Assembly Of High Fidelity Polynucleotides

Jacobson; Joseph ;   et al.

Patent Application Summary

U.S. patent application number 17/341286 was filed with the patent office on 2021-09-23 for assembly of high fidelity polynucleotides. This patent application is currently assigned to Gen9, Inc.. The applicant listed for this patent is Gen9, Inc.. Invention is credited to Larry Li-Yang Chu, Joseph Jacobson.

Application Number20210291136 17/341286
Document ID /
Family ID1000005629488
Filed Date2021-09-23

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