U.S. patent application number 17/106736 was filed with the patent office on 2021-04-15 for elliptical structure for bulk acoustic wave resonator.
The applicant listed for this patent is Akoustis, Inc.. Invention is credited to Rohan W. HOULDEN, Dae Ho KIM, Pinal PATEL, James Blanton SHEALY, Jeffrey B. SHEALY.
Application Number | 20210111695 17/106736 |
Document ID | / |
Family ID | 1000005298624 |
Filed Date | 2021-04-15 |
United States Patent
Application |
20210111695 |
Kind Code |
A1 |
KIM; Dae Ho ; et
al. |
April 15, 2021 |
ELLIPTICAL STRUCTURE FOR BULK ACOUSTIC WAVE RESONATOR
Abstract
An elliptical-shaped resonator device. The device includes a
bottom metal plate, a piezoelectric layer overlying the bottom
metal plate, and a top metal plate overlying the piezoelectric
layer. The top metal plate, the piezoelectric layer, and the bottom
metal plate are characterized by an elliptical shape having a
horizontal diameter (dx) and a vertical diameter (dy), which can be
represented as ellipse ratio R=dx/dy. Using the elliptical
structure, the resulting bulk acoustic wave resonator (BAWR) can
exhibit equivalent or improved insertion loss, higher coupling
coefficient, and higher quality factor compared to conventional
polygon-shaped resonators.
Inventors: |
KIM; Dae Ho; (Cornelius,
NC) ; PATEL; Pinal; (Charlotte, NC) ; HOULDEN;
Rohan W.; (Oak Ridge, NC) ; SHEALY; James
Blanton; (Ithaca, NY) ; SHEALY; Jeffrey B.;
(Cornelius, NC) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Akoustis, Inc. |
Huntersville |
NC |
US |
|
|
Family ID: |
1000005298624 |
Appl. No.: |
17/106736 |
Filed: |
November 30, 2020 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
16054929 |
Aug 3, 2018 |
10855247 |
|
|
17106736 |
|
|
|
|
62541028 |
Aug 3, 2017 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H03H 9/131 20130101;
H03H 9/02118 20130101; H03H 9/568 20130101; H03H 9/172 20130101;
H03H 9/02157 20130101; H03H 9/132 20130101 |
International
Class: |
H03H 9/02 20060101
H03H009/02; H03H 9/13 20060101 H03H009/13; H03H 9/17 20060101
H03H009/17; H03H 9/56 20060101 H03H009/56 |
Claims
1. An elliptical-shaped resonator circuit device, the device
comprising: a substrate a piezoelectric layer overlying the
substrate, the piezoelectric layer having a micro-via; a bottom
metal plate underlying the piezoelectric layer; a backside metal
interconnect underlying the piezoelectric layer and coupled to the
bottom metal plate; a top metal plate overlying the piezoelectric
layer; and a topside metal interconnect overlying the piezoelectric
layer and coupled to the backside metal interconnect through the
micro-via; wherein the top metal plate, the piezoelectric layer,
and the bottom metal plate are characterized by an elliptical shape
having a horizontal diameter (dx) and a vertical diameter (dy),
which can be represented as ellipse ratio R=dx/dy.
2. The device of claim 1 wherein the ellipse ratio R ranges from
about 1.20 to about 2.0.
3. The device of claim 1 wherein the bottom metal plate and top
metal plate include molybdenum (Mo), ruthenium (Ru), or tungsten
(W), Aluminum-Copper (AlCu).
4. The device of claim 1 wherein the piezoelectric layer includes
materials or alloys having at least one of the following: AlN,
AlGaN, GaN, InN, InGaN, AlInN, AlInGaN, ScAlN, ScGaN, AlScYN, and
BN.
5. The device of claim 1 further comprising one or more pillar-type
energy confinement features (ECFs) coupled to the top metal plate
or the bottom metal plate; wherein the one or more pillar-type ECFs
comprises a dielectric material, a metal material, or a combination
of dielectric and metal materials.
6. The device of claim 1 further comprising one or more cavity-type
energy confinement features (ECFs) configured within the top metal
plate or the bottom metal plate.
7. An RF filter circuit device, the device comprising: a substrate
member; a dielectric passivation layer overlying the substrate
member; a plurality of elliptical-shaped resonator devices
overlying the substrate member and configured within the dielectric
passivation layer, each of the elliptical shaped resonators
comprising a piezoelectric layer overlying the bottom metal plate,
the piezoelectric layer having a micro-via; a bottom metal plate
underlying the piezoelectric layer; a backside metal interconnect
underlying the piezoelectric layer and coupled to the bottom metal
plate; a top metal plate overlying the piezoelectric layer; and a
topside metal interconnect overlying the piezoelectric layer and
coupled to the backside metal interconnect through the micro-via;
wherein the top metal plate, the piezoelectric layer, and the
bottom metal plate are characterized by an elliptical shape having
a horizontal diameter (dx) and a vertical diameter (dy), which can
be represented as ellipse ratio R=dx/dy; and wherein each of the
plurality of elliptical-shaped resonator devices is coupled to at
least one other resonator in the plurality of elliptical-shaped
resonator devices.
8. The device of claim 7 wherein the ellipse ratio R ranges from
about 1.20 to about 2.00.
9. The device of claim 7 wherein the substrate member is selected
from a silicon substrate, a sapphire substrate, silicon carbide
substrate, a GaN bulk substrate, a GaN template, an AlN bulk
substrate, an AlN template, Al.sub.xGa.sub.1-xN templates,
engineered substrates such as silicon on insulator (SOI), and
polycrystalline AlN templates.
10. The device of claim 7 wherein the dielectric passivation layer
includes silicon oxide, silicon nitride, aluminum nitride, or
aluminum oxide materials.
11. The device of claim 7 wherein the bottom metal plate and top
metal plate include molybdenum (Mo), ruthenium (Ru), tungsten (W),
or Aluminum Copper (AlCu) materials.
12. The device of claim 7 wherein the piezoelectric layer includes
materials or alloys having at least one of the following: AlN,
AlGaN, GaN, InN, InGaN, AlInN, AlInGaN, ScAlN, ScGaN, AlScYN, and
BN.
13. The device of claim 7 wherein the micro-via includes molybdenum
(Mo), ruthenium (Ru), tungsten (W), or Aluminum Copper (AlCu)
materials.
14. The device of claim 7 further comprising one or more
pillar-type energy confinement features (ECFs) coupled to the top
metal plate or the bottom metal plate; wherein the one or more
pillar-type ECFs comprises a dielectric material, a metal material,
or a combination of dielectric and metal materials.
15. The device of claim 7 further comprising one or more
cavity-type energy confinement features (ECFs) configured within
the top metal plate or the bottom metal plate.
16. An RF filter circuit device, the device comprising: a substrate
member; a dielectric passivation layer overlying the substrate
member; a plurality of elliptical-shaped resonator devices
overlying the substrate member and configured within the dielectric
passivation layer, each of the elliptical shaped resonators
comprising a piezoelectric layer overlying the bottom metal plate,
the piezoelectric layer having a micro-via; a bottom metal plate
underlying the piezoelectric layer; a backside metal interconnect
underlying the piezoelectric layer and coupled to the bottom metal
plate; a top metal plate overlying the piezoelectric layer; a
topside metal interconnect overlying the piezoelectric layer and
coupled to the backside metal interconnect through the micro-via;
one or more pillar-type energy confinement features (ECFs) coupled
to the top metal plate or the bottom metal plate, wherein the one
or more pillar-type ECFs comprises a dielectric material, a metal
material, or a combination of dielectric and metal materials; and
one or more cavity-type energy confinement features (ECFs)
configured within the top metal plate or the bottom metal plate;
wherein the top metal plate, the piezoelectric layer, and the
bottom metal plate are characterized by an elliptical shape having
a horizontal diameter (dx) and a vertical diameter (dy), which can
be represented as ellipse ratio R=dx/dy; and wherein each of the
plurality of elliptical-shaped resonator devices is coupled to at
least one other resonator in the plurality of elliptical-shaped
resonator devices.
17. The device of claim 16 wherein the ellipse ratio R ranges from
about 1.20 to about 2.00.
18. The device of claim 16 wherein the substrate member is selected
from a silicon substrate, a sapphire substrate, silicon carbide
substrate, a GaN bulk substrate, a GaN template, an AlN bulk
substrate, an AlN template, Al.sub.xGa.sub.1-xN templates,
engineered substrates such as silicon on insulator (SOI), and
polycrystalline AlN templates; and wherein the dielectric
passivation layer includes silicon oxide, silicon nitride, aluminum
nitride, or aluminum oxide materials.
19. The device of claim 16 wherein the bottom metal plate and top
metal plate include molybdenum (Mo), ruthenium (Ru), tungsten (W),
or Aluminum Copper (AlCu) materials; wherein the piezoelectric
layer includes materials or alloys having at least one of the
following: AlN, AlGaN, GaN, InN, InGaN, AlInN, AlInGaN, ScAlN,
ScGaN, AlScYN, and BN; and wherein the micro-via includes
molybdenum (Mo), ruthenium (Ru), tungsten (W), or Aluminum Copper
(AlCu) materials.
20. The device of claim 16 wherein the piezoelectric layer includes
materials or alloys having at least one of the following: AlN,
AlGaN, GaN, InN, InGaN, AlInN, AlInGaN, ScAlN, ScGaN, AlScYN, and
BN.
Description
CROSS-REFERENCES TO RELATED APPLICATIONS
[0001] The present application claims priority to and is a
continuation of U.S. patent application Ser. No. 16/054,929, titled
"ELLIPTICAL STRUCTURE FOR BULK ACOUSTIC WAVE RESONATOR", filed Aug.
3, 2018, now U.S. Pat. No. 10,855,247 issued Dec. 1, 2020; which
claims priority to U.S. Prov. App. No. 62/541,028, titled
"ELLIPTICAL RESONATOR", filed Aug. 3, 2017.
BACKGROUND OF THE INVENTION
[0002] The present invention relates generally to electronic
devices and more particularly to resonators based on piezoelectric
epitaxial films and essentially single crystal films.
[0003] Mobile telecommunication devices have been successfully
deployed world-wide. Over a billion mobile devices, including cell
phones and smartphones, were manufactured in a single year and unit
volume continues to increase year-over-year. With ramp of 4G/LTE in
about 2012, and explosion of mobile data traffic, data rich content
is driving the growth of the smartphone segment--which is expected
to reach 2 B per annum within the next few years. Coexistence of
new and legacy standards and thirst for higher data rate
requirements is driving RF complexity in smartphones.
Unfortunately, limitations exist with conventional RF technology
that is problematic, and may lead to drawbacks in the future.
[0004] From the above, it is seen that techniques for improving
electronic devices are highly desirable.
BRIEF SUMMARY OF THE INVENTION
[0005] The present invention relates generally to electronic
devices and more particularly to resonators based on piezoelectric
epitaxial films and essentially single crystal films.
[0006] In an example, the present invention provides an
elliptical-shaped resonator device. The device includes a bottom
metal plate, a piezoelectric layer overlying the bottom metal
plate, and a top metal plate overlying the piezoelectric layer. The
top metal plate, the piezoelectric layer, and the bottom metal
plate are characterized by an elliptical shape having a horizontal
diameter (dx) and a vertical diameter (dy), which can be
represented as ellipse ratio R=dx/dy. In a specific example, the
ellipse ratio R ranges from about 1.20 to about 2.00.
[0007] A plurality of these elliptical-shaped resonator devices can
be configured within an RF filter circuit device. A plurality of
micro-vias can be configured to coupled certain resonators to each
other or couple a resonator to an interconnect metal or bond pad.
In a specific example, the present invention provides an RF filter
configuration using 11 elliptical-shaped resonator devices, with
seven such resonators coupled in series and four such resonators
coupled between junctions of the resonator series chain and ground.
Those of ordinary skill in the art will recognize other variations,
modifications, and alternatives.
[0008] One or more benefits are achieved over pre-existing
techniques using the invention. In particular, the present device
can be manufactured in a relatively simple and cost effective
manner while using conventional materials and/or methods according
to one of ordinary skill in the art. Using the present method, one
can create an improved bulk acoustic wave resonator (BAWR) having
equivalent or improved insertion loss compared to conventional
polygon-shaped resonators. Such filters or resonators can be
implemented in an RF filter device, an RF filter system, or the
like. Depending upon the embodiment, one or more of these benefits
may be achieved. Of course, there can be other variations,
modifications, and alternatives.
[0009] A greater understanding of the nature and advantages of the
invention may be realized by reference to the latter portions of
the specification and attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more fully understand the present invention,
reference is made to the accompanying drawings. Understanding that
these drawings are not to be considered limitations in the scope of
the invention, the presently described embodiments and the
presently understood best mode of the invention are described with
additional detail through use of the accompanying drawings in
which:
[0011] FIGS. 1A and 1B are simplified diagrams illustrating a side
view and top view, respectively, for an elliptical-shaped resonator
device according to an example of the present invention.
[0012] FIG. 2 is a simplified diagram illustrating an RF filter
circuit device using several elliptical-shaped resonators according
to various examples of the present invention.
[0013] FIG. 3A is a simplified diagram illustrating a
cross-sectional view of the RF filter circuit of FIG. 2 along the
A-B reference line according to an example of the present
invention.
[0014] FIG. 3B is a simplified diagram illustrating a
cross-sectional view of the RF filter circuit of FIG. 2 along the
A-B reference line according to an example of the present
invention.
[0015] FIG. 4 is a computer-aided design (CAD) layout of an RF
filter circuit device using elliptical-shaped resonators according
to an example of the present invention.
[0016] FIG. 5 is an image of a physical implementation of an RF
filter circuit using elliptical-shaped resonators according to an
example of the present invention.
[0017] FIG. 6 is a simplified circuit diagram illustrating an
elliptical-shaped resonator configured RF filter circuit device
according to an example of the present invention.
[0018] FIG. 7A is a graph comparing the insertion loss of a filter
passband for a conventional polygon-shaped resonator to one for an
elliptical-shaped resonator (R=1.61) according to an example of the
present invention.
[0019] FIG. 7B is a graph comparing the insertion loss of a filter
narrow band spectrum for a conventional polygon-shaped resonator to
one for an elliptical-shaped resonator (R=1.61) according to an
example of the present invention.
[0020] FIG. 7C is a graph comparing the insertion loss of a filter
wide band spectrum for a conventional polygon-shaped resonator to
one for an elliptical-shaped resonator (R=1.61) according to an
example of the present invention.
[0021] FIG. 8A-8D is are simplified diagrams illustrating
elliptical-shaped resonators configured with various ratios of
R.
[0022] FIGS. 9A and 9B are graphs comparing the coupling
coefficient and quality factor, respectively, between a
conventional polygon-shaped resonator and an elliptical-shaped
resonator according to an example of the present invention.
[0023] FIG. 9C is a table summarizing the results from the graphs
shown in FIGS. 9A and 9B.
DETAILED DESCRIPTION OF THE INVENTION
[0024] The present invention relates generally to electronic
devices and more particularly to resonators based on piezoelectric
epitaxial films and essentially single crystal films.
[0025] Generally, a Bulk Acoustic Wave Resonator (BAWR) is a
parallel plate capacitor which can be characterized by the
geometrical shape of its metal plates and the thickness and
composition of the piezoelectric material between the two
electrodes of the capacitor. A configuration of such resonators can
be used to create an RF filter creating a signal passband that is
characterized by the insertion loss (known as "S21"), which
describes the impact of placing the filter in an RF circuit.
[0026] Conventional resonators are typically constructed using
polygons with N-number of sides (where N.gtoreq.3). Circular-shaped
resonators are possible, but typically offer undesirable symmetry,
which leads to undesirable modes in the resonator. However,
elliptical-shaped resonators can be constructed with a ratio,
defined as R, of the horizontal diameter (dx) to vertical diameter
(dy) of the resonator, where R=dx/dy. Once defined with R, the
resonator can be placed in an RF circuit at an arbitrary angle
theta (.theta.).
[0027] According to examples of the present invention,
single-crystal piezoelectric-based RF filters using ellipse-shaped
resonators with the unique ratio of R between about 1.60 and about
1.61 have been fabricated and tested to provide equivalent or
improved insertion loss performance when compared to conventional
polygon-shaped resonators. Such filters are characterized by a
center frequency ranging from about 0.4 GHz to about 20 GHz and use
one or more areas to adjust the electrical impedance of the filter
circuit.
[0028] FIG. 1A is a simplified diagram illustrating a side
"sandwich" view of an elliptical-shaped resonator according to an
example of the present invention. As shown, device 101 includes a
top metal plate 110 and bottom metal plate 120 that sandwich a
piezoelectric layer 130. FIG. 1B is a simplified diagram
illustrating a top view of the same elliptical-shaped resonator
according an example of the present invention. Here, device 102
only shows the top metal plate 110, but the previously discussed
measurements of the horizontal diameter (dx), vertical diameter
(dy), and angle theta (.theta.) are shown in reference to the top
metal plate 110.
[0029] FIG. 2 is a simplified diagram illustrating an RF filter
circuit device using several elliptical-shaped resonators according
to various examples of the present invention. As shown, device 200
includes several elliptical-shaped resonators 220 configured on a
circuit die 210. In a specific example, the circuit die (or
substrate) is selected from a silicon substrate, a sapphire
substrate, silicon carbide substrate, a GaN bulk substrate, a GaN
template, an AlN bulk, an AlN template, Al.sub.xGa.sub.1-xN
templates, engineered substrates such as silicon on insulator
(SOI), and polycrystalline AlN templates. These resonators 220 can
be connected by metal interconnects 230 with or without micro-vias
240 to each other or to connections off-chip. In this example, a
dielectric passivation layer 211 is formed overlying the circuit
die 210, which can be silicon dioxide (SiO.sub.2), silicon nitride
(SiN), aluminum nitride (AlN), or aluminum oxide (AlO), or the
like. The use of SiO.sub.2 can improve temperature drift in the RF
filter circuit. Those of ordinary skill in the art will recognize
other variations, modifications, and alternatives.
[0030] FIG. 3A is a simplified diagram illustrating a
cross-sectional view of the RF filter circuit of FIG. 2 along the
A-B reference line according to an example of the present
invention. As shown, device 301 includes an elliptical-shaped
resonator device 320 overlying a substrate 310, which can include a
silicon carbide (SiC) material or the like, and a dielectric
passivation layer 311, which can include SiO.sub.2 or the like. The
resonator device 320 includes a top metal plate (top electrode) 321
and a bottom metal plate (bottom electrode) 322 sandwiching a
piezoelectric layer 323, which can include an aluminum nitride
(AlN) material or the like. Region 324 of the piezoelectric layer
323 shows the portion that is sandwiched between the top and bottom
electrodes 321, 322. In a specific example, the piezoelectric layer
includes materials or alloys having at least one of the following:
AlN, AlGaN, GaN, InN, InGaN, AlInN, AlInGaN, ScAlN, ScGaN, AlScYN,
and BN. A micro-via 340 is configured adjacent to this resonator
320, with a backside metal interconnect 331, which can include a
molybdenum material or the like, coupling the micro-via 340 to the
bottom metal plate 322. Metal interconnects 330 can be coupled to
the top electrode 321 or to the bottom electrode 322 through the
micro-via 340 and the backside metal interconnect 331.
[0031] In a specific example, the resonator 320 also includes two
types of energy confinement features (ECFs), ECF-1 341 and ECF-2
342. The ECF-1 341 include one or more pillar structures on the top
metal plate surface, while the ECF-2 342 include one or more cavity
regions within the top metal electrode surface. These ECF
structures can also be formed on the bottom metal plate as well. In
a specific example, the bottom metal plate, top metal plate, and
the ECF structures can include molybdenum (Mo), ruthenium (Ru),
Aluminum Copper (AlCu), or tungsten (W), or the like. Of course,
there can be other variations, modifications, and alternatives.
[0032] FIG. 3B is a simplified diagram illustrating a
cross-sectional view of the RF filter circuit of FIG. 2 along the
A-B reference line according to an example of the present
invention. As shown, device 302 is similar to device 301 except
that only ECF-1 structures are present without any ECF-2
structures. The remaining elements follow the same reference number
scheme as those in FIG. 3A.
[0033] FIG. 4 is a computer-aided design (CAD) layout of an RF
filter circuit device using elliptical-shaped resonators according
to an example of the present invention. Image 400 shows a layout
similar to that of FIG. 2. FIG. 5 is an image of a physical
implementation of an RF filter circuit using elliptical-shaped
resonators according to an example of the present invention. Image
500 is configured in the same orientation as FIG. 4 for comparison
purposes.
[0034] FIG. 6 is a simplified circuit diagram illustrating an
elliptical-shaped resonator configured RF filter circuit device
according to an example of the present invention. As shown, device
600 includes an RF filter input 601 and an RF filter output 602
with elliptical-shaped resonators 620 configured in between. In a
specific example, the RF filter includes 11 such resonators, with
seven resonators in series between the input and output and four
resonators connected to intersections of the series configurations
and ground. Of course, there can be other variations,
modifications, and alternatives.
[0035] FIG. 7A is a graph 701 comparing the insertion loss of a
filter passband for a conventional polygon-shaped resonator to one
for an elliptical-shaped resonator (R=1.61) according to an example
of the present invention. The results for the conventional
polygon-shaped resonator are shown by plot 710, while the results
for the elliptical-shaped resonator are shown by plot 720.
[0036] FIG. 7B is a graph 702 comparing the insertion loss of a
filter narrow band spectrum for a conventional polygon-shaped
resonator to one for an elliptical-shaped resonator (R=1.61)
according to an example of the present invention. The results for
the conventional polygon-shaped resonator are shown by plot 710,
while the results for the elliptical-shaped resonator are shown by
plot 720.
[0037] FIG. 7C is a graph 703 comparing the insertion loss of a
filter wide band spectrum for a conventional polygon-shaped
resonator to one for an elliptical-shaped resonator (R=1.61)
according to an example of the present invention. The results for
the conventional polygon-shaped resonator are shown by plot 710,
while the results for the elliptical-shaped resonator are shown by
plot 720.
[0038] FIG. 8A-8D is are simplified diagrams illustrating
elliptical-shaped resonators configured with various ratios of R.
FIG. 8A illustrates a device 801 having an ellipse ratio of R=1.2.
FIG. 8B illustrates a device 802 having an ellipse ratio of R=1.6.
FIGS. 8C and 8D illustrate devices 803 and 804, which have ellipse
ratios of R=1.8 and R=2.0, respectively.
[0039] Examples of the present invention take advantage of the fact
that the shape of the BAW resonator determines the overall
performance. Lateral mode noise reduces as the overall symmetry of
the shape decreases, i.e., an elliptical shape shows weaker lateral
mode noise than circular shapes. Weak vertical amplitude of
acoustic wave in corners of quadrilateral or pentagon shapes
reduces the coupling coefficient of the resonator; thus, an
elliptical-shaped resonator eliminates the corners to allow a
higher coupling coefficient. Further, the ratio of area-to-edge
affects the quality factor of the resonator as the acoustic wave
radiates outside of the resonator along the edge. Since an ellipse
has a shorter edge for a given area compared to a quadrilateral, or
other polygonal shape, an elliptical-shaped resonator can exhibit a
higher quality factor as well.
[0040] In a specific example, an elliptical-shaped resonator with a
specific aspect ratio of R=1.6 exhibits a better quality factor
near the anti-resonance frequency (Q.sub.p). The date from BAW
resonators with the resonance frequency around 5 GHz shows a higher
Q.sub.p when the aspect ratio of the ellipse is 1.6. The coupling
coefficient for an elliptical-shaped resonator with a ratio of 1.6
is slightly less than an that of an elliptical-shaped resonator
with the ratio of 1.2, but the overall figure of merit is higher
with R=1.6. The graphs and table of FIGS. 9A-9C summarize these
results.
[0041] FIG. 9A is a graph 901 comparing the coupling coefficient
variation for the elliptical-shaped resonators shown in FIG. 8. As
shown in graph 901, the resonator with a ratio of 1.2 starts at the
highest coupling coefficient. The value of this coefficient then
falls as the ratio reaches 1.8, but rises again at a ratio of 2.0.
FIG. 9B is a graph 902 comparing the quality factor for the
elliptical-shaped resonators shown in FIG. 8. As shown in graph
902, the quality factor increases with the ratio as the ratio
increases from 1.2 to 1.6, but then falls as the ratio descends to
1.8 and 2.0. FIG. 9C is a table 903 summarizing the results of the
graphs 901, 902 from FIGS. 9A and 9B. Although the coupling
coefficient variation was higher with an ellipse ratio of 1.2, the
overall figure of merit was the highest at R=1.6 (about 1.60 to
about 1.61).
[0042] One or more benefits are achieved over pre-existing
techniques using the invention. In particular, the present device
can be manufactured in a relatively simple and cost effective
manner while using conventional materials and/or methods according
to one of ordinary skill in the art. Using the present method, one
can create an improved bulk acoustic wave resonator (BAWR) having
equivalent or improved insertion loss compared to conventional
polygon-shaped resonators. Such filters or resonators can be
implemented in an RF filter device, an RF filter system, or the
like. Depending upon the embodiment, one or more of these benefits
may be achieved. Of course, there can be other variations,
modifications, and alternatives.
[0043] While the above is a full description of the specific
embodiments, various modifications, alternative constructions and
equivalents may be used. As an example, the packaged device can
include any combination of elements described above, as well as
outside of the present specification. Therefore, the above
description and illustrations should not be taken as limiting the
scope of the present invention which is defined by the appended
claims.
* * * * *