U.S. patent application number 17/344370 was filed with the patent office on 2021-12-16 for substrate module or light emitting module.
This patent application is currently assigned to NICHIA CORPORATION. The applicant listed for this patent is NICHIA CORPORATION. Invention is credited to Kazuma KOZURU.
Application Number | 20210392750 17/344370 |
Document ID | / |
Family ID | 1000005695021 |
Filed Date | 2021-12-16 |
United States Patent
Application |
20210392750 |
Kind Code |
A1 |
KOZURU; Kazuma |
December 16, 2021 |
SUBSTRATE MODULE OR LIGHT EMITTING MODULE
Abstract
A substrate module includes: a substrate having top and bottom
surfaces and comprising, at the top surface, a plurality of first
wiring regions and a plurality of second wiring regions that are
electrically connected to the plurality of first wiring regions;
one or more power receiving devices disposed on the plurality of
first wiring regions; a first connection component disposed on the
plurality of second wiring regions, wherein the first connection
component has opposite ends in a first direction; and a protected
component disposed on the top surface of the substrate. In a top
plan view, (i) the protected component is located between two
straight lines passing through the respective opposite ends of the
first connection component and extending in a second direction
perpendicular to the first direction, and (ii) the protected
component is located between the one or more power receiving
devices and the first connection component.
Inventors: |
KOZURU; Kazuma;
(Tokushima-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
NICHIA CORPORATION |
Anan-shi |
|
JP |
|
|
Assignee: |
NICHIA CORPORATION
Anan-shi
JP
|
Family ID: |
1000005695021 |
Appl. No.: |
17/344370 |
Filed: |
June 10, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 1/0296 20130101;
H05K 2201/10174 20130101; H05K 1/18 20130101; H05K 2201/10522
20130101; H01S 5/0239 20210101; H05K 2201/10196 20130101; H05K
2201/10189 20130101; H01R 12/79 20130101 |
International
Class: |
H05K 1/18 20060101
H05K001/18; H05K 1/02 20060101 H05K001/02; H01S 5/0239 20060101
H01S005/0239 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 11, 2020 |
JP |
2020-101645 |
Claims
1. A substrate module comprising: a substrate having a top surface
and a bottom surface and comprising, at the top surface, a
plurality of first wiring regions and a plurality of second wiring
regions that are electrically connected to the plurality of first
wiring regions; one or more power receiving devices disposed on the
plurality of first wiring regions; a first connection component
disposed on the plurality of second wiring regions, wherein the
first connection component has opposite ends in a first direction;
and a protected component disposed on the top surface of the
substrate; wherein, in a top plan view, (i) the protected component
is located between two straight lines passing through the
respective opposite ends of the first connection component and
extending in a second direction perpendicular to the first
direction, and (ii) the protected component is located between the
one or more power receiving devices and the first connection
component.
2. The substrate module according to claim 1, wherein: the one or
more power receiving devices are light emitting devices.
3. The substrate module according to claim 1, wherein: the
protected component is a thermistor.
4. The substrate module according to claim 1, wherein: the first
connection component comprises a first connection portion; and the
substrate module further comprises a second connection component
comprising: a second connection portion connected to the first
connection portion, and a protection portion disposed above the
protected component, wherein the second connection component is
configured to supply power to the one or more power receiving
devices.
5. The substrate module according to claim 4, wherein: the
protection portion includes, in a top plan view, a region
overlapping the second connection portion and a region not
overlapping the second connection portion; and the region not
overlapping the second connection portion is disposed above the
protected component.
6. The substrate module according to claim 4, wherein: the second
connection component further comprises a wiring part; the second
connection portion is connected to a bottom surface of the wiring
part; the protection portion is connected to a top surface of the
wiring part and includes, in a top plan view, a region overlapping
the wiring part and a region not overlapping the wiring part; and
the region not overlapping the wiring part is disposed above the
protected component.
7. The substrate module according to claim 6, wherein: the wiring
part is a flexible printed circuit board.
8. The substrate module according to claim 1, wherein: the
substrate further comprises one or more third wiring regions at the
top surface, and, in a top plan view, each of the one or more third
wiring regions is disposed at a position spaced from the plurality
of second wiring regions in the first direction; the substrate
further comprises one or more fourth wiring regions at the top
surface, and, in a top plan view, each of the one or more fourth
wiring regions is disposed at a position spaced from the plurality
of second wiring regions in the first direction and opposite to the
one or more third wiring regions; in a top plan view, the plurality
of first wiring regions are provided at positions spaced from the
plurality of second wiring regions in the second direction; and the
one or more third wiring regions and the one or more fourth wiring
regions are electrically connected to the plurality of second
wiring regions.
9. A light emitting module comprising: a substrate having a top
surface and a bottom surface and comprising, at the top surface, a
plurality of first wiring regions and a plurality of second wiring
regions that are electrically connected to the plurality of first
wiring regions; one or more light emitting devices disposed on the
plurality of first wiring regions; a protected component disposed
on the top surface of the substrate and subject to protection from
light in an operating state of the one or more light emitting
devices; and a first connection component disposed on the plurality
of second wiring regions, wherein the first connection component
has opposite ends in a first direction, wherein, in a top plan
view, (i) the protected component is disposed between two straight
lines passing through the respective opposite ends of the first
connection component in a first direction and extending in a second
direction perpendicular to the first direction, and (ii) the
protected component is disposed between the one or more light
emitting devices and the first connection component.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to Japanese Patent
Application No. 2020-101645, filed on Jun. 11, 2020, the disclosure
of which is hereby incorporated by reference in its entirety.
BACKGROUND
[0002] The present disclosure relates to a substrate module or a
light emitting module.
[0003] Japanese Patent Publication No. 2019-153570 discloses a
light emitting module in which a light emitting device and a
connector are mounted in order to supply power to the light
emitting device. With the connector provided, an electrical
connection with the light emitting device can be easily made.
Further, a thermistor can be provided to the light emitting device
to measure a temperature during operation. In this patent
publication, a thermistor is disposed in an interior of the light
emitting device.
SUMMARY
[0004] In Japanese Patent Publication No. 2019-153570, the
thermistor is protected from light from outside the light emitting
device. However, even in a case in which the thermistor is disposed
outside the light emitting device, it may be necessary to protect
the thermistor from outside light. Further, the protected object is
not limited to a thermistor, and the object from which protection
is provided is not limited to light. For components that should be
protected from external factors, it is necessary to design a module
so that protection can be easily provided, as needed.
[0005] According to one embodiment, a substrate module includes: a
substrate having a top surface and a bottom surface and comprising,
at the top surface, a plurality of first wiring regions and a
plurality of second wiring regions that are electrically connected
to the plurality of first wiring regions; one or more power
receiving devices disposed on the plurality of first wiring
regions; a first connection component disposed on the plurality of
second wiring regions, wherein the first connection component has
opposite ends in a first direction; and a protected component
disposed on the top surface of the substrate. In a top plan view,
(i) the protected component is located between two straight lines
passing through the respective opposite ends of the first
connection component and extending in a second direction
perpendicular to the first direction, and (ii) the protected
component is located between the one or more power receiving
devices and the first connection component.
[0006] According to another embodiment, a light emitting module
includes: a substrate having a top surface and a bottom surface and
comprising, at the top surface, a plurality of first wiring regions
and a plurality of second wiring regions that are electrically
connected to the plurality of first wiring regions; one or more
light emitting devices disposed on the plurality of first wiring
regions; a protected component disposed on the top surface of the
substrate and subject to protection from light in an operating
state of the one or more light emitting devices; and a first
connection component disposed on the plurality of second wiring
regions, wherein the first connection component has opposite ends
in a first direction. In a top plan view, (i) the thermistor is
disposed between two straight lines passing through both ends of
the first connection component in a first direction and extending
in a second direction perpendicular to the first direction, and
(ii) the thermistor is disposed between the one or more light
emitting devices and the first connection component.
[0007] According to certain embodiments of the present invention, a
module having a structure configured to protect a target component
can be achieved.
BRIEF DESCRIPTION OF DRAWINGS
[0008] FIG. 1 is a perspective view of a light emitting module
according to a first embodiment.
[0009] FIG. 2 is a perspective view of the light emitting module
according to the first embodiment, viewed from a direction
different from that of FIG. 1.
[0010] FIG. 3 is a top plan view of the light emitting module
according to the first embodiment.
[0011] FIG. 4 is a top plan view of the light emitting module
according to the first embodiment in a state in which a protected
component is protected.
[0012] FIG. 5 is a side view of the light emitting module according
to the first embodiment in a state in which the protected component
is protected.
[0013] FIG. 6 is a perspective view of a light emitting device
according to the first embodiment.
[0014] FIG. 7 is a perspective view of the light emitting device
according to the first embodiment, viewed from a direction
different from that of FIG. 6.
[0015] FIG. 8 is a top plan view of the light emitting device
according to the first embodiment.
[0016] FIG. 9 is a top plan view for explaining an internal
structure of the light emitting device according to the first
embodiment.
[0017] FIG. 10 is a perspective view of a second connection
component according to the first embodiment, viewed from a top
surface side.
[0018] FIG. 11 is a perspective view of the second connection
component according to the first embodiment, viewed from a bottom
surface side.
[0019] FIG. 12 is a perspective view of a light emitting module
according to a second embodiment.
[0020] FIG. 13 is a perspective view of the light emitting module
according to the second embodiment, viewed from a direction
different from that of FIG. 12.
[0021] FIG. 14 is a top plan view of the light emitting module
according to the second embodiment.
[0022] FIG. 15 is a top plan view of the light emitting module
according to the second embodiment in a state in which the
protected component is protected.
[0023] FIG. 16 is a six-sided view of the light emitting module
according to the first embodiment.
[0024] FIG. 17 is a six-sided view of the light emitting device
according to the first embodiment.
[0025] FIG. 18 is a six-sided view of the light emitting module
according to the second embodiment.
DETAILED DESCRIPTION
[0026] In the present specification and claims, polygons such as
triangles and quadrangles, including shapes in which the corners of
the polygon are rounded, chamfered, beveled, coved, or the like,
are referred to as polygons. Further, a shape obtained by
processing not only the corners (ends of sides), but also an
intermediate portion of a side are similarly referred to as
polygons. That is, a shape that is partially processed while the
base remains a polygon is included in the interpretation of
"polygon" described in the present specification and claims.
[0027] The same applies not only to polygons but also to words
representing specific shapes such as trapezoids, circles,
protrusions, and recessions. Further, the same applies in the
treatment of each side forming that shape. That is, even if
processing is performed on a corner or an intermediate portion of a
certain side, the interpretation of "side" includes the processed
portion. Note that when a "polygon" or "side" not partially
processed is to be distinguished from a processed shape, "strict"
will be added to the description as in, for example, "strict
quadrangle".
[0028] Further, in the present specification and claims, when there
are a plurality of components corresponding to a certain component
and each of the components is to be expressed separately, the
components may be distinguished by adding the terms first and
second in front of the component term. Further, ordinals and
viewpoints may differ between the present specification and the
present claims. In other words, the same terms in the specification
and claims may not refer to the same elements.
[0029] For example, in this specification, there are elements
distinguished by being terms "first," "second," and "third."
However, when a claim refers to only the first and third elements
of the specification, the elements termed "first" and "second" in
the claims may refer to the elements termed "first" and "third" in
the specification.
[0030] Embodiments for carrying out the present invention are
described below with reference to the drawings. However, the
illustrated embodiments are for embodying the technical concepts of
the present invention, and are not intended to limit the present
invention. Further, in the description below, the same term or
reference numeral represents the same member or a similar member,
and duplicate descriptions will be omitted as appropriate. Note
that sizes, positional relationships, and the like of members
illustrated in the drawings may sometimes be exaggerated in order
to facilitate understanding.
First Embodiment
[0031] A substrate module according to a first embodiment will now
be described. FIG. 1 to FIG. 5 are drawings for explaining an
exemplary form of the substrate module. Note that, in the drawings,
a light emitting module 1, which is an exemplary form of the
substrate module, is described. FIG. 1 is a perspective view of the
light emitting module 1. FIG. 2 is a perspective view of the light
emitting module 1 viewed from a diagonal direction of FIG. 1. FIG.
3 is a top plan view of the light emitting module 1. FIG. 4 is a
top plan view illustrating an example of the light emitting module
1 in a state in which a second connection component is connected.
FIG. 5 is a side view of the light emitting module 1 corresponding
to FIG. 4.
[0032] FIG. 6 to FIG. 9 are drawings for explaining an exemplary
form of a power receiving device mounted onto the substrate module.
Note that, in the drawings, a light emitting device 20, which is an
exemplary form of the power receiving device, is described. FIG. 6
is a perspective view of the light emitting device 20. FIG. 7 is a
perspective view of the light emitting device 20 viewed from a
diagonal direction of FIG. 6. FIG. 8 is a top plan view of the
light emitting device 20. FIG. 9 is a top plan view of a region in
which a light emitting element 24 is disposed in the light emitting
device 20.
[0033] FIG. 10 and FIG. 11 are drawings for explaining an exemplary
form of a second connection component 50 of the substrate module.
FIG. 10 is a perspective view of the second connection component 50
viewed from a top surface side. FIG. 11 is a perspective view of
the second connection component 50 viewed from a bottom surface
side.
[0034] The substrate module includes a substrate 10, one or more of
the power receiving devices, a protected component, and a
connection component 40. In the illustrated light emitting module
1, the light emitting device 20 is employed as the power receiving
device. A thermistor 30 is employed as the protected component.
[0035] The substrate module can include another connection
component 50 connected to the connection component 40. When these
two connection components are to be distinguished in a description,
the components are referred to as the first connection component 40
and the second connection component 50. Hereinafter, each component
will be described, and then the substrate module will be
described.
Substrate 10
[0036] The substrate 10 has a top surface and a bottom surface. The
substrate 10 is formed with a plate-like shape and has a
rectangular shape in a top plan view. Other components are disposed
on the top surface of the substrate 10. A plurality of wiring
regions 11 are located the top surface of the substrate 10. One or
a plurality of through-holes 15 extending in a vertical direction
are formed in the substrate 10.
Power Receiving Device
[0037] The power receiving device includes a bottom surface. The
power receiving device is a device that operates upon reception of
a supply of power from outside the substrate module. The power
receiving device includes an electronic component that operates by
receiving a supply of electricity from an external power source. In
the illustrated light emitting module 1, the light emitting element
24 is employed as the electronic component, but the electronic
component need not be limited to the light emitting element 24. The
electronic component can be a component without a light emitting
function.
Protected Component
[0038] The protected component includes a bottom surface. The
protected component is a component to be protected in an
environment in which the power receiving device is operating in the
substrate module. The protected component is a component to be
protected from the influence of the power receiving device or from
influences outside of the substrate module in the environment in
which the power receiving device is operating. In the illustrated
light emitting module 1, the thermistor 30 is employed as the
protected component, but the protected component need not be
limited to the thermistor 30. For example, a Zener diode can be the
protected component.
First Connection component 40
[0039] The first connection component 40 includes a bottom surface.
The first connection component 40 includes a connection portion 41.
The second connection component 50 is connected to the connection
portion 41. The connection portion 41 is provided on a top surface
side of the first connection component 40. Note that the connection
portion 41 can be provided on a lateral surface side of the first
connection component 40.
Second Connection component 50
[0040] The second connection component 50 includes a connection
portion 51 that is connected to the first connection component 40.
When the connection portions of the first connection component 40
and the second connection component 50 are to be distinguished in a
description, the connection portions are respectively referred to
as the first connection portion 41 and the second connection
portion 51. The first connection component 40 is connected to the
second connection portion 51. The second connection portion 51 is
connected to the first connection portion 41.
[0041] The second connection component 50 includes a protection
portion 52. The protection portion 52 is provided above the second
connection portion 51. The protection portion 52, in a top plan
view, is larger in size than the second connection portion 51. The
protection portion 52, in a top plan view, covers the second
connection portion 51.
[0042] The protection portion 52 protects the protected component
in an environment in which the power receiving device is operating.
Accordingly, the protection portion 52 has properties that protect
the protected component. For example, the protection portion 52 has
light shielding properties. Thus, the protected component is
protected from the influence of light. For example, the protection
portion 52 is a material having good heat dissipation. Thus, the
protected component is protected from the influence of heat. For
example, the protection portion 52 can be formed from a plate-like
metal.
[0043] The second connection component 50 includes a wiring part
53. The wiring part 53 is, for example, a flexible printed circuit
board. The wiring part 53 is electrically connected to the second
connection portion 51. The second connection portion 51 is disposed
on a bottom surface of the wiring part 53.
[0044] The protection portion 52 is disposed on a top surface of
the wiring part 53. The protection portion 52 is connected to the
top surface of the wiring part 53. The wiring part 53, in a top
plan view, is formed with an elongated shape. The second connection
portion 51 is connected to the bottom surface of the wiring part 53
at a tip end portion of the wiring part 53 extending in an
elongated matter. The protection portion 52 extends further beyond
the leading end of the wiring part 53 where the second connection
portion 51 is connected. Accordingly, the protection portion 52
includes, in a top plan view, a region overlapping the second
connection portion 51 and a region not overlapping the second
connection portion 51. The second connection portion 51 is not
exposed in a top plan view. The protection portion 52 includes, in
a top plan view, a region overlapping the wiring part 53 and a
region not overlapping the wiring part 53. In a top plan view, the
wiring part 53 is not exposed.
Substrate Module
[0045] In the substrate module, the one or more power receiving
devices, the protected component, and the first connection
component 40 are mounted onto the substrate 10. The bottom surface
of each of the power receiving devices is joined to the top surface
of the substrate 10. The bottom surface of the protected component
is joined to the top surface of the substrate 10. The bottom
surface of the first connection component 40 is joined to the top
surface of the substrate 10.
[0046] The one or more power receiving devices and the first
connection component 40 are disposed on the plurality of wiring
regions 11 of the substrate 10. Thus, the one or more power
receiving devices and the first connection component 40 are
electrically connected. The protected component and the first
connection component 40 are disposed on the plurality of wiring
regions 11 of the substrate 10. Thus, the protected component and
the first connection component 40 are electrically connected.
[0047] Here, of the plurality of wiring regions 11, the wiring
region 11 on which the power receiving device is disposed is
referred to as a first wiring region 12, the wiring region 11 on
which the first connection component 40 is disposed is referred to
as a second wiring region 13, and the wiring region 11 on which the
protected component is disposed is referred to as a third wiring
region 14.
[0048] The substrate 10 includes a plurality of the first wiring
regions 12, and the one or more power receiving devices are
disposed on the plurality of first wiring regions 12. The substrate
10 includes a plurality of the second wiring regions 13, and the
first connection component 40 is disposed on the plurality of
second wiring regions 13. The substrate 10 includes a plurality of
the third wiring regions 14, and the protected component is
disposed on the plurality of third wiring regions 14. The plurality
of first wiring regions 12 and the plurality of second wiring
regions 13 are electrically connected. The plurality of second
wiring regions 13 and the plurality of third wiring regions 14 are
electrically connected.
[0049] The protected component is disposed on a top plan view,
between the one or more power receiving devices and the first
connection component 40. The protected component is interposed
between a lateral surface of the power receiving device and a
lateral surface of the first connection component 40 facing each
other. The protected component is disposed, in a top plan view,
between two planes respectively including the lateral surface of
the power receiving device and the lateral surface of the first
connection component 40 facing each other.
[0050] Here, in a top plan view, a direction parallel to the
lateral surface of the first connection component 40 facing the
power receiving device is a first direction, and a perpendicular
direction is a second direction. At this time, the protected
component is disposed, in a top plan view, between two straight
lines that pass through the respective opposite ends of the first
connection component 40 in the first direction and extend in the
second direction.
[0051] The protected component is disposed, in a top plan view,
between two straight lines that pass through both ends of the one
or more power receiving devices in the first direction and extend
in the second direction. In a top plan view, each lateral surface
of the one or more power receiving devices facing the lateral
surface of the first connection component 40 is parallel to the
first direction.
[0052] In a top plan view, a virtual straight line parallel to the
first direction and passing through the first wiring region 12 does
not pass through the second wiring region 13. In a top plan view,
the virtual straight line parallel to the first direction and
passing through the first wiring region 12 does not pass through
the third wiring region 14. In a top plan view, a virtual straight
line parallel to the first direction and passing through the second
wiring region 13 does not pass through the third wiring region
14.
[0053] In a top plan view, there exists a virtual straight line
parallel to the second direction and passing through the first
wiring region 12 and the second wiring region 13. That is, the
first wiring region 12 is provided at a position, in a top plan
view, spaced from the second wiring region 13 in a direction
orthogonal to the first direction. In a top plan view, there exists
a virtual straight line parallel to the second direction and
passing through the first wiring region 12, the second wiring
region 13, and the third wiring region 14. That is, the third
wiring region 14 is provided at a position, in a top plan view,
spaced from the second wiring region 13 in a direction orthogonal
to the first direction.
[0054] In a top plan view, among the plurality of second wiring
regions 13, a plurality of the second wiring regions electrically
connected to the third wiring region 14 are provided between two of
the second wiring regions 13 electrically connected to the first
wiring region 12. The plurality of second wiring regions
electrically connected to the third wiring region 14 are provided
between these two second wiring regions 13 in the first
direction.
[0055] Apart from the first wiring region 12, the second wiring
region 13, and the third wiring region 14, the plurality of wiring
regions 11 includes a plurality of the wiring regions 11 provided
at positions spaced from the plurality of second wiring regions 13
in the first direction. This plurality of wiring regions 11
includes one or a plurality of pairs of the wiring regions 11 that
sandwich the plurality of second wiring regions 13 in the first
direction.
[0056] Each of the pairs of wiring regions 11 is electrically
connected to the first wiring region 12. Each of the pairs of
wiring regions 11 is electrically connected to the third wiring
region 14. The one or plurality of pairs of wiring regions 11 are
electrically connected to the plurality of second wiring regions
13.
[0057] Electrical connection with the power receiving device can be
made by this pair of wiring regions 11 without passing through the
first connection component 40. Electrical connection with the
protected component can be made by this pair of wiring regions 11
without passing through the first connection component 40. This
pair of wiring regions 11 can be used, for example, in a case in
which the operation of the power receiving device or the protected
component needs to be checked without passing through the first
connection component 40.
[0058] For each of the one or plurality of pairs of wiring regions
11, one wiring region 11 is provided at a position spaced from the
second wiring region 13 in the first direction, and the other
wiring region 11 is provided at a position spaced from the second
wiring region 13 in the first direction and opposite to the one
wiring region 11.
[0059] The second connection component 50 is connected to the
substrate module onto which the one or more power receiving
devices, the protected component, and the first connection
component 40 are mounted. The second connection portion 51 is
connected to the first connection portion 41, thereby electrically
connecting the second connection component 50 to the one or more
power receiving devices. Power is supplied to the one or more power
receiving devices via the second connection component 50. The
second connection component 50 is electrically connected to the
protected component, and power is supplied to the protected
component via the second connection component 50.
[0060] When the first connection component 40 and the second
connection component 50 are connected, the protection portion 52 is
disposed above the protected component. In the protection portion
52, in a top plan view, the region not overlapping the second
connection portion 51 is disposed above the protected component. In
the protection portion 52, in a top plan view, the region not
overlapping the wiring part 53 is disposed above the protected
component.
[0061] The protection portion 52 is disposed at a position not in
contact with the one or more power receiving devices. The protected
component is disposed between the one or more power receiving
devices and the first connection component 40, making it possible
to protect the protected component by the second connection
component 50 including the protection portion 52.
[0062] In the substrate module with the second connection component
50 connected, the protected component is covered by the protection
portion 52 in a top plan view. A height from the top surface of the
substrate 10 to the protection portion 52 of the second connection
component 50 connected to the first connection component 40 is
greater than a height from the top surface of the substrate 10 to a
top surface of the protected component. Thus, the protection
portion 52 can protect the protected component while avoiding
contact with the protected component.
[0063] The height from the top surface of the substrate 10 to the
protection portion 52 of the second connection component 50
connected to the first connection component 40 is less than a
height from the top surface of the substrate 10 to a top surface of
the power receiving device. Thus, the protection portion 52 can be
provided at a position lower than that of the top surface of the
power receiving device, and the protected component can be
protected from the influence of the power receiving device. For
example, in a case in which the power receiving device is the light
emitting device 20, such as in the illustrated light emitting
module, when the protection portion 52 is positioned higher than
the top surface of the power receiving device, a portion of the
light emitted from a top surface of the light emitting device 20 is
likely to be emitted onto the bottom surface of the protection
portion 52 and travel to the protected component.
[0064] Here, the light emitting device 20, which is an example of
the power receiving device, will be described. The light emitting
device 20 includes, as components, a package 21, one or a plurality
of the light emitting elements 24, one or a plurality of reflecting
members 25, a plurality of wires 26, an optical member 27, and an
adhesive 28.
[0065] The package 21 includes a base part 22 and a lid member 23,
and the light emitting element 24 is sealed by joining the lid
member 23 to the base part 22 with the light emitting element 24
and the reflecting member 25 disposed on the base part 22. Thus,
the light emitting element 24 can be disposed in a closed space
that is vacuum-sealed or hermetically sealed.
[0066] In the illustrated example of the light emitting device 20,
four of the light emitting elements 24 are disposed side-by-side.
Further, four of the reflecting members 25 are disposed
side-by-side. The light emitting elements 24 and the reflecting
members 25 are provided in a one-to-one correspondence. The light
emitting elements 24 are electrically connected to the package 21
by the plurality of wires 26. Thus, the light emitting element 24
can receive a supply of power from outside the substrate module via
the package 21.
[0067] Light emitted from the light emitting elements 24 is
reflected by the reflecting members 25 and travels upwards. The
light traveling upwards passes through the lid member 23 and is
emitted outside of the package 21. The light emitted outside the
package 21 passes through the optical member 27 and is emitted
upward from lens surfaces of the optical member 27.
[0068] The lens surfaces having a one-to-one correspondence with
the light emitting elements 24 are provided on a top surface of the
optical member 27. Light emitted from the light emitting element 24
and passing through this lens surface becomes collimated light and
is emitted from the optical member 27.
[0069] The optical member 27 is joined to the lid member 23 by the
adhesive 28. Further, two types of the adhesive 28, a first
adhesive 281, and a second adhesive 282, are used to join the
optical member 27 and the lid member 23. For example, the first
adhesive 281 is an ultraviolet curing resin, and the second
adhesive 282 is a thermosetting resin. The combination of the first
adhesive 281 and the second adhesive 282 is not limited
thereto.
[0070] A semiconductor laser element can be employed for the light
emitting element 24. Further, for example, a semiconductor laser
element that emits blue light can be employed. Note that the
semiconductor laser element can be a semiconductor laser element
that emits light other than blue. Here, blue light refers to light
having an emission peak wavelength within a range from 420 nm to
494 nm. Examples of the semiconductor laser element that emits blue
light include a semiconductor laser element including a nitride
semiconductor. GaN, InGaN, and AlGaN, for example, can be used as
the nitride semiconductor.
[0071] In the light emitting module 1 in which the light emitting
device 20 and the thermistor 30 are mounted onto the substrate 10,
light emitted upward from the top surface of the light emitting
device 20 may be reflected from an object further ahead and
returned to the substrate module. At this time, the thermistor 30
can be protected from the returning light by the protection portion
52 of the second connection component 50. Note that the protected
object need not be limited to the thermistor 30. The protected
component in the light emitting module 1 is a component to be
protected from light in the operating state of the light emitting
device.
Second Embodiment
[0072] Next, a substrate module according to a second embodiment
will be described. FIG. 12 to FIG. 15 are drawings for explaining
an exemplary form of the substrate module. Note that, in the
drawings, a light emitting module 2, which is an exemplary form of
the substrate module, is described. FIG. 12 is a perspective view
of the light emitting module 2. FIG. 13 is a perspective view of
the light emitting module 2 viewed from a diagonal direction of
FIG. 12. FIG. 14 is a top plan view of the light emitting module 2.
FIG. 15 is a top plan view illustrating an example of the light
emitting module 2 in a state in which a second connection component
is connected.
[0073] This substrate module differ from the substrate module
according to the first embodiment in that the plurality of power
receiving devices are disposed side-by-side in the first direction.
In the illustrated example of the light emitting module 2, two of
the power receiving devices are disposed side-by-side in the first
direction. Note that, in the substrate module, the number of power
receiving devices arranged side-by-side need not be limited to
two.
[0074] The lateral surfaces of the plurality of power receiving
devices that face the lateral surface of the first connection
component 40 are provided on the same plane. Distances in the
second direction between the lateral surface of the first
connection component 40 and the lateral surfaces of the power
receiving devices facing each other are the same for each of the
plurality of power receiving devices.
[0075] The plurality of power receiving devices are disposed
line-symmetrically with respect to a straight line parallel to the
second direction in a top plan view. In the illustrated example of
the light emitting module 2, the light emitting devices 20 are
disposed so that the lens surfaces of the optical member 27 are
close to each other. In a top plan view, the optical member 27 is
disposed closer to one lateral surface of the light emitting device
20. The plurality of power receiving devices include two power
receiving devices having the same distance to the protected
component. The plurality of power receiving devices include two
power receiving devices having the same distance to the first
connection component 40. The two power receiving devices having the
same distance to the protected component and the two power
receiving devices having the same distance to the first connection
component 40 are the same two power receiving devices. In a case in
which the plurality of power receiving devices aligned in the first
direction, the protected component, and the first connection
component 40 are disposed in this way, and, with respect to the
substrate module as well, the second connection component 50 is
connected to the first connection component 40, the protection
portion 52 can protect the protected component in the same
manner.
[0076] As stated above, the present invention having the technical
features disclosed in the specification is not necessarily limited
to the structure described in the embodiments of the specification.
For example, the present invention can be applied to a substrate
module including components not disclosed in the embodiments, and a
difference from the disclosed structure does not constitute a basis
for not being able to apply the present invention. Further, in
terms of the minimum number of components for completing the
invention, it can be said that the described embodiments of the
substrate module can include components not required.
[0077] This means that the substrate modules disclosed according to
the embodiments of this specification each include not only a
viewpoint of completion of the invention but also a viewpoint of
disclosure of a rational configuration that assumes one form of
usage. The invention works effectively by being applied to the
exemplary forms of usage, but the application of the invention is
not limited to these forms of usage.
[0078] From such a point of view, it may not be essential to
include all of the components disclosed in one embodiment in the
present invention. For example, in a case in which a portion of the
components of the substrate module disclosed by an embodiment are
not stated in the claims, the components are not limited to those
disclosed in the embodiment, and there is a degree of freedom in
design by those skilled in the art, such as substitutions,
omissions, shape modifications, and material changes, which demands
that the invention recited in the claims is applied thereupon.
[0079] Further, to specify the structure of each specific form of
the light emitting module and the light emitting device in more
detail, FIG. 16 to FIG. 18 illustrate six-sided views of the light
emitting module 1, the light emitting device 20, and the light
emitting module 2, respectively. Note that the light emitting
device 20 in which the light emitting element 24 is a semiconductor
laser element can be referred to as a laser package. Further, the
light emitting module 1 and the light emitting module 2 including
the light emitting device 20 in which the light emitting element 24
is a semiconductor laser element can be referred to as a laser
package module.
[0080] The light emitting module described in the embodiments can
be utilized in a projector. That is, the projector can be said to
be one form of usage to which the present invention is applied.
Note that the present invention is not limited thereto, and can be
utilized in on-vehicle headlights, head-mounted displays, lights,
displays, and the like. Furthermore, the substrate module can also
be utilized in a substrate module of an electronic circuit or an
information processing device such as a computer.
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