U.S. patent application number 16/309731 was filed with the patent office on 2021-07-22 for display module and electronic device.
The applicant listed for this patent is WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.. Invention is credited to Kunpeng WANG.
Application Number | 20210225209 16/309731 |
Document ID | / |
Family ID | 1000005693031 |
Filed Date | 2021-07-22 |
United States Patent
Application |
20210225209 |
Kind Code |
A1 |
WANG; Kunpeng |
July 22, 2021 |
DISPLAY MODULE AND ELECTRONIC DEVICE
Abstract
A display module and an electronic device including the display
module are provided. The display module includes a backing layer, a
flexible substrate, and at least one via hole. The backing layer
includes a first backing plate and a second backing plate. The
flexible substrate includes a first region, a second region, and a
curved region. The first region corresponds to the first backing
plate and the second region corresponds to the second backing
plate. The at least one via hole is located in the second backing
plate.
Inventors: |
WANG; Kunpeng; (Wuhan,
Hubei, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY
CO., LTD. |
Wuhan, Hubei |
|
CN |
|
|
Family ID: |
1000005693031 |
Appl. No.: |
16/309731 |
Filed: |
October 12, 2018 |
PCT Filed: |
October 12, 2018 |
PCT NO: |
PCT/CN2018/110062 |
371 Date: |
December 13, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G09F 9/301 20130101;
G06F 1/1652 20130101 |
International
Class: |
G09F 9/30 20060101
G09F009/30; G06F 1/16 20060101 G06F001/16 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 26, 2018 |
CN |
201811122437.7 |
Claims
1. A display module, comprising: a supporting layer; a backing
layer located on the supporting layer and comprising a first
backing plate and a second backing plate; a flexible substrate
located on the backing layer and comprising a first region
configured to arrange a pixel array, a second region, and a curved
region connecting the first region and the second region, wherein
the first region corresponds to the first backing plate and the
second region corresponds to the second backing plate; and at least
one via hole located in the second backing plate, wherein a depth
of the at least one via hole is not greater than a thickness of the
second backing layer.
2. The display module according to claim 1, wherein the at least
one via hole is disposed adjacent to the flexible substrate.
3. The display module according to claim 2, wherein the second
backing plate comprises at least one row of the at least one via
hole, and each row of the at least one via hole comprises at least
two via holes.
4. The display module according to claim 3, wherein a center
spacing of any two adjacent via holes is same as on the second
backing plate.
5. The display module according to claim 2, wherein a shape of the
at least one via hole is at least one of a triangle, a square, and
a circle in a direction from the flexible substrate to the second
backing plate.
6. The display module according to claim 2, further comprising
optical glue disposed between the supporting layer and the backing
layer, and between the flexible substrate and the backing
layer.
7. An electronic device comprising a display module, wherein the
display module comprises: a supporting layer; a backing layer
located on the supporting layer and comprising a first backing
plate and a second backing plate; a flexible substrate located on
the backing layer and comprising a first region configured to
arrange a pixel array, a second region, and a curved region
connecting the first region and the second region, wherein the
first region corresponds to the first backing plate and the second
region corresponds to the second backing plate; and at least one
via hole located in the second backing plate.
8. The electronic device according to claim 7, wherein the at least
one via hole is disposed adjacent to the flexible substrate, and a
depth of the at least one via hole is not greater than a thickness
of the second backing layer.
9. The electronic device according to claim 8, wherein the second
backing plate comprises at least one row of the at least one via
hole, and each row of the at least one via hole comprises at least
two via holes.
10. The electronic device according to claim 9, wherein a center
spacing of any two adjacent via holes is same as on the second
backing plate.
11. The electronic device according to claim 8, wherein a shape of
the at least one via hole is at least one of a triangle, a square,
and a circle in a direction from the flexible substrate to the
second backing plate.
12. The electronic device according to claim 8, wherein the display
module further comprises optical glue disposed between the
supporting layer and the backing layer, and between the flexible
substrate and the backing layer.
13. The electronic device according to claim 7, wherein a bonding
pressure between the flexible substrate and the backing layer
ranges between 250 Kp and 350 Kp.
14. A display module, comprising: a supporting layer; a backing
layer located on the supporting layer and comprising a first
backing plate and a second backing plate; a flexible substrate
located on the backing layer and comprising a first region
configured to arrange a pixel array, a second region, and a curved
region connecting the first region and the second region, wherein
the first region corresponds to the first backing plate and the
second region corresponds to the second backing plate; and at least
one via hole located in the second backing plate.
15. The display module according to claim 14, wherein the at least
one via hole is disposed adjacent to the flexible substrate.
16. The display module according to claim 15, wherein the second
backing plate comprises at least one row of the at least one via
hole, and each row of the at least one via hole comprises at least
two via holes.
17. The display module according to claim 16, wherein a center
spacing of any two adjacent via holes is same as on the second
backing plate.
18. The display module according to claim 15, wherein a shape of
the at least one via hole is at least one of a triangle, a square,
and a circle in a direction from the flexible substrate to the
second backing plate.
19. The display module according to claim 15, further comprising
optical glue disposed between the supporting layer and the backing
layer, and between the flexible substrate and the backing
layer.
20. The display module according to claim 14, wherein a bonding
pressure between the flexible substrate and the backing layer
ranges between 250 Kp and 350 Kp.
Description
FIELD OF INVENTION
[0001] The present disclosure relates to the field of display
technologies, and more particularly to a display module and an
electronic device.
BACKGROUND OF INVENTION
[0002] With rapid development of display technologies, flexible
displays have gradually become mainstream. Commonly used flexible
displays include liquid crystal display (LCD) and organic light
emitting diode (OLED) displays.
[0003] Current flexible display modules include a support layer, a
backing layer, and a flexible substrate. In a bonding process
between the backing layer and the flexible substrate, because a
driving chip binding region is disposed at one end of the flexible
substrate, there is a certain height difference in the driving chip
binding region. In order to avoid damage to components in the
driving chip binding region, the backing layer and the flexible
substrate are bonded using a step-type bonding pressure. Therefore,
an uneven force on the backing layer during a bonding process
causes the backing layer corresponding to the driving chip binding
region to easily generate bubbles, and this reduces quality of the
display module.
[0004] Therefore, there is a need to provide a display module to
solve the above technical problems.
SUMMARY OF INVENTION
[0005] The present disclosure provides a display module and an
electronic device to solve technical problems that bubbles are
easily generated between a backing layer and a flexible substrate
in a conventional display panel.
[0006] In order to solve the above technical problems, technical
solutions provided by the present disclosure are as follows.
[0007] To achieve the above object, an embodiment of the present
disclosure provides a display module. The display module includes a
supporting layer, a backing layer, a flexible substrate, and at
least one via hole. The backing layer is located on the supporting
layer and includes a first backing plate and a second backing
plate. The flexible substrate is located on the backing layer and
includes a first region configured to arrange a pixel array, a
second region, and a curved region connecting the first region and
the second region. The first region corresponds to the first
backing plate and the second region corresponds to the second
backing plate. The at least one via hole is located in the second
backing plate. A depth of the at least one via hole is not greater
than a thickness of the second backing layer.
[0008] In an embodiment of the present disclosure, the at least one
via hole is disposed adjacent to the flexible substrate.
[0009] In an embodiment of the present disclosure, the second
backing plate includes at least one row of the at least one via
hole, and each row of the at least one via hole includes at least
two via holes.
[0010] In an embodiment of the present disclosure, a center spacing
of any two adjacent via holes is same as on the second backing
plate.
[0011] In an embodiment of the present disclosure, a shape of the
at least one via hole is at least one of a triangle, a square, and
a circle in a direction from the flexible substrate to the second
backing plate.
[0012] In an embodiment of the present disclosure, the display
module further includes optical glue disposed between the
supporting layer and the backing layer, and between the flexible
substrate and the backing layer.
[0013] An embodiment of the present disclosure further provides an
electronic device including a display module. The display module
includes a supporting layer, a backing layer, a flexible substrate,
and at least one via hole. The backing layer is located on the
supporting layer and includes a first backing plate and a second
backing plate. The flexible substrate is located on the backing
layer and includes a first region configured to arrange a pixel
array, a second region, and a curved region connecting the first
region and the second region. The first region corresponds to the
first backing plate and the second region corresponds to the second
backing plate. The at least one via hole is located in the second
backing plate.
[0014] In an embodiment of the present disclosure, the at least one
via hole is disposed adjacent to the flexible substrate, and a
depth of the at least one via hole is not greater than a thickness
of the second backing layer.
[0015] In an embodiment of the present disclosure, the second
backing plate includes at least one row of the at least one via
hole, and each row of the at least one via hole includes at least
two via holes.
[0016] In an embodiment of the present disclosure, a center spacing
of any two adjacent via holes is same as on the second backing
plate.
[0017] In an embodiment of the present disclosure, a shape of the
at least one via hole is at least one of a triangle, a square, and
a circle in a direction from the flexible substrate to the second
backing plate.
[0018] In an embodiment of the present disclosure, the display
module further includes optical glue disposed between the
supporting layer and the backing layer, and between the flexible
substrate and the backing layer.
[0019] In an embodiment of the present disclosure, a bonding
pressure between the flexible substrate and the backing layer
ranges between 250 Kp and 350 Kp.
[0020] An embodiment of the present disclosure further provides a
display module. The display module includes a supporting layer, a
backing layer, a flexible substrate, and at least one via hole. The
backing layer is located on the supporting layer and includes a
first backing plate and a second backing plate. The flexible
substrate is located on the backing layer and includes a first
region configured to arrange a pixel array, a second region, and a
curved region connecting the first region and the second region.
The first region corresponds to the first backing plate and the
second region corresponds to the second backing plate. The at least
one via hole is located in the second backing plate.
[0021] In an embodiment of the present disclosure, the at least one
via hole is disposed adjacent to the flexible substrate.
[0022] In an embodiment of the present disclosure, the second
backing plate includes at least one row of the at least one via
hole, and each row of the at least one via hole includes at least
two via holes.
[0023] In an embodiment of the present disclosure, a center spacing
of any two adjacent via holes is same as on the second backing
plate.
[0024] In an embodiment of the present disclosure, a shape of the
at least one via hole is at least one of a triangle, a square, and
a circle in a direction from the flexible substrate to the second
backing plate.
[0025] In an embodiment of the present disclosure, the display
module further includes optical glue disposed between the
supporting layer and the backing layer, and between the flexible
substrate and the backing layer.
[0026] In an embodiment of the present disclosure, a bonding
pressure between the flexible substrate and the backing layer
ranges between 250 Kp and 350 Kp.
[0027] Beneficial effects of the embodiment the present disclosure
are that by providing a plurality of via holes in the second
backing plate, the flexible substrate and the second backing plate
are bonded in a bonding process, and generated bubbles enter the
via holes, this eliminates the bubbles between the flexible
substrate and the second backing plate and improves quality of a
display panel.
DESCRIPTION OF DRAWINGS
[0028] The accompanying figures to be used in the description of
embodiments of the present disclosure or prior art will be
described in brief to more clearly illustrate the technical
solutions of the embodiments or the prior art. The accompanying
figures described below are only part of the embodiments of the
present disclosure, from which figures those skilled in the art can
derive further figures without making any inventive efforts.
[0029] FIG. 1 is a structural diagram of a film layer of a display
module according to an embodiment of the present disclosure.
[0030] FIG. 2 is a top plan view of a second backing plate of a
display module according to an embodiment of the present
disclosure.
[0031] FIG. 3 is a structural diagram of a film layer of a second
backing plate and a flexible substrate of a display module
according to a first embodiment of the present disclosure.
[0032] FIG. 4 is a structural diagram of a film layer of a second
backing plate and a flexible substrate of a display module
according to a second embodiment of the present disclosure.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
[0033] The embodiments described herein with reference to the
accompanying drawings are explanatory, illustrative, and used to
generally understand the present disclosure. Furthermore,
directional terms described by the present disclosure, such as top,
bottom, front, back, left, right, inner, outer, side, etc., are
only directions by referring to the accompanying drawings, and thus
the used terms are used only for the purpose of describing
embodiments of the present disclosure and are not intended to be
limiting of the present disclosure. In the drawings, modules with
similar structures are labeled with the same reference number.
[0034] Refer to FIG. 1, a structural diagram of a film layer of a
display module according to an embodiment of the present disclosure
is provided.
[0035] The display module includes a supporting layer 10, a backing
layer 20, a flexible substrate 30, a light emitting component layer
40, and an encapsulation layer 50.
[0036] The supporting layer 10 is located on a base of the display
module and is mainly used to support a structure located on the
supporting layer 10.
[0037] The backing layer 20 is located on the supporting layer 10
and includes a first backing plate 201 and a second backing plate
202.
[0038] For the flexible substrate 30, since a part of a panel to
which a flexible circuit board is connected is bent to an inner
side of the panel, a lower frame of an electronic device is
reduced, and a screen ratio is increased. In order to ensure a
bending performance of a flexible panel, a corresponding backing
plate of a curved region 303 needs to be removed. Therefore, a gap
is included between a first backing plate 201 and a second backing
plate 202. A gap region corresponds to the curved region 303 of the
flexible substrate 30 to reduce a bending stress of the flexible
substrate 30.
[0039] An orthographic projection of the backing layer 20 on the
flexible substrate 30 is located within the flexible substrate 30.
That is, an area of the flexible substrate 30 is greater than an
area of the backing layer 20.
[0040] The flexible substrate 30 is located on the backing layer 20
and includes a first region 301 configured to arrange a pixel
array, a second region 302, and a curved region 303 connecting the
first region 301 and the second region 302. The first region 301
corresponds to the first backing plate 201 and the second region
302 corresponds to the second backing plate 202.
[0041] In one embodiment, a display panel constituting the display
module is not limited to an organic light emitting diode (OLED)
display panel in the present disclosure, and may be a liquid
crystal display (LCD) display panel or other types of display
panels, and is not limited thereto.
[0042] Refer to FIG. 2, a top plan view of a second backing plate
of a display module according to an embodiment of the present
disclosure is provided.
[0043] The second backing plate 202 further provided with a
plurality of via holes 203.
[0044] Refer to FIGS. 3 and 4, the via holes 203 are disposed
adjacent to the flexible substrate 30. One side of the second
backing plate 202 on which the via holes 203 are disposed is
connected to the flexible substrate 30.
[0045] In one embodiment, a depth of at least one via hole 203 is
not greater than a thickness of the second backing layer, that is,
the at least one via hole 203 may be a through hole or a blind
hole.
[0046] FIG. 3 is a structural diagram of a film layer of a second
backing plate and a flexible substrate of a display module
according to a first embodiment of the present disclosure. The at
least one via hole 203 is a through hole. A depth of the at least
one via hole 203 is equal to a thickness of the second backing
plate 202.
[0047] FIG. 4 is a structural diagram of a film layer of a second
backing plate and a flexible substrate of a display module
according to a second embodiment of the present disclosure. The at
least one via hole 203 is blind hole. A depth of the at least one
via hole 203 is less than a thickness of the second backing plate
202.
[0048] In one embodiment, the second backing plate 202 includes at
least one row of the at least one via hole 203, and each row of the
at least one via hole 203 includes at least two via holes 203.
[0049] Refer to FIG. 2, the second backing plate 202 includes at
least two rows of the at least one via hole 203, and each row of
the at least one via hole 203 includes multiple via holes 203. A
center spacing of any two adjacent via holes 203 is same as on the
second backing plate 202.
[0050] In one embodiment, a shape of the at least one via hole 203
is at least one of a triangle, a square, and a circle in a
direction from the flexible substrate 30 to the second backing
plate 202.
[0051] Referring to FIG. 2, in a direction of the flexible
substrate 30 to the second backing plate 202, each of the via holes
203 has a circular shape, and each of the via holes 203 has a same
size.
[0052] Referring to FIG. 2, a diameter of the at least one via hole
203 may be, but not limited to, 2 mm. Center spacing of any two
adjacent via holes 203 may be, but is not limited to, 5 mm.
[0053] In one embodiment, the display module further includes
optical glue disposed between the supporting layer 10 and the
backing layer 20, and between the flexible substrate 30 and the
backing layer 20. The supporting layer 10, the backing layer 20,
and the flexible substrate 30 are bonded together by the optical
glue.
[0054] In one embodiment, a position between a plurality of
structures may be provided with, but not limited to, one type of
optical glue.
[0055] In one embodiment, the display module attaches the flexible
substrate 30 to the backing layer 20 using a roller.
[0056] In one embodiment, the first backing plate 201 and the
second backing plate 202 are first aligned with the flexible
substrate 30. Next, a bonding process of the first backing plate
201, the second backing plate 202, and the flexible substrate 30 is
sequentially performed using a roller.
[0057] In one embodiment, a bonding pressure of the roller ranges
between 250 Kp and 350 Kp.
[0058] In one embodiment, the display module further includes a
touch layer, a polarizer layer, and a cover layer on the
encapsulation layer 50. The encapsulation layer 50 is bonded to the
touch layer through a first optical adhesive layer, and the
polarizing layer is bonded to the cover layer through a second
optical adhesive layer.
[0059] In an embodiment, the flexible substrate corresponding to
the second backing plate includes a plurality of driving chip
bonding regions. That is, a height difference generated by the
driving chip bonding region causes bonding pressure of the second
backing plate to be different, and the at least one via hole serves
as a vent hole in the embodiment, such that the flexible substrate
and the second backing plate are bonded in a bonding process, and
generated bubbles enter the via holes, this eliminates the bubbles
between the flexible substrate and the second backing plate and
improves quality of a display panel.
[0060] The present disclosure also provides an electronic device
including the display module. Refer to FIG. 1, a structural diagram
of a film layer of a display module according to an embodiment of
the present disclosure is provided.
[0061] The display module includes a supporting layer 10, a backing
layer 20, and a flexible substrate 30.
[0062] The supporting layer 10 is located on a base of the display
module and is mainly used to support a structure located on the
supporting layer 10.
[0063] The backing layer 20 is located on the supporting layer 10
and includes a first backing plate 201 and a second backing plate
202.
[0064] For the flexible substrate 30, since a part of a panel to
which a flexible circuit board is connected is bent to an inner
side of the panel, a lower frame of an electronic device is
reduced, and a screen ratio is increased. In order to ensure a
bending performance of a flexible panel, a corresponding backing
plate of a curved region 303 needs to be removed. Therefore, a gap
is included between a first backing plate 201 and a second backing
plate 202. A gap region corresponds to the curved region 303 of the
flexible substrate 30 to reduce a bending stress of the flexible
substrate 30.
[0065] An orthographic projection of the backing layer 20 on the
flexible substrate 30 is located within the flexible substrate 30.
That is, an area of the flexible substrate 30 is greater than an
area of the backing layer 20.
[0066] The flexible substrate 30 is located on the backing layer 20
and includes a first region 301 configured to arrange a pixel
array, a second region 302, and a curved region 303 connecting the
first region 301 and the second region 302. The first region 301
corresponds to the first backing plate 201 and the second region
302 corresponds to the second backing plate 202.
[0067] In one embodiment, a display panel constituting the display
module is not limited to an organic light emitting diode (OLED)
display panel in the present disclosure, and may be a liquid
crystal display (LCD) display panel or other types of display
panels, and is not limited thereto.
[0068] Refer to FIG. 2, a top plan view of a second backing plate
of a display module according to an embodiment of the present
disclosure is provided.
[0069] The second backing plate 202 further provided with a
plurality of via holes 203.
[0070] Referring to FIGS. 3 and 4, the via holes 203 are disposed
adjacent to the flexible substrate 30. One side of the second
backing plate 202 on which the via holes 203 are disposed is
connected to the flexible substrate 30.
[0071] In one embodiment, a depth of the at least one via hole 203
is not greater than a thickness of the second backing layer, that
is, the at least one via hole 203 may be a through hole or a blind
hole.
[0072] FIG. 3 is a structural diagram of a film layer of a second
backing plate and a flexible substrate of a display module
according to a first embodiment of the present disclosure. The at
least one via hole 203 is a through hole. A depth of the at least
one via hole 203 is equal to a thickness of the second backing
plate 202.
[0073] FIG. 4 is a structural diagram of a film layer of a second
backing plate and a flexible substrate of a display module
according to a second embodiment of the present disclosure. The at
least one via hole 203 is blind hole. A depth of the at least one
via hole 203 is less than a thickness of the second backing plate
202.
[0074] In one embodiment, the second backing plate 202 includes at
least one row of the at least one via hole 203, and each row of the
at least one via hole 203 includes at least two via holes 203.
[0075] Referring to FIG. 2, the second backing plate 202 includes
at least two rows of the at least one via hole 203, and each row of
the at least one via hole 203 includes multiple via holes 203. A
center spacing of any two adjacent via holes 203 is same as on the
second backing plate 202.
[0076] In one embodiment, a shape of the at least one via hole 203
is at least one of a triangle, a square, and a circle in a
direction from the flexible substrate 30 to the second backing
plate 202.
[0077] Referring to FIG. 2, in a direction of the flexible
substrate 30 to the second backing plate 202, each of the via holes
203 has a circular shape, and each of the via holes 203 has a same
size.
[0078] Referring to FIG. 2, a diameter of the at least one via hole
203 may be, but not limited to, 2 mm. Center spacing of any two
adjacent via holes 203 may be, but is not limited to, 5 mm.
[0079] In one embodiment, the display module further includes
optical glue disposed between the supporting layer 10 and the
backing layer 20, and between the flexible substrate 30 and the
backing layer 20. The supporting layer 10, the backing layer 20,
and the flexible substrate 30 are bonded together by the optical
glue.
[0080] In one embodiment, a position between a plurality of
structures may be provided with, but not limited to, one type of
optical glue.
[0081] In one embodiment, the display module attaches the flexible
substrate 30 to the backing layer 20 using a roller.
[0082] In one embodiment, the first backing plate 201 and the
second backing plate 202 are first aligned with the flexible
substrate 30. Next, a bonding process of the first backing plate
201, the second backing plate 202, and the flexible substrate 30 is
sequentially performed using a roller.
[0083] In one embodiment, a bonding pressure of the roller ranges
between 250 Kp and 350 Kp.
[0084] It can be understood that the electronic device in the
present disclosure includes, but is not limited to, a mobile phone,
a tablet computer, a computer display, a game machine, a
television, a display screen, a wearable device, and other living
appliances or household appliances having a display function.
[0085] An embodiment of the present disclosure provides a display
module and an electronic device including the display module. The
display module includes a supporting layer, a backing layer, a
flexible substrate, and at least one via hole. The backing layer is
located on the supporting layer and includes a first backing plate
and a second backing plate. The flexible substrate is located on
the backing layer and includes a first region configured to arrange
a pixel array, a second region, and a curved region connecting the
first region and the second region. The first region corresponds to
the first backing plate and the second region corresponds to the
second backing plate. The at least one via hole is located in the
second backing plate. In the embodiment of the present disclosure,
by providing a plurality of via holes in the second backing plate,
the flexible substrate and the second backing plate are bonded in a
bonding process, and generated bubbles enter the via holes, this
eliminates the bubbles between the flexible substrate and the
second backing plate and improves quality of a display panel.
[0086] Also, although the disclosure has been shown and described
with respect to one or more implementations, equivalent alterations
and modifications will occur to others skilled in the art based
upon a reading and understanding of this specification and the
annexed drawings. The disclosure includes all such modifications
and alterations and is limited only by the scope of the following
claims. In particular regard to the various functions performed by
the above described components, the terms used to describe such
components are intended to correspond, unless otherwise indicated,
to any component which performs the specified function of the
described component (e.g., that is functionally equivalent), even
though not structurally equivalent to the disclosed structure which
performs the function in the herein illustrated exemplary
implementations of the disclosure. In addition, while a particular
feature of the disclosure may have been disclosed with respect to
only one of several implementations, such feature may be combined
with one or more other features of the other implementations as may
be desired and advantageous for any given or particular
application. Furthermore, to the extent that the terms "includes",
"having", "has", "with", or variants thereof are used in either the
detailed description or the claims, such terms are intended to be
inclusive in a manner similar to the term "comprising."
[0087] The above descriptions are merely preferred implementations
of the present disclosure, it should be noted that those of
ordinary skill in the art can make a variety of improvements and
substitutions on the premise of not deviating from the technical
principle of the present disclosure, and these improvements and
substitutions should be encompassed within the protection scope of
the present disclosure.
* * * * *