U.S. patent application number 17/178859 was filed with the patent office on 2021-06-10 for antenna module and method of manufacturing the same.
This patent application is currently assigned to Samsung Electro-Mechanics Co., Ltd.. The applicant listed for this patent is Samsung Electro-Mechanics Co., Ltd.. Invention is credited to Ho Kyung KANG, ThomasA KIM.
Application Number | 20210175637 17/178859 |
Document ID | / |
Family ID | 1000005403969 |
Filed Date | 2021-06-10 |
United States Patent
Application |
20210175637 |
Kind Code |
A1 |
KANG; Ho Kyung ; et
al. |
June 10, 2021 |
ANTENNA MODULE AND METHOD OF MANUFACTURING THE SAME
Abstract
An antenna module includes: an integrated circuit (IC)
configured to generate a radio frequency (RF) signal; and a
substrate including an antenna portion providing a first surface of
the substrate, and a circuit pattern portion providing a second
surface of the substrate. The antenna portion includes first
antenna members configured to transmit the RF signal, cavities
corresponding to the first antenna members, through vias
respectively disposed in the cavities and respectively electrically
connected to the first antenna members, and a plating member
disposed in at least one cavity among the cavities. The circuit
pattern portion includes a circuit pattern and an insulating layer
forming, for each of the through vias, an electrical connection
path to the IC.
Inventors: |
KANG; Ho Kyung; (Suwon-si,
KR) ; KIM; ThomasA; (Suwon-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electro-Mechanics Co., Ltd. |
Suwon-si |
|
KR |
|
|
Assignee: |
Samsung Electro-Mechanics Co.,
Ltd.
Suwon-si
KR
|
Family ID: |
1000005403969 |
Appl. No.: |
17/178859 |
Filed: |
February 18, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
15994514 |
May 31, 2018 |
10971825 |
|
|
17178859 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/50 20130101;
H01L 2924/15192 20130101; H01L 2924/16152 20130101; H01L 23/552
20130101; H01L 23/49816 20130101; H01L 2224/73204 20130101; H01L
21/486 20130101; H01L 21/56 20130101; H01L 23/49838 20130101; H01Q
1/2283 20130101; H01L 23/13 20130101; H01L 21/4857 20130101; H01L
24/16 20130101; H01L 2223/6677 20130101; H01L 23/3121 20130101;
H01L 2223/6616 20130101; H01L 21/481 20130101; H01L 2224/16227
20130101; H01L 23/49833 20130101; H01Q 9/0414 20130101; H01L
21/6835 20130101; H01L 2924/1421 20130101; H01L 2924/19105
20130101; H01L 2924/3025 20130101; H01L 23/66 20130101; H01L 25/16
20130101; H01Q 21/065 20130101; H01L 2924/15321 20130101; H01Q 1/38
20130101; H01L 24/81 20130101; H01L 2223/6683 20130101; H01Q 9/0407
20130101; H01L 2924/1423 20130101; H01L 2224/32225 20130101; H01L
2924/181 20130101; H01L 2221/68345 20130101; H01L 23/49827
20130101; H01Q 1/523 20130101; H01L 2924/19042 20130101; H01L
2924/19041 20130101 |
International
Class: |
H01Q 21/06 20060101
H01Q021/06; H01Q 1/38 20060101 H01Q001/38; H01L 23/498 20060101
H01L023/498; H01L 23/13 20060101 H01L023/13; H01L 23/552 20060101
H01L023/552; H01L 23/66 20060101 H01L023/66; H01L 21/48 20060101
H01L021/48; H01L 23/00 20060101 H01L023/00; H01L 21/56 20060101
H01L021/56; H01L 23/31 20060101 H01L023/31; H01Q 9/04 20060101
H01Q009/04; H01Q 1/22 20060101 H01Q001/22; H01Q 1/52 20060101
H01Q001/52; H01L 21/683 20060101 H01L021/683 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 28, 2017 |
KR |
10-2017-0096349 |
Sep 22, 2017 |
KR |
10-2017-0122447 |
Claims
1. An antenna module, comprising: an insulating member having a
cavity surrounded by the insulating member; a dielectric member
disposed in the cavity and having a dielectric dissipation factor
(Df) lower than a Df of the insulating member; and an antenna
member disposed on the dielectric member and configured to remotely
transmit and/or receive an RF signal.
2. The antenna module of claim 1, wherein the dielectric member
includes quartz or teflon.
3. The antenna module of claim 1, further comprising a through via
disposed to penetrate through the dielectric member and providing a
path of the RF signal to the antenna member.
4. The antenna module of claim 1, further comprising an
encapsulation member disposed on the dielectric member, wherein the
antenna member is disposed between the encapsulation member and the
dielectric member.
5. The antenna module of claim 4, further comprising a second
antenna member disposed in the encapsulation member, wherein upper
surfaces of the second antenna member and the encapsulation member
form a common planar surface.
6. The antenna module of claim 5, wherein the second antenna member
is configured as second antenna members disposed to be spaced apart
from each other.
7. The antenna module of claim 4, wherein the dielectric member is
configured as dielectric members disposed to be spaced apart from
each other, and a portion of the encapsulation member is disposed
between the dielectric members.
8. The antenna module of claim 1, wherein the cavity is configured
as cavities respectively surrounded by the insulating member, and
the dielectric member is configured as dielectric members disposed
in the cavities.
9. The antenna module of claim 8, further comprising a plating
member disposed to respectively surround the dielectric
members.
10. The antenna module of claim 1, further comprising a plating
member disposed between the insulating member and the dielectric
member.
11. The antenna module of claim 10, further comprising shielding
vias disposed in the dielectric member, wherein the antenna member
is configured as antenna members disposed to be spaced apart from
each other and disposed to do not overlap the shielding vias in
extending directions of the shielding vias.
12. The antenna module of claim 1, wherein the antenna member is
configured as antenna members disposed to be spaced apart from each
other.
13. The antenna module of claim 1, further comprising a circuit
pattern portion disposed below the dielectric member and comprising
a circuit pattern and an insulating layer, and wherein the Df of
the dielectric member is lower than a Df of the insulating
layer.
14. An antenna module, comprising: a circuit pattern portion
comprising a circuit pattern and an insulating layer; a dielectric
member disposed on one surface of the circuit pattern portion and
having a dielectric dissipation factor (Df) lower than a Df of the
insulating layer; and an antenna member disposed on the dielectric
member and configured to remotely transmit and/or receive an RF
signal.
15. The antenna module of claim 14, wherein the dielectric member
includes quartz or teflon.
16. The antenna module of claim 14, further comprising a through
via disposed to penetrate through the dielectric member and
providing a path of the RF signal to the antenna member.
17. The antenna module of claim 14, further comprising an
encapsulation member disposed on the dielectric member, wherein the
antenna member is disposed between the encapsulation member and the
dielectric member.
18. The antenna module of claim 17, further comprising a second
antenna member disposed in the encapsulation member, wherein upper
surfaces of the second antenna member and the encapsulation member
form a common planar surface.
19. The antenna module of claim 14, further comprising a plating
member surrounding the dielectric member, wherein the dielectric
member is configured as dielectric members respectively surrounded
by the plating member.
20. The antenna module of claim 14, further comprising: a plating
member surrounding the dielectric member; and shielding vias
disposed in the dielectric member, wherein the antenna member is
configured as antenna members disposed to be spaced apart from each
other and disposed to do not overlap the shielding vias in
extending directions of the shielding vias.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser.
No. 15/994,514 filed on May 31, 2018, which claims the benefit
under 35 U.S.C. .sctn. 119(a) of Korean Patent Application Nos.
10-2017-0096349 and 10-2017-0122447 filed on Jul. 28, 2017 and Sep.
22, 2017, respectively, in the Korean Intellectual Property Office,
the entire disclosures of which are incorporated herein by
reference for all purposes.
BACKGROUND
1. Field
[0002] The following description relates to an antenna module and a
method of manufacturing an antenna module.
2. Description of Related Art
[0003] Recently, research has been conducted on millimeter wave
(mmWave) communications, including fifth generation (5G)
communications. Additionally, research has recently been conducted
on an antenna module that is capable of implementing millimeter
wave (mmWave) communications with suitable performance.
SUMMARY
[0004] This Summary is provided to introduce a selection of
concepts in a simplified form that are further described below in
the Detailed Description. This Summary is not intended to identify
key features or essential features of the claimed subject matter,
nor is it intended to be used as an aid in determining the scope of
the claimed subject matter.
[0005] In one general aspect, an antenna module includes: an
integrated circuit (IC) configured to generate a radio frequency
(RF) signal; and a substrate including an antenna portion providing
a first surface of the substrate, and a circuit pattern portion
providing a second surface of the substrate. The antenna portion
includes first antenna members configured to transmit the RF
signal, cavities corresponding to the first antenna members,
through vias respectively disposed in the cavities and respectively
electrically connected to the first antenna members, and a plating
member disposed in at least one cavity among the cavities. The
circuit pattern portion includes a circuit pattern and an
insulating layer forming, for each of the through vias, an
electrical connection path to the IC.
[0006] The antenna portion may further include an insulating member
at least partially two-dimensionally surrounding each of the
cavities. A thickness of the insulating member may be greater than
a thickness of the insulating layer.
[0007] The through vias may form linear connections between the
circuit pattern portion and corresponding first antenna members
among the first antenna members.
[0008] The plating member may two-dimensionally surround each of
the cavities.
[0009] The antenna portion may further include shielding vias at
least partially two-dimensionally surrounding each of the cavities
and the plating member.
[0010] The antenna module may further include: a dielectric member
disposed in at least some of the cavities and at least partially
two-dimensionally surrounding corresponding through vias among the
through vias, wherein a dielectric constant of the dielectric
member is different from a dielectric constant of the insulating
layer.
[0011] A dielectric dissipation factor (Df) of the dielectric
member may be lower than a Df of the insulating layer, and a
specific dielectric constant (Dk) of the dielectric member may be
lower than a Dk of the insulating layer.
[0012] The first antenna members may be disposed in the
corresponding cavities, and the antenna portion may further include
second antenna members corresponding to the first antenna members,
and an encapsulation member at least partially two-dimensionally
surrounding the second antenna members and forming the first
surface.
[0013] The IC may be configured to convert a signal received
through a connector or a receiving port disposed on the second
surface into the RF signal in a millimeter wave (mmWave) band.
[0014] In another general aspect, a method to manufacture an
antenna module includes: cutting a portion including an insulating
member and cavities formed in the insulating member; plating the
insulating member; forming first antenna members and through vias
in the cavities; adhering the insulating member to a circuit
pattern portion including a circuit pattern; and disposing an
integrated circuit (IC) on a surface of the circuit pattern
portion.
[0015] The method may further include compressing an encapsulation
member and second antenna members together on the insulating
member.
[0016] The forming of the first antenna members and the through
vias may include forming the through vias to be connected to
respective first antennas among the first antennas. The adhering of
the insulating member to the circuit pattern portion may include
disposing the insulating member such that the through vias are
connected to the circuit pattern.
[0017] The disposing of the IC on the surface the circuit pattern
portion may include connecting the IC to the circuit pattern.
[0018] The method may further include disposing dielectric members
in the cavities such that the dielectric layers are penetrated by
respective through vias, among the through vias.
[0019] Other features and aspects will be apparent from the
following detailed description, the drawings, and the claims.
BRIEF DESCRIPTION OF DRAWINGS
[0020] FIG. 1 is a diagram illustrating an antenna module,
according to an embodiment.
[0021] FIG. 2 is a diagram illustrating an antenna module having a
plating structure corresponding to each of first antennas therein,
according to an embodiment.
[0022] FIG. 3 is a diagram illustrating an antenna module including
a molding member for an IC, according to an embodiment.
[0023] FIG. 4 is a diagram illustrating an antenna module including
a connector, a receiving port and a shielding structure, according
to an embodiment.
[0024] FIGS. 5A through 5J are diagrams illustrating a method of
manufacturing the antenna module of FIG. 2, according to an
embodiment.
[0025] FIG. 6 is a diagram illustrating a first surface of the
antenna module of FIG. 2.
[0026] FIG. 7 is a diagram illustrating a first surface of an
antenna module, according to another embodiment.
[0027] FIG. 8 is a diagram illustrating a second surface of an
antenna module of FIG. 7, according to an embodiment.
[0028] Throughout the drawings and the detailed description, the
same reference numerals refer to the same elements. The drawings
may not be to scale, and the relative size, proportions, and
depiction of elements in the drawings may be exaggerated for
clarity, illustration, and convenience.
DETAILED DESCRIPTION
[0029] The following detailed description is provided to assist the
reader in gaining a comprehensive understanding of the methods,
apparatuses, and/or systems described herein. However, various
changes, modifications, and equivalents of the methods,
apparatuses, and/or systems described herein will be apparent after
an understanding of the disclosure of this application. For
example, the sequences of operations described herein are merely
examples, and are not limited to those set forth herein, but may be
changed as will be apparent after an understanding of the
disclosure of this application, with the exception of operations
necessarily occurring in a certain order. Also, descriptions of
features that are known in the art may be omitted for increased
clarity and conciseness.
[0030] The features described herein may be embodied in different
forms, and are not to be construed as being limited to the examples
described herein. Rather, the examples described herein have been
provided merely to illustrate some of the many possible ways of
implementing the methods, apparatuses, and/or systems described
herein that will be apparent after an understanding of the
disclosure of this application.
[0031] Throughout the specification, when an element, such as a
layer, region, or substrate, is described as being "on," "connected
to," or "coupled to" another element, it may be directly "on,"
"connected to," or "coupled to" the other element, or there may be
one or more other elements intervening therebetween. In contrast,
when an element is described as being "directly on," "directly
connected to," or "directly coupled to" another element, there can
be no other elements intervening therebetween.
[0032] As used herein, the term "and/or" includes any one and any
combination of any two or more of the associated listed items.
[0033] Although terms such as "first," "second," and "third" may be
used herein to describe various members, components, regions,
layers, or sections, these members, components, regions, layers, or
sections are not to be limited by these terms. Rather, these terms
are only used to distinguish one member, component, region, layer,
or section from another member, component, region, layer, or
section. Thus, a first member, component, region, layer, or section
referred to in examples described herein may also be referred to as
a second member, component, region, layer, or section without
departing from the teachings of the examples.
[0034] Spatially relative terms such as "above," "upper," "below,"
and "lower" may be used herein for ease of description to describe
one element's relationship to another element as shown in the
figures. Such spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. For example,
if the device in the figures is turned over, an element described
as being "above" or "upper" relative to another element will then
be "below" or "lower" relative to the other element. Thus, the term
"above" encompasses both the above and below orientations depending
on the spatial orientation of the device. The device may also be
oriented in other ways (for example, rotated 90 degrees or at other
orientations), and the spatially relative terms used herein are to
be interpreted accordingly.
[0035] The terminology used herein is for describing various
examples only, and is not to be used to limit the disclosure. The
articles "a," "an," and "the" are intended to include the plural
forms as well, unless the context clearly indicates otherwise. The
terms "comprises," "includes," and "has" specify the presence of
stated features, numbers, operations, members, elements, and/or
combinations thereof, but do not preclude the presence or addition
of one or more other features, numbers, operations, members,
elements, and/or combinations thereof.
[0036] Due to manufacturing techniques and/or tolerances,
variations of the shapes shown in the drawings may occur. Thus, the
examples described herein are not limited to the specific shapes
shown in the drawings, but include changes in shape that occur
during manufacturing.
[0037] The features of the examples described herein may be
combined in various ways as will be apparent after an understanding
of the disclosure of this application. Further, although the
examples described herein have a variety of configurations, other
configurations are possible as will be apparent after an
understanding of the disclosure of this application.
[0038] FIG. 1 is a diagram illustrating an antenna module 10,
according to an embodiment.
[0039] Referring to FIG. 1, a substrate of the antenna module 10
has a heterogeneous structure including an antenna region or
antenna portion 100 and a circuit pattern region or circuit pattern
portion 200. The antenna region (or portion) 100 has a structure
that facilitates improving antenna performance, and the circuit
pattern region 200 has a structure in which at least one circuit
pattern 202 and at least one insulating layer 204 are disposed. The
antenna portion 100 is disposed on the circuit pattern portion
200.
[0040] Referring to FIG. 1, the antenna portion 100 includes
cavities each including at least some of first antenna members
115a, 115b, 115c and 115d, through vias 120a, 120b, 120c and 120d,
dielectric members 130a, 130b, 130c and 130d, plating members 161
and 165, and shield vias 162, 163, and 164, and at least some of
second antenna members 110a, 110b, 110c, and 110d, an insulating
member 140, and a encapsulation member 150.
[0041] The second antenna members 110a, 110b, 110c, and 110d are
disposed adjacent to or on a first surface (upper surface in FIG.
1) of the antenna module 10 and receive radio frequency (RF)
signals or transmit RF signals generated from an integrated circuit
(IC) 300. That is, second antenna members 110a, 110b, 110c, and
110d are disposed on an upper surface of the antenna portion
100.
[0042] The first antenna members 115a, 115b, 115c, and 115d are
electromagnetically coupled to corresponding second antenna members
110a, 110b, 110c, and 110d to transmit the RF signals to the
corresponding second antenna members or receive the RF signals from
the corresponding second antenna members.
[0043] For example, the first antenna members 115a, 115b, 115c, and
115d may have a shape similar to that of the corresponding second
antenna members, and improve antenna performance such as
directivity of the corresponding second antenna member adjacent to
the corresponding second antenna member.
[0044] Depending on the design, one of the second antenna members
110a, 110b, 110c, and 110d and the first antenna members 115a,
115b, 115c, and 115d may be omitted. In addition, the antenna
portion 100 may further include additional antenna members
corresponding to the second antenna members 110a, 110b, 110c, and
110d, respectively.
[0045] The through vias 120a, 120b, 120c, and 120d may be
electrically connected to the corresponding first antenna members
to provide paths for the RF signals. The through vias 120a, 120b,
120c, and 120d may extend as much as a length longer than a
thickness of each insulating layer of the circuit pattern portion
200. Accordingly, the transmission efficiency of the RF signals may
be improved.
[0046] The dielectric members 130a, 130b, 130c, and 130d are
penetrated by the corresponding through vias 120a, 120b, 120c, and
120d and may surround the corresponding through vias 120a, 120b,
120c, and 120d. The dielectric members 130a, 130b, 130c, and 130d
are disposed on an upper surface of the circuit pattern portion
200. The dielectric members 130a, 130b, 130c, and 130d may have a
thickness greater than a thickness of each insulating layer 404 of
the circuit pattern portion 200.
[0047] Due to the lengths of the through vias 120a, 120b, 120c, and
120d and the thicknesses of the dielectric members 130a, 130b,
130c, and 130d, the boundary conditions for an operation of
transmitting and receiving the RF signals of the corresponding
first and second antenna members may be freely designed.
Accordingly, the through vias 120a, 120b, 120c, and 120d and the
dielectric members 130a, 130b, 130c, and 130d have boundary
conditions (e.g., a small manufacturing tolerance, a short
electrical length, a smooth surface, a large size of the cavity,
and a low dielectric constant, as non-limiting examples) suitable
for the operation of transmitting and receiving RF signals of the
corresponding first antenna members 115a, 115b, 115c, and 115d and
second antenna members 110a, 110b, 110c, and 110d, such that the
antenna performance of the first antenna members 115a, 115b, 115c,
and 115d and the second antenna members 110a, 110b, 110c, and 110d
is improved.
[0048] For example, the dielectric members 130a, 130b, 130c, and
130d may be formed of a material having a dielectric dissipation
factor (Df) such as quartz or teflon and/or a material having a low
specific dielectric constant (Dk). Thus, the antenna performance of
the corresponding first antenna members 115a, 115b, 115c, and 115d
and second antenna members 110a, 110b, 110c, and 110d is further
improved.
[0049] The insulating member 140 may have a thickness similar to
the thickness of the dielectric members 130a, 130b, 130c, and 130d.
For example, the insulating member 140 is formed of the same
material as that of the insulating layer 204 of the circuit pattern
portion 200, and may be implemented as a copper clad laminate
(CCL).
[0050] The encapsulation member 150 surrounds the second antenna
members 110a, 110b, 110c, and 110d and is inserted into a gap
between the dielectric members 130a, 130b, 130c, and 130d and the
insulating member 140. That is, the encapsulation member 150
improves the stability of the antenna portion 100.
[0051] The plating members 161 and 165 are disposed between the
dielectric members 130a, 130b, 130c, and 130d and the insulating
member 140.
[0052] The plating members 161 and 165 provide the boundary
conditions suitable for the operation of transmitting and receiving
the RF signals of the first antenna members 115a, 115b, 115c, and
115d and the second antenna members 110a, 110b, 110c, and 110d, and
improve isolation between the cavities, such that the antenna
performance of the first antenna members 115a, 115b, 115c, and 115d
and the second antenna members 110a, 110b, 110c, and 110d is 110a,
110b, 110c, and 110d is improved.
[0053] The shielding vias 162, 163, and 164 are disposed between
the dielectric members 130a, 130b, 130c, and 130d. The shielding
vias 162, 163, and 164 are disposed to two-dimensionally surround
or partially surround each of the cavities together along with the
plating members 161 and 165.
[0054] The plating members 161 and 165 and the shielding vias 162,
163, and 164 provide the boundary conditions suitable for the
operation of transmitting and receiving the RF signals of each of
the corresponding first antenna members 115a, 115b, 115c, and 115d
and second antenna members 110a, 110b, 110c, and 110d, and further
improve the isolation between the cavities, such that the antenna
performance of the corresponding first antenna members 115a, 115b,
115c, and 115d and second antenna members 110a, 110b, 110c, and
110d is improved.
[0055] The circuit pattern portion 200 provides an electrical
connection path to the IC 300 of each of the through vias 120a,
120b, 120c, and 120d. That is, the through vias 120a, 120b, 120c,
and 120d are respectively connected to the first antenna members
115a, 115b, 115c, and 115d, and are connected to the at least one
circuit pattern 202 to provide respective linear electrical
connection paths between the through vias 120a, 120b, 120c, and
120d and the at least one circuit pattern 202. In addition, the
circuit pattern portion 200 may provide a ground region and/or a
power supply region that supports the IC 300, and may provide an
electrical connection path between sub-substrates 400a and 400b and
the IC 300.
[0056] For example, the circuit pattern portion 200 has a structure
similar to a copper redistribution layer (RDL) of a printed circuit
board (PCB). On the other hand, the specific form of the circuit
pattern 202 in the circuit pattern portion 200 is not limited to
the form shown in FIG. 1. For example, the circuit pattern 202
includes feeding lines that are electrically isolated from each
other and electrically connect the corresponding through vias to
the IC 300.
[0057] Referring to FIG. 1, at least some of the IC 300, solder
balls 310, a resin 320, electronic components 350a and 350b, and
the sub-substrates 400a and 400b are disposed on a second surface
(lower surface in FIG. 1) of the antenna module 10. That is, at
least some of the IC 300, solder balls 310, a resin 320, electronic
components 350a and 350b, and the sub-substrates 400a and 400b are
disposed on a lower surface of the circuit pattern portion 200.
[0058] The IC 300 may generates the RF signals and receives the RF
signals received through the second antenna members 110a, 110b,
110c, and 110d. For example, the IC 300 receives a low frequency
signal through the sub-substrates 400a and 400b, and performs any
one or any combination of any two or more of frequency conversion,
amplification, filtering phase control, and power generation on the
low frequency signal and converts the low frequency signal into the
RF signal in a millimeter wave (mmWave) band.
[0059] The solder balls 310 electrically connect the IC 300 to the
circuit patterns 202 of the circuit pattern portion 200 and
electrically connect the circuit patterns 202 to the sub-substrates
400a and 400b.
[0060] The resin 320 improves the disposition stability for the
second surface (lower surface in FIG. 1) of the antenna module of
the IC 300.
[0061] The electronic components 350a and 350b provide any one or
any combination of any two or more of a resistance value, a
capacitance, and an inductance to the IC 300. For example, the
electronic components 350a and 350b may include a multilayer
ceramic capacitor (MLCC).
[0062] The sub-substrates 400a and 400b receive a low frequency
signal and/or a power, transmit the low frequency signal and/or the
power to the IC 300, and are electrically connected to the circuit
patterns 202 of the circuit pattern region 200 by solder balls
310.
[0063] For example, the sub-substrates 400a and 400b include at
least one circuit pattern 410a and at least one circuit pattern
410b, respectively, at least one insulating layer 420a and at least
one insulating layer 420b, respectively, and external connection
solder balls 430a and 430b, respectively.
[0064] FIG. 2 is a diagram showing an antenna module 10' including
a plating structure corresponding to each of the first antennas
115a, 115b, 115c, and 115d.
[0065] Referring to FIG. 2, the antenna portion 100' includes the
insulating member 140 and second to fourth insulating members 141,
142, and 143. The second to fourth insulating members 141, 142, and
143 are surrounded or partially surrounded by corresponding plating
members 162a, 163a, and 164a.
[0066] That is, the insulating member 140 and the second insulating
member 141 may surround or partially surround a first cavity
two-dimensionally, the second insulating member 141 and the third
insulating member 142 may surround or partially surround a second
cavity two-dimensionally, the third insulating member 142 and the
fourth insulating member 143 may surround or partially surround a
third cavity two-dimensionally, and the fourth insulating member
143 and the insulating member 140 may surround or partially
surround a fourth cavity two-dimensionally. In this example, the
plating members 161, 162a, 163a, 164a, and 165 may surround or
partially surround each of the first to fourth cavities
two-dimensionally.
[0067] FIG. 3 is a diagram showing an antenna module 10'' including
a molding member 300 for the IC 300.
[0068] Referring to FIG. 3, in the antenna module 10'', the IC 300
and the electronic components 350a and 350b are at least partially
covered or surrounded by a molding member 330 to protect the IC 300
and the electronic components 350a and 350b from the external
environment. The molding member 330 may be formed of an epoxy
molding compound.
[0069] FIG. 4 is a diagram showing an antenna module 10'''
including a connector 500, a receiving port 600 and a shielding can
700.
[0070] Referring to FIG. 4, the connector 500 may be configured to
be coupled to an outside component, another module, or another
substrate in a wired manner.
[0071] The receiving port 600 may also be configured to be
electromagnetically coupled to an outside component, another
module, or another substrate, and may receive a low frequency
signal and/or a power and transmit the low frequency signal and/or
the power to the IC 300.
[0072] A shielding can 700 surrounds the IC 300 to protect the IC
300 from external noise.
[0073] FIGS. 5A through 5J are diagrams showing a method of
manufacturing the antenna module 10', according to an
embodiment.
[0074] Referring to FIGS. 5A and 5B, first, the insulating sheet 40
and copper foil layers 166 and 167 disposed on upper and lower
surfaces thereof is cut to form the insulating member 140 and the
second through fourth insulating members 141, 142, and 143 to form
cavities C1, C2, C3, and C4. However, in a manufacturing process of
the antenna module 10 shown in FIG. 1, the second to fourth
insulating members 141, 142, and 143 are omitted.
[0075] The cavities C1, C2, C3, and C4 are provided with the
plating members 161, 162a, 163a, 164a, and 165, respectively, as
shown in FIG. 5C. The plating members 161, 162a, 163a, 164a, and
165 are disposed on the insulating members 140, 141, 142, and 143,
respectively. In the manufacturing process of the antenna module 10
shown in FIG. 1, the insulating members 162a, 163a, and 164a
corresponding to the second to fourth insulating members 141, 142,
and 143 are omitted.
[0076] Referring to FIG. 5D, an adhesive member 170 is applied to
the insulating member 140.
[0077] Referring to FIG. 5E, the first antenna members 115a, 115b,
115c, and 115d, the through vias 120a, 120b, 120c, and 120d, and
the dielectric members 130a, 130b, 130c, and 130d are disposed in
the respective cavities C1, C2, C3, and C4. In the manufacturing
process of the antenna module 10 shown in FIG. 1, the shielding
vias 162, 163, and 164 are arranged to penetrate the corresponding
dielectric members 130a, 130b, 130c, and 130d.
[0078] Referring to FIG. 5F, a film 180, including the second
antenna members 110a, 110b, 110c, and 110d attached to a lower
surface thereof, and the encapsulation member 150 are stacked on
upper surfaces of the insulating layers 140, 141, 142, and 143, the
first antenna members 115a, 115b, 115c, and 115d, and the
dielectric members 130a, 130b, 130c, and 130d. Referring to FIG.
5G, the insulating member 140, the encapsulation member 150, the
second antenna members 110a, 110b, 110c, and 110d, and the film 180
are then compressed such that the second antenna members 110a,
110b, 110c, and 110d are pressed into the encapsulation member 150,
thereby forming the antenna portion 100'. In this example, a
laminating method of a fan out panel level package (FOPLP)
technology may be utilized.
[0079] Next, as shown in FIG. 5H, film 180 is removed.
[0080] As shown in FIG. 5I, the adhesive member 170 is removed from
the lower surface of the antenna portion 100', and the circuit
pattern portion 200 is attached to the lower surface of the antenna
portion 100'. In this example, a circuit redistribution layer (RDL)
may be formed by the FOPLP technology.
[0081] As shown in FIG. 5J, the circuit pattern portion 200 shown
in FIG. 5I is provided with the solder balls 310, the IC 300, the
electronic component 350, and the sub-substrates 400a and 400b. The
solder balls 310 are applied with the resin 320 (FIG. 2).
[0082] FIG. 6 is a diagram showing a first surface of the antenna
module 10' shown in FIG. 2.
[0083] Referring to FIG. 6, each of the second antenna members
110a, 110b, 110c, 110d, 110e, 110f, 110g, 110h, 110i, 110j, 110k,
110l, 110m, 110n, 110o, and 110p is surrounded by corresponding
plating members 160a, 160b, 160c, 160d, 160e, 160f, 160g, 160h,
160i, 160j, 160k, 160l, 160m, 160n, 160o, and 160p. The plating
members 160a, 160b, 160c, 160d, 160e, 160f, 160g, 160h, 160i, 160j,
160k, 160l, 160m, 160n, 160o, and 160p provide the boundary
conditions suitable for the operation of transmitting and receiving
the RF signals of the corresponding second antenna members 110a,
110b, 110c, 110d, 110e, 110f, 110g, 110h, 110i, 110j, 110k, 110l,
110m, 110n, 110o, and 110p, such that the antenna performance of
the corresponding second antenna members is improved.
[0084] FIG. 7 is a diagram showing the first surface of an antenna
module, according to another embodiment.
[0085] Referring to FIG. 7, second antenna members 110-1, 110-2,
110-3, 110-4, 110-5, 110-6, 110-7, 110-8, and 110-9 are surrounded
by at least one corresponding plating member and at least one
corresponding shielding via. That is, plating members 160-1, 160-2,
160-3, 160-4, 160-6, 160-7, 160-8, and 160-9 and of shielding vias
190-1, 190-2, 190-3, 190-4, 190-5, 190-6, 190-7, 190-8, and 190-9
provide the boundary conditions suitable for the operation of
transmitting and receiving the RF signals of the corresponding
second antenna members 110-1, 110-2, 110-3, 110-4, 110-5, 110-6,
110-7, 110-8, and 110-9, such that the antenna performance of the
corresponding second antenna members 110-1, 110-2, 110-3, 110-4,
110-5, 110-6, 110-7, 110-8, and 110-9 is improved.
[0086] The plating members 160-1, 160-2, 160-3, 160-4, 160-6,
160-7, 160-8, and 160-9 may more completely surround the
corresponding second antenna members 110-1, 110-2, 110-3, 110-4,
110-5, 110-6, 110-7, 110-8, and 110-9 than the shielding vias
190-1, 190-2, 190-3, 190-4, 190-5, 190-6, 190-7, 190-8, and 190-9.
That is, the performance of a second antenna member completely
surrounded by a plating member may be better than that of a second
antenna member surrounded by a shielding via.
[0087] A process of forming the shielding via may be simpler than a
process of forming the plating member. Accordingly, a plating
member and a shielding via may be appropriately selected according
to the performance and cost required for the antenna module.
[0088] A number, a disposition, and a shape of the second antenna
members shown in FIGS. 6 and 7 is not particularly limited. For
example, the shape of the plurality of second antenna members shown
in FIG. 6 may be circular, and the number of second antenna members
shown in FIG. 7 may be four.
[0089] When the second antenna members are omitted in an antenna
module according to FIGS. 6 and 7, the second antenna members may
be replaced with the first antenna members (e.g., the first antenna
members 115a, 115b, 115c, and 115d shown in FIGS. 1-4).
[0090] FIG. 8 is a diagram showing a second surface of an antenna
module, according to an embodiment.
[0091] Referring to FIG. 8, the IC 300 and electronic components
350 are surrounded by a sub-substrate 400. The electronic
components may include the electronic components 350a and 350b
shown in FIGS. 1 through 4, and the sub-substrate 400 may include
the sub-substrates 400a and 400 b shown in FIGS. 1 through 4.
[0092] As set forth above, according to embodiments disclosed
herein, an antenna module and a method of manufacturing the antenna
module improve the degree of freedom of the boundary conditions
that the cavities provide to the plurality of antennas, and improve
a degree of isolation between the cavities, thereby improving the
antenna performance.
[0093] In addition, the disclosed antenna module and method of
manufacturing the antenna module provide a structure that is easily
miniaturized while having the high level of antenna performance, by
using a substrate having an antenna portion facilitating
improvement of the antenna performance and a circuit pattern
portion facilitating formation of the circuit pattern.
[0094] While this disclosure includes specific examples, it will be
apparent after an understanding of the disclosure of this
application that various changes in form and details may be made in
these examples without departing from the spirit and scope of the
claims and their equivalents. The examples described herein are to
be considered in a descriptive sense only, and not for purposes of
limitation. Descriptions of features or aspects in each example are
to be considered as being applicable to similar features or aspects
in other examples. Suitable results may be achieved if the
described techniques are performed in a different order, and/or if
components in a described system, architecture, device, or circuit
are combined in a different manner, and/or replaced or supplemented
by other components or their equivalents. Therefore, the scope of
the disclosure is defined not by the detailed description, but by
the claims and their equivalents, and all variations within the
scope of the claims and their equivalents are to be construed as
being included in the disclosure.
* * * * *