U.S. patent application number 17/010840 was filed with the patent office on 2021-06-10 for network equipment power supply and heat dissipation system therefor.
The applicant listed for this patent is Delta Electronics, Inc.. Invention is credited to Kai DONG, Yong HUANG, Jie RUAN, Jun YANG, Li ZHU.
Application Number | 20210176900 17/010840 |
Document ID | / |
Family ID | 1000005116942 |
Filed Date | 2021-06-10 |
United States Patent
Application |
20210176900 |
Kind Code |
A1 |
ZHU; Li ; et al. |
June 10, 2021 |
NETWORK EQUIPMENT POWER SUPPLY AND HEAT DISSIPATION SYSTEM
THEREFOR
Abstract
The disclosure provides a network equipment power supply and a
heat dissipation system therefor. The heat dissipation system
includes a liquid-cooling heat dissipation device and an
air-cooling heat dissipation device. The liquid-cooling heat
dissipation device includes a liquid inlet, a liquid outlet, and a
liquid-cooling pipe between them, wherein liquid-cooling medium
flows inside the liquid-cooling pipe and takes away heat generated
by components arranged around the liquid-cooling pipe; The
air-cooling heat dissipation device includes an air inlet, an air
outlet, and an air-cooling channel between them, wherein airflow
passes through the air-cooling channel and takes away heat
generated by components arranged around the air-cooling channel.
The disclosure conducts hybrid heat dissipation combining
characteristics of liquid-cooling heat dissipation and air-cooling
heat dissipation to effectively enhance heat dissipation
efficiency, and provides a new choice for design of a power supply
unit with high power density.
Inventors: |
ZHU; Li; (Taoyuan City,
TW) ; DONG; Kai; (Taoyuan City, TW) ; HUANG;
Yong; (Taoyuan City, TW) ; YANG; Jun; (Taoyuan
City, TW) ; RUAN; Jie; (Taoyuan City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Delta Electronics, Inc. |
Taoyuan City |
|
TW |
|
|
Family ID: |
1000005116942 |
Appl. No.: |
17/010840 |
Filed: |
September 3, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/20272 20130101;
H05K 7/20927 20130101; H05K 7/20145 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 10, 2019 |
CN |
201911256557.0 |
Claims
1. A heat dissipation system for a network equipment power supply,
comprising: a first heat dissipation device having a liquid inlet,
a liquid outlet, and a liquid-cooling pipe between the liquid inlet
and the liquid outlet, wherein liquid-cooling medium flows inside
the liquid-cooling pipe and takes away heat generated by components
arranged around the liquid-cooling pipe; and a second heat
dissipation device having an air inlet, an air outlet, and an
air-cooling channel between the air inlet and the air outlet,
wherein airflow passes through the air-cooling channel and takes
away heat generated by components arranged around the air-cooling
channel.
2. The heat dissipation system according to claim 1, wherein the
liquid-cooling pipe is arranged within the network equipment power
supply.
3. The heat dissipation system according to claim 2, wherein the
liquid-cooling pipe is a straight liquid-cooling pipe, or a bending
liquid-cooling pipe, or a multidirectional liquid-cooling pipe
having a plurality of furcation branches.
4. The heat dissipation system according to claim 3, wherein the
straight liquid-cooling pipe is arranged in middle of a housing of
the network equipment power supply.
5. The heat dissipation system according to claim 3, wherein at
least one portion of the liquid-cooling pipe is adjacent or
attached to one side of an inner wall of a housing of the network
equipment power supply, and the other portion is arranged in middle
of the housing of the network equipment power supply.
6. The heat dissipation system according to claim 3, wherein the
multidirectional liquid-cooling pipe has a single liquid inlet and
a single liquid outlet, and the plurality of furcation branches
share the single liquid inlet and the single liquid outlet.
7. The heat dissipation system according to claim 2, wherein the
liquid-cooling pipe has a first part surface exposed by a first
opening on a housing of the network equipment power supply
corresponding thereto; or attached to an inner wall of the housing
of the network equipment power supply.
8. The heat dissipation system according to claim 2, wherein the
components arranged around the liquid-cooling pipe are in direct
contact with the liquid-cooling pipe, or thermally coupled to the
liquid-cooling pipe through a heat conducting member.
9. The heat dissipation system according to claim 1, wherein the
liquid-cooling pipe is arranged outside the network equipment power
supply.
10. The heat dissipation system according to claim 9, wherein the
liquid-cooling pipe is a straight liquid-cooling pipe thermally
coupled to a top of a housing of the network equipment power
supply.
11. The heat dissipation system according to claim 10, wherein the
housing of the network equipment power supply has a heat conducting
member, and the components arranged around the liquid-cooling pipe
are attached to the housing via the heat conducting member.
12. The heat dissipation system according to claim 9, wherein the
liquid-cooling pipe is arranged in a network equipment cabinet, and
the network equipment power supply is insertable mounted in the
network equipment cabinet, and outside of a housing of the network
equipment power supply is thermally coupled to the liquid-cooling
pipe after insertion.
13. The heat dissipation system according to claim 1, wherein the
airflow comes from a fan of a network equipment cabinet.
14. The heat dissipation system according to claim 1, wherein the
airflow comes from a fan of the network equipment power supply.
15. The heat dissipation system according to claim 14, wherein the
fan of the network equipment power supply is arranged within a
housing of the network equipment power supply, or arranged out of
the housing of the network equipment power supply.
16. The heat dissipation system according to claim 1, further
comprising hydraulic quick connectors on the liquid inlet and the
liquid outlet.
17. The heat dissipation system according to claim 1, wherein the
network equipment power supply is suitable for a server or a data
center.
18. The heat dissipation system according to claim 1, wherein the
liquid inlet and the liquid outlet are arranged on same side of the
first heat dissipation device.
19. The heat dissipation system according to claim 1, wherein the
liquid inlet and the liquid outlet are arranged on different sides
of the first heat dissipation device.
20. A network equipment power supply, comprising the heat
dissipation system according to claim 1.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This non-provisional application claims priority under 35
U.S.C. .sctn. 119(a) on Patent Application No. 201911256557.0 filed
in P.R. China on Dec. 10, 2019, the entire contents of which are
hereby incorporated by reference.
[0002] Some references, if any, which may include patents, patent
applications and various publications, may be cited and discussed
in the description of this invention. The citation and/or
discussion of such references, if any, is provided merely to
clarify the description of the present invention and is not an
admission that any such reference is "Prior Art" to the present
invention described herein. All references listed, cited and/or
discussed in this specification are incorporated herein by
reference in their entireties and to the same extent as if each
reference was individually incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0003] The disclosure relates to a heat dissipation system, and in
particular, to a network equipment power supply and a heat
dissipation system therefor.
2. Related Art
[0004] With innovation and development of distributed computing
architectures such as artificial intelligence, cloud computing, big
data, and so on, data center acting as information infrastructure
undertakes an increasing amount of calculation, and has a higher
requirement for computational efficiency. To cope with various
challenges, power density of the data center is rising, and since
the traditional air-cooling heat dissipation is fatigue in facing
the high density, heat dissipation efficiency is gradually unable
to keep pace with the computational efficiency. Regardless of large
cloud computing data center, or small edge data center,
liquid-cooling heat dissipation reflects a better using effect. The
liquid-cooling heat dissipation has the following advantages: (1)
large specific heat capacity and high heat dissipation efficiency;
(2) reducing power consumption, and decreasing outlay cost; (3)
saving energy, protecting environment, and reducing noise
index.
[0005] Moreover, temperature also has a large influence on quality
and safety of a Power Supply Unit (PSU, sometimes it is also short
for "power supply"). Currently, the PSU, especially for AC-DC PSU,
commonly uses the way of air-cooling heat dissipation and natural
heat dissipation, but the maximum power density that can be coped
with by these two heat dissipation ways is estimated to be 100
W/in.sup.3. As for the PSU with a power density larger than 100
W/in.sup.3, thermal design is still a difficult problem to be
solved.
[0006] Therefore, with development of power supply products with a
high power density, how to provide a choice for thermal design of
power supply products with high power density also becomes an
urgent issue to be solved.
SUMMARY OF THE INVENTION
[0007] The present disclosure provides a heat dissipation system
for a network equipment power supply, comprising:
[0008] a liquid-cooling heat dissipation device including a liquid
inlet, a liquid outlet, and a liquid-cooling pipe between the
liquid inlet and the liquid outlet, wherein liquid-cooling medium
flows inside the liquid-cooling pipe and takes away heat generated
by components arranged around the liquid-cooling pipe; and
[0009] an air-cooling heat dissipation device including an air
inlet, an air outlet, and an air-cooling channel between the air
inlet and the air outlet, wherein airflow passes through the
air-cooling channel and takes away heat generated by components
arranged around the air-cooling channel.
[0010] The present disclosure further provides a network equipment
power supply, and the network equipment power supply is configured
to include the above heat dissipation system.
[0011] The disclosure realizes a hybrid design of heat dissipation
making use of characteristics of liquid-cooling heat dissipation
and air-cooling heat dissipation, and the characteristic of better
heat dissipation capability of liquid-cooling is utilized to
conduct liquid-cooling heat dissipation for heat dense integration
area and high loss devices such as transformer, and the
characteristics of poor heat dissipation capability, while
non-conductivity, good flowability, and small corrosion of
air-cooling are utilized to conduct air-cooling heat dissipation
for devices with little heat and located remotely, such that heat
dissipation efficiency can be enhanced effectively, and a new
choice may be provided for thermal design of the PSU with high
power density through a combination thereof.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] To make aforementioned and other objects, features,
advantages and embodiments of the disclosure more obvious and
understandable, the accompanying drawings are provided as
follows:
[0013] FIG. 1A is a structural diagram of a first embodiment of a
heat dissipation system for a network equipment power supply.
[0014] FIG. 1B is a spatial structural diagram with an upper cover
of a housing removed in FIG. 1A.
[0015] FIG. 1C is a front view of FIG. 1A.
[0016] FIG. 1D is a back view of FIG. 1A.
[0017] FIG. 1E illustrates a modification of the heat dissipation
system of FIG. 1B.
[0018] FIG. 2A is a spatial structural diagram of a second
embodiment of a heat dissipation system for a network equipment
power supply.
[0019] FIG. 2B is a structural diagram with an upper cover of a
housing removed in FIG. 2A.
[0020] FIG. 2C is a front view of FIG. 2A.
[0021] FIG. 2D is a back view of FIG. 2A.
[0022] FIG. 2E is a modification of the heat dissipation system of
FIG. 2B.
[0023] FIG. 2F is a side view of the network equipment power supply
when a liquid-cooling heat dissipation device of the heat
dissipation system of FIG. 2A is mounted on a network equipment
cabinet, wherein a top of the network equipment power supply is a
wedge structure.
[0024] FIG. 3 illustrates another modification of the heat
dissipation system of FIG. 1B.
[0025] FIG. 4 illustrates a spatial structural diagram of a third
embodiment of a heat dissipation system for a network equipment
power supply.
[0026] FIG. 5 illustrates a spatial structural diagram of a fourth
embodiment of a heat dissipation system for a network equipment
power supply.
[0027] FIG. 6 illustrates a spatial structural diagram of a fifth
embodiment of a heat dissipation system for a network equipment
power supply.
DETAILED EMBODIMENTS OF THE INVENTION
[0028] To make the disclosure more explicit and complete, reference
can be made to the accompanying drawings and the various
embodiments, wherein the same numbers in the drawings represent the
same or similar components. On the other hand, the commonly known
components and steps are not described in the embodiment to avoid
unnecessary limitations to the disclosure. In addition, to simplify
the drawings, some known common structures and elements are
illustrated in a simple way in the drawings.
[0029] Hereinafter the detailed embodiments of the disclosure are
further explained with reference to the accompanying drawings and
examples, but the protection scope of the disclosure is not limited
thereto. It shall be pointed out that processes or signs without
special explanations can be understood or implemented by those
skilled in the art with reference to the prior arts.
[0030] In FIGS. 1A-1D, a spatial structure of a first embodiment of
a heat dissipation system 100 for a network equipment power supply
200 according to the disclosure is illustrated. The heat
dissipation system 100 comprises a liquid-cooling heat dissipation
device 10 and an air-cooling heat dissipation device 20 to form a
structure of hybrid heat dissipation.
[0031] The liquid-cooling heat dissipation device 10 includes a
liquid inlet 11, a liquid outlet 12, and a liquid-cooling pipe 13
between the liquid inlet 11 and the liquid outlet 12. The
liquid-cooling medium flows inside the liquid-cooling pipe 13 and
takes away heat generated by first devices 211, 212, 213 arranged
around the liquid-cooling pipe 13. In this embodiment, the
liquid-cooling medium may include but is not limited to water, for
example. The first devices may include but are not limited to high
loss devices having large heat production, such as, a MOS
transistor, a rectifier bridge, a transformer, a heating module,
and the like. For example, the first device 211 may be a printed
circuit board (PCB) module, the first device 212 may be a power
component such as a MOS transistor, and the first device 213 may be
a heating module such as a transformer. The expression "arranged
around the liquid-cooling pipe" refers to but is not limited to
arrangement surrounding one or more sides around the liquid-cooling
pipe. For example, it may refer to arrangement on one side of the
liquid-cooling pipe, or arrangement on both sides of the
liquid-cooling pipe, or arrangement around the liquid-cooling pipe,
or the like. In this embodiment, the liquid inlet 11 and the liquid
outlet 12 are arranged on the same side, for example, a left side
(a front side as shown in FIG. 1C) of the liquid-cooling heat
dissipation device 10, and may be provided with hydraulic quick
connectors 31 and 32 respectively through which a quick connection
between the liquid-cooling heat dissipation device 10 and an
external liquid medium source (for example, an external water
source) may be made, and liquid in-flow and out-flow may be better
controlled. The liquid medium may flow in from the hydraulic quick
connector 31 on the liquid inlet 11, and flows out from the
hydraulic quick connector 32 on the liquid outlet 12 after flowing
through the liquid-cooling pipe 13. As shown in FIG. 1B, the liquid
medium flows in from a solid arrow direction I, and flows out from
a solid arrow direction 0 in the figure. In other embodiment, the
liquid inlet 11 and the liquid outlet 12 may also be arranged on
different sides of the liquid-cooling heat dissipation device
10.
[0032] The air-cooling heat dissipation device 20 includes an air
inlet 21, an air outlet 22, and an air-cooling channel 23 between
the air inlet 21 and the air outlet 22. Airflow passes through the
air-cooling channel 23 and takes away heat generated by the
components around the air-cooling channel 23. In this embodiment,
the air inlet 21, for example, is arranged on a back side of the
network equipment power supply 200, as shown in FIG. 1D, and the
air outlet 22, for example, is arranged on a front side of the
network equipment power supply 200, as shown in FIG. 1C. Moreover,
the airflow, for example, comes from a fan 24 of the network
equipment power supply 200, and the fan 24 may be provided within a
housing 201 of the network equipment power supply 200, and also may
be provided out of the housing 201 of the network equipment power
supply 200. The airflow may be introduced into the network
equipment power supply 20 from outside through the fan 24. The
introduced airflow flows through the air-cooling channel 23 shown
in a dotted arrow direction A in FIG. 1B, takes away heat generated
by the network equipment power supply 200, and flows out from the
air outlet 22.
[0033] In this embodiment, as shown in FIG. 1B, the liquid-cooling
pipe 13 is provided inside the network equipment power supply 200.
Also, the liquid-cooling pipe 13 may be a straight liquid-cooling
pipe adjacent or attached to one side of an inner wall 2011 of the
housing 201 of the network equipment power supply 200, for example.
In this embodiment, power components with high losses or more heat
(such as, including but not limited to a printed circuit board
module 211, a power component 212, a heating module 213, and the
like) are arranged around the liquid-cooling pipe 13 (attached or
adjacent to the liquid-cooling pipe 13, for example), so as to be
largely under water-cooling heat dissipation to have a large amount
of concentrated heat taken away. Meanwhile, the airflow generated
by operation of the fan 24 may conduct air-cooling heat dissipation
to heat generated by the network equipment power supply 200
including first devices 211-213 arranged around the liquid-cooling
pipe 13 and second devices 221-222 far away from the liquid-cooling
pipe 13, thereby achieving hybrid heat dissipation combining
water-cooling heat dissipation and air-cooling heat dissipation and
effectively enhancing heat dissipation efficiency. In addition, the
second devices 221-222 far away from the liquid-cooling pipe 13 may
also conduct heat to the liquid-cooling pipe 13 or the housing 201
for heat dissipation by using of heat conducting glue, heat
conducting gasket, or other heat conducting structures.
[0034] FIG. 1E illustrates a modification of the heat dissipation
system 100 of FIG. 1B, which differs from the first embodiment
shown in FIGS. 1A to 1D in that the airflow comes from outside of
the network equipment power supply 200, and may be system air from
the fan of a network equipment cabinet, for example, or natural
wind.
[0035] FIGS. 2A to 2D illustrate a structure of a second embodiment
of a heat dissipation system 100 for a network equipment power
supply according to the disclosure, which differs from the first
embodiment shown in FIGS. 1A to 1D in that the liquid-cooling pipe
13' is arranged outside of the network equipment power supply 200,
such as, over top of an upper cover 2012 of the housing 201 of the
network equipment power supply 200. Other structures of the heat
dissipation system 100 are substantially the same as that in the
first embodiment shown in FIGS. 1A to 1D, so the details are
omitted herein. In this embodiment, the liquid-cooling pipe 13',
for example, may be the straight liquid-cooling pipe thermally
coupled to the top of the upper cover 2012 of the housing 201. The
fan 24 of the network equipment power supply 200 may be mounted
within or out of the housing 201. The first device 213 (such as, a
thermal surface-mounted device or a PCB board) may be attached or
adjacent to the upper cover 2012 of the housing 201. Alternatively,
the housing 201 may also have a heat conducting member (such as,
heat conducting glue, heat conducting gasket, or the like), and the
first device 213 may be attached to the housing 201 through the
heat conducting member. The device slightly far away may conduct
heat to the upper cover 2012 of the housing 201 for heat
dissipation by using of heat conducting glue, heat conducting
gasket, or other heat conducting structures. Most of heat generated
by the first device 213 arranged around the liquid-cooling pipe 13'
may be taken away by the liquid-cooling pipe 13' in the way of
water-cooling heat dissipation, and heat generated by the device
far away from the liquid-cooling pipe 13' and a part of heat
generated by the first device 213 may be blown away by the fan
24.
[0036] In this embodiment, the top of the upper cover 2012 of the
housing 201 and the liquid-cooling pipe 13' may also be filled with
heat conducting glue therebetween for conducting heat and
flattening the interface.
[0037] FIG. 2E illustrates a modification of the heat dissipation
system 100 of FIG. 2A, which differs from the second embodiment
shown in FIGS. 2A to 2D in that the airflow comes from outside of
the network equipment power supply 200, and may be system air from
the fan of a network equipment cabinet for example, or natural
wind.
[0038] In other embodiments, the liquid-cooling heat dissipation
device 10 of the heat dissipation system 100 may be mounted in a
network equipment cabinet where the network equipment power supply
200 is insertable mounted, and the outside of the housing 201 of
the network equipment power supply 200 is thermally coupled to the
liquid-cooling pipe 13' after the insertion. FIG. 2F is a side view
of the network equipment power supply when a liquid-cooling heat
dissipation device of the heat dissipation system of FIG. 2A is
mounted on a network equipment cabinet. A top 2013 of the network
equipment power supply 200 may be a wedge structure. The wedge
structure may match well with the liquid-cooling pipe 13' mounted
in the network equipment cabinet when the network equipment power
supply is inserted into the network equipment cabinet so as to
enhance heat dissipation efficiency and system reliability.
[0039] FIG. 3 illustrates another modification of the heat
dissipation system 100 of FIG. 1B. The liquid-cooling pipe 13 is
provided in an internal space of the housing 201 of the network
equipment power supply. When the heating components on the PCB may
be arranged along one line, the liquid-cooling pipe 13 may be
arranged in a line shape, and provided on one side of the housing
201 for liquid-cooling heat dissipation with one surface of the
liquid-cooling pipe 13.
[0040] FIG. 4 illustrates a structure of a third embodiment of a
heat dissipation system for a network equipment power supply
according to the disclosure. The liquid-cooling pipe 13 is the
straight liquid-cooling pipe provided in middle of the housing 201
of the network equipment power supply for liquid-cooling heat
dissipation with two surfaces of the liquid-cooling pipe 13, such
that heat dissipation efficiency is further enhanced. Taking
thermal design of a 10 KW network equipment power supply for
example, when designing, heating components such as the MOS
transistor, the rectifier bridge, the module, and the like may be
directly attached to the straight liquid-cooling pipe 13, irregular
heating components such as magnetic elements, and the like are
arranged to be adjacent to the straight liquid-cooling pipe 13, and
if necessary, heat may be conducted to the straight liquid-cooling
pipe 13 by encapsulating heat conducting glue. Moreover, there is
system air, which may be blown into the network equipment power
supply for air-cooling heat dissipation of partial inside
components, outside of the network equipment power supply. In such
way, heat dissipation of the network equipment power supply may be
efficiently solved by the way of heat dissipation combining
liquid-cooling heat dissipation and air-cooling heat
dissipation.
[0041] FIG. 5 illustrates a structure of a fourth embodiment of a
heat dissipation system for a network equipment power supply
according to the disclosure. The liquid-cooling pipe 13 is a
multidirectional liquid-cooling pipe having a plurality of
furcation branches, and may comprise one shared portion 13a and a
plurality of furcation branch portions 13b, 13c, 13d, for example.
When the heating components on the PCB are dispersed,
liquid-cooling heat dissipation may be conducted using this
multidirectional liquid-cooling pipe structure. The
multidirectional liquid-cooling pipe 13 has the single liquid inlet
11 and the single liquid outlet 12, and the plurality of furcation
branch portions 13b, 13c, 13d of the liquid-cooling pipe 13 share
the liquid inlet 11 and the liquid outlet 12, and extend in
multiple directions to area with severely heated devices. At this
time, the dispersed heating components may contact the
liquid-cooling pipe 13 for liquid-cooling heat dissipation.
[0042] FIG. 6 illustrates a structure of a fifth embodiment of a
heat dissipation system for a network equipment power supply
according to the disclosure. The liquid-cooling pipe 13 is the
bending liquid-cooling pipe having bending portions, and may
comprise a plurality of straight portions 13-1, 13-2, 13-3, the
bending portion 13-12 between the straight portions 13-1 and 13-2,
and the bending portion 13-23 between the straight portions 13-2
and 13-3, for example. Moreover, the straight portions 13-1, 13-2,
13-3 are adjacent or attached to one side of the inner wall of the
housing 201 of the network equipment power supply. For example, the
straight portions 13-1 and 13-3 are provided on an inner side of a
right sidewall of the housing 201 shown in the figure, the straight
portion 13-2 is provided on an inner side of a left sidewall of the
housing 201 shown in the figure, and the bending portions 13-12 and
13-23 are connected to the straight portions 13-1, 13-2, 13-3. The
bending portions 13-12 and 13-23 are made of a deformable material.
In other words, the liquid-cooling pipe 13 may change directions
according to positions of electrical elements, and is prepared into
a shape with multiple bending, such that a cooling liquid may flow
through the network equipment power supply in any directions such
as a horizontal direction, a longitudinal direction, a slant
direction, and the like, and layout of the electronic devices is
less affected by the liquid-cooling pipe. Such layout has a higher
flexibility than the straight line layout of the liquid-cooling
pipe, allows heat dissipation with several surfaces, and has a
higher efficiency.
[0043] In this disclosure, when using the layout shown in FIGS. 3
to 6, it may be designed in such way that a part of the
liquid-cooling pipe 13 is adjacent or attached to one side of the
inner wall of the housing of the network equipment power supply,
and the other portion is provided in middle of the housing of the
network equipment power supply. Furthermore, the liquid-cooling
pipe 13 may also have a first part surface exposed by a first
opening on the housing of the network equipment power supply
corresponding thereto; or attached to the inner wall of the housing
of the network equipment power supply. In other words, when there
is a layout that one part of the liquid-cooling pipe is attached to
the housing, for example, when the straight portions 13-1, 13-2,
13-3 shown in FIG. 6 are attached to the housing 201, the housing
with an attached portion may be removed, and replaced with the
corresponding sidewall of the liquid-cooling pipe. Alternatively,
the sidewall of the liquid-cooling pipe may attach to the inner
wall of the housing of the network equipment power supply in such
way that a large area of housing becomes to a heating conducting
sheet of the liquid-cooling pipe. In addition to heat dissipation
by using of the liquid-cooling pipe, the heating components may
also conduct heat to the housing, such that heat dissipation
efficiency is further enhanced.
[0044] Through the layout of the liquid-cooling pipe, without
increasing an external size, the liquid-cooling pipe may flexibly
reach the heating area inside the network equipment power supply, a
contact area between the heating area and the liquid-cooling pipe
is increased, and more heating components may be attached to a
surface of the liquid-cooling pipe, so as to achieve the objects of
improving heat dissipation amount, reducing temperature of
components inside the network equipment power supply, and solving
quality and safety problems caused by extremely high temperature of
the network equipment power supply with a high power density.
[0045] The disclosure further provides a network equipment power
supply 200 comprising the above heat dissipation system 100, as
shown in FIG. 1A. The network equipment power supply 200 is
suitable for a server or a data center.
[0046] The disclosure realizes a hybrid design of heat dissipation
making use of characteristics of liquid-cooling (or water-cooling)
heat dissipation and air-cooling heat dissipation. The
characteristic of strong heat dissipation capability of
liquid-cooling is utilized to conduct liquid-cooling heat
dissipation for heat dense integration area and high loss devices
such as transformer, and the characteristics of poor heat
dissipation capability, while non-conductivity, good flowability,
and small corrosion of air-cooling are utilized to conduct
air-cooling heat dissipation for devices with little heat and
located remotely. In such way, some designs of PSU (such as AC-DC
PSU) with high power density may be effectively solved through a
combination thereof.
[0047] The disclosure may largely reduce PSU noises, and may be
applied to sites having a high requirement for noises such as
medical treatment through application of liquid-cooling heat
dissipation.
[0048] The disclosure may enhance heat dissipation capability of
the PSU, and solve the problem of heat dissipation effectively
within a quite limited space.
[0049] The disclosure may promote application of water cooling in
the industries of communication server and network server, and
improve power densities of the system and the network
equipment.
[0050] Although the disclosure has been disclosed by the above
embodiments, any skilled technicians shall make various changes and
modifications without departing from spirit and scope of the
disclosure, so the protection scope of the disclosure shall be
determined by the scope defined by the appended claims.
* * * * *