U.S. patent application number 16/656524 was filed with the patent office on 2021-02-25 for connection interface circuit, memory storage device and signal generation method.
This patent application is currently assigned to PHISON ELECTRONICS CORP.. The applicant listed for this patent is PHISON ELECTRONICS CORP.. Invention is credited to Ming-Chien Huang.
Application Number | 20210055756 16/656524 |
Document ID | / |
Family ID | 1000004436431 |
Filed Date | 2021-02-25 |
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United States Patent
Application |
20210055756 |
Kind Code |
A1 |
Huang; Ming-Chien |
February 25, 2021 |
CONNECTION INTERFACE CIRCUIT, MEMORY STORAGE DEVICE AND SIGNAL
GENERATION METHOD
Abstract
A connection interface circuit, a memory storage device and a
signal generation method are disclosed. The connection interface
circuit is configured to connect a memory controller to a volatile
memory module. The connection interface circuit includes a phase
locking circuit, a wire module and a signal interface. The signal
interface is coupled between the wire module and the memory
controller. The phase locking circuit is configured to receive a
first clock signal from the memory controller. The phase locking
circuit is further configured to generate a second clock signal
according to the first clock signal and a delay feature of the wire
module. The wire module is configured to provide a third clock
signal to the signal interface according to the second clock
signal.
Inventors: |
Huang; Ming-Chien; (Hsinchu
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
PHISON ELECTRONICS CORP. |
Miaoli |
|
TW |
|
|
Assignee: |
PHISON ELECTRONICS CORP.
Miaoli
TW
|
Family ID: |
1000004436431 |
Appl. No.: |
16/656524 |
Filed: |
October 17, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G11C 7/22 20130101; H04L
7/033 20130101; G06F 1/06 20130101; H03K 5/135 20130101; G11C
11/4076 20130101; G06F 1/08 20130101; H03L 7/085 20130101; G11C
8/18 20130101; G06F 13/16 20130101; H04L 7/0331 20130101; G11C
29/023 20130101; H03L 7/00 20130101; G11C 7/222 20130101 |
International
Class: |
G06F 1/08 20060101
G06F001/08; H03L 7/085 20060101 H03L007/085; H03K 5/135 20060101
H03K005/135 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 21, 2019 |
TW |
108129899 |
Claims
1. A connection interface circuit for coupling a memory controller
to a volatile memory module, the connection interface circuit
comprising: a phase locking circuit, coupled to the memory
controller; a wire module, coupled to the phase locking circuit;
and a signal interface, coupled between the wire module and the
memory controller, wherein the phase locking circuit is configured
to receive a first clock signal from the memory controller, the
phase locking circuit is further configured to generate a second
clock signal according to the first clock signal and a delay
feature of the wire module, and the wire module is configured to
provide a third clock signal to the signal interface according to
the second clock signal.
2. The connection interface circuit according to claim 1, wherein
the phase locking circuit is further configured to lock a phase
difference between the first clock signal and the second clock
signal at a target phase difference, and the target phase
difference is affected by the delay feature of the wire module.
3. The connection interface circuit according to claim 2, wherein
the wire module is further configured to delay the second clock
signal to generate the third clock signal, and a delay amount of
the second clock signal corresponds to the target phase
difference.
4. The connection interface circuit according to claim 1, wherein
the phase locking circuit comprises: a modulation circuit, coupled
to the memory controller and the wire module; and a compensation
circuit, coupled to the modulation circuit, wherein the modulation
circuit is configured to generate the second clock signal according
to the first clock signal and a compensation signal, and the
compensation circuit is configured to generate the compensation
signal according to the second clock signal.
5. The connection interface circuit according to claim 4, wherein
the compensation circuit comprises: at least one first circuit
module, configured to simulate a delay feature of at least one
connection line in the wire module; and at least one second circuit
module, coupled to the at least one first circuit module and
configured to simulate a delay feature of at least one wiring
turning point in the wire module.
6. The connection interface circuit according to claim 5, wherein
the at least one first circuit module comprises at least one RC
circuit.
7. The connection interface circuit according to claim 5, wherein
the at least one second circuit module comprises at least one
buffer component.
8. The connection interface circuit according to claim 4, wherein
the modulation circuit comprises: a phase detector, coupled to the
memory controller and the compensation circuit; and a clock output
circuit, coupled to the phase detector and the wire module, wherein
the phase detector is configured to detect a phase difference
between the first clock signal and the compensation signal, and the
clock output circuit is configured to generate the second clock
signal according to the phase difference.
9. A memory storage device, comprising: a volatile memory module; a
memory controller; and a connection interface circuit, coupled to
the volatile memory module and the memory controller, wherein the
connection interface circuit is configured to receive a first clock
signal from the memory controller, the connection interface circuit
is further configured to generate a second clock signal according
to the first clock signal and a delay feature of a wire module in
the connection interface circuit, and the connection interface
circuit is further configured to provide a third clock signal to a
signal interface between the connection interface circuit and the
memory controller according to the second clock signal.
10. The memory storage device according to claim 9, wherein the
connection interface circuit is further configured to lock a phase
difference between the first clock signal and the second clock
signal at a target phase difference, and the target phase
difference is affected by the delay feature of the wire module.
11. The memory storage device according to claim 10, wherein the
connection interface circuit is further configured to delay the
second clock signal by the wire module to generate the third clock
signal, and a delay amount of the second clock signal corresponds
to the target phase difference.
12. The memory storage device according to claim 9, wherein the
connection interface circuit comprises: a modulation circuit,
coupled to the memory controller; and a compensation circuit,
coupled to the modulation circuit, wherein the modulation circuit
is configured to generate the second clock signal according to the
first clock signal and a compensation signal, and the compensation
circuit is configured to generate the compensation signal according
to the second clock signal.
13. The memory storage device according to claim 12, wherein the
compensation circuit comprises: at least one first circuit module,
configured to simulate a delay feature of at least one connection
line in the wire module; and at least one second circuit module,
coupled to the at least one first circuit module and configured to
simulate a delay feature of at least one wiring turning point in
the wire module.
14. The memory storage device according to claim 13, wherein the at
least one first circuit module comprises at least one RC
circuit.
15. The memory storage device according to claim 13, wherein the at
least one second circuit module comprises at least one buffer
component.
16. The memory storage device according to claim 12, wherein the
modulation circuit comprises: a phase detector, coupled to the
memory controller and the compensation circuit; and a clock output
circuit, coupled to the phase detector and the wire module, wherein
the phase detector is configured to detect a phase difference
between the first clock signal and the compensation signal, and the
clock output circuit is configured to generate the second clock
signal according to the phase difference.
17. A signal generation method for a connection interface circuit,
wherein the connection interface circuit is configured to connect a
memory controller and a volatile memory module, and the signal
generation method comprises: receiving a first clock signal from
the memory controller; generating a second clock signal according
to the first clock signal and a delay feature of a wire module in
the connection interface circuit; and providing a third clock
signal to a signal interface between the connect interface circuit
and the memory controller by the wire module according to the
second clock signal.
18. The signal generation method according to claim 17, further
comprising: locking a phase difference between the first clock
signal and the second clock signal at a target phase difference,
wherein the target phase difference is affected by the delay
feature of the wire module.
19. The signal generation method according to claim 18, further
comprising: delaying the second clock signal by the wire module to
generate the third clock signal, wherein a delay amount of the
second clock signal corresponds to the target phase difference.
20. The signal generation method according to claim 17, wherein the
step of generating the second clock signal according to the first
clock signal and the delay feature of the wire module in the
connection interface circuit comprises: generating the second clock
signal according to the first clock signal and a compensation
signal; and generating the compensation signal according to the
second clock signal.
21. The signal generation method according to claim 20, further
comprising: simulating a delay feature of at least one connection
line in the wire module; and simulating a delay feature of at least
one wiring turning point in the wire module.
22. The signal generation method according to claim 21, wherein the
step of simulating the delay feature of the at least one connection
line in the wire module comprises: simulating the delay feature of
the at least one connection line in the wire module by at least one
RC circuit.
23. The signal generation method according to claim 21, wherein the
step of simulating the delay feature of the at least one wiring
turning point in the wire module comprises: simulating the delay
feature of the at least one wiring turning point by at least one
buffer component.
24. The signal generation method according to claim 20, wherein the
step of generating the second clock signal according to the first
clock signal and the compensation signal comprises: detecting a
phase difference between the first clock signal and the
compensation signal; and generating the second clock signal
according to the phase difference.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefit of Taiwan
application serial no. 108129899, filed on Aug. 21, 2019. The
entirety of the above-mentioned patent application is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND
Technical Field
[0002] The disclosure relates to a signal processing technology,
and in particular, relates to a connection interface circuit, a
memory storage device and a signal generation method.
Description of Related Art
[0003] In general, a memory controller can access a volatile memory
module through a connection interface circuit. However, in order to
align a clock signal provided to the volatile memory module by the
connection interface circuit with a clock signal of the memory
controller itself, normally, a delay caused by transmitting the
clock signal in the connection interface circuit can be measured
first, and then an delay amount of an output signal can be
iteratively adjusted by the memory controller according to the
delay. However, in practice, due to factors like temperature
changes and/or process errors, the memory controller often needs to
spend more time than expected to adjust the clock signal, thereby
reducing an operational efficiency of the memory storage
device.
[0004] Nothing herein should be construed as an admission of
knowledge in the prior art of any portion of the present
disclosure. Furthermore, citation or identification of any document
in this application is not an admission that such document is
available as prior art to the present disclosure, or that any
reference forms a part of the common general knowledge in the
art.
SUMMARY
[0005] The disclosure provides a connection interface circuit, a
memory storage device and a signal generation method, which can
effectively improve the operational efficiency of the memory
storage device.
[0006] An exemplary embodiment of the disclosure provides a
connection interface circuit, which is configured to couple a
memory controller to a volatile memory module. The connection
interface circuit includes a phase locking circuit, a wire module
and a signal interface. The phase locking circuit is coupled to the
memory controller. The wire module is coupled to the phase locking
circuit. The signal interface is coupled between the wire module
and the memory controller. The phase locking circuit is configured
to receive a first clock signal from the memory controller. The
phase locking circuit is further configured to generate a second
clock signal according to the first clock signal and a delay
feature of the wire module. The wire module is configured to
provide a third clock signal to the signal interface according to
the second clock signal.
[0007] An exemplary embodiment of the disclosure further provides a
memory storage device, which includes a volatile memory module, a
memory controller and a connection interface circuit. The memory
interface circuit is coupled to the volatile memory module and the
memory controller. The connection interface circuit is configured
to receive a first clock signal from the memory controller. The
connection interface circuit is further configured to generate a
second clock signal according to the first clock signal and a delay
feature of a wire module in the connection interface circuit. The
connection interface circuit is further configured to provide a
third clock signal to a signal interface between the connection
interface circuit and the memory controller according to the second
clock signal.
[0008] An exemplary embodiment of the disclosure further provides a
signal generation method for a connection interface circuit. The
connection interface circuit is configured to couple a memory
controller to a volatile memory module. The signal generation
method includes: receiving a first clock signal from the memory
controller; generating a second clock signal according to the first
clock signal and a delay feature of a wire module in the connection
interface circuit; and providing a third clock signal to a signal
interface between the connection interface circuit and the memory
controller by the wire module according to the second clock
signal.
[0009] Based on the above, after the connection interface circuit
receives the first clock signal from the memory controller, the
connection interface circuit can generate the second clock signal
according to the first clock signal and the delay feature of the
wire module in the connection interface circuit. Then, the third
clock signal is provided to the signal interface between the
connection interface circuit and the memory controller by the wire
module according to the second clock signal. As a result, the
efficiency of signal alignment between the connection interface
circuit and the memory controller can be effectively improved.
[0010] It should be understood, however, that this Summary may not
contain all of the aspects and embodiments of the present
disclosure, is not meant to be limiting or restrictive in any
manner, and that the disclosure as disclosed herein is and will be
understood by those of ordinary skill in the art to encompass
obvious improvements and modifications thereto.
[0011] To make the aforementioned more comprehensible, several
embodiments accompanied with drawings are described in detail as
follows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a schematic diagram illustrating a memory storage
device according to an exemplary embodiment of the disclosure.
[0013] FIG. 2 is a timing diagram of a plurality of signals
according to an exemplary embodiment of the disclosure.
[0014] FIG. 3 is a schematic diagram illustrating a phase locking
circuit according to an exemplary embodiment of the disclosure.
[0015] FIG. 4 is an equivalent schematic diagram illustrating a
compensation circuit according to an exemplary embodiment of the
disclosure.
[0016] FIG. 5 is a flowchart illustrating a signal generation
method according to an exemplary embodiment of the disclosure.
[0017] FIG. 6 is a schematic diagram illustrating a memory storage
device according to an exemplary embodiment of the disclosure.
DESCRIPTION OF THE EMBODIMENTS
[0018] Reference will now be made in detail to the present
preferred embodiments of the disclosure, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0019] Embodiments of the present disclosure may comprise any one
or more of the novel features described herein, including in the
Detailed Description, and/or shown in the drawings. As used herein,
"at least one", "one or more", and "and/or" are open-ended
expressions that are both conjunctive and disjunctive in operation.
For example, each of the expressions "at least one of A, B and C",
"at least one of A, B, or C", "one or more of A, B, and C", "one or
more of A, B, or C" and "A, B, and/or C" means A alone, B alone, C
alone, A and B together, A and C together, B and C together, or A,
B and C together.
[0020] It is to be noted that the term "a" or "an" entity refers to
one or more of that entity. As such, the terms "a" (or "an"), "one
or more" and "at least one" can be used interchangeably herein.
[0021] The provided exemplary embodiments can be suitably combined.
The term "coupling/coupled" used in this specification (including
claims) may refer to any direct or indirect connection means. For
example, "a first device is coupled to a second device" should be
interpreted as "the first device is directly connected to the
second device" or "the first device is indirectly connected to the
second device through other devices or connection means." In
addition, the term "signal" can mean a current, a voltage, a
charge, a temperature, data or any one or multiple signals.
[0022] FIG. 1 is a schematic diagram illustrating a memory storage
device according to an exemplary embodiment of the disclosure.
Referring to FIG. 1, a memory storage device 10 includes a memory
controller 11, a connection interface circuit 12 and a volatile
memory module 13. The memory controller 11, the connection
interface circuit 12 and the volatile memory module 13 may be
installed on one or more circuit boards in the memory storage
device 10. The memory controller 11 supports separate and/or
parallel data access operations for the volatile memory module
13.
[0023] The memory controller 11 can serve as a communication bridge
between a central processing unit (not shown) and the volatile
memory module 13 and can be dedicated to control the volatile
memory module 13. In an exemplary embodiment, the memory controller
11 is also known as a dynamic random access memory controller (DRAM
controller).
[0024] The volatile memory module 13 can be used to temporarily
store data. For example, the volatile memory module 13 may include
various types of volatile memory modules including a DDR SDRAM
(first generation Double Data Rate Synchronous Dynamic Random
Access Memory), a DDR 2 SDRAM (second generation Double Data Rate
Synchronous Dynamic Random Access Memory), a DDR 3 SDRAM (third
generation Double Data Rate Synchronous Dynamic Random Access
Memory), a DDR 4 SDRAM (fourth generation Double Data Rate
Synchronous Dynamic Random Access Memory). Also, the number of the
volatile memory module 13 may be one or more.
[0025] The connection interface circuit 12 is configured to connect
the memory controller 11 to the volatile memory module 13. When
data is to be read from the volatile memory module 13 or data is to
be stored into the volatile memory module 13, the memory controller
11 can send a control command to the volatile memory module 13
through the connection interface circuit 12. When the control
command is received by the volatile memory module 13, the volatile
memory module 13 can store write-data corresponding to the control
command or return read-data corresponding to the control command to
the memory controller 11 through the connection interface circuit
12. In an exemplary embodiment, the connection interface circuit 12
is also known as a memory interface circuit.
[0026] In an exemplary embodiment, the connection interface circuit
12 includes a phase locking circuit 101, a wire module 102 and a
signal interface 103. The phase locking circuit 101 is coupled to
the memory controller 11. The wire module 102 is coupled between
the phase locking circuit 101 and the signal interface 103. The
signal interface 103 is coupled between the connection interface
circuit 12 and the memory controller 11.
[0027] In an exemplary embodiment, the phase locking circuit 101 is
also known as a phase-locked loop (PLL) circuit. The phase locking
circuit 101 can receive a clock signal (a.k.a. a first clock
signal) CLK(1) from the memory controller 11. The phase locking
circuit 101 can generate a clock signal (a.k.a. a second clock
signal) CLK(2) according to the clock signal CLK(1) and a delay
feature of the wire module 102. The wire module 102 can provide a
clock signal (a.k.a. a third clock signal) CLK(3) to the signal
interface 103 according to the clock signal CLK(2).
[0028] In general, a delay of the clock signal CLK(2) will occur in
the process of being transmitted by the wire module 102, causing a
phase difference between the clock signals CLK(3) and CLK(2) to
shift. Therefore, conventionally, after the memory controller 11
provides the clock signal CLK(1) to the phase locking circuit 101,
the memory controller 11 needs to adjust a phase of the clock
signal CLK(3) provided by the wire module 102 so that the phase of
the clock signal CLK(3) and a phase of CLK(1) are aligned with each
other.
[0029] Thereafter, signals S(1) to S(24) outputted by the memory
controller 11 can be correctly cooperated with the clock signal
CLK(3) in the signal interface 103 to, for example, sample the
signals S(1) to S(24) at a correct phase. Here, the signals S(1) to
S(24) may include a data signal and/or a command signal.
[0030] Traditionally, the memory controller 11 mainly adjusts the
phase of the clock signal CLK(3) with a preset delay amount to
initially attempt to bring the phase of the clock signal CLK(3)
closer to the phase of CLK(1). In addition, the memory controller
11 can further correct the phase of the clock signal CLK(3) in an
iterative manner. However, under the influence of temperature
changes and/or process variations, such adjustment may take more
time than expected, resulting in a decrease in the performance of
the memory storage device 10.
[0031] In an exemplary embodiment, the phase locking circuit 101
can simulate the delay feature of the wire module 102 and generate
the clock signal CLK(2) according to such delay feature. For
example, the phase locking circuit 101 can attempt to lock a phase
difference between the clock signals CLK(1) and CLK(2) at a target
phase difference according to the delay feature of the wire module
102. The target phase difference can be affected by the delay
feature of the wire module 102. Then, in the process of
transmitting the clock signal CLK(2) to the signal interface 103,
the wire module 102 can delay the clock signal CLK(2) according to
its own delay feature to generate the clock signal CLK(3). In
particular, an delay amount of the clock signal CLK(2) in the wire
module 102 corresponds to the target phase difference described
above. In this way, at output terminals of the wire module 102, the
phase of the clock signal CLK(3) and the phase of the clock signal
CLK(1) can be substantially aligned with each other. It should be
noted that, the so-called "substantially aligned" may refer to
"completely aligned" or "partially aligned with fractional error
allowed".
[0032] FIG. 2 is a timing diagram of a plurality of signals
according to an exemplary embodiment of the disclosure. Referring
to FIG. 1 and FIG. 2, the phase locking circuit 101 can delay the
clock signal CLK(1) according to the delay feature of the wire
module 102 to generate the clock signal CLK(2) (i.e., a first
delay) so that the target phase difference (e.g., n degrees) is
generated between the clock signals CLK(1) and CLK(2). Then, in the
process of transmitting the clock signal CLK(2) to the signal
interface 103, the wire module 102 can delay the clock signal
CLK(2) according to its own delay feature to generate the clock
signal CLK(3) (i.e., a second delay). The phase of the clock signal
CLK(3) output by the wire module 102 and the phase of the clock
signal CLK(1) can be substantially aligned with each other. In
addition, the clock signal CLK(3) output by the wire module 102 can
also be automatically aligned with a signal S(i) to facilitate a
subsequent analysis of the signal S(i). The signal S(i) may be any
one of the signals S(1) to S(24) in FIG. 1.
[0033] In other words, after the first delay, the target phase
difference can be generated between the clock signals CLK(1) and
CLK(2). However, after the second delay, the target phase
difference can be recovered or removed so that the phase of the
clock signal CLK(3) and the phase of the clock signal CLK(1) can be
substantially aligned with each other. In an exemplary embodiment,
under the influence of temperature changes and/or process
variations, in response to changes in the delay feature of the wire
module 102, the phase locking circuit 101 can dynamically adjust
the target phase difference. According to the dynamically adjusted
target phase difference, the phase of the clock signal CLK(3) can
continuously be substantially aligned with the phase of the clock
signal CLK(1).
[0034] FIG. 3 is a schematic diagram illustrating a phase locking
circuit according to an exemplary embodiment of the disclosure.
Referring to FIG. 3, the phase locking circuit 101 includes a
modulation circuit 31 and a compensation circuit 32. The modulation
circuit 31 is coupled to the memory controller 101 and the wire
module 102 of FIG. 1. The compensation circuit 32 is coupled to the
modulation circuit 31. The modulation circuit 31 can receive the
clock signal CLK(1) and a compensation signal CS. The modulation
circuit 31 can generate the clock signal CLK(2) according to the
clock signal CLK(1) and the compensation signal CS. For example,
the modulation circuit 31 can be used to continuously adjust (e.g.,
delay) the phase of the clock signal CLK(2) to reduce a phase
difference between the clock signal CLK(1) and the compensation
signal CS. After reaching a steady state (e.g., a phase of the
compensation signal CS catches up with the phase of the pulse
signal CLK(1)), the modulation circuit 31 can lock the phase
difference between the clock signals CLK(1) and CLK(2) at the
target phase difference.
[0035] In an exemplary embodiment, the modulation circuit 31
includes a phase detector 311 and a clock output circuit 312. The
phase detector 311 can receive the clock signal CLK(1) and the
compensation signal CS. The phase detector 311 can detect the phase
difference between the clock signal CLK(1) and the compensation
signal CS and generate a phase difference signal FD. For example,
the phase difference signal FD can reflect the phase difference
between the clock signal CLK(1) and the compensation signal CS. The
clock output circuit 312 can receive the phase difference signal FD
and generate the clock signal CLK(2) according to the phase
difference signal FD. For example, the clock output circuit 312 may
include a charge pump, a voltage controlled oscillator and/or a
voltage divider. The clock output circuit 312 can continuously
adjust the phase of the clock signal CLK(2) according to the phase
difference signal FD.
[0036] The compensation circuit 32 can generate the compensation
signal CS according to the clock signal CLK(2). For example, the
compensation circuit 32 can simulate the delay feature of the wire
module 102 and delay the clock signal CLK(2) according to such
delay feature to generate the compensation signal CS.
[0037] FIG. 4 is an equivalent schematic diagram illustrating a
compensation circuit according to an exemplary embodiment of the
disclosure. Referring to FIG. 4, taking a wire module 402 as an
example, the wire module 402 includes connection lines L(1) to L(4)
and wiring turning points P(1) to P(4). The wire module 402 can
delay a signal at an input terminal IN according to its own delay
feature and output the delayed signal at output terminals OUT.
[0038] A compensation circuit 42 is an equivalent circuit of the
wire module 402. The compensation circuit 42 can simulate the delay
feature of the wire module 402. For example, the compensation
circuit 42 includes circuit modules (a.k.a. first circuit modules)
EL(1) to EL(4) and circuit modules (a.k.a. second circuit modules)
EP(1) to EP(4). The circuit modules EL(1) to EL(4) can be used to
simulate delay features of the connection lines L(1) to L(4) in the
wire module 402, respectively. The circuit modules EP(1) to EP(4)
can be used to simulate delay features of the wiring turning points
P(1) to P(4) in the wire module 402, respectively.
[0039] In an exemplary embodiment, each of the circuit modules
EL(1) to EL(4) includes at least one RC circuit. As shown by FIG.
4, one RC circuit can include at least one resistance component and
at least one capacitance component. In an exemplary embodiment,
each of the circuit modules EP(1) to EP(4) includes at least one
buffer component. As shown by FIG. 4, one buffer component may be a
non-reversing or reversing delay component (e.g., a reversing
amplifier). An delay amount generated by a signal passing through
the wire module 402 can be equal to an delay amount generated by
the signal passing through the compensation circuit 42. A similar
circuit design can be applied to design the compensation circuit 32
of FIG. 3 to simulate the delay feature of the wire module 102 of
FIG. 1.
[0040] In an exemplary embodiment of FIG. 1 and/or FIG. 3, the
phase locking circuit 101 and/or the clock output circuit 312 can
generate the clock signal CLK(2) with 1.times. frequency. That is
to say, the frequency of the clock signal CLK(2) is identical to
the frequency of the clock signal CLK(1). Nonetheless, in an
exemplary embodiment of FIG. 1 and/or FIG. 3, the phase locking
circuit 101 and/or the clock output circuit 312 can also generate a
2.times. clock signal, a 4.times. clock signal or a clock signal
with frequency of other multiples. For example, the frequency of
the 2.times. clock signal is 2 times the frequency of the clock
signal CLK(2), the frequency of the 4.times. clock signal is 4
times the frequency of the clock signal CLK(2), and so on and so
forth.
[0041] It should be noted that the schematic diagrams of the
circuit structures presented in FIG. 1, FIG. 3 and FIG. 4 are
merely examples and are not intended to limit the disclosure. In
other exemplary embodiments not mentioned, more electronic
components may be included in the circuit structures presented in
FIG. 1, FIG. 3, and FIG. 4 to provide additional functionality.
Alternatively, some of the electronic components in the circuit
structure presented in FIG. 1, FIG. 3, and FIG. 4 may be replaced
by electronic components having the same or similar functions, and
the disclosure is not limited thereto.
[0042] FIG. 5 is a flowchart illustrating a signal generation
method according to an exemplary embodiment of the disclosure.
Referring to FIG. 5, in step S501, a first clock signal is received
from a memory controller. In step S502, a second clock signal is
generated according to the first clock signal and a delay feature
of a wire module in the connection interface circuit. In step S503,
a third clock signal is provided to a signal interface between the
connection interface circuit and the memory controller by the wire
module according to the second clock signal.
[0043] Nevertheless, steps depicted in FIG. 5 are described in
detail as above so that related description thereof is omitted
hereinafter. It should be noted that, the steps depicted in FIG. 5
may be implemented as a plurality of program codes or circuits,
which are not particularly limited in the disclosure. Moreover, the
method disclosed in FIG. 5 may be implemented by reference with
above exemplary embodiments, or may be implemented separately,
which are not particularly limited in the disclosure.
[0044] FIG. 6 is a schematic diagram illustrating a memory storage
device according to an exemplary embodiment of the disclosure.
Referring to FIG. 6, a memory storage device 60 is a memory storage
device including both a rewritable non-volatile memory module 63
and a volatile memory module 64, such as a SSD (Solid State Drive).
The memory storage device 60 can be used together with a host
system so the host system can write data into the memory storage
device 60 or read data from the memory storage device 60. For
example, the mentioned host system may be any system capable of
substantially cooperating with the memory storage device 60 for
storing data, such as a desktop computer, a notebook computer, a
digital camera, a video camera, a communication device, an audio
player, a video player or a tablet computer.
[0045] The memory storage device 60 includes a connection interface
unit 61, a memory control circuit unit 62, the rewritable
non-volatile memory module 63 and the volatile memory module 64.
The connection interface unit 61 is configured to connect the
memory storage device 60 to the host system. In an exemplary
embodiment, the connection interface unit 61 is compatible with a
SATA (Serial Advanced Technology Attachment) standard.
Nevertheless, it should be understood that the disclosure is not
limited in this regard. The connection interface unit 61 may also
be compatible with a PATA (Parallel Advanced Technology Attachment)
standard, a PCI Express (Peripheral Component Interconnect Express)
interface standard, a USB (Universal Serial Bus) standard or other
suitable standards. The connection interface unit 61 may be
packaged together with the memory control circuit unit 62 into one
chip, or the connection interface unit 61 may also be distributed
outside of a chip containing the memory control circuit unit
62.
[0046] The memory control circuit unit 62 is configured to perform
operations of writing, reading or erasing data in the rewritable
non-volatile memory module 63 according to the control commands.
For example, the memory control circuit unit 62 may include the
memory controller 11 and the connection interface circuit 12 in
FIG. 1 to control the volatile memory module 64.
[0047] The rewritable non-volatile memory module 63 is coupled to
the memory control circuit unit 62 and configured to store data
written from the host system. The rewritable non-volatile memory
module 63 may be a SLC (Single Level Cell) NAND flash memory module
(i.e., a flash memory module capable of storing one bit in one
memory cell), an MLC (Multi Level Cell) NAND flash memory module
(i.e., a flash memory module capable of storing two bits in one
memory cell), a TLC (Triple Level Cell) NAND flash memory module
(i.e., a flash memory module capable of storing three bits in one
memory cell), a QLC (Qual Level Cell) NAND-type flash memory module
(i.e., a flash memory module capable of storing four bits in one
memory cell), other flash memory modules or other memory modules
having the same features.
[0048] In summary, after the first delay of the phase locking
circuit, the target phase difference can be generated between the
first clock signal and the second clock signal. Then, after the
second delay of the wire module, the target phase difference can be
recovered or removed so that the phase of the third clock signal
and the phase of the first clock signal can be substantially
aligned with each other. Accordingly, under the influence of
temperature changes and/or process variations, the phase of the
third clock signal can continuously be substantially aligned with
the phase of the first clock signal. As a result, the efficiency of
signal alignment between the connection interface circuit and the
memory controller can be effectively improved.
[0049] The previously described exemplary embodiments of the
present disclosure have the advantages aforementioned, wherein the
advantages aforementioned not required in all versions of the
disclosure.
[0050] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present disclosure without departing from the scope or spirit of
the disclosure. In view of the foregoing, it is intended that the
present disclosure cover modifications and variations of this
disclosure provided they fall within the scope of the following
claims and their equivalents.
* * * * *