U.S. patent application number 17/091276 was filed with the patent office on 2021-05-13 for organic light emitting diode display device.
The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Kyung Hyun CHOI, Jin Koo CHUNG.
Application Number | 20210143371 17/091276 |
Document ID | / |
Family ID | 1000005240991 |
Filed Date | 2021-05-13 |
![](/patent/app/20210143371/US20210143371A1-20210513\US20210143371A1-2021051)
United States Patent
Application |
20210143371 |
Kind Code |
A1 |
CHOI; Kyung Hyun ; et
al. |
May 13, 2021 |
ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE
Abstract
An organic light emitting diode display device includes a
substrate, a first pixel structure, a second pixel structure, a
thin film encapsulation structure, and a functional module. The
substrate includes a display region and a module region. The
display region includes a first pixel region, and the module region
includes a second pixel region and a transmissive region. The first
pixel structure is disposed in the first pixel region on the
substrate. The second pixel structure is disposed in the second
pixel region on the substrate. The thin film encapsulation
structure is disposed on the first and second pixel structures, and
includes a plurality of scatterers in the first module region. The
functional module is disposed in the module region on a bottom
surface of the substrate.
Inventors: |
CHOI; Kyung Hyun;
(Cheonan-si, KR) ; CHUNG; Jin Koo; (Suwon-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-Si |
|
KR |
|
|
Family ID: |
1000005240991 |
Appl. No.: |
17/091276 |
Filed: |
November 6, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/5253 20130101;
H01L 27/3244 20130101; H01L 51/5268 20130101 |
International
Class: |
H01L 51/52 20060101
H01L051/52 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 7, 2019 |
KR |
10-2019-0141958 |
Claims
1. An organic light emitting diode display device comprising: a
substrate including a display region and a module region, wherein
the display region includes a first pixel region, and the module
region includes a second pixel region and a transmissive region; a
first pixel structure disposed in the first pixel region on the
substrate; a second pixel structure disposed in the second pixel
region on the substrate; a thin film encapsulation structure
disposed on the first and second pixel structures, wherein the thin
film encapsulation structure includes a plurality of scatterers in
the module region; and a functional module disposed in the module
region on a bottom surface of the substrate.
2. The organic light emitting diode display device of claim 1,
wherein the thin film encapsulation structure includes: a first
inorganic thin film encapsulation layer disposed on the first and
second pixel structures; a first organic thin film encapsulation
layer disposed on the first inorganic thin film encapsulation
layer; and a second inorganic thin film encapsulation layer
disposed on the first organic thin film encapsulation layer.
3. The organic light emitting diode display device of claim 2,
wherein the scatterers are disposed inside a portion of the first
organic thin film encapsulation layer located in the module
region.
4. The organic light emitting diode display device of claim 2,
wherein a refractive index of the first organic thin film
encapsulation layer located in the display region is different from
a refractive index of the first organic thin film encapsulation
layer located in the module region.
5. The organic light emitting diode display device of claim 1,
wherein the scatterers include low refractive scatterers and high
refractive scatterers.
6. The organic light emitting diode display device of claim 1,
wherein the display region surrounds at least a portion of the
module region.
7. The organic light emitting diode display device of claim 1,
further comprising: a partition structure disposed at an outer
periphery of the module region on the substrate to surround the
second pixel structure.
8. The organic light emitting diode display device of claim 7,
wherein the thin film encapsulation structure includes: a first
inorganic thin film encapsulation layer disposed on the first and
second pixel structures and the partition structure; a first
organic thin film encapsulation layer disposed in the display
region on the first inorganic thin film encapsulation layer; a
second organic thin film encapsulation layer disposed in the module
region on the first inorganic thin film encapsulation layer; and a
second inorganic thin film encapsulation layer disposed on the
first and second organic thin film encapsulation layers.
9. The organic light emitting diode display device of claim 8,
wherein the scatterers are disposed inside the second organic thin
film encapsulation layer.
10. The organic light emitting diode display device of claim 8,
wherein the first organic thin film encapsulation layer is disposed
on an outer side of the partition structure, the second organic
thin film encapsulation layer is disposed on an inner side of the
partition structure, and a refractive index of the first organic
thin film encapsulation layer is different from a refractive index
of the second organic thin film encapsulation layer.
11. An organic light emitting diode display device comprising: a
substrate including: a display region including a first pixel
region; a first module region including a second pixel region and a
first transmissive region; and a second module region spaced apart
from the first module region and including a third pixel region and
a second transmissive region; a first pixel structure disposed in
the first pixel region on the substrate; a second pixel structure
disposed in the second pixel region on the substrate; a third pixel
structure disposed in the third pixel region on the substrate; a
first partition structure surrounding the second pixel structure; a
thin film encapsulation structure disposed on the first, second,
and third pixel structures and the first partition structure,
wherein the thin film encapsulation structure includes a plurality
of scatterers in the first and second module regions; a first
functional module disposed in the first module region on a bottom
surface of the substrate; and a second functional module disposed
in the second module region on the bottom surface of the
substrate.
12. The organic light emitting diode display device of claim 11,
wherein the thin film encapsulation structure includes: a first
inorganic thin film encapsulation layer disposed on the first,
second, and third pixel structures and the first partition
structure; a first organic thin film encapsulation layer disposed
in the display region and the second module region on the first
inorganic thin film encapsulation layer; a second organic thin film
encapsulation layer disposed in the first module region on the
first inorganic thin film encapsulation layer; and a second
inorganic thin film encapsulation layer disposed on the first and
second organic thin film encapsulation layers.
13. The organic light emitting diode display device of claim 12,
wherein the scatterers are disposed inside a portion of the first
organic thin film encapsulation layer located in the second module
region, and the scatterers are disposed inside the second organic
thin film encapsulation layer.
14. The organic light emitting diode display device of claim 12,
wherein the first organic thin film encapsulation layer is disposed
on an outer side of the first partition structure, the second
organic thin film encapsulation layer is disposed on an inner side
of the first partition structure, a refractive index of the first
organic thin film encapsulation layer located in the display region
is different from a refractive index of the first organic thin film
encapsulation layer located in the second module region, and the
refractive index of the first organic thin film encapsulation layer
located in the display region is different from a refractive index
of the second organic thin film encapsulation layer.
15. The organic light emitting diode display device of claim 11,
wherein the display region surrounds at least a portion of the
first module region and at least a portion of the second module
region.
16. The organic light emitting diode display device of claim 11,
further comprising: a second partition structure disposed at an
outer periphery of the second module region on the substrate to
surround the third pixel structure.
17. The organic light emitting diode display device of claim 16,
wherein the thin film encapsulation structure includes: a first
inorganic thin film encapsulation layer disposed on the first,
second, and third pixel structures, the first partition structure
and the second partition structure; a first organic thin film
encapsulation layer disposed in the display region on the first
inorganic thin film encapsulation layer; a second organic thin film
encapsulation layer disposed in the first module region on the
first inorganic thin film encapsulation layer; a third organic thin
film encapsulation layer disposed in the second module region on
the first inorganic thin film encapsulation layer; and a second
inorganic thin film encapsulation layer disposed on the first,
second, and third organic thin film encapsulation layers.
18. The organic light emitting diode display device of claim 17,
wherein the scatterers are disposed inside the second organic thin
film encapsulation layer, and the scatterers are disposed inside
the third organic thin film encapsulation layer.
19. The organic light emitting diode display device of claim 17,
wherein the first organic thin film encapsulation layer is disposed
on an outer side of each of the first and second partition
structures, the second organic thin film encapsulation layer is
disposed on an inner side of the first partition structure, the
third organic thin film encapsulation layer is disposed on an inner
side of the second partition structure, a refractive index of the
first organic thin film encapsulation layer is different from a
refractive index of the second organic thin film encapsulation
layer, and the refractive index of the first organic thin film
encapsulation layer is different from a refractive index of the
third organic thin film encapsulation layer.
20. The organic light emitting diode display device of claim 11,
wherein each of the first and second functional modules includes at
least one selected from a camera module, a face recognition sensor
module, a pupil recognition sensor module, an acceleration sensor
module, a proximity sensor module, an infrared sensor module, and
an illuminance sensor module.
Description
[0001] This application claims priority to Korean Patent
Application No. 10-2019-0141958, filed on Nov. 7, 2019, and all the
benefits accruing therefrom under 35 USC .sctn. 119, the content of
which in its entirety is herein incorporated by reference.
BACKGROUND
1. Field
[0002] Exemplary embodiments relate generally to an organic light
emitting diode display device. More particularly, embodiments of
the invention relate to an organic light emitting diode display
device including a functional module.
2. Description of the Related Art
[0003] Flat panel display devices are widely used as display
devices due to lightweight and thin characteristics thereof. Such
flat panel display devices include a liquid crystal display device
and an organic light emitting diode display device.
[0004] The organic light emitting diode display device may include
a display region configured to display an image and a non-display
region, and a functional module may be disposed in the non-display
region. The functional module may include: a camera module for
capturing an image of an object which is located over a front
surface of the organic light emitting diode display device; a face
recognition sensor module for detecting a face of a user; a pupil
recognition sensor module for detecting a pupil of the user; an
acceleration sensor module and a geomagnetic sensor module for
determining a movement of the organic light emitting diode display
device; a proximity sensor module and an infrared sensor module for
detecting proximity with respect to a front side of the organic
light emitting diode display device; or an illuminance sensor
module for measuring a degree of brightness when left in a pocket
or a bag, for example. Since the functional modules are typically
disposed in the non-display region of the organic light emitting
diode display device, an image may not be displayed at a portion
where the functional modules are disposed.
SUMMARY
[0005] Exemplary embodiments provide an organic light emitting
diode display device including a functional module.
[0006] According to an exemplary embodiment, an organic light
emitting diode display device includes a substrate, a first pixel
structure, a second pixel structure, a thin film encapsulation
structure, and a functional module. In such an embodiment, the
substrate includes a display region and a module region. In such an
embodiment, the display region includes a first pixel region, and
the module region includes a second pixel region and a transmissive
region. In such an embodiment, the first pixel structure is
disposed in the first pixel region on the substrate. In such an
embodiment, the second pixel structure is disposed in the second
pixel region on the substrate. In such an embodiment, the thin film
encapsulation structure is disposed on the first and second pixel
structures, and includes a plurality of scatterers in the module
region. In such an embodiment, the functional module is disposed in
the module region on a bottom surface of the substrate.
[0007] In an exemplary embodiment, the thin film encapsulation
structure may include a first inorganic thin film encapsulation
layer disposed on the first and second pixel structures, a first
organic thin film encapsulation layer disposed on the first
inorganic thin film encapsulation layer, and a second inorganic
thin film encapsulation layer disposed on the first organic thin
film encapsulation layer.
[0008] In an exemplary embodiment, the scatterers may be disposed
inside a portion of the first organic thin film encapsulation layer
located in the module region.
[0009] In an exemplary embodiment, a refractive index of the first
organic thin film encapsulation layer located in the display region
may be different from a refractive index of the first organic thin
film encapsulation layer located in the first module region.
[0010] In an exemplary embodiment, the scatterers may include low
refractive scatterers and high refractive scatterers.
[0011] In an exemplary embodiment, the display region may surround
at least a portion of the module region.
[0012] In an exemplary embodiment, the organic light emitting diode
display device may further include a partition structure disposed
at an outer periphery of the module region on the substrate to
surround the second pixel structure.
[0013] In an exemplary embodiment, the thin film encapsulation
structure may include a first inorganic thin film encapsulation
layer disposed on the first and second pixel structures and the
partition structure, a first organic thin film encapsulation layer
disposed in the display region on the first inorganic thin film
encapsulation layer, a second organic thin film encapsulation layer
disposed in the first module region on the first inorganic thin
film encapsulation layer, and a second inorganic thin film
encapsulation layer disposed on the first and second organic thin
film encapsulation layers.
[0014] In an exemplary embodiment, the scatterers may be disposed
inside the second organic thin film encapsulation layer.
[0015] In an exemplary embodiment, the first organic thin film
encapsulation layer may be disposed on an outer side of the
partition structure, and the second organic thin film encapsulation
layer may be disposed on an inner side of the partition structure.
In such an embodiment, a refractive index of the first organic thin
film encapsulation layer may be different from a refractive index
of the second organic thin film encapsulation layer.
[0016] According to an exemplary embodiment, an organic light
emitting diode display device includes a substrate, a first pixel
structure, a second pixel structure, a third pixel structure, a
first partition structure, a thin film encapsulation structure, a
first functional module, and a second functional module. In such an
embodiment, the substrate includes a display region, a first module
region, and a second module region. In such an embodiment, the
display region includes a first pixel region, and the first module
region includes a second pixel region and a first transmissive
region. In such an embodiment, the second module region is spaced
apart from the first module region, and includes a third pixel
region and a second transmissive region. In such an embodiment, the
first pixel structure is disposed in the first pixel region on the
substrate. In such an embodiment, the second pixel structure is
disposed in the second pixel region on the substrate. In such an
embodiment, the third pixel structure is disposed in the third
pixel region on the substrate. In such an embodiment, the first
partition structure surrounds the second pixel structure. In such
an embodiment, the thin film encapsulation structure is disposed on
the first, second, and third pixel structures and the first
partition structure, and includes a plurality of scatterers in the
first and second module regions. In such an embodiment, the first
functional module is disposed in the first module region on a
bottom surface of the substrate. In such an embodiment, the second
functional module is disposed in the second module region on the
bottom surface of the substrate.
[0017] In an exemplary embodiment, the thin film encapsulation
structure may include a first inorganic thin film encapsulation
layer disposed on the first, second, and third pixel structures and
the first partition structure, a first organic thin film
encapsulation layer disposed in the display region and the second
module region on the first inorganic thin film encapsulation layer,
a second organic thin film encapsulation layer disposed in the
first module region on the first inorganic thin film encapsulation
layer, and a second inorganic thin film encapsulation layer
disposed on the first and second organic thin film encapsulation
layers.
[0018] In an exemplary embodiment, the scatterers may be disposed
inside a portion of the first organic thin film encapsulation layer
located in the second module region, and may be disposed inside the
second organic thin film encapsulation layer.
[0019] In an exemplary embodiment, the first organic thin film
encapsulation layer may be disposed on an outer side of the first
partition structure, and the second organic thin film encapsulation
layer may be disposed on an inner side of the first partition
structure. In such an embodiment, a refractive index of the first
organic thin film encapsulation layer located in the display region
may be different from a refractive index of the first organic thin
film encapsulation layer located in the second module region, and
the refractive index of the first organic thin film encapsulation
layer located in the display region may be different from a
refractive index of the second organic thin film encapsulation
layer.
[0020] In an exemplary embodiment, the display region may surround
at least a portion of the first module region and at least a
portion of the second module region.
[0021] In an exemplary embodiment, the organic light emitting diode
display device may further include a second partition structure
disposed at an outer periphery of the second module region on the
substrate to surround the third pixel structure.
[0022] In an exemplary embodiment, the thin film encapsulation
structure may include a first inorganic thin film encapsulation
layer disposed on the first, second, and third pixel structures,
the first partition structure and the second partition structure, a
first organic thin film encapsulation layer disposed in the display
region on the first inorganic thin film encapsulation layer, a
second organic thin film encapsulation layer disposed in the first
module region on the first inorganic thin film encapsulation layer,
a third organic thin film encapsulation layer disposed in the
second module region on the first inorganic thin film encapsulation
layer, and a second inorganic thin film encapsulation layer
disposed on the first, second, and third organic thin film
encapsulation layers.
[0023] In an exemplary embodiment, the scatterers may be disposed
inside the second organic thin film encapsulation layer, and may be
disposed inside the third organic thin film encapsulation
layer.
[0024] In an exemplary embodiment, the first organic thin film
encapsulation layer may be disposed on an outer side of each of the
first and second partition structures, and the second organic thin
film encapsulation layer may be disposed on an inner side of the
first partition structure. In such an embodiment, the third organic
thin film encapsulation layer may be disposed on an inner side of
the second partition structure, and a refractive index of the first
organic thin film encapsulation layer may be different from a
refractive index of the second organic thin film encapsulation
layer. In such an embodiment, the refractive index of the first
organic thin film encapsulation layer may be different from a
refractive index of the third organic thin film encapsulation
layer.
[0025] In an exemplary embodiment, each of the first and second
functional modules may include at least one selected from a camera
module, a face recognition sensor module, a pupil recognition
sensor module, an acceleration sensor module, a proximity sensor
module, an infrared sensor module, and an illuminance sensor
module.
[0026] In exemplary embodiments of the invention, the organic light
emitting diode display device includes the thin film encapsulation
structure including the scatterers in the module region, so that
the transmittance of the external light may be adjusted in the
module region. Accordingly, in such embodiments of the organic
light emitting diode display device, a refractive index of the thin
film encapsulation structure located in the module region may be
effectively adjusted according to the type of the functional
module.
[0027] In exemplary embodiments of the invention, the organic light
emitting diode display device includes the partition structure, the
first organic thin film encapsulation layer, and the second organic
thin film encapsulation layer, so that the first organic thin film
encapsulation layer may be separated from the second organic thin
film encapsulation layer to allow the scatterers to be located only
inside the second organic thin film encapsulation layer.
Accordingly, in such embodiments of the organic light emitting
diode display device, the scatterers may be effectively prevented
from leaking from the module region to the display region.
[0028] In exemplary embodiments of the invention, the organic light
emitting diode display device includes the first partition
structure, the second partition structure, the first organic thin
film encapsulation layer, the second organic thin film
encapsulation layer, and the third organic thin film encapsulation
layer, so that the first organic thin film encapsulation layer may
be separated from the second organic thin film encapsulation layer
and the third organic thin film encapsulation layer to allow the
scatterers to be located only inside each of the second organic
thin film encapsulation layer and the third organic thin film
encapsulation layer. Accordingly, in such embodiment of the organic
light emitting diode display device, the scatterers may be
effectively prevented from leaking from the first module region and
the second module region to the display region.
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The above and other features of the invention will become
more apparent by describing in further detail exemplary embodiments
thereof with reference to the accompanying drawings, in which:
[0030] FIG. 1 is a perspective view showing an organic light
emitting diode display device according to an exemplary embodiment
of the invention;
[0031] FIG. 2 is a perspective view showing a first functional
module disposed on a rear surface of the organic light emitting
diode display device of FIG. 1;
[0032] FIG. 3 is a plan view showing a display region and a first
module region of the organic light emitting diode display device of
FIG. 1;
[0033] FIG. 4 is a partially enlarged plan view showing `A` region
of the display region shown in FIG. 3;
[0034] FIG. 5 is a partially enlarged plan view showing `B` region
of the first module region shown in FIG. 3;
[0035] FIG. 6 is a partially enlarged plan view showing an
exemplary embodiment of the first module region shown in FIG.
3;
[0036] FIG. 7 is a cross-sectional view taken along line I-I' of
FIG. 4;
[0037] FIG. 8 is a cross-sectional view taken along line II-IF of
FIG. 5;
[0038] FIG. 9 is a plan view showing an organic light emitting
diode display device according to an alternative exemplary
embodiment of the invention;
[0039] FIG. 10 is a partially enlarged plan view showing `C` region
of FIG. 9;
[0040] FIG. 11 is a plan view showing an exemplary embodiment of a
partition structure included in the organic light emitting diode
display device of FIG. 9;
[0041] FIG. 12 is a cross-sectional view taken along line of FIG.
10;
[0042] FIG. 13 is a perspective view showing an organic light
emitting diode display device according to another alternative
exemplary embodiment of the invention;
[0043] FIG. 14 is a perspective view showing a first functional
module and a second functional module disposed on a rear surface of
the organic light emitting diode display device of FIG. 13;
[0044] FIG. 15 is a plan view for describing a display region, a
first module region, and a second module region of the organic
light emitting diode display device of FIG. 13;
[0045] FIG. 16 is a partially enlarged plan view showing `D` region
of FIG. 15;
[0046] FIG. 17 is a partially enlarged plan view showing `E` region
of a second module region shown in FIG. 16;
[0047] FIG. 18 is a cross-sectional view taken along line IV-IV' of
FIG. 17;
[0048] FIG. 19 is a plan view showing an organic light emitting
diode display device according to another alternative exemplary
embodiment of the invention;
[0049] FIG. 20 is a partially enlarged plan view showing `F` region
of FIGS. 19; and
[0050] FIG. 21 is a cross-sectional view taken along line V-V' of
FIG. 19.
DETAILED DESCRIPTION
[0051] The invention now will be described more fully hereinafter
with reference to the accompanying drawings, in which various
embodiments are shown. This invention may, however, be embodied in
many different forms, and should not be construed as limited to the
embodiments set forth herein. Rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope of the invention to those skilled in
the art. Like reference numerals refer to like elements
throughout.
[0052] It will be understood that when an element is referred to as
being "on" another element, it can be directly on the other element
or intervening elements may be therebetween. In contrast, when an
element is referred to as being "directly on" another element,
there are no intervening elements present.
[0053] It will be understood that, although the terms "first,"
"second," "third" etc. may be used herein to describe various
elements, components, regions, layers and/or sections, these
elements, components, regions, layers and/or sections should not be
limited by these terms. These terms are only used to distinguish
one element, component, region, layer or section from another
element, component, region, layer or section. Thus, "a first
element," "component," "region," "layer" or "section" discussed
below could be termed a second element, component, region, layer or
section without departing from the teachings herein.
[0054] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting. As
used herein, the singular forms "a," "an," and "the" are intended
to include the plural forms, including "at least one," unless the
content clearly indicates otherwise. "Or" means "and/or." As used
herein, the term "and/or" includes any and all combinations of one
or more of the associated listed items. It will be further
understood that the terms "comprises" and/or "comprising," or
"includes" and/or "including" when used in this specification,
specify the presence of stated features, regions, integers, steps,
operations, elements, and/or components, but do not preclude the
presence or addition of one or more other features, regions,
integers, steps, operations, elements, components, and/or groups
thereof.
[0055] Furthermore, relative terms, such as "lower" or "bottom" and
"upper" or "top," may be used herein to describe one element's
relationship to another elements as illustrated in the Figures. It
will be understood that relative terms are intended to encompass
different orientations of the device in addition to the orientation
depicted in the Figures. For example, if the device in one of the
figures is turned over, elements described as being on the "lower"
side of other elements would then be oriented on "upper" sides of
the other elements. The exemplary term "lower," can therefore,
encompasses both an orientation of "lower" and "upper," depending
on the particular orientation of the figure. Similarly, if the
device in one of the figures is turned over, elements described as
"below" or "beneath" other elements would then be oriented "above"
the other elements. The exemplary terms "below" or "beneath" can,
therefore, encompass both an orientation of above and below.
[0056] "About" or "approximately" as used herein is inclusive of
the stated value and means within an acceptable range of deviation
for the particular value as determined by one of ordinary skill in
the art, considering the measurement in question and the error
associated with measurement of the particular quantity (i.e., the
limitations of the measurement system). For example, "about" can
mean within one or more standard deviations, or within .+-.30%,
20%, 10%, 5% of the stated value.
[0057] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
disclosure belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and the disclosure, and
will not be interpreted in an idealized or overly formal sense
unless expressly so defined herein.
[0058] Exemplary embodiments are described herein with reference to
cross section illustrations that are schematic illustrations of
idealized embodiments. As such, variations from the shapes of the
illustrations as a result, for example, of manufacturing techniques
and/or tolerances, are to be expected. Thus, embodiments described
herein should not be construed as limited to the particular shapes
of regions as illustrated herein but are to include deviations in
shapes that result, for example, from manufacturing. For example, a
region illustrated or described as flat may, typically, have rough
and/or nonlinear features. Moreover, sharp angles that are
illustrated may be rounded. Thus, the regions illustrated in the
figures are schematic in nature and their shapes are not intended
to illustrate the precise shape of a region and are not intended to
limit the scope of the claims.
[0059] Hereinafter, exemplary embodiments of an organic light
emitting diode display device according to the invention will be
described in detail with reference to the accompanying drawings. In
the accompanying drawings, same or similar reference numerals refer
to the same or similar elements.
[0060] FIG. 1 is a perspective view showing an organic light
emitting diode display device according to an exemplary embodiment
of the invention, FIG. 2 is a perspective view showing a first
functional module disposed on a rear surface of the organic light
emitting diode display device of FIG. 1, and FIG. 3 is a plan view
showing a display region and a first module region of the organic
light emitting diode display device of FIG. 1.
[0061] Referring to FIGS. 1, 2, and 3, an exemplary embodiment of
an organic light emitting diode display device 100 may include a
substrate 110 (see FIG. 7), a thin film encapsulation structure 450
(see FIG. 7), a functional module 410, and the like. The organic
light emitting diode display device 100 may have a first surface S1
(e.g., a top surface of the thin film encapsulation structure 450)
for displaying an image and a second surface S2 (e.g., a bottom
surface of the substrate 110) opposite to the first surface S1. The
functional module 410 may be located on one side portion, e.g., an
upper side portion, of the bottom surface of the substrate 110.
[0062] In an exemplary embodiment, as shown in FIG. 3, the organic
light emitting diode display device 100 may include a display
region 10 and a module region 20. In such an embodiment, the
display region 10 may surround at least a portion of the module
region 20, and the functional module 410 may overlap the module
region 20. In an exemplary embodiment, the display region 10 may
completely surround the module region 20, and an area of the
display region 10 may be greater than an area of the module region
20.
[0063] The display region 10 may include a plurality of first pixel
regions (e.g., corresponding to a first pixel region 11 of FIG. 4),
and the module region 20 may include a plurality of second pixel
regions and a plurality of transmissive regions (e.g.,
corresponding to a second pixel region 12 and a transmissive region
21 of FIG. 5). In such an embodiment, the thin film encapsulation
structure 450 of the organic light emitting diode display device
100 includes scatterers 490 to have different refractive indexes in
the display region 10 and the module region 20. In one embodiment,
for example, external light may be incident on the first surface S1
of the organic light emitting diode display device 100, and the
external light may pass through the thin film encapsulation
structure 450. In such an embodiment, a transmittance of the
external light passing through the thin film encapsulation
structure 450 located in the display region 10 may be different
from a transmittance of the external light passing through the thin
film encapsulation structure 450 located in the module region 20.
Accordingly, in such an embodiment, the transmittance of the
external light may be adjusted according to a type of the
functional module 410 located in the module region 20 on the bottom
surface of the substrate 110.
[0064] In an exemplary embodiment, as described above, the
functional module 410 may overlap the module region 20 on the
bottom surface of the substrate 110. In such an embodiment, a size
of the module region 20 may be substantially the same as a size of
the functional module 410. In such an embodiment, a shape of the
module region 20 may be defined to correspond to a shape of the
functional module 410. The functional module 410 may include at
least one selected from: a camera module for capturing (or
recognizing) an image of an object which is located over the first
surface S1 of the organic light emitting diode display device 100;
a face recognition sensor module for detecting a face of a user; a
pupil recognition sensor module for detecting a pupil of the user;
an acceleration sensor module and a geomagnetic sensor module for
determining a movement of the organic light emitting diode display
device 100; a proximity sensor module and an infrared sensor module
for detecting proximity with respect to a front side of the organic
light emitting diode display device 100; and an illuminance sensor
module for measuring a degree of brightness when left in a pocket
or a bag.
[0065] Herein, for convenience of illustration and description,
exemplary embodiments, where each of the module region 20 and the
functional module 410 has a circular shape when viewed in a plan
view, are shown and described, but the shape of each of the module
region 20 and the functional module 410 is not limited thereto.
Alternatively, the module region 20 may have a triangular shape, a
rectangular shape, a rhombic shape, a polygonal shape, a track
shape, or an elliptical shape, for example, when viewed in a plan
view.
[0066] FIG. 4 is a partially enlarged plan view showing `A` region
of the display region shown in FIG. 3, FIG. 5 is a partially
enlarged plan view showing `B` region of the first module region
shown in FIG. 3, and FIG. 6 is a partially enlarged plan view
showing an exemplary embodiment of the first module region shown in
FIG. 3.
[0067] Referring to FIGS. 4 and 5, in an exemplary embodiment, the
display region 10 of the organic light emitting diode display
device 100 may include a plurality of first pixel regions 11. In
one exemplary embodiment, for example, the first pixel regions 11
may be arranged in the display region 10 along a first direction D1
parallel to a top surface of the substrate 110 and a second
direction D2 perpendicular to the first direction D1. In such an
embodiment, the first pixel regions 11 may be arranged over the
display region 10.
[0068] Herein, for convenience of illustration and description,
exemplary embodiments, where each of the display region 10 and the
first pixel region 11 has a rectangular shape when viewed in a plan
view are shown and described, but the shapes thereof are not
limited thereto. Alternatively, each of the display region 10 and
the first pixel region 11 may have a triangular shape, a rhombic
shape, a polygonal shape, a circular shape, a track shape, or an
elliptical shape, for example, when viewed in a plan view.
[0069] Herein, for convenience of illustration and description,
exemplary embodiments, where the first pixel regions 11 are
arranged in an RGB stripe scheme in which rectangles having the
same size are sequentially arranged, are shown and described, but
the configuration thereof is not limited thereto. Alternatively,
the first pixel regions 11 may be arranged by using an S-stripe
scheme including a blue organic light emitting diode having a
relatively large area, a WRGB scheme further including a white
organic light emitting diode, a PenTile scheme in which RG-GB
patterns are repeatedly arranged, or the like, for example.
[0070] In an exemplary embodiment, the module region 20 of the
organic light emitting diode display device 100 may include a
plurality of second pixel regions 12 and a plurality of
transmissive regions 21. In one exemplary embodiment, for example,
the second pixel regions 12 may be arranged in the first direction
D1 in the module region 20, and the transmissive regions 21 may be
arranged in the first direction D1 in a row different from a row in
which the second pixel regions 12 are arranged. In such an
embodiment, the second pixel regions 12 and the transmissive
regions 21 may be arranged over the module region 20. In an
exemplary embodiment, compared to the first pixel regions 11
disposed in the display region 10 of FIG. 4, the module region 20
may include a relatively small number of pixel regions per unit
area due to the transmissive regions 21. In such an embodiment, a
resolution of the module region 20 may be lower than a resolution
of the display region 10. In such an embodiment, the transmissive
region 21 may be substantially transparent or have a lower light
transmittance than that of the display region 10.
[0071] In an alternative exemplary embodiment, as shown in FIG. 6,
the module region 20 may include a transmissive region 31 having a
relatively large area. In such an embodiment, the module region 20
may include a relatively smaller number of pixel regions per unit
area due to the transmissive region 31 having a relatively large
area. In such an embodiment, even when the resolution of the module
region 20 is relatively low, due to the transmissive region 31
having a relatively large area, the functional module 410 may
relatively easily recognize an image of an object which is located
over the first surface S1 of the organic light emitting diode
display device 100.
[0072] Herein, for convenience of illustration and description,
exemplary embodiments, where each of the second pixel region 12 and
the transmissive region 21 has a rectangular shape when viewed in a
plan view are shown and described, but the shapes are not limited
thereto. Alternatively, each of the second pixel region 12 and the
transmissive region 21 may have a triangular shape, a rhombic
shape, a polygonal shape, a circular shape, a track shape, or an
elliptical shape, for example, when viewed in a plan view.
[0073] Herein, for convenience of illustration and description,
exemplary embodiments, where the second pixel regions 12 are
arranged in the RGB stripe scheme, but the configuration thereof is
not limited thereto. Alternatively, the second pixel regions 12 may
be arranged by using the S-stripe scheme, the WRGB scheme, the
PenTile scheme, or the like, for example.
[0074] FIG. 7 is a cross-sectional view taken along line I-I' of
FIG. 4, and FIG. 8 is a cross-sectional view taken along line II-IF
of FIG. 5.
[0075] Referring to FIGS. 7 and 8, an exemplary embodiment of the
organic light emitting diode display device 100 may include a
substrate 110, a buffer layer 115, a first semiconductor element
250, a second semiconductor element 550, a gate insulating layer
150, an insulating interlayer 190, a planarization layer 270, a
pixel defining layer 310, a first pixel structure 200, a second
pixel structure 600, a capping layer 345, a thin film encapsulation
structure 450, a functional module 410, and the like. The organic
light emitting diode display device 100 includes a display region
10 including a first pixel region 11, and a module region 20
including a second pixel region 12 and a transmissive region 21, so
that the substrate 110 may be divided into the display region 10
including the first pixel region 11, and the module region 20
including the second pixel region 12 and the transmissive region
21. The first pixel structure 200 is disposed in the display region
10, and the second pixel structure 600 is disposed in the module
region 20, so that an image may be displayed in the display region
10 and the module region 20. In such an embodiment, the module
region 20 includes the transmissive region 21, so that external
light may be incident on the functional module 410 through the
transmissive region 21.
[0076] In an exemplary embodiment, as shown in FIGS. 7 and 8, the
first semiconductor element 250 may include a first active layer
130, a first gate electrode 170, a first source electrode 210, and
a first drain electrode 230, and the second semiconductor element
550 may include a second active layer 430, a second gate electrode
470, a second source electrode 510, and a second drain electrode
530. In such an embodiment, the first pixel structure 200 may
include a first lower electrode 290, a first light emitting layer
330, and an upper electrode 340, and the second pixel structure 600
may include a second lower electrode 590, a second light emitting
layer 630, and an upper electrode 340. In such an embodiment, the
thin film encapsulation structure 450 may include a first inorganic
thin film encapsulation layer 451, an organic thin film
encapsulation layer 452, and a second inorganic thin film
encapsulation layer 453. In an exemplary embodiment, the thin film
encapsulation structure 450 located in the module region 20 may
include a plurality of scatterers 490, and the scatterers 490 may
include high refractive scatterers 491 and low refractive
scatterers 492.
[0077] The substrate 110 may include a transparent or opaque
material. The substrate 110 may be a transparent resin substrate.
In one exemplary embodiment, for example, the transparent resin
substrate may include a polyimide substrate. In one exemplary
embodiment, for example, the substrate 110 may have a configuration
in which a first organic layer, a first barrier layer, a second
organic layer, and a second barrier layer are sequentially stacked.
The first barrier layer and the second barrier layer may include an
inorganic material such as silicon oxide. In such an embodiment,
the first organic layer and the second organic layer may include an
organic material such as a polyimide-based resin. In one exemplary
embodiment, for example, each of the first and second barrier
layers may block moisture penetrating through the first and second
organic layers.
[0078] In an exemplary embodiment of a method of manufacturing the
organic light emitting diode display device 100, the substrate 110
is thin and flexible, so that the substrate 110 may be formed on a
rigid glass substrate to support the formation of an upper
structure (e.g., the first and second semiconductor elements 250
and 550, the first and second pixel structures 200 and 600, and the
thin film encapsulation structure 450). In one exemplary
embodiment, for example, after the buffer layer 115 is disposed on
the second barrier layer, the upper structure may be formed on the
buffer layer 115. After the upper structure is formed, the glass
substrate may be removed. In such an embodiment, due to flexible
physical properties of the substrate 110, it may be difficult to
directly form the upper structure on the substrate 110. Considering
the flexible physical properties of the substrate 110, the upper
structure is formed by using a rigid glass substrate, and then the
glass substrate is removed, so that the first organic layer, the
first barrier layer, the second organic layer, and the second
barrier layer may be used as the substrate 110. In an exemplary
embodiment, the substrate 110 may include at least one selected
from a quartz substrate, a synthetic quartz substrate, a calcium
fluoride substrate, a fluorine-doped quartz substrate (F-doped
quartz substrate), a soda lime glass substrate, a non-alkali glass
substrate, and the like.
[0079] In an alternative exemplary embodiment, a lower protective
film may be disposed on the bottom surface of the substrate 110.
The lower protective film may protect the substrate 110, and an
opening overlapping the module region 20 may be defined through the
lower protective film. The functional module 410 may be located in
the opening. In one exemplary embodiment, for example, the lower
protective film may include at least one material selected from
polyethylene terephthalate ("PET"), polyethylene naphthalene
("PEN"), polypropylene ("PP"), polycarbonate ("PC"), polystyrene
("PS"), polysulfone ("Psul"), polyethylene ("PE"), polyphthalamide
("PPA"), polyether sulfone ("PES"), polyarylate ("PAR"),
polycarbonate oxide ("PCO"), modified polyphenylene oxide ("MPPO"),
and the like
[0080] The buffer layer 115 may be disposed on the substrate 110.
The buffer layer 115 may be disposed over the substrate 110. The
buffer layer 115 may effectively prevent metal atoms or impurities
from diffusing through the substrate 110 into the upper structure.
In an exemplary embodiment, where a surface of the substrate 110 is
not uniform, the buffer layer 115 may serve to improve flatness of
the surface of the substrate 110. Depending on a type of the
substrate 110, at least two buffer layers may be provided on the
substrate 110, or the buffer layer may be omitted. In one exemplary
embodiment, for example, the buffer layer 115 may include an
organic material or an inorganic material. In an alternative
exemplary embodiment, the buffer layer 115 may not be disposed in
the transmissive region 21 of the module region 20. In such an
embodiment, an opening which exposes the top surface of the
substrate 110 located in the transmissive region 21 may be defined
through the buffer layer 115.
[0081] The first active layer 130 and the second active layer 430
may be disposed on the buffer layer 115. In one exemplary
embodiment, for example, the first active layer 130 may be disposed
in the first pixel region 11 of the display region 10 on the
substrate 110, and the second active layer 430 may be disposed in
the second pixel region 12 of the module region 20 on the substrate
110. Each of the first and second active layers 130 and 430 may
include a metal oxide semiconductor, an inorganic semiconductor
(e.g., amorphous silicon or poly silicon semiconductor), an organic
semiconductor, or the like. Each of the first and second active
layers 130 and 430 may have a source region and a drain region.
[0082] The gate insulating layer 150 may be disposed on the buffer
layer 115 and the first and second active layers 130 and 430. In an
alternative exemplary embodiment, the gate insulating layer 150 may
not be disposed in the transmissive region 21. In such an
embodiment, an opening which exposes the top surface of the
substrate 110 located in the transmissive region 21 may be defined
through the gate insulating layer 150. The opening of the gate
insulating layer 150 may overlap the opening of the buffer layer
115.
[0083] The gate insulating layer 150 may sufficiently cover the
first and second active layers 130 and 430 on the buffer layer 115,
and may have a substantially flat top surface without forming a
step structure around the first and second active layers 130 and
430. Alternatively, the gate insulating layer 150 may be disposed
along a profile of the first and second active layers 130 and 430
with a uniform thickness to cover the first and second active
layers 130 and 430 on the buffer layer 115. In an exemplary
embodiment, the gate insulating layer 150 may have a multilayer
structure including a plurality of insulating layers. In one
exemplary embodiment, for example, the insulating layers may have
different thicknesses from each other or may include different
materials from each other.
[0084] The first gate electrode 170 and the second gate electrode
470 may be disposed on the gate insulating layer 150. In one
exemplary embodiment, for example, the first gate electrode 170 may
be disposed on a portion of the gate insulating layer 150 under
which the first active layer 130 is located, and the second gate
electrode 470 may be disposed on a portion of the gate insulating
layer 150 under which the second active layer 430 is located. Each
of the first and second gate electrodes 170 and 470 may include at
least one material selected from a metal, an alloy, metal nitride,
conductive metal oxide, a transparent conductive material, and the
like. In one exemplary embodiment, for example, each of the first
and second gate electrodes 170 and 470 may include at least one
material selected from gold (Au), silver (Ag), aluminum (Al),
platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd),
magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum
(Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc),
neodymium (Nd), iridium (Ir), an aluminum-containing alloy,
aluminum nitride (AlN.sub.x), a silver-containing alloy, tungsten
nitride (WN.sub.x), a copper-containing alloy, a
molybdenum-containing alloy, titanium nitride (TiN.sub.x), chromium
nitride (CrN.sub.x), tantalum nitride (TaN.sub.x), strontium
ruthenium oxide (SrRu.sub.xO.sub.y), zinc oxide (ZnO.sub.x), indium
tin oxide ("ITO"), tin oxide (SnO.sub.x), indium oxide (InO.sub.x),
gallium oxide (GaO.sub.x), indium zinc oxide ("IZO"), and the like.
These materials may be used alone or in combination with each
other. In an exemplary embodiment, each of the first and second
gate electrodes 170 and 470 may have a multilayer structure
including a plurality of metal layers. In one exemplary embodiment,
for example, the metal layers may have different thicknesses from
each other or may include different materials from each other.
[0085] The insulating interlayer 190 may be disposed on the gate
insulating layer 150 and the first and second gate electrodes 170
and 470. In an alternative exemplary embodiment, the insulating
interlayer 190 may not be disposed in the transmissive region 21.
In such an embodiment, an opening which exposes the top surface of
the substrate 110 located in the transmissive region 21 may be
defined through the insulating interlayer 190. The opening of the
insulating interlayer 190 may overlap the opening of the buffer
layer 115 and the opening of the gate insulating layer 150.
[0086] The insulating interlayer 190 may sufficiently cover the
first and second gate electrodes 170 and 470 on the gate insulating
layer 150, and may have a substantially flat top surface without
forming a step structure around the first and second gate
electrodes 170 and 470. Alternatively, the insulating interlayer
190 may be disposed along a profile of the first and second gate
electrodes 170 and 470 with a uniform thickness to cover the first
and second gate electrodes 170 and 470 on the gate insulating layer
150. The insulating interlayer 190 may include at least one
material selected from a silicon compound, metal oxide, and the
like. In an exemplary embodiment, the insulating interlayer 190 may
have a multilayer structure including a plurality of insulating
layers. In one exemplary embodiment, for example, the insulating
layers may have different thicknesses from each other or may
include different materials from each other.
[0087] The first source electrode 210, the first drain electrode
230, the second source electrode 510, and the second drain
electrode 530 may be disposed on the insulating interlayer 190. In
an exemplary embodiment, the first source electrode 210 may be
connected to the source region of the first active layer 130
through a contact hole formed by removing first portions of the
gate insulating layer 150 and the insulating interlayer 190, and
the first drain electrode 230 may be connected to the drain region
of the first active layer 130 through a contact hole formed by
removing second portions of the gate insulating layer 150 and the
insulating interlayer 190. In such an embodiment, the second source
electrode 510 may be connected to the source region of the second
active layer 430 through a contact hole formed by removing third
portions of the gate insulating layer 150 and the insulating
interlayer 190, and the second drain electrode 530 may be connected
to the drain region of the second active layer 430 through a
contact hole formed by removing fourth portions of the gate
insulating layer 150 and the insulating interlayer 190.
[0088] Each of the first and second source electrodes 210 and 510
and the first and second drain electrodes 230 and 530 may include
at least one material selected from a metal, an alloy, metal
nitride, conductive metal oxide, a transparent conductive material,
and the like. These may be used alone or in combination with each
other. In an exemplary embodiment, each of the first and second
source electrodes 210 and 510 and the first and second drain
electrodes 230 and 530 may have a multilayer structure including a
plurality of metal layers. In one exemplary embodiment, for
example, the metal layers may have different thicknesses from each
other or may include different materials from each other.
[0089] Accordingly, the first semiconductor element 250 including
the first active layer 130, the first gate electrode 170, the first
source electrode 210, and the first drain electrode 230 may be
provided, and the second semiconductor element 550 including the
second active layer 430, the second gate electrode 470, the second
source electrode 510, and the second drain electrode 530 may be
provided.
[0090] Herein, for convenience of illustration and description,
exemplary embodiments, where each of the first and second
semiconductor elements 250 and 550 has a top gate structure are
shown and described, but the configuration thereof is not limited
thereto. In one alternative exemplary embodiment, for example, each
of the first and second semiconductor elements 250 and 550 may have
a bottom gate structure and/or a double gate structure.
[0091] Although only the first semiconductor element 250 is shown
in FIG. 7, other elements, e.g., at least one semiconductor element
and at least one storage capacitor, may be disposed on the
substrate 110 when viewed in other cross-sectional views of the
first pixel region 11 of FIG. 4. Similarly, although only the
second semiconductor element 550 has been shown in FIG. 8, other
elements, e.g., at least one semiconductor element and at least one
storage capacitor, may be disposed on the substrate 110 when viewed
in other cross-sectional views of the second pixel region 12 of
FIG. 5.
[0092] The planarization layer 270 may be disposed on the
insulating interlayer 190 and the first and second semiconductor
elements 250 and 550, and first and second contact holes which
expose a portion of the first drain electrode 230 and a portion of
the second drain electrode 530, respectively, may be defined
through the planarization layer 270. In an alternative exemplary
embodiment, an opening which exposes the top surface of the
substrate 110 located in the transmissive region 21 may be defined
through the planarization layer 270, and the opening of the
planarization layer 270 may overlap the opening of the buffer layer
115, the opening of the gate insulating layer 150, and the opening
of the insulating interlayer 190.
[0093] In an exemplary embodiment, the planarization layer 270 may
have a relatively thick thickness to sufficiently cover the first
and second semiconductor elements 250 and 550. In such an
embodiment, the planarization layer 270 may have a substantially
flat top surface. In an exemplary embodiment, a planarization
process may be additionally performed on the planarization layer
270 to provide such a flat top surface of the planarization layer
270. The planarization layer 270 may include an organic material,
an inorganic material, or the like. In the exemplary embodiment
shown in FIGS. 7 and 8, the planarization layer 270 may include the
organic material.
[0094] The first lower electrode 290 and the second lower electrode
590 may be disposed on the planarization layer 270. In one
exemplary embodiment, for example, the first lower electrode 290
may be disposed in the first pixel region 11 on the planarization
layer 270, may be in direct contact with the first drain electrode
230 through the first contact hole of the planarization layer 270,
and may be electrically connected to the first semiconductor
element 250. In such an embodiment, the second lower electrode 590
may be disposed in the second pixel region 12 on the planarization
layer 270, may be in direct contact with the second drain electrode
530 through the second contact hole of the planarization layer 270,
and may be electrically connected to the second semiconductor
element 550.
[0095] Each of the first and second lower electrodes 290 and 590
may include at least one material selected from a metal, an alloy,
metal nitride, conductive metal oxide, a transparent conductive
material, and the like. These materials may be used alone or in
combination with each other. In an exemplary embodiment, each of
the first and second lower electrodes 290 and 590 may have a
multilayer structure including a plurality of metal layers. In one
exemplary embodiment, for example, the metal layers may have
different thicknesses from each other or may include different
materials from each other.
[0096] The pixel defining layer 310 may be disposed on a portion of
each of the first and second lower electrodes 290 and 590 and the
planarization layer 270. The pixel defining layer 310 may cover
both sides of each of the first and second lower electrodes 290 and
590, and an opening which exposes a portion of a top surface of
each of first, second, and third lower electrodes 290, 590, and 890
may be defined through the pixel defining layer 310.
[0097] In an alternative embodiment, an opening which exposes the
top surface of the substrate 110 located in the transmissive region
21 may be defined through the pixel defining layer 310, and the
opening of the pixel defining layer 310 may overlap the opening of
the planarization layer 270, the opening of the insulating
interlayer 190, the opening of the gate insulating layer 150, and
the opening of the buffer layer 115. In one exemplary embodiment,
for example, the openings may be defined as transmissive windows.
In such an embodiment, a light transmittance may be relatively
increased in the transmissive region 21. The pixel defining layer
310 may include or be formed of an organic material or an inorganic
material. In the exemplary embodiment shown in FIGS. 7 and 8, the
pixel defining layer 310 may include the organic material.
[0098] The first light emitting layer 330 may be disposed on the
first lower electrode 290 exposed by the pixel defining layer 310,
and the second light emitting layer 630 may be disposed on the
second lower electrode 590 exposed by the pixel defining layer 310.
Each of the first and second light emitting layers 330 and 630 may
be formed by using at least one of light emitting materials for
emitting different color lights (i.e., red light, green light, blue
light, and the like.) according to pixels. Alternatively, each of
the first and second light emitting layers 330 and 630 may be
formed by stacking a plurality of light emitting materials for
generating different color lights such as red light, green light,
and blue light to emit white light as a whole. In such an
embodiment, a color filter may be disposed on each of the first and
second light emitting layers 330 and 630 (e.g., to overlap each of
the first and second light emitting layers 330 and 630 on the top
surface of the thin film encapsulation structure 450). The color
filter may include at least one selected from a red color filter, a
green color filter, and a blue color filter. In an alternative
exemplary embodiment, the color filter may include a yellow color
filter, a cyan color filter, and a magenta color filter. The color
filter may include a photosensitive resin or a color
photoresist.
[0099] The upper electrode 340 may be disposed on the pixel
defining layer 310 and the first and second light emitting layers
330 and 630. In an exemplary embodiment, the upper electrode 340
may be disposed over the substrate 110, and the first pixel
structure 200 and the second pixel structure 600 may commonly
include (or share) the upper electrode 340. In an alternative
exemplary embodiment, the upper electrode 340 may not be disposed
in the transmissive region 21. In such an embodiment, the light
transmittance may be relatively increased in the transmissive
region 21.
[0100] The upper electrode 340 may include at least one material
selected from a metal, an alloy, metal nitride, conductive metal
oxide, a transparent conductive material, and the like. These
materials may be used alone or in combination with each other. In
an exemplary embodiment, the upper electrode 340 may have a
multilayer structure including a plurality of metal layers. In one
exemplary embodiment, for example, the metal layers may have
different thicknesses from each other or may include different
materials from each other.
[0101] Accordingly, the first pixel structure 200 including the
first lower electrode 290, the first light emitting layer 330, and
the upper electrode 340 and the second pixel structure 600
including the second lower electrode 590, the second light emitting
layer 630, and the upper electrode 340 may be provided.
[0102] The capping layer 345 may be disposed on the upper electrode
340. In an exemplary embodiment, the capping layer 345 may be
disposed over the substrate 110. In an alternative exemplary
embodiment, the capping layer 345 may not be disposed in the
transmissive region 21. The capping layer 345 may protect the first
and second pixel structures 200 and 600, and may be disposed to
adjust refractive indexes and reflectances. The capping layer 345
may include an organic material or an inorganic material. In an
exemplary embodiment, the capping layer 345 may include an organic
material such as a triamine derivative, an arylenediamine
derivative, 4,4'-N,N'-dicarbazole-biphenyl
(4,4'-bis(N-carbazolyl)-1,1'-biphenyl; "CBP"), and
tris-8-hydroxyquinoline aluminum ("Alq3").
[0103] In an alternative exemplary embodiment, an additional
capping layer may be disposed on the capping layer 345. The
additional capping layer may include a material different from the
material of the capping layer 345. In one exemplary embodiment, for
example, the additional capping layer may include at least one
material selected from lithium fluoride (LiF), magnesium fluoride
(MgF), aluminum fluoride (AlF), sodium fluoride (NaF), aluminum
oxide (AlO), and the like.
[0104] The first inorganic thin film encapsulation layer 451 may be
disposed on the capping layer 345. The first inorganic thin film
encapsulation layer 451 may be disposed along a profile of the
capping layer 345 with a uniform thickness to cover the capping
layer 345. In one exemplary embodiment, for example, the first
inorganic thin film encapsulation layer 451 may be disposed at an
outermost portion of the organic light emitting diode display
device 100, and the buffer layer 115 and the first inorganic thin
film encapsulation layer 451 may be in direct contact with each
other at the outermost portion. In such an embodiment, the first
inorganic thin film encapsulation layer 451 and the buffer layer
115 may prevent the first and second pixel structures 200 and 600
from being deteriorated due to penetration of moisture, oxygen, and
the like. In such an embodiment, the first inorganic thin film
encapsulation layer 451 may function to protect the first and
second pixel structures 200 and 600 from an external impact. The
first inorganic thin film encapsulation layer 451 may include an
inorganic material having flexibility. In one exemplary embodiment,
for example, the first inorganic thin film encapsulation layer 451
may include at least one material selected from a silicon compound,
metal oxide, and the like. In one exemplary embodiment, for
example, the first inorganic thin film encapsulation layer 451 may
include at least one material selected from silicon oxide
(SiO.sub.x), silicon nitride (SiN.sub.x), silicon oxynitride
(SiO.sub.xN.sub.y), silicon oxycarbide (SiO.sub.xC.sub.y), silicon
carbonitride (SiC.sub.xN.sub.y), aluminum oxide (AlO.sub.x),
aluminum nitride (AlN.sub.x), tantalum oxide (TaO.sub.x), hafnium
oxide (HfO.sub.x), zirconium oxide (ZrO.sub.x), titanium oxide
(TiO.sub.x), and the like. In an exemplary embodiment, the first
inorganic thin film encapsulation layer 451 may be formed by using
SiON.
[0105] The organic thin film encapsulation layer 452 may be
disposed on the first inorganic thin film encapsulation layer 451.
The organic thin film encapsulation layer 452 may be disposed on
the first inorganic thin film encapsulation layer 451 with a
relatively thick thickness, and may have a substantially flat top
surface.
[0106] In an exemplary embodiment, as shown in FIG. 8, the
scatterers 490 may be located inside the organic thin film
encapsulation layer 452 located in the module region 20. In such an
embodiment, as shown in FIG. 7, the scatterers 490 are not located
inside the organic thin film encapsulation layer 452 located in the
display region 10. In such an embodiment, a refractive index of the
organic thin film encapsulation layer 452 located in the display
region 10 may be different from a refractive index of the organic
thin film encapsulation layer 452 located in the module region
20.
[0107] In one exemplary embodiment, for example, a portion of the
external light incident on the top surface of the thin film
encapsulation structure 450 may be transmitted through the
transmissive region 21 of the module region 20. In such an
embodiment, the transmitted external light may be incident on the
functional module 410. In such an embodiment, the refractive index
of the organic thin film encapsulation layer 452 may be
approximately 1.5. When the refractive index of the organic thin
film encapsulation layer 452 is approximately 1.5, a transmittance
of visible light may be a relatively high value, whereas a
transmittance of infrared light may be a relatively low value. In
one exemplary embodiment, for example, where the functional module
410 is a module using the visible light (e.g., the camera module),
the organic thin film encapsulation layer 452 may be formed by
adjusting a ratio (or density, a size, etc.) of the high refractive
scatterer 491 and the low refractive scatterer 492 in a way such
that the transmittance of the visible light is a maximum value
(e.g., a refractive index between approximately 1.5 and 1.6).
Alternatively, where the functional module 410 is a module using
the infrared light (e.g., the face recognition sensor module, the
pupil recognition sensor module, the proximity sensor module, the
infrared sensor module, etc.), the organic thin film encapsulation
layer 452 may be formed by adjusting the ratio of the high
refractive scatterer 491 and the low refractive scatterer 492 in a
way such that the transmittance of the infrared light is a maximum
value (e.g., a refractive index between approximately 1 and
1.3).
[0108] An organic thin film encapsulation layer included in a
conventional organic light emitting diode display device does not
include the scatterers 490. In such a conventional organic light
emitting diode display device, the organic thin film encapsulation
layer may have a refractive index of approximately 1.5. When the
conventional organic light emitting diode display device includes a
camera module and an infrared module, the camera module may
normally operate because the transmittance of the visible light
according to a refractive index of the organic thin film
encapsulation layer is relatively high, whereas the infrared sensor
may abnormally operate because the transmittance of the infrared
light according to the refractive index of the organic thin film
encapsulation layer is relatively low.
[0109] The organic thin film encapsulation layer 452 may improve
flatness of the organic light emitting diode display device 100,
and may protect the first and second pixel structures 200 and 600.
The organic thin film encapsulation layer 452 may include an
organic material having flexibility. In one exemplary embodiment,
for example, the organic thin film encapsulation layer 452 may
include at least one material selected from a photoresist, a
polyacryl-based resin, a polyimide-based resin, a polyamide-based
resin, a siloxane-based resin, an acryl-based resin, an epoxy-based
resin, and the like. In one exemplary embodiment, for example, the
scatterers 490 may include at least one material selected from
silica powder, crystalline silicon, polycrystalline silicon,
amorphous silicon, SiN, GaP, GaAs, TiO, AlSb, AlAs, AlGaAs,
AlGaInP, BP, ZnGeP, SiO, PMMA, a photoresist, and the like.
[0110] The second inorganic thin film encapsulation layer 453 may
be disposed on the organic thin film encapsulation layer 452. The
second inorganic thin film encapsulation layer 453 may be disposed
along a profile of the organic thin film encapsulation layer 452
with a uniform thickness to cover the organic thin film
encapsulation layer 452. In one exemplary embodiment, for example,
the second inorganic thin film encapsulation layer 453 may be
disposed at an outermost portion of the organic light emitting
diode display device 100, and the first inorganic thin film
encapsulation layer 451 and the second inorganic thin film
encapsulation layer 453 may be in direct contact with each other at
the outermost portion. In such an embodiment, the second inorganic
thin film encapsulation layer 453 may prevent the first and second
pixel structures 200 and 600 from being deteriorated due to the
penetration of moisture, oxygen, and the like together with the
buffer layer 115 and the first inorganic thin film encapsulation
layer 451. In such an embodiment, the second inorganic thin film
encapsulation layer 453 may function to protect the first and
second pixel structures 200 and 600 from an external impact
together with the first inorganic thin film encapsulation layer 451
and the organic thin film encapsulation layer 452. The second
inorganic thin film encapsulation layer 453 may include an
inorganic material having flexibility. In one exemplary embodiment,
for example, the second inorganic thin film encapsulation layer 453
may include at least one selected from SiO.sub.x, SiN.sub.x,
SiO.sub.xN.sub.y, SiO.sub.xC.sub.y, SiC.sub.xN.sub.y, AlO.sub.x,
AlN.sub.x, TaO.sub.x, HfO.sub.x, ZrO.sub.x, TiO.sub.x, and the
like. In an exemplary embodiment, the second inorganic thin film
encapsulation layer 453 may be formed by using SiN. In an exemplary
embodiment, a thickness of the second inorganic thin film
encapsulation layer 453 may be relatively thinner than a thickness
of the first inorganic thin film encapsulation layer 451.
[0111] Accordingly, the thin film encapsulation structure 450
including the first inorganic thin film encapsulation layer 451,
the organic thin film encapsulation layer 452, and the second
inorganic thin film encapsulation layer 453 may be provided.
[0112] The functional module 410 may be disposed in the module
region 20 on the bottom surface of the substrate 110. As described
above, a portion of the external light incident on the top surface
of the thin film encapsulation structure 450 may be incident on the
functional module 410 through the transmissive regions 21 located
in the module region 20, and the functional module 410 may operate
through the incident external light. The functional module 410 may
include at least one selected from a camera module, a face
recognition sensor module, a pupil recognition sensor module, an
acceleration sensor module, a geomagnetic sensor module, a
proximity sensor module, an infrared sensor module, an illuminance
sensor module, and the like.
[0113] In an exemplary embodiment of the invention, the organic
light emitting diode display device 100 includes the thin film
encapsulation structure 450 including the scatterers 490 in the
module region 20, so that the transmittance of the external light
may be adjusted in the module region 20. Accordingly, in such an
embodiment of the organic light emitting diode display device 100,
a refractive index of the thin film encapsulation structure 450
located in the module region 20 may be effectively adjusted
according to the type of the functional module 410.
[0114] FIG. 9 is a plan view showing an organic light emitting
diode display device according to an alternative exemplary
embodiment of the invention, FIG. 10 is a partially enlarged plan
view showing `C` region of FIG. 9, FIG. 11 is a plan view showing
an exemplary embodiment of a partition structure included in the
organic light emitting diode display device of FIG. 9, and FIG. 12
is a cross-sectional view taken along line of FIG. 10.
[0115] An organic light emitting diode display device 500
illustrated in FIGS. 9, 10, and 12 may have a configuration
substantially the same or similar to the configuration of the
organic light emitting diode display device 100 described above
with reference to FIGS. 1 to 8 except for a partition structure
390. The same or like elements shown in FIGS. 9 to 12 have been
labeled with the same reference characters as used above to
describe the exemplary embodiments of the organic light emitting
diode display device 100 shown in FIGS. 1 to 8, and any repetitive
detailed description thereof will hereinafter be omitted or
simplified.
[0116] Referring to FIGS. 9, 10, and 12, an exemplary embodiment of
the organic light emitting diode display device 500 may include a
substrate 110, a buffer layer 115, a first semiconductor element
250, a second semiconductor element 550, a gate insulating layer
150, an insulating interlayer 190, a planarization layer 270, a
pixel defining layer 310, a first pixel structure 200, a second
pixel structure 600, a capping layer 345, a thin film encapsulation
structure 450, a functional module 410, a partition structure, and
the like. In such an embodiment, as shown in FIG. 12, the substrate
110 may be divided into a display region 10 including a first pixel
region 11, and a module region 20 including a second pixel region
12 and a transmissive region 21. The first pixel structure 200 is
disposed in the display region 10, and the second pixel structure
600 is disposed in the module region 20, so that an image may be
displayed in the display region 10 and the module region 20. In
such an embodiment, the module region 20 includes the transmissive
region 21, so that external light may be incident on the functional
module 410 through the transmissive region 21.
[0117] In one exemplary embodiment, for example, the thin film
encapsulation structure 450 may include a first inorganic thin film
encapsulation layer 451, a first organic thin film encapsulation
layer 452, a second inorganic thin film encapsulation layer 453,
and a second organic thin film encapsulation layer 454. In an
exemplary embodiment, the thin film encapsulation structure 450
located in the module region 20 may include a plurality of
scatterers 490, and the scatterers 490 may include high refractive
scatterers 491 and low refractive scatterers 492.
[0118] In an exemplary embodiment, the partition structure 390 may
be disposed at an outer periphery of the module region 20 on the
pixel defining layer 310 to surround the module region 20. In such
an embodiment, the partition structure 390 may surround the second
pixel structures 600 located in the module region 20 and the first
pixel structures 200 located between the partition structure 390
and the module region 20. The first organic thin film encapsulation
layer 452 and the second organic thin film encapsulation layer 454
may be spaced apart from each other on the partition structure 390.
In an alternative exemplary embodiment, the partition structure 390
may be disposed in the module region 20. In such an embodiment, the
partition structure 390 may surround the second pixel structures
600 located in the module region 20. In an exemplary embodiment, a
portion of the partition structure 390 may be disposed in the
module region 20, and the remaining portion of the partition
structure 390 may be disposed at the outer periphery of the module
region 20.
[0119] The partition structure 390 may include an organic material
such as a photoresist, a polyacryl-based resin, a polyimide-based
resin, a polyamide-based resin, a siloxane-based resin, an
acryl-based resin, and an epoxy-based resin. The partition
structure 390 may be formed simultaneously with the pixel defining
layer 310 by using a same material as the pixel defining layer 310.
In one exemplary embodiment, for example, a photoresist may be
disposed over the planarization layer 270, the photoresist may be
etched by using a half-tone mask, and the pixel defining layer 310
and the partition structure 390 may be simultaneously formed with
each other.
[0120] In an exemplary embodiment, as shown in FIG. 10, the
partition structure 390 may have a rectangular shape when viewed in
a plan view. In an alternative exemplary embodiment, as shown in
FIG. 11, the partition structure 390 may have a circular shape when
viewed in a plan view. Alternatively, the partition structure 390
may have a triangular shape, a rhombic shape, a polygonal shape, a
track shape, or an elliptical shape according to arrangement of
pixels when viewed in a plan view.
[0121] In an exemplary embodiment, the first organic thin film
encapsulation layer 452 may be disposed in the display region 10 on
the first inorganic thin film encapsulation layer 451. In such an
embodiment, the first organic thin film encapsulation layer 452 may
be disposed on an outer side of the partition structure 390 on the
first inorganic thin film encapsulation layer 451. The first
organic thin film encapsulation layer 452 may be disposed on the
first inorganic thin film encapsulation layer 451 with a relatively
thick thickness, and may have a substantially flat top surface. In
an exemplary embodiment, the first organic thin film encapsulation
layer 452 may not include the scatterers 490. The first organic
thin film encapsulation layer 452 may include an organic material
having flexibility.
[0122] In an exemplary embodiment, the second organic thin film
encapsulation layer 454 may be disposed in the module region 20 on
the first inorganic thin film encapsulation layer 451 and in the
display region 10 located on an inner side of the partition
structure 390. In such an embodiment, the second organic thin film
encapsulation layer 454 may be disposed on the inner side of the
partition structure 390 on the first inorganic thin film
encapsulation layer 451. The second organic thin film encapsulation
layer 454 may be disposed on the first inorganic thin film
encapsulation layer 451 with a relatively thick thickness, and may
have a substantially flat top surface.
[0123] In an exemplary embodiment, the scatterers 490 may be
located inside the second organic thin film encapsulation layer 454
located in the module region 20. In such an embodiment, a
refractive index of the first organic thin film encapsulation layer
452 located in the display region 10 may be different from a
refractive index of the second organic thin film encapsulation
layer 454 located in the module region 20.
[0124] The second inorganic thin film encapsulation layer 453 may
be disposed on the partition structure 390, the first organic thin
film encapsulation layer 452, and the second organic thin film
encapsulation layer 454. The second inorganic thin film
encapsulation layer 453 may be disposed along a profile of the
partition structure 390, the first organic thin film encapsulation
layer 452, and the second organic thin film encapsulation layer 454
with a uniform thickness to cover the partition structure 390, the
first organic thin film encapsulation layer 452, and the second
organic thin film encapsulation layer 454. The second inorganic
thin film encapsulation layer 453 may include an inorganic material
having the flexibility.
[0125] Accordingly, the thin film encapsulation structure 450
including the first inorganic thin film encapsulation layer 451,
the first organic thin film encapsulation layer 452, the second
inorganic thin film encapsulation layer 453, and the second organic
thin film encapsulation layer 454 may be provided.
[0126] In an exemplary embodiment of the invention, the organic
light emitting diode display device 500 includes the partition
structure 390, the first organic thin film encapsulation layer 452,
and the second organic thin film encapsulation layer 454, so that
the first organic thin film encapsulation layer 452 may be
separated from the second organic thin film encapsulation layer 454
such that the scatterers 490 may be located only inside the second
organic thin film encapsulation layer 454. Accordingly, in such an
embodiment of the organic light emitting diode display device 500,
the scatterers 490 may be effectively prevented from leaking from
the module region 20 to the display region 10.
[0127] FIG. 13 is a perspective view showing an organic light
emitting diode display device according to another alternative
exemplary embodiment of the invention, FIG. 14 is a perspective
view showing a first functional module and a second functional
module disposed on a rear surface of the organic light emitting
diode display device of FIG. 13, and FIG. 15 is a plan view for
describing a display region, a first module region, and a second
module region of the organic light emitting diode display device of
FIG. 13.
[0128] An organic light emitting diode display device 700
illustrated in FIGS. 13, 14, and 15 may have a configuration
substantially identical or similar to the configuration of the
organic light emitting diode display device 500 described with
reference to FIGS. 9, 10, and 12 except for a second module region
30 and a second functional module 420. The same or like elements
shown in FIGS. 13 to 15 have been labeled with the same reference
characters as used above to describe the exemplary embodiments of
the organic light emitting diode display device 100 shown in FIGS.
9, 10 and 12, and any repetitive detailed description thereof will
hereinafter be omitted or simplified.
[0129] Referring to FIGS. 13, 14, and 15, an exemplary embodiment
of the organic light emitting diode display device 700 may include
a substrate 110 (see FIG. 18), a thin film encapsulation structure
450 (see FIG. 18), a first functional module 410, a second
functional module 420, and the like. The first functional module
410 and the second functional module 420 may be located on one side
portion, e.g., an upper side portion, of a bottom surface of the
substrate 110.
[0130] In an exemplary embodiment, the organic light emitting diode
display device 700 may include a display region 10, a first module
region 20, and a second module region 30. In such an embodiment,
the first module region 20 and the second module region 30 may be
spaced apart from each other, and the display region 10 may
surround at least a portion of each of the first module region 20
and the second module region 30. The first functional module 410
may overlap the first module region 20, and the second functional
module 420 may overlap the second module region 30. In an exemplary
embodiment, the display region 10 may completely surround the first
module region 20 and the second module region 30, and an area of
the display region 10 may be greater than an area of the first
module region 20 and an area of the second module region 30.
[0131] The display region 10 may include a plurality of first pixel
regions (e.g., corresponding to the first pixel region 11 of FIG.
4), the first module region 20 may include a plurality of second
pixel regions and a plurality of first transmissive regions (e.g.,
corresponding to the second pixel region 12 and the transmissive
region 21 of FIG. 5), and the second module region 30 may include a
plurality of third pixel regions and a plurality of second
transmissive regions (e.g., corresponding to a third pixel region
13 and a second transmissive region 22 of FIG. 17).
[0132] In an exemplary embodiment, as described above, the first
functional module 410 may overlap the first module region 20 on the
bottom surface of the substrate 110. In such an embodiment, a size
of the first module region 20 may be substantially the same as a
size of the first functional module 410. In such an embodiment, a
shape of the first module region 20 may correspond to a shape of
the first functional module 410. In such an embodiment, the second
functional module 420 may overlap the second module region 30 on
the bottom surface of the substrate 110. In such an embodiment, a
size of the second module region 30 may be substantially the same
as a size of the second functional module 420. In such an
embodiment, a shape of the second module region 30 may correspond
to a shape of the second functional module 420. Each of the first
functional module 410 and the second functional module 420 may
include at least one selected from a camera module, a face
recognition sensor module, a pupil recognition sensor module, an
acceleration sensor module, a geomagnetic sensor module, a
proximity sensor module, an infrared sensor module, an illuminance
sensor module, and the like.
[0133] Here, for convenience of illustration and description,
exemplary embodiments where each of the first module region 20, the
second module region 30, the first functional module 410, and the
second functional module 420 according to the invention has a
circular shape when viewed in a plan view are described, but the
shape of each of the first module region 20, the second module
region 30, the first functional module 410, and the second
functional module 420 is not limited thereto. In one alternative
exemplary embodiment, for example, the module region 20 may have a
triangular shape, a rectangular shape, a rhombic shape, a polygonal
shape, a track shape, or an elliptical shape when viewed in a plan
view.
[0134] FIG. 16 is a partially enlarged plan view showing `D` region
of FIG. 15, and FIG. 17 is a partially enlarged plan view showing
`E` region of a second module region shown in FIG. 16.
[0135] Referring to FIGS. 4, 5, 16, and 17, in an exemplary
embodiment, the display region 10 of the organic light emitting
diode display device 700 may include a plurality of first pixel
regions 11. In such an embodiment, the first pixel regions 11 may
be arranged over the display region 10.
[0136] In an exemplary embodiment, as shown in FIG. 5, the first
module region 20 of the organic light emitting diode display device
700 may include a plurality of second pixel regions 12 and a
plurality of first transmissive regions 21. In such an embodiment,
the second pixel regions 12 and the first transmissive regions 21
may be arranged over the first module region 20.
[0137] In an exemplary embodiment, as shown in FIG. 17, the second
module region 30 of the organic light emitting diode display device
700 may include a plurality of third pixel regions 13 and a
plurality of second transmissive regions 22. In one exemplary
embodiment, for example, the third pixel regions 13 may be arranged
in a first direction D1 in the second module region 30, and the
second transmissive regions 22 may be arranged in the first
direction D1 in a row different from a row in which the third pixel
regions 13 are arranged. In such an embodiment, the third pixel
regions 13 and the second transmissive regions 22 may be arranged
over the second module region 30. In an exemplary embodiment, the
second module region 30 may include a relatively small number of
pixel regions per unit area due to the second transmissive regions
22 compared to the first pixel regions 11 disposed in the display
region 10 as shown in FIG. 4. In such an embodiment, a resolution
of the second module region 30 may be lower than a resolution of
the display region 10. In such an embodiment, the second
transmissive region 22 may be substantially transparent.
[0138] Herein, for convenience of illustration and description,
exemplary embodiments, where each of the third pixel region 13 and
the second transmissive region 22 has a rectangular shape when
viewed in a plan view are shown and described, but the shapes are
not limited thereto. Alternatively, each of the third pixel region
13 and the second transmissive region 22 may have a triangular
shape, a rhombic shape, a polygonal shape, a circular shape, a
track shape, or an elliptical shape, for example, when viewed in a
plan view.
[0139] Herein, for convenience of illustration and description,
exemplary embodiments, where the third pixel regions 13 are in the
RGB stripe scheme are shown and described, but the configuration of
the invention is not limited thereto. Alternatively, the third
pixel regions 13 may be arranged by using the S-stripe scheme, the
WRGB scheme, the PenTile scheme, or the like, for example.
[0140] FIG. 18 is a cross-sectional view taken along line IV-IV' of
FIG. 17.
[0141] Referring to FIGS. 12 and 18, in an exemplary embodiment,
the organic light emitting diode display device 700 may include a
substrate 110, a buffer layer 115, a first semiconductor element
250, a second semiconductor element 550, a third semiconductor
element 850, a gate insulating layer 150, an insulating interlayer
190, a planarization layer 270, a pixel defining layer 310, a
partition structure 390, a first pixel structure 200, a second
pixel structure 600, a third pixel structure 800, a capping layer
345, a thin film encapsulation structure 450, a first functional
module 410, a second functional module 420, and the like. In such
an embodiment, the organic light emitting diode display device 700
includes a display region 10 including a first pixel region 11, a
module region 20 including a second pixel region 12 and a first
transmissive region 21, and a second module region 30 including a
third pixel region 13 and a second transmissive region 22, so that
the substrate 110 may also be divided into the display region 10
including the first pixel region 11, the module region 20 including
the second pixel region 12 and the first transmissive region 21,
and the second module region 30 including the third pixel region 13
and the second transmissive region 22. The first pixel structure
200 is disposed in the display region 10, the second pixel
structure 600 is disposed in the first module region 20, and the
third pixel structure 800 is disposed in the second module region
30, so that an image may be displayed in the display region 10, the
first module region 20, and the second module region 30. In such an
embodiment, the first module region 20 includes the first
transmissive region 21 so that external light may be incident on
the first functional module 410 through the first transmissive
region 21, and the second module region 30 includes the second
transmissive region 22, so that the external light may be incident
on the second functional module 420 through the second transmissive
region 22.
[0142] In an exemplary embodiment, as shown in FIG. 18, the third
semiconductor element 850 may include a third active layer 730, a
third gate electrode 770, a third source electrode 810, and a third
drain electrode 830. In such an embodiment, the third pixel
structure 800 may include a third lower electrode 890, a third
light emitting layer 930, and an upper electrode 340. In such an
embodiment, the thin film encapsulation structure 450 may include a
first inorganic thin film encapsulation layer 451, a first organic
thin film encapsulation layer 452, a second inorganic thin film
encapsulation layer 453, and a second organic thin film
encapsulation layer 454. In an exemplary embodiment, the thin film
encapsulation structure 450 located in the first module region 20
and the second module region 30 may include a plurality of
scatterers 490, and the scatterers 490 may include high refractive
scatterers 491 and low refractive scatterers 492.
[0143] In an exemplary embodiment, the first organic thin film
encapsulation layer 452 may be disposed in the display region 10
and the second module region 30 on the first inorganic thin film
encapsulation layer 451. In such an embodiment, the first organic
thin film encapsulation layer 452 may be disposed on an outer side
of the partition structure 390 on the first inorganic thin film
encapsulation layer 451. The first organic thin film encapsulation
layer 452 may be disposed on the first inorganic thin film
encapsulation layer 451 with a relatively thick thickness, and may
have a substantially flat top surface. In an exemplary embodiment,
as shown in FIG. 7, the first organic thin film encapsulation layer
452 located in the display region 10 may not include the scatterers
490, and as shown in FIG. 18, the scatterers 490 may be located
inside the first organic thin film encapsulation layer 452 located
in the second module region 30. In such an embodiment, a refractive
index of the first organic thin film encapsulation layer 452
located in the display region 10 may be different from a refractive
index of the first organic thin film encapsulation layer 452
located in the second module region 30. In such an embodiment, the
refractive index of the first organic thin film encapsulation layer
452 located in the display region 10 may be different from a
refractive index of the second organic thin film encapsulation
layer 454. The first organic thin film encapsulation layer 452 may
include an organic material having flexibility.
[0144] The second inorganic thin film encapsulation layer 453 may
be disposed on the partition structure 390, the first organic thin
film encapsulation layer 452, and the second organic thin film
encapsulation layer 454. The second inorganic thin film
encapsulation layer 453 may be disposed along a profile of the
partition structure 390, the first organic thin film encapsulation
layer 452, and the second organic thin film encapsulation layer 454
with a uniform thickness to cover the partition structure 390, the
first organic thin film encapsulation layer 452, and the second
organic thin film encapsulation layer 454. In one exemplary
embodiment, for example, the second inorganic thin film
encapsulation layer 453 may be disposed at an outermost portion of
the organic light emitting diode display device 700, and the first
inorganic thin film encapsulation layer 451 and the second
inorganic thin film encapsulation layer 453 may make direct contact
with each other at the outermost portion. In such an embodiment,
the second inorganic thin film encapsulation layer 453 may prevent
the first, second, and third pixel structures 200, 600, and 800
from being deteriorated due to the penetration of moisture, oxygen,
and the like together with the buffer layer 115 and the first
inorganic thin film encapsulation layer 451. In such an embodiment,
the second inorganic thin film encapsulation layer 453 may function
to protect the first, second, and third pixel structures 200, 600,
and 800 from an external impact together with the first inorganic
thin film encapsulation layer 451, the first organic thin film
encapsulation layer 452, and the second organic thin film
encapsulation layer 454. The second inorganic thin film
encapsulation layer 453 may include inorganic materials having the
flexibility.
[0145] Accordingly, the thin film encapsulation structure 450
including the first inorganic thin film encapsulation layer 451,
the first organic thin film encapsulation layer 452, the second
inorganic thin film encapsulation layer 453, and the second organic
thin film encapsulation layer 454 may be provided.
[0146] The first functional module 410 may be disposed in the first
module region 20 on the bottom surface of the substrate 110. In
such an embodiment, as described above, a portion of the external
light incident on the top surface of the thin film encapsulation
structure 450 may be incident on the first functional module 410
through the first transmissive regions 21 located in the first
module region 20, and the first functional module 410 may operate
through the incident external light.
[0147] The second functional module 420 may be disposed in the
second module region 30 on the bottom surface of the substrate 110.
In such an embodiment, as described above, a portion of the
external light incident on the top surface of the thin film
encapsulation structure 450 may be incident on the second
functional module 420 through the second transmissive regions 22
located in the second module region 30, and the second functional
module 420 may operate through the incident external light.
[0148] Each of the first functional module 410 and the second
functional module 420 may include at least one selected from a
camera module, a face recognition sensor module, a pupil
recognition sensor module, an acceleration sensor module, a
geomagnetic sensor module, a proximity sensor module, an infrared
sensor module, an illuminance sensor module, and the like.
[0149] In an exemplary embodiment, where the organic light emitting
diode display device 700 has the same refractive index in the first
module region 20 and the second module region 30, the first
functional module 410 and the second functional module 420 may
include a same type of module as each other. In one exemplary
embodiment, for example, each of the first functional module 410
and the second functional module 420 may include a camera module.
In an alternative exemplary embodiment, where the organic light
emitting diode display device 700 has different refractive indexes
in the first module region 20 and the second module region 30, the
first functional module 410 and the second functional module 420
may include different types of modules. In one exemplary
embodiment, for example, the first functional module 410 may
include a camera module, and the second functional module 420 may
include at least one selected from a face recognition sensor
module, a pupil recognition sensor module, a proximity sensor
module, an infrared sensor module, and an illuminance sensor
module.
[0150] In an alternative exemplary embodiment, the organic light
emitting diode display device 700 may further include a third
module region spaced apart from the first module region 20 and the
second module region 30, and a third functional module disposed in
the third module region.
[0151] FIG. 19 is a plan view showing an organic light emitting
diode display device according to another alternative exemplary
embodiment of the invention, FIG. 20 is a partially enlarged plan
view showing `F` region of FIG. 19, and FIG. 21 is a
cross-sectional view taken along line V-V' of FIG. 19.
[0152] An organic light emitting diode display device 900
illustrated in FIGS. 19, 20, and 21 may have a configuration
substantially identical or similar to the configuration of the
organic light emitting diode display device 400 described with
reference to FIGS. 13 to 18 except for a second partition structure
395. The same or like elements shown in FIGS. 19 to 21 have been
labeled with the same reference characters as used above to
describe the exemplary embodiments of the organic light emitting
diode display device 100 shown in FIGS. 13 to 18, and any
repetitive detailed description thereof will hereinafter be omitted
or simplified.
[0153] Referring to FIGS. 12, 19, 20, and 21, in an exemplary
embodiment, the organic light emitting diode display device 900 may
include a substrate 110, a buffer layer 115, a first semiconductor
element 250, a second semiconductor element 550, a third
semiconductor element 850, a gate insulating layer 150, an
insulating interlayer 190, a planarization layer 270, a pixel
defining layer 310, a first partition structure 390, a second
partition structure 395, a first pixel structure 200, a second
pixel structure 600, a third pixel structure 800, a capping layer
345, a thin film encapsulation structure 450, a first functional
module 410, a second functional module 420, and the like. In such
an embodiment, the organic light emitting diode display device 900
includes a display region 10 including a first pixel region 11, a
module region 20 including a second pixel region 12 and a first
transmissive region 21, and a second module region 30 including a
third pixel region 13 and a second transmissive region 22, so that
the substrate 110 may also be divided into the display region 10
including the first pixel region 11, the module region 20 including
the second pixel region 12 and the first transmissive region 21,
and the second module region 30 including the third pixel region 13
and the second transmissive region 22.
[0154] In an exemplary embodiment, as shown in FIG. 21, the thin
film encapsulation structure 450 may include a first inorganic thin
film encapsulation layer 451, a first organic thin film
encapsulation layer 452, a second inorganic thin film encapsulation
layer 453, a second organic thin film encapsulation layer 454, and
a third organic thin film encapsulation layer 455. In an exemplary
embodiment, the thin film encapsulation structure 450 located in
the first module region 20 and the second module region 30 may
include a plurality of scatterers 490, and the scatterers 490 may
include high refractive scatterers 491 and low refractive
scatterers 492.
[0155] In an exemplary embodiment, the second partition structure
395 may be disposed at an outer periphery of the second module
region 30 on the pixel defining layer 310 to surround the second
module region 30. In such an embodiment, the second partition
structure 395 may surround the third pixel structures 800 located
in the second module region 30 and the first pixel structures 200
located between the second partition structure 395 and the second
module region 30. The first organic thin film encapsulation layer
452 and the third organic thin film encapsulation layer 455 may be
spaced apart from each other on the second partition structure 395.
In an alternative exemplary embodiment, the second partition
structure 395 may be disposed in the second module region 30. In
such an embodiment, the second partition structure 395 may surround
the third pixel structures 800 located in the second module region
30. In such an embodiment, a portion of the second partition
structure 395 may be disposed in the second module region 30, and
the remaining portion of the second partition structure 395 may be
disposed at the outer periphery of the second module region 30.
[0156] The second partition structure 395 may include an organic
material. The second partition structure 395 may be formed
simultaneously with the pixel defining layer 310 and the first
partition structure 390 by using a same material as the pixel
defining layer 310 and the first partition structure 390. In one
exemplary embodiment, for example, a photoresist may be disposed
over the planarization layer 270, the photoresist may be etched by
using a half-tone mask, and the pixel defining layer 310, the first
partition structure 390, and the second partition structure 395 may
be simultaneously formed.
[0157] In an exemplary embodiment, as shown in FIG. 20, the second
partition structure 395 may have a rectangular shape when viewed in
a plan view. In an alternative exemplary embodiments, the second
partition structure 395 may have a circular shape when viewed in a
plan view. Alternatively, the second partition structure 395 may
have a triangular shape, a rhombic shape, a polygonal shape, a
track shape, or an elliptical shape, for example, according to
arrangement of pixels when viewed in a plan view.
[0158] In an exemplary embodiment, the first organic thin film
encapsulation layer 452 may be disposed in the display region 10 on
the first inorganic thin film encapsulation layer 451. In such an
embodiment, the first organic thin film encapsulation layer 452 may
be disposed on an outer side of the first partition structure 390
and an outer side of the second partition structure 395 on the
first inorganic thin film encapsulation layer 451. In an exemplary
embodiment, the first organic thin film encapsulation layer 452 may
not include the scatterers 490.
[0159] In an exemplary embodiment, the second organic thin film
encapsulation layer 454 may be disposed in the first module region
20 on the first inorganic thin film encapsulation layer 451 and in
the display region 10 located on an inner side of the first
partition structure 390. In such an embodiment, the second organic
thin film encapsulation layer 454 may be disposed on the inner side
of the first partition structure 390 on the first inorganic thin
film encapsulation layer 451. In an exemplary embodiment, the
scatterers 490 may be located inside the second organic thin film
encapsulation layer 454 located in the first module region 20.
[0160] In an exemplary embodiment, the third organic thin film
encapsulation layer 455 may be disposed in the second module region
30 on the first inorganic thin film encapsulation layer 451 and in
the display region 10 located on an inner side of the second
partition structure 395. In such an embodiment, the third organic
thin film encapsulation layer 455 may be disposed on the inner side
of the second partition structure 395 on the first inorganic thin
film encapsulation layer 451. In an exemplary embodiment, the
scatterers 490 may be located inside the third organic thin film
encapsulation layer 455 located in the second module region 30.
[0161] The second inorganic thin film encapsulation layer 453 may
be disposed on the first partition structure 390, the second
partition structure 395, the first organic thin film encapsulation
layer 452, the second organic thin film encapsulation layer 454,
and the third organic thin film encapsulation layer 455. The second
inorganic thin film encapsulation layer 453 may be disposed along a
profile of the first partition structure 390, the second partition
structure 395, the first organic thin film encapsulation layer 452,
the second organic thin film encapsulation layer 454, and the third
organic thin film encapsulation layer 455 with a uniform thickness
to cover the first partition structure 390, the second partition
structure 395, the first organic thin film encapsulation layer 452,
the second organic thin film encapsulation layer 454, and the third
organic thin film encapsulation layer 455. The second inorganic
thin film encapsulation layer 453 may include an inorganic material
having the flexibility.
[0162] In an exemplary embodiment, a refractive index of the first
organic thin film encapsulation layer 452 may be different from a
refractive index of the second organic thin film encapsulation
layer 454, and the refractive index of the first organic thin film
encapsulation layer 452 may be different from a refractive index of
the third organic thin film encapsulation layer 455.
[0163] Accordingly, thin film encapsulation structure 450 including
the first inorganic thin film encapsulation layer 451, the first
organic thin film encapsulation layer 452, the second inorganic
thin film encapsulation layer 453, the second organic thin film
encapsulation layer 454, and the third organic thin film
encapsulation layer 455 may be provided.
[0164] In exemplary embodiments of the invention, the organic light
emitting diode display device 900 includes the first partition
structure 390, the second partition structure 395, the first
organic thin film encapsulation layer 452, the second organic thin
film encapsulation layer 454, and the third organic thin film
encapsulation layer 455, so that the first organic thin film
encapsulation layer 452 may be separated from the second organic
thin film encapsulation layer 454 and the third organic thin film
encapsulation layer 455. Accordingly, in such embodiments, the
scatterers 490 may be located only inside each of the second
organic thin film encapsulation layer 454 and the third organic
thin film encapsulation layer 455. In exemplary embodiments of the
organic light emitting diode display device 900, the scatterers 490
may be effectively prevented from leaking from the first module
region 20 and the second module region 30 to the display region
10.
[0165] Exemplary embodiments of the invention may be applied to
various electronic devices including an organic light emitting
diode display device, e.g., vehicle-display device, a ship-display
device, an aircraft-display device, portable communication devices,
display devices for display or for information transfer, a
medical-display device, etc.
[0166] The invention should not be construed as being limited to
the exemplary embodiments set forth herein. Rather, these exemplary
embodiments are provided so that this disclosure will be thorough
and complete and will fully convey the concept of the invention to
those skilled in the art.
[0167] While the invention has been particularly shown and
described with reference to exemplary embodiments thereof, it will
be understood by those of ordinary skill in the art that various
changes in form and details may be made therein without departing
from the spirit or scope of the invention as defined by the
following claims.
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