U.S. patent application number 16/982683 was filed with the patent office on 2021-11-25 for stamping portions having metal flow receiving features.
This patent application is currently assigned to Hewlett-Packard Development Company, L.P.. The applicant listed for this patent is Hewlett-Packard Development Company, L.P.. Invention is credited to Te-Shun Lee, Chao-Hung Lin, Chia-Cheng Wei, Kuan-Ting Wu.
Application Number | 20210362211 16/982683 |
Document ID | / |
Family ID | 1000005814192 |
Filed Date | 2021-11-25 |
United States Patent
Application |
20210362211 |
Kind Code |
A1 |
Lin; Chao-Hung ; et
al. |
November 25, 2021 |
STAMPING PORTIONS HAVING METAL FLOW RECEIVING FEATURES
Abstract
An example system includes a first stamping portion having a
first surface to form a corresponding stamped surface on a metal
component to be stamped, and a second stamping portion having a
second surface, the second surface to oppose the first surface of
the first stamping portion during stamping of the metal component.
The second surface includes a metal flow receiving feature, the
metal flow receiving feature including a non-flat surface to
attenuate an amount of metal flowing therein during stamping of the
metal component between the first stamping portion and the second
stamping portion.
Inventors: |
Lin; Chao-Hung; (Taipei
City, TW) ; Lee; Te-Shun; (Taipei City, TW) ;
Wu; Kuan-Ting; (Taipei City, TW) ; Wei;
Chia-Cheng; (Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Hewlett-Packard Development Company, L.P. |
Spring |
TX |
US |
|
|
Assignee: |
Hewlett-Packard Development
Company, L.P.
Spring
TX
|
Family ID: |
1000005814192 |
Appl. No.: |
16/982683 |
Filed: |
July 2, 2018 |
PCT Filed: |
July 2, 2018 |
PCT NO: |
PCT/US2018/040564 |
371 Date: |
September 21, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B21D 22/02 20130101 |
International
Class: |
B21D 22/02 20060101
B21D022/02 |
Claims
1. A system, comprising: a first stamping portion having a first
surface to form a corresponding stamped surface on a metal
component to be stamped; and a second stamping portion having a
second surface, the second surface to oppose the first surface of
the first stamping portion during stamping of the metal component,
wherein the second surface includes a metal flow receiving feature,
the metal flow receiving feature including a non-flat surface to
attenuate an amount of metal flowing therein during stamping of the
metal component between the first stamping portion and the second
stamping portion.
2. The system of claim 1, wherein the first stamping portion and
the second stamping portion have a hardness greater than a hardness
of the metal component.
3. The system of claim 1, wherein the metal flow receiving feature
includes at least one of a curved surface, a wave formation or a
sawtooth formation.
4. The system of claim 3, wherein the first surface of the first
stamping portion includes a substantially flat portion.
5. A system, comprising: a first stamping portion having a first
surface, the flat surface having a substantially flat portion; a
second stamping portion having a second surface; and a metal
component positioned between the first surface of the first
stamping portion and the second surface of the second stamping
portion, the metal component having a stamped surface facing the
first surface of the first stamping portion, the metal component
having a non-stamped surface opposite the stamped surface and
facing the second surface of the second stamping portion, wherein
the second surface of the second stamping portion includes a metal
flow receiving feature, the metal flow receiving feature including
a non-flat surface.
6. The system of claim 5, wherein the first stamping portion and
the second stamping portion have a hardness greater than a hardness
of the metal component.
7. The system of claim 5, wherein the metal flow receiving feature
includes at least one of a curved surface, a wave formation or a
sawtooth formation.
8. The system of claim 5, wherein the first surface of the first
stamping portion includes a substantially flat portion.
9. The system of claim 5, wherein the metal component is a surface
of an electronic device.
10. The system of claim 9, wherein the stamped surface includes a
finger recess for the surface of the electronic device.
11. A method, comprising: positioning a metal component between a
first stamping portion and a second stamping portion, the metal
component having a stamped surface to be stamped and a non-stamped
surface opposite the stamped surface, the first stamping portion
having a first surface facing the stamped surface of the metal
component, the second stamping portion having a second surface
facing the non-stamped surface of the metal component, the second
surface of the second stamping portion including a metal flow
receiving feature; stamping the metal component between the first
stamping portion and the second stamping portion, the stamping
including flowing material from the metal component into the metal
flow feature.
12. The method of claim 11, wherein the first stamping portion and
the second stamping portion have a hardness greater than a hardness
of the metal component.
13. The method of claim 11, wherein the first surface of the first
stamping portion includes a substantially flat portion.
14. The method of claim 11, wherein the first surface of the first
stamping portion includes a substantially flat portion.
15. The method of claim 11, wherein the stamped surface of the
metal component includes a finger tab for a surface of an
electronic device.
Description
BACKGROUND
[0001] Many devices include components that are manufactured in a
variety of manners. For example, certain devices or components are
formed of plastic using injection molding, while others may be
formed of a metal that may be forged, machined, or otherwise
shaped. The method of forming the component may be selected based
on such factors as strength or surface shape desired.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] For a more complete understanding of various examples,
reference is now made to the following description taken in
connection with the accompanying drawings in which:
[0003] FIG. 1 illustrates an example system for stamping metal
components;
[0004] FIG. 2 illustrates another example system for stamping metal
components;
[0005] FIGS. 3-5 illustrate various phases of the stamping of a
metal component using the example system of FIG. 2;
[0006] FIG. 6 illustrates another example system for stamping metal
components;
[0007] FIG. 7 illustrates another example system for stamping metal
components; and
[0008] FIG. 8 is a flow chart illustrating an example method for
stamping of metal components.
DETAILED DESCRIPTION
[0009] Various mechanisms may be used for forming different
components or devices. For metal components, certain features can
be achieved through stamping of a metal component. Stamping can
often result in defects on the surface of a component. The defects
can include significant non-uniformity of the stamped surface. For
certain components and materials, the non-uniformity of the surface
can, in turn, result in non-uniformity in color or appearance of
the surface. Further, for certain components, the non-uniformity
may be significantly noticeable to the touch by a user.
[0010] In various examples described herein, metal components may
be stamped to form a desired shape or feature. For example, the
body of a laptop computer may have a cover with features which can
be stamped. In one example, a laptop cover is provided with a
recess to allow a user to insert a finger to open the cover. In
various examples, stamping systems allow improved stamping of metal
components, such as laptop covers, with reduced surface defects. In
this regard, an example stamping system includes a first stamping
portion provided with a first surface having a shape which
corresponds to the desired shape of the component to be stamped,
such as a flat shape for the finger recess of the laptop cover. A
second stamping portion is provided with a second surface to oppose
the first surface. The metal component to be stamped may be
positioned between the first stamping portion and the second
stamping portion, with the portion of the metal component to have
the desired shape positioned between the first surface and the
second surface. The second surface is provided with a metal flow
receiving feature which includes a non-flat surface. The non-flat
surface allows the amount of metal to flow into the metal flow
receiving feature to be attenuated during stamping of the metal
component between the first stamping portion and the second
stamping portion. For example, a stamping force may be adjusted to
cause an optimal amount of metal to flow into the metal flow
receiving feature to provide a substantially defect-free stamped
surface on the metal component. In various examples, the non-flat
surface of the metal flow receiving feature may include various
shapes such as an arc or a sawtooth pattern.
[0011] Referring first to FIG. 1, an example system for stamping
metal components is illustrated. The example system 100 includes a
first stamping portion 110 and a second stamping portion 120. The
first stamping portion 110 is provided with a first surface 112.
The first surface 112 is shaped to form a corresponding stamped
surface on a metal component to be stamped (not shown in FIG. 1).
In this regard, the first surface 112 of the first stamping portion
110 is formed to any shape that may be desirable for the stamped
surface of the metal component. In the example of FIG. 1, the first
surface 112 of the first stamping portion 110 is shown as a
substantially flat or linear surface.
[0012] The second stamping portion 120 is provided with a second
surface 122 to oppose the first surface 112 of the first stamping
portion 110 during stamping of the metal component, with the metal
component being positioned between the first surface 112 of the
first stamping portion 110 and the second surface 122 of the second
stamping portion 120. In various examples, the second surface 122
of the second stamping portion 120 includes a metal flow receiving
feature 124. The metal flow receiving feature 124 includes a
non-flat surface to attenuate an amount of metal flowing therein
during stamping of the metal component between the first stamping
portion 110 and the second stamping portion 120. In this regard,
the first surface 112 of the first stamping portion 110 produces a
desired shape, while any variations in the amount of metal that is
flowed as a result of the stamping is attenuated on the opposite
side of the metal component. In some examples, the amount of metal
flowing into the metal flow receiving feature 124 can vary based on
the stamping pressure, while the first surface 112 of the first
stamping portion produces a consistent amount of flow on the
stamped side of the metal component.
[0013] The first stamping portion 110 and the second stamping
portion 120 of the example system 100 may be formed of any of a
variety of materials. In one example, the first stamping portion
110 and the second stamping portion 120 are each formed of steel.
Generally, the first stamping portion 110 and the second stamping
portion 120 may be formed of a material having a hardness that is
greater than the hardness of the metal component to be stamped.
[0014] Referring now to FIG. 2, another example system for stamping
metal components 200 is illustrated. The example system 200 of FIG.
2 is similar to the example system 100 described above with
reference to FIG. 1 and includes a first stamping portion 210 and a
second stamping portion 220. The example system 200 of FIG. 2
includes a metal component 230 to be stamped. As illustrated in
FIG. 2, the metal component 230 may form a surface of an electronic
device, such as a laptop, for example. The example metal component
230 of FIG. 2 is provided with a surface feature 238 which may be,
for example, a finger recess to allow a user to open a closed
laptop. In this regard, the surface feature 238 should be smooth to
the touch of a user. It is noted that FIG. 2A illustrates a
completed (e.g., stamped) metal component 230, while FIG. 2B
illustrates a cross-sectional view of the component 230 before it
is stamped.
[0015] As with the example system 100 of FIG. 1, the first stamping
portion 210 of example system 200 of FIG. 2 is provided with a
first surface 212 formed to correspond to a stamped surface 232 of
the metal component 230 to be stamped. Thus, the first surface 212
is formed to the desired shape for the stamped surface 232 of the
metal component 230 illustrated in FIG. 2A. In this regard, the
first surface 212 of the first stamping portion 210 includes a
substantially flat portion.
[0016] The second stamping portion 220 is provided with a second
surface 222, and the metal component 230 is positioned between the
first surface 212 of the first stamping portion 210 and the second
surface 222 of the second stamping portion 220. As noted above, the
metal component 230 includes a stamped surface 232 to be stamped.
As illustrated in FIG. 2B, the stamped surface 232 of the metal
component 230 faces the first surface 212 of the first stamping
portion 210. The metal component further includes a non-stamped
surface 234 opposite the stamped surface 232. The non-stamped
surface 234 faces the second surface 222 of the second stamping
portion 220.
[0017] In the example system 200 of FIG. 2, the second surface 222
of the second stamping portion 220 includes a metal flow receiving
feature 224 which includes a non-flat surface. As noted above, the
non-flat surface of the metal flow receiving feature 224 allows
attenuation of the amount of metal flowing therein during stamping
of the metal component between the first stamping portion 210 and
the second stamping portion 220. In this regard, the first surface
212 of the first stamping portion 210 produces a desired shape
(e.g., the flat shape illustrated in FIG. 2), while any variations
in the amount of metal that is flowed as a result of the stamping
is attenuated on the opposite side of the metal component.
[0018] Referring now to FIGS. 3-5, various phases of the stamping
of the metal component 230 using the example system 200 of FIG. 2
are illustrated. As illustrated in FIGS. 3-5, the first stamping
portion 210 and the second stamping portion 220 are moved toward
each other until the stamping is complete. In various examples, the
completion of the stamping may occur when the first stamping
portion 210 and the stamping portion 220 are no longer in movement
relative to each other when a certain stamping pressure is applied.
In this regard, the level of stamping pressure may be determined by
any of a variety of factors including, but not limited to, the
material of the metal component 230, tool damage prevention,
accuracy, and smooth motion.
[0019] Referring first to FIG. 3, the example system 200 is
illustrated as a snapshot at a point at which the first stamping
portion 210 and the second stamping portion 220 both make contact
with the metal component 230. In the example of FIG. 3, at this
point, the first surface 212 of the first stamping portion 210 is
in contact with the metal component 230. At this point, the metal
component 230 may offer resistance to the relative movement of the
first stamping portion 210 and the second stamping portion 220, and
sufficient stamping pressure may be used to overcome the resistance
and continue to move the first stamping portion 210 and the second
stamping portion 220 towards each other.
[0020] Referring now to FIG. 4, the example system 200 is
illustrated as a snapshot at a point at which the first stamping
portion 210 and the second stamping portion 220 continue to move
toward each other and deform the metal component 230. As
illustrated in FIG. 4, the metal component 230, or the stamped
surface 232 thereof, is beginning to acquire the shape of the first
surface 212 of the first stamping portion 210.
[0021] Referring now to FIG. 5, the example system 200 is
illustrated as a snapshot at a point at which the first stamping
portion 210 and the second stamping portion 220 have stopped moving
toward each other. As noted above, this stoppage point may be
determined by the amount of stamping pressure applied. At this
stoppage point, the first surface 212 of the first stamping portion
210 forms a substantially identical surface on the stamped surface
232 of the metal component 230. At the same time, the metal flow
receiving feature 224 of the second surface 222 of the second
stamping portion 220 may accommodate any variations or
imperfections in the amount of metal flowing during the stamping
process.
[0022] In this regard, the non-linear or non-flat surface of the
metal flow receiving feature 224 provides regions in which excess
metal can flow during stamping. Similarly, the non-flat surface can
accommodate varying amounts of metal flowing with variations in
stamping pressure. For example, once a minimum level of stamping is
achieved to sufficiently form the stamped surface 232 of the metal
component 230, additional stamping pressure may result in
additional metal flowing into the non-flat metal flow receiving
feature 224 while maintaining the desired stamped surface 232.
Thus, the non-stamped surface 234 of the metal component may or may
not significantly match the second surface 222 of the second
stamping portion 220.
[0023] FIGS. 1-5 illustrate various examples of stamping systems
with a metal flow receiving feature corresponding to a non-stamped
surface of a metal component. In the example systems 100, 200
described above, the metal flow receiving feature 224 is
illustrated as a non-linear or non-flat surface, having a
non-linear cross-section, such as an arc. In other examples, the
metal flow receiving feature 224 may have any of a variety of other
non-linear or non-flat surfaces. In this regard, FIGS. 6 and 7
illustrate some example systems with different metal flow receiving
features 224.
[0024] Referring first to FIG. 6, the example system 600 includes a
first stamping portion 610, a second stamping portion 620 and a
metal component 630 being stamped therebetween. Similar to the
example systems described above, the first stamping portion 610 of
the example system 600 includes a first surface 612 formed to
correspond to a stamped surface 632 of the metal component 630.
[0025] The second stamping portion 620 is provided with a second
surface 622, and the metal component 630 is positioned between the
first surface 612 of the first stamping portion 610 and the second
surface 622 of the second stamping portion 620. The metal component
includes a stamped surface 632 facing the first surface 612 of the
first stamping portion 610 and a non-stamped surface 634, opposite
the stamped surface 632, and facing the second surface 622 of the
second stamping portion 620.
[0026] In the example system 600 of FIG. 6, the second surface 622
of the second stamping portion 620 includes a metal flow receiving
feature 624 which includes a non-flat surface. In the example
system 600 of FIG. 6, the metal flow receiving feature 624 is
provided with a waved formation. Viewed in three-dimensions, the
metal flow receiving feature 624 may include a series of crests and
troughs. During stamping, the crests may contact the metal
component 630 and transmit the stamping pressure onto the metal
component 630, while the troughs may provide space for a variable
amount of metal to flow into. Thus, the metal flow into the metal
flow receiving feature 624 may absorb any imperfections in the
stamping process, thereby producing a more uniform surface on the
stamped surface 232 of the metal component.
[0027] Referring next to FIG. 7, the example system 700 includes a
first stamping portion 710, a second stamping portion 720 and a
metal component 730 being stamped therebetween. Similar to the
example systems described above, the first stamping portion 710 of
the example system 700 includes a first surface 712 formed to
correspond to a stamped surface 732 of the metal component 730.
[0028] The second stamping portion 720 is provided with a second
surface 722, and the metal component 730 is positioned between the
first surface 712 of the first stamping portion 710 and the second
surface 722 of the second stamping portion 720. The metal component
includes a stamped surface 732 facing the first surface 712 of the
first stamping portion 710 and a non-stamped surface 734 opposite
the stamped surface 732 and facing the second surface 722 of the
second stamping portion 720.
[0029] In the example system 700 of FIG. 7, the second surface 722
of the second stamping portion 720 includes a metal flow receiving
feature 724 which includes a non-flat surface. In the example
system 700 of FIG. 7, the metal flow receiving feature 724 is
provided with a sawtooth pattern. During stamping, the sawtooth
pattern can simultaneously provide the force on the metal
components resulting from the stamping pressure and space for a
variable amount of metal to flow into. Thus, the metal flow into
the metal flow receiving feature 724 may absorb any imperfections
in the stamping process, thereby producing a more uniform surface
on the stamped surface 732 of the metal component.
[0030] Referring now to FIG. 8, a flow chart illustrating an
example method for stamping of metal components is provided. The
example method 800 includes positioning a metal component between a
first stamping portion and a second stamping portion (block 810).
In various examples, the metal component has a stamped surface to
be stamped and a non-stamped surface opposite the stamped surface.
Further, the first stamping portion has a first surface facing the
stamped surface of the metal component, and the second stamping
portion has a second surface facing the non-stamped surface of the
metal component. The second surface of the second stamping portion
includes a metal flow receiving feature. As described above,
various examples of the metal flow receiving feature may have a
non-flat feature, such as a wave formation or a sawtooth formation,
for example.
[0031] The example method 800 further includes stamping the metal
component between the first stamping portion and the second
stamping portion (block 820). As described above, the stamping
includes flowing material from the metal component into the metal
flow receiving feature. In this regard, the metal flow receiving
feature can absorb imperfections, thus allowing the stamped surface
to be substantially defect-free.
[0032] The foregoing description of various examples has been
presented for purposes of illustration and description. The
foregoing description is not intended to be exhaustive or limiting
to the examples disclosed, and modifications and variations are
possible in light of the above teachings or may be acquired from
practice of various examples. The examples discussed herein were
chosen and described in order to explain the principles and the
nature of various examples of the present disclosure and its
practical application to enable one skilled in the art to utilize
the present disclosure in various examples and with various
modifications as are suited to the particular use contemplated. The
features of the examples described herein may be combined in all
possible combinations of methods, apparatus, modules, systems, and
computer program products.
[0033] It is also noted herein that while the above describes
examples, these descriptions should not be viewed in a limiting
sense. Rather, there are several variations and modifications which
may be made without departing from the scope as defined in the
appended claims.
* * * * *