U.S. patent application number 17/068535 was filed with the patent office on 2021-01-28 for loop heat pipe structure.
The applicant listed for this patent is ASIA VITAL COMPONENTS (CHINA) CO., LTD.. Invention is credited to Yuan-Yi Lin.
Application Number | 20210025658 17/068535 |
Document ID | / |
Family ID | 1000005149246 |
Filed Date | 2021-01-28 |
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United States Patent
Application |
20210025658 |
Kind Code |
A1 |
Lin; Yuan-Yi |
January 28, 2021 |
LOOP HEAT PIPE STRUCTURE
Abstract
A loop heat pipe structure includes an evaporator internally
defining a vaporization chamber, in which a first wick structure is
provided and a working fluid is filled; at least one vapor pipe
having a first end and a second end, and the first end being
communicable with an end of the evaporator; and at least one liquid
pipe having a third end and a fourth end, the third end being
communicable with the second end of the at least one vapor pipe and
forming a condensing section, and the fourth end being communicable
with another end of the evaporator. The evaporator, the at least
one vapor pipe and the at least one liquid pipe together form a
loop for the working fluid; and a grand total cross sectional area
of the at least one vapor pipe is larger than that of the at least
one liquid pipe.
Inventors: |
Lin; Yuan-Yi; (Shenzhen,
CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASIA VITAL COMPONENTS (CHINA) CO., LTD. |
Shenzhen |
|
CN |
|
|
Family ID: |
1000005149246 |
Appl. No.: |
17/068535 |
Filed: |
October 12, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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15821719 |
Nov 22, 2017 |
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17068535 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F28D 15/043
20130101 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. A loop heat pipe structure, comprising: an evaporator internally
defining a vaporization chamber, in which a first wick structure is
provided and a working fluid is filled; a plurality of vapor pipes
each having a first end and a second end, and the first end being
communicable with one end of the evaporator; and at least one
liquid pipe having a third end and a fourth end, the third end
being communicable with the second end of the plurality of vapor
pipes and forming a condensing section, and the fourth end being
communicable with another end of the evaporator; and the
evaporator, the plurality of vapor pipes and the liquid pipes
together forming a loop for the working fluid; and where a grand
total cross sectional area of the plurality of vapor pipes is
larger than a grand total cross sectional area of the at least one
liquid pipe.
2. The loop heat pipe structure as claimed in claim 1, wherein the
condensing section is diametrically expanded and internally defines
a condensation chamber, which has an end communicable with the
second end of the plurality of vapor pipes and another end
communicable with the third end of the at least one liquid
pipe.
3. The loop heat pipe structure as claimed in claim 1, wherein the
at least one liquid pipe is internally provided with a second wick
structure.
4. The loop heat pipe structure as claimed in claim 3, wherein the
condensing section is internally provided with a third wick
structure, and the third wick structure being capillarily connected
to the second wick structure.
5. The loop heat pipe structure as claimed in claim 1, wherein the
condensing section is externally provided with a radiation fin
assembly.
6. The loop heat pipe structure as claimed in claim 1, wherein the
first wick structure separates the vaporization chamber into a
liquid chamber and a vapor chamber; the liquid chamber being
located adjacent to the fourth end of the at least one liquid pipe
and storing the working fluid that is in a liquid phase, and the
vapor chamber being located adjacent to the first end of the
plurality of vapor pipes and allowing the working fluid in a gas
phase to flow therethrough; and the first wick structure including
a plurality of grooves, via which the gas-phase working fluid
flowing to the vapor chamber.
7. The loop heat pipe structure as claimed in claim 1 wherein there
are two liquid pipes.
8. The loop heat pipe structure as claimed in claim 2 wherein there
are two liquid pipes.
9. The loop heat pipe structure as claimed in claim 6 wherein there
are two liquid pipes.
Description
[0001] The present application is a continuation in part of U.S.
patent application Ser. No. 15/821,719, filed on Nov. 22, 2017.
FIELD OF THE INVENTION
[0002] The present invention relates to a loop heat pipe structure,
and more particularly to a loop heat pipe structure that increases
the amount of gas-phase working fluid flowing out of an evaporator
of the loop heat pipe structure.
BACKGROUND OF THE INVENTION
[0003] While the currently available electronic apparatus have
increasingly upgraded performance, the electronic elements of these
high-performance electronic apparatus for signal processing and
data computing also produce more heat than the electronic elements
of the conventional electronic apparatus. Generally, the most
commonly adopted heat dissipation elements include heat pipes, heat
sinks and vapor chambers. These heat dissipation elements are so
arranged that they are in direct contact with the heat-producing
electronic elements in order to provide further enhanced heat
dissipation effect and prevent the electronic elements from being
burnt out due to overheating. In many cases, fans with forced heat
dissipation effect are further used to cool the heat-producing
electronic elements. While the fans indeed enable upgraded heat
dissipation effect, they are not always suitable for use with the
electronic apparatus that have a limited or narrow internal space.
Therefore, the space available in the electronic apparatus is also
a key point to be considered in designing a heat dissipation
system. Recently, the concept of gas-liquid circulation in a heat
pipe has been utilized to develop a loop heat pipe structure (LHP),
which is a loop module consisting of a vaporization chamber and a
condensation device fluid-communicably connected to each other via
a pipe, through which a working fluid flows.
[0004] The pipe in the above-described conventional loop heat pipe
structure for connecting the vaporization chamber to the
condensation device can be divided into two sections, namely, a
vapor pipe extended from a vapor outlet of the vaporization chamber
to the condensation device and a liquid pipe extended from the
condensation device to an inlet of the vaporization chamber. In the
conventional loop heat pipe structure, the vapor pipe and the
liquid pipe are the same in pipe size. That is, the conventional
vapor pipe does not provide more space for the working fluid in gas
phase to flow therethrough. Since the gas-phase working fluid has a
density lower than that of the working fluid in liquid-phase, the
flow of the gas-phase working fluid is lower than that of the same
amount of liquid-phase working fluid. Therefore, the amount of the
liquid-phase working fluid flowing back to the vaporization chamber
is higher than that of the gas-phase working fluid flowing out of
the vaporization chamber. As a result, the gas-phase working fluid
in the vaporization chamber could not be quickly delivered via the
vapor pipe to the condensation device for condensing into the
liquid-phase working fluid while the condensed liquid-phase working
fluid has already flowed from the condensation device back to the
vaporization chamber. In other words, the vapor is blocked in the
vaporization chamber to cause lowered overall heat dissipation
effect of the loop heat pipe structure.
[0005] It has been the intention of the inventor to develop an
improved loop heat pipe structure to overcome the blocking problem
in the conventional loop heat pipe structure.
SUMMARY OF THE INVENTION
[0006] To effectively solve the problem in the conventional loop
heat pipe structure, a primary object of the present invention is
to provide an improved loop heat pipe structure that enables an
increased amount of out-going gas-phase working fluid, so that the
flow of the gas-phase working fluid and of the liquid-phase working
fluid in the loop heat pipe structure are almost the same to
thereby largely upgrade the cooling effect of the loop heat pipe
structure.
[0007] To achieve the above and other objects, the loop heat pipe
structure according to the present invention includes an
evaporator, at least one vapor pipe and at least one liquid pipe.
The evaporator internally defines a vaporization chamber, in which
a first wick structure is provided and a working fluid is filled.
The at least one vapor pipe has a first end and a second end, and
the first end is communicable with an end of the evaporator. The at
least one liquid pipe has a third end and a fourth end, the third
end is communicable with the second end of the at least one vapor
pipe and forms a condensing section, and the fourth end is
communicable with another end of the evaporator. The evaporator,
the at least one vapor pipe and the at least one liquid pipe form a
loop for the working fluid. A grand total cross sectional area of
the at least one vapor pipe is larger than a grand total cross
sectional area of the at least one liquid pipe.
[0008] According to an embodiment of the present invention, at
least one of the first end and the second end of the at least one
vapor pipe is formed of a plurality of communicating pipes.
[0009] According to an embodiment of the present invention, the
condensing section internally defines a condensation chamber, which
has an end communicable with the second end of the at least one
vapor pipe and another end communicable with the third end of the
at least one liquid pipe.
[0010] According to an embodiment of the present invention, the
condensing section consists of a plurality of condensing pipes,
each of which has an end communicable with the second end of the at
least one vapor pipe and another end communicable with the third
end of the at least one liquid pipe.
[0011] According to an embodiment of the present invention, the at
least one liquid pipe is internally provided with a second wick
structure.
[0012] According to an embodiment of the present invention, the
condensing section is internally provided with a third wick
structure, and the third wick structure is capillarily connected to
the second wick structure.
[0013] According to an embodiment of the present invention, the
condensing section is externally provided with a radiation fin
assembly.
[0014] According to an embodiment of the present invention, the
first wick structure separates the vaporization chamber into a
liquid chamber and a vapor chamber. The liquid chamber is located
adjacent to the fourth end of the at least one liquid pipe and
stores the working fluid that is in a liquid phase, and the vapor
chamber is located adjacent to the first end of the at least one
vapor pipe and allows the working fluid in a gas phase to flow
therethrough. Further, the first wick structure includes a
plurality of grooves, via which the gas-phase working fluid flows
to the vapor chamber.
[0015] According to the present invention, the grand total of the
cross-sectional areas of the vapor pipes is larger than that of the
liquid pipes. With this design, the amount of the out-going
gas-phase working fluid from the evaporator can be increased,
making the flow of the gas-phase working fluid and of the
liquid-phase working fluid almost the same and accordingly,
enabling the loop heat pipe structure of the present invention to
have largely upgraded heat dissipation effect.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein
[0017] FIG. 1 is a fragmentary sectional top view of a loop heat
pipe structure according to a first embodiment of the present
invention, showing an evaporator thereof;
[0018] FIG. 1a includes sectional views taken along two lines A-A
of FIG. 1, showing the cross-sectional areas of a vapor pipe and a
liquid pipe of the evaporator of FIG. 1;
[0019] FIG. 2 is a complete sectional top view of the loop heat
pipe structure according to the first embodiment of the present
invention;
[0020] FIG. 3 is a sectional top view of a loop heat pipe structure
according to a second embodiment of the present invention;
[0021] FIG. 4 is a fragmentary sectional top view showing a
condensing section for the loop heat pipe structure according to
the second embodiment of the present invention;
[0022] FIG. 5 is a sectional top view of a loop heat pipe structure
according to a third embodiment of the present invention;
[0023] FIG. 6 is a sectional top view of a loop heat pipe structure
according to a fourth embodiment of the present invention;
[0024] FIG. 7 is a sectional top view of a loop heat pipe structure
according to a fifth embodiment of the present invention;
[0025] FIG. 8 is a sectional top view of a loop heat pipe structure
according to a sixth embodiment of the present invention;
[0026] FIG. 8a includes sectional views taken along two lines B-B
of FIG. 8, showing the cross-sectional areas of a plurality of
vapor pipes and a liquid pipe of the loop heat pipe structure
according to the sixth embodiment of the present invention;
[0027] FIG. 9 is a sectional top view of a loop heat pipe structure
according to a seventh embodiment of the present invention; and
[0028] FIG. 9a includes sectional views taken along two lines C-C
of FIG. 9, showing the cross-sectional areas of a plurality of
vapor pipes and a plurality of liquid pipes of the loop heat pipe
structure according to the seventh embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0029] The present invention will now be described with some
preferred embodiments thereof and by referring to the accompanying
drawings. For the purpose of easy to understand, elements that are
the same in the preferred embodiments are denoted by the same
reference numerals.
[0030] Please refer to FIG. 2 which is a complete sectional top
view of a loop heat pipe structure 10 according to a first
embodiment of the present invention. As shown, the loop heat pipe
structure 10 in the first embodiment includes an evaporator 110, at
least one vapor pipe 130, and at least one liquid pipe 150. FIG. 1
is a fragmentary sectional top view of the loop heat pipe structure
10 of FIG. 2, showing the evaporator 110; and FIG. 1a includes
sectional views taken along two lines A-A of FIG. 1, showing the
cross-sectional areas of the vapor pipe 130 and the liquid pipe 150
of the evaporator 110 of FIG. 1.
[0031] The evaporator 110 internally defines a vaporization chamber
115, in which a first wick structure 117 is provided and a working
fluid 170 is filled. In the illustrated first embodiment, the first
wick structure 117 separates the vaporization chamber 115 into a
liquid chamber 115a and a vapor chamber 115b. The liquid chamber
115a is located adjacent to the at least one liquid pipe 150 and
stores the working fluid 170 that is in a liquid phase. The vapor
chamber 115b is located adjacent to the at least one vapor pipe 130
and allows the working fluid 170 in a gas phase to flow
therethrough. The first wick structure 117 includes a plurality of
grooves 117a, via which the gas-phase working fluid 170 flows to
the vapor chamber 115b.
[0032] The at least one vapor pipe 130 has a first end 131 and a
second end 133 located at two opposite ends of the vapor pipe 130.
The first end 131 of the vapor pipe 130 is communicable with an end
of the vaporization chamber 115 of the evaporator 110 having the
vapor chamber 115b. In the illustrated first embodiment, there is
only one vapor pipe 130 connected to the vaporization chamber 115
of the evaporator 110 and the first end 131 of the vapor pipe 130
is directly communicable with the vaporization chamber 115.
[0033] The at least one liquid pipe 150 has a third end 152 and a
fourth end 154 located at two opposite ends of the liquid pipe 150.
The third end 152 of the liquid pipe 150 is communicable with the
second end 133 of the vapor pipe 130, and the fourth end 154 of the
liquid pipe 150 is communicable with another end of the evaporator
110 having the liquid chamber 115a. With these arrangements, the
evaporator 110, the vapor pipe 130 and the liquid pipe 150 together
form a loop for the working fluid 170. Further, the at least one
liquid pipe 150 is extended into the vaporization chamber 115. In
the illustrated first embodiment, the at least one liquid pipe 150
has a second wick structure 156 provided therein. In the
illustrated first embodiment, there is only one liquid pipe 150,
which is communicable with the vapor pipe 130. A section of the
third end 152 of the liquid pipe 150 that leads to and communicates
with the second end 133 of the vapor pipe 130 is formed into a
condensing section 190. A radiation fin assembly 192 is provided
around an outer surface of the condensing section 190.
[0034] The vapor pipe 130 has a total cross-sectional area larger
than that of the liquid pipe 150. As can be seen in FIG. 1a, in the
illustrated first embodiment, the one single vapor pipe 130 has a
total cross-sectional area larger than that of the one single
liquid pipe 150.
[0035] In practical application of the present invention, the
evaporator 110 is in contact with a heat source (not shown) to
absorb heat produced by the heat source. The first wick structure
117 absorbs the liquid-phase working fluid 170 that flows into the
liquid chamber 115a of the vaporization chamber 115. The evaporator
110 absorbs the heat from the heat source and the liquid-phase
working fluid 170 in the first wick structure 117 is accordingly
heated, vaporized and converted into a gas phase. The gas-phase
working fluid 170 flows through the grooves 117a of the first wick
structure 117 toward the vapor chamber 115b. The gas-phase working
fluid 170 flows from the vapor chamber 115b into the vapor pipe 130
via the first end 131 thereof and keeps flowing toward the
condensing section 190. The gas-phase working fluid 170 finally
flows into the condensing section 190 via the second end 133 of the
vapor pipe 130. Heat carried by the gas-phase working fluid 170 is
absorbed by the condensing section 190 and the radiation fin
assembly 192, from where the heat is radiated into ambient air. The
gas-phase working fluid 170 is cooled and condensed at the
condensing section 190 and converted into the liquid-phase working
fluid 170 again to flow into the liquid pipe 150 via the third end
152 of the liquid pipe 150. The second wick structure 156 in the
liquid pipe 150 enables the liquid-phase working fluid 170 to flow
toward the fourth end 154 of the liquid pipe 150 more quickly.
Finally, the liquid-phase working fluid 170 flows back into the
liquid chamber 115a of the vaporization chamber 115 to start
another cycle of gas-liquid circulation in the loop heat pipe
structure 10.
[0036] According to the present invention, the total
cross-sectional area of the vapor pipe or pipes 130 is larger than
that of the liquid pipe or pipes 150. With this design, the amount
of the out-going gas-phase working fluid 170 from the evaporator
110 can be increased to thereby increase the flow of the gas-phase
working fluid 170 into the condensing section 190, making the flow
of the gas-phase working fluid 170 and of the liquid-phase working
fluid 170 almost the same and accordingly, enabling the loop heat
pipe structure 10 of the present invention to have largely upgraded
heat dissipation effect.
[0037] FIG. 3 is a sectional top view of a loop heat pipe structure
10 according to a second embodiment of the present invention, and
FIG. 4 shows a condensing section 190 for the loop heat pipe
structure 10 according to the second embodiment of the present
invention. Please refer to FIGS. 3 and 4 along with FIGS. 1 and 2.
As shown, the second embodiment is different from the first
embodiment in that the condensing section 190 in the second
embodiment is diametrically expanded and internally defines a
condensation chamber 194, which has an end communicable with the
second end 133 of the vapor pipe 130 and another end communicable
with the third end 152 of the liquid pipe 150. Since all other
structural and functional features of the second embodiment are
similar to those of the first embodiment, they are not repeatedly
described herein.
[0038] Further, in the illustrated second embodiment, the
condensing section 190 is internally provided with a third wick
structure 196, which is capillarily connected to the second wick
structure 156. Herein, the description "is capillarily connected
to" means the second and the third wick structure 156, 196 are in
material contact or connection with each other, such that pores in
the second wick structure 156 are communicable with pores in the
third wick structure 196 and a capillary force of the third wick
structure 196 can be transmitted or extended to the second wick
structure 156, enabling the liquid-phase working fluid 170 to flow
from the condensing section 190 back to the liquid chamber 115a due
to the capillary force.
[0039] The condensation chamber 194 can receive and cool more
gas-phase working fluid 170 at a time, and the capillary force of
the second and third wick structures 156, 196 enables the
liquid-phase working fluid 170 to more quickly flow back to the
liquid chamber 115a. With these arrangements, the loop heat pipe
structure 10 of the present invention can have largely upgraded
heat dissipation effect.
[0040] FIG. 5 is a sectional top view of a loop heat pipe structure
10 according to a third embodiment of the present invention. Please
refer to FIG. 5 along with FIGS. 3 and 4. As shown, the third
embodiment is different from the second embodiment in that the
condensing section 190 in the third embodiment consists of a
plurality of condensing pipes 190a, which respectively have an end
communicable with the second end 133 of the vapor pipe 130 and
another end communicable with the third end 152 of the liquid pipe
150. Since all other structural and functional features of the
third embodiment are similar to those of the second embodiment,
they are not repeatedly described herein.
[0041] Since the plurality of condensing pipes 190a of the
condensing section 190 can receive and cool more gas-phase working
fluid 170 at a time, the loop heat pipe structure 10 of the present
invention can have largely upgraded heat dissipation effect.
[0042] FIG. 6 is a sectional top view of a loop heat pipe structure
10 according to a fourth embodiment of the present invention.
Please refer to FIG. 6 along with FIG. 5. As shown, the fourth
embodiment is different from the third embodiment in that the first
end 131 of the vapor pipe 130 in the fourth embodiment is formed of
a plurality of communicating pipes 131a, which respectively have an
end communicable with the vapor chamber 115b of the vaporization
chamber 115 in the evaporator 110. Since all other structural and
functional features of the fourth embodiment are similar to those
of the third embodiment, they are not repeatedly described
herein.
[0043] With the plurality of communicating pipes 131a at the first
end 131 of the vapor pipe 130, the amount of the gas-phase working
fluid 170 that can flow into the condensing section 190 at a time
is increased, making the flow of the gas-phase working fluid 170
and of the liquid-phase working fluid 170 almost the same and
accordingly, enabling the loop heat pipe structure 10 of the
present invention to have largely upgraded heat dissipation
effect.
[0044] FIG. 7 is a sectional top view of a loop heat pipe structure
10 according to a fifth embodiment of the present invention. Please
refer to FIG. 7 along with FIG. 5. As shown, the fifth embodiment
is different from the third embodiment in that the second end 133
of the vapor pipe 130 in the fifth embodiment is formed of a
plurality of communicating pipes 133a, which respectively have an
end communicable with the condensing section 190 and accordingly,
the condensation chamber 194 defined in the condensing section 190.
Since all other structural and functional features of the fifth
embodiment are similar to those of the third embodiment, they are
not repeatedly described herein.
[0045] With the plurality of communicating pipes 133a at the second
end 133 of the vapor pipe 130, the amount of the gas-phase working
fluid 170 that can flow into the condensing section 190 at a time
is increased, making the flow of the gas-phase working fluid 170
and of the liquid-phase working fluid 170 almost the same and
accordingly, enabling the loop heat pipe structure 10 of the
present invention to have largely upgraded heat dissipation
effect.
[0046] FIG. 8 is a sectional top view of a loop heat pipe structure
10 according to a sixth embodiment of the present invention, and
FIG. 8a includes sectional views taken along two lines B-B of FIG.
8, showing the cross-sectional areas of a plurality of vapor pipes
130 and a liquid pipe 150 of the loop heat pipe structure 10
according to the sixth embodiment of the present invention. Please
refer to FIGS. 8 and 8a along with FIG. 6. As shown, the sixth
embodiment is different from the fourth embodiment in that a
plurality of vapor pipes 130 is included in the sixth embodiment
and these vapor pipes 130 are communicably connected at their first
ends 131 to the vaporization chamber 115 of the evaporator 110 and
at their second ends 133 to the condensation chamber 194 in the
condensing section 190. Since all other structural and functional
features of the sixth embodiment are similar to those of the fourth
embodiment, they are not repeatedly described herein.
[0047] As can be seen in FIG. 8a, in the illustrated sixth
embodiment, a grand total of the cross-sectional areas of the vapor
pipes 130 is larger than the total cross-sectional area of the one
single liquid pipe 150.
[0048] With the plurality of vapor pipes 130, an increased amount
of gas-phase working fluid 170 can be guided out of the evaporator
110 into the condensation chamber 194 for cooling, enabling the
loop heat pipe structure 10 of the present invention to have
largely upgraded heat dissipation effect.
[0049] FIG. 9 is a sectional top view of a loop heat pipe structure
10 according to a seventh embodiment of the present invention, and
FIG. 9a includes sectional views taken along two lines C-C of FIG.
9, showing the cross-sectional areas of a plurality of vapor pipes
130 and the cross-sectional areas of a plurality of liquid pipes
150 of the loop heat pipe structure 10 according to the seventh
embodiment of the present invention. Please refer to FIGS. 9 and 9a
along with FIG. 8. As shown, the seventh embodiment is different
from the fifth embodiment in that a plurality of liquid pipes 150
is included in the seventh embodiment and these liquid pipes 150
are communicably connected at their third ends 152 to the
condensation chamber 194 in the condensing section 190 and at their
fourth ends 154 to the vaporization chamber 115 of the evaporator
110. Since all other structural and functional features of the
seventh embodiment are similar to those of the fifth embodiment,
they are not repeatedly described herein.
[0050] As can be seen in FIG. 9a, in the illustrated seventh
embodiment, a grand total of the cross-sectional areas of the vapor
pipes 130 is larger than a grand total of the cross-sectional areas
of the liquid pipes 150.
[0051] With the plurality of liquid pipes 150, the amount of the
liquid-phase working fluid 170 that can flow back to the evaporator
110 at a time is increased, enabling the loop heat pipe structure
10 of the present invention to have largely upgraded heat
dissipation effect.
[0052] Therefore, according to the present invention, the grand
total of the cross-sectional areas of the vapor pipes 130 is larger
than that of the liquid pipes 150. With this design, the amount of
the out-going gas-phase working fluid 170 from the evaporator 110
can be increased, making the flow of the gas-phase working fluid
170 and of the liquid-phase working fluid 170 almost the same and
accordingly, enabling the loop heat pipe structure 10 of the
present invention to have largely upgraded heat dissipation
effect.
[0053] The present invention has been described with some preferred
embodiments thereof and it is understood that many changes and
modifications in the described embodiments can be carried out
without departing from the scope and the spirit of the invention
that is intended to be limited only by the appended claims.
* * * * *