U.S. patent application number 16/557111 was filed with the patent office on 2021-03-04 for remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment.
The applicant listed for this patent is DELL PRODUCTS, LP. Invention is credited to William K. Coxe, III, Corey D. Hartman.
Application Number | 20210068308 16/557111 |
Document ID | / |
Family ID | 1000005399779 |
Filed Date | 2021-03-04 |
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United States Patent
Application |
20210068308 |
Kind Code |
A1 |
Coxe, III; William K. ; et
al. |
March 4, 2021 |
Remote Heat Exchanger Arm for Direct Contact Liquid Cooling for
Rack Mounted Equipment
Abstract
An information handling system includes a server rack, a
processing system, and a liquid cooling heat exchanger module. The
processing system is configured to be installed into at least one
rack unit of the server rack, and includes a component configured
to be cooled by a liquid cooling cold plate. The heat exchanger
module is affixed to the server rack within a same rack unit as the
processing system, and is configured to provide chilled cooling
liquid to cool the cold plate, and to no other equipment in the
server rack.
Inventors: |
Coxe, III; William K.;
(Round Rock, TX) ; Hartman; Corey D.; (Hutto,
TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
DELL PRODUCTS, LP |
Round Rock |
TX |
US |
|
|
Family ID: |
1000005399779 |
Appl. No.: |
16/557111 |
Filed: |
August 30, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/20272 20130101;
H05K 7/20736 20130101; H05K 7/20781 20130101; H05K 7/20209
20130101; H05K 7/20145 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Claims
1. An information handling system, comprising: a server rack
including a plurality of rack units for receiving equipment; a
processing system configured to be installed into at least one of
the rack units, the processing system including a component
configured to be cooled by a liquid cooling cold plate; and a
liquid cooling heat exchanger module affixed within a same rack
unit as the processing system, and configured to provide chilled
cooling liquid to cool the cold plate, and to no other equipment in
the server rack, wherein when the processing system is removed from
the server rack, the liquid cooling heat exchanger module pivots at
a point where the liquid cooling heat exchanger module is affixed
to the server rack, to permit the flexible coolant lines to remain
coupled to the liquid cooling heat exchanger module.
2. The information handling system of claim 1, wherein the liquid
cooling heat exchanger module is affixed to the server rack and the
cold plate is coupled to the liquid cooling heat exchanger module
via flexible coolant lines.
3. (canceled)
4. The information handling system of claim 2, wherein the
processing system is coupled to a plurality of cables for
conducting signals and power to the processing system.
5. The information handling system of claim 4, wherein when the
processing system is removed from the server rack and the liquid
cooling heat exchanger module pivots, and an articulating arm
further permits the cables to remain coupled to the processing
system.
6. The information handling system of claim 1, wherein the liquid
cooling heat exchanger module is affixed to the processing
system.
7. The information handling system of claim 1, wherein the liquid
cooling heat exchanger module includes: a heat exchanger to chill
the cooling liquid circulated to the cold plate; a fan to blow air
over the heat exchanger to chill the heat exchanger; and. a
temperature sensor to sense a temperature of the cooling
liquid.
8. The information handling system of claim 7, wherein a fan speed
of the fan is controlled by a processor of the liquid cooling heat
exchanger module based upon a temperature received from the
temperature sensor.
9. The information handling system of claim 7, wherein a fan speed
is controlled by the processing system based upon a temperature
received from the temperature sensor.
10. The information handling system of claim 1, further comprising:
a baffle to receive the air from the processing system, and to
channel air to the fan.
11. A method, comprising: installing, into a server rack including
a plurality of rack units for receiving equipment, a processing
system into at least one of the rack units, the processing system
including a component configured to be cooled by a liquid cooling
cold plate; affixing, within a same rack unit as the processing
system, a liquid cooling heat exchanger module to provide chilled
cooling liquid to cool the cold plate, and to no other equipment in
the server rack; and extending, from the server rack, the
processing system, wherein when the processing system is extended
from the server rack, the liquid cooling heat exchanger module
pivots at a point where the liquid cooling heat exchanger module is
affixed to the server rack, to permit the flexible coolant lines to
remain coupled to the liquid cooling heat exchanger module and the
processing system.
12. The method of claim 11, wherein: the liquid cooling heat
exchanger module is affixed to the server rack; and the method
further comprises, coupling the cold plate to the liquid cooling
heat exchanger module via flexible coolant lines.
13. (canceled)
14. The method of claim 12, further comprising: coupling a
plurality of cables for conducting signals and power to the
processing system.
15. The method of claim 14, wherein when the processing system is
removed from the server rack and the liquid cooling heat exchanger
module pivots, and an articulating arm further permits the cables
to remain coupled to the processing system.
16. The method of claim 11, wherein the liquid cooling heat
exchanger module is affixed to the processing system.
17. The method of claim 11, further comprising: circulating the
cooling liquid from the cold plate to a heat exchanger of the
liquid cooling heat exchanger module to chill the cooling liquid
circulated to the cold plate; blowing, by a fan of the liquid
cooling heat exchanger module, air over the heat exchanger to chill
the heat exchanger; and determining, by a temperature sensor of the
liquid cooling heat exchanger module, a temperature of the cooling
liquid.
18. The method of claim 17, wherein a fan speed of the fan is
controlled based upon the temperature.
19. The method of claim 17, further comprising: receiving, at a
baffle, the air from the processing system; and channeling, by the
baffle, the air to the fan.
20. An information handling system, comprising: a server rack
including a plurality of rack units for receiving equipment; a
first processing system configured to be installed into a first one
of the rack units, the first processing system including a first
component configured to be cooled by a first liquid cooling cold
plate; a first liquid cooling heat exchanger module affixed within
the first rack unit, and configured to provide chilled cooling
liquid to chill only the first cold plate, wherein when the first
processing system is removed from the server rack, the first liquid
cooling heat exchanger module pivots at a point where the first
liquid cooling heat exchanger module is affixed to the server rack,
to permit the flexible coolant lines to remain coupled to the first
liquid cooling heat exchanger module; a second processing system
configured to be installed into a second one of the rack units, the
second processing system including a second component configured to
be cooled by a second liquid cooling cold plate; a second liquid
cooling heat exchanger module affixed within the second rack unit,
and configured to provide cold cooling liquid to chill only the
second cold plate.
Description
FIELD OF THE DISCLOSURE
[0001] The present disclosure generally relates to information
handling systems, and more particularly relates to a remote heat
exchanger arm for direct contact liquid cooling for rack mounted
equipment.
BACKGROUND
[0002] As the value and use of information continues to increase,
individuals and businesses seek additional ways to process and
store information. One option is an information handling system. An
information handling system generally processes, compiles, stores,
or communicates information or data for business, personal, or
other purposes. Technology and information handling needs and
requirements can vary between different applications. Thus
information handling systems can also vary regarding what
information is handled, how the information is handled, how much
information is processed, stored, or communicated, and how quickly
and efficiently the information can be processed, stored, or
communicated. The variations in information handling systems allow
information handling systems to be general or configured for a
specific user or specific use such as financial transaction
processing, airline reservations, enterprise data storage, or
global communications. In addition, information handling systems
can include a variety of hardware and software resources that can
be configured to process, store, and communicate information and
can include one or more computer systems, graphics interface
systems, data storage systems, networking systems, and mobile
communication systems. Information handling systems can also
implement various virtualized architectures. Data and voice
communications among information handling systems may be via
networks that are wired, wireless, or some combination.
SUMMARY
[0003] An information handling system may include a processing
system installed into at least one rack unit of a server rack, and
may include a component configured to be cooled by a liquid cooling
cold plate. A liquid cooling heat exchanger module may be affixed
to the server rack within a same rack unit as the processing
system, and may be configured to provide chilled cooling liquid to
cool the cold plate, and to no other equipment in the server
rack.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] It will be appreciated that for simplicity and clarity of
illustration, elements illustrated in the Figures are not
necessarily drawn to scale. For example, the dimensions of some
elements may be exaggerated relative to other elements. Embodiments
incorporating teachings of the present disclosure are shown and
described with respect to the drawings herein, in which:
[0005] FIG. 1 is a top view of an information handling system
according to at least one embodiment of the present disclosure;
[0006] FIG. 2 is a detailed top view of a liquid cooling heat
exchanger module of the information handling system of FIG. 1;
[0007] FIG. 3 is a detailed top view of the information handling
system of FIG. 1;
[0008] FIG. 4 is a top view of an information handling system
according to another embodiment of the present disclosure;
[0009] FIG. 5 illustrates front and back perspective views of the
heat exchanger module of FIG. 4;
[0010] FIG. 6 is another front perspective view of the heat
exchanger module of FIG. 5;
[0011] FIG. 7 is a top view of an information handling system
according to another embodiment of the present disclosure; and
[0012] FIG. 8 is a block diagram of a general information handling
system according to at least one embodiment of the disclosure.
[0013] The use of the same reference symbols in different drawings
indicates similar or identical items.
DETAILED DESCRIPTION OF THE DRAWINGS
[0014] The following description in combination with the Figures is
provided to assist in understanding the teachings disclosed herein.
The description is focused on specific implementations and
embodiments of the teachings, and is provided to assist in
describing the teachings. This focus should not be interpreted as a
limitation on the scope or applicability of the teachings.
[0015] A constant challenge in data centers is to keep the data
center equipment cooled sufficiently in order to be operated at the
equipment's highest performance settings. Solutions to equipment
cooling have historically been directed to fan cooling, carefully
directing the cooling air over the critical components of the data
center equipment, and providing larger heatsinks on the critical
components. However, as the performance and power levels of the
equipment has increased, the ability to sufficiently maintain lower
component temperatures using forced air over increasingly large
heatsinks has become an increasing challenge. One solution has been
to provide a liquid cooling solution for the components of the data
center equipment, with centralized liquid cooling infrastructure at
the server rack or data center level. This solution presents
different challenges in the routing and distribution of the cooling
liquid to the components on the individual elements of data center
equipment. Further, it is not uncommon for particular data centers
to forbid the use of centralized liquid cooling solutions due to
the increased cost and complexity in supporting the data
center.
[0016] FIG. 1 illustrates an information handling system 100.
Information handling system 100 represents a rack-mountable element
that is installable into a standard 19-inch server rack or cabinet,
or into any other non-standard server rack or cabinet. For example,
information handling system 100 and the associated server rack may
each be in conformance with an Electronic Industries Alliance
EIA-310-D standard, a Consumer Electronics Association CEA-310-E
standard, an International Electrotechnical Commission IEC 60297
standard, or the like. As such, information handling system 100
will be understood to be have a height that is specified in a
number of "rack units" (U), such as 1 U-equipment, 2 U-equipemnt,
or another number of rack units (U).
[0017] Information handling system 100 includes a processing system
110 and a liquid cooling heat exchanger module 120. Processing
system 110 represents an element of data center equipment, such as
a stand-alone or blade server, storage server, network switching
and routing equipment, power supply, or other equipment as may
typically be utilized in a data center for providing the data
processing functions of the data center. Processing system 110 is
characterized by the fact that one or more element of the
processing system presents a particularly heavy thermal load, and
thus presents a challenge to the cooling system of the processing
system. Heat exchanger module 120 represents a liquid cooling
solution that is dedicated to the use of processing system 110, and
that is sized to conform with the rack-mountable nature of
information handling system 100. As such, heat exchanger module 120
provides a liquid cooling solution that does not violate a data
center's restrictions on the use of centralized liquid cooling
solutions, because the liquid cooling infrastructure is limited to
the confines of information handling system 100. Further, heat
exchanger module 120 fits within the dimensions of the server rack,
inhabiting a location that may also be typically utilized by cable
management arms, or other equipment at a back side of the server
rack. In a particular embodiment, heat exchanger module 120 may be
configured to be attached to a mounting bracket of information
handling system 100, such as to rack sliding rails of the
information handling system, as shown and described in FIG. 3,
below. In another embodiment, heat exchanger module 120 may be
configured to be attached to a hinge that is affixed to the server
rack, as shown and described in FIG. 4, below.
[0018] FIG. 2 illustrates a detailed view of information handling
system 100, processing system 110, and heat exchanger module 120.
In particular, processing system 110 includes elements that,
because they present a particularly heavy thermal load on the
processing system, are cooled with liquid cooling cold plates 210
and 214, also referred to as cold plates, that are connected to
form a liquid cooling circuit with a remote liquid heat exchanger
220 of heat exchanger module 120 to transfer the heat from the
elements to the heat exchanger module. Fans 222 of heat exchanger
module 120 provide airflow to cool heat exchanger 220. In
particular, a first cold plate 210 is affixed to the surface of a
first high-heat element of processing system 110 to transfer heat
from the first element to a cooling liquid that passes through the
first cold plate, and a second cold plate 214 is affixed to the
surface of a second high-heat element of the processing system.
Specifically, cold plate 210 is connected to receive chilled
cooling liquid from an input coolant line 216. An output of the
first cold plate 210 is connected to provide the heated cooling
liquid to cold plate 214 via an intermediate coolant line 212. An
output of the second cold plate 214 is connected to provide the
twice heated cooling liquid to an output coolant line 218. Coolant
lines 216 and 218 are routed within processing system 110 to a back
end of the processing system to be connected to heat exchanger
module 120. Coolant lines 216 and 218 may have tubing connectors at
the rear wall of processing system 110, with separate tubing
elements connecting between processing system 110 and heat
exchanger module 220. Fans 220 are connected via cable 224 to
receive power and/or control signals from processing system 110.
Liquid cooling within a processing system, the details of providing
liquid cooling for high-heat elements within a processing system,
and of connecting and routing of coolant lines is known in the art,
and will not be further described herein except as needed to
illuminate the present disclosure.
[0019] In operation, heat exchanger module 120 operates to provide
chilled cooling liquid to input coolant line 216 to cool cold
plates 210 and 214, and to receive the twice heated cooling liquid
from coolant line 218 from the cold plates. Heat exchanger 220
operates to receive the heated cooling liquid from coolant line
218, to remove the heat from the cooling liquid, and to provide the
cooled cooling liquid to coolant line 216. Fans 220 operate to pass
cooled air over heat exchanger 220 to cool the cooling liquid. It
will be understood that a liquid cooling system as described herein
will include other elements, such as coolant pumps, coolant
reservoirs, temperature sensors and the like, as may be known in
the art. Such elements will not be further described herein, except
as needed to illustrate the present embodiments.
[0020] In a particular embodiment, illustrated in FIG. 3, heat
exchanger module 120 is configured to be attached to a mounting
bracket 300 attached to information handling system 100. Here, heat
exchanger module 120 (not illustrated in FIG. 3) is rigidly
attached to mounting bracket 300 such that, as information handling
system 100 is installed into or removed from a server rack, the
heat exchanger module moves with the whole of the information
handling system. As such, information handling system 100 can be
provided from a manufacturer as an integrated whole that provides
the functionality of the associated processing system 110, along
with the liquid cooling system provided by heat exchanger module
120. It will be understood that, as illustrated with respect to
FIG. 3, a heat exchanger module may be configured to be attached to
a mounting bracket of the associated information handling system,
to a set of rack sliding rails affixed to the side of the
information handling system, or to another member affixed to the
information handling system, such that the heat exchanger module
moves as a unit with the associated information handling
system.
[0021] FIG. 4 illustrates an installation 400, where an information
handling system 410 is installed into a server rack 430 by affixing
the information handling system to slides 440 and sliding the
information handling system into the server rack. A liquid cooling
heat exchanger module 420, similar to heat exchanger module 120, is
configured to be attached to a hinge 424 that is affixed to server
rack 430 via a mounting bracket 422. Information handling system
410 is connected to heat exchanger module 420 via coolant lines 429
in a flexible way such that as the information handling system is
slid into server rack 430, the heat exchanger module is pushed by
an articulating arm that manages the coolant lines and pivots
around hinge 424 and pivot points 426 and 428, to rotate into a
position behind the information handling system that is similar to
the position of heat exchanger module 120 in the back of
information handling system 100, as shown in FIG. 1. Similarly, as
information handling system 410 is slid out of server rack 430, the
heat exchanger module is pulled by the articulating arm that
manages coolant lines 429 and pivots around hinge 424 and pivot
points 426 and 428, to rotate out of the position behind the
information handling system. In this way, a server rack can be
pre-installed with one or more heat exchanger modules that can be
connected to the associated information handling systems as they
are installed into the server rack. Here, coolant lines 429 can be
connected via quick-disconnect connections located at the rear of
information handling system 210, so that the coolant lines can be
disconnected or reconnected as needed to remove or install the
information handling system. This configuration may make
maintenance and repair of the associated information handling
systems easier, without any necessity to manage the heat exchanger
modules. Likewise, the maintenance and repair of the heat exchanger
modules may thus be simplified.
[0022] FIG. 5 illustrates front and back views of heat exchanger
module 420. Heat exchanger module 420 includes a mounting arm 505
to which is affixed one or more fans 510 and a heat exchanger 520.
Heat exchanger 520 is configured to provide coolant line couplers
525, to which are attached the coolant lines to an information
handling system or processing system. Mounting arm 505 is attached
to a mounting latch 530 via a hinge 535. Mounting latch 530 is
rigidly attached to a rear of a server rack, or to a mounting rail
of information handling system 410, for example via a buckling
mechanism, such as may be used for mounting cable management arms
to server racks.
[0023] FIG. 6 illustrates a front view of heat exchanger module 420
with cooling fans 510 removed to expose a printed circuit board
(PCB) 600 that is affixed to mounting arm 505. PCB 600 includes a
fan connector 602 associated with each fan 510, and a power
connector 604. PCP 600 this provides a mechanical mounting
mechanism for fans 510, and for coupling power from power connector
604 to the fans via fan connectors 602. PCB 600 further includes an
input coolant temperature sensor 606 and an output coolant
temperature sensor 608. PCB 600 may also include air temperature
sensors, as needed or desired, to determine the ambient air
temperature being blown over heat exchanger 520. In a particular
embodiment, PCB 600 includes circuitry to provide power, telemetry,
and control signals from power/control connector 604. The circuitry
operates to monitor the input and output coolant temperatures via
temperature sensors 606 and 608, and to control the fan speed of
fans 510 based upon the coolant temperatures. Here, power connector
may be configured as a two-wire power connector with a voltage
contact and a ground contact, and the circuitry may operate
autonomously to control the fan speeds. An example of circuitry for
controlling the fan speeds may include an embedded processor, a
programmable logic device, a hardware analog control circuit, or
the like, as needed to maintain the output coolant temperature at a
desired temperature. In another embodiment, power connector 604
provides contacts for temperature sensors 606 and 608 to circuitry
on the information handling system or processing system as needed
or desired, and the circuitry operates to provide a control signal,
such as a pulse width modulated (PWM) signal to the power connector
to control the fan speeds of fans 510. An example of circuitry on
an information handling system or processing system may include a
baseboard management controller, an Integrated Dell Remote Access
Controller (iDRAC), or another controller, as needed or desired.
Other functions for controlling heat exchanger module 420 may
include valve control, coolant level detection and warning, coolant
pump operation and warning, leak detection and warning, and the
like, as needed or desired.
[0024] FIG. 7 illustrates an information handling system 700,
including a processing system 710, a liquid cooling heat exchanger
module 720, and a baffle 730. Here, baffle 730 operates to direct
cooling air from processing system 710 to the fans and heat
exchanger of heat exchanger module 720. In this way, a greater flow
of air may be provided to heat exchanger module 720, and the
associated fans may represent an element of an overall air handling
design for processing system 710. This also may be favorable in
some environments where the ambient temperature at rear of
processing system 710 rack environment is higher temp than
expected, or is poorly controlled. This embodiment is provided in
contrast to the embodiment shown in FIG. 1, where there is no
associated baffle. In the case of the embodiment of FIG. 1, there
may be no necessary coupling of the air flow through processing
system 110, and the air flow through heat exchanger module 120, as
is the case in the embodiment shown in FIG. 7.
[0025] It will be understood that, in any one of the above
embodiments, the embodied liquid cooling systems may represent a
Direct Contact Liquid Cooling (DCLC) system, as needed or desired.
Further, while not shown, it will be understood that the embodied
liquid cooling systems may include a pump to move the coolant
through the liquid cooling circuit, and that such a pump may be
located on the associated heat exchanger module, on the associated
cold plates, or elsewhere in the information handling system, as
needed or desired. It will be further understood that embodied
liquid cooling systems may include a coolant reservoir, and that
such a coolant reservoir may be located on the associated heat
exchanger module, on the associated cold plates, or elsewhere in
the information handling system, as needed or desired. It will be
understood that the mounting of a heat exchanger module to a server
rack may utilize existing mounting locations for, e.g., a cable
management arm, or other device at the back of the server rack, as
needed or desired. It will be further understood that the circuitry
to control the fan speeds on a heat exchanger module may also
monitor, manage, and maintain other functions, as needed or
desired, such as fan power, pump power, heat exchanger module
health, leak detection, reservoir detection, air inlet and outlet
temperatures, and the like.
[0026] FIG. 8 illustrates a generalized embodiment of information
handling system 800. For purpose of this disclosure information
handling system 800 can include any instrumentality or aggregate of
instrumentalities operable to compute, classify, process, transmit,
receive, retrieve, originate, switch, store, display, manifest,
detect, record, reproduce, handle, or utilize any form of
information, intelligence, or data for business, scientific,
control, entertainment, or other purposes. For example, information
handling system 800 can be a personal computer, a laptop computer,
a smart phone, a tablet device or other consumer electronic device,
a network server, a network storage device, a switch router or
other network communication device, or any other suitable device
and may vary in size, shape, performance, functionality, and price.
Further, information handling system 800 can include processing
resources for executing machine-executable code, such as a central
processing unit (CPU), a programmable logic array (PLA), an
embedded device such as a System-on-a-Chip (SoC), or other control
logic hardware. Information handling system 800 can also include
one or more computer-readable medium for storing machine-executable
code, such as software or data. Additional components of
information handling system 800 can include one or more storage
devices that can store machine-executable code, one or more
communications ports for communicating with external devices, and
various input and output (I/O) devices, such as a keyboard, a
mouse, and a video display. Information handling system 800 can
also include one or more buses operable to transmit information
between the various hardware components.
[0027] Information handling system 800 includes processors 802 and
804, a chipset 810, a memory 820, a graphics adapter 830 connected
to a video display 834, a non-volatile RAM (NV-RAM) 840 that
includes a basic input and output system/extensible firmware
interface (BIOS/EFI) module 842, a disk controller 850, a hard disk
drive (HDD) 854, an optical disk drive 856, a disk emulator 860
connected to a solid state drive (SSD) 864, an input/output (I/O)
interface 870 connected to an add-on resource 874 and a trusted
platform module (TPM 876, a network interface 880, and a baseboard
management controller (BMC) 890. Processor 802 is connected to
chipset 810 via processor interface 806, and processor 804 is
connected to the chipset via processor interface 808. In a
particular embodiment, processors 802 and 804 are connected
together via a high-capacity coherent fabric, such as a
HyperTransport link, a QuickPath Interconnect, or the like. Chipset
810 represents an integrated circuit or group of integrated
circuits that manages the data flows between processors 802 and 804
and the other elements of information handling system 800. In a
particular embodiment, chipset 810 represents a pair of integrated
circuits, such as a northbridge component and a southbridge
component. In another embodiment, some or all of the functions and
features of chipset 810 are integrated with one or more of
processors 802 and 804. Memory 820 is connected to chipset 810 via
a memory interface 822. An example of memory interface 822 includes
a Double Data Rate (DDR) memory channel and memory 820 represents
one or more DDR Dual In-Line Memory Modules (DIMMs). In a
particular embodiment, memory interface 822 represents two or more
DDR channels. In another embodiment, one or more of processors 802
and 804 include a memory interface that provides a dedicated memory
for the processors. A DDR channel and the connected DDR DIMMs can
be in accordance with a particular DDR standard, such as a DDR3
standard, a DDR4 standard, a DDR5 standard, or the like. Memory 820
may further represent various combinations of memory types, such as
Dynamic Random Access Memory (DRAM) DIMMs, Static Random Access
Memory (SRAM) DIMMs, non-volatile DIMMs (NV-DIMMs), storage class
memory devices, Read-Only Memory (ROM) devices, or the like.
Graphics adapter 830 is connected to chipset 810 via a graphics
interface 832, and provides a video display output 836 to a video
display 834. An example of a graphics interface 832 includes a
Peripheral Component Interconnect-Express (PCIe) interface and
graphics adapter 830 can include a four lane (x4) PCIe adapter, an
eight lane (x8) PCIe adapter, a 16-lane (x16) PCIe adapter, or
another configuration, as needed or desired. In a particular
embodiment, graphics adapter 830 is provided down on a system
printed circuit board (PCB). Video display output 836 can include a
Digital Video Interface (DVI), a High-Definition Multimedia
Interface (HDMI), a DisplayPort interface, or the like, and video
display 834 can include a monitor, a smart television, an embedded
display such as a laptop computer display, or the like.
[0028] NV-RAM 840, disk controller 850, and I/O interface 870 are
connected to chipset 810 via an I/O channel 812. An example of I/O
channel 812 includes one or more point-to-point PCIe links between
chipset 810 and each of NV-RAM 840, disk controller 850, and I/O
interface 870. Chipset 810 can also include one or more other I/O
interfaces, including an Industry Standard Architecture (ISA)
interface, a Small Computer Serial Interface (SCSI) interface, an
Inter-Integrated Circuit (I.sup.2C) interface, a System Packet
Interface (SPI), a Universal Serial Bus (USB), another interface,
or a combination thereof. NV-RAM 840 includes BIOS/EFI module 842
that stores machine-executable code (BIOS/EFI code) that operates
to detect the resources of information handling system 800, to
provide drivers for the resources, to initialize the resources, and
to provide common access mechanisms for the resources. The
functions and features of BIOS/EFI module 842 will be further
described below.
[0029] Disk controller 850 includes a disk interface 852 that
connects the disc controller to a hard disk drive (HDD) 854, to an
optical disk drive (ODD) 856, and to disk emulator 860. An example
of disk interface 852 includes an Integrated Drive Electronics
(IDE) interface, an Advanced Technology Attachment (ATA) such as a
parallel ATA (PATA) interface or a serial ATA (SATA) interface, a
SCSI interface, a USB interface, a proprietary interface, or a
combination thereof. Disk emulator 860 permits a solid-state drive
(SSD) 864 to be connected to information handling system 800 via an
external interface 862. An example of external interface 862
includes a USB interface, a proprietary interface, or a combination
thereof. Alternatively, solid-state drive 864 can be disposed
within information handling system 800.
[0030] I/O interface 870 includes a peripheral interface 872 that
connects the I/O interface to add-on resource 874, to TPM 876, and
to network interface 880. Peripheral interface 872 can be the same
type of interface as I/O channel 812, or can be a different type of
interface. As such, I/O interface 870 extends the capacity of I/O
channel 812 when peripheral interface 872 and the I/O channel are
of the same type, and the I/O interface translates information from
a format suitable to the I/O channel to a format suitable to the
peripheral channel 872 when they are of a different type. Add-on
resource 874 can include a data storage system, an additional
graphics interface, a network interface card (NIC), a sound/video
processing card, another add-on resource, or a combination thereof.
Add-on resource 874 can be on a main circuit board, on separate
circuit board or add-in card disposed within information handling
system 800, a device that is external to the information handling
system, or a combination thereof.
[0031] Network interface 880 represents a network communication
device disposed within information handling system 800, on a main
circuit board of the information handling system, integrated onto
another component such as chipset 810, in another suitable
location, or a combination thereof. Network interface device 880
includes a network channel 882 that provides an interface to
devices that are external to information handling system 800. In a
particular embodiment, network channel 882 is of a different type
than peripheral channel 872 and network interface 880 translates
information from a format suitable to the peripheral channel to a
format suitable to external devices. In a particular embodiment,
network interface 880 includes a network interface card (NIC) or
host bus adapter (HBA), and an example of network channel 882
includes an InfiniBand channel, a Fibre Channel, a Gigabit Ethernet
channel, a proprietary channel architecture, or a combination
thereof. In another embodiment, network interface 880 includes a
wireless communication interface, and network channel 882 includes
a WiFi channel, a near-field communication (NFC) channel, a
Bluetooth or Bluetooth-Low-Energy (BLE) channel, a cellular based
interface such as a Global System for Mobile (GSM) interface, a
Code-Division Multiple Access (CDMA) interface, a Universal Mobile
Telecommunications System (UMTS) interface, a Long-Term Evolution
(LTE) interface, or another cellular based interface, or a
combination thereof. Network channel 882 can be connected to an
external network resource (not illustrated). The network resource
can include another information handling system, a data storage
system, another network, a grid management system, another suitable
resource, or a combination thereof.
[0032] BMC 890 is connected to multiple elements of information
handling system 800 via one or more management interface 892 to
provide out of band monitoring, maintenance, and control of the
elements of the information handling system. As such, BMC 890
represents a processing device different from processor 802 and
processor 804, which provides various management functions for
information handling system 800. For example, BMC 890 may be
responsible for power management, cooling management, and the like.
The term baseboard management controller (BMC) is often used in the
context of server systems, while in a consumer-level device a BMC
may be referred to as an embedded controller (EC). A BMC included
at a data storage system can be referred to as a storage enclosure
processor. A BMC included at a chassis of a blade server can be
referred to as a chassis management controller and embedded
controllers included at the blades of the blade server can be
referred to as blade management controllers.
[0033] Capabilities and functions provided by BMC 890 can vary
considerably based on the type of information handling system. BMC
890 can operate in accordance with an Intelligent Platform
Management Interface (IPMI). Examples of BMC 890 include an
Integrated Dell Remote Access Controller (iDRAC). Management
interface 892 represents one or more out-of-band communication
interfaces between BMC 890 and the elements of information handling
system 800, and can include an Inter-Integrated Circuit (I2C) bus,
a System Management Bus (SMBUS), a Power Management Bus (PMBUS), a
Low Pin Count (LPC) interface, a serial bus such as a Universal
Serial Bus (USB) or a Serial Peripheral Interface (SPI), a network
interface such as an Ethernet interface, a high-speed serial data
link such as a Peripheral Component Interconnect-Express (PCIe)
interface, a Network Controller Sideband Interface (NC-SI), or the
like. As used herein, out-of-band access refers to operations
performed apart from a BIOS/operating system execution environment
on information handling system 800, that is apart from the
execution of code by processors 802 and 804 and procedures that are
implemented on the information handling system in response to the
executed code. BMC 890 operates to monitor and maintain system
firmware, such as code stored in BIOS/EFI module 842, option ROMs
for graphics interface 830, disk controller 850, add-on resource
874, network interface 880, or other elements of information
handling system 800, as needed or desired. In particular, BMC 890
includes a network interface 894 that can be connected to a remote
management system to receive firmware updates, as needed or
desired. Here, BMC 890 receives the firmware updates, stores the
updates to a data storage device associated with the BMC, transfers
the firmware updates to NV-RAM of the device or system that is the
subject of the firmware update, thereby replacing the currently
operating firmware associated with the device or system, and
reboots information handling system, whereupon the device or system
utilizes the updated firmware image.
[0034] BMC 890 utilizes various protocols and application
programming interfaces (APIs) to direct and control the processes
for monitoring and maintaining the system firmware. An example of a
protocol or API for monitoring and maintaining the system firmware
includes a graphical user interface (GUI) GUI associated with BMC
890, an interface defined by the Distributed Management Taskforce
(DMTF) (such as a Web Services Management (WS-MAN) interface, a
Management Component Transport Protocol (MCTP) or, a Redfish
interface), various vendor defined interfaces (such as a Dell EMC
Remote Access Controller Administrator (RACADM) utility, a Dell EMC
OpenManage Server Administrator (OMSS) utility, a Dell EMC
OpenManage Storage Services (OMSS) utility, or a Dell EMC
OpenManage Deployment Toolkit (DTK) suite), a BIOS setup utility
such as invoked by a "F2" boot option, or another protocol or API,
as needed or desired.
[0035] In a particular embodiment, BMC 890 is included on a main
circuit board (such as a baseboard, a motherboard, or any
combination thereof) of information handling system 800, or is
integrated onto another element of the information handling system
such as chipset 810, or another suitable element, as needed or
desired. As such, BMC 890 can be part of an integrated circuit or a
chip set within information handling system 800. An example of BMC
890 includes an integrated Dell remote access controller (iDRAC),
or the like. BMC 890 may operate on a separate power plane from
other resources in information handling system 800. Thus BMC 890
can communicate with the management system via network interface
894 while the resources of information handling system 800 are
powered off. Here, information can be sent from the management
system to BMC 890 and the information can be stored in a RAM or
NV-RAM associated with the BMC. Information stored in the RAM may
be lost after power-down of the power plane for BMC 890, while
information stored in the NV-RAM may be saved through a
power-down/power-up cycle of the power plane for the BMC.
[0036] The term "computer-readable medium" includes a single medium
or multiple media, such as a centralized or distributed database,
and/or associated caches and servers that store one or more sets of
instructions. The term "computer-readable medium" shall also
include any medium that is capable of storing, encoding, or
carrying a set of instructions for execution by a processor or that
cause a computer system to perform any one or more of the methods
or operations disclosed herein. In a particular non-limiting,
exemplary embodiment, the computer-readable medium can include a
solid-state memory such as a memory card or other package that
houses one or more non-volatile read-only memories. Further, the
computer-readable medium can be a random access memory or other
volatile re-writable memory. Additionally, the computer-readable
medium can include a magneto-optical or optical medium, such as a
disk or tapes or other storage device to store information received
via carrier wave signals such as a signal communicated over a
transmission medium. Furthermore, a computer readable medium can
store information received from distributed network resources such
as from a cloud-based environment. A digital file attachment to an
e-mail or other self-contained information archive or set of
archives may be considered a distribution medium that is equivalent
to a tangible storage medium. Accordingly, the disclosure is
considered to include any one or more of a computer-readable medium
or a distribution medium and other equivalents and successor media,
in which data or instructions may be stored.
[0037] When referred to as a "device," a "module," or the like, the
embodiments described herein can be configured as hardware. For
example, a portion of an information handling system device may be
hardware such as, for example, an integrated circuit (such as an
Application Specific Integrated Circuit (ASIC), a Field
Programmable Gate Array (FPGA), a structured ASIC, or a device
embedded on a larger chip), a card (such as a Peripheral Component
Interface (PCI) card, a PCI-express card, a Personal Computer
Memory Card International Association (PCMCIA) card, or other such
expansion card), or a system (such as a motherboard, a
system-on-a-chip (SoC), or a stand-alone device).
[0038] The device or module can include software, including
firmware embedded at a processor or software capable of operating a
relevant environment of the information handling system. The device
or module can also include a combination of the foregoing examples
of hardware or software. Note that an information handling system
can include an integrated circuit or a board-level product having
portions thereof that can also be any combination of hardware and
software.
[0039] Devices, modules, resources, or programs that are in
communication with one another need not be in continuous
communication with each other, unless expressly specified
otherwise. In addition, devices, modules, resources, or programs
that are in communication with one another can communicate directly
or indirectly through one or more intermediaries.
[0040] Although only a few exemplary embodiments have been
described in detail herein, those skilled in the art will readily
appreciate that many modifications are possible in the exemplary
embodiments without materially departing from the novel teachings
and advantages of the embodiments of the present disclosure.
Accordingly, all such modifications are intended to be included
within the scope of the embodiments of the present disclosure as
defined in the following claims. In the claims, means-plus-function
clauses are intended to cover the structures described herein as
performing the recited function and not only structural
equivalents, but also equivalent structures.
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