U.S. patent application number 16/874458 was filed with the patent office on 2021-05-06 for connector and connector assembly.
This patent application is currently assigned to DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD. The applicant listed for this patent is DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD. Invention is credited to Baiyu DUAN, Zhen LUO, Xiaokai WANG, Xiaoping WU.
Application Number | 20210132312 16/874458 |
Document ID | / |
Family ID | 1000004855430 |
Filed Date | 2021-05-06 |
United States Patent
Application |
20210132312 |
Kind Code |
A1 |
DUAN; Baiyu ; et
al. |
May 6, 2021 |
CONNECTOR AND CONNECTOR ASSEMBLY
Abstract
Related to is the technical field of connectors and disclosed
are a connector and a connector assembly. The connector includes a
connector body and a heatsink, where an upper surface of the
connector body is provided with a buckle; the heatsink is disposed
on the upper surface of the connector body, and the heatsink is
provided with multiple heatsink clips spaced apart from each other
and arranged side by side and is clamped to the connector body
through the buckle. The connector assembly includes the connector
described above and a docking connector plug-in fitted with the
connector. A large amount of heat generated by the connector in use
is quickly dissipated into the air through the heatsink so that the
connector can be prevented from being burnt or even burnt out due
to the high temperature.
Inventors: |
DUAN; Baiyu; (Dongguan City,
CN) ; LUO; Zhen; (Dongguan City, CN) ; WANG;
Xiaokai; (Dongguan City, CN) ; WU; Xiaoping;
(Dongguan City, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD |
Dongguan City |
|
CN |
|
|
Assignee: |
DONGGUAN LUXSHARE TECHNOLOGIES CO.,
LTD
Dongguan City
CN
|
Family ID: |
1000004855430 |
Appl. No.: |
16/874458 |
Filed: |
May 14, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/2039 20130101;
G02B 6/428 20130101; G02B 6/4269 20130101; G02B 6/426 20130101 |
International
Class: |
G02B 6/42 20060101
G02B006/42; H05K 7/20 20060101 H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 6, 2019 |
CN |
201911077181.7 |
Claims
1. A connector, comprising: a connector body, wherein an upper
surface of the connector body is provided with a buckle; and a
heatsink disposed on the upper surface of the connector body,
wherein the heatsink is provided with a plurality of heatsink clips
spaced apart from each other and arranged side by side, and clamped
to the connector body through the buckle.
2. The connector of claim 1, wherein the upper surface of the
connector body is provided with a receiving opening and a lower
surface of the heatsink is provided with a heatsink block capable
of extending into the receiving opening.
3. The connector of claim 2, wherein the connector body is provided
with buckles on two sides of the receiving opening.
4. The connector of claim 3, wherein the buckles on the two sides
of the receiving opening are misaligned.
5. The connector of claim 3, wherein each of the two sides of the
receiving opening is provided with at least two buckles.
6. The connector of claim 1, wherein the heatsink is provided with
a buckle position fitted with the buckle.
7. The connector of claim 6, wherein the buckle comprises an
extending portion, an resilient portion and a pressing portion that
are sequentially connected, the extending portion is disposed at an
included angle with respect to the resilient portion, the pressing
portion is disposed at an included angle with respect to the
resilient portion and located between the extending portion and the
resilient portion, the resilient portion and the pressing portion
are capable of extending into the buckle position, and the pressing
portion is capable of pressing against the heatsink.
8. The connector of claim 1, wherein the connector body is provided
with a socket and the heatsink is located above the socket.
9. The connector of claim 8, wherein the connector body is provided
with a plurality of sockets and a respective heatsink is disposed
above each of the plurality of sockets.
10. The connector of claim 2, wherein an optical module is disposed
in the connector body and a lower surface of the heatsink block is
attached to an upper surface of the optical module.
11. The connector of claim 1, further comprising a light guide,
wherein the upper surface of the connector body is provided with a
limit member, one of the limit member and the light guide is
provided with a positioning hole and another of the limit member
and the light guide is provided with a positioning protrusion
plug-in fitted with the positioning hole.
12. The connector of claim 11, wherein the light guide comprises
two light guide stripes, every two adjacent heatsink clips of the
plurality of heatsink clips form a recess, and the two light guide
stripes are located in respective recesses or a same recess.
13. The connector of claim 11, wherein one of the light guide and
the connector body is provided with a limit hole and another of the
light guide and the connector body is provided with a limit
protrusion plug-in fitted with the limit hole.
14. A connector assembly, comprising a connector and a docking
connector plug-in fitted with the connector, wherein the connector
comprises: a connector body, wherein an upper surface of the
connector body is provided with a buckle; and a heatsink disposed
on the upper surface of the connector body, wherein the heatsink is
provided with a plurality of heatsink clips spaced apart from each
other and arranged side by side, and clamped to the connector body
through the buckle.
15. The connector assembly of claim 14, wherein the upper surface
of the connector body is provided with a receiving opening and a
lower surface of the heatsink is provided with a heatsink block
capable of extending into the receiving opening.
16. The connector assembly of claim 15, wherein the connector body
is provided with buckles on two sides of the receiving opening.
17. The connector assembly of claim 16, wherein the buckles on the
two sides of the receiving opening are misaligned.
18. The connector assembly of claim 16, wherein each of the two
sides of the receiving opening is provided with at least two
buckles.
19. The connector assembly of claim 14, wherein the heatsink is
provided with a buckle position fitted with the buckle.
20. The connector assembly of claim 19, wherein the buckle
comprises an extending portion, an resilient portion and a pressing
portion that are sequentially connected, the extending portion is
disposed at an included angle with respect to the resilient
portion, the pressing portion is disposed at an included angle with
respect to the resilient portion and located between the extending
portion and the resilient portion, the resilient portion and the
pressing portion are capable of extending into the buckle position,
and the pressing portion is capable of pressing against the
heatsink.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] This application claims priority to Chinese patent
application No. 201911077181.7 filed on Nov. 6, 2019, disclosure of
which is incorporated herein by reference in its entirety.
TECHNICAL FIELD
[0002] The present disclosure relates to the technical field of
connectors, in particular, a connector and a connector
assembly.
BACKGROUND
[0003] With the development of society and science and technology,
the data transmission speed is developing rapidly. To meet demands
of market for higher-density high-speed pluggable solutions, a quad
small form-factor pluggable (QSFP) interface is generated.
[0004] The QSFP can be used as an optical fiber solution and is
superior to a quad CX4 interface in speed and density. Since the
QSFP can support data transmission of four channels at a speed of
10 Gbps per channel at the same port volume as an XFP, the QSFP can
have a four times density than an XFP product and have a three
times density than an SFP+ product. The QSFP interface which has
four channels and a higher density than the CX4 has been adopted by
InfiniBand standard.
[0005] However, the increase of the data transmission quantity of a
high-speed connector can easily heat the whole system and the
connector up.
[0006] Therefore, there is an urgent need for a connector and a
connector assembly to solve the above technical problems.
SUMMARY
[0007] An object of the present disclosure is to provide a
connector and a connector assembly so that it is feasible for a
large amount of heat generated by the connector in use to be
quickly dissipated into the air through a heatsink to cool the
connector.
[0008] To achieve this object, provided are a connector and a
connector assembly.
[0009] In one aspect, a connector is provided. The connector
includes a connector body and a heatsink.
[0010] The upper surface of the connector body is provided with a
buckle.
[0011] The heatsink is disposed on the upper surface of the
connector body, and the heatsink is provided with multiple heatsink
clips spaced apart from each other and arranged side by side, and
clamped to the connector body through the buckle.
[0012] In one embodiment, the upper surface of the connector body
is provided with a receiving opening and the lower surface of the
heatsink is provided with a heatsink block capable of extending
into the receiving opening.
[0013] In one embodiment, the connector body is provided with
buckles on two sides of the receiving opening.
[0014] In one embodiment, the buckles on the two sides of the
receiving opening are misaligned.
[0015] In one embodiment, each of the two sides of the receiving
opening is provided with at least two buckles.
[0016] In one embodiment, the heatsink is provided with a buckle
position fitted with the buckle.
[0017] In one embodiment, the buckle includes an extending portion,
an resilient portion and a pressing portion that are sequentially
connected, the extending portion is disposed at an included angle
with respect to the resilient portion, the pressing portion is
disposed at an included angle with respect to the resilient portion
and located between the extending portion and the resilient
portion, the resilient portion and the pressing portion are capable
of extending into the buckle position, and the pressing portion is
capable of pressing against the heatsink.
[0018] In one embodiment, the connector body is provided with a
socket and the heatsink is located above the socket.
[0019] In one embodiment, the connector body is provided with
multiple sockets and a respective heatsink is disposed above each
socket.
[0020] In one embodiment, an optical module is disposed in the
connector body and the lower surface of the heatsink block is
attached to the upper surface of the optical module.
[0021] In one embodiment, the connector further includes a light
guide, where the upper surface of the connector body is provided
with a limit member, one of the limit member and the light guide is
provided with a positioning hole and the other one of the limit
member and the light guide is provided with a positioning
protrusion plug-in fitted with the positioning hole.
[0022] In one embodiment, the light guide includes two light guide
stripes, every two adjacent heatsink clips of the plurality of
heatsink clips form a recess, and the two light guide stripes are
located in respective recesses or a same recess.
[0023] In one embodiment, one of the light guide and the connector
body is provided with a limit hole and the other one of the light
guide and the connector body is provided with a limit protrusion
plug-in fitted with the limit hole.
[0024] In another aspect, a connector assembly is provided. The
connector assembly includes the connector described above and a
docking connector plug-in fitted with the connector.
[0025] The beneficial effects of the present disclosure is that a
large amount of heat generated by the connector in use is quickly
dissipated into the air through the heatsink so that the connector
can be prevented from being burnt or even burnt out due to the high
temperature.
[0026] Additionally, the light guide has an indication function so
that whether related devices are conductive to each other can be
quickly and clearly determined through the light guide.
BRIEF DESCRIPTION OF DRAWINGS
[0027] FIG. 1 is a structural schematic diagram illustrating a
connector according to the present disclosure.
[0028] FIG. 2 is a partial enlarged view of part A of FIG. 1.
[0029] FIG. 3 is a structural schematic diagram illustrating one
perspective of a heatsink according to the present disclosure.
[0030] FIG. 4 is a structural schematic diagram illustrating
another perspective of a heatsink according to the present
disclosure.
[0031] FIG. 5 is a partial structural schematic diagram
illustrating a connector according to the present disclosure.
[0032] FIG. 6 is a structural schematic diagram illustrating a
light guide according to the present disclosure.
[0033] In the drawings:
[0034] 1. metallic casing; 11. receiving opening; 12. buckle; 121.
extending portion; 122. resilient portion; 123. pressing portion;
13. limit member; 131. positioning hole; 14. limit hole; 15.
metallic partition; 16. connecting pin;
[0035] 2. heatsink; 21. heat conduction plate; 22. heatsink clip;
23. heatsink block; 24. buckle position;
[0036] 3. light guide; 31. light guide stripe; 32. first connecting
bridge; 321. positioning protrusion; 33. second connecting bridge;
331. limit protrusion; 34. third connecting bridge.
DETAILED DESCRIPTION
[0037] To illustrate the purpose and advantages of the present
disclosure more clearly, the present disclosure will be described
clearly and completely in conjunction with drawings. Apparently,
the embodiments described below are part, not all, of embodiments
of the present disclosure. The assemblies of the embodiments of the
present disclosure described and illustrated in the drawings herein
can generally be arranged and designed in various different
configurations.
[0038] Therefore, the following detailed description of the
embodiments of the present disclosure provided in the drawings is
not intended to limit the scope of the present disclosure, but
merely represents selected embodiments of the present disclosure.
Based on the embodiments of the present disclosure, all other
embodiments acquired by those skilled in the art are within the
scope of the present disclosure on the premise that no creative
work is done.
[0039] It should be noted that similar reference numerals and
letters indicate similar items in the following drawings, and
therefore, once a particular item is defined in a drawing, the item
need not to be further defined and explained in following
drawings.
[0040] In the description of the present disclosure, it should be
noted that the orientational or positional relationships indicated
by terms "above", "below", "left", "right", "vertical",
"horizontal", "inside", "outside" and the like are based on the
orientational or positional relationships illustrated in the
drawings or the orientational or positional relationship that
products of the present disclosure are usually used in, which are
for the mere purpose of facilitating and simplifying the
description of the present disclosure and do not indicate or imply
that the apparatus or element referred to has a specific
orientation and is constructed and operated in a specific
orientation, and thus it is not to be construed as limiting the
present disclosure. Moreover, terms "first", "second" and "third"
are merely for distinguishing the description and are not to be
construed as indicating or implying relative importance. In the
description of the present disclosure, unless otherwise noted, "a
plurality of" means two or more.
[0041] In the description of the present disclosure, it is also to
be noted that, unless otherwise expressly specified and limited,
terms "dispose" and "connection" should be understood in a broad
sense, for example, may be a secured connection, a detachable
connection or an integrated connection, or may be a mechanical
connection or an electrical connection. For those skilled in the
art, the preceding terms can be construed depending on specific
contexts.
[0042] In the present disclosure, unless otherwise expressly
specified and limited, when a first feature is described as "above"
or "below" a second feature, the first feature and the second
feature may be in direct contact, or may be in contact via another
feature between the two features. Moreover, when the first feature
is described as "on", "above" or "over" the second feature, the
first feature is right on, above or over the second feature or the
first feature is obliquely on, above or over the second feature, or
the first feature is simply at a higher level than the second
feature. When the first feature is described as "under", "below" or
"underneath" the second feature, the first feature is right under,
below or underneath the second feature or the first feature is
obliquely under, below or underneath the second feature, or the
first feature is simply at a lower level than the second
feature.
[0043] The embodiments of the present disclosure are described in
detail below, and examples of the embodiments are illustrated in
the drawings, where the same or similar reference numerals indicate
the same or similar elements or elements having the same or similar
functions. The embodiments described below with reference to the
drawings are merely exemplary and intended to explain the present
disclosure, and are not to be construed as limiting the present
disclosure.
[0044] As shown in FIGS. 1 to 6, disclosed is a connector,
including a connector body, a heatsink 2 and a light guide 3. The
connector body includes a metallic casing 1, a PCB (printed circuit
board) and an optical module received in the metallic casing 1. The
metallic casing 1 is provided with a socket, the PCB is disposed
below the metallic casing 1, and the metallic casing 1 is secured
onto the PCB. In one embodiment, a side wall of the metallic casing
1 extends downward with multiple connecting pins 16, each
connecting pin 16 is inserted into a respective connecting hole on
the PCB, and a free end of each connecting pin 16 is bent to secure
the metallic casing 1 onto the PCB. The optical module is also
secured onto the PCB and electrically connected to the PCB.
[0045] As shown in FIGS. 3 and 4, the heatsink 2 is disposed on an
upper surface of the connector body and provided with multiple
heatsink clips 22 spaced apart from each other and arranged side by
side. The multiple heatsink clips 22 are disposed along a length
direction of the heatsink 2 and may quickly dissipate the heat of
the heatsink 2 into the air to complete the heat dissipation and
cooling of the connector body. Each heatsink clip 22 is made of a
metallic material with high heat conduction, such as cooper,
aluminum alloy or the like. The heatsink 2 includes a heat
conduction plate 21 for supporting the multiple heatsink clips 22,
and each heatsink clip 22 is vertically disposed on one side of the
heat conduction plate 21. The heat conduction plate 21 is a heat
pipe or a temperature equalization plate, and the heat pipe and the
temperature equalization plate both have a fast heat conduction
rate and may transfer heat to each part of the heat conduction
plate 21 and then dissipate the heat through the multiple heat
clips 22, thereby effectively avoiding great temperature
differences between different parts of the heat conduction plate 21
that result in uneven heat dissipation.
[0046] As shown in FIGS. 1, 2 and 4, the upper surface of the
connector body is provided with a receiving opening 11 and a lower
surface of the heatsink 2 is provided with a heatsink block 23
capable of extending into the receiving opening 11. That is, the
receiving opening 11 is disposed on an upper wall of the metallic
casing and the heatsink block 23 is disposed on one side of the
heat conduction plate 21 facing away from the multiple heatsink
clips 22. In this embodiment, a lower surface of the heatsink block
23 is attached to an upper surface of the optical module. In one
embodiment, the heatsink block 23 and the optical module are
arranged at an interval, a heatsink plate may be disposed between
the heatsink block 23 and the optical module. The heatsink block 23
is made of high heat-conduction metal or other high heat-conduction
materials and can rapidly transfer heat generated by the optical
module to the heat conduction plate 21, and the heatsink plate is
also made of high heat-conduction metal or other high
heat-conduction materials.
[0047] As shown in FIG. 1, to meet the information transmission
requirements, the connector body is provided with multiple sockets,
a respective heatsink 2 is disposed above each socket, and two
adjacent sockets are separated by a metallic partition 15 disposed
in the metallic casing 1. In one embodiment, the multiple sockets
are disposed at a front end of the metallic casing 1 side by side,
a respective optical module is disposed in each socket, and a
respective receiving opening 11 and a respective heatsink 2 are
disposed on the metallic casing 1 above each optical module.
[0048] As shown in FIGS. 1 to 3, the upper surface of the connector
body is provided with a buckle 12, and the heatsink 2 is clamped to
the connector body through the buckle 12. In one embodiment, the
buckle 12 is disposed on the metallic casing, and the connector
body is provided with buckles 12 on two sides of the receiving
opening 11. In one embodiment, the buckles 12 on the two sides of
the receiving opening 11 are misaligned, that is, asymmetrically
disposed. In other embodiments, the buckles 12 on the two sides of
the receiving opening 11 may be symmetrically disposed. Each of the
two sides of the receiving opening 11 is provided with at least two
buckles 12. In one embodiment, each of the two sides of the
receiving opening 11 is provided with two buckles 12. In other
embodiments, each of the two sides of the receiving opening 11 may
be provided with one, three, four or even more buckles, which is
specifically determined according to a length of the heatsink
2.
[0049] Two sides of the heatsink 2 is each provided with a buckle
position 24 fitted with the buckle 12. The buckle position 24 is a
notch disposed in the heat conduction plate 21 and a heatsink clip
22 at edges of the heat conduction plate 21, so that the buckle 12
is clamped to the heat conduction plate 21. In one embodiment, part
of the buckle 12 is received in the notch and then the buckle 12 is
clamped to the heat conduction plate 21 to clamp the heatsink 2 to
the metallic casing 1. Moreover, part of the buckle 12 is located
in the buckle position 24 and limits the heatsink 2 so that the
heatsink 2 is unmovable along the length direction of the heatsink
2, and each buckle position 24 corresponds to, but is not limited
to corresponding to, at least one buckle 12. In this embodiment,
each buckle position 24 corresponds to a respective buckle 12 so
that the heat conduction plate is more firmly clamped to prevent
from moving along the length direction of the heat conduction
plate. Furthermore, the metallic casing 1 are provided with buckles
12 on the two sides of the heatsink 2, and the buckles 12 on the
two sides cooperate to prevent the heatsink 2 from moving along a
width direction of the heatsink 2. The multiple buckles 12 on the
two sides of the receiving opening 11 cooperate to secure the
heatsink 2 onto the metallic casing 1.
[0050] The buckle 12 includes an extending portion 121, an
resilient portion 122 and a pressing portion 123 that are
sequentially connected, the extending portion 121 is disposed at an
included angle with respect to the resilient portion 122, the
pressing portion 123 is disposed at an included angle with respect
to the resilient portion 122 and located between the extending
portion 121 and the resilient portion 122, the resilient portion
122 and the pressing portion 123 are capable of extending into the
buckle position 24, and the pressing portion 123 is capable of
pressing against the heatsink 2. To install the heatsink 2,
firstly, the heatsink 2 is placed above the receiving opening 11,
and two sides of the buckle position 24 of the heatsink 2 are
pressed against the resilient portion 122 of the buckle 12; then,
the heatsink 2 is pressed downward, and the resilient portion 122
is deformed under the force and moves to one side facing toward the
extending portion 121; after the heatsink 2 moves downward in
place, the resilient portion 122 rebounds to press the pressing
portion 123 against the upper surface of the heat conduction plate
21. The pressing portion 123 presses against the heatsink 2 and
thus can limit the vertical movement of the heatsink 2 so that the
heat sink 23 can be attached to a light film clip.
[0051] A top of the extending portion 121 is located outside the
receiving opening 11, and a bottom of the extending portion 121 has
a preset distance from an edge of the receiving opening 11, where
the preset distance is greater than a length of the pressing
portion 123 so that the extending portion 121 and the pressing
portion 123 do not interfere with the installation of the heatsink
2. In one embodiment, the buckle 12 is formed through a punching
and bending process.
[0052] As shown in FIGS. 1, 2, 5 and 6, the connector body is
provided with a limit member 13. In one embodiment, the limit
member 13 is disposed on the metallic casing 1 and is formed
through a punching and bending process. The light guide 3 is
disposed on the connector body, and the limit member 13 is
configured to support the light guide 3.
[0053] Referring to FIG. 6, the light guide 3 includes two light
guide stripes 31 spaced apart from each other and arranged side by
side, and front ends of the two light guide stripes 31 are
connected through a first connecting bridge 32 that is located
below the two light guide stripes 31. A tail of each light guide
stripe 31 is bent downward and the bent portion is located at a
tail of the metallic casing. Lower parts of rear-half portions of
the two light guide stripes 31 are connected through a second
connecting bridge 33. In one embodiment, tails of unbent portions
of the two light guide stripes 31 are connected through the second
connecting bridge 33. Tails of the two light guide stripes 31 are
connected through a third connecting bridge 34, that is, the bent
portions of the two light guide stripes 31 are connected through
the third connecting bridge 34, and the third connecting bridge 34
is located one side of the two light guide stripes 31 facing away
from the metallic casing 1.
[0054] As shown in FIGS. 2, 5 and 6, two adjacent heatsink clips 22
forms a recess, and the two light guide stripes 31 are respectively
located in corresponding recesses on the heatsink 2 or the two
light guide stripes 31 are located in the same recess (not shown in
FIGS). One of the limit member 13 and the light guide 3 is provided
with a positioning hole 131, and the other one of the limit member
13 and the light guide 3 is provided with a positioning protrusion
321 plug-in fitted with the positioning hole 131. In one
embodiment, the positioning hole 131 or the positioning protrusion
321 is disposed on the first connecting bridge 32. In one
embodiment, the limit member 13 is a limit clip, the positioning
hole 131 is disposed on the limit clip, the positioning protrusion
321 is disposed on the first connecting bridge 32 and protrudes
toward the tails of the two light guide stripes. In other
embodiments, the positioning hole 131 may further be disposed on
the first connecting bridge 32, and the positioning protrusion 321
may further be disposed on the limit member 13.
[0055] One of the second connecting bridge 33 and the connector
body is provided with a limit hole 14, and the other one of the
second connecting bridge 33 and the connector body is provided with
a limit protrusion 331 plug-in fitted with the limit hole 14.
Moreover, a circumference at a top of the limit protrusion 331 is
annularly provided with a stop protrusion, and the stop protrusion
has a limit effect and thus can prevent the limit protrusion 331
from automatically falling off from the limit hole 14.
[0056] In one embodiment, the limit protrusion 331 is disposed on a
lower surface of a second connecting bridge 33, and the limit hole
14 is disposed on the upper wall of the metallic casing 1 of the
connector body. In other embodiments, the limit protrusion 331 may
further be disposed on the connector body, and the limit hole 14
may further be disposed on the second connecting bridge 33. When
the light guide 3 is installed, firstly, the positioning protrusion
321 is inserted into the positioning hole 131, and then the light
guide 3 is pressed down so that the limit protrusion 331 is
inserted into the limit hole 14 and the stop protrusion is located
in the metallic casing 1 to play a limit and stop role. The
positioning protrusion 321 and the positioning hole 131 cooperate
and the limit protrusion 331 and the limit hole 14 cooperate to
secure the light guide 3 onto the metallic casing 1.
[0057] The connector further includes a pad (not shown in FIGS)
that is secured onto the PCB and located outside the tail of the
metallic casing 1. Two receiving holes are disposed on the pad, and
each light guide 3 corresponds to a respective pad. Free ends of
the tails of the two light guide stripes 31 are inserted into the
two receiving holes of the pad. A light-emitting assembly (not
shown in FIGS.) is disposed on the PCB, located in the respective
receiving hole, and optically connected to the free end of the tail
of the respective light guide stripe 31. That is, each light guide
stripe 31 is made of a light-transmitting material, and the light
emitted by the light-emitting assembly may be refracted into the
respective light guide stripe 31 so that the light guide stripe 31
can emit light. The light source of the light-emitting assembly is
disposed in the respective receiving hole so that the spread of the
light emitted by the light-emitting assembly can be reduced and the
light of the light-emitting assembly can be completely transferred
to the light guide 3.
[0058] The light-emitting assembly may indicate whether the PCB is
conductive to the optical module 15. After the PCB is conductive to
the optical module 15, the light-emitting assembly displays the
light source and transfers the light source to the light guide 3,
and the light guide 3 emits light for ease of observation. If the
light guide 3 emits no light, then it means that the PCB is not
conductive to the optical module.
[0059] A respective light-emitting assembly corresponding to each
light guide stripe 31 is disposed on the PCB. In this embodiment,
one of the two light guide stripes 31 is configured to indicate
whether the PCB is conductive to the optical module, and the other
one of the two light guide stripes 31 is configured to indicate
whether the connector is conductive to a docking connector of the
connector. If the docking connector is conductive to the connector,
then another light guide 3 emits light; if the docking connector is
not conductive to the connector, the another light guide 3 emits no
light. The light guide 3 is larger than the light-emitting assembly
in volume and is exposed outside the connector for ease of
observation.
[0060] A large amount of heat generated by the connector in use is
quickly dissipated into the air through the heatsink 2 so that the
connector can be prevented from being burnt or even burnt out due
to the high temperature.
[0061] Additionally, the light guide 3 has an indication function
so that whether related devices are conductive to each other can be
quickly and clearly determined through the light guide 3.
[0062] An embodiment further discloses a connector assembly. The
connector assembly includes the connector described above and a
docking connector plug-in fitted with the connector.
[0063] A large amount of heat generated by the connector in use is
quickly dissipated into the air through the heatsink 2 so that the
connector can be prevented from being burnt or even burnt out due
to the high temperature.
[0064] Additionally, the light guide 3 has an indication function
so that whether related devices are conductive to each other can be
quickly and clearly determined through the light guide 3.
[0065] Apparently, the above embodiments of the present disclosure
are merely illustrative of the present disclosure and are not
intended to limit the embodiments of the present disclosure. For
those of ordinary skill in the art, alterations or modifications in
other different forms can be made based on the above description.
Embodiments of the present disclosure cannot be and do not need to
be exhausted herein. Any modifications, equivalent substitutions
and improvements within the spirit and principle of the present
disclosure fall within the scope of the claims of the present
disclosure.
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