U.S. patent application number 16/991007 was filed with the patent office on 2021-03-18 for electronic device and method of performing fingerprint recognition using electronic device.
The applicant listed for this patent is InnoLux Corporation. Invention is credited to Nai-Fang Hsu, Kuan-Feng Lee, CHANDRA LIUS.
Application Number | 20210081638 16/991007 |
Document ID | / |
Family ID | 1000005058868 |
Filed Date | 2021-03-18 |
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United States Patent
Application |
20210081638 |
Kind Code |
A1 |
LIUS; CHANDRA ; et
al. |
March 18, 2021 |
ELECTRONIC DEVICE AND METHOD OF PERFORMING FINGERPRINT RECOGNITION
USING ELECTRONIC DEVICE
Abstract
An electronic device viewable from a viewing side is disclosed.
The electronic device includes a first substrate, a second
substrate, a display unit, a sensor unit and a first light blocking
layer. The second substrate is disposed between the first substrate
and a viewing side of the electronic device. The display unit is
disposed between the first substrate and the second substrate. The
sensor unit is disposed on the second substrate. The first light
blocking layer is disposed between the sensor unit and the viewing
side.
Inventors: |
LIUS; CHANDRA; (Miao-Li
County, TW) ; Lee; Kuan-Feng; (Miao-Li County,
TW) ; Hsu; Nai-Fang; (Miao-Li County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
InnoLux Corporation |
Miao-Li County |
|
TW |
|
|
Family ID: |
1000005058868 |
Appl. No.: |
16/991007 |
Filed: |
August 11, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G02F 1/133512 20130101;
G06K 9/0004 20130101; G02F 1/13338 20130101 |
International
Class: |
G06K 9/00 20060101
G06K009/00; G02F 1/1333 20060101 G02F001/1333; G02F 1/1335 20060101
G02F001/1335 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 12, 2019 |
CN |
201910863636.1 |
Claims
1. An electronic device viewable from a viewing side, comprising: a
first substrate; a second substrate disposed between the first
substrate and the viewing side; a display unit disposed between the
first substrate and the second substrate; a sensor unit disposed on
the second substrate; and a first light blocking layer disposed
between the sensor unit and the viewing side.
2. The electronic device according to claim 1, wherein the sensor
unit is disposed between the second substrate and the display
unit.
3. The electronic device according to claim 2, wherein the first
light blocking layer is disposed between the second substrate and
the sensor unit.
4. The electronic device according to claim 2, wherein the first
light blocking layer is disposed between the second substrate and
the viewing side.
5. The electronic device according to claim 1, wherein the sensor
unit is disposed between the viewing side and the second
substrate.
6. The electronic device according to claim 1, further comprising a
second light blocking layer disposed between the sensor unit and
the display unit.
7. The electronic device according to claim 6, wherein the first
light blocking layer and the second light blocking layer have
different material.
8. The electronic device according to claim 1, wherein the first
light blocking layer comprises an opening overlapping the sensor
unit in a top direction of the electronic device.
9. The electronic device according to claim 1, wherein the sensor
unit comprising a metal layer adjacent to the display unit and the
metal layer is opaque.
Description
BACKGROUND OF THE DISCLOSURE
1. Field of the Disclosure
[0001] The present disclosure relates to an electronic device and a
method of performing fingerprint recognition using an electronic
device, and more particularly to an electronic device capable of
improving the signal to noise ratio and a related fingerprint
recognition method.
2. Description of the Prior Art
[0002] In recent years, with the progress of technology,
information products may have fingerprint recognition function to
protect the user data. However, ambient light and light generated
by information products themselves may affect the accuracy of
fingerprint recognition, so how to improve the performance of
fingerprint recognition is still an issue that needs continuous
efforts in the industry.
SUMMARY OF THE DISCLOSURE
[0003] One of the objects of the present disclosure is to provide
an electronic device and a method of performing fingerprint
recognition. Since the electronic device includes a light blocking
layer, the light noise entering a sensor unit can be reduced, and
the signal to noise ratio can be further increased, thereby
improving the performance of fingerprint recognition.
[0004] An embodiment of the present disclosure provides an
electronic device, which is viewable from a viewing side. The
electronic device of the present disclosure includes a first
substrate, a second substrate, a display unit, a sensor unit and a
first light blocking layer. The second substrate is disposed
between the first substrate and the viewing side. The display unit
is disposed between the first substrate and the second substrate.
The sensor unit is disposed on the second substrate. The first
light blocking layer is disposed between the sensor unit and the
viewing side.
[0005] An embodiment of the present disclosure provides a method of
performing fingerprint recognition by using an electronic device,
comprising: providing an electronic device, wherein the electronic
device comprises a sensor unit, a light emitting unit and a signal
processing unit; starting a fingerprint recognition mode; enabling
the light emitting unit to produce a light with intermittent
intensity; the sensor unit sending a light sensing signal that is
sensed to the signal processing unit; and the signal processing
unit distinguishing an intermittent signal from the light sensing
signal and converting the intermittent signal into a fingerprint
recognition data.
[0006] These and other objectives of the present disclosure will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the embodiment that
is illustrated in the various figures and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a schematic cross-sectional view of a first
embodiment of an electronic device according to the present
disclosure.
[0008] FIG. 2 is a schematic top-view of a first substrate of the
electronic device shown in FIG. 1.
[0009] FIG. 3 is a schematic top-view of a second substrate of the
electronic device shown in FIG. 1.
[0010] FIG. 4 is an enlarged partial cross-sectional view of the
electronic device shown in FIG. 1.
[0011] FIG. 5 is an enlarged partial cross-sectional view of a
second embodiment and a variant embodiment of an electronic device
according to the present disclosure.
[0012] FIG. 6 is an enlarged partial cross-sectional view of a
third embodiment and a variant embodiment of an electronic device
according to the present disclosure.
[0013] FIG. 7 is an enlarged partial cross-sectional view
enlargement schematic diagram of a fourth embodiment and variant
embodiments of an electronic device according to the present
disclosure.
[0014] FIG. 8 is an enlarged partial cross-sectional view of a
fifth embodiment of an electronic device according to the present
disclosure.
[0015] FIG. 9 is an enlarged partial cross-sectional view of a
variant embodiment of the fifth embodiment of an electronic device
according to the present disclosure.
[0016] FIG. 10 is an enlarged partial cross-sectional view of a
sixth embodiment and variant embodiments of an electronic device
according to the present disclosure.
[0017] FIG. 11 is an enlarged partial cross-sectional view of a
seventh embodiment of an electronic device according to the present
disclosure.
[0018] FIG. 12 is an enlarged partial cross-sectional view of a
first variant embodiment of the seventh embodiment of an electronic
device according to the present disclosure.
[0019] FIG. 13 is an enlarged partial cross-sectional view of a
second variant embodiment of the seventh embodiment of an
electronic device according to the present disclosure.
[0020] FIG. 14 is an enlarged partial cross-sectional view of a
third variant embodiment of the seventh embodiment of an electronic
device according to the present disclosure.
[0021] FIG. 15 is an enlarged partial cross-sectional view of a
fourth variant embodiment of the seventh embodiment of an
electronic device according to the present disclosure.
[0022] FIG. 16 is an enlarged partial cross-sectional view of a
fifth variant embodiment of the seventh embodiment of an electronic
device according to the present disclosure.
[0023] FIG. 17 is an enlarged partial cross-sectional view of an
eighth embodiment of an electronic device according to the present
disclosure.
[0024] FIG. 18 is an enlarged partial cross-sectional view of a
variant embodiment of the eighth embodiment of an electronic device
according to the present disclosure.
[0025] FIG. 19 is an enlarged partial cross-sectional view of a
ninth embodiment of an electronic device according to the present
disclosure.
[0026] FIG. 20 is a schematic diagram of the signal according to an
embodiment of a method of performing fingerprint recognition of an
electronic device according to the present disclosure.
[0027] FIG. 21 is an exterior schematic diagram of an embodiment of
an electronic device according to the present disclosure.
[0028] FIG. 22 is a flowchart according to an embodiment of
performing fingerprint recognition of an electronic device
according to the present disclosure.
DETAILED DESCRIPTION
[0029] The present disclosure may be understood by reference to the
following detailed description, taken in conjunction with the
drawings as described below. It is noted that, for purposes of
illustrative clarity and being easily understood by the readers,
various drawings of this disclosure show only a portion of the
device, and certain components in drawings may not be drawn to
scale. In addition, the number and dimension of each component
shown in drawings are only illustrative and are not intended to
limit the scope of the present disclosure.
[0030] Certain terms are used throughout the description and
following claims to refer to particular components. As one skilled
in the art will understand, electronic equipment manufacturers may
refer to a component by different names. This document does not
intend to distinguish between components that differ in name but
not function. In the following description and in the claims, the
terms "include" and "comprise" are used in an open-ended fashion,
and thus should be interpreted to mean "include, but not limited to
. . . ". When the terms "include", "comprise" and/or "have" are
used in the description of the present disclosure, the
corresponding features, areas, steps, operations and/or components
would be pointed to existence, but not limited to the existence or
increase of one or a plurality of the corresponding or other
features, areas, steps, operations, components and/or combinations
thereof. When the corresponding component or layer is referred to
as being "on" or "connected to" another component or layer, it may
be directly on or directly connected to the other component or
layer, or intervening components or layers may be presented. In
contrast, when the corresponding component or layer is referred to
as being "directly on" or "directly connected to" another component
or layer, there are no intervening components or layers
presented.
[0031] Although the terms such as "first", "second", "third" and so
on is used to describe or may be used to describe or name different
members, such members are not limited to these terms. These terms
are used to distinguish one member from other members in the
description and are not related to the manufacturing sequence of
such members. The same terms may not be used in the claims, and
"first", "second", "third" and so on may be substituted according
to the claiming sequence of the members in the claims. Accordingly,
in the following description, the first member may be a second
member in the claims.
[0032] It should be noted that the technical features in different
embodiments described in the following can be replaced, recombined,
or mixed with one another to constitute another embodiment without
departing from the spirit of the present disclosure.
[0033] Please refer to FIG. 1 to FIG. 4. FIG. 1 is a schematic
cross-sectional view of a first embodiment of an electronic device
according to the present disclosure. FIG. 2 is a schematic top-view
of a first substrate of the electronic device shown in FIG. 1. FIG.
3 is a schematic top-view of a second substrate of the electronic
device shown in FIG. 1. FIG. 4 is an enlarged partial
cross-sectional view of the electronic device shown in FIG. 1, and
shows the cross-sectional structures along line A-A' and line B-B'
in FIG. 2 and FIG. 3. As shown in FIG. 1, an electronic device 100
of a first embodiment of the present disclosure is viewable from a
viewing side 200, that is, a surface of the electronic device 100
closest to the viewing side 200 can be regarded as a display
surface 100d (a top surface of the electronic device 100 in FIG. 1)
of the electronic device 100, and an user USR may view the display
surface 100d of the electronic device 100 from the viewing side 200
to enjoy images or pictures displayed by the electronic device 100.
A direction DZ represents a direction that the display surface 100d
faces the user USR. It should be noted that, in FIG. 1, the display
surface 100d is at the side of the electronic device 100 closest to
the user USR. A person skilled in the art may easily understand
that the display surface 100d may face different directions
depending on the installation position or application environment
of the electronic device 100.
[0034] The electronic device 100 includes a first substrate SUB1, a
second substrate SUB2, a display unit DPU and a sensor unit SSU.
The second substrate SUB2 is disposed between the first substrate
SUB1 and the viewing side 200, and the display unit DPU is disposed
between the first substrate SUB1 and the second substrate SUB2, for
example, formed on an upper surface SUB11 of the first substrate
SUB1. The display unit DPU may be used to control a display media
layer DML. It should be noted that, although FIG. 1 shows the
display unit DPU in one layer, the display unit DPU may include
(but is not limited to) a plurality of layers, a plurality of
switch elements and a plurality of traces, and these switch
elements and traces may be respectively disposed in different
layers of the display unit DPU.
[0035] The sensor unit SSU is disposed between the first substrate
SUB1 and the second substrate SUB2. In some embodiments, the sensor
unit SSU may be disposed on the second substrate SUB2, that is, the
sensor unit SSU is disposed on a surface of the second substrate
SUB2 or at a position that is close to the surface of the second
substrate SUB2, for example, disposed on a lower surface SUB21 of
the second substrate SUB2, as shown in FIG. 1. In other
embodiments, the sensor unit SSU may be disposed on an upper
surface SUB22 of the second substrate SUB2. It should be noted
that, although FIG. 1 shows the sensor unit SSU in one layer, the
sensor unit SSU may include (but is not limited to) a plurality of
layers, a plurality of sensing elements, driving elements and/or
reading elements, and these elements may be respectively disposed
in different layers.
[0036] Furthermore, the electronic device 100 further includes a
first light blocking layer LB1 disposed between the sensor unit SSU
and the viewing side 200, and the first light blocking layer LB1
may be disposed on the surface of the second substrate SUB2, for
example, disposed on the lower surface SUB21 of the second
substrate SUB2, as shown in FIG. 1. In other variant embodiments,
the first light blocking layer LB1 may be disposed on the upper
surface SUB22 of the second substrate SUB2, that is to say, the
second substrate SUB2 is between the first light blocking layer LB1
and the sensor unit SSU, but not limited thereto.
[0037] As an example, the electronic device 100 shown in FIG. 1
includes a liquid crystal display device, which may include a light
emitting unit, a backlight module BLU and a display media layer
DML. The backlight module BLU is on a side of the first substrate
SUB that is opposite to the side that second substrate exists, that
is, the first substrate SUB1 is between the second substrate SUB2
and the backlight module BLU. In FIG. 1, the backlight module BLU
is adjacent to a lower surface SUB12 of the first substrate SUB1.
In the electronic device shown in FIG. 1, the display media layer
DML may be a liquid crystal layer, but not limited thereto. In some
embodiments, the display media layer DML may include an organic
light emitting diode (OLED), a light emitting diode (LED), such as
a micro light-emitting diode (micro LED) or a mini light-emitting
diode (mini LED), a quantum dot light-emitting diode (QLED/QDLED),
plasma, quantum dots, fluorescent materials, phosphorescent
materials, other suitable materials or combinations of the
above-mentioned materials, but not limited thereto. It should be
noted that, when the display media layer DML of the electronic
device 100 is self-light emitting materials, the backlight module
BLU may be omitted.
[0038] The electronic device 100 of the present disclosure may
include a display device, a tiled device, a light emitting device,
a sensing device, an antenna device, other appropriate devices or
combinations of the above-described devices, but not limited
thereto. The tiled device may be, for example, a device tiled by a
plurality of displays or tiled by a display and other devices such
as antenna device and sensing device, but not limited thereto. When
the electronic device 100 is not a display, the display unit DPU
may be replaced with a circuit array unit, and the display media
layer DML may be omitted. Furthermore, the electronic device 100 of
the present disclosure may be a curved-surface electronic device or
a bendable electronic device, among which the bendable electronic
device refers to an electronic device that may be curved, bent,
folded, stretched, flexed or other similarly transformed. In other
words, when operating, the electronic device may have a curved
surface or present a bending state, and the electronic device may
have a fixed curved surface shape or have different bending states
according to the using requirements. According to different
applications, the first substrate SUB1 and the second substrate
SUB2 of the electronic device 100 may include corresponding
materials, such as a hard substrate or a soft and flexible
substrate. The hard substrate may be, for example, a glass
substrate, a quartz substrate or a sapphire substrate, and the soft
and flexible substrate may be, for example, a polyimide (PI)
substrate, a polycarbonate (PC) substrate or a polyethylene
terephthalate (PET) substrate, but not limited thereto.
[0039] Please refer to FIG. 2 and FIG. 4, among which the backlight
module BLU is omitted in FIG. 4. The display unit DPU may be
disposed on the surface SUB11 of the first substrate SUB1, and the
display unit DPU may include a plurality of data lines DL and a
plurality of scan lines SL. The data lines DL may extend along the
direction DY, the scan lines SL may extend along the direction DX,
and the extending directions of the data lines DL and the scan
lines SL are different. The data lines DL and the scan lines SL may
be intersected with each other and may generally define a plurality
of sub-pixels 102 (such as the regions between the data lines DL
and the scan lines SL). The sub-pixels 102 may respectively have a
corresponding switch element TFT electrically connected to a
corresponding data line DL, a corresponding scan line SL and a
corresponding pixel electrode PXE (illustrated in FIG. 4) to
control the states of the sub-pixels 102.
[0040] Please refer to FIG. 4. In the present disclosure, the
switch element TFT may be a thin-film transistor 162 for example.
The thin-film transistor 162 may include a gate 162G, a source
162S, a drain 162D, a semiconductor layer 162C and a gate
insulating layer 154. The gate 162G may be electrically connected
to the scan line SL, the source 162S may be electrically connected
to the data line DL, and the drain 162D may be electrically
connected to the pixel electrode PXE. The semiconductor layer 162C
may include low temperature poly silicon (LTPS) materials, metal
oxide materials or other suitable semiconductor materials.
Different thin-film transistors 162 may include semiconductor
layers 162C of different materials, but not limited thereto. The
gate 162G and the scan line SL may be formed by a first metal
layer, the source 162S, the drain 162D and the data line DL may be
formed by a second metal layer, and the pixel electrode PXE may
include a first transparent conductive layer. A common electrode
COE may be disposed on the pixel electrode PXE. The pixel electrode
PXE and the common electrode COE may be insulated by an insulating
layer 160, and the common electrode COE may include a second
transparent conductive layer. A light shielding layer 164 may be
further disposed on the upper surface SUB11 of the first substrate
SUB1, and the light shielding layer 164 is between the
semiconductor layer 162C and the first substrate SUB1. The light
shielding layer 164 includes opaque materials, such as metals, but
not limited thereto. The display unit may further include a first
buffer layer 150, a second buffer layer 152, an insulating layer
156 and an insulating layer 158. The first buffer layer 150 may be
disposed between the light shielding layer 164 and the first
substrate SUB1, and the second buffer layer 152 may be disposed
between the light shielding layer 164 and the semiconductor layer
162C. The insulating layer 156 and the insulating layer 158 covers
the gate 162G, and the insulating layer 158 may be between the
pixel electrode PXE and the source 162S. It should be noted that,
the display unit DPU may further include other elements or
conducting wires, not limited to the content shown in FIG. 4. In
addition, the structure illustrated in FIG. 2 to FIG. 4 is an
example, and the structure of the electronic device of the present
disclosure is not limited thereto.
[0041] Please refer to FIG. 3 and FIG. 4. The first blocking layer
LB1 and the sensor unit SSU may be disposed on the surface of the
second substrate SUB2. The sensor unit SSU is disposed between the
second substrate SUB2 and the display unit DPU, and the sensor unit
SSU may include a plurality of sensing elements SSE. The plurality
of sensing elements SSE may respectively include a driving
transistor 106, a reading transistor 108 and a sensor 110, but not
limited thereto. For example, the reading transistor 108 may
include a gate 108G, a source 108S, a drain 108D, a semiconductor
layer 108C and a gate insulating layer 124. The driving transistor
106 may include a similar structure, the film materials of the
driving transistor 106 may refer to the thin-film transistor 162
described above, and are not redundantly described herein. It
should be noted that, the position of the driving transistor 106 or
the reading transistor 108 may not necessarily correspond to the
position of the switch element TFT of the sub-pixel. In FIG. 4, it
shows the sensor unit SSU may include a metal layer adjacent to the
display unit DPU and the metal layer is opaque. To be more
specific, The sensor 110 may be, for example, a PIN semiconductor
sensor, including an upper electrode 1101, a semiconductor layer
1102 and a lower electrode 1103 adjacent to the display unit DPU
for example. The semiconductor layer 1102 may include N-type
semiconductor layer, an intrinsic semiconductor layer or a P-type
semiconductor layer, and the upper electrode 1101 and the lower
electrode 1103 may include a transparent conductive layer and/or an
opaque conductive layer, such as metals, but the structure and the
material of the sensor 110 of the present disclosure are not
limited to those described above. In some embodiments, the upper
electrode 1101 may be electrically connected to the reading
transistor 108, and the lower electrode 1103 may be electrically
connected to a bias line 132. The first light blocking layer LB1
may be disposed on the lower surface SUB21 of the second substrate
SUB2, that is, disposed between the second substrate SUB2 and the
sensor unit SSU. In a top view of the electronic device 100, the
first light blocking layer LB1 covers at least one portion of the
sensing element SSE. That is to say, in the direction DZ, the first
blocking layer LB1 at least partially overlaps the sensor 110, the
reading transistor 108 and/or the driving transistor 106. In some
embodiments, the direction DZ may be a normal direction of the
second substrate SUB2. The first light blocking layer LB1 may
include a dark film which is organic or inorganic, such as an
organic pigment layer or a metal layer, for example, a black matrix
(BM) layer. In the direction DZ, the first light blocking layer LB1
blocks the elements of the sensing element SSE, and it is not easy
to find the sensing element SSE from the viewing side 200, and also
the reflected light on the surface of the display surface 100d is
reduced, such that the electronic device 100 may have better visual
effects on the display surface 100d. On the other hand, the
material of the first light blocking layer LB1 may block more than
70% amount of visible light, and the total amount of ambient light
entering the sensor 110 may be reduced, thereby reducing the
generated background noise, improving the signal to noise ratio
(S/N ratio) and/or improving the sensing accuracy. In some
embodiments, the electronic device 100 may further include a second
light blocking layer LB2 disposed between the sensor unit SSU and
the display media layer DML. In some embodiments, the second light
blocking layer LB2 is disposed between the sensor unit SSU and the
display unit DPU. In some embodiments, the second light blocking
layer LB2 may surround the periphery of the sensor, for example,
covering a sidewall, a bottom surface and/or the bias line 132 of
the sensor 110. The second light blocking layer LB2 may reduce the
noise caused by the direct or scattered light entering the sensor
110 from the lateral side or the back side (e.g., the light emitted
from the backlight module BLU or the light reflected from nearby
sub-pixels), and the sensing accuracy may be improved. The material
of the second light blocking layer LB2 may be the same as or
different from the material of the first light blocking layer LB1,
not redundantly described herein. The lower surface SUB21 of the
second substrate SUB2 may be selectively disposed with an
insulating layer 120, a buffer layer 122, an insulating layer 126,
a protective layer 128 and a planarization layer 130. The
insulating layer 120 and the planarization layer 130 may include
overcoating layer materials, for example, including organic
materials. The planarization layer 130 covers the lower surface
SUB21 of the second substrate SUB2, that is, covering the sensor
110 and the second light blocking layer LB2. The protective layer
128 may be used as a passivation layer. Each of the above layers
may respectively include an organic or inorganic insulating
material, such as an oxide layer or a nitride layer, but not
limited thereto. The sensor unit SSU may be used to perform
fingerprint recognition. When the user's finger touches or
approaches the display surface 100d, light may be reflected by the
finger. After the reflected light enters the sensor 110,
photoelectric signals may be generated, and fingerprint recognition
data may be obtained after processing and analyzing the fingerprint
recognition data by the processing unit. It should be noted that,
although the present disclosure takes fingerprint recognition as an
example, the function of the sensor unit SSU is not limited to the
fingerprint recognition.
[0042] A light converting layer may be disposed on the surface
SUB21 of the second substrate SUB2, and the light converting layer
may include a plurality of light converting elements 104 disposed
in the openings of the patterned first light blocking layer LB1.
When the electronic device 100 includes a liquid crystal display
panel, the light converting elements 104 may be respectively a
color light filtering layer. In FIG. 3, the symbols "R", "G" and
"B" respectively represent a red light filtering layer, a green
light filtering layer and a blue light filtering layer. The red
light filtering layer, the green light filtering layer and the blue
light filtering layer are adjacently and alternately disposed in a
sequence and respectively correspond to a sub-pixel 102, and three
of the sub-pixels 102 may be a group to form a pixel. However, the
colors of the color light filtering layers are not limited to those
described above. In addition, the number of the sub-pixels that
forms the pixel is not limited to three, and the arrangement of the
sub-pixels 102 is not limited to that shown in FIG. 3. Furthermore,
although FIG. 3 shows that a sensing element SSE may be disposed
beside a pixel, the number of pixels corresponding to one sensing
element SSE is not limited in the present disclosure. In other
words, in some embodiments, it may be designed that not each pixel
is arranged with a sensing element SSE.
[0043] The electronic device of the present disclosure is not
limited by the aforementioned embodiments. Other different
embodiments or variant embodiments of the present disclosure will
be disclosed in the following description. However, for simplifying
the description and clearly showing the difference between various
embodiments or variant embodiments, the identical components in the
following description are marked with identical symbols, and the
repeated parts will not be redundantly described. In addition, the
material and thickness of each film or layer and conditions of
related fabrication process in the following embodiments of the
present disclosure may refer to the first embodiment, which will
not be redundantly described.
[0044] Please refer to FIG. 5. FIG. 5 is an enlarged partial
cross-sectional view of a second embodiment and a variant
embodiment of an electronic device according to the present
disclosure. FIG. 5 mainly illustrates the arrangement of the second
substrate SUB2, the first light blocking layer LB1 and the sensor
unit SSU, and most of the other layers are omitted, wherein the
arrangement of the other layers may refer to FIG. 4. The following
FIG. 6 to FIG. 9 have similar omission, not redundantly described
hereinafter. The example (I) of FIG. 5 illustrates that a first
light blocking layer LB1 may be disposed on the upper surface SUB22
of the second substrate SUB2, and the sensor unit SSU may be
disposed on the lower surface SUB21 of the second substrate SUB2.
In other words, the second substrate SUB2 is disposed between the
sensor unit SSU and the first light blocking layer LB1, that is,
the first light blocking layer LB1 is disposed between the second
substrate SUB2 and the viewing side 200, and the sensor unit SSU is
disposed between the viewing side 200 and the second substrate
SUB2. The example (II) of FIG. 5 illustrates that the first light
blocking layer LB1 and the sensor unit SSU are both disposed on the
upper surface SUB22 of the second substrate SUB2, and the sensor
unit SSU is between the first light blocking layer LB1 and the
second substrate SUB2. In the embodiments shown in FIG. 5, the
first light blocking layer LB1 is between the sensor unit SSU and
the viewing side 200, that is, the first light blocking layer LB1
is between the sensor unit SSU and the user USR, and the first
light blocking layer LB1 is closer to the display surface 100d of
the electronic device 100 than the sensor unit SSU. The design
described above may reduce most background ambient light to enter
the sensor unit SSU from the viewing side 200 for increasing the
signal to noise ratio of the sensor unit SSU when sensing. The
relative arrangement of the sensor unit SSU and the first light
blocking layer LB1 may be applied in various embodiments of the
present disclosure, and will not be described in the following.
[0045] In the embodiments illustrated in FIG. 5, the second light
blocking layer LB2 is not illustrated, but the second light
blocking layer LB2 may be disposed corresponding to the sensor unit
SSU in some embodiments, for example, disposed on the back side of
the sensor unit, as shown in FIG. 6.
[0046] Please refer to FIG. 6. FIG. 6 is an enlarged partial
cross-sectional view of a third embodiment and a variant embodiment
of an electronic device according to the present disclosure. FIG. 6
mainly illustrates the arrangement of the second substrate SUB2,
the first light blocking layer LB1, the second light blocking layer
LB2 and the sensor unit SSU, and most of the other layers are
omitted. The example (I) of FIG. 6 illustrates that the second
substrate SUB2 is between the first blocking layer LB1 and the
sensor unit SSU, and the sensor unit SSU may be surrounded by the
second light blocking layer LB2. For example, the back side and the
lateral side of the sensor 110 in the sensing element SSE of the
sensor unit SSU may be surrounded by the second light blocking
layer LB2, but not limited thereto. The example (II) of FIG. 6
illustrates that the sensor unit SSU is between the first light
blocking layer LB1 and the second substrate SUB2, and the second
light blocking layer LB2 and the sensor unit SSU are at different
sides of the second substrate SUB2. Viewing form the back side, the
second light blocking layer LB2 at least partially blocks the back
side of the sensor 110. For example, the sensor 110 may have a
smaller size or width than the corresponding second light blocking
layer LB2 to reduce the proportion of light entering the sensor 110
from the back side of the sensor 110. It should be noted that, in
this embodiment, the arrangement of the first light blocking layer
LB1, the second light blocking layer LB2 and the sensor unit SSU
are not limited in the way shown in FIG. 6. In addition, in some
embodiments, the second light blocking layer LB2 may be a light
blocking layer corresponding to a plurality of sensors 110 after
being patterned. In other embodiments, the second light blocking
layer LB2 may be a large-area film covering most of the surface of
the second substrate SUB2.
[0047] Please refer to FIG. 7. FIG. 7 is an enlarged partial
cross-sectional view enlargement schematic diagram of a fourth
embodiment and variant embodiments of an electronic device
according to the present disclosure. FIG. 7 mainly illustrates the
arrangement of the first light blocking layer LB1, the second light
blocking layer LB2 and the sensor unit SSU on the surface of the
second substrate SUB2, and most of the other layers are omitted. In
the example (I) of FIG. 7, the first light blocking layer LB1 is on
the lower surface of the second substrate SUB2, that is, located
between the sensor 110 and the second substrate SUB2. The first
light blocking layer LB1 further includes an opening OP exposing
part of the sensor 110. In other words, in a top view direction of
the electronic device 100, the opening OP overlaps at least one
portion of the sensor unit SSU. The size (or the width) of the
opening OP shown in FIG. 7 may be smaller than the size (or the
width) of the sensor 110, but not limited thereto. The opening OP
may be designed in different shapes or sizes as required. When
performing fingerprint recognition, the light reflected by a finger
from one side of the display surface 100d may enter the sensor 110
through the opening OP, thereby increasing the total amount of the
reflected light entering the sensor 110. In addition, the example
(I) illustrates that the second light blocking layer LB2 covers the
lower surface and the sidewall of the sensor 110. In the example
(II), the substrate SUB2 is between the first light blocking layer
LB1 and the sensor unit SSU, and the first light blocking layer LB1
includes an opening OP. In the example (III), the sensor 110 is
between the first light blocking layer LB1 and the second substrate
SUB2, and the first light blocking layer LB1 includes an opening
OP. In the example (IV), the relative positions of the first light
blocking layer LB1 and the sensor 100 are similar to the example
(I), but the first light blocking layer LB1 includes a plurality of
smaller openings OP adjacently arranged. This design benefits
enhancing the collimation of the incident light, that is, it is
more likely to limit the light entering the sensor 110 to the light
incident in a normal direction, and the large angle incident light
may be filtered. Disposing the opening OP in the first light
blocking layer LB1 may enable the sensor 110 to receive more light
reflected from the fingers, and the signal intensity is increased,
and in combination with the first light blocking layer LB1 which
may block most of the ambient light, thus improving the signal to
noise ratio.
[0048] Please refer to FIG. 8. FIG. 8 is an enlarged partial
cross-sectional view of a fifth embodiment of an electronic device
according to the present disclosure. The electronic device 100
shown in FIG. 8 further includes a cover CG disposed above the
second substrate SUB2, and the cover CG may be a transparent glass
substrate or a transparent soft substrate for example, but not
limited thereto. When performing finger recognition, the finger may
touch the upper surface of the cover CG for recognizing. In the
direction DZ, the opening OP of the first light blocking layer LB1
may not overlap the sensor 110 and may be located at the adjacent
side of the sensor 110. When the finger FGR approaches the cover
CG, the light L1 emitted from a light source LSR of a light
emitting unit may enter the cover CG and be reflected by the finger
FGR near the upper surface of the cover CG, and the cover CG may be
used as a light guiding plate, and the reflected light L2 may
travel laterally (e.g., being totally reflected) in the cover CG to
the far side before exiting the cover CG and enter the sensor 110
through the opening OP. For example, the light source LSR may be
disposed on the first substrate (not shown) or the second substrate
SUB2, e.g., disposed near the outer edge of the first substrate,
but not limited thereto. In some embodiments, the light source LSR
may be an additional element independently disposed outside the
substrate.
[0049] Please refer to FIG. 9. FIG. 9 is an enlarged partial
cross-sectional view of a variant embodiment of the fifth
embodiment of an electronic device according to the present
disclosure. In the electronic device 100 shown in FIG. 9, the
sensing element SSE1 corresponds to its adjacent pixel 1021, the
sensing element SSE2 corresponds to it adjacent pixel 1022, and the
opening OP of the first light blocking layer LB1 has an inclined
sidewall OPS. When the electronic device 100 performs fingerprint
recognition, one sensor 110 may receive the reflected light of the
light emitted from the pixel that does not correspond to the sensor
110 itself. For example, the pixel 1022 is not adjacent to the
sensing element SSE1 and does not correspond to the sensing element
SSE1, but the light L1 emitted from the pixel 1022 may be reflected
by the finger FGR to form the light L2, entering the sensor 110 of
the sensing element SSE1 that is farther from the pixel 1022, and
perform fingerprint sensing and recognition. In FIG. 9, the opening
OP having the inclined sidewall OPS may be designed to receive the
reflected light of the pixel 1022 which is apart for the sensor 110
of the sensing element SSE1 in a specific distance, but the present
disclosure is not limited thereto. The sensor 110 may receive the
reflected light L2 of the light L1 emitted from the pixel with a
longer distance, for example, may receive the reflected light L2 of
the light L1 emitted from the pixel that are two pixels apart or
more than two pixels apart.
[0050] Please refer to FIG. 10. FIG. 10 is an enlarged partial
cross-sectional view of a sixth embodiment and variant embodiments
of an electronic device according to the present disclosure. The
electronic device 100 shown in FIG. 10 may further include a third
light blocking layer LB3. As shown in the example (I), the first
light blocking layer LB1 is disposed on the upper surface of the
second substrate SUB2, the second light blocking layer LB2 is
disposed on the lower side of the sensor 110, and the third light
blocking layer LB3 is disposed between the second substrate SUB2
and the sensor unit 110. In the example (II), the first light
blocking layer LB1 has an opening OP1, and the third light blocking
layer LB3 has an opening OP2. The opening OP1 and the opening OP2
may have approximately identical size and correspond to each other
up and down, and for example, the sidewalls of the opening OP1 and
the opening OP2 are substantially aligned with each other, but not
limited thereto. The incident angle limitation formed by the
opening OP1 and the opening OP2 may filter the incident light or
increase the signal to noise ratio. In the example (III), the size
or width of the opening OP1 is smaller than the size or width of
the opening OP2, and the opening OP1 substantially corresponds to
the central region of the opening OP2. In this design, the light L1
and the light L2 may pass through the opening OP1, the second
substrate SUB2, and the opening OP2 in sequence with a larger
incident angle and then enter the sensor 110. In the example (IV),
a sidewall of the opening OP1 may be substantially aligned with a
sidewall of the opening OP2, and this design enables the light L1
entering the sensor 110 and the light L2 entering the sensor 110 to
have different angles. The opening sizes and relative positions of
the opening OP1 and the opening OP2 described above may be
determined according to the actual requirements of the products.
The material of the third light blocking layer LB3 may be the same
as or different from the first light blocking layer LB1 and the
second light blocking layer LB2, and the size and width of the
third light blocking layer LB3 are not limited to those shown in
FIG. 10, which may be changed according to actual requirements. It
should be noted that, the example (III) and the example (IV) of
FIG. 10 have different light incident angles, which may
respectively correspond to the condition when the large angle light
(e.g., when the light source is a distant pixel or a distant light
source LSR) is detected or the condition when the small angle light
(e.g., when the light source is a near pixel) is detected.
[0051] Please refer to FIG. 11. FIG. 11 is an enlarged partial
cross-sectional view of a seventh embodiment of an electronic
device according to the present disclosure, and the cross-sectional
views illustrated in FIG. 11 may substantially correspond to the
line segment A-A' and the line segment B-B' of FIG. 3. In some
embodiments, a light shielding layer LSL may be disposed above the
driving transistor 106 and the reading transistor 108, and the
light shielding layer LSL may include low light transmittance
materials, for example, including metals, but not limited thereto.
The light shielding layer LSL may be used as the first light
blocking layer LB1 mentioned in the above-described present
disclosure, and the black matrix layer (which is used as the first
blocking layer LB1 in the above-described embodiments) may be
replaced by the light shielding layer LSL. In addition, compared
with the above-described embodiments, the electronic device shown
in FIG. 11 also omits the insulating layer 120 that may be used as
an overcoating layer. Furthermore, in FIG. 11, the light converting
element 104 is between the protective layer 128 and the
planarization layer 130, and in the direction DZ, the heights of
the places where the light converting element 104 and the sensor
110 are disposed are approximately the same. That is to say, the
sensor 110 may be disposed between the protective layer 128 and the
planarization layer 130, too.
[0052] Please refer to FIG. 12. FIG. 12 is an enlarged partial
cross-sectional view of a first variant embodiment of the seventh
embodiment of an electronic device according to the present
disclosure, and the cross-sectional views illustrated in FIG. 12
may substantially correspond to the line segment A-A' and the line
segment B-B' of FIG. 3. The second light blocking layer LB2 of the
electronic device 100 shown in FIG. 12 covers the lower surface of
the second substrate SUB2 in a large area. The second light
blocking layer LB2 has openings LB21, and the light converting
elements 104 may be respectively disposed in one of the openings
LB21. The second light blocking layer LB2 may include a black
matrix layer, but not limited thereto.
[0053] Please refer to FIG. 13. FIG. 13 is an enlarged partial
cross-sectional view of a second variant embodiment of the seventh
embodiment of an electronic device according to the present
disclosure, and FIG. 13 only illustrates the cross-sectional view
substantially corresponding to the line segment A-A' of FIG. 3. In
FIG. 13, the insulating layer 122, the gate insulating layer 124,
the insulating layer 126 and the protective layer 128 of the sensor
unit SSU and the first light blocking layer LB1 have an opening
168, and the opening 168 may accommodate the refractive index
adjusting material 166. For example, the refractive index n of the
material is greater than the refractive index of the first light
blocking layer LB1, and also may be greater than the insulating
layer 122, the gate insulating layer 124, the insulating layer 126
and the protective layer 128, and the light is not easily to exit
from the sidewall of the opening 168 after entering the opening
168, and the light may be reflected downward in the opening 168 to
enter the sensor 110, and increase the light sensing efficiency. In
another variant embodiment, the opening 168 and the refractive
index adjusting material 166 may be only located in the first light
blocking layer LB1, and the insulating layer 122, the gate
insulating layer 124, the insulating layer 126 and the protective
layer 128 do not have the opening 168.
[0054] Please refer to FIG. 14, FIG. 15 and FIG. 16. FIG. 14 is an
enlarged partial cross-sectional view of a third variant embodiment
of the seventh embodiment of an electronic device according to the
present disclosure. FIG. 15 is an enlarged partial cross-sectional
view of a fourth variant embodiment of the seventh embodiment of an
electronic device according to the present disclosure. FIG. 16 is
an enlarged partial cross-sectional view of a fifth variant
embodiment of the seventh embodiment of an electronic device
according to the present disclosure. In the electronic device 100
shown in FIG. 14, the protective layer 128 has the opening 168, and
a portion of the sensor 110 is disposed in the opening 168. In the
electronic device 100 shown in FIG. 15, the gate insulating layer
124, the insulating layer 126 and the protective layer 128 has the
opening 168, and a portion of the sensor 110 is disposed in the
opening 168. Furthermore, in FIG. 15, the first light blocking
layer includes the opening OP, and the insulating layer 122 is
filled in the opening OP. In this design, the traveling path of the
incident light may also be adjusted by using the difference in
refractive indexes between the insulating layer 122 and the opening
OP. In another variant embodiment, the first light blocking layer
LB1 may not have the opening OP. In the electronic device 100 shown
in FIG. 16, the insulating layer 122, the gate insulating layer
124, the insulating layer 126 and the protective layer 128 have the
opening 168, and a portion of the sensor 110 and the second light
blocking layer LB2 is disposed in the opening 168. Furthermore, the
first light blocking layer LB1 has the opening OP, and a portion of
the upper electrode 1101 of the sensor 110 is disposed in the
opening OP.
[0055] Please refer to FIG. 17. FIG. 17 is an enlarged partial
cross-sectional view of an eighth embodiment of an electronic
device according to the present disclosure. In some embodiment, the
electronic device 100 may further include one or more lenses LEN
disposed on the upper side of the second substrate SUB2. As shown
in FIG. 17, in the direction DZ, the first light blocking layer LB1
is disposed between the second substrate SUB2 and the lens LEN, and
the first light blocking layer LB1 includes the opening OP
substantially corresponding to the sensor 110 and the lens LEN. In
detail, a plurality of lenses LEN may be included on the second
substrate SUB2, and the plurality of lenses LEN respectively
correspond to one sensor 110 and one opening OP of the first light
blocking layer LB1. In addition, the lens LEN may be adhered to the
surface of the first light blocking layer LB1 by using an adhesive
layer 174. It should be noted that, in FIG. 17, the adhesive layer
174 also covers the region besides the opening OP, but this
embodiment is not limited thereto. In some embodiments, the
adhesive layer 174 is only located in the opening OP. On the other
hand, the insulating layer 122, the gate insulating layer 124, the
insulating layer 126 and the protective layer 128 shown in FIG. 17
include the opening 168. The sensor 110 is disposed in the opening
168, and the planarization layer 176 covers the protective layer
128 and is filled in the opening 168. It should be noted that, at
the opening 168, the sidewall of the insulating layer 126 and the
sidewall of the protective layer 128 may not be aligned with the
sidewall of the insulating layer 122 and the sidewall of the gate
insulating layer 124, and the bias line 132 and a portion of the
upper electrode 1101 of the sensor 110 may be disposed at a
position where the insulating layer 126 exposes the gate insulating
layer 124. In FIG. 17, another planarization layer 130 may cover
the surface of the planarization layer 176. The second light
blocking layer LB2 may cover the surface of the planarization layer
130.
[0056] Please refer to FIG. 18. FIG. 18 is an enlarged partial
cross-sectional view of a variant embodiment of the eighth
embodiment of an electronic device according to the present
disclosure. In FIG. 18, an insulating layer 180 may be disposed
between the lens LEN and the first light blocking layer LB1. The
insulating layer 180, for example, includes (but is not limited to)
the inorganic insulating materials, and a portion of the lens LEN
and a portion of the insulating layer 180 may be both disposed in
the opening OP of the light blocking layer LB1. In another variant
embodiment (not shown), the first light blocking layer LB1 may be
disposed on the lower side of the second substrate SUB and may have
the opening OP, and the opening 168 exposes the opening OP.
Furthermore, a portion of the sensor 110 is disposed in the opening
OP and the opening 168.
[0057] Please refer to FIG. 19. FIG. 19 is an enlarged partial
cross-sectional view of a ninth embodiment of an electronic device
according to the present disclosure. In FIG. 19, the second light
blocking layer LB2 is disposed on the bottom surface of the sensor
110 and the periphery of the bottom part of the sidewall of the
sensor 110, and the third light blocking layer LB3 is disposed on
the periphery of the top part of the sidewall of the sensor 110.
The third light blocking layer LB3 and the second light blocking
layer LB2 may include different materials. For example, the second
light blocking layer LB2 may have a greater elastic coefficient or
recovery property. A first alignment layer PI1 and a second
alignment layer PI2 are disposed on two sides of the display media
layer DML, the first alignment layer PI1 and the second alignment
layer PI2 are respectively disposed adjacent to the upper surface
SUB11 of the first substrate SUB1 and the lower surface SUB21 of
the second substrate SUB2, among which the second alignment layer
PI2 covers the second light blocking layer LB2 and the sensor 110.
In the region having the sensor 110, the first alignment layer PI1
may contact the second alignment layer PI2. The sensor 110 and the
second light blocking layer LB2 may be used as a spacer of the
display media layer DML for partially replacing or totally
replacing the photospacer, and to provide the function of
maintaining the cell hap of the display media layer DML. When the
second light blocking layer LB2 or the third light blocking layer
LB3 has a good recovery property, better support function may be
also provided when the second light blocking layer LB2 or the third
light blocking layer LB3 is used as the spacer. In some variant
embodiments, the combination of sensor 110 and the second light
blocking layer LB2 still be used as the spacer of the display media
layer DML, but the third light blocking layer LB3 is not
included.
[0058] Please refer to FIG. 20, FIG. 21 and FIG. 22. FIG. 20 is a
schematic diagram of the signal according to an embodiment of a
method of performing fingerprint recognition of an electronic
device according to the present disclosure. FIG. 21 is an exterior
schematic diagram of an embodiment of an electronic device
according to the present disclosure. FIG. 22 is a flowchart
according to an embodiment of performing fingerprint recognition of
an electronic device according to the present disclosure. The
electronic device 100 applied to the method of performing
fingerprint recognition of the present disclosure may include, but
not limited to, the structures in any embodiments or variant
embodiments described above. For example, the electronic device 100
may include the first substrate, the second substrate, the sensor
unit and the light emitting unit. The first substrate is on a side
of the second substrate that is opposite to the display surface
100d, the sensor unit is disposed on the second substrate, and the
light emitting unit (e.g., the light source LSR shown in FIG. 8 or
the backlight module BLU shown in FIG. 1) is on a side of the
second substrate that is opposite to the display surface 100d. The
elements of the electronic device 100 described above may refer to
the description of other embodiments and related drawings of the
present disclosure, not redundantly described herein. As shown in
FIG. 21, the display surface 100d may be discriminated into a
general display region R1 and a fingerprint recognition region R2.
It should be noted that, although the fingerprint recognition
region R2 has the function of fingerprint recognition, the
fingerprint recognition region R2 still may display images, and the
occupied regions and sizes of the display region R1 and the
fingerprint recognition region R2 are not limited to those in FIG.
21. In some embodiments, the electronic device 100 may further
include a frame FRM and a signal processing unit SPU. The frame FRM
is on the outer side of the display surface 100d, and the signal
processing unit SPU may be disposed on the back side of the display
surface 100d. As shown in FIG. 20, the time period T1 represents
that when fingerprint recognition is not been performed yet, the
light emitting unit may remain in an "off" state or a long "on"
mode (continuously emitting light with uniform intensity). The time
period T2 represents the time when the electronic device 100 of the
present disclosure is in a fingerprint recognition mode. When the
fingerprint recognition mode of the electronic device 100 is
started, the light emitting unit or light source for providing the
fingerprint recognition light may produce the light with
intermittent intensity. For example, the light emitting unit will
be turned on or off with fixed time intervals, or the light source
has a fixed refresh frame rate. Before the finger touches the
electronic device 100 for fingerprint recognition (the time period
TA), the sensor unit for performing fingerprint recognition may
only receive the ambient light or the background light, and a light
sensing signal of intensity S1 may be produced. When the user
touches the electronic device 100 with the finger for fingerprint
recognition (the time period TB), the sensor unit may further
receive the light reflected by the finger, and the intensity of the
light sensing signal detected in the time period TB includes the
intensity S1 and intensity S2, among which the intensity S2 is
generated from the light reflected back from the finger to the
sensor unit After the fingerprint recognition is completed and the
fingerprint recognition mode is turned off, it gets into the time
period T3, the light emitting unit may be turned off or the long
"on" mode will be restored. The sensor unit may send the light
sensing signal to the signal processing unit SPU, the signal
processing unit SPU may distinguish the intermittent signal from
the light sensing signal, that is, the signal with intermittent
intensity variation in the time period TB, and the signal
processing unit SPU may convert the intermittent signal into the
fingerprint recognition data. On the other hand, the signal
processing unit SPU may further distinguish the continuous signal
from the light sensing signal, that is, the light sensing signal
obtained in the time period TA and the time period T3, and when the
signal processing unit SPU converts the above-described
intermittent signal into the fingerprint recognition data, the
above-described continuous signal may be excluded. For example, the
intensity of the continuous signal can be excluded from the light
sensing signal, and the signal intensity after calculating may have
a greater intensity difference.
[0059] According to the above description, an embodiment of the
method of performing fingerprint recognition of the electronic
device 100 of the present disclosure includes the following
steps:
[0060] S100: providing an electronic device, wherein the electronic
device comprises a sensor unit, a light emitting unit and a signal
processing unit;
[0061] S102: starting a fingerprint recognition mode, that is to
say, getting into the time T2 in FIG. 20;
[0062] S104: enabling the light emitting unit to produce a light
with intermittent intensity;
[0063] S106: the sensor unit sending a sensed light sensing signal
to the signal processing unit SPU; and
[0064] S108: the signal processing unit SPU distinguishing an
intermittent signal from the light sensing signal and converting
the intermittent signal into a fingerprint recognition data.
[0065] According to the present disclosure, the electronic device
may include a sensor unit and at least one light blocking layer.
The sensor unit may be used to perform fingerprint recognition, and
the at least one light blocking layer is disposed between the
sensor unit and the viewing side, that is, the light blocking layer
is closer to the display surface than the sensor unit. The light
blocking layer may block at least one portion of the sensor unit,
and the total amount of ambient light entering the sensor unit may
be reduced, thereby increasing the signal to noise ratio to improve
the signal sensing effects and the accuracy of fingerprint
recognition. The electronic device of the present disclosure may
adopt different arrangement to change the relative positions of the
light converting element, the sensor, the substrate and one or more
light blocking layers, the openings of the light blocking layers,
the openings of the insulating layers in different embodiments, and
the electronic device with the fingerprint recognition function may
be designed according to the actual requirements. In addition,
according to the method of fingerprint recognition in the
disclosure, the accuracy of the fingerprint recognition is enhanced
by deducting the background signals or using the light emitting
unit that emits light intermittently.
[0066] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the disclosure. Accordingly, the
above disclosure should be construed as limited only by the metes
and bounds of the appended claims.
* * * * *