U.S. patent application number 16/868851 was filed with the patent office on 2021-11-11 for structures and methods for forming dynamic random-access devices.
This patent application is currently assigned to Applied Materials, Inc.. The applicant listed for this patent is Applied Materials, Inc.. Invention is credited to Sony Varghese.
Application Number | 20210351188 16/868851 |
Document ID | / |
Family ID | 1000005925993 |
Filed Date | 2021-11-11 |
United States Patent
Application |
20210351188 |
Kind Code |
A1 |
Varghese; Sony |
November 11, 2021 |
STRUCTURES AND METHODS FOR FORMING DYNAMIC RANDOM-ACCESS
DEVICES
Abstract
Disclosed are DRAM devices and methods of forming DRAM devices.
One non-limiting method may include providing a device, the device
including a plurality of angled structures formed from a substrate,
a bitline and a dielectric between each of the plurality of angled
structures, and a drain disposed along each of the plurality of
angled structures. The method may further include providing a
plurality of mask structures of a patterned masking layer over the
plurality of angled structures, the plurality of mask structures
being oriented perpendicular to the plurality of angled structures.
The method may further include etching the device at a non-zero
angle to form a plurality of pillar structures.
Inventors: |
Varghese; Sony; (Manchester,
MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Applied Materials, Inc. |
Santa Clara |
CA |
US |
|
|
Assignee: |
Applied Materials, Inc.
Santa Clara
CA
|
Family ID: |
1000005925993 |
Appl. No.: |
16/868851 |
Filed: |
May 7, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/10823 20130101;
H01L 21/26586 20130101; H01L 21/308 20130101; H01L 21/26513
20130101; H01L 27/10876 20130101; H01L 27/10891 20130101; H01L
21/3065 20130101; H01L 27/10855 20130101; H01L 27/10885 20130101;
H01L 27/10814 20130101 |
International
Class: |
H01L 27/108 20060101
H01L027/108; H01L 21/3065 20060101 H01L021/3065; H01L 21/308
20060101 H01L021/308; H01L 21/265 20060101 H01L021/265 |
Claims
1. A method, comprising: providing a device, comprising: a
plurality of angled structures formed from a substrate; a bitline
and a dielectric between each of the plurality of angled
structures; and a drain disposed along each of the plurality of
angled structures; providing a plurality of mask structures of a
patterned masking layer over the plurality of angled structures,
the plurality of mask structures being oriented perpendicular to
the plurality of angled structures; and etching the device at a
non-zero angle to form a plurality of pillar structures.
2. The method of claim 1, further comprising forming a wordline
along each of the plurality of pillar structures, wherein the
wordline wraps around each sidewall of each of the plurality of
pillar structures.
3. The method of claim 1, further comprising etching the plurality
of angled structures between each of the plurality of mask
structures to form the plurality of pillar structures.
4. The method of claim 1, further comprising orienting the
plurality of angled structures at a first non-zero angle, in a
first plane, relative to a perpendicular to a plane defined by a
top surface of the substrate of the device.
5. The method of claim 4, further comprising orienting the
plurality of pillar structures at a second non-zero angle, in a
second plane, relative to the perpendicular to the plane defined by
the top surface of the substrate of the device.
6. The method of claim 1, further comprising: forming an oxide fill
over the device including over the plurality of pillar structures;
forming a plurality of oxide trenches in the oxide fill to expose
one or more sidewalls of each of the plurality of pillar
structures; and forming a gate dielectric along the one or more
sidewalls of each of the plurality of pillar structures.
7. The method of claim 6, further comprising forming a gate metal
within each of the plurality of oxide trenches.
8. The method of claim 1, further comprising: forming a spacer over
the plurality of angled structures, wherein the spacer has an
opening at a bottom portion of a first sidewall of each of the
plurality of angled structures; forming a drain in each of the
plurality of angled structures by performing an ion implant to the
substrate, wherein the ion implant impacts the first sidewall
through the opening at the bottom portion of the first sidewall;
removing the spacer from the first sidewall; and forming the
bitline over the spacer along a bottom surface of each of a
plurality of trenches.
9. The method of claim 8, further comprising: forming the
dielectric over the bitline within each trench of the plurality of
trenches; and performing a second ion implant to form a source atop
each of the plurality of angled structures.
10. The method of claim 8, wherein performing the ion implant to
the substrate comprises implanting the substrate at a non-zero
angle of incidence with respect to a perpendicular extending from a
plane defined by a top surface of the substrate.
11. A dynamic random-access memory (DRAM) device, comprising: a
plurality of pillar structures formed from a substrate, wherein
each of the plurality of pillar structures is oriented at a first
non-zero angle relative to a perpendicular to a plane defined by a
top surface of the substrate, and wherein each of the plurality of
pillar structures is oriented at a second non-zero angle relative
to the perpendicular to the plane defined by the top surface of the
substrate; and a plurality of wordlines extending across the
plurality of pillar structures, wherein the plurality of wordlines
wrap entirely around each of the plurality of pillar
structures.
12. The DRAM device of claim 11, wherein each of the plurality of
pillar structures includes a plurality of sidewalls, and wherein
the plurality of wordlines extend along each of the plurality of
sidewalls.
13. The DRAM device of claim 11, further comprising a plurality of
bitlines formed atop the substrate, wherein the plurality of
bitlines is oriented perpendicular to the plurality of
wordlines.
14. The DRAM device of claim 11, further comprising a gate
dielectric disposed between the plurality of wordlines and the
plurality of pillar structures.
15. A method of forming a dynamic random-access memory (DRAM)
device, comprising: providing a device, comprising: a plurality of
angled structures formed from a substrate, the plurality of angled
structures oriented at a first non-zero angle relative to a
perpendicular to a top surface of the substrate; a bitline and a
dielectric between each of the plurality of angled structures; and
a drain disposed along a lower portion of each of the plurality of
angled structures; providing a plurality of mask structures of a
patterned masking layer over the plurality of angled structures,
the plurality of mask structures being oriented perpendicular to
the plurality of angled structures; etching the device at a second
non-zero angle to form a plurality of pillar structures; and
forming a plurality of wordlines along the plurality of pillar
structures, wherein the plurality of wordlines wrap entirely around
each of the plurality of pillar structures.
16. The method of claim 15, further comprising etching the
plurality of angled structures between each of the plurality of
mask structures to form the plurality of pillar structures.
17. The method of claim 15, further comprising: forming an oxide
fill over the device including over the plurality of pillar
structures; forming a plurality of oxide trenches in the oxide fill
to expose one or more sidewalls of each of the plurality of pillar
structures; forming a gate dielectric along the one or more
sidewalls of each of the plurality of pillar structures; and
forming a gate metal within each of the plurality of oxide
trenches.
18. The method of claim 15, further comprising: forming a spacer
over the plurality of angled structures, wherein the spacer has an
opening at a bottom portion of a first sidewall of each of the
plurality of angled structures; forming a drain in each of the
plurality of angled structures by performing an ion implant to the
substrate, wherein the ion implant impacts the first sidewall
through the opening at the bottom portion of the first sidewall;
removing the spacer from the first sidewall; and forming the
bitline over the spacer along a bottom surface of each of a
plurality of trenches.
19. The method of claim 18, further comprising: forming the
dielectric over the bitline within each trench of the plurality of
trenches; and performing a second ion implant to form a source atop
each of the plurality of angled structures.
20. The method of claim 18, further comprising performing the ion
implant to the substrate comprises implanting the substrate at a
non-zero angle of incidence with respect to a perpendicular
extending from a plane defined by a top surface of the substrate.
Description
FIELD
[0001] The present embodiments relate to semiconductor devices, and
more particularly, to 4F.sup.2 dynamic random-access devices and
approaches for forming.
BACKGROUND
[0002] As dynamic random-access memory (DRAM) devices scale to
smaller dimensions, an increasing emphasis is placed on patterning
for forming three dimensional structures, including trenches for
storage nodes as well as access transistors. In current DRAM
devices, transistors may be formed using narrow and tall, vertical
semiconductor fin structures, often made from monocrystalline
silicon. In accordance with current trends, the aspect ratio of
such fin structures, meaning the height (depth) of a fin divided by
the spacing between adjacent fins, may reach 30:1 or more in the
coming years.
[0003] In an effort to continue scaling smaller, 4F.sup.2 DRAM
devices have been developed. However, current 4F.sup.2 DRAM devices
have off-leakage current issues for vertical channel transistors.
The off-leakage current results from the floating body effect
caused by hole accumulation into the body of the 4F.sup.2 DRAM
device. Furthermore, significant challenges exist for creating an
asymmetric drain for node since the area of silicon has been
reduced. With respect to these and other considerations, the
present disclosure is provided.
SUMMARY OF THE DISCLOSURE
[0004] The Summary is provided to introduce a selection of concepts
in a simplified form, the concepts further described below in the
Detailed Description. The Summary is not intended to identify key
features or essential features of the claimed subject matter, nor
is the Summary intended as an aid in determining the scope of the
claimed subject matter.
[0005] In some approaches, a method includes providing a device,
the device including a plurality of angled structures formed from a
substrate, a bitline and a dielectric between each of the plurality
of angled structures, and a drain disposed along each of the
plurality of angled structures. The method may further include
providing a plurality of mask structures of a patterned masking
layer over the plurality of angled structures, the plurality of
mask structures being oriented perpendicular to the plurality of
angled structures. The method may further include etching the
device at a non-zero angle to form a plurality of pillar
structures.
[0006] In some approaches, a dynamic random-access memory (DRAM)
device may include a plurality of pillar structures formed from a
substrate, wherein each of the plurality of pillar structures is
oriented at a first non-zero angle relative to a perpendicular to a
plane defined by a top surface of the substrate, and wherein each
of the plurality of pillar structures is oriented at a second
non-zero angle relative to the perpendicular to the plane defined
by the top surface of the substrate. The DRAM device may further
include a plurality of wordlines extending across the plurality of
pillar structures, wherein the plurality of wordlines wrap entirely
around each of the plurality of pillar structures.
[0007] In some approaches, a method of forming a dynamic
random-access memory (DRAM) device may include providing a device,
the device having a plurality of angled structures formed from a
substrate, the plurality of angled structures oriented at a first
non-zero angle relative to a perpendicular to a top surface of the
substrate. The device may further include a bitline and a
dielectric between each of the plurality of angled structures, and
a drain disposed along a lower portion of each of the plurality of
angled structures. The method may further include providing a
plurality of mask structures of a patterned masking layer over the
plurality of angled structures, the plurality of mask structures
being oriented perpendicular to the plurality of angled structures.
The method may further include etching the device at a second
non-zero angle to form a plurality of pillar structures, and
forming a plurality of wordlines along the plurality of pillar
structures, wherein the plurality of wordlines wrap entirely around
each of the plurality of pillar structures.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The accompanying drawings illustrate exemplary approaches of
the disclosed embodiments so far devised for the practical
application of the principles thereof.
[0009] FIG. 1 is a perspective view of a device including a
substrate and a plurality of angled structures in accordance with
embodiments of the present disclosure.
[0010] FIG. 2 is a perspective view of the device following an etch
process in accordance with embodiments of the present
disclosure.
[0011] FIG. 3 is a perspective view of the device following a
dielectric layer deposition and recess process in accordance with
embodiments of the present disclosure.
[0012] FIG. 4 is a perspective view of the device following removal
of a portion of a spacer in accordance with embodiments of the
present disclosure.
[0013] FIG. 5 is a perspective view of the device during an ion
implant in accordance with embodiments of the present
disclosure.
[0014] FIG. 6 is a perspective view of the device after formation
of a plurality of drains in accordance with embodiments of the
present disclosure.
[0015] FIG. 7 is a perspective view of the device after removal of
the spacer in accordance with embodiments of the present
disclosure.
[0016] FIG. 8 is a perspective view of the device after a bitline
deposition and recess process in accordance with embodiments of the
present disclosure.
[0017] FIG. 9 is a perspective view of the device after a
dielectric fill and planarization process in accordance with
embodiments of the present disclosure.
[0018] FIG. 10 is a perspective view of the device during a second
ion implant in accordance with embodiments of the present
disclosure.
[0019] FIG. 11 is a perspective view of the device after formation
of a patterned masking layer in accordance with embodiments of the
present disclosure.
[0020] FIG. 12 is a side view of the device during an etch process
in accordance with embodiments of the present disclosure.
[0021] FIG. 13 is a perspective view of the device following
formation of plurality of pillar structures in accordance with
embodiments of the present disclosure.
[0022] FIG. 14 is a perspective view of the device after an oxide
fill in accordance with embodiments of the present disclosure.
[0023] FIG. 15 is a perspective view of the device following
formation of a plurality of oxide trenches in accordance with
embodiments of the present disclosure.
[0024] FIG. 16 is a perspective view of the device following
formation of a gate oxide along the plurality of pillar structures
in accordance with embodiments of the present disclosure.
[0025] FIG. 17 is a perspective view of the device following
formation of a gate metal within the oxide trenches in accordance
with embodiments of the present disclosure.
[0026] FIG. 18 is a perspective view of the device of FIG. 17 with
the oxide fill removed in accordance with embodiments of the
present disclosure.
[0027] FIG. 19 is a perspective view of the device following
removal of the gate dielectric from the pillar structures in
accordance with embodiments of the present disclosure.
[0028] FIG. 20 is a top view of the device of FIG. 19 in accordance
with embodiments of the present disclosure.
[0029] FIG. 21 is a perspective view of the device following
formation of a dielectric fill and a plurality of drains, in
accordance with embodiments of the present disclosure.
[0030] FIG. 22 is a perspective view of the device following
formation of a plurality of capacitors along the plurality of
drains, in accordance with embodiments of the present
disclosure.
[0031] FIG. 23 is a side cross-sectional view of the plurality of
pillar structures and the wordlines, in accordance with embodiments
of the present disclosure.
[0032] The drawings are not necessarily to scale. The drawings are
merely representations, not intended to portray specific parameters
of the disclosure. The drawings are intended to depict exemplary
embodiments of the disclosure, and therefore are not be considered
as limiting in scope. In the drawings, like numbering represents
like elements.
[0033] Furthermore, certain elements in some of the figures may be
omitted, or illustrated not-to-scale, for illustrative clarity. The
cross-sectional views may be in the form of "slices", or
"near-sighted" cross-sectional views, omitting certain background
lines otherwise visible in a "true" cross-sectional view, for
illustrative clarity. Furthermore, for clarity, some reference
numbers may be omitted in certain drawings.
DETAILED DESCRIPTION
[0034] Methods and devices in accordance with the present
disclosure will now be described more fully hereinafter with
reference to the accompanying drawings, where embodiments of the
methods are shown. The methods and devices may be embodied in many
different forms and are not to be construed as being limited to the
embodiments set forth herein. Instead, these embodiments are
provided so the disclosure will be thorough and complete, and will
fully convey the scope of the system and method to those skilled in
the art.
[0035] The present embodiments provide novel devices and methods
for forming such devices, such as transistors, formed from
semiconductor fin structures. These approaches may be especially
applicable to formation of DRAM devices, while other devices may
also be formed according to the embodiments of the disclosure.
Various non-limiting embodiments are particularly useful for
implementation where the width of fin structures or pitch between
fin structures is less than 50 nm, and in some embodiments, 20 nm
or less. Embodiments herein provide new integrations to effectively
remove accumulated holes, which requires lateral doping to drain
with high concentration. By providing an asymmetrical wraparound
gate, operating range is increased, which provides a wider Ioff
compared to Ion. The wraparound gate is beneficial because
parasitic currents from other devices near the transistor make
turning off the transistor more difficult.
[0036] Turning now to FIG. 1, there is shown a device 100, such as
a dynamic random-access memory (DRAM) device, according to
embodiments of the disclosure. The device 100 may include a
plurality of angled structures 102 separated by a plurality of
trenches 104. The plurality of angled structures 102 may be formed
by etching a substrate 101, for example, using an angled ion etch.
In exemplary embodiments, the plurality of angled structures 102
may be an array of fin structures having a length extending along a
first direction (such as parallel to the z-axis of the Cartesian
coordinate system shown), a height extending along a second
direction (y-axis), and a width extending along a third direction
(x-axis). According to various embodiments of the disclosure, the
angled structures 102 are monolithically formed with the same
material as the substrate 101. As will be appreciated, the device
100 may be used to make transistors and arrays of devices, such as
DRAM arrays, having superior properties, including more uniformity
in performance between devices, higher device yield, and so
forth.
[0037] As shown in FIG. 1, the device 100 may include a first
spacer layer 108 conformally formed over the substrate 101,
including over all exposed surfaces of the angled structures 102
and a bottom surface 109 of each trench 104. The first spacer layer
108 may be deposited over a first sidewall 110 and a second
sidewall 112 of each of the angled structures 102. As will be
described in greater detail herein, each angled structure 102 is
oriented at a first non-zero angle (.beta.), in a first plane (x-y
plane), relative to a perpendicular 126 from a plane (e.g., x-z
plane) defined by a top surface 111 of the substrate 101. As shown,
the perpendicular 126 may generally be parallel to the y-axis.
Advantageously, the angled structures 102 are slanted or tilted
(e.g., along the x-axis) so the second sidewall 112 extends
partially or fully over an adjacent trench 104.
[0038] Next, as shown in FIG. 2, the first spacer layer 108 may be
removed from the angled structures 102, including from the first
sidewall 110 and from a top surface 118 thereof. In some
embodiments, the first spacer layer 108 may be etched, for example,
using a vertical reactive ion etch (RIE) process 120. Due to the
angle of the angled structures 102 extending over each trench 104,
the first spacer layer 108 may not be removed by the vertical RIE
120 from the bottom surface 109 of each trench 104 or from a base
122 between the first sidewall 110 and the bottom surface 109. As
shown, a footing 124 of the first spacer layer 108, which extends
partially up the first sidewall 110, may remain in place.
[0039] It will be appreciated that the presence and/or size of the
footing 124 may be influenced by the non-zero angle (.beta.) of the
angled structures 102 and/or the angle of the RIE 120 relative to
the perpendicular 126. For example, a larger/greater non-zero angle
of incidence between the second sidewall 112 and the perpendicular
126 means the angled structures 102 extend farther over the
trenches 104, thus preventing the vertical RIE from reaching more
of the first spacer layer 108 along the trenches 104 and the first
sidewalls 110.
[0040] As depicted in FIG. 3, a dielectric layer 130 may be formed
over the first spacer layer 108 along the bottom surface 109 of
each of the trenches 104. In some embodiments, the dielectric layer
130 may be deposited and then recessed to a desired depth/height.
As shown, the dielectric layer 130 extends partially up the first
and second sidewalls 110, 112 to a point above the footing 124 of
the first spacer layer 108. Although non-limiting, the dielectric
layer 130 may be silicon oxide, nitride, or other type of
film/material.
[0041] As shown in FIG. 4, a second spacer layer 132 may then be
formed over the angled structures 102. The second spacer layer 132
may extend along the first and second sidewalls 110, 112 to a top
surface 134 of the dielectric layer 130. Once the dielectric layer
130 is removed, as demonstrated in FIG. 5, an opening 135 at a
bottom portion 136 of each first sidewall 110 may be present. The
opening 135 may separate the footing 124 of the first spacer layer
108 from the second spacer layer 132. A subsequent ion implant 140
to the device 100 will impact the first sidewalls 110 through each
opening 135, resulting in a drain 142 being formed in each angled
structure 102, as shown in FIG. 6. The ion implant 140 may be an
epi plasma doping (PLAD) or beamline implant.
[0042] Although shown as a single implant, it will be appreciated
that the ion implant 140 may include a series of multiple implants.
For example, in some non-limiting embodiments, the ion implant 140
may first include a deep phosphorous implant to isolate Pwell
followed by boron implant for the Pwell, e.g., for array access
devices. A voltage for the boron implant may then be raised to
reduce row hammer, which is an issue seen in DRAM devices due to
frequent turning on or off of adjacent cells, followed by a
source/drain (S/D) P implant and a S/D As implant. Next, a Ge
implant into poly silicon may be performed to form a storage node
contact, while also reducing interface resistance by amorphization.
A blanket P implant for NMOS may then be performed, wherein PMOS
may be counter doped at a later stage. Finally, the device 100 may
be heated, for example, by a 1000C rapid thermal anneal (RTA). In
some non-limiting embodiments, the RTA may be performed for
approximately 10 seconds in 1% O2 to activate dopants.
[0043] Next, as shown in FIG. 7, the second spacer layer 132 may
then be removed from the first sidewalls 110 and from the top
surfaces 118 of each angled structure 102. In some embodiments, the
first spacer layer 108 may remain atop the bottom surface 109 of
each trench 104. The footing 124 (FIG. 6) of the first spacer layer
108 may be removed, however. As shown in FIG. 8, a bitline 144 may
be formed over the first spacer layer 108 within each trench 104.
In some embodiments, the bitline 144 may be a low resistance
material, such as tungsten, titanium nitride, titanium, Ruthenium,
Cobalt Molybdenum etc., which is deposited over the device 100 and
recessed to a desired thickness/height within the trenches 104. As
shown, the bitline 144 may extend partially up the first and second
sidewalls 110, 112. However, a portion of each drain 142 may remain
uncovered by the bitline 144 in some embodiments. Furthermore, a
portion of the first spacer layer 108 remains exposed along the
second sidewalls 112.
[0044] As shown in FIG. 9, a first dielectric 148 may be deposited
over the device 100, including over the bitline 144 within each of
the trenches 104 (FIG. 8). The first dielectric 148 may then be
planarized to a desired height, for example, planar or
substantially planar with the top surface 118 of the angled
structures 102. As shown in FIG. 10, second ion implant 150 may
then be performed to form a source layer 152 atop each of the
angled structures 102. In some embodiments, the second ion implant
150 may be a low-dose source/drain Phosphorous or Arsenic
implant.
[0045] As shown in FIG. 11, a patterned masking layer 153 may be
formed over the device 100, including over the angled structures
102, the first dielectric 148, and the source layer 152. As shown,
the patterned masking layer 153 may include a plurality of mask
structures 154 extending perpendicular to the angled structures
102, e.g., along the x-direction. Each of the mask structures 154
may include a first sidewall 155, a second sidewall 156, and a top
surface 157.
[0046] As shown in FIG. 12, the device 100 may then receive an etch
process 158 delivered at a non-zero angle with respect to a plane
defined by the first and second sidewalls 155, 156 of the mask
structures 154. The etch process 158 impacts the first dielectric
148 between each of the mask structures 154 to form a set of
trenches (not shown) in the device 100. In some embodiments, the
etch process 158 extends into the first dielectric 148 in an area
beneath each of the mask structures 154. Furthermore, the etch
process 158 may cut through the angled structures 102. In some
embodiments, the etch process 158 is selective to the bitline
144.
[0047] Once the etch process 158 is complete, a plurality of pillar
structures 160 are formed, as shown in FIG. 13. The pillar
structures 160 may generally be angled or slanted in the x and -z
directions. Said another way, each of the pillar structures 160 is
oriented at a second non-zero angle (.PHI.), in a second plane (y-z
plane) relative to the perpendicular 126 extending from the top
surface 111 of the substrate 101. As shown, the perpendicular 126
may generally be parallel to the y-axis. In some embodiments, the
pillar structures 160 may be uniformly sized and spaced with
respect to one another. For example, the pillar structures 160 may
be arranged in a first series of rows aligned in the x-direction,
and in a second series of rows aligned in the z-direction. Although
not shown, it will be appreciated that the bitlines 144 and the
drains 142 may be present atop the substrate 101. Additionally, the
source layer 152 may be present atop each of the pillar structures
160.
[0048] As shown in FIG. 14, an oxide fill 162 is formed over the
device 100 and planarized to expose the source layer 152 atop each
of the pillar structures 160. A patterned mask (not shown) may then
be formed over the oxide fill 162, and a plurality of oxide
trenches 163 formed in the device 100, as shown in FIG. 15. The
oxide trenches 163 may generally extend between the pillar
structures 160, e.g., along the x-direction. In some embodiments,
the oxide trenches 163 may be formed to expose one or more
sidewalls 164 of the pillar structures 160.
[0049] As shown in FIG. 16, a gate oxide or dielectric 165 may be
formed along the exposed sidewalls 164 of the pillar structures
160. In some embodiments, the gate dielectric 165 may be formed by
a deposition and etch back process. A gate metal 161 may then be
formed within the oxide trenches 163, as shown in FIG. 17, to form
a series of wordlines 168. The gate metal 161 may be formed over
the gate dielectric 165. In some embodiments, the gate metal 161 of
the wordline 168 may be a low-resistance material, such as
tungsten, titanium nitride, titanium, ruthenium, cobalt molybdenum,
etc. As shown, the gate metal 161 of the wordlines 168 may be
deposited and then removed (e.g., etched) to a desired
height/thickness below a plane defined by a top surface 169 of the
oxide fill 162. As shown, the wordlines 168 may extend partially up
the plurality of pillar structures 160. Furthermore, the wordlines
168 may run parallel to the bitlines 144. FIG. 18 demonstrates the
device 100 without the presence of the oxide fill 162. As shown,
the gate dielectric 165 may not be formed along one or more
surfaces 167 covered by the oxide fill 162.
[0050] Next, as shown in FIGS. 19-20, the oxide fill 162 and a
portion of the gate dielectric 165 may be removed from the device
100 following formation of the wordlines 168. As shown, the
wordlines 168 may be generally vertically oriented, while the
pillar structures 160 lean in the x and -z directions. In some
embodiments, the gate dielectric 165 may remain between the
wordlines 168 and the pillar structures 160. Once complete, the
device 100 may be an improved 4F.sup.2 DRAM device having bitlines
144 tucked under the tilted/angled pillar structures 160 and the
wordlines 168 present along each sidewall surface of each pillar
structure 160, as will be described in greater detail below.
[0051] As shown in FIG. 21, a dielectric fill 174 is formed over
the device 100, and a plurality of drains 175 are formed therein.
As shown, the drains 175 connect to corresponding pillar structures
160. A portion of the device 100 has been removed to better depict
connection between the drains 175 and the pillar structures 160, as
well as the wordlines 168 wrapped around the pillar structures 160.
Finally, as shown in FIG. 22, the dielectric fill 174 may be
removed and a capacitor layer 177 formed along each of the drains
175.
[0052] Turning now to FIG. 23, a cross-sectional view of the device
100 according to embodiments of the present disclosure will be
described in greater detail. It will be appreciated that not all
components of the device 100 are shown for ease of viewing. As
shown, the device 100 may include the plurality of pillar
structures 160 separated by trenches 180. The pillar structures 160
generally extend vertically, at an angle in two directions (e.g.,
the x-direction and the z-direction). Each of the pillar structures
160 may be defined by a first sidewall 181, a second sidewall 182,
a third sidewall 183, and a fourth sidewall (not shown), which is
opposite the third sidewall 183. Although each of the pillar
structures 160 is generally shown as a cuboid, it will be
appreciated that other shapes may be possible in alternative
embodiments.
[0053] Due to the angle and thickness (e.g., along the x-direction)
of the plurality of pillar structures 160, each second sidewall 182
may extend over an adjacent trench 180. Furthermore, each bitline
144 may be tucked under the pillar structures 160, while the drains
(not shown) can be doped by a vertical implant and/or a line of
sight angled implant. In some embodiments, a phosphorous implant
may be performed before or after fin etching to form wells in the
device 100.
[0054] As further shown, the wordlines 168 may generally extend
perpendicular to the bitlines 144 and parallel to the trenches 180.
The wordlines 168 wrap around each of the pillar structures 160
such that the wordlines 168 extend along each of the first sidewall
181, the second sidewall 182, the third sidewall 183, and the
fourth sidewall. In some embodiments, the gate dielectric 165 (not
shown) is disposed between each of the wordlines 168 and the
corresponding pillar structures 160 intersected by the wordlines
168. In this embodiment, the wordlines 168 are recessed below a top
surface 186 of the pillar structures 160. As shown, due to the
angle of the pillar structures 160, each wordline 168 may impact
and/or cover the first sidewall 181 along an upper portion of the
pillar structures 160, and may impact and/or cover the second
sidewall 182 along a lower portion of the pillar structure 160.
Said another way, the wordlines 168 may be present only along the
upper portion of the first sidewall 181 of the pillar structures
160, but not along the lower portion of the first sidewall 181 of
the pillar structures 160. Inversely, the wordlines 168 may be
present only along the lower portion of the second sidewall 182 of
the pillar structures 160, but not along the upper portion of the
second sidewall 182 of the pillar structures 160. Similarly, due to
the angle of the pillar structures 160, the wordlines 168 may be
present more towards the upper portion of the third sidewall 183
and more towards the lower portion of the fourth surface. Although
non-limiting, the upper and lower portions of each pillar structure
160 may be defined relative to a midpoint 188 generally extending
halfway up each pillar structure 160.
[0055] In view of the foregoing, at least the following advantages
are achieved by the embodiments disclosed herein. A first advantage
is the elimination or reduction in hole accumulation into the body
of the device due to the floating body effect, by providing a path
for the holes. A second advantage is the reduction of off-leakage
current, e.g., for vertical channel transistors. A third advantage,
due to the wraparound wordline gates, is a wider Ioff compared to
Ion.
[0056] In various embodiments, design tools can be provided and
configured to create the datasets used to pattern the semiconductor
layers of the device 100, e.g., as described herein. For example,
data sets can be created to generate photomasks used during
lithography operations to pattern the layers for structures as
described herein. Such design tools can include a collection of one
or more modules and can also be comprised of hardware, software or
a combination thereof. Thus, for example, a tool can be a
collection of one or more software modules, hardware modules,
software/hardware modules or any combination or permutation
thereof. As another example, a tool can be a computing device or
other appliance running software, or implemented in hardware.
[0057] As used herein, a module might be implemented utilizing any
form of hardware, software, or a combination thereof. For example,
one or more processors, controllers, ASICs, PLAs, logical
components, software routines or other mechanisms might be
implemented to make up a module. In implementation, the various
modules described herein might be implemented as discrete modules
or the functions and features described can be shared in part or in
total among one or more modules. In other words, as would be
apparent to one of ordinary skill in the art after reading this
description, the various features and functionality described
herein may be implemented in any given application and can be
implemented in one or more separate or shared modules in various
combinations and permutations. Although various features or
elements of functionality may be individually described or claimed
as separate modules, one of ordinary skill in the art will
understand these features and functionality can be shared among one
or more common software and hardware elements.
[0058] The term "substrate" as used herein is intended to include a
semiconductor substrate, a semiconductor epitaxial layer deposited
or otherwise formed on a semiconductor substrate and/or any other
type of semiconductor body, and all such structures are
contemplated as falling within the scope of the present
embodiments. For example, the semiconductor substrate may comprise
a semiconductor wafer (e.g., silicon, SiGe, or an SOI wafer) or one
or more die on a wafer, and any epitaxial layers or other type
semiconductor layers formed there over or associated therewith. A
portion or entire semiconductor substrate may be amorphous,
polycrystalline, or single-crystalline. In addition to the
aforementioned types of substrates, the semiconductor substrate
employed in the present embodiments may also comprise a hybrid
oriented (HOT) semiconductor substrate having surface regions of
different crystallographic orientation. The semiconductor substrate
may be doped, undoped, or contain doped regions and undoped regions
therein. The semiconductor substrate may contain regions with
strain and regions without strain therein, or contain regions of
tensile strain and compressive strain.
[0059] For the sake of convenience and clarity, terms such as
"top," "bottom," "upper," "lower," "vertical," "horizontal,"
"lateral," and "longitudinal" will be used herein to describe the
relative placement and orientation of components and their
constituent parts as appearing in the figures. The terminology will
include the words specifically mentioned, derivatives thereof, and
words of similar import.
[0060] The use of "including," "comprising," or "having" and
variations thereof herein is meant to encompass the items listed
thereafter and equivalents thereof as well as additional items.
Accordingly, the terms "including," "comprising," or "having" and
variations thereof are open-ended expressions and can be used
interchangeably herein.
[0061] The phrases "at least one", "one or more", and "and/or", as
used herein, are open-ended expressions that are both conjunctive
and disjunctive in operation. For example, each of the expressions
"at least one of A, B and C", "at least one of A, B, or C", "one or
more of A, B, and C", "one or more of A, B, or C" and "A, B, and/or
C" means A alone, B alone, C alone, A and B together, A and C
together, B and C together, or A, B and C together.
[0062] All directional references (e.g., proximal, distal, upper,
lower, upward, downward, left, right, lateral, longitudinal, front,
back, top, bottom, above, below, vertical, horizontal, radial,
axial, clockwise, and counterclockwise) are only used for
identification purposes to aid the reader's understanding of the
present disclosure, and do not create limitations, particularly as
to the position, orientation, or use of this disclosure. Connection
references (e.g., attached, coupled, connected, and joined) are to
be construed broadly and may include intermediate members between a
collection of elements and relative movement between elements
unless otherwise indicated. As such, connection references do not
necessarily infer that two elements are directly connected and in
fixed relation to each other.
[0063] As used herein, an element or operation recited in the
singular and proceeded with the word "a" or "an" is to be
understood as including plural elements or operations, until such
exclusion is explicitly recited. Furthermore, references to "one
embodiment" of the present disclosure are not intended as limiting.
Additional embodiments may also incorporate the recited
features.
[0064] Furthermore, the terms "substantial" or "substantially," as
well as the terms "approximate" or "approximately," can be used
interchangeably in some embodiments, and can be described using any
relative measures acceptable by one of ordinary skill in the art.
For example, these terms can serve as a comparison to a reference
parameter, to indicate a deviation capable of providing the
intended function. Although non-limiting, the deviation from the
reference parameter can be, for example, in an amount of less than
1%, less than 3%, less than 5%, less than 10%, less than 15%, less
than 20%, and so on.
[0065] Still furthermore, one of ordinary skill will understand
when an element such as a layer, region, or substrate is referred
to as being formed on, deposited on, or disposed "on," "over" or
"atop" another element, the element can be directly on the other
element or intervening elements may also be present. In contrast,
when an element is referred to as being "directly on," "directly
over" or "directly atop" another element, no intervening elements
are present.
[0066] As used herein, "depositing" and/or "deposited" may include
any now known or later developed techniques appropriate for the
material to be deposited including but not limited to, for example:
chemical vapor deposition (CVD), low-pressure CVD (LPCVD),
plasma-enhanced CVD (PECVD), semi-atmosphere CVD (SACVD) and high
density plasma CVD (HDPCVD), rapid thermal CVD (RTCVD), ultra-high
vacuum CVD (UHVCVD), limited reaction processing CVD (LRPCVD),
metal-organic CVD (MOCVD), sputtering deposition, ion beam
deposition, electron beam deposition, laser assisted deposition,
thermal oxidation, thermal nitridation, spin-on methods, physical
vapor deposition (PVD), atomic layer deposition (ALD), chemical
oxidation, molecular beam epitaxy (MBE), plating, evaporation.
[0067] While certain embodiments of the disclosure have been
described herein, the disclosure is not limited thereto, as the
disclosure is as broad in scope as the art will allow and the
specification may be read likewise. Therefore, the above
description is not to be construed as limiting. Instead, the above
description is merely as exemplifications of particular
embodiments. Those skilled in the art will envision other
modifications within the scope and spirit of the claims appended
hereto.
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