U.S. patent application number 16/889023 was filed with the patent office on 2021-12-02 for liquid immersion cooling tank as a high density aggregated server chassis for modular blades.
The applicant listed for this patent is Arvind Bhargava, Robert CV Chen, Calvin Chu, Vincent Quan Hoang, Dennis Dantog Ignacio, Shankar Kesavan. Invention is credited to Arvind Bhargava, Robert CV Chen, Calvin Chu, Vincent Quan Hoang, Dennis Dantog Ignacio, Shankar Kesavan.
Application Number | 20210378148 16/889023 |
Document ID | / |
Family ID | 1000004899261 |
Filed Date | 2021-12-02 |
United States Patent
Application |
20210378148 |
Kind Code |
A1 |
Chen; Robert CV ; et
al. |
December 2, 2021 |
LIQUID IMMERSION COOLING TANK AS A HIGH DENSITY AGGREGATED SERVER
CHASSIS FOR MODULAR BLADES
Abstract
The disclosed computer cooling system includes a liquid
immersion cooling tank configured as a server chassis with an
integrated power bus, control bus and data bus. The server chassis
tank receives and services a plurality of modular blades including
disaggregated single server components dedicated to similar
functions and resembling a beekeeper's box of vertical and spaced
operation, insertion and extraction. The modular blades include at
least one management blade, interfaces and peripherals blade,
storage blade, CPU blade and one or more GPU blades and other
processors. Each blade configures hottest operating components
lowest in a heat flow via transverse mounted brackets and vented
ends. A blade extraction mechanism includes movable winches for
manipulating the plurality of modular blades from a top side of the
heat flow and a hydraulic lift for pushing each modular blade from
a bottom of the heat flow out of the liquid immersion cooling
tank.
Inventors: |
Chen; Robert CV; (Livermore,
CA) ; Chu; Calvin; (San Jose, CA) ; Ignacio;
Dennis Dantog; (San Ramon, CA) ; Kesavan;
Shankar; (Union City, CA) ; Hoang; Vincent Quan;
(San Jose, CA) ; Bhargava; Arvind; (Fremont,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Chen; Robert CV
Chu; Calvin
Ignacio; Dennis Dantog
Kesavan; Shankar
Hoang; Vincent Quan
Bhargava; Arvind |
Livermore
San Jose
San Ramon
Union City
San Jose
Fremont |
CA
CA
CA
CA
CA
CA |
US
US
US
US
US
US |
|
|
Family ID: |
1000004899261 |
Appl. No.: |
16/889023 |
Filed: |
June 1, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/20772 20130101;
H05K 7/20236 20130101; H05K 7/20272 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. A computer cooling system comprising: a plurality of modular
blades each dedicated to a singular function of different functions
including graphics, central processing, memory storage, peripheral
interface and device management via components disaggregated for a
heat transfer from an aggregated server of the different functions;
a liquid immersion cooling tank configured as a server chassis of
the plurality of modular blades comprising a backplane power bus,
control bus and data bus and configured to group the heat transfer
of the disaggregated components by the respective singular function
of each of the plurality of modular blades; wherein the liquid
immersion cooling tank aggregates the plurality of modular blades
into a single server chassis of the different functions.
2. (canceled)
3. (canceled)
4. (canceled)
5. The system of claim 1, further comprising a modular blade
extraction mechanism configured to remove the plurality of modular
blades from a top side of the heat flow and from a bottom side of
the heat flow out of the liquid immersion cooling tank.
6. The system of claim 5, wherein the modular blade extraction
mechanism comprises movable winches for manipulating the plurality
of modular blades from a top side of the heat flow.
7. The system of claim 5, wherein the modular blade extraction
mechanism further comprises a hydraulic lift configured to push
each modular blade from a bottom of the heat flow out of the liquid
immersion cooling tank.
8. The system of claim 1, further comprising a fluid pump and a
heat exchanger and a redundant fluid pump and a redundant heat
exchanger configured to remove heat from the heat flow in the
liquid immersion cooling tank.
9. The system of claim 1, further comprising a plurality of power
supply components integral to the liquid immersion cooling tank and
having disabled air fans to reduce a power consumption of the
system.
10. The system of claim 1, wherein the integrated buses further
comprise a built-in backplane configured to serve as a control bus
and as a data bus for a signaling and a communication between the
plurality of modular blades.
11. The system of claim 1, wherein the plurality of modular blades
further comprises a dedicated management blade for blade
administration, blade security and blade monitoring.
12. The system of claim 1, further comprising a software defined
network controller configured to logically decouple a control
modular blade from a data modular blade of the plurality of modular
blades and enable a scalability of a number of the plurality of
modular blades.
13. The system of claim 1, wherein each of the respective hottest
operating components of the plurality of modular blades, each
further comprises a spring loaded reduced z coordinate height
double riser and heat sink.
14. The system of claim 1, wherein the respective hottest operating
components of the plurality of modular blades comprises a plurality
of GPU (graphics processor units), a plurality of CPU (central
processing unit) and a PSU (power supply unit).
15. The system of claim 1, wherein the liquid immersion cooling
tank further comprises double hull stainless steel walls to prevent
corrosion and leakage of the liquid therein.
16. The system of claim 1, further comprising a maintenance
platform configured for drainage and access to the plurality of
modular blades, the integrated bus and the modular blade extraction
mechanism.
17. The system of claim 1, wherein the liquid immersion cooling
tank further comprises an integrated temperature gauge, temperature
alarm and RFID (radio frequency identification).
18. (canceled)
19. (canceled)
20. A computer cooling system, comprising: a) a liquid immersion
cooling tank configured as a server chassis comprising a backplane
having a power bus, a control bus and a data bus and configured to
receive and service a plurality of modular blades resembling a
beekeeper's box of vertical and spaced operation, insertion and
extraction; b) a plurality of modular blades comprising at least
one disaggregated management blade, interfaces and peripherals
blade, storage blade, CPU blade and GPU blade, wherein each blade
configures hottest operating components lowest in a coolest portion
of a heat flow to optimize heat transfer; and c) a blade extraction
mechanism comprising movable winches for manipulating the plurality
of modular blades from a top side of the heat flow and a hydraulic
lift for pushing each modular blade from a bottom of the heat flow
out of the liquid immersion cooling tank, wherein the ambient heat
flows from a coolest and a lowest point to a hotter and a highest
point in the liquid immersion cooling tank and in each of the
plurality of modular blades and wherein the liquid immersion
cooling tank aggregates the modular blades into a single server
chassis of dedicated functions.
Description
BACKGROUND OF THE INVENTION
[0001] The first thing one notices walking into an immersion-cooled
data center is the virtual silence. The high-pitched whirring of
server fans and air handlers found in air-cooled sites are replace
with the subtle hum of fluid pumps. Next, one realizes that the
data center is not freezing cold. With immersion cooling, air
conditioning is only needed for technician comfort. Air-cooled data
centers are cold and noisy without the compute density of
comparable immersion-cooled space.
[0002] Furthermore, immersion cooling simplifies data center
operations. Conventional systems keep coolant inside a rack at a
temperature safe for technical staff though higher temperatures are
safe for electronic components and equipment. Conventional coolants
are made from synthetic stock used in domestic applications and
cosmetics.
[0003] In contrast to densely packed racks, there is no need to
handle heavy IT equipment high in vertical racks or low to the
ground when installing or retrieving servers. Also, the virtually
silent environment eliminates the need for technical staff to wear
hearing protection. Along with health considerations, immersion
cooling also permits technical staff to communicate more easily to
troubleshoot and resolve issues right at the rack.
[0004] Immersion cooling systems also help reduce the number of
service events by improving server reliability. Servers immersed in
coolant are protected from dust and other air-pollutants, along
with moisture and oxygen, hence corrosion. What is more, the
absence of server fans eliminates vibrations and reseat errors.
[0005] Cooling a data center never used to be so hard. But IT and
data center professionals have watched the thermal design power
(TDP) of chips rise almost 50% in the last decade, generating more
heat and using more power than ever before. Rack density has grown.
Hot GPUs (graphics processor units) are becoming the weapon of
choice for tackling high-performance computing requirements.
SUMMARY OF THE INVENTION
[0006] Single servers are disaggregated into dedicated modular
blades of same and similar functions to optimize a heat transfer
and fluid dynamics in the liquid cooling tank by immersing the
modular blades into a heat flow from hottest bottom components to
cooler top components immersed therein. The liquid immersion
cooling tank further acts as the server chassis complete with power
distribution, data and control buses and precludes the need for air
cooling fans and aggregated processor, power distribution, data and
control buses and support architectures. In other words, the liquid
immersion cooling tank aggregates the modular blades into a server
chassis of dedicated functions.
[0007] A disclosed computer cooling system comprises a liquid
immersion cooling tank configured as a disaggregated server chassis
comprising an integrated power bus, an integrated control bus and
an integrated data bus. The system and integrated buses are
configured to receive and service a plurality of modular blades
resembling a beekeeper's box of vertical and spaced operation,
insertion and extraction. The system also includes a plurality of
modular blades disaggregating and dedicating similar and same
functions comprising at least one management blade, interfaces and
peripherals blade, storage blade, CPU blade and at least one GPU
blade, wherein each blade configures hottest operating components
lowest in a heat flow via transverse mounted brackets and vented
ends.
[0008] The system further includes a blade extraction mechanism
comprising movable winches for manipulating the plurality of
modular blades from a top side of the heat flow and a hydraulic
lift for pushing each modular blade from a bottom of the heat flow
out of the liquid immersion cooling tank. Heat flows in the system
from a coolest and a lowest point to a hotter and a highest point
in the liquid immersion cooling tank and in each of the plurality
of modular blades and wherein the liquid immersion cooling tank
defines an access opening adjacent the highest point of the heat
flow. Additional GPU and Storage modular blades are added to the
disclosed system for scaling-out processing and storage needs,
respectively.
[0009] A disclosed method for cooling a computer system includes
configuring a liquid immersion cooling tank as a server chassis
comprising an integrated bus for receiving and servicing a
plurality of modular blades resembling a beekeeper's box of
vertical and spaced operation, insertion and extraction. The method
also includes configuring a plurality of modular blades comprising
disaggregated server components configured with respective with
respective hottest operating components lowest in a heat flow in
the liquid immersion cooling tank via transverse mounted brackets
and vented lower ends. The method additionally includes extracting
one of the plurality of modular blades via a blade extraction
mechanism simultaneously from a top side of the heat flow and from
a bottom side of the heat flow out of the liquid immersion cooling
tank. The method further includes a heat flowing in the system from
a coolest and a lowest point to a hotter and a highest point in the
liquid immersion cooling tank and in each of the plurality of
modular blades. The liquid cooling immersion tank defines an access
opening adjacent the highest point of the heat flow. The method yet
includes manipulating the modular blades from a top side of the
heat flow via a modular blade extraction mechanism of movable
winches. The method includes pushing each modular blade from a
bottom of the heat flow out of the liquid immersion cooling tank
via a modular blade extraction mechanism of a hydraulic lift.
[0010] Other aspects and advantages of embodiments of the
disclosure will become apparent from the following detailed
description, taken in conjunction with the accompanying drawings,
illustrated by way of example of the principles of the
disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 depicts the liquid immersion cooling tank as a high
density server chassis for modular blades in accordance with an
embodiment of the present disclosure.
[0012] FIG. 2 depicts types of high density modular blades with
integrated control, data and power buses in accordance with an
embodiment of the present disclosure.
[0013] FIG. 3 depicts an expanded view of the liquid immersion
cooling tank as a high density server chassis for modular blades
with fluid circulation in accordance with an embodiment of the
present disclosure.
[0014] FIG. 4 depicts a high speed backplane for control and data
buses for signaling and communication between modular blades in
accordance with an embodiment of the present disclosure.
[0015] FIG. 5 depicts block diagram components of a software
defined network architecture with a layering technologies approach
in accordance with an embodiment of the present disclosure.
[0016] FIG. 6 depicts a top view and end views of a single server
with transverse brackets in accordance with an embodiment of the
present disclosure.
[0017] FIG. 7 depicts a block diagram view of a partially
disaggregated longitudinal processor server layout in accordance
with an embodiment of the present disclosure.
[0018] FIG. 8 depicts a block diagram view of a partially
disaggregated transverse processor server layout in accordance with
an embodiment of the present disclosure.
[0019] FIG. 9 depicts a block diagram view of another partially
disaggregated transverse server layout in accordance with an
embodiment of the present disclosure.
[0020] FIG. 10 depicts a serviceability and modular blade
extraction mechanism for the liquid immersion cooling tank as a
high density server chassis in accordance with an embodiment of the
present disclosure.
[0021] FIG. 11 depicts a flow diagram of a method of cooling the
liquid immersion cooling tank as a high density server chassis in
accordance with an embodiment of the present disclosure.
[0022] FIG. 12 depicts another flow diagram of a method of cooling
the liquid immersion cooling tank as a high density server chassis
in accordance with an embodiment of the present disclosure.
[0023] Throughout the description, similar reference numbers may be
used to identify similar elements in the several embodiments and
drawings. Although specific embodiments of the invention have been
illustrated, the invention is not to be limited to the specific
forms or arrangements of parts so described and illustrated. The
scope of the invention is to be defined by the claims herein and
their equivalents.
DETAILED DESCRIPTION
[0024] Reference will now be made to exemplary embodiments
illustrated in the drawings and specific language will be used
herein to describe the same. It will nevertheless be understood
that no limitation of the scope of the disclosure is thereby
intended. Alterations and further modifications of the inventive
features illustrated herein and additional applications of the
principles of the inventions as illustrated herein, which would
occur to one skilled in the relevant art and having possession of
this disclosure, are to be considered within the scope of the
invention.
[0025] Throughout the present disclosure, the term `server chassis`
refers to a physical structure that is used to house or physically
assemble servers in various different form factors. The server
chassis makes it possible to put multiple servers and other storage
and peripheral equipment in a single physical body. The terms
`aggregated,` and `disaggregated,` refer respectively to components
operating on a single substrate and on multiple substrates of
varying percentages of same and similar component types. In other
words, an aggregated single server blade composes a processor,
memory, management, power distribution, control and data buses. A
disaggregated modular blade comprises several processors and some
support components for a partially disaggregated modular blade to
all processors and no support components for a completely
disaggregated modular blade. Therefore a CPU modular blade, for
example, comprises all CPU components and very little support
components if any. On the other hand, another CPU modular blade,
for example comprises several co-processor CPUs and some support
components. Similarly, a GPU modular blade, a Storage modular
blade, a management modular blade, an accelerator modular blade,
etc, are dedicated to a particular function in the effective liquid
immersion cooling tank as a server chasses to varying degrees based
on heat transfer and fluid dynamics for thermal management
thereof.
[0026] The term `modular blade,` refers to a disaggregated
substrate for dedicating similar and same functions including but
not limited to CPU (central processing unit), GPU (graphics
processing unit), FPU (floating point processing unit), DSP
(digital signal processor), Media processor, ASIC (application
specific integrated circuit) processor, PSU (power supply unit),
Storage, Interfaces, and Management as explained and detailed
throughout the present disclosure. `Transverse,` is used throughout
the present disclosure to describe components which are lengthwise
situated side by side relative to a lengthwise side of a modular
blade. In other words, transverse components are lengthwise
parallel to a lateral dimension of the modular blade. The term
`backplane,` refers to a group of electrical connectors in parallel
with each other wherein each pin of each connector is linked to the
same relative pin of all the other connectors. Therefore and
accordingly, the phrase `tank as a chassis,` is defined as each
disaggregated modular blade having individual power needs supplied
by an external Power Distribution Unit (PDU) that is either
attached or built-in the cooling tank. Thus, there is no need for
PSU (power supply units) and a removal of respective fans. The term
`modular class blade,` refers to the modular blades dedicated to
specific functions such as GPU, CPU, Storage, Interface, Management
and etc.
[0027] FIG. 1 depicts the liquid immersion cooling tank as a high
density server chassis for modular blades in accordance with an
embodiment of the present disclosure. The depiction includes the
cooling tank 5, the cooling fluid 10, the modular class blades 20
and the lid of the cooling tank 15. The lid 15 is shown hinged on a
lengthwise side but may also hinge from any edge and not be hinged
at all. The lid may be metallic or a transparent material allowing
visual inspection of the cooling tank. The modular class blades 20
extend into the cooling fluid 10 and are therefore not depicted
below a level of the cooling fluid 10 for depiction purposes. Also,
the modular blades are covered and immersed completely in operation
and not visible above the level of the cooling fluid 10
depicted.
[0028] FIG. 2 depicts types of high density modular blades with
integrated control, data and power buses in accordance with an
embodiment of the present disclosure. The depiction includes the
power bus 30, the data bus 35, the control bus 40, the accelerator
blade 45, the central processing blade 50, the storage blade 55,
the management blade 60 and the interfaces blade 65 disposed in the
cooling tank (not shown). For depiction purposes, the modular
blades are shown outside of the cooling tank chassis but are
immersed completely therein in operation. Also for depiction
purposes, the respective modular blades are shown in block diagram
form but in built-out installation include components which are
hereafter detailed and described.
[0029] FIG. 3 depicts an expanded view of the liquid immersion
cooling tank as a high density server chassis for modular blades
with fluid circulation in accordance with an embodiment of the
present disclosure. The depiction includes the immersion tank 5,
the graphics accelerator blades 45, the central processing blade
50, the storage blade 55, the interface blade 65 and the management
blades 60, the fluid pump 75, and the heat exchanger 80. The
external power distribution 85 sits adjacent the cooling tank and
supplies electrical power to each blade on a backplane or a power
line. The fluid pump 75 circulates the cooling fluid in the cooling
tank through the heat exchanger 80. The cooling fluid 10 will
circulate in the cooling tank 5 without the fluid and without the
heat exchanger under physical properties of heat transfer and fluid
dynamics. However, the fluid pump and the heat exchanger accelerate
the heat transfer and fluid dynamics in a more time efficient
manner. The open server approach modularizes each blade for
dedicated functions. The central processing blade runs any Linux
distribution. The dedicated management blade enables
administration, security and monitoring.
[0030] FIG. 4 depicts a high speed backplane for control and data
buses for signaling and communication between modular blades in
accordance with an embodiment of the present disclosure. The
depiction includes the cooling tank interior view of the GPU blade
45, the CPU blade 50, the storage blade 55, the interface blade 65
and the management blade 60. A perspective view of a modular class
blade 20 is included with a data bus 35 and a control bus 40 at an
edge connector of the modular blade 20. The high speed connector
cabling 90 supports the high speed backplane 90 in distributing
power, data and control for signaling and communication modular
blade to modular blade through the tank backplane and to
peripherals and external digital hardware.
[0031] FIG. 5 depicts block diagram components of a software
defined network architecture with a layering technologies approach
in accordance with an embodiment of the present disclosure. The
depiction includes the control layer 95, the data layer 100, the
application layer 105, the SDN (software defined network)
controller 110, the SDN 120, the SDN approach to layering of
technologies 125, the Northbound APIs (application programming
interfaces)130 and the Southbound APIs 135.
[0032] FIG. 6 depicts a top view and end views of a single server
with transverse brackets in accordance with an embodiment of the
present disclosure. The depiction includes the side panel removed
200, the top end 215, the bottom end 210, the transverse mounted
brackets 220 and the bottom end vents 215. Brackets are transverse
mounted to not obstruct cooling liquid flow. The chassis side panel
exposes a lower third of the aggregated single server to provide
optimal liquid contact for heat transfer and cooling. Medical grade
metals are used throughout the system for optimal performance.
Components are disposed on the aggregated single server with
highest operating temperatures located at the lowest end of the
chassis for optimal heat flow, optimal fluid dynamics and optimal
heat transfer. The bottom end 210 is vented for efficient liquid
flow.
[0033] FIG. 7 depicts a block diagram view of a partially
disaggregated longitudinal processor server layout in accordance
with an embodiment of the present disclosure. A GPU modular blade
is a customized electronic circuit board mounted in a lightweight
but strong chassis for installing and connecting a maximum number
of Graphics Processing Unit (GPU) cards for immersion cooling. It
will have provisions for power and current PCIE connectivity. It
will have harnesses to secure GPU cards in place to prevent any
movement while immersed in coolant liquid. An implementation
includes the processor units 235 which are GPU or CPU (central
processing units) or FPU (floating point processing unit) or DSP
(digital signal processor) or a Media processor or an ASIC
processor depending on an aggregated or disaggregated
implementation. The PSU (power supply unit) 240, the non-volatile
solid state drive 245, the PSU breakout board 250 and a subsequent
processing unit 255 which is a CPU (central processing unit) or a
subsequent GPU (graphics processing unit) or FPU or DSP or Media
processor or an ASIC processor depending on an aggregated or
disaggregated implementation. Embodiments of the disclosure include
a modular blade configuration where the processing units 235 and
255 are respectively part of a co-processor CPU implementation or a
co-processor GPU implementation or co-processor FPU or a DSP
co-processor or Media co-processor or an ASIC co-processor
implementation. The processing unit 255 is located proximal the top
and the processing units 235 are proximal a bottom of the
aggregated single server.
[0034] FIG. 8 depicts a block diagram view of a partially
disaggregated transverse processor server layout in accordance with
an embodiment of the present disclosure. The CPU blade is a
customized electronic board mounted in a lightweight but strong
chassis for installing one or more CPUs and main memory. It will
have industry specifications for CPU sockets and Dual In-line
Memory Module sockets. The Central Processing Blade is effectively
a motherboard with external connections for PCIE and other
peripherals such as network interfaces. The Central Processing
Blade is where the system's Operating System will be installed. The
depiction further includes the transverse mounted processor unit
235 which are GPU or CPU or FPU or DSP or Media processor or an
ASIC processor depending on an aggregated or disaggregated
implementation. The PSU (power supply unit) 240, the non-volatile
solid state drive 245, the PSU breakout board 250 and the
subsequent processing unit 255 which is a GPU or a CPU or FPU or
DSP or Media processor or ASIC processor depending on an aggregated
or disaggregated implementation. The subsequent processing unit 255
is located proximal the bottom and the transverse mounted
processing units 235 are proximal a top thereof. The transverse
orientation enables a top to bottom heat transfer and fluid dynamic
for efficient cooling proximal a top thereof. Embodiments of the
disclosure include a modular blade configuration where the
processing units 235 and 255 are respectively part of a
co-processor CPU implementation or a co-processor GPU
implementation or a FPU co-processor implementation or a DSP
co-processor implementation or Media co-processor or ASIC
co-processor.
[0035] In other words, an aggregated single server blade composes a
processor, memory, management, power distribution, control and data
buses. A disaggregated modular CPU blade comprises several
processors and some support components or comprises all processors
and no support components. Therefore a CPU modular blade, for
example, comprises all CPU components and very little support
components if any. On the other hand, another CPU modular blade,
for example, comprises several co-processor CPUs and some support
components immersed in the liquid cooling tank as a server chassis
to varying degrees based on heat transfer and fluid dynamics for
thermal management thereof.
[0036] FIG. 9 depicts a block diagram view of another partially
disaggregated transverse processor layout in accordance with an
embodiment of the present disclosure. The storage blade is a
customized electronic board mounted in a lightweight but strong
chassis for installing various types of Solid-State Drives (SSD)
such as 2.5 inch Flash Drives and M.2 SSDs. It will effectively be
a JBOF unit--Just a Bunch of Flash, with high-speed connections for
minimal latency. The depiction further includes the transverse
mounted processor units 235 which are GPU or CPU or FPU or DSP or
Media processor or ASIC processor depending on an aggregated or
disaggregated implementation. The PSU (power supply unit) 240, the
non-volatile solid state drive 245, the PSU breakout board 250 and
the subsequent processing unit 255 which is a CPU or a GPU or FPU
or DSP or Media processor or ASIC processor depending on an
aggregated or disaggregated implementation. The subsequent
processing unit 255 is located proximal the bottom and the
transverse mounted processing units 235 are proximal a top of the
single server. The transverse orientation enables a top to bottom
heat transfer and fluid dynamic for efficient cooling proximal a
bottom thereof. Embodiments of the disclosure include a modular
blade configuration where the processing units 235 and 255 are
respectively part of a co-processor CPU implementation or a
co-processor GPU implementation or FPU co-processor implementation
or a DSP co-processor implementation or a Media co-processor or an
ASIC co-processor.
[0037] FIG. 10 depicts a serviceability and modular blade
extraction mechanism for the liquid immersion cooling tank as a
high density server chassis in accordance with an embodiment of the
present disclosure. The interfaces blade is a customized electronic
board mounted in a lightweight but strong chassis with multiple
Network Interfaces (10 GB-Ethernet, 100 GB-Ethernet, 1000
GB-Ethernet, Optical, FiberChannel, and more. It will also have
various Peripheral interfaces--PCIE, USB, Thunderbolt, Serial,
Bluetooth, etc. The depiction further includes the liquid immersion
cooling tank 5, the modular blades 20, the hydraulic lift for
pushing each modular class blade 20 out of the tank 5, the blade
extraction mechanism 310 with movable winches for manipulating the
modular class blades 20. The depiction also includes the winches
320, the maintenance platform 330 for drainage and access to
components and the blade extraction boom 340. Heavy duty locking
casters are used for mobility and tank maintenance.
[0038] FIG. 11 depicts a flow diagram of a method of cooling the
liquid immersion cooling tank as a high density server chassis in
accordance with an embodiment of the present disclosure. The method
includes configuring 400 a liquid immersion cooling tank as a
server chassis comprising an integrated bus for receiving and
servicing a plurality of modular blades resembling a beekeeper's
box of vertical and spaced operation, insertion and extraction. The
method also includes configuring 410 a plurality of modular blades
dedicating disaggregated server components of similar functions
with respective hottest operating components lowest in a heat flow
in the liquid immersion cooling tank via transverse mounted
brackets and vented lower ends. The method further includes
extracting 420 one of the plurality of modular blades via a blade
extraction mechanism simultaneously from a top side of the heat
flow and from a bottom side of the heat flow out of the liquid
immersion cooling tank.
[0039] FIG. 12 depicts another flow diagram of a method of cooling
the liquid immersion cooling tank as a high density server chassis
in accordance with an embodiment of the present disclosure. The
method includes a heat flowing 430 in the system from a coolest and
a lowest point to a hotter and a highest point in the liquid
immersion cooling tank and in each of the plurality of modular
blades. The liquid cooling immersion tank defines an access opening
adjacent the highest point of the heat flow. The method also
includes disaggregating 440 an aggregated server's functions into
the plurality of modular blades by a dedicated same and similar
function including processing, storing data and instructions,
interfacing and managing administration, security and monitoring.
The method additionally includes manipulating 450 the modular
blades from a top side of the heat flow via a modular blade
extraction mechanism and pushing each modular blade from a bottom
of the heat flow out of the liquid immersion cooling tank via a
modular blade extraction mechanism of a hydraulic lift.
[0040] In other words, the disclosure disaggregates single
aggregated servers into dedicated blades for GPUs, Central
Processing units or FPUs, Storage, etc. for cooling tank immersion
heat transfer via ambient and dynamic fluid dynamics. The liquid
immersion cooling tank aggregates the modular blades into a server
chassis of dedicated functions
[0041] For example a modular GPU Blade is a customized electronic
circuit board mounted in a lightweight but strong chassis for
installing and connecting a maximum number of Graphics Processing
Unit (GPU) cards for immersion cooling. It has provisions for power
and current PCIE connectivity. It has harnesses to secure GPU cards
in place to prevent any movement while immersed in the coolant
liquid.
[0042] A modular Central Processing Blade is a customized
electronic board mounted in a lightweight but strong chassis for
installing one or more CPUs and main memory. It has industry
specifications for CPU sockets and Dual In-line Memory Module
sockets. The Central Processing Blade is effectively a motherboard
with external connections for PCIE and other peripherals such as
network interfaces. The Central Processing Blade is where the
system's Operating System is installed.
[0043] A Floating Point processor is specially designed to carry
out operations on floating-point numbers. Operations include
addition, subtraction, multiplication, division, and square root.
FPUs can also perform various transcendental functions such as
exponential or trigonometric calculations, with varying accuracy so
embodiments compute these functions in software. In aggregated
servers, one or more FPUs are integrated as execution units within
the central processing unit; however, many embedded processors do
not have hardware support for floating-point operations while they
increasingly have them as standard, at least 32-bit ones.
[0044] A Digital Signal Processor is used for measuring, filtering
and/or compress digital or analog signals. The signal processing
means analysis and manipulation of signal. This processing can be
done via computer or Application Specific Integrated Circuits
(ASIC), Field Programmable Gate Array (FPGA) or Digital Signal
Processor (DSP) to obtain the clear signal. The DSP processors are
used in an oscilloscope, barcode scanners, mobile phones, printers,
etc. These processors are fast and use for real-time
applications.
[0045] A media processor is designed or created to deal with image,
video and audio data in real-time. The voice user interface and
professional audio are the applications of the audio processor.
Some of the media processors are TN2302AP IP, IN2602 AP IP, DM3730,
DM3725, DM37385, DM388, TMS320DM6467, TMS320DM6431, etc
[0046] An ASIC processor (application-specific integrated circuits)
are built for specific applications. These processors are small in
size and consume low power. The design cost of ASIC is high and
this is the main disadvantage. The application-specific integrated
circuit chips are used in satellites, modems, computers, etc. Some
of the top ASICs manufacturer companies are Ams AG. Listed Company,
Bitfury. Private Company, XMOS Semiconductor Private Company,
Analogix Semiconductor Private Company, EDAptive Computing Private
Company, Lumen Radio Private Company, Integrated Device Technology,
Hookit. Private Company, etc.
[0047] A modular Storage Blade is a customized electronic board
mounted in a lightweight but strong chassis for installing various
types of Solid-State Drives (SSD) such as 2.5 inch Flash Drives and
M.2 SSDs. It is effectively be a JBOF unit--Just a Bunch of Flash,
with high-speed connections for minimal latency.
[0048] A modular Interfaces Blade is a customized electronic board
mounted in a lightweight but strong chassis with multiple Network
Interfaces (10 GB-Ethernet, 100 GB-Ethernet, 1000 GB-Ethernet,
Optical, FiberChannel, and more. It has various Peripheral
interfaces--PCIE, USB, Thunderbolt, Serial, Bluetooth, etc.
[0049] Each blade has individual power needs supplied by an
external Power Distribution Unit (PDU) that is either attached or
built-in the tank. Thus, there is no need for PSUs and the removal
or disabling of respective fans. The modular blades include at
least one management blade, interfaces and peripherals blade,
storage blade, Central Processing blade and one or more GPU blades.
Additional GPU and Storage blades are easily added to the system
for scaling-out processing and storage needs, respectively.
[0050] Therefore, in embodiments of the disclosure, disaggregated
processors are grouped on dedicated modular blades to optimize heat
transfer and fluid dynamics in the liquid cooling tank by immersing
the modular blades into a heat flow from hottest bottom components
to cooler top components immersed therein. The cooling tank further
acts as the server chassis complete with power distribution, data
and control buses and precludes the need for air cooling fans and
aggregated processor and support architectures. The liquid
immersion cooling tank aggregates the modular blades into a server
chassis of dedicated functions The disclosure therefore fills a
need heretofore unmet in the cooling space for high density
servers.
[0051] Although the operations of the method(s) herein are shown
and described in a particular order, the order of the operations of
each method may be altered so that certain operations may be
performed in an inverse order or so that certain operations may be
performed, at least in part, concurrently with other operations. In
another embodiment, instructions or sub-operations of distinct
operations may be implemented in an intermittent and/or alternating
manner.
[0052] While the forgoing examples are illustrative of the
principles of the present disclosure in one or more particular
applications, it will be apparent to those of ordinary skill in the
art that numerous modifications in form, usage and details of
implementation can be made without the exercise of inventive
faculty, and without departing from the principles and concepts of
the invention. Accordingly, it is not intended that the disclosure
be limited, except as by the specification and claims set forth
herein.
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