodiment of FIG. 3, a placement mechanism or tool
120 can be used with material handling system 100. As illustrated,
the mechanism 120 includes a first arm 122A terminating at a distal
tool 124A (e.g., an end effector and robotic arm) and a second arm
122B terminating at a distal tool 124B. Each of the arms 122 are
coupled with an actuator assembly 126 that operates to move the
arms 122 and the distal tools 124. The actuator assembly 126 can be
one or more hydraulic or pneumatic cylinders, in one embodiment.
When tools 124 are in place, the actuator assembly 126 can actuate
arms 128A and 128B to latch mechanisms 34 with respect to the arms
122A and 122B, respectively. In an open position, the arms 128A and
128B actuate latch mechanisms 34 in the open position. In this
position, the placement mechanism can place the clamping mechanism
30 over the package assembly 12. In some embodiments, the placement
mechanism further aligns the central aperture 32 with the package
assembly 12 on the chuck assembly 10. When clamping mechanism 30 is
in place, release of the arms 128 from the latch mechanisms 34
allow the spring loaded latch mechanisms 34 to return to the closed
position where the latch mechanisms 34 engage surface 18.
[0022] After the latch mechanisms 34 secure package assembly 12 to
the surface 14, placement mechanism 120 can retract and the
assembly 12 can be addressed to an inspection tool to conduct
inspection on the assembly 12. Once inspection is complete, the
latch mechanism 34 can be released and the placement mechanism 120
can be moved into contact with the clamping mechanism 30. The
placement mechanism 120 can retract the clamping mechanism 30 away
from the assembly 12 and surface 14 so that the assembly 12 can be
unloaded from the surface 14 for further processing.
[0023] FIG. 4 is a schematic top plan view of an alternative chuck
assembly 50 that includes a top surface 52 and can further be used
with a placement mechanism 120 as discussed above. The chuck 50
further includes a plurality of gripping members 54 positioned
around the wafer-level package assembly 12. The gripping members 54
can be transitioned from a first, recessed position to a second,
gripping position in order to secure a wafer-level package assembly
12 to the chuck 50.
[0024] FIG. 5 illustrates a schematic side view of operation of
gripping member 54. As illustrated, the gripping member 54 is
recessed from top surface 52. In particular, a top surface 60 of
the gripping member 54 can be co-planar with the top surface 52 and
or recessed therefrom when the gripping member 54 is in the
recessed position. In order to secure the wafer-level package
assembly 12 to the chuck assembly 50, the gripping member 54 can be
operated to a gripping position 54' in which the gripping member 54
applies pressure to the wafer-level package assembly 12 and
subsequently secures the wafer-level package 12 to the chuck
assembly 50. In one embodiment, movement of the gripping member 54
can be controlled using a pneumatic actuator.
[0025] Operation of the gripping members 54 can move in a linear
fashion such as that schematically illustrated in FIG. 6. In
particular, transition of the gripping member 54 to the gripping
position 54' involves a vertical movement, a horizontal movement,
and another vertical movement. Alternatively, as illustrated in
FIG. 7, the gripping member 54 can define a vertical movement, a
curvilinear movement, and another vertical movement to secure
wafer-level package assembly 12 to chuck assembly 50.
[0026] Various embodiments of the invention have been described
above for purposes of illustrating the details thereof and to
enable one of ordinary skill in the art to make and use the
invention. The details and features of the disclosed embodiment[s]
are not intended to be limiting, as many variations and
modifications will be readily apparent to those of skill in the
art. Accordingly, the scope of the present disclosure is intended
to be interpreted broadly and to include all variations and
modifications coming within the scope and spirit of the appended
claims and their legal equivalents.
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