U.S. patent application number 17/252649 was filed with the patent office on 2021-08-19 for magnetofluid pump device for igbt heat dissipation and test method therefor.
The applicant listed for this patent is DALIAN UNIVERSITY OF TECHNOLOGY. Invention is credited to Kunpeng LI, Qingye LI, Xueguan SONG, Wei SUN, Changan ZHOU, Chaoyong ZONG.
Application Number | 20210257278 17/252649 |
Document ID | / |
Family ID | 1000005614392 |
Filed Date | 2021-08-19 |
United States Patent
Application |
20210257278 |
Kind Code |
A1 |
SONG; Xueguan ; et
al. |
August 19, 2021 |
MAGNETOFLUID PUMP DEVICE FOR IGBT HEAT DISSIPATION AND TEST METHOD
THEREFOR
Abstract
A magnetofluid pump device for IGBT heat dissipation and a test
method therefor are provided. The magnetofluid pump device uses a
liquid metal as a coolant, which can absorb more heat than an
ordinary water-cooling device and better dissipate heat for IGBT
chips. Temperature and pressure changes in an inlet pipe and an
outlet pipe of a magnetofluid pump can be monitored in real time
through temperature sensors and pressure sensors, and temperature
changes of the IGBT chips can be observed in real time through a
thermal imager. The test method for the magnetofluid pump device
for IGBT heat dissipation proposed by the present invention is
simple and easy to implement. A magnetic fluid can be driven to
flow by energizing positive and negative electrodes in the
magnetofluid pump under the action of magnetic fields, and
water-cooling equipment can dissipate heat for the magnetic fluid
in the magnetofluid pump.
Inventors: |
SONG; Xueguan; (Dalian,
Liaoning, CN) ; LI; Kunpeng; (Dalian, Liaoning,
CN) ; ZHOU; Changan; (Dalian, Liaoning, CN) ;
ZONG; Chaoyong; (Dalian, Liaoning, CN) ; LI;
Qingye; (Dalian, Liaoning, CN) ; SUN; Wei;
(Dalian, Liaoning, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
DALIAN UNIVERSITY OF TECHNOLOGY |
Dalian, Liaoning |
|
CN |
|
|
Family ID: |
1000005614392 |
Appl. No.: |
17/252649 |
Filed: |
August 3, 2020 |
PCT Filed: |
August 3, 2020 |
PCT NO: |
PCT/CN2020/106578 |
371 Date: |
December 15, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01J 2005/0077 20130101;
G01J 5/00 20130101; H01L 23/473 20130101; H02K 44/04 20130101; H02K
11/25 20160101; G01L 19/0092 20130101 |
International
Class: |
H01L 23/473 20060101
H01L023/473; G01J 5/00 20060101 G01J005/00; G01L 19/00 20060101
G01L019/00; H02K 11/25 20060101 H02K011/25; H02K 44/04 20060101
H02K044/04 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 25, 2019 |
CN |
201910787108.2 |
Claims
1. A magnetofluid pump device for IGBT heat dissipation, wherein
the magnetofluid pump device is used to dissipate heat for a IGBT
chipset; the IGBT chipset comprises an IGBT chip A, an IGBT chip B,
an IGBT chip C and an IGBT bottom plate; the IGBT chip A, the IGBT
chip B and the IGBT chip C are welded on the IGBT bottom plate by
tin solder; the IGBT chipset is arranged on a magnetofluid pump;
and the magnetofluid pump device comprises the magnetofluid pump, a
water-cooling device, pressure measuring devices, temperature
measuring devices and a data acquisition system; the inner part of
the magnetofluid pump is provided with a liquid metal, and the
magnetofluid pump comprises a magnetofluid pump upper shell, a
magnetofluid pump lower shell, a magnetofluid pump pipe in the
upper and lower shells, as well as a magnet S pole A, a magnet N
pole A, a magnet S pole B and a magnet N pole B which are arranged
in order from left to right in the magnetofluid pump upper shell;
the front face of the magnetofluid pump upper shell is provided
with a positive electrode and a negative electrode, and the back
face of the magnetofluid pump upper shell is provided with a
negative electrode and a positive electrode; the magnetofluid pump
upper shell is connected with the magnetofluid pump lower shell
below by connecting bolts, and is connected with the IGBT bottom
plate above by connecting bolts; the magnetofluid pump lower shell
is connected with the water-cooling device by a magnetofluid pump
water inlet pipe and a magnetofluid pump water outlet pipe, wherein
the magnetofluid pump water outlet pipe is connected with the
magnetofluid pump lower shell by flanges, and the magnetofluid pump
water inlet pipe is connected with the magnetofluid pump lower
shell by flanges; the magnetofluid pump pipe is connected with the
magnetofluid pump upper shell by threads; a magnetic field is
generated by the magnet S pole A and the magnet N pole A, an
electric field is generated by the positive electrode and the
negative electrode, and the liquid metal moves upwards under the
co-action of the electric field and the magnetic field; similarly,
under the action of a magnetic field generated by the magnet S pole
B and the magnet N pole B and an electric field generated by the
negative electrode and the positive electrode, the liquid metal
moves downwards; the water-cooling device is a piece of
water-cooling equipment, which is used to dissipate heat for the
liquid metal in the magnetofluid pump; water-cooling equipment is
connected with the magnetofluid pump water inlet pipe and the
magnetofluid pump water outlet pipe both by flanges; the pressure
measuring devices are a pressure sensor A and a pressure sensor B,
which are respectively arranged on the magnetofluid pump water
inlet pipe and the magnetofluid pump water outlet pipe, and are
used to measure the pressure in the magnetofluid pump water inlet
pipe and the magnetofluid pump water outlet pipe; the temperature
measuring devices are a temperature sensor A, a temperature sensor
B and a thermal imager, which are respectively arranged on the
magnetofluid pump water inlet pipe, the magnetofluid pump water
outlet pipe and the IGBT chipset, and are used to measure the
temperature of the magnetofluid pump water inlet pipe, the
magnetofluid pump water outlet pipe and the IGBT chipset; and the
data acquisition system is an industrial personal computer, is used
to control an external circuit to heat the IGBT chip A, the IGBT
chip B and the IGBT chip C to a certain temperature and acquire the
data information of the pressure sensor A, the pressure sensor B,
the temperature sensor A, the temperature sensor B and the thermal
imager, and is electrically connected with each sensor.
2. The magnetofluid pump device for IGBT heat dissipation according
to claim 1, wherein an annular groove is formed between the
magnetofluid pump upper shell and the IGBT bottom plate, and an
annular seal ring is arranged in the annular groove and used for
sealing.
3. The magnetofluid pump device for IGBT heat dissipation according
to claim 1, wherein connecting parts of the flanges are all
provided with seal rings for end face sealing.
4. The magnetofluid pump device for IGBT heat dissipation according
to claim 1, wherein thermal imager is 30 cm away from the IGBT chip
A, the IGBT chip B and the IGBT chip C, and is used to measure the
temperature changes of the chips.
5. The magnetofluid pump device for IGBT heat dissipation according
to claim 1, wherein the liquid metal is a GaInSn alloy material,
which comprises 68% of Ga, 22% of In and 10% of Sn by mass
percentage.
6. A test method for the magnetofluid pump device for IGBT heat
dissipation according to claim 1, comprising the following steps:
step 1: starting the system, turning on the water-cooling
equipment, and adjusting appropriate flow and pressure to dissipate
heat for the magnetofluid pump; acquiring the data information of
the pressure sensor A, the pressure sensor B, the temperature
sensor A and the temperature sensor B by the industrial personal
computer to monitor the heat dissipation of the magnetofluid pump
in real time; controlling the external circuit to heat the IGBT
chip A, the IGBT chip B and the IGBT chip C, observing the
temperature of the chips by the thermal imager, and heating the
chips to a certain temperature; step 2: controlling the external
circuit by the industrial personal computer to supply power to the
positive electrode, the negative electrode, the negative electrode
and the positive electrode, and driving the liquid metal to flow
for heat dissipation by Lorentz forces; controlling the flow rate
of the liquid metal by controlling the voltage of the two pairs of
electrodes; acquiring the surface temperature of the IGBT chip A,
the IGBT chip B and the IGBT chip C by the thermal imager, and
uploading the temperature information to the industrial personal
computer for data processing; and step 3: analyzing the heat
dissipation effect of the magnetofluid pump device by comparing the
temperature changes of the IGBT chip A, the IGBT chip B and the
IGBT chip C before and after heat dissipation; judging whether a
test is completed; if the test is not completed, continuing to
control the external circuit to heat the IGBT chip A, the IGBT chip
B and the IGBT chip C to another temperature or adjusting the
voltage of the electrodes to control the flow rate of the liquid
metal; if the test is completed, stopping and shutting down the
system.
Description
TECHNICAL FIELD
[0001] The present invention belongs to the field related to IGBT
heat dissipation, and relates to a magnetofluid pump device for
IGBT heat dissipation and a test method therefor.
BACKGROUND
[0002] Related fields such as offshore wind power, submarine
drilling and railways require highly reliable power conversion
systems. IGBT is a core component of a power conversion system, and
the service life thereof is crucial to the normal operation of the
system. Most of the failures of power electronic equipment are
caused by high temperature, and most of the existing cooling
systems are based on water cooling. As the power density of power
electronics technology continues to increase, redundant heat cannot
be dissipated by water cooling technology. It is of great
significance to find a new type of coolant with high thermal
conductivity for heat dissipation. Liquid metals have better
thermal conductivity than water and can absorb more heat, but
currently very few cooling devices uses liquid metals as
coolants.
[0003] Temperature is an important factor that affects the service
life of an IGBT. How to use a liquid metal as a coolant to fully
dissipate heat for the IGBT and keep the IGBT at a suitable
operating temperature is of great significance. Therefore, it is
necessary to invent a magnetofluid pump device for IGBT heat
dissipation and a test method therefor.
SUMMARY
[0004] In view of the problems in the prior art, the present
invention provides a magnetofluid pump device for IGBT heat
dissipation and a test method therefor. The magnetofluid pump
device for IGBT heat dissipation designed by the present invention
absorbs more heat than a traditional water-cooling device, and has
a better heat dissipation effect. The test method for the
magnetofluid pump device for IGBT heat dissipation proposed by the
present invention is simple in operation, can be used to well
dissipate heat for an IGBT, and can be used to test the heat
dissipation effect of a liquid metal at different flow rates on
IGBT chips when the IGBT is at different temperatures.
[0005] To achieve the above purpose, the present invention adopts
the following technical solution:
[0006] A magnetofluid pump device for IGBT heat dissipation,
wherein the magnetofluid pump device is used to dissipate heat for
a IGBT chipset; and the IGBT chipset comprises an IGBT chip A 8, an
IGBT chip B 22, an IGBT chip C 24 and an IGBT bottom plate 23. The
IGBT chip A 8, the IGBT chip B 22 and the IGBT chip C 24 are welded
on the IGBT bottom plate 23 by tin solder, and the IGBT chipset is
arranged on a magnetofluid pump. The magnetofluid pump device
comprises the magnetofluid pump, a water-cooling device, pressure
measuring devices, temperature measuring devices and a data
acquisition system.
[0007] The magnetofluid pump comprises a magnetofluid pump upper
shell 7, a magnetofluid pump lower shell 2, a magnetofluid pump
pipe 3, a magnet S pole A 9, a magnet N pole A 10, a magnet S pole
B 11, a magnet N pole B 12, a positive electrode A 18, a negative
electrode A 19, a negative electrode B 39 and a positive electrode
B 40. The magnet S pole A 9, the magnet N pole A 10, the magnet S
pole B 11, the magnet N pole B 12, the positive electrode A 18, the
negative electrode A 19, the negative electrode B 39 and the
positive electrode B 40 are all embedded in the magnetofluid pump
upper shell 7; the magnet S pole A 9, the magnet N pole A 10, the
magnet S pole B 11 and the magnet N pole B 12 are arranged in order
from left to right; the positive electrode A 18 and the negative
electrode B 39 are located on the front face of the magnetofluid
pump upper shell 7; and the negative electrode A 19 and the
positive electrode B 40 are located on the back face of the
magnetofluid pump upper shell 7. The magnetofluid pump lower shell
2 is connected with the water-cooling device by a magnetofluid pump
water inlet pipe 1 and a magnetofluid pump water outlet pipe 16.
The magnetofluid pump upper shell 7 is connected with the
magnetofluid pump lower shell 2 by a connecting bolt A 6 and a
connecting bolt B 13. A magnetic field is generated by the magnet S
pole A 9 and the magnet N pole A 10, an electric field is generated
by the positive electrode A 18 and the negative electrode A 19; a
liquid metal is conductive and magnetic, and an upward Lorentz
force will be generated under the co-action of the electric field
and the magnetic field, so that the liquid metal will move upwards.
Similarly, a downward Lorentz force will be generated under the
action of a magnetic field generated by the magnet S pole B 11 and
the magnet N pole B 12 and an electric field generated by the
negative electrode B 39 and the positive electrode B 40, so that
the liquid metal will move downwards.
[0008] An annular groove is formed between the IGBT bottom plate 23
and the magnetofluid pump upper shell 7, an annular seal ring 20 is
arranged in the annular groove and used for sealing, and the IGBT
bottom plate 23 and the magnetofluid pump upper shell 7 are
connected by a connecting bolt C 21 and a connecting bolt D 25. The
magnetofluid pump pipe 3 is connected with the magnetofluid pump
upper shell 7 by threads. The magnetofluid pump water inlet pipe 1
is connected with the magnetofluid pump lower shell 2 by flanges
and fastened by a connecting bolt E 26 and a connecting bolt F 27;
the magnetofluid pump water outlet pipe 16 is connected with the
magnetofluid pump lower shell 2 by flanges and fastened by a
connecting bolt G 28 and a connecting bolt H 29; and connecting
parts of the flanges are all provided with seal rings for end face
sealing.
[0009] The water-cooling device is a piece of water-cooling
equipment 17, which is connected with the magnetofluid pump water
inlet pipe 1 and the magnetofluid pump water outlet pipe 16, and is
used to dissipate heat for the liquid metal in the magnetofluid
pump. Specifically: the magnetofluid pump water outlet pipe 16 is
connected with the water-cooling equipment 17 by flanges, and two
flanges are fastened by a connecting bolt I 30 and a connecting
bolt J 31; the magnetofluid pump water inlet pipe 1 is also
connected with the water-cooling equipment 17 by flanges, and two
flanges are fastened by a connecting bolt K 32 and a connecting
bolt L 33; and the connecting parts of the flanges are all provided
with seal rings for end face sealing.
[0010] The pressure measuring devices are a pressure sensor A 4 and
a pressure sensor B 14, which are arranged on the magnetofluid pump
water inlet pipe 1 and the magnetofluid pump water outlet pipe 16,
and are used to measure the pressure in the magnetofluid pump water
inlet pipe 1 and the magnetofluid pump water outlet pipe 16.
Specifically: the pressure sensor A 4 is connected with a pressure
sensor A base 35 by threads, the pressure sensor A base 35 is
connected with the magnetofluid pump water inlet pipe 1 by threads,
and all connecting parts are provided with seal rings; and the
installation method of the pressure sensor B 14 is the same.
[0011] The temperature measuring devices are a temperature sensor A
5, a temperature sensor B 15 and a thermal imager 36, which are
arranged on the magnetofluid pump water inlet pipe 1, the
magnetofluid pump water outlet pipe 16 and the IGBT chipset, and
are used to measure the temperature of the magnetofluid pump water
inlet pipe 1, the magnetofluid pump water outlet pipe 16 and the
IGBT chipset. Specifically: the temperature sensor A 5 is connected
with a temperature sensor A base 34 by threads, the temperature
sensor A base 34 is connected with the magnetofluid pump water
inlet pipe 1 by threads, and all connecting parts are provided with
seal rings; and the installation method of the temperature sensor B
15 is the same. The thermal imager 36 is 30 cm away from the IGBT
chip A 8, the IGBT chip B 22 and the IGBT chip C 24, and is used to
measure the temperature changes of the chips.
[0012] The data acquisition system is an industrial personal
computer 38, is used to control an external circuit to heat the
IGBT chip A 8, the IGBT chip B 22 and the IGBT chip C 24 to a
certain temperature and acquire the data information of the
pressure sensor A 4, the pressure sensor B 14, the temperature
sensor A 5, the temperature sensor B 15 and the thermal imager 36,
and is electrically connected with each sensor.
[0013] A test method for the magnetofluid pump device for IGBT heat
dissipation, comprising the following steps:
[0014] Step 1: starting the system, turning on the water-cooling
equipment 17, and adjusting appropriate flow and pressure to
dissipate heat for the magnetofluid pump; and acquiring the data
information of the pressure sensor A 4, the pressure sensor B 14,
the temperature sensor A 5 and the temperature sensor B 15 by the
industrial personal computer 38 to monitor the heat dissipation of
the magnetofluid pump in real time. Controlling the external
circuit to heat the IGBT chip A 8, the IGBT chip B 22 and the IGBT
chip C 24, observing the temperature of the chips by the thermal
imager 36, and heating the chips to a certain temperature.
[0015] Step 2: controlling the external circuit by the industrial
personal computer 38 to supply power to the positive electrode A
18, the negative electrode A 19, the negative electrode B 39 and
the positive electrode B 40, and driving the liquid metal to flow
for heat dissipation by the Lorentz forces generated under the
action of the electric fields and the magnetic fields. Controlling
the flow rate of the liquid metal by controlling the voltage of the
two pairs of electrodes. Acquiring the surface temperature of the
IGBT chip A 8, the IGBT chip B 22 and the IGBT chip C 24 by the
thermal imager 36, and uploading the temperature information to the
industrial personal computer 38 for data processing.
[0016] Step 3: analyzing the heat dissipation effect of the
magnetofluid pump device by comparing the temperature changes of
the IGBT chip A 8, the IGBT chip B 22 and the IGBT chip C 24 before
and after heat dissipation. Judging whether a test is completed; if
the test is not completed, continuing to control the external
circuit to heat the IGBT chip A 8, the IGBT chip B 22 and the IGBT
chip C 24 to another temperature or adjusting the voltage of the
electrodes to control the flow rate of the liquid metal. If the
test is completed, stopping and shutting down the system.
[0017] The liquid metal is a GaInSn alloy material, which comprises
68% of Ga, 22% of In and 10% of Sn by mass percentage. The material
has a density of 6400 kg/m.sup.3, an electrical conductivity of
3.46.times.10.sup.6 S/m and a thermal conductivity of 16.5
W/(m.degree. C.), and has better thermal conductivity than
water.
[0018] The technical solution of the present invention has the
following advantages:
[0019] (1) The magnetofluid pump device for IGBT heat dissipation
proposed by the present invention has a better heat dissipation
effect than an ordinary water-cooling device. GaInSn liquid metal
is used as a coolant, which can absorb more heat than water and
better dissipate heat for IGBT chips.
[0020] (2) In the magnetofluid pump device for IGBT heat
dissipation proposed by the present invention, temperature and
pressure changes in the inlet pipe and outlet pipe of the
magnetofluid pump can be monitored in real time by temperature
sensors and pressure sensors, and the heat dissipation effect of
the IGBT chips can be monitored in real time by the thermal
imager.
[0021] (3) The test method for the magnetofluid pump device for
IGBT heat dissipation proposed by the present invention is simple
and easy to implement. The liquid metal can be driven to flow by
energizing the positive and negative electrodes in the magnetofluid
pump under the action of the magnetic fields, and water-cooling
equipment can dissipate heat for the liquid metal in the
magnetofluid pump. The test method proposed by the present
invention can be used to test the heat dissipation effect of a
magnetic fluid at different flow rates on IGBT chips when the IGBT
is at different temperatures.
DESCRIPTION OF DRAWINGS
[0022] FIG. 1 General structural diagram of magnetofluid pump
device;
[0023] FIG. 2 Principle diagram of liquid metal flow;
[0024] FIG. 3 Schematic diagram of connection between magnetofluid
pump upper shell and IGBT bottom plate;
[0025] FIG. 4 Schematic diagram of sealing between magnetofluid
pump upper shell and annular seal ring;
[0026] FIG. 5 Schematic diagram of connection of magnetofluid pump
lower shell with water inlet pipe and water outlet pipe;
[0027] FIG. 6 Schematic diagram of connection of water-cooling
equipment with water inlet pipe and water outlet pipe;
[0028] FIG. 7 Schematic diagram of installation of temperature
sensor and pressure sensor on pipe;
[0029] FIG. 8 Diagram of signal flow direction of magnetofluid pump
device for IGBT heat dissipation; and
[0030] FIG. 9 Flow chart of test method for magnetofluid pump
device for IGBT heat dissipation.
[0031] In the figures: 1 magnetofluid pump water inlet pipe; 2
magnetofluid pump lower shell; 3 magnetofluid pump pipe; 4 pressure
sensor A; 5 temperature sensor A; 6 connecting bolt A; 7
magnetofluid pump upper shell; 8 IGBT chip A; 9 magnet S pole A; 10
magnet N pole A; 11 magnet S pole B; 12 magnet N pole B; 13
connecting bolt B; 14 pressure sensor B; 15 temperature sensor B;
16 magnetofluid pump water outlet pipe; 17 water-cooling equipment;
18 positive electrode A; 19 negative electrode A; 20 annular seal
ring; 21 connecting bolt C; 22 IGBT chip B; 23 IGBT bottom plate;
24 IGBT chip C; 25 connecting bolt D; 26 connecting bolt E; 27
connecting bolt F; 28 connecting bolt G; 29 connecting bolt H; 30
connecting bolt I; 31 connecting bolt J; 32 connecting bolt K; 33
connecting bolt L; 34 temperature sensor A base; 35 pressure sensor
A base; 36 thermal imager; 37 power supply circuit; 38 industrial
personal computer; 39 negative electrode B; and 40 positive
electrode B.
DETAILED DESCRIPTION
[0032] The present invention will be described in detail below in
combination with the drawings.
[0033] General structure of the magnetofluid pump device is shown
in FIG. 1, FIG. 2 and FIG. 3; the IGBT chipset comprises an IGBT
chip A 8, an IGBT chip B 22, an IGBT chip C 24 and an IGBT bottom
plate 23; and the magnetofluid pump comprises a magnetofluid pump
upper shell 7, a magnetofluid pump lower shell 2, a magnetofluid
pump pipe 3, a magnet S pole A 9, a magnet N pole A 10, a magnet S
pole B 11, a magnet N pole B 12, a positive electrode A 18, a
negative electrode A 19, a negative electrode B 39 and a positive
electrode B 40. The IGBT chipset is arranged on the magnetofluid
pump; the magnetofluid pump is connected with a water-cooling
equipment 17 by a magnetofluid pump water inlet pipe 1 and a
magnetofluid pump water outlet pipe 16; and the magnetofluid pump
upper shell 7 is connected with the magnetofluid pump lower shell 2
by a connecting bolt A 6 and a connecting bolt B 13.
[0034] Principle of liquid metal flow is shown in FIG. 2; a
magnetic field is generated by the magnet S pole A 9 and the magnet
N pole A 10, an electric field is generated by the positive
electrode 18 and the negative electrode 19; a Lorentz force will be
generated when the liquid metal is under the co-action of the
electric field and the magnetic field, and the direction of the
Lorentz force is upward according to the left-hand rule, so that
the liquid metal will move upwards. Similarly, a downward Lorentz
force will be generated under the action of a magnetic field
generated by the magnet S pole B 11 and the magnet N pole B 12 and
an electric field generated by the negative electrode B 39 and the
positive electrode B 40, so that the liquid metal will move
downwards.
[0035] Schematic diagram of connection between the magnetofluid
pump upper shell 7 and the IGBT bottom plate 23 is shown in FIG. 3
and FIG. 4; the IGBT chip A 8, the IGBT chip B 22 and the IGBT chip
C 24 are welded on the IGBT bottom plate 23 by tin solder; an
annular groove is formed between the IGBT bottom plate 23 and the
magnetofluid pump upper shell 7, an annular seal ring 20 is
arranged in the annular groove and used for sealing, and the IGBT
bottom plate 23 and the magnetofluid pump upper shell 7 are
connected by a connecting bolt C 21 and a connecting bolt D 25; and
the magnetofluid pump pipe 3 is connected with the magnetofluid
pump upper shell 7 by threads.
[0036] Schematic diagram of connection of the magnetofluid pump
lower shell 2 with the magnetofluid pump water inlet pipe 1 and the
magnetofluid pump water outlet pipe 16 is shown in FIG. 5; the
magnetofluid pump water inlet pipe 1 is connected with the
magnetofluid pump lower shell 2 by flanges and fastened by a
connecting bolt E 26 and a connecting bolt F 27; the magnetofluid
pump water outlet pipe 16 is connected with the magnetofluid pump
lower shell 2 by flanges and fastened by a connecting bolt G 28 and
a connecting bolt H 29; and connecting parts of the flanges are all
provided with seal rings for end face sealing.
[0037] Schematic diagram of connection of the water-cooling
equipment 17 with the magnetofluid pump water inlet pipe 1 and the
magnetofluid pump water outlet pipe 16 is shown in FIG. 6; the
magnetofluid pump water outlet pipe 16 is connected with the
water-cooling equipment 17 by flanges, and two flanges are fastened
and connected by a connecting bolt I 30 and a connecting bolt J 31;
the magnetofluid pump water inlet pipe 1 is also connected with the
water-cooling equipment 17 by flanges, and two flanges are fastened
and connected by a connecting bolt K 32 and a connecting bolt L 33;
and the connecting parts of the flanges are all provided with seal
rings for end face sealing.
[0038] Schematic diagram of connection of a temperature sensor A 5
and a pressure sensor A 4 with the magnetofluid pump water inlet
pipe 1 is shown in FIG. 7; the temperature sensor A 5 is connected
with a temperature sensor A base 34 by threads, and the temperature
sensor Abase 34 is connected with the magnetofluid pump water inlet
pipe 1 by threads; the pressure sensor A 4 is connected with a
pressure sensor A base 35 by threads, the pressure sensor A base 35
is connected with the magnetofluid pump water inlet pipe 1 by
threads, and all connecting parts are provided with seal rings; and
the installation method of a pressure sensor B 14 and a temperature
sensor B 15 is the same.
[0039] Signal flow direction of the magnetofluid pump device for
IGBT heat dissipation is shown in FIG. 8; power is supplied by a
power supply circuit to the IGBT chip A 8, the IGBT chip B 22, the
IGBT chip C 24, the temperature sensor A 5, the temperature sensor
B 15, the pressure sensor A 4 and the pressure sensor B 14; the
temperature information of the IGBT chip A 8, the IGBT chip B 22
and the IGBT chip C 24 is acquired by a thermal imager 36 and sent
to an industrial personal computer 38; and the data information of
the temperature sensor A 5, the temperature sensor B 15, the
pressure sensor A 4 and the pressure sensor B 14 is directly sent
to the industrial personal computer 38 for processing.
[0040] Flow chart of the test method for the magnetofluid pump
device for IGBT heat dissipation is shown in FIG. 9; first, the
system is started, the water-cooling equipment 17 is turned on, the
pressure is adjusted to 0.1 MPa, and the flow is adjusted to 0.5
m.sup.3/min; and the data information of the pressure sensor A 4,
the pressure sensor B 14, the temperature sensor A 5 and the
temperature sensor B 15 is acquired by the industrial personal
computer 38. An external circuit is controlled to heat the IGBT
chip A 8, the IGBT chip B 22 and the IGBT chip C 24 to 80.degree.
C., and the heating temperature is fed back by the thermal imager
36. The external circuit is controlled by the industrial personal
computer 38 to adjust the voltage of the positive electrode 18, the
negative electrode 19, the negative electrode 39 and the positive
electrode 40 to 12 V, and the liquid metal is driven to flow for
heat dissipation. The surface temperature of the IGBT chip A 8, the
IGBT chip B 22 and the IGBT chip C 24 is acquired by the thermal
imager 36, and uploaded to the industrial personal computer 38 for
processing. The heat dissipation effect of the magnetofluid pump
device is analyzed by comparing the temperature changes of the IGBT
chip A 8, the IGBT chip B 22 and the IGBT chip C 24 before and
after heat dissipation. Whether a test is completed is judged; if
the test is not completed, the external circuit is continued to be
controlled to heat the IGBT chip A 8, the IGBT chip B 22 and the
IGBT chip C 24 to 100.degree. C., or the voltage of the electrodes
is adjusted to 24 V to change the flow rate of the liquid metal and
continue the test. If the test is completed, the system is stopped
and shut down.
[0041] This description is merely the enumeration of the
implementation forms of the inventive concept. The protection scope
of the present invention shall not be limited to the specific forms
described in the embodiments, but shall also involve the equivalent
technical means that can be contemplated by those skilled in the
art according to the inventive concept.
* * * * *