U.S. patent application number 16/793078 was filed with the patent office on 2021-08-19 for sensitivity region of interest processing (roip) for input/output (i/o) operative touch sensor device (tsd).
This patent application is currently assigned to SigmaSense, LLC.. The applicant listed for this patent is SigmaSense, LLC.. Invention is credited to Kevin Joseph Derichs, Patrick Troy Gray, Timothy W. Markison, Gerald Dale Morrison, Richard Stuart Seger, JR., Shayne X. Short, Daniel Keith Van Ostrand.
Application Number | 20210255735 16/793078 |
Document ID | / |
Family ID | 1000005750136 |
Filed Date | 2021-08-19 |
United States Patent
Application |
20210255735 |
Kind Code |
A1 |
Gray; Patrick Troy ; et
al. |
August 19, 2021 |
Sensitivity Region of Interest Processing (ROIP) for Input/Output
(I/O) Operative Touch Sensor Device (TSD)
Abstract
A touch sensor device (TSD) includes TSD electrodes associated
with a surface of the TSD. Also, an overlay that includes marker
electrode(s) is also associated with a region of the surface of the
TSD. The TSD also includes drive-sense circuits (DSCs) operably
coupled to the plurality of TSD electrodes. A DSC is configured to
provide a TSD electrode signal to a TSD electrode and
simultaneously to sense a change of the TSD electrode signal based
on a change of impedance of the TSD electrode caused by capacitive
coupling between the TSD electrode and the marker electrode(s) of
the overlay. Processing module(s) is configured to process a
digital signal generated by the DSC and other digital signals
generated by other DSCs determine the region of the surface of the
TSD that is associated with the overlay and to adapt sensitivity of
the TSD within that region.
Inventors: |
Gray; Patrick Troy; (Cedar
Park, TX) ; Morrison; Gerald Dale; (Redmond, WA)
; Van Ostrand; Daniel Keith; (Leander, TX) ;
Seger, JR.; Richard Stuart; (Belton, TX) ; Derichs;
Kevin Joseph; (Buda, TX) ; Short; Shayne X.;
(Austin, TX) ; Markison; Timothy W.; (Mesa,
AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SigmaSense, LLC. |
Wilmington |
DE |
US |
|
|
Assignee: |
SigmaSense, LLC.
Wilmington
DE
|
Family ID: |
1000005750136 |
Appl. No.: |
16/793078 |
Filed: |
February 18, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F 3/0445 20190501;
G06F 3/016 20130101 |
International
Class: |
G06F 3/044 20060101
G06F003/044; G06F 3/01 20060101 G06F003/01 |
Claims
1. A touch sensor device (TSD) comprising: a plurality of TSD
electrodes associated with a surface of the TSD, wherein an overlay
that includes one or more marker electrodes also being associated
with a region of the surface of the TSD; a plurality of drive-sense
circuits (DSCs) operably coupled to the plurality of TSD
electrodes, wherein a DSC of the plurality of DSCs is operably
coupled to receive a reference signal and to generate a TSD
electrode signal based on the reference signal, wherein, when
enabled, the DSC operably coupled and configured to: provide the
TSD electrode signal to a TSD electrode of the plurality of TSD
electrodes and simultaneously to sense a change of the TSD
electrode signal based on a change of impedance of the TSD
electrode caused by capacitive coupling between the TSD electrode
and the one or more marker electrodes based on the overlay being
associated with the at least a portion of the surface of the TSD;
and generate a digital signal that is representative of the change
of impedance of the TSD electrode; memory that stores operational
instructions; and one or more processing modules operably coupled
to the plurality of DSCs and the memory, wherein, when enabled, the
one or more processing modules is configured to execute the
operational instructions to: generate the reference signal; process
the digital signal generated by the DSC of the plurality of DSCs
and a plurality of other digital signals generated by other DSCs of
the plurality of DSCs to determine the region of the surface of the
TSD that is associated with the overlay; and adapt sensitivity of
the TSD within the region of the surface of the TSD that is
associated with the overlay including to change a number
operational electrodes of the plurality of TSD electrodes that are
implemented to service the region of the surface of the TSD that is
associated with the overlay in accordance with detecting user
interaction with the overlay.
2. The TSD of claim 1, wherein, when enabled, the one or more
processing modules is configured to execute the operational
instructions to adapt the sensitivity of the TSD within the region
of the surface of the TSD that is associated with the overlay
including to operate fewer than all of a subset of the plurality of
TSD electrodes that are implemented to service the region of the
surface of the TSD that is associated with the overlay in
accordance with detecting user interaction with the overlay.
3. The TSD of claim 1, wherein, when enabled, the one or more
processing modules is configured to execute the operational
instructions to adapt the sensitivity of the TSD within the region
of the surface of the TSD that is associated with the overlay
including to increase the number operational electrodes of the
plurality of TSD electrodes that are implemented to service the
region of the surface of the TSD that is associated with the
overlay in accordance with detecting user interaction with the
overlay.
4. The TSD of claim 1, wherein, when enabled, the one or more
processing modules is configured to execute the operational
instructions to process the digital signal generated by the DSC of
the plurality of DSCs to determine one or more characteristics of
the overlay that is associated with the region of the surface of
the TSD.
5. The TSD of claim 4, wherein the one or more characteristics of
the overlay includes one or more of: an outline of the overlay;
locations of keys of the overlay; a location of the overlay on the
surface of the TSD; location of the one or more marker electrodes
within the at least a portion of the surface of the TSD; a pattern
of the one or more marker electrodes; a function of the overlay; a
type of the overlay; or an orientation of the overlay.
6. The TSD of claim 1, wherein the TSD is a portable device that
includes an internal power source.
7. The TSD of claim 1, wherein the plurality of TSD electrodes
includes a first subset of the plurality of TSD electrodes aligned
in a first direction and a second subset of the plurality of TSD
electrodes that are separated from the first subset of the
plurality of TSD electrodes by a dielectric material and are
aligned in a second direction.
8. The TSD of claim 1, wherein: the TSD includes multiple sections;
the TSD has a first shape when the multiple sections are
implemented within a first configuration; and the TSD has a second
shape when the multiple sections are implemented within a second
configuration.
9. The TSD of claim 1, wherein the surface of the TSD includes at
least one of a non-flat surface or curved surface.
10. The TSD of claim 1, wherein the DSC of the plurality of DSCs
further comprises: a power source circuit operably coupled via a
single line to the TSD electrode, wherein, when enabled, the power
source circuit is configured to provide an analog signal via the
single line coupling to the TSD electrode, and wherein the analog
signal includes at least one of a DC (direct current) component or
an oscillating component; and a power source change detection
circuit operably coupled to the power source circuit, wherein, when
enabled, the power source change detection circuit is configured
to: detect an effect on the analog signal that is based on an
electrical characteristic of the TSD electrode; and generate the
digital signal that is representative of the change of impedance of
the TSD electrode.
11. The TSD of claim 10 further comprising: the power source
circuit including a power source to source at least one of a
voltage or a current via the single line to the TSD electrode; and
the power source change detection circuit including: a power source
reference circuit configured to provide at least one of a voltage
reference or a current reference; and a comparator configured to
compare the at least one of the voltage and the current provided
via the single line to the TSD electrode to the at least one of the
voltage reference and the current reference to produce the analog
signal.
12. A touch sensor device (TSD) comprising: a plurality of TSD
electrodes associated with a surface of the TSD, wherein an overlay
that includes one or more marker electrodes also being associated
with a region of the surface of the TSD, wherein the plurality of
TSD electrodes includes a first subset of the plurality of TSD
electrodes aligned in a first direction and a second subset of the
plurality of TSD electrodes that are separated from the first
subset of the plurality of TSD electrodes by a dielectric material
and are aligned in a second direction; a plurality of drive-sense
circuits (DSCs) operably coupled to the plurality of TSD
electrodes, wherein a DSC of the plurality of DSCs is operably
coupled to receive a reference signal and to generate a TSD
electrode signal based on the reference signal, wherein, when
enabled, the DSC operably coupled and configured to: provide the
TSD electrode signal to a TSD electrode of the plurality of TSD
electrodes and simultaneously to sense a change of the TSD
electrode signal based on a change of impedance of the TSD
electrode caused by capacitive coupling between the TSD electrode
and the one or more marker electrodes based on the overlay being
associated with the at least a portion of the surface of the TSD;
and generate a digital signal that is representative of the change
of impedance of the TSD electrode; memory that stores operational
instructions; and one or more processing modules operably coupled
to the plurality of DSCs and the memory, wherein, when enabled, the
one or more processing modules is configured to execute the
operational instructions to: generate the reference signal; process
the digital signal generated by the DSC of the plurality of DSCs
and a plurality of other digital signals generated by other DSCs of
the plurality of DSCs to determine the region of the surface of the
TSD that is associated with the overlay to determine one or more
characteristics of the overlay that is associated with the region
of the surface of the TSD; and adapt sensitivity of the TSD within
the region of the surface of the TSD that is associated with the
overlay including to change a number operational electrodes of the
plurality of TSD electrodes that are implemented to service the
region of the surface of the TSD that is associated with the
overlay in accordance with detecting user interaction with the
overlay.
13. The TSD of claim 12, wherein, when enabled, the one or more
processing modules is configured to execute the operational
instructions to adapt the sensitivity of the TSD within the region
of the surface of the TSD that is associated with the overlay
including to operate fewer than all of another subset of the
plurality of TSD electrodes that are implemented to service the
region of the surface of the TSD that is associated with the
overlay in accordance with detecting user interaction with the
overlay.
14. The TSD of claim 12, wherein, when enabled, the one or more
processing modules is configured to execute the operational
instructions to adapt the sensitivity of the TSD within the region
of the surface of the TSD that is associated with the overlay
including to increase the number operational electrodes of the
plurality of TSD electrodes that are implemented to service the
region of the surface of the TSD that is associated with the
overlay in accordance with detecting user interaction with the
overlay.
15. The TSD of claim 12, wherein the one or more characteristics of
the overlay includes one or more of: an outline of the overlay;
locations of keys of the overlay; a location of the overlay on the
surface of the TSD; location of the one or more marker electrodes
within the at least a portion of the surface of the TSD; a pattern
of the one or more marker electrodes; a function of the overlay; a
type of the overlay; or an orientation of the overlay.
16. The TSD of claim 12, wherein the TSD is a portable device that
includes an internal power source.
17. The TSD of claim 12, wherein: the TSD includes multiple
sections; the TSD has a first shape when the multiple sections are
implemented within a first configuration; and the TSD has a second
shape when the multiple sections are implemented within a second
configuration.
18. The TSD of claim 12, wherein the surface of the TSD includes at
least one of a non-flat surface or curved surface.
19. The TSD of claim 12, wherein the DSC of the plurality of DSCs
further comprises: a power source circuit operably coupled via a
single line to the TSD electrode, wherein, when enabled, the power
source circuit is configured to provide an analog signal via the
single line coupling to the TSD electrode, and wherein the analog
signal includes at least one of a DC (direct current) component or
an oscillating component; and a power source change detection
circuit operably coupled to the power source circuit, wherein, when
enabled, the power source change detection circuit is configured
to: detect an effect on the analog signal that is based on an
electrical characteristic of the TSD electrode; and generate the
digital signal that is representative of the change of impedance of
the TSD electrode.
20. The TSD of claim 19 further comprising: the power source
circuit including a power source to source at least one of a
voltage or a current via the single line to the TSD electrode; and
the power source change detection circuit including: a power source
reference circuit configured to provide at least one of a voltage
reference or a current reference; and a comparator configured to
compare the at least one of the voltage and the current provided
via the single line to the TSD electrode to the at least one of the
voltage reference and the current reference to produce the analog
signal.
Description
CROSS REFERENCE TO RELATED PATENTS/PATENT APPLICATIONS
Incorporation by Reference
[0001] The U.S. Utility application Ser. No. 16/793,043, entitled
"Input/Output (I/O) Operative Touch Sensor Device (TSD)," filed
concurrently on Feb. 20, 2020, pending, is hereby incorporated
herein by reference in its entirety and made part of the present
U.S. Utility patent application for all purposes.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0002] Not Applicable.
INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT
DISC
[0003] Not Applicable.
BACKGROUND OF THE INVENTION
Technical Field of the Invention
[0004] This invention relates generally to data communication
systems and more particularly to sensed data collection and/or
communication.
Description of Related Art
[0005] Sensors are used in a wide variety of applications ranging
from in-home automation, to industrial systems, to health care, to
transportation, and so on. For example, sensors are placed in
bodies, automobiles, airplanes, boats, ships, trucks, motorcycles,
cell phones, televisions, touch-screens, industrial plants,
appliances, motors, checkout counters, etc. for the variety of
applications.
[0006] In general, a sensor converts a physical quantity into an
electrical or optical signal. For example, a sensor converts a
physical phenomenon, such as a biological condition, a chemical
condition, an electric condition, an electromagnetic condition, a
temperature, a magnetic condition, mechanical motion (position,
velocity, acceleration, force, pressure), an optical condition,
and/or a radioactivity condition, into an electrical signal.
[0007] A sensor includes a transducer, which functions to convert
one form of energy (e.g., force) into another form of energy (e.g.,
electrical signal). There are a variety of transducers to support
the various applications of sensors. For example, a transducer is
capacitor, a piezoelectric transducer, a piezoresistive transducer,
a thermal transducer, a thermal-couple, a photoconductive
transducer such as a photoresistor, a photodiode, and/or
phototransistor.
[0008] A sensor circuit is coupled to a sensor to provide the
sensor with power and to receive the signal representing the
physical phenomenon from the sensor. The sensor circuit includes at
least three electrical connections to the sensor: one for a power
supply; another for a common voltage reference (e.g., ground); and
a third for receiving the signal representing the physical
phenomenon. The signal representing the physical phenomenon will
vary from the power supply voltage to ground as the physical
phenomenon changes from one extreme to another (for the range of
sensing the physical phenomenon).
[0009] The sensor circuits provide the received sensor signals to
one or more computing devices for processing. A computing device is
known to communicate data, process data, and/or store data. The
computing device may be a cellular phone, a laptop, a tablet, a
personal computer (PC), a work station, a video game device, a
server, and/or a data center that support millions of web searches,
stock trades, or on-line purchases every hour.
[0010] The computing device processes the sensor signals for a
variety of applications. For example, the computing device
processes sensor signals to determine temperatures of a variety of
items in a refrigerated truck during transit. As another example,
the computing device processes the sensor signals to determine a
touch on a touchscreen. As yet another example, the computing
device processes the sensor signals to determine various data
points in a production line of a product.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)
[0011] FIG. 1 is a schematic block diagram of an embodiment of a
communication system in accordance with the present invention;
[0012] FIG. 2 is a schematic block diagram of an embodiment of a
computing device in accordance with the present invention;
[0013] FIG. 3 is a schematic block diagram of another embodiment of
a computing device in accordance with the present invention;
[0014] FIG. 4 is a schematic block diagram of another embodiment of
a computing device in accordance with the present invention;
[0015] FIG. 5A is a schematic plot diagram of a computing subsystem
in accordance with the present invention;
[0016] FIG. 5B is a schematic block diagram of another embodiment
of a computing subsystem in accordance with the present
invention;
[0017] FIG. 5C is a schematic block diagram of another embodiment
of a computing subsystem in accordance with the present
invention;
[0018] FIG. 5D is a schematic block diagram of another embodiment
of a computing subsystem in accordance with the present
invention;
[0019] FIG. 5E is a schematic block diagram of another embodiment
of a computing subsystem in accordance with the present
invention;
[0020] FIG. 6 is a schematic block diagram of a drive center
circuit in accordance with the present invention;
[0021] FIG. 6A is a schematic block diagram of another embodiment
of a drive sense circuit in accordance with the present
invention;
[0022] FIG. 7 is an example of a power signal graph in accordance
with the present invention;
[0023] FIG. 8 is an example of a sensor graph in accordance with
the present invention;
[0024] FIG. 9 is a schematic block diagram of another example of a
power signal graph in accordance with the present invention;
[0025] FIG. 10 is a schematic block diagram of another example of a
power signal graph in accordance with the present invention;
[0026] FIG. 11 is a schematic block diagram of another example of a
power signal graph in accordance with the present invention;
[0027] FIG. 11A is a schematic block diagram of another example of
a power signal graph in accordance with the present invention;
[0028] FIG. 12 is a schematic block diagram of an embodiment of a
power signal change detection circuit in accordance with the
present invention;
[0029] FIG. 13 is a schematic block diagram of another embodiment
of a drive-sense circuit in accordance with the present
invention;
[0030] FIG. 14 is a schematic block diagram of an embodiment of a
touch sensor device (TSD) in accordance with the present
invention;
[0031] FIG. 15 is a schematic block diagram of another embodiment
of a touch sensor device (TSD) in accordance with the present
invention;
[0032] FIG. 16 is a schematic block diagram of various embodiments
of electrode patterns that may be used on a touch sensor device
(TSD) in accordance with the present invention;
[0033] FIG. 17 is a schematic block diagram of another embodiment
of a touch sensor device (TSD) that is similar to FIG. 15 with the
option of using any desired electrode pattern in accordance with
the present invention;
[0034] FIG. 18 is a schematic block diagram of another embodiment
of a touch sensor device (TSD) in accordance with the present
invention;
[0035] FIG. 19 is a schematic block diagram of an embodiment of a
touch sensor device (TSD) in accordance with the present
invention;
[0036] FIG. 20 is a schematic block diagram of another embodiment
of a touch sensor device (TSD) in accordance with the present
invention;
[0037] FIG. 21 is a schematic block diagram of another embodiment
of a touch sensor device (TSD) in accordance with the present
invention;
[0038] FIG. 22 is a schematic block diagram of another embodiment
of multiple touch sensor devices (TSDs) in accordance with the
present invention;
[0039] FIG. 23A is a logic diagram of an embodiment of a method for
sensing a touch on a touch sensor device (TSD)(with or without
display functionality) in accordance with the present
invention;
[0040] FIG. 23B is a schematic block diagram of an embodiment of a
drive sense circuit in accordance with the present invention;
[0041] FIG. 24 is a schematic block diagram of another embodiment
of a drive sense circuit in accordance with the present
invention;
[0042] FIG. 25 is a schematic block diagram of an embodiment of a
DSC that is interactive with an electrode in accordance with the
present invention;
[0043] FIG. 26 is a schematic block diagram of another embodiment
of a DSC that is interactive with an electrode in accordance with
the present invention;
[0044] FIG. 27 is a schematic block diagram of various embodiments
of touch sensor devices (TSDs), which may or may not include
display functionality via a touchscreen display, an liquid crystal
display (LCD) operable display, a light emitting diode (LED)
operable display, and/or other visual output component, in
accordance with the present invention.
[0045] FIG. 28A is a schematic block diagram of other various
embodiments of TSDs which may or may not include display
functionality via a touchscreen display, an liquid crystal display
(LCD) operable display, a light emitting diode (LED) operable
display, and/or other visual output component, as well as 3-D
geometric objects, which may or may not include TSD functionality,
in accordance with the present invention;
[0046] FIG. 28B is a schematic block diagram of other various
embodiments of TSDs which may or may not include display
functionality via a touchscreen display, an liquid crystal display
(LCD) operable display, a light emitting diode (LED) operable
display, and/or other visual output component in accordance with
the present invention;
[0047] FIG. 29 is a schematic block diagram of various embodiments
of a 3-D geometric objects, which may or may not include TSD
functionality, that is operative with a TSD in accordance with the
present invention;
[0048] FIG. 30 is a schematic block diagram of an embodiment of an
overlay that is operative with a TSD in accordance with the present
invention;
[0049] FIG. 31 is a schematic block diagram of another embodiment
of an overlay that is operative with a TSD in accordance with the
present invention;
[0050] FIG. 32 is a schematic block diagram of an embodiment of an
overlay and a 3-D geometric object, which may or may not include
TSD functionality, that are both operative with a TSD in accordance
with the present invention;
[0051] FIG. 33 is a schematic block diagram of various embodiments
of overlays including marker electrodes that facilitate
identification, location determination, and mapping of the overlays
by a TSD in accordance with the present invention;
[0052] FIG. 34 is a schematic block diagram of various embodiments
of 3-D geometric objects, which may or may not include TSD
functionality, including marker electrodes that facilitate
identification, location determination, and mapping of the overlays
by a TSD in accordance with the present invention;
[0053] FIG. 35A is a schematic block diagram of other various
embodiments of overlays including marker electrodes that facilitate
identification, location determination, and mapping of the overlays
by a TSD in accordance with the present invention;
[0054] FIG. 35B is a schematic block diagram of other various
embodiments of overlays including marker electrodes that facilitate
identification, location determination, and mapping of the overlays
by a TSD in accordance with the present invention;
[0055] FIG. 36 is a schematic block diagram of various embodiments
of TSDs including communication functionality, power sourcing,
and/or controller functionality in accordance with the present
invention;
[0056] FIG. 37A is a schematic block diagram of an embodiment of a
communication system including a TSD in accordance with the present
invention;
[0057] FIG. 37B is a schematic block diagram of another embodiment
of a communication system including a TSD in accordance with the
present invention;
[0058] FIG. 38 is a schematic block diagram of another embodiment
of a communication system including a TSD in accordance with the
present invention;
[0059] FIG. 39A is a schematic block diagram of another embodiment
of a communication system including a TSD in accordance with the
present invention;
[0060] FIG. 39B is a schematic block diagram of another embodiment
of a communication system including a TSD in accordance with the
present invention;
[0061] FIG. 40 is a schematic block diagram of various embodiments
of TSDs that are configurable in accordance with the present
invention;
[0062] FIG. 41 is a schematic block diagram of various embodiments
of TSDs that are configurable and operative with TSDs in accordance
with the present invention;
[0063] FIG. 42 is a schematic block diagram of other various
embodiments of 3-D geometric objects or TSDs that are configurable
and operative with TSDs in accordance with the present
invention
[0064] FIG. 43A is a schematic block diagram of other various
embodiments of 3-D geometric objects or TSDs that are configurable
and operative with TSDs in accordance with the present
invention;
[0065] FIG. 43B is a schematic block diagram of other various
embodiments of 3-D geometric objects or TSDs that are configurable
and operative with TSDs in accordance with the present
invention;
[0066] FIG. 44 is a schematic block diagram of other various
embodiments of 3-D geometric objects or TSDs that are configurable
and operative with TSDs in accordance with the present
invention;
[0067] FIG. 45 is a schematic block diagram of an embodiment of an
overlay that is operative with a TSD that is configured to perform
sensitivity based region of interest processing (ROIP) in
accordance with the present invention;
[0068] FIG. 46 is a schematic block diagram of another embodiment
of an overlay that is operative with a TSD that is configured to
perform sensitivity based ROIP in accordance with the present
invention;
[0069] FIG. 47 is a schematic block diagram of an embodiment of an
overlay and a 3-D geometric object, which may or may not include
TSD functionality, that are both operative with a TSD that is
configured to perform sensitivity based ROIP in accordance with the
present invention;
[0070] FIG. 48 is a schematic block diagram of an embodiment of an
overlay that is operative with a TSD that is configured to perform
enable/disable based ROIP in accordance with the present
invention;
[0071] FIG. 49 is a schematic block diagram of another embodiment
of an overlay that is operative with a TSD that is configured to
perform enable/disable based ROIP in accordance with the present
invention;
[0072] FIG. 50 is a schematic block diagram of an embodiment of an
overlay and a 3-D geometric object, which may or may not include
TSD functionality, that are both operative with a TSD that is
configured to perform enable/disable based ROIP in accordance with
the present invention;
[0073] FIG. 51 is a schematic block diagram of another embodiment
of an overlay and a 3-D geometric object, which may or may not
include TSD functionality, that are both operative with a TSD that
is configured to perform enable/disable based ROIP in accordance
with the present invention;
[0074] FIG. 52 is a schematic block diagram of various embodiments
of TSDs that are configured to interface with one or more other TSD
and/or one or more other devices that include one or more
electrodes in accordance with the present invention;
[0075] FIG. 53A is a schematic block diagram of an embodiment of
TSDs that are interfaced in accordance with the present
invention;
[0076] FIG. 53B is a schematic block diagram of an embodiment of
TSDs that are interfaced in accordance with the present
invention;
[0077] FIG. 54A is a schematic block diagram of another embodiment
of TSDs that are interfaced in accordance with the present
invention;
[0078] FIG. 54B is a schematic block diagram of another embodiment
of TSDs that are interfaced in accordance with the present
invention;
[0079] FIG. 55 is a schematic block diagram of various embodiments
of TSDs that are interfaced in accordance with the present
invention;
[0080] FIG. 56 is a schematic block diagram of other various
embodiments of TSDs that are configured to interface with one or
more other TSD and/or one or more other devices that include one or
more electrodes in accordance with the present invention; and
[0081] FIG. 57 is a schematic block diagram of various embodiments
of TSDs and/or one or more other devices that include one or more
electrodes that are interfaced in accordance with the present
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0082] FIG. 1 is a schematic block diagram of an embodiment of a
communication system 10 that includes a plurality of computing
devices 12-10, one or more servers 22, one or more databases 24,
one or more networks 26, a plurality of drive-sense circuits 28, a
plurality of sensors 30, and a plurality of actuators 32. Computing
devices 14 include a touchscreen 16 with sensors and drive-sensor
circuits and computing devices 18 include a touch & tactic
screen 20 that includes sensors, actuators, and drive-sense
circuits.
[0083] A sensor 30 functions to convert a physical input into an
electrical output and/or an optical output. The physical input of a
sensor may be one of a variety of physical input conditions. For
example, the physical condition includes one or more of, but is not
limited to, acoustic waves (e.g., amplitude, phase, polarization,
spectrum, and/or wave velocity); a biological and/or chemical
condition (e.g., fluid concentration, level, composition, etc.); an
electric condition (e.g., charge, voltage, current, conductivity,
permittivity, eclectic field, which includes amplitude, phase,
and/or polarization); a magnetic condition (e.g., flux,
permeability, magnetic field, which amplitude, phase, and/or
polarization); an optical condition (e.g., refractive index,
reflectivity, absorption, etc.); a thermal condition (e.g.,
temperature, flux, specific heat, thermal conductivity, etc.); and
a mechanical condition (e.g., position, velocity, acceleration,
force, strain, stress, pressure, torque, etc.). For example,
piezoelectric sensor converts force or pressure into an eclectic
signal. As another example, a microphone converts audible acoustic
waves into electrical signals.
[0084] There are a variety of types of sensors to sense the various
types of physical conditions. Sensor types include, but are not
limited to, capacitor sensors, inductive sensors, accelerometers,
piezoelectric sensors, light sensors, magnetic field sensors,
ultrasonic sensors, temperature sensors, infrared (IR) sensors,
touch sensors, proximity sensors, pressure sensors, level sensors,
smoke sensors, and gas sensors. In many ways, sensors function as
the interface between the physical world and the digital world by
converting real world conditions into digital signals that are then
processed by computing devices for a vast number of applications
including, but not limited to, medical applications, production
automation applications, home environment control, public safety,
and so on.
[0085] The various types of sensors have a variety of sensor
characteristics that are factors in providing power to the sensors,
receiving signals from the sensors, and/or interpreting the signals
from the sensors. The sensor characteristics include resistance,
reactance, power requirements, sensitivity, range, stability,
repeatability, linearity, error, response time, and/or frequency
response. For example, the resistance, reactance, and/or power
requirements are factors in determining drive circuit requirements.
As another example, sensitivity, stability, and/or linear are
factors for interpreting the measure of the physical condition
based on the received electrical and/or optical signal (e.g.,
measure of temperature, pressure, etc.).
[0086] An actuator 32 converts an electrical input into a physical
output. The physical output of an actuator may be one of a variety
of physical output conditions. For example, the physical output
condition includes one or more of, but is not limited to, acoustic
waves (e.g., amplitude, phase, polarization, spectrum, and/or wave
velocity); a magnetic condition (e.g., flux, permeability, magnetic
field, which amplitude, phase, and/or polarization); a thermal
condition (e.g., temperature, flux, specific heat, thermal
conductivity, etc.); and a mechanical condition (e.g., position,
velocity, acceleration, force, strain, stress, pressure, torque,
etc.). As an example, a piezoelectric actuator converts voltage
into force or pressure. As another example, a speaker converts
electrical signals into audible acoustic waves.
[0087] An actuator 32 may be one of a variety of actuators. For
example, an actuator 32 is one of a comb drive, a digital
micro-mirror device, an electric motor, an electroactive polymer, a
hydraulic cylinder, a piezoelectric actuator, a pneumatic actuator,
a screw jack, a servomechanism, a solenoid, a stepper motor, a
shape-memory allow, a thermal bimorph, and a hydraulic
actuator.
[0088] The various types of actuators have a variety of actuators
characteristics that are factors in providing power to the actuator
and sending signals to the actuators for desired performance. The
actuator characteristics include resistance, reactance, power
requirements, sensitivity, range, stability, repeatability,
linearity, error, response time, and/or frequency response. For
example, the resistance, reactance, and power requirements are
factors in determining drive circuit requirements. As another
example, sensitivity, stability, and/or linear are factors for
generating the signaling to send to the actuator to obtain the
desired physical output condition.
[0089] The computing devices 12, 14, and 18 may each be a portable
computing device and/or a fixed computing device. A portable
computing device may be a social networking device, a gaming
device, a cell phone, a smart phone, a digital assistant, a digital
music player, a digital video player, a laptop computer, a handheld
computer, a tablet, a video game controller, and/or any other
portable device that includes a computing core. A fixed computing
device may be a computer (PC), a computer server, a cable set-top
box, a satellite receiver, a television set, a printer, a fax
machine, home entertainment equipment, a video game console, and/or
any type of home or office computing equipment. The computing
devices 12, 14, and 18 will be discussed in greater detail with
reference to one or more of FIGS. 2-4.
[0090] A server 22 is a special type of computing device that is
optimized for processing large amounts of data requests in
parallel. A server 22 includes similar components to that of the
computing devices 12, 14, and/or 18 with more robust processing
modules, more main memory, and/or more hard drive memory (e.g.,
solid state, hard drives, etc.). Further, a server 22 is typically
accessed remotely; as such it does not generally include user input
devices and/or user output devices. In addition, a server may be a
standalone separate computing device and/or may be a cloud
computing device.
[0091] A database 24 is a special type of computing device that is
optimized for large scale data storage and retrieval. A database 24
includes similar components to that of the computing devices 12,
14, and/or 18 with more hard drive memory (e.g., solid state, hard
drives, etc.) and potentially with more processing modules and/or
main memory. Further, a database 24 is typically accessed remotely;
as such it does not generally include user input devices and/or
user output devices. In addition, a database 24 may be a standalone
separate computing device and/or may be a cloud computing
device.
[0092] The network 26 includes one more local area networks (LAN)
and/or one or more wide area networks WAN), which may be a public
network and/or a private network. A LAN may be a wireless-LAN
(e.g., Wi-Fi access point, Bluetooth, ZigBee, etc.) and/or a wired
network (e.g., Firewire, Ethernet, etc.). A WAN may be a wired
and/or wireless WAN. For example, a LAN may be a personal home or
business's wireless network and a WAN is the Internet, cellular
telephone infrastructure, and/or satellite communication
infrastructure.
[0093] In an example of operation, computing device 12-1
communicates with a plurality of drive-sense circuits 28, which, in
turn, communicate with a plurality of sensors 30. The sensors 30
and/or the drive-sense circuits 28 are within the computing device
12-1 and/or external to it. For example, the sensors 30 may be
external to the computing device 12-1 and the drive-sense circuits
are within the computing device 12-1. As another example, both the
sensors 30 and the drive-sense circuits 28 are external to the
computing device 12-1. When the drive-sense circuits 28 are
external to the computing device, they are coupled to the computing
device 12-1 via wired and/or wireless communication links as will
be discussed in greater detail with reference to one or more of
FIGS. 5A-5C.
[0094] The computing device 12-1 communicates with the drive-sense
circuits 28 to; (a) turn them on, (b) obtain data from the sensors
(individually and/or collectively), (c) instruct the drive sense
circuit on how to communicate the sensed data to the computing
device 12-1, (d) provide signaling attributes (e.g., DC level, AC
level, frequency, power level, regulated current signal, regulated
voltage signal, regulation of an impedance, frequency patterns for
various sensors, different frequencies for different sensing
applications, etc.) to use with the sensors, and/or (e) provide
other commands and/or instructions.
[0095] As a specific example, the sensors 30 are distributed along
a pipeline to measure flow rate and/or pressure within a section of
the pipeline. The drive-sense circuits 28 have their own power
source (e.g., battery, power supply, etc.) and are proximally
located to their respective sensors 30. At desired time intervals
(milliseconds, seconds, minutes, hours, etc.), the drive-sense
circuits 28 provide a regulated source signal or a power signal to
the sensors 30. An electrical characteristic of the sensor 30
affects the regulated source signal or power signal, which is
reflective of the condition (e.g., the flow rate and/or the
pressure) that sensor is sensing.
[0096] The drive-sense circuits 28 detect the effects on the
regulated source signal or power signals as a result of the
electrical characteristics of the sensors. The drive-sense circuits
28 then generate signals representative of change to the regulated
source signal or power signal based on the detected effects on the
power signals. The changes to the regulated source signals or power
signals are representative of the conditions being sensed by the
sensors 30.
[0097] The drive-sense circuits 28 provide the representative
signals of the conditions to the computing device 12-1. A
representative signal may be an analog signal or a digital signal.
In either case, the computing device 12-1 interprets the
representative signals to determine the pressure and/or flow rate
at each sensor location along the pipeline. The computing device
may then provide this information to the server 22, the database
24, and/or to another computing device for storing and/or further
processing.
[0098] As another example of operation, computing device 12-2 is
coupled to a drive-sense circuit 28, which is, in turn, coupled to
a senor 30. The sensor 30 and/or the drive-sense circuit 28 may be
internal and/or external to the computing device 12-2. In this
example, the sensor 30 is sensing a condition that is particular to
the computing device 12-2. For example, the sensor 30 may be a
temperature sensor, an ambient light sensor, an ambient noise
sensor, etc. As described above, when instructed by the computing
device 12-2 (which may be a default setting for continuous sensing
or at regular intervals), the drive-sense circuit 28 provides the
regulated source signal or power signal to the sensor 30 and
detects an effect to the regulated source signal or power signal
based on an electrical characteristic of the sensor. The
drive-sense circuit generates a representative signal of the affect
and sends it to the computing device 12-2.
[0099] In another example of operation, computing device 12-3 is
coupled to a plurality of drive-sense circuits 28 that are coupled
to a plurality of sensors 30 and is coupled to a plurality of
drive-sense circuits 28 that are coupled to a plurality of
actuators 32. The generally functionality of the drive-sense
circuits 28 coupled to the sensors 30 in accordance with the above
description.
[0100] Since an actuator 32 is essentially an inverse of a sensor
in that an actuator converts an electrical signal into a physical
condition, while a sensor converts a physical condition into an
electrical signal, the drive-sense circuits 28 can be used to power
actuators 32. Thus, in this example, the computing device 12-3
provides actuation signals to the drive-sense circuits 28 for the
actuators 32. The drive-sense circuits modulate the actuation
signals on to power signals or regulated control signals, which are
provided to the actuators 32. The actuators 32 are powered from the
power signals or regulated control signals and produce the desired
physical condition from the modulated actuation signals.
[0101] As another example of operation, computing device 12-x is
coupled to a drive-sense circuit 28 that is coupled to a sensor 30
and is coupled to a drive-sense circuit 28 that is coupled to an
actuator 32. In this example, the sensor 30 and the actuator 32 are
for use by the computing device 12-x. For example, the sensor 30
may be a piezoelectric microphone and the actuator 32 may be a
piezoelectric speaker.
[0102] FIG. 2 is a schematic block diagram of an embodiment of a
computing device 12 (e.g., any one of 12-1 through 12-x). The
computing device 12 includes a core control module 40, one or more
processing modules 42, one or more main memories 44, cache memory
46, a video graphics processing module 48, a display 50, an
Input-Output (I/O) peripheral control module 52, one or more input
interface modules 56, one or more output interface modules 58, one
or more network interface modules 60, and one or more memory
interface modules 62. A processing module 42 is described in
greater detail at the end of the detailed description of the
invention section and, in an alternative embodiment, has a
direction connection to the main memory 44. In an alternate
embodiment, the core control module 40 and the I/O and/or
peripheral control module 52 are one module, such as a chipset, a
quick path interconnect (QPI), and/or an ultra-path interconnect
(UPI).
[0103] Each of the main memories 44 includes one or more Random
Access Memory (RAM) integrated circuits, or chips. For example, a
main memory 44 includes four DDR4 (4.sup.th generation of double
data rate) RAM chips, each running at a rate of 2,400 MHz. In
general, the main memory 44 stores data and operational
instructions most relevant for the processing module 42. For
example, the core control module 40 coordinates the transfer of
data and/or operational instructions from the main memory 44 and
the memory 64-66. The data and/or operational instructions retrieve
from memory 64-66 are the data and/or operational instructions
requested by the processing module or will most likely be needed by
the processing module. When the processing module is done with the
data and/or operational instructions in main memory, the core
control module 40 coordinates sending updated data to the memory
64-66 for storage.
[0104] The memory 64-66 includes one or more hard drives, one or
more solid state memory chips, and/or one or more other large
capacity storage devices that, in comparison to cache memory and
main memory devices, is/are relatively inexpensive with respect to
cost per amount of data stored. The memory 64-66 is coupled to the
core control module 40 via the I/O and/or peripheral control module
52 and via one or more memory interface modules 62. In an
embodiment, the I/O and/or peripheral control module 52 includes
one or more Peripheral Component Interface (PCI) buses to which
peripheral components connect to the core control module 40. A
memory interface module 62 includes a software driver and a
hardware connector for coupling a memory device to the I/O and/or
peripheral control module 52. For example, a memory interface 62 is
in accordance with a Serial Advanced Technology Attachment (SATA)
port.
[0105] The core control module 40 coordinates data communications
between the processing module(s) 42 and the network(s) 26 via the
I/O and/or peripheral control module 52, the network interface
module(s) 60, and a network card 68 or 70. A network card 68 or 70
includes a wireless communication unit or a wired communication
unit. A wireless communication unit includes a wireless local area
network (WLAN) communication device, a cellular communication
device, a Bluetooth device, and/or a ZigBee communication device. A
wired communication unit includes a Gigabit LAN connection, a
Firewire connection, and/or a proprietary computer wired
connection. A network interface module 60 includes a software
driver and a hardware connector for coupling the network card to
the I/O and/or peripheral control module 52. For example, the
network interface module 60 is in accordance with one or more
versions of IEEE 802.11, cellular telephone protocols, 10/100/1000
Gigabit LAN protocols, etc.
[0106] The core control module 40 coordinates data communications
between the processing module(s) 42 and input device(s) 72 via the
input interface module(s) 56 and the I/O and/or peripheral control
module 52. An input device 72 includes a keypad, a keyboard,
control switches, a touchpad, a microphone, a camera, etc. An input
interface module 56 includes a software driver and a hardware
connector for coupling an input device to the I/O and/or peripheral
control module 52. In an embodiment, an input interface module 56
is in accordance with one or more Universal Serial Bus (USB)
protocols.
[0107] The core control module 40 coordinates data communications
between the processing module(s) 42 and output device(s) 74 via the
output interface module(s) 58 and the I/O and/or peripheral control
module 52. An output device 74 includes a speaker, etc. An output
interface module 58 includes a software driver and a hardware
connector for coupling an output device to the I/O and/or
peripheral control module 52. In an embodiment, an output interface
module 56 is in accordance with one or more audio codec
protocols.
[0108] The processing module 42 communicates directly with a video
graphics processing module 48 to display data on the display 50.
The display 50 includes an LED (light emitting diode) display, an
LCD (liquid crystal display), and/or other type of display
technology. The display has a resolution, an aspect ratio, and
other features that affect the quality of the display. The video
graphics processing module 48 receives data from the processing
module 42, processes the data to produce rendered data in
accordance with the characteristics of the display, and provides
the rendered data to the display 50.
[0109] FIG. 2 further illustrates sensors 30 and actuators 32
coupled to drive-sense circuits 28, which are coupled to the input
interface module 56 (e.g., USB port). Alternatively, one or more of
the drive-sense circuits 28 is coupled to the computing device via
a wireless network card (e.g., WLAN) or a wired network card (e.g.,
Gigabit LAN). While not shown, the computing device 12 further
includes a BIOS (Basic Input Output System) memory coupled to the
core control module 40.
[0110] FIG. 3 is a schematic block diagram of another embodiment of
a computing device 14 that includes a core control module 40, one
or more processing modules 42, one or more main memories 44, cache
memory 46, a video graphics processing module 48, a touchscreen 16,
an Input-Output (I/O) peripheral control module 52, one or more
input interface modules 56, one or more output interface modules
58, one or more network interface modules 60, and one or more
memory interface modules 62. The touchscreen 16 includes a
touchscreen display 80, a plurality of sensors 30, a plurality of
drive-sense circuits (DSC), and a touchscreen processing module
82.
[0111] Computing device 14 operates similarly to computing device
12 of FIG. 2 with the addition of a touchscreen as an input device.
The touchscreen includes a plurality of sensors (e.g., electrodes,
capacitor sensing cells, capacitor sensors, inductive sensor, etc.)
to detect a proximal touch of the screen. For example, when one or
more fingers touches the screen, capacitance of sensors proximal to
the touch(es) are affected (e.g., impedance changes). The
drive-sense circuits (DSC) coupled to the affected sensors detect
the change and provide a representation of the change to the
touchscreen processing module 82, which may be a separate
processing module or integrated into the processing module 42.
[0112] The touchscreen processing module 82 processes the
representative signals from the drive-sense circuits (DSC) to
determine the location of the touch(es). This information is
inputted to the processing module 42 for processing as an input.
For example, a touch represents a selection of a button on screen,
a scroll function, a zoom in-out function, etc.
[0113] FIG. 4 is a schematic block diagram of another embodiment of
a computing device 18 that includes a core control module 40, one
or more processing modules 42, one or more main memories 44, cache
memory 46, a video graphics processing module 48, a touch and
tactile screen 20, an Input-Output (I/O) peripheral control module
52, one or more input interface modules 56, one or more output
interface modules 58, one or more network interface modules 60, and
one or more memory interface modules 62. The touch and tactile
screen 20 includes a touch and tactile screen display 90, a
plurality of sensors 30, a plurality of actuators 32, a plurality
of drive-sense circuits (DSC), a touchscreen processing module 82,
and a tactile screen processing module 92.
[0114] Computing device 18 operates similarly to computing device
14 of FIG. 3 with the addition of a tactile aspect to the screen 20
as an output device. The tactile portion of the screen 20 includes
the plurality of actuators (e.g., piezoelectric transducers to
create vibrations, solenoids to create movement, etc.) to provide a
tactile feel to the screen 20. To do so, the processing module
creates tactile data, which is provided to the appropriate
drive-sense circuits (DSC) via the tactile screen processing module
92, which may be a stand-alone processing module or integrated into
processing module 42. The drive-sense circuits (DSC) convert the
tactile data into drive-actuate signals and provide them to the
appropriate actuators to create the desired tactile feel on the
screen 20.
[0115] FIG. 5A is a schematic plot diagram of a computing subsystem
25 that includes a sensed data processing module 65, a plurality of
communication modules 61A-x, a plurality of processing modules
42A-x, a plurality of drive sense circuits 28, and a plurality of
sensors 1-x, which may be sensors 30 of FIG. 1. The sensed data
processing module 65 is one or more processing modules within one
or more servers 22 and/or one more processing modules in one or
more computing devices that are different than the computing
devices in which processing modules 42A-x reside.
[0116] A drive-sense circuit 28 (or multiple drive-sense circuits),
a processing module (e.g., 41A), and a communication module (e.g.,
61A) are within a common computing device. Each grouping of a
drive-sense circuit(s), processing module, and communication module
is in a separate computing device. A communication module 61A-x is
constructed in accordance with one or more wired communication
protocol and/or one or more wireless communication protocols that
is/are in accordance with the one or more of the Open System
Interconnection (OSI) model, the Transmission Control
Protocol/Internet Protocol (TCP/IP) model, and other communication
protocol module.
[0117] In an example of operation, a processing module (e.g., 42A)
provides a control signal to its corresponding drive-sense circuit
28. The processing module 42A may generate the control signal,
receive it from the sensed data processing module 65, or receive an
indication from the sensed data processing module 65 to generate
the control signal. The control signal enables the drive-sense
circuit 28 to provide a drive signal to its corresponding sensor.
The control signal may further include a reference signal having
one or more frequency components to facilitate creation of the
drive signal and/or interpreting a sensed signal received from the
sensor.
[0118] Based on the control signal, the drive-sense circuit 28
provides the drive signal to its corresponding sensor (e.g., 1) on
a drive & sense line. While receiving the drive signal (e.g., a
power signal, a regulated source signal, etc.), the sensor senses a
physical condition 1-x (e.g., acoustic waves, a biological
condition, a chemical condition, an electric condition, a magnetic
condition, an optical condition, a thermal condition, and/or a
mechanical condition). As a result of the physical condition, an
electrical characteristic (e.g., impedance, voltage, current,
capacitance, inductance, resistance, reactance, etc.) of the sensor
changes, which affects the drive signal. Note that if the sensor is
an optical sensor, it converts a sensed optical condition into an
electrical characteristic.
[0119] The drive-sense circuit 28 detects the effect on the drive
signal via the drive & sense line and processes the affect to
produce a signal representative of power change, which may be an
analog or digital signal. The processing module 42A receives the
signal representative of power change, interprets it, and generates
a value representing the sensed physical condition. For example, if
the sensor is sensing pressure, the value representing the sensed
physical condition is a measure of pressure (e.g., x PSI (pounds
per square inch)).
[0120] In accordance with a sensed data process function (e.g.,
algorithm, application, etc.), the sensed data processing module 65
gathers the values representing the sensed physical conditions from
the processing modules. Since the sensors 1-x may be the same type
of sensor (e.g., a pressure sensor), may each be different sensors,
or a combination thereof; the sensed physical conditions may be the
same, may each be different, or a combination thereof. The sensed
data processing module 65 processes the gathered values to produce
one or more desired results. For example, if the computing
subsystem 25 is monitoring pressure along a pipeline, the
processing of the gathered values indicates that the pressures are
all within normal limits or that one or more of the sensed
pressures is not within normal limits.
[0121] As another example, if the computing subsystem 25 is used in
a manufacturing facility, the sensors are sensing a variety of
physical conditions, such as acoustic waves (e.g., for sound
proofing, sound generation, ultrasound monitoring, etc.), a
biological condition (e.g., a bacterial contamination, etc.) a
chemical condition (e.g., composition, gas concentration, etc.), an
electric condition (e.g., current levels, voltage levels,
electro-magnetic interference, etc.), a magnetic condition (e.g.,
induced current, magnetic field strength, magnetic field
orientation, etc.), an optical condition (e.g., ambient light,
infrared, etc.), a thermal condition (e.g., temperature, etc.),
and/or a mechanical condition (e.g., physical position, force,
pressure, acceleration, etc.).
[0122] The computing subsystem 25 may further include one or more
actuators in place of one or more of the sensors and/or in addition
to the sensors. When the computing subsystem 25 includes an
actuator, the corresponding processing module provides an actuation
control signal to the corresponding drive-sense circuit 28. The
actuation control signal enables the drive-sense circuit 28 to
provide a drive signal to the actuator via a drive & actuate
line (e.g., similar to the drive & sense line, but for the
actuator). The drive signal includes one or more frequency
components and/or amplitude components to facilitate a desired
actuation of the actuator.
[0123] In addition, the computing subsystem 25 may include an
actuator and sensor working in concert. For example, the sensor is
sensing the physical condition of the actuator. In this example, a
drive-sense circuit provides a drive signal to the actuator and
another drive sense signal provides the same drive signal, or a
scaled version of it, to the sensor. This allows the sensor to
provide near immediate and continuous sensing of the actuator's
physical condition. This further allows for the sensor to operate
at a first frequency and the actuator to operate at a second
frequency.
[0124] In an embodiment, the computing subsystem is a stand-alone
system for a wide variety of applications (e.g., manufacturing,
pipelines, testing, monitoring, security, etc.). In another
embodiment, the computing subsystem 25 is one subsystem of a
plurality of subsystems forming a larger system. For example,
different subsystems are employed based on geographic location. As
a specific example, the computing subsystem 25 is deployed in one
section of a factory and another computing subsystem is deployed in
another part of the factory. As another example, different
subsystems are employed based function of the subsystems. As a
specific example, one subsystem monitors a city's traffic light
operation and another subsystem monitors the city's sewage
treatment plants.
[0125] Regardless of the use and/or deployment of the computing
system, the physical conditions it is sensing, and/or the physical
conditions it is actuating, each sensor and each actuator (if
included) is driven and sensed by a single line as opposed to
separate drive and sense lines. This provides many advantages
including, but not limited to, lower power requirements, better
ability to drive high impedance sensors, lower line to line
interference, and/or concurrent sensing functions.
[0126] FIG. 5B is a schematic block diagram of another embodiment
of a computing subsystem 25 that includes a sensed data processing
module 65, a communication module 61, a plurality of processing
modules 42A-x, a plurality of drive sense circuits 28, and a
plurality of sensors 1-x, which may be sensors 30 of FIG. 1. The
sensed data processing module 65 is one or more processing modules
within one or more servers 22 and/or one more processing modules in
one or more computing devices that are different than the computing
device, devices, in which processing modules 42A-x reside.
[0127] In an embodiment, the drive-sense circuits 28, the
processing modules, and the communication module are within a
common computing device. For example, the computing device includes
a central processing unit that includes a plurality of processing
modules. The functionality and operation of the sensed data
processing module 65, the communication module 61, the processing
modules 42A-x, the drive sense circuits 28, and the sensors 1-x are
as discussed with reference to FIG. 5A.
[0128] FIG. 5C is a schematic block diagram of another embodiment
of a computing subsystem 25 that includes a sensed data processing
module 65, a communication module 61, a processing module 42, a
plurality of drive sense circuits 28, and a plurality of sensors
1-x, which may be sensors 30 of FIG. 1. The sensed data processing
module 65 is one or more processing modules within one or more
servers 22 and/or one more processing modules in one or more
computing devices that are different than the computing device in
which the processing module 42 resides.
[0129] In an embodiment, the drive-sense circuits 28, the
processing module, and the communication module are within a common
computing device. The functionality and operation of the sensed
data processing module 65, the communication module 61, the
processing module 42, the drive sense circuits 28, and the sensors
1-x are as discussed with reference to FIG. 5A.
[0130] FIG. 5D is a schematic block diagram of another embodiment
of a computing subsystem 25 that includes a processing module 42, a
reference signal circuit 100, a plurality of drive sense circuits
28, and a plurality of sensors 30. The processing module 42
includes a drive-sense processing block 104, a drive-sense control
block 102, and a reference control block 106. Each block 102-106 of
the processing module 42 may be implemented via separate modules of
the processing module, may be a combination of software and
hardware within the processing module, and/or may be field
programmable modules within the processing module 42.
[0131] In an example of operation, the drive-sense control block
104 generates one or more control signals to activate one or more
of the drive-sense circuits 28. For example, the drive-sense
control block 102 generates a control signal that enables of the
drive-sense circuits 28 for a given period of time (e.g., 1 second,
1 minute, etc.). As another example, the drive-sense control block
102 generates control signals to sequentially enable the
drive-sense circuits 28. As yet another example, the drive-sense
control block 102 generates a series of control signals to
periodically enable the drive-sense circuits 28 (e.g., enabled once
every second, every minute, every hour, etc.).
[0132] Continuing with the example of operation, the reference
control block 106 generates a reference control signal that it
provides to the reference signal circuit 100. The reference signal
circuit 100 generates, in accordance with the control signal, one
or more reference signals for the drive-sense circuits 28. For
example, the control signal is an enable signal, which, in
response, the reference signal circuit 100 generates a
pre-programmed reference signal that it provides to the drive-sense
circuits 28. In another example, the reference signal circuit 100
generates a unique reference signal for each of the drive-sense
circuits 28. In yet another example, the reference signal circuit
100 generates a first unique reference signal for each of the
drive-sense circuits 28 in a first group and generates a second
unique reference signal for each of the drive-sense circuits 28 in
a second group.
[0133] The reference signal circuit 100 may be implemented in a
variety of ways. For example, the reference signal circuit 100
includes a DC (direct current) voltage generator, an AC voltage
generator, and a voltage combining circuit. The DC voltage
generator generates a DC voltage at a first level and the AC
voltage generator generates an AC voltage at a second level, which
is less than or equal to the first level. The voltage combining
circuit combines the DC and AC voltages to produce the reference
signal. As examples, the reference signal circuit 100 generates a
reference signal similar to the signals shown in FIG. 7, which will
be subsequently discussed.
[0134] As another example, the reference signal circuit 100
includes a DC current generator, an AC current generator, and a
current combining circuit. The DC current generator generates a DC
current a first current level and the AC current generator
generates an AC current at a second current level, which is less
than or equal to the first current level. The current combining
circuit combines the DC and AC currents to produce the reference
signal.
[0135] Returning to the example of operation, the reference signal
circuit 100 provides the reference signal, or signals, to the
drive-sense circuits 28. When a drive-sense circuit 28 is enabled
via a control signal from the drive sense control block 102, it
provides a drive signal to its corresponding sensor 30. As a result
of a physical condition, an electrical characteristic of the sensor
is changed, which affects the drive signal. Based on the detected
effect on the drive signal and the reference signal, the
drive-sense circuit 28 generates a signal representative of the
effect on the drive signal.
[0136] The drive-sense circuit provides the signal representative
of the effect on the drive signal to the drive-sense processing
block 104. The drive-sense processing block 104 processes the
representative signal to produce a sensed value 97 of the physical
condition (e.g., a digital value that represents a specific
temperature, a specific pressure level, etc.). The processing
module 42 provides the sensed value 97 to another application
running on the computing device, to another computing device,
and/or to a server 22.
[0137] FIG. 5E is a schematic block diagram of another embodiment
of a computing subsystem 25 that includes a processing module 42, a
plurality of drive sense circuits 28, and a plurality of sensors
30. This embodiment is similar to the embodiment of FIG. 5D with
the functionality of the drive-sense processing block 104, a
drive-sense control block 102, and a reference control block 106
shown in greater detail. For instance, the drive-sense control
block 102 includes individual enable/disable blocks 102-1 through
102-y. An enable/disable block functions to enable or disable a
corresponding drive-sense circuit in a manner as discussed above
with reference to FIG. 5D.
[0138] The drive-sense processing block 104 includes variance
determining modules 104-1a through y and variance interpreting
modules 104-2a through y. For example, variance determining module
104-1a receives, from the corresponding drive-sense circuit 28, a
signal representative of a physical condition sensed by a sensor.
The variance determining module 104-1a functions to determine a
difference from the signal representing the sensed physical
condition with a signal representing a known, or reference,
physical condition. The variance interpreting module 104-1b
interprets the difference to determine a specific value for the
sensed physical condition.
[0139] As a specific example, the variance determining module
104-1a receives a digital signal of 1001 0110 (150 in decimal) that
is representative of a sensed physical condition (e.g.,
temperature) sensed by a sensor from the corresponding drive-sense
circuit 28. With 8-bits, there are 2.sup.8 (256) possible signals
representing the sensed physical condition. Assume that the units
for temperature is Celsius and a digital value of 0100 0000 (64 in
decimal) represents the known value for 25 degree Celsius. The
variance determining module 104-b1 determines the difference
between the digital signal representing the sensed value (e.g.,
1001 0110, 150 in decimal) and the known signal value of (e.g.,
0100 0000, 64 in decimal), which is 0011 0000 (86 in decimal). The
variance determining module 104-b1 then determines the sensed value
based on the difference and the known value. In this example, the
sensed value equals 25+86*(100/256)=25+33.6=58.6 degrees
Celsius.
[0140] FIG. 6 is a schematic block diagram of a drive center
circuit 28-a coupled to a sensor 30. The drive sense-sense circuit
28 includes a power source circuit 110 and a power signal change
detection circuit 112. The sensor 30 includes one or more
transducers that have varying electrical characteristics (e.g.,
capacitance, inductance, impedance, current, voltage, etc.) based
on varying physical conditions 114 (e.g., pressure, temperature,
biological, chemical, etc.), or vice versa (e.g., an actuator).
[0141] The power source circuit 110 is operably coupled to the
sensor 30 and, when enabled (e.g., from a control signal from the
processing module 42, power is applied, a switch is closed, a
reference signal is received, etc.) provides a power signal 116 to
the sensor 30. The power source circuit 110 may be a voltage supply
circuit (e.g., a battery, a linear regulator, an unregulated
DC-to-DC converter, etc.) to produce a voltage-based power signal,
a current supply circuit (e.g., a current source circuit, a current
mirror circuit, etc.) to produce a current-based power signal, or a
circuit that provide a desired power level to the sensor and
substantially matches impedance of the sensor. The power source
circuit 110 generates the power signal 116 to include a DC (direct
current) component and/or an oscillating component.
[0142] When receiving the power signal 116 and when exposed to a
condition 114, an electrical characteristic of the sensor affects
118 the power signal. When the power signal change detection
circuit 112 is enabled, it detects the affect 118 on the power
signal as a result of the electrical characteristic of the sensor.
For example, the power signal is a 1.5 voltage signal and, under a
first condition, the sensor draws 1 milliamp of current, which
corresponds to an impedance of 1.5 K Ohms. Under a second
conditions, the power signal remains at 1.5 volts and the current
increases to 1.5 milliamps. As such, from condition 1 to condition
2, the impedance of the sensor changed from 1.5 K Ohms to 1 K Ohms.
The power signal change detection circuit 112 determines this
change and generates a representative signal 120 of the change to
the power signal.
[0143] As another example, the power signal is a 1.5 voltage signal
and, under a first condition, the sensor draws 1 milliamp of
current, which corresponds to an impedance of 1.5 K Ohms. Under a
second conditions, the power signal drops to 1.3 volts and the
current increases to 1.3 milliamps. As such, from condition 1 to
condition 2, the impedance of the sensor changed from 1.5 K Ohms to
1 K Ohms. The power signal change detection circuit 112 determines
this change and generates a representative signal 120 of the change
to the power signal.
[0144] The power signal 116 includes a DC component 122 and/or an
oscillating component 124 as shown in FIG. 7. The oscillating
component 124 includes a sinusoidal signal, a square wave signal, a
triangular wave signal, a multiple level signal (e.g., has varying
magnitude over time with respect to the DC component), and/or a
polygonal signal (e.g., has a symmetrical or asymmetrical polygonal
shape with respect to the DC component). Note that the power signal
is shown without affect from the sensor as the result of a
condition or changing condition.
[0145] In an embodiment, power generating circuit 110 varies
frequency of the oscillating component 124 of the power signal 116
so that it can be tuned to the impedance of the sensor and/or to be
off-set in frequency from other power signals in a system. For
example, a capacitance sensor's impedance decreases with frequency.
As such, if the frequency of the oscillating component is too high
with respect to the capacitance, the capacitor looks like a short
and variances in capacitances will be missed. Similarly, if the
frequency of the oscillating component is too low with respect to
the capacitance, the capacitor looks like an open and variances in
capacitances will be missed.
[0146] In an embodiment, the power generating circuit 110 varies
magnitude of the DC component 122 and/or the oscillating component
124 to improve resolution of sensing and/or to adjust power
consumption of sensing. In addition, the power generating circuit
110 generates the drive signal 110 such that the magnitude of the
oscillating component 124 is less than magnitude of the DC
component 122.
[0147] FIG. 6A is a schematic block diagram of a drive center
circuit 28-a1 coupled to a sensor 30. The drive sense-sense circuit
28-a1 includes a signal source circuit 111, a signal change
detection circuit 113, and a power source 115. The power source 115
(e.g., a battery, a power supply, a current source, etc.) generates
a voltage and/or current that is combined with a signal 117, which
is produced by the signal source circuit 111. The combined signal
is supplied to the sensor 30.
[0148] The signal source circuit 111 may be a voltage supply
circuit (e.g., a battery, a linear regulator, an unregulated
DC-to-DC converter, etc.) to produce a voltage-based signal 117, a
current supply circuit (e.g., a current source circuit, a current
mirror circuit, etc.) to produce a current-based signal 117, or a
circuit that provide a desired power level to the sensor and
substantially matches impedance of the sensor. The signal source
circuit 111 generates the signal 117 to include a DC (direct
current) component and/or an oscillating component.
[0149] When receiving the combined signal (e.g., signal 117 and
power from the power source) and when exposed to a condition 114,
an electrical characteristic of the sensor affects 119 the signal.
When the signal change detection circuit 113 is enabled, it detects
the affect 119 on the signal as a result of the electrical
characteristic of the sensor.
[0150] FIG. 8 is an example of a sensor graph that plots an
electrical characteristic versus a condition. The sensor has a
substantially linear region in which an incremental change in a
condition produces a corresponding incremental change in the
electrical characteristic. The graph shows two types of electrical
characteristics: one that increases as the condition increases and
the other that decreases and the condition increases. As an example
of the first type, impedance of a temperature sensor increases and
the temperature increases. As an example of a second type, a
capacitance touch sensor decreases in capacitance as a touch is
sensed.
[0151] FIG. 9 is a schematic block diagram of another example of a
power signal graph in which the electrical characteristic or change
in electrical characteristic of the sensor is affecting the power
signal. In this example, the effect of the electrical
characteristic or change in electrical characteristic of the sensor
reduced the DC component but had little to no effect on the
oscillating component. For example, the electrical characteristic
is resistance. In this example, the resistance or change in
resistance of the sensor decreased the power signal, inferring an
increase in resistance for a relatively constant current.
[0152] FIG. 10 is a schematic block diagram of another example of a
power signal graph in which the electrical characteristic or change
in electrical characteristic of the sensor is affecting the power
signal. In this example, the effect of the electrical
characteristic or change in electrical characteristic of the sensor
reduced magnitude of the oscillating component but had little to no
effect on the DC component. For example, the electrical
characteristic is impedance of a capacitor and/or an inductor. In
this example, the impedance or change in impedance of the sensor
decreased the magnitude of the oscillating signal component,
inferring an increase in impedance for a relatively constant
current.
[0153] FIG. 11 is a schematic block diagram of another example of a
power signal graph in which the electrical characteristic or change
in electrical characteristic of the sensor is affecting the power
signal. In this example, the effect of the electrical
characteristic or change in electrical characteristic of the sensor
shifted frequency of the oscillating component but had little to no
effect on the DC component. For example, the electrical
characteristic is reactance of a capacitor and/or an inductor. In
this example, the reactance or change in reactance of the sensor
shifted frequency of the oscillating signal component, inferring an
increase in reactance (e.g., sensor is functioning as an integrator
or phase shift circuit).
[0154] FIG. 11A is a schematic block diagram of another example of
a power signal graph in which the electrical characteristic or
change in electrical characteristic of the sensor is affecting the
power signal. In this example, the effect of the electrical
characteristic or change in electrical characteristic of the sensor
changes the frequency of the oscillating component but had little
to no effect on the DC component. For example, the sensor includes
two transducers that oscillate at different frequencies. The first
transducer receives the power signal at a frequency of f.sub.1 and
converts it into a first physical condition. The second transducer
is stimulated by the first physical condition to create an
electrical signal at a different frequency f.sub.2. In this
example, the first and second transducers of the sensor change the
frequency of the oscillating signal component, which allows for
more granular sensing and/or a broader range of sensing.
[0155] FIG. 12 is a schematic block diagram of an embodiment of a
power signal change detection circuit 112 receiving the affected
power signal 118 and the power signal 116 as generated to produce,
therefrom, the signal representative 120 of the power signal
change. The affect 118 on the power signal is the result of an
electrical characteristic and/or change in the electrical
characteristic of a sensor; a few examples of the affects are shown
in FIGS. 8-11A.
[0156] In an embodiment, the power signal change detection circuit
112 detect a change in the DC component 122 and/or the oscillating
component 124 of the power signal 116. The power signal change
detection circuit 112 then generates the signal representative 120
of the change to the power signal based on the change to the power
signal. For example, the change to the power signal results from
the impedance of the sensor and/or a change in impedance of the
sensor. The representative signal 120 is reflective of the change
in the power signal and/or in the change in the sensor's
impedance.
[0157] In an embodiment, the power signal change detection circuit
112 is operable to detect a change to the oscillating component at
a frequency, which may be a phase shift, frequency change, and/or
change in magnitude of the oscillating component. The power signal
change detection circuit 112 is also operable to generate the
signal representative of the change to the power signal based on
the change to the oscillating component at the frequency. The power
signal change detection circuit 112 is further operable to provide
feedback to the power source circuit 110 regarding the oscillating
component. The feedback allows the power source circuit 110 to
regulate the oscillating component at the desired frequency, phase,
and/or magnitude.
[0158] FIG. 13 is a schematic block diagram of another embodiment
of a drive sense circuit 28-b includes a change detection circuit
150, a regulation circuit 152, and a power source circuit 154. The
drive-sense circuit 28-b is coupled to the sensor 30, which
includes a transducer that has varying electrical characteristics
(e.g., capacitance, inductance, impedance, current, voltage, etc.)
based on varying physical conditions 114 (e.g., pressure,
temperature, biological, chemical, etc.).
[0159] The power source circuit 154 is operably coupled to the
sensor 30 and, when enabled (e.g., from a control signal from the
processing module 42, power is applied, a switch is closed, a
reference signal is received, etc.) provides a power signal 158 to
the sensor 30. The power source circuit 154 may be a voltage supply
circuit (e.g., a battery, a linear regulator, an unregulated
DC-to-DC converter, etc.) to produce a voltage-based power signal
or a current supply circuit (e.g., a current source circuit, a
current mirror circuit, etc.) to produce a current-based power
signal. The power source circuit 154 generates the power signal 158
to include a DC (direct current) component and an oscillating
component.
[0160] When receiving the power signal 158 and when exposed to a
condition 114, an electrical characteristic of the sensor affects
160 the power signal. When the change detection circuit 150 is
enabled, it detects the affect 160 on the power signal as a result
of the electrical characteristic of the sensor 30. The change
detection circuit 150 is further operable to generate a signal 120
that is representative of change to the power signal based on the
detected effect on the power signal.
[0161] The regulation circuit 152, when its enabled, generates
regulation signal 156 to regulate the DC component to a desired DC
level and/or regulate the oscillating component to a desired
oscillating level (e.g., magnitude, phase, and/or frequency) based
on the signal 120 that is representative of the change to the power
signal. The power source circuit 154 utilizes the regulation signal
156 to keep the power signal at a desired setting 158 regardless of
the electrical characteristic of the sensor. In this manner, the
amount of regulation is indicative of the affect the electrical
characteristic had on the power signal.
[0162] In an example, the power source circuit 158 is a DC-DC
converter operable to provide a regulated power signal having DC
and AC components. The change detection circuit 150 is a comparator
and the regulation circuit 152 is a pulse width modulator to
produce the regulation signal 156. The comparator compares the
power signal 158, which is affected by the sensor, with a reference
signal that includes DC and AC components. When the electrical
characteristics is at a first level (e.g., a first impedance), the
power signal is regulated to provide a voltage and current such
that the power signal substantially resembles the reference
signal.
[0163] When the electrical characteristics changes to a second
level (e.g., a second impedance), the change detection circuit 150
detects a change in the DC and/or AC component of the power signal
158 and generates the representative signal 120, which indicates
the changes. The regulation circuit 152 detects the change in the
representative signal 120 and creates the regulation signal to
substantially remove the effect on the power signal. The regulation
of the power signal 158 may be done by regulating the magnitude of
the DC and/or AC components, by adjusting the frequency of AC
component, and/or by adjusting the phase of the AC component.
[0164] With respect to the operation of various drive-sense
circuits as described herein and/or their equivalents, note that
the operation of such a drive-sense circuit is operable
simultaneously to drive and sense a signal via a single line. In
comparison to switched, time-divided, time-multiplexed, etc.
operation in which there is switching between driving and sensing
(e.g., driving at first time, sensing at second time, etc.) of
different respective signals at separate and distinct times, the
drive-sense circuit is operable simultaneously to perform both
driving and sensing of a signal. In some examples, such
simultaneous driving and sensing is performed via a single line
using a drive-sense circuit.
[0165] In addition, other alternative implementations of various
drive-sense circuits (DSCs) are described in U.S. Utility patent
application Ser. No. 16/113,379, entitled "DRIVE SENSE CIRCUIT WITH
DRIVE-SENSE LINE," (Attorney Docket No. SGS00009), filed Aug. 27,
2018, pending. Any instantiation of a drive-sense circuit as
described herein may also be implemented using any of the various
implementations of various drive-sense circuits (DSCs) described in
U.S. Utility patent application Ser. No. 16/113,379.
[0166] In addition, note that the one or more signals provided from
a drive-sense circuit (DSC) may be of any of a variety of types.
For example, such a signal may be based on encoding of one or more
bits to generate one or more coded bits used to generate modulation
data (or generally, data). For example, a device is configured to
perform forward error correction (FEC) and/or error checking and
correction (ECC) code of one or more bits to generate one or more
coded bits. Examples of FEC and/or ECC may include turbo code,
convolutional code, trellis coded modulation (TCM), turbo trellis
coded modulation (TTCM), low density parity check (LDPC) code,
Reed-Solomon (RS) code, BCH (Bose and Ray-Chaudhuri, and
Hocquenghem) code, binary convolutional code (BCC), Cyclic
Redundancy Check (CRC), and/or any other type of ECC and/or FEC
code and/or combination thereof, etc. Note that more than one type
of ECC and/or FEC code may be used in any of various
implementations including concatenation (e.g., first ECC and/or FEC
code followed by second ECC and/or FEC code, etc. such as based on
an inner code/outer code architecture, etc.), parallel architecture
(e.g., such that first ECC and/or FEC code operates on first bits
while second ECC and/or FEC code operates on second bits, etc.),
and/or any combination thereof.
[0167] Also, the one or more coded bits may then undergo modulation
or symbol mapping to generate modulation symbols (e.g., the
modulation symbols may include data intended for one or more
recipient devices, components, elements, etc.). Note that such
modulation symbols may be generated using any of various types of
modulation coding techniques. Examples of such modulation coding
techniques may include binary phase shift keying (BPSK), quadrature
phase shift keying (QPSK), 8-phase shift keying (PSK), 16
quadrature amplitude modulation (QAM), 32 amplitude and phase shift
keying (APSK), etc., uncoded modulation, and/or any other desired
types of modulation including higher ordered modulations that may
include even greater number of constellation points (e.g., 1024
QAM, etc.).
[0168] In addition, note that a signal provided from a DSC may be
of a unique frequency that is different from signals provided from
other DSCs. Also, a signal provided from a DSC may include multiple
frequencies independently or simultaneously. The frequency of the
signal can be hopped on a pre-arranged pattern. In some examples, a
handshake is established between one or more DSCs and one or more
processing modules (e.g., one or more controllers) such that the
one or more DSC is/are directed by the one or more processing
modules regarding which frequency or frequencies and/or which other
one or more characteristics of the one or more signals to use at
one or more respective times and/or in one or more particular
situations.
[0169] With respect to any signal that is driven and simultaneously
detected by a DSC, note that any additional signal that is coupled
into a line, an electrode, a touch sensor, a bus, a communication
link, a battery, a load, an electrical coupling or connection, etc.
associated with that DSC is also detectable. For example, a DSC
that is associated with such a line, an electrode, a touch sensor,
a bus, a communication link, a battery, a load, an electrical
coupling or connection, etc. is configured to detect any signal
from one or more other lines, electrodes, touch sensors, buses,
communication links, loads, electrical couplings or connections,
etc. that get coupled into that line, electrode, touch sensor, bus,
communication link, battery, load, electrical coupling or
connection, etc.
[0170] Note that the different respective signals that are driven
and simultaneously sensed by one or more DSCs may be are
differentiated from one another. Appropriate filtering and
processing can identify the various signals given their
differentiation, orthogonality to one another, difference in
frequency, etc. Other examples described herein and their
equivalents operate using any of a number of different
characteristics other than or in addition to frequency.
[0171] Moreover, with respect to any embodiment, diagram, example,
etc. that includes more than one DSC, note that the DSCs may be
implemented in a variety of manners. For example, all of the DSCs
may be of the same type, implementation, configuration, etc. In
another example, the first DSC may be of a first type,
implementation, configuration, etc., and a second DSC may be of a
second type, implementation, configuration, etc. that is different
than the first DSC. Considering a specific example, a first DSC may
be implemented to detect change of impedance associated with a
line, an electrode, a touch sensor, a bus, a communication link, an
electrical coupling or connection, etc. associated with that first
DSC, while a second DSC may be implemented to detect change of
voltage associated with a line, an electrode, a touch sensor, a
bus, a communication link, an electrical coupling or connection,
etc. associated with that second DSC. In addition, note that a
third DSC may be implemented to detect change of a current
associated with a line, an electrode, a touch sensor, a bus, a
communication link, an electrical coupling or connection, etc.
associated with that DSC. In general, while a common reference may
be used generally to show a DSC or multiple instantiations of a DSC
within a given embodiment, diagram, example, etc., note that any
particular DSC may be implemented in accordance with any manner as
described herein, such as described in U.S. Utility patent
application Ser. No. 16/113,379, etc. and/or their equivalents.
[0172] Note that certain of the following diagrams show a computing
device (e.g., alternatively referred to as device; the terms
computing device and device may be used interchangeably) that may
include or be coupled to one or more processing modules. In certain
instances, the one or more processing modules is configured to
communicate with and interact with one or more other devices
including one or more of DSCs, one or more components associated
with a DSC, one or more components associated with a display, a
touch sensor device that may or may not include display
functionality (e.g., a touchscreen display with sensors, a panel
without display functionality that includes one or more sensors,
etc., one or more other components associated with a display, a
touchscreen display with sensors, or generally a touch sensor
device that may or may not include display functionality, etc.)
Note that any such implementation of one or more processing modules
may include integrated memory and/or be coupled to other memory. At
least some of the memory stores operational instructions to be
executed by the one or more processing modules. In addition, note
that the one or more processing modules may interface with one or
more other computing devices, components, elements, etc. via one or
more communication links, networks, communication pathways,
channels, etc. (e.g., such as via one or more communication
interfaces of the computing device, such as may be integrated into
the one or more processing modules or be implemented as a separate
component, circuitry, etc.).
[0173] In addition, when a DSC is implemented to communicate with
and interact with another element, the DSC is configured
simultaneously to transmit and receive one or more signals with the
element. For example, a DSC is configured simultaneously to sense
and to drive one or more signals to the one element. During
transmission of a signal from a DSC, that same DSC is configured
simultaneously to sense the signal being transmitted from the DSC
and any other signal may be coupled into the signal that is being
transmitted from the DSC.
[0174] In addition, while many examples, embodiments, diagrams,
etc. herein include one or more DSCs (e.g., coupled to one or more
processing modules and one or more electrodes), note that any
instantiation of a DSC may alternatively be implemented using a
channel drive circuitry, an Analog Front End (AFE) that includes
analog to digital and/or digital to analog conversion capability,
etc. within alternative embodiments.
[0175] FIG. 14 is a schematic block diagram of an embodiment 1400
of a touch sensor device (TSD) in accordance with the present
invention. This diagram includes a schematic block diagram of an
embodiment of a TSD 1410 that is implemented to include a
touchscreen display with sensors 80 that also includes a plurality
of drive-sense circuits (DSCs), a touchscreen processing module 82,
a display 83, and a plurality of electrodes 85 (e.g., the
electrodes operate as the sensors or sensor components into which
touch and/or proximity may be detected in the touchscreen display
with sensors 80). The touchscreen display with sensors 80 is
coupled to a processing module 42, a video graphics processing
module 48, and a display interface 93, which are components of a
computing device (e.g., one or more of computing devices 14-18), an
interactive display, or other device that includes a touchscreen
display. An interactive display functions to provide users with an
interactive experience (e.g., touch the screen to obtain
information, be entertained, etc.). For example, a store provides
interactive displays for customers to find certain products, to
obtain coupons, to enter contests, etc.
[0176] In some examples, note that display functionality and
touchscreen functionality are both provided by a combined device
that may be referred to as a touchscreen display with sensors 80.
However, in other examples, note that touchscreen functionality and
display functionality are provided by separate devices, namely, the
display 83 and a touchscreen that is implemented separately from
the display 83. Generally speaking, different implementations may
include display functionality and touchscreen functionality within
a combined device such as a touchscreen display with sensors 80, or
separately using a display 83 and a touchscreen.
[0177] There are a variety of other devices that may be implemented
to include a touchscreen display. For example, a vending machine
includes a touchscreen display to select and/or pay for an item.
Another example of a device having a touchscreen display is an
Automated Teller Machine (ATM). As yet another example, an
automobile includes a touchscreen display for entertainment media
control, navigation, climate control, etc.
[0178] The touchscreen display with sensors 80 includes a large
display 83 that has a resolution equal to or greater than full
high-definition (HD), an aspect ratio of a set of aspect ratios,
and a screen size equal to or greater than thirty-two inches. The
following table lists various combinations of resolution, aspect
ratio, and screen size for the display 83, but it's not an
exhaustive list. Other screen sizes, resolutions, aspect ratios,
etc. may be implemented within other various displays.
TABLE-US-00001 pixel screen screen Width Height aspect aspect size
Resolution (lines) (lines) ratio ratio (inches) HD (high 1280 720
1:1 16:9 32, 40, 43, definition) 50, 55, 60, 65, 70, 75, &/or
>80 Full HD 1920 1080 1:1 16:9 32, 40, 43, 50, 55, 60, 65, 70,
75, &/or >80 HD 960 720 4:3 16:9 32, 40, 43, 50, 55, 60, 65,
70, 75, &/or >80 HD 1440 1080 4:3 16:9 32, 40, 43, 50, 55,
60, 65, 70, 75, &/or >80 HD 1280 1080 3:2 16:9 32, 40, 43,
50, 55, 60, 65, 70, 75, &/or >80 QHD 2560 1440 1:1 16:9 32,
40, 43, (quad HD) 50, 55, 60, 65, 70, 75, &/or >80 UHD 3840
2160 1:1 16:9 32, 40, 43, (Ultra 50, 55, 60, HD) or 4K 65, 70, 75,
&/or >80 8K 7680 4320 1:1 16:9 32, 40, 43, 50, 55, 60, 65,
70, 75, &/or >80 HD and 1280->=7680 720->=4320 1:1,
2:3, 2:3 50, 55, 60, above etc. 65, 70, 75, &/or >80
[0179] The display 83 is one of a variety of types of displays that
is operable to render frames of data into visible images. For
example, the display is one or more of: a light emitting diode
(LED) display, an electroluminescent display (ELD), a plasma
display panel (PDP), a liquid crystal display (LCD), an LCD high
performance addressing (HPA) display, an LCD thin film transistor
(TFT) display, an organic light emitting diode (OLED) display, a
digital light processing (DLP) display, a surface conductive
electron emitter (SED) display, a field emission display (FED), a
laser TV display, a carbon nanotubes display, a quantum dot
display, an interferometric modulator display (IMOD), and a digital
microshutter display (DMS). The display is active in a full display
mode or a multiplexed display mode (i.e., only part of the display
is active at a time).
[0180] The display 83 further includes integrated electrodes 85
that provide the sensors for the touch sense part of the
touchscreen display. The electrodes 85 are distributed throughout
the display area or where touchscreen functionality is desired. For
example, a first group of the electrodes are arranged in rows and a
second group of electrodes are arranged in columns. As will be
discussed in greater detail with reference to one or more of FIGS.
18, 19, 20, and 21, the row electrodes are separated from the
column electrodes by a dielectric material.
[0181] The electrodes 85 are comprised of a transparent conductive
material and are in-cell or on-cell with respect to layers of the
display. For example, a conductive trace is placed in-cell or
on-cell of a layer of the touchscreen display. The transparent
conductive material, which is substantially transparent and has
negligible effect on video quality of the display with respect to
the human eye. For instance, an electrode is constructed from one
or more of: Indium Tin Oxide, Graphene, Carbon Nanotubes, Thin
Metal Films, Silver Nanowires Hybrid Materials, Aluminum-doped Zinc
Oxide (AZO), Amorphous Indium-Zinc Oxide, Gallium-doped Zinc Oxide
(GZO), and poly polystyrene sulfonate (PEDOT).
[0182] In an example of operation, the processing module 42 is
executing an operating system application 89 and one or more user
applications 91. The user applications 91 includes, but is not
limited to, a video playback application, a spreadsheet
application, a word processing application, a computer aided
drawing application, a photo display application, an image
processing application, a database application, etc. While
executing an application 91, the processing module generates data
for display (e.g., video data, image data, text data, etc.). The
processing module 42 sends the data to the video graphics
processing module 48, which converts the data into frames of video
87.
[0183] The video graphics processing module 48 sends the frames of
video 87 (e.g., frames of a video file, refresh rate for a word
processing document, a series of images, etc.) to the display
interface 93. The display interface 93 provides the frames of video
to the display 83, which renders the frames of video into visible
images.
[0184] In certain examples, one or more images are displayed so as
to facilitate communication of data from a first computing device
to a second computing device via a user. For example, one or more
images are displayed on the touchscreen display with sensors 80,
and when a user is in contact with the one or more images that are
displayed on the touchscreen display with sensors 80, one or more
signals that are associated with the one or more images are coupled
via the user to another computing device. In some examples, the
touchscreen display with sensors 80 is implemented within a
portable device, such as a cell phone, a smart phone, a tablet,
and/or any other such device that includes a touching display with
sensors 80. Also, in some examples, note that the computing device
that is displaying one or more images that are coupled via the user
to another computing device does not include a touchscreen display
with sensors 80, but merely a display that is implemented to
display one or more images. In accordance with operation of the
display, whether implemented as it display alone for a touchscreen
display with sensors, as the one or more images are displayed, and
when the user is in contact with the display (e.g., such as
touching the one or more images with a digit of a hand, such as
found, fingers, etc.) or is was within sufficient proximity to
facilitate coupling of one or more signals that are associated with
a lot of images, then the signals are coupled via the user to
another computing device.
[0185] When the display 83 is implemented as a touchscreen display
with sensors 80, while the display 83 is rendering the frames of
video into visible images, the drive-sense circuits (DSC) provide
sensor signals to the electrodes 85. When the touchscreen (e.g.,
which may alternatively be referred to as screen) is touched,
capacitance of the electrodes 85 proximal to the touch (i.e.,
directly or close by) is changed. The DSCs detect the capacitance
change for affected electrodes and provide the detected change to
the touchscreen processing module 82.
[0186] The touchscreen processing module 82 processes the
capacitance change of the effected electrodes to determine one or
more specific locations of touch and provides this information to
the processing module 42. Processing module 42 processes the one or
more specific locations of touch to determine if an operation of
the application is to be altered. For example, the touch is
indicative of a pause command, a fast forward command, a reverse
command, an increase volume command, a decrease volume command, a
stop command, a select command, a delete command, etc.
[0187] In addition, note that certain implementations of TSDs may
be made to include many more row electrodes and many more column
electrodes than shown in this diagram as well as others included
herein. In certain examples, a TSD includes tens, hundreds,
thousands, etc. or an even larger number of row electrodes and/or
tens, hundreds, thousands, etc. or an even larger number of column
electrodes. In general, a TSD may be implemented to include one or
more electrodes. In certain examples, such one or more electrodes
includes a first group of one or more electrodes implemented in a
first direction and a second group of one or more electrodes
implemented in a second direction that is different than the first
direction. In one implementation, the second direction is 90
degrees different than the first direction. In another
implementation, the second direction is offset from the first
direction by some other amount (e.g., a difference in alignment
that is greater than 10 degrees and less than 90 degrees different
than the first direction).
[0188] FIG. 15 is a schematic block diagram of another embodiment
1500 of a TSD 1510 in accordance with the present invention. This
diagram has certain similarities to the prior diagram and includes
a schematic block diagram of another embodiment of a TSD 1510 that
includes display functionality, e.g., a touchscreen display 80, and
that also includes a plurality of drive-sense circuits (DSCs), the
touchscreen processing module 82, the processing module 42, the
video graphics processing module 48, a display 83, and a plurality
of electrodes 85. The processing module 42 is executing an
operating system 89 and one or more user applications 91 to produce
data that is processed by the video graphics processing module 48
to generate frames of data 87. The processing module 42 provides
the frames of data 87 to the display interface 93.
[0189] This diagram is similar to the prior diagram with at least
one different being that the electrodes 85 are diagonally aligned.
Generally speaking, the electrodes 85 may be implemented using any
desired pattern, configuration, arrangement, etc. In addition,
interfaces (I/Fs) 86 provide interfacing between the DSCs and the
electrodes 85 appropriately such that a respective DSC services one
or more electrodes 85 that are diagonally aligned in this
implementation of a TSD 1510. For example, given the diagonally
aligned electrodes 85, the DSCs as implemented in a particular
architecture may not align directly with the respective electrodes
that they service, and the I/Fs 86 provide for appropriate coupling
between the DSCs and the electrodes 85. The TSD 1510 operates
similarly to the TSD 1410 of FIG. 14 with the above noted
differences.
[0190] FIG. 16 is a schematic block diagram of various embodiments
1601 through 1617 of electrode patterns that may be used on a TSD
in accordance with the present invention. These diagrams show
portions of or cross-sections of various embodiments of electrode
patterns that may be used in accordance with any of the various
TSDs described herein and/or their equivalents.
[0191] Generally speaking, the various electrodes within a TSD may
be implemented in any desired configuration, pattern, arrangement,
etc. In addition, note that alternative embodiments may include an
electrode that is a pad, a button, etc. that is not implemented in
a configuration, pattern, arrangement, etc. that facilitate
capacitive coupling between a first electrode implemented in a
first direction and a second electrode implemented in a second
direction.
[0192] Reference 1601 corresponds to a pattern that includes
uniformly spaced vertical electrodes. Reference numeral 1602
corresponds to a pattern that includes uniformly spaced horizontal
electrodes. Generally speaking, note that the electrodes of such
patterns may be aligned in any desired direction. Also, they may be
uniformly spaced, non-uniformly spaced, parallel, non-parallel,
etc.
[0193] Reference numeral 1603 corresponds to a pattern that
includes non-uniformly spaced vertical electrodes. Reference
numeral 1604 corresponds to a pattern that includes non-uniformly
spaced horizontal electrodes. Note that the non-uniformity of
spacing of the vertical or horizontal electrodes may be based on
any desired pattern, including a repetitive pattern, a random
pattern, etc.
[0194] Reference numeral 1605 corresponds to a pattern that
includes uniformly spaced slanted/diagonal electrodes. Reference
numeral 1606 corresponds to a pattern that includes nonuniformly
spliced slanted electrodes.
[0195] Reference 1607 corresponds to a pattern that includes a
uniformly spaced checkerboard. Reference 1608 corresponds to a
pattern that includes non-uniformly spaced checkerboard. Note that
the non-uniformity of spacing of the vertical and horizontal
electrodes within such a non-uniformly spaced checkerboard pattern
may be based on any desired pattern, including a repetitive
pattern, a random pattern, etc. In addition, note that a pattern
including electrodes extending in various directions such as
checkerboard may include electrical isolation between the
electrodes aligned in one direction and the electrodes aligned in
another direction. For example, considering a checkerboard pattern
such as these, the vertical and horizontal aligned electrodes may
be electrically isolated such that there is not direct electrical
connection between the vertical and horizontal aligned electrodes
yet are configured to facilitate capacitive coupling of signals
between the vertical and horizontal aligned electrodes.
[0196] Reference 1609 corresponds to a pattern that includes curved
vertical aligned electrodes. In this particular example, the
electrodes are more closely aligned to one another near the middle
of the pattern than at the top or the bottom of the pattern.
Reference 1610 corresponds to a pattern that includes curved
horizontal aligned electrodes. In this particular example, the
electrodes are more closely aligned to one another near the middle
of the pattern than at the left or the right of the pattern.
[0197] Reference 1611 corresponds to a pattern that includes a
curved checkerboard that includes both curved vertical aligned
electrodes and curved horizontal aligned electrodes. Note also that
the curved vertical aligned electrodes and curved horizontal
aligned electrodes may be electrically isolated from one another
such that such that there is not direct electrical connection
between the vertical aligned electrodes and curved horizontal
aligned electrodes.
[0198] Reference 1612 corresponds to a pattern that includes
s-shaped vertical aligned electrodes. Note that an alternative
pattern may alternatively include s-shaped horizontal aligned
electrodes.
[0199] Reference 1613 corresponds to a pattern that includes a
uniformly spaced slanted/diagonal checkerboard. Reference 1614
corresponds to a pattern that includes a non-uniformly spaced
slanted/diagonal checkerboard. In this particular example, the
electrodes are more closely aligned near the corners of this
cross-section than in the middle/center of this cross-section.
[0200] Reference 1615 corresponds to a pattern that includes an
alternative curved checkerboard such that some electrodes curve up
and back down when traversing from left to right and other
electrodes curve down and back up when traversing from left to
right and other. Reference 1616 corresponds to a pattern that
includes an alternative curved checkerboard such that some
electrodes curve to the right and back to the left when traversing
from top to bottom and other electrodes curve to the left and back
to the right when traversing from top to bottom. Reference 1617
corresponds to a vertical and slanted/diagonal pattern that
includes some electrodes aligned vertically and other electrodes
aligned in a slanted/diagonal manner.
[0201] For example, considering the patterns shown by reference
numerals 1613, 1614, 1615, 1616, and 1617 that include electrodes
aligned in at least 2 different directions may be electrically
isolated such that there is not direct electrical connection
between the electrodes aligned in at least 2 different directions
yet are configured to facilitate capacitive coupling of signals
between the electrodes aligned in at least 2 different
directions.
[0202] Generally speaking, any desired pattern of electrodes may be
used in a TSD and may be implemented on any surface, layer,
component, etc. of the TSD. In some examples, note that one or more
protective layers may be implemented over electrodes to ensure that
they are not damaged, etc. yet still are configured to facilitate
capacitive coupling with the electrodes and/or between electrodes
through the one or more protective layers.
[0203] In addition, with respect to electrodes implemented in
different directions (e.g., rows and columns, or some other
pattern) within a TSD, a mutual capacitance is created between a
first electrode implemented in a first direction in a first
surface, layer, component, etc. of the TSD and a second electrode
implemented in a second direction in a second surface, layer,
component, etc. of the TSD. In addition, each electrode has a
self-capacitance, which corresponds to a parasitic capacitance
created by the electrode with respect to other conductors in the
TSD (e.g., ground, conductive layer(s), and/or one or more other
electrodes). Also, a mutual capacitance exists between a first
electrode implemented in a first direction in a first surface,
layer, component, etc. of the TSD and a second electrode
implemented in a second direction in a second surface, layer,
component, etc. of the TSD. When no touch (e.g., from a user,
stylus, other device that may or may not include TSD functionality,
another other TSD, etc. is present), the self-capacitances and
mutual capacitances of the TSD are at a nominal state. Depending on
the length, width, and thickness of the electrodes, separation from
the electrodes and other conductive surfaces, and dielectric
properties of the layers, the self-capacitances and mutual
capacitances can range from a few pico-Farads to 10's of
nano-Farads.
[0204] FIG. 17 is a schematic block diagram of another embodiment
1700 of a TSD that is similar to FIG. 15 with the option of using
any desired electrode pattern in accordance with the present
invention. For example, the electrodes 85 of the TSD 1710 may be
implemented using any of the various electrode patterns shown
within FIG. 16, or alternatively, using any other desired electrode
pattern, configuration, etc. Similar to FIG. 15, I/Fs 86 provide
for appropriate coupling between the DSCs and the electrodes 85 to
accommodate any desired electrode pattern and coupling between the
DSCs and the electrodes 85.
[0205] FIG. 18 is a schematic block diagram of another embodiment
1800 of a touchscreen display in accordance with the present
invention. This diagram includes a schematic block diagram of
another embodiment of a touch sensor device (TSD) 1810 that
includes display functionality, e.g., a touchscreen display 80, and
that also includes a plurality of drive-sense circuits (DSCs), the
processing module 42, a display 83, and a plurality of electrodes
85. The processing module 42 is executing an operating system 89
and one or more user applications 91 to produce frames of data 87.
The processing module 42 provides the frames of data 87 to the
display interface 93. The TSD 1810 operates similarly to the TSD
1410 of FIG. 14 with the above noted differences.
[0206] FIG. 19 is a schematic block diagram of an embodiment 1900
of a touch sensor device (TSD) in accordance with the present
invention. Note that a touch sensor device may or may not include
display functionality. For example, one example of a touch sensor
device includes a touchscreen display (e.g., such as described with
respect to FIG. 14 or FIG. 15). Alternatively, a touch sensor
device may include touch sensor functionality without including
display functionality. In this diagram, an alternative example of a
touch sensor device, namely, touch sensor device 1910, includes
sensor 80 but with no display functionality. Generally speaking,
any reference to a touch sensor device herein may be used to refer
to a touch sensor device that may or may not include display
functionality (e.g., a touchscreen display or a touch sensor device
such as touch sensor device 1910 that does not include display
functionality). This diagram is similar to FIG. 17 with at least
some differences being that this diagram includes a touch sensor
device 1910 with sensors 80. The touch sensor device 1910 of this
diagram includes a panel 1912 (e.g., that includes
embedded/integrated electrodes 85) that facilitates touch sensor
functionality. However, the touch sensor device 1910 of this
diagram does not include display functionality and does not include
a video graphics processing module 48 or a display interface 93 as
does FIG. 17. In addition, the touchscreen processing module 82 of
FIG. 14, which may include and/or be coupled to memory, is replaced
in FIG. 19 by a touch sensor device processing module 1942, which
may include and/or be coupled to memory.
[0207] The touch sensor device processing module 1942 operates
similarly to the touchscreen processing module 82 of FIG. 17 with
respect to touch related functionality yet with at least some
differences being that the touch sensor device processing module
1942 does not particularly operate in accordance with display
related functionality. For example, the touch sensor device 1910
includes a panel 1912, a plurality of sensors (e.g., shows as
electrodes 85 in the diagram), a plurality of drive-sense circuits
(DSCs), and the touch sensor device processing module 1942. The
touch sensor device 1910 includes a plurality of sensors (e.g.,
electrodes 85, capacitor sensing cells, capacitor sensors,
inductive sensor, etc.) to detect a proximal touch of the panel
1912. For example, when one or more fingers, styluses, other
components, etc. touches the screen, capacitance of sensors
proximal to the touch(es) are affected (e.g., impedance changes).
The drive-sense circuits (DSC) coupled to the affected sensors
detect the change and provide a representation of the change to the
touch sensor device processing module 1942, which may be a separate
processing module or integrated into the processing module 42.
[0208] The touch sensor device processing module 1942 processes the
representative signals from the drive-sense circuits (DSC) to
determine the location of the touch(es). This information is
inputted to the processing module 42 for processing as an input.
For example, a touch represents a selection of a location on the
panel 1912, a motion on the panel 1912, a gesture of a user with
respect to the panel 1912, etc.
[0209] In addition, with respect to this diagram and others herein,
note that the panel 1912 may be implemented in a variety of ways
including in a rigid format such as is made when such electrodes
are implemented in a TSD that includes display functionality.
However, when the panel 1912 that includes the electrodes 85, which
may be implemented in any desired pattern, may alternatively be
implementation using other non-rigid materials that are flexible
and allow for adaptability to a variety of applications. Such
materials may be polymer, flexible plastic, any other materials
that facilitates capacitive coupling to the electrodes of the panel
1912 while also allowing flexibility of the panel 1912.
[0210] FIG. 20 is a schematic block diagram of another embodiment
2000 of a touch sensor device (TSD) in accordance with the present
invention. This diagram has some similarities to prior diagrams
including FIG. 19. In this diagram, the functionality from a touch
sensor device processing module 1942, which may include or be
coupled to memory, such as with respect to FIG. 19, is integrated
into the processing module 42, which may include or be coupled to
memory. The processing module 42 facilitates touch related
functionality without specifically supporting display related
functionality.
[0211] Note that while many of the examples of electrode alignment
within a panel or touchscreen display show the electrodes as being
aligned with respect to rows and columns, any other desired
configuration of electrodes may alternatively be made. For example,
electrodes may be arranged angularly such as a first set of
electrodes are implemented as extending from upper left to lower
right of the panel or touch screen display and a second set of
electrodes are implemented as extending from upper right to lower
left of the panel or touchscreen display. Generally speaking, any
desired configuration and implementation of electrode arrangement
within such a panel or touchscreen display, including any such
pattern shown with respect to FIG. 16, may be implemented within
any such device as described here including various aspects,
embodiments, and/or examples of the invention (and/or their
equivalents).
[0212] FIG. 21 is a schematic block diagram of another embodiment
2100 of a touch sensor device (TSD) in accordance with the present
invention. The TSD includes one or more drive-sense circuits (DSCs)
28 and one or more electrodes 85 in accordance with the present
invention. Within this diagram, as well as any other diagram
described herein, or their equivalents, the one or electrodes 85
that are in communication with one or more DSC 28 (e.g., touch
sensor electrodes such as may be implemented within a TSD
configured to facilitate sensing of touch, proximity, gesture,
etc.) may be of any of a variety of one or more types including any
one or more of a touch sensor element (e.g., including one or more
touch sensors with or without display functionality), a touchscreen
including both touch sensor and display functionality, a button, an
electrode, an external controller, one or more rows of electrodes,
one or more columns of electrodes, a matrix of buttons, an array of
buttons, a film that includes any desired implementation of
components to facilitate touch sensor operation, and/or any other
configuration by which interaction with the touch sensor may be
performed.
[0213] Note that the one or more electrodes 85 may be implemented
within any of a variety of devices including any one or more of a
touchscreen, a pad device, a laptop, a cell phone, a smartphone, a
whiteboard, an interactive display, a navigation system display, an
in-vehicle display, a panel (e.g., implemented using rigid or
flexible material), etc., and/or any other device in which one or
more touch electrodes 85 may be implemented.
[0214] Note that such interaction of a user with an electrode 85
may correspond to the user touching the touch sensor, the user
being in proximate distance to the touch sensor (e.g., within a
sufficient proximity to the touch sensor that coupling from the
user to the touch sensor may be performed via capacitively coupling
(CC), etc. and/or generally any manner of interacting with the
touch sensor that is detectable based on processing of signals
transmitted to and/or sensed from the touch sensor including
proximity detection, gesture detection, etc.). With respect to the
various embodiments, implementations, etc. of various respective
electrodes as described herein, note that they may also be of any
such variety of one or more types. For example, electrodes may be
implemented within any desired shape or style (e.g., lines,
buttons, pads, etc.) or include any one or more of touch sensor
electrodes, capacitive buttons, capacitive sensors, row and column
implementations of touch sensor electrodes such as in a
touchscreen, etc.
[0215] One example of such user interaction with the one or more
electrodes 85 is via capacitive coupling between the user and the
one or more electrodes 85. Such capacitive coupling (CC) may be
achieved from a user, via a stylus, an active element such as an
electronic pen (e-pen), and/or any other element such as an
overlay, another TSD, etc. implemented to facilitate capacitive
coupling between the user and the electrode 85. In some examples,
note that the one or more electrodes 85 are also implemented to
detect user interaction based on user touch (e.g., via capacitive
coupling (CC) from a user, such as a user's finger, to the one or
more electrodes 85).
[0216] Another example of such interaction with the one or more
electrodes 85 is via capacitive coupling between a non-user element
and the one or more electrodes 85. For example, consider a robotic
arm, article of manufacture, etc. comes into proximity to the one
or more electrodes 85, then capacitive coupling between the a
robotic arm, article of manufacture, etc. may be detected via the
one or more electrodes 85. Note that any example, embodiment, etc.
described herein corresponding to user interaction with the TSD may
analogously be performed based on interaction of any other object
other than a user when interacting with the TSD.
[0217] At the bottom of this diagram, one or more processing
modules 42 is coupled to drive-sense circuits (DSCs) 28. Note that
the one or more processing modules 42 may include integrated memory
and/or be coupled to other memory. At least some of the memory
stores operational instructions to be executed by the one or more
processing modules 42.
[0218] FIG. 22 is a schematic block diagram of another embodiment
2200 of multiple touch sensor devices (TSDs) in accordance with the
present invention. At the bottom of this diagram, a first
TSD/1.sup.st device includes one or more processing modules 42
includes a first subset of the one or more processing modules 42
that are in communication and operative with a first subset of the
one or more DSCs 28 (e.g., those in communication with one or more
row and/or column electrodes of the first TSD/1.sup.st device) and
a second TSD/2.sup.nd device includes a second subset of the one or
more processing modules 42 that are in communication and operative
with a second subset of the one or more DSCs 28 (e.g., those in
communication with one or more row and/or column electrodes of the
second TSD/2.sup.nd device).
[0219] In even other examples, the one or more processing modules
42 shown in the first TSD/1.sup.st device or the second
TSD/2.sup.nd device includes a first subset of the one or more
processing modules 42 that are in communication and operative with
a first subset of the one or more DSCs 28 (e.g., those in
communication with one or more row and/or column electrodes of a
TSD) and a second subset of the one or more processing modules 42
that are in communication and operative with a second subset of the
one or more DSCs 28 (e.g., those in communication with electrodes
of an e-pen or some other TSD).
[0220] In some examples, the first subset of the one or more
processing modules 42, a first subset of one or more DSCs 28, and a
first subset of one or more electrodes 85 are implemented within or
associated with a first TSD/1.sup.st device, and the second subset
of the one or more processing modules 42, a second subset of one or
more DSCs 28, and a second subset of one or more electrodes 85 are
implemented within or associated with a second TSD/2.sup.nd device.
The different respective devices (e.g., first and second) may be
similar type devices or different devices. For example, they may
both be devices that include touch sensors (e.g., without display
functionality). For example, they may both be devices that include
touchscreens (e.g., with display functionality). For example, the
first TSD/1.sup.st device may be a device that include touch
sensors (e.g., with or without display functionality), and the
second TSD/2.sup.nd device is an e-pen device.
[0221] In an example of operation and implementation, with respect
to the first subset of the one or more processing modules 42 that
are in communication and operative with a first subset of one or
more DSCs 28, a signal #1 is coupled from a first electrode 85 that
is in communication to a first DSC 28 of the first subset of one or
more DSCs 28 that is in communication and operative with the first
subset of the one or more processing modules 42 to a second
electrode 85 that is in communication to a first DSC 28 of the
second subset of one or more DSCs 28 that is in communication and
operative with the second subset of the one or more processing
modules 42.
[0222] When more than one DSC 28 is included within the first
subset of one or more DSCs 28, the signal #1 may also be coupled
from the first electrode 85 that is in communication to a first DSC
28 of the first subset of one or more DSCs 28 that is in
communication and operative with the first subset of the one or
more processing modules 42 to a third electrode 85 that is in
communication to a second DSC 28 of the second subset of one or
more DSCs 28 that is in communication and operative with the second
subset of the one or more processing modules 42.
[0223] Generally speaking, signals may be coupled between one or
more electrodes 85 that are in communication and operative with the
first subset of the one or more DSCs 28 associated with the first
subset of the one or more processing modules 42 and the one or more
electrodes 85 that are in communication and operative with the
second subset of the one or more DSCs 28 (e.g., signal #1, signal
#2). In certain examples, such signals are coupled from one
electrode 85 (e.g., such as associated with the first TSD/1.sup.st
device) to one or more other electrodes 85 (e.g., such as
associated with the second TSD/2.sup.nd device).
[0224] In some examples, these two different subsets of the one or
more processing modules 42 are also in communication with one
another (e.g., via communication effectuated via capacitive
coupling between a first subset of electrodes 85 serviced by the
first subset of the one or more processing modules 42 and a second
subset of electrodes 85 serviced by the first subset of the one or
more processing modules 42, via one or more alternative
communication means such as a backplane, a bus, a wireless
communication path, etc., and/or other means). In some particular
examples, these two different subsets of the one or more processing
modules 42 are not in communication with one another directly other
than via the signal coupling between the one or more electrodes 85
themselves.
[0225] A first group of one or more DSCs 28 is/are implemented
simultaneously to drive and to sense respective one or more signals
provided to a first of the one or more electrodes 85. In addition,
a second group of one or more DSCs 28 is/are implemented
simultaneously to drive and to sense respective one or more other
signals provided to a second of the one or more electrodes 85.
[0226] For example, a first DSC 28 is implemented simultaneously to
drive and to sense a first signal via a first sensor electrode 85.
A second DSC 28 is implemented simultaneously to drive and to sense
a second signal via a second sensor electrode 85. Note that any
number of additional DSCs implemented simultaneously to drive and
to sense additional signals to additional electrodes 85 as may be
appropriate in certain embodiments. Note also that the respective
DSCs 28 may be implemented in a variety of ways. For example, they
may be implemented within a device that includes the one or more
electrodes 85, they may be implemented within a TSD such as a
touchscreen that includes display functionality, they may be
distributed among a TSD that includes the one or more electrodes 85
that does not include display functionality, etc.
[0227] In this diagram as well as any other diagram herein, note
that the different respective signals that are driven and
simultaneously sensed via the electrodes 85 may be differentiated
from one another. For example, appropriate filtering and processing
can identify the various signals given their differentiation,
orthogonality to one another, difference in frequency, etc. Note
that the differentiation among the different respective signals
that are driven and simultaneously sensed by the various DSCs 28
may be differentiated based on any one or more characteristics such
as frequency, amplitude, modulation, modulation & coding
set/rate (MCS), forward error correction (FEC) and/or error
checking and correction (ECC), type, etc.
[0228] Other examples described herein and their equivalents
operate using any of a number of different characteristics other
than or in addition to frequency. Differentiation between the
signals based on frequency corresponds to a first signal has a
first frequency and a second signal has a second frequency
different than the first frequency. Differentiation between the
signals based on amplitude corresponds to a that if first signal
has a first amplitude and a second signal has a second amplitude
different than the first amplitude. Note that the amplitude may be
a fixed amplitude for a DC signal or the oscillating amplitude
component for a signal having both a DC offset and an oscillating
component. Differentiation between the signals based on DC offset
corresponds to a that if first signal has a first DC offset and a
second signal has a second DC offset different than the first DC
offset.
[0229] Differentiation between the signals based on modulation
and/or modulation & coding set/rate (MCS) corresponds to a
first signal has a first modulation and/or MCS and a second signal
has a second modulation and/or MCS different than the first
modulation and/or MCS. Examples of modulation and/or MCS may
include binary phase shift keying (BPSK), quadrature phase shift
keying (QPSK) or quadrature amplitude modulation (QAM), 8-phase
shift keying (PSK), 16 quadrature amplitude modulation (QAM), 32
amplitude and phase shift keying (APSK), 64-QAM, etc., uncoded
modulation, and/or any other desired types of modulation including
higher ordered modulations that may include even greater number of
constellation points (e.g., 1024 QAM, etc.). For example, a first
signal may be of a QAM modulation, and the second signal may be of
a 32 APSK modulation. In an alternative example, a first signal may
be of a first QAM modulation such that the constellation points
there and have a first labeling/mapping, and the second signal may
be of a second QAM modulation such that the constellation points
there and have a second labeling/mapping.
[0230] Differentiation between the signals based on FEC/ECC
corresponds to a first signal being generated, coded, and/or based
on a first FEC/ECC and a second signal being generated, coded,
and/or based on a second FEC/ECC that is different than the first
modulation and/or first FEC/ECC. Examples of FEC and/or ECC may
include turbo code, convolutional code, turbo trellis coded
modulation (TTCM), low density parity check (LDPC) code,
Reed-Solomon (RS) code, BCH (Bose and Ray-Chaudhuri, and
Hocquenghem) code, binary convolutional code (BCC), Cyclic
Redundancy Check (CRC), and/or any other type of ECC and/or FEC
code and/or combination thereof, etc. Note that more than one type
of ECC and/or FEC code may be used in any of various
implementations including concatenation (e.g., first ECC and/or FEC
code followed by second ECC and/or FEC code, etc. such as based on
an inner code/outer code architecture, etc.), parallel architecture
(e.g., such that first ECC and/or FEC code operates on first bits
while second ECC and/or FEC code operates on second bits, etc.),
and/or any combination thereof. For example, a first signal may be
generated, coded, and/or based on a first LDPC code, and the second
signal may be generated, coded, and/or based on a second LDPC code.
In an alternative example, a first signal may be generated, coded,
and/or based on a BCH code, and the second signal may be generated,
coded, and/or based on a turbo code. Differentiation between the
different respective signals may be made based on a similar type of
FEC/ECC, using different characteristics of the FEC/ECC (e.g.,
codeword length, redundancy, matrix size, etc. as may be
appropriate with respect to the particular type of FEC/ECC).
Alternatively, differentiation between the different respective
signals may be made based on using different types of FEC/ECC for
the different respective signals.
[0231] Differentiation between the signals based on type
corresponds to a first signal being or a first type and a second
signal being of a second generated, coded, and/or based on a second
type that is different than the first type. Examples of different
types of signals include a sinusoidal signal, a square wave signal,
a triangular wave signal, a multiple level signal, a polygonal
signal, a DC signal, etc. For example, a first signal may be of a
sinusoidal signal type, and the second signal may be of a DC signal
type. In an alternative example, a first signal may be of a first
sinusoidal signal type having first sinusoidal characteristics
(e.g., first frequency, first amplitude, first DC offset, first
phase, etc.), and the second signal may be of second sinusoidal
signal type having second sinusoidal characteristics (e.g., second
frequency, second amplitude, second DC offset, second phase, etc.)
that is different than the first sinusoidal signal type.
[0232] Note that any implementation that differentiates the signals
based on one or more characteristics may be used in this and other
embodiments, examples, and their equivalents.
[0233] FIG. 23A is a logic diagram of an embodiment of a method for
sensing a touch on a touch sensor device (TSD)(with or without
display functionality) in accordance with the present invention.
This diagram includes a logic diagram of an embodiment of a method
2301 for execution by one or more computing devices for sensing a
touch on a TSD that is executed by one or more processing modules
of one or various types (e.g., 42, 82, 1942 and/or 48 of other
figures included herein). The method 2301 begins at step 2300 where
the processing module generate a control signal (e.g., power
enable, operation enable, etc.) to enable a drive-sense circuit to
monitor the sensor signal on the electrode. The processing module
generates additional control signals to enable other drive-sense
circuits to monitor their respective sensor signals. In an example,
the processing module enables all of the drive-sense circuits for
continuous sensing for touches of the screen. In another example,
the processing module enables a first group of drive-sense circuits
coupled to a first group of row electrodes and enables a second
group of drive-sense circuits coupled to a second group of column
electrodes.
[0234] The method 2301 continues at step 2302 where the processing
module receives a representation of the impedance on the electrode
from a drive-sense circuit. In general, the drive-sense circuit
provides a drive signal to the electrode. The impedance of the
electrode affects the drive signal. The effect on the drive signal
is interpreted by the drive-sense circuit to produce the
representation of the impedance of the electrode. The processing
module does this with each activated drive-sense circuit in serial,
in parallel, or in a serial-parallel manner.
[0235] The method 2301 continues at step 2304 where the processing
module interprets the representation of the impedance on the
electrode to detect a change in the impedance of the electrode. A
change in the impedance is indicative of a touch. For example, an
increase in self-capacitance (e.g., the capacitance of the
electrode with respect to a reference (e.g., ground, etc.)) is
indicative of a touch on the electrode of a user or other element.
As another example, a decrease in mutual capacitance (e.g., the
capacitance between a row electrode and a column electrode) is also
indicative of a touch and/or presence of a user or other element
near the electrodes. The processing module does this for each
representation of the impedance of the electrode it receives. Note
that the representation of the impedance is a digital value, an
analog signal, an impedance value, and/or any other analog or
digital way of representing a sensor's impedance.
[0236] The method 2301 continues at step 2306 where the processing
module interprets the change in the impedance to indicate a touch
and/or presence of a user or other element of the TSD in an area
corresponding to the electrode. For each change in impedance
detected, the processing module indicates a touch and/or presence
of a user or other element. Further processing may be done to
determine if the touch is a desired touch or an undesired
touch.
[0237] FIG. 23B is a schematic block diagram of an embodiment 2302
of a drive sense circuit in accordance with the present invention.
this diagram includes a schematic block diagram of an embodiment of
a drive sense circuit 28-18 that includes a first conversion
circuit 2310 and a second conversion circuit 2312. The first
conversion circuit 2310 converts an electrode signal 2316
(alternatively a sensor signal, such as when the electrode 85
includes a sensor, etc.) into a signal 2320 that is representative
of the electrode signal and/or change thereof (e.g., note that such
a signal may alternatively be referred to as a sensor signal, a
signal representative of a sensor signal and/or change thereof,
etc. such as when the electrode 85 includes a sensor, etc.). The
second conversion circuit 2312 generates the drive signal component
2314 from the sensed signal 2312. As an example, the first
conversion circuit 2310 functions to keep the electrode signal 2316
substantially constant (e.g., substantially matching a reference
signal) by creating the signal 2320 to correspond to changes in a
receive signal component 2318 of the sensor signal. The second
conversion circuit 2312 functions to generate a drive signal
component 2314 of the sensor signal based on the signal 2320
substantially to compensate for changes in the receive signal
component 2318 such that the electrode signal 2316 remains
substantially constant.
[0238] In an example, the electrode signal 2316 (e.g., which may be
viewed as a power signal, a drive signal, a sensor signal, etc.
such as in accordance with other examples, embodiments, diagrams,
etc. herein) is provided to the electrode 85 as a regulated current
signal. The regulated current (I) signal in combination with the
impedance (Z) of the electrode creates an electrode voltage (V),
where V=I*Z. As the impedance (Z) of electrode changes, the
regulated current (I) signal is adjusted to keep the electrode
voltage (V) substantially unchanged. To regulate the current
signal, the first conversion circuit 2310 adjusts the signal 2320
based on the receive signal component 2318, which is indicative of
the impedance of the electrode and change thereof. The second
conversion circuit 2312 adjusts the regulated current based on the
changes to the signal 2320.
[0239] As another example, the electrode signal 2316 is provided to
the electrode 85 as a regulated voltage signal. The regulated
voltage (V) signal in combination with the impedance (Z) of the
electrode creates an electrode current (I), where I=V/Z. As the
impedance (Z) of electrode changes, the regulated voltage (V)
signal is adjusted to keep the electrode current (I) substantially
unchanged. To regulate the voltage signal, the first conversion
circuit 2310 adjusts the signal 2320 based on the receive signal
component 2318, which is indicative of the impedance of the
electrode and change thereof. The second conversion circuit 2312
adjusts the regulated voltage based on the changes to the signal
2320.
[0240] FIG. 24 is a schematic block diagram of another embodiment
2400 of a drive sense circuit in accordance with the present
invention. this diagram includes a schematic block diagram of
another embodiment of a drive sense circuit 28 that includes a
first conversion circuit 2310 and a second conversion circuit 2312.
The first conversion circuit 2310 includes a comparator (comp) and
an analog to digital converter 2430. The second conversion circuit
2312 includes a digital to analog converter 2432, a signal source
circuit 2433, and a driver.
[0241] In an example of operation, the comparator compares the
electrode signal 2316 (alternatively, a sensor signal, etc.) to an
analog reference signal 2422 to produce an analog comparison signal
2424. The analog reference signal 2424 includes a DC component
and/or an oscillating component. As such, the electrode signal 2316
will have a substantially matching DC component and/or oscillating
component. An example of an analog reference signal 2422 is also
described in greater detail with reference to FIG. 7 such as with
respect to a power signal graph.
[0242] The analog to digital converter 2430 converts the analog
comparison signal 2424 into the signal 2320. The analog to digital
converter (ADC) 2430 may be implemented in a variety of ways. For
example, the (ADC) 2430 is one of: a flash ADC, a successive
approximation ADC, a ramp-compare ADC, a Wilkinson ADC, an
integrating ADC, a delta encoded ADC, and/or a sigma-delta ADC. The
digital to analog converter (DAC) 2432 may be a sigma-delta DAC, a
pulse width modulator DAC, a binary weighted DAC, a successive
approximation DAC, and/or a thermometer-coded DAC.
[0243] The digital to analog converter (DAC) 2432 converts the
signal 2320 into an analog feedback signal 2426. The signal source
circuit 2433 (e.g., a dependent current source, a linear regulator,
a DC-DC power supply, etc.) generates a regulated source signal
2435 (e.g., a regulated current signal or a regulated voltage
signal) based on the analog feedback signal 2426. The driver
increases power of the regulated source signal 2435 to produce the
drive signal component 2314.
[0244] FIG. 25 is a schematic block diagram of an embodiment 2500
of a DSC that is interactive with an electrode in accordance with
the present invention. Similar to other diagrams, examples,
embodiments, etc. herein, the DSC 28-a2 of this diagram is in
communication with one or more processing modules 42. The DSC 28-a2
is configured to provide a signal (e.g., a power signal, an
electrode signal, transmit signal, a monitoring signal, etc.) to
the electrode 85 via a single line and simultaneously to sense that
signal via the single line. In some examples, sensing the signal
includes detection of an electrical characteristic of the electrode
that is based on a response of the electrode 85 to that signal.
Examples of such an electrical characteristic may include detection
of an impedance of the electrode 85 such as a change of capacitance
of the electrode 85, detection of one or more signals coupled into
the electrode 85 such as from one or more other electrodes, and/or
other electrical characteristics.
[0245] This embodiment of a DSC 28-a2 includes a current source
110-1 and a power signal change detection circuit 112-a1. The power
signal change detection circuit 112-a1 includes a power source
reference circuit 130 and a comparator 132. The current source
110-1 may be an independent current source, a dependent current
source, a current mirror circuit, etc.
[0246] In an example of operation, the power source reference
circuit 130 provides a current reference 134 with DC and
oscillating components to the current source 110-1. The current
source generates a current as the power signal 116 based on the
current reference 134. An electrical characteristic of the
electrode 85 has an effect on the current power signal 116. For
example, if the impedance of the electrode 85 decreases and the
current power signal 116 remains substantially unchanged, the
voltage across the electrode 85 is decreased.
[0247] The comparator 132 compares the current reference 134 with
the affected power signal 118 to produce the signal 120 that is
representative of the change to the power signal. For example, the
current reference signal 134 corresponds to a given current (I)
times a given impedance (Z). The current reference generates the
power signal to produce the given current (I). If the impedance of
the electrode 85 substantially matches the given impedance (Z),
then the comparator's output is reflective of the impedances
substantially matching. If the impedance of the electrode 85 is
greater than the given impedance (Z), then the comparator's output
is indicative of how much greater the impedance of the electrode 85
is than that of the given impedance (Z). If the impedance of the
electrode 85 is less than the given impedance (Z), then the
comparator's output is indicative of how much less the impedance of
the electrode 85 is than that of the given impedance (Z).
[0248] FIG. 26 is a schematic block diagram of another embodiment
2600 of a DSC that is interactive with an electrode in accordance
with the present invention. Similar to other diagrams, examples,
embodiments, etc. herein, the DSC 28-a3 of this diagram is in
communication with one or more processing modules 42. Similar to
the previous diagram, although providing a different embodiment of
the DSC, the DSC 28-a3 is configured to provide a signal to the
electrode 85 via a single line and simultaneously to sense that
signal via the single line. In some examples, sensing the signal
includes detection of an electrical characteristic of the electrode
85 that is based on a response of the electrode 85 to that signal.
Examples of such an electrical characteristic may include detection
of an impedance of the electrode 85 such as a change of capacitance
of the electrode 85, detection of one or more signals coupled into
the electrode 85 such as from one or more other electrodes, and/or
other electrical characteristics.
[0249] This embodiment of a DSC 28-a3 includes a voltage source
110-2 and a power signal change detection circuit 112-a2. The power
signal change detection circuit 112-a2 includes a power source
reference circuit 130-2 and a comparator 132-2. The voltage source
110-2 may be a battery, a linear regulator, a DC-DC converter,
etc.
[0250] In an example of operation, the power source reference
circuit 130-2 provides a voltage reference 136 with DC and
oscillating components to the voltage source 110-2. The voltage
source generates a voltage as the power signal 116 based on the
voltage reference 136. An electrical characteristic of the
electrode 85 has an effect on the voltage power signal 116. For
example, if the impedance of the electrode 85 decreases and the
voltage power signal 116 remains substantially unchanged, the
current through the electrode 85 is increased.
[0251] The comparator 132 compares the voltage reference 136 with
the affected power signal 118 to produce the signal 120 that is
representative of the change to the power signal. For example, the
voltage reference signal 134 corresponds to a given voltage (V)
divided by a given impedance (Z). The voltage reference generates
the power signal to produce the given voltage (V). If the impedance
of the electrode 85 substantially matches the given impedance (Z),
then the comparator's output is reflective of the impedances
substantially matching. If the impedance of the electrode 85 is
greater than the given impedance (Z), then the comparator's output
is indicative of how much greater the impedance of the electrode 85
is than that of the given impedance (Z). If the impedance of the
electrode 85 is less than the given impedance (Z), then the
comparator's output is indicative of how much less the impedance of
the electrode 85 is than that of the given impedance (Z).
[0252] With respect to many of the following diagrams, one or more
processing modules 42, which includes and/or is coupled to memory,
is configured to communicate and interact with one or more DSCs 28
the coupled to one or more electrodes of the panel or a touchscreen
display such as may be implemented within a touch sensor device
(TSD)(with or without display functionality). In many of the
diagrams, the DSCs 28 are shown as interfacing with electrodes of
the panel or touchscreen display (e.g., via interface 86 that
couples to row electrodes and another interface 86 that couples to
column electrodes). Note that the number of lines that coupled the
one or more processing modules 42 to the respective one or more
DSCs 28, and from the one or more DSCs 28 to the respective
interfaces 86 may be varied (e.g., such as may be described by n
and m, which are positive integers greater than or equal to 1).
Note that the respective values may be the same or different within
different respective embodiments and/or examples herein.
[0253] Note that the same and/or different respective signals may
be driven simultaneously sensed by the respective one or more DSCs
28 that couple to electrodes 85 within any of the various
embodiments and/or examples herein. In some examples, a common
signal (e.g., having common one or more characteristics) is
implemented in accordance with self signaling, and different
respective signals (e.g., different respective signals having one
or more different characteristics) are implemented in accordance
with mutual signaling as described below. Again, as mentioned
above, note that the different respective signals that are driven
and simultaneously sensed via the electrodes 85 may be
differentiated from one another.
[0254] FIG. 27 is a schematic block diagram of various embodiments
2701 through 2707 of touch sensor devices (TSDs), which may or may
not include display functionality via a touchscreen display, an
liquid crystal display (LCD) operable display, a light emitting
diode (LED) operable display, and/or other visual output component,
in accordance with the present invention. For example, one or more
means of providing visual output that may be observed by a user may
be implemented within a TSD. Such a means may be an LED that is
eliminated when the TSD is operational. Such a means may
alternatively be a display, such as in accordance with a
touchscreen display associated with at least a portion of the TSD.
Such a means may alternatively be a display such as implemented on
a pager type device such as including one or more lines configured
to display textual information. Note that such a TSD may be
implemented with or without such visual output functionality.
[0255] One or more touch sensors are implemented on one or more
surfaces of a TSD. For example, a TSD may be implemented to have
any desired shape, and one or more touch sensors are implemented on
one or more surfaces of that particular shape. In certain examples,
one or more touch sensors are implemented on all of surfaces of
that particular shape. For example, one or more electrodes are
implemented on one or more surfaces of the TSD to facilitate
capacitive coupling in accordance with detecting user interaction
with the TSD (e.g., such as based on a finger, hand, or other part
of a user, from a stylus associated with a user, and/or from active
element such as an e-pen, another TSD, etc. associated with a user)
and/or in accordance with detecting one or more signals being
coupled into the one or more electrodes of the TSD (e.g., such as
from active element such as an e-pen, another TSD, etc. associated
with a user). Also, note that the one or more electrodes may be
implemented underneath a protective layer on the surface of the TSD
through which capacitive coupling may still be made to the one or
more electrodes through the protective layer.
[0256] Note that the one or more electrodes are coupled to one or
more DSCs that are in communication with one or more processing
modules, as described with respect to other diagrams herein (e.g.,
including FIG. 21, 22, etc.).
[0257] Referring to the diagram, TSD 2701 has a flat surface that
is generally square in shape and has a particular thickness. In
addition, in certain examples, the TSD 2701 one or more holes or
voids. Such vacancies can include touch sensor functionality (e.g.,
the surface inside of the hole or void includes electrodes). Also,
such vacancies also provide for other components to be implemented
therein. For example, one or more other devices (e.g., such as a
camera, a speaker, a mounting screw, a credit card reader, etc.)
may be implemented within the one or more holes or voids. Note that
the TSD functionality as described herein (e.g., using one or more
DSCs coupled to one or more processing modules and electrodes)
enables full TSD functionality right up to the edge of the holes or
voids.
[0258] TSD 2702 is similar to TSD 2701 with at least one difference
being that it generally has a rectangular shape and a particular
thickness. In addition, in certain examples, the TSD 2702 one or
more holes or voids. TSD 2703 includes multiple sections that
facilitate changing of the configuration of the TSD based on how
those particular sections are arranged next to one another. TSD
2704a has a flat surface that is generally circular or oval and has
a particular thickness. TSD 2704b also has a flat surface that is
generally circular or oval and has a particular thickness and
includes a hole or void therein. For example, a variant of the TSD
2704b may be in the shape of a steering wheel, a navigational
wheel, an aircraft control wheel, etc.
[0259] TSD 2705 and TSD 2706 include non-flat/curved surfaces. For
example, note that a TSD may be implemented to have any desired
shape, and one or more electrodes may be implemented on any of the
one or more surfaces of the TSD including any non-flat/curved
surfaces. For example, TSD 2705 and 2706 may be viewed as having a
shape similar to various styles and options of a computer
mouse.
[0260] TSD 2707 includes multiple portions such that one portion
corresponds to a touch sensor region, such as may be implemented
using a touchscreen, and also includes a casing/bezel that may or
may not include touch sensors. For example, the TSD 2707 may be
implemented such that touch sensor functionality is included only
within the touch sensor region and not within the casing/bezel
thereof. T
[0261] FIG. 28A is a schematic block diagram of other various
embodiments 2801 through 2809 of TSDs which may or may not include
display functionality via a touchscreen display, an liquid crystal
display (LCD) operable display, a light emitting diode (LED)
operable display, and/or other visual output component, as well as
3-D geometric objects, which may or may not include TSD
functionality, in accordance with the present invention.
[0262] With respect to those TSDs, such as 3-D geometric objects
that include TSD functionality, data communication signaling may be
made between two devices (e.g., such as with respect to FIG. 22) to
provide information beyond merely positional, gesture, movement,
proximity, etc. related information such that data is included
within the signals coupled between electrodes of the two devices.
In addition, in certain examples, user interaction that is detected
by a first device may be communicated to the second device via such
data communication signals.
[0263] In addition, consider a 3-D geometric object that does not
include TSD functionality. In certain examples, such a 3-D
geometric object is constructed so as to improve coupling from a
user to a TSD through the 3-D geometric object. For example, the
3-D geometric object includes material that is a dielectric loaded
material with a very high dielectric strength. In certain examples,
the 3-D geometric object includes material such as small particles,
e.g., spheres or some other shapes, that are not conductive but
provide serve as a high dielectric with a very high dielectric
strength.
[0264] In another example, the 3-D geometric object includes one
more conductors extending from one surface to another (e.g.,
through the 3-D geometric object, from top to bottom) so as to
improve coupling from a user to a TSD through the 3-D geometric
object.
[0265] This diagram provides additional examples by which the TSD
may be implemented. TSD 2801 includes a cube, squared shape. TSD
2802 includes a triangular shape. TSD 2803 includes a pyramid
shape. TSD 2804 includes a cone shape. TSD 2805 includes a game
controller shape, such as may be used in accordance with the gaming
system. The TSD 2805 having the game controller shape may include
one or more of a button, a lever, a joystick, etc. Note that an
active device, such as an e-pen 2806 may also be configured to
interact with one or more TSDs.
[0266] Also, an overlay 2820, which may be implemented to have any
particular desired shape may be used in conjunction with a TSD. For
example, the overlay 2820 may be implemented to have any desired
form or shape, such as that of the keyboard, keypad, a number pad,
a mouse pad, a touch pad, a gaming board such as a chess or
checkerboard, etc. Generally speaking, such an overlay may have any
desired form. For example, when the overlay 2020 is placed on the
TSD, a user can then interact with the overlay that is placed on
the TSD to provide user input. Consider an example in which the
overlay 2820 is that of a keyboard, then as the overlay 2820 is
placed on the TSD, the user can interact with the overlay 2820 that
is the keyboard to effectuate keyboard functionality via TSD. For
example, the one or more processing modules of the TSD interprets
user interaction with the TSD based on the portion of the TSD that
is associated with the overlay 2820 as corresponding to user input
provided via a keyboard.
[0267] Note that the overlay 2820 may be implemented using any of a
variety of types of materials. Considering an example, the overlay
2820 may be implemented using a rigid material to provide tactile
feedback and sensation to the user similar to how an actual
keyboard provides to user. The overlay 2820 may include plastic
buttons/keys similar to an actual keyboard such that, when the
plastic buttons/keys are depressed by the user, they react similar
to a keyboard as physically moving downward when selected by the
user and returning to their original position when the user ceases
contacting them. Considering another example, the overlay 2820 is
implemented to include one or more actuators to provide feedback in
the form of physical sensation to a user of the overlay 2820, such
as providing a desired degree of movement of one or more portions
of the overlay 2820 that may be felt by a user when interacting
with the overlay 2820.
[0268] In even other examples, the overlay 2820 may include
buttons/keys that implemented based on dome switches. In even other
examples, the overlay 2820 may include buttons/keys that
implemented based on scissor-switch mechanisms. For example, any of
a number of means may be used to implement buttons/keys of the
overlay 2820 such as to provide audio output, such as a clicking
sound, when the keys are depressed, in a manner that certain
keywords do. For example, the overlay 2820 may be implemented using
appropriate means to provide a desired amount of tactile, audio,
etc. feedback to the user in accordance with providing a user
experience when interacting with the overlay 2820 that is similar
to that of an actual keyboard. In some examples, the overlay 2820
is a passive device that is configured to facilitate user
interaction with the TSD in a particular manner corresponding to
the form of the overlay 2820. For example, the overlay 2820 may be
implemented using polymer material, plastic material, some type of
dielectric material, etc. so that capacitive coupling from a user
interacting with the overlay 2820 is detected by the TSD.
[0269] In certain examples, a TSD is implemented to detect
location, position, placement, etc. of the overlay 2820, such as
based on one or more marker electrodes, other conductive elements,
conductive material included within a particular colored pigment
used to form and/or print at least some portions of the overlay
2820 such as Titanium Oxide or other conductive material, etc.
included within the overlay 2820. For example, consider an overlay
2820 that is formed and/or printed using a silicon material of the
first color, such as white or clear color, compared to another
overlay 2820 that is formed and/or printed using a silicon material
of a second color, such as black. Such an overlay 2820 that is
formed using one of the colors may include better conductive
properties than an overlay 2820 that is formed using another one of
the colors. In some examples, it may be preferable to use a
particular color to form and/or print such an overlay 2820
facilitate better identification of the overlay 2820, including its
location, position, placement, etc. by the TSD. For example, the
perimeter of the overlay 2820 and/or the perimeters of respective
keys of the overlay 2820 may be printed with a particular colored
pigment to facilitate better conductivity and detection by the TSD.
In some instances, the respective keys themselves are printed using
one particular colored pigment that has a conductivity that is
greater than portions of the overlay 2820 that do not correspond to
keys. In such an instance, the TSD is configured to detect the
arrangement of the respective keys of the overlay 2020.
[0270] As shown on the upper right-hand side of the diagram, with
respect to reference numeral 2807, a TSD may be implemented as a
lap desk that may be placed on a lap of the user who is sitting.
Also, in certain alternative examples, one or more of an overlay,
3-D geometric objects, another TSD, etc. may be configured to
facilitate user interaction with the TSD 2807 that is implemented
as a lap desk.
[0271] The bottom of the diagram shows tables 2808 and 2809 that
include one or more TSDs. For example, the surface of the table
2808 is implemented to include TSD functionality. For example, one
or more electrodes of the TSD are implemented on the surface of the
table. The table 2809 is implemented using multiple
elements/sections, and one or more of these multiple
elements/sections may include TSD functionality. In one example,
each of the respective elements/sections of the top of the table
2809 includes TSD functionality. In another example, fewer than all
of the elements/sections of the top of the table 2809 includes TSD
functionality (e.g., the section implemented as a backing or rear
barrier of the surface of the table 2809 may be implemented not to
include TSD functionality).
[0272] Generally speaking, note that such TSD functionality may be
included within any number of devices having any number of various
shapes, forms, configurations, etc. These examples are
representative and not exhaustive of all possible shapes, forms,
configurations, etc. of devices that may be implemented to include
TSD functionality. Generally speaking, one or more electrodes may
be included within any desired object, element, etc. to provide TSD
functionality for that object, elements, etc.
[0273] FIG. 28B is a schematic block diagram of other various
embodiments of TSDs which may or may not include display
functionality via a touchscreen display, an liquid crystal display
(LCD) operable display, a light emitting diode (LED) operable
display, and/or other visual output component in accordance with
the present invention.
[0274] For example, table 2901 includes a curved surface such that
it bends upwards at one end. Note that such a table may
alternatively be implemented to include any number of non-flat
shapes or surfaces such as a pyramid shaped portion extending
upward, a dome portion extending upward, etc. such as in the middle
or another location on the surface of the table. Alternatively, the
surface of the table may include a wavy surface that flows up and
down across the surface of the table. Table 2902 includes a wavy
surface. Table 2903 includes multiple elements or sections and at
least one has one or more 3-D geometric objects, which may or may
not include TSD functionality, placed thereon. In some example, one
or more of these 3-D geometric objects is made of glass or some
other transparent material that may be illuminated by the table
surface (e.g., when the table is implemented as a TSD that includes
display functionality such as a touchscreen or with some other
display or output functionality such as LEDs, etc.). In some
examples, the one or more of these 3-D geometric objects is an
active device includes an action figure type shape (e.g., in the
form or a Disney character, a cartoon character, etc.) such that it
receives data signal communication from the table (e.g., via
capacitive coupling from electrodes in the table to electrodes in
the action figure type shape, and the action figure type shape is
may be interactive with a user of the table (e.g., include a
speaker to provide audio output, include one or more actuators to
effectuate mouth, hand, head, etc. movement, etc.).
[0275] In addition, note that the one or more 3-D geometric objects
may be implemented to includes light pipes such it includes is
configured to display information thereon such as based on light
signals provided up from the table (e.g., when the table is
implemented as a TSD that includes display functionality such as a
touchscreen or with some other display or output functionality such
as LEDs, etc.).
[0276] FIG. 29 is a schematic block diagram of various embodiments
2901 through 2904 of a 3-D geometric objects, which may or may not
include TSD functionality, that is operative with a TSD in
accordance with the present invention.
[0277] Embodiment 2901 includes a touch sensor device (TSD) 2910
that is configured to facilitate user interaction with a 3-D
geometric object, shown in this example as a cone. The 3-D
geometric object may or may not include TSD functionality. For
example, consider embodiment 2904 in the upper right portion of the
diagram as including a 3-D geometric object that does include TSD
functionality, then a transmit identification (TX ID) signal may be
transmitted from the 3-D geometric object, such as via one or more
electrodes included within the 3-D geometric object, to convey one
or more characteristics associated with the 3-D geometric object to
the TSD 2910. For example, such one or more characteristics may
include the identity, type, shape, form, functionality, function,
capabilities, etc. of the 3-D geometric object to the TSD 2910.
Such a TX ID signal may be implemented in any number of ways, such
as including a particular frequency, signal pattern, packet
content, and/or any other one or more characteristics that may be
used to inform the TSD 2910 of the one or more characteristics
associated with the 3-D geometric object.
[0278] Considering embodiment 2901 in the upper left portion of the
diagram, as a user is interacting with the 3-D geometric object,
the position and/or any motion of the 3-D geometric object may be
detected by the TSD 2910. For example, as the user is interacting
with the 3-D geometric object, such as placing it in a particular
location, moving it in a particular manner, etc., the TSD 2910 is
configured to detect the portion of the user's body, such as hand
and/or fingers, in accordance with such user interaction. In some
examples, the TSD 2910 is configured to detect touch, proximity,
etc. of the portion of the user's body based on capacitive coupling
of that portion of the user's body to one or more electrodes
included within the TSD 2910. In other examples, the TSD 2910 is
configured to detect location, movement, etc. of the 3-D geometric
object itself, such as based on one or more marker electrodes,
other conductive elements, conductive material included within
pigment used to form and/or print at least some portions of the 3-D
geometric object such as Titanium Oxide or other conductive
material, etc. included within the 3-D geometric object. In even
other examples, the TSD 2910 is configured to detect location,
movement, etc. of the 3-D geometric object based on the 3-D
geometric object including TSD functionality, such as with
reference to embodiment 2904, where the 3-D geometric object is
capable to transmit one or more signals to the TSD 2910.
[0279] Considering embodiment 2902 in the lower left portion of the
diagram, the location, movement, etc. of an e-pen (e.g., based on
being user-controlled) may be determined based on one or more
signals being capacitively coupled from the e-pen to the TSD 2910
and/or one or more signals being capacitively coupled from the TSD
2910 to the e-pen. Any of a number of user-controlled effects may
be detected by the e-pen and/or the TSD 2910. Examples of such
effects may include motion, tilt, pressure, barrel rotation, etc.
In addition, as a user controls position, location, movement, etc.
of the e-pen, inking may be displayed on one or more display
devices based on such user control of the e-pen. In some examples,
the TSD 2910 self includes display functionality, and inking is
displayed on the display of the TSD 2910 based on user control of
the e-pen and interaction of the e-pen with the TSD 2910. In other
examples, a display that is a separate element from the TSD 2910
displays inking there on based on communications from the TSD 2910
to the display that is a separate element from the TSD 2910 based
on such user control of the e-pen.
[0280] Considering embodiment 2903 in the lower right portion of
the diagram, multiple 3-D geometric objects are configured to
facilitate user interaction with the TSD 2910 simultaneously,
concurrently, etc. that is to say, more than one 3-D geometric
object, whether the 3-D geometric object includes TSD functionality
or not, may be interactive with the TSD 2910 simultaneously,
concurrently, etc. such that user interaction with multiple 3-D
geometric objects and the TSD 2910 can all be monitored and
detected at the same time. For example, consider a user interacting
with an e-pen using a left-hand and interacting with a 3-D
geometric object in the shape of a cone using a right-hand. Such
user interaction with both of the objects may be detected by the
TSD 2910 at the same time.
[0281] FIG. 30 is a schematic block diagram of an embodiment 3000
of an overlay that is operative with a TSD in accordance with the
present invention. In this diagram, and overlay 3020, which may be
of any desired form, such as a keyboard, keypad, number pad, etc.
and/or any other form, etc. is configured to be placed on a TSD
3010, as shown at the top of the diagram. As can be seen at the
bottom of the diagram, consider the surface of the TSD 3010 prior
to and after the overlay 3020 being placed thereon. After the
overlay 3020 is placed on the surface of the TSD 3010, a first
portion of the TSD 3010 is operative for an provision for user
interaction with the TSD 3010 based on the overlay 3020. When the
overlay 3020 is placed on the surface of the TSD 3010, the touch
sensing functionality of that particular portion of the TSD 3010 is
then provisioned to operate in accordance with the function
associated with the overlay 3020. For example, consider that the
overlay 3020 corresponds to that of the keyboard, then the touch
sensing functionality of the TSD 3010 that is located under the
overlay 3020 is then provisioned to detect user interaction with
the TSD 3010 in accordance with operation of the keyboard that
corresponds to the physical layout of the overlay 3020.
[0282] Any remaining portion of the TSD 3010 that does not include
or is not associated with the overlay 3020 may be used for any one
or more other purposes. For example, the remaining portion of the
TSD 3010 may be operative for non-overlay functionality. For
example, touch, proximity, etc. detection of user interaction may
be performed using the remaining portion of the TSD 3010. In some
examples, the sensitivity of the remaining portion of the TSD 3010
is unchanged after the overlay 3020 is placed on the first portion
of the TSD 3010. In other examples, the sensitivity of the
remaining portion of the TSD 3010 is modified (e.g., reduced
sensitivity, increased sensitivity, disabled, etc.) after the
overlay 3020 is placed on the first portion of the TSD 3010. In
even other examples, the remaining portion of the TSD 3010 is
disabled after the overlay 3020 is placed on the first portion of
the TSD 3010.
[0283] FIG. 31 is a schematic block diagram of another embodiment
3100 of an overlay that is operative with a TSD in accordance with
the present invention. This diagram has some similarities to the
previous diagram with at least one difference being that more than
one overlay is placed on a TSD 3110. For example, consider two
separate overlays 3120 and 3122, which may be of any desired form,
such as keyboards, keypads, number pads, etc. and/or any other
forms, etc. are configured to be placed on a TSD 3110, as shown at
the top of the diagram. Note that the overlays may be of different
size, shape, form, function, etc. When the overlays 3120 and 3122
are placed on the surface of the TSD 3110, the touch sensing
functionality of those particular portions of the TSD 3110 are then
provisioned to operate in accordance with the function associated
with the overlays 3120 and 3122. For example, the overlay 3120 may
correspond to that of a keyboard, and the overlay 3122 may
correspond to that of a number pad. Then, the touch sensing
functionality of the TSD 3110 that is located under the overlay
3120 is then provisioned to detect user interaction with the TSD
3110 in accordance with operation of the keyboard that corresponds
to the physical layout of the overlay 3120, and the touch sensing
functionality of the TSD 3110 that is located under the overlay
3122 is then provisioned to detect user interaction with the TSD
3110 in accordance with operation of the number pad that
corresponds to the physical layout of the overlay 3122.
[0284] As also described with respect to the previous diagram, any
remaining portion of the TSD 3110 that does not include boys not
associated with the overlays 3120 and 3122 may be used for one or
more other purposes (e.g., non-overlay functionality, changed or
unchanged sensitivity, disabled, etc.).
[0285] FIG. 32 is a schematic block diagram of an embodiment of
3200 an overlay and a 3-D geometric object, which may or may not
include TSD functionality, that are both operative with a TSD in
accordance with the present invention. This diagram has some
similarities to the previous diagram with at least one difference
being that an overlay 3220 as well as a 2.sup.nd TSD/3-D geometric
object 3212 are configured to facilitate user interaction with a
TSD 3210. Again, the overlay 3220 may be of any desired form, such
as the keyboard, keypad, number pad, etc.
[0286] The 2.sup.nd TSD/3-D geometric object 3212, which may or may
not include TSD functionality, is configured to facilitate user
interaction with the TSD 3210. In one example, the 2.sup.nd TSD/3-D
geometric object 3212 is an active device that includes one or more
electrodes that are coupled to one or more DSCs that service them,
and the DSC are coupled to one or more processing modules. Based on
user interaction with the 2.sup.nd TSD/3-D geometric object 3212,
the TSD 3210 is configured to detect location, movement, etc. of
the 2.sup.nd TSD/3-D geometric object 3212 based on that user
interaction with it based on one or both of one or more signals
being coupled and detected between the 2.sup.nd TSD/3-D geometric
object 3212 is an active device and the TSD 3210 and detection of
one or more portions of the users body associated with the 2.sup.nd
TSD/3-D geometric object 3212 is an active device.
[0287] In another example, the 2.sup.nd TSD/3-D geometric object
3212 is not an active device (e.g., a passive device), the TSD 3210
is configured to determine location, movement, etc. of the 2.sup.nd
TSD/3-D geometric object 3212 based on detection of one or more
portions of the users body associated with the 2.sup.nd TSD/3-D
geometric object 3212.
[0288] In addition, the overlay 3220 is configured to facilitate
user interaction with the TSD 3220 based on the characteristics of
the overlay 3220, such as the type of the overlay 3220, the
physical layout of the overlay 3220, the prescribed function of the
overlay 3220 in accordance with user interaction therewith,
etc.
[0289] In an example of operation and implementation, a TSD (e.g.,
TSD 3210 or any other TSD described herein or their equivalents)
includes a plurality of TSD electrodes associated with a surface of
the TSD. Also, an overlay that includes one or more marker
electrodes also being associated with at least a portion of the
surface of the TSD. The TSD also includes a plurality of
drive-sense circuits (DSCs) operably coupled to the plurality of
TSD electrodes. A DSC of the plurality of DSCs is operably coupled
to receive a reference signal and to generate a TSD electrode
signal based on the reference signal. For example, when enabled,
the DSC operably coupled and configured to provide the TSD
electrode signal to a TSD electrode of the plurality of TSD
electrodes and simultaneously to sense a change of the TSD
electrode signal based on a change of impedance of the TSD
electrode caused by capacitive coupling between the TSD electrode
and the one or more marker electrodes based on the overlay being
associated with the at least a portion of the surface of the TSD.
The DSC is also operably coupled and configured to generate a
digital signal that is representative of the change of impedance of
the TSD electrode.
[0290] The TSD also includes and/or is coupled to memory that
stores operational instructions. The TSD also includes one or more
processing modules operably coupled to the plurality of DSCs and
the memory. For example, when enabled, the one or more processing
modules is configured to execute the operational instructions to
generate the reference signal and to process the digital signal to
determine one or more characteristics of the overlay that is
associated with the at least a portion of the surface of the
TSD.
[0291] In certain examples, another DSC of the plurality of DSCs is
operably coupled to receive another reference signal and to
generate another TSD electrode signal based on the other reference
signal. When enabled, the other DSC operably coupled and configured
to provide the other TSD electrode signal to another TSD electrode
of the plurality of TSD electrodes that is implemented within the
at least a portion of the surface of the TSD with which the overlay
is associated and simultaneously to sense a change of the other TSD
electrode signal based on a change of impedance of the other TSD
electrode caused by a proximal touch to the at least a portion of
the surface of the TSD with which the overlay is associated. The
DSC is also operably coupled and configured generate another
digital signal that is representative of the change of impedance of
the other TSD electrode.
[0292] The one or more processing modules, when enabled, is further
configured to execute the operational instructions to generate the
other reference signal and to process the other digital signal to
determine location of the proximal touch to the at least a portion
of the surface of the TSD with which the overlay is associated.
[0293] In certain examples, the one or more processing modules,
when enabled, is further configured to execute the operational
instructions to determine user interaction with a portion of the
overlay based on the location of the proximal touch to the at least
a portion of the surface of the TSD with which the overlay is
associated. Also, the one or more processing modules is further
configured to generate an output signal that is representative of
the user interaction with the portion of the overlay and transmit
the output signal to a computing device to be interpreted by the
computing device as user input.
[0294] Examples of the one or more characteristics of the overlay
may include any one or more of an outline of the overlay, locations
of keys of the overlay, a location of the overlay on the surface of
the TSD, location of the one or more marker electrodes within the
at least a portion of the surface of the TSD, a pattern of the one
or more marker electrodes, a function of the overlay, a type of the
overlay, and/or an orientation of the overlay.
[0295] Also, in certain examples, the TSD is a portable device that
includes an internal power source (e.g., such as with respect to
FIG. 36).
[0296] Also, in some implementations of the TSD, note that the
plurality of TSD electrodes includes a first subset of the
plurality of TSD electrodes aligned in a first direction and a
second subset of the plurality of TSD electrodes that are separated
from the first subset of the plurality of TSD electrodes by a
dielectric material and are aligned in a second direction.
[0297] In addition, in some examples, the TSD includes multiple
sections (e.g., such as certain TSDs including depicted in FIGS.
27, 28, 34, 40, among others). The TSD has a first shape when the
multiple sections are implemented within a first configuration, and
the TSD has a second shape when the multiple sections are
implemented within a second configuration. Also, note that certain
implementations of the TSD include a non-flat surface and/or curved
surface (e.g., such as certain TSDs including depicted in FIG. 27,
among others).
[0298] In addition, note that the DSC of the plurality of DSCs may
be implemented in a variety of ways. In certain examples, the DSC
includes a power source circuit operably coupled via a single line
to the TSD electrode. When enabled, the power source circuit is
configured to provide an analog signal via the single line coupling
to the TSD electrode. Note that the analog signal includes at least
one of a DC (direct current) component or an oscillating component.
The DSC also includes a power source change detection circuit
operably coupled to the power source circuit. When enabled, the
power source change detection circuit is configured to detect an
effect on the analog signal that is based on an electrical
characteristic of the TSD electrode and to generate the digital
signal that is representative of the change of impedance of the TSD
electrode.
[0299] Also, in certain particular examples, the power source
circuit includes a power source to source at least one of a voltage
or a current via the single line to the TSD electrode. Also, the
power source change detection circuit includes a power source
reference circuit configured to provide at least one of a voltage
reference or a current reference, and a comparator configured to
compare the at least one of the voltage and the current provided
via the single line to the TSD electrode to the at least one of the
voltage reference and the current reference to produce the analog
signal.
[0300] In another example of operation and implementation, a TSD
(e.g., TSD 3210 or any other TSD described herein or their
equivalents) includes a first plurality of TSD electrodes aligned
in a first direction and a second plurality of TSD electrodes
aligned in a second direction. Note that the first plurality of TSD
electrodes and the second plurality of TSD electrodes associated
with a surface of the TSD, and an overlay that includes one or more
marker electrodes is also associated with at least a portion of the
surface of the TSD.
[0301] The TSD includes a plurality of drive-sense circuits (DSCs)
operably coupled to the first plurality of TSD electrodes and the
second plurality of TSD electrodes. A first DSC of the plurality of
DSCs is operably coupled to receive a first reference signal and to
generate a first TSD electrode signal based on the first reference
signal. When enabled, the first DSC operably coupled and configured
to provide the first TSD electrode signal to a first TSD electrode
of the first plurality of TSD electrodes and simultaneously to
sense a change of the first TSD electrode signal based on a change
of impedance of the first TSD electrode caused by capacitive
coupling between the first TSD electrode and the one or more marker
electrodes based on the overlay being associated with the at least
a portion of the surface of the TSD. The first DSC is also operably
coupled and configured to generate a first digital signal that is
representative of the change of impedance of the first TSD
electrode.
[0302] A second DSC of the plurality of DSCs is operably coupled to
receive a second reference signal and to generate a second TSD
electrode signal based on the second reference signal. When
enabled, the second DSC operably coupled and configured to provide
the second TSD electrode signal to a second TSD electrode of the
second plurality of TSD electrodes and simultaneously to sense a
change of the second TSD electrode signal based on a change of
impedance of the second TSD electrode caused by capacitive coupling
between the second TSD electrode and the one or more marker
electrodes based on the overlay being associated with the at least
a portion of the surface of the TSD. The second DSC is also
operably coupled and configured to generate a second digital signal
that is representative of the change of impedance of the second TSD
electrode.
[0303] The TSD also includes and/or is coupled to memory that
stores operational instructions. The TSD includes one or more
processing modules operably coupled to the plurality of DSCs and
the memory. When enabled, the one or more processing modules is
configured to execute the operational instructions to generate the
first reference signal and the second reference signal, and process
the first digital signal and the second digital signal to determine
one or more characteristics of the overlay that is associated with
the at least a portion of the surface of the TSD.
[0304] In certain examples, a third DSC of the plurality of DSCs is
operably coupled to receive a third reference signal and to
generate a third TSD electrode signal based on the third reference
signal. When enabled, the third DSC operably coupled and configured
to provide the third TSD electrode signal to a third TSD electrode
of the first plurality of TSD electrodes and simultaneously to
sense a change of the third TSD electrode signal based on a change
of impedance of the third TSD electrode caused by a proximal touch
to the at least a portion of the surface of the TSD with which the
overlay is associated. The third DSC is also operably coupled and
configured to generate a third digital signal that is
representative of the change of impedance of the third TSD
electrode.
[0305] Also, a fourth DSC of the plurality of DSCs is operably
coupled to receive a fourth reference signal and to generate a
fourth TSD electrode signal based on the fourth reference signal.
When enabled, the fourth DSC operably coupled and configured to
provide the fourth TSD electrode signal to a fourth TSD electrode
of the second plurality of TSD electrodes and simultaneously to
sense a change of the fourth TSD electrode signal based on a change
of impedance of the fourth TSD electrode caused by the proximal
touch to at least a portion of the surface of the TSD with which
the overlay is associated. The fourth DSC operably coupled and
configured to generate a fourth digital signal that is
representative of the change of impedance of the fourth TSD
electrode.
[0306] The TSD also includes and/or is coupled to memory that
stores operational instructions. The TSD includes one or more
processing modules operably coupled to the plurality of DSCs and
the memory. When enabled, the one or more processing modules is
configured to execute the operational instructions to generate the
third reference signal and the fourth reference signal and to
process the third digital signal and the fourth digital signal to
determine location of the proximal touch to the at least a portion
of the surface of the TSD with which the overlay is associated.
[0307] FIG. 33 is a schematic block diagram of various embodiments
3301, 3302, 3303, and 3304 of overlays and 3-D geometric objects,
which may or may not include TSD functionality, including marker
electrodes that facilitate identification, location determination,
and mapping of the overlays by a TSD in accordance with the present
invention.
[0308] Generally speaking, marker electrodes implemented in a
non-symmetric or asymmetrical manner are preferred as to facilitate
easier recognition of the marker electrodes themselves and a
pattern that may be differentiated form other patterns, to
determine orientation, position, etc.
[0309] Generally speaking, with respect to any overlay, 3-D
geometric object, etc., one or more characteristics thereof may be
used for identification of the overlay, 3-D geometric object, etc.
by a TSD. For example, such an overlay, 3-D geometric object, etc.
is implemented to include one or more marker electrodes 3310 to be
used in accordance with facilitating identification of one or more
characteristics of the overlay, 3-D geometric object, etc. Examples
of such one or more characteristics of the overlay, 3-D geometric
object, etc. may include the identity, type, shape, form, location,
position, alignment, functionality, function, capabilities,
etc.
[0310] For example, based on capacitive coupling between one or
more marker electrodes 3310 of the overlay, 3-D geometric object,
etc. and one or more electrodes of a TSD, the TSD is configured to
identify the location of those one or more marker electrodes 3310
to determine one or more characteristics associated with the
overlay, 3-D geometric object, etc. For example, one or more
processing modules of the TSD is configured to interpret
information provided from one or more DSCs that are coupled to the
one or more electrodes of the TSD that experience capacitive
coupling with the one or more marker electrodes 3310 of the
overlay, 3-D geometric object, etc. Different respective
arrangements, patterns, etc. of marker electrodes 3310 may be used
to differentiate different respective overlays, 3-D geometric
objects, etc. For example, the marker electrodes 3310 may be of any
desired shape, length, thickness, etc. In some examples, one of the
marker electrodes is a rectangular shaped conductive material. In
other examples, a marker electrode is a circular shaped conductive
material. And yet another example, a marker electrode is a straight
conductor of a particular thickness.
[0311] For example, information corresponding to arrangement,
pattern, etc. of one or more marker electrodes 3310 associated with
various overlays, 3-D geometric objects, etc. is stored within
memory, a lookup table, a server, etc., that is accessible by one
or more processing modules of a TSD. Based on detection of the
particular one or more marker electrodes 3310 associated with the
overlay, 3-D geometric object, etc. including their arrangement,
pattern, etc., the one or more processing modules of the TSD is
operative to determine whether those one or more marker electrodes
3310 compare favorably to the information. Based on favorable
comparison, the one or more processing modules of the TSD is
configured to determine which particular overlay, 3-D geometric
object, etc. is within proximity to the TSD. Based on unfavorable
comparison, one or more processing modules the TSD is configured to
determine that the overlay, 3-D geometric object, etc. that is
within proximity of the TSD may not be properly determined or
identified. In some examples, the TSD provides some indication to a
user of the TSD, such as via some form of visual output, audio
output, error message, etc. that may be interpreted by a user of
the TSD indicating that the overlay, 3-D geometric object, etc. has
not been properly identified.
[0312] Reference numeral 3301 at the upper left-hand portion of the
diagram includes an overlay or a portion of a 3-D geometric object
and includes marker electrodes 3310. The marker electrodes are
arranged at particular locations in such that two of the marker
electrodes 3310 are separated by a distance W1, and rows of the
marker electrodes 3310 are separated by distances H1 and H2. Based
on the particular locations, separations, etc. of these marker
electrodes 3310 that are determined based on processing of signals
provided from DSCs of the TSD that experience capacitive coupling
with the marker electrodes 3310, one or more processing modules of
the TSD is configured to perform a number of functions. The TSD is
configured to identify the locations of the respective marker
electrodes to determine the location of the overlay, 3-D geometric
object, etc. that includes the marker electrodes 3310. In addition,
the TSD is configured to determine the one or more characteristics
of the overlay, 3-D geometric object, etc. (e.g., identity, type,
shape, form, location, position, alignment, functionality,
function, capabilities, etc.). In addition, in some examples, the
TSD is also configured to adapt operation of the TSD appropriately
corresponding to the region or regions of the TSD that are within
proximity of the overlay, 3-D geometric object, etc.
[0313] Generally speaking, note that the marker electrodes 3310 may
be implemented in any of a variety of ways. For example,
considering reference numeral 3302, marker electrodes 3310 have
approximately a similar spatial arrangement to those with respect
to reference numeral 3301, with at least one difference being that
at least some of the marker electrodes 3310 are of larger size and
different shape than other of the marker electrodes 3310. For
example, the upper right-hand and lower left-hand marker electrodes
3310 with respect to the reference numeral 3302 are shown as being
much larger and oblong in shape. Based on the particular
characteristics of the marker electrodes 3310 of this embodiment
3302, the TSD is configured to determine the one or more
characteristics of the overlay, 3-D geometric object, etc. (e.g.,
identity, type, shape, form, location, position, alignment,
functionality, function, capabilities, etc.). Note that the
particular spatial arrangement of any one or more marker electrodes
3310 may be implemented in any of a variety of ways, including
marker electrodes 3310 that form some type of pattern. In addition,
note that the particular arrangement of one or more marker
electrodes 3310 may be used to determine whether or not an overlay,
3-D geometric object, etc. is appropriately placed on or within
appropriate proximity and alignment to a TSD. For example, an
overlay, 3-D geometric object, etc. may be intended to have a
particular upright position, and an appropriately selected
arrangement of marker electrodes 3310 may be used to facilitate
determination whether or not the overlay, 3-D geometric object,
etc. it is in fact properly placed, align, etc.
[0314] For example, consider reference numeral 3303 at the bottom
left-hand portion of the diagram, marker electrodes 3310 are
arranged forming an asymmetric shape formed by straight and curved
conductors substantially located within the middle of the overlay,
3-D geometric object, etc. Note that any desired shape may
alternatively be used to facilitate determination of one or more
characteristics of the overlay, 3-D geometric object, etc. Examples
of alternative shapes may include a star, a circle, square, a
figure 8 pattern, and/or any other particular shape. Again,
generally speaking, marker electrodes implemented in a
non-symmetric or asymmetrical manner are preferred as to facilitate
easier recognition of the marker electrodes themselves and a
pattern that may be differentiated form other patterns, to
determine orientation, position, etc. In addition, note that
multiple respective shapes of similar word different size,
characteristic, etc. made also be used to facilitate determination
of the one or more characteristics of the overlay, 3-D geometric
object, etc.
[0315] In addition, consider reference numeral 3304 at the bottom
right-hand portion of the diagram, marker electrodes 3310 may be
implemented with respect to any one or more portions of an overlay
3320, which may be of any of a variety of types (e.g., keyboard,
keypad, number pad, etc.). For example, one or more marker
electrodes 3310 may be implemented corresponding to any one or more
of the keys of the overlay 3320. In addition, note that the
respective one or more marker electrodes 3310 may be of similar
shape, different shape, etc. Also, marker electrodes implemented in
a non-symmetric or asymmetrical manner are preferred as to
facilitate easier recognition of the marker electrodes themselves
and a pattern that may be differentiated form other patterns, to
determine orientation, position, etc.
[0316] Note that the material conductivity of the overlay 3320 may
be selected such that one or more processing modules of the TSD is
operative to determine the contour, shape, outline, etc., overlay
3320 that is within proximity to the TSD. For example, certain
conductive material may be included within the pigment that is used
to color the overlay 3320. For example, titanium dioxide may be
included within the pigment to facilitate capacitive coupling of
one or more portions of the overlay 3322 one or more electrodes of
a TSD. Generally speaking, when one or more of the keys of the
overlay 3320 includes one or more elements element to facilitate
capacitive coupling between the overlay 3320 and the one or more
electrodes of the TSD, the pattern of which particular one or more
keys of the overlay 3320 includes one or more elements may take on
any desired form. For example, the corners of the overlay 3320 may
be used, every other key of the overlay 3320 may include such
elements, every third key of the overlay 3320 may include such
elements, etc. In addition, as described above with respect to
another overlay, the overlay 3320 may be implemented using
appropriate means to provide a desired amount of tactile, audio,
etc. feedback to the user in accordance with providing a user
experience when interacting with the overlay 3320 that is similar
to that of an actual keyboard.
[0317] Generally speaking, the use of marker electrodes 3310 within
an overlay, 3-D geometric object, etc. provides a means by which a
TSD is configured to detect the orientation, configuration,
position, function, etc. of the overlay, 3-D geometric object, etc.
Based on the conductivity of the marker electrodes 3310, including
capacitive coupling between them and one or more electrodes of the
TSD, a particular impedance (Z) signature that is based on the
marker electrodes 3310 may be determined by one or more processing
models of the TSD. This Z signature may be used to determine the
one or more characteristics of the overlay, 3-D geometric object,
etc. (e.g., identity, type, shape, form, location, position,
alignment, functionality, function, capabilities, etc.).
[0318] FIG. 34 is a schematic block diagram of various embodiments
3401, 3402, 3403, and 3404 of 3-D geometric objects, which may or
may not include TSD functionality, including marker electrodes that
facilitate identification, location determination, and mapping of
the overlays by a TSD in accordance with the present invention.
[0319] Reference numeral 3401 at the upper left hand portion of the
diagram shows a 3-D geometric object in the shape of a cone that
includes marker electrodes 3310 that are aligned vertically along
the length of the cone shape. This arrangement of marker electrodes
3310 in this particular manner is a particular Z signature 3411
that may be determined by one or more processing modules of a TSD
based on capacitive coupling between these marker electrodes 3310
and one or more electrodes of the TSD.
[0320] Reference numeral 3402 at the upper right hand portion of
the diagram shows a 3-D geometric object also in the shape of a
cone that includes marker electrodes 3310, except the marker
electrodes 3310 of this embodiment 3402 are arranged horizontally
around the length of the cone shape. This arrangement of marker
electrodes 3310 in this particular manner is a particular Z
signature 3412 that is different than the Z signature 3411 that may
be determined by one or more processing modules of a TSD based on
capacitive coupling between these marker electrodes 3310 and one or
more electrodes of the TSD and may be used to differentiate between
the 3-D geometric objects in the shape of a cone within the
embodiments 3401 and 3402. For example, while the shape of the 3-D
geometric objects in the embodiments 3401 and 3402 may be of
similar shape, they may have different identity, function, etc. For
example, a TSD is configured to interpret user interaction with
respect to the 3-D geometric objects in the embodiments 3401 and
3402 differently. Consider an example in which the 3-D geometric
object of embodiments 3401 is intended to facilitate user
interaction based as a joystick, and the 3-D geometric object of
embodiments 3402 is intended to facilitate user interaction based
as a game piece. Providing a means by which different respective Z
signatures can be provided even to similarly shaped 3-D geometric
objects provides the ability for a TSD to interact respect to
similarly shaped 3-D geometric objects differently and for
different functions, purposes, etc.
[0321] Reference numeral 3403 at the bottom left hand portion of
the diagram shows a 3-D geometric shape including one surface that
is substantially square in shape and having a particular thickness.
Marker electrodes 3310 are implemented on this surface of the 3-D
geometric shape. Depending on the arrangement of the marker
electrodes 3310, this 3-D geometric shape has a particular Z
signature 3413a when upright, and a different Z signature 3413b
when upside down. As can be seen, the Z signature of the 3-D
geometric shape is based on the orientation of the 3-D geometric
shape based on the arrangement of the marker electrodes 3310.
[0322] Reference numeral 3404 at the bottom right hand portion of
the diagram shows a multi-section 3-D geometric object including
multiple sections (e.g., 2 or more) of the 3-D geometric object
shown with reference to reference numeral 3403 that are stacked one
on top of each other. Note that different respective marker
electrodes 3310 may be included within one or more of the sections
of the 3-D geometric object, and they may have same or different
arrangements within the different respective sections. This
multi-section 3-D geometric shape has a corresponding Z signature
3414 based on the respective marker electrodes 3310 that are
included within the multiple sections thereof, their respective
arrangement, etc. Note also that this multi-section 3-D geometric
shape will have different respective Z signatures based on the
multi-section 3-D geometric shape being in different orientations
(e.g., upright, upside down, laying on one particular side versus
another side, etc.).
[0323] FIGS. 35A and 35B are schematic block diagrams of other
various embodiments 3501, 3502, 3503, 3504, 3505, 3506, 3507, and
3508 of overlays including marker electrodes that facilitate
identification, location determination, and mapping of the overlays
by a TSD in accordance with the present invention.
[0324] As mentioned above with respect to different embodiments,
examples, of overlays, one or more of the keys of the overlay 3320
may be implemented to include one or more elements element to
facilitate capacitive coupling between the overlay and the one or
more electrodes of the TSD.
[0325] These embodiments 3501, 3502, 3503, 3504, 3505, and 3506
illustrate various ways by which such elements may be implemented
within the keys of an overlay. Generally speaking, an overlay
having a general form of a keyboard is used for illustration in
these embodiments 3501, 3502, 3503, 3504, 3505, and 3506. However,
note that such an overlay may generally have any desired form
including more or fewer keys in similar or different arrangements
as shown here.
[0326] Reference numeral 3501 at the upper left hand portion of the
diagram shows marker electrodes 3310 included within every key of
an overlay. Reference numeral 3502 at the upper right hand portion
of the diagram shows marker electrodes 3310 being included only
within the corner keys of an overlay.
[0327] Reference numeral 3503 at the bottom left hand portion of
the diagram shows marker electrodes 3310 being included in
accordance with a checkerboard pattern of the keys of an overlay.
Reference numeral 3504 at the bottom right hand portion of the
diagram shows marker electrodes 3310 being included in accordance
with another pattern 1 that substantially includes columns of
marker electrodes 3310.
[0328] Within FIG. 35B, reference numeral 3505 at the upper left
hand portion of the diagram shows marker electrodes 3310 being
included in accordance with another pattern 2 that includes four
marker electrodes 3310 on the left-hand side and the right hand
side of the overlay, in the top and bottom rows of keys, and four
other marker electrodes 3310 offset with respect to columns of keys
substantially located in the center of the overlay. Reference
numeral 3506 at the upper right hand portion of the diagram shows
marker electrodes 3310 being included around the perimeter of the
keys of the overlay.
[0329] Reference numeral 3507 at the lower left hand portion of the
diagram shows marker electrodes 3310 being implemented using to
curved electrodes of a particular thickness arranged as shown.
Reference numeral 3508 at the lower right hand portion of the
diagram shows marker electrodes 3310 being implemented as
rectangular shapes arranged such that one is horizontal and the
other is diagonal, each being of different respective thicknesses.
These diagrams show examples that include marker electrodes 3310
that are not implemented particularly with respect to the keys of
the overlay. Generally speaking, the marker electrodes may be of
any shape, style, size, etc. such as any desired mixture of
rectangular shape, square shaped, circular shape, triangular shape,
etc., including circle-shaped electrodes that have a void in the
middle such as in the shape of the doughnut, etc.
[0330] In addition, note that if an overlay is implemented as an
active device, such as including TSD functionality, the overlay is
configured to be programmable such that it can provide signaling
that is detected by the TSD on which such an active device overlay
is placed. For example, an active device overlay provides very low
level voltage signals that are detected by the TSD on which it is
placed. In another example, an active device overlay energizes one
or more marker electrodes 3310 thereby changing one or more
electrical characteristics thereof to effectuate any desired
pattern that may be detected by the TSD in which the active device
overlay is placed.
[0331] In addition, different desired human interface device (HID)
protocols may be used for different types of overlays. For example,
a first HID protocol is used for keyboard, second HID protocol is
used for a touchpad, etc.
[0332] In certain embodiments, note that a virtual overlay may be
implemented by a TSD with display functionality, such as when the
TSD is implemented as a touchscreen, such that a window opens on
the touchscreen and displays the virtual overlay, whether it be a
keyboard, a number pad, a gameboard, etc., and the user is able to
interact with the portion of the touchscreen that displays the
virtual overlay. In an example of operation and implementation,
when a user interacts with the TSD in a certain manner, such as
spreading two fingers apart on the touchscreen, or when the user
draws a particular shape on the touchscreen, such a virtual overlay
is then displayed within that particular region of the
touchscreen.
[0333] In another example of operation and implementation, when a
TSD is implemented with display functionality, such as when the TSD
is implemented as a touchscreen, when an overlay is placed on the
surface of the TSD, for certain types of overlays, such as a
keyboard, touchscreen will display a virtual operational space at
one or more locations near the overlay. Examples of such a virtual
operational space may be a virtual keyboard, a virtual touchpad, a
virtual number pad, etc. that may be used in conjunction with the
overlay. Consider the overlay being configured to effectuate the
function of a keyboard when operating with the TSD. Based on the
overlay being placed on the touchscreen, then a virtual operational
space, number pad (e.g., a 10 or 12-key number pad) is displayed to
the right of the overlay (or alternatively to the left of the
overlay if desired, such as to accommodate a left-handed user). In
addition, different respective virtual operational spaces, such as
different dialog boxes or any of a variety of applications
including audio control, brightness control, mute/un-mute, etc.,
windows for various software operating on the TSD and/or a
computing device in communication with the TSD, media players,
control bars, touchpad, sliders, function keys, calculators of any
desired functionality whether basic functionality or scientific
higher capability functionality, etc. may be opened on the
touchscreen and implemented to operate cooperatively with such
overlays. For example, one or more hotkeys, function keys, etc.
could be opened at one or more desired locations around or near the
overlay.
[0334] Generally speaking, any desired pattern of marker electrodes
3310 may be implemented with respect to one or more keys of the
overlay to facilitate identification of one or more characteristics
of the overlay by one or more processing modules of a TSD that is
within contact to or within proximity of the overlay. Note also
that appropriate arrangement of one or more marker electrodes 3310
may be used to determine whether or not the overlay is upright or
upside down, based on the orientation and/or configuration of the
overlay on or within proximity to the TSD. Also, note that any
desired type of overlay may be implemented including various types
of keyboards (e.g., QWERTY, AWERTY, AT, Dvorak, and/or any other
mapping of keys on a keyboard, etc.), various types of number pads
(e.g., numbers 7 8 9 top row, followed by numbers 4 5 6 next from
top row, etc.), etc.
[0335] Based on the particular pattern of marker electrodes 3310
within a particular overlay, one or more processing modules of the
TSD is configured to determine the one or more characteristics of
the overlay (e.g., identity, type, shape, form, location, position,
alignment, functionality, function, capabilities, etc.). In
addition, the one or more processing modules of the TSD is
configured to adapt operation of at least a portion of the TSD that
is in contact with, in proximity with, or associated with the
overlay to facilitate user interaction with the overlay and to
interpret the user interaction with the overlay.
[0336] For example, when the TSD to determines the one or more
characteristics of the overlay (e.g., identity, type, shape, form,
location, position, alignment, functionality, function,
capabilities, etc.), the TSD is then configured to interpret user
interaction with the TSD within the location of the TSD that is
associated with the overlay to interpret the user interaction with
the overlay. The TSD is configured to detect user interaction with
the TSD than the location of the TSD that is associated with the
overlay, such as fingers of the user capacitively coupling through
the overlay to the one or more electrodes of the TSD and
interpreting the locations, timing, sequence, etc. of the
capacitive coupling of the fingers of the user in the locations
that corresponded to keys based on the physical layout of the
overlay to determine which letters, numbers, symbols, characters,
functions, etc. are being selected, and in which order, by the
user. The one or more processing modules of the TSD is configured
to generate output corresponding to the user interaction with the
TSD in accordance with the overlay.
[0337] For example, considering the overlay to be a keyboard, the
TSD is configured to detect capacitive coupling through the overlay
to the one or more electrodes of the TSD and interpreting the
locations, timing, sequence, etc. of the capacitive coupling of the
fingers of the user in the locations that corresponded to keys
based on the physical layout of the overlay to determine what
particular information the user is typing, and to generate output
corresponding to that particular information. Such output
corresponding to that particular information may be provided to any
one or more output devices such as a display, monitor, television,
a smart phone, tablet, a text to audio converter output device, a
text to video converter output device, etc., and/or transmitted via
one or more communication systems to be stored within memory, a
database, a server, etc., and/or provided to one or more other
computing devices to undergo processing such as in accordance with
normal network processing, machine learning, etc.
[0338] FIG. 36 is a schematic block diagram of various embodiments
3501, 3602, 3603, 3604, and 3605 of TSDs including communication
functionality, power sourcing, and/or controller functionality in
accordance with the present invention.
[0339] Reference numeral 3601 at the upper left hand portion of the
diagram shows a touch sensor device (TSD) 3610, with or without
display functionality, that includes processing modules 42, which
may include and/or be coupled to memory that stores one or more
operational instructions to be executed by the one or more
processing modules 42. The one or more processing modules 42 are
coupled to one or more DSCs 28, as shown via a coupling which may
have up to x pathways respectively connecting to respective DSCs
28, where x is a positive integer greater than or equal to 1. The
one or more DSCs 28 are coupled to one or more electrodes 85, as
shown via a coupling which may have up to y pathways respectively
connecting to respective DSCs 28, where y is a positive integer
greater than or equal to 1. In some examples, x=y, and in other
examples, x and y have different values. For example, there may be
instances in which a DSC 28 is operative to service more than one
electrode 85, such as in accordance with the time multiplex
implementation such that a first electrode 85 is serviced by the
DSC 28 at a first time, a second electrode 85 the service by the
DSC 28 at a second time, and so on. The electrodes 85 of the TSD
3610 may be appointed in accordance with any desired pattern, which
may include first electrodes 85 implemented in a first direction
and second electrodes 85 implemented in a second direction such
that capacitive coupling may be effectuated between the first
electrodes 85 in the second electrodes 85 in accordance with
cross-point detection to determine location of user interaction
with respect to the electrodes 85. For example, one or more DSCs 28
are implemented to mutual signaling such as signals being
transmitted from the one or more DSCs 28 via the first electrodes
85 and, after being capacitively coupled into the second electrodes
85, that mutual signaling is detected by one or more DSCs 85
coupled to via the second electrodes 85. In other examples, one or
more of the electrodes 85 of the TSD 3610 is implemented as a
button, a pad, and/or any other feature that may be used to
facilitate proximity, touch, user interaction, etc. of the user
with the one or more electrodes 85 based on them being serviced by
one or more DSCs 28.
[0340] Reference numeral 3602 at the upper middle portion of the
diagram shows the TSD 3612 that includes an internal power source
2810, such as a battery. Such a TSD 3612 may be implemented in
accordance with the mobile device, such as a laptop computer, smart
phone, but tablet, a personal digital assistant (PDS), etc. and/or
any other device that includes an internal power source.
[0341] Reference numeral 3603 at the upper right hand portion of
the diagram shows a TSD 3614 that includes an external power source
interface 2812. For example, external power source interface 2812
is implemented to interface with AC power, such as via a wall
charging device. In some examples, the TSD 3614 also includes an
internal power source 2810, such as a battery. In certain
implementations, the external power source interface 2812 is
operative to facilitate charging of the internal power source 2810,
which may be implemented as a rechargeable internal power source
(e.g., a lithium ion battery, some other type of rechargeable
battery, an energy storage capacitor, or some other rechargeable
internal power source, etc.).
[0342] Reference numeral 3604 at the middle right hand portion of
the diagram shows a TSD 3616 that is configured to communicate with
one or more tethered external controllers via tether(s). Reference
numeral 3605 at the bottom left hand portion of the diagram shows a
TSD 3618 that is configured to communicate with one or more
wireless external controllers via wireless communications. In some
examples, note that the one or more tethered external controllers
and/or the one or more wireless external controllers are configured
to communicate with one or more other computing devices 12 and/or
one or more other processing modules 42, such as may be implemented
within the one or more computing devices 12 (e.g., via wired,
wireless, optical, etc. communication means).
[0343] Note that the external controllers, whether tethered or
wireless, may be implemented to include one or more DSCs integrated
therein to facilitate user interaction with one or more buttons,
electrodes, etc. that may be included within the external
controllers. In these embodiments 3604 and 3605, the external
controllers include communication capability to communicate with
the one or more other computing devices 12 and/or the one or more
other processing modules 42. However, in certain implementations,
note that the TSDs 3616 and 3618 may also include mitigation
communication capability to communicate with the one or more other
computing devices 12 and/or the one or more other processing
modules 42. Examples of TSDs that includes such communication
capability are described with respect to certain of the following
certain of the following diagrams.
[0344] FIG. 37A is a schematic block diagram of an embodiment 3701
of a communication system including a TSD in accordance with the
present invention. This diagram shows communication between
computing device 12-37a and/or processing module(s) and a touch
sensor device (TSD)(with or without display functionality) 3710. A
TSD 3710 is in communication with computing device 12-37a (and/or
any number of other computing devices) via one or more transmission
media. The TSD 3710 includes a communication interface 3760
configured to perform transmitting and/or receiving of at least one
signal, symbol, packet, frame, etc. (e.g., using a transmitter (TX)
3762 and a receiver (RX) 3764).
[0345] Generally speaking, the communication interface 3760 is
implemented to perform any such operations of an analog front end
(AFE) and/or physical layer (PHY) transmitter, receiver, and/or
transceiver. Examples of such operations may include any one or
more of various operations including conversions between the
frequency and analog or continuous time domains (e.g., such as the
operations performed by a digital to analog converter (DAC) and/or
an analog to digital converter (ADC)), gain adjustment including
scaling, filtering (e.g., in either the digital or analog domains),
frequency conversion (e.g., such as frequency upscaling and/or
frequency downscaling, such as to a baseband frequency at which one
or more of the components of the TSD 3710 operates), equalization,
pre-equalization, metric generation, symbol mapping and/or
de-mapping, automatic gain control (AGC) operations, and/or any
other operations that may be performed by an AFE and/or PHY
component within a wireless communication device.
[0346] In some implementations, the TSD 3710 also includes one or
more processing module(s) 42 and either an associated memory that
is included within the TSD 3710 or is coupled to the one or more
processing module(s) 42 of the TSD 3710, to execute various
operations including interpreting at least one signal, symbol,
packet, and/or frame transmitted to computing device 12-37a and/or
received from the computing device 12-37a. The TSD 3710 and
computing device 12-37a may be implemented using at least one
integrated circuit in accordance with any desired configuration or
combination of components, modules, etc. within at least one
integrated circuit. In certain examples, note that the computing
device 12-37a includes one or more processing module(s) 42 and
included memory and/or that are coupled to memory. Also, in certain
examples, the computing device 12-37a also includes a communication
interface 3760 providing similar functionality to the communication
interface 3760 included in the TSD 3710.
[0347] Also, in some examples, note that one or more of the
processing module(s) 42, the communication interface 3760
(including the TX 3762 and/or RX 3764 thereof), and/or the memory
may be implemented in one or more "processing modules," "processing
circuits," "processing circuitry," "processors," and/or "processing
units" or their equivalents. Considering one example, a
system-on-a-chip (SOC) is implemented to include the processing
module(s) 42, the communication interface 3760 (including the TX
3762 and/or RX 3764 thereof), and the memory (e.g., a SOC being a
multi-functional, multi-module integrated circuit that includes
multiple components therein). Considering another example, a
processing-memory circuitry may be implemented to include
functionality similar to both the processing module(s) 42 and the
memory (e.g., when the memory is included within the processing
module(s) 42) yet the communication interface 3760 is a separate
circuitry (e.g., processing-memory circuitry is a single integrated
circuit that performs functionality of processing circuitry and a
memory and is coupled to and also interacts with the communication
interface 3760).
[0348] Considering even another example, two or more processing
circuitries may be implemented to include the processing module(s)
42, the communication interface 3760 (including the TX 3762 and/or
RX 3764 thereof), and/or the memory. In such examples, such a
"processing circuitry" or "processing circuitries" (or "processor"
or "processors") is/are configured to perform various operations,
functions, communications, etc. as described herein. In general,
the various elements, components, etc. shown within the TSD 3710
may be implemented in any number of "processing modules,"
"processing circuits," "processing circuitry," "processors," and/or
"processing units" (e.g., 1, 2, . . . , and generally using N such
"processing modules," "processing circuits," "processors," and/or
"processing units", where N is a positive integer greater than or
equal to 1).
[0349] In some examples, the TSD 3710 includes both processing
module(s) 42, the communication interface 3760 configured to
perform various operations. In other examples, the TSD 3710
includes a SOC configured to perform various operations. In even
other examples, the TSD 3710 includes processing-memory circuitry
(e.g., with memory included within the processing module(s) 42)
configured to perform various operations. Generally, such
operations include generating, transmitting, etc. signals intended
for one or more other devices (e.g., computing device 12-37a and/or
other processing module(s) 42) and receiving, processing, etc.
other signals received for one or more other devices (e.g.,
computing device 12-37a and/or other processing module(s) 42).
[0350] In some examples, note that the communication interface
3760, which is coupled to the processing module(s) 42, that is
configured to support communications within a satellite
communication system, a wireless communication system, a wired
communication system, a fiber-optic communication system, and/or a
mobile communication system (and/or any other type of communication
system implemented using any type of communication medium or
media). Any of the signals generated and transmitted and/or
received and processed by the TSD 3710 may be communicated via any
of these types of communication systems.
[0351] In addition, the processing module(s) 42 is coupled to one
or more drive-sense circuit (DSCs) 28 as described herein. For
examples, the processing module(s) 42 is coupled to one or more
DSCs 28 via one or more lines, shown as x, where x is a positive
integer greater than or equal to 1. The one or more DSCs 28 is
implemented to interact with one or more electrodes 85, shown as y,
where y is a positive integer greater than or equal to 1. In
certain examples, note that x=y. In other examples, x and y are
different numbers, such that x and y are positive integers and may
be the same or different valued positive integers. In some
examples, a single DSC 28 is implemented in a multiplexed fashion
to service more than one DSC 28 (e.g., a first DSC 28 at a first
time, a second DSC 28 at a second time, etc.). Note that the DSC 28
is configured to perform simultaneous driving and sensing of
signals provided to the one or more electrodes 85.
[0352] FIG. 37B is a schematic block diagram of another embodiment
3702 of a communication system including a TSD in accordance with
the present invention. This diagram is similar to the prior diagram
with the exception that a TSD 3712 (that includes similar
components as the TSD 3710 of the prior diagram) is implemented to
support wireless communications with computing device 12-37b and/or
other processing module(s) 42 using a communication interface 3762
implemented to support wireless communications. For example, this
diagram shows communication between computing device 12-37b and/or
other processing module(s) and TSD 3712 that are implemented as
wireless communication devices. Also, the computing device 12-37b
and TSD 3712 may each include one or more antennas for transmitting
and/or receiving of at least one signal, symbol, packet, frame,
etc. (e.g., computing device 12-37b and may include m antennas, and
TSD 3712 may include n antennas, such that m and n are positive
integers and may be the same or different valued positive
integers).
[0353] FIG. 38 is a schematic block diagram of another embodiment
3800 of a communication system including a TSD in accordance with
the present invention. This diagram shows a touch sensor device
(TSD) 3810, with or without display functionality, that is
configured to support communications with any of a number of
different other devices via wireless and/or wired communication
means. For example, the TSD 3810 is configured to support
communications with a computing device 12 via wireless and/or wired
communication means. For another example, the TSD 3810 is
configured to support communications with enterprise equipment 3830
(e.g., a server) via wireless and/or wired communication means.
[0354] In addition, in some examples, the TSD 3810 is configured to
support wireless communications with a number of other wireless
communication devices may include any one or more of a watch 3811,
or some other wearable elements that may be worn by a user, a game
controller 3832, a personal computer 3024, a laptop 3818, a
cellular/smart phone 3828, a personal digital assistant (PDA) 3830,
and/or any other type of device configured to support wireless
communications.
[0355] In an example of operation and implementation, the TSD 3810
is configured to interpret user interaction with the TSD 3810,
which may be based on a user interacting with the TSD 3810 in
conjunction with an overlay, 3-D geometric object, etc., and to
provide that interpreted user interaction to one or more other
devices, such as the various wireless communication devices
depicted herein, and/or their equivalents. For example, consider an
overlay that is implemented to facilitate keyboard interaction with
the TSD 3810 based on user interaction there with, the TSD 3810 is
configured to interpret that user interaction with the TSD 3810,
particularly based on the location, type, etc. of the overlay, it
and to provide output corresponding to the user interaction with
that overlay and the TSD 3810 to one or more of the various
devices, such as to the personal computer 3824. The personal
computer 3824, instead of receiving input directly from a
traditional keyboard that is connected to it, would then receive
input from the TSD 3810 that is interpreted to be and corresponding
to be keyboard input from the user that is provided via the TSD 38
and that is associated with the overlay that is implemented to
facilitate keyboard interaction with the TSD 3810 based on user
interaction there with.
[0356] FIG. 39A is a schematic block diagram of another embodiment
3901 of a communication system including a TSD in accordance with
the present invention. A TSD 3910 is configured to support
communications with a computing device 12 via wireless and/or wired
communication means.
[0357] One or more network segments 3916 provide communication
inter-connectivity for at least two computing devices 12 and 12-1
(e.g., such computing devices may be implemented and operative to
support communications with other computing devices in certain
examples, and such computing devices may alternatively be referred
to as communication devices in such situations including both
computing device and communication device functionality and
capability). Generally speaking, any desired number of
communication devices are included within one or more communication
systems (e.g., as shown by communication device 12-2).
[0358] The various communication links within one or more network
segments 3916 may be implemented using any of a variety of
communication media including communication links implemented as
wireless, wired, optical, satellite, microwave, and/or any
combination thereof, etc. communication links. In general, the one
or more network segments 3916 may be implemented to support a
wireless communication system, a wire lined communication system, a
non-public intranet system, a public internet system, a local area
network (LAN), a wireless local area network (WLAN), a wide area
network (WAN), a satellite communication system, a fiber-optic
communication system, and/or a mobile communication system. Note
that the one or more network segment 3916 may be implemented in
accordance with any one or more of a variety of environments,
including the Internet, cellular system, cloud computing
environment, etc. Also, in some instances, communication links of
different types may cooperatively form a connection pathway between
any two communication devices.
[0359] Considering one possible example, a communication pathway
between the TSD 3910 and the computing device 12 includes some
segments of wired communication links, other segments of wireless
communication links, and other segments of optical communication
links, and/or other communication media. In addition, the various
communication pathways of the one or more network segments 3916 may
include some segments of wired communication links, other segments
of wireless communication links, and other segments of optical
communication links, and/or other communication media. Note also
that the computing devices 12, 12-1, and 12-2 may be of a variety
of types of devices including stationary devices, mobile devices,
portable devices, etc. and may support communications for any of a
number of services or service flows including data, telephony,
television, Internet, media, synchronization, etc.
[0360] In an example of operation and implementation, the TSD 3910
is in communication with the computing device 12, and the computing
device 12 includes a communication interface to support
communications with one or more of the other devices 12-1 through
12-2. For example, the computing device 12 includes a communication
interface configured to interface and communicate with a
communication network (e.g., the one or more network segments
3916), memory that stores operational instructions, and processing
circuitry coupled to the communication interface and to the memory.
For example, one or more processing modules of the computing device
12 is configured to execute the operational instructions to perform
various functions, operations, etc. Note that the communication
supported by the computing device 12 may be bidirectional/to and
from the one or more of the other computing devices 12-1 through
12-2 or unidirectional (or primarily unidirectional) from the one
or more of the other computing devices 12-1 through 12-2.
[0361] In one example, computing device 12 includes one or more
processing modules that generates, modulates, encodes, etc. and
transmits signals via a communication interface of the computing
device 12 and also receives and processes, demodulates, decodes,
etc. other signals received via the communication interface of the
computing device 12 (e.g., received from other computing devices
such as computing device 12-1, computing device 12-2, etc.).
[0362] In some examples, note that the computing device 12 is
configured to support receipt of user input (e.g., via a
touchscreen, from the TSD 3910 that is associated with an overlay
3920 implemented with the TSD 3910 to facilitate operation of a
keyboard, from the TSD 3910 that is associated with another TSD,
such as a 3-D geometric object configured to facilitate user
interaction with it and/or with the TSD 3910, etc.) to facilitate
user interaction with one or more users of the TSD 3910 and to
communicate such information to one or more of the other devices
12-1 through 12-2 via the computing device 12. In even other
examples, note that the TSD 3910 itself is configured to
communicate directly with the one or more network segments 3916 to
communicate such information to one or more of the other devices
12-1 through 12-2 (e.g., not necessarily via the computing device
12).
[0363] In an example of operation and implementation, the TSD 3910
is configured to support communications with computing device 12
(e.g., via at least one communication interface of the TSD 3910),
and the computing device 12 is configured to support communications
with a communication system, such as including one or more network
segments 3916, to support transmission of output to one or more of
the other devices 12-1 through 12-2. Note that the communication
system may include any or any combination of and/or any one or more
of a satellite communication system, a wireless communication
system, a wired communication system, a fiber-optic communication
system, and/or a mobile communication system, etc. Note also that
the TSD 3910 is configured to support communications directly with
a communication system (e.g., one or more network segments 3916)
directly in some examples, such as via at least one communication
interface of the TSD 3910.
[0364] FIG. 39B is a schematic block diagram of another embodiment
3902 of a communication system including a TSD in accordance with
the present invention. The TSD 3910 is configured to support
communications with one or more other devices via wireless and/or
wired communication means. Examples of such other devices may
include one or more wireless communication devices 3960-3966.
[0365] The wireless communication system includes one or more base
stations and/or access points 3950, wireless communication devices
3960, 3964, 3966 (e.g., wireless stations (STAs)), and a network
hardware component 1396. The wireless communication devices
3960-3966 may be laptop computers, or tablets, 3960, personal
digital assistants (PDAs) 3962, personal computers 3964 and/or
cellular telephones 3966 (and/or any other type of wireless
communication device). Other examples of such wireless
communication devices 3960-3966 could also or alternatively include
other types of devices that include wireless communication
capability (and/or other types of communication functionality such
as wired communication functionality, satellite communication
functionality, fiber-optic communication functionality, etc.).
Examples of wireless communication devices may include a wireless
smart phone, a cellular phone, a laptop, a personal digital
assistant, a tablet, a personal computers (PC), a work station,
and/or a video game device.
[0366] Some examples of possible devices that may be implemented to
operate in accordance with any of the various examples,
embodiments, options, and/or their equivalents, etc. described
herein may include, but are not limited by, appliances within
homes, businesses, etc. such as refrigerators, microwaves, heaters,
heating systems, air conditioners, air conditioning systems,
lighting control systems, and/or any other types of appliances,
etc.; meters such as for natural gas service, electrical service,
water service, Internet service, cable and/or satellite television
service, and/or any other types of metering purposes, etc.; devices
wearable on a user or person including watches, monitors such as
those that monitor activity level, bodily functions such as
heartbeat, breathing, bodily activity, bodily motion or lack
thereof, etc.; medical devices including intravenous (IV) medicine
delivery monitoring and/or controlling devices, blood monitoring
devices (e.g., glucose monitoring devices) and/or any other types
of medical devices, etc.; premises monitoring devices such as
movement detection/monitoring devices, door closed/ajar
detection/monitoring devices, security/alarm system monitoring
devices, and/or any other type of premises monitoring devices;
multimedia devices including televisions, computers, audio playback
devices, video playback devices, and/or any other type of
multimedia devices, etc.; and/or generally any other type(s) of
device(s) that include(s) wireless communication capability,
functionality, circuitry, etc. In general, any device that is
implemented to support wireless communications may be implemented
to operate in accordance with any of the various examples,
embodiments, options, and/or their equivalents, etc. described
herein.
[0367] The one or more base stations (BSs) or access points (APs)
3950 are operably coupled to the network hardware 3956 via local
area network connection 3952. The network hardware 3956, which may
be a router, switch, bridge, modem, system controller, etc.,
provides a wide area network connection 3954 for the communication
system. Each of the one or more base stations or access points 3950
has an associated antenna or antenna array to communicate with the
wireless communication devices in its area. Typically, the wireless
communication devices register with a particular base station or
access point 3950 to receive services from the communication
system. For direct connections (i.e., point-to-point
communications), wireless communication devices communicate
directly via an allocated channel.
[0368] Any of the various wireless communication devices (WDEVs)
3960-3966 and one or more BSs or APs 3950 may include a processing
circuitry and/or a communication interface to support
communications with any other of the wireless communication devices
3960-3966 and one or more BSs or APs 3950. In an example of
operation, a processing circuitry and/or a communication interface
implemented within one of the devices (e.g., any one of the WDEVs
3960-3966 and one or more BSs or APs 3950) is/are configured to
process at least one signal received from and/or to generate at
least one signal to be transmitted to another one of the devices
(e.g., any other one of the one or more WDEVs 3960-3966 and one or
more BSs or APs 3950).
[0369] Note that general reference to a communication device, such
as a wireless communication device (e.g., WDEVs) 3960-3966 and one
or more BSs or APs 3950 in FIG. 39D, or any other communication
devices and/or wireless communication devices may alternatively be
made generally herein using the term `device` (e.g., "device" when
referring to "wireless communication device" or "WDEV"). Generally,
such general references or designations of devices may be used
interchangeably.
[0370] The processing circuitry and/or the communication interface
of any one of the various devices, WDEVs 3960-3966 and one or more
BSs or APs 3950, may be configured to support communications with
any other of the various devices, WDEVs 3960-3966 and one or more
BSs or APs 3950. Such communications may be uni-directional or
bi-directional between devices. Also, such communications may be
uni-directional between devices at one time and bi-directional
between those devices at another time.
[0371] In an example, a device (e.g., any one of the WDEVs
3960-3966 and one or more BSs or APs 3950) includes a communication
interface and/or a processing circuitry (and possibly other
possible circuitries, components, elements, etc.) to support
communications with other device(s) and to generate and process
signals for such communications. The communication interface and/or
the processing circuitry operate to perform various operations and
functions to effectuate such communications (e.g., the
communication interface and the processing circuitry may be
configured to perform certain operation(s) in conjunction with one
another, cooperatively, dependently with one another, etc. and
other operation(s) separately, independently from one another,
etc.). In some examples, such a processing circuitry includes all
capability, functionality, and/or circuitry, etc. to perform such
operations as described herein. In some other examples, such a
communication interface includes all capability, functionality,
and/or circuitry, etc. to perform such operations as described
herein. In even other examples, such a processing circuitry and a
communication interface include all capability, functionality,
and/or circuitry, etc. to perform such operations as described
herein, at least in part, cooperatively with one another.
[0372] In an example of implementation and operation, a wireless
communication device (e.g., any one of the WDEVs 3960-3966 and one
or more BSs or APs 3950) includes a processing circuitry to support
communications with one or more of the other wireless communication
devices (e.g., any other of the WDEVs 3960-3966 and one or more BSs
or APs 3950). For example, such a processing circuitry is
configured to perform both processing operations as well as
communication interface related functionality. Such a processing
circuitry may be implemented as a single integrated circuit, a
system on a chip, etc.
[0373] In another example of implementation and operation, a
wireless communication device (e.g., any one of the WDEVs 3960-3966
and one or more BSs or APs 3950) includes a processing circuitry, a
communication interface, and a memory configured to support
communications with one or more of the other wireless communication
devices (e.g., any other of the WDEVs 3960-3966 and one or more BSs
or APs 3950).
[0374] In an example of operation and implementation, the TSD 3910
is in communication with one or more of the one of the WDEVs
3960-3966, and the one of the WDEVs 3960-3966 includes a
communication interface to support communications with one or more
other devices via the one or more BSs or APs 3950, the local area
network connection 3952, the network hardware 3956, and/or the wide
area network connection 3954. This diagram shows yet another
implementation of the communication system in which user
interaction with the TSD 3910, such as may be in accordance with an
overlay, a 3-D geometric object, etc. that is associated with the
TSD 3910, may be communicated to one or more other devices via one
or more communication means, pathways, communication media,
systems, etc. such user interaction with the TSD 3910 may be
provided to any one or more other devices for processing thereby,
for storage therein, for analysis thereby such as in accordance
with artificial intelligence, pattern recognition, etc. for machine
learning, and/or for any other purposes. Also, note that the TSD
3910 is configured to support communications directly with the one
or more BSs or APs 3950 directly in some examples, such as via at
least one wireless communication interface of the TSD 3910.
[0375] FIG. 40 is a schematic block diagram of various embodiments
4001, 4002, 4003, and 4004 of TSDs that are configurable in
accordance with the present invention. In this diagram, a 3-D
geometric object or TSD 4010 includes multiple sections. Note that
such 3-D geometric objects may or may not include TSD functionality
such as 3-D geometric object may be a passive device, such as
including one or more electrodes, which may include one or more
marker electrodes. In other examples, such as 3-D geometric object
is an active device that is operative to support the TSD
functionality, such as including one or more electrodes, one or
more DSCs servicing those one or more electrodes, and one or more
processing modules in communication with the one or more DSCs that
are configured to operate cooperatively to support TSD
functionality.
[0376] For example, the 3-D geometric object or TSD 4010, shown in
the upper left-hand portion of the diagram, includes three
sections. As shown by embodiment 4001, the respective sections are
capable to be folded with respect to one another, as shown by
section 1, section 2, and section 3. Traversing to the right at the
top of the diagram, the 3-D geometric object or TSD 4010 is
transformed from a first configuration to a second configuration
based on the folding of the respective sections. For example, as
section 3 is folded towards section 2, and as section 1 is folded
towards section 2, as shown in the diagram, the 3-D geometric
object or TSD 4010 is transformed from a first configuration to a
second configuration.
[0377] With respect to this diagram and any others herein that
include one or more TSDs, note that one or more marker electrodes
may be included within any one or more portions of a 3-D geometric
object or TSD, including the different respective sections of the
multiple section 3-D geometric object or TSD. Note also that the
marker electrodes may have the same or different patterns within
the different respective sections, as may be desired in various
examples.
[0378] Considering another example, the 3-D geometric object or TSD
4020, as shown in the middle left of the diagram, includes four
respective sections. As can be seen by the embodiment 4002, based
on folding of section 4 toward section 3, section 3 toward section
2, and section 1 toward second 2, the 3-D geometric object or TSD
4020 is transformed from a first configuration to a second
configuration.
[0379] Considering yet another example with respect to the 3-D
geometric object or TSD 4020, as can be seen by the embodiment
4003, based on folding of section 3 toward section 2, the 3-D
geometric object or TSD 4020 is transformed from a first
configuration to a third configuration that is different from the
second configuration. As can be seen, with respect to a 3-D
geometric object or TSD, such as 3-D geometric object or TSD 4020,
having multiple sections, that same 3-D geometric object or TSD may
be transformed into different respective configurations based on
the capability by which the 3-D geometric object or TSD may be
modified. In this example, the 3-D geometric object or TSD 4020
includes different respective sections that may be folded onto one
another thereby forming different respective configurations based
on the same 3-D geometric object or TSD 4020.
[0380] Considering another example, consider embodiment 4004 that
includes a variant of the TSD 3-D geometric object or 4020, which
is similar in format but includes differently sized sections, such
as sections 2 and 4 are larger than shown with respect to 3-D
geometric object or TSD 4020. Consider similar folding within
embodiment 4004 as is performed with respect to them by about 4002,
then the variant of the 3-D geometric object or TSD 4020 is
transformed from a first configuration to a fourth configuration
such that a void is included within the center of the 3-D geometric
object or TSD after being transformed into the fourth
configuration.
[0381] Generally speaking, different respective 3-D geometric
objects or TSDs may be implemented in any of a variety of ways
having capability to be transformed into any of a variety of
configurations; the embodiments of this diagram show 3-D geometric
objects or TSDs having multiple respective sections of 3-D
geometric objects being substantially rectangular in shape having a
particular thickness.
[0382] As can be seen, not only can a particular 3-D geometric
object or TSD be transformed into different respective
configurations such as for different respective uses, but such a
3-D geometric object or TSD may also be configured to interact with
another TSD differently based on the particular configuration is
then. For example, consider such a 3-D geometric object or TSD as
including one or more marker electrodes within one or more of the
sections of the 3-D geometric object or TSD. Based on the
configuration in which the 3-D geometric object or TSD has been
transformed, the one or more marker electrodes will provide
different respective Z signatures that may be detected by another
TSD. For example, different respective 3-D geometric objects or
TSDs will have different respective Z signatures that facilitate
another TSD to identify and differentiate them one from
another.
[0383] Also, based on any one or more other considerations, such as
configuration, position, orientation, and/or other considerations
of a given 3-D geometric object or TSD may be used to provide
different respective Z signatures that may be detected by another
TSD and used to select between different respective functions of
the very same 3-D geometric object or TSD when interacting with the
other TSD. For example, based on any one or more such
considerations (e.g., configuration, position, orientation, etc.)
of the 3-D geometric object or TSD, that 3-D geometric object or
TSD may be configured to support different functionality when
interacting with the other TSD.
[0384] FIG. 41 is a schematic block diagram of various embodiments
4101, 4102, 4103, 4104, 4105, and 4106 of TSDs that are
configurable and operative with TSDs in accordance with the present
invention. These various embodiments 4101, 4102, 4103, 4104, 4105,
and 4106 show different ways in which a 3-D geometric object or TSD
is configured to interact with the TSD 4110 based on one or more
characteristics of the 3-D geometric object or TSD.
[0385] Embodiment 4101 shows the 3-D geometric object or TSD 4112
that is implemented in a first configuration and in contact with or
proximity to TSD 4110. The TSD 4110 is configured to detect the 3-D
geometric object or TSD 4112 based on a first Z signature
corresponding to the 3-D geometric object or TSD 4112 being in the
first configuration. The TSD 4110 then interacts with the 3-D
geometric object or TSD 4112 based on a first function that
corresponds to the 3-D geometric object or TSD 4112 being in this
first configuration.
[0386] Embodiment 4102 shows the 3-D geometric object or TSD 4112
that is implemented in a second configuration and in contact with
or proximity to TSD 4110. The TSD 4110 is configured to detect the
3-D geometric object or TSD 4112 based on a second Z signature
corresponding to the 3-D geometric object or TSD 4112 being in the
second configuration. The TSD 4110 then interacts with the 3-D
geometric object or TSD 4112 based on a second function that
corresponds to the 3-D geometric object or TSD 4112 being in this
second configuration.
[0387] Embodiments 4101 and 4102 operate such that the TSD 4110
interacts with the 3-D geometric object or TSD 4112 differently
based on the particular configuration in which the 3-D geometric
object or TSD 4112 is currently implemented.
[0388] Embodiment 4103 shows the 3-D geometric object or TSD 4114
that is implemented in a first orientation and in contact with or
proximity to TSD 4110. The TSD 4110 is configured to detect the 3-D
geometric object or TSD 4114 based on a first Z signature
corresponding to the 3-D geometric object or TSD 4114 being in the
first orientation. The TSD 4110 then interacts with the 3-D
geometric object or TSD 4114 based on a first function that
corresponds to the 3-D geometric object or TSD 4114 being in this
first orientation.
[0389] Embodiment 4103 shows the 3-D geometric object or TSD 4114
that is implemented in a second orientation and in contact with or
proximity to TSD 4110. The TSD 4110 is configured to detect the 3-D
geometric object or TSD 4114 based on a second Z signature
corresponding to the 3-D geometric object or TSD 4114 being in the
second orientation. The TSD 4110 then interacts with the 3-D
geometric object or TSD 4114 based on a second function that
corresponds to the 3-D geometric object or TSD 4114 being in this
second orientation.
[0390] Embodiments 4103 and 4104 operate such that the TSD 4110
interacts with the 3-D geometric object or TSD 4114 differently
based on the particular orientation in which the 3-D geometric
object or TSD 4114 is currently implemented. In these embodiments
for 103 and 4104, the interaction between the TSD 4110 and the 3-D
geometric object or TSD 4114 is selected based on the orientation
of the 3-D geometric object or TSD 4114 with respect to the TSD
4110. In such examples, such orientation-based function change is
the same whether or not the 3-D geometric object or TSD 4114 is
upright or upside down. That is to say, the TSD 4110 is configured
to detect the a first corresponding Z signature of the 3-D
geometric object or TSD 4114 when upright and a second
corresponding Z signature of the 3-D geometric object or TSD 4114
when upside down and is also configured to select the same function
for both of those instances. In other alternative examples, such
orientation-based function change is the different based on whether
or not the 3-D geometric object or TSD 4114 is upright or upside
down. That is to say, the TSD 4110 is configured to detect the a
first corresponding Z signature of the 3-D geometric object or TSD
4114 when upright and a second corresponding Z signature of the 3-D
geometric object or TSD 4114 when upside down and is also
configured respectively to select different respective functions,
such as a first function and a second function, for both of those
instances.
[0391] Embodiment 4105 shows the 3-D geometric object or TSD 4116
that is implemented in a first location and in contact with or
proximity to TSD 4110. The TSD 4110 is configured to detect the 3-D
geometric object or TSD 4116 based on a first Z signature
corresponding to the 3-D geometric object or TSD 4116 being in the
first location. The TSD 4110 then interacts with the 3-D geometric
object or TSD 4116 based on a first function that corresponds to
the 3-D geometric object or TSD 4116 being in this first
location.
[0392] Embodiment 4106 shows the 3-D geometric object or TSD 4116
that is implemented in a second location and in contact with or
proximity to TSD 4110. The TSD 4110 is configured to detect the 3-D
geometric object or TSD 4116 based on a second Z signature
corresponding to the 3-D geometric object or TSD 4116 being in the
second location. The TSD 4110 then interacts with the 3-D geometric
object or TSD 4116 based on a second function that corresponds to
the 3-D geometric object or TSD 4116 being in this second
location.
[0393] Embodiments 4105 and 4106 operate such that the TSD 4110
interacts with the 3-D geometric object or TSD 4116 differently
based on the particular location with respect to the TSD 4110 at
which the 3-D geometric object or TSD 4116 is currently
located.
[0394] These embodiments 4101, 4102, 4103, 4104, 4105, and 4106
show variability and select ability of different respective
functions of a 3-D geometric object or TSD when interacting with
the TSD 4110 based on configuration, orientation, and position.
Note also that, and other examples, combinations of configuration,
orientation, and position made be used to select among an even
larger number of different respective functions of a 3-D geometric
object or TSD when interacting with the TSD 4110.
[0395] For example, consider a 3-D geometric object or TSD in a
first configuration and a first orientation may be to select a
first function when interacting with the TSD 4110. The 3-D
geometric object or TSD in the first configuration and a second
orientation may be to select a second function when interacting
with the TSD 4110. The 3-D geometric object or TSD in a second
configuration and the first orientation may be to select a third
function when interacting with the TSD 4110. The 3-D geometric
object or TSD in the second configuration and the second
orientation may be to select a fourth function when interacting
with the TSD 4110.
[0396] For yet another example, consider a 3-D geometric object or
TSD in a first configuration and a first location may be to select
a first function when interacting with the TSD 4110. The 3-D
geometric object or TSD in the first configuration and a second
location may be to select a second function when interacting with
the TSD 4110. The 3-D geometric object or TSD in a second
configuration and the first location may be to select a third
function when interacting with the TSD 4110. The 3-D geometric
object or TSD in the second configuration and the second location
may be to select a fourth function when interacting with the TSD
4110.
[0397] For even yet another example, consider a 3-D geometric
object or TSD in a first configuration, a first orientation, and a
first location may be to select a first function when interacting
with the TSD 4110. The 3-D geometric object or TSD in the first
configuration, the first orientation, and a second location may be
to select a second function when interacting with the TSD 4110. The
3-D geometric object or TSD in the first configuration, a second
orientation, and the first location may be to select a third
function when interacting with the TSD 4110. The 3-D geometric
object or TSD in the first configuration, the second orientation,
and the second location may be to select a fourth function when
interacting with the TSD 4110.
[0398] Similar variability in selection of different other
functions may be made based on the 3-D geometric object or TSD
being in a second configuration and having different respective
orientations and/or locations to select different respective
functions when interacting with the TSD 4110.
[0399] Examples of different respective functions corresponding to
the interaction of the TSD 4110 with different respective 3-D
geometric objects or TSDs may be performed in a variety of ways.
Generally speaking, a respective 3-D geometric object or TSD may be
implemented to operate in accordance with different respective
functionalities at different times based on any one of
configuration, orientation, position, and or other characteristics
associated with the respective 3-D geometric object or TSD when
interacting with the TSD 4210.
[0400] For example, a first function may correspond to a 3-D
geometric object or TSD operating as a remote control for the
television. A second function may correspond to the 3-D geometric
object or TSD operating as a remote control for a digital video
recorder (DVR). A second function may correspond to the 3-D
geometric object or TSD operating as a garage door opener. The
fourth function may correspond to the 3-D geometric object or TSD
operating as a heating, ventilation, air conditioning (HVAC)
controller. The fifth function may correspond to the 3-D geometric
object or TSD operating as an appliance controller interface (e.g.,
such as for an oven, microwave, etc.). Also, note that such a 3-D
geometric object or TSD, when implemented as an active device, may
be implemented to include display functionality to provide
indication of which portions of the 3-D geometric object or TSD
correspond to buttons or touch sections that correspond to
operation in accordance with various operations for various
functions. In some examples, such display functionality is
implemented using one or more of touchscreen display, an liquid
crystal display (LCD) operable display, a light emitting diode
(LED) operable display, and/or other visual output component, that
is configured to provide indication to the a user of where
particularly to touch the 3-D geometric object or TSD.
[0401] In other examples, the 3-D geometric object or TSD includes
no such display functionality, and user interaction in accordance
with the 3-D geometric object or TSD with respect to different
surfaces, portions, etc. of the 3-D geometric object or TSD
effectuates the different functions. The user then interacts with
the 3-D geometric object or TSD based on information known to the
user regarding where and how to interact with the 3-D geometric
object or TSD to effectuate the different respective functions.
[0402] In even other examples, the 3-D geometric object or TSD is
implemented to include different respective patterns, colors, text,
description, printing, etc. and/or other differentiating and
indicating means on one or more portions of one or more surfaces of
the 3-D geometric object or TSD. The user then interacts with the
3-D geometric object or TSD based on information known to the user
regarding where and how to interact with the 3-D geometric object
or TSD with respect to the different one or more portions of one or
more surfaces of the 3-D geometric object or TSD to effectuate the
different respective functions. For example, the user interacts
with a first portion of a first surface of the 3-D geometric object
or TSD that is facing upwards to effectuate a first function, with
a second portion of the first surface of the 3-D geometric object
or TSD that is facing upwards to effectuate a second function, and
so on. The different differentiating and indicating means
associated with the first and second portions of the first surface
of the 3-D geometric object or TSD provide indication to the user
of where to interact with the 3-D geometric object or TSD to
effectuate the different respective functions (e.g., first printing
on the first portion of the first surface of the 3-D geometric
object or TSD to indicate that portion may be used to effectuate
the first function, second printing on the second portion of the
second surface of the 3-D geometric object or TSD to indicate that
particular portion may be used to effectuate the second function,
and so on). The different respective portions of the first surface
include different respective patterns, colors, text, description,
printing, etc. and/or other differentiating and indicating
means.
[0403] For another example, the user interacts with a first surface
of the 3-D geometric object or TSD when that first surface of the
3-D geometric object or TSD is facing upwards to effectuate a first
function, with a second surface of the 3-D geometric object or TSD
when that second surface of the 3-D geometric object or TSD is
facing upwards to effectuate a second function, and so on. The
different respective surfaces include different respective
patterns, colors, text, description, printing, etc. and/or other
differentiating and indicating means. For example, depending on the
orientation of the 3-D geometric object or TSD with respect to the
TSD 4110, different respective surfaces will be facing upwards and
are then available to facilitate user interaction therewith.
[0404] Note that such different respective patterns, colors, text,
description, printing, etc. and/or other differentiating and
indicating means on one or more portions of one or more surfaces of
the 3-D geometric object or TSD may also be implemented with
respect to different respective sections of a multiple section 3-D
geometric object or TSD so as to provide information to a user
regarding the what functionality is associated with the 3-D
geometric object or TSD depending on its orientation,
configuration, etc. For example, consider that a multiple section
3-D geometric object or TSD is implemented in a first orientation
and/or configuration, then a first pattern, color, text,
description, printing, etc. and/or other differentiating and
indicating means is visible to a user providing information to the
user regarding a first function associated with that first
orientation and/or configuration. Then, when the multiple section
3-D geometric object or TSD is implemented in a second orientation
and/or configuration, then a second pattern, color, text,
description, printing, etc. and/or other differentiating and
indicating means is visible to the user regarding a second function
associated with that second orientation and/or configuration.
[0405] In yet other examples, user interaction accordance with the
3-D geometric object or TSD with respect any of surfaces, portions,
etc. of the 3-D geometric object or TSD effectuates a given
function. For example, consider the 3-D geometric object or TSD
configured to operate as a button that operates generally as a very
simple, toggle switch (e.g., such as garage door opener such that a
first touch of the button starts the garage door to move, and a
second touch of the button stops the garage door at its current
position and/or reverses the direction of movement of the garage
door), then any user interaction with the 3-D geometric object or
TSD effectuates the operation of such the toggle switch. In
addition, depending on the orientation, configuration, etc. of the
-D geometric object or TSD, different respective portions or
surfaces of the 3-D geometric object or TSD may be implemented to
effectuate different simple, toggle switches. In one example, the
first and second functions may be very simple/toggle type functions
such the first function being that of a garage door opener, the
second function being that of door lock/unlock mechanism, etc.
[0406] In even other examples, the first and second functions are
more complex functions such the first function being that of a TV
and/or DVR remote control, the second function being that of an
HVAC control console to effectuate heating and/or cooling
operations of a building, etc.
[0407] Generally speaking, the number of different respective
functions corresponding to the interaction of the TSD 4110 with
different respective 3-D geometric objects or TSDs are myriad.
These are examples and do not constitute an exhaustive list of the
countless variety of functions for that may be implemented
corresponding to the interaction of the TSD 4110 with different
respective 3-D geometric objects or TSDs.
[0408] FIG. 42 is a schematic block diagram of other various
embodiments 4201, 4202, 4203, and 4204 of 3-D geometric objects or
TSDs that are configurable and operative with TSDs in accordance
with the present invention. This diagram shows a 3-D geometric
object or TSD 4220 as including four respective sections and is
configurable based on those four respective sections. A 3-D
geometric object or TSD 4220 is operative to interact with the TSD
4210. Based on the configuration of these the 3-D geometric object
or TSD 4220, the TSD 4210 is configured to interact differently
with the 3-D geometric object or TSD 4220.
[0409] As can be seen with respect to embodiment 4201, based on the
3-D geometric object or TSD 4220 being implemented within a first
configuration, the TSD 4210 interacts with the 3-D geometric object
or TSD 4220 based on the first function. For example, the first
configuration corresponds to the four respective sections of the
3-D geometric object or TSD 4220 being aligned together in the same
plane, or corresponding to a flat configuration.
[0410] In embodiment 4202, based on the 3-D geometric object or TSD
4220 being implemented within a second configuration, the TSD 4210
interacts with the 3-D geometric object or TSD 4220 based on a
second function. The second configuration corresponds to the four
sections of the 3-D geometric object or TSD 4220 being folded
together, and also with the 3-D geometric object or TSD 4220 being
any particular orientation with respect to the TSD 4210. For
example, the two larger sections of the four sections of the 3-D
geometric object or TSD 4220 are located on the top and bottom
within this second configuration.
[0411] In embodiment 4203, based on the 3-D geometric object or TSD
4220 being implemented within a third configuration, the TSD 4210
interacts with the 3-D geometric object or TSD 4220 based on a
third function. The third configuration also corresponds to the
four sections of the 3-D geometric object or TSD 4220 being folded
together, and also with the 3-D geometric object or TSD 4220 being
any particular orientation with respect to the TSD 4210 that is
different than within the embodiment 4202. For example, the two
larger sections of the four sections of the 3-D geometric object or
TSD 4220 are located on the left and right within this third
configuration, such that the 3-D geometric object or TSD 4220 is
oriented within the embodiment 4203 after having undergone a
90.degree. rotation relative to the embodiment 4202.
[0412] In embodiment 4204, based on the 3-D geometric object or TSD
4220 being implemented within a fourth configuration, the TSD 4210
interacts with the 3-D geometric object or TSD 4220 based on a
fourth function. The fourth configuration also corresponds to the
four sections of the 3-D geometric object or TSD 4220 being folded
together, and also with the 3-D geometric object or TSD 4220 being
any particular orientation with respect to the TSD 4210 that is
different than within the embodiment 4202 or embodiment 4203. For
example, the two larger sections of the four sections of the 3-D
geometric object or TSD 4220 are located on the top and bottom
within this fourth configuration, such that the 3-D geometric
object or TSD 4220 is oriented within the fourth 4203 after having
undergone a 90.degree. rotation relative to the embodiment 4203 or
after having undergone a 180.degree. rotation relative to the
embodiment 4202.
[0413] As can be seen with respect to these embodiments, different
functionality of a 3-D geometric object or TSD 4220 may be
performed based on its interaction with a TSD 4210 based not only
on the configuration and manner in which the 3-D geometric object
or TSD 4220 is particularly configured, but also based on its
orientation with respect to the TSD 4210.
[0414] FIG. 43A is a schematic block diagram of other various
embodiments 4301, 4302, 4303, and 4304 of 3-D geometric objects or
TSDs that are configurable and operative with TSDs in accordance
with the present invention. These embodiments show
orientation-based function change with respect to a 3-D geometric
object or TSD 4314 when interacting with a TSD 4310. For example,
embodiment 4301 shows a first orientation such that the 3-D
geometric object or TSD 4314 is inverted relative to the
orientation as is shown in the middle of the diagram.
[0415] In embodiment 4301, based on the 3-D geometric object or TSD
4314 being implemented within a first orientation, the TSD 4310
interacts with the 3-D geometric object or TSD 4314 based on a
first function.
[0416] Embodiment 4302 shows a second orientation such that the 3-D
geometric object or TSD 4314 is rotated clockwise 90.degree.
relative to the orientation as is shown in the middle of the
diagram. In embodiment 4302, based on the 3-D geometric object or
TSD 4314 being implemented within a second orientation, the TSD
4310 interacts with the 3-D geometric object or TSD 4314 based on a
second function.
[0417] Embodiment 4303 shows a third orientation such that the 3-D
geometric object or TSD 4314 is similarly oriented as is shown in
the middle of the diagram. In embodiment 4303, based on the 3-D
geometric object or TSD 4314 being implemented within a third
orientation, the TSD 4310 interacts with the 3-D geometric object
or TSD 4314 based on a third function.
[0418] Embodiment 4304 shows a second orientation such that the 3-D
geometric object or TSD 4314 is rotated counter-clockwise
90.degree. relative to the orientation as is shown in the middle of
the diagram. In embodiment 4302, based on the 3-D geometric object
or TSD 4314 being implemented within a second orientation, the TSD
4310 interacts with the 3-D geometric object or TSD 4314 based on a
second function.
[0419] In some examples, such selectivity between different
respective functions is made based on only the orientation of the
3-D geometric object or TSD 4314 with respect to the TSD 4310. For
example, one or more processing modules of the TSD 4310 is
implemented to interpret signals provided from DSCs that are
coupled to electrodes of the TSD 4310 and to facilitate selectivity
between different respective functions based on only the
orientation of the 3-D geometric object or TSD 4314 with respect to
the TSD 4310.
[0420] FIG. 43B is a schematic block diagram of other various
embodiments 4305 and 4206 of 3-D geometric objects or TSDs that are
configurable and operative with TSDs in accordance with the present
invention. These embodiments show position-based function change
with respect to a 3-D geometric object or TSD 4314 when interacting
with a TSD 4310.
[0421] Embodiment 4305 shows a first location of the 3-D geometric
object or TSD 4314 with respect to the TSD 4310. For example, the
first location corresponds to the 3-D geometric object or TSD 4314
being located to the left of the top surface of with respect to the
TSD 4310. In embodiment 4305, based on the 3-D geometric object or
TSD 4314 being located within this first location, the TSD 4310
interacts with the 3-D geometric object or TSD 4314 based on a
first function.
[0422] Embodiment 4306 shows a second location of the 3-D geometric
object or TSD 4314 with respect to the TSD 4310. For example, the
second location corresponds to the 3-D geometric object or TSD 4314
being located to the right of the top surface of with respect to
the TSD 4310. In embodiment 4305, based on the 3-D geometric object
or TSD 4314 being located within this second location, the TSD 4310
interacts with the 3-D geometric object or TSD 4314 based on a
second function.
[0423] In some examples, such selectivity between different
respective functions is made based on only the location of the 3-D
geometric object or TSD 4314 with respect to the TSD 4310. For
example, one or more processing modules of the TSD 4310 is
implemented to interpret signals provided from DSCs that are
coupled to electrodes of the TSD 4310 and to facilitate selectivity
between different respective functions based on only the location
of the 3-D geometric object or TSD 4314 with respect to the TSD
4310.
[0424] FIG. 44 is a schematic block diagram of other various
embodiments 4401, 4402, 4403, 4404, 4405, 4406, 4407, and 4408 of
3-D geometric objects or TSDs that are configurable and operative
with TSDs in accordance with the present invention. These
embodiments show combined position-based and orientation-based
function change with respect to a 3-D geometric object or TSD 4412
when interacting with a TSD 4410. Providing selectivity between
different respective functions using more than one consideration or
dimensions, in this case both position and orientation, and even
greater number of different respective functions may be supported
based on a 3-D geometric object or TSD 4412 interacting with a TSD
4410. Generally speaking, any of a number of different
considerations or dimensions such as configuration, position,
orientation, and/or other considerations may be used to select
between different respective functions.
[0425] Embodiment 4401 shows a first orientation such that the 3-D
geometric object or TSD 4412 is inverted relative to the
orientation as is shown in the top middle of the diagram. In
embodiment 4401, based on the 3-D geometric object or TSD 4314
being implemented within a first orientation and also within a
first location, such as corresponding to the left hand portion of
the top surface of the TSD 4410, the TSD 4410 interacts with the
3-D geometric object or TSD 4412 based on a first function.
[0426] Embodiment 4402 also shows the first orientation such that
the 3-D geometric object or TSD 4412 is inverted relative to the
orientation as is shown in the top middle of the diagram. In
embodiment 4402, based on the 3-D geometric object or TSD 4314
being implemented within the first orientation yet within a second
location, such as corresponding to the right hand portion of the
top surface of the TSD 4410, the TSD 4410 interacts with the 3-D
geometric object or TSD 4412 based on a second function.
[0427] Embodiment 4403 shows a second orientation such that the 3-D
geometric object or TSD 4412 is similarly oriented as is shown in
the top middle of the diagram. In embodiment 4403, based on the 3-D
geometric object or TSD 4314 being implemented within the second
orientation yet within the first location, such as corresponding to
the left hand portion of the top surface of the TSD 4410, the TSD
4410 interacts with the 3-D geometric object or TSD 4412 based on a
third function.
[0428] Embodiment 4404 shows the second orientation such that the
3-D geometric object or TSD 4412 is similarly oriented as is shown
in the top middle of the diagram. In embodiment 4404, based on the
3-D geometric object or TSD 4314 being implemented within the
second orientation yet within a second location, such as
corresponding to the right hand portion of the top surface of the
TSD 4410, the TSD 4410 interacts with the 3-D geometric object or
TSD 4412 based on a fourth function.
[0429] Embodiment 4405 shows a third orientation such that the 3-D
geometric object or TSD 4412 is rotated clockwise 90.degree.
compared to the orientation of the 3-D geometric object or TSD 4412
as is shown in the top middle of the diagram. In embodiment 4405,
based on the 3-D geometric object or TSD 4314 being implemented
within the third orientation yet within the first location, such as
corresponding to the left hand portion of the top surface of the
TSD 4410, the TSD 4410 interacts with the 3-D geometric object or
TSD 4412 based on a fifth function.
[0430] Embodiment 4406 also shows the third orientation such that
the 3-D geometric object or TSD 4412 is rotated clockwise
90.degree. compared to the orientation of the 3-D geometric object
or TSD 4412 as is shown in the top middle of the diagram. In
embodiment 4406, based on the 3-D geometric object or TSD 4314
being implemented within the third orientation yet within the
second location, such as corresponding to the right hand portion of
the top surface of the TSD 4410, the TSD 4410 interacts with the
3-D geometric object or TSD 4412 based on a sixth function.
[0431] Embodiment 4407 shows a fourth orientation such that the 3-D
geometric object or TSD 4412 is rotated counter-clockwise
90.degree. compared to the orientation of the 3-D geometric object
or TSD 4412 as is shown in the top middle of the diagram. In
embodiment 4407, based on the 3-D geometric object or TSD 4314
being implemented within the fourth orientation yet within the
first location, such as corresponding to the left hand portion of
the top surface of the TSD 4410, the TSD 4410 interacts with the
3-D geometric object or TSD 4412 based on a seventh function.
[0432] Embodiment 4408 also shows the fourth orientation such that
the 3-D geometric object or TSD 4412 is rotated counter-clockwise
90.degree. compared to the orientation of the 3-D geometric object
or TSD 4412 as is shown in the top middle of the diagram. In
embodiment 4408, based on the 3-D geometric object or TSD 4314
being implemented within the fourth orientation yet within the
second location, such as corresponding to the right hand portion of
the top surface of the TSD 4410, the TSD 4410 interacts with the
3-D geometric object or TSD 4412 based on an eighth function.
[0433] In some examples, such selectivity between different
respective functions is made based on both the location and the
orientation of the 3-D geometric object or TSD 4414 with respect to
the TSD 4410. For example, one or more processing modules of the
TSD 4410 is implemented to interpret signals provided from DSCs
that are coupled to electrodes of the TSD 4410 and to facilitate
selectivity between different respective functions based on both
the location and the orientation of the 3-D geometric object or TSD
4414 with respect to the TSD 4410.
[0434] As described above with respect to various embodiments,
examples, etc., a TSD is configured to detect various
characteristics including the presence, location, orientation,
and/or position, etc. of any another component or device, such as
another TSD, a 3-D geometric object, an overlay, a 3-D geometric
object including TSD functionality, etc. and to operate
appropriately based on the presence, location, orientation, and/or
position, etc. of the other component or device with respect to the
TSD. Various embodiments, examples, etc., are described below with
respect to operation of a TSD in accordance with region of interest
processing (ROIP) with respect to one or more portions of the TSD.
In certain implementations, such ROIP is performed with respect to
adapting sensitivity of one or more portions of the TSD based on
presence, location, orientation, and/or position, etc. of the other
component or device with respect to the TSD. In even other
alternative implementations, such ROIP is performed with respect to
adapting operation entirely, such as enabling/disabling operation
of one or more portions of the TSD based on presence, location,
orientation, and/or position, etc. of the other component or device
with respect to the TSD.
[0435] FIG. 45 is a schematic block diagram of an embodiment 4500
of an overlay that is operative with a TSD that is configured to
perform sensitivity based region of interest processing (ROIP) in
accordance with the present invention. In this diagram, and overlay
4520 is placed on a first portion of a surface of a TSD 4510. The
TSD 4510 is shown as having row and column electrodes, but with
respective the TSD 4510 of this diagram as well as any other TSD in
any other embodiment, example, diagram, etc., note that electrodes
implemented therein may be implemented in accordance with any
desired pattern, arrangement, configuration, etc. In addition, note
that the overlay 4520 of this diagram as well as any other overlay
in any other embodiment, example, diagram, etc. may be implemented
to include one or more electrodes in one or more keys thereof such
as to facilitate improved capacitive coupling with one or more
electrodes of the TSD 4510.
[0436] The first portion of the service of the TSD 4510 is
provision for the overlay 4520. The remaining portion of the
surface of the TSD 4510 is available for any of a number of other
functions that may include any one or more of non-overlay
functionality, as having unchanged sensitivity, being disabled,
etc.
[0437] As can be seen in the projection of the first portion of the
surface of the TSD 4510 and the overlay 4520 there on in the middle
left of the diagram, based on the TSD 4510 detecting the location,
position, identity, etc. of the overlay 4520, the TSD 4510 is
configured to adapt operation of the first portion of the surface
of the TSD 4510 that is associated with the overlay 4520. Moving
from left to right, as can be seen, a different level of
sensitivity is operated with respect to the electrodes associated
with the first portion of the surface of the TSD 4510 that is
associated with the overlay 4520. For example, as can be seen at
the bottom of the diagram, moving left right, the first portion of
the TSD 4510 is shown without the overlay 4520 there on to provide
better illustration of adaptation of the sensitivity of the first
portion of the TSD 4510.
[0438] On the bottom left of the diagram, the first portion of the
TSD 4510 is operated based on a first sensitivity, such as may be
associated with using all the available electrodes within the first
portion of the TSD 4510. On the bottom right of the diagram, the
first portion of the TSD 4510 is operated based on the second
sensitivity, which corresponds to a different sensitivity than the
first sensitivity. For example, the second sensitivity is
implemented using a subset of the electrodes within the first
portion of the TSD 4510. In one implementation, this corresponds to
using every other electrode in the first portion of the TSD 4510.
In another implementations corresponds to using every third
electrode in the first portion of the TSD 4510. This may correspond
to using every other electrode, every third electrode, etc.
corresponding to relevant column electrodes of the first portion of
the TSD 4510 that is associated with the overlay 4520.
[0439] Generally speaking, based on the TSD 4510 detecting the
location, position, identity, etc. the overlay 4520, the TSD 4510
is configured to adapt operation of the first portion of the TSD
4510 that is associated with the overlay 4520. Consider the overlay
4520 having keys that are of much greater size than the pitch,
spacing, etc. of the electrodes of the TSD 4510. In such an
instance, every electrode passing underneath the keys of the
overlay 4520 need not be used to detect user interaction with the
overlay 4520 that is associated with the TSD 4510. Consider an
example in which n (a positive integer greater than or equal to)
electrodes pass underneath a key of the overlay 4520, yet based on
the spacing of those electrodes being Y millimeters, where X is
some number such as 1, 1.5, 2, etc., and consider that the width of
a key of the overlay 40 is Y centimeters, where Y is some number
such as 1, 1.5, 2, etc. Then also consider that X is much less than
Y, then fewer than all of the n electrodes that pass underneath a
key of the overlay 4520 may be used and still detect user
interaction with that key of the overlay 4520 that is associated
with the TSD 4510 while still detecting and discriminating with
which particular key or keys of the overlay 4520 that the user is
interacting. In such instances, the TSD 4510 is configured to
operate based on a sensitivity that is less than the full
sensitivity of the first portion of the TSD 4510.
[0440] FIG. 46 is a schematic block diagram of another embodiment
4600 of an overlay that is operative with a TSD that is configured
to perform sensitivity based ROIP in accordance with the present
invention. This diagram is similar to the prior diagram with the
difference being that the first portion of the TSD 4510 is operated
using a third sensitivity that is less than a second sensitivity
used in the prior diagram. For example, the TSD 4510 is initially
operated using every other electrode in the first portion of the
TSD 4510. Based on acceptable operation and performance in
accordance with the second sensitivity, the TSD 4510 is
subsequently operated using every third electrode of the first
portion of the TSD 4510 in accordance with the third sensitivity
that is less than the second sensitivity. As may be desired, the
TSD 4510 is further adapted in terms of operation using fewer and
fewer electrodes in the first portion of the TSD 4510 until the
operation and performance fails to meet one or more performance
criteria. When operation and performance of the TSD 4510 in
cooperation with the overlay 4520 compares unfavorably with the one
or more performance criteria, the TSD 4510 is configured to adapt
operation to increase sensitivity within the first portion of the
TSD 4510. Then, based on this increasing sensitivity within the
first portion of the TSD 4510, when operation and performance of
the TSD 4510 in cooperation with the overlay 4520 compares
favorably with the one or more performance criteria, the TSD 4510
is configured to continue operation within this acceptable level of
sensitivity within the first portion of the TSD 4510.
[0441] Note that adapting the sensitivity of operation of the TSD
4510 can provide for many improvements in the operation of the TSD
4510 when interacting with the overlay 4520 including sensitivity
optimization, power management which may include power savings,
reduced power consumption, optimize power consumption, etc.,
adaptive sensitivity for improved detection of user interaction
with the overlay 4520 that is associated with the TSD 4510, etc.,
among other improvements.
[0442] FIG. 47 is a schematic block diagram of an embodiment 4700
of an overlay and a 3-D geometric object, which may or may not
include TSD functionality, that are both operative with a TSD that
is configured to perform sensitivity based ROIP in accordance with
the present invention. This diagram has certain similarities to the
previous two diagrams with at least one difference being that a
second TSD or 3-D geometric object 4712 is interactive with a TSD
4710 and allocation that is different than an overlay 4720. Similar
to previous diagrams, the first portion of the surface of the TSD
4710 is provisioned for operation based on the overlay 4720,
however, the second TSD or 3-D geometric object 4712 is operative
within another location of the TSD 4710. The remaining portion of
the surface of the TSD 4710 that is not included within the first
portion of the service of the TSD 4710 that is provisioned for the
overlay 4720, and particularly any portion of this remaining
portion of the service of the TSD 4710 that is not associated with
the second TSD or 3-D geometric object 4712 is available for any of
a number of other functions that may include any one or more of
non-overlay functionality, as having unchanged sensitivity, being
disabled, etc.
[0443] In this diagram, the TSD 4710 is configured to adapt the
sensitivity associated with the first portion of the surface of the
TSD 4710 that is provisioned for the overlay 4720 and/or that
portion included within the remaining portion of the service of the
TSD 4710 that is associated with the second TSD or 3-D geometric
object 4712. For example, the sensitivity within these portions of
the surface of the TSD 4710 may be increased, decreased, etc.
[0444] While certain embodiments, examples, diagrams, etc.
described herein correspond to situations where sensitivity of
different respective portions of a TSD may be adapted or modified
based on the TSD being implemented and operative in accordance with
any one or more of another TSD, and overlay, a 3-D geometric
object, etc., Other embodiments, examples, diagrams, etc. are
described below where sensitivity or touch sensing capability is
enabled or disabled for different respective portions of a TSD so
implemented.
[0445] In an example of operation and implementation, a TSD (e.g.,
TSD 4710 or any other TSD described herein or their equivalents)
includes a plurality of TSD electrodes associated with a surface of
the TSD. Also, an overlay that includes one or more marker
electrodes also being associated with a region of the surface of
the TSD.
[0446] The TSD also includes a plurality of drive-sense circuits
(DSCs) operably coupled to the plurality of TSD electrodes. A DSC
of the plurality of DSCs is operably coupled to receive a reference
signal and to generate a TSD electrode signal based on the
reference signal. When enabled, the DSC operably coupled and
configured to provide the TSD electrode signal to a TSD electrode
of the plurality of TSD electrodes and simultaneously to sense a
change of the TSD electrode signal based on a change of impedance
of the TSD electrode caused by capacitive coupling between the TSD
electrode and the one or more marker electrodes based on the
overlay being associated with the at least a portion of the surface
of the TSD. The DSC is also operably coupled and configured to
generate a digital signal that is representative of the change of
impedance of the TSD electrode.
[0447] The TSD includes or is coupled to memory that stores
operational instructions. The TSD also includes one or more
processing modules operably coupled to the plurality of DSCs and
the memory. When enabled, the one or more processing modules is
configured to execute the operational instructions to generate the
reference signal and to process the digital signal generated by the
DSC of the plurality of DSCs and a plurality of other digital
signals generated by other DSCs of the plurality of DSCs to
determine the region of the surface of the TSD that is associated
with the overlay. Also, the one or more processing modules is
configured to execute the operational instructions to adapt
sensitivity of the TSD within the region of the surface of the TSD
that is associated with the overlay including to change a number
operational electrodes of the plurality of TSD electrodes that are
implemented to service the region of the surface of the TSD that is
associated with the overlay in accordance with detecting user
interaction with the overlay.
[0448] In certain examples, when enabled, the one or more
processing modules is configured to execute the operational
instructions to adapt the sensitivity of the TSD within the region
of the surface of the TSD that is associated with the overlay
including to operate fewer than all of a subset of the plurality of
TSD electrodes that are implemented to service the region of the
surface of the TSD that is associated with the overlay in
accordance with detecting user interaction with the overlay.
[0449] In other examples, when enabled, the one or more processing
modules is configured to execute the operational instructions to
adapt the sensitivity of the TSD within the region of the surface
of the TSD that is associated with the overlay including to
increase the number operational electrodes of the plurality of TSD
electrodes that are implemented to service the region of the
surface of the TSD that is associated with the overlay in
accordance with detecting user interaction with the overlay.
[0450] In even other examples, when enabled, the one or more
processing modules is configured to execute the operational
instructions to process the digital signal generated by the DSC of
the plurality of DSCs to determine one or more characteristics of
the overlay that is associated with the region of the surface of
the TSD.
[0451] Examples of the one or more characteristics of the overlay
may include any one or more of an outline of the overlay, locations
of keys of the overlay, a location of the overlay on the surface of
the TSD, location of the one or more marker electrodes within the
at least a portion of the surface of the TSD, a pattern of the one
or more marker electrodes, a function of the overlay, a type of the
overlay, and/or an orientation of the overlay.
[0452] Also, in certain examples, the TSD is a portable device that
includes an internal power source (e.g., such as with respect to
FIG. 36).
[0453] Also, in some implementations of the TSD, note that the
plurality of TSD electrodes includes a first subset of the
plurality of TSD electrodes aligned in a first direction and a
second subset of the plurality of TSD electrodes that are separated
from the first subset of the plurality of TSD electrodes by a
dielectric material and are aligned in a second direction.
[0454] In addition, in some examples, the TSD includes multiple
sections (e.g., such as certain TSDs including depicted in FIGS.
27, 28, 34, 40, among others). The TSD has a first shape when the
multiple sections are implemented within a first configuration, and
the TSD has a second shape when the multiple sections are
implemented within a second configuration. Also, note that certain
implementations of the TSD include a non-flat surface and/or curved
surface (e.g., such as certain TSDs including depicted in FIG. 27,
among others).
[0455] In addition, note that the DSC of the plurality of DSCs may
be implemented in a variety of ways. For example, in one
implementation, the DSC of the plurality of DSCs includes a power
source circuit operably coupled via a single line to the TSD
electrode. When enabled, the power source circuit is configured to
provide an analog signal via the single line coupling to the TSD
electrode. Note that the analog signal includes at least one of a
DC (direct current) component or an oscillating component. The DSC
also includes a power source change detection circuit operably
coupled to the power source circuit. When enabled, the power source
change detection circuit is configured to detect an effect on the
analog signal that is based on an electrical characteristic of the
TSD electrode and to generate the digital signal that is
representative of the change of impedance of the TSD electrode.
[0456] In certain particular examples, the power source circuit
includes a power source to source at least one of a voltage or a
current via the single line to the TSD electrode. The power source
change detection circuit also includes a power source reference
circuit configured to provide at least one of a voltage reference
or a current reference, and a comparator configured to compare the
at least one of the voltage and the current provided via the single
line to the TSD electrode to the at least one of the voltage
reference and the current reference to produce the analog
signal.
[0457] In another example of operation and implementation, a TSD
(e.g., TSD 4710 or any other TSD described herein or their
equivalents) includes a plurality of TSD electrodes associated with
a surface of the TSD. Also, an overlay that includes one or more
marker electrodes is also associated with a region of the surface
of the TSD. Note that the plurality of TSD electrodes includes a
first subset of the plurality of TSD electrodes aligned in a first
direction and a second subset of the plurality of TSD electrodes
that are separated from the first subset of the plurality of TSD
electrodes by a dielectric material and are aligned in a second
direction.
[0458] The TSD also includes a plurality of drive-sense circuits
(DSCs) operably coupled to the plurality of TSD electrodes. A DSC
of the plurality of DSCs is operably coupled to receive a reference
signal and to generate a TSD electrode signal based on the
reference signal. When enabled, the DSC is operably coupled and
configured to provide the TSD electrode signal to a TSD electrode
of the plurality of TSD electrodes and simultaneously to sense a
change of the TSD electrode signal based on a change of impedance
of the TSD electrode caused by capacitive coupling between the TSD
electrode and the one or more marker electrodes based on the
overlay being associated with the at least a portion of the surface
of the TSD. The DSC is also operably coupled and configured to
generate a digital signal that is representative of the change of
impedance of the TSD electrode.
[0459] The TSD includes and/or is coupled to memory that stores
operational instructions. The TSD also includes one or more
processing modules operably coupled to the plurality of DSCs and
the memory When enabled, the one or more processing modules is
configured to execute the operational instructions to generate the
reference signal and to process the digital signal generated by the
DSC of the plurality of DSCs and a plurality of other digital
signals generated by other DSCs of the plurality of DSCs to
determine the region of the surface of the TSD that is associated
with the overlay to determine one or more characteristics of the
overlay that is associated with the region of the surface of the
TSD. The one or more processing modules is also configured to
execute the operational instructions to adapt sensitivity of the
TSD within the region of the surface of the TSD that is associated
with the overlay including to change a number operational
electrodes of the plurality of TSD electrodes that are implemented
to service the region of the surface of the TSD that is associated
with the overlay in accordance with detecting user interaction with
the overlay.
[0460] In certain examples, when enabled, the one or more
processing modules is configured to execute the operational
instructions to adapt the sensitivity of the TSD within the region
of the surface of the TSD that is associated with the overlay
including to operate fewer than all of another subset of the
plurality of TSD electrodes that are implemented to service the
region of the surface of the TSD that is associated with the
overlay in accordance with detecting user interaction with the
overlay.
[0461] In certain other examples, when enabled, the one or more
processing modules is configured to execute the operational
instructions to adapt the sensitivity of the TSD within the region
of the surface of the TSD that is associated with the overlay
including to increase the number operational electrodes of the
plurality of TSD electrodes that are implemented to service the
region of the surface of the TSD that is associated with the
overlay in accordance with detecting user interaction with the
overlay.
[0462] FIG. 48 is a schematic block diagram of an embodiment 4800
of an overlay that is operative with a TSD that is configured to
perform enable/disable based ROIP in accordance with the present
invention. In this diagram has some similarities to certain of the
previous diagrams in that a first portion of the surface of a TSD
4810 that is provisioned for an overlay 4820 that is placed thereon
operates in accordance with user interaction with the TSD 4810 in
the location of the first portion of the surface of the TSD 4810
that includes the overlay 4020. However, in this embodiment 4800,
touch sensing functionality within your regions other than the
overlay 4820 are disabled when the overlay 4820 is implemented to
facilitate user interaction in accordance with the TSD 4810.
[0463] In this diagram, the sensitivity within the region of the
overlay 4820 operates based on knee based on the typical
operational sensitivity of the TSD 4810. That is to say, the
sensitivity within the region of the overlay 4820 corresponding to
the first portion of the surface of the TSD 4810 remains unchanged
in this diagram.
[0464] FIG. 49 is a schematic block diagram of another embodiment
4900 of an overlay that is operative with a TSD that is configured
to perform enable/disable based ROIP in accordance with the present
invention. This diagram includes some similarities to the previous
diagram such that sensitivity or touch sensing capability is
disabled within regions of the remaining portion of the surface of
the TSD 4810 other than where the overlay 4820 is located. However,
in this diagram, sensitivity or touch sensing capability within the
region of the overlay 4820 corresponding to the first portion of
the surface of the TSD 4810 is modified or adapted. The sensitivity
within this first portion of the surface of the TSD 4810 that is
provisioned for the overlay 4820 may be increased, decreased,
etc.
[0465] For example, as described above with respect to other
embodiments, examples, etc., fewer than all of the electrodes
implemented within a TSD 4810 and specifically within the first
portion of the surface of the TSD 4810 may be used while still
facilitating user interaction with the overlay 4820 and the TSD
4810. In general, the sensitivity within the first portion of the
surface of the TSD 4810 may be modified differently at different
times, such as increased at a first time, decreased at a second
time, etc.
[0466] FIG. 50 is a schematic block diagram of an embodiment 5000
of an overlay and a 3-D geometric object, which may or may not
include TSD functionality, that are both operative with a TSD that
is configured to perform enable/disable based ROIP in accordance
with the present invention. This diagram has some similarities to
the previous diagrams with at least one difference being that a
second 3-D geometric object or TSD 5012 is also operative with the
TSD 4810 as is the overlay 4820.
[0467] In this diagram, sensitivity or touch sensing capability is
disabled in the remaining regions of the surface of the TSD 4810
that are not associated with the overlay 4824 the second 3-D
geometric object or TSD 5012.
[0468] FIG. 51 is a schematic block diagram of another embodiment
5100 of an overlay and a 3-D geometric object, which may or may not
include TSD functionality, that are both operative with a TSD that
is configured to perform enable/disable based ROIP in accordance
with the present invention. This diagram includes some similarities
to the previous diagram such that sensitivity or touch sensing
capability is disabled in the remaining regions of the surface of
the TSD 4810 that are not associated with the overlay 4824 the
second 3-D geometric object or TSD 5012. However, in this diagram,
sensitivity or touch sensing capability within the region of the
overlay 4820 corresponding to the first portion of the surface of
the TSD 4810 and/or within the region corresponding to the location
of the second 3-D geometric object or TSD 5012 is modified or
adapted. The sensitivity within this first portion of the surface
of the TSD 4810 that is provisioned for the overlay 4820 and/or
within the region corresponding to the location of the second 3-D
geometric object or TSD 5012 may be increased, decreased, etc.
[0469] Certain diagrams described below provide various
embodiments, examples, etc. of interfaceable devices that include
at least interfaceable TSD and one or more other devices. In some
implementations, this includes two or more fully independent and
interfaceable TSDs. In other implementations, this includes one or
more fully independent and interfaceable TSDs and one or more fully
dependent and interfaceable devices. In yet other implementations,
this includes one or more fully independent and interfaceable TSDs
and one or more partially dependent and interfaceable devices. In
even other implementations, this includes one or more fully
independent and interfaceable TSDs, one or more fully dependent and
interfaceable devices, and one or more partially dependent and
interfaceable devices. Generally speaking, various implementations
may be performed using interfaceable devices that include at least
interfaceable TSD to operate in a variety of ways and to provide
scalability of the operational area that may be serviced by TSD
functionality (e.g., by providing more than one device thereby
extending the useful operational area of the system).
[0470] FIG. 52 is a schematic block diagram of various embodiments
5201, 5202, 5203, and 5204 of TSDs that are configured to interface
with one or more other TSD and/or one or more other devices that
include one or more electrodes in accordance with the present
invention. In the upper left-hand portion of the diagram,
embodiment 5201 shows multiple DSCs that couple via multiplexers to
the respective row and column electrodes of a TSD. This provides
MUX DSC servicing of the electrodes of the TSD such that a given
DSC is configured to drive and simultaneously to sense one or more
signals, including detecting any change(s) thereof, that is/are
provided to one or more electrodes based on the selection of the
MUX (e.g., regarding to which electrodes the DSC is coupled to via
the MUX at a given time).
[0471] In an example of operation and implementation, a first DSC
is configured to drive and simultaneously to sense a first one or
more signals, including detecting any change(s) thereof, that
is/are provided to a first one or more electrodes at a first time,
and that first DSC is configured to drive and simultaneously to
sense a second one or more signals provided to a second one or more
electrodes at a second time. Also, a second DSC is configured to
drive and simultaneously to sense a third one or more signals,
including detecting any change(s) thereof, that is/are provided to
a third one or more electrodes at a third time, and that second DSC
is configured to drive and simultaneously to sense a fourth one or
more signals, including detecting any change(s) thereof, that
is/are provided to a fourth one or more electrodes at a fourth
time. In some examples, the first time and the third time are the
same, and the second time in the fourth time are the same. In other
examples, the first time and the fourth time are the same, and the
second time and the third time are the same.
[0472] In another example of operation and implementation, a DSC
that is configured coupled to certain electrodes via a MUX is
operative such that the MUX is implemented to connect two or more
electrodes together electrically such that those two or more
electrodes effectively operate as a single electrode. For example,
in accordance with other embodiments, examples, diagrams, etc.
described herein, including implementations in which a TSD operates
based on varying precision, sensitivity, etc., by electrically
tying two or more electrodes together, multiple electrodes may be
driven and simultaneously sense together, such that they are not
driven and simultaneously sensed individually.
[0473] In some examples, a first DSC is configured to drive and
simultaneously to sense a first signal provided to a first
electrode at a first time, and that first DSC is configured to
drive and simultaneously to sense a second signal, including
detecting any change thereof, that is provided to a second
electrodes at a second time. Also, a second DSC is configured to
drive and simultaneously to sense a third signal, including
detecting any change thereof, that is provided to a third electrode
at a third time, and that second DSC is configured to drive and
simultaneously to sense a fourth signal, including detecting any
change thereof, that is provided to a fourth electrode at a second
fourth time. In some examples, the first time and the third time
are the same, and the second time in the fourth time are the same.
In other examples, the first time and the fourth time are the same,
and the second time and the third time are the same.
[0474] In the upper right-hand portion of the diagram, embodiment
5202 shows multiple DSCs that couple on a one-to-one basis to the
respective row and column electrodes of the TSD.
[0475] Also, with respect to the embodiment 5201 and/or the
embodiment 5202, note that servicing of the respective electrodes
of the TSD may be performed from more than two sides of the TSD.
For example, similar implementations of DSCs with multiplexers may
be implemented on the right hand side and/or bottom of the TSD of
the embodiment 5201 in addition to the DSCs with multiplexers that
are implemented on the left-hand side and top of the TSD of the
embodiment 5201. That is to say, any one or more electrodes of the
TSD may be driven from both directions or both electrode ends as
desired in certain alternative embodiments.
[0476] For another example, similar implementations of DSCs
implemented on a one-to-one basis may be implemented on the right
hand side and/or bottom of the TSD of the embodiment 5202 in
addition to the DSCs implemented on a one-to-one basis on the
left-hand side and top of the TSD of the embodiment 5202. That is
to say, any one or more electrodes of the TSD may be driven from
both directions or both electrode ends as desired in certain
alternative embodiments.
[0477] Note that the use of DSCs that are coupled via multiplexers
to electrodes facilitates adaptive operation of the TSD, such as in
accordance with an implementation shown with respect to embodiment
5201. For example, any one or more of the electrodes that are
coupled to the one or more DSCs via the multiplexers may be
selected in accordance with enabling or disabling operation of a
portion of the TSD, adapting the sensitivity of any portion of the
TSD including increasing or decreasing the sensitivity of any
portion of the TSD, etc. With respect to an implementation in which
DSCs are coupled to electrodes on a one-to-one basis, such as in
accordance with an implementation shown with respect to embodiment
5202, selectivity of which of those DSCs is functional and
operational may be performed in accordance with enabling or
disabling operation of a portion of the TSD, adapting the
sensitivity of any portion of the TSD including increasing or
decreasing the sensitivity of any portion of the TSD, etc. For
example, those electrodes that are to be enabled or disabled,
turned on or turned off, etc., in accordance with such operations,
the desired one or more DSCs may be enabled or disabled, etc.
[0478] In the lower left-hand portion of the diagram, embodiment
5203 shows a vertical stack up or side view of DSCs that are
coupled to row and column electrodes. As can be seen, the DSCs are
implemented below the row and column electrodes in this embodiment
5203. One or more DSCs are coupled to one or more row electrodes,
such as in accordance with the embodiment 5201 using multiplexers
or embodiment 5202 on a one-to-one basis, Also, one or more other
DSCs are coupled to one or more column electrodes. such as in
accordance with the embodiment 5201 using multiplexers or
embodiment 5202 on a one-to-one basis. Note that one or more
dielectric layers may be implemented between the row and column
electrodes to keep them from coming in direct contact with one
another, yet facilitating capacitive coupling between them so that
one or more signals from the one or more row electrodes may be
coupled into the one or more column electrodes, and vice versa.
[0479] With respect to interface-ability of the various TSDs
described within this diagram, in certain examples, the top and
right-hand sides of the TSD are implemented to include male
connector sides, and the left and bottom sides of the TSD are
implemented to include female connector sides. As such, different
respective TSDs may be interfaced with one another based on the
male/female connector interfaces (I/Fs) of those different
respective TSDs, such that a male connector side interfaces with
female connector side. Alternatively, in other examples, the top
and right-hand sides of the TSD are implemented to include female
connector sides, and the left and bottom sides of the TSD are
implemented to include male connector sides. Generally speaking,
any desired interface that facilitates connection, coupling, and/or
capacitive coupling between electrodes of different respective TSDs
may be used to interface-ability of TSDs to provide scalability of
the operational area that may be serviced by TSD functionality
(e.g., by providing more than one device thereby extending the
useful operational area of the system).
[0480] As shown with respect embodiment 5204, note that the
embodiments 5201, 5202, and 5203, note that one or more respective
electrodes are coupled respectively to one or more DSCs, which may
be on a one to one basis such as with respect to embodiment 5202,
or via a multiplexed implementation such as with respect embodiment
5201. Also, the one or more DSCs are coupled to one or more
processing modules 42 that includes and/or is coupled to memory in
accordance with other embodiments, examples, diagrams, etc. as
described herein. A DSC is configured to drive and simultaneously
to sense a signal, including detecting any change thereof, that is
provided to an electrode. The DSC is configured to provide a signal
to the one or more processing modules 42 corresponding to at least
one electrical characteristic of the electrode and/or the signal
that is provided to the electrode, including any change of the
signal. The one or more processing modules 42 is configured to
process that signal received from the DSC to determine the at least
one electrical characteristic of the electrode and/or the
signal.
[0481] FIG. 53A is a schematic block diagram of an embodiment 5301
of TSDs that are interfaced in accordance with the present
invention. In this diagram, two separate TSDs are interfaced
together to form a touch sensor operative system that is larger
than any one of the TSDs. In this diagram, the two separate TSDs
are similar in size and shape, but note that they may be of
different size and shape in other embodiments, examples, etc.
[0482] Within this diagram, two respective TSDs are interfaced,
such as based on a male/female connector interface. Again, with
respect to this diagram and any other diagram herein that shows two
or more devices interfaced together, such interfacing may be
implemented in any of a variety of ways including male/female
connector interfaces (I/Fs) and generally any desired interface
that facilitates connection, coupling, and/or capacitive coupling
between electrodes of different respective devices.
[0483] With respect to the first TSD on the left-hand side,
multiple DSCs couple via multiplexers to the respective column
electrodes of the first TSD, and other multiple DSCs couple via
multiplexers to certain of the respective row electrodes of the
first TSD. With respect to the second TSD on the right-hand side,
multiple DSCs couple via multiplexers to the respective column
electrodes of the second TSD, and other multiple DSCs couple via
multiplexers to certain of the respective row electrodes of the
second TSD.
[0484] Being this diagram, the row electrodes of the first TSD and
the second TSD interface together, as can be seen by the red and
blue colored row electrodes. The column electrodes of the first TSD
and the second TSD are colored black. The column electrodes of the
first TSD and the second TSD did not interface together. They are
serviced by the multiple DSCs that are coupled via multiplexers to
the column electrodes of the first TSD in the second TSD,
respectively.
[0485] In the implementation of this diagram, the row electrodes
are shown as being serviced from both the DSCs on the left-hand
side of the diagram colored blue and the DSCs on the right-hand
side of the diagram colored red, both respectively coupled via
multiplexers to the row electrodes of the first TSD and the second
TSD, respectively. That is to say, the DSCs on the left-hand side
of the diagram and the right-hand side of the diagram, colored blue
and red, respectively, both operate to drive and simultaneously
sense signals via the respective row electrodes from the respective
ends of the row electrodes to the left of the first TSD and to the
right of the second TSD, respectively.
[0486] In certain alternative implementations, note that the column
electrodes may be serviced from both ends of a device, such that
one or more additional DSCs, such as coupled via multiplexers, may
be implemented at the bottom of the first TSD in the second TSD,
respectively, such that the column electrodes of the first TSD and
the second TSD are serviced from both ends.
[0487] Within this diagram and others that operate by servicing
electrodes from both ends of a device, whether that is left and
right, or top and bottom, note that different channels,
frequencies, signals, etc. are driven from the two ends of the
device. For example, in this diagram, the signals provided from the
blue colored DSCs on the left-hand side of the diagram operate
using different channels, frequencies, signals, etc. then the red
colored DSCs on the right-hand side of the diagram when servicing
the same electrodes.
[0488] FIG. 53B is a schematic block diagram of an embodiment 5302
of TSDs that are interfaced in accordance with the present
invention. This diagram is similar to the previous diagram with at
least one difference being that DSCs on the left-hand side of the
diagram that are colored blue only service the blue colored row
electrodes of the first TSD on the left-hand side of the diagram,
and the DSCs on the right-hand side of the diagram that are red
colored only service the red colored row electrodes of the second
TSD on the right-hand side of the diagram. Again, the respective
row electrodes, both blue colored in red colored, are interfaced
together such that the DSCs that are implemented to service the
blue or red colored row electrodes of one of the TSDs also services
those same colored row electrodes of the other TSD via the
interface between the first TSD and the second TSD.
[0489] For example, the blue colored DSCs on the left-hand side of
the diagram that service the blue colored row electrodes of the
first TSD on the left-hand side of the diagram also service the
blue colored row electrodes of the second TSD on the right-hand
side of the diagram via the interface between the first TSD and the
second TSD. Similarly, the red colored DSCs on the right-hand side
of the diagram that serviced the red colored row electrodes of the
second TSD on the right-hand side of the diagram also service the
red colored row electrodes of the first TSD on the left-hand side
of the diagram via the interface between the first TSD and the
second TSD.
[0490] FIG. 54A is a schematic block diagram of another embodiment
5401 of TSDs that are interfaced in accordance with the present
invention. In this diagram, four separate TSDs are interfaced
together to form a touch sensor operative system that is larger
than any one of the TSDs. In this diagram, a first two of the TSDs
are similar in size and shape, and the two other of the TSDs are
similar in size and shape yet of different size and shape than the
first two of the TSDs.
[0491] In this diagram, the row and column electrodes of the
interfaced TSDs are driven and simultaneously sensed from both ends
such that a first group of DSCs. For example, black colored DSCs
are coupled via multiplexers to the column electrodes of the top
left and the top right TSDs, and green colored DSCs are coupled via
multiplexers to the column electrodes of the bottom left in the
bottom right TSDs. Similarly, blue colored DSCs are coupled via
multiplexers to the row electrodes of the top left and the bottom
left TSDs, and red colored DSCs a couple via multiplexers to the
top right and bottom right TSDs.
[0492] Also, within this diagram and others that operate by
servicing electrodes from both ends of a device (e.g., FIG. 53A),
whether that is left and right, or top and bottom, note that
different channels, frequencies, signals, etc. are driven from the
two ends of the device. For example, in this diagram, the signals
provided from the blue colored DSCs on the left-hand side of the
diagram operate using different channels, frequencies, signals,
etc. then the red colored DSCs on the right-hand side of the
diagram when servicing the same electrodes. Similarly, the signals
provided from the black colored DSCs on the top of the diagram
operate using different channels, frequencies, signals, etc. then
the green colored DSCs on the bottom side of the diagram when
servicing the same electrodes.
[0493] FIG. 54B is a schematic block diagram of another embodiment
5402 of TSDs that are interfaced in accordance with the present
invention. This diagram is similar to the previous diagram with at
least one difference being that DSCs on the left-hand side of the
diagram that are colored blue only service the blue colored row
electrodes of the top left TSD and the bottom left TSD, and the
DSCs on the right-hand side of the diagram that are red colored
only service the red colored row electrodes of the top right TSD
and the bottom right TSD. Also, DSCs on the top of the diagram that
are black blue only service the black colored column electrodes of
the top left TSD and the top right TSD, and the DSCs on the bottom
of the diagram that are green colored only service the green
colored column electrodes of the bottom left TSD and the bottom
right TSD.
[0494] Again, the respective row electrodes, both blue colored in
red colored, are interfaced together such that the DSCs that are
implemented to service the blue or red colored row electrodes of
one of the TSDs (e.g., top left and bottom left TSDs and top right
and bottom right TSDs) also services those same colored row
electrodes of the other TSDs via the interfaces between the TSDs.
Similarly, the respective column electrodes, both black and green
colored, are interfaced together such that the DSCs that are
implemented to service the black or green colored column electrodes
of one of the TSDs (e.g., top left and top right TSDs and bottom
left and bottom right TSDs) also services those same colored row
electrodes of the other TSDs via the interfaces between the
TSDs.
[0495] For example, the blue colored DSCs on the left-hand side of
the diagram that serviced the blue colored row electrodes of the
top left and bottom left TSDs on the left-hand side of the diagram
also service the blue colored row electrodes of the top right and
bottom right TSDs on the right-hand side of the diagram via the
interfaces between the top left TSD and the top right TSD as well
as the bottom left TSD and the bottom right TSD, respectively.
Similarly, the red colored DSCs on the right-hand side of the
diagram that serviced the red colored row electrodes of the top
right and bottom right TSDs on the right-hand side of the diagram
also service the red colored row electrodes of the top left and
bottom left TSDs on the left-hand side of the diagram via the
interfaces between the top left TSD and the top right TSD as well
as the bottom left TSD and the bottom right TSD, respectively.
[0496] Similarly, the black colored DSCs on the top of the diagram
and the green colored DSCs on the bottom of the diagram service
respectively the black colored column electrodes and the green
colored column electrodes including the black colored column
electrodes in the green colored column electrodes of the TSDs to
which they are not particularly coupled via the interfaces between
the top left TSD and the bottom left TSD as well as the top right
TSD and the bottom right TSD, respectively.
[0497] FIG. 55 is a schematic block diagram of various embodiments
5501, 5502, 5503, 5504, and 5505 of TSDs that are interfaced in
accordance with the present invention. This diagram shows various
ways in which TSDs may be interfaced together to form a touch
sensor operative system that is larger than any one of the TSDs. In
this diagram, the different respective TSDs are shown as having a
similar size and shape, yet different respective TSDs, devices,
etc. may be of different size and shape and other examples.
[0498] Embodiment 5501 shows two TSDs implemented side-by-side, on
left and right. Alternatively, two TSDs could be implemented
side-by-side, on top and bottom.
[0499] In addition, while many of the embodiments, examples, etc.
herein show interfacing of two or more TSDs such that they align
with one another along a particular edge, such as to TSDs having
the same with and height for having the same width only, etc., note
that an alternative implementation of interfacing two or more TSDs
may be made such that only a portion of the TSDs are aligned with
one another along a particular edge. For example, less than a
portion of a first TSD and the second TSD may be aligned along a
given edge, such that only some, fewer than all, of the row or
column electrodes of the first TSD and the second TSD interface
with one another and the other row or column electrodes do not
interface with one another. For example, there may be instances in
which a non-symmetric touch sensor operative system is desired. For
example, consider embodiment 5502 in which fewer than all of the
row electrodes of the first TSD in the second TSD interface with
one another. This is one possible manner by which a non-symmetric
touch sensor operative system may be implemented.
[0500] Embodiment 5503 shows four TSDs implemented in a 2.times.2
pattern formed a touch sensor operative system. Embodiment 5504
shows four TSDs implemented in a cross pattern touch sensor
operative system to form a touch sensor operative system.
Embodiment 5505 shows two implementations of touch sensor operative
systems. For example, one implementation includes three TSDs (TSD
1, 2, and 3) aligned in a row with respect to one another to form a
first touch sensor operative system, and another implementation
includes six TSDs (TSD 1, 2, 3, 4, 5, and 6) aligned in two rows
and three columns with respect to one another to form a second
touch sensor operative system. Generally speaking, any number of
rows and columns of TSDs may be implemented. Embodiment 5506 shows
8 TSDs implemented in an alternative cross pattern to that of
embodiment 5504 to form a touch sensor operative system.
[0501] FIG. 56 is a schematic block diagram of other various
embodiments 5601, 5602, 5603, 5604, 5605, 5606, and 5607 of TSDs
that are configured to interface with one or more other TSD and/or
one or more other devices that include one or more electrodes in
accordance with the present invention.
[0502] In the upper left-hand portion of the diagram, embodiment
5601 shows DSCs that couple via multiplexers to the respective row
and column electrodes, respectively, of a TSD. This provides MUX
DSC servicing of the electrodes of the TSD such that a given DSC is
configured to drive and simultaneously to sense one or more
signals, including detecting any change(s) thereof, that is/are
provided to one or more electrodes based on the selection of the
MUX (e.g., regarding to which electrodes the DSC is coupled via the
MUX at a given time). For example, this diagram shows a TSD with
three row electrodes and four column electrodes service
respectively by two DSCs that couple via multiplexers to the
respective row and column electrodes, respectively, of a TSD.
[0503] In the upper right-hand portion of the diagram, embodiment
5602 shows multiple DSCs that couple on a one-to-one basis to the
respective row and column electrodes of the TSD. For example, this
diagram shows a TSD with three row electrodes and four column
electrodes serviced respectively by seven DSCs.
[0504] Note that certain implementations of TSDs include more row
electrodes and/or more column electrodes then shown in the
embodiments 5601 and 5602 as well as other diagrams included
herein. These relatively small number of row and column electrodes
(e.g., three row electrodes and four column electrodes) implemented
within TSDs are used for illustration. In certain examples, a TSD
includes tens, hundreds, thousands, etc. or an even larger number
of row electrodes and/or tens, hundreds, thousands, etc. or an even
larger number of column electrodes.
[0505] In the bottom left-hand portion of the diagram, embodiment
5603 shows a device that includes electrodes only. This is a fully
dependent device that can be interfaced with one or more other
devices such as a fully independent TSD, a partially dependent TSD,
or another device that includes electrodes only. The device shown
in the embodiment 5603 provides yet another option for scalability
of a touch sensor operative system including using components that
are not individually active or independent, yet when interfaced
with an active device, either directly or via an interface with one
or more other devices, is operative to provide a touch sensor
operative system.
[0506] Embodiment 5604 shows a partially dependent TSD such that
row electrodes are serviced by a DSC that is coupled via a
multiplexer. The column electrodes of the partially dependent TSD
of the embodiment 5604 are dependent and operative to facilitate
scaling of a touch sensor capable work area when interfaced with an
active device, either directly or via an interface with one or more
other devices.
[0507] Embodiment 5605 shows another partially dependent TSD such
that the row electrodes are serviced by multiple DSCs that couple
on a one-to-one basis to the respective row electrodes of the
partially dependent TSD. Similar to the embodiment 5604, the column
electrodes of the partially dependent TSD of the embodiment 5605
are dependent and operative to facilitate scaling of a touch sensor
capable work area when interfaced with an active device, either
directly or via an interface with one or more other devices.
[0508] Embodiments 5606 and 5607 are similar to the embodiments
5604 and 5605, respectively, with the difference being that the
column electrodes are serviced by one or more DSCs, and the row
electrodes of these partially dependent TSDs of the embodiments
5606 and 5607 are dependent and operative to facilitate scaling of
a touch sensor operative system when interfaced with an active
device, either directly or via an interface with one or more other
devices.
[0509] Generally speaking, a touch sensor operative system may be
implemented in any of a variety of configurations using the various
building blocks shown in this diagram of independent TSDs,
dependent TSDs including fully dependent or partially dependent
TSDs. In an example of operation and implementation, at least one
independent TSD is implemented within the system to facilitate
active operation of a touch sensor operative system. That is to
say, the at least one independent TSD is configured to facilitate
TSD operation and functionality for any one or more electrodes of a
dependent or partially dependent TSD via coupling of signals from
the at least one independent TSD to the one or more electrodes of
the dependent or partially dependent TSD.
[0510] FIG. 57 is a schematic block diagram of various embodiments
5701, 5702, and 5703 of TSDs and/or one or more other devices that
include one or more electrodes that are interfaced in accordance
with the present invention.
[0511] This diagram shows various possible ways in which the
various building blocks shown in the previous diagram may be
implemented to provide a touch sensor operative system of any
desired size based on the scalability of their respective building
blocks of the prior diagram.
[0512] For example, embodiment 5701 shows an implementation that
includes a TSD selected from the embodiment 5601 or 5602 that is
interfaced to the left of a TSD that is selected from the
embodiment 5606 or 5607. For example, the respective electrodes of
the TSDs may be serviced by one or more DSCs the coupled to the
electrodes via one or more multiplexers or using multiple DSCs that
couple on a one-to-one basis to the electrodes of the TSDs.
[0513] Embodiment 5702 shows an implementation that includes four
respective TSDs. In the upper left hand corner of embodiment 5702
is a TSD selected from the embodiment 5601 or 5602. In the upper
right-hand corner of the embodiment 5702 is a TSD selected from the
embodiment 5606 or 5607. In the lower left hand corner of the
embodiment 5702 is a TSD selected from the embodiment 5604 or 5605.
In the lower right-hand corner of the embodiment 5702 is a TSD
selected from the embodiment 5603. Note that the TSD selected from
the embodiment 5603 is a fully dependent device that includes
electrodes only, yet is operational when interfaced with one or
more of the other TSDs shown in the embodiment 5702.
[0514] Embodiment 5703 shows additional scalability of a touch
sensor operative system using various building blocks as shown in
the prior diagram. In embodiment 5703, the upper left-hand corner
includes a TSD selected from the embodiment 5601 or 5602. To the
right of this TSD is another TSD selected from embodiment 5606 or
5607. Note that any number of one or more additional TSDs selected
from embodiment 5606 or 5607 may be implemented to the right to
extend the touch sensor operative system to any desired size.
Extending down the left-hand most column of the embodiment 5703 or
one or more TSDs selected from the embodiment 5604 or 5605. Note
that any number of one or more additional TSDs selected from
embodiment 5604 or 5605 may be implemented down the left-hand most
column of the embodiment 5703 to extend the touch sensor operative
system to any desired size. The lower right-hand portion of the
embodiment 5703 includes any desired number of TSDs selected from
the embodiment 5603. Again, note that the TSD selected from the
embodiment 5603 is a fully dependent device that includes
electrodes only, yet is operational when interfaced with one or
more of the other TSDs shown in the embodiment 5703.
[0515] Note that such embodiments, examples, etc. as shown herein
with respect to the interfacing of different respective devices in
accordance with generating a touch sensor operative system are not
exhaustive of all possible combinations, and the principles
described herein a be used to generate other tech sensor operative
systems of any desired size, configuration, shape, etc.
[0516] It is noted that terminologies as may be used herein such as
bit stream, stream, signal sequence, etc. (or their equivalents)
have been used interchangeably to describe digital information
whose content corresponds to any of a number of desired types
(e.g., data, video, speech, text, graphics, audio, etc. any of
which may generally be referred to as `data`).
[0517] As may be used herein, the terms "substantially" and
"approximately" provide an industry-accepted tolerance for its
corresponding term and/or relativity between items. For some
industries, an industry-accepted tolerance is less than one percent
and, for other industries, the industry-accepted tolerance is 10
percent or more. Other examples of industry-accepted tolerance
range from less than one percent to fifty percent.
Industry-accepted tolerances correspond to, but are not limited to,
component values, integrated circuit process variations,
temperature variations, rise and fall times, thermal noise,
dimensions, signaling errors, dropped packets, temperatures,
pressures, material compositions, and/or performance metrics.
Within an industry, tolerance variances of accepted tolerances may
be more or less than a percentage level (e.g., dimension tolerance
of less than +/-1%). Some relativity between items may range from a
difference of less than a percentage level to a few percent. Other
relativity between items may range from a difference of a few
percent to magnitude of differences.
[0518] As may also be used herein, the term(s) "configured to",
"operably coupled to", "coupled to", and/or "coupling" includes
direct coupling between items and/or indirect coupling between
items via an intervening item (e.g., an item includes, but is not
limited to, a component, an element, a circuit, and/or a module)
where, for an example of indirect coupling, the intervening item
does not modify the information of a signal but may adjust its
current level, voltage level, and/or power level. As may further be
used herein, inferred coupling (i.e., where one element is coupled
to another element by inference) includes direct and indirect
coupling between two items in the same manner as "coupled to".
[0519] As may even further be used herein, the term "configured
to", "operable to", "coupled to", or "operably coupled to"
indicates that an item includes one or more of power connections,
input(s), output(s), etc., to perform, when activated, one or more
its corresponding functions and may further include inferred
coupling to one or more other items. As may still further be used
herein, the term "associated with", includes direct and/or indirect
coupling of separate items and/or one item being embedded within
another item.
[0520] As may be used herein, the term "compares favorably",
indicates that a comparison between two or more items, signals,
etc., provides a desired relationship. For example, when the
desired relationship is that signal 1 has a greater magnitude than
signal 2, a favorable comparison may be achieved when the magnitude
of signal 1 is greater than that of signal 2 or when the magnitude
of signal 2 is less than that of signal 1. As may be used herein,
the term "compares unfavorably", indicates that a comparison
between two or more items, signals, etc., fails to provide the
desired relationship.
[0521] As may be used herein, one or more claims may include, in a
specific form of this generic form, the phrase "at least one of a,
b, and c" or of this generic form "at least one of a, b, or c",
with more or less elements than "a", "b", and "c". In either
phrasing, the phrases are to be interpreted identically. In
particular, "at least one of a, b, and c" is equivalent to "at
least one of a, b, or c" and shall mean a, b, and/or c. As an
example, it means: "a" only, "b" only, "c" only, "a" and "b", "a"
and "c", "b" and "c", and/or "a", "b", and "c".
[0522] As may also be used herein, the terms "processing module",
"processing circuit", "processor", "processing circuitry", and/or
"processing unit" may be a single processing device or a plurality
of processing devices. Such a processing device may be a
microprocessor, micro-controller, digital signal processor,
microcomputer, central processing unit, field programmable gate
array, programmable logic device, state machine, logic circuitry,
analog circuitry, digital circuitry, and/or any device that
manipulates signals (analog and/or digital) based on hard coding of
the circuitry and/or operational instructions. The processing
module, module, processing circuit, processing circuitry, and/or
processing unit may be, or further include, memory and/or an
integrated memory element, which may be a single memory device, a
plurality of memory devices, and/or embedded circuitry of another
processing module, module, processing circuit, processing
circuitry, and/or processing unit. Such a memory device may be a
read-only memory, random access memory, volatile memory,
non-volatile memory, static memory, dynamic memory, flash memory,
cache memory, and/or any device that stores digital information.
Note that if the processing module, module, processing circuit,
processing circuitry, and/or processing unit includes more than one
processing device, the processing devices may be centrally located
(e.g., directly coupled together via a wired and/or wireless bus
structure) or may be distributedly located (e.g., cloud computing
via indirect coupling via a local area network and/or a wide area
network). Further note that if the processing module, module,
processing circuit, processing circuitry and/or processing unit
implements one or more of its functions via a state machine, analog
circuitry, digital circuitry, and/or logic circuitry, the memory
and/or memory element storing the corresponding operational
instructions may be embedded within, or external to, the circuitry
comprising the state machine, analog circuitry, digital circuitry,
and/or logic circuitry. Still further note that, the memory element
may store, and the processing module, module, processing circuit,
processing circuitry and/or processing unit executes, hard coded
and/or operational instructions corresponding to at least some of
the steps and/or functions illustrated in one or more of the
Figures. Such a memory device or memory element can be included in
an article of manufacture.
[0523] One or more embodiments have been described above with the
aid of method steps illustrating the performance of specified
functions and relationships thereof. The boundaries and sequence of
these functional building blocks and method steps have been
arbitrarily defined herein for convenience of description.
Alternate boundaries and sequences can be defined so long as the
specified functions and relationships are appropriately performed.
Any such alternate boundaries or sequences are thus within the
scope and spirit of the claims. Further, the boundaries of these
functional building blocks have been arbitrarily defined for
convenience of description. Alternate boundaries could be defined
as long as the certain significant functions are appropriately
performed. Similarly, flow diagram blocks may also have been
arbitrarily defined herein to illustrate certain significant
functionality.
[0524] To the extent used, the flow diagram block boundaries and
sequence could have been defined otherwise and still perform the
certain significant functionality. Such alternate definitions of
both functional building blocks and flow diagram blocks and
sequences are thus within the scope and spirit of the claims. One
of average skill in the art will also recognize that the functional
building blocks, and other illustrative blocks, modules and
components herein, can be implemented as illustrated or by discrete
components, application specific integrated circuits, processors
executing appropriate software and the like or any combination
thereof.
[0525] In addition, a flow diagram may include a "start" and/or
"continue" indication. The "start" and "continue" indications
reflect that the steps presented can optionally be incorporated in
or otherwise used in conjunction with one or more other routines.
In addition, a flow diagram may include an "end" and/or "continue"
indication. The "end" and/or "continue" indications reflect that
the steps presented can end as described and shown or optionally be
incorporated in or otherwise used in conjunction with one or more
other routines. In this context, "start" indicates the beginning of
the first step presented and may be preceded by other activities
not specifically shown. Further, the "continue" indication reflects
that the steps presented may be performed multiple times and/or may
be succeeded by other activities not specifically shown. Further,
while a flow diagram indicates a particular ordering of steps,
other orderings are likewise possible provided that the principles
of causality are maintained.
[0526] The one or more embodiments are used herein to illustrate
one or more aspects, one or more features, one or more concepts,
and/or one or more examples. A physical embodiment of an apparatus,
an article of manufacture, a machine, and/or of a process may
include one or more of the aspects, features, concepts, examples,
etc. described with reference to one or more of the embodiments
discussed herein. Further, from figure to figure, the embodiments
may incorporate the same or similarly named functions, steps,
modules, etc. that may use the same or different reference numbers
and, as such, the functions, steps, modules, etc. may be the same
or similar functions, steps, modules, etc. or different ones.
[0527] Unless specifically stated to the contra, signals to, from,
and/or between elements in a figure of any of the figures presented
herein may be analog or digital, continuous time or discrete time,
and single-ended or differential. For instance, if a signal path is
shown as a single-ended path, it also represents a differential
signal path. Similarly, if a signal path is shown as a differential
path, it also represents a single-ended signal path. While one or
more particular architectures are described herein, other
architectures can likewise be implemented that use one or more data
buses not expressly shown, direct connectivity between elements,
and/or indirect coupling between other elements as recognized by
one of average skill in the art.
[0528] The term "module" is used in the description of one or more
of the embodiments. A module implements one or more functions via a
device such as a processor or other processing device or other
hardware that may include or operate in association with a memory
that stores operational instructions. A module may operate
independently and/or in conjunction with software and/or firmware.
As also used herein, a module may contain one or more sub-modules,
each of which may be one or more modules.
[0529] As may further be used herein, a computer readable memory
includes one or more memory elements. A memory element may be a
separate memory device, multiple memory devices, or a set of memory
locations within a memory device. Such a memory device may be a
read-only memory, random access memory, volatile memory,
non-volatile memory, static memory, dynamic memory, flash memory,
cache memory, and/or any device that stores digital information.
The memory device may be in a form a solid-state memory, a hard
drive memory, cloud memory, thumb drive, server memory, computing
device memory, and/or other physical medium for storing digital
information.
[0530] While particular combinations of various functions and
features of the one or more embodiments have been expressly
described herein, other combinations of these features and
functions are likewise possible. The present disclosure is not
limited by the particular examples disclosed herein and expressly
incorporates these other combinations.
* * * * *