U.S. patent application number 16/930914 was filed with the patent office on 2021-05-27 for deposition mask, method of manufacturing display device using the deposition mask, and display device.
This patent application is currently assigned to Samsung Display Co., Ltd.. The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Jeongkuk KIM, Youngmin MOON.
Application Number | 20210159291 16/930914 |
Document ID | / |
Family ID | 1000005022267 |
Filed Date | 2021-05-27 |
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United States Patent
Application |
20210159291 |
Kind Code |
A1 |
KIM; Jeongkuk ; et
al. |
May 27, 2021 |
DEPOSITION MASK, METHOD OF MANUFACTURING DISPLAY DEVICE USING THE
DEPOSITION MASK, AND DISPLAY DEVICE
Abstract
Provided are a deposition mask, a method of manufacturing a
display device using the deposition mask, and a display device. The
deposition mask includes a main frame defining a first opening;
ribs extending away from a side of the main frame, the ribs being
apart from each other and defining second openings; and bridges
connecting the ribs to one another across the second openings,
wherein the bridges and the ribs form the same top surface, and a
thickness of each of the bridges is less than a thickness of each
of the ribs.
Inventors: |
KIM; Jeongkuk; (Yongin-si,
KR) ; MOON; Youngmin; (Yongin-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-si |
|
KR |
|
|
Assignee: |
Samsung Display Co., Ltd.
Yongin-si
KR
|
Family ID: |
1000005022267 |
Appl. No.: |
16/930914 |
Filed: |
July 16, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/0011 20130101;
C23C 14/042 20130101; H01L 27/3258 20130101; H01L 27/3246 20130101;
H01L 27/3227 20130101 |
International
Class: |
H01L 27/32 20060101
H01L027/32; H01L 51/00 20060101 H01L051/00; C23C 14/04 20060101
C23C014/04 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 26, 2019 |
KR |
10-2019-0153544 |
Claims
1. A deposition mask comprising: a main frame defining a first
opening; ribs extending away from a side of the main frame, the
ribs being apart from each other and defining second openings; and
bridges connecting the ribs to one another across the second
openings, wherein the bridges and the ribs form a same top surface,
and a thickness of each of the bridges is less than a thickness of
each of the ribs.
2. The deposition mask of claim 1, wherein a cross-section of each
bridge has an inverted triangle shape, the cross-section being
perpendicular to a longwise direction of each bridge.
3. The deposition mask of claim 1, wherein a width of each bridge
in a direction perpendicular to a lengthwise direction of each
bridge is less than a thickness of each bridge, and a difference
between the thickness of each rib and the thickness of each bridge
is at least about 0.5 times the width of each bridge.
4. The deposition mask of claim 1, wherein a region of the main
frame that neighbors the second openings has a same shape of the
bridges.
5. A display device comprising: a substrate; a first display area
including first pixels disposed over the substrate; and a second
display area including second pixels disposed over the substrate
and having a resolution different from a resolution of the first
display area, wherein the first pixels and the second pixels
include a common electrode, the common electrode includes: a main
common electrode corresponding to the first display area; and
extension portions extending from the main common electrode to the
second display area and being apart from one another, and each of
the extension portions includes a first region between the second
pixels, the first region being thinner than the main common
electrode.
6. The display device of claim 5, wherein the common electrode
further includes second regions thinner than the main common
electrode in connection portions of the main common electrode and
the extension portions.
7. The display device of claim 5, wherein the first region crosses
a corresponding extension portion among the extension portions.
8. The display device of claim 5, wherein a transmission area is
defined between the extension portions in the second display area,
and the common electrode is not disposed in the transmission
area.
9. The display device of claim 8, wherein a resolution of the
second display area is less than a resolution of the first display
area.
10. The display device of claim 5, further comprising a component
for detecting an external signal, the component being disposed at a
position overlapping the second display area.
11. The display device of claim 10, wherein each of the first
pixels and the second pixels includes: a thin film transistor; and
an organic light-emitting diode electrically connected to the thin
film transistor, and a blocking layer is further disposed between
the thin film transistor and the substrate in the second display
area.
12. The display device of claim 11, further comprising a first
buffer layer and a second buffer layer disposed on the substrate,
wherein the blocking layer is disposed between the first buffer
layer and the second buffer layer.
13. The display device of claim 12, wherein an active layer of the
thin film transistor includes a silicon material, the first buffer
layer includes silicon nitride, and the second buffer layer
includes silicon oxide.
14. The display device of claim 11, further comprising: a
planarization layer between the thin film transistor and the
organic light-emitting diode; and a pixel-defining layer disposed
on the planarization layer and covering edge portions of a pixel
electrode of the organic light-emitting diode to define an emission
region, wherein a portion of the planarization layer and a portion
of the pixel-defining layer corresponding to a position overlapping
the transmission area are removed.
15. The display device of claim 5, wherein a number of second
pixels disposed in the second display area per a unit area is less
than a number of first pixels disposed in the first display area
per the unit area.
16. A method of manufacturing a display device, the method
comprising: attaching a substrate to a deposition mask; and
forming, through the deposition mask, a common electrode over the
substrate, wherein the deposition mask includes: a main frame
defining a first opening; ribs protruding away from a side of the
main frame, the ribs being apart from each other and defining
second openings; and bridges fixing the ribs to one another by
connecting the ribs across the second openings, each of the bridges
having a thickness less than a thickness of each of the ribs, the
common electrode includes: a main common electrode being deposited
through the first opening; and extension portions being deposited
through the second openings between the ribs, and the extension
portions include a first region thinner than the main common
electrode at a position where the bridges are disposed.
17. The method of claim 16, wherein a region of the main frame that
neighbors the second openings has a same shape of the bridges,
second regions are formed in connection portions of the main common
electrode and the extension portions, and the second regions and
the first region have a same shape.
18. The method of claim 16, wherein the ribs and the bridges form a
same top surface.
19. The method of claim 16, wherein the common electrode is not
formed in a transmission area between the extension portions.
20. The method of claim 16, wherein a component for sensing an
external signal is further disposed at a position overlapping at
least the transmission area.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
[0001] This application claims priority to and benefits of Korean
Patent Application No. 10-2019-0153544 under 35 U.S.C. .sctn. 119,
filed in the Korean Intellectual Property Office on Nov. 26, 2019,
the entire contents of which are incorporated herein by
reference.
BACKGROUND
1. Technical Field
[0002] One or more embodiments relate to a deposition mask, a
method of manufacturing a display device using the deposition mask,
and a display device.
2. Description of the Related Art
[0003] Recently, use of display devices has become diversified. As
display devices have become thinner and lighter, their range of use
has gradually been extended.
[0004] As display devices may be used in various ways, display
devices have been designed to have various shapes. Also, functions
that may be combined or associated with display devices continue to
increase.
[0005] It is to be understood that this background of the
technology section is, in part, intended to provide useful
background for understanding the technology. However, this
background of the technology section may also include ideas,
concepts, or recognitions that were not part of what was known or
appreciated by those skilled in the pertinent art prior to a
corresponding effective filing date of the subject matter disclosed
herein.
SUMMARY
[0006] One or more embodiments may include a deposition mask, a
method of manufacturing a display device using the deposition mask,
and a display device.
[0007] Additional aspects will be set forth in part in the
description which follows and, in part, will be apparent from the
description, or may be learned by practice of the presented
embodiments of the disclosure.
[0008] According to one or more embodiments, a deposition mask may
include a main frame defining a first opening, ribs extending away
from a side of the main frame, the ribs being apart from each other
and defining second openings, and bridges connecting the ribs to
one another across the second openings, wherein the bridges and the
ribs may form a same top surface, and a thickness of each of the
bridges may be less than a thickness of each of the ribs.
[0009] A cross-section of each bridge may have an inverted triangle
shape, the cross-section being perpendicular to a longwise
direction of each bridge.
[0010] A width of each bridge in a direction perpendicular to a
lengthwise direction of each bridge may be less than a thickness of
each bridge, and a difference between the thickness of each rib and
the thickness of each bridge may be at least about 0.5 times the
width of each bridge.
[0011] A region of the main frame that neighbors the second
openings may have a same shape of the bridges.
[0012] According to one or more embodiments, a display device may
include a substrate, a first display area including first pixels
disposed over the substrate, and a second display area including
second pixels disposed over the substrate and having a resolution
different from a resolution of the first display area, wherein the
first pixels and the second pixels may include a common electrode,
the common electrode may include a main common electrode
corresponding to the first display area, and extension portions
extending from the main common electrode to the second display area
and being apart from each other, and each of the extension portions
includes a first region between the second pixels, the first region
being thinner than the main common electrode.
[0013] The common electrode may further include second regions
thinner than the main common electrode in connection portions of
the main common electrode and the extension portions.
[0014] The first region may cross a corresponding extension portion
among the extension portions.
[0015] A transmission area may be defined between the extension
portions in the second display area, and the common electrode may
not be disposed in the transmission area.
[0016] A resolution of the second display area may be less than a
resolution of the first display area.
[0017] The display device may further include a component for
detecting an external signal, the component being disposed at a
position overlapping the second display area.
[0018] Each of the first pixels and the second pixels may include a
thin film transistor, and an organic light-emitting diode
electrically connected to the thin film transistor, and a blocking
layer may be further disposed between the thin film transistor and
the substrate in the second display area.
[0019] A first buffer layer and a second buffer layer may be
further disposed on the substrate, and the blocking layer may be
disposed between the first buffer layer and the second buffer
layer.
[0020] An active layer of the thin film transistor may include a
silicon material, the first buffer layer may include silicon
nitride, and the second buffer layer may include silicon oxide.
[0021] The display device may further include a planarization layer
between the thin film transistor and the organic light-emitting
diode, and a pixel-defining layer disposed on the planarization
layer and covering edge portions of a pixel electrode of the
organic light-emitting diode to define an emission region, wherein
a portion of the planarization layer and a portion of the
pixel-defining layer corresponding to a position overlapping the
transmission area may be removed.
[0022] A number of second pixels disposed in the second display
area per a unit area may be less than a number of first pixels
disposed in the first display area per the unit area.
[0023] According to one or more embodiments, a method of
manufacturing a display device may include attaching a substrate to
a deposition mask, and forming a common electrode over the
substrate through the deposition mask, wherein the deposition mask
may include a main frame defining a first opening, ribs protruding
away from a side of the main frame, the ribs being apart from each
other and defining second openings, and bridges fixing the ribs to
one another by connecting the ribs across the second openings, each
of the bridges having a thickness less than a thickness of the each
of the ribs, the common electrode may include a main common
electrode being deposited through the first opening, and extension
portions being deposited through the second openings between the
ribs, and the extension portions may include a first region thinner
than the main common electrode in a position where the bridges may
be disposed.
[0024] A region of the main frame that neighbors the second
openings may have a same shape of the bridges, second regions may
be formed in connection portions of the main common electrode and
the extension portions, and the second regions and the first region
may have a same shape.
[0025] The ribs and the bridges may form a same top surface.
[0026] The common electrode may not be formed in a transmission
area between the extension portions.
[0027] A component for sensing an external signal may be further
disposed at a position overlapping at least the transmission
area.
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The above and other aspects, features, and advantages of
certain embodiments of the disclosure will be more apparent from
the following description taken in conjunction with the
accompanying drawings, in which:
[0029] FIG. 1 is a schematic perspective view of an example of a
display device according to an embodiment;
[0030] FIG. 2 is a schematic cross-sectional view of an example of
cross-sections of the display device taken along lines A-A' and
B-B' of FIG. 1;
[0031] FIG. 3 is a schematic perspective view for illustrating some
processes of manufacturing the display device of FIG. 1;
[0032] FIG. 4 is a schematic plan view of a portion of a deposition
mask of FIG. 3;
[0033] FIG. 5 is a schematic cross-sectional view of an example of
a manufacturing apparatus used during a process of manufacturing
the display device of FIG. 2;
[0034] FIG. 6 is a schematic cross-sectional view of an example of
the deposition mask taken along line II-II' of FIG. 4;
[0035] FIG. 7 is a schematic plan view of the display device of
FIG. 1;
[0036] FIG. 8 is a schematic plan view of a portion of a common
electrode of the display device of FIG. 7;
[0037] FIG. 9 is a schematic cross-sectional view of an example of
the display device taken along line IV-IV' of FIG. 8; and
[0038] FIG. 10 is a schematic cross-sectional view of an example of
the deposition mask taken along line VI-VI' of FIG. 4.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0039] Reference will now be made in detail to embodiments,
examples of which are illustrated in the accompanying drawings,
wherein like reference numerals refer to like elements throughout.
In this regard, the embodiments may have different forms and should
not be construed as being limited to the descriptions set forth
herein. Accordingly, the embodiments are merely described below, by
referring to the figures, to explain aspects of the description. As
used herein, the term "and/or" includes any and all combinations of
one or more of the associated listed items. The terms "and" and
"or" may be used in the conjunctive or disjunctive sense and may be
understood to be equivalent to "and/or." Throughout the disclosure,
the expression "at least one of a, b and c" indicates only a, only
b, only c, both a and b, both a and c, both b and c, all of a, b,
and c, or variations thereof.
[0040] It will be understood that although the terms "first,"
"second," etc. may be used herein to describe various components,
these components should not be limited by these terms. These
components are only used to distinguish one component from
another.
[0041] As used herein, the singular forms "a," "an," and "the" are
intended to include the plural forms as well, unless the context
clearly indicates otherwise.
[0042] It will be further understood that the terms "comprises"
and/or "comprising" used herein specify the presence of stated
features or components, but do not preclude the presence or
addition of one or more other features or components.
[0043] It will be understood that when a layer, region, or
component is referred to as being "formed on," another layer,
region, or component, it can be directly or indirectly formed on
the other layer, region, or component. For example, intervening
layers, regions, or components may be present.
[0044] Sizes of elements in the drawings may be exaggerated or
reduced for convenience of explanation. In other words, since sizes
and thicknesses of components in the drawings may be arbitrarily
illustrated for convenience of explanation, the following
embodiments are not limited thereto.
[0045] When a certain embodiment may be implemented differently, a
specific process order may be performed differently from the
described order. For example, two consecutively described processes
may be performed substantially at the same time or performed in an
order opposite to the described order.
[0046] The term overlap may include layer, stack, face or facing,
extending over, covering or partly covering or any other suitable
term as would be appreciated and understood by those of ordinary
skill in the art.
[0047] "About" or "approximately" as used herein is inclusive of
the stated value and means within an acceptable range of deviation
for the particular value as determined by one of ordinary skill in
the art, considering the measurement in question and the error
associated with measurement of the particular quantity (i.e., the
limitations of the measurement system). For example, "about" may
mean within one or more standard deviations, or within .+-.30%,
20%, 5% of the stated value.
[0048] Unless otherwise defined, all terms used herein (including
technical and scientific terms) have the same meaning as commonly
understood by those skilled in the art to which this disclosure
pertains. It will be further understood that terms, such as those
defined in commonly used dictionaries, should be interpreted as
having a meaning that is consistent with their meaning in the
context of the relevant art and will not be interpreted in an ideal
or excessively formal sense unless clearly defined in the
specification.
[0049] FIG. 1 is a schematic perspective view of an example of a
display device 1 according to an embodiment.
[0050] Referring to FIG. 1, a display area DA of the display device
1 may include a first display area DA1 and a second display area
DA2. The first display area DA1 may be a main display area
displaying a main image by using light emitted from first pixels
Pm.
[0051] The second display area DA2 may be an area in which an
input/output component 300 such as a sensor that may use a light
signal or a sound signal may be disposed (e.g., arranged) below a
substrate 100. The input/output component 300 may emit, receive, or
emit and receive, for example, light and/or sound. A transmission
area TA may be provided in the second display area DA2 such that
the input/output component 300 may receive an external light signal
and/or sound signal, and such signals may be output to the outside
of the display device 1 from the input/output component. Since
second pixels Pa may be disposed in the second display area DA2,
the second display area DA2 may display an image by using light
emitted from the second pixels Pa. However, since the transmission
area TA may be disposed in the second display area DA2, the
resolution of an image provided by the second display area DA2 may
be less than the resolution of an image provided by the first
display area DA1. For example, the number of second pixels Pa
disposed in the second display area DA2 per same unit area may be
less than the number of first pixels Pm disposed in the first
display area DA1 per same unit area.
[0052] Hereinafter, though the display device 1 according to an
embodiment may be described as an organic light-emitting display
device as an example, a display device 1, a deposition mask, and a
method of manufacturing a display device according to embodiments
may be or may be applied with various types of display devices such
as inorganic light-emitting displays and quantum dot light-emitting
displays. Similarly, a display device, a deposition mask, and a
method of manufacturing a display device may be applied as various
technologies, including as a phone, a head up display, a
television, an artificial intelligence device, etc.
[0053] FIG. 2 is a schematic cross-sectional view of an example of
cross-sections of the display device taken along lines A-A' and
B-B' of FIG. 1.
[0054] As shown in FIG. 2, the first pixel Pm and the second pixel
Pa may include an organic light-emitting diode OLED having a
similar structure and a thin film transistor TFT having a similar
structure. A difference between the first pixel Pm and the second
pixel Pa may be the number of pixels per unit area in the first
display area DA1 and the second display area DA2.
[0055] The display device 1 may include the substrate 100 and the
input/output component 300. The substrate 100 may include the first
display area DA1 and the second display area DA2, and the
input/output component 300 may be disposed at a position
overlapping the second display area DA2.
[0056] The input/output component 300 may include an electronic
element that may use light or sound. For example, the input/output
component 300 may be a sensor such as an infrared sensor that emits
and/or receives light, a sensor that outputs and senses light or
sound to measure a distance or recognize a fingerprint, a small
lamp that outputs light, a speaker that outputs sound, and/or an
image-pickup device. An electronic element that uses light may use
light in various wavelength bands such as visible light, infrared
light, and ultraviolet light. The number of input/output components
300 disposed in the second display area DA2 may be provided in
plural. For example, a light-emitting element and a light-receiving
element as the input/output component 300 may be provided together
in a second display area DA2. As another example, a light-emitting
element and a light-receiving element may be simultaneously
provided in a single input/output component 300.
[0057] The substrate 100 may include glass, a polymer resin, or a
combination thereof. The polymer resin may include
polyethersulfone, polyacrylate, polyetherimide, polyethylene
naphthalate, polyethylene terephthalate, polyphenylene sulfide,
polyarylate, polyimide, polycarbonate, cellulose acetate
propionate, or a combination thereof. The substrate 100 including
the polymer resin may be flexible, rollable, or bendable. The
substrate 100 may have a multi-layered structure including a layer
including the polymer resin, and an inorganic layer (not
shown).
[0058] A buffer layer 111 may be disposed on the substrate 100. The
buffer layer 111 may reduce or block the penetration of foreign
substances, moisture, or external air from below the substrate 100
and provide a flat surface on the substrate 100.
[0059] The buffer layer 111 may include an inorganic material such
as an oxide or a nitride, an organic material, or an
organic/inorganic composite material, and may include a single
layer or a multi-layer including an inorganic material and an
organic material. For example, the buffer layer 111 may have a
structure in which a first buffer layer 111a and a second buffer
layer 111b may be stacked. The first buffer layer 111a and the
second buffer layer 111b may include different materials. For
example, the first buffer layer 111a may include silicon nitride,
for example, SiN.sub.x. The second buffer layer 111b may include
silicon oxide, for example, SiO.sub.x.
[0060] In the case where the first buffer layer 111a includes
silicon nitride, hydrogen may be included in forming the silicon
nitride. Through this technique, the carrier mobility of an active
layer 1130 formed on the buffer layer 111 may be improved and the
electric characteristic of a thin film transistor TFT may be
improved. The active layer 1130 may include a silicon material. An
interface bonding characteristic between the active layer 1130
including silicon and the second buffer layer 111b including
silicon oxide may be improved and thus the electric characteristic
of the thin film transistor TFT may be improved.
[0061] The thin film transistor TFT may be disposed on the buffer
layer 111, the thin film transistor TFT including the active layer
1130, a gate electrode G, a source electrode S, and a drain
electrode D. Hereinafter, though a top gate-type thin film
transistor TFT in which the gate electrode G disposed over the
active layer 1130 may be described, the thin film transistor TFT
may be a bottom gate-type thin film transistor in which the gate
electrode G may be disposed below the active layer 1130.
[0062] The active layer 1130 on the buffer layer 111 may include,
for example, polycrystalline silicon. The active layer 1130 may
include a channel region, a source region, and a drain region, the
channel region overlapping the gate electrode G. The source region
and the drain region may be disposed on two opposite sides of the
channel region and doped with impurities having a higher
concentration than that of the channel region. Here, the impurities
may include N-type impurities or P-type impurities. In another
embodiment, the active layer 1130 may include amorphous silicon or
an organic semiconductor material. In another embodiment, the
active layer 1130 may include an oxide semiconductor.
[0063] The gate electrode G may be disposed over the active layer
1130 with a first gate insulating layer 112 therebetween. The gate
electrode G may include at least one of molybdenum (Mo), aluminum
(Al), copper (Cu), and titanium (Ti), and may include a single
layer or a multi-layer.
[0064] The first gate insulating layer 112 may include at least one
of silicon oxide (SiO.sub.2), silicon nitride (SiN.sub.x), silicon
oxynitride (SiON), aluminum oxide (Al.sub.2O.sub.3), titanium oxide
(TiO.sub.2), tantalum oxide (Ta.sub.2O.sub.5), and hafnium oxide
(HfO.sub.2), and zinc oxide (ZnO.sub.2).
[0065] A second gate insulating layer 113 may cover the gate
electrode G. The second gate insulating layer 113 may include at
least one of silicon oxide (SiO.sub.2), silicon nitride
(SiN.sub.x), silicon oxynitride (SiON), aluminum oxide
(Al.sub.2O.sub.3), titanium oxide (TiO.sub.2), tantalum oxide
(Ta.sub.2O.sub.5), and hafnium oxide (HfO.sub.2), and zinc oxide
(ZnO.sub.2).
[0066] The source electrode S and the drain electrode D may be
disposed on an interlayer insulating layer 115. The source
electrode S and the drain electrode D may include a conductive
material including molybdenum (Mo), aluminum (Al), copper (Cu),
titanium (Ti), or a combination thereof, and may include a single
layer or a multi-layer including the above materials.
[0067] A planarization layer 117 may be disposed on the source
electrode S and the drain electrode D. An organic light-emitting
diode OLED may be disposed on the planarization layer 117. The
organic light-emitting diode OLED may be electrically connected to
the thin film transistor TFT. For example, the organic
light-emitting diode OLED may be electrically connected to the
drain electrode D.
[0068] The planarization layer 117 may have a flat top surface such
that a pixel electrode 210 may be formed flat. The planarization
layer 117 may include a single layer or a multi-layer including an
organic material. The planarization layer 117 may include a
general-purpose polymer such as benzocyclobutene (BCB), polyimide,
hexamethyldisiloxane (HMDSO), polymethylmethacrylate (PMMA) or
polystyrene (PS), polymer derivatives having a phenol-based group,
an acryl-based polymer, an imide-based polymer, an aryl ether-based
polymer, an amide-based polymer, a fluorine-based polymer, a
p-xylene-based polymer, a vinyl alcohol-based polymer, or a blend
thereof. The planarization layer 117 may include an inorganic
material. The planarization layer 117 may include at least one of
silicon oxide (SiO.sub.2), silicon nitride (SiN.sub.x), silicon
oxynitride (SiON), aluminum oxide (Al.sub.2O.sub.3), titanium oxide
(TiO.sub.2), tantalum oxide (Ta.sub.2O.sub.5), and hafnium oxide
(HfO.sub.2), and zinc oxide (ZnO.sub.2). In the case where the
planarization layer 117 includes an inorganic material, chemical
mechanical polishing may be performed depending on the case. The
planarization layer 117 may include both an organic material and an
inorganic material.
[0069] The pixel electrode 210 may include a (semi)-transparent
electrode or a reflective electrode. In an embodiment, the pixel
electrode 210 may include a reflective layer and a transparent or
(semi)-transparent electrode layer on the reflective layer, the
reflective layer including silver (Ag), magnesium (Mg), aluminum
(Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni),
neodymium (Nd), iridium (Ir), chrome (Cr), or a compound thereof.
The transparent or (semi)-transparent electrode layer may include
at least one of indium tin oxide (ITO), zinc oxide (IZO), zinc
oxide (ZnO), indium oxide (In.sub.2O.sub.3), indium gallium oxide
(IGO), and aluminum zinc oxide (AZO). In an embodiment, the pixel
electrode 210 may have a stacked structure of ITO/Ag/ITO.
[0070] A pixel-defining layer 119 may be disposed on the
planarization layer 117. The pixel-defining layer 119 may define an
emission region by including an opening corresponding to a pixel,
that is, an opening exposing at least a central portion of the
pixel electrode 210. The pixel-defining layer 119 may prevent an
arc, etc. from occurring between edges of the pixel electrode 210
and the common electrode 230 by increasing a distance between the
edges of the pixel electrode 210 and the common electrode 230. The
pixel-defining layer 119 may include, for example, an organic
material such as polyimide or HMDSO.
[0071] An intermediate layer 220 may include a low molecular weight
material or a polymer material. In the case where the intermediate
layer 220 includes a low molecular weight material, the
intermediate layer 220 may have a structure in which an HIL, an
HTL, an emission layer (EML), an ETL, an EIL, etc. may be stacked
in a single or a composite configuration. The intermediate layer
220 may include various organic materials such as copper
phthalocyanine (CuPc), N, N'-Di (naphthalene-1-yl)-N,
N'-diphenyl-benzidine (NPB), tris-8-hydroxyquinoline aluminum
(Alq3), or a combination thereof. These layers may be formed by
vacuum deposition.
[0072] In the case where the intermediate layer 220 includes a
polymer material, the intermediate layer 220 may have a structure
including an HTL and an EML. The HTL may include poly-3, 4-ethylene
dioxy thiophene (PEDOT), and the EML may include a polymer material
such as a polyphenylene vinylene (PPV)-based material or a
polyfluorene-based material. The structure of the intermediate
layer 220 is not limited to the above description and may have
various structures. For example, at least one of layers
constituting the intermediate layer 220 may be formed as one body
over the pixel electrodes 210. As another example, the intermediate
layer 220 may include a layer patterned to correspond to each of
the pixel electrodes 210.
[0073] The common electrode 230 may include a transparent electrode
or a reflective electrode. In an embodiment, the common electrode
230 may include a transparent or semi-transparent electrode and may
include a metal thin layer having a small work function and
including at least one of lithium (Li), calcium (Ca), lithium
fluoride (LiF)/Ca, LiF/aluminum (Al), Al, silver (Ag), magnesium
(Mg), and a compound thereof. The common electrode 230 may be
disposed over the first display area DA1 and the second display
area DA2 and disposed on the intermediate layer 220 and the
pixel-defining layer 119.
[0074] The transmission area TA of the second display area DA2 may
be an area through which a light signal and/or a sound signal
emitted from the input/output component 300 passes. For precise
signal transfer, the common electrode 230 may not be formed in the
transmission area TA. According to an experiment, a case where the
common electrode 230 may not be formed in the transmission area TA
shows about 1.5 times higher transmittance than a case where the
common electrode 230 may be formed in the transmission area TA. A
process of manufacturing the common electrode 230 having this
characteristic structure is described below. Also, to improve a
transmittance of the transmission area TA, the planarization layer
117 and the pixel-defining layer 119 may be removed from the
transmission area TA.
[0075] A blocking layer BSM may be disposed between the substrate
100 and the thin film transistor TFT in a position overlapping the
second pixel Pa in the second display area DA2. The blocking layer
BSM blocks the thin film transistor TFT such that the thin film
transistor TFT may not be influenced by a light signal or a sound
signal from the input/output component 300 adjacent thereto. For
example, the blocking layer BSM may be disposed between the first
buffer layer 111a and the second buffer layer 111b.
[0076] Though not shown, a thin-film encapsulation layer may be
formed on the common electrode 230, the thin-film encapsulation
layer including at least one inorganic encapsulation layer and at
least one organic encapsulation layer that may be stacked. The
inorganic encapsulation layer may include at least one inorganic
insulating material among aluminum oxide, titanium oxide, tantalum
oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride,
and silicon oxynitride. The organic encapsulation layer may include
polyethylene terephthalate, polyethylene naphthalate,
polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene,
polyacrylate, HMDSO, an acryl-based resin (e.g.
polymethylmethacrylate, polyacrylic acid, etc.), or a combination
thereof.
[0077] FIG. 3 is a schematic perspective view of some processes of
manufacturing the display device of FIG. 1. FIG. 4 is a schematic
plan view of a portion of a deposition mask of FIG. 3. FIG. 5 is a
schematic cross-sectional view of an example of a manufacturing
apparatus used during a process of manufacturing the display device
of FIG. 2. FIG. 6 is a schematic cross-sectional view of an example
of the deposition mask taken along line II-II' of FIG. 4.
[0078] FIG. 3 shows a method of forming the common electrode 230
(see FIG. 7) over the substrate 100. Specifically, a deposition
mask 10 may be closely attached to the substrate 100, and a
material that forms the common electrode 230 (see FIG. 7) may be
deposited over the substrate 100 through the deposition mask 10.
The common electrode 230 (see FIG. 7) may be formed over the first
display area DA1 and the second display area DA2 by one-time
deposition process. For this purpose, the deposition mask 10 may
include a first opening 12 and ribs 13, the first opening 12
corresponding to the first display area DA1.
[0079] The first opening 12 may be defined by a main frame 11 of
the deposition mask 10. The ribs 13 may protrude from a side of the
main frame toward the outside in a plan view to correspond to the
second display area DA2. For example, the ribs 13 may protrude from
the side of the main frame 11 away from the main frame 11.
[0080] The ribs 13 may be apart from each other, and as shown in
FIG. 4, second openings 15 may be defined between the ribs 13.
Since the ribs 13 may be disposed to correspond to the transmission
area TA (see FIG. 6), consequently, the common electrode 230 (see
FIG. 7) may not be deposited in the transmission area TA (see FIG.
6).
[0081] In contrast, the second openings 15 may be formed in
positions to overlap the second pixels Pa. Though this
configuration, the common electrode 230 (see FIG. 7) may be
deposited on positions corresponding to the second pixels Pa. A
width of the second opening 15 may be greater than a width of the
second pixels Pa. As a result, the common electrode 230 (see FIG.
7) deposited through the second openings 15 may cover the second
pixels Pa. Here, the width of the second pixels Pa may mean a width
of a width of the pixel-defining layer 119 (see FIG. 2) defining
the emission region. Therefore, even though a minute alignment
error between the deposition mask 10 and the substrate 100 may
occur during a process of forming the common electrode 230 (see
FIG. 7), the occurrence of a formation defect of the common
electrode 230 (see FIG. 7) may be prevented.
[0082] The ribs 13 may be connected to each other by bridges 14.
For example, the bridge 14 may cross the second opening 15 and be
disposed between forming regions of the second pixels Pa. Here, in
case that the bridge 14 may be referred to as crossing the second
opening 15, it may not only cross the second opening 15 at a
shortest distance but also may obliquely cross the second opening
15 with a straight shape depending on a position of the second
pixels Pa as shown in FIG. 4. The bridge 14 may allow the common
electrode 230 (see FIG. 7) to be formed at an accurate position in
the second display area DA2 by fixing the positions of the ribs 13
extended from the main frame 11.
[0083] The forming of the common electrode 230 (see FIG. 7) by
using the deposition mask 10 may be performed by using a
manufacturing apparatus 400 shown in FIG. 5. The manufacturing
apparatus 400 may include a chamber 410, a mask assembly 420, a
first supporter 430, a second supporter 440, a deposition source
450, a magnetic force generator 460, a vision part 470, and a
pressure adjuster 480.
[0084] The chamber 410 may include a space therein, and a portion
of the chamber 410 may be open. A gate valve 411 may be disposed in
an open portion of the chamber 410 such that the gate valve 411 may
be opened/closed. The pressure adjuster 480 may be connected to the
chamber 410 to adjust the pressure of the inside of the chamber
410. The pressure adjuster 480 may include a connection pipe 481
and a pump 482, the connection pipe 481 being connected to the
chamber 410, and the pump 482 being disposed at the connection pipe
481.
[0085] The mask assembly 420 may include a mask sheet 422 and a
mask frame 421 coupled to the mask sheet 422. The mask sheet 422
may include the deposition mask 10 described above. For example,
the mask sheet 422 may include multiple deposition masks 10. The
mask sheet 422 may be fixed to the mask frame 421 with tensile
force applied thereto.
[0086] The substrate 100 may be safely seated on the first
supporter 430. The first supporter 430 may adjust the position of
the substrate 100. For example, the first supporter 430 may include
a UVW stage. The mask assembly 420 may be safely seated on the
second supporter 440. Similarly to the first supporter 430, the
second supporter 440 may adjust the position of the mask assembly
420.
[0087] The deposition source 450 may receive a deposition material
and evaporate or sublimate the deposition material to supply the
deposition material to the chamber 410. The deposition source 450
may include a heater therein and melt or sublimate the deposition
material by heating the deposition material inside the deposition
source 450 through an operation of the heater.
[0088] The vision part 470 may be disposed on the chamber 410 and
may photograph the positions of the mask assembly 420 and the
substrate 100. The vision part 470 may photograph an alignment mark
of at least one of the mask assembly 420 and the substrate 100.
[0089] The magnetic force generator 460 may be disposed in the
chamber 410 and may closely attach the substrate 100 to the mask
assembly 420. The magnetic force generator 460 may include an
electromagnet or a permanent magnet generating magnetic force. As
described above, since the deposition mask 10 may include the
bridge 14 that may fix the positions of the ribs 13 extended from
the main frame 11, the deposition mask 10 may prevent the positions
of the ribs 13 from being twisted while the substrate 100 may be
closely attached to the mask assembly 420. As a result, the common
electrode 230 (see FIG. 7) may be deposited at an accurate position
in the second display area DA2.
[0090] The common electrode 230 (see FIG. 7) in the second display
area DA2 may be deposited through the second openings 15 between
the ribs 13. The bridge 14 may be disposed to cross the second
openings 15. However, it may be required that the common electrode
230 (see FIG. 7) deposited through the second openings 15 may not
be disconnected by the bridge 14. For this purpose, as shown in
FIG. 6, the bridge 14 and the rib 13 may form the same top surface,
and a thickness of the bridge 14 may be less than a thickness of
the rib 13. For example, since a bottom surface of the bridge 14
may be apart from a deposition surface on which the common
electrode 230 may be deposited, the common electrode 230 may be
deposited also below the bridge 14, and the common electrode 230
(see FIG. 7) may be continuously formed in the second display area
DA2 without being disconnected by the bridge 14.
[0091] Since the ribs 13 have a protruding shape from the main
frame 11 of the deposition mask 10, the common electrode 230 (see
FIG. 7) should be prevented from being disconnected by the main
frame 11 in the first display area DA1 and the second display area
DA2. For this purpose, a region P of the main frame 11 that
neighbors the second opening 15 may have the same shape as that of
the bridge 14. For example, a portion of the main frame 11
corresponding to the region P may have a thickness less than that
of the surroundings, and a cross-section of the deposition mask 10
taken along line II-II' of FIG. 4 and a cross-section of the
deposition mask 10 taken along line III-Ill' of FIG. 4 may have the
same shape as shown in FIG. 6. As a result, in case of depositing
the common electrode 230 (see FIG. 7) by using the deposition mask
10, the common electrode 230 (see FIG. 7) may be prevented from
being separated in the first display area DA1 and the second
display area DA2.
[0092] FIG. 7 is a schematic plan view of the display device of
FIG. 1. FIG. 8 is a schematic plan view of a portion of the common
electrode of the display device of FIG. 7. FIG. 9 is a schematic
cross-sectional view of an example of the display device taken
along line IV-IV' of FIG. 8.
[0093] First, as shown in FIG. 7, the display area DA may include
the first display area DA1 and the second display area DA2
respectively having different resolutions. The common electrode 230
may include a main common electrode 230a and extension portions
230b, the main common electrode 230a being disposed in the first
display area DA1, and the extension portions 230b being disposed in
the second display area DA2.
[0094] The common electrode 230 may be formed through one-time
deposition process by using the deposition mask 10 (see FIG. 3)
described above. Through this, the main common electrode 230a and
the extension portions 230b may be formed as one body. Therefore,
the first pixels Pm and the second pixels Pa may include the common
electrode 230 provided as one body.
[0095] The first pixels Pm may be densely disposed in the first
display area DA1, and the main common electrode 230a may be formed
as one body to correspond to the first pixels Pm.
[0096] Since the second pixels Pa may be less densely disposed in
the second display area DA2 than the first pixels Pm, the
resolution of the second display area DA2 may be less than the
resolution of the first display area DA1. The extension portions
230b may protrude from the main common electrode 230a and
respectively correspond to the second pixels Pa.
[0097] Although it is shown in FIG. 7 that the extension portions
230b may have a zigzag shape, the shape of the extension portions
230b may be variously changed depending on the arrangement of the
second pixels Pa. For example, the extension portions 230b may be
formed long in a straight line shape or obliquely formed, depending
on the arrangement of the second pixels Pa. The extension portions
230b may be apart from each other in a direction perpendicular to
the extension direction to form the transmission area TA.
[0098] The extension portions 230b may respectively cover the
second pixels Pa, and a width of an extension portion 230b may be
greater than a width of a second pixel Pa. Here, the width of the
second pixels Pa may mean a width of the opening of the
pixel-defining layer 119 (see FIG. 2) defining the emission region.
The extension portion 230b may include a first region G between the
second pixels Pa, the first region G being thinner than a thickness
of the main common electrode 230a. The first region G may have a
concave shape having a top surface that may be less than a top
surface of the surroundings. The first region G may be formed at a
position at which the bridge 14 (see FIG. 4) described above may be
disposed and may have the same pattern as that of the bridge 14
(see FIG. 4). For example, the first region G may cross the
extension portion 230b.
[0099] As described above, since the region P of the main frame
that neighbors the second opening 15 (see FIG. 4) may have the same
shape as that of the bridge 14 (see FIG. 4), the common electrode
230 may further include a second region Q having a height less than
that of the common electrode 230 adjacent thereto, the second
region Q being at a connection portion of the main common electrode
230a and the extension portion 230b. For example, cross-sections of
the display device taken along line IV-IV and line V-V of FIG. 8
may have the same shape as shown in FIG. 9.
[0100] FIG. 10 is a schematic cross-sectional view of an example of
the deposition mask taken along line VI-VI' of FIG. 4.
[0101] FIG. 10 shows a cross-sectional shape perpendicular to a
lengthwise direction of the bridge 14. As described above, since
the bottom surface of the bridge 14 may be apart from the
deposition surface, the common electrode 230 (see FIG. 7) may be
deposited below the bridge 14. In case of depositing the common
electrode 230 (see FIG. 7), the deposition material may be
obliquely incident. To improve a deposition efficiency of a portion
below the bridge 14, a shape of a vertical cross-section of the
bridge 14 may be an inverted triangle. However, the disclosure is
not limited thereto and the bridge 14 may have various shapes.
[0102] To improve the efficiency of depositing the common electrode
230 (see FIG. 2) below the bridge 14, a thickness T2 of the bridge
14 may be greater than a width W of the bridge 14, and a difference
between a thickness T1 of the rib 13 and the thickness T2 of the
bridge 14 may be at least about 0.5 times the width W of the bridge
14.
[0103] According to embodiments, since an image may be displayed
even in an area in which an input/output component may be disposed,
a display device in which a display area may be extended may be
implemented. The common electrode may be formed in an entire region
including a main display area and an area in which an input/output
component may be disposed by one-time deposition process.
[0104] It should be understood that embodiments described herein
should be considered in a descriptive sense only and not for
purposes of limitation. Descriptions of features or aspects within
each embodiment should typically be considered as available for
other similar features or aspects in other embodiments. While one
or more embodiments have been described with reference to the
figures, it will be understood by those of ordinary skill in the
art that various changes in form and details may be made therein
without departing from the spirit and scope as defined by the
following claims, including their equivalents.
* * * * *