U.S. patent application number 17/478732 was filed with the patent office on 2022-01-06 for solid-state imaging element and solid-state imaging apparatus.
This patent application is currently assigned to SONY GROUP CORPORATION. The applicant listed for this patent is SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATION. Invention is credited to Masashi BANDO, Osamu ENOKI, Shintarou HIRATA, Yohei HIROSE, Hideaki MOGI, Iwao YAGI.
Application Number | 20220005872 17/478732 |
Document ID | / |
Family ID | |
Filed Date | 2022-01-06 |
United States Patent
Application |
20220005872 |
Kind Code |
A1 |
HIROSE; Yohei ; et
al. |
January 6, 2022 |
SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS
Abstract
A first solid-state imaging element according to an embodiment
of the present disclosure includes a bottom-electrode; a
top-electrode opposed to the bottom-electrode; a photoelectric
conversion layer provided between the bottom-electrode and the
top-electrode and including a first organic semiconductor material;
and--an upper inter-layer provided between the top-electrode and
the photoelectric conversion layer, and including a second organic
semiconductor material having a halogen atom in a molecule at a
concentration in a range from 0 volume % or more to less than 0.05
volume %.
Inventors: |
HIROSE; Yohei; (Tokyo,
JP) ; YAGI; Iwao; (Kanagawa, JP) ; HIRATA;
Shintarou; (Tokyo, JP) ; MOGI; Hideaki;
(Kanagawa, JP) ; BANDO; Masashi; (Kanagawa,
JP) ; ENOKI; Osamu; (Kanagawa, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SONY GROUP CORPORATION
SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
Tokyo
Kanagawa |
|
JP
JP |
|
|
Assignee: |
SONY GROUP CORPORATION
Tokyo
JP
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Kanagawa
JP
|
Appl. No.: |
17/478732 |
Filed: |
September 17, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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16316999 |
Jan 10, 2019 |
11158675 |
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PCT/JP2017/026243 |
Jul 20, 2017 |
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17478732 |
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International
Class: |
H01L 27/30 20060101
H01L027/30; H01L 51/42 20060101 H01L051/42; H01L 51/44 20060101
H01L051/44; H04N 5/369 20060101 H04N005/369 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 20, 2016 |
JP |
2016-142154 |
Aug 8, 2016 |
JP |
2016-155728 |
Claims
1.-24. (canceled)
25. A solid-state imaging element comprising: a bottom-electrode; a
top-electrode opposed to the bottom-electrode; a photoelectric
conversion layer provided between the bottom-electrode and the
top-electrode and including an organic semiconductor material that
has one or two or more halogen atoms in a molecule and in which
binding energy of a halogen atom having smallest binding energy in
the molecule is 5.4 eV or higher; and an upper inter-layer provided
between the top-electrode and the photoelectric conversion
layer.
26. The solid-state imaging element of claim 25, wherein the first
organic semiconductor material is selected from the group
consisting of a quinacridone derivative, boronated
subphthalocyanine derivative, pentacene derivative, fullerene
derivative, benzothieno-benzothiphene derivative, and combinations
thereof.
27. The solid-state imaging element of claim 26, wherein the first
organic semiconductor material is the boronated subphthalocyanine
derivative.
28. The solid-state imaging element of claim 27, wherein the first
organic semiconductor material is boron subphthalocyanine
chloride.
29. The solid-state imaging element of claim 25, wherein the
photoelectric conversion layer includes a third organic
semiconductor material or a fourth organic semiconductor material
or both, the third organic semiconductor material serving as an
electron donor to the first organic semiconductor material and the
fourth organic semiconductor material serving as an electron
acceptor to the first organic semiconductor material.
30. The solid-state imaging element of claim 25, wherein the upper
inter-layer comprises a second organic semiconductor material
having a halogen atom in a molecule, wherein a concentration of the
second organic semiconductor material is less than 0.05 volume % of
the upper inter-layer.
31. The solid-state imaging element of claim 25, wherein in a case
where the top-electrode functions as a cathode, a work function
(WF) of the top-electrode, an electron affinity of the upper
inter-layer (EA1), and an electron affinity of a material having
smallest electron affinity of materials included in the
photoelectric conversion layer (EA2) satisfy
EA2.ltoreq.EA1.ltoreq.WF.
32. The solid-state imaging element of claim 25, wherein in a case
where the top-electrode functions as an anode, the work function
(WF) of the top-electrode and the electron affinity of the upper
inter-layer (EA1) satisfy EA1>WF.
33. The solid-state imaging element of claim 25, wherein the
top-electrode is formed from a material comprising indium tin oxide
(ITO), indium zinc oxide (IZO), and indium-tungsten oxide
(IWO).
34. The solid-state imaging element of claim 25, wherein an organic
photoelectric converter including one or a plurality of the
photoelectric conversion layers, and one or a plurality of
inorganic photoelectric converters are stacked, the inorganic
photoelectric converters performing photoelectric conversion in a
different wavelength range from the organic photoelectric
converter.
35. A solid-state imaging apparatus provided with a plurality of
pixels each including one or a plurality of solid-state imaging
elements, each of the solid-state imaging elements comprising: a
bottom-electrode; and a top-electrode opposed to the
bottom-electrode; a photoelectric conversion layer provided between
the bottom-electrode and the top-electrode and including an organic
semiconductor material that has one or two or more halogen atoms in
a molecule and in which binding energy of a halogen atom having
smallest binding energy in the molecule is 5.4 eV or higher; and an
upper inter-layer provided between the top-electrode and the
photoelectric conversion layer.
Description
TECHNICAL FIELD
[0001] The present disclosure relates to a solid-state imaging
element including a photoelectric conversion layer that uses an
organic semiconductor material, and a solid-state imaging apparatus
including the solid-state imaging element.
BACKGROUND ART
[0002] In a solid-state imaging element including an organic
semiconductor material, in general, a photoelectric conversion
layer is formed by stacking or mixing of a p-type organic
semiconductor and an n-type organic semiconductor. This allows for
efficient charge generation and charge transport.
[0003] In addition, for example, PTL 1 discloses an organic
photoelectric conversion element including a carrier blocking layer
(an electron blocking layer and a hole blocking layer) and a charge
transport layer (an electron transport auxiliary layer and a hole
transport auxiliary layer), respectively, between a negative
electrode and an organic photoelectric conversion film and between
a positive electrode and the organic photoelectric conversion film.
The negative electrode and the positive electrode are opposed to
each other with the organic photoelectric conversion film
interposed therebetween. This organic photoelectric conversion
element attempts to further enhance charge extraction efficiency by
provision of the charge blocking layer and the charge transport
layer.
CITATION LIST
Patent Literature
[0004] PTL 1: Japanese Unexamined Patent Application Publication
No. 2014-22525
SUMMARY OF THE INVENTION
[0005] Incidentally, a solid-state imaging element is requested to
enhance electric characteristics. In addition, the solid-state
imaging element is requested to have excellent responsivity.
[0006] It is desirable to provide a solid-state imaging element and
a solid-state imaging apparatus that make it possible to enhance
the electric characteristics. In addition, it is desirable to
provide a solid-state imaging element and a sold-state imaging
apparatus that make it possible to enhance the responsivity.
[0007] A first solid-state imaging element according to an
embodiment of the present disclosure includes: a bottom-electrode;
a top-electrode opposed to the bottom-electrode; a photoelectric
conversion layer provided between the bottom-electrode and the
top-electrode and including a first organic semiconductor material;
and an upper inter-layer provided between the top-electrode and the
photoelectric conversion layer, and including a second organic
semiconductor material having a halogen atom in a molecule at a
concentration in a range from 0 volume % or more to less than 0.05
volume %.
[0008] A first solid-state imaging apparatus according to an
embodiment of the present disclosure includes one or a plurality of
first solid-state imaging elements according to the foregoing
embodiment of the present disclosure, for each of a plurality of
pixels.
[0009] In the first solid-state imaging element and the first
solid-state imaging apparatus according to the respective
embodiments of the present disclosure, the upper inter-layer
including the second organic semiconductor material having a
halogen atom in a molecule at a concentration in a range from 0
volume % or more to less than 0.05 volume % is provided between the
top-electrode and the photoelectric conversion layer including the
first organic semiconductor material. This makes it possible to
suppress modification of organic materials included in the
top-electrode and the solid-state imaging element during film
formation.
[0010] A second solid-state imaging element according to an
embodiment of the present disclosure includes: a bottom-electrode;
a top-electrode opposed to the bottom-electrode; a photoelectric
conversion layer provided between the bottom-electrode and the
top-electrode and including an organic semiconductor material that
has one or two or more halogen atoms in a molecule and in which
binding energy of a halogen atom having smallest binding energy in
the molecule is 5.4 eV or higher; and an upper inter-layer provided
between the top-electrode and the photoelectric conversion
layer.
[0011] A second solid-state imaging apparatus according to an
embodiment of the present disclosure includes one or a plurality of
second solid-state imaging elements according to the foregoing
embodiment of the present disclosure for each of a plurality of
pixels.
[0012] In the second solid-state imaging element and the second
solid-state imaging apparatus according to the respective
embodiments of the present disclosure, the upper inter-layer is
provided between the top-electrode and the photoelectric conversion
layer, and the organic semiconductor material that has one or two
or more halogen atoms in a molecule and in which binding energy of
a halogen atom having smallest binding energy in the molecule is
5.4 eV or higher is used as a material of the photoelectric
conversion layer. This makes it possible to suppress the
modification of organic materials included in the top-electrode and
the solid-state imaging element during film formation.
[0013] A third solid-state imaging element according to an
embodiment of the present disclosure includes: a bottom-electrode;
a top-electrode opposed to the bottom-electrode; a photoelectric
conversion layer provided between the bottom-electrode and the
top-electrode and including an organic semiconductor material
having a halogen atom in a molecule; and an organic semiconductor
layer provided between the top-electrode and the photoelectric
conversion layer, in which a distance between the top-electrode and
the photoelectric conversion layer is in a range from 5 nm to 20 nm
both inclusive.
[0014] A third solid-state imaging apparatus according to an
embodiment of the present disclosure includes one or a plurality of
third solid-state imaging elements according to the foregoing
embodiment of the present disclosure for each of a plurality of
pixels.
[0015] In the third solid-state imaging element and the third
solid-state imaging apparatus according to the respective
embodiments of the present disclosure, the organic semiconductor
material is provided between the top-electrode and the
photoelectric conversion layer, and the distance between the
top-electrode and the photoelectric conversion layer is in the
range from 5 nm to 20 nm both inclusive. This makes it possible to
suppress the modification of the top-electrode during film
formation.
[0016] A fourth solid-state imaging element according to an
embodiment of the present disclosure includes: a first electrode; a
second electrode opposed to the first electrode; and a
photoelectric conversion layer provided between the first electrode
and the second electrode, in which the photoelectric conversion
layer includes an exciton generation layer including a dye material
and a first semiconductor material, and an exciton disassociation
layer including a second semiconductor material.
[0017] A fourth solid-state imaging apparatus according to the
embodiment of the present disclosure includes one or a plurality of
fourth solid-state imaging elements according to the foregoing
embodiment of the present disclosure, for each of a plurality of
pixels.
[0018] In the fourth solid-state imaging element and the fourth
solid-state imaging apparatus according to the respective
embodiments of the present disclosure, the photoelectric conversion
layer includes the exciton generation layer including the dye
material and the first semiconductor material, and the exciton
disassociation layer including the second semiconductor material.
This makes it possible to separate a light absorbing field (an
exciton generation layer) and a charge generating field (an exciton
disassociation layer).
[0019] According to the first solid-state imaging element and the
first solid-state imaging apparatus according to the respective
embodiments of the present disclosure, the upper inter-layer
including the second organic semiconductor material having a
halogen atom in a molecule at a concentration in a range from 0
volume % or more to less than 0.05 volume % is provided between the
top-electrode and the photoelectric conversion layer including the
first organic semiconductor material. This suppresses the
modification during the film formation of the organic materials
included in the top-electrode and the solid-state imaging element,
thus making it possible to enhance electric characteristics.
[0020] According to the second solid-state imaging element and the
second solid-state imaging apparatus according to the respective
embodiments of the present disclosure, the upper inter-layer is
provided between the top-electrode and the photoelectric conversion
layer, and the organic semiconductor material that has one or two
or more halogen atoms in a molecule and in which binding energy of
a halogen atom having smallest binding energy in the molecule is
5.4 eV or higher is used as the material of the photoelectric
conversion layer. This suppresses the modification during the film
formation of the organic materials included in the top-electrode
and the solid-state imaging element, thus making it possible to
enhance electric characteristics.
[0021] According to the third solid-state imaging element and the
third solid-state imaging apparatus according to the respective
embodiments of the present disclosure, the organic semiconductor
material is provided between the top-electrode and the
photoelectric conversion layer to cause the distance between the
top-electrode and the photoelectric conversion layer to be in the
range from 5 nm to 20 nm. This suppresses the modification of the
top-electrode during the film formation, thus making it possible to
enhance electric characteristics.
[0022] According to the fourth solid-state imaging element and the
fourth solid-state imaging apparatus according to the respective
embodiments of the present disclosure, provision of the exciton
generation layer including the dye material and the first
semiconductor material and the exciton disassociation layer
including the second semiconductor material separates the light
absorbing field and the charge generating field. This makes it
possible to enhance electric characteristics.
[0023] It is to be noted that effects described here are not
necessarily limited and any of effects described in the present
disclosure may be included.
BRIEF DESCRIPTION OF DRAWINGS
[0024] FIG. 1 is a schematic view of a cross-sectional
configuration of an organic photoelectric converter according to a
first embodiment of the present disclosure.
[0025] FIG. 2 is a cross-sectional view of a schematic
configuration of a solid-state imaging element according to the
first embodiment of the present disclosure.
[0026] FIG. 3A is a diagram illustrating an example of an energy
level of the organic photoelectric converter illustrated in FIG.
1.
[0027] FIG. 3B is a diagram illustrating another example of the
energy level of the organic photoelectric converter illustrated in
FIG. 1.
[0028] FIG. 4 is a schematic plan view of a configuration of a
pixel of a solid-state imaging apparatus illustrated in FIG. 2.
[0029] FIG. 5 is a cross-sectional view for description of a method
of manufacturing the solid-state imaging element illustrated in
FIG. 2.
[0030] FIG. 6 is a cross-sectional view of a process following FIG.
5.
[0031] FIG. 7 is cross-sectional view of a process following FIG.
6.
[0032] FIG. 8 is a cross-sectional view of a process following FIG.
7.
[0033] FIG. 9 is a schematic view of a cross-sectional
configuration of an organic photoelectric converter according to a
second embodiment of the present disclosure.
[0034] FIG. 10 is a schematic view of a cross-sectional
configuration of an organic photoelectric converter according to a
third embodiment of the present disclosure.
[0035] FIG. 11 is a schematic view of a cross-sectional
configuration of an organic photoelectric converter according to a
fourth embodiment of the present disclosure.
[0036] FIG. 12A is a diagram illustrating an example of an energy
level of respective layers that configure the photoelectric
conversion layer illustrated in FIG. 11.
[0037] FIG. 12B is a diagram illustrating another example of the
energy level of the respective layers that configure the
photoelectric conversion layer illustrated in FIG. 11.
[0038] FIG. 13A is a diagram of another example of the energy level
of the respective layers that configure the photoelectric
conversion layer illustrated in FIG. 11.
[0039] FIG. 13B is a diagram illustrating another example of the
energy level of the respective layers that configure the
photoelectric conversion layer illustrated in FIG. 11.
[0040] FIG. 14 is a cross-sectional view of an example of a
schematic configuration of a solid-state imaging element (an
organic photoelectric converter) according to a fifth embodiment of
the present disclosure.
[0041] FIG. 15 is a cross-sectional view of an example of a
schematic configuration of a solid-state imaging element (an
organic photoelectric converter) according to a sixth embodiment of
the present disclosure.
[0042] FIG. 16 is a functional block diagram illustrating a
solid-state imaging apparatus that uses, as a pixel, the
solid-state imaging element illustrated in FIG. 2.
[0043] FIG. 17 is a block diagram illustrating a schematic
configuration of an electronic apparatus that uses the solid-state
imaging apparatus illustrated in FIG. 16.
[0044] FIG. 18 is a block diagram depicting an example of a
schematic configuration of an in-vivo information acquisition
system.
[0045] FIG. 19 is a view depicting an example of a schematic
configuration of an endoscopic surgery system.
[0046] FIG. 20 is a block diagram depicting an example of a
functional configuration of a camera head and a camera control unit
(CCU).
[0047] FIG. 21 is a block diagram depicting an example of schematic
configuration of a vehicle control system.
[0048] FIG. 22 is a diagram of assistance in explaining an example
of an installation position of an imaging section.
[0049] FIG. 23 is a characteristic diagram illustrating a relation
of a doping concentration and a rate of increasing a dark current
from before to after formation of a protective layer in Experiment
1.
[0050] FIG. 24 is a characteristic diagram illustrating the
relation of the doping concentration and the rate of increasing the
dark current from before to after the formation of the protective
layer in Experiment 2.
[0051] FIG. 25 is a characteristic diagram illustrating the
relation of the doping concentration and the rate of increasing the
dark current from before to after the formation of the protective
layer in Experiment 3.
[0052] FIG. 26 is a characteristic diagram illustrating a relation
of minimum binding energy and the rate of increasing the dark
current from before to after the formation of the protective
layer.
[0053] FIG. 27 is a characteristic diagram illustrating a relation
of electron affinity and a dark current of an upper inter-layer in
experimental examples 28 to 33.
[0054] FIG. 28 is a characteristic diagram illustrating a relation
of the electron affinity and quantum efficiency of the upper
inter-layer in the experimental examples 28 to 33.
[0055] FIG. 29 is a characteristic diagram illustrating the
relation of the electron affinity and the dark current of the upper
inter-layer in experimental examples 34 to 37.
[0056] FIG. 30 is a characteristic diagram illustrating the
relation of the electron affinity and the quantum efficiency of the
upper inter-layer in the experimental examples 34 to 37.
[0057] FIG. 31 is a characteristic diagram illustrating a relation
of a distance between a photoelectric conversion layer and a
top-electrode and a rate (J.sub.dk-J.sub.dk,0)/J.sub.dk,0 of
increasing the dark current from before to after the formation of
the protective layer.
MODES FOR CARRYING OUT THE INVENTION
[0058] In the following, some embodiments of the disclosure are
described in detail with reference to the drawings. The embodiments
described below each illustrate a specific example of the present
disclosure, and the present disclosure is not limited to the
following embodiments. Moreover, the present disclosure is not
limited to positions, dimensions, dimension ratios, and other
factors of respective components illustrated in the drawings. It is
to be noted that description is given in the following order.
[0059] 1. First Embodiment (First example in which an upper
inter-layer is provided between a top-electrode and a photoelectric
conversion layer) [0060] 1-1. Configuration of Solid-state Imaging
Element [0061] 1-2. Method of Manufacturing Solid-state Imaging
Element [0062] 1-3. Workings and Effects [0063] 2. Second
Embodiment (Second example in which the upper inter-layer is
provided between the top-electrode and the photoelectric conversion
layer) [0064] 3. Third Embodiment (Third example in which the upper
inter-layer is provided between the top-electrode and the
photoelectric conversion layer) [0065] 4. Fourth Embodiment
(Example having a photoelectric conversion layer including an
exciton generation layer and an exciton disassociation layer)
[0066] 4-1. Configuration of Organic Photoelectric Converter [0067]
4-2. Workings and Effects [0068] 5. Fifth Embodiment (Example in
which an inter-layer is provided between the exciton generation
layer and the exciton disassociation layer) [0069] 6. Sixth
Embodiment (Example in which another inter-layer is further
provided between the exciton generation layer and the exciton
disassociation layer) [0070] 7. Application Examples [0071] 8.
Examples
1. FIRST EMBODIMENT
[0072] FIG. 1 schematically illustrates a cross-sectional
configuration of an organic photoelectric converter 20 included in
a solid-state imaging element (a solid-state imaging element 10)
according to a first embodiment of the present disclosure. FIG. 2
illustrates a cross-sectional configuration of the solid-state
imaging element 10 including the organic photoelectronic converter
20 illustrated in FIG. I. The solid-state imaging element 10
configures one pixel (a unit pixel P) in a solid-state imaging
apparatus (a solid-state imaging apparatus 1: see FIG. 14) such as
a CMOS image sensor used in an electronic apparatus such as a
digital still camera and a video camera, for example.
(1-1. Configuration of Solid-State Imaging Element)
[0073] The solid-state imaging element 10 is of a so-called
longitudinal direction spectral type in which, for example, at
least an organic photoelectric converter 20A and two inorganic
photoelectric converters 32B and 32R are stacked in a longitudinal
direction. The organic photoelectric converter 20A is provided on a
side on which a first surface (back side) 30A is located of a
semiconductor substrate 30. The inorganic photoelectric converters
32B and 32R are formed to be embedded in the semiconductor
substrate 30, and are stacked in a thickness direction of the
semiconductor substrate 30. The organic photoelectric converter 20A
has a configuration in which a lower inter-layer 22 is provided
between a bottom-electrode 21 and a photoelectric conversion layer
23A, and an upper inter-layer 24 is provided between the
photoelectric conversion layer 23A and a top-electrode 25.
[0074] The organic photoelectric converter 20A and the inorganic
photoelectric converters 32B and 32R selectively detect light of
mutually different wavelength ranges to perform photoelectric
conversion. For example, the organic photoelectric converter 20A
acquires a green (G) color signal. The inorganic photoelectric
converters 32B and 32R respectively acquire a blue (B) color signal
and a red (R) color signal by a difference in absorption
coefficients. This allows the solid-state imaging element 10 to
acquire a plurality of types of the color signals in one pixel
without using a color filter.
[0075] It is to be noted that in the present embodiment,
description is given of a case where electrons of electron-hole
pairs generated by photoelectric conversion in the inorganic
photoelectric converters 32B and 32R are read as signal charges (in
a case where an n-type semiconductor region serves as a
photoelectric conversion layer). Moreover, in the drawings, "+
(plus)" attached to "p" or "n" indicates that p-type or n-type
impurity concentration is high, and "++" indicates that p-type or
n-type impurity concentration is higher than that in a case of
"+".
[0076] For example, floating diffusions (floating diffusion layers)
FD1, FD2, and FD3, a vertical type transistor (transfer transistor)
Tr1, a transfer transistor Tr2, an amplifier transistor (modulation
element) AMP, a reset transistor RST, and multilayer wiring 40 are
provided on a second surface (front side) 30B of the semiconductor
substrate 30. The multilayer wiring 40 has a configuration in which
wiring layers 41, 42, and 43 are stacked in an insulating layer
44.
[0077] It is to be noted that in the drawings, the side on which
the first surface 30A is located of the semiconductor substrate 30
is represented as a light entering side S1 and a side on which the
second surface 30B is located of the semiconductor substrate 30 is
represented as a wiring layer side S2.
[0078] The organic photoelectric converter 20A has a configuration
in which, as described above, the bottom-electrode 21, the lower
inter-layer 22, the photoelectric conversion layer 23A, the upper
inter-layer 24, and the top-electrode 25 are stacked in this order
from the side on which the first surface 30A is located of the
semiconductor substrate 30. In the present embodiment, the
top-electrode 25 is separately formed for each of the solid-state
imaging elements 10, for example. The bottom-electrode 21, the
lower inter-layer 22, the photoelectric conversion layer 23A and
the upper inter-layer 24 are provided as a continuous layer common
to a plurality of solid-state imaging elements 10. For example, a
layer having fixed charges (a fixed charge layer) 26, a dielectric
layer 27 having an insulating property, and an inter-layer
insulating layer 28 are provided between the first surface 30A of
the semiconductor substrate 30 and the bottom-electrode 21. A
protective layer 29 is provided on the top-electrode 25. Optical
members such as a planarization layer and an on-chip lens (both not
illustrated) are disposed above the protective layer 29,
[0079] A through electrode 34 is provided between the first surface
30A and the second surface 30B of the semiconductor substrate 30.
The organic photoelectric converter 20A is coupled to a gate Gamp
of the amplifier transistor AMP and the floating diffusion FD3 via
the through electrode 34. This allows the solid-state imaging
element 10 to well transfer the charges generated in the organic
photoelectric converter 20A on the side on which the first surface
30A is located of the semiconductor substrate 30 to the side on
which the second surface 30B is located of the semiconductor
substrate 30 via the through electrode 34, thereby enhancing
characteristics.
[0080] The through electrode 34 is provided in each of the organic
photoelectric converters 20A in each of the solid-state imaging
elements 10, for example. The through electrode 34 has a function
as a connector between the organic photoelectric converter 20A and
both the gate Gamp of the amplifier transistor AMP and the floating
diffusion FD3, and serves as a transmission path of the charges
(herein, electrons) generated in the organic photoelectric
converter 20A. A lower end of the through electrode 34 is coupled
to a connection unit 41A in the wiring layer 41 of the multilayer
wiring 40 via a first lower contact 35, for example. The connection
unit 41A and the gate Gamp of the amplifier transistor AMP are
coupled via a second lower contact 45. The connection unit 41A and
the floating diffusion FD3 are coupled by a third lower contact 46.
A top edge of the through electrode 34 is coupled to the
top-electrode 25 via an upper contact 36, for example.
[0081] It is preferable that a reset gate Grst of the reset
transistor RST be disposed next to the floating diffusion FD3, as
illustrated in FIG. 2. This makes it possible to reset the charges
accumulated in the floating diffusion FD3 by the reset transistor
RST.
[0082] The through electrode 34 penetrates the semiconductor
substrate 30 and is separated from the semiconductor substrate 30
by a separation groove 50, for example. It is preferable that, for
example, the through electrode 34 include the same semiconductor as
the semiconductor substrate 30, for example, silicon (Si), and have
a resistance value reduced by injection of the n-type or the p-type
impurity (indicated by p+in FIG. 2, for example). It is also
preferable that a high-concentration impurity region (indicated by
p++ in FIG. 2, for example) be provided in an upper end section a
lower end section of the through electrode 34 and that connection
resistance with the upper contact 36 and the connection resistance
with the first lower contact 35 be further reduced. The through
electrode 34 may include metal or a conductive material. Use of the
metal or the conductive material makes it possible to further
reduce the resistance value of the through electrode 34 and further
reduce the connection resistance of the through electrode 34 with
the first lower contact 35, the second lower contact 45, and the
third lower contact 46. As the metal or the conductive material
included in the through electrode 34, aluminum (Al), tungsten (W),
titanium (Ti), cobalt (Co), hafnium (Hf), tantalum (Ta), etc. are
adopted.
[0083] 00371 As illustrated in FIG. 2, an outer surface 51, an
inner surface 52, and a bottom surface 53 of the separation groove
50 are covered by the dielectric layer 27 having an insulating
property, for example. The dielectric layer 27 has an outer
dielectric layer 27A covering the outer surface 51 of the
separation groove 50 and an inner dielectric layer 27B covering the
inner surface 52 of the separation groove 50. It is preferable that
a cavity 54 be provided between the outer dielectric layer 27A and
the inner dielectric layer 27B. That is, the separation groove 50
is circular or annular, and the cavity 54 is circular or annular,
forming a concentric circle with the separation groove 50. This
reduces electrostatic capacitance generated between the through
electrode 34 and the semiconductor substrate 30, thus making it
possible to improve the conversion efficiency and suppress a delay
(residual image).
[0084] In addition, it is preferable that an impurity region
(indicated by p+in FIG. 2) of a same conductivity type (n-type or
p-type) as the through electrode 34 be provided in the
semiconductor substrate 30 on the outer surface 51 of the
separation groove 50. Furthermore, it is preferable that the fixed
charge layer 26 be provided on the outer surface 51, the inner
surface 52, and the bottom surface 53 of the separation groove 50,
and on the first surface 30A of the semiconductor substrate 30.
Specifically, it is preferable to provide a p-type impurity region
(indicated by p+in FIG. 2) in the semiconductor substrate 30 on the
outer surface 51 of the separation groove 50, and to provide a film
having negative fixed charges as the fixed charge layer 26. This
allows for reduction in a dark current.
[0085] In the solid-state imaging element 10 of the present
embodiment, light entering the organic photoelectric converter 20A
from a side on which the top-electrode 25 is located is absorbed by
a dye material included in the photoelectric conversion layer 23A.
In addition, the photoelectric conversion layer 23A includes either
a material serving as an electron donor or a material serving as an
electron acceptor for the dye material. Excitons generated by light
absorption of the dye material are thereby disassociated to
generate charges at an interface between the dye material and the
electron donor or at an interface between the dye material and the
electron acceptor. The charges (electrons and holes) generated at
the interface are each carried to a corresponding electrode by
diffusion resulting from a difference in concentration of the
electrons, an internal electric field resulting from a difference
in work function between the bottom-electrode 21 and the
top-electrode 25, or application of a voltage between the
bottom-electrode 21 and the top-electrode 25, and are detected as a
photocurrent. It is also possible to control transport directions
of the electrons and the holes by control of an internal electric
field generated between the bottom-electrode 21 and the
top-electrode 25.
[0086] In the following, description is given of the
configurations, materials, etc. of respective components.
[0087] The organic photoelectric converter 20A is a photoelectric
conversion element that absorbs green light corresponding to a
portion or the entirety of a selective wavelength range (for
example, 495 nm to 570 nm) to generate the electron-hole pairs.
[0088] The bottom-electrode 21 is directly opposed to light
receiving surfaces of the inorganic photoelectric converters 32B
and 32R formed in the semiconductor substrate 30, and is provided
in regions covering the light receiving surfaces. The
bottom-electrode 21 is formed with use of a conductive material
having optical transparency (a transparent conductive material),
and includes ITO (indium tin oxide), for example. However, in
addition to ITO, a tin oxide (SnO.sub.2)-based material to which a
dopant is added or a zinc oxide-based material prepared through
adding a dopant to zinc oxide (ZnO) may be used as a constituent
material of the bottom-electrode 21. Examples of the zinc
oxide-based material include aluminum zinc oxide (AZO) to which
aluminum (Al) is added as a dopant, gallium zinc oxide (GZO) to
which gallium (Ga) is added, and indium zinc oxide (120) to which
indium (In) is added. In addition to these materials,
indium-tungsten oxide (IWO), Cul, InSbO.sub.4, ZnMgO, CuInO.sub.2,
MgIn.sub.2O.sub.4, CdO, ZnSnO.sub.3, etc. may also be used. In the
solid-state imaging apparatus 1 that uses the solid-state imaging
element 10 as one pixel, the bottom-electrode 21 may be separated
for each pixel or may be formed as a common electrode for
respective pixels.
[0089] The lower inter-layer 22 functions as a charge injection
blocking layer that suppresses injection of the charges from the
bottom-electrode 21. For example, in a case where the
bottom-electrode 21 is used as an anode, the lower inter-layer 22
functions as an electron injection blocking layer that suppresses
injection of electrons from the bottom-electrode 21. In this case,
examples of a material that forms the lower inter-layer 22 include,
a phenanthroline-based compound, an aluminum quinoline-based
compound, an oxadiazole-based compound, and a silole-based
compound. It is preferable that a film thickness in a stacking
direction (hereinafter, simply referred to as a thickness) of the
lower inter-layer 22 be, for example, in a range from 5 nm to 100
nm both inclusive.
[0090] In a case where the bottom-electrode 21 is used as a
cathode, the lower inter-layer 22 functions as a hole injection
blocking layer that suppresses injection of holes from the
bottom-electrode 21. In this case, examples of the material
included in the lower inter-layer 22 include a naphthalene
diimide-based material and a material including pyridine,
pyrimidine, or triazine, and more specific examples thereof include
B3PyMPM (bis-4,6-(3,5-di-3-pyridylphenyl)-2-methylpyrimi-dine),
etc. In addition, the material of the lower inter-layer 22 is not
limited to an organic semiconductor, and the lower inter-layer 22
may be formed with use of an oxide semiconductor such as ZnO,
TiO.sub.2, and InGaZnO. It is preferable that the lower inter-layer
22 have a thickness in a range from 5 nm to 200 nm both inclusive,
for example.
[0091] The photoelectric conversion layer 23A converts optical
energy into electric energy. The photoelectric conversion layer 23
is formed with use of the dye material absorbing light, and the
electron acceptor or the electron donor or both with respect to the
dye material. The photoelectric conversion layer 23 is provided by
mixing of the dye material and the electron acceptor, mixing of the
dye material and the electron donor, or mixing of the dye material,
the electron acceptor, and the electron donor. The photoelectric
conversion layer 23A has a so-called bulk hetero structure in a
layer in which bonded surfaces of the dye material and the electron
acceptor or bonded surfaces of the dye material and the electron
donor, or both are formed. The photoelectric conversion layer 23A
provides a field where excitons generated upon absorption of light
are dissociated into electrons and holes. Specifically, the
excitons are dissociated into the electrons and the holes at the
interface between the dye material and the electron donor or the
interface between the dye material and the electron acceptor, or
both.
[0092] Examples of materials included in the photoelectronic
conversion layer 23A include quinacridone, boron subphthalocyanine
chloride, boronated boron subphthalocyanine pentacene,
benzothieno-benzothiphene, fullerene, and derivatives thereof. The
photoelectric conversion layer 23A includes a combination of two or
more kinds of the foregoing organic semiconductor materials. The
foregoing organic semiconductor materials function as a p-type
semiconductor or an n-type semiconductor, depending on the
combination.
[0093] It is to be noted that the organic semiconductor material (a
first organic semiconductor material) included in the photoelectric
conversion layer 23A is not limited, in particular. Besides the
organic semiconductor materials listed above, for example, any one
kind of naphthalene, anthracene, phenantherene, tetracene, pyrene,
perylene, and fluoranthene, and derivatives thereof is preferably
used. Alternatively, a polymer such as phenylenevinylene, fluorene,
carbazole, indole, pyrene, pyrrole, picoline, thiophene, acetylene,
diacetylene or a derivative thereof may be used. Additionally, it
is possible to preferably use a metal complex dye, a cyanine-based
dye, a merocyanine-based dye, a phenylxanthene-based dye, a
triphenylmethane-based dye, a rhodacyanine-based dye, a
xanthene-based dye, a macrocyclic azaannulene-based dye, an
azulene-based dye, naphthaquinone, an anthraquinone-based dye, a
chain compound in which a condensed polycyclic aromatic group such
as anthracene and pyrene and an aromatic ring or a heterocyclic
compound are condensed, a cyanine-like dye bonded by two
nitrogen-containing hetero rings such as quinoline, benzothiazole,
and benzoxazole that have a squarylium group and croconic methine
group as a bonded chain, or by ae squarylium group or a croconic
methine group, etc. It is to be noted that the foregoing metal
complex dye is preferably, but not limited to, a dithiol metal
complex-based dye, a metallophthalocyanine dye, a metalloporphyrine
dye, or a ruthenium complex dye. The photoelectric conversion layer
23A preferably has a thickness in a range from 50 nm to 500 nm both
inclusive, for example.
[0094] The upper inter-layer 24 functions as a charge injection
blocking layer that suppresses injection of charges from the
top-electrode 25. As a material forming the upper inter-layer 24,
an organic semiconductor material having no halogen atom in a
molecule is preferably used. However, in a case where an organic
semiconductor material (a second organic semiconductor material)
having a halogen atom in a molecule is used, it is preferable that
a concentration of the second organic semiconductor material in the
upper inter-layer 24 be less than 0.05 volume %.
[0095] For example, the upper inter-layer 24 functions as a hole
injection blocking layer that suppresses injection of holes from
the top-electrode 25 in a case where the top-electrode 25 is used
as a cathode electrode. In this case, examples of a material that
forms the upper inter-layer 24 include a naphthalene diimide-based
material and a material including pyridine, pyrimidine, or
triazine, and more specific examples thereof include B3PyMPM
(bis-4,6-(3,5-di-3-pyridylphenyl)-2-methylpyrimi-dine), etc. It is
preferable that the upper inter-layer 24 have a thickness in a
range from 5 nm to 100 nm both inclusive, for example.
[0096] In addition, the upper inter-layer 24 may be used for the
purpose of controlling an effective work function of the
top-electrode, for example. In this case, examples of a material
that forms the upper inter-layer 24 include molybdenum oxide
(MoO.sub.2, MoP.sub.3), tungsten oxide (WO.sub.3), and HAT-CN
(1,4,5,8,9,11-Hexaazatriphenylenehexacarbonitrile), etc. Formation
of the upper inter-layer 24 using the foregoing material makes it
possible to control a charge readout direction to cause the
top-electrode 25 to function as an anode.
[0097] It is to be noted that in a case where the top-electrode 25
is used as the anode, an electron injection blocking layer may be
provided between the upper inter-layer 24 and the photoelectric
conversion layer 23A. Examples of a material of the electron
injection blocking layer include a phenanthroline-based compound,
an aluminum quinoline-based compound, an oxadiazole-based compound,
a silole-based compound, etc. It is preferable that the electron
injection blocking layer have a thickness in a range from 5 nm to
100 nm both inclusive, for example.
[0098] Any layer other than the lower inter-layer 22, the
photoelectric conversion layer 23A, and the upper inter-layer 24
may be provided in the organic photoelectric converter 20A. As the
other layers, to enhance carrier injection blocking performance,
for example, another carrier injection blocking layer may be
provided between the lower inter-layer 22 and the photoelectric
conversion layer 23A or between the upper inter-layer 24 and the
photoelectric conversion layer 23A. The foregoing electron
injection blocking layer is a specific example of the carrier
injection blocking layer.
[0099] The top-electrode 25 is formed with use of a conductive
material (a transparent conductive material) having optical
transparency similar to the bottom-electrode 21. Specific examples
of the conductive material includes ITO (indium tin oxide), a tin
oxide (SnO.sub.2)-based material to which a dopant is added or a
zinc oxide-based material to which a dopant is added. Examples of
the zinc oxide-based material include aluminum zinc oxide (AZO) to
which aluminum (Al) is added as a dopant, gallium zinc oxide (GZO)
to which gallium (Ga) is added, and indium zinc oxide (IZO) to
which indium (In) is added. In addition to these materials,
indium-tungsten oxide (IWO), CuI, InSbO.sub.4, ZnMgO, CuInO.sub.2,
MgIn.sub.2O.sub.4, CdO, ZnSnO.sub.3, etc. may also be used. It is
preferable that the top-electrode 25 have a thickness in a range
from 10 nm to 200 nm both inclusive, for example.
[0100] It is to be noted that although a plurality of materials are
listed as the materials of the respective layers that configure the
organic photoelectric converter 20A, it is preferable to select the
materials of the respective layers to cause the organic
photoelectric converter 20A of the present embodiment to have an
energy level as illustrated in FIGS. 3A and 3B, for example.
[0101] For example, in a case where the top-electrode 25 is used as
the cathode, as illustrated in FIG. 3A, it is preferable that a
work function (WF) of the top-electrode 25, electron affinity EA1
of the upper inter-layer 24, and electron affinity EA2 of an
electron acceptor material included in the photoelectric conversion
layer 23A have a magnitude relationship of
EA2.ltoreq.EA1.ltoreq.WF. This makes it possible to satisfy both
enhancement of extraction efficiency (quantum efficiency) of signal
charges (herein, electrons) generated in the photoelectric
conversion layer 23A and reduction in a dark current. In addition,
it is preferable to use a material in which an ionization potential
(IP1) of the upper inter-layer 24 is larger than the work function
(WF) of the top-electrode 25 and an ionization potential (IP2) of
an electron donor material included in the photoelectric conversion
layer 23A. This makes it possible to efficiently suppress injection
of the holes from the top-electrode 25.
[0102] For example, in a case where the top-electrode 25 is used as
the anode, as illustrated in (B) of FIG. 3, it is preferable to use
a material where the electron affinity EA1 of the upper inter-layer
24 is larger than the work function (WF) of the top-electrode 25.
This makes it possible to satisfy both enhancement of extraction
efficiency (quantum efficiency) of signal charges (herein, holes)
generated in the photoelectric conversion layer 23A and reduction
in a dark current.
[0103] The fixed charge layer 26 may be a film having positive
fixed charges or a film having negative fixed charges. Materials of
the film having the negative fixed charges include hafnium oxide,
aluminum oxide, zirconium oxide, tantalum oxide, titanium oxide,
etc. In addition to the foregoing materials, lanthanum oxide,
praseodymium oxide, cerium oxide, neodymium oxide, promethium
oxide, samarium oxide, europium oxide, gadolinium oxide, terbium
oxide, dysprosium oxide, holmium oxide, thulium oxide, ytterbium
oxide, lutetium oxide, yttrium oxide, an aluminum nitride film, a
hafnium oxynitride film, or an aluminum oxynitride film, etc. may
also be used.
[0104] The fixed charge layer 26 may have a configuration in which
two or more kinds of films are stacked. This makes it possible to
further enhance a function as a hole accumulation layer, for
example, in the case of the film having the negative fixed
charges.
[0105] Although materials of the dielectric layer 27 are not
specifically limited, the dielectric layer 27 is formed with use
of, for example, a silicon oxide film, TEOS, a silicon nitride
film, a silicon oxynitride film, etc.
[0106] The inter-layer insulating layer 28 includes, for example, a
single-layer film including one kind of silicon oxide, silicon
nitride, silicon oxynitride (SiON) or the like, or a laminated film
including two or more kinds thereof.
[0107] The protective layer 29 includes a material having optical
transparency, and includes, for example, a single-layer film
including any of silicon oxide, silicon nitride, and silicon
oxynitride (SiON), or a laminated film including two or more kinds
thereof. The protective layer 29 has a thickness in a range from
100 nm to 30000 nm, for example.
[0108] The semiconductor substrate 30 includes a n-type silicon
(Si) substrate, for example, and has a p-well 31 in a predetermined
region. The vertical type transistor Tr1, the transfer transistor
Tr2, the amplifier transistor AMP, and the reset transistor RST,
etc., described above are provided on the second surface 30B of the
p-well 31. In addition, peripheral circuits (not illustrated)
including a logic circuit, etc., are provided in a periphery of the
semiconductor substrate 30.
[0109] The inorganic photoelectric converters 32B and 32R each have
a p/n junction in a predetermined region of the semiconductor
substrate 30. The inorganic photoelectric converters 32B and 32R
enable dispersion of light in a longitudinal direction with use of
a difference in wavelength of absorbed light depending on a depth
of light incidence in the silicon substrate. The inorganic
photoelectric converter 32B selectively detects blue light to
accumulate signal charges corresponding to blue, and is disposed at
a depth that allows for efficient photoelectric conversion of blue
light. The inorganic photoelectric converter 32R selectively
detects red light to accumulate signal charge corresponding to red,
and is disposed at a depth that allows for efficient photoelectric
conversion of red light. It is to be noted that blue (B) and red
(R) are colors respectively corresponding to a wavelength range of
450 nm to 495 nm, for example, and a wavelength range of 620 nm to
750 nm, for example. It is only necessary to allow each of the
inorganic photoelectric converters 32B and 32R to detect light in a
portion or the entirety of each of the wavelength ranges.
[0110] The inorganic photoelectric converter 32B includes a p+
region serving as a hole accumulation layer, and an n region
serving as an electron accumulation layer, for example. The
inorganic photoelectric converter 32R has a p+ region serving as a
hole accumulation layer, and an n region serving as an electron
accumulation layer (has a stacking structure of p-n-p), for
example. The n region of the inorganic photoelectric converter 32B
is coupled to the vertical type transistor Tr1. The p+ region of
the inorganic photoelectric converter 32B bends along the vertical
type transistor Tr1 and is connected to the p+ region of the
inorganic photoelectric converter 32R.
[0111] The vertical type transistor Tr1 is a transfer transistor
that transfers, to the floating diffusion FD1, signal charges
(electrons in the present embodiment) corresponding to blue
generated and accumulated in the inorganic photoelectric converter
32B. The inorganic photoelectric converter 32B is formed at a
position deep from the second surface 30B of the semiconductor
substrate 30; therefore, the transfer transistor of the inorganic
photoelectric converter 32B preferably includes the vertical type
transistor Tr1.
[0112] The transfer transistor Tr2 transfers, to the floating
diffusion FD2, signal charges (electrons in the present embodiment)
corresponding to red generated and accumulated in the inorganic
photoelectric converter 32R, and includes a MOS transistor, for
example.
[0113] The amplifier transistor AMP is a modulation element that
modulates an amount of charges generated in the organic
photoelectric converter 20A into voltage, and includes a MOS
transistor, for example.
[0114] The reset transistor RST resets the charges transferred from
the organic photoelectric converter 20A to the floating diffusion
FD3, and includes a MOS transistor, for example.
[0115] The first lower contact 35, the second lower contact 45, the
third lower contact 46, and the upper contact 36 each include, for
example, a doped silicon material such as PDAS (Phosphorus Doped
Amorphous Silicon) or a metal material such as aluminum (Al),
tungsten (W), titanium (Ti), cobalt (Co), hafnium (Hf), and
tantalum (Ta).
[0116] FIG. 4 is a plan view of a configuration example of the
solid-state imaging apparatus (the solid-state imaging apparatus 1,
for example) having the unit pixel P in which a plurality of
photoelectric converters (for example, the foregoing inorganic
photoelectric converters 32B and 32R and the foregoing organic
photoelectric converter 20A) to which the technology according to
the present disclosure may be applied are stacked. That is, FIG. 4
illustrates an example of a planar configuration of the unit pixel
P that configures a pixel unit 1a illustrated in FIG. 14, for
example.
[0117] The unit pixel P includes a photoelectric conversion region
1100 where a red photoelectric converter (the inorganic
photoelectric converter 32R in FIG. 2), a blue photoelectric
converter (the inorganic photoelectric converter 32B in FIG. 2),
and a green photoelectric converter (the organic photoelectric
converter 20A in FIG. 2) that photoelectrically convert light of
respective wavelengths of R (Red), G (Green), and B (Blue) (any of
which is not illustrated in FIG. 4) are stacked in three layers in
order of, for example, the green photoelectric converter, the blue
photoelectric converter, and the red photoelectric converter from a
side on which a light receiving surface (the light entering side S1
in FIG. 2). Furthermore, the unit pixel P includes a Tr group 1110,
a Tr group 1120, and a Tr group 1130 as charge readout units that
read out charges corresponding to the light of the respective
wavelengths of RGB from the red photoelectric converter, the green
photoelectric converter, and the blue photoelectric converter. In
the solid-state imaging apparatus 1, in one unit pixel, dispersion
in the longitudinal direction, that is, dispersion of light of each
of RGB in each of the layers as the red photoelectric converter,
the green photoelectric converter, and the blue photoelectric
converter, is performed.
[0118] The Tr group 1110, the Tr group 1120, and the Tr group 1130
are formed on the periphery of the photoelectric conversion region
1100. The Tr group 1110 outputs, as a pixel signal, signal charges
corresponding to light of R generated and accumulated in the red
photoelectric converter. The Tr group 1110 includes a transfer Tr
(MOS FET) 1111, a reset Tr 1112, an amplification Tr 1113, and a
selection Tr 1114. The Tr group 1120 outputs, as a pixel signal,
signal charges corresponding to light of B generated and
accumulated in the blue photoelectric converter. The Tr group 1120
includes a transfer Tr 1121, a reset Tr 1122, an amplification Tr
1123, and a selection Tr 1124. The Tr group 1130 outputs, as a
pixel signal, signal charges corresponding to light of G generated
and accumulated in the green photoelectric converter. The Tr group
1130 includes a transfer Tr 1131, a reset Tr 1132, an amplification
Tr 1133, and a selection Tr 1134.
[0119] The transfer Tr 1111 includes a gate G, a source/drain
region S/D, and an FD (floating diffusion) 1115(a source/drain
region serving as a FD). The transfer Tr 1121 includes the gate G,
the source/drain region S/D and an FD 1125. The transfer Tr 1131
includes the gate G, the green photoelectric converter (that is,
the source/drain region S/D coupled to the green photoelectric
converter) in the photoelectric conversion region 1100, and an FD
1135. It is to be noted that the source/drain region of the
transfer Tr 1111 is coupled to the red photoelectric converter in
the photoelectric conversion region 1100, and the source/drain
region S/D of the transfer Tr 1121 is coupled to the blue
photoelectric converter in the photoelectric conversion region
1100.
[0120] Each of the reset Tr 1112, 1132, and 1122, the amplification
Tr 1113, 1133, and 1123, and the selection Tr 1114, 1134, and 1124
includes the gate G and a pair of source/drain regions S/D disposed
to interpose the gate G therebetween.
[0121] The FD 1115, 1135, and 1125 are respectively coupled to the
source/drain regions S/D serving as sources of the reset Tr 1112,
1132, and 1122, and are respectively coupled to the gates G of the
amplification Tr 1113, 1133, and 1123. A power source Vdd is
coupled to each of the source/drain region S/D common to the reset
Tr 1112 and the amplification Tr 1113, the source/drain region S/D
common to the reset Tr 1132 and the amplification Tr 1133, and the
source/drain region S/D common to the reset Tr 1122 and the
amplification Tr 1123. A VSL (vertical signal line) is coupled to
each of the source/drain regions S/D serving as sources of the
selection Tr 1114, 1134, and 1124.
[0122] The technology according to the present disclosure is
applicable to the solid-state imaging apparatus as described
above.
(1-2. Method of Manufacturing Solid-State Imaging Element)
[0123] It is possible to manufacture the solid-state imaging
element 10 of the present embodiment in the following manner, for
example.
[0124] FIG. 5 to FIG. 8 illustrate the method of manufacturing the
slid-state imaging element 10 in process order. First, as
illustrated in FIG. 5, the p-well 31, for example, is formed as a
well of a first conductivity type in the semiconductor substrate
30, and the inorganic photoelectric converters 32B and 32R of a
second conductivity type (the n type, for example) are formed in
this p-well 31. The p+ region is formed in the vicinity of the
first surface 30A of the semiconductor substrate 30.
[0125] In addition, also as illustrated in FIG. 5, an impurity
region (a p+region) penetrating from the first surface 30A to the
second surface 30B of the semiconductor substrate 30 is formed in a
region where the through electrode 34 and the separation groove 50
are to be formed. Furthermore, a high-concentration impurity region
(a p++ region) is formed in a region where the upper end and the
lower end of the through electrode 34 are to be formed.
[0126] As also illustrated in FIG. 5, on the second surface 30B of
the semiconductor substrate 30, n+ regions serving as the floating
diffusions FD1 to FD3 are formed, and thereafter, a gate wiring
layer 37 including respective gates of a gate insulation layer 33,
the vertical type transistor Tr1, the transfer transistor Tr2, the
amplifier transistor AMP, and the reset transistor RST is formed.
Thus, the vertical type transistor Tr1, the transfer transistor
Tr2, the amplifier transistor AMP, and the reset transistor RST are
formed. Furthermore, the multilayer wiring 40 including the first
lower contact 35, the second lower contact 45, the third lower
contact 46, the wiring layers 41 to 43 including the connection
unit 41A, and the insulation layer 44 is formed on the second
surface 30B of the semiconductor substrate 30.
[0127] As a base substrate of the semiconductor substrate 30, an
SOI (Silicon on Insulator) substrate in which the semiconductor
substrate 30, an embedded oxide film (not illustrated), and a
retaining substrate (not illustrated) are stacked is used. The
embedded oxide film and the retaining substrate are not illustrated
in FIG. 2, but are joined to the first surface 30A of the
semiconductor substrate 30. Annealing treatment is performed after
ion implantation.
[0128] Next, a supporting substrate (not illustrated), another
semiconductor base substrate, or the like is joined to the side on
which the second surface 30B is located of the semiconductor
substrate 30 (a side on which the multilayer wiring 40 is located)
and flipped from top to bottom. Subsequently, the semiconductor
substrate 30 is separated from the embedded oxide film and the
retaining substrate of the SOI substrate to cause the first surface
30A of the semiconductor substrate 30 to be exposed. It is possible
to perform the above processes with technologies used in a typical
CMOS process such as ion implantation and CVD (Chemical Vapor
Deposition).
[0129] Next, as illustrated in FIG. 6, the semiconductor substrate
30 is processed from the side on which the first surface 30A is
located by dry etching, for example, to form the annular or
circular separation groove 50. The depth of the separation groove
50 preferably penetrates from the first surface 30A to the second
surface 30B of the semiconductor substrate 30 to reach the gate
insulation layer 33, as indicated by an arrow D50A of FIG. 6.
Furthermore, to further enhance an insulating effect in the bottom
surface 53 of the separation groove 50, the separation groove 50
preferably penetrates through the semiconductor substrate 30 and
the gate insulation layer 33 to reach the insulation layer 44 of
the multilayer wiring 40, as indicated by an arrow D50B of FIG. 6.
FIG. 6 illustrates a case where the separation groove 50 penetrates
through the semiconductor substrate 30 and the gate insulation
layer 33.
[0130] Subsequently, as illustrated in FIG. 7, for example, the
negative fixed charge layer 26 is formed on the outer surface 51,
the inner surface 52, and the bottom surface 53 of the separation
groove 50 and on the first surface 30A of the semiconductor
substrate 30. Two or more kinds of films may be stacked as the
negative fixed charge layer 26. This makes it possible to further
enhance a function as the hole accumulation layer. After the
negative fixed charge layer 26 is formed, the dielectric layer 27
having the outer dielectric layer 27A and the inner dielectric
layer 27B is formed. At this time, the cavity 54 is formed between
the outer dielectric layer 27A and the inner dielectric layer 27B
in the separation groove 50 through appropriately adjusting a film
thickness of the dielectric layer 27 and film-forming
conditions.
[0131] Next, as illustrated in FIG. 8, the inter-layer insulating
layer 28 is formed. Subsequently, the bottom-electrode 21, the
lower inter-layer 22, the photoelectric conversion layer 23A, the
upper inter-layer 24, the top-electrode 25, and the protective
layer 29 are formed on the inter-layer insulating layer 28. In
addition, the upper contact 36 is formed and coupled to the upper
end of the through electrode 34. Lastly, the optical member such as
the planarization layer and the on-chip lens (not illustrated) are
disposed. Thus, the solid-state imaging element 10 illustrated in
FIG. 2 is completed.
[0132] In the solid-state imaging element 10, in a case where light
enters the organic photoelectric converter 20A via the on-chip lens
(not illustrated), the light passes through the organic
photoelectric converter 20A and the inorganic photoelectric
converters 32B and 32R in order, and each of green light, blue
light, and red light is photoelectrically converted in the course
of passing. In the following, signal acquisition operations of the
respective colors are described.
(Acquisition of Green Signal by Organic Photoelectric Converter
20)
[0133] Of the light entering the solid-state imaging element 10,
first, green light is selectively detected (absorbed) and
photoelectrically converted in the organic photoelectric converter
20A.
[0134] The organic photoelectric converter 20A is coupled to the
gate Gamp of the amplifier transistor AMP and the floating
diffusion FD3 via the through electrode 34. Thus, herein, electrons
of the electron-hole pairs generated in the organic photoelectric
converter 20A is retrieved from the side on which the top-electrode
25 is located, transferred to the side on which the second surface
30B is located of the semiconductor substrate 30 via the through
electrode 34, and accumulated in the floating diffusion FD3.
Simultaneously with this, the amount of charges generated in the
organic photoelectric converter 20A is modulated into voltage by
the amplifier transistor AMP.
[0135] In addition, the reset gate Grst of the reset transistor RST
is disposed adjacent to the floating diffusion FD3. Accordingly,
the charges accumulated in the floating diffusion FD3 are reset by
the reset transistor RST.
[0136] Herein, the organic photoelectric converter 20A is coupled
not only to the amplifier transistor AMP but also to the floating
diffusion FD3 via the through electrode 34, thus making it possible
for the reset transistor RST to easily reset the charges
accumulated in the floating diffusion FD3.
[0137] In contrast, in a case where the through electrode 34 is not
coupled to the floating diffusion FD3, it is difficult to reset the
charges accumulated in the floating diffusion FD3, causing the
charges to be drawn to a side on which the top-electrode 25 is
located by application of a large voltage. This may damage the
photoelectric conversion layer 23A. In addition, a configuration
that enables resetting in a short period of time causes an increase
dark time noise, thereby resulting in a trade-off; therefore, this
configuration is difficult.
(Acquisition of Blue Signal and Red Signal by Inorganic
Photoelectric Converters 32B and 32R)
[0138] Subsequently, blue light and red light of the light having
passed through the organic photoelectric converter 20A are absorbed
and photoelectrically converted in order respectively in the
inorganic photoelectric converter 32B and the inorganic
photoelectric converter 32R. In the inorganic photoelectric
converter 32B, electrons corresponding to the incident blue light
are accumulated in the n region of the inorganic photoelectric
converter 32B, and the accumulated electrons are transferred to the
floating diffusion FD1 by the vertical type transistor Tr 1.
Similarly, in the inorganic photoelectric converter 32R, electrons
corresponding to the incident red light are accumulated in the n
region of the inorganic photoelectric converter 32R, and the
accumulated electrons are transferred to the floating diffusion FD2
by the transfer transistor Tr2.
(1-3. Workings and Effects)
[0139] In the solid-state imaging element using the organic
semiconductor materials, as described above, the photoelectric
conversion layer including the p-type and n-type organic
semiconductor materials is formed to allow for efficient charge
generation and charge transport. Whether a certain organic
semiconductor material used for the photoelectric conversion layer
functions as the p-type semiconductor or the n-type semiconductor
is determined by a relative relationship between an energy level of
the organic semiconductor material and an energy level of a
material used together.
[0140] In the organic semiconductor, a level difference between
HOMO and LUMO corresponds to a bandgap (Eg), and an energy
difference between the HOMO and a vacuum level is referred to as an
ionization potential (I) and the energy difference between the LUMO
and the vacuum level is referred to as electron affinity (.chi.).
For example, in a case where one organic semiconductor material of
two kinds of organic semiconductor materials included in the
photoelectric conversion layer has higher electron affinity than
the other organic semiconductor material, the one organic
semiconductor material has a higher electron-withdrawing property
than the other organic semiconductor material. Therefore, the one
organic semiconductor material functions as the n-type
semiconductor and the other organic semiconductor material
functions as the p-type semiconductor. Examples of a method of
causing the organic semiconductor material to have an n-type
property include a method of introducing, into a molecule
structure, a halogen atom having large electronegativity. For
example, the above-described boron subphthalocyanine chloride used
with quinacridone functions as the n-type semiconductor.
[0141] In addition, as described above, an organic photoelectric
conversion element is reported in which an electron blocking layer
and a hole blocking layer are each provided between the
photoelectric conversion layer and a pair of electrodes to further
enhance electron extraction efficiency. In the organic
photoelectric conversion element having such a configuration, to
make it easier to extract charges (electrons) generated in the
photoelectric conversion layer, it is desirable to form the hole
blocking layer using a material having a deeper LUMO value (high
electron affinity) than an organic semiconductor material that
functions as the n-type semiconductor in the photoelectric
conversion layer. Therefore, in general, an organic semiconductor
material having a halogen atom in a molecule is also used for the
material of the hole blocking layer.
[0142] However, in a case where the material (the organic
semiconductor material) having the halogen atom in the molecule is
used as the material of the organic semiconductor layer provided
between the pair of electrodes, the halogen atom included in the
molecule of the organic semiconductor material may be desorbed due
to exposure of the organic semiconductor layer to ultraviolet rays
used during formation of the top-electrode or formation of the
protection film. The desorbed halogen atom diffuses to the side on
which the top-electrode is located. At this time, in a case where
the electrode material of the top-electrode includes a metal oxide
including indium, such as ITO, the desorbed halogen atom and the
metal oxide react, causing a metal element to be eluted. The eluted
metal element thermally diffuses into the photoelectric conversion
layer during manufacturing of the solid-state imaging element. The
metal element diffused into the photoelectric conversion layer
causes deterioration in dark current characteristics.
[0143] It is conceivable that desorption of the halogen atom as
described above occurs most easily in a layer directly under the
top-electrode (in contact with the top-electrode).
[0144] In contrast, in the present embodiment, the upper
inter-layer 24 in which a concentration of the organic
semiconductor material having the halogen atom in the molecule is
in a range from 0 volume % to less than 0.05 volume % is provided
between the photoelectric conversion layer 23A and the
top-electrode 25. This makes it possible to suppress modification
of metal oxide included in the top-electrode 25 and the organic
material included in the organic photoelectric converter 20A (for
example, the organic semiconductor material included in the upper
inter-layer 24) during formation of the top-electrode 25.
[0145] In the present embodiment, the upper inter-layer 24 in which
the concentration of the organic semiconductor material having the
halogen atom in the molecule is in a range from 0 volume % to less
than 0.05 volume % is provided between the photoelectric conversion
layer 23A and the top-electrode 25, which thus suppresses the
modification of the metal oxide included in the top-electrode 25
and the organic semiconductor material included in the upper
inter-layer 24 during formation of the top-electrode 25. Therefore,
the dark current characteristics are improved, thereby making it
possible to provide the solid-state imaging element 10 having
excellent electric characteristics.
[0146] Next, description is given of second to sixth embodiments.
In the following, same components as those in the foregoing first
embodiment are denoted by same reference numerals, and description
thereof is omitted where appropriate.
2. SECOND EMBODIMENT
[0147] FIG. 9 schematically illustrates a cross-sectional
configuration of a photoelectric converter 20B that configures a
solid-state imaging element according to the second embodiment of
the present disclosure. Similarly to the foregoing first
embodiment, the organic photoelectric converter 20B of the present
embodiment is of the so-called longitudinal direction spectral type
in which, for example, one organic photoelectric converter 20B and
two inorganic photoelectric converters 32B and 32R (see FIG. 2) are
stacked in the longitudinal direction. In the present embodiment,
the photoelectric conversion layer 23B is configured with use of an
organic semiconductor material that has one or two or more halogen
atoms in a molecule.
[0148] Desorption of the halogen atom, as described in the
foregoing first embodiment, from the organic semiconductor layer
that is provided between the pair of electrodes and configured with
use of the material having the halogen atom in the molecule also
occurs in a case where the photoelectric conversion layer 23B is
formed with use of the organic semiconductor material having the
halogen atom in the molecule. In this case, using, as the material
included in the photoelectric conversion layer 23B, an organic
semiconductor material in which binding energy of the halogen atom
having the smallest binding energy of one or two or more halogen
atoms included in the molecule is 5.4 eV or higher makes it
possible to suppress modification of the metal oxide included in
the top-electrode 25 and the organic semiconductor material
included in the photoelectric conversion layer 23B during formation
of the top-electrode 25.
[0149] It is to be noted that similarly to the material of the
photoelectric conversion layer 23A in the foregoing first
embodiment, examples of the material of the photoelectric
conversion layer 23B in the present embodiment include
quinacridone, boron subphthalocyanine chloride, pentacene,
benzothieno-benzothiphene, fullerene, and derivatives thereof,
except that the photoelectric conversion layer 23B has one or more
halogen atoms in the molecule.
[0150] As described above, in the present embodiment, the
photoelectric conversion layer 23B is formed with sue of the
organic semiconductor material having one or two or more halogen
atoms in the molecule in which binding energy of the halogen atom
having the smallest binding energy in the molecule is 5.4 eV or
higher. Accordingly, the organic photoelectric converter 20B has
effects similar to those of the foregoing first embodiment.
3. THIRD EMBODIMENT
[0151] FIG. 10 schematically illustrates a cross-sectional
configuration of a photoelectric converter 20C that configures a
solid-state imaging element according to a third embodiment of the
present disclosure. Similarly to the foregoing first embodiment,
the organic photoelectric converter 20C of the present embodiment
is of the so-called longitudinal direction spectral type in which,
for example, one organic photoelectric converter 20B and two
inorganic photoelectric converters 32B and 32R (see FIG. 2) are
stacked in the longitudinal direction. In the present embodiment, a
distance between the photoelectric conversion layer 23B and the
top-electrode 25 is set to 5 nm or larger.
[0152] In a case where a material having a halogen atom in a
molecule is used as the material included in the photoelectric
conversion layer 23, as in the foregoing first embodiment, even if
the concentration of the organic semiconductor material having the
halogen atom in the molecule in the upper inter-layer 24 is 0
volume %, desorption of the halogen atom in the photoelectric
conversion layer 23 may occur due to irradiation with ultraviolet
rays, etc. during formation of the top-electrode 25 or the
protective layer 29, thereby modifying the organic material
included in the top-electrode 25 or the solid-state imaging element
10.
[0153] In contrast, in the present embodiment, the upper
inter-layer 24B that is formed with use of a material having no
halogen atom in a molecule and has a thickness of 5 nm or larger is
provided between the photoelectric conversion layer 23 including
the organic semiconductor material having the halogen atom in the
molecule and the top-electrode 25. Examples of the material
included in the upper inter-layer 24 include a material including a
pyridine skeleton, a pyrimidine skeleton, or a triazine skeleton in
a molecule. Specific examples thereof include B3PyMPM
(bis-4,6-(3,5-di-3-pyridylphenyl)-2-methylpyrimi-dine), B4P6mPM,
etc.
[0154] As described above, in the present embodiment, the upper
inter-layer 24B having a thickness of 5 nm or larger is provided
between the photoelectric conversion layer 23 and the top-electrode
25, and as the material thereof, the organic semiconductor material
having no halogen atom in the molecule is used. Accordingly, the
organic photoelectric converter 20C has effects similar to those in
the foregoing first embodiment.
[0155] It is to be noted that the present technology may have a
configuration in which the first embodiment and the second
embodiment are combined, the first embodiment and the third
embodiment are combined, or the first embodiment, the second
embodiment, and the third embodiment are combined.
4. FOURTH EMBODIMENT
[0156] FIG. 11 schematically illustrates a cross-sectional
configuration of a photoelectric converter 60 that configures a
solid-state imaging element according to a fourth embodiment of the
present disclosure. The solid-state imaging element of the present
embodiment configures one pixel (unit pixel P) in a solid-state
imaging apparatus (the solid-state imaging apparatus 1: see FIG.
16) such as a CMOS image sensor used in an electronic apparatus
such as a digital still camera and a video camera, for example.
(4-1. Configuration of Organic Photoelectric Converter)
[0157] Similarly to the foregoing first embodiment, the solid-state
imaging element of the present embodiment is of a so-called
longitudinal direction spectral type in which, for example, one
organic photoelectric converter 60 and two inorganic photoelectric
converters 32B and 32R (see FIG. 2) are stacked in the longitudinal
direction. The organic photoelectric converter 60 is provided on
the side on which the first surface (the back side) 30A is located
of the semiconductor substrate 30. The inorganic photoelectric
converters 32B and 32R are formed to be embedded in the
semiconductor substrate 30, and are stacked in the thickness
direction of the semiconductor substrate 30.
[0158] The organic photoelectric converter 60 of the present
embodiment includes a pair of electrodes (a bottom-electrode 61 and
a top-electrode 64), and an exciton blocking layer 62 and a
photoelectric conversion layer 63 provided between the pair of
electrodes. In the present embodiment, the photoelectric conversion
layer 63 is configured by two layers, i.e., an exciton generation
layer 63A including a dye material and a first semiconductor
material and an exciton disassociation layer 63B including a second
semiconductor material.
[0159] In the solid-state imaging element of the present
embodiment, light entering the organic photoelectric converter 60
from a side on which the top-electrode 64 is located is absorbed by
the exciton generation layer 63A of the photoelectric conversion
layer 63. Excitons generated thereby move to the disassociation
layer 63B, and are disassociated into electrons and holes. Charges
(electrons and holes) generated here are each carried to different
electrodes by diffusion resulting from a difference in
concentration of carriers or an internal electric field resulting
from a difference in work function between a negative electrode
(herein, the bottom-electrode 61) and a positive electrode (herein,
the top-electrode 64), and are detected as a photocurrent. In
addition, it is possible to control transport directions of the
electrons and the holes by application of a potential between the
bottom-electrode 61 and the top-electrode 64.
[0160] In the following, description is given of the
configurations, materials, etc, of respective components.
[0161] The organic photoelectric converter 60 is a photoelectric
conversion element that absorbs green light corresponding to a
portion or the entirety of a selective wavelength range (for
example, 495 nm to 570 nm) to generate the electron-hole pairs.
[0162] The bottom-electrode 61 is directly opposed to the light
receiving surfaces of the inorganic photoelectric converters 32B
and 32R formed in the semiconductor substrate 30, illustrated in
FIG. 2, for example, and is provided in regions covering the light
receiving surfaces. The bottom-electrode 61 is configured with a
conductive material having optical transparency (a transparent
conductive material), and includes ITO (indium tin oxide), for
example. However, in addition to ITO, a tin oxide (SnO.sub.2)-based
material to which a dopant is added or a zinc oxide-based material
prepared through adding a dopant to aluminum zinc oxide (ZnO) may
be used as a constituent material of the bottom-electrode 61.
Examples of the zinc oxide-based material include aluminum zinc
oxide (AZO) to which aluminum (Al) is added as a dopant, gallium
zinc oxide (GZO) to which gallium (Ga) is added, and indium zinc
oxide (IZO) to which indium (In) is added. In addition to these
materials, aluminum (Al), Cul, InSbO.sub.4, ZnMgO, CuInO.sub.2,
MgInO.sub.2O.sub.4, CdO, ZnSnO.sub.3, etc. may also be used. In the
solid-state imaging apparatus 1 that uses the solid-state imaging
element 10 as one pixel, the bottom-electrode 61 may be separated
for each pixel or may be formed as a common electrode for
respective pixels.
[0163] The exciton blocking layer 62 prevents the excitons
generated in the exciton generation layer 63A, for example, from
being deactivated by the bottom-electrode 61. In a case where a
relation of energy levels of the respective layers that configure
the organic photoelectric converter 60, for example, is established
as illustrated in FIG. 12A and FIG. 12B to be described later, an
electron transport material is preferably used as a material that
forms an exciton blocking layer 62A. Specific examples of the
electron transport material include Bathocuproine (BCP), 2,9-Bi
s(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthro line (NBphen),
2,2',2''-(1,3,5-Benzinetriyl)-tris(1-phenyl-1-H-benzimidazole)
(TPBi), (8-Quinolinolato) lithium (Liq),
2-(4-tert-Butylphenyl)-5-(4-biphenylyl)-1,3,4-oxadiazole (PBD),
1,3-bis[5-(4-tert-butylphenyl)-2[1,3,4]oxadiazolyl] benzene
(OXD-7),
3-(Biphenyl-4-yl)-5-(4-tert-butylphenyl)-4-phenyl-4H-1,2,4-triazole
(TAZ), 4,4'-Bis(4,6-diphenyl-1,3,5-triazin-2-yl) biphenyl (BTB),
Bis-4,6-(3,5-di-4-pyridylphenyl)-2-methylpyrimidine (B4PyMPM), etc.
In addition, for example, in a case where the relation of the
energy levels of the respective layers that configure the organic
photoelectric converter 60 is established as illustrated in FIG.
13A and FIG. 13B to be described later, a hole transport material
is preferably used. Specific examples of the hole transport
material include triarylamine derivatives (such as TPD, NPB, and
TAPC), carbazole derivatives (such as CBP and TCTA), and fluorene
derivatives (such as BSBF). It is preferable that the exciton
blocking layer 62A have a thickness in a range from 1 nm to 50 nm,
for example.
[0164] The photoelectric conversion layer 63 converts optical
energy into electric energy. As described above, the photoelectric
conversion layer 63 is configured by the two layers, i.e., the
exciton generation layer 63A and the exciton disassociation layer
63B. The exciton generation layer 63A is a layer including the dye
material and the first semiconductor material and has a bulk
heterojunction interface configured by the dye material and the
first semiconductor material. Light entering the organic
photoelectric converter 60 is absorbed by the dye material at the
bulk heterojunction interface, and transfer of energy to the first
semiconductor material generates excitons on the first
semiconductor material. The exciton disassociation layer 63B
includes the second semiconductor material. In the exciton
disassociation layer 63B, the excitons diffused from the exciton
generation layer 63A are disassociated into charges (electrons and
holes). It is to be noted that as a positional relation of the
exciton generation layer 63A and the exciton disassociation layer
63B, the exciton disassociation layer 63B is preferably disposed on
the light entering side S1, for example. This is because density of
the excitons generated in the exciton generation layer 63A is high
on a side on which the light entering surface is located, and a
distance (diffusion distance) at which the generated excitons move
to the exciton disassociation layer 63B is preferably short in
order to enhance photoelectric conversion efficiency.
[0165] In the dye material and the first semiconductor material
included in the exciton generation layer 63A, it is preferable that
the first semiconductor material, for example, have a bandgap
substantially equal to, or smaller than a bandgap of the dye
material. This facilitates energy transfer from the dye material to
the first semiconductor material. The first semiconductor material
and the second semiconductor material are the p-type semiconductor
or the n-type semiconductor, and are semiconductor materials that
have polarities different from each other. In addition, it is
preferable that the first semiconductor material and the second
semiconductor material have a difference in energy level. This
makes it possible to quickly transfer charges (electrons and holes)
generated in the exciton disassociation layer 63B to the
bottom-electrode 61 and the top-electrode 64.
[0166] FIGS. 12A, 12B, 13A, and 13B each illustrate the exciton
generation layer 63A and the exciton disassociation layer 63B and a
combination of the energy levels of the dye material, the first
semiconductor material, and the second semiconductor material that
are included therein. For example, in a case holes are used as
charges, as illustrated in FIG. 12A, it is preferable that the
first semiconductor material included in the exciton generation
layer 63A have a deeper HOMO level and a deeper LUMO level than the
second semiconductor material included in the exciton
disassociation layer 63B. In a case of such a combination of the
energy levels, the first semiconductor material is the n-type
semiconductor and the second semiconductor material is the p-type
semiconductor. As for the energy level of the dye material, for
example, the LUMO levels of the dye material and the first
semiconductor material may be equal to each other, as illustrated
in FIG. 12A, or the HOMO levels of the dye material and the first
semiconductor material may be equal to each other, as illustrated
in FIG. 12B.
[0167] In a case where electrons are used as charges, as
illustrated in FIG. 13A, it is preferable that the first
semiconductor material included in the exciton generation layer 63A
have a shallower HOMO level and a shallower LUMO level than the
second semiconductor material included in the exciton
disassociation layer 63B. In a case of such a combination of the
energy levels, the first semiconductor material is the p-type
semiconductor and the second semiconductor material is the n-type
semiconductor. As for the energy level of the dye material, for
example, the LUMO levels of the dye material and the first
semiconductor material may be equal to each other, as illustrated
in FIG. 13A, or the HOMO levels of the dye material and the first
semiconductor material may be equal to each other, as illustrated
in FIG. 13B.
[0168] The materials used as the first semiconductor material and
the second semiconductor material are preferably organic materials,
and include the following materials in the case of the combination
of the energy levels illustrated in FIG. 12A. As the dye material,
a material having a high linear absorption coefficient of a maximal
absorption wavelength in a visible light region is preferable. This
makes it possible to increase absorption capacity of light in the
visible light region in the organic photoelectric converter 60 and
have a sharp spectral shape. Examples of such a material include
subphthalocyanine or a derivative thereof expressed by a general
formula (1). Specific examples of the material include
F.sub.6SubPcOC.sub.6F.sub.5. Examples of the first semiconductor
material (the n-type semiconductor) include fullerene or a
derivative thereof expressed by a general formula (2) or a general
formula (3). Examples of the second semiconductor material (the
p-type semiconductor) include thiophene or a derivative thereof
expressed by a general formula (4). It is to be noted that in the
present disclosure, fullerene is treated as the organic
semiconductor material.
##STR00001##
[0169] (R1 to R12 are each independently selected from a group
configured of a hydrogen atom, a halogen atom, a straight-chain,
branched, or cyclic alkyl group, a thioalkyl group, a thioaryl
group, an aryl sulfonyl group, an alkyl sulfonyl group, an amino
group, an alkyl amino group, an aryl amino group, a hydroxy group,
an alkoxy group, an acyl amino group, an acyloxy group, a phenyl
group, a carboxy group, a carboxamide group, a carboalkoxy group,
an acyl group, a sulfonyl group, a cyano group, and a nitro group,
and any adjacent ones of R1 to R12 are optionally part of a
condensed aliphatic ring or a condensed aromatic ring. The
condensed aliphatic ring or the condensed aromatic ring described
above optionally includes one or more atoms other than carbon. M is
boron or a divalent or trivalent metal. X is an anionic group.)
##STR00002##
[0170] (R13 and R14 are each independently one of a hydrogen atom,
a halogen atom, a straight-chain, branched, or cyclic alkyl group,
a phenyl group, a group having a straight-chain or condensed ring
aromatic compound, a group having a halogen compound, a partial
fluoroalkyl group, a perfluoroalkyl group, a silyl alkyl group, a
silyl alkoxy group, an aryl silyl group, an aryl sulfanyl group, an
alkyl sulfanyl group, an aryl sulfonyl group, an alkyl sulfonyl
group, an aryl sulfide group, an alkyl sulfide group, an amino
group, an alkyl amino group, an aryl amino group, a hydroxy group,
an alkoxy group, an acyl amino group, an acyloxy group, a carbonyl
group, a carboxy group, a carboxamide group, a carboalkoxy group,
an acyl group, a sulfonyl group, a cyano group, a nitro group, a
group having a chalcogen compound, a phosphine group, a phosphene
group, and derivatives thereof. Each of n and m is an integer of 1
or larger.)
##STR00003##
[0171] (R15 and R16 are each independently a hydrogen atom or a
substituent group expressed by a formula (4'). R17 is an aromatic
ring group or an aromatic ring group having a substituent
group.)
[0172] It is to be noted that the material included in the
photoelectric conversion layer 63 is not particularly limited.
Besides the materials listed above, examples of the material
include naphthalene, anthracene, phenantherene, tetracene, pyrene,
perylene, fluoranthene, and derivatives thereof. Alternatively, a
polymer such as phenylenevinylene, fluorene, carbazole, indole,
pyrene, pyrrole, picoline, thiophene, acetylene, and diacetylene,
or a derivative thereof may be used. Additionally, it is possible
to preferably use a metal complex dye, a cyanine-based dye, a
merocyanine-based dye, a phenylxanthene-based dye, a
triphenylmethane-based dye, a rhodacyanine-based dye, a
xanthene-based dye, a macrocyclic azaannulene-based dye, an
azulene-based dye, naphthaquinone, an anthraquinone-based dye, a
chain compound in which a condensed polycyclic aromatic group such
as anthracene and pyrene and an aromatic ring or a heterocyclic
compound are condensed, a cyanine-like dye bonded by two
nitrogen-containing hetero rings such as quinoline, benzothiazole,
and benzoxazole that have a squarylium group and croconic methine
group as a bonded chain, or by ae squarylium group or a croconic
methine group, etc. It is to be noted that the foregoing metal
complex dye is preferably, but not limited to, a dithiol metal
complex-based dye, a metallophthalocyanine dye, a metalloporphyrine
dye, or a ruthenium complex dye.
[0173] It is preferable that the exciton generation layer 63A have
the thickness in a range of 50 nm to 300 nm, for example. It is
preferable that the exciton disassociation layer 63B have a
thickness in a range from 5 nm to 100 nm, for example.
[0174] It is to be noted that any other layer, for example, a
buffer film may be provided between the photoelectric conversion
layer 63 and the bottom-electrode 61 and between the photoelectric
conversion layer 63 and the top-electrode 64. In addition, for
example, an undercoat layer, a hole transport layer, an electron
blocking film, the photoelectric conversion layer 63, a hole
blocking film, the buffer film, an electron transport layer, a work
coefficient adjustment film, etc. may also be stacked in order from
side on which the bottom-electrode 61 is located.
[0175] The top-electrode 64 includes a conductive film having
optical transparency similar to the bottom-electrode 61. In the
solid-state imaging apparatus 1 that uses the sold-state imaging
element 10 as one pixel, the top-electrode 64 may be separated for
each pixel, or may be formed as a common electrode for respective
pixels. The top-electrode 64 has a thickness in a range from 10 nm
to 200 nm, for example.
(4-2. Workings and Effects)
[0176] In recent years, in the solid-state imaging apparatus such
as a CCD image sensor or a CMOS image sensor, high color
reproducibility, a high frame rate, and high sensitivity have been
in demand. To achieve them, an excellent spectral shape, high
responsivity, and high external quantum efficiency (EQE) are in
demand.
[0177] For example, in an imaging element (a solid-state imaging
element) having a stacking structure of an organic photoelectric
conversion film and an inorganic photoelectric converter that
performs silicon bulk spectroscopy, the organic photoelectric
conversion film in general includes two kinds of materials that
function as the p-type semiconductor or the n-type semiconductor.
The organic photoelectric conversion film includes a bulk
heterojunction interface (an P/N interface) formed, in a film, by
the p-type semiconductor and the n-type semiconductor. Excitons
generated in the organic photoelectric conversion film by light
absorption are disassociated (separated) into carriers (electrons
and holes) generated at the bulk heterojunction interface. Of the
carriers generated at the bulk heterojunction interface, electrons
are transported to one electrode by the n-type semiconductor, and
holes are transported to the other electrode by the p-type
semiconductor.
[0178] To achieve high responsivity in the solid-state imaging
element provided with the organic photoelectric conversion film
including the two kinds of materials (two elements), it is
necessary for both the p-type semiconductor and the n-type
semiconductor to have high charge transport characteristics.
Therefore, to achieve an excellent spectral shape, high
responsivity, and high external quantum efficiency, it is necessary
for either the p-type semiconductor or the n-type semiconductor to
have both sharp spectral characteristics and high charge mobility.
However, in general, a material having a sharp spectral shape in a
solid film tends not to have high charge transport characteristics.
Thus, it is extremely difficult to achieve an excellent spectral
shape, high responsivity, and high external quantum efficiency by
the two kinds of materials.
[0179] Hence, a material having a sharp spectral shape (a dye
material, for example) is separately prepared, and a solid-state
imaging element provided with an organic photoelectric conversion
film including a mixture of three kinds of materials (three
elements), i.e., the dye material, and a p-type semiconductor and
an n-type semiconductor that have high charge transport
characteristics is conceivable. For a photoelectric conversion
mechanism in the photoelectric conversion film formed by mixing of
the foregoing three kinds of materials, three paths (a path A, a
path B, and a path C) are assumed. In the organic photoelectric
conversion film in which the three kinds of materials are mixed,
first, the dye material absorbs light and enters an excited state.
The dye material in the excited state may follow the three paths
(the path A, the path B, and the path C) thereafter.
[0180] In the path A, energy is transferred from the dye material
in the excited state to the n-type semiconductor, and the n-type
semiconductor enters the excited state. Thereafter, disassociation
of excitons occurs between the n-type semiconductor and the p-type
semiconductor, and holes are generated on the p-type semiconductor
and the electrons are generated on the n-type semiconductor. Each
of the holes and the electrons is transported to a corresponding
electrode by an electric field. It is to be noted that although a
path where energy of the dye material is transferred to the p-type
semiconductor is conceivable, in general, the p-type semiconductor
often has a wider bandgap than that of the dye material. Thus,
energy transfer from the dye material to the p-type semiconductor
is less likely to occur.
[0181] In the path B, disassociation of excitons occurs between the
dye material and the p-type semiconductor, and electrons are
generated on the dye material and the holes are generated on the
p-type semiconductor. The electrons on the dye material move to the
n-type semiconductor for stabilization. Each of the holes on the
p-type semiconductor and the electrons having moved to the n-type
semiconductor is transported to a corresponding electrode by an
electric field, similarly to the path A.
[0182] In the path C, disassociation of excitons occurs between the
dye material and the n-type semiconductor, and holes are generated
on the dye material and electrons are generated on the n-type
semiconductor. The holes on the dye material move to the p-type
semiconductor for stabilization. Each of the electrons on the
n-type semiconductor and the holes having moved to the p-type
semiconductor is transported to a corresponding electrode by an
electric field, similarly to the path A.
[0183] As described above, all reactions of the foregoing path A,
the foregoing path B, and the foregoing path C may occur in the
organic photoelectric conversion film formed by mixing of the three
kinds of materials. However, in general, carrier transport
performance of the dye material is low. Accordingly, in a case
where the holes or the electrons are generated on the dye material
as in the path B or the path C, expected photoelectric conversion
efficiency or expected responsivity may not be achieved due to the
low carrier transport performance.
[0184] 1n contrast, in the present embodiment, the photoelectric
conversion layer 63 includes two layers, i.e., the exciton
generation layer 63A including the dye material and the p-type
semiconductor or the n-type semiconductor and the exciton
disassociation layer 63B including the n-type semiconductor or the
p-type semiconductor. This achieves a configuration in which a
light absorbing field (the exciton generation layer 63A) and a
charge generating field (the exciton disassociation layer 63B) are
separated, that is, a configuration in which the dye material is
not in direct contact with a charge transport material (the second
semiconductor material), thus causing the path A of the foregoing
two paths to be selected.
[0185] As described above, in the present embodiment, the
photoelectric conversion layer 63 including the exciton generation
layer 63A and the exciton disassociation layer 63B is provided,
thus reducing occurrence of exciton disassociation on the dye
material having low carrier transport performance. Therefore,
disassociation of excitors easily occurs between the p-type
semiconductor and the n-type semiconductor that have high carrier
transport performance, thus making it possible to enhance
responsivity. In addition, it is also possible to enhance
photoelectric conversion efficiency.
[0186] In addition, in a case where a solid film in which a
plurality of materials are mixed is formed, a mixing state varies
depending on compatibility among the respective materials. In a
case where the solid film including a plurality of materials is
used as the photoelectric conversion layer, it is preferable that
the solid film take a certain level of phase separation structure
to cause a carrier transfer path (percolation) to function. In a
case where the compatibility among the respective materials is
high, however, the solid film is a layer in which the respective
materials are uniformly mixed, and in a case where the
compatibility among the respective materials is low, the solid film
is widely phase-separated. Both the cases are not desirable as the
photoelectric conversion layer. As described above, in a case where
the photoelectric conversion layer is formed with use of the
mixture of the three kinds of materials, it is difficult to control
compatibility among all the three kinds of materials to establish
an ideal phase-separating structure.
[0187] In contrast, in the present embodiment, as described above,
the respective layers (the exciton generation layer 63A and the
exciton disassociation layer 63B) that configure the photoelectric
conversion layer 63 include not more than two kinds of materials,
which thus makes it easy to establish a preferable phase-separating
structure. In addition, flexibility in the combination of the
materials is improved.
[0188] Furthermore, the photoelectric conversion layer 63 has a
two-layer configuration (the exciton generation layer 63A and the
exciton disassociation layer 63B) including not more than two kinds
of materials, which thus makes it possible to significantly
simplify, for example, a manufacturing apparatus, such as a vapor
deposition source, a power source, and a control panel, prepared in
a case where the photoelectric conversion layer 63 is formed with
use of a vapor deposition method, and a manufacturing method.
[0189] It is to be noted that the exciton generation layer 63A and
the exciton dissociation layer 63B may include materials other than
the above-described materials as far as the effects of the present
disclosure are achievable.
5. FIFTH EMBODIMENT
[0190] FIG. 14 schematically illustrates a cross-sectional
configuration of an organic photoelectric converter 70 that
configures a solid-state imaging element according to a fifth
embodiment of the present disclosure. The organic photoelectric
converter 70 includes the pair of electrodes (the bottom-electrode
61 and the top-electrode 64) and a photoelectric conversion layer
73 provided between the pair of electrodes. In the present
embodiment, the photoelectric conversion layer 73 differs from the
foregoing fourth embodiment in that the photoelectric conversion
layer 73 includes an exciton generation layer 73A, an exciton
disassociation layer 73B, and an inter-layer 73C (a first
inter-layer) provided between the exciton generation layer 73A and
the exciton disassociation layer 73B.
[0191] The inter-layer 73C prevents a dye material included in the
exciton generation layer 73A from being in contact with the second
semiconductor material included in the exciton disassociation layer
7313. The inter-layer 73C is configured with use of the first
semiconductor material, for example. The inter-layer 73C has a
thickness large enough to prevent the dye material from being in
contact with the second semiconductor material, and has a thickness
in a range from 5 nm to 20 nm, for example.
[0192] As described above, in general, the dye material has the low
carrier transport performance. In contrast, in the present
embodiment, as described above, the inter-layer 73C including the
first semiconductor material is provided between the exciton
generation layer 73A and the exciton disassociation layer 73B.
Preventing formation of an interface between the dye material and
the second semiconductor material in this manner makes it possible
to prevent disassociation of excitons on the dye material.
Therefore, an effect of allowing for further enhancement of
responsivity and photoelectric conversion efficiency is achieved,
in addition to the effects of the foregoing fourth embodiment.
6. SIXTH EMBODIMENT
[0193] FIG. 15 schematically illustrates a cross-sectional
configuration of a photoelectric converter 80 that configures a
solid-state imaging element according to a sixth embodiment of the
present disclosure. The photoelectric converter 80 includes the
pair of electrodes (the bottom-electrode 61 and the top-electrode
64) and a photoelectric conversion layer 83 provided between the
pair of electrodes. The present embodiment differs from the
foregoing second and fifth embodiments in that the photoelectric
conversion layer 83 includes an exciton generation layer 83A, an
exciton disassociation layer 83B, and an inter-layer 83C, and that
an inter-layer 83D (a second inter-layer) is further provided
between the exciton disassociation layer 83B and the inter-layer
83C. It is to be noted that the inter-layer 83C has a configuration
similar to that of the inter-layer 63C in the foregoing fifth
embodiment.
[0194] The inter-layer 83D includes the first semiconductor
material and the second semiconductor material. The inter-layer 83D
has a bulk heterojunction interface configured by the first
semiconductor material and the second semiconductor material. The
inter-layer 83D has a thickness in a range from 5 nm to 50 nm, for
example.
[0195] In the present embodiment, the inter-layer 83D including the
first semiconductor and the second semiconductor is provided
between the exciton disassociation layer 83B and the inter-layer
83C, thus increasing an area of an interface where excitons are
disassociated, and charges are generated. This enhances separation
speed from the excitons to the charges, thus achieving an effect of
allowing for further enhancement of responsivity, in addition to
the effects of the foregoing fifth embodiment.
7. APPLICATION EXAMPLES
Application Example 1
[0196] FIG. 16 illustrates an overall configuration of a
solid-state imaging apparatus (the solid-state imaging apparatus 1)
that uses, for each of the pixels, the solid-state imaging element
(the solid-state imaging element 10, for example) including the
organic photoelectric converter 20 (or the organic photoelectric
converter 60, 70, or 80) described in the foregoing first to sixth
embodiments. The solid-state imaging apparatus 1 is a CMOS image
sensor, and includes the pixel unit 1a as an imaging region on the
semiconductor substrate 30 and includes, in a peripheral region of
the pixel unit 1a, a peripheral circuit unit 130 that includes, for
example, a row scanner 131, a horizontal selector 133, a column
scanner 134, and a system controller 132.
[0197] The pixel unit 1a has a plurality of unit pixels P (each
corresponding to the solid-state imaging element 10)
two-dimensionally arranged in a matrix, for example. The unit
pixels P are wired with pixel drive lines Lread (specifically, row
selection lines and reset control lines) for respective pixel rows
and vertical signal lines Lsig for respective pixel columns. The
pixel drive lines Lread transmit drive signals for signal reading
from the pixels. The pixel drive lines each have one end coupled to
a corresponding one of output terminals, corresponding to the
respective rows, of the row scanner 131.
[0198] The row scanner 131 includes a shift register, an address
decoder, etc. and is a pixel driver, for example, that drives the
respective pixels P in the pixel unit 1a on a row-by-row basis. A
signal outputted from each of the pixels P of a pixel row
selectively scanned by the row scanner 131 is supplied to the
horizontal selector 133 through each of the vertical signal lines
Lsig. The horizontal selector 133 includes an amplifier, a
horizontal selection switch, etc. provided for each of the vertical
signal lines Lsig.
[0199] The column scanner 134 includes a shift register, an address
decoder, etc., and drives horizontal selection switches of the
horizontal selector 133 in sequence while scanning the horizontal
selection switches. Such selective scanning by the column scanner
134 causes the signals of the respective pixels transmitted through
the respective vertical signal lines Lsig to be outputted in
sequence to a horizontal signal line 135 and thereafter transmitted
to outside of the semiconductor substrate 30 through the horizontal
signal line 135.
[0200] Circuit components including the row scanner 131, the
horizontal selector 133, the column scanner 134, and the horizontal
signal line 135 may be formed directly on the semiconductor
substrate 30 or disposed in an external control IC. Alternatively,
the circuit components may be formed by any other substrate coupled
by a cable, etc.
[0201] The system controller 132 receives a clock given from the
outside of the semiconductor substrate 30 or data etc. on
instructions of operation modes, and also outputs data such as
internal information of the solid-state imaging apparatus 1. The
system controller 132 further has a timing generator that generates
various timing signals, and performs drive control of the
peripheral circuits such as the row scanner 131, the horizontal
selector 133, and the column scanner 134, on the basis of the
various timing signals generated by the timing generator.
Application Example 2
[0202] The foregoing solid-state imaging apparatus 1 is applicable
to various kinds of electronic apparatuses having imaging
functions. Examples of the electronic apparatuses include camera
systems such as digital still cameras and video cameras and mobile
phones having the imaging functions. FIG. 17 illustrates, for
purpose of an example, a schematic configuration of an electronic
apparatus 2 (a camera). The electronic apparatus 2 is a video
camera that enables shooting of a still image or a moving image,
for example, and includes the solid-state imaging apparatus 1, an
optical system (an optical lens) 310, a shutter apparatus 311, a
driver 313 that drives the solid-state imaging apparatus 1 and the
shutter apparatus 311, and a signal processor 312.
[0203] The optical system 310 guides image light (incident light)
from an object to the pixel unit 1a of the solid-state imaging
apparatus 1. The optical system 310 may include a plurality of
optical lenses. The shutter apparatus 311 controls a period in
which the solid-state imaging apparatus 1 is irradiated with the
light and a period in which the light is blocked. The driver 313
controls a transfer operation of the solid-state imaging apparatus
1 and a shutter operation of the shutter apparatus 311. The signal
processor 312 performs various types of signal processing on
signals outputted from the solid-state imaging apparatus 1. An
image signal Dout having been subjected to the signal processing is
stored in a storage medium such as a memory or outputted to a
monitor, etc.
[0204] Furthermore, the foregoing solid-state imaging element 10
including the organic photoelectronic converter 20 (or the organic
photoelectric converter 60, 70, or 80) described in the foregoing
first to sixth embodiments is applicable to the following
electronic apparatuses (a capsule endoscope 10100, a mobile body of
a vehicle, etc.).
Application Example 3
<Application Example to In-Vivo Information Acquisition
System>
[0205] FIG. 18 is a block diagram depicting an example of a
schematic configuration of an in-vivo information acquisition
system of a patient using a capsule type endoscope, to which the
technology according to an embodiment of the present disclosure
(present technology) can be applied.
[0206] The in-vivo information acquisition system 10001 includes a
capsule type endoscope 10100 and an external controlling apparatus
10200.
[0207] The capsule type endoscope 10100 is swallowed by a patient
at the time of inspection. The capsule type endoscope 10100 has an
image pickup function and a wireless communication function and
successively picks up an image of the inside of an organ such as
the stomach or an intestine (hereinafter referred to as in-vivo
image) at predetermined intervals while it moves inside of the
organ by peristaltic motion for a period of time until it is
naturally discharged from the patient. Then, the capsule type
endoscope 10100 successively transmits information of the in-vivo
image to the external controlling apparatus 10200 outside the body
by wireless transmission.
[0208] The external controlling apparatus 10200 integrally controls
operation of the in-vivo information acquisition system 10001.
Further, the external controlling apparatus 10200 receives
information of an in-vivo image transmitted thereto from the
capsule type endoscope 10100 and generates image data for
displaying the in-vivo image on a display apparatus (not depicted)
on the basis of the received information of the in-vivo image.
[0209] In the in-vivo information acquisition system 10001, an
in-vivo image imaged a state of the inside of the body of a patient
can be acquired at any time in this manner for a period of time
until the capsule type endoscope 10100 is discharged after it is
swallowed.
[0210] A configuration and functions of the capsule type endoscope
10100 and the external controlling apparatus 10200 are described in
more detail below.
[0211] The capsule type endoscope 10100 includes a housing 10101 of
the capsule type, in which a light source unit 10111, an image
pickup unit 10112, an image processing unit 10113, a wireless
communication unit 10114, a power feeding unit 10115, a power
supply unit 10116 and a control unit 10117 are accommodated.
[0212] The light source unit 10111 includes a light source such as,
for example, a light emitting diode (LED) and irradiates light on
an image pickup field-of-view of the image pickup unit 10112.
[0213] The image pickup unit 10112 includes an image pickup element
and an optical system including a plurality of lenses provided at a
preceding stage to the image pickup element. Reflected light
(hereinafter referred to as observation light) of light irradiated
on a body tissue which is an observation target is condensed by the
optical system and introduced into the image pickup element. In the
image pickup unit 10112, the incident observation light is
photoelectrically converted by the image pickup element, by which
an image signal corresponding to the observation light is
generated. The image signal generated by the image pickup unit
10112 is provided to the image processing unit 10113.
[0214] The image processing unit 10113 includes a processor such as
a central processing unit (CPU) or a graphics processing unit (GPU)
and performs various signal processes for an image signal generated
by the image pickup unit 10112. The image processing unit 10113
provides the image signal for which the signal processes have been
performed thereby as RAW data to the wireless communication unit
10114.
[0215] The wireless communication unit 10114 performs a
predetermined process such as a modulation process for the image
signal for which the signal processes have been performed by the
image processing unit 10113 and transmits the resulting image
signal to the external controlling apparatus 10200 through an
antenna 10114A. Further, the wireless communication unit 10114
receives a control signal relating to driving control of the
capsule type endoscope 10100 from the external controlling
apparatus 10200 through the antenna 10114A. The wireless
communication unit 10114 provides the control signal received from
the external controlling apparatus 10200 to the control unit
10117.
[0216] The power feeding unit 10115 includes an antenna coil for
power reception, a power regeneration circuit for regenerating
electric power from current generated in the antenna coil, a
voltage booster circuit and so forth. The power feeding unit 10115
generates electric power using the principle of non-contact
charging.
[0217] The power supply unit 10116 includes a secondary battery and
stores electric power generated by the power feeding unit 10115. In
FIG. 18, in order to avoid complicated illustration, an arrow mark
indicative of a supply destination of electric power from the power
supply unit 10116 and so forth are omitted. However, electric power
stored in the power supply unit 10116 is supplied to and can be
used to drive the light source unit 10111, the image pickup unit
10112, the image processing unit 10113, the wireless communication
unit 10114 and the control unit 10117.
[0218] The control unit 10117 includes a processor such as a CPU
and suitably controls driving of the light source unit 10111, the
image pickup unit 10112, the image processing unit 10113, the
wireless communication unit 10114 and the power feeding unit 10115
in accordance with a control signal transmitted thereto from the
external controlling apparatus 10200.
[0219] The external controlling apparatus 10200 includes a
processor such as a CPU or a GPU, a microcomputer, a control board
or the like in which a processor and a storage element such as a
memory are mixedly incorporated. The external controlling apparatus
10200 transmits a control signal to the control unit 10117 of the
capsule type endoscope 10100 through an antenna 10200A to control
operation of the capsule type endoscope 10100. In the capsule type
endoscope 10100, an irradiation condition of light upon an
observation target of the light source unit 10111 can be changed,
for example, in accordance with a control signal from the external
controlling apparatus 10200. Further, an image pickup condition
(for example, a frame rate, an exposure value or the like of the
image pickup unit 10112) can be changed in accordance with a
control signal from the external controlling apparatus 10200.
Further, the substance of processing by the image processing unit
10113 or a condition for transmitting an image signal from the
wireless communication unit 10114 (for example, a transmission
interval, a transmission image number or the like) may be changed
in accordance with a control signal from the external controlling
apparatus 10200.
[0220] Further, the external controlling apparatus 10200 performs
various image processes for an image signal transmitted thereto
from the capsule type endoscope 10100 to generate image data for
displaying a picked up in-vivo image on the display apparatus. As
the image processes, various signal processes can be performed such
as, for example, a development process (demosaic process), an image
quality improving process (bandwidth enhancement process, a
super-resolution process, a noise reduction (NR) process and/or
image stabilization process) and/or an enlargement process
(electronic zooming process). The external controlling apparatus
10200 controls driving of the display apparatus to cause the
display apparatus to display a picked up in-vivo image on the basis
of generated image data. Alternatively, the external controlling
apparatus 10200 may also control a recording apparatus (not
depicted) to record generated image data or control a printing
apparatus (not depicted) to output generated image data by
printing.
[0221] The description has been given above of one example of the
in-vivo information acquisition system, to which the technology
according to the present disclosure can be applied. The technology
according to the present disclosure is applicable to, for example,
the image pickup unit 10112 of the configurations described above.
This makes it possible to acquire a fine operative image having
higher color reproducibility, thereby improving accuracy of an
inspection.
Application Example 4
4. Application Example to Endoscopic Surgery System
[0222] The technology according to the present disclosure is
applicable to various products. For example, the technology
according to the present disclosure may be applied to an endoscopic
surgery system.
[0223] FIG. 19 is a view depicting an example of a schematic
configuration of an endoscopic surgery system to which the
technology according to an embodiment of the present disclosure
(present technology) can be applied.
[0224] In FIG. 19, a state is illustrated in which a surgeon
(medical doctor) 11131 is using an endoscopic surgery system 11000
to perform surgery for a patient 11132 on a patient bed 11133. As
depicted, the endoscopic surgery system 11000 includes an endoscope
11100, other surgical tools 11110 such as a pneumoperitoneum tube
11111 and an energy treatment tool 11112, a supporting arm
apparatus 11120 which supports the endoscope 11100 thereon, and a
cart 11200 on which various apparatus for endoscopic surgery are
mounted.
[0225] The endoscope 11100 includes a lens barrel 11101 having a
region of a predetermined length from a distal end thereof to be
inserted into a body lumen of the patient 11132, and a camera head
11102 connected to a proximal end of the lens barrel 11101. In the
example depicted, the endoscope 11100 is depicted which includes as
a hard mirror having the lens barrel 11101 of the hard type.
However, the endoscope 11100 may otherwise be included as a soft
mirror having the lens barrel 11101 of the soft type.
[0226] The lens barrel 11101 has, at a distal end thereof, an
opening in which an objective lens is fitted. A light source
apparatus 11203 is connected to the endoscope 11100 such that light
generated by the light source apparatus 11203 is introduced to a
distal end of the lens barrel 11101 by a light guide extending in
the inside of the lens barrel 11101 and is irradiated toward an
observation target in a body lumen of the patient 11132 through the
objective lens. It is to be noted that the endoscope 11100 may be a
direct view mirror or may be a perspective view mirror or a side
view mirror.
[0227] An optical system and an image pickup element are provided
in the inside of the camera head 11102 such that reflected light
(observation light) from the observation target is condensed on the
image pickup element by the optical system. The observation light
is photo-electrically converted by the image pickup element to
generate an electric signal corresponding to the observation light,
namely, an image signal corresponding to an observation image. The
image signal is transmitted as RAW data to a CCU 11201.
[0228] The CCU 11201 includes a central processing unit (CPU), a
graphics processing unit (GPU) or the like and integrally controls
operation of the endoscope 11100 and a display apparatus 11202.
Further, the CCU 11201 receives an image signal from the camera
head 11102 and performs, for the image signal, various image
processes for displaying an image based on the image signal such
as, for example, a development process (demosaic process).
[0229] The display apparatus 11202 displays thereon an image based
on an image signal, for which the image processes have been
performed by the CCU 11201, under the control of the CCU 11201.
[0230] The light source apparatus 11203 includes a light source
such as, for example, a light emitting diode (LED) and supplies
irradiation light upon imaging of a surgical region to the
endoscope 11100.
[0231] An inputting apparatus 11204 is an input interface for the
endoscopic surgery system 11000. A user can perform inputting of
various kinds of information or instruction inputting to the
endoscopic surgery system 11000 through the inputting apparatus
11204. For example, the user would input an instruction or a like
to change an image pickup condition (type of irradiation light,
magnification, focal distance or the like) by the endoscope
11100.
[0232] A treatment tool controlling apparatus 11205 controls
driving of the energy treatment tool 11112 for cautery or incision
of a tissue, sealing of a blood vessel or the like. A
pneumoperitoneum apparatus 11206 feeds gas into a body lumen of the
patient 11132 through the pneumoperitoneum tube 11111 to inflate
the body lumen in order to secure the field of view of the
endoscope 11100 and secure the working space for the surgeon. A
recorder 11207 is an apparatus capable of recording various kinds
of information relating to surgery. A printer 11208 is an apparatus
capable of printing various kinds of information relating to
surgery in various forms such as a text, an image or a graph.
[0233] It is to be noted that the light source apparatus 11203
which supplies irradiation light when a surgical region is to be
imaged to the endoscope 11100 may include a white light source
which includes, for example, an LED, a laser light source or a
combination of them. Where a white light source includes a
combination of red, green, and blue (RGB) laser light sources,
since the output intensity and the output timing can be controlled
with a high degree of accuracy for each color (each wavelength),
adjustment of the white balance of a picked up image can be
performed by the light source apparatus 11203. Further, in this
case, if laser beams from the respective RGB laser light sources
are irradiated time-divisionally on an observation target and
driving of the image pickup elements of the camera head 11102 are
controlled in synchronism with the irradiation timings. Then images
individually corresponding to the R, G and B colors can be also
picked up time-divisionally. According to this method, a color
image can be obtained even if color filters are not provided for
the image pickup element.
[0234] Further, the light source apparatus 11203 may be controlled
such that the intensity of light to be outputted is changed for
each predetermined time. By controlling driving of the image pickup
element of the camera head 11102 in synchronism with the timing of
the change of the intensity of light to acquire images
time-divisionally and synthesizing the images, an image of a high
dynamic range free from underexposed blocked up shadows and
overexposed highlights can be created.
[0235] Further, the light source apparatus 11203 may be configured
to supply light of a predetermined wavelength band ready for
special light observation. In special light observation, for
example, by utilizing the wavelength experimental examplecy of
absorption of light in a body tissue to irradiate light of a narrow
band in comparison with irradiation light upon ordinary observation
(namely, white light), narrow band observation (narrow band
imaging) of imaging a predetermined tissue such as a blood vessel
of a superficial portion of the mucous membrane or the like in a
high contrast is performed. Alternatively, in special light
observation, fluorescent observation for obtaining an image from
fluorescent light generated by irradiation of excitation light may
be performed. In fluorescent observation, it is possible to perform
observation of fluorescent light from a body tissue by irradiating
excitation light on the body tissue (autofluorescence observation)
or to obtain a fluorescent light image by locally injecting a
reagent such as indocyanine green (ICG) into a body tissue and
irradiating excitation light corresponding to a fluorescent light
wavelength of the reagent upon the body tissue.
[0236] The light source apparatus 11203 can be configured to supply
such narrow-band light and/or excitation light suitable for special
light observation as described above.
[0237] FIG. 20 is a block diagram depicting an example of a
functional configuration of the camera head 11102 and the CCU 11201
depicted in FIG. 19.
[0238] The camera head 11102 includes a lens unit 11401, an image
pickup unit 11402, a driving unit 11403, a communication unit 11404
and a camera head controlling unit 11405. The CCU 11201 includes a
communication unit 11411, an image processing unit 11412 and a
control unit 11413. The camera head 11102 and the CCU 11201 are
connected for communication to each other by a transmission cable
11400.
[0239] The lens unit 11401 is an optical system, provided at a
connecting location to the lens barrel 11101. Observation light
taken in from a distal end of the lens barrel 11101 is guided to
the camera head 11102 and introduced into the lens unit 11401. The
lens unit 11401 includes a combination of a plurality of lenses
including a zoom lens and a focusing lens.
[0240] The number of image pickup elements which is included by the
image pickup unit 11402 may be one (single-plate type) or a plural
number (multi-plate type). Where the image pickup unit 11402 is
configured as that of the multi-plate type, for example, image
signals corresponding to respective R, G and B are generated by the
image pickup elements, and the image signals may be synthesized to
obtain a color image. The image pickup unit 11402 may also be
configured so as to have a pair of image pickup elements for
acquiring respective image signals for the right eye and the left
eye ready for three dimensional (3D) display. If 3D display is
performed, then the depth of a living body tissue in a surgical
region can be comprehended more accurately by the surgeon 11131. It
is to be noted that, where the image pickup unit 11402 is
configured as that of stereoscopic type, a plurality of systems of
lens units 11401 are provided corresponding to the individual image
pickup elements.
[0241] Further, the image pickup unit 11402 may not necessarily be
provided on the camera head 11102. For example, the image pickup
unit 11402 may be provided immediately behind the objective lens in
the inside of the lens barrel 11101.
[0242] The driving unit 11403 includes an actuator and moves the
zoom lens and the focusing lens of the lens unit 11401 by a
predetermined distance along an optical axis under the control of
the camera head controlling unit 11405. Consequently, the
magnification and the focal point of a picked up image by the image
pickup unit 11402 can be adjusted suitably.
[0243] The communication unit 11404 includes a communication
apparatus for transmitting and receiving various kinds of
information to and from the CCU 11201. The communication unit 11404
transmits an image signal acquired from the image pickup unit 11402
as RAW data to the CCU 11201 through the transmission cable
11400.
[0244] In addition, the communication unit 11404 receives a control
signal for controlling driving of the camera head 11102 from the
CCU 11201 and supplies the control signal to the camera head
controlling unit 11405. The control signal includes information
relating to image pickup conditions such as, for example,
information that a frame rate of a picked up image is designated,
information that an exposure value upon image picking up is
designated and/or information that a magnification and a focal
point of a picked up image are designated.
[0245] It is to be noted that the image pickup conditions such as
the frame rate, exposure value, magnification or focal point may be
designated by the user or may be set automatically by the control
unit 11413 of the CCU 11201 on the basis of an acquired image
signal. In the latter case, an auto exposure (AE) function, an auto
focus (AF) function and an auto white balance (AWB) function are
incorporated in the endoscope 11100.
[0246] The camera head controlling unit 11405 controls driving of
the camera head 11102 on the basis of a control signal from the CCU
11201 received through the communication unit 11404.
[0247] The communication unit 11411 includes a communication
apparatus for transmitting and receiving various kinds of
information to and from the camera head 11102. The communication
unit 11411 receives an image signal transmitted thereto from the
camera head 11102 through the transmission cable 11400.
[0248] Further, the communication unit 11411 transmits a control
signal for controlling driving of the camera head 11102 to the
camera head 11102. The image signal and the control signal can be
transmiued by electrical communication, optical communication or
the like.
[0249] The image processing unit 11412 performs various image
processes for an image signal in the form of RAW data transmitted
thereto from the camera head 11102.
[0250] The control unit 11413 performs various kinds of control
relating to image picking up of a surgical region or the like by
the endoscope 11100 and display of a picked up image obtained by
image picking up of the surgical region or the like. For example,
the control unit 11413 creates a control signal for controlling
driving of the camera head 11102.
[0251] Further, the control unit 11413 controls, on the basis of an
image signal for which image processes have been performed by the
image processing unit 11412, the display apparatus 11202 to display
a picked up image in which the surgical region or the like is
imaged. Thereupon, the control unit 11413 may recognize various
objects in the picked up image using various image recognition
technologies. For example, the control unit 11413 can recognize a
surgical tool such as forceps, a particular living body region,
bleeding, mist when the energy treatment tool 11112 is used and so
forth by detecting the shape, color and so forth of edges of
objects included in a picked up image. The control unit 11413 may
cause, when it controls the display apparatus 11202 to display a
picked up image, various kinds of surgery supporting information to
be displayed in an overlapping manner with an image of the surgical
region using a result of the recognition. Where surgery supporting
information is displayed in an overlapping manner and presented to
the surgeon 11131, the burden on the surgeon 11131 can be reduced
and the surgeon 11131 can proceed with the surgery with
certainty.
[0252] The transmission cable 11400 which connects the camera head
11102 and the CCU 11201 to each other is an electric signal cable
ready for communication of an electric signal, an optical fiber
ready for optical communication or a composite cable ready for both
of electrical and optical communications.
[0253] Here, while, in the example depicted, communication is
performed by wired communication using the transmission cable
11400, the communication between the camera head 11102 and the CCU
11201 may be performed by wireless communication.
[0254] In the foregoing, the description has been given of one
example of the endoscopic surgery system to which the technology
according to the present disclosure can be applied. The technology
according to the present disclosure may be applied to the image
pickup unit 11402 among the components of the configuration
described above. Applying the technology according to the present
disclosure to the image pickup unit 11402 makes it possible to
obtain a clearer image of the surgical region. Hence, it is
possible for the surgeon to confirm the surgical region with
certainty.
[0255] Note that the description has been given above of the
endoscopic surgery system as one example. The technology according
to the present disclosure may be applied to any medical system
besides the endoscopic surgery system, such as a micrographic
surgery system.
Application Example 5
<Application Example to Mobile Body>
[0256] The technology (present technology) according to the present
disclosure is applicable to various products. For example, the
technology according to the present disclosure may be achieved in
the form of an apparatus to be mounted to a mobile body of any kind
such as an automobile, an electric vehicle, a hybrid electric
vehicle, a motorcycle, bicycle, a personal mobility, an airplane,
an unmanned aerial vehicle, a vessel, and a robot.
[0257] FIG. 21 is a block diagram depicting an example of schematic
configuration of a vehicle control system as an example of a mobile
body control system to which the technology according to an
embodiment of the present disclosure can be applied.
[0258] The vehicle control system 12000 includes a plurality of
electronic control units connected to each other via a
communication network 12001. In the example depicted in FIG. 21,
the vehicle control system 12000 includes a driving system control
unit 12010, a body system control unit 12020, an outside-vehicle
information detecting unit 12030, an in-vehicle information
detecting unit 12040, and an integrated control unit 12050. In
addition, a microcomputer 12051, a sound/image output section
12052, and a vehicle-mounted network interface (1/F) 12053 are
illustrated as a functional configuration of the integrated control
unit 12050.
[0259] The driving system control unit 12010 controls the operation
of devices related to the driving system of the vehicle in
accordance with various kinds of programs. For example, the driving
system control unit 12010 functions as a control device for a
driving force generating device for generating the driving force of
the vehicle, such as an internal combustion engine, a driving
motor, or the like, a driving force transmitting mechanism for
transmitting the driving force to wheels, a steering mechanism for
adjusting the steering angle of the vehicle, a braking device for
generating the braking force of the vehicle, and the like.
[0260] The body system control unit 12020 controls the operation of
various kinds of devices provided to a vehicle body in accordance
with various kinds of programs. For example, the body system
control unit 12020 functions as a control device for a keyless
entry system, a smart key system, a power window device, or various
kinds of lamps such as a headlamp, a backup lamp, a brake lamp, a
turn signal, a fog lamp, or the like. In this case, radio waves
transmitted from a mobile device as an alternative to a key or
signals of various kinds of switches can be input to the body
system control unit 12020. The body system control unit 12020
receives these input radio waves or signals, and controls a door
lock device, the power window device, the lamps, or the like of the
vehicle.
[0261] The outside-vehicle information detecting unit 12030 detects
information about the outside of the vehicle including the vehicle
control system 12000. For example, the outside-vehicle information
detecting unit 12030 is connected with an imaging section 12031.
The outside-vehicle information detecting unit 12030 makes the
imaging section 12031 image an image of the outside of the vehicle,
and receives the imaged image. On the basis of the received image,
the outside-vehicle information detecting unit 12030 may perform
processing of detecting an object such as a human, a vehicle, an
obstacle, a sign, a character on a road surface, or the like, or
processing of detecting a distance thereto.
[0262] The imaging section 12031 is an optical sensor that receives
light, and which outputs an electric signal corresponding to a
received light amount of the light. The imaging section 12031 can
output the electric signal as an image, or can output the electric
signal as information about a measured distance. In addition, the
light received by the imaging section 12031 may be visible light,
or may be invisible light such as infrared rays or the like.
[0263] The in-vehicle information detecting unit 12040 detects
information about the inside of the vehicle. The in-vehicle
information detecting unit 12040 is, for example, connected with a
driver state detecting section 12041 that detects the state of a
driver. The driver state detecting section 12041, for example,
includes a camera that images the driver. On the basis of detection
information input from the driver state detecting section 12041,
the in-vehicle information detecting unit 12040 may calculate a
degree of fatigue of the driver or a degree of concentration of the
driver, or may determine whether the driver is dozing.
[0264] The microcomputer 12051 can calculate a control target value
for the driving force generating device, the steering mechanism, or
the braking device on the basis of the information about the inside
or outside of the vehicle which information is obtained by the
outside-vehicle information detecting unit 12030 or the in-vehicle
information detecting unit 12040, and output a control command to
the driving system control unit 12010. For example, the
microcomputer 12051 can perform cooperative control intended to
implement functions of an advanced driver assistance system (ADAS)
which functions include collision avoidance or shock mitigation for
the vehicle, following driving based on a following distance,
vehicle speed maintaining driving, a warning of collision of the
vehicle, a warning of deviation of the vehicle from a lane, or the
like.
[0265] In addition, the microcomputer 12051 can perform cooperative
control intended for automatic driving, which makes the vehicle to
travel autonomously without depending on the operation of the
driver, or the like, by controlling the driving force generating
device, the steering mechanism, the braking device, or the like on
the basis of the information about the outside or inside of the
vehicle which information is obtained by the outside-vehicle
information detecting unit 12030 or the in-vehicle information
detecting unit 12040.
[0266] In addition, the microcomputer 12051 can output a control
command to the body system control unit 12020 on the basis of the
information about the outside of the vehicle which information is
obtained by the outside-vehicle information detecting unit 12030.
For example, the microcomputer 12051 can perform cooperative
control intended to prevent a glare by controlling the headlamp so
as to change from a high beam to a low beam, for example, in
accordance with the position of a preceding vehicle or an oncoming
vehicle detected by the outside-vehicle information detecting unit
12030.
[0267] The sound/image output section 12052 transmits an output
signal of at least one of a sound and an image to an output device
capable of visually or auditorily notifying information to an
occupant of the vehicle or the outside of the vehicle. In the
example of FIG. 21, an audio speaker 12061, a display section
12062, and an instrument panel 12063 are illustrated as the output
device. The display section 12062 may, for example, include at
least one of an on-board display and a head-up display.
[0268] FIG. 22 is a diagram depicting an example of the
installation position of the imaging section 12031.
[0269] In FIG. 22, the imaging section 12031 includes imaging
sections 12101, 12102, 12103, 12104, and 12105.
[0270] The imaging sections 12101, 12102, 12103, 12104, and 12105
are, for example, disposed at positions on a front nose, sideview
mirrors, a rear bumper, and a back door of the vehicle 12100 as
well as a position on an upper portion of a windshield within the
interior of the vehicle. The imaging section 12101 provided to the
front nose and the imaging section 12105 provided to the upper
portion of the windshield within the interior of the vehicle obtain
mainly an image of the front of the vehicle 12100. The imaging
sections 12102 and 12103 provided to the sideview mirrors obtain
mainly an image of the sides of the vehicle 12100. The imaging
section 12104 provided to the rear bumper or the back door obtains
mainly an image of the rear of the vehicle 12100. The imaging
section 12105 provided to the upper portion of the windshield
within the interior of the vehicle is used mainly to detect a
preceding vehicle, a pedestrian, an obstacle, a signal, a traffic
sign, a lane, or the like.
[0271] Incidentally, FIG. 22 depicts an example of photographing
ranges of the imaging sections 12101 to 12104. An imaging range
12111 represents the imaging range of the imaging section 12101
provided to the front nose. Imaging ranges 12112 and 12113
respectively represent the imaging ranges of the imaging sections
12102 and 12103 provided to the sideview mirrors. An imaging range
12114 represents the imaging range of the imaging section 12104
provided to the rear bumper or the back door. A bird's-eye image of
the vehicle 12100 as viewed from above is obtained by superimposing
image data imaged by the imaging sections 12101 to 12104, for
example.
[0272] At least one of the imaging sections 12101 to 12104 may have
a function of obtaining distance information. For example, at least
one of the imaging sections 12101 to 12104 may be a stereo camera
constituted of a plurality of imaging elements, or may be an
imaging element having pixels for phase difference detection.
[0273] For example, the microcomputer 12051 can determine a
distance to each three-dimensional object within the imaging ranges
12111 to 12114 and a temporal change in the distance (relative
speed with respect to the vehicle 12100) on the basis of the
distance information obtained from the imaging sections 12101 to
12104, and thereby extract, as a preceding vehicle, a nearest
three-dimensional object in particular that is present on a
traveling path of the vehicle 12100 and which travels in
substantially the same direction as the vehicle 12100 at a
predetermined speed (for example, equal to or more than 0 km/hour).
Further, the microcomputer 12051 can set a following distance to be
maintained in front of a preceding vehicle in advance, and perform
automatic brake control (including following stop control),
automatic acceleration control (including following start control),
or the like. It is thus possible to perform cooperative control
intended for automatic driving that makes the vehicle travel
autonomously without depending on the operation of the driver or
the like.
[0274] For example, the microcomputer 12051 can classify
three-dimensional object data on three-dimensional objects into
three-dimensional object data of a two-wheeled vehicle, a
standard-sized vehicle, a large-sized vehicle, a pedestrian, a
utility pole, and other three-dimensional objects on the basis of
the distance information obtained from the imaging sections 12101
to 12104, extract the classified three-dimensional object data, and
use the extracted three-dimensional object data for automatic
avoidance of an obstacle. For example, the microcomputer 12051
identifies obstacles around the vehicle 12100 as obstacles that the
driver of the vehicle 12100 can recognize visually and obstacles
that are difficult for the driver of the vehicle 12100 to recognize
visually. Then, the microcomputer 12051 determines a collision risk
indicating a risk of collision with each obstacle. In a situation
in which the collision risk is equal to or higher than a set value
and there is thus a possibility of collision, the microcomputer
12051 outputs a warning to the driver via the audio speaker 12061
or the display section 12062, and performs forced deceleration or
avoidance steering via the driving system control unit 12010. The
microcomputer 12051 can thereby assist in driving to avoid
collision.
[0275] At least one of the imaging sections 12101 to 12104 may be
an infrared camera that detects infrared rays. The microcomputer
12051 can, for example, recognize a pedestrian by determining
whether or not there is a pedestrian in imaged images of the
imaging sections 12101 to 12104. Such recognition of a pedestrian
is, for example, performed by a procedure of extracting
characteristic points in the imaged images of the imaging sections
12101 to 12104 as infrared cameras and a procedure of determining
whether or not it is the pedestrian by performing pattern matching
processing on a series of characteristic points representing the
contour of the object. When the microcomputer 12051 determines that
there is a pedestrian in the imaged images of the imaging sections
12101 to 12104, and thus recognizes the pedestrian, the sound/image
output section 12052 controls the display section 12062 so that a
square contour line for emphasis is displayed so as to be
superimposed on the recognized pedestrian. The sound/image output
section 12052 may also control the display section 12062 so that an
icon or the like representing the pedestrian is displayed at a
desired position.
8. EXAMPLES
Example 1
[0276] First, after a glass substrate with an ITO electrode as a
bottom-electrode was subjected to UV/ozone cleaning, this substrate
was moved to an organic vapor deposition chamber, and an interior
of the chamber was depressurized to 1.times.10.sup.-5 Pa or lower.
Thereafter, while a substrate holder was rotated, a photoelectric
conversion layer including no halogen atom was formed. Then, an
upper inter-layer including a halogen-containing molecule as a
dopant (a guest) was similarly formed. Specifically, in an
experiment 1, a naphthalene diimide-based material expressed by the
following formula (5) was used as a host material, a
subphthalocyanine-based material expressed by the following formula
(6) was used as a guest material, and a doping concentration
(volume %) of the guest material was set to 0, 0.01, 0.05, 0.1, 1,
10, and 100 (experimental examples 1 to 7). In an experiment 2, the
material expressed by the formula (5) was used as the host
material, a subphthalocyanine-based material expressed by the
following formula (7) was used as the guest material, and the
doping concentration (volume %) of the guest material was set to 0,
0.01, 0.05, 0.1, 1, 10, and 100 (experimental examples 8 to 14). In
an experiment 3, the material expressed by the formula (5) was used
as the host material, a hexaazatriphenylene-based material
expressed by the following formula (8) was used as the guest
material, and the doping concentration (volume %) of the guest
material was set to 0, 0.01, 0.05, 0.1, 1, 10, and 100
(experimental examples 15 to 21). Next, after ITO was formed as a
top-electrode on the upper inter-layer with use of a sputtering
method, a silicon nitride (SiN) film was formed as a protective
layer on the ITO with use of a CVD method.
##STR00004##
[0277] Tables 1 to 3 are each a summary of the host materials, the
guest materials, the concentrations (volume %) of the guest
materials, film thicknesses (nm) of the upper inter-layer, and
rates (%) of increasing a dark current from before to after
formation of the protective layer, which were used in the
experimental examples 1 to 7, the experimental examples 8 to 14,
and the experimental examples 15 to 21. FIG. 23 to FIG. 25 each
illustrate a relation between the doping concentrations and the
rate (%) of increasing the dark current from before to after the
formation of the protective layer in the experiments 1 to 3. In a
case where the dark current before the formation of the protective
layer was J.sub.dk.0 and the dark current after the formation of
the protective layer was J.sub.dk, the rate
(J.sub.dk-J.sub.dk,0)/J.sub.dk,0 of increasing the dark current
from before to after the formation of the protective layer
increased in a case where the doping concentration was 0.05 volume
% or higher irrespective of the kind of the guest material. This
has revealed that the halogen-containing molecule included in the
upper inter-layer is preferably set to less than 0.05 volume % to
suppress an increase in the dark current after the formation of the
protective layer.
TABLE-US-00001 TABLE 1 Rate of Film Increasing Concentration
Thickness Dark Current Host Material Guest Material (Volume %) (nm)
(%) Experimental Example 1 Formula (5) Formula (6) 0 10 0.3
Experimental Example 2 Formula (5) Formula (6) 0.01 10 3
Experimental Example 3 Formula (5) Formula (6) 0.05 10 12
Experimental Example 4 Formula (5) Formula (6) 0.1 10 1053
Experimental Example 5 Formula (5) Formula (6) 1 10 2248
Experimental Example 6 Formula (5) Formula (6) 10 10 6234
Experimental Example 7 Formula (5) Formula (6) 100 10 10543
TABLE-US-00002 TABLE 2 Rate of Film Increasing Concentration
Thickness Dark Current Host Material Guest Material (Volume %) (nm)
(%) Experimental Example 8 Formula (5) Formula (7) 0 10 0.23
Experimental Example 9 Formula (5) Formula (7) 0.01 10 2.3
Experimental Example 10 Formula (5) Formula (7) 0.05 10 8
Experimental Example 11 Formula (5) Formula (7) 0.1 10 13
Experimental Example 12 Formula (5) Formula (7) 1 10 322
Experimental Example 13 Formula (5) Formula (7) 10 10 237
Experimental Example 14 Formula (5) Formula (7) 100 10 534
TABLE-US-00003 3TABLE 3 Rate of Film Increasing Concentration
Thickness Dark Current Host Material Guest Material (Volume %) (nm)
(%) Experimental Example 15 Formula (5) Formula (8) 0 10 0.9
Experimental Example 16 Formula (5) Formula (8) 0.01 10 1.2
Experimental Example 17 Formula (5) Formula (8) 0.05 10 2
Experimental Example 18 Formula (5) Formula (8) 0.1 10 13
Experimental Example 19 Formula (5) Formula (8) 1 10 322
Experimental Example 20 Formula (5) Formula (8) 10 10 592
Experimental Example 21 Formula (5) Formula (8) 100 10 848
Example 2
[0278] First, after a glass substrate with an ITO electrode as a
bottom-electrode was subjected to UV/ozone cleaning, this substrate
was moved to an organic vapor deposition chamber, and an interior
of the chamber was depressurized to 1.times.10.sup.-5 Pa or lower.
Thereafter, while a substrate holder was rotated, as a
photoelectric conversion layer, films of an electron donor
material, an electron acceptor material, and a dye material were
formed by means of vacuum co-evaporation to have a film thickness
ratio of 4:2:4 and a total film thickness of 230 nm. Then, after an
upper inter-layer containing no halogen atom was formed by means of
vacuum deposition, similarly to Example 1, a top-electrode and a
protective layer were formed in order. In this example, as the dye
material, a subphthalocyanine-based material expressed by the
following formula (9) (an experimental example 22), the material
expressed by the formula (6) (an experimental example 23), a
subphthalocyanine-based material expressed by the following formula
(10) (an experimental example 24), the material expressed by the
formula (7) (an experimental example 25), a subphthalocyanine-based
material expressed by the following formula (11) (an experimental
example 26), and a subphthalocyanine-based material expressed by
the following formula (12) (an experimental example 27) were used.
The same material was used for the electron donor material, the
electron acceptor material, and the upper inter-layer.
##STR00005##
[0279] Table 4 is a summary of the dye materials, the materials of
the upper inter-layer, minimum binding energy (eV) of a halogen
atom in a molecule of the dye material, and the rate (%) of
increasing the dark current from before to after the formation of
the protective layer, each of which was used in the experimental
examples 22 to 27. FIG. 26 illustrates a relation between the
minimum binding energy and the rate of increasing the dark current
from before to after the formation of the protective layer. From an
examination of dependence of the rate (%) of increasing the dark
current from before to after the formation of the protective layer
on the dye material, a correlation was observed between the minimum
binding energy of the halogen atom and the rate of increasing the
dark current in binding having a halogen contained in the molecule
of the dye material. This has revealed that in a case where the
halogen-containing molecule is present in the photoelectric
conversion layer and the minimum binding energy of the binding
having the halogen atom is 5.4 eV or higher, an increase in the
dark current after the formation of the protective layer is
suppressed. It is to be noted that binding disassociation energy
was computed by calculation of an energy change in reaction
expressed by the following formula (1). A density functional theory
was used as a calculation method. B3LYP was used for a functional
and 6-31G** was used for a basis function.
[Math. 1]
AB.fwdarw.A+B (1)
TABLE-US-00004 TABLE 4 Minimum Rate Binding of Increasing Upper
Energy Dark Current Dye Material Inter-layer (eV) (%) Experimental
Formula (9) Formula (5) 4.54 4536 Example 22 Experimental Formula
(6) Formula (5) 4.93 832 Example 23 Experimental Formula (10)
Formula (5) 4.95 2454 Example 24 Experimental Formula (7) Formula
(5) 5.37 53 Example 25 Experimental Formula (11) Formula (5) 5.5 33
Example 26 Experimental Formula (12) Formula (5) 7.15 60 Example
27
Example 3
[0280] First, after a glass substrate with an ITO electrode as a
bottom-electrode was subjected to UV/ozone cleaning, this substrate
was moved to an organic vapor deposition chamber and an interior of
the chamber was depressurized to 1.times.10.sup.-5 Pa or lower.
Thereafter, while the substrate holder was rotated, as a
photoelectric conversion layer, films of an electron donor
material, an electron acceptor material, and a dye material were
formed by means of vacuum co-evaporation to have a film thickness
ratio of 4:2:4 and a total film thickness of 230 nm. Then, after an
upper inter-layer containing no halogen atom was formed by means of
vacuum deposition, similarly to Example 1, a top-electrode and a
protective layer were formed in order. In this example, as a
material of the upper inter-layer, the material expressed by the
formula (5) (an experimental example 28), a naphthalene
diimide-based material expressed by the following formula (13) (an
experimental example 29), a naphthalene diimide-based material
expressed by the following formula (14) (an experimental example
30), a naphthalene diimide-based material expressed by the
following formula (15) (an experimental example 31), a
naphthalene-1,4,5,8-tetracarboxylic dianhydride (an experimental
example 32), a naphthalene diimide-based material expressed by the
following formula (17) (an experimental example 33), molybdenum
oxide (MoO.sub.3) (an experimental example 34), tungsten oxide
(WO.sub.3) (an experimental example 35), a
hexaazatriphenylene-based material expressed by the following
formula (18) (an experimental example 36), and the material
expressed by the formula (5) (an experimental example 37) were
used. The same material was used for the electron donor material,
the electron acceptor material, and the upper inter-layer.
##STR00006## ##STR00007##
[0281] Table 5 is a summary of work functions of the top-electrodes
in the experimental examples 28 to 37, electron affinity (eV) of
the upper inter-layer and the photoelectric conversion layer,
relative values of the dark current, and relative values of quantum
efficiency, each of which is in the experimental examples 28 to 37.
FIG. 27 illustrates a relation of the electron affinity of the
upper inter-layer and the dark current in the experimental examples
28 to 33. FIG. 28 illustrates a relation of the electron affinity
of the upper inter-layer and the quantum efficiency in the
experimental examples 28 to 33. FIG. 29 illustrates a relation of
the electron affinity of the upper inter-layer and the dark current
in the experimental examples 34 to 37. FIG. 30 illustrates a
relation of the electron affinity of the upper inter-layer and the
quantum efficiency in the experimental examples 34 to 37.
[0282] In this example, dependence of the upper inter-layer on the
dark current relative value after the formation of the protective
layer and the quantum efficiency relative value was examined. It is
to be noted that the quantum efficiency was evaluated by
application of green light having an excitation wavelength of 560
nm and intensity of 10 .mu.W/cm.sup.2. The work function of the
top-electrode was acquired with use of an ultraviolet photoelectron
spectroscopy method. The electron affinity of each of the materials
of the upper inter-layer and the photoelectric conversion layer was
computed through subtracting an ionization potential obtained by
the ultraviolet photoelectron spectroscopy method and an optical
bandgap obtained by absorption spectroscopy measurement. As a
result, it has been revealed that it is possible to establish both
a low dark current and high quantum efficiency in a case where the
top-electrode is a cathode and the upper inter-layer that satisfies
EA2.ltoreq.EA1.ltoreq.WF is used where the work function of the
top-electrode is WF, the electron affmity of the upper inter-layer
is EA1, and electron affinity of a material having the smallest
electron affinity of the photoelectric conversion materials is EA2.
In addition, it has been revealed that in a case where the
top-electrode is an anode, it is possible to establish both a low
dark current and high quantum efficiency in a case where
EA1>WF.
TABLE-US-00005 TABLE 5 Electron Affinity of Photoelectric
Conversion Upper Inter-layer Layer Material (eV) Dark Quantum
Top-electrode Electron Electron Electron Current Efficiency Work
Affinity Donor Dye Acceptor Relative Relative Material Polarity
Function Material (eV) Material Material Material Value Value
Experimental Example 28 ITO Cathode 4.8 Formula (5) 4.8 2.5 4.5 4.5
1 1 Experimental Example 29 ITO Cathode 4.8 Formula (13) 4.3 2.5
4.5 4.5 1.29 0.71 Experimental Example 30 ITO Cathode 4.8 Formula
(14) 4.7 23 4.5 4.5 1.36 1.01 Experimental Example 31 ITO Cathode
4.8 Formula (15) 5.4 2.5 4.5 4.5 11.3 0.99 Experimental Example 32
ITO Cathode 4.8 Formula (16) 4.9 2.5 4.5 4.5 3.78 1 Experimental
Example 33 ITO Cathode 4.8 Formula (17) 4.5 2.5 4.5 4.5 0.95 0.98
Experimental Example 34 ITO Anode 4.8 MoO.sub.3 6.7 2.5 4.5 4.5 1 1
Experimental Example 35 ITO Anode 4.8 WO.sub.3 6.5 2.5 4.5 4.5 1
1.02 Experimental Example 36 ITO Anode 4.8 Formula (18) 5.6 2.5 4.5
4.5 1.19 0.99 Experimental Example 37 ITO Anode 4.8 Formula (5) 4.8
2.5 4.5 4.5 21 0.7
Example 4
[0283] First, after a glass substrate with an ITO electrode as a
bottom-electrode was subjected to UV/ozone cleaning, this substrate
was moved to an organic vapor deposition chamber and an interior of
the chamber was depressurized to 1.times.10.sup.-5 Pa or lower.
Thereafter, while a substrate holder was rotated, as a
photoelectric conversion layer, films of an electron donor
material, an electron acceptor material, and a dye material having
a halogen atom in a molecule were formed by means of vacuum
co-evaporation to have a film thickness ratio of 4:2:4 and a total
film thickness of 230 nm. Then, an upper inter-layer containing no
halogen atom was formed by means of vacuum deposition. At that
time, a film thickness of the upper inter-layer was set to 3 nm (an
experimental example 38), 5 nm (an experimental example 39), 7 nm
(an experimental example 40), 10 nm (an experimental example 41),
15 nm (an experimental example 42), and 20 nm (an experimental
example 43). Thereafter, similarly to Example 1, a top-electrode
and a protective layer were formed in order. In this example, the
material expressed by the formula (7) was used as the dye material,
and the material expressed by the formula (5) was used as the upper
inter-layer. In addition, in all the experimental examples, the
same material was used for the electron donor material and the
electron acceptor material.
[0284] Table 6 is a summary of the dye material, the material of
the upper inter-layer, the film thickness (nm) of the upper
inter-layer, and the rate (%) of increasing the dark current from
before to after the formation of the protective layer, each of
which is in the experimental examples 34 to 43. FIG. 31 illustrates
the film thickness of the upper inter-layer, that is, a relation of
a distance between the photoelectric conversion layer and the
top-electrode and the rate (J.sub.dk-J.sub.dk,0)/J.sub.dk,0 of
increasing the dark current from before to after the formation of
the protective layer. It has been revealed from the result of
Example 2 that even though no halogen-containing molecule is
included in the upper inter-layer, desorption of the halogen atom
occurs to no small extent during formation of the top-electrode or
the protective layer, in a case where the halogen-containing
molecule is included in the photoelectric conversion layer, which
thus results in an increase in dark current. This is assumed to be
attributable to penetration, into the photoelectric conversion
layer, of ultraviolet rays generated upon formation of the
top-electrode or the protective layer, for example.
TABLE-US-00006 TABLE 6 Rate Film of Increasing Upper Thickness Dark
Current Dye Material Inter-layer (nm) (%) Experimental Formula (7)
Formula (5) 3 847 Example 38 Experimental Formula (7) Formula (5) 5
1 Example 39 Experimental Formula (7) Formula (5) 7 0.8 Example 40
Experimental Formula (7) Formula (5) 10 0.3 Example 41 Experimental
Formula (7) Formula (5) 15 1 Example 42 Experimental Formula (7)
Formula (5) 20 0.8 Example 43
[0285] An examination of the dependence, on the film thickness of
the upper inter-layer, of the rate of increasing the dark current
from before to after the formation of the protective layer has
revealed that the increase in the dark current after the formation
of the protective layer is suppressed through making the film
thickness 5 nm or larger, that is, making the distance from the
top-electrode to the photoelectric conversion layer including the
halogen-containing molecule 5 nm or larger.
[0286] Although the description has been given with reference to
the foregoing first and sixth embodiments, the application
examples, and the examples, the content of the present disclosure
is not limited to the foregoing embodiments, etc., and may be
modified in a variety of ways. For example, although the
photoelectric conversion element in the foregoing first embodiment
has a configuration in which the organic photoelectric converter 20
detecting the green light and the inorganic photoelectric
converters 32B and 32R respectively detecting blue light and red
light are stacked, the contents of the present disclosure are not
limited to such a configuration. That is, the organic photoelectric
converter may detect red light or blue light, and the inorganic
photoelectric converter may detect green light.
[0287] In addition, the number of organic photoelectric converters,
the number of inorganic photoelectric converters, a ratio between
the organic photoelectric converters and the inorganic
photoelectric converters are not limited, and two or more organic
photoelectric converters may be provided, or color signals of a
plurality of colors may be obtained by only the organic
photoelectric converter. Further, the content of the present
disclosure is not limited to a configuration in which organic
photoelectric converters and inorganic photoelectric converters are
stacked in the longitudinal direction, and organic photoelectric
converters and inorganic photoelectric converters may be disposed
side by side along a substrate surface.
[0288] Furthermore, in the foregoing first embodiment, the
configuration of the back-side illumination type solid-state
imaging apparatus has been exemplified: however, the contents of
the present disclosure are applicable to a front-side illumination
type solid-state imaging apparatus. In addition, it is not
necessary that the solid-state imaging element (and the imaging
apparatus) of the present disclosure include all of the respective
components described in the foregoing embodiments, and or may
include any other layer.
[0289] It is to be noted that the effects described herein are
merely illustrative and non-limiting, and other effects may be
included.
[0290] Moreover, the present disclosure may have the following
configurations. [0291] (1)
[0292] A solid-state imaging element including:
[0293] a bottom-electrode;
[0294] a top-electrode opposed to the bottom-electrode;
[0295] a photoelectric conversion layer provided between the
bottom-electrode and the top-electrode and including a first
organic semiconductor material; and
[0296] an upper inter-layer provided between the top-electrode and
the photoelectric conversion layer, and including a second organic
semiconductor material having a halogen atom in a molecule at a
concentration in a range from 0 volume % or more to less than 0.05
volume %. [0297] (2)
[0298] The solid-state imaging element according to (1), in which
the first organic semiconductor material includes one or two or
more halogen atoms in the molecule, and binding energy of a halogen
atom having smallest binding energy in the molecule is 5.4 eV or
higher. [0299] (3)
[0300] The solid-state imaging element according to (1) or (2), in
which the photoelectric conversion layer includes a third organic
semiconductor material or a fourth organic semiconductor material
or both, the third organic semiconductor material serving as an
electron donor to the first organic semiconductor material and the
fourth organic semiconductor material serving as an electron
acceptor to the first organic semiconductor material. [0301]
(4)
[0302] The solid-state imaging element according to any of (1) to
(3), in which the first organic semiconductor material is a
boronated subphthalocyanine derivative. [0303] (5)
[0304] The solid-state imaging element according to any of (2) to
(4), in which in a case where the top-electrode functions as a
cathode, a work function (WF) of the top-electrode, electron
affinity of the upper inter-layer (EA1), and electron affinity of a
material having smallest electron affinity of materials included in
the photoelectric conversion layer (EA2) satisfy
EA2.ltoreq.EA1.ltoreq.WF. [0305] (6)
[0306] The solid-state imaging element according to any of (2) or
(5), in which in a case where the top-electrode functions as an
anode, the work function (WF) of the top-electrode and the electron
affinity of the upper inter-layer (EA1) satisfy EA1>WF. [0307]
(7)
[0308] The solid-state imaging element according to any of (1) to
(6), in which a distance between the top-electrode and the
photoelectric conversion layer is in a range from 5 nm to 20 nm
both inclusive. [0309] (8)
[0310] The solid-state imaging element according to any of (1) to
(7), in which the top-electrode is formed including one or more
kinds of indium tin oxide (ITO), indium zinc oxide (IZO), and
indium-tungsten oxide (IWO). [0311] (9)
[0312] The solid-state imaging element according to any of (1) to
(8), in which an organic photoelectric converter including one or a
plurality of the photoelectric conversion layers, and one or a
plurality of inorganic photoelectric converters are stacked, the
inorganic photoelectric converters performing photoelectric
conversion in a different wavelength range from the organic
photoelectric converter. [0313] (10)
[0314] The solid-state imaging element according to any of (9), in
which
[0315] the inorganic photoelectric converter is formed to be
embedded in a semiconductor substrate, and
[0316] the organic photoelectric converter is formed on a side on
which a first surface is located of the semiconductor substrate.
[0317] (11)
[0318] A solid-state imaging element including:
[0319] a bottom-electrode;
[0320] a top-electrode opposed to the bottom-electrode;
[0321] a photoelectric conversion layer provided between the
bottom-electrode and the top-electrode and including an organic
semiconductor material that has one or two or more halogen atoms in
a molecule and in which binding energy of a halogen atom having
smallest binding energy in the molecule is 5.4 eV or higher;
and
[0322] an upper inter-layer provided between the top-electrode and
the photoelectric conversion layer. [0323] (12)
[0324] A solid-state imaging element including:
[0325] a bottom-electrode;
[0326] a top-electrode opposed to the bottom-electrode;
[0327] a photoelectric conversion layer provided between the
bottom-electrode and the top-electrode and including an organic
semiconductor material having a halogen atom in a molecule; and
[0328] an organic semiconductor layer provided between the
top-electrode and the photoelectric conversion layer, wherein
[0329] a distance between the top-electrode and the photoelectric
conversion layer is in a range from 5 nm to 20 nm both inclusive.
[0330] (13)
[0331] A solid-state imaging element including:
[0332] a first electrode;
[0333] a second electrode opposed to the first electrode; and
[0334] a photoelectric conversion layer provided between the first
electrode and the second electrode, in which
[0335] the photoelectric conversion layer includes an exciton
generation layer including a dye material and a first semiconductor
material, and an exciton disassociation layer including a second
semiconductor material. [0336] (14)
[0337] The solid-state imaging element according to (13), in which
the photoelectric conversion layer includes a first inter-layer
including a first semiconductor material between the exciton
generation layer and the exciton disassociation layer. [0338]
(15)
[0339] The solid-state imaging element according to (14), in which
the photoelectric conversion layer includes a second inter-layer
including the first semiconductor material and the second
semiconductor material between the first inter-layer and the
exciton disassociation layer. [0340] (16)
[0341] The solid-state imaging element according to any of (13) to
(15), in which the first semiconductor material and the second
semiconductor material are semiconductor materials having mutually
different polarities. [0342] (17)
[0343] The solid-state imaging element according to any of (13) to
(16), in which a bandgap of the first semiconductor material is
equal to a bandgap of the dye material or smaller than the bandgap
of the dye material. [0344] (18)
[0345] The solid-state imaging element according to any of (13) to
(17), in which the first semiconductor material and the second
semiconductor material have a difference in energy level. [0346]
(19)
[0347] The solid-state imaging element according to any of (13) to
(18), in which the second semiconductor material forms an interface
with the first semiconductor material and is not in direct contact
with the dye material. [0348] (20)
[0349] The solid-state imaging element according to any of (13) to
(19), in which the dye material, the first semiconductor material,
and the second semiconductor material are organic materials. [0350]
(21)
[0351] A solid-state imaging apparatus provided with a plurality of
pixels each including one or a plurality of solid-state imaging
elements, each of the solid-state imaging elements including:
[0352] a bottom-electrode;
[0353] a top-electrode opposed to the bottom-electrode;
[0354] a photoelectric conversion layer provided between the
bottom-electrode and the top-electrode and including a first
organic semiconductor material; and
[0355] an upper inter-layer provided between the top-electrode and
the photoelectric conversion layer, and including a second organic
semiconductor material having a halogen atom in a molecule at a
concentration in a range from 0 volume % or more to less than 0.05
volume %. [0356] (22)
[0357] A solid-state imaging apparatus provided with a plurality of
pixels each including one or a plurality of solid-state imaging
elements, each of the solid-state imaging elements including:
[0358] a bottom-electrode; and
[0359] a top-electrode opposed to the bottom-electrode;
[0360] a photoelectric conversion layer provided between the
bottom-electrode and the top-electrode and including an organic
semiconductor material that has one or two or more halogen atoms in
a molecule and in which binding energy of a halogen atom having
smallest binding energy in the molecule is 5.4 eV or higher;
and
[0361] an upper inter-layer provided between the top-electrode and
the photoelectric conversion layer. [0362] (23)
[0363] A solid-state imaging apparatus provided with a plurality of
pixels each including one or a plurality of solid-state imaging
elements, each of the solid-state imaging elements comprising:
[0364] a bottom-electrode;
[0365] a top-electrode opposed to the bottom-electrode;
[0366] a photoelectric conversion layer provided between the
bottom-electrode and the top-electrode and including an organic
semiconductor material having a halogen atom in a molecule; and
[0367] an organic semiconductor layer provided between the
top-electrode and the photoelectric conversion layer, in which
[0368] a distance between the top-electrode and the photoelectric
conversion layer is in a range from 5 nm to 20 nm both inclusive.
[0369] (24)
[0370] A solid-state imaging apparatus provided with a plurality of
pixels each including one or a plurality of solid-state imaging
elements, each of the solid-state imaging elements comprising:
[0371] a first electrode;
[0372] a second electrode opposed to the first electrode; and
[0373] a photoelectric conversion layer provided between the first
electrode and the second electrode, wherein
[0374] the photoelectric conversion layer includes an exciton
generation layer including a dye material and a first semiconductor
material, and an exciton disassociation layer including a second
semiconductor material.
[0375] This application claims the benefits of Japanese Priority
Patent Application No. 2016-142154 filed on Jul. 20, 2016 and
Japanese Priority Patent Application No. 2016-155728 filed on Aug.
8, 2016, the entire contents of which are incorporated herein by
reference.
[0376] It should be understood that those skilled in the art could
conceive various modifications, combinations, sub-combinations, and
alterations depending on design requirements and other factors,
insofar as they are within the scope of the appended claims or the
equivalents thereof.
* * * * *