U.S. patent application number 16/675849 was filed with the patent office on 2021-04-01 for fingerprint detection device.
The applicant listed for this patent is SuperC-Touch Corporation. Invention is credited to Shang CHIN, Hsiang-Yu LEE, Ping-Tsun LIN, Chia-Hsun TU.
Application Number | 20210097249 16/675849 |
Document ID | / |
Family ID | 1000004456462 |
Filed Date | 2021-04-01 |
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United States Patent
Application |
20210097249 |
Kind Code |
A1 |
LEE; Hsiang-Yu ; et
al. |
April 1, 2021 |
FINGERPRINT DETECTION DEVICE
Abstract
The present invention provides a fingerprint detection device,
including: a substrate, a switch circuit layer, a sensing electrode
layer, a heat dissipating antistatic structure layer, and a
protective layer. The switch circuit layer is disposed on the
substrate. The sensing electrode layer is disposed on the switch
circuit layer, and includes a plurality of sensing electrodes. The
heat dissipating antistatic structure layer is disposed on the
sensing electrode layer, and includes a conductive mesh and a
plurality of shunt heat sinks. The conductive mesh is formed with a
plurality of mesh openings, and configured to shunt charges. The
shunt heat sinks are adjacent to the conductive mesh, and
correspond to the sensing electrodes. The shunt heat sinks are
electrically insulated from each other, electrically insulated from
the conductive mesh, and electrically insulated from the sensing
electrodes. The protective layer is disposed on the heat
dissipating antistatic structure layer.
Inventors: |
LEE; Hsiang-Yu; (New Taipei
City, TW) ; CHIN; Shang; (New Taipei City, TW)
; LIN; Ping-Tsun; (New Taipei City, TW) ; TU;
Chia-Hsun; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SuperC-Touch Corporation |
New Taipei City |
|
TW |
|
|
Family ID: |
1000004456462 |
Appl. No.: |
16/675849 |
Filed: |
November 6, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06K 9/00053 20130101;
G06K 9/0002 20130101; H01L 27/0248 20130101; H05K 9/0067
20130101 |
International
Class: |
G06K 9/00 20060101
G06K009/00 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 27, 2019 |
TW |
108134981 |
Claims
1. A fingerprint detection device, comprising: a substrate; a
switch circuit layer disposed on the substrate, and including a
plurality of transistor switches, a plurality of data lines, and a
plurality of control lines; a sensing electrode layer disposed on
the switch circuit layer, and including a plurality of sensing
electrodes; a heat dissipating antistatic structure layer disposed
on the sensing electrode layer, the heat dissipating antistatic
structure layer including: a conductive mesh formed with a
plurality of mesh openings, and configured to shunt charges; and a
plurality of shunt heat sinks adjacent to the conductive mesh, and
corresponding to the sensing electrodes, the shunt heat sinks being
electrically insulated from each other, electrically insulated from
the conductive mesh, and electrically insulated from the sensing
electrodes; and a protective layer disposed on the heat dissipating
antistatic structure layer.
2. The fingerprint detection device of claim 1, wherein the heat
dissipating antistatic structure layer is divided into an upper
sublayer and a lower sublayer, the conductive mesh is located in
the upper sublayer, and the shunt heat sinks are located in the
lower sublayer.
3. The fingerprint detection device of claim 1, wherein each
sensing electrode corresponds to one or more shunt heat sinks, and
the shunt heat sink(s) corresponding to the sensing electrode have
a total area equal to or greater than 625 .mu.m.sup.2.
4. The fingerprint detection device of claim 1, wherein one or more
coupling capacitances are formed between each sensing electrode and
the corresponding shunt heat sink(s), and the coupling
capacitance(s) couples charge distribution and/or charge change of
a finger to the sensing electrode.
5. The fingerprint detection device of claim 1, wherein when being
observed along a normal direction of the substrate, one or more
shunt heat sinks are exactly located in a mesh opening of the
conductive mesh.
6. The fingerprint detection device of claim 5, wherein each mesh
opening is defined by a regional ring of the conductive mesh, and
the shunt heat sink(s) located in the mesh opening has a total area
greater than a total area of the regional ring.
7. The fingerprint detection device of claim 1, wherein each shunt
heat sink has a thermal conductivity equal to or greater than 35
Wm.sup.-1K.sup.-1.
8. The fingerprint detection device of claim 1, wherein each shunt
heat sink has a thermal conductivity equal to or greater than 100
Wm.sup.-1K.sup.-1, and made of molybdenum, silver, copper, gold,
aluminum, or graphite.
9. The fingerprint detection device of claim 1, wherein the
conductive mesh is electrically connected to a ground terminal, a
DC reference voltage terminal, or a metal shell, and made of
molybdenum, silver, copper, gold, aluminum, or graphite.
10. The fingerprint detection device of claim 1, further comprising
an upper insulating layer disposed between the sensing electrode
layer and the heat dissipating antistatic structure layer.
11. The fingerprint detection device of claim 10, wherein a thermal
conductivity of each shunt heat sink is greater than a thermal
conductivity of the upper insulating layer for five times or
more.
12. The fingerprint detection device of claim 11, wherein the upper
insulating layer includes a first point-of-evaporation material
layer and/or a second point-of-evaporation material layer.
13. The fingerprint detection device of claim 12, wherein the first
point-of-evaporation material layer is made of silicon nitride
compound, and the second point-of-evaporation material layer is
made of curing acrylic material.
14. The fingerprint detection device of claim 1, further comprising
a shielding electrode layer disposed between the switch circuit
layer and the sensing electrode layer, and including at least one
shielding electrode, the shielding electrode being, configured to
provide shielding effect between the switch circuit layer and the
sensing electrode layer.
15. The fingerprint detection device of claim 14, further
comprising a middle insulating layer disposed between the shielding
electrode layer and the sensing electrode layer.
16. The fingerprint detection device of claim 14, further
comprising a lower insulating layer disposed between the switch
circuit layer and the shielding electrode layer.
17. The fingerprint detection device of claim 1, further comprising
a detecting circuit connected to the sensing electrodes of the
sensing electrode layer through the switch circuit layer, and
configured to select one sensing electrode, and receive a finger
sensing signal from the selected sensing electrode.
18. The fingerprint detection device of claim 17, wherein the
detecting circuit is further configured to orderly or randomly
apply an electrode stimulating signal, which is an alternating
signal, to the selected sensing electrode.
19. The fingerprint detection device of claim 17, wherein the
detecting circuit is further configured to apply a finger
stimulating signal, which is an alternating signal, to a finger of
a target object.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefits of the Taiwan Patent
Application Serial Number 108134981, filed on Sep. 27, 2019, the
subject matter of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
[0002] The present invention relates to a fingerprint detection
device, which is particularly provided with an antistatic
structure, and more particularly, provided with a dissipating
antistatic structure.
2. Description of Related Art
[0003] Nowadays, with the rise of electronic commerce, the
development of remote payment has reached a new milestone. In order
to deal with the remote payment, there is a rapidly increasing
demand for biometric technologies. The fingerprint identification
is considered to be the primary choice among various types of the
biometric technologies, because it satisfies the requirements of
efficiency, security, and non-intrusion. Especially, the capacitive
fingerprint detection has outstanding properties in terms of device
size, manufacturing cost, power saving, reliability, and
anti-counterfeiting.
[0004] However, a capacitive fingerprint detection device typically
faces with a serious problem for its low electrostatic tolerance.
In order to detect the weak electrical signal induced by a finger,
the protective insulation of the capacitive fingerprint detection
device has to be thinner (in comparison with an optical fingerprint
detection device), but a thinner protective insulation does not
have enough ability to protect the capacitive fingerprint detection
device away from being damaged by the electrostatic discharge.
[0005] A shunt structure has been proposed to enhance the
electrostatic protection. However, the electrostatic discharge
always causes an extremely high temperature at a short moment in
the shunt structure. Such extremely high temperature will melt or
gasify the shunt structure itself or the materials around it, or
even cause an explosion, and finally leads to an unrecoverable
damage in the capacitive fingerprint detection device. While, it is
not a good idea to use a thicker shunt structure, because it will
reduce the active sensing areas of the sensing electrodes, and thus
weaken the electrical signal induced by the finger. Consequently,
the electrical signal is too weak and not reliable. It shows that
the known shunt structure is ineffective. It now becomes a common
question in this industry about how to improve the electrostatic
tolerance of the capacitance fingerprint detection device.
[0006] Therefore, it is desirable to provide a novel fingerprint
detection device to obviate or mitigate the aforementioned
problems.
SUMMARY OF THE INVENTION
[0007] The present invention aims to provide a fingerprint
detection device, which has an antistatic structure, and further
has a heat dissipating antistatic structure. It can remain high
efficiency and be manufactured in low cost.
[0008] According to the present invention, the antistatic structure
is designed by disposing a conductive mesh to shunt or drain the
electrostatic charges. The dissipating antistatic structure is
designed by further disposing shunt heat sinks in mesh openings of
the conductive mesh. The shunt heat sinks are chosen with good
thermal conductive property, they appear as floating islands, and
they are located corresponding to the sensing electrodes.
[0009] In one aspect, the shunt heat sinks can provide dual effects
of current division and heat dispassion at the moment when the
electrostatic discharge suddenly happens.
[0010] In another aspect, the shunt heat sinks can provide
shielding effect for the sensing electrodes, to protect the sensing
electrodes away from being damaged by the direct strike of the
electrostatic discharge.
[0011] In still another aspect, a coupling capacitance may be
formed between the floating shunt heat sink in an upper layer and
the corresponding sensing electrode in a lower layer. The coupling
capacitance may be in a form of parasitic capacitance. The coupling
capacitance can couple charge distribution and/or charge change
from the shunt heat sink to the below sensing electrode, so as to
perform fingerprint detection.
[0012] In view of this, according to one aspect of the present
invention, there is provided a fingerprint detection device
including a substrate, a switch circuit layer, a sensing electrode
layer, a heat dissipating antistatic structure layer, and a
protective layer. The switch circuit layer is disposed on the
substrate, and includes a plurality of transistor switches, a
plurality of data lines, and a plurality of control lines. The
sensing electrode layer is disposed on the switch circuit layer,
and includes a plurality of sensing electrodes. The heat
dissipating antistatic structure layer is disposed on the sensing
electrode layer. The heat dissipating antistatic structure layer
includes a conductive mesh and a plurality of shunt heat sinks. The
conductive mesh is formed with a plurality of mesh openings, and
configured to shunt charges. The shunt heat sinks are adjacent to
the conductive mesh, and correspond to the sensing electrodes. The
shunt heat sinks are electrically insulated from each other,
electrically insulated from the conductive mesh, and electrically
insulated from the sensing electrodes. The protective layer is
disposed on the heat dissipating antistatic structure layer.
[0013] Optionally, or preferably, the heat dissipating antistatic
structure layer is divided into an upper sublayer and a lower
sublayer, the conductive mesh is located in the upper sublayer, and
the shunt heat sinks are located in the lower sublayer.
[0014] Optionally, or preferably, each sensing electrode
corresponds to one or more shunt heat sinks, and the shunt heat
sink(s) corresponding to the sensing electrode has a total area
equal to or greater than 625 .mu.m.sup.2.
[0015] Optionally, or preferably, one or more coupling capacitances
are formed between each sensing electrode and the corresponding
shunt heat sink(s), and the coupling capacitance(s) couples charge
distribution and/or charge change of a finger to the sensing
electrode.
[0016] Optionally, or preferably, when being observed along a
normal direction of the substrate, one or more shunt heat sinks are
exactly located in a mesh opening, of the conductive mesh.
[0017] Optionally, or preferably, the mesh opening is defined by a
regional ring of the conductive mesh, and the shunt heat sink(s)
located in the mesh opening has a total area greater than a total
area of the regional ring.
[0018] Optionally, or preferably, each shunt heat sink has a
thermal conductivity equal to or greater than 35
Wm.sup.-1K.sup.-1.
[0019] Optionally, or preferably, each shunt heat sink has a
thermal conductivity equal to or greater than 100 Wm.sup.-1
K.sup.1, and made of molybdenum, silver, copper, gold, aluminum, or
graphite.
[0020] Optionally, or preferably, the conductive mesh is
electrically connected to a ground terminal, a DC reference voltage
terminal, or a metal shell, and made of molybdenum, silver, copper,
gold, aluminum, or graphite.
[0021] Optionally, or preferably, the fingerprint detection device
further includes an upper insulating layer disposed between the
sensing electrode layer and the heat dissipating antistatic
structure layer.
[0022] Optionally, or preferably, the thermal conductivity of each
shunt heat sink is greater than the thermal conductivity of the
upper insulating layer for five times or more.
[0023] Optionally, or preferably, the upper insulating layer
includes a first point-of-evaporation material layer and/or a
second point-of-evaporation material layer.
[0024] Optionally, or preferably, the first point-of-evaporation
material layer is made of silicon nitride compound, and the second
point-of-evaporation material layer is made of curing acrylic
material.
[0025] Optionally, or preferably, the fingerprint detection device
further includes a shielding electrode layer disposed between the
switch circuit layer and the sensing electrode layer, and including
at least one shielding electrode. The shielding electrode is
configured to provide shielding effect between the switch circuit
layer and the sensing electrode layer.
[0026] Optionally, or preferably, the fingerprint detection device
further includes a middle insulating layer disposed between the
shielding electrode layer and the sensing electrode layer.
[0027] Optionally, or preferably, the fingerprint detection device
further includes a lower insulating layer disposed between the
switch circuit layer and the shielding electrode layer.
[0028] Optionally, or preferably, the fingerprint detection device
further includes a detecting circuit connected to the sensing
electrodes of the sensing electrode layer through the switch
circuit layer, and configured to select one sensing electrode, and
receive a finger sensing signal from the selected sensing
electrode.
[0029] Optionally, or preferably, the detecting circuit is further
configured to orderly or randomly apply an alternating electrode
stimulating signal to the selected sensing electrode.
[0030] Optionally, or preferably, the detecting circuit is further
configured to apply an alternating finger stimulating signal to a
finger of a target object.
[0031] Other objects, advantages, and novel features of the present
invention will become more apparent from the following detailed
description when taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIG. 1 shows a structural diagram of the fingerprint
detection device according to one embodiment of the present
invention;
[0033] FIG. 2A shows a structural diagram of the fingerprint
detection device according to another embodiment of the present
invention;
[0034] FIG. 2B shows a structural diagram of the fingerprint
detection device according to still another embodiment of the
present invention;
[0035] FIG. 2C shows a structural diagram of the fingerprint
detection device according to yet still another embodiment of the
present invention;
[0036] FIGS. 3A, 3B, and 3C show three types of the detecting
circuits according to the present invention;
[0037] FIG. 4A shows a schematic diagram illustrating how the
electrostatic discharge causes damage;
[0038] FIG. 4B shows a perspective diagram of the heat dissipating
antistatic structure layer according to one embodiment of the
present invention;
[0039] FIG. 5 shows a planar diagram of the conductive mesh and the
shunt heat sink according to one embodiment of the present
invention;
[0040] FIGS. 6A and 6B show schematic diagrams of coupling
capacitances formed between the shunt heat sinks and the sensing
electrodes; and
[0041] FIG. 7 shows a time-temperature diagram of the electrostatic
discharge.
DETAILED DESCRIPTION OF THE EMBODIMENT
[0042] Different embodiments of the present invention are provided
in the following description. These embodiments are meant to
explain the technical content of the present invention, but not
meant to limit the scope of the present invention. A feature
described in an embodiment may be applied to other embodiments by
suitable modification, substitution, combination, or
separation.
[0043] It should be noted that, in the present specification, when
a component is described to have an element, it means that the
component may have one or more of the elements, and it does not
mean that the component has only one of the element, except
otherwise specified.
[0044] Moreover, in the present specification, the ordinal numbers,
such as "first" or "second", are used to distinguish a plurality of
elements having the same name, and it does not means that there is
essentially a level, a rank, an executing order, or an
manufacturing order among the elements, except otherwise specified.
A "first" element and a "second" element may exist together in the
same component, or alternatively, they may exist in different
components, respectively. The existence of an element described by
a greater ordinal number does not essentially means the existent of
another element described by a smaller ordinal number.
[0045] Moreover, in the present specification, the terms, such as
"top", "bottom", "left", "right", "front", "back", or "middle", as
well as the terms, such as "on", "above", "under", "below", or
"between", are used to describe the relative positions among a
plurality of elements, and the described relative positions may be
interpreted to include their translation, rotation, or
reflection.
[0046] Moreover, in the present specification, when an element is
described to be arranged "on" another element, it does not
essentially means that the elements contact the other element,
except otherwise specified. Such interpretation is applied to other
cases similar to the case of "on".
[0047] Moreover, in the present specification, the terms, such as
"preferably" or "advantageously", are used to describe an optional
or additional element or feature, and in other words, the element
or the feature is not an essential element, and may be ignored.
[0048] Moreover, each component, may be realized as a single
circuit or an integrated circuit in suitable ways, and may include
one or more active elements, such as transistors or logic gates, or
one or more passive elements, such as resistors, capacitors, or
inductors, but not limited thereto. Each component may be connected
to each other in suitable ways, for example, by using one or more
traces to for in series connection or parallel connection,
especially to satisfy the requirements of input terminal and output
terminal. Furthermore, each component may allow transmitting or
receiving input signals or output signals in sequence or in
parallel. The aforementioned configurations may be realized
depending on practical applications.
[0049] Moreover, in the present specification, the terms, such as
"system", "apparatus", "device", "module", or "unit", refer to an
electronic element, or a digital circuit, an analogous circuit, or
other general circuit, composed of a plurality of electronic
elements, and there is not essentially a level or a rank among the
aforementioned terms, except otherwise specified.
[0050] Moreover, in the present specification, two elements may be
electrically connected to each other directly or indirectly, except
otherwise specified. In an indirect connection, one or more
elements, such as resistors, capacitors, or inductors may exist
between the two elements. The electrical connection is used to send
one or more signals, such as DC or AC currents or voltages,
depending, on practical applications.
[0051] FIG. 1 shows a structural diagram of the fingerprint
detection device 1 according to one embodiment of the present
invention.
[0052] As shown in FIG. 1, a basic structure of the fingerprint
detection device 1 of the present invention includes a substrate
10, a switch circuit layer 20, a sensing electrode layer 50, a heat
dissipating antistatic structure layer 60, and a protective layer
70. They are stacked in sequence along a normal direction Z of the
substrate 10. The normal direction Z is perpendicular to a main
surface of the substrate 10.
[0053] FIG. 2A shows a structural diagram of the fingerprint
detection device 1 according to another embodiment of the present
invention.
[0054] The embodiment of FIG. 2A is derived from the embodiment of
FIG. 1. In the embodiment of FIG. 2A, the fingerprint detection
device 1 includes a substrate 10, a switch circuit layer 20, a
shielding electrode layer 40, a sensing electrode layer 50, a heat
dissipating antistatic structure layer 60, and a protective layer
70. They are stacked in sequence along a normal direction Z of the
substrate 10. Two successively mentioned layers may contact each
other, but there may be an additional layer disposed between
them.
[0055] The switch circuit layer 20 may be divided into a thin film
transistor layer 21 and a metal trace layer 22. The thin film
transistor layer 21 and the metal trace layer 22 may be two
different layers arranged in the normal direction Z, or
alternatively, they may be integrated into the same layer. The thin
film transistor layer 21 includes a plurality of transistor
switches 211 (referring to FIG. 3A). The metal trace layer 22 may
include a plurality of data lines and a plurality of control lines.
The data lines are connected to the sensing electrodes 501,
respectively through the transistor switches 211 which are
controlled by the control lines.
[0056] The shielding electrode layer 40 includes at least one
shielding electrode 401 (referring to FIG. 4B). It is possible to
shield the whole or a part of the sensing electrode layer 50 by one
or more the shielding electrodes 401. The shielding electrode 401
is configured to provide shielding effect between the switch
circuit layer 20 and the sensing electrode layer 50, to avoid
interfering with and distorting the signals (especially, the finger
sensing signal SR) carried in the switch circuit layer 20.
[0057] The sensing electrode layer 50 includes a plurality of
sensing electrodes 501 (referring to FIG. 3A). The sensing
electrode 501 is configured to sense charges carried on a finger of
a target object (e.g. a human being).
[0058] FIGS. 3A, 3B, and 3C show three types of the detecting
circuits 90 according to the present invention, used for
self-capacitance sensing, mutual-capacitance sensing, and self and
mutual hybrid capacitance sensing, respectively.
[0059] The fingerprint detection device 1 includes a detecting
circuit 90. The detecting circuit 90 may be disposed in the switch
circuit layer 20, but not limited thereto. In other embodiments,
the detecting circuit 90 may be an external integrated circuit that
is independent from the structure of FIG. 2A, and it is an
important issue about how to ensure the accuracy of the finger
sensing signals, because it requires a longer signal path in this
case.
[0060] As shown in FIGS. 3A, 3B, and 3C, the detecting circuit 90
is connected to the sensing electrodes 501 of the sensing electrode
layer 50 thought circuits (such as transistor switch(s) 211 and/or
amplifier(s) 212) in the switch circuit layer 20, and configured to
select one sensing electrode 501, and receive a finger sensing
signal SR from the selected sensing electrode 501.
[0061] FIG. 3A shows that in the self-capacitance sensing
mechanism, the detecting circuit 90 may further be configured to
orderly (e.g. sequentially) or randomly apply an electrode
stimulating signal ST (which may be an alternating signal) to the
selected sensing electrode 501. In particular, the electrode
stimulating signal ST is transmitted to a specified (or selected)
sensing electrode 501 a finger induces charge distribution or
charge change in the specified sensing electrode 501, and thus
generates the finger sensing signal SR, and then the detecting
circuit 90 receives the finger sensing signal SR from the specified
sensing electrode 501.
[0062] FIG. 3B shows that in the mutual-capacitance sensing
mechanism, the detecting circuit 90 may further be configured to
apply a finger stimulating signal SF (which may be an alternating
signal) to a finger of a target object. In particular, the
fingerprint detection device 1 may include a metal frame 80, and
the finger stimulating signal SF is transmitted to the metal frame
80. When the finger approaches the fingerprint detection device 1,
any part of the finger may contact the metal frame 80, to receive
weak current or charges (safe to living things), so that the finger
may induce a stronger finger sensing signal SR, and thus improve
the accuracy of the finger detection.
[0063] The self and mutual hybrid capacitance sensing mechanism in
FIG. 3C is the combination of the mechanisms of FIGS. 3A and
3B.
[0064] FIG. 4A shows a schematic diagram illustrating how the
electrostatic discharge causes damage.
[0065] As shown in FIG. 4A, a finger approaching the sensing
electrode may carry excessive charges, and the excessive charges
may jump into the fingerprint detection device and damage its
internal components. In order to drain the charges jumping into the
fingerprint detection device, the conductive mesh is introduced in
the fingerprint detection device. The conductive mesh is typically
formed of thinner metal stripes to avoid interfering with the
sensing electrodes. However, the conductive mesh formed of the
thinner metal stripes has greater resistance that is difficult to
drain the charges, and therefore, when facing with the
electrostatic discharge, the accumulated charges cause an extremely
high temperature (e.g. over ten thousand degrees centigrade) in a
short moment. Such extremely high temperature will melt, or even
gasify the whole conductive mesh and/or the materials around
it.
[0066] FIG. 4B shows a perspective diagram of the heat dissipating
antistatic structure layer 60 according to one embodiment of the
present invention.
[0067] The heat dissipating antistatic structure layer 60 includes
a conductive mesh 61 and a plurality of shunt heat sinks 62. The
shunt heat sinks 62 are adjacent to the conductive mesh 61. In this
embodiment, the conductive mesh 61 and the shunt heat sinks 62 are
arranged in the same layer in the normal direction Z.
[0068] As shown in FIGS. 4A and 4B, the conductive mesh 61 is
electrically connected to a ground terminal, or alternatively, the
conductive mesh 61 may be electrically connected to a DC reference
voltage terminal or a metal shell, so as to drain the charges. The
conductive mesh 61 has a resistance Rgd. The charges drain from the
conductive mesh 61 to the ground terminal as a current Igd. The
conductive mesh 61 may be made of molybdenum, silver, copper, gold,
aluminum, or graphite, for example.
[0069] FIG. 5 shows a planar diagram of the conductive mesh 61 and
the shunt heat sink 62 according to one embodiment of the present
invention, observed along the normal direction Z of the substrate
10.
[0070] As shown in FIG. 5, the conductive mesh 61 is formed with a
plurality of mesh openings 610. A mesh opening 610 is defined by a
regional ring 611 of the conductive mesh 61. The regional ring 611
surrounding and defining the mesh opening 610 includes a first
strip, a second strip, a third strip, and a fourth strip, having a
first area Agd1, second area Agd2, a third area Agd3, and a fourth
area Agd4, respectively.
[0071] Preferably, according to the present invention, the one or
more shunt heat sinks 62 in a mesh opening 610 have a total area
Ahs, and the total area Ahs is greater than a total area of the
regional ring 611 surrounding and defining the mesh opening 610,
that is, Ahs>Agd1+Agd2+Agd3+Agd4.
[0072] FIGS. 6A and 6B show schematic diagrams of coupling
capacitances formed between the shunt heat sinks 62 and the sensing
electrodes 501.
[0073] Referring to FIGS. 5, 6A, and 6B, the sensing electrodes 501
of the sensing electrode layer 50 and the mesh openings 610 of the
conductive mesh 61 may be one-to-one corresponding or one-to-many
corresponding, and they may be orderly aligned with each other when
being observed along the normal direction Z, for example.
Meanwhile, the shunt heat sinks 62 correspond to the sensing
electrodes 501. One sensing electrode 501 may correspond to one or
more shunt heat sinks 62. The shunt heat sink(s) 62 are located in
the mesh opening(s) 610, respectively. In particular, one or more
shunt heat sinks 62 may exist in one mesh opening 610.
[0074] The shunt heat sinks 62 are electrically insulated from each
other, electrically insulated from the conductive mesh 61, and
electrically insulated from the sensing electrodes 501. Therefore,
each shunt heat sink 62 appears as a floating island.
[0075] In one aspect, the shunt heat sinks 62 can greatly improve
heat dissipating effect. In order to achieve good heat dissipating
effect, the shunt heat sink 62 is chosen to have a thermal
conductivity equal to or greater than 35 Wm.sup.-1K.sup.-1.
Preferably, the shunt heat sink 62 may have a thermal conductivity
equal to or greater than 100 Wm.sup.-1K.sup.-1. The shunt heat sink
62 may be made of molybdenum, silver, copper, gold, aluminum, or
graphite, for example, and thus they are electrically conductive,
to facilitate the shunt or drain of the charges. The current
induced in the fingerprint detection device 1 by the electrostatic
discharge will dramatically increase the temperature around a
certain component (such as the conductive mesh 61 or the sensing
electrode layer 50), and may damage the certain component or the
materials around it. For this, the aforementioned thermal
conductivity of the shunt heat sink 62 is chosen to ensure heat
dissipating efficiency.
[0076] It should be noted that, the floating state of the shunt
heat sink 62 may be changed in different conditions. In the normal
conditions, the shunt heat sink(s) 62 is in the floating state, so
they do not affect the finger detection. However, when the
electrostatic discharge occurs, the electrostatic discharge will
cause an extremely high temperature that induces electron
ionization in the fingerprint detection device 1, and the shunt
heat sink(s) 62 turns to having ability to shunt or drain the
charges, even if they are arranged as isolated islands. In other
word, the shunt heat sink(s) may be regarded to be conductive in
the extremely high temperature.
[0077] In another aspect, the shunt heat sink 62 can provide
shielding effect for the sensing electrode 501, to protect the
sensing electrode 501 away from being damaged by the direct strike
of the electrostatic discharge.
[0078] In still another aspect, one or more coupling capacitances
may be formed between each sensing electrode 501 and the
corresponding shunt heat sink(s) 62, and the coupling capacitances
couple charge distribution and/or charge change in the shunt heat
sink 62 induced by a finger to the sensing electrode 501, so as to
perform fingerprint detection.
[0079] FIG. 6A shows that each sensing electrode 501 corresponds to
one shunt heat sink 62, and thus one coupling capacitance, e.g.
C11, is formed between them. FIG. 6B shows that each sensing
electrode 501 corresponds to a plurality of (e.g. four) shunt heat
sinks 62, and thus a plurality of (e.g. four) coupling capacitance,
e.g. C111, C112, C113, and C114 are formed between them.
[0080] Preferably, according to the present invention, one or more
shunt heat sinks 62 corresponding to one sensing electrode 501 have
a total area Ahs equal to or greater than 625 .mu.m.sup.2.
[0081] Referring back to FIG. 2A, the protective layer 70 is used
to protect other layers away from physical impact or chemical
corrosion. In this embodiment, the protective layer 70 may further
be divided into a silicon nitride compound layer 71 and a printing
coating layer 72.
[0082] Preferably, a lower insulating layer 31 may be disposed
between the switch circuit layer 20 and the shielding electrode
layer 40. Preferably, a middle insulating layer 32 may be disposed
between the shielding electrode layer 40 and the sensing electrode
layer 50. The lower insulating layer 31 or the middle insulating
layer 32 may be a second point-of-evaporation (POE) material layer,
and made of curing acrylic material, for example.
[0083] Preferably, an upper insulating layer 33 may be disposed
between the sensing electrode layer 50 and the heat dissipating
antistatic structure layer 60. In this embodiment, the upper
insulating layer 33 may further include a first
point-of-evaporation material layer 331 and/or a second
point-of-evaporation material layer 332, wherein the first
point-of-evaporation material layer 331 may be made of silicon
nitride compound, for example, and the second point-of-evaporation
material layer 332 may be made of curing acrylic material, for
example. The shunt heat sink 62 is chosen to have a thermal
conductivity greater than the thermal conductivity the upper
insulating layer 33 for at least five times.
[0084] FIG. 2B shows a structural diagram of the fingerprint
detection device 1 according to still another embodiment of the
present invention.
[0085] The embodiment of FIG. 2B is derived from the embodiments of
FIGS. 1 and 2A. The embodiment of FIG. 2B is different from the
embodiment of FIG. 2A in that: the upper insulating layer 33 only
includes a first point-of-evaporation material layer, made of
silicon nitride compound, for example.
[0086] FIG. 2C shows a structural diagram of the fingerprint
detection device 1 according to yet still another embodiment of the
present invention.
[0087] The embodiment of FIG. 2C is derived from the embodiments of
FIGS. 1 and 2B. The embodiment of FIG. 2C is different from the
embodiment of FIG. 2B in that: the heat dissipating antistatic
structure layer 60 is divided into an upper sublayer and a lower
sublayer, the conductive mesh 61 is located in the upper sublayer,
and the shunt heat sinks 62 is located in the lower sublayer.
However, when being observed along the normal direction Z of the
substrate 10, one or more shunt heat sinks 62 are still located in
a mesh opening 610, and thus their have the same appearance as
shown in FIG. 5.
[0088] In addition, an intermediary insulating layer 34 may be
disposed between the upper sublayer (i.e. wherein the conductive
mesh 61 is located) and the lower sublayer (i.e. wherein the shunt
heat sinks 62 are located). The intermediary insulating layer 34
includes a first point-of-evaporation material layer, made of
silicon nitride compound, for example.
[0089] FIG. 7 shows a time-temperature diagram of the electrostatic
discharge.
[0090] In the observation of the structures of FIGS. 2A, 2B, and
2C, the first point-of-evaporation material layer is preferably
disposed close to (e.g. directly contact) the heat dissipating
antistatic structure layer 60 (e.g. below it or between the
sublayers composing it); while, the second point-of-evaporation
material layer may be disposed in other places. Referring to FIGS.
4A, 4B, and 7, the evaporation temperature of the conductive mesh
62 is greater than the evaporation temperature of the first
point-of-evaporation material layer, and the evaporation
temperature of the first point-of-evaporation material layer is
greater than the evaporation temperature of the second
point-of-evaporation material layer.
[0091] The curve (a) is the temperature function measured around
the conductive mesh (i.e. the electrostatic discharging point) in
the structure of FIG. 4A (without the shunt heat sink(s) 62 of the
present invention) at the moment when encountering an impact of the
electrostatic discharge. At the moment, the temperature of the
conductive mesh dramatically increases beyond the evaporation
temperature of the first point-of-evaporation material and the
evaporation temperature of the second point-of-evaporation
material, even beyond the evaporation temperature of the conductive
mesh. In this case, the electrostatic discharge causes an
unrecoverable damage around the electrostatic discharging
point.
[0092] The curve (b) is the temperature function measured around
the conductive mesh 61 (i.e. the electrostatic discharging point)
in the structure of FIG. 4B (with the shunt heat sink(s) 62 of the
present invention) at the moment when encountering an impact of the
electrostatic discharge. In this case, thanks to the good effects
of current shunt and heat dissipation provided by the shunt heat
sink(s) 62, the increasing temperature remains below the
evaporation temperature of the second point-of-evaporation material
layer, and therefore, the impact of the electrostatic discharge
does not cause damage.
[0093] Although the present invention has been explained in
relation to its preferred embodiment, it is to be understood that
many other possible modifications and variations can be made
without departing from the spirit and scope of the present
invention as hereinafter claimed.
* * * * *