U.S. patent application number 16/721551 was filed with the patent office on 2021-04-15 for copper alloy with high strength, high electrical conductivity, and high wear resistance and preparation method thereof.
The applicant listed for this patent is Dalian University of Technology. Invention is credited to Zhiqiang Cao, Zongning Chen, Enyu Guo, Jinchuan Jie, Huijun Kang, Rengeng Li, Tingju Li, Yiping Lu, Tongmin Wang, Yubo Zhang.
Application Number | 20210108289 16/721551 |
Document ID | / |
Family ID | 1000004761188 |
Filed Date | 2021-04-15 |
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United States Patent
Application |
20210108289 |
Kind Code |
A1 |
Wang; Tongmin ; et
al. |
April 15, 2021 |
COPPER ALLOY WITH HIGH STRENGTH, HIGH ELECTRICAL CONDUCTIVITY, AND
HIGH WEAR RESISTANCE AND PREPARATION METHOD THEREOF
Abstract
The present invention provides a copper alloy with high
strength, high electrical conductivity, and high wear resistance
and a preparation method thereof. The copper alloy includes 0.7 to
1.5 wt % of Cr, 0.2 to 0.6 wt % Zr and Hf, and Cu as balance. The
present invention further discloses a preparation method of the
copper, and the method includes the following steps: conducting
hot-rolling and then solution treatment, removing a surface
oxidation layer, and successively conducting first rolling, first
aging treatment, second rolling, and second aging treatment. In the
present invention, the preparation method of the copper alloy with
high strength, high electrical conductivity, and high wear
resistance can effectively avoid mutual interference between hard
second phase particles and alloying elements, and the copper alloy
with high strength, high electrical conductivity, and high wear
resistance prepared by using the method has excellent wear
resistance and mechanical properties.
Inventors: |
Wang; Tongmin; (Dalian,
CN) ; Li; Rengeng; (Dalian, CN) ; Kang;
Huijun; (Dalian, CN) ; Chen; Zongning;
(Dalian, CN) ; Guo; Enyu; (Dalian, CN) ;
Jie; Jinchuan; (Dalian, CN) ; Cao; Zhiqiang;
(Dalian, CN) ; Lu; Yiping; (Dalian, CN) ;
Zhang; Yubo; (Dalian, CN) ; Li; Tingju;
(Dalian, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dalian University of Technology |
Dalian |
|
CN |
|
|
Family ID: |
1000004761188 |
Appl. No.: |
16/721551 |
Filed: |
December 19, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C21D 8/0226 20130101;
C22C 9/00 20130101; C21D 8/0263 20130101 |
International
Class: |
C22C 9/00 20060101
C22C009/00; C21D 8/02 20060101 C21D008/02 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 14, 2019 |
CN |
201910971260.6 |
Claims
1. A copper alloy with high strength, high electrical conductivity,
and high wear resistance, wherein the alloy comprises 0.7 to 1.5 wt
% of Cr, 0.2 to 0.6 wt % Zr and Hf, and Cu as balance.
2. The copper alloy with high strength, high electrical
conductivity, and high wear resistance according to claim 1,
wherein the alloy comprises 0.8 to 1.2 wt % of Cr, 0.3 to 0.5 wt %
Zr and Hf, and Cu as balance.
3. The copper alloy with high strength, high electrical
conductivity, and high wear resistance according to claim 1,
wherein in the alloy, the Cr element exists in the form of
nano-precipitates Cr and submicron Cr particles.
4. The copper alloy with high strength, high electrical
conductivity, and high wear resistance according to claim 3,
wherein in the alloy, 50 to 70 wt % of the Cr element exists in a
form of nano-precipitates Cr with face-centered cubic structure,
and 30 to 50 wt % of the Cr element exists in a form of submicron
Cr particles with body-centered cubic structure.
5. A preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 1, comprising the following steps: melting and casting
according to the proportion; conducting hot-rolling and then
solution treatment, wherein a solution temperature is 960 to
985.degree. C., and a holding time is 0.5 to 1 h; and conducting
water-cooling quenching; removing a surface oxidation layer, and
conducting first rolling, wherein a rolling deformation amount is
45 to 75%, and is reduced by 10% each pass, and a rolling
temperature is -196 to 30.degree. C.; conducting first aging
treatment, wherein an aging temperature is 400 to 450.degree. C.,
and an aging time is 120 to 150 min; conducting second rolling,
wherein a rolling deformation amount is 15 to 45%, and is reduced
to less than 10% each pass, a rolling temperature is -196 to
30.degree. C., and a total rolling deformation amount of the first
rolling and the second rolling is 80 to 95%; and conducting second
aging treatment, wherein an aging temperature is 400 to 500.degree.
C., and an aging time is 150 to 360 min.
6. (canceled)
7. (canceled)
8. (canceled)
9. (canceled)
10. A preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 2, comprising the following steps: smelting raw materials
according to a proportion; conducting hot-rolling and then solution
treatment, wherein a solution temperature is 960 to 985.degree. C.,
and a holding time is 0.5 to 1 h; and conducting water-cooling
quenching; removing a surface oxidation layer, and conducting first
rolling, wherein a rolling deformation amount is 45 to 75%, and is
reduced by 10% each pass, and a rolling temperature is -196 to
30.degree. C.; conducting first aging treatment, wherein an aging
temperature is 400 to 450.degree. C., and an aging time is 120 to
150 min; conducting second rolling, wherein a rolling deformation
amount is 15 to 45%, and is reduced to less than 10% each pass, a
rolling temperature is -196 to 30.degree. C., and a total rolling
deformation amount of the first rolling and the second rolling is
80 to 95%; and conducting second aging treatment, wherein an aging
temperature is 400 to 500.degree. C., and an aging time is 150 to
360 min.
11. A preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 3, comprising the following steps: smelting raw materials
according to a proportion; conducting hot-rolling and then solution
treatment, wherein a solution temperature is 960 to 985.degree. C.,
and a holding time is 0.5 to 1 h; and conducting water-cooling
quenching; removing a surface oxidation layer, and conducting first
rolling, wherein a rolling deformation amount is 45 to 75%, and is
reduced by 10% each pass, and a rolling temperature is -196 to
30.degree. C.; conducting first aging treatment, wherein an aging
temperature is 400 to 450.degree. C., and an aging time is 120 to
150 min; conducting second rolling, wherein a rolling deformation
amount is 15 to 45%, and is reduced to less than 10% each pass, a
rolling temperature is -196 to 30.degree. C., and a total rolling
deformation amount of the first rolling and the second rolling is
80 to 95%; and conducting second aging treatment, wherein an aging
temperature is 400 to 500.degree. C., and an aging time is 150 to
360 min.
12. A preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 4, comprising the following steps: smelting raw materials
according to a proportion; conducting hot-rolling and then solution
treatment, wherein a solution temperature is 960 to 985.degree. C.,
and a holding time is 0.5 to 1 h; and conducting water-cooling
quenching; removing a surface oxidation layer, and conducting a
first rolling, wherein a rolling deformation amount is 45 to 75%,
and is reduced by 10% each pass, and a rolling temperature ranges
from -196 to 30.degree. C.; conducting a first aging treatment,
wherein an aging temperature is 400 to 450.degree. C., and an aging
time ranges from 120 to 150 min; conducting a second rolling,
wherein a rolling deformation amount is 15 to 45%, and is reduced
to less than 10% each pass, a rolling temperature is -196 to
30.degree. C., and a total rolling deformation amount of the first
rolling and the second rolling is 80 to 95%; and conducting a
second aging treatment, wherein an aging temperature is 400 to
500.degree. C., and an aging time is 150 to 360 min.
13. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 5, wherein in the first rolling, the rolling deformation
amount is 50 to 65%, and is reduced by 10% each pass, and the
rolling temperature is -150 to 25.degree. C.
14. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 10, wherein in the first rolling, the rolling deformation
amount is 50 to 65%, and is reduced by 10% each pass, and the
rolling temperature is -150 to 25.degree. C.
15. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 11, wherein in the first rolling, the rolling deformation
amount is 50 to 65%, and is reduced by 10% each pass, and the
rolling temperature is -150 to 25.degree. C.
16. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 12, wherein in the first rolling, the rolling deformation
amount is 50 to 65%, and is reduced by 10% each pass, and the
rolling temperature is -150 to 25.degree. C.
17. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 5, wherein in the first aging treatment, the aging
temperature is 400 to 425.degree. C., and the aging time is 120 to
130 min.
18. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 10, wherein in the first aging treatment, the aging
temperature is 400 to 425.degree. C., and the aging time is 120 to
130 min.
19. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 11, wherein in the first aging treatment, the aging
temperature is 400 to 425.degree. C., and the aging time is 120 to
130 min.
20. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 12, wherein in the first aging treatment, the aging
temperature is 400 to 425.degree. C., and the aging time is 120 to
130 min.
21. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 5, wherein in the second rolling, the rolling deformation
amount is 25 to 40%, and is reduced to less than 10% each pass, the
rolling temperature is -196 to 30.degree. C., and the total rolling
deformation amount of the first rolling and the second rolling is
85 to 92%.
22. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 10, wherein in the second rolling, the rolling deformation
amount is 25 to 40%, and is reduced to less than 10% each pass, the
rolling temperature is -196 to 30.degree. C., and the total rolling
deformation amount of the first rolling and the second rolling is
85 to 92%.
23. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 11, wherein in the second rolling, the rolling deformation
amount is 25 to 40%, and is reduced to less than 10% each pass, the
rolling temperature is -196 to 30.degree. C., and the total rolling
deformation amount of the first rolling and the second rolling is
85 to 92%.
24. The preparation method of the copper alloy with high strength,
high electrical conductivity, and high wear resistance according to
claim 5, wherein in the second aging treatment, the aging
temperature is 425 to 475.degree. C., and the aging time is 280 to
360 min.
Description
TECHNICAL FIELD
[0001] The present invention relates to metal material
technologies, and in particular, to a copper alloy with high
strength, high electrical conductivity, and high wear resistance
and preparation method thereof.
BACKGROUND
[0002] Copper and its alloys have relatively good mechanical
properties and electrical conductivity, and therefore are widely
applied to the electronic field, the electrical field, the building
field, the transportation field, the communication field, the
national defense and military industry field, and so on.
[0003] The high strength and high electrical conductivity cannot be
well balanced at the same time, and it is difficult to
simultaneously achieve high strength and high conductivity. Common
methods for improving the mechanical properties of materials will
degrade their electrical conductivity to some extent. Therefore,
balancing a relationship between strength and electrical
conductivity becomes one of key problems in the copper processing
field. In addition, the wear resistance of a copper alloy directly
affects its service life, and improving the wear resistance of the
copper alloy can help to prolong its service life and reduce a
resource loss. Generally, adding a second phase with high hardness
to copper is one of the effective means to improve the wear
resistance of materials. Most common hard second phase particles
are borides, such as TiB.sub.2, ZrB.sub.2, and HfB.sub.2. However,
these borides inevitably interact with alloying elements in the
copper alloy, resulting in serious segregation of borides, so as to
affect the wear resistance of the materials. In addition, the
addition of excessive borides also seriously compromises the
electrical conductivity. Meanwhile, it is difficult and challenging
to achieve high strength, high electrical conductivity, and high
wear resistance simultaneously.
SUMMARY
[0004] An objective of the present invention is to prepare a copper
alloy with high strength, high conductivity, and high wear
resistance in view of a problem that high strength, high
conductivity, and high wear resistance of a copper alloy cannot be
achieved at the same time currently. The copper alloy can
effectively avoid mutual interference between hard second phase
particles and alloying elements, and thus has excellent wear
resistance and mechanical properties.
[0005] To achieve the above purpose, the present invention provides
the following technical solutions: A copper alloy with high
strength, high electrical conductivity, and high wear resistance
includes 0.7 to 1.5 wt % of Cr, 0.2 to 0.6 wt % Zr and Hf, and Cu
as balance.
[0006] Further, the alloy includes 0.8 to 1.2 wt % of Cr, 0.3 to
0.5 wt % Zr and Hf, and Cu as balance.
[0007] Further, the mass ratio of Zr to Hf is 1-1.5.
[0008] Further, in the alloy, the Cr element exists in both
nano-precipitates Cr and submicron Cr particles.
[0009] Further, in the alloy, 50 to 70 wt % of the Cr element
exists in a form of nano-precipitates Cr with face-centered cubic
structure, and 30 to 50 wt % of the Cr element exists in a form of
submicron Cr particles with body-centered cubic structure.
[0010] The present invention further provides a preparation method
of the copper alloy with high strength, high electrical
conductivity, and high wear resistance, including the following
steps:
[0011] melting and casting according to a proportion; conducting
hot-rolling and then solution treatment, where a solution treatment
temperature is 960 to 985.degree. C., and a holding time is 0.5 to
1 h; and conducting water-cooling quenching;
[0012] removing a surface oxidation layer, and conducting the first
rolling, where a rolling deformation amount is 45 to 75%, and is
reduced by 10% each pass, and a rolling temperature is -196 to
30.degree. C.;
[0013] conducting the first aging treatment, where an aging
temperature is 400 to 450.degree. C., and an aging time is 120 to
150 min;
[0014] conducting the second rolling, where a rolling deformation
amount is 15 to 45%, and is reduced to less than 10% each pass, a
rolling temperature is -196 to 30.degree. C., and a total rolling
deformation amount of the first rolling and the second rolling is
80 to 95%; and
[0015] conducting second aging treatment, where an aging
temperature is 400 to 500.degree. C., and an aging time is 150 to
360 min.
[0016] Further, in the first rolling, the rolling deformation
amount is 50 to 65%, and is reduced by 10% each pass, and the
rolling temperature is -150 to 25.degree. C.
[0017] Further, in the first aging treatment, the aging temperature
is 400 to 425.degree. C., and an aging time is 120 to 130 min.
[0018] Further, in the second rolling, the rolling deformation
amount is 25 to 40%, and is reduced to less than 10% each pass, the
rolling temperature is -196 to 30.degree. C., and the total rolling
deformation amount of the first rolling and the second rolling is
85 to 92%.
[0019] Further, in the second aging treatment, the aging
temperature is 425 to 475.degree. C., and the aging time is 280 to
360 min.
[0020] In the present invention, the copper alloy with high
strength, high electrical conductivity, and high wear resistance
and a preparation method thereof are provided. Hard Cr particles
are introduced to improve the wear resistance of the copper alloy;
the nano-precipitates Cr are introduced to enhance mechanical
properties of the copper alloy; and this strategy can effectively
avoid mutual interference between the hard particles and the
alloying elements. Specifically, compared with the prior art, the
present invention has the following advantages:
[0021] (1) In the present invention, composition design and process
optimization are conducted, aging treatment is conducted on a part
of Cr elements in Cu--Cr--Zr--Hf alloy to form nano-precipitates
Cr; the remaining Cr elements exist in a form of submicron Cr
particles. The nano-precipitates Cr enhances strength of the copper
alloy, while the submicron Cr particles enhance friction wear
resistance of the copper alloy. With the combination of the
nano-precipitates Cr and the submicron Cr particles, a
Cu--Cr--Zr--Hf alloy plate with high strength, high electrical
conductivity, and high wear resistance was prepared via the
two-step rolling-aging process.
[0022] (2) According to the preparation method of the copper alloy
with high strength, high electrical conductivity, and high wear
resistance in the present invention, the prepared Cu--Cr--Zr--Hf
alloy has high strength (tensile strength is 705 MPa), high
electrical conductivity (79% IACS), and high wear resistance. The
copper alloy not only satisfies requirements for high strength and
high conductivity in an actual application, but also effectively
prolongs the service life of the component.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] FIG. 1 is an engineering stress-strain curve of the copper
alloy with high strength, high electrical conductivity, and high
wear resistance according to Embodiment 1;
[0024] FIG. 2 is a comparison diagram of macroscopic wear
morphologies of the copper alloys, where figure (a) shows a
comparison sample: Cu-0.4% Cr-0.2% Zr-0.2% Hf alloy; and figure (b)
shows the copper alloy with high strength, high electrical
conductivity, and high wear resistance in Embodiment 1; and
[0025] FIG. 3 is an engineering stress-strain curve of a copper
alloy with high strength, high electrical conductivity, and high
wear resistance according to Embodiment 2.
DETAILED DESCRIPTION
[0026] The present invention is further described below with
reference to embodiments.
Embodiment 1
[0027] This embodiment discloses a copper alloy with high strength,
high electrical conductivity, and high wear resistance. The copper
alloy includes components at the following weight proportion: 1%
Cr, 0.2% Zr, 0.2% Hf, and Cu as balance and is referred to as Cu-1%
Cr-0.2% Zr-0.2% Hf.
[0028] In this embodiment, a preparation method of the copper alloy
with high strength, high electrical conductivity, and high wear
resistance includes the following steps:
[0029] preparing the ingots according to the weight proportion;
conducting hot-rolling and then solution treatment, where the
solution temperature is 972.degree. C., and the holding time is 45
min; and conducting water-cooling quenching;
[0030] removing a surface oxidation layer and other defects, and
conducting first rolling, where the rolling deformation amount is
60%, and is reduced by 10% each pass, and the rolling temperature
is 25.degree. C. (that is, rolling at room temperature);
[0031] conducting a first aging treatment, where an aging
temperature is 400.degree. C., and an aging time is 120 min;
[0032] conducting a second rolling, where the rolling deformation
amount is 30%, and is reduced by 10% each pass, a rolling
temperature is 25.degree. C., and a total rolling deformation
amount of first rolling and second rolling is 90%; and
[0033] conducting a second aging treatment, where an aging
temperature is 450.degree. C., and an aging time is 300 min.
[0034] FIG. 1 is an engineering stress-strain curve of a copper
alloy with high strength, high electrical conductivity, and high
wear resistance according to Embodiment 1. Specifically,
[0035] FIG. 1 is an engineering stress-strain curve of the Cu-1%
Cr-0.2% Zr-0.2% Hf alloy prepared through two-step room-temperature
(rolling temperature is 25.degree. C.) rolling and aging treatment
according to this embodiment. As shown in FIG. 1 and Table 1, the
Cu-1% Cr-0.2% Zr-0.2% Hf alloy with yield strength of 613 MPa,
tensile strength of 648 MPa, and electrical conductivity of 80.05%
IACS is finally prepared in this embodiment. Generally, tensile
strength of a common Cu--Cr--Zr alloy is approximately 600 MPa, and
overall performance of the sample prepared in this embodiment is
higher than that of common Cu--Cr--Zr series alloys. To compare
wear resistance, a Cu-0.4% Cr-0.2% Zr-0.2% Hf alloy with the
composition outside the range of this embodiment is selected as a
comparison sample.
[0036] FIG. 2 is a comparison diagram of macroscopic wear
morphologies of copper alloys, where figure (a) shows a comparison
sample: Cu-0.4% Cr-0.2% Zr-0.2% Hf alloy; and figure (b) shows the
copper alloy with high strength, high electrical conductivity, and
high wear resistance in Embodiment 1. Specifically, FIG. 2 is a
comparison diagram of macroscopic wear morphologies of Cu-1%
Cr-0.2% Zr-0.2% Hf alloy and Cu-0.4% Cr-0.2% Zr-0.2% Hf alloy that
are both subjected to two-step room-temperature (rolling
temperature is 25.degree. C.) rolling and aging treatment in
Embodiment 1 in frictional wear experiment conditions: the load is
45N, the sliding speed is 120 mm/s, and the sliding distance is 216
m. FIG. (a) shows the Cu-0.4% Cr-0.2% Zr-0.2% Hf alloy (a
comparison sample); and figure (b) shows the sample prepared in
specific Embodiment 1. It can be obviously seen from FIG. 2 that,
the wear scar diameter of the Cu-1% Cr-0.2% Zr-0.2% Hf alloy
prepared in this embodiment is obviously smaller than that of the
Cu-0.4% Cr-0.2% Zr-0.2% Hf alloy. This indicates that the wear
resistance of the product in this embodiment is greatly improved.
Through a calculation, the volume wear loses of the Cu-1% Cr-0.2%
Zr-0.2% Hf alloy in this embodiment is 0.05 mm.sup.3, while the
volume wear loss of the comparison sample is 0.14 mm.sup.3. This
indicates that wear resistance of the copper alloy is effectively
improved in this embodiment. In summary, in this embodiment, a new
alloy with high strength, high electrical conductivity, and high
wear resistance is prepared.
TABLE-US-00001 TABLE 1 Performance of the Cu--1%Cr--0.2%Zr--0.2%Hf
alloy prepared through two-step room-temperature (rolling
temperature is 25.degree. C.) rolling and aging treatment Yield
strength Tensile strength Conductivity Components (MPa) (MPa) (%
IACS) Cu0.4Cr0.2Zr0.2Hf 613 .+-. 2 648 .+-. 4 80.05 .+-. 0.23
Embodiment 2
[0037] This embodiment discloses a copper alloy with high strength,
high electrical conductivity, and high wear resistance. The
composition of the copper alloy is Cu-1% Cr-0.2% Zr-0.2% Hf.
[0038] In this embodiment, a preparation method of the copper alloy
with high strength, high electrical conductivity, and high wear
resistance includes the following steps:
[0039] conducting hot-rolling and then solution treatment, where
the solution temperature is 972.degree. C., and the holding time is
45 min; and conducting water-cooling quenching; removing a surface
oxidation layer and other defects, and conducting a first rolling,
where the rolling deformation amount is 60%, and is reduced by 10%
each pass, and the rolling temperature is -150.degree. C. (that is,
rolling at cryogenic temperature);
[0040] conducting a first aging treatment, where an aging
temperature is 400.degree. C., and an aging time is 120 min;
[0041] conducting a second rolling, where a rolling deformation
amount is 30%, and is reduced by 10% each pass, a rolling
temperature is -150.degree. C. (that is, rolling at cryogenic
temperature), and the total rolling deformation amount of the first
rolling and second rolling is 90%; and
[0042] conducting a second aging treatment, where the aging
temperature is 450.degree. C., and the aging time is 300 min.
[0043] FIG. 3 is an engineering stress-strain curve of a copper
alloy with high strength, high electrical conductivity, and high
wear resistance according to Embodiment 2. Specifically, the
engineering stress-strain curve is an engineering stress-strain
curve of the Cu-1% Cr-0.2% Zr-0.2% Hf alloy prepared through the
two-step cryogenic (rolling temperature is -150.degree. C.) rolling
and aging treatment in Embodiment 2. As shown in FIG. 3 and Table
2, the Cu-1% Cr-0.2% Zr-0.2% Hf alloy with yield strength of 655
MPa, tensile strength of 705 MPa, and conductivity of 79.00% IACS
is finally prepared in this embodiment. Overall performance of the
sample prepared in this embodiment is higher than that of common
Cu--Cr--Zr series alloys. To compare wear resistance, a Cu-0.4%
Cr-0.2% Zr-0.2% Hf alloy with composition outside the range of this
embodiment is selected as a comparison sample. Through calculation,
the volume wear loss of the Cu-1% Cr-0.2% Zr-0.2% Hf alloy in this
embodiment is 0.06 mm.sup.3, while the volume wear loss of the
comparison sample is 0.13 mm.sup.3. This indicates that wear
resistance of the copper alloy is effectively improved in this
embodiment. In summary, in this embodiment, a new alloy with high
strength, high electrical conductivity, and high wear resistance is
prepared.
TABLE-US-00002 TABLE 2 Performance of the Cu--1%Cr--0.2%Zr--0.2%Hf
alloy prepared through two-step cryogenic (rolling temperature is
-150.degree. C.) rolling and aging treatment Yield strength Tensile
strength Conductivity Components (MPa) (MPa) (% IACS)
Cu0.4Cr0.2Zr0.2Hf 655 .+-. 6 705 .+-. 4 79.00 .+-. 0.15
[0044] Finally, it should be noted that the foregoing embodiments
are merely intended for describing the technical solutions of the
present invention, but not for limiting the present invention.
Although the present invention is described in detail with
reference to the foregoing embodiments, persons of ordinary skill
in the art should understand that they may still make modifications
to the technical solutions described in the foregoing embodiments
or make equivalent replacements to some or all technical features
thereof, without departing from the scope of the technical
solutions of the embodiments of the present invention.
* * * * *