U.S. patent application number 17/471547 was filed with the patent office on 2021-12-30 for functional film and method for producing functional film.
This patent application is currently assigned to FUJIFILM Corporation. The applicant listed for this patent is FUJIFILM Corporation. Invention is credited to Yoshihiko MOCHIZUKI.
Application Number | 20210402739 17/471547 |
Document ID | / |
Family ID | 1000005896716 |
Filed Date | 2021-12-30 |
United States Patent
Application |
20210402739 |
Kind Code |
A1 |
MOCHIZUKI; Yoshihiko |
December 30, 2021 |
FUNCTIONAL FILM AND METHOD FOR PRODUCING FUNCTIONAL FILM
Abstract
It is an object to provide a functional film which does not
require formation of a protective layer by laminating and applying
a protective film, and sticking of the protective layer, and also
has high moist heat resistance; and a method for producing the
same. The object is accomplished by a configuration where the
functional film includes a support, an inorganic layer, and a
protective layer consisting of a resin film, in which the inorganic
layer and the protective layer are directly joined to each other,
and in a case where an intensity ratio obtained by dividing an
intensity of a maximum peak B in a range of 2,900 to 3,000
cm.sup.-1 by an intensity of a maximum peak A in a range of 2,800
to 2,900 cm.sup.-1 in an infrared absorption spectrum is defined as
B/A, the intensity ratio B/A in a surface of the protective layer
on the inorganic layer side is 1.04 times or more the intensity
ratio B/A in a surface of the protective layer on the opposite
side.
Inventors: |
MOCHIZUKI; Yoshihiko;
(Minamiashigara-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
FUJIFILM Corporation |
Tokyo |
|
JP |
|
|
Assignee: |
FUJIFILM Corporation
Tokyo
JP
|
Family ID: |
1000005896716 |
Appl. No.: |
17/471547 |
Filed: |
September 10, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
PCT/JP2020/013291 |
Mar 25, 2020 |
|
|
|
17471547 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B32B 9/005 20130101;
B32B 27/08 20130101; B32B 2255/20 20130101; B32B 7/12 20130101;
B32B 2307/732 20130101; C23C 16/345 20130101 |
International
Class: |
B32B 7/12 20060101
B32B007/12; B32B 27/08 20060101 B32B027/08; B32B 9/00 20060101
B32B009/00; C23C 16/34 20060101 C23C016/34 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 27, 2019 |
JP |
2019-059658 |
Claims
1. A functional film comprising: a support; an inorganic layer; and
a protective layer consisting of a resin film, wherein the
inorganic layer and the protective layer are directly joined to
each other, in a case where a maximum peak in a range of 2,800 to
2,900 cm.sup.-1 is defined as a peak A and a maximum peak in a
range of 2,900 to 3,000 cm.sup.-1 is defined as a peak B in an
infrared absorption spectrum, and an intensity ratio obtained by
dividing an intensity of the peak B by an intensity of the peak A
is defined as B/A, the intensity ratio B/A in a surface of the
protective layer on the inorganic layer side is 1.04 times or more
the intensity ratio B/A in a surface of the protective layer on an
opposite side to the inorganic layer.
2. The functional film according to claim 1, wherein the inorganic
layer has an inorganic compound containing silicon as a main
component.
3. The functional film according to claim 2, wherein the inorganic
layer contains any one of silicon nitride, silicon oxide, or
silicon oxynitride as a main component.
4. The functional film according to claim 1, wherein a thickness of
the inorganic layer is 50 nm or less.
5. The functional film according to claim 1, wherein the functional
film has a base layer between the support and the inorganic
layer.
6. The functional film according to claim 1, wherein a peeling
strength between the protective layer and the inorganic layer is
2.5 N/25 mm or more.
7. The functional film according to claim 1, wherein the protective
layer contains polyethylene as a main component.
8. A method for producing a functional film, comprising: an
inorganic layer forming step of forming an inorganic layer on a
support by a gas phase film deposition method under reduced
pressure, a treating step of plasma-treating one surface of a resin
film under reduced pressure; and a bonding step of making the
inorganic layer and the plasma-treated surface of the resin film
face each other while maintaining the reduced pressure to bond the
inorganic layer to the resin film.
9. The method for producing a functional film according to claim 8,
wherein in the bonding step, a temperature of the resin film at the
time of bonding the inorganic layer to the resin film is 80.degree.
C. or lower.
10. The method for producing a functional film according to claim
8, wherein the formation of the inorganic layer in the inorganic
layer forming step is performed by plasma CVD.
11. The method for producing a functional film according to claim
8, wherein it is the inorganic layer that first comes into contact
with the resin film after the formation of the inorganic layer in
the inorganic layer forming step.
12. The method for producing a functional film according to claim
8, wherein the support is a long support, and the inorganic layer
forming step and the bonding step are performed while the long
support is transported in a longitudinal direction.
13. The method for producing a functional film according to any
claim 8, wherein the resin film is a long resin film, and the
treating step is performed while the long resin film is transported
in a longitudinal direction.
14. The method for producing a functional film according to claim
8, wherein a base layer forming step of forming a base layer on a
surface of the support is performed before the inorganic layer
forming step.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a Continuation of PCT International
Application No. PCT/JP2020/013291 filed on Mar. 25, 2020, which
claims priority under 35 U.S.C. .sctn. 119(a) to Japanese Patent
Application No. 2019-059658 filed on Mar. 27, 2019. Each of the
above applications is hereby expressly incorporated by reference,
in its entirety, into the present application.
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0002] The present invention relates to a functional film and a
method for producing the functional film.
2. Description of the Related Art
[0003] Gas barrier films are used in order to protect elements and
the like that are degraded by water and/or oxygen, or the like,
such as solar cells, organic electroluminescence elements, and
illumination devices using quantum dots.
[0004] In addition, a functional film having a laminated structure
that includes an organic layer and an inorganic layer is known as a
functional film having high gas barrier properties. The functional
film having a laminated structure that includes an organic layer
and an inorganic layer has a configuration in which at least one
set of a combination of an inorganic layer and a base organic layer
serving as a base layer (undercoat layer) of the inorganic layer is
formed on a surface of a support.
[0005] In the functional film having a laminated structure that
includes an organic layer and an inorganic layer, the inorganic
layer mainly expresses a desired function such as gas barrier
properties. Therefore, in a functional film having an inorganic
layer, it is important that the inorganic layer is maintained in an
appropriate state.
[0006] That is, in a case where the uppermost layer is an inorganic
film, an inorganic layer may be broken by contact or the like, and
a desired function such as gas barrier properties cannot be
obtained. Therefore, in the functional film having an inorganic
layer, a protective layer is formed on the uppermost layer in order
to prevent the inorganic layer from being broken. As the protective
layer, an organic layer formed by a coating method is generally
used.
[0007] In addition, in the functional film having an inorganic
layer, a process in which an inorganic layer is formed and then a
protective film (lamination film) is laminated on the inorganic
layer is also performed in order to protect the inorganic layer for
a period until the protective layer is formed after the inorganic
layer is formed.
[0008] For example, JP2011-207126A describes a method for producing
a functional film such as a gas barrier film, including a step of
continuously supplying a long support, a step of forming an
inorganic film under reduced pressure, and a step of winding the
support on a roll under reduced pressure while interposing a
protective film that imparts a sliding property between the
inorganic film and the support and that has a surface roughness Ra
equal to or less than the thickness of the inorganic film.
[0009] JP2015-171798A describes a functional film including a first
organic layer, an inorganic layer, and a second organic layer in
this order, in which the second organic layer is a layer formed by
curing a polymerizable composition that is applied directly onto a
surface of the inorganic layer, the polymerizable composition
includes a urethane-skeleton acrylate polymer, the
urethane-skeleton acrylate polymer has a structure that includes an
acrylic main chain and a side chain including a urethane polymer
unit or a urethane oligomer unit, and the side chain has an
acryloyl group at an end thereof.
SUMMARY OF THE INVENTION
[0010] As shown in JP2011-207126A and JP2015-171798A, in a
functional film having an inorganic layer as a layer expressing a
main function, an inorganic film cannot be prevented from breaking
and a high-performance functional film cannot be obtained unless a
certain protective layers is formed on the inorganic film. That is,
it is important that a surface of a functional film has a layer
having a function of protecting an inorganic layer; a functional
layer that enhances affinity for a product that uses the functional
film; and the like.
[0011] In this respect, the functional films described in
JP2011-207126A and JP2015-171798A are very functional and have
excellent performance including a high ability of protecting an
inorganic layer.
[0012] However, functional films in the related art, having an
inorganic layer as a layer expressing a main function, also have a
drawback that processes for producing the same are extremely
complicated.
[0013] For example, in the case of producing a functional film
having an inorganic layer by roll-to-roll, after the formation of
an inorganic layer, a protective film is laminated on the inorganic
layer and the laminate is wound into a roll shape in a film
deposition apparatus for the inorganic layer. Subsequently, the
roll is removed from the film deposition apparatus for the
inorganic layer and loaded in a film deposition apparatus for an
organic layer, the protective film is peeled, and then an organic
layer serving as a protective layer is formed on the inorganic
layer.
[0014] As described above, the functional film having an inorganic
layer requires steps of, for example, laminating a protective film
after the formation of an inorganic layer, attaching or detaching a
roll from a film deposition apparatus for the inorganic layer to a
film deposition apparatus for an organic layer, and peeling the
protective film, whereby a production process for the functional
film is extremely complicated.
[0015] In addition, depending on the type of the protective film
and the state of the protective film after peeling from the
inorganic layer, there may be cases where the protective film
should be discarded, which is thus disadvantageous in terms of
cost.
[0016] In addition, it is also known that in the functional film
having an inorganic layer, a protective layer is formed on a
surface of the inorganic layer by adhering a resin film serving as
a protective layer of the inorganic layer with an adhesive.
[0017] However, in this case, the thickness of the functional film
is increased by an amount of the adhesive, and in recent years, it
is difficult to decrease the thickness of the functional film as
required. In addition, the increase in the thickness of the
functional film is also disadvantageous in terms of flexibility and
optical characteristics.
[0018] Further, the adhesion of the protective film using an
adhesive also requires a step of applying the adhesive onto a
surface of the inorganic layer or a surface of the resin film. In
particular, since the formation of the inorganic layer is generally
performed in vacuum, the application of the adhesive onto the
inorganic layer is a separate step, which causes an increase in
cost and a complicated production step.
[0019] In addition, there are significant restrictions on the
adhesion between the inorganic layer and the resin film using an
adhesive. For example, the application of the adhesive to the
inorganic layer has restrictions such as a limited heating
temperature, a limited solvent that can be used, and the inorganic
layer acting as a barrier to suppress the volatilization of the
solvent.
[0020] Moreover, the adhesive often has insufficient heat
resistance and moisture resistance, and thus, has a problem that
the protective layer is peeled in a case where the adhesive is used
for a long period of time under a high temperature and a high
humidity.
[0021] An object of the present invention is to solve such a
problem, and is thus to provide a functional film having an
inorganic layer such as a gas barrier film, in which the inorganic
layer can be suitably protected, formation of a protective layer by
laminating and applying a protective film on the inorganic layer,
and sticking of the protective layer by an adhesive are not
required, and the functional film has high heat resistance and
moisture resistance; and a method for producing the functional
film.
[0022] In order to accomplish such an object, the present invention
has the following configurations.
[0023] [1] A functional film comprising:
[0024] a support;
[0025] an inorganic layer; and
[0026] a protective layer consisting of a resin film,
[0027] in which the inorganic layer and the protective layer are
directly joined to each other,
[0028] in a case where a maximum peak in a range of 2,800 to 2,900
cm.sup.-1 is defined as a peak A and a maximum peak in a range of
2,900 to 3,000 cm.sup.-1 is defined as a peak B in an infrared
absorption spectrum, and an intensity ratio obtained by dividing an
intensity of the peak B by an intensity of the peak A is defined as
B/A,
[0029] the intensity ratio B/A in a surface of the protective layer
on the inorganic layer side is 1.04 times or more the intensity
ratio B/A in a surface of the protective layer on an opposite side
to the inorganic layer.
[0030] [2] The functional film as described in [1],
[0031] in which the inorganic layer contains an inorganic compound
containing silicon as a main component.
[0032] [3] The functional film as described in [2],
[0033] in which the inorganic layer contains any one of silicon
nitride, silicon oxide, or silicon oxynitride as a main
component.
[0034] [4] The functional film as described in any one of [1] to
[3],
[0035] in which a thickness of the inorganic layer is 50 nm or
less.
[0036] [5] The functional film as described in any one of [1] to
[4],
[0037] in which the functional film has a base layer between the
support and the inorganic layer.
[0038] [6] The functional film as described in any one of [1] to
[5],
[0039] in which a peeling strength between the protective layer and
the inorganic layer is 2.5 N/25 mm or more.
[0040] [7] The functional film as described in any one of [1] to
[6],
[0041] in which the protective layer contains polyethylene as a
main component.
[0042] [8] A method for producing a functional film,
comprising:
[0043] an inorganic layer forming step of forming an inorganic
layer on a support by a gas phase film deposition method under
reduced pressure,
[0044] a treating step of plasma-treating one surface of a resin
film under reduced pressure; and
[0045] a bonding step of making the inorganic layer and the
plasma-treated surface of the resin film face each other while
maintaining the reduced pressure to bond the inorganic layer to the
resin film.
[0046] [9] The method for producing a functional film as described
in [8],
[0047] in which in the bonding step, a temperature of the resin
film at the time of bonding the inorganic layer to the resin film
is 80.degree. C. or lower.
[0048] [10] The method for producing a functional film as described
in [8] or [9],
[0049] in which the formation of the inorganic layer in the
inorganic layer forming step is performed by plasma CVD.
[0050] [11] The method for producing a functional film as described
in any one of [8] to [10],
[0051] in which it is the inorganic layer that first comes into
contact with the resin film after the formation of the inorganic
layer in the inorganic layer forming step.
[0052] [12] The method for producing a functional film as described
in any one of [8] to [11],
[0053] in which the support is a long support. and the inorganic
layer forming step and the bonding step are performed while the
long support is transported in a longitudinal direction.
[0054] [13] The method for producing a functional film as described
in any one of [8] to [12],
[0055] in which the resin film is a long resin film, and the
treating step is performed while the long resin film is transported
in a longitudinal direction.
[0056] [14] The method for producing a functional film as described
in any one of [8] to [13],
[0057] in which a base layer forming step of forming a base layer
on a surface of the support is performed before the inorganic layer
forming step.
[0058] According to the present invention, provided is a functional
film having an inorganic layer such as a gas barrier film, in which
the inorganic layer can be suitably protected, lamination of a
protective film on the inorganic layer, formation of a protective
layer by application, and adhesion of the protective layer by an
adhesive are not required, and the functional film has high heat
resistance and moisture resistance
BRIEF DESCRIPTION OF THE DRAWINGS
[0059] FIG. 1 is a conceptual diagram showing an example of a
functional film of the present invention.
[0060] FIG. 2 is a conceptual diagram showing another example of
the functional film of the present invention.
[0061] FIG. 3 is a conceptual diagram of an example of an organic
film deposition apparatus for producing a functional film.
[0062] FIG. 4 is a conceptual diagram of an example of an inorganic
film deposition apparatus for producing a functional film.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0063] Hereinafter, embodiments of the functional film of the
embodiment of the present invention and the method for producing a
functional film will be described with reference to drawings.
[0064] FIG. 1 conceptually shows an example of the functional film
of the embodiment of the present invention.
[0065] FIG. 1 is a conceptual diagram of the functional film of the
embodiment of the present invention, as viewed from a plane
direction of the main surface. The main surface is a maximum area
surface of a sheet-like object (a film or a plate-like object).
[0066] A functional film 10 shown in FIG. 1 is used as, for
example, a gas barrier film, and is configured to have a support
12, a base layer 14, an inorganic layer 16, and a protective layer
18.
[0067] As will be described in detail later, in the functional film
of the embodiment of the present invention, the protective layer 18
consists of a resin film, and the inorganic layer 16 and the
protective layer 18 are directly joined to each other. In addition,
in a case where a maximum peak in a range of 2,800 to 2,900
cm.sup.-1 is defined as a peak A and a maximum peak in a range of
2,900 to 3,000 cm.sup.-1 is defined as a peak B in an infrared
absorption spectrum, and an intensity ratio obtained by dividing an
intensity of the peak B by an intensity of the peak A is defined as
B/A in the protective layer 18, the intensity ratio B/A in a
surface of the protective layer on the inorganic layer side 16 side
is 1.04 times or more the intensity ratio B/A in a surface of the
protective layer on an opposite side to the inorganic layer 16.
[0068] In the following description, the support 12 side of the
functional film 10 is also referred to as "lower", and the
protective layer 18 side is also referred to as "upper".
[0069] The functional film 10 shown in FIG. 1 is a functional film
having an inorganic layer 16 and a base layer 14 serving as a base
for the inorganic layer 16, and having a laminated structure that
includes an organic layer and an inorganic layer, mentioned
above.
[0070] However, in the present invention, the base layer 14 is
provided as a preferred aspect, and is not an essential
configuration requirement in the functional film of the embodiment
of the present invention. Accordingly, the functional film of the
embodiment of the present invention may be configured to have the
inorganic layer 16 on the support 12 and have the protective layer
18 on the inorganic layer 16.
[0071] In addition, the example shown in FIG. 1 has one set of a
combination of the base layer 14 and the inorganic layer 16, but
the present invention is not limited thereto. For example, the
functional film of the embodiment of the present invention may have
two sets of combinations of the base layer 14 and the inorganic
layer 16, as in the functional film 10A conceptually shown in FIG.
2. Alternatively, the functional film of the embodiment of the
present invention may have three or more sets of combinations of
the base layer 14 and the inorganic layer 16.
[0072] Alternatively, the functional film of the embodiment of the
present invention preferably has the base layer 14 on the support
12, may have the inorganic layer 16 on the base layer 14, may have
the protective layer 18 on the inorganic layer 16, may have a
second layer of the inorganic layer 16 on the protective layer 18,
and may have the second layer of the protective layer 18 on the
second layer of the inorganic layer 16. In addition, the functional
film may have three or more set of combinations of the inorganic
layer 16 and the protective layer 18.
[0073] That is, for the functional film of the embodiment of the
present invention, various layer configurations are available as
long as the functional film has a support 12 and one or more
inorganic layers 16, and a protective layer 18 consisting of a
resin film which will be described later is directly joined to the
inorganic layer 16 that is the most distant from the support 12. In
addition, basically, the larger the number of the inorganic layers
16, the more advantageous in terms of gas barrier properties.
[0074] However, it is preferable that the inorganic layer 16 is a
single layer from the viewpoints that, for example, sufficient gas
barrier properties can be ensured, the thickness of a functional
film can be decreased, a functional film having good flexibility
can be obtained, high productivity can be obtained, and a
production step can be simplified. Above all, in particular, the
functional film 10 shown in FIG. 1 having the base layer 14 on the
support 12, an inorganic layer 16 on the base layer 14, and the
protective layer 18 on the inorganic layer 16 is preferably
exemplified.
[0075] The support 12 supports the base layer 14, the inorganic
layer 16, and the protective layer 18.
[0076] As the support 12, various known sheet-like materials that
are used as a support in various functional films such as the
above-mentioned functional film having a laminated structure that
includes an organic layer and an inorganic layer and various known
gas barrier films are available.
[0077] The material of the support 12 is not limited, and various
materials can be used as long as the base layer 14 or the inorganic
layer 16 can be formed. Preferred examples of the material of the
support 12 include various resin materials.
[0078] Examples of the material of the support 12 include
polyethylene (PE), polyethylene naphthalate (PEN), polyamides (PA),
polyethylene terephthalate (PET), polyvinyl chloride (PVC),
polyvinyl alcohol (PVA), polyacrylonitrile (PAN), polyimides (PI),
transparent polyimides, polymethyl methacrylate resins (PMMA),
polycarbonates (PC), polyacrylates, polymethacrylates,
polypropylene (PP), polystyrene (PS),
acrylonitrile-butadiene-styrene copolymers (ABS), cycloolefin
copolymers (COC), cycloolefin polymers (COP), triacetyl cellulose
(TAC), and ethylene-vinyl alcohol copolymers (EVOH).
[0079] A thickness of the support 12 is not limited, and may be
appropriately set in accordance with the use of the functional film
10, the material of the support 12, and the like.
[0080] The thickness of the support 12 is preferably 5 to 150
.mu.m, and more preferably 10 to 100 .mu.m from the viewpoints
that, for example, the mechanical strength of the functional film
10 can be sufficiently secured, the functional film 10 having good
flexibility can be obtained, a decrease in the weight and the
thickness of the functional film 10 can be promoted, and the
functional film 10 having good flexibility can be obtained.
[0081] In the functional film 10, the base layer 14 is formed on
the support 12 (one surface).
[0082] The base layer 14 is, for example, a layer consisting of an
organic compound obtained by polymerizing (crosslinking or curing)
monomers, dimers, oligomers, or the like. As mentioned above, in
the present invention, the base layer 14 is provided as a preferred
aspect.
[0083] The base layer 14 serving as a lower layer of the inorganic
layer 16 is a layer serving as a base that appropriately forms the
inorganic layer 16.
[0084] The base layer 14 formed on a surface of the support 12
embeds irregularities on a surface of the support 12, and foreign
matter and the like adhering to the surface to make the surface
having the inorganic layer 16 formed thereon proper, which enables
the inorganic layer 16 to be properly formed.
[0085] Furthermore, as mentioned above, the functional film of the
embodiment of the present invention may have a plurality of sets of
combinations of the inorganic layer 16 and the base layer 14. In
this case, the base layer 14 serving as a second layer or any of
subsequent layers is formed on the inorganic layer 16, but even
with this configuration, the base layer 14 serving as a surface
having the inorganic layer 16 formed thereon expresses the same
action.
[0086] In particular, by placing such the base layer 14 on a
surface of the support 12, it is possible to properly form the
inorganic layer 16 that mainly expresses gas barrier
properties.
[0087] The base layer 14 is formed by, for example, curing a
composition for forming a base layer, which contains an organic
compound (a monomer, a dimer, a trimer, an oligomer, a polymer, and
the like). The composition for forming a base layer may include one
organic compound or may include two or more organic compounds.
[0088] The base layer 14 contains, for example, a thermoplastic
resin and an organosilicon compound. Examples of the thermoplastic
resin include polyesters, (meth)acrylic resins, methacrylic
acid-maleic acid copolymers, polystyrene, transparent fluororesins,
polyimides, fluorinated polyimides, polyamides, polyamide-imides,
polyetherimides, cellulose acylate, polyurethanes, polyether ether
ketone, polycarbonates, alicyclic polyolefins, polyarylates,
polyether sulfones, polysulfones, fluorene ring-modified
polycarbonates, alicycle-modified polycarbonates, fluorene
ring-modified polyesters, and acrylic compounds. Examples of the
organosilicon compound include polysiloxane.
[0089] It is preferable that the base layer 14 includes a polymer
of a radically curable compound and/or a cationically curable
compound having an ether group from the viewpoints of an excellent
strength and a glass transition temperature.
[0090] It is preferable that the base layer 14 contains a
(meth)acrylic resin including a (meth)acrylate monomer or a polymer
such as an oligomer as a main component from the viewpoint that the
refractive index of the base layer 14 is decreased. By decreasing
the refractive index of the base layer 14, the transparency is
enhanced and the light transmittance is improved.
[0091] The base layer 14 more preferably includes a (meth)acrylic
resin that contains, as a main component, a polymer derived from a
monomer, a dimer, an oligomer, and the like of a bifunctional or
higher functional (meth)acrylate, such as dipropylene glycol
di(meth)acrylate (DPGDA), trimethylolpropane tri(meth)acrylate
(TMPTA), and dipentaerythritol hexa(meth)acrylate (DPHA), and still
more preferably includes a (meth)acrylic resin that contains, as a
main component, a polymer derived from a monomer, a dimer, an
oligomer, and the like of a trifunctional or higher functional
(meth)acrylate. In addition, a plurality of these (meth)acrylic
resins may be used.
[0092] The composition for forming a base layer preferably includes
an organic solvent, a surfactant, a silane coupling agent, and the
like, in addition to the organic compound.
[0093] In a case where a plurality of the base layers 14 are
provided, that is, a case where a plurality of sets of combinations
of the base layer 14 and the inorganic layer 16 are provided, the
materials of the respective base layers 14 may be the same as or
different from each other.
[0094] A thickness of the base layer 14 is not limited and can be
appropriately set in accordance with the components included in the
composition for forming a base layer, the support 12 used, and the
like.
[0095] The thickness of the base layer 14 is preferably 0.1 to 5
.mu.m, and more preferably 0.2 to 3 .mu.m. By setting the thickness
of the base layer 14 to 0.1 .mu.m or more, for example,
irregularities on a surface of the support 12, and foreign matter
and the like adhering to the surface are embedded, and the surface
of the base layer 14 can be planarized, and from this viewpoint,
such the thickness is preferable. By setting the thickness of the
base layer 14 to 5 .mu.m or less, for example, cracks in the base
layer 14 can be prevented, the flexibility of the functional film
10 can be enhanced, and the thickness and the weight of the
functional film 10 can be decreased, and from these viewpoints, the
thickness is preferable.
[0096] In a case where a plurality of base layers 14 are provided,
that is, a case where a plurality of sets of combinations of the
inorganic layer 16 and the base layer 14 are provided, the
thicknesses of the respective base layers 14 may be the same as or
different from each other.
[0097] The base layer 14 can be formed by a known method depending
on the material.
[0098] For example, the base layer 14 can be formed by a coating
method in which the above-mentioned composition for forming a base
layer is applied to the support 12 and the composition for forming
a base layer is dried. In the formation of the base layer 14 by the
coating method, the dried composition for forming a base layer is
further irradiated with ultraviolet rays, as needed, to polymerize
(crosslink) the organic compounds in the composition for forming a
base layer.
[0099] The base layer 14 is preferably formed by a roll-to-roll
process. In the following description, "roll to roll" is also
referred to as "R-to-R".
[0100] As is well known, the R-to-R process is a production method
in which a long sheet-like product is fed from a roll of a long
sheet-like product and subjected to film fonnation while being
transported in the longitudinal direction, and the sheet-like
product after the film formation is wound into a roll shape. By
using the R-to-R process, a high productivity and a production
efficiency can be obtained.
[0101] In the functional film 10, the inorganic layer 16 is formed
on (a surface of) the base layer 14. In the functional film 10, the
inorganic layer 16 mainly expresses a desired function such as gas
barrier properties.
[0102] The surface of the support 12 has regions where a film of an
inorganic compound is not easily deposited, such as irregularities
and shadows of foreign matter. By providing the base layer 14 and
forming the inorganic layer 16 thereon, a region where the film of
an inorganic compound is not easily deposited is covered.
Therefore, the inorganic layer 16 can be formed, without a gap, on
a surface having the inorganic layer 16 formed thereon.
[0103] A material of the inorganic layer 16 is not limited, and for
example, various known inorganic compounds that are used for known
gas barrier layers consisting of an inorganic compound expressing
gas barrier properties can be used.
[0104] Examples of the material of the inorganic layer 16 include
inorganic compounds, for example, metal oxides such as aluminum
oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium
oxide, and indium tin oxide (ITO); metal nitrides such as aluminum
nitride; metal carbides such as aluminum carbide; oxides of silicon
such as silicon oxide, silicon oxynitride, silicon oxycarbide, and
silicon oxycarbonitride; nitrides of silicon such as silicon
nitride and silicon carbonitride; carbides of silicon such as
silicon carbide; hydrides thereof; mixtures of two or more thereof;
and hydrogen-containing products thereof. In addition, mixtures of
two or more of these inorganic compounds can also be used.
[0105] Among those, silicon nitride, silicon oxide, silicon
oxynitride, aluminum oxide, and a mixture of two or more thereof
are suitably used from the viewpoint that they have high
transparency and can express excellent gas barrier properties.
Among these, the compound including silicon is preferably used from
the viewpoint that it can enhance the adhesiveness to the
protective layer 18. Among the compounds including silicon, silicon
nitride, silicon oxide, or silicon oxynitride is preferably used.
Among these, silicon nitride is preferably used from the viewpoint
that the adhesiveness to the protective layer 18 can be enhanced
and excellent gas barrier properties can be expressed.
[0106] That is, the inorganic layer 16 preferably contains a
compound having silicon as a main component, more preferably has
any one of silicon nitride, silicon oxide, or silicon oxynitride as
a main component, and still more preferably contains silicon
nitride as a main component.
[0107] Furthermore, in the present invention, the main components
in the support 12, the base layer 14, the inorganic layer 16, the
protective layer 18, and the like are components included in the
layer in the largest amount in terms of mass ratio. The main
component is preferably a component included in the layer in an
amount of more than 50% by mass, and more preferably a component
included in the layer in an amount of more than 70% by mass.
[0108] A thickness of the inorganic layer 16 is not limited, and
can be appropriately set depending on the material, such that
desired gas barrier properties can be expressed.
[0109] The thickness of the inorganic layer 16 is preferably 5 to
150 nm, more preferably 8 to 75 nm, and still more preferably 10 to
50 nm.
[0110] By setting the thickness of the inorganic layer 16 to 5 nm
or more, the inorganic layer 16 stably expressing sufficient gas
barrier properties can be formed, and from this viewpoint, such the
thickness is preferable. In addition, the inorganic layer 16 is
generally brittle, and thus, in a case where the inorganic layer 16
is excessively thick, it can cause generation of breakage, cracks,
peeling, or the like, whereas by setting the thickness of the
inorganic layer 16 to 150 nm or less, the generation of breakage
can be prevented.
[0111] In the inorganic layer 16, the intensity of a maximum peak
in a range of 2,100 to 2,250 cm.sup.-1 relative to the intensity of
a maximum peak in a range of 800 to 1,100 cm.sup.-1 in the infrared
absorption spectrum is preferably 0.2 or less. That is, the
inorganic layer 16 preferably satisfies "Maximum peak of 2,100 to
2,250 cm.sup.-1)/(Maximum peak of 800 to 1,100
cm.sup.-1).gtoreq.0.2".
[0112] Furthermore, in the infrared absorption spectrum, the peak
in a range of 800 to 1,100 cm.sup.-1 is an Si--O or Si--N system
peak. On the other hand, in the infrared absorption spectrum, the
maximum peak in a range of 2,100 to 2,250 cm.sup.-1 is the peak of
Si--H.
[0113] Such a configuration can provide the inorganic layer 16 with
a high density and a higher gas barrier properties, and further, a
number of direct bonds between the inorganic layer 16 and the
protective layer 18 as described later are formed to enhance the
adhesiveness between the inorganic layer 16 and the protective
layer 18.
[0114] As mentioned above, in a case where a plurality of inorganic
layers 16 are provided, the thicknesses of the respective inorganic
layers 16 may be the same as or different from each other.
[0115] In addition, in a case where a plurality of the inorganic
layers 16 are provided, the materials of the inorganic layers 16
may be the same as or different from each other.
[0116] The inorganic layer 16 can be formed by a known method
depending on the material.
[0117] Suitable examples of the method include various gas phase
film deposition methods, for example, plasma CVDs such as
capacitively coupled plasma (CCP)-CVD and inductively coupled
plasma (ICP)-CVD, sputtering such as atomic layer deposition (ALD),
magnetron sputtering, and reactive sputtering, and vacuum vapor
deposition. Among these, the plasma CVDs are preferably used.
[0118] Further, the inorganic layer 16 is also preferably formed by
an R-to-R process.
[0119] In the functional film 10, the protective layer 18 is formed
on (a surface of) the inorganic layer 16.
[0120] In the functional film 10 of an embodiment of the present
invention, the protective layer 18 is consisting of a resin film,
and the inorganic layer 16 and the protective layer 18 are directly
joined to each other without an adhesive (pressure sensitive
adhesive).
[0121] In addition, in a case where a maximum peak in a range of
2,800 to 2,900 cm.sup.-1 is defined as a peak A and a maximum peak
in a range of 2,900 to 3,000 cm.sup.-1 is defined as a peak B in an
infrared absorption spectrum, and an intensity ratio obtained by
dividing an intensity of the peak B by an intensity of the peak A
is defined as B/A in the protective layer 18, the intensity ratio
B/A in a surface of the protective layer on the inorganic layer
side 16 side is 1.04 times or more the intensity ratio B/A in a
surface of the protective layer on an opposite side to the
inorganic layer 16.
[0122] Furthermore, in the following description, the infrared
absorption spectrum is also referred to as an "IR spectrum". In
addition, in the following description, the intensity ratio B/A in
a surface of the protective layer 18 on the inorganic layer 16 side
is a "joint surface-side intensity ratio B/A", and the intensity
ratio B/A in a surface of the protective layer 18 on a side
opposite to the inorganic layer 16 is also referred to as
"surface-side intensity ratio B/A".
[0123] By adopting this configuration of the functional film 10 of
the present invention, a functional film which can sufficiently
protect the inorganic layer 16, require neither lamination of a
protective film after the formation of the inorganic layer 16 nor
formation of a protective layer by coating for protecting the
inorganic layer 16, and has high heat resistance and moisture
resistance is realized.
[0124] As mentioned above, in a case of producing a functional film
having an inorganic layer that expresses a desired function, the
inorganic layer is formed, a protective film is then laminated on
the inorganic layer, and the laminate is wound (in a vacuum
chamber) in a film deposition apparatus for the inorganic layer.
Subsequently, a roll obtained by winding the film having the
inorganic layer formed thereon is loaded in a film deposition
apparatus for a protective layer (organic layer), the protective
film is peeled, and then an organic layer is formed as a protective
layer that protects the inorganic layer, on the inorganic layer, by
a coating method.
[0125] That is, with regard to a functional film having an
inorganic layer in the related art, steps such as a step of
laminating the protective film, a step of removing a roll from a
film deposition apparatus for the inorganic layer, a step of
loading the roll in a film deposition apparatus for a base layer,
and a step of peeling the protective film are required after the
formation of the inorganic layer in order to form a protective
layer that protects the inorganic layer, and thus, a production
process for the functional film is extremely complicated. In
addition, the protective film may also need to be disposed,
depending on the state of the protective film peeled from the
inorganic layer.
[0126] As a method for avoiding such inconvenience, a method of
forming an inorganic layer and then laminating a protective film
such as a resin film as a protective layer, instead of the
protective layer, on the inorganic layer can be considered.
[0127] However, in this method, an adhesive is required to stick
the protective film to the inorganic layer with a sufficient
adhesive force, and the thickness of the functional film increases
by the amount of the adhesive. Therefore, with this configuration,
it is difficult to attain a decrease in the thickness of the
functional film, which has been required in recent years. In
addition, the increase in the thickness of the functional film is
also disadvantageous in terms of flexibility and optical
characteristics. Further, a step of applying the adhesive onto a
surface of the inorganic layer or a surface of the resin film is
also required. In addition, the adhesion between the inorganic
layer and the resin film by the adhesive has many restrictions such
as temperature.
[0128] Moreover, the adhesive often has insufficient heat
resistance and moisture resistance, and thus, has a problem that
the protective layer is peeled in a case where the adhesive is used
for a long period of time under a high temperature and a high
humidity.
[0129] On the other hand, the functional film 10 of the embodiment
of the present invention is used as the protective layer 18 by
joining the resin film which has been laminated as a protective
film on the inorganic layer directly to the inorganic layer 16
until the protective layer is formed after the formation of the
inorganic layer in the related art. Accordingly, according to the
present invention, the peeling of the protective film and formation
of a protective layer are not required in the subsequent steps, and
the protective film is not wasted.
[0130] Here, as is clear from the production of a functional film
in the related art, even in a case where a protective film (resin
film) is laminated on and bonded to a surface of the inorganic
layer 16, the protective film can be easily peeled, and thus, a
sufficient adhesive force which makes it possible to function as a
protective layer cannot be obtained.
[0131] In contrast, in the functional film 10 of the embodiment of
the present invention, the protective layer 18 consisting of a
resin film has a joint surface-side intensity ratio B/A which is
1.04 times or more a surface-side intensity ratio B/A in the IR
spectrum. By adopting such a configuration of the functional film
10 of the embodiment of the present invention, the protective layer
18 and the inorganic layer 16 can be directly and firmly joined to
each other and adhered with a high adhesive force even without a
use of an adhesive, and the protective layer 18 can be prevented
from peeling for a long period of time even under a high
temperature and a high humidity.
[0132] As mentioned above, the peak A is a maximum peak in a range
2,800 to 2,900 cm.sup.-1 in the IR spectrum. On the other hand, the
peak B is a maximum peak in a range of 2,900 to 3,000 cm.sup.-1 in
the IR spectrum.
[0133] In the IR spectrum, the peak A in a range of 2,800 to 2,900
cm.sup.-1 is a peak of a methylene group (--CH.sub.2--) and
corresponds to a main chain moiety of the resin (polymer compound).
On the other hand, in the IR spectrum, the peak B in a range of
2,900 to 3,000 cm.sup.-1 is a peak of a methyl group (--CH.sub.3)
and corresponds to a terminal of a main chain of the resin.
[0134] In the IR spectrum, a large intensity ratio B/A indicates
that the main chain of the resin is short and there are many
terminals. This indicates that the resin has fewer bonds of
molecules, that is, repeating units, and is soft. In addition, a
description that there are many terminals of the main chain of the
resin indicates that there are many bonds that can be bonded to
other compounds, that is, an adhesive force to the adjacent layer
can be enhanced.
[0135] That is, the description that the joint surface-side
intensity ratio B/A is 1.04 times or more the surface-side
intensity ratio B/A in the protective layer 18 indicates that the
side of the inorganic layer 16 is softer, as compared with the side
opposite to the inorganic layer 16, and there are many bonds with
the inorganic layer 16 in the protective layer 18. That is, the
description that the joint surface-side intensity ratio B/A is 1.04
times or more the surface-side intensity ratio B/A in the
protective layer 18 indicates that the joint surface side with the
inorganic layer 16 is softer, as compared with the surface side,
and there are many bonds with the inorganic layer 16 in the
protective layer 18.
[0136] Therefore, in the functional film 10 of the embodiment of
the present invention, the protective layer 18 (resin film)
suitably follows the fine irregularities of the hard inorganic
layer 16 on the joint surface side with the inorganic layer 16, and
can adhere with a high degree of adhesion without forming voids.
That is, the contact area between the inorganic layer 16 and the
protective layer 18 can be increased.
[0137] In addition, the protective layer 18 can be directly joined
to the inorganic layer 16 with many bonds on the joint surface side
with the inorganic layer 16. For example, the protective layer 18
can form a large number of Si--C bonds between Si of the inorganic
layer and C of the protective layer 18 on the joint surface side
with the inorganic layer 16.
[0138] As a result, in the functional film 10 of the embodiment of
the present invention, the inorganic layer 16 and the protective
layer 18 are directly joined to each other with a strong adhesive
force, and a high adhesive force between the two layers can be
obtained.
[0139] Moreover, the bond between the inorganic layer 16 and the
protective layer 18 in the functional film 10 of the embodiment of
the present invention is, for example, an Si--C bond in which Si of
the inorganic layer 16 and C of the protective layer 18 are
directly joined to each other. Therefore, the bond between the
inorganic layer 16 and the protective layer 18 does not cause
hydrolysis or the like due to moisture in any case, which is
different from an Si--O--C bond or the like due to dehydration
fusion using a silane coupling agent or the like. As a result, the
functional film 10 of the embodiment of the present invention does
not reduce a adhesive force between the inorganic layer 16 and the
protective layer 18 even under a high temperature and a high
humidity, and can prevent the protective layer 18 from peeling.
[0140] The functional film 10 of the embodiment of the present
invention, having the inorganic layer 16 and the protective layer
18, can be produced by, for example, forming the inorganic layer 16
by a gas phase film deposition method under reduced pressure, and
on the other hand, plasma-treating one surface of a resin film
under reduced pressure, and making the inorganic layer 16 and the
plasma-treated surface of the resin film face each other to bond
the inorganic layer 16 and the resin film while maintaining the
reduced pressure.
[0141] This production method will be described in detail
later.
[0142] In the functional film 10 of the embodiment of the present
invention, the joint surface-side intensity ratio B/A is 1.04 times
or more the surface-side intensity ratio B/A in the protective
layer 18.
[0143] The joint surface-side intensity ratio B/A that is less than
1.04 times or more the surface-side intensity ratio B/A causes
inconvenience from the viewpoint that, for example, a sufficient
adhesive force between the inorganic layer 16 and the protective
layer 18 cannot be obtained, and sufficient durability under a high
temperature and a high humidity cannot be obtained.
[0144] The joint surface-side intensity ratio B/A is preferably
1.07 times or more, and more preferably 1.1 times or more the
surface-side intensity ratio B/A.
[0145] An upper limit of the magnitude of the joint surface-side
intensity ratio B/A relative to the surface-side intensity ratio
B/A is not limited. However, in a case where the intensity of the
plasma treatment is too strong, there is a possibility that the
surface of the resin film can be brittle while the adhesiveness to
the inorganic layer 16 is lowered. In consideration of this
viewpoint, the magnitude of the joint surface-side intensity ratio
B/A relative to the surface-side intensity ratio B/A is preferably
1.5 times or less, and more preferably 1.4 times or less.
[0146] Furthermore, in the present invention, the IR spectra of a
surface of the protective layer 18 on the inorganic layer 16 side
and a surface of the protective layer 18 on a side opposite to the
inorganic layer 16 may be measured by a known method.
[0147] As an example, a method of cutting a functional film in the
thickness direction and measuring the IR spectrum of a
cross-section by microscopic infrared spectrum analysis is
exemplified.
[0148] Specifically, first, the functional film is cut diagonally
in the thickness direction. With respect to this cross-section, the
JR spectra of an edge surface of the protective layer 18 on the
inorganic layer 16 side and an edge surface of the protective layer
18 on a side opposite to the inorganic layer 16, for example, in a
range of 10.times.10 .mu.m are measured, using an infrared
microscope in reflection measurement (ATR) mode. As a result, the
IR spectra of the surface of the protective layer 18 on the
inorganic layer 16 side and the surface of the protective layer 18
on a side opposite to the inorganic layer 16 may be acquired.
[0149] Preferably, measurement of such an IR spectrum is performed
at five points optionally selected on the edge surface on the
inorganic layer 16 side and the edge surface on a side opposite to
the inorganic layer 16. An average value of the intensities of the
peak A and the peak B in the IR spectra at these five positions is
taken as the values of the peak A and the peak B on the surface of
the protective layer 18 on the inorganic layer 16 side and the
surface of the protective layer 18 on a side opposite to the
inorganic layer 16, respectively.
[0150] In the functional film 10 of the embodiment of the present
invention, the protective layer 18, that is, the resin film serving
as the protective layer 18 is not limited, and various known resin
films can be used as long as they have a sufficient function as a
protective layer of the inorganic layer 16.
[0151] Examples of the materials of the protective layer 18 include
polyethylene (PE), an ethylene-vinyl acetate copolymer (EVA),
polypropylene (PP), polyvinyl alcohol (PVA), polyvinyl chloride
(PVC), polyethylene terephthalate (PET), polystyrene (PS),
polymethyl methacrylate (PMMA), an ethylene-vinyl alcohol copolymer
(EVOH), polyamide (PA), polyacrylonitrile (PAN), polyimide (PI),
polycarbonate (PC), an acrylonitrile-butadiene-styrene copolymer
(ABS), a cycloolefin copolymer (COC), a cycloolefin polymer (COP),
and triacetylcellulose (TAC).
[0152] Among those, PE (PE film) is preferably used from the
viewpoints of an adhesive force to the inorganic layer 16, high
flexibility, low cost, availability as a heat sealing material, and
the like. That is, in the present invention, it is preferable that
the protective layer 18 contains PE as a main component.
[0153] Furthermore, as mentioned above, the resin film serving as
the protective layer 18 is preferably soft as long as it can
express a sufficient function as the protective layer 18, for
example, from the viewpoint that a high adhesive force between the
inorganic layer 16 and the protective layer 18 can be obtained.
[0154] The heat-resistance temperature of the protective layer 18
is not limited.
[0155] The heat-resistance temperature of the protective layer 18
is preferably 50.degree. C. or higher, and more preferably
60.degree. C. or higher from the viewpoint that sufficient heat
resistance can be obtained, for example.
[0156] In addition, an upper limit of the heat-resistance
temperature of the protective layer 18 is about 200.degree. C. or
lower in consideration of a fact that the protective layer 18
consists of a resin film.
[0157] Furthermore, in the present invention, the heat-resistance
temperature of the protective layer 18 indicates a lower side of
the melting point and the glass transition temperature of a
material forming the protective layer 18.
[0158] The protective layer 18, that is, the resin film serving as
the protective layer 18, is basically a single resin film that does
not have an interface, a clear boundary, a joint surface, or the
like in the thickness direction. Therefore, in a case where the
resin film serving as the protective layer 18 is a single resin
film that does not have an interface or the like, it may be a resin
film in which a plurality of resins are joined to each other by a
co-extrusion method (co-casting method) or the like.
[0159] However, in a case where the protective layer 18 is formed
by a resin film in which different kinds of resins are joined to
each other, such as a single resin film that does not have an
interface or the like prepared by subjecting PE and EVA to a
co-extrusion method, there is a possibility that inconveniences
such as a warpage due to a difference in a coefficient of thermal
expansion and peeling of the protective layer 18 due to the warpage
may occur.
[0160] In consideration of this point, even in a case where the
resin film that forms the protective layer 18 is a resin film in
which a plurality of resins are joined to each other by a
co-extrusion method, it is preferably a resin film formed of only
one kind of resin, such as a resin film consisting of only PE and a
resin film consisting of only EVA. Further, the resin film
consisting of only one kind of resin may have a different average
molecular weight in the thickness direction, may have a different
molecular weight distribution in the thickness direction, may have
a different crystallinity in the thickness direction, and may have
a different hardness between one surface and the other surface.
[0161] As mentioned above, the resin film serving as the protective
layer 18, which is soft, is advantageous in terms of the adhesive
force between the inorganic layer 16 and the protective layer
18.
[0162] Therefore, in a case where the resin film serving as the
protective layer 18 has a different hardness between one surface
and the other surface, it is preferable that the soft side of the
resin film faces the inorganic layer 16 to form the protective
layer 18. The same applies to resin films produced by joining
different kinds of resins.
[0163] In the functional film 10 of the embodiment of the present
invention, a thickness of the protective layer 18 is not limited,
and may be appropriately set in accordance with the protective
layer 18, that is, a material of the resin film, durability
required for the functional film 10, and the like. The thickness of
the protective layer 18 is preferably 1 to 70 .mu.m, more
preferably 5 to 60 .mu.m, and still more preferably 10 to 50
.mu.m.
[0164] By setting the thickness of the protective layer 18 to 1
.mu.m or more, the inorganic layer 16 can be suitably protected,
and from this viewpoint, such the thickness is preferable.
[0165] By setting the thickness of the protective layer 18 to 70
.mu.m or less, for example, a highly transparent functional film 10
can be obtained, and the functional film 10 can be prevented from
being unnecessarily thick, and a functional film 10 having good
flexibility can be obtained, and from this viewpoint, such the
thickness is preferable.
[0166] In the functional film 10 of the embodiment of the present
invention, it is basically preferable that the adhesive force
between the inorganic layer 16 and the protective layer 18 is
high.
[0167] Specifically, a peeling strength between the inorganic layer
16 and the protective layer 18 is preferably 2.5 N/25 mm or more,
more preferably 3 N/25 mm or more, and still more preferably 3.5
N/25 mm or more.
[0168] Furthermore, the higher the peeling strength between the
inorganic layer 16 and the protective layer 18, the more preferable
it is, and although there is no upper limit in the peeling
strength, the upper limit is generally 30 N/25 mm or less.
[0169] Moreover, in the functional film 10 of the embodiment of the
present invention, the peeling strength between the inorganic layer
16 and the protective layer 18 may be measured in accordance with a
180.degree. peel test of Japanese Industrial Standards (JIS) Z
0237:2009.
[0170] Hereinafter, an example of the method for producing the
functional film 10 of the embodiment of the present invention will
be described with reference to the conceptual diagrams of FIGS. 3
and 4.
[0171] The apparatus shown in FIG. 3 is an organic film deposition
apparatus 40 that forms a base layer 14.
[0172] The organic film deposition apparatus 40 forms the base
layer 14 by an R-to-R process. That is, in the organic film
deposition apparatus 40, the above-mentioned composition for
forming a base layer, which forms the base layer 14, is applied and
dried while a long support 12 is transported in the longitudinal
direction, and then an organic compound included in the composition
for forming a base layer is polymerized (cured) by light
irradiation, thereby forming the base layer 14.
[0173] As one example, the organic film deposition apparatus 40 in
the illustrated example has a coating part 42, a drying part 46, a
light irradiation part 48, a rotational shaft 50, a winding shaft
52, and transport roller pairs 54 and 56.
[0174] On the other hand, the apparatus shown in FIG. 4 is an
inorganic film deposition apparatus 60 in which an inorganic layer
16 is formed, and a protective layer 18 is laminated on the
inorganic layer 16. In the inorganic film deposition apparatus 60,
a supply/winding chamber 64 and a film deposition chamber 68 are
separated from each other by two partition walls 62 and a drum
70.
[0175] The inorganic film deposition apparatus 60 is also
configured to form the inorganic layer 16 by an R-to-R process.
That is, the inorganic film deposition apparatus 60 forms the
inorganic layer 16 on a base layer 14 of a support 12 while a long
support 12 having the base layer 14 formed thereon is transported
in the longitudinal direction, and subsequently, a resin film 18F
serving as the protective layer 18 is laminated on and adhered to a
surface of the inorganic layer 16 to form the protective layer 18.
Here, in the inorganic film deposition apparatus 60, a surface of
the resin film 18F facing the inorganic layer 16 is subjected to a
plasma treatment before laminating the resin film 18F on the
inorganic layer 16.
[0176] In a case of producing the functional film 10, first, a
support roll 12R formed by winding the long support 12 is loaded on
a rotational shaft 50 of an organic film deposition apparatus
40.
[0177] In a case where the support roll 12R is loaded on the
rotational shaft 50, the support 12 is drawn from the support roll
12R and is allowed to pass through the coating part 42, the drying
part 46, and the light irradiation part 48 through the transport
roller pair 54, and pass through a predetermined transport path
leading to the winding shaft 52 through the transport roller pair
56.
[0178] The support 12 drawn from the support roll 12R is
transported to the coating part 42 by the transport roller pair 54,
and a composition for forming a base layer serving as a base layer
14 is applied onto a surface of the support.
[0179] The composition for forming a base layer serving as a base
layer 14 includes an organic solvent, an organic compound (a
monomer, a dimer, a trimer, an oligomer, a polymer, and the like)
for forming a base layer 14, a surfactant, a silane coupling agent,
and the like, as mentioned above.
[0180] In addition, various known methods such as a die coating
method, a dip coating method, an air knife coating method, a
curtain coating method, a roller coating method, a wire bar coating
method, and a gravure coating method can be used for applying the
composition for forming a base layer in the coating part 42.
[0181] The support 12 coated with the composition for forming a
base layer serving as a base layer 14 is then heated by the drying
part 46 to remove the organic solvent, and thus, dry the
composition for forming a base layer.
[0182] The drying part 46 has a drying part 46a that performs
drying by heating from the front surface side (composition for
forming a base layer (side having the base layer 14 or the like
formed thereon)) and a drying part 46b that performs drying by
heating from the back surface side of the support 12, and performs
the drying of the composition for forming a base layer from the
both of the surface side and the back surface side
[0183] Heating in the drying part 46 may be performed by a known
method for heating a sheet-like product. For example, the drying
part 46a on the front surface side is a hot-air drying part, and
the drying part 46b on the back surface side is a heat roller (a
guide roller having a heating mechanism).
[0184] The support 12 in which the composition for forming a base
layer serving as a base layer 14 is dried is then irradiated with
ultraviolet rays or the like by the light irradiation part 48, and
the organic compound is polymerized (crosslinked) and cured to form
a base layer 14. Further, curing of the organic compound for
forming the base layer 14 may be performed in an inert atmosphere
such as a nitrogen atmosphere, as needed.
[0185] The support 12 having the base layer 14 formed thereon is
transported by the transport roller pair 56 and wound into a roll
shape by the winding shaft 52.
[0186] In a case where the formation of the base layer 14 having a
predetermined length is finished, the support 12 is cut as needed
and then taken as a support roll 12aR obtained by winding a support
12a having the base layer 14 thereon. The support roll 12aR is
supplied to the inorganic film deposition apparatus 60 illustrated
in FIG. 4, and subjected to formation of an inorganic layer 16 and
formation of a protective layer 18.
[0187] Further, as described above, the base layer 14 is not an
essential configuration requirement in the present invention.
Accordingly, in the production method of an embodiment of the
present invention, the formation of the base layer 14 is performed
as a preferred aspect.
[0188] The inorganic film deposition apparatus 60 has a vacuum
chamber 72. As mentioned above, the inside of the vacuum chamber 72
is separated into a supply/winding chamber 64 at the upper part in
the drawing and a film deposition chamber 68 at the lower part in
the drawing by two partition walls 62 and a drum 70.
[0189] The supply/winding chamber 64 has a vacuum exhausting unit
74. By driving the vacuum exhausting unit 74, a pressure within the
supply/winding chamber 64 can be adjusted. The film deposition
chamber 68 has a vacuum exhausting unit 76. By driving the vacuum
exhausting unit 76, a pressure within the film deposition chamber
68 can be adjusted.
[0190] The supply/winding chamber 64 includes a plasma treating
unit 80, a rotational shaft 92, pass rollers 94a to 94c, a supply
roll 104, pass rollers 106a to 106c, and a winding shaft 108.
[0191] The film deposition chamber 68 has a first film deposition
unit 100A and a second film deposition unit 100B.
[0192] In the inorganic film deposition apparatus 60, the inorganic
layer 16 is formed on the base layer 14 while the long support 12
having the base layer 14 formed thereon is transported in the
longitudinal direction, and the protective layer 18 is formed on
the inorganic layer 16, thereby preparing a functional film 10.
[0193] First, the support roll 12aR formed by winding the support
12a having the base layer 14 formed thereon is loaded onto the
rotational shaft 92. Subsequently, the support 12 drawn from the
support roll 12aR is inserted into a predetermined transport path
that extends to the winding shaft 108 via the pass rollers 94a to
94c, the drum 70, and the pass rollers 106a to 106c.
[0194] The support 12 drawn from the support roll 12aR is guided by
the pass rollers 94a to 94c, thus wound around the drum 70, and
transported in a predetermined path to form the inorganic layer 16
by the first film deposition unit 100A and/or the second film
deposition unit 100B.
[0195] Furthermore, the drum 70 has a built-in temperature control
unit. The support 12 is cooled or heated by the drum 70 as needed,
and the inorganic layer 16 is formed by the first film deposition
unit 100A and/or the second film deposition unit 100B.
[0196] Moreover, the drum 70 is configured to enable bias power to
be supplied.
[0197] The film forming method in the first film deposition unit
100A and the second film deposition unit 100B is CCP-CVD as an
example.
[0198] The first film deposition unit 100A and the second film
deposition unit 100B have the same configuration, and have a shower
electrode 114 forming an electrode pair with the drum 70, a high
frequency power supply 116, and a gas supply unit 118.
[0199] The shower electrode 114 is a known shower electrode (shower
plate) used for plasma CVD, which has an opening for supplying a
raw material gas onto a surface facing the drum 70.
[0200] The high frequency power supply 116 supplies plasma
excitation power to the shower electrode 114, and is a known high
frequency power supply used for plasma CVD.
[0201] The gas supply unit 118 supplies the raw material gas to the
shower electrode 114, and is a known gas supply unit used for
plasma CVD. For example, in a case where silicon nitride is formed
as the inorganic layer 16, examples of the raw material gas include
a silane gas, an ammonia gas, and a hydrogen gas.
[0202] Moreover, a thickness of the inorganic layer 16 may be
adjusted by a known method such as adjustment of plasma excitation
power, adjustment of a film deposition time, that is, a
transportation speed of the support 12, and adjustment of an amount
of the raw material gas to be supplied.
[0203] A resin film 18F serving as the protective layer 18 is
laminated on the support 12 having the inorganic layer 16 formed on
the base layer 14, in the pass roller 106a immediately downstream
of the drum 70. That is, the inorganic layer 16 and the resin film
18F serving as the protective layer 18 are laminated on and bonded
to each other while maintaining the reduced pressure.
[0204] The resin film 18F is sent out from the resin film roll 18FR
and transported to the pass roller 106a. Here, the plasma treating
unit 80 is arranged in the transport path of the resin film 18F
from the resin film roll 18FR to the pass roller 106a.
[0205] In the plasma treating unit 80, prior to lamination of the
resin film 18F on the support 12 (inorganic layer 16), a surface of
the resin film 18F facing the inorganic layer 16, that is, a
surface of the protective layer 18 on the inorganic layer 16 side
(joint surface) is subjected to a plasma treatment under reduced
pressure.
[0206] In the production method of the embodiment of the present
invention, such a plasma treatment is performed, the inorganic
layer 16 and the resin film 18F are laminated on and adhered to
each other while maintaining the reduced pressure, thereby
preparing a functional film 10 having the inorganic layer 16 and
the protective layer 18 which are firmly joined to each other as
described above, and thus, the adhesive force is high.
[0207] That is, by subjecting a surface of the resin film 18F
facing the inorganic layer 16 to a plasma treatment, a main chain
of the resin is partially cut by plasma on the surface of the resin
film 18F facing the inorganic layer 16. As a result, the surface of
the resin film 18F on the inorganic layer 16 side is brought into a
state where the main chain of the resin is short and there are many
terminals, as mentioned above. As a result, the surface on the
inorganic layer 16 side of the resin film 18F, that is, the
protective layer 18, can have a joint surface-side intensity ratio
B/A that is 1.04 times or more a surface-side intensity ratio B/A,
as mentioned above. That is, the resin film 18F is subjected to a
plasma treatment, and can thus be brought into a state where the
surface of the protective layer 18 on the inorganic layer 16 side
is softer and there are many bonds with the inorganic layer 16, as
compared with the surface on a side opposite to the inorganic layer
16, as mentioned above.
[0208] On the other hand, the inorganic layer 16 is in a state
where the reduced pressure is maintained after the formation of a
film by plasma CVD, and thus, in a state where the surface activity
is very high.
[0209] That is, in the inorganic film deposition apparatus 60, the
resin film 18F which is soft and has many bonds and the inorganic
layer 16 having a high surface activity are laminated on and bonded
to each other.
[0210] As a result, as mentioned above, the resin film 18F that is
soft suitably follows fine irregularities of the inorganic layer 16
to come into contact with a wide area, and is strongly joined and
adhered through many bonds, for example, by the direct bonding of
Si--C. As a result, the protective layer 18 is formed on the
inorganic layer 16 with a strong adhesive force.
[0211] In the production method of the present invention, the resin
film 18F that had been subjected to plasma treatment and the
inorganic layer 16 are merely laminated on and adhered to each
other. Accordingly, the produced functional film does not have any
layer in which the component of the resin film 18F and the
component of the inorganic layer 16 are mixed between the resin
film 18F and the inorganic layer 16.
[0212] In the production method of the embodiment of the present
invention, the plasma treatment of the resin film 18F may be
performed by a known method.
[0213] In the inorganic film deposition apparatus 60 in the
illustrated example, the plasma treating unit 80 includes a shower
electrode 82, a high frequency power supply 84, and a gas supply
unit 86. The shower electrode 82 is a known shower electrode used
for a plasma treatment. The high frequency power supply 84 is a
known high frequency power supply used for a plasma treatment.
Further, the gas supply unit 86 supplies a plasma treatment gas to
the shower electrode 82, and is a known gas supply unit used for a
plasma treatment.
[0214] The intensity of the plasma treatment, and the like may be
performed by a known method such as selection of a plasma treatment
gas, adjustment of an amount of a plasma treatment gas to be
supplied, adjustment of a pressure, adjustment of a plasma
excitation power, or the like.
[0215] As the plasma treatment gas, various known gases used for a
plasma treatment can be used. Preferred examples of the plasma
treatment gas include an inert gas such as a nitrogen gas, a helium
gas, and an argon gas, a hydrogen gas, an oxygen gas, and a mixed
gas thereof.
[0216] The plasma excitation power may be appropriately set in
accordance with the intensity of a plasma treatment, and the like.
The plasma excitation power is preferably 0.1 to 5 kW, more
preferably 0.3 to 4 kW, and still more preferably 0.4 to 3 kW.
[0217] The frequency of the plasma excitation power may also be
appropriately set in accordance with a plasma excitation power, a
plasma treatment gas used, and the like. The frequency of the
plasma excitation power is preferably 0.01 to 3,000 MHz, more
preferably 0.04 to 1,000 MHz, and still more preferably 0.08 to 500
MHz.
[0218] The plasma treatment pressure may also be appropriately set
in accordance with a plasma excitation power, a plasma treatment
gas used, and the like. The plasma treatment pressure is preferably
0.1 to 3,000 Pa, more preferably 1 to 2,000 Pa, and still more
preferably 2 to 1,000 Pa.
[0219] In the production method of the embodiment of the present
invention, the temperature of the resin film 18F in a case of being
bonded to the inorganic layer 16 is preferably 80.degree. C. or
lower.
[0220] By setting the temperature of the resin film 18F in a case
of being bonded to the inorganic layer 16 to 80.degree. C. or
lower, for example, a damage to the resin film 18F, that is, the
protective layer 18 due to heat can be prevented, and the warpage
of the functional film 10 due to a thermal stress during bonding
and the peeling of the protective layer 18 can be prevented, and
from this viewpoint, such the temperature is preferable.
[0221] The temperature of the resin film 18F in a case of being
bonded to the inorganic layer 16 is more preferably 70.degree. C.
or lower, and still more preferably 60.degree. C. or lower.
[0222] Furthermore, a lower limit of the temperature of the resin
film 18F in a case of being bonded to the inorganic layer 16 is not
limited, but in consideration of the activity of a surface of the
resin film 18F, the flexibility of the resin film 18F in a case of
being bonded, and the like, the lower limit is preferably 0.degree.
C. or higher.
[0223] In the production method of the embodiment of the present
invention, it is preferably the resin film 18F that first comes
into contact with the inorganic layer 16 after the inorganic layer
16 is formed.
[0224] As a result, a damage to the inorganic layer 16 due to a
contact with a pass roller or the like can be prevented, and also
the inorganic layer 16 and the resin film 18F are bonded to each
other in a state where the activity of a surface of the inorganic
layer 16 is sufficiently high, whereby an adhesive force between
the inorganic layer 16 and the protective layer 18 can be
increased.
[0225] The functional film 10 having the protective layer 18 formed
thereon by laminating and bonding the resin film 18F is guided by
the pass rollers 106a to 106c, transported to a winding shaft 108,
and wound by the winding shaft 108, and thus, a functional film
roll 10R around which the functional film 10 is wound can be
obtained.
[0226] Thereafter, the vacuum chamber 72 is opened to atmosphere,
and a purified dry air is introduced. Thereafter, the functional
film roll 10R is then taken out from the vacuum chamber 72.
[0227] Furthermore, in a case where two or more sets of
combinations of the base layer 14 and the inorganic layer 16 are
formed, the same formation of the base layer 14 and the inorganic
layer 16 may be repeated according to the number of combinations to
be formed. In this case, in order to prevent a damage to the
inorganic layer 16, it is preferable that except for the uppermost
inorganic layer 16, the inorganic layer 16 is formed and then a
protective film is laminated on the inorganic layer 16 and
wound.
[0228] Although the functional film and the method for producing
the functional film of the embodiments of the present invention
have been described in detail above, the present invention is not
limited to the aspects, and various improvements and modifications
may be made without departing from the gist of the present
invention.
[0229] For example, in the above-mentioned method for producing a
functional film, all steps of forming the base layer 14, forming
the inorganic layer 16, and laminating the resin film 18F, that is,
forming the protective layer 18 are performed by an R-to-R process,
as a preferred aspect. However, the present invention is not
limited thereto, and at least one step may be performed in a batch
method after cutting the film or all the steps may be performed in
a batch method for a cut sheet.
EXAMPLES
[0230] Hereinbelow, the present invention will be described in more
detail with reference to Examples. The present invention is not
limited to specific examples shown below.
Example 1
[0231] <Support>
[0232] A PET film (manufactured by Toyobo Co., Ltd., COSMOSHINE
A4300) having a width of 1,000 mm and a thickness of 100 .mu.m was
used as a support.
[0233] <Resin Film as Protective Layer>
[0234] As a resin film serving as a protective layer, a PE film A
((PE-A) manufactured by Sun A. Kaken Company, Limited, PAC-2A-30T)
having a thickness of 30 .mu.m was prepared.
[0235] <Formation of Base Layer>
[0236] TMPTA (manufactured by Daicel Allnex Ltd.) and a
photopolymerization initiator (manufactured by Lamberti S.p.A.,
ESACURE KTO 46) were prepared and weighed such that a mass ratio of
the TMPTA to the photopolymerization initiator was 95:5, and these
were dissolved in methyl ethyl ketone (MEK) to reach a
concentration of solid contents of 15% by mass, thereby preparing a
composition for forming a base layer, which was intended to form a
base layer.
[0237] As shown in FIG. 3, the prepared composition for forming a
base layer was charged into a coating part of an organic film
deposition apparatus having the coating part, a drying part, and a
light irradiation part, and forming a base layer by a coating
method through an R-to-R process.
[0238] In addition, a support roll formed by winding a long support
into a roll shape was loaded at a predetermined position, and the
support taken out from the support roll was inserted into a
predetermined transport path.
[0239] In the organic film deposition apparatus, while the support
was transported in the longitudinal direction, the composition for
forming a base layer was applied in the coating part, and the
composition for forming a base layer was dried in the drying part.
A die coater was used in the coating part. The heating temperature
in the drying part was 50.degree. C. and the passage time in the
drying part was 3 minutes.
[0240] Next, in the light irradiation part, the composition for
forming a base layer was cured by irradiating the dried composition
for forming a base layer with ultraviolet rays (an integrated
irradiation amount of about 600 mJ/cm.sup.2) to form a base layer.
Thereafter, the support having the base layer formed thereon was
wound into a roll shape by the winding shaft.
[0241] The thickness of the formed base layer was 2 .mu.m.
[0242] <Formation of Inorganic Layer and Protective
Layer>
[0243] An inorganic film deposition apparatus as shown in FIG. 4
was used to form an inorganic layer and a protective layer. As
mentioned above, this inorganic film deposition apparatus has a
pass roller group, a drum, a first film deposition unit and a
second film deposition unit, a pass roller group, and a plasma
treating unit, and forms an inorganic layer by CCP-CVD through an
R-to-R process, and a resin film which has been subjected to a
plasma treatment is laminated on a support with the most upstream
pass roller after the formation of the inorganic layer.
[0244] A support roll around which a support having a base layer
formed thereon had been wound was loaded at a predetermined
position of the inorganic film deposition apparatus. Subsequently,
the support (the support that formed the base layer) taken out from
the support roll was inserted into a predetermined transport path
extending to a winding shaft via the pass roller, the drum, and the
pass roller.
[0245] On the other hand, a resin film roll wound with a long PE
film A (PE-A) serving as a protective layer was loaded at a
predetermined position in the inorganic film deposition apparatus
such that it was laminated on the inorganic layer in the most
upstream pass roller after the formation of the inorganic
layer.
[0246] A silicon nitride layer was formed as an inorganic layer on
the base layer while the support taken out from the support roll
was transported in the longitudinal direction.
[0247] Thereafter, the PE film A in which a surface on the
inorganic layer side had been subjected to a plasma treatment was
laminated on and bonded to the support having the inorganic layer
formed thereon to form a protective layer.
[0248] In this manner, a functional film as shown in FIG. 1, having
a base layer, an inorganic layer, and a protective layer on a
support, was prepared. The prepared functional film was wound
around the winding shaft.
[0249] Both the first film deposition unit and the second film
deposition unit were used for forming the inorganic layer (silicon
nitride layer). For the both, film deposition was performed under
the same conditions.
[0250] As the raw material gas, a silane gas, an ammonia gas, and a
hydrogen gas were used.
[0251] As an amount of the raw material gas to be supplied, the
amounts of the silane gas, the ammonia gas, and the hydrogen gas
supplied were 100 sccm, 250 sccm, and 500 sccm, respectively. The
plasma excitation power was 1 kW and the frequency of the plasma
excitation power was 13.56 MHz.
[0252] A bias power of 0.5 kW with a frequency of 0.4 MHz was
supplied to the drum. In addition, the temperature of the drum was
controlled to 60.degree. C. by a cooling unit.
[0253] The transportation speed of the support was 10 m/min. The
film formation pressure was 50 Pa.
[0254] The thickness of the inorganic layer was 30 nm.
[0255] In the plasma treatment of the PE film A by the plasma
treating unit, the plasma excitation charge was 0.5 kW and the
frequency of the plasma excitation power was 0.1 MHz.
[0256] As the plasma treatment gas, a mixed gas of an argon gas and
a hydrogen gas was used. As an amount of the plasma treatment gas
to be supplied, the amount of the argon gas to be supplied was
1,000 sccm and the amount of the hydrogen gas supplied was 100
sccm. The plasma treatment pressure was 10 Pa.
Comparative Example 1
[0257] A functional film was prepared in the same manner as in
Example 1, except that the PE film A serving as a protective layer
was not subjected to a plasma treatment.
Comparative Example 2
[0258] A PE film A which had not been subjected to a plasma
treatment was laminated on a support having an inorganic layer
formed thereon as a protective film to prepare a functional film
having no protective layer.
[0259] Thereafter, the functional film was taken out from the
inorganic film deposition apparatus and the PE film A as a
protective film was peeled. Subsequently, a urethane-based adhesive
was applied to the inorganic layer to a thickness of 5 .mu.m, and
the PE film A was adhered thereto as a protective layer to prepare
a functional film.
Comparative Example 3
[0260] As a resin film serving as a protective layer, a PE film B
((PE-B) manufactured by Mitsui Chemicals Tohcello, Inc., T500)
having a thickness of 60 .mu.m was prepared. This PE film B is a
self-pressure sensitive adhesive film.
[0261] A functional film was prepared in the same manner as in
Example 1, except that the PE film B was used instead of the PE
film A, and the PE film B was not subjected to a plasma
treatment.
Example 2
[0262] A functional film was prepared in the same manner as in
Example 1, except that in the formation of the inorganic layer
(silicon nitride layer), as an amount of the raw material gas to
supplied, the amounts of the silane gas, the ammonia gas, and the
hydrogen gas supplied were 150 sccm, 375 sccm, and 500 sccm,
respectively, and the plasma excitation power was 1.5 kW.
[0263] The thickness of the inorganic layer was 47 nm.
Example 3
[0264] A functional film was prepared in the same manner as in
Example 1, except that in the formation of the inorganic layer
(silicon nitride layer), as an amount of the raw material gas to be
supplied, the amounts of the silane gas, the ammonia gas, and the
hydrogen gas supplied were 20 sccm, 50 sccm, and 500 sccm,
respectively, and the plasma excitation power was 0.2 kW.
[0265] The thickness of the inorganic layer was 5 nm.
Example 4
[0266] A functional film was prepared in the same manner as in
Example 1, except that in the formation of the inorganic layer
(silicon nitride layer), as an amount of the raw material gas to be
supplied, the amounts of the silane gas, the ammonia gas, and the
hydrogen gas supplied were 200 sccm, 500 sccm, and 500 sccm,
respectively, and the plasma excitation power was 2 kW.
[0267] The thickness of the inorganic layer was 61 nm.
Example 5
[0268] A functional film was prepared in the same manner as in
Example 1, except that an inorganic layer (silicon nitride layer)
was directly formed on a support while not forming a base
layer.
Example 6
[0269] A functional film was prepared in the same manner as in
Example 1, except that the plasma excitation power was changed to
0.3 kW in the plasma treatment of the PE film A serving as the
protective layer.
Example 7
[0270] As a resin film serving as a protective layer, a PE film C
((PE-CB) manufactured by Mitsui Chemicals Tohcello, Inc., FC-D)
having a thickness of 30 .mu.m was prepared.
[0271] A functional film was prepared in the same manner as in
Example 1, except that the PE film C was used instead of the PE
film A.
Example 8
[0272] As a resin film serving as a protective layer, an EVA film
(LV342 manufactured by Mitsubishi Chemical Corporation) having a
thickness of 30 .mu.m was prepared.
[0273] A functional film was prepared in the same manner as in
Example 1, except that the EVA film was used instead of the PE film
A.
Example 9
[0274] A functional film was prepared in the same manner as in
Example 1, except that the inorganic layer was changed to a silicon
oxide film.
[0275] A hexamethyldisiloxane (HMDSO) gas and an oxygen gas were
used as the raw material gas. As an amount of the raw material gas
to be supplied, the amounts of the HMDSO gas and the oxygen gas
supplied were 100 sccm and 500 sccm, respectively, and the plasma
excitation power was 1 kW.
Example 10
[0276] A functional film was prepared in the same manner as in
Example 1, except that the inorganic layer was changed to a silicon
oxynitride film.
[0277] As the raw material gas, an HMDSO gas and a nitrous oxide
(N.sub.2O) gas were used. As an amount of the raw material gas to
be supplied, the amounts of the HMDSO gas and the nitrous oxide gas
supplied were 100 sccm and 200 sccm, respectively, and the plasma
excitation power was 1 kW.
[0278] [Measurement of IR Spectrum]
[0279] The prepared functional film was obliquely cut at 10.degree.
using an inclined cutting machine to form an oblique cross-section
in the thickness direction.
[0280] For this cross-section, the IR spectrum of an edge surface
on the inorganic layer side and the edge surface on a side opposite
to the inorganic layer, of the protective layer, was measured by a
single reflection type ATR, using an infrared microscope IRT-5200
manufactured by JASCO Corporation. Ge was used as a material for
the ATR prism. The measurement area was 10.times.10 .mu.m.
[0281] As a result, the peak A which is a maximum peak in a range
of 2,800 to 2,900 cm.sup.-1 and the peak B which is a maximum peak
in a range of 2,900 to 3,000 cm.sup.-1 in the IR spectrum on a
surface of the protective layer on the inorganic layer side (joint
surface side) and a surface of the protective layer on an opposite
side to the inorganic layer (surface side) were measured.
[0282] Furthermore, measurement of the IR spectrum was performed at
five points optionally selected on an edge surface of the
protective layer on the inorganic layer side and an edge surface of
the protective layer on a side opposite to the inorganic layer.
Then, an average value of the intensities of the peak A and the
peak B at the five points was calculated, and this average value
was taken as the values of the peak A and the peak B on the surface
of the protective layer on the inorganic layer side and the surface
of the protective layer on a side opposite to the inorganic layer,
respectively.
[0283] From the measurement results, the magnitudes of the
surface-side intensity ratio B/A (surface-side B/A), the joint
surface-side intensity ratio B/A (joint surface-side B/A), and the
joint surface-side intensity ratio B/A relative to the surface-side
intensity ratio B/A were calculated.
[0284] Furthermore, the magnitudes of the joint surface-side
intensity ratio B/A relative to the surface-side intensity ratio
B/A was calculated by dividing [Joint surface-side intensity ratio
B/A] by [surface-side intensity ratio B/A], and in the table, it is
described as "Intensity ratio of joint surface to surface".
[0285] [Evaluation]
[0286] A total light transmittance, the adhesiveness, and the gas
barrier performance of the prepared functional film were
evaluated.
[0287] <Total Light Transmittance>
[0288] With respect to the prepared functional film, the total
light transmittance [%] was measured using NDH-7000 manufactured by
Nippon Denshoku Industries Co., Ltd. in accordance with JIS K
7361-1 (1996).
[0289] <Adhesiveness>
[0290] As a test on the adhesiveness of the protective layer, a
cross-cut peel test and a 180.degree. peel test were performed.
[0291] <<180.degree. Peel Test>>
[0292] A peeling strength (N/25 mm) was measured in accordance with
the 180.degree. peel test of JS Z 0237: 2009.
[0293] <<Cross-Cut Peel Test>>
[0294] A cross-cut peel test was performed in accordance with JIS
K5600-5-6 (1999).
[0295] Cuts were formed on the protective layer on a surface of the
functional film at an angle of 90.degree. with respect to the film
surface with an interval of 1 mm, using a cutter knife, to create a
grid constituted by 100 squares having a side of 1 mm. A Mylar tape
(manufactured by Nitto Denko Corporation, polyester tape, No. 31B)
having a width of 2 cm was applied onto the surface and then
peeled.
[0296] The adhesiveness was evaluated on the basis of the number of
squares where the protective layer (resin film) remained (maximum:
100).
[0297] <Gas Barrier Properties>
[0298] A water vapor transmission rate (WVTR) [g/(m.sup.2day)] of
the prepared functional film was measured under the conditions of a
temperature of 25.degree. C. and a relative humidity of 50% RH by a
calcium corrosion method (the method described in
JP2005-283561A).
[0299] Furthermore, the 180.degree. peel test, the cross-cut peel
test, and measurement of gas barrier properties were performed
under both of (a high temperature and a high humidity) by leaving
the films to stand for 500 hours immediately after the preparation
of the functional film (initial stage) and in an environment of a
temperature of 85.degree. C. and a relative humidity of 85% RH.
[0300] The results are shown in Table 1 below.
TABLE-US-00001 TABLE 1 Protective layer IR spectrum Intensity Total
Inorganic layer Plasma Joint ratio of light Thick- excitation
surface- Surface- joint trans- ness Resin power side side surface
to mittance Material [nm] film [kW] B/A B/A surface [%] Example 1
SiN 30 PE-A 0.5 1.62 1.38 1.17 times 85 Comparative SiN 30 PE-A --
1.40 1.38 1.01 times 85 Example 1 Comparative SiN 30 PE-A -- 1.40
1.38 1.01 times 79 Example 2 Comparative SiN 30 PE-B -- 1.51 1.50
1.01 times 78 Example 3 Example 2 SiN 47 PE-A 0.5 1.62 1.38 1.17
times 83 Example 3 SiN 5 PE-A 0.5 1.62 1.38 1.17 times 89 Example 4
SiN 61 PE-A 0.5 1.62 1.38 1.17 times 80 Example 5 SiN 30 PE-A 0.5
1.62 1.38 1.17 times 87 Example 6 SiN 30 PE-A 0.3 1.43 1.37 1.04
times 86 Example 7 SiN 30 PE-C 0.5 1.51 1.41 1.07 times 85 Example
8 SiN 30 EVA 0.5 1.87 1.58 1.18 times 86 Example 9 SiO.sub.2 25
PE-A 0.5 1.62 1.38 1.17 times 88 Example 10 SiON 29 PE-A 0.5 1.62
1.38 1.17 times 87 Adhesiveness Gas barrier properties 180.degree.
peel test Cross-cut [g/(m.sup.2 day)] High High High temperature
temperature temperature Initial and high Initial and high Initial
and high stage humidity stage humidity stage humidity Example 1 5.1
5.1 100 100 2 .times. 10.sup.-5 2.1 .times. 10.sup.-5 Comparative
0.03 0.02 0 0 2 .times. 10.sup.-5 1 .times. 10.sup.-2 Example 1
Comparative 3.5 0.5 100 5 2 .times. 10.sup.-5 6 .times. 10.sup.-3
Example 2 Comparative 2.8 0.3 81 2 2 .times. 10.sup.-5 8 .times.
10.sup.-3 Example 3 Example 2 4.7 4.5 100 100 1.8 .times. 10.sup.-5
2 .times. 10.sup.-5 Example 3 6.2 6.2 100 100 3 .times. 10.sup.-5
3.1 .times. 10.sup.-5 Example 4 5.5 5 100 99 1.8 .times. 10.sup.-5
2.4 .times. 10.sup.-5 Example 5 3 2.8 100 100 1 .times. 10.sup.-4
1.1 .times. 10.sup.-4 Example 6 3.6 3.6 100 100 2 .times. 10.sup.-5
2.1 .times. 10.sup.-5 Example 7 3.8 3.8 100 100 2.2 .times.
10.sup.-5 2.3 .times. 10.sup.-5 Example 8 8.9 8.8 100 100 1.9
.times. 10.sup.-5 2 .times. 10.sup.-6 Example 9 4 4 100 100 7
.times. 10.sup.-5 7.2 .times. 10.sup.-5 Example 10 4.1 4 100 100 5
.times. 10.sup.-5 5.2 .times. 10.sup.-5 The plasma excitation power
is an excitation power in a plasma treatment of a resin film. In
Comparative Example 2, the protective layer is formed by adherence
of the resin film by an adhesive, the resin film PE-B of
Comparative Example 3 is self-pressure sensitive adhesive, and in
the evaluations of the adhesiveness, a unit of the peel is [N/25
mm] and the cross-cut is the number of residual squares.
[0301] As shown in Table 1, the functional films of the embodiment
of the present invention in which a resin film is directly joined
as a protective layer and the IR spectra of the surfaces on the
inorganic layer side and an opposite side thereto of the protective
layer fall within a predetermined range all have good gas barrier
properties and adhesiveness of the protective layer. In addition,
since the protective layer has high adhesiveness, there are small
decreases in the adhesiveness and the gas barrier properties after
a long-term exposure to a high temperature and a high humidity
environment and after a ball drop test.
[0302] Moreover, as shown in Examples 1 and 5, higher adhesiveness
and gas barrier performance can be obtained by forming the
inorganic layer on the base layer. In addition, as shown in
Examples 1, 9, and 10, higher gas barrier properties can be
obtained by using silicon nitride for the inorganic layer.
[0303] Furthermore, since the thickness of the inorganic layer in
Example 4 is thicker than that in other examples falling within the
most preferred range, the adhesiveness of the protective layer
after the exposure to an environment with a high temperature and a
high humidity is slightly lower than that in other examples, but
there is no problem in practical use. In Example 6, since the
plasma treatment strength of the resin film serving as the
protective layer is lower than that in the other examples, the
adhesiveness of the protective layer is slightly lower than that in
the other examples, but there is no problem in practical use.
[0304] In contrast, in Comparative Example 1 in which the resin
film serving as the protective layer was not subjected to a plasma
treatment, the adhesiveness of the protective layer was extremely
low.
[0305] In addition, in Comparative Example 2 in which the
protective layer was adhered to the inorganic layer using an
adhesive and Comparative Example 3 in which a self-pressure
sensitive adhesive resin film that was not plasma-treated was used
had low adhesiveness of the protective layer and a significant
decrease in the adhesiveness of the protective layer after the
exposure to an environment with a high temperature and a high
humidity. Further, in both the cases, the total light transmittance
is low.
[0306] In addition, in Comparative Examples, the reduction in the
gas barrier properties after being exposed to an environment with a
high temperature and a high humidity is significant. This is
considered to be caused by a fact that the protective layer is
partially peeled due to a decrease in the adhesiveness of the
protective layer after the exposure to an environment with a high
temperature and a high humidity, and as a result, the protective
layer does not function sufficiently and the inorganic layer is
damaged.
[0307] From the results, the effect of the present invention is
apparent.
[0308] The functional film of the embodiment of the present
invention can be suitably used as a sealing material for a solar
cell and the like.
EXPLANATION OF REFERENCES
[0309] 10, 10A: functional film [0310] 10R: functional film roll
[0311] 12: support [0312] 12R, 12aR: support roll [0313] 14: base
layer [0314] 16: inorganic layer [0315] 18: protective layer [0316]
18F: resin film [0317] 18FR: resin film roll [0318] 40: organic
film deposition apparatus [0319] 42: coating part [0320] 46, 46a,
46b: drying part [0321] 48: light irradiation part [0322] 50, 92:
rotational shaft [0323] 52, 108: winding shaft [0324] 60: inorganic
film deposition apparatus [0325] 62: partition wall [0326] 64:
supply/winding chamber [0327] 68: film deposition chamber [0328]
70: drum [0329] 72: vacuum chamber [0330] 74, 76: vacuum exhausting
unit [0331] 80: plasma treating unit [0332] 82, 114: shower
electrode [0333] 84, 116: high frequency power supply [0334] 86,
118: gas supply unit [0335] 94a to 94c, 106a to 106c: pass roller
[0336] 100A: first film deposition unit [0337] 100B: second film
deposition unit [0338] 102: drum [0339] 114: shower electrode
[0340] 116: high frequency power supply [0341] 118: gas supply
unit
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