U.S. patent application number 16/966146 was filed with the patent office on 2021-07-29 for circuit backplane of display panel, method for manufacturing the circuit backplane, and display panel.
The applicant listed for this patent is BOE TECHNOLOGY GROUP CO., LTD.. Invention is credited to Zhanfeng CAO, Haixu LI, Ke WANG.
Application Number | 20210233940 16/966146 |
Document ID | / |
Family ID | 1000005556549 |
Filed Date | 2021-07-29 |
United States Patent
Application |
20210233940 |
Kind Code |
A1 |
LI; Haixu ; et al. |
July 29, 2021 |
CIRCUIT BACKPLANE OF DISPLAY PANEL, METHOD FOR MANUFACTURING THE
CIRCUIT BACKPLANE, AND DISPLAY PANEL
Abstract
A circuit backplane of a display panel, a method for
manufacturing the same, and a display panel are provided. The
circuit backplane includes a substrate and a plurality of circuit
regions on the substrate. Each of the plurality of circuit regions
includes a cathode soldered electrode, an anode soldered electrode,
and a flow blocking island that are on the substrate. The flow
blocking island is between the cathode soldered electrode and the
anode soldered electrode, and in a thickness direction of the
circuit backplane, a height of the flow blocking island is greater
than each of a height of the cathode soldered electrode and a
height of the anode soldered electrode.
Inventors: |
LI; Haixu; (Beijing, CN)
; CAO; Zhanfeng; (Beijing, CN) ; WANG; Ke;
(Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BOE TECHNOLOGY GROUP CO., LTD. |
Beijing |
|
CN |
|
|
Family ID: |
1000005556549 |
Appl. No.: |
16/966146 |
Filed: |
December 25, 2019 |
PCT Filed: |
December 25, 2019 |
PCT NO: |
PCT/CN2019/128125 |
371 Date: |
July 30, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 25/167 20130101;
H01L 27/1259 20130101; H01L 2224/32145 20130101; H01L 27/124
20130101; H01L 27/1248 20130101; H01L 24/32 20130101; H01L 33/62
20130101; H01L 2224/26145 20130101; H01L 2924/12041 20130101 |
International
Class: |
H01L 27/12 20060101
H01L027/12; H01L 25/16 20060101 H01L025/16; H01L 23/00 20060101
H01L023/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 28, 2019 |
CN |
201910149604.5 |
Claims
1. A circuit backplane of a display panel, comprising a substrate
and a plurality of circuit regions on the substrate, wherein each
of the plurality of circuit regions comprises a cathode soldered
electrode, an anode soldered electrode, and a flow blocking island
that are on the substrate; and the flow blocking island is between
the cathode soldered electrode and the anode soldered electrode,
and in a thickness direction of the circuit backplane, a height of
the flow blocking island is greater than each of a height of the
cathode soldered electrode and a height of the anode soldered
electrode.
2. The circuit backplane according to claim 1, wherein each of the
plurality of circuit regions further comprises: a drive circuit on
the substrate, a planarization layer between the drive circuit and
a layer where the cathode soldered electrode and the anode soldered
electrode are located, and an electrode protection layer on the
layer where the cathode soldered electrode and the anode soldered
electrode are located; wherein the flow blocking island comprises a
protruding portion of the planarization layer between the cathode
soldered electrode and the anode soldered electrode, and a portion
of the electrode protection layer on the protruding portion.
3. The circuit backplane according to claim 2, wherein the
protruding portion has slope surfaces proximal to the cathode
soldered electrode and the anode soldered electrode,
respectively.
4. The circuit backplane according to claim 3, wherein an angle
between each of the slope surfaces and the substrate is in a range
of [50.degree., 80.degree.].
5. The circuit backplane according to claim 2, further comprising a
plurality of flow blocking grooves in a portion of the electrode
protection layer on each slope surface.
6. The circuit backplane according to claim 5, wherein an
orthographic projection of each of the plurality of flow blocking
grooves on the substrate is a circular arc, a circle center of the
circular arc of each of the flow blocking grooves on the slope
surface proximal to the cathode soldered electrode is proximal to
the cathode soldered electrode, and a circle center of the circular
arc of each of the flow blocking grooves on the slope surface
proximal to the anode soldered electrode is proximal to the anode
soldered electrode.
7. The electrical circuit backplane according to claim 5, wherein
the electrode protection layer has a thickness in a range of [3,500
.ANG., 6,500 .ANG.].
8. A method for manufacturing a circuit backplane of a display
panel, comprising: forming a driver circuit in each circuit region
on a substrate; forming a planarization layer on the driver circuit
by using a half-mask process; forming a cathode soldered electrode
and an anode soldered electrode on the planarization layer; and
forming an electrode protection layer on a layer where the cathode
soldered electrode and the anode soldered electrode are located;
wherein the planarization layer has a protruding portion between
the cathode soldered electrode and the anode soldered electrode,
and the protruding portion and a portion of the electrode
protection layer on the protruding portion form a flow blocking
island.
9. The method according to claim 8, wherein the forming an
electrode protection layer on a layer where the cathode soldered
electrode and the anode soldered electrode are located comprises:
forming a plurality of flow blocking grooves in a portion of the
electrode protection layer on each of slope surfaces of the
protruding portion, wherein the slope surfaces are proximal to the
cathode soldered electrode and the anode soldered electrode,
respectively.
10. A display panel, comprising the circuit backplane according to
claim 1 and a plurality of micro LEDs, wherein an anode and a
cathode of each of the plurality of micro LEDs are respectively
fixed to the anode soldered electrode and the cathode soldered
electrode in a corresponding circuit region of the circuit
backplane by silver paste.
11. The circuit backplane according to claim 3, further comprising
a plurality of flow blocking grooves in a portion of the electrode
protection layer on each slope surface.
12. The circuit backplane according to claim 4, further comprising
a plurality of flow blocking grooves in a portion of the electrode
protection layer on each slope surface.
13. The method according to claim 9, wherein an angle between each
of the slope surfaces and the substrate is in a range of
[50.degree., 80.degree.].
14. The method according to claim 13, further comprising: forming a
plurality of flow blocking grooves in a portion of the electrode
protection layer on each slope surface.
15. The method according to claim 14, wherein an orthographic
projection of each of the plurality of flow blocking grooves on the
substrate is a circular arc, a circle center of the circular arc of
each of the flow blocking grooves on the slope surface proximal to
the cathode soldered electrode is proximal to the cathode soldered
electrode, and a circle center of the circular arc of each of the
flow blocking grooves on the slope surface proximal to the anode
soldered electrode is proximal to the anode soldered electrode.
16. The method according to claim 14, wherein the electrode
protection layer has a thickness in a range of [3,500 .ANG., 6,500
.ANG.].
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims the priority of Chinese
patent application No. 201910149604.5, filed on Feb. 28, 2019, the
content of which is incorporated herein in its entirety by
reference.
TECHNICAL FIELD
[0002] The present disclosure relates to the technical field of
display panels, and in particular, to a circuit backplane of a
display panel, a method for manufacturing a circuit backplane of a
display panel, and a display panel.
BACKGROUND
[0003] Micro light-emitting diodes (LEDs) may be formed by
thinning, miniaturizing, and arraying LEDs, next transferring the
resultant (arrayed) LEDs to a circuit backplane in batches, and
then forming a protection layer and an electrode to encapsulate the
circuit backplane. As compared with the related OLED technologies,
the formed micro LEDs have advantages of higher brightness, higher
light-emitting efficiency, and lower power consumption.
SUMMARY
[0004] In a first aspect, embodiments of the present disclosure
provide a circuit backplane of a display panel, the circuit
backplane including a substrate and a plurality of circuit regions
on the substrate, wherein
[0005] each of the plurality of circuit regions includes a cathode
soldered electrode, an anode soldered electrode, and a flow
blocking island that are on the substrate; and
[0006] the flow blocking island is between the cathode soldered
electrode and the anode soldered electrode, and in a thickness
direction of the circuit backplane, a height of the flow blocking
island is greater than each of a height of the cathode soldered
electrode and a height of the anode soldered electrode.
[0007] In the embodiments of the present disclosure, the flow
blocking island is provided between the cathode soldered electrode
and the anode soldered electrode on the circuit backplane, and in
the thickness direction of the circuit backplane, a height of the
flow blocking island is greater than each of a height of the
cathode soldered electrode and a height of the anode soldered
electrode. As such, the flow blocking island can block the flowing
of the silver paste used for soldering an anode and a cathode of
each micro LED during formation of a display panel, so as to avoid
short circuit caused by the connection of the anode and the cathode
due to the flowing of the silver paste.
[0008] In a possible embodiment, each of the plurality of circuit
regions further includes: a drive circuit on the substrate, a
planarization layer between the drive circuit and a layer where the
cathode soldered electrode and the anode soldered electrode are
located, and an electrode protection layer on the layer where the
cathode soldered electrode and the anode soldered electrode are
located;
[0009] wherein the flow blocking island includes a protruding
portion of the planarization layer between the cathode soldered
electrode and the anode soldered electrode, and a portion of the
electrode protection layer on the protruding portion.
[0010] In an embodiment of the present disclosure, the flow
blocking island can be formed by the planarization layer and the
electrode protection layer on the substrate, and needs not being
provided separately, thereby simplifying the manufacturing process
thereof as much as possible.
[0011] In a possible embodiment, the protruding portion has slope
surfaces proximal to the cathode soldered electrode and the anode
soldered electrode, respectively.
[0012] In an embodiment of the present disclosure, the slope
surfaces of the protruding portion that are proximal to the cathode
soldered electrode and the anode soldered electrode, respectively,
can increase a resistance to the flowing of the silver paste as
much as possible.
[0013] In a possible embodiment, an angle between each of the slope
surfaces and the substrate is in a range of [50.degree.,
80.degree.].
[0014] In an embodiment of the present disclosure, an angle between
each of the slope surfaces and the substrate is in a range of
[50.degree., 80.degree.]. As such, a height of the flow blocking
island in the thickness direction of the substrate is limited to
facilitate soldering of each micro LED, while ensuring that the
resistance to the flowing of the silver paste is as large as
possible.
[0015] In a possible embodiment, the circuit backplane further
includes a plurality of flow blocking grooves in a portion of the
electrode protection layer on each slope surface.
[0016] In an embodiment of the present disclosure, a plurality of
flow blocking grooves are formed in a portion of the electrode
protection layer on each slope surface, which can further block the
flowing of the silver paste.
[0017] In a possible embodiment, an orthographic projection of each
of the plurality of flow blocking grooves on the substrate is a
circular arc, a circle center of the circular arc of each of the
flow blocking grooves on the slope surface proximal to the cathode
soldered electrode is proximal to the cathode soldered electrode,
and a circle center of the circular arc of each of the flow
blocking grooves on the slope surface proximal to the anode
soldered electrode is proximal to the anode soldered electrode.
[0018] In an embodiment of the present disclosure, each of the flow
blocking grooves may be a groove formed in a portion of the
electrode protection layer opposite to the cathode soldered
electrode or the anode soldered electrode, and may be formed as an
encircling circular arc, so as to block the flowing of the silver
paste.
[0019] In a possible embodiment, the electrode protection layer has
a thickness in a range of [3,500 .ANG., 6,500 .ANG.].
[0020] In an embodiment of the present disclosure, a thickness of
the electrode protection layer may be increased to about 5,000
.ANG. relative to that of an electrode protection layer in the
related art, such that each of the flow blocking grooves may have a
large depth into the electrode protection layer, thereby improving
the effect of blocking the flowing of the silver paste.
[0021] In a second aspect, embodiments of the present disclosure
provide a method for manufacturing a circuit backplane of a display
panel, the method including:
[0022] forming a driver circuit in each circuit region on a
substrate;
[0023] forming a planarization layer on the driver circuit by using
a half-mask process;
[0024] forming a cathode soldered electrode and an anode soldered
electrode on the planarization layer; and
[0025] forming an electrode protection layer on a layer where the
cathode soldered electrode and the anode soldered electrode are
located;
[0026] wherein the planarization layer has a protruding portion
between the cathode soldered electrode and the anode soldered
electrode, and the protruding portion and a portion of the
electrode protection layer on the protruding portion form a flow
blocking island.
[0027] In a possible embodiment, the forming an electrode
protection layer on a layer where the cathode soldered electrode
and the anode soldered electrode are located includes:
[0028] forming a plurality of flow blocking grooves in a portion of
the electrode protection layer on each of slope surfaces of the
protruding portion, wherein the slope surfaces are proximal to the
cathode soldered electrode and the anode soldered electrode,
respectively.
[0029] In a third aspect, embodiments of the present disclosure
provide a display panel, including the circuit backplane according
to any one of the embodiments of the first aspect and a plurality
of micro LEDs, wherein an anode and a cathode of each of the
plurality of micro LEDs are respectively fixed to the anode
soldered electrode and the cathode soldered electrode in a
corresponding circuit region of the circuit backplane by silver
paste.
BRIEF DESCRIPTION OF THE DRAWINGS
[0030] FIG. 1 is a schematic diagram showing a structure of a
circuit backplane of a display panel according to an embodiment of
the present disclosure;
[0031] FIG. 2 is a schematic diagram showing a structure of a
circuit backplane of a display panel according to an embodiment of
the present disclosure;
[0032] FIG. 3 is a schematic diagram showing a structure of a
circuit backplane of a display panel according to an embodiment of
the present disclosure;
[0033] FIG. 4 is a schematic diagram showing a structure of a
circuit backplane of a display panel according to an embodiment of
the present disclosure;
[0034] FIG. 5 is a schematic diagram showing a structure of a
circuit backplane of a display panel according to an embodiment of
the present disclosure;
[0035] FIG. 6 is a schematic diagram showing a structure of a
circuit backplane of a display panel according to an embodiment of
the present disclosure; and
[0036] FIG. 7 is a schematic flowchart of a method for
manufacturing a circuit backplane of a display panel according to
an embodiment of the present disclosure.
DETAILED DESCRIPTION
[0037] To make objects, technical solutions and advantages of the
present disclosure be more clearly understood, the technical
solutions in exemplary embodiments of the present disclosure will
be clearly and fully described below with reference to the drawings
accompanying the exemplary embodiments of the present disclosure.
It is to be understood that the exemplary embodiments described
below are only for illustrating and explaining the present
disclosure, but are not intended to limit the present disclosure.
Further, the embodiments and features of the embodiments described
herein may be combined with each other in a case where conflict
does not occur. It should be noted that the thicknesses and shapes
of the layers shown in the drawings are not necessarily drawn to
true scale, but are merely illustrative of the present disclosure.
Further, like or similar reference numerals refer to like or
similar elements or elements having like or similar functions
throughout the present disclosure.
[0038] The inventors of the present inventive concept found that,
during the overall manufacturing process of the micro LEDs, a
circuit backplane needs to be bonded to the micro LEDs after the
circuit backplane is formed. Thus, soldering micro LED chips to the
circuit backplane such as a thin film transistor (TFT) backplane is
an important step. At present, the micro LED chips are soldered on
the TFT backplane through reflow soldering, and an adhesive used
for the reflow soldering is a silver adhesive. Since the silver
adhesive has a good mobility, silver past may flow to a position
between a cathode and an anode during the reflow soldering, which
may cause the cathode and the anode to be electrically connected to
each other to result in short circuit. Therefore, it is desirable
to provide a circuit backplane of a display panel, a method for
manufacturing a circuit backplane of a display panel, and a display
panel, which avoid the problem of short circuit that is likely to
occur during the process of bonding the circuit backplane of the
display panel to an LED in the related art.
[0039] In view of the foregoing, embodiments of the present
disclosure provide a circuit backplane of a display panel, which
can block flowing of silver paste and avoid connection between a
cathode and an anode of a micro LED.
[0040] The circuit backplane of a display panel, the method for
manufacturing a circuit backplane of a display panel, and the
display panel according to the embodiments of the present
disclosure will be described in detail below with reference to the
accompanying drawings. The thicknesses and shapes of the various
layers shown in the drawings are not necessarily drawn to true
scale, but are merely illustrative of the present disclosure.
[0041] An embodiment of the present disclosure provides a circuit
backplane of a display panel, as shown in FIG. 1 that is a
schematic cross-sectional view of the circuit backplane taken along
a thickness direction of the circuit backplane. The circuit
backplane provided by the embodiment of the present disclosure
includes a substrate 10, wherein a plurality of circuit regions are
provided on the substrate 10. Each of the plurality of circuit
regions includes a cathode soldered electrode 12, an anode soldered
electrode 11, and a flow blocking island 13, which are positioned
on the substrate 10. FIG. 1 shows one of the circuit regions as an
example.
[0042] In the present embodiment, the flow blocking island 13 of
each circuit region is located between the cathode soldered
electrode 12 and the anode soldered electrode 11 of the circuit
region, and in the thickness direction of the circuit backplane, a
height of the flow blocking island 13 is greater than each of a
height of the cathode soldered electrode 12 and a height of the
anode soldered electrode 11. As such, the flow blocking island 13
may block the flowing of a soldering agent (e.g., the silver paste)
between an anode and a cathode during the process of soldering a
micro LED on the circuit backplane, so as to avoid short circuit
caused by the connection of the anode and the cathode due to the
flowing of the silver paste. In a possible embodiment, the flow
blocking island 13 is located at a middle position (i.e., the
center) between the cathode soldered electrode 12 and the anode
soldered electrode 11, such that the flow blocking island 13 has
the same flow blocking effect as possible on the silver pastes
respectively flowing from the cathode soldered electrode 12 and
from the anode soldered electrode 11. In the thickness direction of
the circuit backplane, the height of the flow blocking island 13 is
a range of [1 .mu.m, 2 .mu.m] (i.e., 1 .mu.m.ltoreq.the height of
the flow blocking island 13.ltoreq.2 .mu.m), and is less than each
of a height of the anode and a height of the cathode of a micro
LED. As such, the flow blocking island 13 may block the flow of the
silver paste while having no influence on the soldering of the
micro LED.
[0043] Specifically, referring to FIG. 2, each circuit region may
further include a driver circuit 20 located on the substrate 10, a
planarization (PLN) layer located between the driver circuit 20 and
a layer where the cathode soldered electrode 12 and the anode
soldered electrode 11 are located, and an electrode protection
layer 106 (which may be referred to as, for example, a PVX layer)
located on the layer where the cathode soldered electrode 12 and
the anode soldered electrode 11 are located. Further, each circuit
region may further include other optional film layers of the
circuit backplane of the display panel, for example, a buffer layer
101, a first insulating layer 102, a second insulating layer 103,
and a dielectric layer 104 that are sequentially stacked on the
substrate 10. A source 203 and a drain 204 are provided on the
dielectric layer 104, and gates 201, 202 are provided on the first
insulating layer 102 and the second insulating layer 103,
respectively. The driver circuit 20 is located on a side of the
buffer layer 101 distal to the substrate 10.
[0044] In a possible embodiment, the flow blocking island 13
according to the present embodiment of the present disclosure
includes a protruding portion of the planarization layer 105
between the cathode soldered electrode 12 and the anode soldered
electrode 11, and a portion of the electrode protection layer 106
on the protruding portion. As such, when the planarization layer
105 is formed, the flow blocking island 13 may be formed without
separately providing a separate flow blocking island 13, thereby
simplifying the manufacturing process of the circuit backplane as
much as possible.
[0045] Continuing reference to FIG. 2, the flow blocking island 13
(e.g., the protruding portion) has slope surfaces proximal to the
cathode soldered electrode 12 and the anode soldered electrode 11,
respectively, such that a shape of a cross-section of the flow
blocking island 13 taken along the thickness direction of the
circuit backplane includes a trapezoid, so as to increase the
resistance to the flow of the silver paste as much as possible.
[0046] In a possible embodiment, an angle a between each of the
slope surfaces and the substrate 10 is small, such that the height
of the flow blocking island 13 in the thickness direction of the
circuit backplane is small, and the effect of blocking the flowing
of the silver paste is poor. On the other hand, if the angle a is
too large, the height of the flow blocking island 13 in the
thickness direction of the circuit backplane may be too great, and
may be greater than the heights of the cathode and the anode of a
micro LED, such that the difficulty in soldering the micro LED is
increased. Therefore, in an embodiment of the present disclosure,
the angle a between each of the slope surfaces and the substrate 10
is in the range of [50.degree., 80.degree.] (i.e.,
50.degree..ltoreq..alpha..ltoreq.80.degree.), such that the height
of the flow blocking island 13 in the thickness direction of the
substrate 10 is limited so as to facilitate the soldering of the
micro LED, while ensuring that the resistance for blocking the
flowing of the silver paste is as large as possible.
[0047] In order to further enhance the effect of blocking the
flowing of the silver paste, in an embodiment of the present
disclosure, a plurality of flow blocking grooves 30 is provided in
a portion of the electrode protection layer 106 on each of the
slope surfaces, as shown in FIG. 3.
[0048] Specifically, referring to FIG. 4, in a possible embodiment,
an orthographic projection of each of the plurality of flow
blocking grooves 30 on the substrate 10 is a circular arc. Further,
a circle center of the circular arc of each of the flow blocking
grooves 30 disposed on the slope surface proximal to the cathode
soldered electrode 12 is proximal to the cathode soldered electrode
12, and a circle center of the circular arc of each of the flow
blocking grooves 30 disposed on the slope surface proximal to the
anode soldered electrode 11 is proximal to the anode soldered
electrode 11. In FIG. 4, the dashed lines represent the projection
of the top of the flow blocking island distal to the substrate and
the projection of the bottom of the flow blocking island proximal
to the substrate, on the substrate, respectively.
[0049] In an embodiment of the present disclosure, each of the flow
blocking grooves 30 may be a groove formed in a portion of the
electrode protection layer 106 opposite to the cathode soldered
electrode 12 or the anode soldered electrode 11, and may be formed
as an encircling circular arc, so as to block the flowing of the
silver paste. The principle that each of the flow blocking grooves
30 can block the flowing of the silver paste is that, the
encircling circular arc is a reverse arc that surrounds a flow
direction of liquid, and the reverse arc can block the flowing of
the liquid upon being in contact with the liquid. Specifically,
referring to FIG. 5 that is a schematic diagram showing the
movement of the liquid relative to the flow blocking groove 30,
during the flowing of the liquid, upon the liquid encounters the
circular arc of the flow blocking groove 30, the flow blocking
groove 30 will generate a large resistance to the liquid. An
internal flowing inertia force of the liquid is consumed due to the
existence of the resistance of the flow blocking groove 30, such
that the flowing of the liquid may be slowed down. Thus, the
addition of the flow blocking grooves 30 according to the present
embodiment of the present disclosure can enhance the effect of
blocking the flowing of the silver paste. The direction indicated
by the arrow shown in FIG. 5 represents the flow direction of the
liquid.
[0050] Further, referring to FIG. 6 that is another schematic
diagram of the movement of the liquid relative to the flow blocking
groove 30, most of contacts between the liquid and the flow
blocking groove 30 in different directions are right-angle
contacts. In this case, a flow force of the liquid is consumed by
the flowing of the liquid, and the resistance to the flowing of the
liquid is increased by the flow blocking groove 30, which further
consumes the flow force of the liquid itself. The directions
indicated by the arrows shown in FIG. 6 represent the flow
directions of liquid.
[0051] In a possible embodiment, a thickness of the electrode
protection layer 106 is in the range of [3,500 .ANG., 6,500 .ANG.]
(i.e., 3,500 .ANG. the thickness of the electrode protection layer
106 6,500 .ANG.), and may be about 5,000 .ANG.. Thus, as compared
with an electrode protection layer having a thickness of about 2000
.ANG. in the related art, the electrode protection layer 106
according to an embodiment of the present disclosure has a greater
thickness, such that each of the flow blocking grooves 30 may have
a large depth into the electrode protection layer 106, thereby
improving the effect of blocking the flowing of the silver paste.
Optionally, a size of an opening of each of the flow blocking
grooves 30 may be in a range of 2 .mu.m to 10 .mu.m, such that the
flow force of the silver paste is consumed as much as possible.
[0052] In the above embodiments of the present disclosure, an
example in which each circuit region includes one flow blocking
island 13 has been described. In a practical application, a
distance between the cathode soldered electrode 12 and the anode
soldered electrode 11 is about 80 .mu.m; a size of the top of the
flow blocking island 13 distal to the substrate 10 is about 5 .mu.m
to 10 .mu.m, and a size of the bottom of the flow blocking island
13 proximal to the substrate 10 is about 20 .mu.m; and optionally,
a plurality of flow blocking islands 13 may be provided between the
cathode soldered electrode 12 and the anode soldered electrode 11,
so as to improve the effect of blocking the following of the silver
paste as much as possible.
[0053] Referring to FIG. 7, based on the same inventive concept, an
embodiment of the present disclosure provides a method for
manufacturing a circuit backplane of a display panel, and the
method may include the following steps S701 to S704.
[0054] Step S701 includes forming a driver circuit in each circuit
region on the substrate 10.
[0055] Step S702 includes forming a planarization layer on the
driver circuit by using a half-mask process.
[0056] Step S703 includes forming a cathode soldered electrode 12
and an anode soldered electrode 11 on the planarization layer.
[0057] Step S704 includes forming an electrode protection layer on
a layer where the cathode soldered electrode 12 and the anode
soldered electrode 11 are located. The planarization layer has a
protruding portion between the cathode soldered electrode 12 and
the anode soldered electrode 11, and the protruding portion and a
portion of the electrode protection layer on the protruding portion
form a flow blocking island 13.
[0058] In an embodiment of the present disclosure, during
manufacturing a circuit backplane of a display panel, a buffer
layer, a driver circuit, a first insulating layer, a second
insulating layer, gates, a source, and a drain may be formed on the
substrate 10 firstly by conventional processes, and then a
planarization layer may be formed. Specifically, the planarization
layer may be formed on the driver circuit by using a half-mask
process, such that the planarization layer has a protruding portion
with a height of about 1 .mu.m to 2 .mu.m at a fixed position, and
a cathode soldered electrode 12 and an anode soldered electrode 11
may be formed at two sides of the fixed position, respectively. An
angle between the protruding portion and the substrate 10 is in a
range of [50.degree., 80.degree.] (i.e., 50.degree..ltoreq.the
angle.ltoreq.80.degree.). That is, an angle between a slope surface
of the protruding portion proximal to the cathode soldered
electrode 12 or a slope surface of the protruding portion proximal
to the anode soldered electrode 11 and the substrate 10 is in a
range of [50.degree., 80.degree.] (i.e., 50.degree..ltoreq.the
angle.ltoreq.80.degree.).
[0059] After the protruding portion is formed, an electrode
protection layer is formed on the layer where the cathode soldered
electrode 12 and the anode soldered electrode 11 are located, to
have a thickness greater than a thickness of an electrode
protection layer in the related art. The thickness of the electrode
protection layer according to the present embodiment of the present
disclosure may increase from 2000 .ANG. as in the related art to
about 5,000 .ANG.. In this way, the protruding portion and the
portion of the electrode protection layer located on the protruding
portion form the flow blocking island 13, thereby blocking the
flowing of the silver paste as much as possible.
[0060] In a possible embodiment, the step of forming an electrode
protection layer on a layer where the cathode soldered electrode 12
and the anode soldered electrode 11 are located may include:
forming a plurality of flow blocking grooves 30 in a portion of the
electrode protection layer on each of the slope surfaces, such that
a size of an opening of each of the plurality of flow blocking
grooves 30 is 2 .mu.m to 10 .mu.m, thereby consuming the flow force
of the silver paste as much as possible. A structure of a circuit
backplane manufactured by the method for manufacturing a circuit
backplane of a display panel may be referred to the above
embodiments of the circuit backplane of the display panel, and
repeated descriptions thereof are omitted.
[0061] Based on the same inventive concept, an embodiment of the
present disclosure provides a display panel including the circuit
backplane according to any one of the above-described embodiments
of the present disclosure and a plurality of micro LEDs. An anode
and a cathode of each of the plurality of micro LEDs are
respectively fixed to the anode soldered electrode 11 and the
cathode soldered electrode 12 in a corresponding circuit region of
the circuit backplane by using the silver paste. An embodiment of
the display panel may be referred to the above-described
embodiments of the circuit backplane of a display panel, and
repeated descriptions thereof are omitted.
[0062] It will be apparent to one of ordinary skill in the art that
various changes and modifications may be made to the foregoing
embodiments of the present disclosure without departing from the
spirit and scope of the present disclosure. Thus, it is intended
that the present disclosure also encompass such modifications and
variations as long as they fall within the scope of the present
disclosure as defined by the appended claims and their
equivalents.
* * * * *