U.S. patent application number 17/266776 was filed with the patent office on 2021-10-14 for camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device.
The applicant listed for this patent is Ningbo Sunny Opotech Co., Ltd.. Invention is credited to Jiawei CHEN, Zhen HUANG, Li LIU, Qimin MEI, Zhewen MEI, Chenxiang XU, Bojie ZHAO.
Application Number | 20210321025 17/266776 |
Document ID | / |
Family ID | 1000005719840 |
Filed Date | 2021-10-14 |
United States Patent
Application |
20210321025 |
Kind Code |
A1 |
HUANG; Zhen ; et
al. |
October 14, 2021 |
CAMERA MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING
METHODS THEREOF, AND ELECTRONIC DEVICE
Abstract
A camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device are
disclosed. The molded photosensitive assembly includes an imaging
assembly, a molded base and a filter assembly. The imaging assembly
includes a circuit board and at least one photosensitive element,
and each photosensitive element is conductively connected to the
circuit board. The molded base has at least one stepped peripheral
groove to define a light window through each stepped peripheral
groove, the molded base embeds a part of the imaging assembly, and
a photosensitive region of each photosensitive element respectively
corresponds to each light window of the molded base. The filter
assembly includes at least one filter element, and each filter
element is correspondingly arranged in each stepped peripheral
groove of the molded base, so that each filter element respectively
corresponds to each light window of the molded base.
Inventors: |
HUANG; Zhen; (Zhejiang,
CN) ; MEI; Qimin; (Zhejiang, CN) ; ZHAO;
Bojie; (Zhejiang, CN) ; MEI; Zhewen;
(Zhejiang, CN) ; LIU; Li; (Zhejiang, CN) ;
CHEN; Jiawei; (Zhejiang, CN) ; XU; Chenxiang;
(Zhejiang, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Ningbo Sunny Opotech Co., Ltd. |
Zhejiang |
|
CN |
|
|
Family ID: |
1000005719840 |
Appl. No.: |
17/266776 |
Filed: |
July 10, 2019 |
PCT Filed: |
July 10, 2019 |
PCT NO: |
PCT/CN2019/095337 |
371 Date: |
February 8, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B29C 43/18 20130101;
B29L 2031/34 20130101; H04N 5/2253 20130101; H04N 5/2257 20130101;
H04N 5/2254 20130101; B29L 2011/00 20130101 |
International
Class: |
H04N 5/225 20060101
H04N005/225; B29C 43/18 20060101 B29C043/18 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 21, 2018 |
CN |
201810952770.4 |
Aug 21, 2018 |
CN |
201821351551.2 |
May 24, 2019 |
CN |
201910438885.6 |
May 24, 2019 |
CN |
201910438917.2 |
May 24, 2019 |
CN |
201910439285.1 |
May 24, 2019 |
CN |
201920764689.3 |
May 24, 2019 |
CN |
201920765166.0 |
May 24, 2019 |
CN |
201920766441.0 |
Claims
1-113. (canceled)
114. A molded photosensitive assembly, characterized by comprising:
an imaging assembly, wherein the imaging assembly includes a
circuit board and at least one photosensitive element, and each
photosensitive element is conductively connected to the circuit
board; a molded base, wherein the molded base has at least one
stepped peripheral groove to define a light window through each
stepped peripheral groove, the molded base embeds a part of the
imaging assembly, and a photosensitive region of each
photosensitive element respectively corresponds to each light
window of the molded base; and a filter assembly, wherein the
filter assembly includes at least one filter element, and each
filter element is correspondingly arranged in each stepped
peripheral groove of the molded base, so that each filter element
respectively corresponds to each light window of the molded
base.
115. The molded photosensitive assembly according to claim 114,
wherein the molded base includes at least one first base portion
and at least one second base portion, and each second base portion
integrally extends inward from an inner circumferential surface of
each first base portion along the circuit board, a first top
surface of each first base portion is higher than a second top
surface of the second base portion, so that each first base portion
and each second base portion form each stepped peripheral groove of
the molded base.
116. The molded photosensitive assembly according to claim 115,
wherein the circuit board includes a chip mounting region and an
edge region located around the chip mounting region, and the
photosensitive element includes a photosensitive region and a
non-photosensitive region located around the photosensitive region,
and the first base portion of the molded base embeds at least a
part of the edge region of the circuit board, and the second base
portion of the molded base embeds at least a part of the
non-photosensitive region of the photosensitive element.
117. The molded photosensitive assembly according to claim 116,
wherein the first base portion embeds a circuit board outer portion
of the edge region of the circuit board, and the second base
portion embeds a circuit board connecting portion and a circuit
board inner portion of the edge region of the circuit board, as
well as a chip outer portion and a chip connecting portion of the
non-photosensitive region of the photosensitive element; or wherein
the first base portion of the molded base embeds a circuit board
outer portion and a circuit board connecting portion of the edge
region of the circuit board, and the second base portion embeds a
circuit board inner portion of the edge region of the circuit
board, as well as a chip outer portion and a chip connecting
portion of the non-photosensitive region of the photosensitive
element; or wherein the first base portion of the molded base
embeds a circuit board outer portion, a circuit board connecting
portion and a circuit board inner portion of the edge region of the
circuit board, and the second base portion embeds a chip outer
portion, a chip connecting portion and a part of a chip inner
portion of the non-photosensitive region of the photosensitive
element; or wherein the first base portion of the molded base
embeds a circuit board outer portion, a circuit board connecting
portion and a circuit board inner portion of the edge region of the
circuit board, as well as a chip outer portion of the
non-photosensitive region of the photosensitive element, and the
second base portion embeds a chip connecting portion and a part of
a chip inner portion of the non-photosensitive region of the
photosensitive element.
118. The molded photosensitive assembly according to claim 117,
wherein the imaging assembly further includes at least one group of
leads to conductively connect the photosensitive element and the
circuit board through each lead, wherein a height of the second
base portion is greater than an arc height of each lead, and the
second base portion embeds each lead of the imaging assembly.
119. The molded photosensitive assembly according to claim 118,
wherein the imaging assembly further includes at least one group of
electronic components, and each electronic component is mounted to
the circuit board outer portion of the edge region of the circuit
board, wherein a height of the first base portion of the molded
base is greater than a height of each electronic component, and the
first base portion embeds each electronic component of the imaging
assembly.
120. The molded photosensitive assembly according to claim 119,
wherein the second top surface of the second base portion is lower
than a top surface of the highest electronic component.
121. The molded photosensitive assembly according to claim 115,
wherein the circuit board includes a chip mounting region and an
edge region located around the chip mounting region, wherein the
first base portion and the second base portion of the molded base
both embed a circuit board outer portion of the edge region of the
circuit board.
122. The molded photosensitive assembly according to claim 121,
wherein the imaging assembly further includes at least one group of
electronic components, and each electronic component is mounted to
the circuit board outer portion of the edge region of the circuit
board, wherein a height of the first base portion of the molded
base is greater than a height of each electronic component, and the
first base portion embeds each electronic component of the imaging
assembly.
123. The molded photosensitive assembly according to claim 115,
wherein a first top surface of the first base portion and a second
top surface of the second base portion are parallel to each
other.
124. The molded photosensitive assembly according to claim 123,
wherein the first top surface of each first base portion of the
molded base and a photosensitive surface of the photosensitive
element are parallel to each other.
125. The molded photosensitive assembly according to claim 115,
wherein an inclination angle of a first inner circumferential
surface of each first base portion relative to a photosensitive
surface of the photosensitive element is less than 30.degree..
126. The molded photosensitive assembly according to claim 125,
wherein an inclination angle of a second inner circumferential
surface of each second base portion relative to the photosensitive
surface of the photosensitive element is less than 30.degree..
127. The molded photosensitive assembly according to claim 115,
wherein the filter assembly further includes at least one glue
layer, and each glue layer is arranged between each filter element
and each second base portion, so that each filter element is
fixedly arranged on each second base portion of the molded base
through each glue layer.
128. The molded photosensitive assembly according to claim 127,
wherein each glue layer is formed by curing glue applied to the
second top surface of each second base portion, and each glue layer
is located between a lower surface of each filter element and a
second top surface of each second base portion.
129. The molded photosensitive assembly according to claim 128,
wherein each second base portion is further provided with at least
one glue recess, wherein each glue recess is sunken downward from
the second top surface of each second base portion to form a recess
for holding the glue.
130. The molded photosensitive assembly according to claim 127,
wherein each glue layer is formed by curing glue applied to a lower
surface of each filter element, and each glue layer is located
between the lower surface of each filter element and the second top
surface of each second base portion.
131. The molded photosensitive assembly according to claim 127,
further including a mounting gap, wherein the mounting gap is
located between the filter element and the first inner
circumferential surface of the first base portion.
132. An electronic device, characterized by comprising: an
electronic device body; and at least one camera module, wherein
each camera module is arranged in the electronic device body for
capturing images, and includes: the molded photosensitive assembly
according to claim 114; and at least one optical lens, wherein each
optical lens is arranged on a photosensitive path of each
photosensitive element of the imaging assembly of the molded
photosensitive assembly, so that each light window provides a light
path for each optical lens and each photosensitive element.
133. A method for manufacturing a molded photosensitive assembly,
characterized by comprising the following steps: mounting a
photosensitive element and at least one group of electronic
components to a circuit board, and conducting the photosensitive
element and the circuit board to assemble an imaging assembly;
forming, by means of a molding process, a molded base which is used
for embedding a part of the circuit board and a part of the
photosensitive element and has a stepped peripheral groove, and
forming a light window through the stepped peripheral groove,
wherein a photosensitive region of the photosensitive element
corresponds to the light window of the molded base, so as to form a
semi-finished molded photosensitive assembly with an integrated
structure; and correspondingly arranging a filter element of a
filter assembly in the stepped peripheral groove of the molded base
of the semi-finished molded photosensitive assembly to assemble a
molded photosensitive assembly, wherein the photosensitive region
of the photosensitive element corresponds to the filter element.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to the field of optical
imaging technology, and particularly to a camera module and a
molded photosensitive assembly and manufacturing methods thereof,
and an electronic device.
BACKGROUND OF THE INVENTION
[0002] In recent years, electronic products, intelligent devices,
and the like have increasingly tended to be thinner, lighter and
smaller. This development trend of electronic products and
intelligent devices puts forward more stringent requirements for
the size of a camera module (especially the height of a camera
module) as one of the standard configurations of electronic
products and intelligent devices.
[0003] During assembly process of the camera module in the prior
art, a chip and electronic components are usually mounted to a
circuit board first, and then a lens holder is formed on the
circuit board through a lens holder attaching process or a molding
process. In addition, a filter assembly is usually mounted to the
lens holder, and then an optical lens is mounted to the filter
assembly, so that the optical lens is held on a photosensitive path
of the chip.
[0004] By this assembly mode in the prior art, the height of the
camera module depends on the thickness of the circuit board, the
height of the lens holder, the thickness of the filter assembly and
the height of the optical lens, that is, according to the existing
structural design mode, the sum of the thickness of the circuit
board, the height of the lens holder, the thickness of the filter
assembly, and the height of the optical lens is equal to the height
of the camera module, which has many limitations for a thin and
light camera module.
[0005] Avoidance spaces should be reserved for the traditionally
attached lens holder and upper and lower parts between electronic
components. Meanwhile, a color filter is mounted on a support arm
of the lens holder, the support arm of the lens holder for mounting
the color filter has a minimum molding thickness, which is usually
0.2 mm or more. In addition, a safety distance is also required
between an upper surface of the color filter and a lower surface of
the lens. Therefore, in the assembly of the traditional lens
holder, the height stacking accumulation causes the height of the
lens holder difficult to be reduced.
[0006] Moreover, similar situations also exist in the molding
process.
[0007] First, in the molding process, the electronic components
mounted on the circuit board are located in a molding die, safety
distances need to be reserved between the electronic components and
the molding die to prevent the molding die from squeezing the
electronic components, that is, no matter in the horizontal
direction or in the height direction, a safety distance needs to be
reserved between the molding die and the respective electronic
component in order to cover each electronic component after a
molded base is formed, so that the height of the molded base has to
be greater than the height of the respective electronic component,
that is, the height of the molded base is limited by the height of
electronic component, which results in that the height of the
molded base cannot be reduced.
[0008] Second, the filter assembly is composed of a filter and a
support element, the support element is usually made by an
injection molding process, and the part of the support element that
supports the filter needs to have certain thickness to ensure
sufficient strength for firmly supporting the filter, so that the
thickness of the filter assembly has to be greater than the
thickness of the filter, that is, the thickness of the filter
assembly is limited by the support element and the filter together,
which results in that the thickness of the filter assembly cannot
be reduced.
[0009] Therefore, due to the limitations of the above various
factors, the assembly mode in the prior art cannot reduce the
height of the camera module, and thus cannot meet the requirements
of the market for lightness, thinness and miniaturization of the
camera module.
[0010] Today's intelligent devices have to be equipped with
high-quality camera modules. For example, a smart phone acquires
images through a camera module to perceive the world. As the
intelligent devices pursue to be thinner and lighter, small-sized
camera modules are more competitive in the market.
[0011] An existing camera module mounted in a smart phone is
disclosed in FIG. 13. A filter assembly 20P is supported above a
photosensitive assembly 30P. An optical lens 10P is mounted above
the filter assembly 20P, so that shaped and filtered light is
transmitted to a chip 300P of the photosensitive assembly 30P. In
order to achieve better quality, the filter assembly 20P needs to
be arranged between the optical lens 10P and the photosensitive
assembly 30P. Then, the thickness of the existing camera module is
determined from the photosensitive assembly 30P to the optical lens
10P. Moreover, the thickness of the camera module is difficult to
be reduced, because of the height of the optical lens 10P, the
thickness of the filter assembly 20P, and the height of the
photosensitive assembly 30P. The camera module with such size is
neither suitable nor attractive in a thin and stylish smart phone.
In this example of the existing camera module, the filter assembly
20P includes a filter 21P and a filter holder 22P. The filter
holder 22P surrounds and supports the filter 21P between the
optical lens 10P and the photosensitive assembly 30P. In addition,
the height of the optical lens 10P and the thickness of the
photosensitive assembly 30P are difficult to be reduced due to the
complicated optical design and the sizes of electronic devices
included in the photosensitive assembly 30P. Particularly, because
the camera module with a short back focus length is usually
required to be less than 0.6 mm, the current technological level
cannot meet this requirement.
[0012] For some existing camera modules, attempts are made to
directly mount the filter 21P at the bottom of the optical lens 10P
without the filter holder 22P, so as to reduce the overall size of
the camera module. However, the optical lens 10P has to be directly
pressed on the filter 21P, and the filter 21P cannot bear the
weight of the optical lens 10P or the movement of the optical lens
10P during usage. Moreover, glue for mounting the optical lens 10P
easily flows into the center of the filter 21P to cover a light
transmission region. The damaged filter 21P causes the entire
camera module to fail to acquire images.
[0013] In some other existing technologies, attempts are made to
attach the filter 21P to the surface of the chip 300P or the bottom
surface of the optical lens 10P. But this requires more details to
attach the filter 21P to the surface, just like attaching a film to
glass. For example, it is difficult to guarantee the flatness
between the filter 21P and the chip 300P, and the durability of the
filter 21P and the chip 300P may be subjected to adverse effects.
Once there are bubbles or wrinkles, the filter effect of the filter
21P will decrease, and the filter 21P cannot work effectively, so
that the quality and reliability of the camera module are
reduced.
[0014] In fact, the distance between the optical lens 10P and the
filter 21P and the distance between the filter 21P and the chip 21P
are critical to the image quality. After reflected on the filter
21P, stray light enters the chip 300P. If the distance between the
filter 21P and the chip 300P is too short, the stray light may
enter the center of the chip 300P, that is, an imaging sensing
region. If the distance between the filter 21P and the chip 300P is
slightly long, the stray light may enter the edge of the chip 300P,
that is, the processing and aggregation of the stray light are
easily neglected. Therefore, if the filter 21P is attached to the
surface of the chip 300P or the bottom surface of the optical lens
10P to reduce the thickness of the camera module, the efficiency of
capturing images will be reduced, that is, the operation of the
filter 21P does not achieve a certain effect, which is not perfect
for an intelligent device.
SUMMARY OF THE INVENTION
[0015] An object of the present invention is to provide a camera
module and a molded photosensitive assembly and manufacturing
methods thereof, and an electronic device, which can reduce the
height of the camera module and are beneficial to meeting
development requirements for lightness, thinness and
miniaturization of the camera module.
[0016] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, which can
reduce the height of the camera module by reducing a distance
between a filter element and a circuit board.
[0017] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, which can
reduce a back focus length of an optical lens of the camera module
and help to achieve smaller camera modules to meet market
requirements.
[0018] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, a molded base of the
molded photosensitive assembly has a stepped peripheral groove, and
a filter element of the molded photosensitive assembly is mounted
in the stepped peripheral groove of the molded base, so that a
distance between the filter element and the circuit board is
reduced.
[0019] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, the molded base has a
stepped peripheral groove, and the filter element is arranged in
the stepped peripheral groove to reduce the distance between the
filter element and the circuit board.
[0020] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, the molded base includes
a first base portion and a second base portion, wherein the second
base portion integrally extends inward from the first base portion
along the circuit board, a first top surface of the first base
portion defines a first mounting surface, a second top surface of
the second base portion defines a second mounting surface, the
first mounting surface is higher than the second mounting surface,
and the filter element is mounted on the second mounting
surface.
[0021] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, the second mounting
surface of the molded base is lower than upper surfaces of
electronic components on the circuit board to further reduce the
distance between the filter element and the circuit board.
[0022] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, the filter element is
mounted on the first mounting surface of the molded base through a
support element, and the filter element is located between the
first mounting surface and the second mounting surface to reduce
the distance between the filter element and the circuit board.
[0023] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, the first mounting
surface and the second mounting surface of the molded base are
parallel to each other, which facilitate a subsequent active
calibration process.
[0024] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, an arc height of gold
wires is reduced by a reverse punching process to avoid a pressure
head of a mold, which can thus reduce the distance between the
second mounting surface of the molded base and the circuit
board.
[0025] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, before the
photosensitive element is mounted, the molded base is manufactured
by a molding process to further reduce the distance between the
second mounting surface of the molded base and the circuit
board.
[0026] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, the photosensitive
element is mounted in a chip mounting recess of the circuit board
to further reduce the distance between the second mounting surface
of the molded base and the circuit board.
[0027] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, the photosensitive
element is mounted in a through hole type chip mounting recess of
the circuit board to further reduce the distance between the second
mounting surface of the molded base and the circuit board.
[0028] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, an upper surface of the
filter element is not higher than the first mounting surface of the
molded base, which effectively prevents impacting the filter
element due to the downward movement of the optical lens in a
dynamic focus camera module.
[0029] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, and in
some embodiments of the present invention, a gap is reserved
between the filter element and a first inner circumferential
surface of the first base portion of the molded base for mounting
the filter element.
[0030] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the thickness of the camera module mainly depends on the height of
a lens and the thickness of a molded photosensitive assembly,
thereby saving installation space in an intelligent device.
[0031] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and electronic device, and in order
to effectively produce a small-sized camera module, the difficulty
and complexity in manufacturing the lens and the molded
photosensitive assembly will not increase.
[0032] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the filter is well supported and does not need to support the lens,
so that the lens is stably supported without worrying about
damaging the filter.
[0033] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein a
lens glue applied between the lens and the molded photosensitive
assembly is far away from the filter to keep a filter region of the
filter uncovered.
[0034] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the distance between the filter and the lens is kept to maintain a
small amount of stray light entering the molded photosensitive film
in the molded photosensitive assembly, so that the image quality is
enhanced.
[0035] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the distance between the filter and the molded photosensitive
assembly is kept to maintain a small amount of stray light entering
the center of the photosensitive film, so that the image quality is
enhanced.
[0036] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the photosensitive film is almost not pressed by the filter and can
have better photosensitive property.
[0037] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the lens is directly supported on the molded photosensitive
assembly, so that the lens has a strong support and is convenient
to be started or moved.
[0038] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the molded photosensitive assembly provides a high support for the
lens, and provides a short support for the filter, so as to
effectively avoid interference between the lens and the filter
under the premise of stably supporting the lens and the filter at
the same time.
[0039] Another object of the present invention is to provide a
camera module and a molded photosensitive assembly and
manufacturing methods thereof, and an electronic device, wherein
the lens can be mounted on the molded photosensitive assembly to
adapt to an edge shape of an intelligent device, so that the
imaging capability is guaranteed with a more attractive
appearance.
[0040] In order to achieve at least one of the above-mentioned
objects or other objects and advantages, the present invention
provides a molded photosensitive assembly, including:
[0041] an imaging assembly, wherein the imaging assembly includes a
circuit board and at least one photosensitive element, and each
photosensitive element is conductively connected to the circuit
board;
[0042] a molded base, wherein the molded base has at least one
stepped peripheral groove to define a light window through each
stepped peripheral groove, the molded base embeds a part of the
imaging assembly, and a photosensitive region of each
photosensitive element corresponds to each light window of the
molded base; and a filter assembly, wherein the filter assembly
includes at least one filter element, and each filter element is
correspondingly arranged in each stepped peripheral groove of the
molded base, so that each filter element respectively corresponds
to each light window of the molded base.
[0043] In some embodiments of the present invention, the molded
base includes at least one first base portion and at least one
second base portion, wherein each second base portion integrally
extends inward from an inner circumferential surface of each first
base portion along the circuit board, a first top surface of each
first base portion is higher than a second top surface of the
second base portion, so that each first base portion and each
second base portion form each stepped peripheral groove of the
molded base.
[0044] In some embodiments of the present invention, the circuit
board includes a chip mounting region and an edge region located
around the chip mounting region, and the photosensitive element
includes a photosensitive region and a non-photosensitive region
located around the photosensitive region, wherein the first base
portion of the molded base embeds at least a part of the edge
region of the circuit board, and the second base portion of the
molded base embeds at least a part of the non-photosensitive region
of the photosensitive element.
[0045] In some embodiments of the present invention, the first base
portion embeds a circuit board outer portion of the edge region of
the circuit board, and the second base portion embeds a circuit
board connecting portion and a circuit board inner portion of the
edge region of the circuit board, as well as a chip outer portion
and a chip connecting portion of the non-photosensitive region of
the photosensitive element.
[0046] In some embodiments of the present invention, the first base
portion of the molded base embeds a circuit board outer portion and
a circuit board connecting portion of the edge region of the
circuit board, and the second base portion embeds a circuit board
inner portion of the edge region of the circuit board, as well as a
chip outer portion and a chip connecting portion of the
non-photosensitive region of the photosensitive element.
[0047] In some embodiments of the present invention, the first base
portion of the molded base embeds a circuit board outer portion, a
circuit board connecting portion and a circuit board inner portion
of the edge region of the circuit board, and the second base
portion embeds a chip outer portion, a chip connecting portion and
a part of a chip inner portion of the non-photosensitive region of
the photosensitive element.
[0048] In some embodiments of the present invention, the first base
portion of the molded base embeds a circuit board outer portion, a
circuit board connecting portion and a circuit board inner portion
of the edge region of the circuit board, as well as a chip outer
portion of the non-photosensitive region of the photosensitive
element, and the second base portion embeds a chip connecting
portion and a part of a chip inner portion of the
non-photosensitive region of the photosensitive element.
[0049] In some embodiments of the present invention, the imaging
assembly further includes at least one group of leads to
conductively connect the photosensitive element and the circuit
board through each lead, wherein a height of the second base
portion is greater than an arc height of each lead, and the second
base portion embeds each lead of the imaging assembly.
[0050] In some embodiments of the present invention, the imaging
assembly further includes at least one group of electronic
components, and each electronic component is mounted to the circuit
board outer portion of the edge region of the circuit board,
wherein a height of the first base portion of the molded base is
greater than a height of each electronic component, and the first
base portion embeds each electronic component of the imaging
assembly.
[0051] In some embodiments of the present invention, the second top
surface of the second base portion is lower than a top surface of
the highest electronic component.
[0052] In some embodiments of the present invention, the circuit
board includes a chip mounting region and an edge region located
around the chip mounting region, wherein the first base portion and
the second base portion of the molded base embed a circuit board
outer portion of the edge region of the circuit board.
[0053] In some embodiments of the present invention, the imaging
assembly further includes at least one group of electronic
components, and each electronic component is mounted to the circuit
board outer portion of the edge region of the circuit board,
wherein the height of the first base portion of the molded base is
greater than the height of each electronic component, and the first
base portion embeds each electronic component of the imaging
assembly.
[0054] In some embodiments of the present invention, the first top
surface of the first base portion and the second top surface of the
second base portion are parallel to each other.
[0055] In some embodiments of the present invention, the first top
surface of each first base portion of the molded base and a
photosensitive surface of the photosensitive element are parallel
to each other.
[0056] In some embodiments of the present invention, an inclination
angle of the first inner circumferential surface of each first base
portion relative to a photosensitive surface of the photosensitive
element is less than 30.degree..
[0057] In some embodiments of the present invention, an inclination
angle of a second inner circumferential surface of each second base
portion relative to the photosensitive surface of the
photosensitive element is less than 30.degree..
[0058] In some embodiments of the present invention, the filter
assembly further includes at least one glue layer, wherein each
glue layer is arranged between each filter element and each second
base portion, so that each filter element is fixedly arranged on
each second base portion of the molded base through each glue
layer.
[0059] In some embodiments of the present invention, each glue
layer is formed by curing glue applied to the second top surface of
each second base portion, and each glue layer is located between a
lower surface of each filter element and the second top surface of
each second base portion.
[0060] In some embodiments of the present invention, each second
base portion is further provided with at least one glue recess,
wherein each glue recess is sunken downward from the second top
surface of each second base portion to form a recess for holding
the glue.
[0061] In some embodiments of the present invention, each glue
layer is formed by curing glue applied to a lower surface of each
filter element, and each glue layer is located between the lower
surface of each filter element and the second top surface of each
second base portion.
[0062] In some embodiments of the present invention, the molded
photosensitive assembly further includes a mounting gap, wherein
the mounting gap is located between the filter element and the
first inner circumferential surface of the first base portion.
[0063] In some embodiments of the present invention, each glue
layer has at least one air escape hole, wherein each air escape
hole extends from an inner side of the glue layer to an outer side
of the glue layer to communicate a space between the filter element
and the photosensitive element with an outer space of the molded
photosensitive assembly.
[0064] In some embodiments of the present invention, the filter
assembly further includes at least one glue layer and at least one
annular support element, wherein each glue layer is located between
an upper surface of each filter element and each support element,
so that each filter element is fixedly mounted to each support
element through each glue layer, wherein each support element is
correspondingly arranged on the first base portion of the molded
base, so that each filter element is located in each stepped
peripheral groove of the molded base.
[0065] In some embodiments of the present invention, each support
element of the filter assembly is mounted to the first top surface
of each first base portion, so that the upper surface of each
filter element is lower than the first top surface of each first
base portion.
[0066] In some embodiments of the present invention, the circuit
board is further provided with at least one chip mounting recess,
wherein each chip mounting recess is located in a chip mounting
region of the circuit board, and each chip mounting recess is
sunken downward from an upper side surface of the circuit board to
form a recess for mounting the photosensitive element.
[0067] In some embodiments of the present invention, each chip
mounting recess extends downward from the upper side surface of the
circuit board to a lower side surface of the circuit board to form
a through hole in the chip mounting region of the circuit board,
wherein each photosensitive element is fixedly arranged in each
chip mounting recess.
[0068] According to another aspect of the present invention, the
present invention further provides a camera module, including:
[0069] the above-mentioned molded photosensitive assembly; and
[0070] at least one optical lens, wherein each optical lens is
arranged on a photosensitive path of each photosensitive element of
the imaging assembly of the molded photosensitive assembly, so that
each light window provides a light path for each optical lens and
each photosensitive element.
[0071] According to another aspect of the present invention, the
present invention further provides an electronic device,
including:
[0072] an electronic device body; and
[0073] the above-mentioned camera modules, wherein each camera
module is arranged in the electronic device body for capturing
images.
[0074] According to another aspect of the present invention, the
present invention further provides a method for manufacturing a
molded photosensitive assembly, including the following steps:
[0075] mounting a photosensitive element and at least one group of
electronic components to a circuit board, and conducting the
photosensitive element and the circuit board to assemble an imaging
assembly;
[0076] forming, by means of a molding process, a molded base which
is used for embedding a part of the circuit board and a part of the
photosensitive element and has a stepped peripheral groove, and
forming a light window through the stepped peripheral groove,
wherein a photosensitive region of the photosensitive element
corresponds to the light window of the molded base, so as to form a
semi-finished molded photosensitive assembly with an integrated
structure; and
[0077] correspondingly arranging a filter element of a filter
assembly in the stepped peripheral groove of the molded base of the
semi-finished molded photosensitive assembly to assemble a molded
photosensitive assembly, wherein the photosensitive region of the
photosensitive element corresponds to the filter element.
[0078] In some embodiments of the present invention, the step of
mounting a photosensitive element and at least one group of
electronic components to a circuit board, and conducting the
photosensitive element and the circuit board to assemble an imaging
assembly includes the following steps:
[0079] mounting the photosensitive element to a chip mounting
region of the circuit board;
[0080] mounting each electronic component to a circuit board outer
portion of an edge region of the circuit board; and
[0081] extending, by means of a wire bonding process, a lead from a
chip connector of the photosensitive element to a circuit board
connector of the circuit board to conductively connect the
photosensitive element and the circuit board.
[0082] In some embodiments of the present invention, the step of
mounting a photosensitive element and at least one group of
electronic components to a circuit board, and conducting the
photosensitive element and the circuit board to assemble an imaging
assembly includes the following steps:
[0083] mounting the photosensitive element to a chip mounting
region of the circuit board;
[0084] mounting each electronic component to a circuit board outer
portion of an edge region of the circuit board; and
[0085] extending, by means of a wire bonding process, a lead from a
circuit board connector of the circuit board to a chip connector of
the photosensitive element to conductively connect the circuit
board and the photosensitive element.
[0086] In some embodiments of the present invention, the step of
forming, by means of a molding process, a molded base which is used
for embedding a part of the circuit board and a part of the
photosensitive element and has a stepped peripheral groove, and
forming a light window through the stepped peripheral groove,
wherein a photosensitive region of the photosensitive element
corresponds to the light window of the molded base, so as to form a
semi-finished molded photosensitive assembly with an integrated
structure includes the following steps:
[0087] placing the imaging assembly in a molding die;
[0088] performing a clamping operation to an upper die and a lower
die of the molding die to form a molding space of the molding die
between the upper die and the lower die;
[0089] adding a molding material to the molding space of the
molding die to form the molded base with the stepped peripheral
groove after the molding material is cured; and
[0090] performing a drafting operation on the upper die and the
lower die to obtain the semi-finished molded photosensitive
assembly.
[0091] In some embodiments of the present invention, the step of
performing a clamping operation to an upper die and a lower die of
the molding die to form a molding space of the molding die between
the upper die and the lower die includes the following steps:
[0092] arranging a cover film on a pressing surface of the upper
die;
[0093] pressing, by means of the cover film, the photosensitive
element of the imaging assembly, so that the cover film is located
between the pressing surface and the photosensitive element;
[0094] forming a first molding space of the molding space between a
first inner surface of the upper die and at least a part of the
edge region of the circuit board; and
[0095] forming a second molding space of the molding space between
a second inner surface of the upper die and at least a part of a
non-photosensitive region of the photosensitive element, wherein
the first inner surface of the upper die is above the second inner
surface of the upper die.
[0096] In some embodiments of the present invention, the step of
adding a molding material to the molding space of the molding die
to form the molded base with the stepped peripheral groove after
the molding material is cured includes the following steps:
[0097] adding the molding material to the first molding space to
form a first base portion of the molded base after the molding
material is cured, wherein the first base portion embeds the at
least a part of the edge region of the circuit board; and
[0098] adding the molding material to the second molding space to
form a second base portion of the molded base after the molding
material is cured, wherein the second base portion embeds the at
least a part of the non-photosensitive region of the photosensitive
element, and a height of the second base portion is lower than a
height of the first base portion.
[0099] In some embodiments of the present invention, the step of
correspondingly arranging a filter element of a filter assembly in
the stepped peripheral groove of the molded base of the
semi-finished molded photosensitive assembly to assemble a molded
photosensitive assembly, wherein the photosensitive region of the
photosensitive element corresponds to the filter element includes
the following steps:
[0100] applying a glue to a second top surface of the second base
portion of the molded base;
[0101] correspondingly arranging the filter element on the second
top surface of the second base portion; and
[0102] forming, after the glue is cured, a glue layer of the filter
assembly between a lower surface of the filter element and the
second top surface of the second base portion.
[0103] In some embodiments of the present invention, the step of
correspondingly arranging a filter element of a filter assembly in
the stepped peripheral groove of the molded base of the
semi-finished molded photosensitive assembly to assemble a molded
photosensitive assembly, wherein the photosensitive region of the
photosensitive element corresponds to the filter element includes
the following steps:
[0104] applying a glue to a lower surface of the filter
element;
[0105] correspondingly arranging the filter element on a second top
surface of the second base portion; and
[0106] forming, after the glue is cured, a glue layer of the filter
assembly between the lower surface of the filter element and the
second top surface of the second base portion.
[0107] In some embodiments of the present invention, the step of
correspondingly arranging a filter element of a filter assembly in
the stepped peripheral groove of the molded base of the
semi-finished molded photosensitive assembly to assemble a molded
photosensitive assembly, wherein the photosensitive region of the
photosensitive element corresponds to the filter element includes
the following steps:
[0108] applying a glue to an annular support element of the filter
assembly;
[0109] correspondingly arranging the filter assembly on the support
element to form a glue layer of the filter assembly between an
upper surface of the filter element and the support element after
the glue is cured; and
[0110] correspondingly arranging the support element on a first top
surface of the first base portion, so that the filter element is
located in the stepped peripheral groove of the molded base.
[0111] According to another aspect of the present invention, the
present invention further provides a method for manufacturing a
molded photosensitive assembly, including the following steps:
[0112] forming, by means of a molding process, a molded base which
is used for embedding a circuit board outer portion of an edge
region of a circuit board and has a stepped peripheral groove, and
forming a light window through the stepped peripheral groove,
wherein a photosensitive region of the photosensitive element
corresponds to the light window of the molded base, so as to form a
semi-finished molded photosensitive assembly with an integrated
structure;
[0113] mounting a photosensitive element to a chip mounting region
of the circuit board, and conducting the photosensitive element and
the circuit board; and
[0114] correspondingly arranging a filter element of a filter
assembly in the stepped peripheral groove of the molded base to
assemble a molded photosensitive assembly, wherein the
photosensitive region of the photosensitive element corresponds to
the filter element.
[0115] According to another aspect of the present invention, the
present invention further provides a method for manufacturing a
camera module, including the following steps:
[0116] manufacturing a molded photosensitive assembly according to
the above-mentioned method for manufacturing a molded
photosensitive assembly; and
[0117] correspondingly arranging an optical lens on a
photosensitive path of an imaging assembly of the molded
photosensitive assembly to form a camera module.
[0118] According to one aspect of the present invention, a camera
module of the present invention that can achieve the foregoing
objectives and other objectives and advantages includes:
[0119] a camera module, characterized by including:
[0120] an optical assembly;
[0121] a filter; and
[0122] a molded photosensitive assembly mounted below the optical
assembly and the filter, wherein the molded photosensitive assembly
includes a main body, some electronic devices, a photosensitive
film and a circuit board, the circuit board is electrically
connected to the electronic devices and the photosensitive film,
the main body embeds the electronic devices and a part of the
circuit board, the photosensitive film is surrounded by a bottom
portion of the main body and keeps a distance from the filter, the
main body includes a bounding body supporting the optical assembly
thereon and a short body supporting the filter thereon, the short
body extends from an inner side of the bounding body, and a
distance between a short upper surface of the short body and the
photosensitive film is more than or equal to 0.15 mm.
[0123] In some embodiments of the present invention, the filter
includes a filter portion for filtering imaging light and an edge
portion extending outward from the filter portion, wherein the edge
portion is supported on the short upper surface of the short body
of the molded photosensitive assembly, so that the filter portion
corresponds to the photosensitive film.
[0124] In some embodiments of the present invention, the filter
portion has an incident surface and an exit surface, wherein the
incident surface faces the optical assembly, and the exit surface
faces the photosensitive film.
[0125] In some embodiments of the present invention, the edge
portion has an edge top surface, an edge side surface and an edge
bottom surface, wherein the edge top surface is coplanar with the
incident surface, and the edge bottom surface is coplanar with the
exit surface.
[0126] In some embodiments of the present invention, a distance
between the edge side surface of the edge portion of the filter and
a high inner side surface of the bounding body is more than or
equal to 0.15 mm.
[0127] In some embodiments of the present invention, a width
between the edge bottom surface of the edge portion of the filter
and the short upper surface of the short body has a maximum value,
which is equal to a width of the edge portion.
[0128] In some embodiments of the present invention, the width of
the edge portion of the filter is more than or equal to 0.25
mm.
[0129] In some embodiments of the present invention, a distance
between each electronic device and the edge side surface of the
edge portion of the filter is more than or equal to 0.25 mm.
[0130] In some embodiments of the present invention, the short
upper surface of the short body is lower than a high upper surface
of the bounding body, and a relative height of the short upper
surface of the short body is lower than a height of the highest
electronic device among the electronic devices.
[0131] In some embodiments of the present invention, a relative
height of the high upper surface of the bounding body is higher
than the height of the highest electronic device among the
electronic devices, so that the bounding body at least embeds the
highest electronic device among the electronic devices, wherein the
optical assembly is mounted on the high upper surface of the
bounding body.
[0132] In some embodiments of the present invention, a distance
between the high upper surface of the bounding body and the short
upper surface of the short body is more than 0.1 mm.
[0133] In some embodiments of the present invention, a width of the
short upper surface of the short body is a distance from the high
inner side surface of the bounding body to a short inner side
surface of the short body, which is more than or equal to 0.4
mm.
[0134] In some embodiments of the present invention, the bounding
body and the short body are shaped into like squares with chamfers,
wherein inscribed circle radii of the chamfers of the bounding body
and the short body are more than or equal to 0.3 mm.
[0135] In some embodiments of the present invention, a height of
the bounding body is more than or equal to 0.5 mm.
[0136] According to another aspect of the present invention, the
present invention further provides a method for manufacturing a
camera module, including the following steps:
[0137] I connecting a photosensitive film with some wires and some
electronic devices to a circuit board;
[0138] II placing the connected circuit board between an upper die
and a lower die; and
[0139] III embedding the electronic devices in a main body and on
the circuit board to form a molded photosensitive assembly, wherein
the main body includes a bounding body and a short body whose
height is lower than that of the bounding body.
[0140] In some embodiments of the present invention, the method for
manufacturing the camera module further includes the following
steps:
[0141] IV mounting a filter on a short upper surface of the short
body; and
[0142] V mounting an optical assembly on a high upper surface of
the bounding body.
[0143] In some embodiments of the present invention, in step III,
the short upper surface of the short body is lower than the high
upper surface of the bounding body, and a relative height of the
short upper surface of the short body is lower than a height of the
highest electronic device among the electronic devices.
[0144] In some embodiments of the present invention, the electronic
devices, the wires, and an edge of the photosensitive film are all
embedded by the main body.
[0145] In some embodiments of the present invention, step III
further includes the following steps:
[0146] III.1 injecting a molding material between an upper die and
a lower die;
[0147] III.2 curing the molding material between the upper die and
the lower die to form the main body; and
[0148] III.3 drafting the upper die and the lower die from the
molded photosensitive assembly.
[0149] In some embodiments of the present invention, an angle
between a high inner side surface of the bounding body and the
short upper surface of the short body is more than or equal to
95.degree..
[0150] In some embodiments of the present invention, step IV
further includes the following steps:
[0151] IV.1 applying a filter glue in a C shape to the short upper
surface of the short body, so that a gap is reserved between two
ends of the filter glue;
[0152] IV.2 mounting the filter on the filter glue;
[0153] IV.3 curing the filter glue; and
[0154] IV.4 filling the gap between the two ends of the filter glue
with supplementary filter glue to form the square-like filter
glue.
[0155] In some embodiments of the present invention, a length of
the gap is more than or equal to 0.7 mm and less than or equal to
1.0 mm.
[0156] According to one aspect of the present invention, a camera
module of the present invention, which can achieve the foregoing
objectives and other objectives and advantages, is suitable for
being fixed in a mounting shell, and includes:
[0157] an optical assembly;
[0158] a filter; and
[0159] a molded photosensitive assembly mounted below the optical
assembly and the filter, wherein the molded photosensitive assembly
includes a main body, some electronic devices, a photosensitive
film and a circuit board, the circuit board is electrically
connected to the electronic devices and the photosensitive film,
the photosensitive film is fixed and surrounded by a bottom portion
of the main body so as to keep a distance from the filter, the main
body includes a bounding body and a short body, the optical
assembly is eccentrically arranged on the bounding body so as to be
close to at least one side of the mounting shell, and the filter is
supported on a short upper surface of the short body.
[0160] In some embodiments of the present invention, the bounding
body has a high upper surface and a low upper surface, wherein a
height of the bounding body at the high upper surface is greater
than a height of the bounding body at the low upper surface, a part
of the optical assembly is supported on the high upper surface of
the bounding body, and the other part of the optical assembly is
supported on the low upper surface of the bounding body.
[0161] In some embodiments of the present invention, the camera
module further includes a lens glue, wherein the lens glue includes
a fixed glue layer, and the fixed glue layer is arranged between
the optical assembly and the high upper surface of the bounding
body.
[0162] In some embodiments of the present invention, the lens glue
further includes a glue filling layer, wherein the glue filling
layer is arranged between the optical assembly and the low upper
surface of the bounding body, and a thickness of the glue filling
layer is greater than a thickness of the fixed glue layer.
[0163] In some embodiments of the present invention, the high upper
surface of the bounding body is U-shaped to support the optical
assembly on three sides; wherein the low upper surface of the
bounding body is linear shaped, and the low upper surface extends
from a high outer side surface of the bounding body to the other
high outer side surface of the bounding body to support the optical
assembly on one side.
[0164] In some embodiments of the present invention, the high upper
surface of the bounding body is U-shaped to support the optical
assembly on three sides; wherein the low upper surface of the
bounding body is linear shaped, and the low upper surface extends
from a high inner side surface of the bounding body to the other
high inner side surface of the bounding body to support the optical
assembly on one side.
[0165] In some embodiments of the present invention, the high upper
surface of the bounding body is L-shaped to support the optical
assembly on two adjacent sides; wherein the low upper surface of
the bounding body is also L-shaped to support the optical assembly
on two adjacent sides.
[0166] In some embodiments of the present invention, the fixed glue
layer is U-shaped, and the glue filling layer is linear shaped, so
that the fixed glue layer and the glue filling layer form the lens
glue with a hollow square-shaped structure.
[0167] In some embodiments of the present invention, the fixed glue
layer is L-shaped, and the glue filling layer is L-shaped, so that
the fixed glue layer and the glue filling layer form the lens glue
with a hollow square-shaped structure.
[0168] In some embodiments of the present invention, the optical
assembly protrudes outward from the low upper surface of the
bounding body relative to the molded photosensitive assembly.
[0169] In some embodiments of the present invention, the electronic
devices are embedded by the bounding body, and the electronic
devices are located below the high upper surface of the bounding
body.
[0170] In some embodiments of the present invention, the electronic
devices are arranged on two or three sides of the photosensitive
film.
[0171] In some embodiments of the present invention, the low upper
surface of the bounding body is in a same height with the short
upper surface of the short body.
[0172] In some embodiments of the present invention, the optical
assembly protrudes outward from at least one side of the bounding
body relative to the molded photosensitive assembly, so that the
optical assembly is close to at least one side of the mounting
shell.
[0173] In some embodiments of the present invention, the short
upper surface of the short body is lower than the high upper
surface of the bounding body, and a relative height of the short
upper surface of the short body is lower than a height of the
highest electronic device among the electronic devices.
[0174] In some embodiments of the present invention, a distance
between the high upper surface of the bounding body and the short
upper surface of the short body is more than 0.1 mm.
[0175] In some embodiments of the present invention, a draft angle
of the high inner side surface of the bounding body is between
5.degree. and 10.degree..
[0176] In some embodiments of the present invention, a fillet
radius between the high inner side surface of the bounding body and
the short upper surface of the short body is substantially equal to
0.1 mm.
[0177] In some embodiments of the present invention, a draft angle
of the high outer side surface of the bounding body is between
5.degree. and 10.degree..
[0178] According to another aspect of the present invention, the
present invention further provides a method for manufacturing a
camera module, including the steps:
[0179] I connecting a photosensitive film with some wires and some
electronic devices to a circuit board;
[0180] II placing the connected circuit board between an upper die
and a lower die;
[0181] III embedding the electronic devices in a main body and on
the circuit board to form a molded photosensitive assembly, wherein
the main body includes a bounding body and a short body whose
height is lower than that of the bounding body;
[0182] IV mounting a filter on a short upper surface of the short
body; and
[0183] V eccentrically arranging the optical assembly on the
bounding body, so that the optical assembly is close to at least
one side of a mounting shell.
[0184] In some embodiments of the present invention, step V
includes the following steps:
[0185] V.1 fixing the optical assembly to a high upper surface of
the bounding body; and
[0186] V.2 reinforcing the optical assembly to a low upper surface
of the bounding body, wherein the low upper surface is lower than
the high upper surface.
[0187] In some embodiments of the present invention, in step V.1, a
lens glue is applied to the high upper surface of the bounding body
to form a fixed glue layer between the optical assembly and the
high upper surface of the bounding body.
[0188] In some embodiments of the present invention, step V.2
includes the following steps:
[0189] V.2.1 inverting the optical assembly and the molded
photosensitive assembly, so that the optical assembly is located
below the molded photosensitive assembly; and
[0190] V.2.2 applying the lens glue between a leg of the optical
assembly and the low upper surface of the bounding body to form a
glue filling layer.
[0191] In some embodiments of the present invention, the high upper
surface of the bounding body is U-shaped to support the optical
assembly on three sides; wherein the low upper surface of the
bounding body is linear shaped, and the low upper surface extends
from a high outer side surface of the bounding body to the other
high outer side surface of the bounding body to support the optical
assembly on one side.
[0192] In some embodiments of the present invention, the high upper
surface of the bounding body is U-shaped to support the optical
assembly on three sides; wherein the low upper surface of the
bounding body is linear shaped, and the low upper surface extends
from a high inner side surface of the bounding body to the other
high inner side surface of the bounding body to support the optical
assembly on one side.
[0193] In some embodiments of the present invention, the high upper
surface of the bounding body is L-shaped to support the optical
assembly on two adjacent sides; wherein the low upper surface of
the bounding body is also L-shaped to support the optical assembly
on two adjacent sides.
[0194] In some embodiments of the present invention, the fixed glue
layer is U-shaped, and the glue filling layer is linear shaped.
[0195] In some embodiments of the present invention, the fixed glue
layer is L-shaped, and the glue filling layer is L-shaped.
[0196] In some embodiments of the present invention, the optical
assembly protrudes outward from the low upper surface of the
bounding body relative to the molded photosensitive assembly.
[0197] In some embodiments of the present invention, an angle
between the high inner side surface of the bounding body and the
short upper surface of the short body is between 95.degree. and
100.degree..
[0198] According to one aspect of the present invention, a camera
module of the present invention that can achieve the foregoing
objectives and other objectives and advantages includes:
[0199] an optical assembly;
[0200] a filter; and
[0201] a molded photosensitive assembly, wherein the molded
photosensitive assembly is mounted below the optical assembly and
the filter; the molded photosensitive assembly includes a main
body, some electronic devices, a photosensitive film and a circuit
board; the circuit board is electrically connected to the
electronic devices and the photosensitive film, the main body
embeds the electronic devices and a part of the circuit board, the
photosensitive film is fixed and surrounded by a bottom portion of
the main body to keep a distance from the filter, and the main body
includes a bounding body supporting the optical assembly thereon,
and a short body; the short body extends from an inner side of the
bounding body, at least some of the electronic devices are embedded
by the short body, and the short body supports the filter
thereon.
[0202] In an embodiment of the present invention, the electronic
devices include at least one short device, wherein at least a part
of the short device is embedded by the short body, and a height of
each short device is less than 0.3 mm.
[0203] In an embodiment of the present invention, the
photosensitive film is electrically connected to the circuit board
through some wires, and the wires are embedded by the short body,
wherein the wires and the short devices are arranged around the
photosensitive film, and the wires and the short devices are
respectively located on different sides of the photosensitive
film.
[0204] In an embodiment of the present invention, a thickness of at
least one side of the bounding body is smaller than a thickness of
the short body, so that the optical assembly protrudes outward from
the at least one side of the bounding body relative to the molded
photosensitive assembly.
[0205] In an embodiment of the present invention, the electronic
devices further include at least one high device, wherein the high
devices are embedded by the bounding body, and a height of each
high device is more than or equal to 0.3 mm.
[0206] In an embodiment of the present invention, the high devices
and the wires are located on the same side of the photosensitive
film.
[0207] In an embodiment of the present invention, the bounding body
has a high upper surface and a low upper surface, wherein a height
of the bounding body at the high upper surface is greater than a
height of the bounding body at the low upper surface, a part of the
optical assembly is supported on the high upper surface of the
bounding body, and the other part of the optical assembly is
supported on the low upper surface of the bounding body.
[0208] In an embodiment of the present invention, each high device
among the electronic devices is embedded under the high upper
surface of the bounding body, each short device among the
electronic devices is embedded under a short upper surface of the
short body, and the short devices are located on at least one side
of the photosensitive film corresponding to the low upper surface
of the bounding body.
[0209] In an embodiment of the present invention, the optical
assembly protrudes outward from the low upper surface of the
bounding body relative to the molded photosensitive assembly.
[0210] In an embodiment of the present invention, an angle between
a high inner side surface of the bounding body and the short upper
surface of the short body is more than or equal to 100.degree..
[0211] In an embodiment of the present invention, a height
difference between the bounding body and the short body is more
than or equal to 0.1 mm.
[0212] In an embodiment of the present invention, the filter
includes a filter portion to transmit imaging light to the
photosensitive film, and an edge portion supported on the short
body of the molded photosensitive assembly.
[0213] In an embodiment of the present invention, the molded
photosensitive assembly further includes an upper cover, wherein
the upper cover is mounted on the high upper surface of the
bounding body, and the upper cover extends inward to cover the edge
portion of the filter.
[0214] In an embodiment of the present invention, a height of the
upper cover is smaller than a thickness of the filter.
[0215] According to another aspect of the present invention, the
present invention further provides a method for manufacturing a
camera module, including the following steps:
[0216] I connecting a photosensitive film with some wires and some
electronic devices to a circuit board;
[0217] II placing the connected circuit board between an upper die
and a lower die; and
[0218] III embedding the electronic devices in a main body and on
the circuit board to form a molded photosensitive assembly, wherein
the main body includes a bounding body and a short body whose
height is lower than that of the bounding body, and at least some
of the electronic devices are embedded by the short body.
[0219] In an embodiment of the present invention, the method for
manufacturing the camera module further includes the following
steps:
[0220] IV mounting a filter on a short upper surface of the short
body; and
[0221] V mounting an optical assembly on the bounding body.
[0222] In an embodiment of the present invention, the electronic
devices include at least one short device, wherein at least a part
of the short device is embedded under the short upper surface of
the short body, and a height of each short device is less than 0.3
mm.
[0223] In an embodiment of the present invention, the wires are
embedded by the short body, wherein the wires and the short devices
are arranged around the photosensitive film, and the wires and the
short devices are respectively located on different sides of the
photosensitive film.
[0224] In an embodiment of the present invention, a thickness of at
least one side of the bounding body is smaller than a thickness of
the short body, so that the optical assembly protrudes outward from
the at least one side of the bounding body relative to the molded
photosensitive assembly.
[0225] In an embodiment of the present invention, the electronic
devices further include at least one high device, wherein the high
devices are embedded by the bounding body, and a height of each
high device is more than or equal to 0.3 mm.
[0226] In an embodiment of the present invention, the high devices
and the wires are located on the same side of the photosensitive
film.
[0227] In an embodiment of the present invention, an angle between
a high inner side surface of the bounding body and the short upper
surface of the short body is more than or equal to 100.degree..
[0228] Through the understanding of the following description and
accompanying drawings, the further objectives and advantages of the
present invention are fully embodied.
[0229] These and other objectives, features and advantages of the
present invention are fully embodied by the following detailed
description, drawings and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0230] FIG. 1 is a three-dimensional schematic diagram of a camera
module according to a first preferred embodiment of the present
invention.
[0231] FIG. 2 is an exploded schematic diagram of the camera module
according to the first preferred embodiment of the present
invention.
[0232] FIG. 3 is a schematic cross-sectional view of a molded
photosensitive assembly of the camera module according to the first
preferred embodiment of the present invention.
[0233] FIG. 4A shows a first modified implementation mode of the
molded photosensitive assembly according to the first preferred
embodiment of the present invention.
[0234] FIG. 4B shows a second modified implementation mode of the
molded photosensitive assembly according to the first preferred
embodiment of the present invention.
[0235] FIG. 4C shows a third modified implementation mode of the
molded photosensitive assembly according to the first preferred
embodiment of the present invention.
[0236] FIGS. 5A and 5B are schematic cross-sectional views of a
manufacturing process of the camera module according to the first
preferred embodiment of the present invention.
[0237] FIG. 6A shows a first modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0238] FIG. 6B shows a second modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0239] FIG. 6C shows a third modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0240] FIG. 6D shows a fourth modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0241] FIG. 6E shows a fifth modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0242] FIG. 6F shows a sixth modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0243] FIG. 6G shows a seventh modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0244] FIG. 6H shows an eighth modified implementation mode of the
camera module according to the first preferred embodiment of the
present invention.
[0245] FIGS. 7A to 7D are respectively schematic flowcharts of a
method for manufacturing the molded photosensitive assembly
according to the first preferred embodiment of the present
invention.
[0246] FIG. 8 is a schematic flowchart of a method for
manufacturing the camera module according to the first preferred
embodiment of the present invention.
[0247] FIG. 9 is a schematic cross-sectional view of a camera
module according to a second preferred embodiment of the present
invention.
[0248] FIGS. 10A and 10B are schematic cross-sectional views of
manufacturing steps of the camera module according to the second
preferred embodiment of the present invention.
[0249] FIG. 11 is a schematic flowchart of a method for
manufacturing the molded photosensitive assembly according to the
second preferred embodiment of the present invention.
[0250] FIG. 12 is a schematic diagram of an electronic device with
the above-mentioned camera module of the present invention.
[0251] FIG. 13 is an existing camera module in an intelligent
device.
[0252] FIG. 14 is a cross-sectional view of a camera module
according to a third embodiment of the present invention.
[0253] FIG. 15 is a three-dimensional schematic diagram of a filter
and a molded photosensitive assembly of the camera module according
to the third embodiment of the present invention.
[0254] FIG. 16 is a schematic top view of the filter and the molded
photosensitive assembly of the camera module according to the third
embodiment of the present invention.
[0255] FIG. 17 is a schematic cross-sectional view of the filter
and the molded photosensitive assembly of the camera module
according to the third embodiment of the present invention.
[0256] FIG. 18 is a schematic cross-sectional view of the camera
module according to the third embodiment of the present invention,
illustrating a possible installation mode in a smart phone.
[0257] FIG. 19 is a schematic flowchart of a method for
manufacturing the camera module according to the third embodiment
of the present invention.
[0258] FIG. 20 is a schematic flowchart of a method for
manufacturing the camera module according to the third embodiment
of the present invention.
[0259] FIG. 21 is a schematic cross-sectional view of a possible
mode of the filter and the molded photosensitive assembly of the
camera module according to the third embodiment of the present
invention.
[0260] FIG. 22 is a schematic cross-sectional view of another
possible mode of the filter and the molded photosensitive assembly
of the camera module according to the third embodiment of the
present invention.
[0261] FIG. 23 is a schematic cross-sectional view of another
possible mode of the filter and the molded photosensitive assembly
of the camera module according to the third embodiment of the
present invention.
[0262] FIG. 24 is a schematic cross-sectional view of the camera
module according to a fourth embodiment of the present
invention.
[0263] FIG. 25 is a three-dimensional schematic diagram of the
camera module according to the fourth embodiment of the present
invention.
[0264] FIG. 26 is a schematic top view of a filter and a molded
photosensitive assembly of the camera module according to the
fourth embodiment of the present invention.
[0265] FIG. 27 is a schematic cross-sectional view of the filter
and the molded photosensitive assembly of the camera module
according to the fourth embodiment of the present invention,
illustrating a possible installation mode in a smart phone.
[0266] FIG. 28 is a schematic cross-sectional view of the camera
module according to a fifth embodiment of the present
invention.
[0267] FIG. 29 is an exploded schematic diagram of a filter and a
molded photosensitive assembly of the camera module according to
the fifth embodiment of the present invention.
[0268] FIG. 30 is a schematic top view of the filter and the molded
photosensitive assembly of the camera module according to the fifth
embodiment of the present invention.
[0269] FIG. 31 is a modified implementation mode of the camera
module according to the fifth embodiment of the present
invention.
[0270] FIG. 32 is a schematic top view of the filter and the molded
photosensitive assembly of the camera module according to the
above-mentioned modified implementation mode of the present
invention.
[0271] FIGS. 33A to 33C are schematic flowcharts of a method for
manufacturing the camera module according to the above-mentioned
modified implementation mode of the present invention.
[0272] FIGS. 34 and 35 show another modified implementation mode of
the camera module according to the fifth embodiment of the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0273] The following description is used to disclose the present
invention, so that a person skilled in the art can implement the
present invention. The preferred embodiments in the following
description are only examples, and a person skilled in the art
could conceive of other obvious variations. The basic principles of
the present invention defined in the following description may be
applied to other implementations, modifications, improvements,
equivalents, and other technical solutions that do not depart from
the spirit and scope of the present invention.
[0274] A person skilled in the art should understand that, in the
disclosure of the present invention, the terms "longitudinal",
"lateral", "upper", "lower", "front", "rear", "left", "right",
"vertical", "horizontal", "top", "bottom", "inner", "outer", and
the like indicate orientations or positional relationships based on
the orientations or positional relationships shown in the drawings.
The terms are only for description convenience of the present
invention and simplification of the description, but do not show or
imply that the indicated devices or elements must have specific
orientations or be constructed and operated in specific
orientations. Therefore, the terms should not be understood to
limit the present invention.
[0275] In the present invention, the term "a" in the claims and
specification should be understood as "one or more", that is, in
one embodiment, the number of an element may be one, and in another
embodiment, the number of the element may be multiple. Unless it is
clearly stated in the disclosure of the present invention that the
number of the element is only one, the term "a" cannot be
understood as unique or singular, and the term "a" cannot be
understood as a limitation on the number.
[0276] In the description of the present invention, it should be
understood that "first", "second", and the like are only used for
descriptive purposes, and cannot be understood as indicating or
implying relative importance. In the description of the present
invention, it should be noted that, unless otherwise specified and
defined, "connected" should be understood in a broad sense, for
example, it may be fixedly connected, detachably connected or
integrally connected; it may be mechanically connected or
electrically connected; or it may be directly connected or
connected by a medium. A person of ordinary skill in the art could
understand the specific meanings of the above terms in the present
invention according to specific circumstances.
[0277] In the description of this specification, the terms "one
embodiment", "some embodiments", "an example", "a specific
embodiment", or "some examples" and the like mean that specific
features, structures, materials or characteristics described in
conjunction with the embodiments or examples are included in at
least one embodiment or example of the present invention. In the
description, the schematic descriptions of the above terms do not
necessarily refer to the same embodiment or example. Moreover, the
specific features, structures, materials or characteristics
described can be combined appropriately in one or more embodiments
or examples. In addition, different embodiments or examples
described in this specification and features of different
embodiments or examples can be combined by a person skilled in the
art without conflicting with each other.
[0278] As electronic products, intelligent devices, and the like
have increasingly developed toward the direction of lightness,
thinness and miniaturization, more stringent requirements have been
put forward for the size (especially the height) of a camera module
as one of the standard configurations of electronic products and
intelligent devices.
[0279] However, in the assembly mode of the prior art, a chip and
electronic components are usually mounted to a circuit board first,
then a molded base is formed on the circuit board through a molding
process, a filter is mounted to a lens holder, and a lens is
mounted to a filter assembly, so that the lens is held on a
photosensitive path of the chip. However, this assembly mode of the
prior art greatly limits the height of the camera module.
[0280] On one hand, although the traditional lens holder is
replaced with the molded base to reduce the lateral size and height
of the camera module, a molding die used in the molding process
needs to avoid electronic components such as capacitors and
resistors on the circuit board (especially the sizes of the
capacitors are large, and the smallest capacitor is 0.38 mm high),
and certain safety distances have to be reserved between the
molding die and various electronic components, so the height of the
molded base is at least more than 0.4 mm; and on the other hand,
the filter is usually combined with a support element to form a
filter assembly, then the filter assembly is mounted to the molded
base, the support element is usually manufactured by an injection
molding process, which requires that the thickness of the part of
the support element for supporting the filter is basically more
than 0.15 mm, and the thickness of the filter itself is usually
0.21 mm or more, so the thickness of the filter assembly is at
least more than 0.36 mm.
[0281] Based on the above, the distance between the lens and the
circuit board is equal to the sum of the height of the molded base
and the thickness of the filter assembly (at least more than 0.76
mm), which is limited by all the above factors. The distance
between the lens of the camera module in the prior art and the
circuit board cannot be further reduced, that is, the height of the
camera module in the prior art cannot be further reduced, which
cannot meet the requirements of the market for lightness, thinness
and miniaturization of the camera module. Therefore, in order to
solve the above problems, the present invention provides a camera
module and a molded photosensitive assembly and manufacturing
methods thereof, and an electronic device.
[0282] Referring to FIGS. 1 to 8 of the accompanying drawings of
the specification of the present invention, a camera module and a
molded photosensitive assembly and manufacturing methods thereof
according to a first preferred embodiment of the present invention
are illustrated. The camera module 1' includes at least one optical
lens 10' and a molded photosensitive assembly 20', wherein the
molded photosensitive assembly 20' includes an imaging assembly
21', a filter assembly 22' and a molded base 23'. The molded base
23' embeds a part of the imaging assembly 21' after being molded,
and has at least one stepped peripheral groove 230'. The filter
assembly 22' includes at least one filter element 221', and each
filter element 221' is correspondingly arranged in each stepped
peripheral groove 230' of the molded base 23', so that each filter
element 221' of the filter assembly 22' respectively corresponds to
a photosensitive path of the imaging assembly 21'. Each optical
lens 10' is respectively arranged on the photosensitive path of the
imaging assembly 21' to form the camera module 1'.
[0283] It is worth mentioning that, although the camera module
includes only one optical lens 10' as an example in FIGS. 1 to 8
and the following description to illustrate the features and
advantages of the camera module of the present invention, a person
skilled in the art could understand that the camera module
disclosed in FIGS. 1 to 8 and the following description is only an
example, which does not constitute a limitation to the content and
scope of the present invention. For example, in other examples of
the camera module, the number of the optical lens 10' may also
exceed one to form an array camera module.
[0284] As shown in FIG. 2, the imaging assembly 21' of the molded
photosensitive assembly 20' includes a circuit board 211' and at
least one photosensitive element 212', and each photosensitive
element 212' is respectively mounted to a different position of the
circuit board 211'.
[0285] Further, as shown in FIG. 3, the circuit board 211' includes
at least one flat chip mounting region 2111' and an edge region
2112', wherein each chip mounting region 2111' and the edge region
2112' are integrally formed, and the edge region 2112' is located
around the chip mounting region 2111'. Each photosensitive element
212' is respectively mounted to each chip mounting region 2111' of
the circuit board 211' to ensure the flatness of each
photosensitive element 212' mounted to each chip mounting region
2111'. For example, in the specific example shown in FIG. 3, the
circuit board 211' may include one chip mounting region 2111' and
one edge region 2112', wherein the chip mounting region 2111' is
located at a middle part of the circuit board 211', and the edge
region 2112' is located at an outer part of the circuit board
211'.
[0286] Generally, as shown in FIG. 3, the circuit board 211'
further includes at least one group of circuit board connectors
2113', wherein each circuit board connector 2113' is respectively
arranged in the edge region 2112' of the circuit board 211'.
[0287] As shown in FIG. 3, the photosensitive element 212' includes
a photosensitive region 2121', a non-photosensitive region 2122',
and at least one group of chip connectors 2123'. The photosensitive
region 2121' and the non-photosensitive region 2122' are integrally
formed, and the non-photosensitive region 2122' is located around
the photosensitive region 2121', that is, the photosensitive region
2121' is located at a middle part of the photosensitive element
212', the non-photosensitive region 2122' is located at an outer
part of the photosensitive element 212', and the non-photosensitive
element 2122' is arranged around the photosensitive region 2121'.
Each chip connector 2123' is respectively arranged in the
non-photosensitive region 2122' of the photosensitive element
212'.
[0288] As shown in FIG. 3, the imaging assembly 21' further
includes at least one group of leads 213', wherein each lead has a
circuit board connecting end and a chip connecting end, each lead
213' respectively extends between the chip connecting end and the
circuit board connecting end in a curved manner, the chip
connecting end of each lead 213' is respectively connected to each
chip connector of the photosensitive element 212', the circuit
board connecting end of each lead 213' is respectively connected to
each circuit board connector of the circuit board 211', and
correspondingly, the photosensitive element 212' and the circuit
board 211' are conducted.
[0289] It is worth mentioning that the type of the leads 213' may
not be limited. For example, the leads 213' may be gold wires, that
is, after the photosensitive element 212' is mounted to the chip
mounting region 2111' of the circuit board 211', the gold wires
213' can conduct the photosensitive element 212' and the circuit
board 211' by means of a wire bonding process. Nevertheless, in
other examples, the leads 213' may also be other types of leads,
such as silver wires and copper wires, to ensure that the leads
213' can conduct the photosensitive element 212' and the circuit
board 211'.
[0290] It is worth noting that, in an example of the camera module
of the present invention, each circuit board connector 2113' of the
circuit board 211' and each chip connector 2123' of the
photosensitive element 212' may be respectively connecting plates,
that is, each circuit board connector 2113' of the circuit board
211' and each chip connector 2123' of the photosensitive element
212' may be respectively in a shape of a plate, so that the circuit
board connecting end and the chip connecting end of the lead 213'
are respectively connected to the circuit board connector 2113' of
the circuit board 211' and the chip connector 2123' of the
photosensitive element 212'. In another example of the camera
module of the present invention, the circuit board connector 2113'
of the circuit board 211' and the chip connector 2123' of the
photosensitive element 212' may be respectively spherical. For
example, solder paste or other soldering material is spotted on the
edge region 2112' of the circuit board 211' and the
non-photosensitive region 2122' of the photosensitive element 212'
to respectively form the circuit board connector 2113' of the
circuit board 211' and the chip connector 2123' of the
photosensitive element 212'. Nevertheless, a person skilled in the
art could understand that the types of the circuit board connector
2113' of the circuit board 211' and the chip connector 2123' of the
photosensitive element 212' do not limit the type and scope of the
camera module of the present invention, that is, in other examples
of the camera module, the circuit board connector 2113' of the
circuit board 211' and the chip connector 2123' of the
photosensitive element 212' may also be in other shapes which are
not mentioned above.
[0291] In addition, as shown in FIG. 3, the imaging assembly 21'
further includes a group of electronic components 214', and the
electronic components 214' can be mounted at intervals to the edge
region 2112' of the circuit board 211' by a process such as SMT
(Surface Mount Technology). It is worth mentioning that the
photosensitive element 212' and each electronic component 214' may
be respectively located on the same side or opposite sides of the
circuit board 211'. For example, in a specific example shown in
FIG. 3, the photosensitive element 212' and each electronic
component 214' may be located on the same side of the circuit board
211', the photosensitive element 212' is mounted to the chip
mounting region 2111' of the circuit board 211', and the electronic
components 214' are respectively mounted at intervals to the edge
region 2112' of the circuit board 211'. It should be understood
that, in the camera module of the present invention, the type of
the electronic components 214' may not be limited. For example, the
electronic components 214' may be implemented as resistors,
capacitors, driving devices, and the like.
[0292] According to the first preferred embodiment of the present
invention, as shown in FIG. 3, each stepped peripheral groove 230'
of the molded base 23' of the molded photosensitive assembly 20'
respectively defines a light window 2301', and each filter element
221' arranged in each stepped peripheral groove 230' respectively
corresponds to each light window, wherein the photosensitive region
2121' of each photosensitive element 212' respectively corresponds
to each light window 2301', so that each light window 2301'
provides a light path for each optical lens 10' and each
photosensitive element 212', and each filter element 221' is
correspondingly located in the light path. For example, in the
specific example shown in FIG. 3, the filter assembly 22' includes
one filter element 221', and the molded base 23' has one stepped
peripheral groove 230' to define the light window 2301', wherein
the filter element 221' is located between the optical lens 10' and
the photosensitive element 212', and the filter element 221', the
optical lens 10' and the photosensitive element 212' all correspond
to the light window 2301', which provides the light path for the
filter element 221', the optical lens 10' and the photosensitive
element 212', so that a light entering the camera module 1' from
the optical lens 10' can be received by the photosensitive region
2121' of the photosensitive element 212' and subjected to
photoelectric conversion after being filtered by the filter element
221'.
[0293] A person skilled in the art could understand that, in
different examples of the camera module, the filter element 221'
can be implemented in different types. For example, the filter
element 221' can be implemented as an infrared cut-off filter, a
full transmission spectrum filter and other filters or a
combination of a plurality of filters. For example, the filter
element 221' can be implemented as a combination of an infrared
cut-off filter and a full transmission spectrum filter, that is,
the infrared cut-off filter and the full transmission spectrum
filter can be switched to be selectively located on the
photosensitive path of the photosensitive assembly 21'. For
example, when the camera module is used in an environment with
sufficient light such as daytime, the infrared cut-off filter can
be switched to the photosensitive path of the photosensitive
element 212', so that the infrared cut-off filter filters infrared
in a light reflected by an object to enter the camera module. When
the camera module is used in a dark environment such as night, the
full transmission spectrum filter can be switched to the
photosensitive path of the photosensitive element 212' to transmit
the infrared in the light reflected by an object to enter the
camera module.
[0294] It is worth noting that, the filter element 221' of the
filter assembly 22' is arranged in the stepped peripheral groove
230' of the molded base 23', so in the camera module 1' provided by
the present invention, a distance between the optical lens 10' and
the circuit board 211' is no longer limited by a thickness of the
filter assembly 22' itself, that is, the distance between the
optical lens 10' and the circuit board 211' can be reduced to be
smaller than a sum of the thickness of the filter assembly 22' and
a height of the molded base 23', thereby reducing a height of the
camera module 1'.
[0295] Specifically, as shown in FIGS. 2 and 3, the molded base 23'
includes a first base portion 231' and a second base portion 232',
wherein the second base portion 232' integrally extends inward from
a first inner circumferential surface 2311' of the first base
portion 231' along the circuit board 211', and a height of the
first base portion 231' is greater than a height of the second base
portion 232', so that the first base portion 231' and the second
base portion 232' form the stepped peripheral groove 230', and the
first inner circumferential surface 2311' of the first base portion
231' and a second inner circumferential surface 2321' of the second
base portion 232' form the light window 2301'. In other words, the
first base portion 231' is located around the second base portion
232', wherein a first bottom surface 2313' of the first base
portion 231' and a second bottom surface 2323' of the second base
portion 232' are attached to the circuit board 211', and a first
top surface 2312' of the first base portion 231' is higher than a
second top surface 2322 of the second base portion 232' to form the
stepped peripheral groove 230' on an inner circumferential edge of
the molded base 23'.
[0296] Therefore, in the first preferred embodiment according to
the present invention, as shown in FIG. 3, the first top surface
2312' of the first base portion 231' of the molded base 23' is
defined as a first mounting surface of the molded base 23' for
mounting the optical lens 10; and the second top surface 2322' of
the second base portion 232' of the molded base 23' is defined as a
second mounting surface of the molded base 23' for mounting the
filter element 221'. Since the second mounting surface is lower
than the first mounting surface, a mounting height of the filter
element 221' is reduced, a back focus length of the optical lens
10' of the camera module 1' is also reduced, and an overall height
of the camera module 1' is reduced to meet the requirements of the
market for lightness, thinness and miniaturization development of
the camera module. It should be understood that, compared with the
camera module in the prior art, not only a support element in the
filter assembly is omitted, but also the filter is directly mounted
on the second mounting surface of the molded base 23', and the lens
is directly mounted on the first mounting surface of the molded
base 23', which not only reduces the mounting height of the filter,
but also reduces the distance between the lens and the circuit
board to reduce the overall height of the camera module.
[0297] Preferably, the first top surface 2312' of the first base
portion 231' and a photosensitive surface of the photosensitive
element 212' are parallel to each other, which facilitates
subsequent active calibration of the optical lens 10' mounted on
the first top surface 2312' and the photosensitive element
212'.
[0298] In addition, as shown in FIG. 3, the second top surface
2322' of the second base portion 232' and the first top surface
2312' of the first base portion 231' are parallel to each other,
that is, the second top surface 2322' of the second base portion
232' is also parallel to the photosensitive surface of the
photosensitive element 212', so that the filter element 221'
mounted on the second top surface 2322' is kept parallel to the
photosensitive element 212'.
[0299] According to the first preferred embodiment of the present
invention, as shown in FIGS. 2 and 3, after the molded base 23' is
formed by a molding process, the molded base 23' embeds at least a
part of the edge region 2112 of the circuit board 211', each
electronic component 214', each lead 213', and at least a part of
the non-photosensitive region 2122' of the photosensitive element
212', to combine the circuit board 211', the photosensitive element
212', the leads 213', and the electronic components 214' of the
imaging assembly 21' into a whole, so that the imaging assembly 21'
and the molded base 23' form an integrated structure.
[0300] Exemplarily, as shown in FIG. 3, the first base portion 231'
of the molded base 23' embeds at least a part of the edge region
2112' of the circuit board 211' and each electronic component 214',
so that the first base portion 231' of the molded base 23' isolates
the adjacent electronic components 214'. Correspondingly, the
second base portion 232' of the molded base 23' embeds at least a
part of the edge region 2112' of the circuit board 211', each lead
213' and at least a part of the non-photosensitive region 2122' of
the photosensitive element 212', so that the second base portion
232' of the molded base 23' isolates the adjacent leads 213'.
[0301] Specifically, as shown in FIG. 3, the non-photosensitive
region 2122' of the photosensitive element 212' has a chip inner
portion 21221', a chip connecting portion 21222' and a chip outer
portion 21223', wherein the chip inner portion 21221' is located
around the photosensitive region 2121', the chip connecting portion
21222' extends inward and outward respectively to be connected to
the chip inner portion 21221' and the chip outer portion 21223',
and each chip connector 2123' is arranged at the chip connecting
portion 21222'. In other words, in the present invention, a region
of the photosensitive element 212' that is used to arrange the chip
connectors 2123' is defined as the chip connecting portion 21222',
a region of the photosensitive element 212' from the chip
connecting portion 21222' to the photosensitive region 2121' is
defined as the chip inner portion 21221', and a region of the
photosensitive element 212' from the chip connecting portion 21222'
to an outer edge of the photosensitive element 212' is defined as
the chip outer portion 21223'. In other words, when the
photosensitive element 212' is looked from a top view, the
photosensitive region 2121', the chip inner portion 21221', the
chip connecting portion 21222', and the chip outer portion 21223'
are sequentially from inside to outside.
[0302] Similarly, as shown in FIG. 3, the edge region 2112' of the
circuit board 211' has a circuit board inner portion 21121', a
circuit board connecting portion 21122' and a circuit board outer
portion 21123', wherein the circuit board inner portion 21121' is
located around the chip mounting region 2111', the circuit board
connecting portion 21122' extends inward and outward respectively
to be connected to the circuit board inner portion 21121' and the
circuit board outer portion 21123', and the circuit board connector
2113' is arranged at the circuit board connecting portion 21122'.
In other words, in the present invention, a region of the circuit
board 211' that is used to arrange the circuit board connector
2113' is defined as the circuit board connecting portion 21122', a
region of the circuit board 211' from the circuit board connecting
portion 21122' to the chip mounting region 2111' is defined as the
circuit board inner portion 21121', and a region of the circuit
board 211' from the circuit board connecting portion 21122' to an
outer edge of the circuit board 211' is defined as the circuit
board outer portion 21123'. In other words, when the circuit board
211' is looked from a top view, the chip mounting region 2111', the
circuit board inner portion 21121', the circuit board connecting
portion 21122', and the circuit board outer portion 21123' are
sequentially from inside to outside.
[0303] In this way, as shown in FIG. 3, the first base portion 231'
of the molded base 23' is configured to embed the circuit board
outer portion 21123' of the edge region 2112' of the circuit board
211', and the second base portion 232' of the molded base 23' is
configured to embed the circuit board connecting portion 21122' and
the circuit board inner portion 21121' of the edge region 2112' of
the circuit board 211', as well as the chip outer portion 21223'
and the chip connecting portion 21222' of the non-photosensitive
region 2122' of the photosensitive element 212', so that each
electronic component 214' is embedded by the first base portion
231' of the molded base 23', and each lead 213' is embedded by the
second base portion 232' of the molded base 23'. It is worth
mentioning that, in the present invention, a height of the first
base portion 231' of the molded base 23' is limited by a height of
each electronic component 214', and a height of the second base
portion 232' of the molded base 23' is limited by an arc height of
each lead 213'.
[0304] During the process of forming the molded base 23' through
the molding process, in order to avoid any contact between the
molding die used and each electronic component 214' and each lead
213', a certain safety gap should be reserved between the molding
die used and each electronic component 214' and each lead 213'.
Therefore, the height of the first base portion 231' has to be
greater than a height of the highest electronic component among the
electronic components 214', and the height of the second base
portion 232' has to be greater than the arc height of the highest
lead among the leads 213'. In addition, capacitors in the
electronic components 214' are relatively high (the smallest
capacitor currently is 0.38 mm), and heights of the capacitors are
also greater than the arc heights of the leads 213', so the height
of the second base portion 232' may be smaller than the height of
the first base portion 231', which can reduce the height of the
filter element 221' mounted on the second top surface 2322' of the
second base portion 232'.
[0305] Preferably, as shown in FIG. 3, the height of the second
base portion 232' is smaller than the height of the electronic
component 214', that is, the second top surface 2322' of the second
base portion 232' is lower than a top surface of the electronic
component 214', so that a lower surface 2211' of the filter element
221' is lower than the top surface of the electronic component
214'. Of course, since different electronic components 214' have
different heights, in some other embodiments of the present
invention, the height of the second base portion 232' only needs to
be smaller than the height of the highest electronic component
among the electronic components 214', that is, the second top
surface 2322' of the second base portion 232' only needs to be
lower than the top surface of the highest electronic component
214'.
[0306] It should be understood that a height difference between the
first base portion 231' and the second base portion 232' may be
designed according to a height difference between the electronic
component 214' and the lead 213', while the thickness of the filter
element 221' is designed according to the filter performance and
the manufacturing process, so that an upper surface 2212' of the
filter element 221' may be higher than the first top surface 2312'
of the first base portion 231', or may be lower than the first top
surface 2312' of the first base portion 231', or may be in a same
height with the first top surface 2312' of the first base portion
231'. Of course, in the first preferred embodiment of the present
invention, since the thickness of the filter element 221' is
greater than the height difference between the first base portion
231' and the second base portion 232', when the lower surface 2211'
of the filter element 221' is mounted to the second top surface
2322' of the second base portion 232', the upper surface 2212' of
the filter element 221' is higher than the first top surface 2321'
of the first base portion 231'.
[0307] FIG. 4A shows a first modified implementation mode of the
molded photosensitive assembly 20' according to the first preferred
embodiment of the present invention, wherein the first base portion
231' of the molded base 23' is configured to embed the circuit
board outer portion 21123' and the circuit board connecting portion
21122' of the edge region 2112' of the circuit board 211', and the
second base portion 232' of the molded base 23' is configured to
embed the circuit board inner portion 21121' of the edge region
2112' of the circuit board 211', as well as the chip outer portion
21223', the chip connecting portion 21222' and a part of the chip
inner portion 21221' of the non-photosensitive region 2122' of the
photosensitive element 212', so that each electronic component 214'
is embedded by the first base portion 231' of the molded base 23',
each lead 213' is jointly embedded by the first base portion 231'
and the second base portion 232' of the molded base 23', and the
first and second base portions 231' and 232' of the molded base 23'
jointly isolate the adjacent leads 213'.
[0308] In this way, since a distance between the second base
portion 232' of the molded base 23' and the electronic component
214' is increased, when the electronic component 232' is close to
the lead 213', the electronic component 232' does not affect an
assembly process of the second base portion 232' of the molded base
23', in other words, when the molded base 23' is molded, the
electronic component 214' does not interfere with a part for
molding the second base portion 232' in the molding die to ensure a
normal progress of the molding process.
[0309] FIG. 4B shows a second modified implementation mode of the
molded photosensitive assembly 20' according to the first preferred
embodiment of the present invention, wherein the first base portion
231' of the molded base 23' is configured to embed the circuit
board outer portion 21123', the circuit board connecting portion
21122' and the circuit board inner portion 21121' of the edge
region 2112' of the circuit board 211', and the second base portion
232' of the molded base 23' is configured to embed the chip outer
portion 21223', the chip connecting portion 21222' and a part of
the chip inner portion 21221' of the non-photosensitive region
2122' of the photosensitive element 212', so that each electronic
component 214' is embedded by the first base portion 231' of the
molded base 23', each lead 213' is jointly embedded by the first
base portion 231' and the second base portion 232' of the molded
base 23', and the first and second base portions 231' and 232' of
the molded base 23' jointly isolate the adjacent leads 213'. In
other words, the first base portion 231' of the molded base 23'
embeds the edge region 2112' of the circuit board 211', and the
second base portion 232' of the molded base 23' embeds a part of
the non-photosensitive region 2122' of the photosensitive element
212', which facilitates an installation position of the electronic
component 214' to be closer to the circuit board connector 2113' of
the circuit board 211', so as to reduce an overall size of the
circuit board 211'.
[0310] FIG. 4C shows a third modified implementation mode of the
molded photosensitive assembly 20' according to the first preferred
embodiment of the present invention, wherein the first base portion
231' of the molded base 23' is configured to embed the edge region
2112' of the circuit board 211' and the chip outer portion 21223'
of the non-photosensitive region 2122' of the photosensitive
element 212', and the second base portion 232' of the molded base
23' is configured to embed the chip connecting portion 21222' and a
part of the chip inner portion 21221' of the non-photosensitive
region 2122' of the photosensitive element 212', so that each
electronic component 214' is embedded by the first base portion
231' of the molded base 23', each lead 213' is jointly embedded by
the first base portion 231' and the second base portion 232' of the
molded base 23', and the adjacent leads 213' are jointly isolated
by the first base portion 231' and second base portion 232' of the
molded base 23'.
[0311] In other words, the first base portion 231' of the molded
base 23' not only embeds the edge region 2112' of the circuit board
211', but also embeds a part of the non-photosensitive region 2122'
of the photosensitive element 212', so that the first base portion
231' enhances the connection strength between the photosensitive
element 212' and the circuit board 211'. At the same time, since
the second base portion 232' of the molded base 23' only embeds a
part of the non-photosensitive region 2122' of the photosensitive
element 212', a lateral size of the stepped peripheral groove 230'
of the molded base 23' is smaller than a lateral size of the
photosensitive element 212'. Therefore, a lateral size of the
filter element 221' arranged in the stepped peripheral groove 230'
is also smaller than the lateral size of the photosensitive element
212', but greater than a lateral size of the photosensitive region
2121' of the photosensitive element 212'. In this way, it can not
only ensure that the filter element 221' completes the
corresponding filtering effect, but also can reduce a size of the
filter element 221' as much as possible, because the larger filter
element 221' is more easily broken and is higher in cost.
[0312] Referring to FIGS. 1 to 5B, the camera module 1' further
includes at least one driver 30', wherein each optical lens 10' is
respectively assembled to each driver 30', and each driver 30' is
respectively assembled to the first top surface 2312' of the first
base portion 231' of the molded base 23', so that each optical lens
10' is respectively held on the photosensitive path of each
photosensitive element 212' of the molded photosensitive assembly
20'. In addition, when the camera module is used, the driver 30'
can drive the optical lens 10' to move back and forth along the
photosensitive path of the photosensitive element 212' to adjust a
focal length of the camera module by means of adjusting the
distance between the optical lens 10' and the photosensitive
element 212'. The type of the driver 30' of the camera module 1' of
the present invention is not limited. The driver 30' may be
implemented as a voice coil motor, which can be electrically
connected to the circuit board 211' to be in a working state after
receiving electric energy and a control signal, so as to drive the
optical lens 10' to move back and forth along the photosensitive
path of the photosensitive element 212'. Nevertheless, a person
skilled in the art could understand that the type of the driver 30'
is not limited, as long as it can drive the optical lens 10' to
move back and forth along the photosensitive path of the
photosensitive element 212'.
[0313] Referring to FIGS. 5A and 5B, a manufacturing process of the
camera module 1' according to the first preferred embodiment of the
present invention is shown. A person skilled in the art should
understand that the manufacturing process of the molded
photosensitive assembly 20' and the manufacturing process of the
camera module 1' shown in FIGS. 5A and 5B are only examples to
illustrate the features and advantages of the present invention,
and do not constitute limitations to the content and scope of the
present invention.
[0314] Specifically, in FIG. 5A, the photosensitive element 212' is
mounted to the chip mounting region 2111' of the circuit board
211', so that the chip connecting end of each lead 213' is
connected to each chip connector 2123' of the photosensitive
element 212', and the circuit board connecting end of each lead
213' is connected to each circuit board connector 2113' of the
circuit board 211'. The electronic components 214' are respectively
mounted at intervals to the circuit board outer portion 21123' of
the edge region 2112' of the circuit board 211' to assemble the
imaging assembly 21'.
[0315] In FIG. 5A, the imaging assembly 21' is put into a molding
die 500', the molding process is performed by means of the molding
die 500' to form the molded base 23' with the stepped peripheral
groove 230', and the molded base 23' embeds the edge region 2112'
of the circuit board 211' and a part of the non-photosensitive
region 2122' of the photosensitive element 212'. A person skilled
in the art should understand that, in other embodiments of the
present invention, a plurality of imaging assemblies 21' can be
simultaneously put into a molding die, and the molding process is
performed on the plurality of imaging assemblies 21' by means of
the molding die to form a plurality of molded bases 23' with the
stepped peripheral grooves 230'.
[0316] Specifically, the molding die 500' includes an upper die
510' and a lower die 520', wherein at least one of the upper and
lower dies 510' and 520' can be moved, so that the upper die 510'
and the lower die 520' can be clamped and drafted; and when the
molding die 500' is in a clamped state, a molding space 530' is
formed between the upper die 510' and the lower die 520', wherein
the molded base 23' is formed by adding a molding material into the
molding space 530' and curing the same.
[0317] More specifically, the upper die 510' has a first inner
surface 511', a second inner surface 512', and a pressing surface
513', wherein the second inner surface 512' is located around the
first inner surface 511', and the second inner surface 512' is
located between the first inner surface 511' and the pressing
surface 513', wherein the second inner surface 512' is lower than
the first inner surface 511', and the pressing surface 513' is
lower than the second inner surface 512'.
[0318] In FIG. 5A, after the imaging assembly 21' is placed in the
upper die 510' and/or the lower die 520', the upper die 510' and
the lower die 520' are operated to clamp the molding die, so that
the imaging assembly 21' is located in the molding space 530'
formed between the upper die 510' and the lower die 520'. At this
time, the first inner surface 511' of the upper die 510'
corresponds to the circuit board outer portion 21123' of the edge
region 2112' of the circuit board 211' so as to define a first
molding space 531' between the first inner surface 511' and the
circuit board 211', and the molding material is added to the first
molding space 531' and cured to form the first base portion 231;
the second inner surface 512 of the upper die 510' corresponds to
the circuit board connecting portion 21122' and the circuit board
inner portion 21121' of the edge region 2112' of the circuit board
211', as well as the chip outer portion 21223' and the chip inner
portion 21221' of the non-photosensitive element 2122' of the
photosensitive element 212' so as to define a second molding space
532' between the second inner surface 512' and the circuit board
211', and the molding material is added to the second molding space
532' and cured to form the second base portion 232'; the pressing
surface 513' of the upper die 510' presses the photosensitive
element 212'; the photosensitive element 212' is located in the
chip mounting region 2111' of the circuit board 211', and the chip
mounting region 2111' is located at the middle part of the circuit
board 211', so the circuit board 211' can be flattened by means of
the pressing surface 513', which ensures the overall flatness of
the circuit board 211', and also provides a flat molding base
surface for the molding process.
[0319] It is worth noting that the first molding space 531' is
communicated with the second molding space 532' to form the molding
space 530' with an integrated structure, so that the molding
material can flow into the second molding space 532' from the first
molding space 531' to form the molded base 23' with an integrated
structure after the molding material is cured. It should be
understood that, when the molding material is cured in the molding
space 530' to form the molded base 23', the first inner surface
511' of the upper die 510' corresponds to the first top surface
2312' of the first base portion 231' of the molded base 23', and
the second inner surface 512' of the upper die 510' corresponds to
the second top surface 2322' of the second base portion 232' of the
molded base 23'. The first inner surface 511' of the upper die 510'
is higher than the second inner surface 512' of the upper die 520',
so that the height of the first base portion 231' is greater than
the height of the second base portion 232', and the stepped
peripheral groove 230' is formed on the inner circumferential edge
of the molded base 23'.
[0320] It is worth mentioning that the first inner surface 511' and
the second inner surface 512' of the upper die 510' are both
parallel to the pressing surface 513' of the upper die 510'. When
the pressing surface 513' presses the photosensitive element 212'
in an overlapping manner, the first inner surface 511' and the
second inner surface 512' are both parallel to the photosensitive
element 212', and after the molded base 23' is formed, the first
top surface 2312' and the second top surface 2322' are both
parallel to the photosensitive element 212', which facilitates
active calibration in the subsequent assembly process.
[0321] Further, as shown in FIG. 5A, the molding die 500' further
includes a cover film 540', wherein the cover film 540' is
overlapped on the pressing surface 513' of the upper die 510'. When
the pressing surface 513' of the upper die 510' presses the
photosensitive element 212', the cover film 540' is located between
the pressing surface 513' of the upper die 510' and the
photosensitive element 212' to prevent the pressing surface 513' of
the upper die 510' from scratching the photosensitive element 212'
or contaminating the photosensitive element 212'. In addition, the
cover film 540' can also prevent the generation of a gap between
the pressing surface 513' of the upper die 510' and the
photosensitive element 212', so as to prevent, during the molding
process, the molding material from entering between the pressing
surface 513' of the upper die 510' and the photosensitive element
212' to contaminate the photosensitive region 2121' of the
photosensitive element 212'. Of course, the cover film 540' can
also absorb the impact force generated at the moment of contact
between the pressing surface 513' of the upper die 510' and the
photosensitive element 212' when the upper die 510' and the lower
die 520' are clamped, thereby avoiding the damage of the
photosensitive element 212' by the clamping of the upper die 510'
and the lower die 520'.
[0322] In other embodiments of the present invention, the cover
film 540' of the molding die 500' has an annular structure, wherein
the cover film 540' is arranged on a peripheral edge of the
pressing surface 513 of the upper die 510', and after the upper and
lower dies 510' and 520' are clamped, the cover film 540'
correspondingly presses the chip inner portion 21221' of the
non-photosensitive region 2122' of the photosensitive element 212',
to prevent the cover film 540' and the pressing surface 513' from
directly contacting the photosensitive region 2121' of the
photosensitive element 212', so that the photosensitive region
2121' of the photosensitive element 212' is not damaged by external
pressure.
[0323] As shown in FIG. 5B, after the molding material is cured in
the molding space 530' to form the molded base 23', a semi-finished
molded photosensitive assembly is formed, wherein the semi-finished
molded photosensitive assembly includes the imaging assembly 21'
and the molded base 23'. Next, the upper die 510' and the lower die
520' are operated for being drafted to open the molding space 530'
of the molding die 500' for taking out the semi-finished molded
photosensitive assembly from the molding space 530'. Then, the
filter element 221' is mounted to the second top surface 2322' of
the second base portion 232' of the molded base 23' to form the
molded photosensitive assembly 20'.
[0324] Generally, for better drafting operation, the inner
circumferential surface of the molded base 23' has a certain
inclination angle relative to the photosensitive surface of the
photosensitive element 212'. In other words, as shown in FIGS. 3
and 5A, the first inner circumferential surface 2311' of the first
base portion 231' has a first predetermined inclination angle
.theta..sub.1 relative to the photosensitive surface of the
photosensitive element 212', the second inner circumferential
surface 2321' of the second base portion 232' also has a second
predetermined inclination angle .theta..sub.2 relative to the
photosensitive surface of the photosensitive element 212', a width
of the first top surface 2312' of the first base portion 231' is
smaller than a width of the first bottom surface 2313' of the first
base portion 231', and a width of the second top surface 2322' of
the second base portion 232' is smaller than a width of the second
bottom surface 2323' of the second base portion 232'.
[0325] However, in order that the filter element 221' has a wider
attachment surface, that is, the second base portion 232' has the
wider second top surface 2322', the first and second predetermined
inclination angles .theta..sub.1 and .theta..sub.2 are as small as
possible, and even the first and second predetermined inclination
angles .theta..sub.1 and .theta..sub.2 may be zero (that is, the
first inner circumferential surface 2311' and the second inner
circumferential surface 2321' may be perpendicular to the
photosensitive surface of the photosensitive element 212').
[0326] Preferably, the first and second predetermined inclination
angles .theta..sub.1 and .theta..sub.2 are less than 30.degree. to
increase an attachment area between the filter element 221' and the
second top surface 2322' of the second base portion 232', to
improve the reliability of adhesion between the filter element 221'
and the second base portion 232', and to prevent the filter element
221' from shifting or falling off.
[0327] According to the first preferred embodiment of the present
invention, as shown in FIG. 5B, the filter assembly 22' further
includes a glue layer 222', wherein the glue layer 222' is arranged
between the second top surface 2322' of the second base portion
232' and the filter element 221' to bond the filter element 221'
with the second base portion 232' together, so that the filter
element 221' is fixedly mounted to the stepped peripheral groove
230' of the molded base 23', and the filter element 221'
corresponds to the light window 2301' of the molded base 23'.
[0328] Specifically, in the implementation mode of mounting the
filter element 221' as shown in FIG. 5B, a glue is first applied to
the second top surface 2322' of the second base portion 232', then
the filter element 221' is correspondingly arranged on the second
top surface 2322' of the second base portion 232' to form the glue
layer 222' between the second top surface 2322' of the second base
portion 232' and the lower surface 2211' of the filter element 221'
after the glue is cured, and the glue layer 222' fixedly connects
the filter element 221' and the second base portion 232' of the
molded base 23'.
[0329] In another implementation mode of mounting the filter
element 221' in the present invention, the glue may also be first
applied to the lower surface 2211' of the filter element 221', then
the filter element 221' is correspondingly arranged on the second
top surface 2322' of the second base portion 232' to form the glue
layer 222' between the second top surface 2322' of the second base
portion 232' and the lower surface 2211' of the filter element 221'
after the glue is cured, and the glue layer 222' fixedly connects
the filter element 221' and the second base portion 232' of the
molded base 23'.
[0330] It is worth mentioning that the glue used to form the glue
layer 222' may be thermosetting glue or other types of glue.
Preferably, the glue layer 222' may have good elasticity to prevent
the filter element 221' from being damaged when the camera module
1' undergoes collision. More preferably, the glue forming the glue
layer 222' has low fluidity to prevent the glue from flowing down
from the second inner circumferential surface 2321' of the second
base portion 232', so as to ensure the yield of the camera module.
The reason for selecting the glue with low fluidity is that, on one
hand, the reflectivity of the cured glue is greater than that of
the molded base 23', and once the glue flows to the second inner
circumferential surface 2321', stray light may be brought to the
camera module; and on the other hand, if the glue flows to the
photosensitive region 2121' of the photosensitive element 212', the
photosensitive region 2121' of the photosensitive element 212' will
be contaminated.
[0331] In addition, as shown in FIG. 5B, a mounting gap 2302' is
reserved between the filter element 221' and the first inner
circumferential surface 2311' of the first base portion 231', that
is, a lateral size of the stepped peripheral groove 230' of the
molded base 23' is greater than a lateral size of the filter
element 221', which facilitates the attachment of the filter
element 221' to the second top surface 2322' of the second base
portion 232'. In this way, because the peripheral edge of the
filter element 221' does not directly contact the first base
portion 231', and the mounting gap 2302' is reserved for safety,
the transmission of received stress to the filter element 221' by
the first base portion 231' of the molded base 23' can be
effectively avoided to prevent damaging the filter element 221'. Of
course, the lateral size of the filter element 221' is smaller than
the lateral size of the stepped peripheral groove 230' of the
molded base 23', which is also advantageous for mounting the filter
element 221' to the stepped peripheral groove 230'.
[0332] Preferably, as shown in FIG. 5B, the glue layer 222' has at
least one air escape hole 2221', wherein the air escape hole 2221'
extends from an inner side of the glue layer 222' to an outer side
of the glue layer 222', an inner space of the glue layer 222' is
communicated with the mounting gap 2302' by the air escape hole
2221', and an inner space of the molded photosensitive assembly 20'
is then communicated with an outer space of the molded
photosensitive assembly 20', so that when the filter element 221'
is mounted to the stepped peripheral groove 230' of the molded base
23', air between the filter element 221' and the photosensitive
element 212' is allowed to escape to the outside through the air
escape hole 2221' to prevent the mounting of the filter element
221' from being affected.
[0333] In other words, the glue is applied to the second top
surface 2322' of the second base portion 232' in a discontinuous
manner to form the glue layer 222' with the air escape hole 2221'
after the glue is cured. That is to say, a circle of the glue
cannot be applied to the second top surface 2322' of the second
base portion 232', but the glue is applied discontinuously to
reserve at least one gap, so that the air escape hole 2221' is
formed on the glue layer 222' after the glue is cured.
[0334] In FIGS. 3 and 5B, the optical lens 10' is assembled to the
driver 30', and the driver 30' is assembled to the first top
surface 2312' of the first base portion 231 of the molded base 23',
so that the optical lens 10' is held on the photosensitive path of
the photosensitive element 212' to form the camera module 1'.
[0335] FIG. 6A shows a first modified implementation mode of the
camera module 1'. The camera module 1' is implemented as a
fixed-focus camera module, that is, the driver 30' may be omitted
in this implementation mode of the camera module of the present
invention. Specifically, the camera module 1' includes at least one
lens barrel 40', wherein the lens barrel 40' integrally extends to
the first top surface 2312' of the first base portion 231' of the
molded base 23', and each optical lens 10' is respectively
assembled to each lens barrel 40', so that each optical lens 10' is
held on the photosensitive path of each photosensitive element 212'
of the molded photosensitive assembly 20' by means of each lens
barrel 40'. That is to say, in this implementation mode of the
camera module of the present invention, the lens barrel 40' and the
molded base 23' may be integrally molded by curing the molding
material through the molding process, thereby enhancing the
stability and reliability of the camera module.
[0336] FIG. 6B shows a second modified implementation mode of the
camera module 1'. After the molded base 23' is formed by curing the
molding material through the molding process, the lens barrel 40'
manufactured separately is assembled to the first top surface 2312'
of the first base portion 231' of the molded base 23', and the
optical lens 10' is assembled to the lens barrel 40', so that the
optical lens 10' is held on the photosensitive path of the
photosensitive element 212' of the molded photosensitive assembly
20' by means of the lens barrel 40'. In addition, when the lens
barrel 40' is assembled to the first top surface 2312' of the first
base portion 231' of the molded base 23', an angle of the lens
barrel 40' assembled to the first top surface 2312' of the first
base portion 231' of the molded base 23' may be adjusted by means
of a calibrator, so that an optical axis of the optical lens 10'
can be perpendicular to the photosensitive surface of the
photosensitive element 212' to ensure the imaging quality of the
camera module 1'. It can be understood that the lens barrel 40' may
be manufactured separately, so that the lens barrel 40' may be
provided with screw threads or not. The present invention is not
limited in this respect.
[0337] FIG. 6C shows a third modified implementation mode of the
camera module 1'. During the process of mounting the photosensitive
element 212', the lead 213' is connected to the circuit board 211'
and the photosensitive element 212' by a "reverse bonding" process.
In this way, a height of upward protrusion of the lead 213' may not
exceed a height of upward protrusion of the chip connector 2123' of
the photosensitive element 212', that is, the arc height of the
lead 213' is reduced in order to reduce the height of the second
base portion 232' of the molded base 23', which can increase the
height difference between the first top surface 2311' of the first
base portion 231' and the second top surface 2321' of the second
base portion 232', so that the upper surface 2212' of the filter
element 221' is in a same height with the first top surface 2312'
of the first base portion 231', and even the upper surface 2212' of
the filter element 221' is lower than the first top surface 2312'
of the first base portion 231' to prevent the optical lens 10' from
colliding with the filter element 221' during movement.
[0338] It is worth mentioning that the "reverse bonding" process
involved in the present invention refers to wire bonding of the
lead 213' from the circuit board 211' to the photosensitive element
212' during the process of conducting the photosensitive element
212' and the circuit board 211' by the lead 213'. Specifically, the
circuit board connector 2113' is arranged on the circuit board
211', a top end of the circuit board connector 2113' is first
bonded by a wire bonding tools to form the circuit board connecting
end of the lead 213' connected to the circuit board connector
2113', then a preset position is raised and translated toward the
circuit board connector 2113', and the chip connecting end of the
lead 213' connected to the chip connector 2123' is formed at a top
end of the chip connector 2123', so that the lead 213' extends in a
curved shape. In this way, the height of upward protrusion of the
lead 213' can be substantially flush with the height of the chip
connector 2123', and even the height of upward protrusion of the
lead 213' can be lower than the height of the chip connector
2123'.
[0339] FIG. 6D shows a fourth modified implementation mode of the
camera module 1'. The second base portion 232' of the molded base
23' is further provided with a glue recess 2324', and the glue
recess 2324' is formed by recessing downward from the second top
surface 2322' of the second base portion 232'. The glue can be
applied to the glue recess 2324' of the second base portion 232',
the glue protrudes from the second top surface 2322' of the second
base portion 232', and after the filter element 221' is
correspondingly arranged on the imaging assembly 21', the glue
layer 222' formed by curing the glue can be overlapped on the lower
surface 2211' of the filter element 221', thereby ensuring that the
filter element 221' is stably arranged in the stepped peripheral
groove 230' of the molded base 23', and preventing the glue from
flowing to the second inner circumferential surface 2321' of the
second base portion 232' of the molded base 23'.
[0340] FIG. 6E shows a fifth modified implementation mode of the
camera module 1'. The filter assembly 22' further includes at least
one annular support element 223', the filter element 221' is
assembled to the support element 223', and the support element 223'
is arranged on the first base portion 231' of the molded base 23',
so that the filter element 221' is correspondingly arranged in the
stepped peripheral groove 230' of the molded base 23' by means of
the support element 223'.
[0341] Specifically, the upper surface 2212 of the filter element
221' is fixedly attached to a lower side of the support element
223' through the glue layer 222', so that when the support element
223' is mounted to the first top surface 2312' of the first base
portion 231' of the molded base 23', the upper surface 2212' of the
filter element 221' is located below the first top surface 2312'.
By this attachment mode, an attachment width or an attachment area
between the filter element 221' and the support element 223' can be
increased, to strengthen the bonding strength between the filter
element 221' and the support element 223', so as to prevent the
filter element 221' from being damaged due to impact. In addition,
the driver 30' of the camera module 1' is also attached to the
first top surface 2312' of the first base portion 231' of the
molded base 23', and the support element 223' is located inside the
driver 30', which will not increase the overall height of the
camera mold 1'.
[0342] It is worth mentioning that the support element 223' may be
made of materials with certain toughness, such as plastics and
metals. Since the support element 223' is made of a material with
higher toughness than the material of the molded base 23', the
filter element 221' is unlikely to separate from the molded base
23' to reduce the risk of rupture of the filter element 221'.
[0343] FIG. 6F shows a sixth modified implementation mode of the
camera module 1'. The support element 223' of the filter assembly
22' is arranged between the driver 30' and the first top surface
2312' of the first base portion 231', that is, the support element
223' is mounted to the first top surface 2312' of the first base
portion 231', and the driver 30' is mounted to the support element
223', so that the filter element 221' is correspondingly arranged
in the stepped peripheral groove 230' of the molded base 23' by
means of the support element 223'.
[0344] It should be understood that, in this modified
implementation mode, the height of the camera module 1' is
increased by a thickness of the support element 223', but the
thickness of the support element 223' is smaller than the thickness
of the filter element 221', so compared with the camera module in
the prior art, the height of the camera module 1' in this modified
implementation mode of the present invention is still reduced. In
addition, since a contact area between the support element 223' and
the molded base 23' is greatly increased, the filter element 221'
can be more firmly mounted on the molded base 23' through the
support element 223' to prevent the filter element 221' from being
damaged due to collision.
[0345] FIG. 6G shows a seventh modified implementation mode of the
camera module 1'. The chip mounting region 2111' of the circuit
board 211' of the imaging assembly 21' of the molded photosensitive
assembly 20' sinks to form a chip mounting recess 2114' in the chip
mounting region 2111' of the circuit board 211'. The photosensitive
element 212' is correspondingly arranged in the chip mounting
recess 2114' of the circuit board 211' to reduce the height of the
photosensitive surface of the photosensitive element 212', so that
the height of the second base portion 232' of the molded base 23'
is further reduced, the upper surface 2212' of the filter element
221' can be in a same height with the first top surface 2312' of
the first base portion 231', and even the upper surface 2212' of
the filter element 221' is lower than the first top surface 2312'
of the first base portion 231' to prevent the optical lens 10' from
colliding with the filter element 221' during movement.
[0346] In other words, the chip mounting recess 2114' of the
circuit board 211' is sunken downward from an upper side of the
circuit board 211' to form a recess in the chip mounting region
2111' of the circuit board 211'. The photosensitive element 212' is
mounted to the recess to reduce the height of the photosensitive
surface of the photosensitive element 212', thereby further
reducing the arc height of the lead 213', which helps to reduce the
height of the second base portion 232' of the molded base 23'.
[0347] FIG. 6H shows an eighth modified implementation mode of the
camera module 1'. The circuit board 211' of the imaging assembly
21' of the molded photosensitive assembly 20' is further provided
with a through hole type chip mounting recess 2114'. The chip
mounting recess 2114' extends downward from the upper side of the
circuit board 211' to a lower side of the circuit board 211' to
form a through hole in the chip mounting region 2111' of the
circuit board 211'. The photosensitive element 212' is
correspondingly arranged in the through hole, so that the
photosensitive surface of the photosensitive element 212' is lower
than the upper side of the circuit board 211', which minimizes the
arc height of the lead 213' to minimize the height of the second
base portion 232' of the molded base 23'.
[0348] Referring to FIGS. 7A to 7D, according to another aspect of
the present invention, the first preferred embodiment of the
present invention further provides a method for manufacturing a
molded photosensitive assembly and a method for manufacturing a
camera module. As shown in FIG. 7A, the method for manufacturing
the molded photosensitive assembly includes the following
steps:
[0349] S1: a photosensitive element 212' and at least one group of
electronic components 214' are mounted to a circuit board 211', and
the photosensitive element 212' and the circuit board 211' are
conducted to assemble an imaging assembly 21';
[0350] S2: a molded base 23' which is used for embedding a part of
the circuit board 211' and a part of the photosensitive element
212' and has a stepped peripheral groove 230' is formed by means of
a molding process, and a light window 2301' is formed through the
stepped peripheral groove 230', wherein a photosensitive region
2121' of the photosensitive element 212' corresponds to the light
window 2301' of the molded base 23', so as to form a semi-finished
molded photosensitive assembly with an integrated structure;
and
[0351] S3: a filter element 221' of a filter assembly 22' is
correspondingly arranged in the stepped peripheral groove 230' of
the molded base 23' of the semi-finished molded photosensitive
assembly to assemble a molded photosensitive assembly 20', wherein
the photosensitive region 2121' of the photosensitive element 212'
corresponds to the filter element 221'.
[0352] It is worth noting that, in an implementation mode of the
present invention, as shown in FIG. 7B, step S1 includes the
following steps:
[0353] S11: the photosensitive element 212' is mounted to a chip
mounting region 2111' of the circuit board 211';
[0354] S12: each electronic component 214' is mounted to a circuit
board outer portion 21123' of an edge region 2112' of the circuit
board 211'; and
[0355] S13: a lead 213' is extended by means of a wire bonding
process from a chip connector 2123' of the photosensitive element
212' to a circuit board connector 2113' of the circuit board 211'
to conductively connect the photosensitive element 212' and the
circuit board 21'.
[0356] In another modified implementation mode of the present
invention, step S1 further includes step S13': a lead 213' is
extended by means of a reverse bonding process from a circuit board
connector 2113' of the circuit board 211' to a chip connector 2123'
of the photosensitive element 212' to conductively connect the
photosensitive element 212' and the circuit board 21'.
[0357] Further, as shown in FIG. 7C, step S2 includes the following
steps:
[0358] S21: the imaging assembly 21' is placed in a molding die
500;
[0359] S22: a clamping operation is performed on an upper die 510'
and a lower die 520' of the molding die 500' to form a molding
space 530' of the molding die 500' between the upper die 510' and
the lower die 520';
[0360] S23: a molding material is added to the molding space 530'
of the molding die 500' to form the molded base 23' with the
stepped peripheral groove 230' after the molding material is cured;
and
[0361] S24: a drafting operation is performed on the molding die
500' to obtain the semi-finished molded photosensitive
assembly.
[0362] More specifically, step S22 includes the following
steps:
[0363] a cover film 540' is arranged on a pressing surface 513' of
the upper die 510';
[0364] the photosensitive element 212' of the imaging assembly 21'
is pressed by means of the cover film 540', so that the cover film
540' is located between the pressing surface 513' and the
photosensitive element 212';
[0365] a first molding space 531' of the molding space 530' is
formed between a first inner surface 511' of the upper die 510' and
a circuit board outer portion 21123' of the edge region 2112' of
the circuit board 211'; and
[0366] a second molding space 532' of the molding space 530' is
formed among a second inner surface 512' of the upper die 510', a
circuit board connecting portion 21122' and a circuit board inner
portion 21121' of the edge region 2112' of the circuit board 211',
and a chip outer portion 21223' and a chip connecting portion
21222' of a non-photosensitive region 2122' of the photosensitive
element 212', wherein the first inner surface 511' of the upper die
510' is above the second inner surface 512' of the upper die
510'.
[0367] In addition, step S23 includes the following steps:
[0368] the molding material is added to the first molding space
531' to form a first base portion 231' of the molded base 23' that
is used to embed the circuit board outer portion 21123' of the edge
region 2112' of the circuit board 211' after the molding material
is cured; and
[0369] the molding material is added to the second molding space
532' to form a second base portion 232' of the molded base 23' that
is used to embed the circuit board connecting portion 21122' and
the circuit board inner portion 21121' of the edge region 2112 of
the circuit board 211' as well as the chip outer portion 21223' and
the chip connecting portion 21222' of the non-photosensitive region
2122' of the photosensitive element 212' after the molding material
is cured, wherein a height of the second base portion 232' is lower
than a height of the first base portion 231'.
[0370] In the first preferred embodiment of the present invention,
as shown in FIG. 7D, step S3 includes the following steps:
[0371] S31: a glue is applied to a second top surface 2322' of the
second base portion 232' of the molded base 23';
[0372] S32: the filter element 221' is correspondingly arranged on
the second top surface 2322' of the second base portion 232;
and
[0373] S33: after the glue is cured, a glue layer 222' of the
filter assembly 22' is formed between a lower surface 2211' of the
filter element 221' and the second top surface 2322' of the second
base portion 232'.
[0374] In a modified implementation mode of the present invention,
as shown in FIG. 7D, step S3 includes the following steps:
[0375] S31': a glue is applied to a lower surface 2211' of the
filter element 221';
[0376] S32': the filter element 221' is correspondingly arranged on
a second top surface 2322' of the second base portion 232'; and
[0377] S33': after the glue is cured, a glue layer 222' of the
filter assembly 22' is formed between the lower surface 2211' of
the filter element 221' and the second top surface 2322' of the
second base portion 232'.
[0378] In another modified implementation mode of the present
invention, as shown in FIG. 7D, step S3 includes the following
steps:
[0379] S31'': a glue is applied to an annular support element 223'
of the filter assembly 22';
[0380] S32'': the filter element 221' is correspondingly arranged
on the support element 223' to form a glue layer 222' of the filter
assembly 22' between an upper surface 2212' of the filter element
221' and the support element 223' after the glue is cured; and
[0381] S33'': the support element 223' is correspondingly arranged
on a first top surface 2312' of the first base portion 231', so
that the filter element 221' is located in the stepped peripheral
groove 230' of the molded base 23'.
[0382] As shown in FIG. 8, the method for manufacturing the camera
module includes the following steps:
[0383] (a) a photosensitive element 212' and at least one group of
electronic components 214' are mounted to a circuit board 211', and
the photosensitive element 212' and the circuit board 211' are
conducted to assemble an imaging assembly 21';
[0384] (b) a molded base 23' which is used for embedding a part of
the circuit board 211' and a part of the photosensitive element
212' and has a stepped peripheral groove 230' is formed by means of
a molding process, and a light window 2301' is defined on the
molded base 23' through the stepped peripheral groove 230', wherein
a photosensitive region 2121' of the photosensitive element 212'
corresponds to the light window 2301' of the molded base 23', so as
to form a semi-finished molded photosensitive assembly with an
integrated structure;
[0385] (c) a filter element 221' of a filter assembly 22' is
correspondingly arranged in the stepped peripheral groove 230' of
the molded base 23' of the semi-finished molded photosensitive
assembly to assemble a molded photosensitive assembly 20', wherein
the photosensitive region 2121' of the photosensitive element 212'
corresponds to the filter element 221'; and
[0386] (d) an optical lens 10' is correspondingly arranged on a
photosensitive path of the imaging assembly 21' of the molded
photosensitive assembly 20' to form a camera module 1'.
[0387] Referring to FIGS. 9 to 11 of the present invention, a
camera module and a molded photosensitive assembly and
manufacturing methods thereof according to a second preferred
embodiment of the present invention are illustrated. Compared with
the above-mentioned first preferred embodiment according to the
present invention, the difference of the camera module 1A'
according to the second preferred embodiment of the present
invention is: as shown in FIG. 9, a molded base 23A' of a molded
photosensitive assembly 20A' of the camera module 1A' only embeds
the circuit board outer portion 21123' of the edge region 2112' of
the circuit board 211', and does not embed other parts of the edge
region 2112' of the circuit board 211' and the non-photosensitive
region 2122' of the photosensitive element 212'. In other words,
the first base portion 231A' and the second base portion 232A' of
the molded base 23A' both embed the circuit board outer portion
21123' of the edge region 2112' of the circuit board 211', the
first base portion 231A' embeds each electronic component 214', but
the second base portion 232A' embeds neither the electronic
components 214' nor each lead 213', so that safety gaps reserved
between the second base portion 232A' and the leads 213' can be
further reduced for further reducing the height of the second base
portion 232A'.
[0388] It is worth noting that, since the circuit board connector
2113' and the chip mounting region 2111' of the circuit board 211'
are exposed outside the molded base 23A', the molded base 23A' can
be first formed on the circuit board 211' by the molding process,
then the photosensitive element 212' is mounted to the circuit
board 211', and finally, the circuit board 211' and the
photosensitive element 212' are conducted.
[0389] Exemplarily, as shown in FIGS. 10A and 10B, the circuit
board 211' is put into a molding die 500A', the molding process is
performed by means of the molding die 500A' to form the molded base
23A' with the stepped peripheral groove 230', and the molded base
23A' embeds the circuit board outer portion 21123' of the edge
region 2112' of the circuit board 211'.
[0390] Specifically, the molding die 500A' includes an upper die
510A' and a lower die 520A', wherein at least one of the upper and
lower dies 510A' and 520A' can be moved, so that the upper die
510A' and the lower die 520A' can be clamped and drafted; and when
the molding die 500A' is in a clamped state, a molding space 530A'
is formed between the upper die 510A' and the lower die 520A',
wherein the molded base 23A' is formed by adding a molding material
into the molding space 530A' and curing the same.
[0391] More specifically, the upper die 510A' has a first inner
surface 511A', a second inner surface 512A', and a pressing surface
513A', wherein the second inner surface 512A' is located around the
first inner surface 511A', and the second inner surface 512A' is
located between the first inner surface 511A' and the pressing
surface 513A', wherein the second inner surface 512A' is lower than
the first inner surface 511A', and the pressing surface 513A' is
lower than the second inner surface 512A'.
[0392] In FIG. 10A, after the circuit board 211' is placed in the
upper die 510A' and/or the lower die 520A', the upper die 510A' and
the lower die 520A' are operated to clamp the molding die, so that
the circuit board 211' is located in the molding space 530A' formed
between the upper die 510A' and the lower die 520A'. At this time,
the first inner surface 511A' of the upper die 510A' corresponds to
the circuit board outer portion 21123' of the edge region 2112' of
the circuit board 211' so as to form a first molding space 531A'
between the first inner surface 511A' and the circuit board outer
portion 21123' of the circuit board 211', and the molding material
is added to the first molding space 531A' and cured to form the
first base portion 231A'; the second inner surface 512A' of the
upper die 510A' also corresponds to the circuit board outer portion
21123' of the edge region 2112' of the circuit board 211' so as to
form a second molding space 532A' between the second inner surface
512A' and the circuit board outer portion 21123' of the circuit
board 211', and the molding material is added to the second molding
space 532A' and cured to form the second base portion 232A'; the
pressing surface 513A' of the upper die 510A' presses the chip
mounting region 2111' of the circuit board 211' as well as the
circuit board inner portion 21121' and the circuit board connecting
portion 21122' of the edge region 2112'; and because the chip
mounting region 2111' is located at the middle part of the circuit
board 211', the circuit board 211' can be flattened by the pressing
surface 513A', which ensures the overall flatness of the circuit
board 211', and also provides a flat molding base surface for the
molding process.
[0393] As shown in FIG. 10B, after the molding material is cured in
the molding space 530A' to form the molded base 23A', a
semi-finished molded photosensitive assembly with an integrated
structure is formed, wherein the semi-finished molded
photosensitive assembly includes the circuit board 211' of the
imaging assembly 21' and the molded base 23'. Next, the upper die
510' and the lower die 520' are operated for being drafted to open
the molding space 530' of the mold 500' for taking out the
semi-finished molded photosensitive assembly from the molding space
530'. Then, the photosensitive element 212' is mounted to the chip
mounting region 2111' of the circuit board 211', and the
photosensitive element 212' and the circuit board 211' are
conducted. Finally, the filter element 221' is mounted to the
second top surface 2322' of the second base portion 232A' of the
molded base 23A' to form the molded photosensitive assembly
20A'.
[0394] It is worth noting that in the second preferred embodiment
of the present invention, except the above-mentioned different
structure, other structures of the camera module 1A' are the same
as those of the camera module 1' according to the first preferred
embodiment of the present invention, and the camera module 1A' also
has the same or similar modified implementation modes as the
various modified implementation modes of the camera module 1' of
the first preferred embodiment. Details are not described herein
again.
[0395] According to another aspect of the present invention, the
second preferred embodiment of the present invention further
provides a method for manufacturing a molded photosensitive
assembly. As shown in FIG. 11, the method for manufacturing the
molded photosensitive assembly 20A' includes the following
steps:
[0396] (A) a molded base 23A' which is used for embedding a circuit
board outer portion 21123' of an edge region 2112' of a circuit
board 211' and has a stepped peripheral groove 230' is formed by
means of a molding process, and a light window 2301' is formed
through the stepped peripheral groove 230', wherein a
photosensitive region 2121' of the photosensitive element 212'
corresponds to the light window 2301' of the molded base 23A', so
as to form a semi-finished molded photosensitive assembly with an
integrated structure;
[0397] (B) a photosensitive element 212' is mounted to a chip
mounting region 2111' of the circuit board 211', and the
photosensitive element 212' and the circuit board 211' are
conducted; and
[0398] (C) a filter element 221' of a filter assembly 22' is
correspondingly arranged in the stepped peripheral groove 230' of
the molded base 23A' to assemble a molded photosensitive assembly
20A', wherein the photosensitive region 2121' of the photosensitive
element 212' corresponds to the filter element 221'.
[0399] Further, before step (A), the method further includes the
following step: at least one group of electronic components 214'
are mounted to the circuit board outer portion 21123' of the edge
region 2112' of the circuit board 211'.
[0400] Referring to FIG. 12, according to another aspect of the
present invention, the present invention further provides an
electronic device 600'. The electronic device 600' includes an
electronic device body 610' and at least one camera module 1' or
1A', wherein each camera modules 1' or 1A' is respectively arranged
on the electronic device body 610' for capturing images. It is
worth mentioning that the type of the electronic device body 610'
is not limited. For example, the electronic device body 610' may be
any electronic device which can be configured with the camera
module, such as a smart phone, a tablet computer, a notebook
computer, an e-book, a personal digital assistant, or a camera. A
person skilled in the art could understand that, although the
electronic device body 610' is implemented as a smart phone as an
example in FIG. 12, it does not constitute a limitation to the
content and scope of the present invention.
[0401] The present invention provides a camera module, as shown in
FIGS. 14 to 33C, which has a small size and is suitable for being
installed in an intelligent device for capturing images. The camera
module according to a third embodiment of the present invention is
shown in FIGS. 14 to 23. The camera module includes an optical
assembly 10, a filter 20 and a molded photosensitive assembly 30.
The thickness of the camera module depends on the height of the
optical assembly 10 and the thickness of the molded photosensitive
assembly 30. The molded photosensitive assembly 30 can receive
imaging light transmitted from the optical assembly 10 and passing
through the filter 20. After the imaging light is shaped by the
optical assembly 10 and filtered by the filter 20, a photosensitive
chip 33 molded by the molded photosensitive assembly 30 obtains
high-quality resources for imaging. The optical assembly 10
includes a lens, a motor lens and other feasible means.
[0402] A position where the filter 20 is mounted on the molded
photosensitive assembly 30 is lower than a position where the
optical assembly 10 is mounted on the molded photosensitive
assembly 30, as shown in FIGS. 14 to 16, so that the distance
between the filter 20 and the molded photosensitive assembly 30 and
the distance between the filter 20 and the optical assembly 10 are
maintained, and little stray light is transmitted to the center of
the molded photosensitive assembly 30. In this preferred
embodiment, the filter 20 is fixed to the molded photosensitive
assembly 30 by a filter glue 220. In addition, the optical assembly
10 is fixed to the molded photosensitive assembly 30 by a lens glue
110. It is worth mentioning that the filter glue 220 and the lens
glue 110 are on different levels of the molded photosensitive
assembly 30, so that the lens glue 110 and the filter glue 220 are
kept at a certain distance without covering the filter 20.
[0403] More particularly, in this preferred embodiment, the
photosensitive chip 33 is preferably fixed to a bottom of the
molded photosensitive assembly 30, and the optical assembly 10 is
attached to a top of the molded photosensitive assembly 30; and the
filter 20 is attached between the optical assembly 10 and the
photosensitive chip 33, so that the molded photosensitive assembly
30 provides a stable support force to the optical assembly 10 and
the filter 20.
[0404] The optical assembly 10 includes a lens barrel 11 and some
lenses 12 mounted in the lens barrel 11. In addition, the lens
barrel 11 includes a leg 111 supporting the lenses 12 away from the
filter 20. The leg 111 of the lens barrel 11 is fixed to the molded
photosensitive assembly 30 to support the lenses 12 to maintain a
distance from the filter 20 and the photosensitive chip 33, so as
to transmit imaging light as required.
[0405] The filter 20 includes a filter portion 21 for filtering the
imaging light and an edge portion 22 extending outward from the
filter portion 21, wherein the edge portion 22 is supported on the
molded photosensitive assembly 30, so that the filter portion 21
corresponds to the photosensitive chip 33. It is worth mentioning
that the filter glue 220 is located between the edge portion 22 and
the molded photosensitive assembly 30, and does not cover the
filter portion 21 and the photosensitive chip 33 of the molded
photosensitive assembly 30. The edge portion 22 of the filter 20 is
directly supported on the molded photosensitive assembly 30 without
additional supporting components. Particularly, in an example of
the present invention, the edge portion 22 integrally extends
outward from the filter portion 21, and the edge portion 22 is
located around the filter portion 21, so that the filter 20 is
implemented as an integrated element, and can be fixed in the
support cavity 300 of the molded photosensitive assembly 30.
[0406] Specifically, the molded photosensitive assembly 30 further
includes a main body 31, some electronic devices 32 and a circuit
board 35. The photosensitive chip 33 is electrically connected to
the electronic devices 32 through the circuit board 35. The main
body 31 embeds the electronic devices 32 on the circuit board 35
and forms the support cavity 300 to support the filter 20 and the
optical assembly 10 at a distance. In other words, the main body 31
embeds the electronic devices 32 and a part of the circuit board
35, wherein the photosensitive chip 33 is surrounded by a bottom
portion of the main body 31 and keeps a distance from the filter
20.
[0407] In this preferred embodiment, the photosensitive chip 33 is
connected to the circuit board 35 by a group of wires 34. One ends
of the wires 34 are fixed to the circuit board 35, and the other
ends are fixed to the photosensitive chip 33. A person skilled in
the art could understand that the photosensitive chip 33 converts
light into images by means of the electronic devices 32 on the
circuit board 35. The main body 31 partially embeds the
photosensitive chip 33 therein. In other words, the wires 34 and an
edge of the photosensitive chip 33 are completely embedded inside
the main body 31 of the molded photosensitive assembly 30 and
protected. The photosensitive chip 33 is surrounded by the
electronic devices 32, as shown in FIGS. 14 to 17, and an edge of
the main body 31 embedding the electronic devices 32 is higher than
an interior of the main body 31 embedding the wires 34.
[0408] Furthermore, a top edge of the main body 31 supports the
optical assembly 10, and the optical assembly 10 is far away from
the filter 20 and the photosensitive chip 33, so that the filter 20
and the photosensitive chip 33 are not subjected to the pressure of
the optical assembly 10. Preferably, the positions of the
electronic devices 32, the photosensitive chip 33 and the filter 20
are stabilized by the main body 31, and a size of the main body 10
and a distance between the main body 10 and the filter 20 are
correspondingly designed to enhance the stability, reliability and
compactness of the camera module. The specific design data of the
main body 31 will be disclosed in the following paragraphs. It is
worth mentioning that the drawings only illustrate the positional
relationship between the optical assembly 10, the filter 20 and the
molded photosensitive assembly 30, but such illustrations do not
strictly follow numerical proportion.
[0409] Further, as shown in FIGS. 16 and 17, the filter portion 21
has an incident surface 211 and an exit surface 212, wherein the
incident surface 211 is arranged opposite to the lenses 12 of the
optical assembly 10, and the exit surface 212 is arranged opposite
to the photosensitive chip 33. After imaging light is shaped by the
lenses 12 of the optical assembly 10, the imaging light passes
through the incident surface 211 and then the exit surface 212 and
is filtered. Preferably, the filter portion 21 is made of an
infrared light filter material. The edge portion 22 has an edge top
surface 221, an edge side surface 222, and an edge bottom surface
223. In this preferred embodiment, the edge top surface 221 is
coplanar with the incident surface 211, and the edge bottom surface
223 is coplanar with the exit surface 212.
[0410] It is worth mentioning that the edge bottom surface 223 of
the edge portion 22 of the filter 20 is attached to the main body
31 of the molded photosensitive assembly 30 by the filter glue 220,
so that the filter portion 21 transmits the imaging light in a
clean state. In addition, the filter portion 21 and the edge
portion 22 do not need to support anything on the incident surface
211 and the edge top surface 221, which provides the filter 20 with
higher reliability.
[0411] Particularly, the main body 31 of the molded photosensitive
assembly 30 includes a bounding body 311 and a short body 312, and
the short body 312 integrally extends from an inner side of the
bounding body 311. The bounding body 311 and the short body 312 are
both formed and molded on a connecting surface 350 of the circuit
board 35 to embed the electronic devices 32, the wires 34 and the
photosensitive chip 33. In the third preferred embodiment, the
electronic devices 32 are mainly embedded by the bounding body 311,
and the wires 34 and the photosensitive chip 33 are mainly embedded
by the short body 312. In other preferred embodiments, the
electronic devices 32 may also be embedded by the short body
312.
[0412] Specifically, the bounding body 311 and the short body 312
have a certain height difference to form a hollow square-shaped
groove inside the main body 31, so that the filter 20 is arranged
in the hollow square-shaped groove of the main body 31. In other
words, the bounding body 311 has a high upper surface 3111 and a
high inner side surface 3112, wherein the high upper surface 3111
of the bounding body 311 is used to support the optical assembly
10. The short body 312 has a short upper surface 3121 and a short
inner side surface 3122, wherein the short upper surface 3121 of
the short body 312 is used to support the filter 20, and the high
inner side surface 3112 of the bounding body 311 and the short
inner side surface 3122 of the short body 312 form the support
cavity 300 of the molded photosensitive assembly 30 inward. A
distance between the high upper surface 3111 of the bounding body
311 and the connecting surface 350 of the circuit board 35 is
greater than a distance between the short upper surface 3121 of the
short body 312 and the connecting surface 350 of the circuit board
35. In other words, the high inner side surface 3112 and the short
upper surface 3121 are shaped in a groove shape to accommodate the
filter 20 therein, and the filter 20 does not need to protrude from
the high upper surface 3111. It could be understood that the
bounding body 311 further has a high outer surface 3113 to form a
peripheral surface of the main body 31.
[0413] In this preferred embodiment, as shown in FIG. 17, the
height difference J between the bounding body 311 and the short
body 312 is more than 0.1 mm, that is, a distance between the high
upper surface 3111 and the short upper surface 3121 is more than
0.1 mm to fit thicknesses of the filter 20 and the filter glue 220.
More preferably, the height difference J between the bounding body
311 and the short body 312 is greater than or equal to the sum
(such as 0.28 mm) of the thickness of the filter 20, the thickness
of the filter glue 220, and a margin of 0.04 mm, so that the
thickness of the filter 20 is hidden in the main body 31 of the
molded photosensitive assembly 30.
[0414] In addition, the thickness H of the filter glue 220 has also
to be considered, generally less than 0.03 mm. The thickness of the
filter glue 220 can be appropriately reduced under the condition
that the glue has sufficient bonding force, and a thermosetting
colloid is used in this preferred embodiment.
[0415] It is worth noting that a width C of the short upper surface
3121 of the short body 312 (that is, a distance from the high inner
side surface 3112 to the short inner side surface 3122, or the
thickness of the short body 312) is preferably more than or equal
to 0.4 mm, so that on the basis of ensuring that the bounding body
311 and the short body 312 can be molded in an L shape, the value
of the width C also ensures that the filter 20 has a sufficient
installation area on the short upper surface 3121 of the short body
312, and can allow certain installation deviation of the filter 20
without causing adverse effects. The filter glue 220 can also have
enough gluing area on the short upper surface 3121, which increases
a contact area between the filter 20 and the filter glue 220, and
improves the bonding force of the glue.
[0416] The filter glue 220 is applied between the edge bottom
surface 223 of the edge portion 22 of the filter 20 and the short
upper surface 3121 of the short body 312, so that the edge portion
22 of the filter 20 is connected to the short body 312 by the
filter glue 220. The filter glue 220 may be implemented as a
colloid having a similar square shape, and a size of the filter
glue 220 is smaller than a size of the lens glue 110.
[0417] Preferably, a width of the filter glue 220 between the edge
bottom surface 223 and the short upper surface 3121 of the short
body 312 has a maximum value, and the maximum width of the filter
glue 220 is equal to a width B of the edge portion 22, wherein the
width B of the edge portion 22 of the filter 20 is preferably more
than or equal to 0.25 mm, so that the filter 20 can be stably
supported by the edge portion 22, which ensures that the filter 20
has a sufficient installation area on the short upper surface 3121
of the short body 312, and can allow certain installation deviation
of the filter 20 without causing adverse effects; and the filter
portion 21 is aligned with the photosensitive chip 33.
[0418] Furthermore, there is a gap between a side of the filter 20
and an inner side of the bounding body 311 of the main body 31. In
other words, the filter 20 does not contact the bounding body 311
of the main body 31, which can reduce the vibration, transmitted by
the main body 31, of the optical assembly 10. In addition, the gap
between the side of the filter 20 and the inner side of the
bounding body 311 of the main body 31 can accommodate the excess
lens glue 110 and keep the lens glue 110 away from the incident
surface 211 of the filter 20, which can effectively prevent the
lens glue 110 from flowing into the incident surface 211 of the
filter portion 21. Preferably, a distance A between the edge side
surface 222 of the edge portion 22 of the filter 20 and the high
inner side surface 3112 of the bounding body 311 is more than or
equal to 0.15 mm, which helps avoidance (that is, yielding) between
the filter 20 and the bounding body 311.
[0419] It is worth noting that the lens glue 110 connects the leg
111 of the lens barrel 11 to the high upper surface 3111 of the
bounding body 311 of the main body 31, so that the optical assembly
10 is mainly supported by the bounding body 311 to reduce the
stress of the photosensitive chip 33. Preferably, a height K of the
bounding body 311 is more than or equal to 0.5 mm, so that the
bounding body 311 embedding the electronic devices 32 can be
effectively molded, and the electronic devices 32 can also be
prevented from being excessively pressed to the leg 111 of the
optical assembly 10. Moreover, because the filter 20 is supported
on the short body 312, the filter 20 does not need to bear the
weight and movement of the optical assembly 10, which improves
reliability. Particularly, the lens barrel 11 is directly on the
main body 31, so that the thickness of the camera module is
determined by the height of the optical assembly 10 and the
thickness of the molded photosensitive assembly 30, which helps to
reduce the overall thickness of the camera module.
[0420] It is worth mentioning that a size of a capacitor among the
electronic devices 32 is usually the largest, so a distance D
between the capacitor among the electronic devices 32 and the edge
side surface 222 of the edge portion 22 of the filter 20 is
preferably more than or equal to 0.2 mm to prevent interference
between the electronic devices 32 and the molding die, and an
enough space can also be reserved between the electronic devices 32
and the filter 20 for structural design optimization, which is
beneficial to forming a complex molded structure between the two
and increasing the function of the molded structure. More
preferably, the distance D between each electronic device 32 and
the edge side surface 222 of the edge portion 22 of the filter 20
is more than or equal to 0.25 mm.
[0421] In this preferred embodiment, the bounding body 311 and the
short body 312 of the main body 30 are preferably shaped into like
squares with chamfers, and inscribed circle radii F of the chamfers
are more than or equal to 0.3 mm. It should be noted that the
chamfers on the bounding body 311 and the short body 312 need to
avoid (that is, yield) the filter 20 to reduce the chance of
interference between the chamfers on the bounding body 311 and the
short body 312 and the filter 20. Of course, in other examples of
the present invention, the chamfers on the bounding body 311 and
the short body 312 may also be designed according to the chamfering
mode of the filter 20.
[0422] As the photosensitive chip 33 is fixed to the bottom portion
of the short body 312 of the main body 31, the filter 20 can
maintain a certain distance from the photosensitive chip 33 through
the short body 312, thereby achieving high-quality imaging.
Preferably, a distance I between the short upper surface 3121 of
the short body 312 and the photosensitive chip 33 is preferably
more than or equal to 0.15 mm, which mainly functions to ensure
that the molded structure of this part has sufficient thickness to
block the stray light reflected by the lens, the filter or other
structures, thereby reducing the incidence of unnecessary light,
improving the imaging quality of the photosensitive chip, and
preventing the photosensitive chip 33 from being damaged due to
pressure. At the same time, the distance I more than or equal to
0.15 can also avoid interference between the molding die and the
wires 34 and help to avoid exposure of the wires 34. It is
understandable that if the back focus length of the camera module
meets the requirements, the distance I can be increased as much as
possible to avoid imaging black spots caused by the dirt of the
filter 20. Particularly, if the distance I between the short upper
surface 3121 of the short body 312 and the photosensitive chip 33
is more than 0.25 mm, the capacitor can be placed under the short
body 312 to reduce the size of the camera module in the XY
direction.
[0423] Therefore, in this preferred embodiment, the main body 31
not only embeds the electronic devices 32 and the wires 34 for
protection, but also provides the support cavity 300 to stably
support the optical assembly 10 and the filter 20, and does not
need to excessively press the electronic devices 32 or the
photosensitive chip 33.
[0424] It is worth mentioning that, on one hand, in order to
increase a screen-to-body ratio of an intelligent device (such as a
smart phone), increasingly high requirements have been put forward
for the degree of fitness between a side of the camera module and a
side of the smart phone, that is, the optical assembly 10 of the
camera module is desired to be closer to a mounting shell of the
smart phone; and on the other hand, in order that the smart phone
has a good holding touch, a cross section of the mounting shell of
the smart phone often has a certain radian (that is, an arc-shaped
outer frame). Side walls of the camera module are usually flat,
resulting in that the flat side walls of the camera module cannot
fit well with the arc-shaped outer frame of the smart phone, so
that there is a large gap between the two, which greatly limits the
degree of fitness between the camera module and the smart phone. It
is understandable that although the height of the camera module of
the present invention can be reduced by reducing the height of the
bounding body 311, the degree of reducing the height of the
bounding body 311 is limited by the height of the electronic device
32 itself, so the fitness between the camera module in the
above-mentioned embodiment of the present invention and the smart
phone is still poor.
[0425] In order to solve the above problem, as shown in FIG. 18,
the present invention further provides a modified implementation
mode of the camera module according to the third embodiment of the
present invention, wherein the optical assembly 10 of the camera
module is eccentrically arranged on the molded photosensitive
assembly 30, so that the optical assembly 10 can be further
adjacent to a mounting shell 51. That is, when the camera module is
fixed to the mounting shell 51, the optical assembly 10 can be
biased toward the mounting shell 51 due to the eccentric
arrangement, so that the optical assembly 10 can be closer to the
mounting shell 51, which helps to further improve the degree of
fitness between the camera module and the mounting shell 51.
[0426] In other words, the optical assembly 10 can be slightly
biased to the molded photosensitive assembly 30 to adapt to the
mounting shell 51 of the intelligent device. In other words, at
least one side of the leg 111 of the lens 11 slightly protrudes
from the high upper surface 3111 of the bounding body 311, which
helps to improve the degree of fitness between the camera module
and the mounting shell of the intelligent device, and does not
affect the stability of the filter 20.
[0427] It is worth noting that when the camera module is mounted on
a top side of the mounting shell 51 of the intelligent device, only
one side of the leg 111 of the lens 11 needs to slightly protrude
from the high upper surface 3111 of the bounding body 311; and when
the camera module is mounted at a corner of the mounting shell 51
of the intelligent device, two adjacent sides of the leg 111 of the
lens 11 need to simultaneously protrude outward from the high upper
surface 3111 of the bounding body 311, so that the camera module
fits with the corner of the mounting shell 51 of the intelligent
device.
[0428] According to another aspect of the present invention, a
method for manufacturing the camera module according to the present
invention is shown in FIGS. 19A to 20. Specifically, as shown in
FIG. 19A, the method for manufacturing the camera module includes
the following steps:
[0429] I. The photosensitive chip 33, the wires 34 and the
electronic devices 32 are connected to the circuit board 35;
[0430] II. The connected circuit board 35 is placed between an
upper die 41 and a lower die 42; and
[0431] III. The electronic devices 32 are embedded in the main body
31 and on the circuit board 35, wherein the main body 31 includes
the bounding body 311 and the short body 312 to form the molded
photosensitive assembly 30.
[0432] Further, as shown in FIG. 19B, the method for manufacturing
the camera module further includes the following steps:
[0433] IV. The filter 20 is mounted to the short upper surface 3121
of the short body 312; and
[0434] V. The optical assembly 10 is mounted to the high upper
surface 3111 of the bounding body 311.
[0435] More particularly, in step III, preferably the short upper
surface of the short body is lower than the high upper surface of
the bounding body, and the relative height of the short upper
surface of the short body is lower than the height of the highest
electronic device among the electronic devices.
[0436] In an example of the present invention, the electronic
devices 32, the wires 34 and the edge of the photosensitive chip 33
are all embedded by the main body 31.
[0437] Exemplarily, as shown in FIG. 19A, step III further includes
the following steps:
[0438] III.1 A molding material is injected between the upper die
41 and the lower die 42;
[0439] III.2 The molding material between the upper die 41 and the
lower die 42 is cured to form the main body 31; and
[0440] III.3 The upper die 41 and the lower die 42 are drafted from
the molded photosensitive assembly 30.
[0441] It is worth mentioning that, as shown in FIG. 19A, an angle
G between the high inner side surface 3112 of the bounding body 311
and the short upper surface 3121 of the short body 312 is
preferably more than or equal to 95.degree., so as to facilitate
the drafting operation. More preferably, the angle G between the
high inner side surface 3112 and the short upper surface 3121 is
also less than 100.degree., so as to ensure that the molded
structure can be formed smoothly and block some stray light. In
addition, in order to ensure normal molding, a fillet radius
between the high inner side surface 3112 and the short upper
surface 3121 is substantially equal to 0.1 mm. In other words,
since an angle between the normals of the high inner side surface
3112 of the bounding body 311 and the short upper surface 3121 can
be referred to as a draft angle of the high inner side surface
3112, the draft angle of the high inner side surface 3112 of the
bounding body 311 is between 5.degree. and 10.degree..
[0442] It is worth noting that a draft angle of the short inner
side surface 3122 of the short body 312 is preferably implemented
to be between 5.degree. and 10.degree.. Particularly, a draft angle
of an outer side surface of the bounding body 311 (that is, an
outer side surface of the main body 31) is also implemented to be
between 5.degree. and 10.degree., which helps to successfully
complete the drafting operation after molding.
[0443] As shown in FIG. 20, step IV further includes the following
steps:
[0444] IV.1 The filter glue 220 is applied to the short upper
surface 3121 in a C shape, so that a gap is reserved between two
ends of the filter glue 220;
[0445] IV.2 The filter 20 is mounted to the filter glue 220;
[0446] IV.3 The filter glue 220 is cured; and
[0447] IV.4 The gap between the two ends of the filter glue 220 is
filled with the filter glue 220 to form the square-like filter glue
220.
[0448] Furthermore, as shown in FIG. 20, in step IV.3, excess air
between the filter 20 and the photosensitive chip 33 can escape
from the gap to ensure an air pressure in the space between the
optical assembly 10 and the photosensitive chip 33 is equal to the
atmospheric pressure. Preferably, a length E of the gap is between
0.7 and 1.0 mm (that is, more than or equal to 0.7 mm and less than
or equal to 1.0 mm), which ensures that a certain gap can still be
reserved when the filter glue 220 is attached and extruded by the
filter 20 to form an air escape hole, so that air can escape from
the gap smoothly.
[0449] It is worth mentioning that the upper die 41 is shaped like
the support cavity 300, so that after the upper die 41 is drafted,
the support cavity 300 is formed between the main body 31 and the
photosensitive chip 33.
[0450] A feasible mode of this preferred embodiment is shown in
FIG. 21, wherein the molded photosensitive assembly 30 further
includes an upper cover 36. The upper cover 36 is mounted on the
high upper surface 3111 of the bounding body 311 and extends to
cover the edge portion 22 of the filter 20, so that the filter 20
is held from bottom to top to enhance the stability of the filter
20. It is worth mentioning that the height of the upper cover 36 is
smaller than the thickness of the filter 20 to reduce the thickness
of the camera module.
[0451] Another feasible mode of this preferred embodiment is shown
in FIG. 22. The difference from the above embodiment lies in that
the short body 312 does not embed the wires 34 of the molded
photosensitive assembly 30, so that the thickness of the camera
module is lower than that in the above embodiment. This is because
only the short body 312 is required to be higher than the wires 34
instead of completely embedding the wires 34. Therefore, the short
body 312 can be lower, and the lower short body 312 and the
bounding body 311 can adapt to the thickness of the filter 20.
[0452] Another feasible mode of this preferred embodiment is shown
in FIG. 23. The difference from the above embodiment lies in that
the position where the photosensitive chip 33 is mounted is lower
than the positions of the electronic devices 32 mounted on the
circuit board 35. For example, there is a groove in a center of the
connecting surface 350 of the circuit board 35, so that the
photosensitive chip 33 is mounted in the groove of the circuit
board 35. In addition, it is reasonable that the thickness of the
camera module in this mode is lower than that of the camera module
in the above embodiment, because the wires 34 are lower due to the
sunken photosensitive chip 33.
[0453] It is worth mentioning that a fourth preferred embodiment of
the present invention is shown in FIGS. 24 to 27. The difference
from the third embodiment lies in that the electronic devices 32A,
the wires 34A, and the photosensitive chip 33A are mainly embedded
by the short body 312A. In other words, the short body 312A is
higher than at least some of the electronic devices 32A to
completely embed at least some of the electronic devices 32A in the
main body 31A.
[0454] In this preferred embodiment, the filter 20A is mounted on
the top of the short body 312A, and the optical assembly 10A is
mounted on the top of the bounding body 311A. As the electronic
devices 32A are mainly embedded by the short body 312A, the
electronic devices 32A are only subjected to the pressure of the
filter 20A, and do not bear the weight and movement of the optical
assembly 10A, so that the electronic devices 32A can have longer
lives. It is understandable that in this embodiment of the present
invention, the filter 20A is firmly bonded to the short upper
surface 3121A of the short body 312A through the filter glue 220A;
and the optical assembly 10A is firmly bonded to the high upper
surface 3111A of the bounding body 311A through the lens glue 110A,
in order to ensure that the relative positions of the filter 20A
and the optical assembly 10A to the photosensitive chip 33A remain
unchanged.
[0455] It is worth mentioning that heights of different electronic
devices 32A in the camera module of the present invention may be
different, and in order to ensure that the short body 312A is not
too high, the heights of the electronic devices 32A embedded in the
short body 312A are preferably less than 0.3 mm. That is, in the
present invention, the electronic devices with heights of less than
0.3 mm are referred to as short devices 321A among the electronic
devices 32A, and the electronic devices with heights of more than
or equal to 0.3 mm are referred to as high devices 322A among the
electronic devices 32A. Then, the short devices 321A among the
electronic devices 32A are embedded by the short body 312A, and the
high devices 322A among the electronic devices 32A are embedded by
the bounding body 311A. It is understandable that the short devices
321A among the electronic devices 32A of the present invention may
be all embedded by the short body 312A (that is, in an top view
direction, all of the short devices 321A are arranged in the short
body 312A); or, the short devices 321A among the electronic devices
32A may be partially embedded by the short body 312A (that is, in
the top view direction, some of the short devices 321A are arranged
in the short body 312A).
[0456] More preferably, the wires 34A or the electronic devices 32A
(that is, the short devices 321A) embedded in the short body 312A
are arranged around the photosensitive chip 33A, and the wires 34A
and the short devices 321A are respectively located on different
sides of the photosensitive chip 33A; that is, the wires 34A and
the electronic devices 32A embedded in the short body 312A are not
sequentially arranged around the photosensitive chip 33A from
inside to outside. In other words, the short devices 321A among the
electronic devices 32A can be distributed according to the
positions of the wires 34A, and the wires 34A are not arranged on
all sides of the photosensitive chip 33A, so the short devices 321A
among the electronic devices 32A can be preferably placed on one
side or two sides of the photosensitive chip 33A without wires 34A,
which can reduce an area of the circuit board, reduce an area of
molding in the XY direction, and reduce an area of the camera
module. It is understandable that since widths of the short devices
321A among the electronic devices 32A are usually about 0.25 mm,
which is similar to the thickness of the short body 312A, if the
short devices 321A among the electronic devices 32A are desired to
be integrated into the short body 312A, the short devices 321A
among the electronic devices 32A can only be arranged on the side
of the photosensitive chip 33A where no wires are arranged, that
is, the positions of the short devices 321A among the electronic
devices 32A and the wires 34A are not compatible, so that gold
wires cannot be bonded (that is, the wires 34A cannot be arranged)
to the part of the short body 312A where the short devices 321A are
arranged.
[0457] It is worth noting that the high devices 322A among the
electronic devices 32A are preferably arranged on the side of the
photosensitive chip 33A with the wires 34A, so that the bounding
body 311A on the side of the photosensitive chip 33A without the
wires 34A does not need to embed the electrical devices 32A. That
is, the bounding body 311A does not necessarily avoid the
electronic devices 32A. Therefore, the thickness of the bounding
body 311A can be reduced, and the thickness of the short body 312A
can be slightly increased. Preferably, the thickness of the
bounding body 311A is smaller than that of the short body 312A, so
that compared with the third preferred embodiment, the short body
312A can provide the larger short upper surface 3121A to support
the edge portion 22A of the filter 20A, and the filter 20A can be
stably mounted on the short body 312A.
[0458] In this preferred embodiment, the angle G between the high
inner side surface 3112A and the short upper surface 3121A may be
more than or equal to 100.degree.. In other words, the bounding
body 311A extends obliquely out of the top of the short body 312A,
so that the bounding body 311A is well supported and can support
the optical assembly 10A without affecting the filter 20A. That is,
the angle G is formed in the case of drafting in the manufacturing
method, and the short inner side surface 3122A and the
photosensitive chip 33A are also inclined, similar to the angle G,
so as to provide a stable support force.
[0459] In this preferred embodiment, the bounding body 311A is
designed to support the optical assembly 10A. Preferably, as shown
in FIG. 27, the high upper surface 3111A of the bounding body 311A
is asymmetric on four sides, that is, the thicknesses of the
bounding body 311A on the four sides of the high upper surface
3111A are different, so that the optical assembly 10A protrudes
outward from a part with a smaller thickness on the bounding body
311A relative to the bounding body 311A, which helps to improve the
degree of fitness between the camera module and the mounting shell
51 of the intelligent device. In other words, in order to adapt to
the mounting shell 51 of the intelligent device, a thickness of a
part adjacent to the mounting shell 51 on the bounding body 311A is
small, so that the optical assembly 10A is slightly out of
alignment with the molded photosensitive assembly 30A, that is, the
optical assembly 10A is biased toward the mounting shell 51 to
improve the degree of fitness between the camera module and the
mounting shell 51 of the intelligent device. Compared with the
third embodiment in FIG. 18, since the bounding body 311A does not
need to consider the electronic devices 32A, the height of the
bounding body 311A can be reduced, and the leg 111A of the optical
assembly 10A has a lower position supported on the high upper
surface 3111A; at the same time, the thickness of the bounding body
311A can also be further reduced, so that the optical assembly 10A
is further closer to the mounting shell 51 of the intelligent
device.
[0460] According to another aspect of the present invention, the
fourth embodiment of the present invention further provides a
method for manufacturing the camera module, including the following
steps:
[0461] I A photosensitive chip 33A, some wires 34A and some
electronic devices 32A are connected to a circuit board 35A;
[0462] II The connected circuit board 35A is placed between an
upper die and a lower die; and
[0463] III The electronic devices 32A are embedded in a main body
31A and on the circuit board 35A to form a molded photosensitive
assembly 30A, wherein the main body 31A includes a bounding body
311A and a short body 312A whose height is lower than that of the
bounding body 311A, and at least some of the electronic devices 32A
are embedded by the short body 312A.
[0464] Further, the method for manufacturing the camera module
further includes the following steps:
[0465] IV A filter 20A is mounted on a short upper surface 3121A of
the short body 312A; and
[0466] V An optical assembly 10A is mounted on the bounding body
311A.
[0467] In an example of the present invention, the electronic
devices 32A include at least one short device 321A, wherein at
least a part of the short device 321 is embedded by the short upper
surface 3121A of the short body 312A, and a height of each short
device 321 is less than 0.3 mm.
[0468] In an example of the present invention, the wires 34A are
embedded by the short body 312A, wherein the wires 34A and the
short devices 321A are arranged around the photosensitive chip 33A,
and the wires 34A and the short devices 321A are respectively
located on different sides of the photosensitive chip 33A.
[0469] In an example of the present invention, a thickness of at
least one side of the bounding body 311A is smaller than the
thickness of the short body 312A, so that the optical assembly 10A
protrudes outward from the at least one side of the bounding body
311A relative to the molded photosensitive assembly 30A.
[0470] In an example of the present invention, the electronic
devices 32A further include at least one high device 322A, wherein
the high devices 322A are embedded by the bounding body 311A, and a
height of each high device 322A is more than or equal to 0.3
mm.
[0471] In an example of the present invention, the high devices
322A and the wires 34A are located on the same side of the
photosensitive chip 33A.
[0472] In an example of the present invention, an angle between a
high inner side surface 3112A of the bounding body 311A and the
short upper surface 3121A of the short body 312A is more than or
equal to 100.degree..
[0473] It is worth mentioning that for an IOM-based product
structure, in order to improve the degree of fitness between the
camera module and the mounting shell of the intelligent device, the
optical assembly 10 (or 10A) of the camera module is eccentrically
arranged on the molded photosensitive assembly 30 (or 30A) in terms
of design as shown in FIG. 18 (or FIG. 27), so that at least one
side of the optical assembly 10 (or 10A) protrudes outward from the
main body 31 (or 31A) of the molded photosensitive assembly 30 (or
30A); but the lens in the optical assembly 10 (or 10A) and the
photosensitive chip 33 (or 33A) in the molded photosensitive
assembly 30 (or 30A) need to be optically aligned, so it can only
be considered to reduce the thickness of the bounding body 311 (or
311A) of the main body 31 (or 31A) on the corresponding side.
However, the reduction in the thickness of the bounding body 311
(or 311A) will result in the narrowing of the lens glue 110 (or
110A), and once the lens glue 110 (or 110A) is too narrow, the
bonding strength between the optical assembly 10 (or 10A) and the
molded photosensitive assembly 30 (or 30A) is insufficient, and the
glue material of the lens glue 110 (or 110A) is prone to
infiltration to contaminate the filter 20 (or 20A).
[0474] In addition, a certain assembly space needs to be reserved
between the high inner side surface 3112 (or 3112A) of the bounding
body 311 (or 311A) and the filter 20 (or 20A), which causes the
adjustable range of the thickness of the bounding body 311 (or
311A) to become very small, so that the thickness of the bounding
body 311 (or 311A) is difficult to reduce, and the degree of
fitness between the camera module and the mounting shell of the
intelligent device cannot be improved. Therefore, in order to solve
the above problem, as shown in FIGS. 28 to 33C, a fifth preferred
embodiment of the present invention further provides a camera
module. The difference from the third and fourth preferred
embodiments is that the bounding body 311B of the main body 31B of
the molded photosensitive assembly 30B has a high upper surface
3111B and a low upper surface 3110B, wherein a height of the
bounding body 311B at the high upper surface 3111B is greater than
a height of the bounding body 311B at the low upper surface 3110B,
that is, the distance between the high upper surface 3111B and the
circuit board 35B is greater than the distance between the low
upper surface 3110B and the circuit board 35B, so that a part of
the optical assembly 10B is supported on the high upper surface
3111B of the bounding body 311B, and the other part of the optical
assembly 10B is supported on the low upper surface 3110B of the
bounding body 311B.
[0475] In other words, the bounding body 311B of the molded
photosensitive assembly 30B is discontinuous, that is, the upper
surface of the bounding body 311B is discontinuous, and includes
the high upper surface 3111B and the low upper surface 3110B lower
than the high upper surface 3111B, so that a part of the optical
assembly 10B can be connected to the high upper surface 3111B of
the bounding body 311B through the lens glue 110B, and the other
part of the optical assembly 10B can also be connected to the low
upper surface 3110B of the bounding body 311B through the lens glue
110B.
[0476] Exemplarily, the lens glue 110B of the camera module may
include, but is not limited to, a fixed glue layer 1101B and a glue
filling layer 1102B. The fixed glue layer 1101B is arranged between
the optical assembly 10B and the high upper surface 3111B of the
bounding body 311B, so that the optical assembly 10B is fixedly
connected to and supported on the high upper surface 3111B of the
bounding body 311B through the fixed glue layer 1101B. The glue
filling layer 1102B is arranged between the optical assembly 10B
and the low upper surface 3112B of the bounding body 311B, so that
the optical assembly 10B is reinforced and supported on the
bounding body 311B through the glue filling layer 1102B.
[0477] Preferably, the lens glue 110B is applied according to a
shape of the high upper surface 3111B of the bounding body 311B, to
form the fixed glue layer 1101B matching the shape of the high
upper surface 3111B of the bounding body 311B, thereby maximizing
the connection strength between the optical assembly 10B and the
molded photosensitive assembly 30B. Next, after the lens glue 110B
is cured to form the fixed glue layer 1101B, the lens glue is
supplemented between the optical assembly 10B and the low upper
surface 3112B of the bounding body 311B to form the glue filling
layer 1102B matching a shape of the low upper surface 3112B of the
bounding body 311B, so that the glue filling layer 1102B can not
only reinforce and support the optical assembly 10B on the bounding
body 311B, but can also seal a space between the optical assembly
10B and the molded photosensitive assembly 30B to prevent external
dust from entering to contaminate the optical assembly 10B and/or
the filter 20B.
[0478] It is worth noting that, because the low upper surface 3110B
of the bounding body 311B is lower than the high upper surface
3111B, a gap between the low upper surface 3110B of the bounding
body 311B and the leg 111B of the optical assembly 10B is larger
than a gap between the high upper surface 3111B of the bounding
body 311B and the leg 111B, that is, a thickness of the glue
filling layer 1102B between the low upper surface 3110B of the
bounding body 311B and the optical assembly 10B is greater than a
thickness of the fixed glue layer 1101B between the high upper
surface 3111B of the bounding body 311B and the optical assembly
10B, which helps to ensure sufficient bonding strength between the
optical assembly 10B and the molded photosensitive assembly 30B,
and can further reduce the thickness of the bounding body 311B at
the low upper surface 3110B, so that the degree of fitness between
the camera module and the mounting shell of the intelligent device
is improved.
[0479] More specifically, in this preferred embodiment, as shown in
FIG. 29, the high upper surface 3111B of the bounding body 311B is
U-shaped, the low upper surface 3110B of the bounding body 311B is
linear shaped, and the low upper surface 3110B of the bounding body
311B extends from one high outer side 3113B of the bounding body
311B to the other high outer side 3113B of the bounding body 311B
(that is, a length of the low upper surface 3110B of the bounding
body 311B is equal to a distance between the two high outer sides
3113B of the bounding body 311B, which is also referred to as an
external dimension of the bounding body 311B), so as to form a
U-shaped groove in the main body 31B. In other words, the high
upper surface 3111B of the bounding body 311B corresponds to three
sides of the optical assembly 10B, and the low upper surface 3110B
of the bounding body 311B corresponds to one side of the optical
assembly 10B, so that the optical assembly 10B is supported on the
high upper surface 3111B of the bounding body 311B on three sides,
and supported on the low upper surface 3110B of the bounding body
311B on one side. It is understandable that the glue filling layer
1102B on the short upper surface 3121B of the short body 312B is
thicker than the fixed glue layer 1101B on the high upper surface
3111B of the bounding body 311B to maintain the optical assembly
10B parallel to the filter 20B.
[0480] Preferably, the fixed glue layer 1101B of the lens glue 110B
may be U-shaped to match the high upper surface 3111B of the
bounding body 311B. The glue filling layer 1102B of the lens glue
110B may be linear shaped to match the low upper surface 3112B of
the bounding body 312B. In this way, the fixed glue layer 1101B and
the glue filling layer 1102B are combined to form the lens glue
110B with a hollow square-shaped structure, so as to seal the space
between the optical assembly 10B and the molded photosensitive
assembly 30B and prevent external dust from entering to contaminate
the optical assembly 10B and/or the filter 20B.
[0481] It is worth noting that in some embodiments of the present
invention, the electronic devices 321B are suitable to be embedded
by the bounding body 311B of the main body 31B due to their
relatively large heights, and are located below the high upper
surface 3111B of the bounding body 311B. That is, the electronic
devices 321B are suitable to be arranged on three sides of the
photosensitive chip 33B, and the electronic devices 321B correspond
to the high upper surface 3111B of the bounding body 311B.
[0482] Further, the low upper surface 3110B of the bounding body
311B is in a same height with the short upper surface 3121B of the
short body 312B, that is, the height of the bounding body 311B at
the low upper surface 3110B is equal to the height of the short
body 312B. In this way, the bounding body 311B does not require any
avoidance space for the filter 20B at the low upper surface 3110B,
which further reduces the thickness of the bounding body 311B on
the side corresponding to the low upper surface 3110B, thereby
increasing the degree of outward protrusion of the optical assembly
10B at the low upper surface 3110B of the bounding body 311B, and
further improving the degree of fitness between the camera module
and the mounting shell of the intelligent device.
[0483] Exemplarily, as shown in FIG. 28, in order to adapt to the
mounting shell 51 with rounded corners in the intelligent device,
the optical assembly 10B protrudes outward from the low upper
surface 3110B of the bounding body 311B (that is, a side of the
main body 31B corresponding to the low upper surface 3110B), so
that the optical assembly 10B of the camera module is closer to the
mounting shell 51 of the intelligent device to increase the
screen-to-body ratio of the intelligent device.
[0484] As shown in FIGS. 28 to 30, the bounding body 311B is molded
into a U-shaped structure, while the short body 312B extends to the
inner side of the bounding body 311B and is molded into a square
shape, so that a U-shaped groove is formed inside the main body
31B. That is, the bounding body 311B of the main body 31B has a
notch at the low upper surface 3110B, and when the optical assembly
10B is bonded to the low upper surface 3110B of the bounding body
311B through the lens glue 110B, an air escape passage is formed
between the optical assembly 10B and the low upper surface 3110B of
the bounding body 311B, so that when the lens glue 110B is heated
and cured, the air between the optical assembly 10B and the filter
20B can escape via the air escape passage, which prevents the air
between the optical assembly 10B and the filter 20B from expanding
due to heating to damage the filter 20B or the optical assembly
10B. It can be understood that, similar to the third embodiment and
the fourth embodiment, the filter 20B in this embodiment of the
present invention is also supported on the short upper surface
3121B of the short body 312B.
[0485] As shown in FIG. 31, the bounding body 311B is molded into
another feasible mode. The low upper surface 3110B of the bounding
body 311B extends from one high inner side surface 3112B of the
bounding body 311B to the other high inner side surface 3112B of
the bounding body 311B (that is, the length of the low upper
surface 3110B of the bounding body 311B is equal to a distance
between the two high inner side surfaces 3112B of the bounding body
311B, which is also referred to as an internal dimension of the
bounding body 311B), so that the bounding body 311B has the larger
high upper surface 3111B to stably support the optical assembly
10B.
[0486] A method for manufacturing the camera module is shown in
FIGS. 32 to 33C. The manufacturing method includes the following
steps:
[0487] I The photosensitive chip 33B, the wires 34B and the
electronic devices 32B are connected to the circuit board 35B;
[0488] II The connected circuit board 35B is placed between an
upper die 41B and a lower die 42B;
[0489] III The electronic devices 32B are embedded in a main body
31B and on the circuit board 35B to form a molded photosensitive
assembly 30B, wherein the main body 31B includes a bounding body
311B and a short body 312B whose height is lower than that of the
bounding body 311B;
[0490] IV The filter 20B is mounted on the short upper surface
3121B of the short body 312B; and
[0491] V The optical assembly 10B is eccentrically arranged on the
bounding body 311B, so that the optical assembly 10B is close to at
least one side of a mounting shell 51.
[0492] Further, step V of the method for manufacturing the camera
module may include the following steps:
[0493] V.1 The optical assembly 10B is fixed to a high upper
surface 3111B of the bounding body 311B; and
[0494] V.2 The optical assembly 10B is reinforced to a low upper
surface 3110B of the bounding body 311B, wherein the low upper
surface 3110B is lower than the high upper surface 3111B.
[0495] In an example of the present invention, the high upper
surface 3111B of the bounding body 311B in step III is U-shaped, so
that the optical assembly is supported on the high upper surface
3111B of the bounding body 311B on three sides, and supported on
the low upper surface 3110B of the bounding body 311B on one
side.
[0496] In an example of the present invention, the low upper
surface 3110B of the bounding body 311B is in a same height with
the short upper surface 3121B of the short body 312B.
[0497] In an example of the present invention, the low upper
surface 3110B of the bounding body 311B extends from one high outer
side surface 3113B of the bounding body 311B to the other high
outer side surface 3113B of the bounding body 311B.
[0498] In another example of the present invention, the low upper
surface 3110B of the bounding body 311B extends from one high inner
side surface 3112B of the bounding body 311B to the other high
inner side surface 3112B of the bounding body 311B.
[0499] It is worth mentioning that in step V.1 of the present
invention, a lens glue 110B is applied to the high upper surface
3111B of the bounding body 311B to form a fixed glue layer 1101B
between the optical assembly 10B and the high upper surface 3111B
of the bounding body 311B.
[0500] Further, step V.2 of the present invention further includes
the following steps:
[0501] V.2.1 The optical assembly 10B and the molded photosensitive
assembly 30B are inverted, so that the optical assembly 10B is
located on a lower side of the molded photosensitive assembly 30B;
and
[0502] V.2.2 The lens glue 110B is applied between the leg 111B of
the optical assembly 10B and the low upper surface 3110B of the
bounding body 311B to form a glue filling layer 1102B.
[0503] It can be understood that as the optical assembly 10B and
the molded photosensitive assembly 30B are inverted, the lens glue
110B has no chance to flow into the incident surface 211B of the
filter portion 21B, so that the filter 20B is maintained clean and
supported firmly.
[0504] In an example of the present invention, the fixed glue layer
1101B is U-shaped, and the glue filling layer 1102B is linear
shaped.
[0505] In an example of the present invention, the fixed glue layer
1101B is L-shaped, and the glue filling layer 1102B is
L-shaped.
[0506] Particularly, in an example of the present invention, an
angle between the high inner side surface 3112B of the bounding
body 311B and the short upper surface 3121B of the short body 312B
is between 95.degree. and 100.degree..
[0507] It is worth mentioning that when the high upper surface
3111B of the bounding body 311B is U-shaped, the low upper surface
3110B of the bounding body 311B will be linear shaped and located
on a separate side of the main body 31B, so that the optical
assembly 10B of the camera module can protrude outward from the
side where the low upper surface 3110B is located relative to the
molded photosensitive assembly 30B, the optical assembly 10B can be
extremely close to the mounting shell of the intelligent device on
the side where the low upper surface 3110B is located, and the
camera module is suitable to be mounted in a non-corner region of
the mounting shell to be unilaterally adjacent to the mounting
shell. However, when the camera module is mounted in a corner
region of the mounting shell of the intelligent device, the optical
assembly 10B cannot be close to the mounting shell on two sides due
to the fact that the low upper surface 3110B is only on one side of
the main body 31B, resulting in insufficient degree of fitness
between the camera module and the mounting shell.
[0508] Therefore, in order to solve the above problem, the present
invention further provides another modified implementation mode of
the camera module, as shown in FIGS. 34 and 35. The high upper
surface 3111B of the bounding body 311B is L-shaped, and the low
upper surface 3110B of the bounding body 311B is also L-shaped, so
that the low upper surface 3110B is located on two adjacent sides
of the main body 31B. That is, in this modified implementation mode
of the present invention, the high upper surface 3111B of the
bounding body 311B of the molded photosensitive assembly 30B of the
camera module is L-shaped, so that the optical assembly 10B is
supported on the high upper surface 3111B of the bounding body 311B
on two adjacent sides, and supported on the low upper surface 3110B
of the bounding body 311B on two adjacent sides. In this way, the
optical assembly 10B of the camera module can protrude relative to
the molded photosensitive assembly 30B from the two sides where the
low upper surface 3110B is located, and the optical assembly 10B
can be extremely close to the mounting shell of the intelligent
device on the two sides where the low upper surface 3110B is
located, so that the camera module is suitable to be mounted in a
corner region of the mounting shell, and the optical assembly 10B
is bilaterally adjacent to the mounting shell to maximize the
screen-to-body ratio of the intelligent device.
[0509] Preferably, the fixed glue layer 1101B of the lens glue 110B
may be L-shaped to match the high upper surface 3111B of the
bounding body 311B. The glue filling layer 1102B of the lens glue
110B may also be L-shaped to match the low upper surface 3112B of
the bounding body 312B. In this way, the fixed glue layer 1101B and
the glue filling layer 1102B are combined to form the lens glue
110B with a hollow square-shaped structure, so as to seal the space
between the optical assembly 10B and the molded photosensitive
assembly 30B and prevent external dust from entering to contaminate
the optical assembly 10B and/or the filter 20B.
[0510] It is worth noting that in some embodiments of the present
invention, the electronic devices 321B are suitable to be embedded
by the bounding body 311B of the main body 31B due to their
relatively large heights, and are located below the high upper
surface 3111B of the bounding body 311B. That is, the electronic
devices 321B are suitable to be arranged on two sides of the
photosensitive chip 33B, and the electronic devices 321B correspond
to the high upper surface 3111B of the bounding body 311B.
[0511] A person skilled in the art should understand that the above
descriptions and the embodiments of the present invention shown in
the accompanying drawings are only examples and do not limit the
present invention. The objects of the present invention are
completely and effectively achieved. The functions and structural
principles of the present invention are shown and explained in the
embodiments, and the implementation modes of the present invention
may have any variation or modification without departing from the
principles.
* * * * *