U.S. patent application number 17/167822 was filed with the patent office on 2021-09-02 for electrode having protective and locking layers on current collector.
The applicant listed for this patent is ZAF ENERGY SYSTEMS, INCORPORATED. Invention is credited to Melissa D. McIntyre, Kurt Salloux, Adam Weisenstein.
Application Number | 20210273234 17/167822 |
Document ID | / |
Family ID | 1000005381522 |
Filed Date | 2021-09-02 |
United States Patent
Application |
20210273234 |
Kind Code |
A1 |
McIntyre; Melissa D. ; et
al. |
September 2, 2021 |
ELECTRODE HAVING PROTECTIVE AND LOCKING LAYERS ON CURRENT
COLLECTOR
Abstract
An electrode includes a current collector, a metal shell in
direct contact with and encapsulating the current collector, green
dendritic columnar growths extending out of the metal shell and
having protrusions thereon, and active material in contact with the
metal shell and having embedded therein the green dendritic
columnar growths. The protrusions penetrate the active material to
form a mechanical retainer that prevents delamination of the active
material from the metal shell and define localized regions of
increased current density during operation of the electrode that
promote deposition of the active material first on the protrusions
and then on areas of the green dendritic columnar growths adjacent
to the protrusions such that the active material electrochemically
adheres to the green dendritic columnar growths and the protrusions
enlarge during repeated charge and discharge cycling of the
electrode.
Inventors: |
McIntyre; Melissa D.;
(Butte, MT) ; Weisenstein; Adam; (Bozeman, MT)
; Salloux; Kurt; (Livingston, MT) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ZAF ENERGY SYSTEMS, INCORPORATED |
Bozeman |
MT |
US |
|
|
Family ID: |
1000005381522 |
Appl. No.: |
17/167822 |
Filed: |
February 4, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
16803534 |
Feb 27, 2020 |
10944113 |
|
|
17167822 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01M 2004/021 20130101;
H01M 4/70 20130101; H01M 4/628 20130101; H01M 4/661 20130101 |
International
Class: |
H01M 4/70 20060101
H01M004/70; H01M 4/66 20060101 H01M004/66; H01M 4/62 20060101
H01M004/62 |
Claims
1. An electrode comprising: a current collector; zinc green
dendritic columnar growths supported by and extending away from the
current collector and having protrusions thereon; and active
material having embedded therein the zinc green dendritic columnar
growths, wherein the protrusions (i) penetrate the active material
to form a mechanical retainer that prevents delamination of the
active material from the current collector and (ii) define
localized regions of increased current density during operation of
the electrode that promote deposition of the active material first
on the protrusions and then on areas of the zinc green dendritic
columnar growths adjacent to the protrusions such that the active
material electrochemically adheres to the zinc green dendritic
columnar growths and the protrusions enlarge during repeated charge
and discharge cycling of the electrode.
2. The electrode of claim 1, wherein the active material is zinc
based.
3. The electrode of claim 1, wherein the current collector includes
aluminum, brass, bronze, chromium, copper, graphite, nickel,
silver, stainless steel, tin, zinc, or combinations thereof.
4. The electrode of claim 1, wherein the zinc green dendritic
columnar growths further include bismuth, cadmium, gallium, indium,
lead, mercury, silver, thallium, tin, or combinations thereof.
5. A battery comprising: the electrode of claim 1.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of application Ser. No.
16/803,534, filed Feb. 27, 2020, the entire contents of which are
incorporated by reference herein.
TECHNICAL FIELD
[0002] This disclosure relates to an electrode containing a
substrate having a metal shell encapsulating a current collector,
and dendritic columnar growths extending from the metal shell.
BACKGROUND
[0003] Current collectors for electrochemical devices provide an
active material scaffold and electron pathways from the active
material. Current collectors, however, can be subjected to
corrosion if not protected properly, leading to higher resistance
and contamination of the electrochemical device. Adhesion of the
active mass to the foil current collector can be poor during
electrode fabrication and is slow at electrochemical adhesion
during active mass formation of the electrode.
SUMMARY
[0004] An electrode includes a substrate comprised of a current
collector, a metal shell in direct contact with and encapsulating
the current collector, and green dendritic columnar growths
extending out of the metal shell and having protrusions thereon.
The electrode also includes active material in contact with the
metal shell and having embedded therein the green dendritic
columnar growths. The protrusions penetrate the active material to
form a mechanical retainer that prevents delamination of the active
material from the metal shell, and define localized regions of
increased current density during operation of the electrode that
promote deposition of the active material first on the protrusions
and then on areas of the green dendritic columnar growths adjacent
to the protrusions such that the active material electrochemically
adheres to the green dendritic columnar growths and the protrusions
enlarge during repeated charge and discharge cycling of the
electrode.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] FIG. 1 is a schematic diagram, in cross-section, of a copper
foil current collector, and blocking and locking layers adhered
with active material before charge and discharge cycling.
[0006] FIG. 2 is a schematic diagram, in cross-section, of the
copper foil current collector, and blocking and locking layers
adhered with active material of FIG. 1 after charge and discharge
cycling.
[0007] FIG. 3 is a field emission scanning electron microscope
image, in cross-section, of a copper foil current collector with a
blocking layer, before active material adhesion.
[0008] FIG. 4 is a field emission scanning electron microscope
image, in cross-section, of a copper foil current collector with
blocking and locking layers, before active material adhesion.
[0009] FIG. 5 is a field emission scanning electron microscope
image, in cross-section, of a copper foil current collector with
blocking and locking layers adhered with active material.
[0010] FIG. 6 is a field emission scanning electron microscope
image, in cross-section, of a copper foil current collector without
blocking and locking layers delaminated from active material.
[0011] FIG. 7 is a column chart of cell resistance for cells with
and without blocking and locking layers.
[0012] FIG. 8 is an electrochemical impedance spectroscopy Nyquist
plot for cells with and without blocking and locking layers.
DETAILED DESCRIPTION
[0013] Various embodiments of the present disclosure are described
herein. The disclosed embodiments, however, are merely exemplary
and other embodiments may take various and alternative forms that
are not explicitly illustrated or described. The figures are not
necessarily to scale; some features may be exaggerated or minimized
to show details of particular components. Therefore, specific
structural and functional details disclosed herein are not to be
interpreted as limiting, but merely as a representative basis for
teaching one of ordinary skill in the art to variously employ the
present invention. As those of ordinary skill in the art will
understand, various features illustrated and described with
reference to any one of the figures may be combined with features
illustrated in one or more other figures to produce embodiments
that are not explicitly illustrated or described. The combinations
of features illustrated provide representative embodiments for
typical applications. However, various combinations and
modifications of the features consistent with the teachings of this
disclosure may be desired for particular applications or
implementations.
[0014] Improving active material adhesion and current collector
protection is helpful to achieving optimal battery performance. To
protect the current collector from corrosion, while also improving
adhesion and maintaining electrical contact with the active
material, two layers of material may be grown on the current
collector prior to attaching the active material. A dense, metal
shell is first deposited onto the current collector. This
blocking/protective layer prevents exposure and corrosion of the
current collector to electrolyte throughout the life of the
electrochemical device. The second layer, or locking layer,
includes dendritic columnar growths extending out of the metal
shell and having convex protrusions. Each of the dendritic columnar
growths are comprised of a base, or trunk, that extends from the
protective layer, and arms, or branches, that extend from the
trunk. These branches increase in length and/or width during
repeated charge and discharge cycles. The current collector and
protective and locking layers define the substrate onto which the
active material is attached. Thus, the active material is in
contact with the metal shell and has embedded therein the dendritic
columnar growths such that the convex protrusions penetrate the
active material to form a mechanical retainer.
[0015] The current collector can be comprised of aluminum, brass,
bronze, chromium, copper, graphite, nickel, stainless steel,
silver, tin, zinc, or combinations thereof. The blocking layer can
be comprised of bismuth, cadmium, gallium, indium, lead, mercury,
thallium, tin, silver, zinc, or combinations thereof. The locking
layer can be comprised of bismuth, cadmium, gallium, indium, lead,
mercury, thallium, tin, silver, zinc, or combinations thereof. And,
the active material can be comprised of zinc-based compounds (e.g.,
calcium zincate, metallic zinc, and zinc oxide), binders (e.g.,
polycarbonate, polyethylene, polypropylene,
polytetrafluoroethylene, and polyvinyl alcohol), or gelling agents
(e.g., acrylate polymers, carboxymethyl cellulose, hydroxyethyl
cellulose, hydroxypropyl methylcellulose, polyacrylic acid, and
polyethylene oxide). The active material can also include hydrogen
gas suppression agents, zinc nucleation agents, zinc solubility
reduction agents, or conductivity enhancement agents (e.g.,
aluminum oxide, barium oxide, bismuth oxide, cadmium, calcium
hydroxide, conductive carbons, gallium, indium hydroxide, lead,
mercury oxide, silver, tin oxides, and thallium oxide).
[0016] The dendritic columnar architecture prevents delamination of
the active material from the metal shell and creates localized
regions of increased current density during operation of the
electrode that promote deposition of the active material. This
deposition happens first on the convex protrusions and then on
areas of the dendritic columnar growths adjacent to the convex
protrusions, to electrochemically adhere the active material to the
dendritic columnar growths. The increased adhesion, both
mechanically and electrochemically, decreases interfacial impedance
of the substrate and the active mass along with producing a more
robust electrode. The dendritic columnar growths will continue to
grow into the active material as the battery is cycled. The largest
growth will occur at the convex protrusions of the dendritic
columns first, followed by the growths adjacent to the convex
protrusions. As such, the adhesion between the activate material
and layers improves with use.
[0017] Conventionally, certain electrodes are fabricated by
casting, pressing, or laminating the active material onto the
current collector, building a cell with the electrodes, and then
charging the cell at low current densities to electrochemically
adhere the active material to the current collector. During this in
situ deposition method, a protective layer forms as metal deposited
onto the current collector. Current densities are kept low to
create a smooth layer and prevent dendrite formation on the active
material, which can pierce the separator resulting in a cell short.
Interfacial resistance and electrochemical performance of cells
made via the in situ deposition method can vary greatly since
electrochemical adhesion will not occur where active material has
delaminated from the current collector and will be limited to
regions where the active material is in direct contact with the
metal shell. Unlike substrates created via in situ deposition,
substrates with the protective and locking layers created before
attaching the active material and being built into a cell do not
have delamination issues, resulting in initial improved lamination,
and thus, utilization of the active material in cells during charge
and discharge cycling. Dendritic columnar growths that have yet to
be exposed to charge and discharge cycling are therefore referred
to as green dendritic columnar growths.
[0018] FIG. 1 is a side view of an electrode 10 of a battery 11
containing a substrate with a current collector 12, a metal shell
14, or blocking layer, in direct contact with and encapsulating the
current collector 12, and green dendritic columnar growths 16, or
locking layer, extending out of the metal shell 14. Active material
18 is in contact with the metal shell 14 and has embedded therein
the dendritic columnar growths 16 such that convex protrusions 20
thereof penetrate the active material 18 to form a mechanical
retainer.
[0019] FIG. 2 is a representation of FIG. 1 after repeated charge
and discharge cycles. Significant growth of the dendritic columns
16, which are no longer green, has occurred at the convex
protrusions 20.
[0020] Protective and locking layers can be formed on a current
collector via electrodeposition in acidic, neutral, or alkaline
plating bath solutions. Although the current collector material and
the metal to be electroplated should be considered when selecting
the appropriate bath composition, the morphologies of the
electrodeposited layers are tailored using different current
densities and plating times. An example of this process involves
creating zinc metal protective and locking layers on a copper foil
current collector. Zinc is first deposited under low current
density conditions to establish a protective zinc layer that
encapsulates the copper foil. An example of the zinc metal
protective layer is shown in FIG. 3, where a current collector 112
with a protective layer 114 was submerged in epoxy, polished, and
imaged with a Field Emission Scanning Electron Microscope (FESEM).
Longer plating times are typically employed to ensure complete
coverage of the copper. A higher current density is then applied to
promote dendritic columnar zinc growth on the protective layer,
which creates the locking layer. An example of the dendritic
columnar zinc growth on a zinc metal protective layer is shown in
FIG. 4, where a current collector 212 with protective and locking
layers 214, 216 was submerged in epoxy, polished, and imaged with
FESEM. This novel process differs from traditional zinc plating
methods where low current density plating conditions are employed
to form a smooth, dense zinc plate and high current density plating
conditions are avoided to prevent dendritic columnar zinc
growth.
[0021] Electroplating zinc is a common method used to protect
metals that are exposed to corrosive environments, such as zinc
coated (galvanized) steel and iron that are used in commercial and
industrial building materials to increase corrosion resistance. In
order to form a protective layer, the plated metal should be a
coherent, non-porous deposit. The two basic growth mechanisms
include layer growth and nucleation--coalescence growth, both of
which are affected by current densities and plating bath conditions
during the plating process. For both mechanisms, grain growth
occurs during the electrodeposition process creating steps or
raised areas where the deposited metal will preferentially deposit.
These protruding areas create localized high current density
regions that promote selective deposition phenomenon. Applying high
currents during electrodeposition enhances this phenomenon
resulting in a nonuniform, rough plating layer. To improve
efficiency and promote more uniform deposition, additives including
leveling agents, brighteners, and carrier or wetting agents may be
added to the plating bath. The types of additives are selected
based on the metal to be deposited, the metal being plated on, and
the plating bath solution.
[0022] The predominate electroplating methods for zinc coatings are
alkaline cyanide, alkaline non-cyanide, and acid chloride plating
baths. Since the zinc is intended to create a protective layer, the
zinc layer must be dense and thick enough to prevent corrosion of
the underlying metal surface. This zinc layer is typically formed
by creating small grain zinc deposits that are grown on top of one
another to create a dense, uniform barrier. As mentioned above,
leveling agents, brighteners, and carrier or wetting agents such as
aliphatic polyamines, aromatic aldehydes, fatty alcohols,
heterocyclic amines, polyalcohol, polyamine, poly vinyl alcohol, or
quaternary nicotinates are typically added to the plating bath to
promote the formation of a uniform zinc layer.
Example One--Alkaline Bath Blocking and Locking Constant Current
Deposition Techniques
[0023] One example of a plating method used to deposit protective
and locking zinc layers on a copper foil includes electrodeposition
in an alkaline plating bath solution of sodium hydroxide and zinc
metal or zinc oxide. Leveling, brightening, or wetting additives
may be added to the solution. In this bath, the copper foil acts as
the cathode and is positioned between two anodes that are comprised
of consumable or non-consumable metal plates (e.g., zinc metal or
nickel metal, respectively). This configuration is used to plate
zinc on both faces of the copper foil. A pump agitates the plating
bath solution with the solution flow directed across the copper to
supply new reactant species (Zn.sup.2+) and remove gas products
from the copper surface during the electrodeposition process. The
protective and locking layers are formed using constant current
deposition techniques. The protective layer is formed first by
galvanostatic deposition at a constant current with a low current
density (typically below 10 mA/cm.sup.2) for a time period that is
selected based on the desired zinc protective layer thickness where
longer times are used to create a thicker zinc deposit. The locking
layer is then formed by galvanostatic deposition at a constant
current with a current density that is higher (3.times. or more)
than the current density used to form the protective layer. Again,
the deposition time is selected based on the desired zinc locking
layer thickness. After plating, the zinc plated copper foil is
rinsed to remove residual plating bath solution and then dried.
Example Two--Alkaline Bath Blocking and Locking Pulsed Deposition
Techniques
[0024] The second example of zinc plating protective and locking
layers on copper foil includes electrodeposition in the same
alkaline plating bath solution and electrode configuration as in
example one. This solution is agitated during the electrodeposition
process while the protective and locking layers are formed using
galvanostatic pulsed deposition techniques. The protective layer is
formed by applying a galvanostatic rectangular-pulse waveform that
has a longer off-time than on-time (typically off-times are
3.times. or more longer than on-times) to produce fine gain zinc
deposits that create a coherent, non-porous layer. Additionally,
the pulse current density is below 50 mA/cm.sup.2 (typically
between 20-40 mA/cm.sup.2) to create fine grain deposits. The
plating time period (total number of pulses) is selected based on
the desired zinc protective layer thickness. Converse of the
protective layer electrodeposition process, the locking layer is
formed by applying a galvanostatic rectangular-pulse waveform that
has a longer on-time than off-time to produce larger grain zinc
deposits that create a rough, porous layer. The plating time period
(total number of pulses) is selected based on the desired zinc
locking layer thickness. After plating, the zinc plated copper foil
is rinsed to remove residual plating bath solution and then dried.
Although rectangular wave forms have been described, other
waveforms, such as sinusoidal pulses or periodic-reverse pulses,
can also be used.
Example Three--Alkaline Bath Blocking and Locking Constant Current
and Pulsed Deposition Techniques
[0025] The third example of zinc plating protective and locking
layers on copper foil also includes electrodeposition in the same
alkaline plating bath solution and electrode configuration as in
example one. This solution is agitated during the electrodeposition
process while the protective layer is formed using the constant
current deposition technique and the locking layer is formed using
the pulsed deposition technique. The protective layer is deposited
on the copper foil using the same parameters as the protective
layer formation in example one. The locking layer is grown on the
protective layer using the same parameters as the locking layer
formation in example two. After plating, the zinc plated copper
foil is rinsed to remove residual plating bath solution and then
dried.
Example Four--Alkaline Bath Blocking and Locking Pulsed and
Constant Current Deposition Techniques
[0026] The fourth example of zinc plating protective and locking
layers on copper foil includes electrodeposition in the same
alkaline plating bath solution and electrode configuration as in
example one. This solution is agitated during the electrodeposition
process while the protective layer is formed using the pulsed
deposition technique and the locking layer is formed using the
constant current deposition technique. The protective layer is
deposited on the copper foil using the same parameters as the
protective layer formation in example two. The locking layer is
grown on the protective layer using the same parameters as the
locking layer formation in example one. After plating, the zinc
plated copper foil is rinsed to remove residual plating bath
solution and then dried.
Example Five--Acid Chloride Bath Blocking and Locking Deposition
Techniques
[0027] The fifth example of zinc plating protective and locking
layers on copper foil includes electrodeposition in an acid
chloride plating bath solution of potassium chloride and zinc metal
or zinc oxide. Leveling, brightening, or wetting additives may be
added to the solution. In this bath, the copper foil acts as the
cathode and is positioned between two anodes that are comprised of
consumable or non-consumable metal plates (e.g., zinc metal or
nickel metal, respectively). This configuration is used to plate
zinc on both faces of the copper foil. A pump agitates the plating
bath solution with the solution flow directed across the copper to
supply new reactant species (Zn.sup.2) and remove gas products from
the copper surface during the electrodeposition process. The
protective and locking layers can be formed using constant current
deposition techniques (see example one), pulsed deposition
techniques (see example two), or combinations thereof (see examples
three and four). After plating, the zinc plated copper foil is
rinsed to remove residual plating bath solution and then dried.
Example Six--Alkaline Bath and Acid Chloride Bath Blocking and
Locking Deposition Techniques
[0028] The sixth example of zinc plating on copper foil includes
electrodeposition of the zinc protective layer in the same alkaline
plating bath solution in example one followed by the
electrodeposition of the zinc locking layer in the same acid
chloride bath solution in example live. The protective layer is
deposited on the copper foil and the locking layer is gown on the
protective layer using any of the constant current and/or pulse
parameters outlined in examples one though four.
Example Seven--Acid Chloride Bath and Alkaline Bath Blocking and
Locking Deposition Techniques
[0029] The seventh example of zinc plating on copper foil includes
electrodeposition of the zinc protective layer in the same acid
chloride bath solution in example five followed by the
electrodeposition of the zinc locking layer in the same alkaline
plating bath solution in example one. The protective layer is
deposited on the copper foil and the locking layer is grown on the
protective layer using any of the constant current and/or pulse
parameters outlined in examples one though four.
[0030] Although the above examples are written for galvanostatic
deposition processes, potentiostatic deposition processes could
also be used, etc.
[0031] Improved adhesion between the active material and current
collectors with the protective and locking layers was verified by
several tests designed to evaluate mechanical and electrochemical
adhesion. In these tests, electrodes were fabricated with a
zinc-based active material. The electrodes employed current
collectors comprised of copper foil with a zinc protective layer
and a zinc locking layer or plain copper foil for direct
comparison.
[0032] Mechanical adhesion between the active material and current
collector in electrodes was examined with cross section images of
the electrodes. Pristine, green tape electrodes 310, 410 were
submerged in epoxy, polished, and imaged with FESEM as shown in
FIGS. 5 and 6 respectively. FIG. 5 shows a current collector 312,
protective layer 314, locking layer 316, and active material 318.
FIG. 6 shows a current collector 412 and active material 418. These
images reveal that the active material 318 and the current
collector 312 with the protective and locking zinc layers 314, 316
are in direct contact. The active material 418, however, has
delaminated from the plain copper foil current collector 412. These
results demonstrate that mechanical adhesion is superior for
current collectors utilizing protective and locking layers.
[0033] For electrochemical adhesion tests, cells were constructed
with electrodes having the protective and locking zinc layer
current collector or plain copper current collector paired with
nickel-based electrodes. The cells were filled with an alkaline
electrolyte. Electrochemical impedance measurements were performed
to evaluate differences in cell impedances associated with
electrochemical adhesion due to the presence or absence of the
protective and locking zinc layers. The interfacial resistance
between the active material and current collector dominates at high
frequencies while charge transfer and mass transport impedances
within the active material are observed at lower frequencies. To
determine the interfacial resistance, cell impedance was recorded
at a single frequency of 1 kHz. As shown in FIG. 7, the electrodes
with the protective and locking layers exhibit a lower average
resistance, 0.17.+-.0.01.OMEGA., compared to electrodes with the
plain copper foil, 0.28.+-.0.02.OMEGA.. The lower resistance is
attributed to increased electric contact between the active
material and current collector. To examine how the interfacial
resistance influences charge transfer and mass transport
impedances, Electrochemical Impedance Spectroscopy (EIS)
measurements were conducted over a range of 100,000-0.1 Hz. The EIS
Nyquist plot for two cells are presented in FIG. 8. The smaller
semicircle for the cell with the protective and locking zinc layers
is indicative of lower impedances. This behavior is ascribed to
increased electric contact with the current collector improving
connectivity within the active materials that may otherwise be
isolated in the electrode with a plain copper foil current
collector. Both single frequency and EIS results demonstrate
overall lower impedances due to improved electrical adhesion in
electrodes with the protective and locking layers.
[0034] While exemplary embodiments are described above, it is not
intended that these embodiments describe all possible forms
encompassed by the claims. The words used in the specification are
words of description rather than limitation, and it is understood
that various changes may be made without departing from the spirit
and scope of the disclosure and claims. As previously described,
the features of various embodiments may be combined to form further
embodiments that may not be explicitly described or illustrated.
While various embodiments may have been described as providing
advantages or being preferred over other embodiments or prior art
implementations with respect to one or more desired
characteristics, those of ordinary skill in the art recognize that
one or more features or characteristics may be compromised to
achieve desired overall system attributes, which depend on the
specific application and implementation. These attributes include,
but are not limited to appearance, cost, durability, ease of
assembly, life cycle cost, manufacturability, marketability,
packaging, serviceability, size, strength, weight, etc. As such,
embodiments described as less desirable than other embodiments or
prior art implementations with respect to one or more
characteristics are not outside the scope of the disclosure and may
be desirable for particular applications.
* * * * *