U.S. patent application number 16/394247 was filed with the patent office on 2021-02-25 for connector having contact members.
This patent application is currently assigned to GITech Inc.. The applicant listed for this patent is GITech Inc.. Invention is credited to John Williams.
Application Number | 20210055329 16/394247 |
Document ID | / |
Family ID | 1000005381757 |
Filed Date | 2021-02-25 |
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United States Patent
Application |
20210055329 |
Kind Code |
A9 |
Williams; John |
February 25, 2021 |
CONNECTOR HAVING CONTACT MEMBERS
Abstract
An electrical connector comprises a bottom assembly, a first
contact assembly, a first substrate assembly, a second contact
assembly, a second substrate assembly, a third contact assembly, a
top assembly and a plurality of conductive vias. The bottom
assembly, the first contact assembly, the first substrate assembly,
the second contact assembly, the second substrate assembly, the
third contact assembly, and the top assembly are arranged in the
given order. The plurality of conductive vias penetrate the bottom
assembly, the first substrate assembly, the second substrate
assembly, and the top assembly. Each of the contact member of the
first contact assembly, the second contact assembly, and the third
contact assembly are of a letter V shape.
Inventors: |
Williams; John; (AUSTIN,
TX) |
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Applicant: |
Name |
City |
State |
Country |
Type |
GITech Inc. |
Austin |
TX |
US |
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Assignee: |
GITech Inc.
AUSTIN
TX
|
Prior
Publication: |
|
Document Identifier |
Publication Date |
|
US 20190391180 A1 |
December 26, 2019 |
|
|
Family ID: |
1000005381757 |
Appl. No.: |
16/394247 |
Filed: |
April 25, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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16246529 |
Jan 13, 2019 |
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16394247 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01R 1/06733 20130101;
G01R 31/2886 20130101; G01R 1/07378 20130101; H01R 2201/20
20130101; H05K 1/115 20130101; H01R 13/6625 20130101; H01R 13/502
20130101; H01R 12/714 20130101; H01R 13/2435 20130101; H05K 1/111
20130101 |
International
Class: |
G01R 1/073 20060101
G01R001/073; H05K 1/11 20060101 H05K001/11; H01R 12/71 20060101
H01R012/71; H01R 13/24 20060101 H01R013/24; H01R 13/66 20060101
H01R013/66; H01R 13/502 20060101 H01R013/502; G01R 1/067 20060101
G01R001/067; G01R 31/28 20060101 G01R031/28 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 30, 2018 |
TW |
107114634 |
May 17, 2018 |
CN |
201810474999.1 |
Jun 25, 2018 |
TW |
107121644 |
Claims
1. An electrical connector comprising: a bottom assembly extending
along a first direction, the bottom assembly comprising a bottom
conductive layer; and a bottom insulation layer; a first contact
assembly comprising a first plurality of contact members; a first
substrate assembly comprising a first substrate layer; a first
conductive layer; and a first encapsulation layer; a second contact
assembly comprising a second plurality of contact members; a second
substrate assembly comprising a second encapsulation layer; a
second conductive layer; and a second substrate layer; a third
contact assembly comprising a third plurality of contact members;
and a top assembly comprising a top insulation layer; and a top
conductive layer; and a plurality of conductive vias; wherein the
bottom assembly, the first contact assembly, the first substrate
assembly, the second contact assembly, the second substrate
assembly, the third contact assembly, and the top assembly are
arranged in the given order in a second direction perpendicular to
the first direction; and wherein the plurality of conductive vias
penetrate the bottom assembly, the first substrate assembly, the
second substrate assembly, and the top assembly.
2. The electrical connector of claim 1, wherein each of the first
plurality of contact members, the second plurality of contact
members, and the third plurality of contact members comprises a
base portion; a first arm; a second arm; a first spacer; and a
second spacer; wherein the first arm; the base portion; and the
second arm form a letter V shape; wherein a top surface of the
first spacer is directly attached to a bottom surface of the base
portion; wherein a bottom surface of the second spacer is directly
attached to a top surface of the base portion.
3. The electrical connector of claim 2, wherein each of the first
contact assembly, the second contact assembly, and the third
contact assembly further comprises a lower spacer; a center
conductive disk; and an upper spacer; wherein a top surface of the
lower spacer is directly attached to a bottom surface of the center
conductive disk; wherein a bottom surface of the upper spacer is
directly attached to a top surface of the center conductive disk;
wherein the plurality of conductive vias comprise a first
conductive via; a center conductive via; and a second conductive
via; wherein the first conductive via, the center conductive via,
and the second conductive via are arranged along the first
direction; and wherein the center conductive via passes through a
center hole of the lower spacer, a center hole of the center
conductive disk, and a center hole of the upper spacer.
4. The electrical connector of claim 3, wherein the center
conductive disk is of a circular disk shape; and wherein the center
conductive via is of a cylinder shape.
5. The electrical connector of claim 3, wherein a top surface of
each first arm of the first plurality of contact members and a top
surface of each second arm of the first plurality of contact
members are co-planar; wherein a top surface of each first arm of
the second plurality of contact members and a top surface of each
second arm of the second plurality of contact members are
co-planar; and wherein a top surface of each first arm of the third
plurality of contact members and a top surface of each second arm
of the third plurality of contact members are co-planar.
6. The electrical connector of claim 5, wherein the center
conductive via is located at an opening side of each letter V
shape.
7. The electrical connector of claim 3, wherein the first substrate
assembly further comprises a first additional encapsulation layer;
a first additional conductive layer; and a capacitor; and wherein
the second substrate assembly further comprises a second additional
conductive layer; a second additional encapsulation layer; and a
capacitor.
8. The electrical connector of claim 3, wherein the electrical
connector is symmetric with respect to a centerline of the
electrical connector; wherein the centerline is parallel to the
first direction; wherein the electrical connector is symmetric with
respect to a symmetric line of the electrical connector; wherein
the symmetric line is perpendicular to the centerline; and wherein
the symmetric line passes through a centroid of the center
conductive via.
9. The electrical connector of claim 8, wherein each first arm and
second arm comprises a slender portion; and an end portion; wherein
a length of the slender portion is larger than a length of the end
portion; and wherein a width of the slender portion is smaller than
a width of the end portion.
10. The electrical connector of claim 9, wherein a majority portion
of the end portion is of an arc shape.
11. The electrical connector of claim 10, wherein a bottom surface
of the first spacer of each of the first plurality of contact
members directly contacts a top surface of the bottom insulation
layer of the bottom assembly; wherein a top surface of the second
spacer of each of the first plurality of contact members directly
contacts a bottom surface of the first substrate layer; wherein a
bottom surface of the first spacer of each of the second plurality
of contact members directly contacts a top surface of the first
encapsulation layer; wherein a top surface of the second spacer of
each of the second plurality of contact members directly contacts
the second encapsulation layer; wherein a bottom surface of the
first spacer of each of the third plurality of contact members
directly contacts a top surface of the second substrate layer; and
wherein a top surface of the second spacer of each of the third
plurality of contact members directly contacts a bottom surface of
the top insulation layer of the top assembly.
12. The electrical connector of claim 3, wherein the first
substrate assembly and the second substrate assembly are of
rectangular prism shapes.
13. The electrical connector of claim 3, wherein a first selected
contact member of the second plurality of contact members is
connected to a first signal pad; wherein a second selected contact
member of the second plurality of contact members is connected to a
second signal pad; wherein a third selected contact member of the
second plurality of contact members is connected to a third signal
pad; wherein a fourth selected contact member of the second
plurality of contact members is connected to a fourth signal pad;
and wherein remaining contact members of the second plurality of
contact members, the first plurality of contact members and the
third plurality of contact members are connected to a ground pad.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This patent application claims priority of TW107121644 filed
on Jun. 25, 2018. This patent application is a Continuation-in-part
application of U.S. patent application Ser. No. 16/246,529 filed on
Jan. 13, 2019. The disclosure made in U.S. Pat. No. 7,989,945 to
Williams et al., the disclosure made in the Patent Application
TW107121644, and the disclosure made in the patent application Ser.
No. 16/246,529 are hereby incorporated by reference.
FIELD OF THE INVENTION
[0002] This invention relates generally to an electrical connector.
More particularly, the present invention relates to an electrical
connector having contact members configured as a modular unit.
BACKGROUND OF THE INVENTION
[0003] FIG. 1 shows a cross-sectional view of a conventional
testing apparatus 9. The testing apparatus 9 facilitates testing of
a device under test (DUT) 900. The DUT 900 can be any form of
packaged integrated circuit (IC) derived from a wafer. The testing
apparatus 9 includes a base 91 and a plurality of spring probes 92.
During testing, the plurality of spring probes 92 are electrically
connected to the DUT 900. The design of the testing apparatus 9 and
locations of the plurality of spring probes 92 are determined based
on the input and output locations of the DUT 900. The type, size,
and shape of DUT may vary which in turn requires various socket
configurations to be considered. New test configurations result in
specific testing apparatuses to be deployed to match DUT foot
prints at the expense of additional manufacturing cost to the
customer.
[0004] Current testing methods require the plurality of spring
probes 92 that directly contact pads or solder balls of the DUT 900
to test electrical signals. Certain testing methods further require
a predetermined force to move the plurality of spring probes 92 so
as to generate frictional motion relative to the contact pads of
the DUT 900. Certain testing methods still further require a
predetermined pressure applied to the contact interfaces between
the plurality of spring probes 92 and the pads of the DUT 900.
[0005] One advantage of the electrical connector of the present
disclosure is its scalable nature. The electrical connector may be
employed to test various electronic devices.
SUMMARY OF THE INVENTION
[0006] An electrical connector (unit) comprises a bottom assembly,
a first contact assembly, a first substrate assembly, a second
contact assembly, a second substrate assembly, a third contact
assembly, a top assembly and a plurality of conductive columns or
vias. The bottom assembly, the first contact assembly, the first
substrate assembly, the second contact assembly, the second
substrate assembly, the third contact assembly, and the top
assembly are arranged in the given order. Interspersed between the
above-mentioned assemblies are a plurality of conductive columns or
via structures that enable electrical connection throughout
conductive layers or circuitry located in the bottom assembly, the
first substrate assembly, the second substrate assembly, and the
top assembly. The design and construction of such a connector
(unit) provides a unique ability to manipulate electrical responses
between the connector (unit) and the apparatus it is electrically
connecting to.
[0007] The bottom assembly comprises a bottom conductive layer and
a bottom insulation layer. The first contact assembly comprises a
first plurality of contact members, the second contact assembly
comprises a second plurality of contact members, and the third
contact assembly comprises a third plurality of contact members.
The first substrate assembly comprises a first substrate layer, a
first conductive layer, and a first encapsulation layer. The second
substrate assembly comprises a second encapsulation layer, a second
conductive layer, and a second substrate layer. The top assembly
comprises a top insulation layer and a top conductive layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 is a cross-sectional view of a conventional testing
apparatus.
[0009] FIG. 2 is an exploded plot of an electrical connector in
examples of the present disclosure.
[0010] FIG. 3 is an assembled perspective view of the electrical
connector of FIG. 2.
[0011] FIG. 4 is a top view of the electrical connector of FIG.
2.
[0012] FIG. 5 is a frontal view of one or more contact members in
examples of the present disclosure.
[0013] FIG. 6 is an end view of the electrical connector of FIG.
2.
[0014] FIG. 7 is a perspective view of an electrical connector
showing contact members configured in a specific manner that
connect to signal pads in examples of the present disclosure.
[0015] FIG. 8 is a frontal view of deformed contact members in
examples of the present disclosure.
[0016] FIG. 9 is an exploded plot showing a device under test in
examples of the present disclosure.
[0017] FIG. 10 is an assembled frontal view of FIG. 9 showing an
electrically connected apparatus in examples of the present
disclosure.
[0018] FIG. 11 is an end view of another electrical connector.
[0019] FIG. 12 is an exploded plot of another electrical connector
in examples of the present disclosure.
[0020] FIG. 13 is an assembled perspective view of the electrical
connector of FIG. 12.
[0021] FIG. 14 is a top view of the electrical connector of FIG.
12.
[0022] FIG. 15 is an end view of the electrical connector of FIG.
12.
DETAILED DESCRIPTION OF THE INVENTION
[0023] FIG. 2 is an exploded plot, FIG. 3 is an assembled
perspective view, FIG. 4 is a top view and FIG. 6 is an end view of
an electrical connector 200 in examples of the present disclosure.
The electrical connector 200 includes a plurality of substrate
assemblies 1, a plurality of contact assemblies 2 comprising a
plurality of bases 211 and a plurality of arms 212, a plurality of
spacers 22, and a plurality of surface assemblies 3.
[0024] In examples of the present disclosure, the electrical
connector 200 comprises a bottom assembly 237A, a first contact
assembly 202A, a first substrate assembly 201A, a second contact
assembly 202B, a second substrate assembly 201B, a third contact
assembly 202C, a top assembly 237B and a plurality of conductive
columns and vias 4 (for example, 241A, 241B, and 241C).
[0025] In examples of the present disclosure, the bottom assembly
237A extends along X-direction. The bottom assembly 237A comprises
a bottom conductive layer 32 and a bottom insulation layer 31. In
one example, the bottom conductive layer 32 has a constant
thickness. In one example, the bottom insulation layer 31 has a
constant thickness.
[0026] In examples of the present disclosure, the first contact
assembly 202A comprises a first plurality of contact members 21,
the second contact assembly 202B comprises a second plurality of
contact members 21, and the third contact assembly 202C comprises a
third plurality of contact members 21.
[0027] In examples of the present disclosure, the first substrate
assembly 201A comprises a first substrate layer 11, a first
conductive layer 12, and a first encapsulation layer 13. In one
example, the first substrate layer 11 has a constant thickness. The
first conductive layer 12 has a constant thickness. The first
encapsulation layer 13 has a constant thickness. In examples of the
present disclosure, a bottom surface of the first conductive layer
12 is directly attached to a top surface of the first substrate
layer 11. A bottom surface of the first encapsulation layer 13 is
directly attached to a top surface of the first conductive layer
12.
[0028] In examples of the present disclosure, the second substrate
assembly 201B comprises a second encapsulation layer 13, a second
conductive layer 12, and a second substrate layer 11. In one
example, the second encapsulation layer 13 has a constant
thickness. The second conductive layer 12 has a constant thickness.
The second substrate layer 11 has a constant thickness. In examples
of the present disclosure, a bottom surface of the second
conductive layer 12 is directly attached to a top surface of the
second encapsulation layer 13. A bottom surface of the second
substrate layer 11 is directly attached to a top surface of the
second conductive layer 12.
[0029] In examples of the present disclosure, the top assembly 237B
extends along X-direction. The top assembly 237B comprises a top
insulation layer 31 and a top conductive layer 32. In one example,
the top insulation layer 31 has a constant thickness. In one
example, the top conductive layer 32 has a constant thickness.
[0030] In examples of the present disclosure, the bottom assembly
237A, the first contact assembly 202A, the first substrate assembly
201A, the second contact assembly 202B, the second substrate
assembly 201B, the third contact assembly 202C, and the top
assembly 237B are arranged in the given order in Y-direction.
[0031] In examples of the present disclosure, the plurality of
conductive vias 4, comprising a plurality of separated vias 41,
penetrate and electrically connect to the bottom assembly 237A, the
first substrate assembly 201A, the second substrate assembly 201B,
and the top assembly 237B.
[0032] In examples of the present disclosure, the first contact
assembly 202A further comprises a first spacer assembly 223A. The
second contact assembly 202B further comprises a second spacer
assembly 223B. The third contact assembly 202C further comprises a
third spacer assembly 223C. In examples of the present disclosure,
each of the first spacer assembly 223A, the second spacer assembly
223B, and the third spacer assembly 223C comprises a lower spacer
24A, a center conductive disk 23, and an upper spacer 24B. A top
surface of the lower spacer 24A is directly attached to a bottom
surface of the center conductive disk 23. A bottom surface of the
upper spacer 24B is directly attached to a top surface of the
center conductive disk 23.
[0033] In examples of the present disclosure, the plurality of
conductive vias 4 comprise a first conductive via 241A, a center
conductive via 241B, and a second conductive via 241C. The first
conductive via 241A, the center conductive via 241B, and the second
conductive via 241C are arranged along the X-direction. The center
conductive via 241B passes through a center hole of the lower
spacer 24A, a center hole 231 of the center conductive disk 23, and
a center hole of the upper spacer 24B.
[0034] In examples of the present disclosure, the center conductive
disk 23 is of a circular disk shape. The center conductive via 241B
is of a cylinder shape.
[0035] In examples of the present disclosure, the electrical
connector 200 is symmetric with respect to a centerline 292 of the
electrical connector 200. The centerline 292 is parallel to
X-direction. The electrical connector is symmetric with respect to
a symmetric line 294 of the electrical connector 200. The symmetric
line 294 is perpendicular to the centerline 292. The symmetric line
294 passes through a centroid of the center conductive via
241B.
[0036] In examples of the present disclosure, the first substrate
assembly 201A and the second substrate assembly 201B are of
rectangular prism shapes.
[0037] FIG. 5 is a frontal view of a contact member 21 in examples
of the present disclosure. In examples of the present disclosure,
the contact member 21 comprises a base portion 522, a first arm
542, a second arm 544, a first spacer 22A of FIG. 6, and second
spacer 22B of FIG. 6. The first arm 542; the base portion 522; and
the second arm 544 form a letter V shape. A top surface of the
first spacer 22A is directly attached to a bottom surface of the
base portion 522. A bottom surface of the second spacer 22B is
directly attached to a top surface of the base portion 522.
[0038] In examples of the present disclosure, the first arm 542 and
the second arm 544 are under in-plane flexural deflection.
[0039] In examples of the present disclosure, the center conductive
via 241B of FIG. 2 is located at an opening side of each letter V
shape of FIGS. 2 and 5.
[0040] In examples of the present disclosure, a top surface of each
first arm 542 of the first contact assembly 202A and a top surface
of each second arm 544 of the first contact assembly 202A are
co-planar. A top surface of each first arm 542 of the second
contact assembly 202B and a top surface of each second arm 544 of
the second contact assembly 202B are co-planar. A top surface of
each first arm 542 of the third contact assembly 202C and a top
surface of each second arm 544 of the third contact assembly 202C
are co-planar.
[0041] In examples of the present disclosure, each first arm 542
and second arm 544 comprises a slender portion 590 and an end
portion 592. A length of the slender portion 590 is larger than a
length of the end portion 592. A width of the slender portion 590
is smaller than a width of the end portion 592. In examples of the
present disclosure, a majority portion of the end portion 592 is of
an arc shape.
[0042] From FIGS. 2-6, a bottom surface of the first spacer 22A of
FIG. 6 of each of the first contact assembly 202A directly contacts
a top surface of the bottom insulation layer of the bottom assembly
237A. A top surface of the second spacer 22B of FIG. 6 of each of
the first contact assembly 202A directly contacts a bottom surface
of the first substrate layer of the first substrate assembly 201A.
A bottom surface of the first spacer of each of the second contact
assembly 202B directly contacts a top surface of the first
encapsulation layer of the first substrate assembly 201A. A top
surface of the second spacer of each of the second contact assembly
202B directly contacts the second encapsulation layer of the second
substrate assembly 201B. A bottom surface of the first spacer of
each of the third contact assembly 202C directly contacts a top
surface of the second substrate layer of the second substrate
assembly 201B. A top surface of the second spacer of each of the
third contact assembly 202C directly contacts a bottom surface of
the top insulation layer of the top assembly 237B.
[0043] FIG. 7 is a perspective view of an electrical connector 700
showing contact members configured in a specific manner that
connect to signal pads in examples of the present disclosure. A
first selected contact member 721A (shown in dark color) of the
second plurality of contact members is connected to a first signal
pad. A second selected contact member 721B (shown in dark color) of
the second plurality of contact members is connected to a second
signal pad. A third selected contact member 721C (shown in dark
color) of the second plurality of contact members is connected to a
third signal pad. A fourth selected contact member 721D (shown in
dark color) of the second plurality of contact members is connected
to a fourth signal pad. Remaining contact members of the second
plurality of contact members, the first plurality of contact
members and the third plurality of contact members 741 are
connected to a ground pad.
[0044] FIG. 8 is a frontal view of deformed contact members in
examples of the present disclosure. In examples of the present
disclosure, under deformation, each contact member still does not
touch adjacent contact member.
[0045] FIG. 9 is an exploded plot and FIG. 10 is a side view
showing a device under test in examples of the present disclosure.
In examples of the present disclosure, the electrical connector 200
is enclosed in an electrically shielded housing 8 and is above an
actuation module 7. The electrically shielded housing 8 has top and
bottom shielded surfaces 81. The top and bottom shielded surfaces
81 comprise a plurality of slots 810. The device 909 under test has
a plurality of pads 991. In examples of the present disclosure,
four pads with dark color are signal pads. Remaining pads are
ground pads.
[0046] FIG. 11 is an end view of an electrical connector 1100. The
electrical connector 1100 is similar to the electrical connector
200 except that the electrical connector 1100 includes additional
components. The first substrate assembly further comprises a first
additional encapsulation layer 13P, a first additional conductive
layer 12P, and a capacitor 14. The second substrate assembly
further comprises a second additional conductive layer 12Q, a
second additional encapsulation layer 13Q, and a capacitor. In
examples of the present disclosure, the first additional
encapsulation layer 13P has a constant thickness. The first
additional conductive layer 12P has a constant thickness. The
second additional conductive layer 12Q has a constant thickness.
The second additional encapsulation layer 13Q has a constant
thickness.
[0047] FIG. 12 is an exploded plot of another electrical connector
in examples of the present disclosure. An electrical connector 1200
of FIG. 12 is a variant of the electrical connector 200 of FIG. 2.
FIG. 13 is an assembled perspective view of the electrical
connector of FIG. 12. FIG. 14 is a top view of the electrical
connector of FIG. 12. FIG. 15 is an end view of the electrical
connector of FIG. 12. The electrical connector 1200 includes a
plurality of substrate assemblies 1, a plurality of contact
assemblies 2 comprising a plurality of bases 211 and a plurality of
arms 212, a plurality of spacers 22, a plurality of surface
assemblies 3, and a plurality of conductive columns or vias 41A and
41B interspersed between assemblies of the connector unit 1200.
[0048] Those of ordinary skill in the art may recognize that
modifications of the embodiments disclosed herein are possible. For
example, a total number of contact members in an electrical
connector and the approach in which they are electrically
configured may vary. Other modifications may occur to those of
ordinary skill in this art, and all such modifications are deemed
to fall within the purview of the present invention, as defined by
the claims.
* * * * *