U.S. patent application number 17/226845 was filed with the patent office on 2021-07-22 for antenna module and electronic device for using the antenna module.
The applicant listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Namjun CHO, Hyoseok NA.
Application Number | 20210226338 17/226845 |
Document ID | / |
Family ID | 1000005507424 |
Filed Date | 2021-07-22 |
United States Patent
Application |
20210226338 |
Kind Code |
A1 |
CHO; Namjun ; et
al. |
July 22, 2021 |
ANTENNA MODULE AND ELECTRONIC DEVICE FOR USING THE ANTENNA
MODULE
Abstract
A mobile communication device includes a processor positioned on
a first printed circuit board, a radio frequency integrated circuit
(RFIC), and an antenna module. The antenna module includes a second
printed circuit board, a first antenna and a second antenna
positioned on the second printed circuit board, and a plurality of
front-end chips positioned on the second printed circuit board. The
plurality of front-end chips include a first front-end chip
electrically connecting the RFIC and the first antenna, and a
second front-end chip electrically connecting the RFIC and the
second antenna.
Inventors: |
CHO; Namjun; (Gyeonggi-do,
KR) ; NA; Hyoseok; (Gyeonggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Gyeonggi-do |
|
KR |
|
|
Family ID: |
1000005507424 |
Appl. No.: |
17/226845 |
Filed: |
April 9, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
16985674 |
Aug 5, 2020 |
|
|
|
17226845 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01Q 1/245 20130101;
H01Q 21/0025 20130101; H01Q 21/24 20130101; H01Q 1/38 20130101;
H04B 7/0404 20130101 |
International
Class: |
H01Q 21/00 20060101
H01Q021/00; H01Q 1/24 20060101 H01Q001/24; H01Q 1/38 20060101
H01Q001/38; H01Q 21/24 20060101 H01Q021/24; H04B 7/0404 20060101
H04B007/0404 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 5, 2019 |
KR |
10-2019-0094745 |
Jul 29, 2020 |
KR |
10-2020-0094609 |
Claims
1. A portable comniuni cation device, comprising: a printed circuit
board (PCB) including a communication processor, an intermediate
frequency integrated circuit (IFIC), and a radio frequency
integrated circuit (RFIC) supporting a mmWave communication; a
first antenna module electrically connected with the PCB and
located within 2 cm from the RFIC, the first antenna module
including a first 1.times.2 antenna array and a second 1.times.2
antenna array; and a second antenna module electrically connected
with the PCB and located within 2 cm from the RFIC, the second
antenna module including a first 1.times.4 antenna array and a
second 1.times.4 antenna array.
2. The portable communication device of claim 1, further
comprising: a first line connecting the RFIC and the first antenna
module; and a second line connecting the RFIC and the second
antenna module, wherein both of the first antenna module and the
second antenna module are located within 2 cm from the RFIC such
that loss of the first line between the RFIC and the first antenna
module is less than 10 dB, and that loss of the second line between
the RFIC and the second antenna module is less than 10 dB.
3. The portable communication device of claim 1, wherein the RFIC
is configured to: receive a first intermediate frequency (IF)
signal from the IFIC, convert the first IF signal into a first
radio frequency (RF) signal, transmit the first RF signal to the
first antenna module, receive a second IF signal from the IFIC,
convert the second IF signal into a second RF signal, transmit the
second RF signal to the second antenna module.
4. The portable communication device of claim 3, wherein the first
RF signal has a first frequency band different from a second
frequency band of the second RF signal.
5. The portable communication device of claim 3, wherein the first
RF signal is horizontally polarized, and the second RF signal is
vertically polarized.
6. The portable communication device of claim 1, further comprising
a flexible printed circuit board (FPCB); wherein the first antenna
module and the RFIC is electrically connected by the FPCB.
7. The portable communication device of claim 1, wherein the
communication processor is configured to form a first beam using
the first 1.times.2 antenna array and to form a second beam using
the second 1.times.2 antenna array.
8. The portable communication device of claim 1, wherein the
communication processor is configured to form a first beam using
the first 1.times.4 antenna array and to form a second beam using
the second 1.times.4 antenna array.
9. The portable communication device of claim 1, further
comprising: a first transmission or reception chain; and a second
transmission or reception chain, wherein the first transmission or
reception chain electrically connects the RFIC and the first
1.times.2 antenna array, and the second transmission or reception
chain electrically connects the RFIC and the second 1.times.2
antenna array.
10. A portable communication device comprising: a printed circuit
board (PCB) including a communication processor, an intermediate
frequency integrated circuit (IFIC), and a radio frequency
integrated circuit (RFIC) supporting a mmWave communication; a
first antenna module; and a second antenna module, wherein the
first antenna module and the second antenna module are electrically
connected with the PCB, and wherein the first antenna module and
the second antenna module are located within 2 cm from the
RFIC.
11. The portable communication device of claim 10, wherein the
first antenna module includes a first 1.times.2 antenna array and a
second 1.times.2 antenna array.
12. The portable communication device of claim 11, wherein the
second antenna module includes a first 1.times.4 antenna array and
a second 1.times.4 antenna array.
13. The portable communication device of claim 11, further
comprising: a first line connecting the RFIC and the first antenna
module; and a second line connecting the RFIC and the second
antenna module, wherein loss of the first line between the RFIC and
the first antenna module is less than 10 dB, and loss of the second
line between the RFIC and the second antenna module is less than 10
dB.
14. The portable communication device of claim 10, wherein the RFIC
is configured to: receive a first intermediate frequency (IF)
signal from the IFIC, convert the first IF signal into a first
radio frequency (RF) signal, transmit the first RF signal to the
first antenna module, receive a second IF signal from the IFIC,
convert the second IF signal into a second RF signal, transmit the
second RF signal to the second antenna module.
15. The portable communication device of claim 14, wherein the
first RF signal has a first frequency band different from a second
frequency band of the second RF signal.
16. The portable communication device of claim 14, wherein the
first RF signal is horizontally polarized, and the second RF signal
is vertically polarized,
17. The portable communication device of claim 10, further
comprising: a flexible printed circuit board (FPCB); wherein the
first antenna module and the RFIC is electrically connected by the
FPCB.
18. The portable communication device of claim 11, wherein the
communication processor is configured to form a first beam using
the first 1.times.2 antenna array and to form a second beam using
the second 1.times.2 antenna array.
19. The portable communication device of claim 11, wherein the
communication processor is configured to form a first beam using
the first 1.times.4 antenna array and to form a second beam using
the second 1.times.4 antenna array.
20. The portable communication device of claim 11, further
comprising: a first transmission or reception chain; and a second
transmission or reception chain, wherein the first transmission or
reception chain electrically connects the RFIC and the first
1.times.2 antenna array, and the second transmission or reception
chain electrically connects the RFIC and the second 1.times.2
antenna array.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application is a Continuation of U.S. patent
application Ser. No. 16/985,674, filed on Aug. 5, 2020, in the U.S.
Patent and Trademark Office, and claims priority under 35 U.S.C.
.sctn. 119 to Korean Patent Application No. 10-2019-0094745, filed
on Aug. 5, 2019, in the Korean Intellectual Property Office, and
Korean Patent Application No. 10-2020-0094609, filed on Jul. 29,
2020, in the Korean Intellectual Property Office, the entire
disclosure of each of which is incorporated herein by
reference.
BACKGROUND
1. Field
[0002] The disclosure relates generally to an antenna module
supporting a high frequency band, and an electronic device for
using the antenna module.
2. Description of Related Art
[0003] A fifth generation (5G) communication system can be
implemented in a high frequency band (e.g., millimeter wave
(mmWave) band) to achieve a high data transfer rate. In particular,
beamforming technology, massive multi-input multi-output (MIMO)
technology, full dimensional MIMO (FD-MIMO) technology, array
antenna technology, analog beam-forming technology, and large scan
antenna technology have been discussed for the 5G communication
system in order to reduce a path loss of radio waves and increase
the transmission distance in high frequency bands.
[0004] Further, communication manners using mmWave bands, such as
802.11ay and 802.11ad have been defined. The characteristics of
mmWave bands are different from those of frequency bands within 6
gigahertz (GHz), so a front end structure for supporting mmWave
frequency bands have been developed.
[0005] As more functions are increasingly required for electronic
devices and mmWave frequency bands are used, it is difficult to
secure a space where an antenna module, which generates and
radiates radio frequency (RF) signals in mmWave frequency bands
through an array antenna, may fit into limited spaces of electronic
devices.
SUMMARY
[0006] The disclosure has been made to address the above-mentioned
problems and disadvantages, and to provide at least the advantages
described below. According to an aspect of the disclosure, a mobile
communication device includes a processor positioned on a first
printed circuit board, a radio frequency integrated circuit (RFIC),
and an antenna module. The antenna module includes a second printed
circuit board, a first antenna and a second antenna positioned on
the second printed circuit board, and a plurality of front-end
chips positioned on the second printed circuit board. The plurality
of front-end chips include a first front-end chip electrically
connecting the RFIC and the first antenna, and a second front-end
chip electrically connecting the RFIC and the second antenna.
[0007] According to an aspect of the disclosure, provided is a
portable communication device that includes a printed circuit board
(PCB) including a communication processor, an intermediate
frequency integrated circuit (IFIC), and a radio frequency
integrated circuit (RFIC) supporting a mmWave communication; a
first antenna module electrically connected with the PCB and
located within 2 cm from the RFIC, the first antenna module
including a first 1.times.2 antenna array and a second 1.times.2
antenna array; and a second antenna module electrically connected
with the PCB and located within 2 cm from the RFIC, the second
antenna module including a first 1.times.4 antenna array and a
second 1.times.4 antenna array.
[0008] According to a further aspect of the disclosure, provided is
a portable communication device that includes a PCB including a
communication processor, an IFIC, and an RFIC supporting a mmWave
communication; a first antenna module; and a second antenna module,
with wherein the first antenna module and the second antenna module
being electrically connected with the PCB, and the first antenna
module and the second antenna module being located within 2 cm from
the RFIC.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The above and other aspects, features, and advantages of
certain embodiments of the present disclosure will be more apparent
from the following description taken in conjunction with the
accompanying drawings, in which:
[0010] FIG. 1 illustrates an electronic device in a network
environment, according to an embodiment;
[0011] FIG. 2 illustrates a transmission/reception structure using
an antenna, according to an embodiment;
[0012] FIG. 3 illustrates improved performance of an antenna
module, according to an embodiment;
[0013] FIG. 4A illustrates an antenna module included in an
electronic device, according to an embodiment;
[0014] FIG. 4B illustrates an antenna module included in an
electronic device, according to an embodiment;
[0015] FIG. 5A illustrates an antenna array is disposed in an
electronic device, according to an embodiment;
[0016] FIG. 5B illustrates an antenna array is disposed in an
electronic device, according to an embodiment;
[0017] FIG. 6 illustrates a transmission/reception structure using
an antenna module in an electronic device, according to an
embodiment;
[0018] FIG. 7 illustrates a transmission/reception structure using
an antenna module in an electronic device, according to an
embodiment;
[0019] FIG. 8 illustrates an RFIC in an electronic device,
according to an embodiment;
[0020] FIG. 9 illustrates an RFIC in an electronic device,
according to an embodiment;
[0021] FIG. 10A illustrates a front end module (FEM) included in an
electronic device, according to an embodiment;
[0022] FIG. 10B illustrates a unit FEM included in an electronic
device, according to an embodiment;
[0023] FIG. 11 illustrates an antenna module in an electronic
device, according to an embodiment;
[0024] FIG. 12 illustrates an antenna module in an electronic
device, according to an embodiment;
[0025] FIG. 13 illustrates an antenna module in an electronic
device, according to an embodiment;
[0026] FIG. 14 illustrates a plurality of antenna modules disposed
in an electronic device, according to various embodiments;
[0027] FIG. 15 illustrates different examples of an antenna module
in the electronic device, according to various embodiments; and
[0028] FIG. 16 illustrates different arrangements of antenna arrays
included in an antenna module in the electronic device, according
to various embodiments.
DETAILED DESCRIPTION
[0029] Various embodiments of the present disclosure are described
with reference to the accompanying drawings. However, various
embodiments of the present disclosure are not limited to particular
embodiments, and it should be understood that modifications,
equivalents, and/or alternatives of the embodiments described
herein can be variously made. With regard to description of
drawings, similar components may be marked by similar reference
numerals.
[0030] FIG. 1 illustrates an electronic device 101 in a network
environment 100 according to various embodiments.
[0031] Referring to FIG. 1, the electronic device 101 in the
network environment 100 may communicate with an electronic device
102 via a first network 198 (e.g., a short-range wireless
communication network), or an electronic device 104 or a server 108
via a second network 199 (e.g., a long-range wireless communication
network). According to an embodiment, the electronic device 101 may
communicate with the electronic device 104 via the server 108.
According to an embodiment, the electronic device 101 may include a
processor 120, memory 130, an input device 150, a sound output
device 155, a display device 160, an audio module 170, a sensor
module 176, an interface 177, a haptic module 179, a camera module
180, a power management module 188, a battery 189, a communication
module 190, a subscriber identification module (SIM) 196, or an
antenna module 197. In some embodiments, at least one (e.g., the
display device 160 or the camera module 180) of the components may
be omitted from the electronic device 101, or one or more other
components may be added in the electronic device 101. In some
embodiments, some of the components may be implemented as single
integrated circuitry. For example, the sensor module 176 (e.g., a
fingerprint sensor, an iris sensor, or an illuminance sensor) may
be implemented as embedded in the display device 160 (e.g., a
display).
[0032] The processor 120 may execute, for example, software (e.g.,
a program 140) to control at least one other component (e.g., a
hardware or software component) of the electronic device 101
coupled with the processor 120, and may perform various data
processing or computation. According to one embodiment, as at least
part of the data processing or computation, the processor 120 may
load a command or data received from another component (e.g., the
sensor module 176 or the communication module 190) in volatile
memory 132, process the command or the data stored in the volatile
memory 132, and store resulting data in non-volatile memory 134.
According to an embodiment, the processor 120 may include a main
processor 121 (e.g., a central processing unit (CPU) or an
application processor (AP)), and an auxiliary processor 123 (e.g.,
a graphics processing unit (GPU), an image signal processor (ISP),
a sensor hub processor, or a communication processor (CP)) that is
operable independently from, or in conjunction with, the main
processor 121. Additionally or alternatively, the auxiliary
processor 123 may be adapted to consume less power than the main
processor 121, or to be specific to a specified function. The
auxiliary processor 123 may be implemented as separate from, or as
part of the main processor 121.
[0033] The auxiliary processor 123 may control at least some of
functions or states related to at least one component (e.g., the
display device 160, the sensor module 176, or the communication
module 190) among the components of the electronic device 101,
instead of the main processor 121 while the main processor 121 is
in an inactive (e.g., sleep) state, or together with the main
processor 121 while the main processor 121 is in an active state
(e.g., executing an application). According to an embodiment, the
auxiliary processor 123 (e.g., an ISP or a CP) may be implemented
as part of another component (e.g., the camera module 180 or the
communication module 190) functionally related to the auxiliary
processor 123.
[0034] The memory 130 may store various data used by at least one
component (e.g., the processor 120 or the sensor module 176) of the
electronic device 101. The various data may include, for example,
software e.g., the program 140) and input data or output data for a
command related thereto. The memory 130 may include the volatile
memory 132 or the non-volatile memory 134.
[0035] The program 140 may be stored in the memory 130 as software,
and may include, for example, an operating system (OS) 142,
middleware 144, or an application 146.
[0036] The input device 150 may receive a command or data to be
used by another component (e.g., the processor 120) of the
electronic device 101, from the outside (e.g., a user) of the
electronic device 101. The input device 150 may include, for
example, a microphone, a mouse, a keyboard, or a digital pen (e.g.,
a stylus pen).
[0037] The sound output device 155 may output sound signals to the
outside of the electronic device 101. The sound output device 155
may include, for example, a speaker or a receiver. The speaker may
be used for general purposes, such as playing multimedia or playing
a record, and the receiver may be used for incoming calls.
According to an embodiment, the receiver may be implemented as
separate from, or as part of the speaker.
[0038] The display device 160 may visually provide information to
the outside (eg., a user) of the electronic device 101. The display
device 160 may include, for example, a display, a hologram device,
or a projector and control circuitry to control a corresponding one
of the display, hologram device, and projector. According to an
embodiment, the display device 160 may include touch circuitry
adapted to detect a touch, or sensor circuitry (e.g., a pressure
sensor) adapted to measure the intensity of force incurred by the
touch.
[0039] The audio module 170 may convert a sound into an electrical
signal and vice versa. According to an embodiment, the audio module
170 may obtain the sound via the input device 150, or output the
sound via the sound output device 155 or a headphone of an external
electronic device (e.g., an electronic device 102) directly (e.g.,
wiredly) or wirelessly coupled with the electronic device 101.
[0040] The sensor module 176 may detect an operational state (e.g.,
power or temperature) of the electronic device 101 or an
environmental state (e.g., a state of a user) external to the
electronic device 101, and then generate an electrical signal or
data value corresponding to the detected state. According to an
embodiment, the sensor module 176 may include, for example, a
gesture sensor, a gyro sensor, an atmospheric pressure sensor, a
magnetic sensor, an acceleration sensor, a grip sensor, a proximity
sensor, a color sensor, an infrared (IR) sensor, a biometric
sensor, a temperature sensor, a humidity sensor, or an illuminance
sensor.
[0041] The interface 177 may support one or more specified
protocols to be used for the electronic device 101 to be coupled
with the external electronic device (e.g., the electronic device
102) directly (e.g., wiredly) or wirelessly. According to an
embodiment, the interface 177 may include, for example, a high
definition multimedia interface (HDMI), a universal serial bus
(USB) interface, a secure digital (SD) card interface, or an audio
interface.
[0042] A connecting terminal 178 may include a connector via which
the electronic device 101 may be physically connected with the
external electronic device (e.g., the electronic device 102).
According to an embodiment, the connecting terminal 178 may
include, for example, an HDMI connector, a USB connector, an SD
card connector, or an audio connector (e.g., a headphone
connector).
[0043] The haptic module 179 may convert an electrical signal into
a mechanical stimulus (e.g., a vibration or a movement) or
electrical stimulus which may be recognized by a user via his
tactile sensation or kinesthetic sensation. According to an
embodiment, the haptic module 179 may include, for example, a
motor, a piezoelectric element, or an electric stimulator.
[0044] The camera module 180 may capture a still image or moving
images. According to an embodiment, the camera module 180 may
include one or more lenses, image sensors, ISP, or flashes.
[0045] The power management module 188 may manage power supplied to
the electronic device 101. According to one embodiment, the power
management module 188 may be implemented as at least part of, for
example, a power management integrated circuit (PMIC).
[0046] The battery 189 may supply power to at least one component
of the electronic device 101. According to an embodiment, the
battery 189 may include, for example, a primary cell which is not
rechargeable, a secondary cell which is rechargeable, or a fuel
cell.
[0047] The communication module 190 may support establishing a
direct (e.g., wired) communication channel or a wireless
communication channel between the electronic device 101 and the
external electronic device (e.g., the electronic device 102, the
electronic device 104, or the server 108) and performing
communication via the established communication channel. The
communication module 190 may include one or more CPs that are
operable independently from the processor 120 (e.g., the AP) and
supports a direct (e.g., wired) communication or a wireless
communication. According to an embodiment, the communication module
190 may include a wireless communication module 192 (e.g., a
cellular communication module, a short-range wireless communication
module, or a global navigation satellite system (GNSS)
communication module) or a wired communication module 194 (e.g., a
local area network (LAN) communication module or a power line
communication (PLC) module). A corresponding one of these
communication modules may communicate with the external electronic
device via the first network 198 (e.g., a short-range communication
network, such as Bluetooth.TM., wireless-fidelity (Wi-Fi) direct,
or Infrared Data Association (IrDA)) or the second network 199
(e.g., a long-range communication network, such as a cellular
network, the Internet, or a computer network (e.g., LAN or wide
area network (WAN)). These various types of communication modules
may be implemented as a single component (e.g., a single chip), or
may be implemented as multi components (e.g., multi chips) separate
from each other. The wireless communication module 192 may identify
and authenticate the electronic device 101 in a communication
network, such as the first network 198 or the second network 199,
using subscriber information (e.g., international mobile subscriber
identity (IMSI)) stored in the subscriber identification module
196.
[0048] The antenna module 197 may transmit or receive a signal or
power to or from the outside (e.g., the external electronic device)
of the electronic device 101. According to an embodiment, the
antenna module 197 may include an antenna including a radiating
element composed of a conductive material or a conductive pattern
formed in or on a substrate (e.g., PCB). According to an
embodiment, the antenna module 197 may include a plurality of
antennas. In such a case, at least one antenna appropriate for a
communication scheme used in the communication network, such as the
first network 198 or the second network 199, may be selected, for
example, by the communication module 190 (e.g., the wireless
communication module 192) from the plurality of antennas. The
signal or the power may then be transmitted or received between the
communication module 190 and the external electronic device via the
selected at least one antenna. According to an embodiment, another
component (e.g,, a radio frequency integrated circuit (RFIC)) other
than the radiating element may be additionally formed as part of
the antenna module 197.
[0049] At least some of the above-described components may be
coupled mutually and communicate signals (e.g., commands or data)
therebetween via an inter-peripheral communication scheme (e.g., a
bus, general purpose input and output (GPIO), serial peripheral
interface (SPI), or mobile industry processor interface
(MIPI)).
[0050] According to an embodiment, commands or data may be
transmitted or received between the electronic device 101 and the
external electronic device 104 via the server 108 coupled with the
second network 199. Each of the electronic devices 102 and 104 may
be a device of a same type as, or a different type, from the
electronic device 101. According to an embodiment, all or some of
the operations to be executed at the electronic device 101 may be
executed at one or more of the external electronic devices 102,
104, or 108. For example, if the electronic device 101 should
perform a function or a service automatically, or in response to a
request from a user or another device, the electronic device 101,
instead of, or in addition to, executing the function or the
service, may request the one or more external electronic devices to
perform at least pail of the function or the service. The one or
more external electronic devices receiving the request may perform
the at least part of the function or the service requested, or an
additional function or an additional service related to the
request, and transfer an outcome of the performing to the
electronic device 101. The electronic device 101 may provide the
outcome, with or without further processing of the outcome, as at
least part of a reply to the request. To that end, a cloud
computing, distributed computing, or client-server computing
technology may be used, for example.
[0051] The electronic device according to various embodiments may
be one of various types of electronic devices. The electronic
devices may include, for example, a portable communication device
(e.g., a smartphone), a computer device, a portable multimedia
device, a portable medical device, a camera, a wearable device, or
a home appliance. According to an embodiment of the disclosure, the
electronic devices are not limited to those described above.
[0052] It should be appreciated that various embodiments of the
present disclosure and the terms used therein are not intended to
limit the technological features set forth herein to particular
embodiments and include various changes, equivalents, or
replacements for a corresponding embodiment. With regard to the
description of the drawings, similar reference numerals may be used
to refer to similar or related elements. It is to be understood
that a singular form of a noun corresponding to an item may include
one or more of the things, unless the relevant context clearly
indicates otherwise. As used herein, each of such phrases as "A or
B," "at least one of A and B," "at least one of A or B," "A, B, or
C," "at least one of A, B, and C," and "at least one of A, B, or
C," may include any one of, or all possible combinations of the
items enumerated together in a corresponding one of the phrases. As
used herein, such terms as "1st" and "2nd," or "first" and "second"
may be used to simply distinguish a corresponding component from
another, and does not limit the components in other aspect (e.g.,
importance or order). It is to be understood that if an element
(e.g., a first element) is referred to, with or without the term
"operatively" or "communicatively", as "coupled with," "coupled
to," "connected with," or "connected to" another element (e.g., a
second element), it means that the element may be coupled with the
other element directly (e.g., wiredly), wirelessly, or via a third
element.
[0053] As used herein, the term "module" may include a unit
implemented in hardware, software, or firmware, and may
interchangeably be used with other terms, for example, "logic,"
"logic block," "part," or "circuitry". A module may be a single
integral component, or a minimum unit or part thereof, adapted to
perform one or more functions. For example, according to an
embodiment, the module may be implemented in a form of an
application-specific integrated circuit (ASIC).
[0054] Various embodiments as set forth herein may be implemented
as software (e.g., the program 140) including one or more
instructions that are stored in a storage medium (e.g., internal
memory 136 or external memory 138) that is readable by a machine
(e.g., the electronic device 101). For example, a processor (e.g.,
the processor 120) of the machine (e.g., the electronic device 101)
may invoke at least one of the one or more instructions stored in
the storage medium, and execute it, with or without using one or
more other components under the control of the processor. This
allows the machine to be operated to perform at least one function
according to the at least one instruction invoked. The one or more
instructions may include a code generated by a complier or a code
executable by an interpreter. The machine-readable storage medium
may be provided in the form of a non-transitory storage medium.
Wherein, the term "non-transitory" simply means that the storage
medium is a tangible device, and does not include a signal (e.g.,
an electromagnetic wave), but this term does not differentiate
between where data is semi-permanently stored in the storage medium
and where the data is temporarily stored in the storage medium.
[0055] According to an embodiment, a method according to various
embodiments of the disclosure may be included and provided in a
computer program product. The computer program product may be
traded as a product between a seller and a buyer. The computer
program product may be distributed in the form of a
machine-readable storage medium (e.g., compact disc read only
memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)
online via an application store (e.g., PlayStore.TM.), or between
two user devices (e.g., smart phones) directly. if distributed
online, at least part of the computer program product may be
temporarily generated or at least temporarily stored in the
machine-readable storage medium, such as memory of the
manufacturer's server, a server of the application store, or a
relay server.
[0056] According to various embodiments, each component (e.g., a
module or a program) of the above-described components may include
a single entity or multiple entities. According to various
embodiments, one or more of the above-described components may be
omitted, or one or more other components may be added.
Alternatively or additionally, a plurality of components (e.g.,
modules or programs) may be integrated into a single component. In
such a case, according to various embodiments, the integrated
component may still perform one or more functions of each of the
plurality of components in the same or similar manner as they are
performed by a corresponding one of the plurality of components
before the integration. According to various embodiments,
operations performed by the module, the program, or another
component may be carried out sequentially, in parallel, repeatedly,
or heuristically, or one or more of the operations may be executed
in a different order or omitted, or one or more other operations
may be added.
[0057] FIG. 2 illustrates a transmission/reception (i.e.,
transmission or reception) structure using an antenna module in an
electronic device, according to an embodiment.
[0058] Referring to FIG. 2, an electronic device 200 may be an
electronic device that transmits or receives signals in a high
frequency hand (mmWave frequency band). The electronic device 200
may have a structure that primarily converts a baseband (BB) signal
up into an intermediate frequency (IF) signal and secondarily
converts the up-converted IF signal up into an RF signal. As
described above, the structure converting a BB signal into an RF
signal through an IF signal, for example, may be a structure
according to a sliding-IF type.
[0059] An electronic device that supports a mmWave band may have a
structure that is different from those of electronic devices that
supports frequency bands of 6 GHz, or 6 GHz or less. This is
because the transmission/reception structures of an electronic
device may depend on the supportable frequency bands. For example,
it is preferable to employ a sliding-IF type in an electronic
device that supports a mmWave band, but it may be preferable to
employ a zero-IF type in an electronic device that supports a
frequency band of a 6 GHz, or 6 GHz or less. An electronic device
employing the zero-IF type may have a structure that converts a BB
signal directly up into an RF signal.
[0060] It may be difficult to employ a zero-IF structure in an
electronic device that supports a high frequency (20 GHz or more),
like a mmWave band, because when a frequency is high (20 GHz or
more), like a mmWave band, a zero-if structure may have difficulty
in generating a local oscillator (LO) signal to be supplied to an
IQ mixer; or when a signal at a high frequency such as a signal in
a mmWave band is transmitted through a transmission line on a flame
retardant 4 (FR4) PCB, very severe attenuation may be caused. In
order to reduce attenuation on the transmission line, it may be
possible to use a PCB that is less (e.g., less than 0.002) in
dielectric loss than the FR4 PCB, but it may not be practical due
to a high price, etc.
[0061] Accordingly, not the zero-IF type, but the sliding-IF type
can be employed in an electronic device that supports a high
frequency band.
[0062] When the sliding-IF type is employed in an electronic
device, for example, in order to reduce attenuation on a
transmission line, a configuration (e.g., a CP) that generates a BB
signal and a configuration that primarily converts the BB signal up
into an IF signal and then secondarily converts the IF signal up
into an RF signal may be independently disposed on a PCB. That is,
the configuration (e.g., a CP) that generates a BB signal may be
disposed on a first PCB and the configuration (e.g., a mixer) that
converts the BB signal up into an RF signal may be disposed on a
second PCB. In this case, signal attenuation due to a high
frequency may restrictively occur only on the transmission line in
the second PCB, but the size of the second PCB may be
increased.
[0063] When the sliding-IF type is employed in an electronic
device, a configuration (e.g., a CP) that generates a BB signal and
a configuration (e.g., an intermediate frequency integrated circuit
(IFIC) that converts the BB signal up into an IF signal may be
disposed on a first PCB, and a configuration (e,g., an RFIC) that
converts the IF signal up into an RF signal may be disposed on a
second PCB. Accordingly, a signal at a relatively low frequency
(e.g., in a 9 GHz band) can be transmitted in the first PCB and a
signal at a relatively high frequency (e.g., 20 GHz or more band)
such as a signal in a mmWave band can be transmitted in the second
PCB. Accordingly, it is possible to prevent an excessive increase
in size of the second PCB on which an antenna module including the
configuration (e.g., an RFIC) that converts an signal up into an RF
signal will be disposed. In order to decrease signal attenuation
due to a high frequency, a PCB having a small dielectric loss
(e.g., less than 0.002) may be used as the second PCB.
[0064] In detail, an IFIC 230 may be mounted on a PCB 250 as a
configuration that converts a BB signal up into an IF signal, and a
first RFIC 261 or a second RFIC 263 may be mounted on a first
antenna module 241 or a second antenna module 243 as a
configuration that converts an IF signal up into an RF signal. The
first antenna module 241 or the second antenna module 243 may be
included in the PCB. The first RFIC 261 or the second RFIC 263 may
be positioned or disposed on one side of the PCB including the
first antenna module 241 or the second antenna module 243. Antenna
elements may be positioned or disposed on the opposite side to the
side on which the first RFIC 261 or the second RFIC 263 is
positioned or disposed. The first RFIC 261 or the second RFIC 263
can transmit or receive a mmWave signal through the antenna
elements.
[0065] At least one processor or 230 may be positioned on the PCB
250. The at least one processor may be at least one of an AP 210 or
a CP. The AP 120 on the PCB 250 can process and calculate various
data, whereby it is possible to control at least one other
configuration (e.g., the CP 220) of an electronic device 101. The
CP 220 on the PCB 250 can generate a BB signal and transmit the
generated BB signal to the IFIC 230 for direct communication or
wireless communication. The IFIC 230 on the PCB 250 can convert the
BB signal transmitted from the CP 220 up into an IF signal and
transmit the IF signal to an antenna module 243 through a
PCB-module interface, or can convert an IF signal transmitted from
the antenna module 243 through the PCB-module interface down into a
BB signal and transmit the BB signal to the CP 220.
[0066] A first power management integrated circuit (PMIC) 271 or a
second PMIC 273 may be positioned on the PCB included in the first
antenna module 241 or the second antenna module 243. The first PMIC
271 or the second PMIC 273 can generate power for driving the first
RFIC 261 or the second RFIC 263. When the first PMIC 271 or the
second PMIC 273 is positioned on the PCB included in the first
antenna module 241 or the second antenna module 243, it is possible
to reduce the number of pins according to a PCB-module between the
PCB 250 and the first antenna module 241 or the second antenna
module 243. In particular, it is possible to reduce a power drop
due to a power line connecting the PCB 250 to the first antenna
module 241 or the second antenna module 243.
[0067] The PCB 250 may be connected with the first antenna module
241 or the second antenna module 243 using a flexible PCB (FPCB), a
flexible RF cable (FRC), or an interposer to exchange signals
and/or supply power. The FRC, for example, may be defined as a
cable that has flexibility not to break even if it is folded or
bent and that has impedance matched for transmitting an RF
signals.
[0068] When the first antenna module 241 or the second antenna
module 243 is mounted in an electronic device, the first antenna
module 241 or the second antenna module 243 may be horizontally
mounted on the PCB 250. In this case, the physical space occupied
by the first antenna module 241 or the second antenna module 243 in
the electronic device may be large. This is because a first RFIC
261 or a second RFIC 263 including a front end circuit (e.g., a
power amplifier (PA), a low noise amplifier (LNA), and a phase
shifter may be positioned on one chip by applying a complementary
metal oxide semiconductor (CMOS) process to the first antenna
module 241 or the second antenna module 243.
[0069] It is possible to separate the front end circuit from the
first RFIC 261 or the second RFIC 263 included in the first antenna
module 241 or the second antenna module 243 in order to decrease
the size of the first antenna module 241 or the second antenna
module 243. An FEM including the front end circuit may be
implemented as one chip using a compound (e.g., silicon germanium
(SiGe) or gallium arsenide (GaAS)) process. In the FEM implemented
using a compound process, the maximum output that can be obtained
from one AP can be increased by about 6 decibel (dB) in comparison
to the case that uses the CMOS process. It is also possible to
reduce the number of antenna elements for achieving the same
performance.
[0070] A mmWave array antenna structure having a 1.times.4
configuration can obtain a gain of 12 dB by generating
reinforcement interference in a desired beam direction using an
array antenna and an array transmission chain structure. In this
case, it is possible to overcome the limit (e.g., 11 dB) of output
power due to one mmWave CMOS PA.
[0071] When a separate structure in which an FEM is implemented
using a compound (SiGe or GaAS) process, it is possible to increase
the maximum output that can be obtained from one PA by 6 dB in
comparison to a PA implemented by using a CMOS process and it is
possible to reduce a half of the antenna elements included in an
array antenna required to obtain the same performance.
[0072] FIG. 3 illustrates improved performance of an antenna
module, according to an embodiment.
[0073] Equivalent isotropic radiated power (EIRP) and spherical
coverages of a 1.times.4 array antenna module (hereafter, referred
to as an "existing antenna module") using a CMOS process and a
1.times.2 array antenna module (hereafter, referred to as an
"improved antenna module") using a compound process are compared in
FIG. 3. The existing antenna module may have a structure in which a
front end circuit is included in an RFIC, and the improved antenna
module may have a structure in which a front end circuit is
separated from an RFIC and included in an FEM. As a result, it can
be seen that the EIRP and spherical coverage of the improved
antenna module are improved in terms of performance in comparison
to the existing antenna module. For example, the EIRP of the
existing antenna module is 29.4 at a point where a cumulative
distribution function (CDF) is maximum, but the EIRP of the
improved antenna module is improved as 30.1. Further, the EIRP of
the existing antenna module is 24.4 at the point where the CDF is
50, the EIRP of the improved antenna module is improved as 25.1.
Additionally, it may be possible to further decrease the size of
the antenna module when implementing an antenna module in which an
RFIC and an FEM are separated, using other processes.
[0074] FIGS. 4A and 4B illustrate an antenna module included in an
electronic device 101, according to various embodiments.
[0075] Specifically, FIG. 4A illustrates an example of the
structure of an existing antenna module using a CMOS process and
FIG. 4B illustrates an example of an improved antenna module using
a compound process. The existing antenna module having a structure
in which a front end circuit is included in an RFIC shown in FIG.
4A includes a 1.times.4 antenna array, and the antenna module
having a structure in which a front end circuit is separated from
an RFIC shown in FIG. 4B includes a 1.times.2 antenna array.
[0076] The size of the existing antenna module may be determined by
a width of 19.1 mm and a length of 4.85 mm, and the size of the
improved antenna module may be determined by a width of 10 mm and a
length of 5.6 mm.
[0077] FIG. 4A illustrates an example in which four antenna
elements (first antenna element 411, second antenna 412, third
antenna 413, and fourth antenna 414) are positioned on a PCB
included in an antenna module.
[0078] Referring to FIG. 4A, the PCB 410 may have two surfaces a
front surface and a rear surface). The first antenna element 411,
the second antenna 412, the third antenna 413, and the fourth
antenna 414 may be positioned on one surface 410-a (e.g., the front
surface) of the PCB 410, and an FPCB connector 415, a PMIC 416, a
passive element 417, and an RFIC 418 may be positioned on the other
surface 410-b (the opposite surface to the surface 410-a) (e.g.,
the rear surface) of the PCB 410. Referring to FIG. 4A, at least
one antenna element of the first antenna element 411, the second
antenna 412, the third antenna 413, and the fourth antenna 414 may
be used to transmit and receive a wireless signal, and another at
least one antenna element may be used to receive a wireless
signal.
[0079] FIG. 4B illustrates an example in which two antenna elements
(first antenna 421 and second antenna 422) are positioned on a PCB
420 included in an antenna module.
[0080] Referring to FIG. 4B, the PCB 420 according to an embodiment
may have two surfaces (e.g., a front surface and a rear surface).
The first antenna 421 and the second antenna 422 may be positioned
on one surface 420-a (e.g., the front surface) of the PCB 420, and
at least one FEM (e.g., a first FEM 424 and/or a second FEM 425)
may be positioned on the other surface 420-b (the opposite surface
to the surface 410-a) (e.g., the rear surface) of the PCB 420. In
FIG. 4B, an RFIC 423 and a PMIC 426 may be further positioned on
the other surface 420-b of the PCB 420. The one or plurality of
FEMs 424 and 425, for example, may be front end chips. The RFIC
423, for example, may be electrically connected to at least one of
the first FEM 424 and/or the second FEM 425. Referring to FIG. 4B,
at least one antenna element e.g., the first antenna element 421)
of the first antenna element 421 and the second antenna element 422
may be used to transmit and receive a wireless signal, and the
other one antenna element (e,g., the second antenna element 422)
may be used to receive a wireless signal.
[0081] When one FEM (e.g., one of the first FEM 424 or the second
FEM 425) is be positioned on the other surface 420-b of the PCB
420, the one FEM may be electrically connected to the first antenna
element 421 and the second antenna element 422. The one FEM, for
example, may be electrically connected to the first antenna element
421 and the second antenna element 422 through a via hole.
[0082] When the first and second FEMs 424 and 425 are positioned on
the other surface 420-b of the PCB 420, the first FEM 424 may be
electrically connected to the first antenna element 421 and the
second FEM 425 may be electrically connected to the second antenna
element 422. The first FEM 424, for example, may be electrically
connected to the first antenna element 421 through a via hole. The
second FEM 425, for example, may be electrically connected to the
second antenna element 422 through a via hole.
[0083] When the PCBs have a multilayer structure, at least two
antenna elements may be positioned on the top of the upper plate of
the PCBs having the multilayer structure, and at least two front
end chips may be positioned on the top of the lower plate of the
PCBs having the multilayer structure.
[0084] A passive element may be positioned on the PCB 420 included
in the antenna module, but may not be limited thereto. The passive
element, for example, may be disposed on a PCB 250 on which an IFIC
is positioned.
[0085] Although an RFIC 423 and/or a PMIC 426 may be disposed on
the other surface 420-b of the PCB 420, they may be disposed on a
PCB 250 on which an IFIC is positioned.
[0086] FIGS. 5A-5B illustrate an antenna array disposed in an
electronic device 101, according to various embodiments.
[0087] FIG. 5A illustrates an example in which an antenna module
510 including a 1.times.4 array antenna is disposed in an
electronic device 500. For example, four antenna elements 511, 513,
515, and 517 constituting one antenna array may be disposed in a
line in an up-down direction 519 (the direction indicated by
arrows) at the right side on the rear surface of an electronic
device. When, four antenna elements 511, 513, 515, and 517 disposed
in an up-down direction 519 constitute one antenna module 510, the
electronic device 101 can control a beam direction only up and
down.
[0088] FIG. 5B illustrates an example in which first antenna module
520-a and second antenna module 520-b, each including a 1.times.2
array antenna, are disposed in an electronic device 500. A first
antenna module 520-a that is one of the two antenna modules 520-a
and 520-b may include first and second antenna elements 521 and 523
constituting a first antenna array. A second antenna module 520-b
that is the other one of the two antenna modules 520-a and 520-b
may include third and fourth antenna elements 525 and 527
constituting a second antenna array.
[0089] FIG. 5B illustrates an example in which two antenna arrays
520-a and 520-b each including a 1.times.2 array antenna are
disposed in an electronic device. The two antenna arrays 520-a and
520-b may be positioned in one antenna module. Accordingly, the
antenna module may include first to fourth antenna elements 521,
523, 525, and 527 constituting the two antenna arrays 520-a and
520-b. The first and second antenna elements 521 and 523 constitute
a first antenna array 520-a, and the third and fourth antenna
elements 525 and 527 constitute a second antenna array 520-b.
[0090] The first and second antenna elements 521 and 523 in the
first antenna module 520-a may be disposed in a line in an up-down
direction 529-a (direction indicated by arrows) at the right side
on the rear surface of the electronic device, and the third and
fourth antenna elements 525 and 527 in the second antenna module
520-b may be disposed in a line in a left-right direction 529-b
(direction indicated by arrows) at the left side on the rear
surface of the electronic device. When there are two separate
antenna arrays (i.e., first antenna module 520-a and second antenna
module 520-b) and the separate two antenna arrays are disposed in
different directions, the electronic device 101 can control the
beam direction up and down and/or left and right.
[0091] Accordingly, it is possible to more freely dispose antenna
modules reduced in size by separating an FEM from an RFIC. For
example, it is possible to dispose antenna modules, as shown in
FIG. 5B, so it may be possible to expand an area in which a
communication service is possible.
[0092] FIG. 6 illustrates a transmission/reception structure using
an antenna module in an electronic device 600, according to an
embodiment.
[0093] Referring to FIG. 6, an electronic device 600 includes a
PMIC 665, a PCB 250 having an AP 210, a CP 220, and an IFIC 230
disposed thereon and with connections to interface 280a and
interface 280b, a first antenna module 660 and/or a second antenna
module 670.
[0094] The electronic device 600, for example, may include one or
both of a first antenna module 660 or a second antenna module 670.
The first antenna module 660 and the second antenna module 670 have
a structure in which an RFIC and an FEM are separated.
[0095] The first antenna module 660 may include a first PCB. A
first RFIC 661 and an FEM 663 may be separately positioned on the
first PCB included in the first antenna module 660. The first RFIC
661, for example, may be formed through a CMOS process. The FEM
663, for example, may be made of a compound process. In this case,
the first RFIC 661 may include a first semiconductor made of a
first material and the FEM 663 may include a second semiconductor
made of a second material different from the first material.
[0096] The first antenna module 660 may include one or a plurality
of 1.times.2 array antennas. The first antenna module 660 may
further include a first interface 667 for signal connection with
the PCB 250. The first interface 667, for example, may be
configured using one of a FPCB connector, an FRC connector, or an
interposer.
[0097] The second antenna module 670 may include a second PCB. A
second PMIC 677 and a plurality of FEMs (e.g.., an FEM #1 673 to an
FEM #n 675) may be separately positioned on the second PCB included
in the second antenna module 670. The second RFIC 671, for example,
may be formed through a CMOS process. The FEM #1 673 to an FEM #n
675, for example, may be made of a compound process. In this case,
the second RFIC 671 may include a first semiconductor made of a
first material and the FEM #1 673 to an FEM #n 675 may include a
second semiconductor made of a second material different from the
first material.
[0098] The second antenna module 670 may include N antenna
elements. The N antenna elements may form a plurality of array
antennas. The second antenna module 670, for example, may form two
array antennas using N antenna elements. In this case, one array
antenna may be electrically connected with the FEM #1 673 and the
other array antenna may be electrically connected with the FEM #n
675. The second antenna module 670 may further include a second
interface 679 for signal connection with the PCB 250. The second
interface 679, for example, may be configured using one of a FPCB
connector, an FRC connector, or an interposer.
[0099] The FEM 663 positioned in the first antenna module 660 may
have the same structure as the FEM #1 673 to the FEM #n 675
positioned in the second antenna module 670. The FEM 663 positioned
in the first antenna module 660 and the FEM #1 673 to the FEM #n
675 positioned in the second antenna module 670 may be front end
chips.
[0100] The first front end chip positioned in the second antenna
module 670 may include first and second transmission/reception
chains, and the second front end chip positioned in the second
antenna module 670 may include third and fourth
transmission/reception chains. For example, the first
transmission/reception chain can electrically connect the RFIC 671
and the first antenna element, the second transmission/reception
chain can electrically connect the RFIC 671 and the third antenna
array, the third transmission/reception chain can electrically
connect the RFIC 671 and the second antenna element, and the fourth
transmission/reception chain can electrically connect the RFIC 671
and the fourth antenna element. The first antenna element and the
third antenna element, for example, may be configured to operate as
a first antenna array for a wireless signal that will be
transmitted by the RFIC 671 or a wireless signal that will be
received by the RFIC 671. The second antenna element and the fourth
antenna element, for example, may be configured to operate as a
second antenna array for a wireless signal that will be transmitted
by the RFIC 671 or a wireless signal that will be received by the
RFIC 671.
[0101] The first and third antenna elements configured to operate
as a first antenna array may be positioned perpendicular to the
second and fourth antenna elements configured to operate as a
second antenna array on the PCB included in the antenna module.
[0102] The CP 220 positioned on the PCB 250 may be configured to
form a first beam using a first front-end chip (e.g., the FEM #1
673) and the first antenna array positioned in the second antenna
module 670 and may be configured to form a second beam using a
second front-end chip (e.g., the FEM #n 675) and the second antenna
array. The CP 220 may be configured to perform an operation of
forming the first beam and an operation of forming the second beam,
for example, such that the first beam and the second beam have the
same frequency. The first beam may be formed, for example, to
travel to a first surface of the electronic device and the second
beam may be formed, for example, to travel to a second surface
different from the first surface.
[0103] The antenna elements electrically connected to the FEM 673
positioned in the second antenna module 670 may be disposed to face
different surfaces of the electronic device, and the antenna
elements electrically connected to the FEM #1 673 to the FEM #n 675
positioned in the second antenna module 670 may be disposed to face
different surfaces of the electronic device. The FEM 673 positioned
in the first antenna module 660, and the FEM #1 673 to the FEM #n
675 positioned in the second antenna module 670 may be disposed to
face the opposite surface to the surface that the antenna elements
face.
[0104] The PCB included in the second antenna module 670 may have a
first rigid PCB portion, a second rigid PCB portion, and a flexible
PCB connecting the first rigid PCB portion and the second rigid PCB
portion. For example, the FEM #1 673 included in the second antenna
module 670, and one or a plurality of antenna elements electrically
coupled to the FEM #1 673 may be positioned on the first rigid PCB
portion. For example, the FEM #n 675 included in the second antenna
module 670, and one or a plurality of antenna elements electrically
coupled to the FEM #n 675 may be positioned on the second rigid PCB
portion.
[0105] FIG. 7 illustrates a transmission/reception structure using
an antenna module in an electronic device 700, according to an
embodiment.
[0106] Referring to FIG. 7, an electronic device 700 includes a PCB
250 having an AP 210, a CP 220, an IFIC 230, an RFIC 780 with
connection to interface 280c, a PMIC 790, a first antenna module
760 and a second antenna module 770.
[0107] The first antenna module 760 may include a plurality of
first antenna elements forming an array antenna, a first FEM 763,
and/or a first interface 761. The first interface 761 may include
at least one of an interposer or an FRC.
[0108] The second antenna module 770 may include a plurality of
second antenna elements, FEM #1 771 to FEM #n 773, and/or a second
interface 775. The second interface 775 may include at least one of
an interposer or an FRC.
[0109] An RFIC 780 and/or a PMIC 790 may be positioned on the PCB
250, The RFIC 780 positioned on the PCB 250 can convert an IF
signal up into an RF signal and can transmit the RF signal to all
or some of a plurality of antenna elements disposed in a plurality
of the first antenna module 760 and the second antenna module 770.
The PMIC 790 positioned on the PCB 250 can supply power for driving
the first antenna module 760 and the second antenna module 770.
[0110] One RFIC 780 and a PMIC 790 may be disposed on the PCB 250,
instead of the RFIC and the PMIC positioned in the antenna module.
This reduces the number of circuits and parts in the antenna
module, thereby being able to secure extra space or reduce the size
of the antenna module. Alternatively, by implementing the FEMs
(i.e., unit FEM 763, or any of FEM #1 771 to FEM #n 773) using a
compound semiconductor (GaAs or SiGe), it is possible to reduce the
power that is consumed by a single PA in comparison to a PA using a
CMOS process. Accordingly, it is possible to reduce the power
current that is supplied to the first antenna module 760 and the
second antenna module 770.
[0111] When the RFIC 780 is disposed on the PCB 250, a wireless
signal in a high frequency band (e.g., a signal in a mmWave band)
generated by the RFIC 780 and can be transmitted to the first
antenna module 760 and the second antenna module 770 through the
PCB 250 having a large loss (e.g., a dielectric loss of about
0.02). In this case, in order to compensate for the loss due to
signal attenuation, the PA or the LNA of a transmission and/or
reception chain uses more power, so the power consumption may be
increased. However, according to a test result, when the antenna
module 760 and 770 are disposed within about 2 cm from the RFIC
780, the loss that a wireless signal in a high frequency band
(e.g., a signal in a mmWave band) will experience may be about 10
dB. The loss of about 10 dB may be compensated, for example,
through an FEM produced through a compound process having excellent
gain and linear characteristic.
[0112] The first antenna module 760 and the second antenna module
770 receive two or more RF signals (e.g., RF1 and RF2) and transmit
the RF signals to a plurality of antenna elements respectively
corresponding to the RF signals, whereby a plurality of array
antenna may be implemented in one antenna module.
[0113] FIG. 8 illustrates an RFIC 800 in an electronic device,
according to an embodiment.
[0114] Referring to FIG. 8, the RFIC 800 may be an RFIC for a
mmWave frequency that is mounted on a PCB 250. The RFIC 800 may
include an LO 810, a first mixer 821, a second mixer 823, a first
buffer 831, a second buffer 833, a splitter-coupler 840, a phase
shifter 850, and/or a switch module 860.
[0115] The LO 810 can generate a local oscillation frequency for
converting an IF signal up into an RF signal and/or converting an
RF signal down into an IF signal. The LO 810 may have the structure
of a phase lock loop (PLL) circuit including a voltage controlled
oscillator (VCO).
[0116] The LO 810 can generate signals having a plurality of local
oscillation frequencies for converting a plurality of IF signals
having different characteristics up into RF signals. The plurality
of IF signals having different characteristics, for example, may
include an IF signal IF_H having horizontal polarization and an IF
signal IF_V having vertical polarization. In this case, the LO 810
can generate a first local oscillation frequency for converting an
IF_H up into an RF signal having horizontal polarization (RF
horizontal (RFH)) and a second local oscillation frequency for
converting an IF_V up into an RF signal having vertical
polarization (RF vertical (RFV)).
[0117] The LO 810 can generate a plurality of local oscillation
frequencies for converting a plurality of RF signals having
different characteristics down into IF signals. The plurality of RF
signals having different characteristics may include an RFH and an
RFV. In this case, the LO 810 can generate a first local
oscillation frequency for converging the RFH down into an IF_H and
a second local oscillation frequency for converting the RFV down
into an IF_V.
[0118] A first mixer 821 can convert and output an IF_H up into an
RFH or convert and output an RFH down into an IF_H, using the first
local oscillation frequency supplied from the LO 810.
[0119] A second mixer 823 can convert and output an IF_H up into an
RFV or convert and output an RFV down into an IF_V, using the
second local oscillation frequency supplied from the LO 810.
[0120] The splitter-coupler 840 can split an RF signal for
transmission through antenna elements in consideration of the
number of the antenna elements or can couple and output RF signals
received from the antenna elements as at least one RF signal. The
RF signal for transmission, for example, may be an RF signal
generated by the first mixer 821 and/or the second mixer 823 and
input through the first buffer 831 and the second buffer 833. The
RF signals received from the antenna elements may be RF signals
that are received by the antenna elements and then input with the
phases shifted through the phase shifter 850.
[0121] When it is required to transmit an RF signal through antenna
elements supporting N double polarization included in an antenna
module 770, the splitter-coupler 840 can split an RF signal (RFH or
RFV) input for transmission into 2N RF signals RFH 1, RFH 2, . . .
, and RFH N and/or RFV 1, RFV 2, . . . , and RFV N. The RFH and the
RFV may be transmitted to one antenna element and the radiated
through the one antenna element. To this end, at least one
processor (e.g., the AP 210 or the CP 220) can control switches
included in the splitter-coupler 840 such that number of
splitter-coupler components that the RF signals pass through.
[0122] The splitter-coupler 84O may include a first
splitter-coupler circuit 842 and a second splitter-coupler circuit
844 that are independent for each RF signal type. A first
splitter-coupler circuit 842 included in the splitter-coupler 84O
can split an RFH that is an RF signal input through the first
buffer 831 to N RFHs, including RFH 1, RFH 2, . . . , and RFH N,
for N antenna elements or can couple N RF signals, including EFH 1,
RFH 2, . . . , and RFH N, received through the N antenna elements
into one RFH and output the RFH to the first buffer 831. A second
splitter-coupler circuit 844 included in the splitter-coupler 840
can split an RFV that is an RF signal input through the second
buffer 833 to N RFVs, including RFV 1, RFV 2, . . . , and RFV N,
for N antenna elements or can couple N RF signals including RFV 1,
RFV 2, . . . , and RFV N, received through the N antenna elements
into one RFV and output the RFV to the second buffer 833.
[0123] When it is required to transmit an RF signal through two
antennas included in an antenna. module 760, the splitter-coupler
840 can form a transmission path so that an RF signal input for
transmission is output as two RF signals (e.g., RFH1 and RFH
N).
[0124] The phase shifter 850 can shift the phases of RF signals to
be transmitted by forming a beam for transmission or can shift the
phases of RF signals received through a beam formed for reception.
The switch module 860 can form a transmission path for transmitting
an RF signal transmitted from the phase shifter 850 to an antenna
module (e.g., the first antenna module 760 and the second antenna
module 770) or can form a reception path for receiving a reception
RF signal from the antenna module (e.g., the first antenna module
760 and the second antenna module 770).
[0125] The phase shifter 850 included in the RFIC 800 may be
disposed in an FEM included in an antenna module.
[0126] When the RFIC 800 having the structure shown in FIG. 8 is
mounted on a PCB, an FEM positioned in an antenna module may
include a PA or an LNA. The FEM positioned in the antenna module
may include a phase shifter 850. In this case, it is possible to
reduce the parts and/or circuits mounted in the antenna module, and
therefore decrease the size of the antenna module.
[0127] The RFIC 800 having the structure shown in FIG. 8 is mounted
in an antenna module, an IF signal can be provided to the antenna
module from a PCB. In this case, the IF signal provided by the PCB
can be converted up into an RF signal by the RFIC 800 mounted in
the antenna module and then the RF signal can be transmitted to an
FEM positioned in the antenna module. The FEM may include a PA or
an LNA. The FEM may include a phase shifter 850. In this case, it
is possible to reduce the parts and/or circuits mounted in the
antenna module, so it is possible to decrease the size of the
antenna module.
[0128] FIG. 9 illustrates an RFIC 900 in an electronic device,
according to an embodiment.
[0129] Referring to FIG. 9, the RFIC 900 may be an RFIC for a
mmWave frequency that is mounted on a PCB. The RFIC 900 may have a
structure having independent transmission/reception chains for
respective polarization. The RFIC 900 may include a first
transmission/reception circuit including a first mixer 921, a first
buffer 931, and a first switch/splitter-coupler 941; and a second
transmission/reception circuit including a second mixer 923, a
second buffer 933, and a second switch/splitter-coupler 943. The
first switch/splitter-coupler 941 and the second
switch/splitter-coupler 943 included in the first
transmission/reception circuit and the second
transmission/reception circuit may include a splitter-coupler, a
phase shifter, and/or a switch module.
[0130] The operation according to the structure for the RFIC 900 in
FIG. 9 may be the same as the operation of the RFIC 800 having the
structure shown in FIG. 8 except for the arrangement of the
components. Accordingly, a detailed operation by the RFIC 900 shown
in FIG. 9 is not described.
[0131] FIG. 10A illustrates a unit FEM 1000 included in an
electronic device, according to an embodiment. FIG. 10B illustrates
a unit FEM 1000 included in an electronic device, according to an
embodiment.
[0132] Referring to FIGS. 10A and 10B, a unit FEM 1001 or 1003 may
be configured such that one RF input signal RF_H is split into two
signals RF1 and RF2 for two antenna elements.
[0133] The unit FEM 1001 or 1003 may respectively include a buffer
1011 or 1013, a splitter-coupler 1021 or 1023, a phase shifter 1031
or 1033, PAs 1041 to 1044, or LNAs 1051 to 1054.
[0134] The splitter-coupler 1021 or 1023 may depend on the number
of maximum antenna elements that can split an RF signal.
[0135] FIG. 10A illustrates a unit FEM that can split an RF signal
maximally to eight antenna elements and FIG. 10B illustrates a unit
FEM that can split an RF signal maximally to four antenna elements.
The number of the maximum supportable antenna elements may be
determined, based on the configuration of the splitter-coupler 1021
or 1023 of the unit FEM.
[0136] Referring to FIG. 10A, the splitter-coupler 1021 may include
several switches 1081a, 1081b, and 1081c for controlling connection
between three splitter-coupler elements 1061a, 1061b, and 1061c and
parts, and terminals 1071a, 1071b, 1071c, 1071d, and 1071e for
connection with the splitter-coupler of another unit FEM in order
to split an RF signal to maximally eight antenna elements.
[0137] Referring to FIG. 10B, the splitter-coupler 1023 may include
several switches 1083a and 1083b for controlling connection between
two splitter-coupler elements 1063a and 1063b and parts, and/or
terminals 1073a, 1073b, and 1073c for connection with the
splitter-coupler of another unit FEM in order to split an RF signal
to four antenna elements maximally.
[0138] For example, a unit FEM including k splitter-coupler
elements can transmit a signal maximally to 2k antenna elements by
being connected with another unit FEM and may include 2k-1
terminals and k switches. For example, k switches may be single
pole double throw (STDP) type switches or each may include three
single pole single throw (SPST) type switches that can transmit an
RF signal. The switches may be implemented as semiconductor
logics.
[0139] FIGS. 11 to 13 illustrate an antenna module in an electronic
device, according to various embodiments.
[0140] More specifically, views 1100, 1200, and 1300 show the
configuration of an antenna module supporting a plurality of
antenna elements using a plurality of unit FEMs.
[0141] The antenna module shown in FIGS. 11 to 13 can support a
plurality of antenna elements using a plurality of unit FEMs. The
antenna module may have a structure that splits an RF_H signal to a
plurality of antenna elements. An antenna module that splits an
RF_V signal to a plurality of antenna elements may have various
input signals. For example, an RF_V signal may be input with an
RF_H signal to the antenna module shown in FIGS. 11 to 13. In this
case, the antenna module can split an RF_V signal into a plurality
of antenna elements. That is, one antenna element can receive and
radiate an RF_H signal and an RF_V signal.
[0142] Referring to FIG. 11, an antenna module can split a received
RF_H signal into signals RF1 to RF8 for eight antenna elements. The
signals RF1 to RF8 for eight antenna elements may be generated by
an RF_H signal that passes through splitter-coupler elements three
times. In this case, signal attenuation of about 3 dB is generated,
for example, every time passing through a splitter-coupler element,
so the signals RF1 to RF 8 for all the antenna elements may have
the same signal intensity.
[0143] The antenna module may include first to fourth unit FEMs
that are four unit FEMs to generate signals RF1 to RF8 for eight
antenna elements.
[0144] The first unit FEM 1110 can connect switches (portions
indicated by .smallcircle.) such that RF1 and RF2 signals are
generated from an RF_H signal through a first splitter-coupler
element 1111a, a second splitter-coupler element 1111b, and a third
splitter-coupler element 1111c.
[0145] The second unit FEM 1120 including splitter-coupler element
1121a, and terminals 1123a, 1123c, 1123d and 1123e, can connect
switches (portions indicated by .smallcircle.) such that RF3 and
RF4 signals are generated from an RF_H signal, which is input
through a seventh terminal 1123b, through a fifth splitter-coupler
element 1121b and a sixth splitter-coupler element 1121c. The RF_H
signal input through the seventh terminal 1123b may be a signal
that is input to the first unit FEM 1110 and then output to a
fourth terminal 1113d (e.g., the terminal connected with the first
splitter-coupler element 1121a). Accordingly, the RF3 and RF4 can
be generated through three splitter-coupler elements of the first
splitter-coupler element 1111a of the first unit FEM 1110, and the
fifth splitter-coupler element 1121b and the sixth splitter-coupler
element 1121c of the second unit FEM 1120.
[0146] The third unit FEM 1130 including splitter-coupler elements
1131a and 1131b, and terminals 1133a, 1133c, 1133d and 1133e, can
connect switches (portions indicated by .smallcircle.) such that
RF5 and RF6 signals are generated from an RF_H signal, which is
input through a thirteenth terminal 1133c, through a ninth sixth
splitter-coupler element 1131c. The RF_H signal input through the
thirteenth terminal 1133c may be a signal that is input to a
seventh terminal 1123b of the second unit FEM 1120 and then output
to a tenth terminal 1113d (e.g., the terminal connected with the
first splitter-coupler element 1111a).
[0147] Accordingly, the RF5 and RF6 can be generated through three
splitter-coupler elements of the first splitter-coupler element
1111a of the first unit FEM 1110, the second splitter-coupler
element 1121b of the second unit FEM 1120, and the third
splitter-coupler element 1131c of the third unit FEM 1130.
[0148] The fourth unit FEM 1140 including splitter-coupler elements
1141a and 1141b, and terminals 1143a and 1143b, can connect
switches (portions indicated by .smallcircle.) such that RF7 and
RF8 signals are generated from a signal that is output from a fifth
terminal 1113e connected with the second splitter-coupler element
1111b of the first unit FEM 1110, is input to the third terminal
1143c, and then passes through the third splitter-coupler element
1141c. Accordingly, the RF7 and RF8 can be generated through three
splitter-coupler elements of the first splitter-coupler element
1111a and the second splitter-coupler element 1111b of the first
unit FEM 1110, and the third splitter-coupler element 1141c of the
fourth unit FEM 1140.
[0149] The signals RF1 to RF8 that are transmitted to eight antenna
elements through the connection described above may be signals
after an RF_H signal passes through three splitter-coupler
elements. The insides of the unit FEMs 1110, 1120, 1130, and 1140
can be adjusted by switch connection and the FEMs may be connected
through lines on the PCB of the antenna module.
[0150] An antenna module may include eight unit FEMs and eight
antenna elements. The eight antenna elements may be disposed on a
first surface of the antenna module. The eight unit FEMs may be
disposed on a second surface of the antenna module. The antenna
module may form 1.times.8 array antenna, 2.times.4 array antenna,
or other types of array antenna configuration, depending on the
arrangement of antenna elements. The eight unit FEMs may be
classified into four unit FEMs that generate and supply signals RF1
to RF8 for eight antenna elements to the antenna elements by
dividing an input RF_H signal and four unit FEMs that generate and
supply signals for eight antenna elements to the antenna elements
by dividing an RF_V signal in the same way. The electronic device
may include eight FEMs for eight antenna elements. The eight FEMs
may be composed of four FEMs for an RF-H and four FEMs for
RF-V.
[0151] Referring to FIG. 12, an RF_H signal received to an antenna
module can be split into signals RF1 to RF4 for four antenna
elements. The signals RF1 to RF4 for the antenna elements may be
generated by an RF_H signal passing through splitter-coupler
elements two times. For example, since signal attenuation of about
3 dB is generated every time passing a splitter-coupler element, an
input signal RF_H should pass through the same number of
splitter-coupler elements in order such that signals RF1 to RF4 for
antenna elements all have the same signal intensity.
[0152] Two unit FEMs 1210 and 1220 may be included to generate
signals RF1 to RF4 for fourth antenna elements. The first unit FEM
1210 of the two unit FEMs includes terminals 1213a and 1213e. The
second unit FEM 1220 of the two unit FEMs includes splitter-coupler
elements 1221a and 1221b, and terminals 1223a, 1223b, 1223d, 1223e.
The first unit FEM 1210 of the two unit FEMs can connect switches
(portions indicated by .smallcircle.) and can connect a second
terminal 1213b and a third terminal 1213c to a PCB line of the
antenna module such that RF1 and RF2 signals are generated by an
RF_H signal detouring around the splitter-coupler element 1211b and
passing through the first splitter-coupler element 1211a and the
third splitter-coupler element 1211c.
[0153] The second unit FEM 1220 can connect switches (portions
indicated by .smallcircle.) such that RF3 and RF4 signals are
generated by a signal output from a fourth terminal 1213d connected
with the first splitter-coupler element 1121a of the first unit FEM
1210, received to a third terminal 1223c, and passing through a
third splitter-coupler element 1221c. Accordingly, the RF3 and RF4
can be formed through two splitter-coupler elements of the first
splitter-coupler element 1211a of the first unit FEM 1210 and the
third splitter-coupler element 1221c of the second unit FEM
1220.
[0154] The signals RF1 to RF4 that are transmitted to four antenna
elements through the connection described above may be signals
after an RF_H signal passes through two splitter-coupler elements.
The insides of the first unit FEM 1210 and the second unit FEM 1220
can be adjusted by switch connection and the FEMs may be connected
through lines on the PCB of the antenna module.
[0155] Four antenna elements may be disposed on a first surface of
an antenna module and four unit FEMs may be disposed on a second
surfaces of the antenna module. The four unit FEMs disposed on the
second surface of the antenna module may include two unit FEMs for
RF-H for processing an RF-H signal and two unit FEMs for RF-V for
processing an RF-V signal. The two unit FEMs for RF-H can divide an
input RF_H signal into signals RF1 to RF4 for four antenna elements
and can supply the divided signals RF1 to RF4 to four antenna
elements for RF_H included in the antenna module. The two unit FEMs
for RF-V can divide an input RF_V signal into signals RF5 to RF8
for four antenna elements and can supply the divided signals RF5 to
RF8 to four antenna elements for RF_V included in the antenna
module.
[0156] An antenna module may have different structures, depending
on the arrangement of antennas. The antenna module, for example,
may have antenna configurations such as a 1.times.4 array antenna,
a 2.times.2 array antenna, an L-shaped array antenna, or a +-shaped
array antenna.
[0157] Referring to FIG. 13, an antenna module can split an RF_H
signal to be transmitted into signals RF1 and RF2 for two antenna
elements. The signals RF1 and RF2 for the antenna elements may be
generated by an RF_H signal passing through a splitter-coupler
element one time. For example, since signal attenuation of about 3
dB is generated every time passing a splitter-coupler element, an
input signal RF_H should pass through the same number of
splitter-coupler elements in order such that the signals RF1 and
RF2 for the antenna elements have the same signal intensity.
[0158] One unit FEM 1310 may be included to generate signals RF1
and RF2 for two antenna elements. The unit FEM 1310 includes
splitter-coupler elements 1311a, 1311b and 1311c, and terminals
1313a, 1313b, 1313c, 1313d and 1313e, and can connect switches
(portions indicated by .smallcircle.) such that RF1 and RF2 signals
are generated from an RF_H signal detouring around a first
splitter-coupler element 1331a and a second splitter-coupler
element 1331b and passing through a third splitter-coupler element
1331c. In this case, a first terminal 1313a may be connected to a
third terminal 1313c through a PCB line of the antenna module.
[0159] The signals RF1 and RF2 that are transmitted to two antenna
elements through the connection described above may be signals
after an RF_H signal passes through one splitter-coupler element.
The inside of the unit FEM 1310 can be adjusted by only simple
switch connection and terminals can be connected using lines on the
PCB of the antenna module to detour around internal
splitter-coupler elements.
[0160] One unit FEM that generates and supplies signals RF1 and RF2
for two antenna elements to the antenna elements by dividing an
RF_H signal to be transmitted and one unit REM that generates and
supplies signals for the two antenna elements to the antenna
element by dividing an RF_V signal may be disposed on a second
surface of an antenna module. A 1.times.2 array antenna can be
configured by disposing two antenna elements on a first surface of
the antenna module.
[0161] Referring to FIG. 9, an RFIC may include a first
switch/splitter-couplers 941 and a second switch/splitter-couplers
943 that can divide signals IF_H and IF_V from an IFIC into a
plurality of RF signals. In this case, it is possible to form
various array antenna structures, depending on the arrangement of a
plurality of antenna modules in an electronic device.
[0162] FIG. 14 illustrate a plurality of antenna modules disposed
in an electronic device 101, according to various embodiments.
[0163] Referring to FIG. 14(a) to FIG. 14(h), an array antenna
structure may be configured in various types, using antenna modules
1410a to 1410b; 1420a to 1420b; 1430a to 1430d; 1440a to 1440d;
1450a to 1450d; 1460a to 1460d; 1470a to 1470b; and 1480a to 1480c
of a 1.times.2 array antenna configuration. Examples of the
structure of the array antenna may be achieved in various ways
other than those shown in the figures.
[0164] It is possible to form a 1.times.4 array antenna 1410a,
1410b shown in FIG. 14(a); a 2.times.2 array antenna 1420a, 1420b
shown in FIG. 14(b); a 2.times.4 or 4.times.2 array antenna 1430a,
1430b, 1430c, 1430d or 1440a, 1440b, 1440c, 1440d shown in FIG.
14(c) or FIG. 14(d); a 1.times.8 or 8.times.1 array antenna 1450a,
1450b, 1450c, 1450d or 1460a, 1460b, 1460c, 1460d shown in FIG.
14(e) or FIG. 14(f); or even different types array antennas 1470a,
1470b or 1480a, 1480b shown in FIG. 14(g) and FIG. 14(h) by
positioning an antenna module including 1.times.2 array antennas in
various ways in the electronic device 101.
[0165] Although antenna modules having the same shape are used in
the various embodiments shown in FIG. 14, it may be possible to
form various shapes of array antenna structures using different
shapes of antenna modules in other various embodiments.
[0166] Further, although it was fundamentally described above that
only one RFIC is positioned on a PCB, it may be possible to
implement various shapes of array antennas and transmit signals in
a plurality of frequency bands by disposing a plurality of RFICs
and enabling the RFICs to generate and each transmit a signal for
at least one antenna module.
[0167] FIG. 15 illustrates different examples of an antenna module
in the electronic device 101, according to various embodiments.
[0168] FIG. 15(a) to FIG. 15(d) show examples of an antenna module
(e.g., a mmWave module) using a PCB 1510, 1520, 1530, and 1540. In
the examples shown in (a)-(d) of FIG. 15, two front end chips 1516
& 1517, 1524 & 1525, 1536 & 1537, and 1546 & 1547
may be disposed on a surface (e.g., the front surface) 1510-b,
1520-b, 1530-b, and 1540-b of the PCB 1510, 1520, 1530, and 1540,
respectively. A plurality of antenna elements 1511-1514, 1521-1522,
1531-1534, and 1541-1544 may be disposed on a different surface
(e.g., the rear surface) 1510-a, 1520-a, 1530-a, and 1540-a,
respectively. The two front end chips may be electrically connected
with the plurality of antenna elements 1511-1514, 1521-1522,
1531-1534, and 1541-1544. The plurality of antenna elements
1511-1514, 1521-1522, 1531-1534, and 1541-1544 respectively
disposed on the PCBs may be configured as one or two antenna
arrays.
[0169] FIG. 15(e) and FIG. 15(f) show examples of an antenna module
(e.g., a mmWave module) using a plurality of PCBs 1550a-c and
1560a-c. Front end chips 1555, 1556, and 1565 may be disposed on a
surface 1550a-2, 1550b-2, and 1560a-2 (e.g., the front surface) of
PCBs 1550a, 1550b, and 1560a. A plurality of antenna elements
1551-1554 and 1561-1564 may be disposed on a different surface
(e.g., the rear surface) 1550a-1, 1550b-1, 1560a-1, and 1560b-1 of
PCBs 1550a, 1550b, 1560a, and 1560b. The front chips 1555, 1556,
and 1565 may be electrically connected with a plurality of antenna
elements 1551-1554 and 1561-1564. Some antenna elements 1563 of the
plurality of antenna elements 1551-1554 and 1561-1564 may be
electrically connected with the front end chip 1565 disposed on
another PCB 1560a. The plurality of antenna elements 1551-1554 and
1561-1564, respectively disposed on the PCBs may configure one
antenna array. The PCBs 1550a, 1550b, 1560a, and 1560b on which the
antenna elements 1551-1554 and 1561-1564 and/or the front end chips
1555, 1556, and 1565 are disposed may be connected by an FPCB.
[0170] Referring to FIGS. 15(a) to 15(f), an antenna module
according to an embodiment may include at least one PCB 1510, 1520,
1530, 1540, 1550a-c, and 1660a-c including several antenna elements
and at least one front end chip.
[0171] FIG. 15(a) illustrates an example in which an antenna module
including the PCB 1510 includes four antenna elements (first to
fourth antennas 1511, 1512, 1513, and 1514), according to an
embodiment.
[0172] Referring to FIG. 15(a) to FIG. 15(e), the PCB 1510 may have
two surfaces (e.g., a front surface and a rear surface). In FIG.
15(a), the first to fourth antenna elements 1511, 1512, 1513, and
1514 may be positioned on a surface 1510-a (e.g., the front
surface) of the PCB 1510. A first front end chip 1516 or a second
front end chip 1517 may be positioned on a different surface 1510-b
(opposite surface to one surface 1510-a) (e.g., the rear surface)
of the PCB 1510. In FIG. 15A, an RFIC 1515 and a PMIC 1518 may be
further positioned on the other surface 1510-b of the PCB 1510.
[0173] Referring to FIG. 15(a), at least one antenna element of the
first to fourth antenna elements 1511, 1512, 1513, and 1514 may be
used to transmit and receive a wireless signal, and another at
least one antenna element may be used to receive a wireless
signal.
[0174] Referring to FIG. 15(a), the first front end chip 1516 may
be electrically connected with the first antenna element 1511 and
the second antenna element 1512, and the second front end chip 1517
may be electrically connected with the third antenna element 1513
and the fourth antenna element 1514. For example, the first front
end chip 1516 may be electrically connected with the first antenna
element 1511 and the second antenna element 1512 through a via
hole, and/or the second front end chip 1517 may be electrically
connected with the third antenna element 1513 and the fourth
antenna element 1514 through a via hole.
[0175] FIG. 15(b) illustrates an example in which an antenna module
including the PCB 1520 includes two antenna elements (first and
second antenna elements 1521 and 1522), according to an
embodiment.
[0176] Referring to FIG. 15(b), the PCB 1520 may have two surfaces
(e.g., a front surface and a rear surface). In FIG. 15B, the first
and second antenna elements 1521 and 1522 may be positioned on one
surface 1520-a (e.g., the front surface) of the PCB 1520. A first
front end chip 1524 or a second front end chip 1525 may be
positioned on another surface 1520-b (opposite surface to one
surface 1510-a) (e.g., the rear surface) of the PCB 1520. In FIG.
15(b), an RFIC 1523 and a PMIC 1526 may be further positioned on
the other surface 1520-b of the PCB 1520.
[0177] Referring to FIG. 15(b), at least one antenna element of the
first and second antenna elements 1521 and 1522 may be used to
transmit and receive a wireless signal, and the other one antenna
element may be used to receive a wireless signal.
[0178] In FIG. 15(b), the first front end chip 1524 may be
electrically connected with the first antenna element 1521, and the
second front end chip 1525 may be electrically connected with the
second antenna element 1522. For example, the first front end chip
1524 may be electrically connected with the first antenna element
1521 through a via hole, and/or the second front end chip 1525 may
be electrically connected with the second antenna element 1522
through a via hole.
[0179] When the PCBs have a multilayer structure in FIGS. 15(a) and
15(b), at least two antenna elements may be positioned on the top
of the upper plate of the PCBs having the multilayer structure, and
at least two front end chips may be positioned on the top of the
lower plate of the PCBs having the multilayer structure.
[0180] FIG. 15(c) illustrates an example in which an antenna module
including the PCB 1530 includes four antenna elements (e.g., first
to fourth antennas 1531, 1532, 1533, and 1534), according to an
embodiment.
[0181] Referring to FIG. 15(c), the PCB 1530 may have two surfaces
(e.g., a front surface and a rear surface). In FIG. 15(c), the
first to fourth antenna elements 1531, 1532, 1533, and 1534 may be
positioned on one surface 1530-a (e.g., the front surface) of the
PCB 1530. A first front end chip 1536 or a second front end chip
1537 may be positioned on another surface 1530-b (opposite surface
to one surface 1530-a) (e.g., the rear surface) of the PCB 1530. In
FIG. 15(c), an RFIC 1535 and a PMIC 1538 may be further positioned
on the other surface 1530-b of the PCB 1530.
[0182] Referring to FIG. 15(c), the first and second antenna
elements 1531 and 1532 disposed in the direction of a horizontal
axis (x-axis) (horizontal direction) at the lower portion of the
first to fourth antenna elements 1531, 1532, 1533, and 1534 may be
used to transmit and receive a wireless signal, and the third and
fourth antenna elements 1533 and 1534 disposed in the direction of
a vertical axis (y-axis) (vertical direction) at the right side may
be used to receive a wireless signal. Additionally or
alternatively, the third and fourth antenna elements 1533 and 1534
disposed in the direction of a vertical axis (y-axis) (vertical
direction) at the right side may be used to transmit and receive a
wireless signal, and the first and second antenna elements 1531 and
1532 disposed in the direction of a horizontal axis (x-axis)
(horizontal direction) at the lower portion may be used to receive
a wireless signal.
[0183] Referring to FIG. 15(c), the first front end chip 1536 may
be electrically connected with the first and second antenna
elements 1531 and 1532, and the second front end chip 1537 may be
electrically connected with the third and fourth antenna elements
1533 and 1534. For example, the first front end chip 1536 may be
electrically connected with the first and second antenna elements
1531 and 1532 through a via hole, and/or the second front end chip
1537 may be electrically connected with the third and fourth
antenna elements 1533 and 1534 through a via hole.
[0184] Referring to FIG. 15(c), the 1535 and the first front end
chip 1536 may be disposed in the direction of a horizontal axis
(x-axis) (horizontal direction) at the upper portion, and the
second front end chip 1537 and the PMIC 1538 may be disposed in the
direction of a vertical axis (y-axis) (vertical direction) at the
right side.
[0185] FIG. 15(d) illustrates an example including four antenna
elements (e.g., first to fourth antenna elements 1541, 1542, 1543,
and 1544) including a PCB 1540, according to an embodiment.
[0186] Referring to FIG. 15(d), the PCB 1540 may have two surfaces
(e.g., a front surface and a rear surface). In FIG. 15(d), the
first to fourth antenna elements 1541, 1542, 1543, and 1544 may be
positioned on one surface 1540-a (e.g., the front surface) of the
PCB 1540. A first front end chip 1546 or a second front end chip
1547 may be positioned on another surface 1540-b (opposite surface
to one surface 1540-a) (e.g., the rear surface) of the PCB 1540. In
FIG. 15(d), an RFIC 1545 and a PMIC 1548 may be further positioned
on the other surface 1545-b of the PCB 1540.
[0187] Referring to FIG. 15(d), the first and second antenna
elements 1541 and 1542 disposed in the direction of a horizontal
axis (x-axis) (horizontal direction) at the upper portion of the
first to fourth antenna elements 1541, 1542, 1543, and 1544 may be
used to transmit and receive a wireless signal, and the third and
fourth antenna elements 1543 and 1544 disposed in the direction of
a vertical axis (y-axis) (vertical direction) at the right side may
be used to receive a wireless signal. Additionally or
alternatively, the third and fourth antenna elements 1543 and 1544
disposed in the direction of a vertical axis (y-axis) (vertical
direction) at the right side may be used to transmit and receive a
wireless signal, and the first and second antenna elements 1541 and
1542 disposed in the direction of a horizontal axis (x-axis)
(horizontal direction) at the upper portion may be used to receive
a wireless signal.
[0188] Referring to FIG. 15(d), the first front end chip 1546 may
be electrically connected with the first and second antenna
elements 1541 and 1542, and the second front end chip 1547 may be
electrically connected with the third and fourth antenna elements
1543 and 1544. For example, the first front end chip 1546 may be
electrically connected with the first and second antenna elements
1541 and 1542 through a via hole, and/or the second front end chip
1547 may be electrically connected with the third and fourth
antenna elements 1543 and 1544 through a via hole.
[0189] Referring to FIG. 15(d), the RFIC 1545 and the first front
end chip 1546 may be disposed in the direction of a horizontal axis
(x-axis) (horizontal direction) at the lower portion, and the
second front end chip 1547 and the PMIC 1548 may be disposed in the
direction of a vertical axis (y-axis) (vertical direction) at the
right side.
[0190] When the PCBs have a multilayer structure in FIGS. 15(c) and
15(d), at least two antenna elements may be positioned on the top
of the upper plate of the PCBs having the multilayer structure, and
at least two front end chips may be positioned on the top of the
lower plate of the PCBs having the multilayer structure.
[0191] FIG. 15(e) illustrates an example in which an antenna module
including three PCBs 1550a, 1550b, and 1550c includes four antenna
elements (e.g., first to fourth antenna elements 1551, 1552, 1553,
and 1554), according to an embodiment.
[0192] Referring to FIG. 15(e), an antenna module may include
several PCBs 1550a, 1550b, and 1550c including several antennas and
a plurality of front end chips. The several PCBs 1550a, 1550b, and
1550c each may have two surfaces (e.g., a front surface and a rear
surface). In FIG. 15(e), a first PCB 1550a and a second PCB 1550b
may be connected by a third PCB 1550c. The third PCB 1550c may be a
flexible PCB (FPCB).
[0193] In FIG. 15(e), the first and second antenna elements 1551
and 1552 may be positioned on a first surface 1550a-1 (e.g., the
front surface) corresponding to one surface of the first PCB 1550a.
A first front end chip 1555 may be positioned on a second surface
1550a-2 (opposite surface to the surface 1550a-1) corresponding to
another surface of the first PCB 1550a. The first and second
antenna elements 1551 and 1552 may be connected to the first front
end chip 1555. An RFIC and a PMIC may be further positioned on the
second surface 1550a-2 of the first PCB 1550a. Additionally or
alternatively, a connection member (a connector) connecting a main
PCB may be further positioned on the second surface 1550a-2 of the
first PCB 1550a.
[0194] In FIG. 15(e), third and fourth antenna elements 1553 and
1554 may be positioned on a first surface 1550b-1 (e.g., the front
surface) corresponding to one surface of the second PCB 1550b. A
second front end chip 1556 may be positioned on a second surface
1550b-2 (opposite surface to the surface 1550b-1) corresponding to
another surface of the second PCB 1550b. The third and fourth
antenna elements 1553 and 1554 may be connected to the second front
end chip 1556. An RFIC and a PMIC may be further positioned on the
second surface 1550b-2 of the second PCB 1550b. Additionally or
alternatively, a connection member (a connector) connecting a main
PCB may be further positioned on the second surface 1550b-2 of the
second PCB 1550b.
[0195] FIG. 15(f) shows an example in which an antenna module
including three PCBs 1560a, 1560b, and 1560c includes four antenna
elements (e.g., first to fourth antenna elements 1561, 1562, 1563,
and 1564), according to an embodiment.
[0196] Referring to FIG. 15(f), an antenna module may include a
plurality of PCBs 1560a, 1560b, and 1560c including several
antennas and a plurality of front end chips. The several PCBs
1560a, 1560b, and 1560c each may have two surfaces (e.g., a front
surface and a rear surface). In FIG. 15(f), a first PCB 1560a and a
second PCB 1560b may be connected by a third PCB 1560c. The third
PCB 1560c may be a flexible PCB (FPCB).
[0197] In FIG. 15(f), the first and second antenna elements 1561
and 1562 may be positioned on a first surface 1560a-1 (e.g., the
front surface) corresponding to one surface of the first PCB 1560a.
In FIG. 15(f), third and fourth antenna elements 1563 and 1564
(receiving antennas) may be positioned on a first surface 1560b-1
(e.g., the front surface) corresponding to one surface of the
second. PCB 1560b. A first front end chip 1565 and a second front
end chip 1566 may be positioned on a second surface 1560a-2
(opposite surface to the surface 1560a-1) corresponding to another
surface of the first PCB 1560a. The first and second antenna
elements 1561 and 1562 may be connected to the first front end chip
1565. The third and fourth antenna elements 1563 and 1564 may be
connected to the second front end chip 1566.
[0198] In FIG. 15(f), an RFIC and a PMIC may be further positioned
on the second surface 1560a-2 of the first PCB 1560a opposite
surface 1560b-2 of second PCB 1560b. Additionally or alternatively,
a connection member (a connector) connecting a main PCB may be
further positioned on the second surface 1560a-2 of the first PCB
1560a. Yet further, a connection member connecting the RFIC, the
PMIC, and the main PCB may be positioned on the second surface
1560a-2 of the second PCB 1560b in FIG. 15(f).
[0199] FIG. 16 illustrates different views showing embodiments of
arrangement of antenna arrays included in an antenna module in the
electronic device 101, according to various embodiments.
[0200] A first antenna array and a second antenna array may be
positioned on one surface of one or several PCBs included in an
antenna module. The first antenna array and the second antenna
array may include several antenna elements. In FIG. 16(a) to FIG.
16(l), for the convenience of description, it is assumed that the
first antenna array includes two antenna elements and the second
antenna array also includes two antenna elements.
[0201] FIG. 16(a) to FIG. 16(l) show various embodiments about
examples in which one or several PCBs included in an antenna module
are disposed in an electronic device 101 and the first antenna
array and the second antenna array are positioned in the one or
several PCBs. In the figures, the shapes of one or several PCBs in
the electronic device are indicated by dotted lines, and the first
antenna array and the second antenna array positioned on the one or
several PCBs are indicated by solid lines on the corresponding
PCBs. The shapes of the one or several PCBs indicated by dotted
lines may not be completely the same as the actually implemented
shapes, but may have shapes curved by the several PCBs in
accordance with the positions the first antenna array and the
second antenna. FIG. 16(a) to FIG. 16(l) show various examples in
which the positions of two antenna elements are changed in the
first and second antenna elements positioned on the PCB.
[0202] A rectangular coordinate system may be used to describe
several antenna array arrangement in the electronic device 101. For
example, in the rectangular coordinate system, the direction of the
X-axis may indicate the transverse direction of the electronic
device 101, the direction of the Y-axis may be the longitudinal
direction of the electronic device 101, and the direction of the
Z-axis may be the thickness direction of the electronic device 101.
For example, the X-axis and Z-axis may be the horizontal direction
and the Y-axis may be the vertical direction.
[0203] The electronic device 101 may have a fronts surface (a first
plate) facing the Z(+)-axial direction, a rear surface (a second
plate) (e.g., a back cover) facing the Z(-)-axial direction, and a
plurality of sides (e.g., side members) facing the X-axial and
Y-axial directions. For example, the sides may include an upper
side facing the Y(+)-axial direction, a lower side facing the
Y(-)-axial direction, a right side facing the X(+)-axial direction,
and a left side facing the X(-)-axial direction.
[0204] Referring to the electronic device 101 of FIG. 16(a), one
surface (e.g., the front surface or the rear surface) of a PCB
1610a on which first and second antenna arrays 1611a and 1613a are
positioned may be disposed to face the Z(-)-axial direction (e.g.,
the rear surface) of the electronic device 101. The first and
second antenna arrays 1611a and 1613a may be disposed close to each
other at one corner area of the electronic device 101.
[0205] The two antenna elements included in the first antenna array
1611a positioned on the PCB 1610a may be disposed up and down in
the vertical direction (the Y-axial direction), and the two antenna
elements included in the second antenna array 1613a positioned on
the PCB 1610a may be disposed left and right in the horizontal
direction (the X-axial direction). Thus, the direction in which the
two antenna elements included in the first antenna array 1611a are
disposed and the direction in which the two antenna elements
included in the second antenna array 1613a are disposed may be
perpendicular to each other.
[0206] Referring to the electronic device 101 in FIG. 16(b), one
surface (e.g., the front surface or the rear surface) of a PCB
1610b on which first and second antenna arrays 1611b and 1613b are
disposed may be disposed to face the Z(-)-axial direction (e.g.,
the rear surface) of the electronic device 101. The first and
second antenna arrays 1611b and 1613b may be disposed close to each
other at one corner area of the electronic device 101.
[0207] The two antenna elements included in the first antenna array
1611b positioned on the PCB 1610b may be disposed left and right in
the horizontal direction (the X-axial direction), and the two
antenna elements included in the second antenna array 1613b
positioned on the PCB 1610b may be disposed up and down in the
vertical direction (the Y-axial direction). Thus, the direction in
which the two antenna elements included in the first antenna array
1611b are disposed, and the direction in which the two antenna
elements included in the second antenna array 1613b are disposed,
may be perpendicular to each other.
[0208] Referring to the electronic device 101 in FIG. 16(c), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611c is positioned of the
PCB 1610c may be disposed to face the Z(-)-axial direction (e.g,
the rear surface) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613c is positioned of the PCB 1610c
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611c and 1613c may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610c may be connected by a third part.
[0209] The two antenna elements included in the first antenna array
1611c positioned on the first part of the PCB 1610c may be disposed
up and down in the vertical direction (the Y-axial direction), and
the two antenna elements included in the second antenna array 1613c
positioned on the second part of the PCB 1610c may be disposed
front and back in the horizontal direction (the Z-axial direction).
Thus, the direction in which the two antenna elements included in
the first antenna array 1611c are disposed and the direction in
which the two antenna elements included in the second antenna array
1613c are disposed may be perpendicular to each other.
[0210] Referring to the electronic device 101 in FIG. 16(d), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611d is positioned of the
PCB 1610d may be disposed to face the Z(-)-axial direction (e.g.,
the rear surface) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613d is positioned of the PCB 1610d
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611d and 1613d may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610d may be connected by a third part.
[0211] The two antenna elements included in the first antenna array
1611d positioned on the first part of the PCB 1610c may be disposed
left and right in the horizontal direction (the X-axial direction),
and the two antenna elements included in the second antenna array
1613d positioned on the second part of the PCB 1610d may be
disposed up and down in the vertical direction (the Y-axial
direction). Thus, the direction in which the two antenna elements
included in the first antenna array 1611d are disposed and the
direction in which the two antenna elements included in the second
antenna array 1613d are disposed may be perpendicular to each
other.
[0212] Referring to the electronic device 101 in FIG. 16(e), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611e is positioned of the
PCB 1610e may be disposed to face the Z(-)-axial direction (e.g.,
the rear surface) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613e is positioned of the PCB 1610e
may be disposed to face the Z(+)-axial direction (e.g., the front
surface) of the electronic device 101. The first and second antenna
arrays 1611e and 1613e may be disposed to face opposite directions
at one corner area of the electronic device 101. The first part and
the second part of the PCB 1610e may be connected by a third
part.
[0213] The two antenna elements included in the first antenna array
1611e positioned on the first part of the PCB 1610e may be disposed
left and right in the horizontal direction (the X-axial direction),
and the two antenna elements included in the second antenna array
1613e positioned on the second part of the PCB 1610e may be
disposed up and down in the vertical direction (the Y-axial
direction). Thus, the direction in which the two antenna elements
included in the first antenna array 1611e are disposed and the
direction in which the two antenna elements included in the second
antenna array 1613e are disposed may be perpendicular to each
other.
[0214] Referring to the electronic device 101 in FIG. 16(f), one
surface of a first part on which the first antenna array 1611f is
positioned of the PCB 1610f may be disposed to face the Z(-)-axial
direction (e.g., the rear surface) of the electronic device 101,
and one surface of a second part on which the second antenna array
1613f is positioned of the PCB 1610f may be disposed to face the
Z(+)-axial direction (e.g., the front surface) of the electronic
device 101. The first and second antenna arrays 1611f and 1613f may
be disposed to face opposite direction at one corner area of the
electronic device 101. The first part and the second part of the
PCB 1610f may be connected by a third part.
[0215] The two antenna elements included in the first antenna array
1611f positioned on the first part of the PCB 1610f may be disposed
up and down in the vertical direction (the Y-axial direction), and
the two antenna elements included in the second antenna array 1613f
positioned on the second part of the PCB 1610f may be disposed left
and right in the horizontal direction (the X-axial direction).
Thus, the direction in which the two antenna elements included in
the first antenna array 1611f are disposed and the direction in
which the two antenna elements included in the second antenna array
1613f are disposed may be perpendicular to each other.
[0216] Referring to the electronic device 101 in FIG. 16(g), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611g is positioned of the
PCB 1610g may be disposed to face the Y(+)-axial direction (e.g.,
the upper side) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613g is positioned of the PCB 1610g
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611g and 1613g may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610g may be connected by a third part.
[0217] The two antenna elements included in the first antenna array
1611g positioned on the first part of the PCB 1610g may be disposed
front and back in the horizontal direction (the Z-axial direction),
and the two antenna elements included in the second antenna array
1613g positioned on the second part of the PCB 161g may be disposed
up and down in the vertical direction (the Y-axial direction).
Thus, the direction in which the two antenna elements included in
the first antenna array 1611g are disposed and the direction in
which the two antenna elements included in the second antenna array
1613g are disposed may be perpendicular to each other.
[0218] Referring to the electronic device 101 in FIG. 16(h), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611h is positioned of the
PCB 1610h may be disposed to face the Y(+)-axial direction e.g.,
the upper surface) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613h is positioned of the PCB 1610h
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611h and 1613h may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610h may be connected by a third part.
[0219] The two antenna elements included in the first antenna array
1611h positioned on the first part of the PCB 1610h may be disposed
left and right in the horizontal direction (the X-axial direction),
and the two antenna elements included in the second antenna array
1613h positioned on the second part of the PCB 1610h may be
disposed front and back in the vertical direction (the Z-axial
direction). Thus, the direction in which the two antenna elements
included in the first antenna array 1611h are disposed and the
direction in which the two antenna elements included in the second
antenna array 1613h are disposed may be perpendicular to each
other.
[0220] Referring to the electronic device 101 in FIG. 16(i), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611i is positioned of the
PCB 1610i may be disposed to face the Z(-)-axial direction (e.g.,
the rear surface) of the electronic device 101, and one surface
(e,g., the front surface or the rear surface) of a second part on
which the second antenna array 1613i is positioned of the PCB 1610i
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611i and 1613i may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610i may be connected by a third part.
[0221] The two antenna elements included in the first antenna array
1611i positioned on the first part of the PCB 1610i may be disposed
up and down in the vertical direction (the Y-axial direction), and
the two antenna elements included in the second antenna array 1613i
positioned on the second part of the PCB 1610i may be disposed up
and down in the vertical direction (the Y-axial direction). Thus,
the direction in which the two antenna elements included in the
first antenna array 1611i are disposed and the direction in which
the two antenna elements included in the second antenna array 1613i
are disposed may be parallel to each other.
[0222] Referring to the electronic device 101 in FIG. 16(j), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611j is positioned of the
PCB 1610j may be disposed to face the Z(-)-axial direction (e.g.,
the rear surface) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613j is positioned of the PCB 1610j
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611j and 1613j may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610j may be connected by a third part.
[0223] The two antenna elements included in the first antenna array
1611j positioned on the first part of the PCB 1610j may be disposed
left and right in the horizontal direction (the X-axial direction),
and the two antenna elements included in the second antenna array
1613j positioned on the second part of the PCB 1610j may be
disposed front and back in the vertical direction (the Z-axial
direction).
[0224] Referring to the electronic device 101 in FIG. 16(k), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611k is positioned of the
PCB 1610k may be disposed to face the Y(+)-axial direction (e.g.,
the upper surface) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613k is positioned of the PCB 1610k
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611k and 1613k may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610k may be connected by a third part.
[0225] The two antenna elements included in the first antenna array
1611k positioned on the first part of the PCB 1610k may be disposed
left and right in the horizontal direction (the X-axial direction),
and the two antenna elements included in the second antenna array
1613k positioned on the second part of the PCB 1610k may be
disposed up and down in the vertical direction (the Y-axial
direction).
[0226] Referring to the electronic device 101 in FIG. 16(l), one
surface (e.g., the front surface or the rear surface) of a first
part on which the first antenna array 1611l is positioned of the
PCB 1610l may be disposed to face the Y(+)-axial direction (e.g.,
the upper side) of the electronic device 101, and one surface
(e.g., the front surface or the rear surface) of a second part on
which the second antenna array 1613l is positioned of the PCB 1610l
may be disposed to face the X(+)-axial direction (e.g., the right
side) of the electronic device 101. The first and second antenna
arrays 1611l and 1613l may be disposed close to each other at one
corner area of the electronic device 101. The first part and the
second part of the PCB 1610l may be connected by a third part.
[0227] The two antenna elements included in the first antenna array
1611l positioned on the first part of the PCB 1610l may be disposed
front and back in the horizontal direction (the Z-axial direction),
and the two antenna elements included in the second antenna array
1613l positioned on the second part of the PCB 1610l may be
disposed front and back in the horizontal direction (the Z-axial
direction). Thus, the direction in which the two antenna elements
included in the first antenna array 1611l are disposed and the
direction in which the two antenna elements included in the second
antenna array 1613l are disposed may be horizontally parallel to
each other.
[0228] Although antenna modules having the same shape are used in
the various embodiments shown in FIG. 16, it may be possible to
form various shapes of antenna array structures using different
shapes of antenna modules.
[0229] Although examples in which antenna arrays are implemented
using a 1.times.2 array antenna and/or a 2.times.1 array antenna in
FIG. 16, an antenna array may also be implemented by disposing two
antenna modules employing antennas having various sizes in the
electronic device 101.
[0230] A mobile communication device includes a processor
positioned on a first PCB; an RFIC; and antenna module, in which
the antenna module may include a second PCB; first and second
antennas positioned on the second PCB; and a plurality of front-end
chips positioned on the second PCB, in which the plurality of
front-end chips may include a first front-end chip electrically
connecting the RFIC and the first antenna, and a second front-end
chip electrically connecting the RFIC and the second antenna.
[0231] The RFIC may be positioned on the first PCB.
[0232] The RFIC may be positioned on the second PCB.
[0233] The mobile communication device may further include a third
antenna and a fourth antenna that are positioned on the second PCB,
in which the third antenna may be electrically connected with the
RFIC by the first front-end chip and the fourth antenna may be
electrically connected with the RFIC by the second front-end
chip.
[0234] The first front-end chip may include a first
transmission/reception chain and a second transmission/reception
chain, in which the first transmission/reception chain may
electrically connect the RFIC and the first antenna and the second
transmission/reception chain may electrically connect the RFIC and
the third antenna; and the second front-end chip may include a
third transmission/reception chain and a fourth
transmission/reception chain, in which the third
transmission/reception chain may electrically connect the RFIC and
the second antenna and the fourth transmission/reception chain may
electrically connect the RFIC and the fourth antenna.
[0235] The first antenna and the third antenna may be configured to
operate as a first antenna array for a wireless signal that will be
transmitted by the RFIC or a wireless signal that will be received
by the RFIC; and the second antenna and the fourth antenna may be
configured to operate as a second antenna array for the wireless
signal that will be transmitted by the RFIC or the wireless signal
that will be received by the RFIC.
[0236] The first antenna and the third antenna configured to
operate as the first antenna array may be positioned perpendicular
to the second antenna and the fourth antenna configured to operate
as the second antenna array.
[0237] The processor may form at least a portion of a CP and the CP
may be configured to form a first beam using the first front-end
chip and the first antenna array and to form a second beam using
the second front-end chip and the second antenna array.
[0238] The CP may be configured to perform an operation of forming
the first beam and an operation of forming the second beam such
that the first beam and the second beam have the same
frequency.
[0239] The CP may be configured to perform an operation of forming
the first beam toward a first surface of the mobile communication
device and an operation of forming a second beam toward a second
surface different from the first surface.
[0240] The first antenna may be positioned to face the first
surface of the mobile communication device, the second antenna may
be positioned to face the second surface different from the first
surface, and the first front-end chip may be positioned to face a
third surface opposite to the first surface.
[0241] The second front-end chip may be positioned to face a fourth
surface opposite to the second surface.
[0242] The second PCB may have a first rigid PCB portion, a second
rigid PCB portion, and an FPCB portion connecting the first rigid
PCB portion and the second rigid PCB portion; and the first antenna
and the first front-end chip may be positioned on the first rigid
PCB portion; and the second antenna and the second front-end chip
may be positioned on the second rigid PCB portion.
[0243] The first antenna and the second antenna may be configured
to operate an antenna array for a wireless signal that will be
transmitted by the RFIC or a wireless signal that will be received
by the RFIC.
[0244] The RFIC may include a first semiconductor made of a first
material, and the first front-end chip or the second front-end chip
may include a second semiconductor made of a second material
different from the first material.
[0245] Accordingly, based on the disclosure, it is possible to
configure antenna modules having various shapes using unit FEMs, to
quickly and easily cope with a change in shape of an antenna.
[0246] Further, the size of the antenna module can be minimized to
solve problems associated with a limited space when mounting an
antenna module in an electronic device.
[0247] Further, it is also possible to configure array antennas
having various shapes without changing the shape of an antenna
module by combining, disposing, and controlling antenna modules
together in an electronic device.
[0248] Electronic devices, according to the various embodiments
described herein, may be different types of electronic devices. The
different types of electronic devices may include, for example, a
portable communication device (e.g., a smartphone), a computer
system, a notebook, a PDA, a portable multimedia device, and a
portable medical device. The different types of electronic devices
are not limited to the devices described above.
[0249] An arrangement structure, and an electronic device using the
arrangement structure, implement and provide a small antenna
module, thereby being able to more efficiently use the space that
the electronic device has.
[0250] Further, the arrangement structure, and an electronic device
using the arrangement structure, can implement antenna modules
having various shapes using an optimized unit antenna module, and
can also reduce circuit part waste.
[0251] The effects of the disclosure are not limited to the effects
described above and other effects can be clearly understood by
those skilled in the art from the description.
[0252] Methods according to an embodiment of the present disclosure
may be implemented in hardware, software, or a combination of
hardware and software.
[0253] When the methods are implemented by software, a
computer-readable storage medium for storing one or more programs
(software modules) may be provided. The one or more programs stored
in the computer-readable storage medium may be configured for
execution by one or more processors within the electronic device.
The one or more program may include instructions that cause the
electronic device to perform the methods according to an embodiment
of the present disclosure as defined by the appended claims and/or
disclosed herein.
[0254] The programs (software modules or software) may be stored in
non-volatile memories including a random access memory and a flash
memory, a read only memory (ROM), an electrically erasable
programmable read only memory (EEPROM), a magnetic disc storage
device, a compact disc-ROM (CD-ROM), digital versatile discs
(DVDs), or other type optical storage devices, or a magnetic
cassette. Any combination of some or all of them may form a memory
in which the program is stored. Further, a plurality of such
memories may be included in the electronic device.
[0255] In addition, the programs may be stored in an attachable
storage device which is accessible through communication networks
such as the Internet, Intranet, local area network (LAN), wide area
network (WAN), and storage area network (SAN), or a combination
thereof. Such a storage device may access the electronic device via
an external port. Further, a separate storage device on the
communication network may access a portable electronic device.
[0256] In the above-described example embodiments of the present
disclosure, a component included in the present disclosure is
expressed in the singular or the plural according to a presented
example embodiment. However, the singular form or plural form is
selected for convenience of description suitable for the presented
situation, and an embodiment of the present disclosure are not
limited to a single element or multiple elements thereof. Further,
either multiple elements expressed in the description may be
configured into a single element or a single element in the
description may be configured into multiple elements.
[0257] While the present disclosure has been illustrated and
described with reference to an example embodiment thereof, it will
be understood by those skilled in the art that various changes in
form and details may be made therein without departing from the
true spirit and full scope of the present disclosure.
* * * * *