U.S. patent application number 16/336650 was filed with the patent office on 2021-10-21 for organic light emitting diode display.
This patent application is currently assigned to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.. The applicant listed for this patent is WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.. Invention is credited to Shijuan Yi, Shang Zhou.
Application Number | 20210327992 16/336650 |
Document ID | / |
Family ID | 1000005739890 |
Filed Date | 2021-10-21 |
United States Patent
Application |
20210327992 |
Kind Code |
A1 |
Zhou; Shang ; et
al. |
October 21, 2021 |
ORGANIC LIGHT EMITTING DIODE DISPLAY
Abstract
An organic light emitting diode (OLED) display including a
display body and a chip encapsulation board is provided. The chip
encapsulation board is electrically connected to the display body
through a connecting component; wherein an edge of the display body
is provided with a groove, and a connection of the connecting
component and the display body is located at a sidewall of the
display body defining of the groove.
Inventors: |
Zhou; Shang; (Wuhan, CN)
; Yi; Shijuan; (Wuhan, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY
CO., LTD. |
Wuhan |
|
CN |
|
|
Assignee: |
WUHAN CHINA STAR OPTOELECTRONICS
SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Wuhan
CN
|
Family ID: |
1000005739890 |
Appl. No.: |
16/336650 |
Filed: |
March 15, 2019 |
PCT Filed: |
March 15, 2019 |
PCT NO: |
PCT/CN2019/078307 |
371 Date: |
March 26, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/3276 20130101;
H01L 27/323 20130101 |
International
Class: |
H01L 27/32 20060101
H01L027/32 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 21, 2018 |
CN |
201811575069.1 |
Claims
1. An organic light emitting diode (OLED) display, wherein the OLED
display comprises: a display body; and a chip encapsulation board,
the chip encapsulation board being electrically connected to the
display body through a connecting component; wherein an edge of the
display body is provided with a groove, and a connection of the
connecting component and the display body is located at a sidewall
of the display body defining the groove, the groove is located at a
top or a bottom of the display body, and the chip encapsulation
board is a chip on film (COF) board, a chip on glass (COG) board or
a chip on plastic (COP) board.
2. The OLED display according to claim 1, wherein a first bending
region is formed on the connecting component at a position near the
connection of the connecting component and the display body, and
the first bending region is located in the groove.
3. The OLED display according to claim 2, wherein the connecting
component is bent toward a back face of the display body along the
first bending region, the chip encapsulation board is located at
the back face of the display body, a projection of the groove along
a thickness direction of the display body encloses a projection of
a bending apex of the connecting component along the thickness
direction of the display body.
4. The OLED display according to claim 1, wherein the display body
comprises a first backboard, a display panel disposed on a front
face of the first backboard, and a touch layer disposed on the
display panel, wherein the touch layer is an external touch
layer.
5. The OLED display according to claim 4, wherein the display body
is electrically connected to a first flexible circuit board which
is used for driving a touch unit of the touch layer, and a
connection of the first flexible circuit board and the display body
is also located at the sidewall of the display body defining the
groove.
6. The OLED display according to claim 5, wherein a second bending
region is formed on the first flexible circuit board at a position
near the connection of the first flexible circuit board and the
display body, and the second bending region is located in the
groove.
7. The OLED display according to claim 6, wherein the first
flexible circuit board is bent toward a back face of the display
body along the second bending region, the first flexible circuit
board is located at a back face of the first backboard, a
projection of the groove along a thickness direction of the display
body encloses a projection of a bending apex of the first flexible
circuit board along the thickness direction of the display
body.
8. The OLED display according to claim 1, wherein the display body
is mounted with a sensor located in the groove.
9. An organic light emitting diode (OLED) display, wherein the OLED
display comprises: a display body; and a chip encapsulation board,
the chip encapsulation board being electrically connected to the
display body through a connecting component; wherein an edge of the
display body is provided with a groove, and a connection of the
connecting component and the display body is located at a sidewall
of the display body defining of the groove.
10. The OLED display according to claim 9, wherein a first bending
region is formed on the connecting component at a position near the
connection of the connecting component and the display body, and
the first bending region is located in the groove.
11. The OLED display according to claim 10, wherein the connecting
component is bent toward a back face of the display body along the
first bending region, the chip encapsulation board is located at
the back face of the display body, a projection of the groove along
a thickness direction of the display body encloses a projection of
a bending apex of the connecting component along the thickness
direction of the display body.
12. The OLED display according to claim 9, wherein the display body
comprises a first backboard, a display panel disposed on a front
face of the first backboard, and a touch layer disposed on the
display panel, wherein the touch layer is an external touch
layer.
13. The OLED display according to claim 12, wherein the display
body is electrically connected to a first flexible circuit board
which is used for driving a touch unit of the touch layer, and a
connection of the first flexible circuit board and the display body
is also located at the sidewall of the display body defining the
groove.
14. The OLED display according to claim 13, wherein a second
bending region is formed on the first flexible circuit board at a
position near the connection of the first flexible circuit board
and the display body, and the second bending region is located in
the groove.
15. The OLED display according to claim 14, wherein the first
flexible circuit board is bent toward a back face of the display
body along the second bending region, the first flexible circuit
board is located at a back face of the first backboard, a
projection of the groove along a thickness direction of the display
body encloses a projection of a bending apex of the first flexible
circuit board along the thickness direction of the display
body.
16. The OLED display according to claim 9, wherein the groove is
located at a top or a bottom of the display body.
17. The OLED display according to claim 16, wherein the display
body is mounted with a sensor located in the groove.
18. The OLED display according to claim 9, wherein the chip
encapsulation board is a chip on film (COF) board, a chip on glass
(COG) board or a chip on plastic (COP) board.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority of International
Application No. PCT/CN2019/078307, filed on 2019 Mar. 15, which
claims priority to Chinese Application No. 201811575069.1, filed on
2018 Dec. 21. The entire disclosures of each of the above
applications are incorporated herein by reference.
BACKGROUND OF INVENTION
Field of Invention
[0002] The present invention relates to the field of display
technologies, and in particular, to an organic light emitting diode
display.
Description of Prior Art
[0003] Organic light emitting diode (OLED) displays are regarded as
next-generation displays because of their energy savings and
portability. Compared with liquid crystal display technology, they
have advantages of high contrast, high color gamut, large viewing
angles and energy saving, and have broad application prospects in
the mobile phone market. Comprehensive screen technology is a
hotspot and a difficult point in the smart phone industry.
Conventional chip encapsulation technologies in the comprehensive
screen technology include chip on glass (COG), chip on film (COF),
and chip on plastic (COP) technologies. COG technology integrates
chips into glass backplanes; COF technology puts chips on glass
backplanes on screen lines; COP technology is a unique
encapsulating process for flexible OLEDs, because the backplane is
not glass, but a flexible bendable material, the backplane is
directly bent back on the basis of COG, and the breadth of the
screen frame is further reduced.
[0004] However, no matter what kind of chip encapsulation
technology is, the connection between a screen display region and a
chip encapsulation board will increase the border width of the
non-display region and reduce the screen-to-body ratio, thereby
affecting the visual effect and experience.
Technical Problem
[0005] The connection between the screen display area and the chip
encapsulation board will increase the border width of the
non-display region and reduce the screen-to-body ratio.
SUMMARY OF INVENTION
[0006] An OLED display, wherein the OLED display includes a display
body and a chip encapsulation board, the chip encapsulation board
being electrically connected to the display body through a
connecting component; wherein an edge of the display body is
provided with a groove, and a connection of the connecting
component and the display body is located at a sidewall of the
display body defining the groove, the groove is located at a top or
a bottom of the display body, and the chip encapsulation board is a
chip on film (COF) board, a chip on glass (COG) board or a chip on
plastic (COP) board.
[0007] Further, a first bending region is formed on the connecting
component at a position near the connection of the connecting
component and the display body, and the first bending region is
located in the groove.
[0008] Further, the connecting component is bent toward a back face
of the display body along the first bending region, the chip
encapsulation board is located at the back face of the display
body, a projection of the groove along a thickness direction of the
display body encloses a projection of a bending apex of the
connecting component along the thickness direction of the display
body.
[0009] Further, the display body comprises a first backboard, a
display panel disposed on a front face of the first backboard, and
a touch layer disposed on the display panel, wherein the touch
layer is an external touch layer.
[0010] Further, the display body is electrically connected to a
first flexible circuit board which is used for driving a touch unit
of the touch layer, and a connection of the first flexible circuit
board and the display body is also located at the sidewall of the
display body defining the groove.
[0011] Further, a second bending region is formed on the first
flexible circuit board at a position near the connection of the
first flexible circuit board and the display body, and the second
bending region is located in the groove.
[0012] Further, the first flexible circuit board is bent toward a
back face of the display body along the second bending region, the
first flexible circuit board is located at a back face of the first
backboard, a projection of the groove along a thickness direction
of the display body encloses a projection of a bending apex of the
first flexible circuit board along the thickness direction of the
display body.
[0013] Further, the display body is mounted with a sensor located
in the groove.
[0014] An OLED display, wherein the OLED display includes a display
body and a chip encapsulation board, the chip encapsulation board
being electrically connected to the display body through a
connecting component; wherein an edge of the display body is
provided with a groove, and a connection of the connecting
component and the display body is located at a sidewall of the
display body defining of the groove.
[0015] Further, a first bending region is formed on the connecting
component at a position near the connection of the connecting
component and the display body, and the first bending region is
located in the groove.
[0016] Further, the connecting component is bent toward a back face
of the display body along the first bending region, the chip
encapsulation board is located at the back face of the display
body, a projection of the groove along a thickness direction of the
display body encloses a projection of a bending apex of the
connecting component along the thickness direction of the display
body.
[0017] Further, the display body comprises a first backboard, a
display panel disposed on a front face of the first backboard, and
a touch layer disposed on the display panel, wherein the touch
layer is an external touch layer.
[0018] Further, the display body is electrically connected to a
first flexible circuit board which is used for driving a touch unit
of the touch layer, and a connection of the first flexible circuit
board and the display body is also located at the sidewall of the
display body defining the groove.
[0019] Further, wherein a second bending region is formed on the
first flexible circuit board at a position near the connection of
the first flexible circuit board and the display body, and the
second bending region is located in the groove.
[0020] Further, the first flexible circuit board is bent toward a
back face of the display body along the second bending region, the
first flexible circuit board is located at a back face of the first
backboard, a projection of the groove along a thickness direction
of the display body encloses a projection of a bending apex of the
first flexible circuit board along the thickness direction of the
display body.
[0021] Further, the groove is located at a top or a bottom of the
display body.
[0022] Further, the display body is mounted with a sensor located
in the groove.
[0023] Further, the chip encapsulation board is a chip on film
(COF) board, a chip on glass (COG) board or a chip on plastic (COP)
board.
Advantageous Effect
[0024] When the chip encapsulation board and the first flexible
circuit board are not bent, the bent regions of the chip
encapsulation board and the first flexible circuit board are
located in the groove, and the non-display region is fully
utilized. After the chip encapsulation board and the first flexible
circuit board are bent, the bent apex of the chip encapsulation
board and the first flexible circuit board do not protrude from the
edge of the display body, thereby preventing the width of the
border of the non-display region from being increased, and
enhancing the visual experience.
BRIEF DESCRIPTION OF DRAWINGS
[0025] In order to clearly describe the embodiments in the present
invention or the prior art, the following instruction will
introduce the drawings for the embodiments shortly. Obviously, the
following description is only a few embodiments, for the common
technical personnel in the field it is easy to acquire some other
drawings without creative work.
[0026] FIG. 1 is a schematic diagram of a first perspective view of
an organic light emitting diode (OLED) display according to
embodiment 1 of the present invention;
[0027] FIG. 2 is a schematic diagram of a second perspective of an
OLED display according to embodiment 1 of the present
invention;
[0028] FIG. 3 is a schematic diagram showing a connection between a
first flexible circuit board and a display screen body according to
embodiment 1 of the present invention;
[0029] FIG. 4 is a schematic diagram of a first perspective of an
OLED display according to embodiment 2 of the present
invention;
[0030] FIG. 5 is a schematic diagram of a second perspective of an
OLED display according to embodiment 2 of the present
invention.
REFERENCE MARKS
[0031] 10, display body; 11, first backboard; 12, display panel;
13, touch layer; 14, polarizer; 15, protective layer; 16, second
backboard; 17, groove; 20, chip encapsulation board; 30, connecting
components; 31, first bending zone; 40, integrated circuit; 50,
first flexible circuit board; 51, second bending region; 60, second
flexible circuit board.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0032] Description of following embodiment, with reference to
accompanying drawings, is used to exemplify specific embodiments
which may be carried out in the present disclosure. Directional
terms mentioned in the present disclosure, such as "top", "bottom",
"front", "back", "left", "right", "inside", "outside", "side",
etc., are only used with reference to orientation of the
accompanying drawings. Therefore, the directional terms are
intended to illustrate, but not to limit, the present disclosure.
In the drawings, components having similar structures are denoted
by same numerals.
[0033] The present invention is aimed to solve the technical
problems of the OLED display of the prior art, in which the border
width of the non-display region is increased due to the bent of the
connection portion of the screen display region and the chip
encapsulation board. The present invention can solve the above
problems.
Embodiment 1
[0034] An organic light emitting diode (OLED) display, as shown in
FIG. 1 and FIG. 2, the OLED display includes a display body 10 and
a chip encapsulation board 20, the chip encapsulation board 20 is
electrically connected to the display body 10 through a connecting
component 30; wherein an edge of the display body 10 is provided
with a groove 17, and a connection of the connecting component 30
and the display body 10 is located at a sidewall of the display
body defining the groove 17.
[0035] When the chip encapsulation board 20 is not bent, the
connecting component 30 is located in the groove 17, and the
non-display region is fully utilized to prevent the connecting
component 30 from being bent to increase the width of the border of
the non-display region, and to prevent the chip encapsulation board
20 from being bent toward the back face of the display body 10,
thereby preventing the connecting component 30 occupies part of the
edge region of the display body 10, so that the effective display
region of the display body 10 is increased to enhance the visual
experience.
[0036] The connecting component 30 is a connection trace, and the
chip encapsulation board 20 is a chip on film (COF) board.
[0037] Further, a first bending region 31 is formed on the
connecting component 30 at a position near the connection of the
connecting component 30 and the display body 10, and the first
bending region 31 is located in the groove 17.
[0038] Further, the connecting component 30 is bent toward a back
face of the display body 10 along the first bending region 31, the
chip encapsulation board 20 is located at the back face of the
display body 10, a projection of the groove 17 along a thickness
direction of the display body 10 encloses a projection of a bending
apex of the connecting component 30 along the thickness direction
of the display body 10.
[0039] It can be understood that when the chip encapsulation board
20 is bent toward the back face of the display body 10 along the
bending region, because the first bending region 31 is located in
the groove 17, and the chip encapsulation board 20 is bent to the
back face of the display body 10, a projection of the groove 17
along the thickness direction of the display body 10 encloses a
projection of the bending apex of the connecting component 30 along
the thickness direction of the display body 10. Thereby, the
connecting component 30 and the connecting trace used for
connecting the chip encapsulation board and the edge of the display
body are bent to increase the width of the border of the
non-display area.
[0040] Further, the display body 10 comprises a first backboard 11,
a display panel 12 disposed on a front face of the first backboard
11, and a touch layer 13 disposed on the display panel 12, and a
polarizer 14 is disposed on the touch layer 13; the display body 10
further includes a protective layer 15 disposed on the back face of
the first backboard 11 and a second backboard 16 disposed on the
protective layer 15.
[0041] Wherein, the chip encapsulation board 20 is provided with a
second flexible circuit board 60 and an integrated circuit 40,
after the chip encapsulation board 20 is bent to the back face of
the display body 10, the chip encapsulation board 20 can be fixedly
connected to the second backboard 16 by adhesive glue.
[0042] As shown in FIG. 2 and FIG. 3, the touch layer 13 is an
external touch layer 13; the display body 10 is electrically
connected to a first flexible circuit board 50 which is used for
driving a touch unit of the touch layer 13, and a connection of the
first flexible circuit board 50 and the display body 10 is also
located at the sidewall of the display body defining the groove
17.
[0043] Further, a second bending region 51 is formed on the first
flexible circuit board 50 at a position near the connection of the
first flexible circuit board 50 and the display body 10, and the
second bending region 51 is located in the groove 17.
[0044] Further, the first flexible circuit board 50 is bent toward
the back face of the display body 10 along the second bending
region 51, the first flexible circuit board 50 is located at the
back face of the first backboard 11, a projection of the groove 17
along the thickness direction of the display body 10 encloses a
projection of a bending apex of the first flexible circuit board 50
along the thickness direction of the display body 10.
[0045] The first flexible circuit board 50 drives the touch unit on
the touch layer 13 to work normally, and the first flexible circuit
board 50 is bent to the back face of the display body 10.
Therefore, it is possible to prevent a bent portion of the first
flexible circuit board 50 from increasing the width of the
non-display region and making full use of the non-display
region.
[0046] Specifically, the display body 10 is mounted with a sensor
located in the groove 17 to fully utilize the non-display region;
the sensor can be an earpiece or a camera, etc., which are not
enumerated here.
Embodiment 2
[0047] An OLED display, as shown in FIG. 4 and FIG. 5, differs from
embodiment 1 in the type of the chip encapsulation board 20.
[0048] Specifically, the chip encapsulation board 20 is a chip on
plastic (COP) board or a chip on glass (COG) board.
[0049] The beneficial effects of the invention are: when the chip
encapsulation board 20 and the first flexible circuit board 50 are
not bent, bent regions of the chip encapsulation board 20 and the
first flexible circuit board 50 are located in the groove 17, and
the non-display region is fully utilized. After the chip
encapsulation board 20 and the first flexible circuit board 50 are
bent, the bent apex of the chip encapsulation board 20 and the
first flexible circuit board 50 do not protrude from the edge of
the display body 10, thereby preventing the width of the border of
the non-display region from being increased, and enhancing the
visual experience.
[0050] As is understood by persons skilled in the art, the
foregoing preferred embodiments of the present disclosure are
illustrative rather than limiting of the present disclosure. It is
intended that they cover various modifications and that similar
arrangements be included in the spirit and scope of the present
disclosure, the scope of which should be accorded the broadest
interpretation so as to encompass all such modifications and
similar structures.
* * * * *