U.S. patent application number 16/516312 was filed with the patent office on 2021-01-21 for system and method for device level thermal management and electromagnetic interference management.
The applicant listed for this patent is Dell Products L.P.. Invention is credited to Steven Embleton, Ben John Sy, Eric Michael Tunks.
Application Number | 20210022269 16/516312 |
Document ID | / |
Family ID | 1000004233104 |
Filed Date | 2021-01-21 |
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United States Patent
Application |
20210022269 |
Kind Code |
A1 |
Embleton; Steven ; et
al. |
January 21, 2021 |
SYSTEM AND METHOD FOR DEVICE LEVEL THERMAL MANAGEMENT AND
ELECTROMAGNETIC INTERFERENCE MANAGEMENT
Abstract
A data processing device includes an internal volume divided
into isolated portions and a thermal management portion. The data
processing device further includes an isolator that
electromagnetically isolates a first isolated portion of the
isolated portions from a second isolated portion of the isolated
portions. The data processing device also include a thermal bus,
disposed in the thermal management portion, that thermally manages
the first portion.
Inventors: |
Embleton; Steven; (Austin,
TX) ; Sy; Ben John; (Austin, TX) ; Tunks; Eric
Michael; (Austin, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Dell Products L.P. |
Hopkinton |
MA |
US |
|
|
Family ID: |
1000004233104 |
Appl. No.: |
16/516312 |
Filed: |
July 19, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 9/0062 20130101;
H05K 7/20709 20130101; H05K 7/20781 20130101; H04W 76/10 20180201;
H05K 7/1488 20130101 |
International
Class: |
H05K 7/20 20060101
H05K007/20; H05K 9/00 20060101 H05K009/00; H05K 7/14 20060101
H05K007/14 |
Claims
1. A data processing device, comprising: an internal volume divided
into isolated portions and a thermal management portion wherein the
isolated portions are electromagnetically isolated from the thermal
management portion by at least 90 decibels; an isolator adapted to
electromagnetically isolate a first isolated portion of the
isolated portions from a second isolated portion of the isolated
portions; and a thermal bus, disposed in the thermal management
portion, adapted to thermally manage the first isolated
portion.
2. The data processing device of claim 1, wherein the thermal bus
is further adapted to thermally manage all of the isolated
portions.
3. The data processing device of claim 1, wherein the thermal bus
is adapted to thermally manage the first isolated portion by
extracting thermal energy from the first isolated portion into the
thermal management portion.
4. The data processing device of claim 3, wherein the thermal bus
is disposed on the first isolated portion, wherein the thermal bus
extracts thermal energy from the first isolated portion through
conduction.
5. The data processing device of claim 3, wherein the thermal bus
is further adapted to extract the thermal energy from the thermal
management portion.
6. The data processing device of claim 1, wherein the thermal
management portion is electromagnetically isolated from an ambient
environment surrounding the data processing device by at least 90
decibels.
7. The data processing device of claim 1, further comprising: a
dissipation wall adapted to receive thermal energy from the thermal
bus; and a thermal management system adapted to dissipate heat from
the dissipation wall into an ambient environment surrounding the
data processing device.
8. The data processing device of claim 1, wherein the isolator
comprises: a metallized bag adapted to attach to a wall delineating
the internal volume.
9. The data processing device of claim 8, further comprising: a
connector that traverses the wall for providing power to a device
disposed within the first isolated portion.
10. The data processing device of claim 9, wherein the connector
comprises an electromagnetic interference filter adapted to reduce
a strength of electromagnetic interference generated by the device
disposed in the first isolated portion as the electromagnetic
interference propagates through the connector.
11. The data processing device of claim 8, further comprising: a
wireless system, disposed in the first isolated portion, adapted to
operably connect to a device disposed in the first isolated portion
using a wireless channel.
12. The data processing device of claim 11, wherein the wireless
system comprises an antenna.
13. The data processing device of claim 1, further comprising: a
thermal sink, disposed in the thermal management portion, adapted
to thermally connect to a device disposed in the first isolated
portion.
14. The data processing device of claim 13, wherein the thermal
sink is adapted to extract thermal energy from the first isolated
portion.
15. The data processing device of claim 14, wherein the thermal
sink is further adapted to transmit the thermal energy to the
thermal bus.
16. The data processing device of claim 1, wherein the first
isolated portion is electromagnetically isolated from the second
isolated portion by at least 90 decibels.
17. The data processing device of claim 1, wherein the internal
volume is sealed from an ambient environment surrounding the data
processing device.
18. The data processing device of claim 1, wherein none of the
isolated portions are adapted to be cooled using convection.
19. The data processing device of claim 1, wherein all of the
isolated portions are adapted to be cooled using conduction.
20. (canceled)
21. A data processing device, comprising: an internal volume
divided into isolated portions and a thermal management portion; an
isolator adapted to electromagnetically isolate a first isolated
portion of the isolated portions from a second isolated portion of
the isolated portions, wherein the isolator comprises a metallized
bag adapted to attach to a wall delineating the internal volume;
and a thermal bus, disposed in the thermal management portion,
adapted to thermally manage the first isolated portion.
Description
BACKGROUND
[0001] High density environment may include devices that are
tightly packed together. In other words, the devices may be
physically close to each other. Such an environment present
numerous challenges relating to thermal management, mechanical
positioning and orienting of devices, and electrical concerns
related to power and operation of such devices.
SUMMARY
[0002] In one aspect, a data processing device in accordance with
one or more embodiments of the invention includes an internal
volume divided into isolated portions and a thermal management
portion; an isolator that electromagnetically isolates a first
isolated portion of the isolated portions from a second isolated
portion of the isolated portions; and a thermal bus, disposed in
the thermal management portion, that thermally manages the first
portion.
BRIEF DESCRIPTION OF DRAWINGS
[0003] Certain embodiments of the invention will be described with
reference to the accompanying drawings. However, the accompanying
drawings illustrate only certain aspects or implementations of the
invention by way of example and are not meant to limit the scope of
the claims.
[0004] FIG. 1.1 shows a diagram of an example system in accordance
with one or more embodiments of the invention.
[0005] FIG. 1.2 shows a diagram of the example system of FIG. 1.1
in a first configuration in accordance with one or more embodiments
of the invention.
[0006] FIG. 1.3 shows a diagram of the example system of FIG. 1.1
in a second configuration in accordance with one or more
embodiments of the invention.
[0007] FIG. 2.1 shows a diagram of a second data processing device
in accordance with one or more embodiments of the invention.
[0008] FIG. 2.2 shows a first cross section diagram of the data
processing device of FIG. 2.1 in accordance with one or more
embodiments of the invention.
[0009] FIG. 2.3 shows a second cross section diagram of the data
processing device of FIG. 2.1 in accordance with one or more
embodiments of the invention.
[0010] FIG. 2.4 shows a third cross section diagram of the data
processing device of FIG. 2.1 in accordance with one or more
embodiments of the invention.
[0011] FIG. 2.5 shows a fourth cross section diagram of the data
processing device of FIG. 2.1 in accordance with one or more
embodiments of the invention.
[0012] FIG. 2.6 shows a fifth cross section diagram of the data
processing device of FIG. 2.1 in accordance with one or more
embodiments of the invention.
[0013] FIG. 3 shows a sixth cross section diagram of the data
processing device of FIG. 2.1 in accordance with one or more
embodiments of the invention.
[0014] FIG. 4 shows a diagram of a computing device in accordance
with one or more embodiments of the invention.
DETAILED DESCRIPTION
[0015] Specific embodiments will now be described with reference to
the accompanying figures. In the following description, numerous
details are set forth as examples of the invention. It will be
understood by those skilled in the art that one or more embodiments
of the present invention may be practiced without these specific
details and that numerous variations or modifications may be
possible without departing from the scope of the invention. Certain
details known to those of ordinary skill in the art are omitted to
avoid obscuring the description.
[0016] In the following description of the figures, any component
described with regard to a figure, in various embodiments of the
invention, may be equivalent to one or more like-named components
described with regard to any other figure. For brevity,
descriptions of these components will not be repeated with regard
to each figure. Thus, each and every embodiment of the components
of each figure is incorporated by reference and assumed to be
optionally present within every other figure having one or more
like-named components. Additionally, in accordance with various
embodiments of the invention, any description of the components of
a figure is to be interpreted as an optional embodiment, which may
be implemented in addition to, in conjunction with, or in place of
the embodiments described with regard to a corresponding like-named
component in any other figure.
[0017] In general, embodiments of the invention relate to systems,
devices, and methods for managing thermal energy and
electromagnetic interference in a high-density environment.
Specifically, embodiments of the invention may provide a system
that manages thermal energy and electromagnetic interference at a
device level (e.g., the devices that generate the thermal energy
and electromagnetic interference). By doing so, embodiments of the
invention may facilitate the inclusion of devices in a high-density
environment while mitigating the impact of electromagnetic
interference and thermal energy generated by the devices.
[0018] In one or more embodiments of the invention, a data
processing device includes electromagnetic interference isolators.
The electromagnetic interference isolators may provide
electromagnetic isolation services to corresponding devices
disposed in the electromagnetic interference i solators.
[0019] In one or more embodiments of the invention, the data
processing device includes a thermal bus that is thermally coupled
to the devices disposed in the electromagnetic interference
isolators. The thermal bus may, predominantly through conduction,
extract thermal energy from the devices to facilitate transport of
the thermal energy away from the devices. By doing so, the thermal
state of the devices may be managed while being electromagnetically
isolated. Consequently, such devices may be integrated into a high
density computing environment without negatively impacting the
electromagnetic or thermal state of the high density computing
environment.
[0020] FIG. 1.1 shows an example system in accordance with one or
more embodiments of the invention. The system may include a frame
(100) and any number of data processing devices (102). The
components of the example system may provide electromagnetic
interference management services for devices disposed within the
data processing devices (102). By doing so, devices that emit
electromagnetic interference may be utilized in a high-density
computing environment without negatively impacting the high-density
computing environment.
[0021] For example, one or more electromagnetic interference
emitting devices may be disposed within one or more of the data
processing devices (102). The system illustrated in FIG. 1.1 may
manage the electromagnetic interference generated by the one or
more electromagnetic interference emitting devices by (i) limiting
the space in which electromagnetic interference is allowed to
freely propagate and/or (ii) attenuating the electromagnetic
interference as it propagates out of the limited space.
[0022] To do so, the system of FIG. 1.1 may reduce the strength of
the electromagnetic interference when propagating from inside of a
portion of the data processing devices (102) to an ambient
environment (or other portions of the data processing devices
(102)) around the data processing devices (102) and/or other
locations by at least 90 decibels. For example, a data processing
device in accordance with embodiments of the invention may provide
greater than 35 decibels of isolation, between 35-50 decibels of
isolation, between 50-65 decibels of isolation, between 65-80
decibels of isolation, and/or greater than 80 decibels of
isolation,
[0023] The electromagnetic interference isolation provided by the
data processing devices (102) may have a frequency dependent
response. For example, the data processing devices (102) may
provide at least 90 decibels (dB), or another suitable level of
isolation, across a frequency band in which devices that may be
disposed within the data processing devices (102) are adapted to
emit electromagnetic interference. In other frequency bands, the
data processing devices (102) may provide different level or no
electromagnetic interference isolation for devices disposed within
the data processing devices (102).
[0024] Accordingly, a data processing device in accordance with one
or more embodiments of the invention may provide electromagnetic
interference suppression services that are frequency dependent. In
one or more embodiments of the invention, a data processing device
provides electromagnetic interference isolation by reducing the
strength of electromagnetic interference across at least one
frequency band by a predetermined amount (e.g., 90 decibels).
[0025] An electromagnetic interference emitting device may be any
type of hardware device that intentionally emits electromagnetic
radiation as part of its operation. The emissions of
electromagnetic radiation may be, for example, continuous,
periodic, or intermittent (e.g., at any point in time based on the
operation of the respective electromagnetic interference emitting
device). An electromagnetic interference emitting device may be,
for example, a personal electronic device such as a cellular device
(e.g., smart phone, cell phone, etc.), a personal computer (e.g.,
any type of computing device with wireless communications
capabilities such as a tablet computer, a laptop computer, etc.), a
watch (e.g., a wireless smart watch), or any other type of hardware
device that intentionally emits electromagnetic radiation for any
purpose (e.g., communications, detection, etc.).
[0026] The electromagnetic interference emitted by an
electromagnetic interference emitting device may be frequency
dependent. That is, the electromagnetic interference emitted by the
electromagnetic interference emitting device may be stronger in a
first frequency band and weaker in a second frequency band. To
provide electromagnetic interference suppression services, a data
processing device in accordance with one or more embodiments of the
invention may attenuate the electromagnetic interference emitted by
an electromagnetic interference emitting device by at least a
predetermined amount (e.g., 80 decibels) across at least one
frequency band in which the electromagnetic interference emitting
device emits electromagnetic interference. The at least one
frequency band may be, for example, the frequency band in which the
emitted electromagnetic interference has a largest magnitude.
[0027] In one or more embodiments of the invention, an
electromagnetic interference emitting device emits electromagnetic
interference having frequency content between 700 megahertz and 10
gigahertz. An electromagnetic interference emitting device may emit
electromagnetic interference having different frequency content
without departing from the invention.
[0028] The components of the example system may also provide
thermal management services for devices disposed within the data
processing devices (102). Thermal management services may include
removing thermal energy from the devices. By doing so, devices
disposed within the data processing devices (102) that generate
thermal energy may operate while all, or a portion, of the
generated thermal is removed for thermal management purposes.
[0029] In one or more embodiments of the invention, the example
system provides thermal management services on a per device level.
That is, the example system may include one or more mechanisms for
removing thermal energy from each of the devices rather than on an
aggregate, device group level.
[0030] To further discuss aspects of embodiments of the disclosed
technology, each component of the system of FIG. 1.1 is discussed
below.
[0031] In one or more embodiments of the invention; the frame (100)
is a physical structure. The physical structure may be adapted to
facilitate storage of the data processing devices (102) in a
high-density computing environment. The high-density computing
environment may be, for example, a data center or another type of
location where multiple data processing devices are located. To
facilitate storage of the data processing devices (102), the frame
(100) may include any number of structural members (e.g., beams,
brackets, bars, etc.) and any number of mechanical mounting points
(e.g., holes, threaded portions, etc.) disposed on the structural
members to facilitate storage of the data processing devices
(102).
[0032] Different structural members may have different shapes,
sizes, and/or other physical characteristics. The shapes, sizes,
and/or other physical characteristics of the structural members may
be adapted to enable the structural members to be mechanically
connected (e.g., permanently or reversibly connected) to each other
to form a predetermined structure. The predetermined structure may
be, for example, a cage, box, or other type of structure that
facilitates positioning and/or orienting the data processing
devices (102).
[0033] When all, or a portion, of the structural members are
mechanically connected to each other, the mechanical mounting
points may be disposed at predetermined locations. The
predetermined locations may correspond to similar predetermination
locations on the data processing devices (102) where mechanical
mounting elements, complementary to the mechanical mounting point,
are disposed. By doing so, the frame (100) and the data processing
devices (102) may be adapted to position the data processing
devices (102) in locations and/or orientations compatible with a
high-density computing environment, or another environment in which
the data processing devices (102) may be located.
[0034] The mechanical mounting points may be any type of physical
structure for attaching (permanently or reversibly) the data
processing devices (102) to the frame (100). There may be any
number of mechanical mounting points to facilitate the attachment
of any number of data processing devices.
[0035] The frame (100) may be implemented using any number of
suitable materials. For example, portions of the frame (100) may be
implemented using metals (e.g., steel, aluminum, etc.). In another
example, portions of the frame (100) may be implemented using
polymers (e.g., Polyamides, polycarbonates, polyester,
polyethylene, polypropylene, polystyrene, polyurethanes, polyvinyl
chloride, polyvinylidene chloride, acrylonitriline butadiene
styrene, etc.). In a still further example, portions of the frame
(100) may be implemented using rubber (e.g., latex,
styrene-butadiene rubbers, etc.) The frame (100) may be implemented
using any quantity and combination of suitable materials without
departing from the invention.
[0036] In one or more embodiments of the invention, the data
processing devices (102) are physical structures. For example, the
data processing devices (102) may include a chassis and one or more
computing devices disposed within the chassis. For additional
details regarding computing devices, refer to FIG. 4.
[0037] A chassis may be a mechanical device that is adapted to (i)
facilitate attachment of the data processing device to the frame,
(ii) house the one or more computing devices, (iii) house one or
more electromagnetic interference emitting devices, and/or (iv)
provide thermal management services to the computing devices and/or
the electromagnetic interference emitting devices. For example, a
chassis may be a frame mountable structure (e.g., a rectangular
box) that includes internal space that may be used to house
computing devices and/or electromagnetic interference emitting
devices. Thus, the chassis may be a frame mountable chassis.
[0038] The chassis may be implemented using any number of suitable
materials. For example, portions of the chassis may be implemented
using metals (e.g., steel, aluminum, etc.). In another example,
portions of the chassis may be implemented using polymers (e.g.,
Polyamides, polycarbonates, polyester, polyethylene, polypropylene,
polystyrene, polyurethanes, polyvinyl chloride, polyvinylidene
chloride, acrylonitriline butadiene styrene, etc.). In a still
further example, portions of the chassis may be implemented using
rubber (e.g., latex, styrene-butadiene rubbers, etc.) The chassis
may be implemented using any quantity and combination of suitable
materials without departing from the invention.
[0039] To facilitate attachment of the data processing device to
the frame, the chassis may include any number of mechanical
mounting elements. The mechanical mounting elements may be located
at predetermined locations. The predetermined locations may
correspond to similar predetermination locations on the frame (100)
where mechanical mounting points, complementary to the mechanical
mounting elements, are disposed.
[0040] For example, a mechanical mounting element may be a rail
disposed on a side of a chassis of a data processing device. The
location of the rail may correspond to a position on the frame
(100) where a rail guide (i.e., a complementary mechanical mounting
point) is disposed. The rail and the rail guide may facilitate
attachment of a data processing device to the frame (100) which, in
turn, positions and orients the data processing device relative to
the frame (100).
[0041] To house the one or more computing devices, the chassis may
include one or more internal volumes. The internal volumes may
facilitate disposing of the one or more computing devices (and/or
other devices such as electromagnetic interference emitting
devices) within a data processing device.
[0042] To house the one or more electromagnetic interference
emitting devices, the chassis may include one or more internal
volumes. The internal volumes may have a shape or other
characteristic(s) that facilitates disposing of the one or more
electromagnetic interference emitting devices within the data
processing device. For example, an internal volume of the chassis
may be a rectangular void capable of housing one or more
electromagnetic interference emitting devices.
[0043] In one or more embodiments of the invention, the one or more
internal volumes of the data processing devices are adapted to
restrict propagation of electromagnetic interference emitted by the
electromagnetic interference emitting devices (and/or other devices
such as computing devices). For example, one or more portions of
the chassis that bound the one or more internal volumes may be made
of metal of a predetermined thickness to prevent and/or limit
transmission of electromagnetic interference through the one or
more portions of the chassis. By doing so, the electromagnetic
interference generated by the electromagnetic interference emitting
devices may be prevented (or at least severely/partially attenuated
when leaving an internal volume) from propagating from within the
data processing devices (102) into the ambient environment (or
other portions of the data processing devices) surrounding the
respective data processing devices (102).
[0044] In another example, one or more portions of the chassis that
bound the one or more internal regions may be formed in a manner
that filters (e.g., reflects/attenuates radiation of a certain
frequency while allowing radiation of other frequencies to
propagate) electromagnetic radiation when electromagnetic radiation
passes through the portions of the chassis. For example, a portion
of the chassis that bounds the one or more internal regions may be
a waveguide filter such as an array of holes (e.g., sub-wavelength
apertures corresponding to a particular frequency) in a metal
sheet. By doing so, the electromagnetic interference generated by
the electromagnetic interference emitting devices may be severely
attenuated (e.g., attenuated by greater than 90 decibels) when
propagating from within the data processing devices (102) into the
ambient environment surrounding the respective data processing
devices (102).
[0045] In a further example, one or more portions of the chassis
that bound the one or more internal regions may be made of an
electromagnetic radiation attenuating material of a predetermined
thickness to prevent and/or limit transmission of electromagnetic
interference through the one or more portions of the chassis. The
electromagnetic radiation attenuating material may be, for example,
a composite of plastic or rubber that includes particulates of
iron, carbonyl iron, or other electromagnetically lossy material.
By doing so, the electromagnetic interference generated by the
electromagnetic interference emitting devices may be severely
attenuated (e.g., attenuated by greater than 90 decibels) when
propagating from within the data processing devices (102) into the
ambient environment surrounding the respective data processing
devices (102).
[0046] To provide thermal management services to the computing
devices and/or the electromagnetic interference emitting devices,
the data processing devices (102) extract thermal energy from the
devices disposed within the data processing devices (102). The data
processing devices (102) may extract the thermal energy through any
thermal transport method (e.g., conduction, convection, radiation).
Once thermal energy is extracted from a device, the thermal energy
may be expelled into a portion of the environment surrounding a
data processing device.
[0047] For example, the data processing devices (102) may extract
thermal energy from the devices by disposing heat sinks and/or
thermal buses onto (direct or indirect) the devices. The thermal
energy may be extracted primarily via conduction of the thermal
energy into the heatsinks and/or thermal buses. The extracted
thermal energy may traverse the thermal buses to another portion of
the data processing devices (102) adapted to expel the thermal
energy from the data processing devices (102).
[0048] In another example, a data processing device may include one
or more vents that enable gas from a first side of a data
processing device to flow into the data processing device, through
the data processing device, and out of a second side of the data
processing device. The gas, flowing through the data processing
device, may be at a different temperature than the one or more
devices disposed within the data processing device. A heatsink,
thermal bus, or other thermal transport component may be disposed
on a device which enables thermal energy to be extracted from the
device and expelled into the gas flow. The gas may be air or
another type/combination of gasses obtained from any source.
[0049] A system in accordance with embodiments of the invention may
include any number of data processing devices, electromagnetic
interference emitting devices, and/or other types of devices.
Different data processing devices (102) may have different
configurations and/or uses within the system.
[0050] For example, some data processing devices may be adapted to
house many electromagnetic interference emitting devices while
other data processing devices may be primarily adapted to house
computing devices. Additional data processing devices may be
adapted to exclusively house data processing devices and no
electromagnetic interference emitting devices. A system in
accordance with embodiments of the invention may include any number
and combination of data processing devices adapted for any number
of different uses without departing from the invention.
[0051] By way of example, the system of FIG. 1.1 may include a
first data processing device (104). The first data processing
device (104) may be of a larger size than a second data processing
device (106) and, consequently, may be capable of housing a larger
number of electromagnetic interference emitting devices and/or
other types of devices. The system of FIG. 1.1 may further include
a third data processing device (108). In contrast to the first data
processing device (104) and the second data processing device
(106), the internal structure of the third data processing device
(108) may be adapted to only housing computing devices rather than
electromagnetic interference generating devices.
[0052] For additional details regarding data processing devices,
refer to FIGS. 2.1-2.5.
[0053] As discussed above, data processing devices (102) may house
electromagnetic interference emitting devices. When so housed, the
electromagnetic interference emitting devices may operate thereby
generating electromagnetic interference (e.g., electromagnetic
radiation). At different points in time, it may be useful to add or
remove electromagnetic interference emitting devices to or from the
data processing devices (102). To facilitate such additions and/or
removals, different portions of the data processing devices (102)
may be adapted to reversibly provide access to the internal volumes
of the data processing devices.
[0054] For example, the different portions of the data processing
devices (102) may be adapted to rotate, translate, or otherwise
move with respect to the remaining portions of the data processing
devices (102). When the different portions of the data processing
devices (102) are in a first predetermination position and/or
orientation, they may electromagnetically seal one or more internal
volumes of the data processing devices (102). That is, they may
limit the extent to which electromagnetic radiation within the
internal volumes is able to propagate to an ambient environment.
However, when the different portions of the data processing devices
(102) are rotated, translated, and/or otherwise moved to a second
predetermined position and/or orientation to enable access to the
internal volumes, the data processing devices (102) may not be
electromagnetically sealed. Consequently, electromagnetic radiation
within the internal volumes may be less limited by the data
processing devices (102) to propagate into the ambient environment
when access to the internal volumes is provided.
[0055] The data processing devices (102) may include hinges,
slides, knobs, and/or other mechanical devices that facilitate
movement of the different portions of the data processing devices
(102) to reversibly reconfigure the data processing devices (102)
between states where access (i.e., physical accessibility) to the
internal volumes of the data processing devices (102) is provided
and states where access to the internal volumes of the data
processing devices (102) is not provided. FIGS. 1.2-1.3 show
diagrams of the data processing devices (102) facilitating the
addition, modification, and/or removal of electromagnetic
interference emitting devices from the internal volumes of the data
processing devices (102).
[0056] While the system of FIG. 1.1 has been illustrated as
including a limited number of components, a system in accordance
with embodiments of the invention may include any number of frames,
data processing devices, and/or other components without departing
from the invention. For example, any number of frames (and/or other
types of physical devices for positioning/orienting devices) may be
used in a high density computing environment to facilitate the
placement and/or orientation of any number of data processing
devices. Further, the frames may be used to position and/or orient
other types of devices. The other types of devices may be, for
examples, servers, storage nodes, compute nodes, communication
devices (e.g., switches, routers, etc. for facilitating
communications between any number of devices and/or devices
external to a high density computing environment), or any other
type of device that may be used in a computing environment (e.g.,
data center, computing nodes, communications center, etc.). Thus,
the frame and data processing devices may be used in conjunction
with any number and/or type of other device without departing from
the invention.
[0057] FIG. 1.2 shows a diagram of the example system of FIG. 1.1
in a configuration (i.e., after a reconfiguration from the
configuration illustrated in FIG. 1.1) where a front vent (110) of
the first data processing device (104) has been opened. The front
vent (110) may be opened by physically rotating and/or translating
the front vent (110) to move the front vent (110) to a new physical
location. By opening the front vent (110), physical access to
internal volumes of the first data processing device (104) may be
provided. Consequently, the internal configuration of the internal
volumes of the first data processing device (104) may be modified.
For example, electromagnetic interference emitting devices (and/or
other types of devices) may be removed from and/or added to the
internal volumes.
[0058] However, in the state illustrated in FIG. 1.2, the ability
of the first data processing device (104) to limit propagation of
and/or attenuate electromagnetic interference generated by
electromagnetic interference emitting devices disposed within the
first data processing device (104) may be compromised. In other
words, the first data processing device (104) may be in an
electromagnetic interference suppression compromised state that
allows electromagnetic interference within internal volumes of the
first data processing device (104) to propagate to the ambient
environment around the first data processing device (104) without
attenuation. In contrast, in the state illustrated in FIG. 1.1, the
first data processing device (104) may be in an electromagnetic
interference suppressed state (i.e., electromagnetic interference
generated by the electromagnetic interference emitting devices may
be contained within the internal volumes and/or attenuated by
greater than 90 decibels when propagating out of the internal
volumes).
[0059] In some embodiments of the invention, the first data
processing device (104) automatically causes all, or a portion, of
the electromagnetic interference emitting devices disposed within
its internal volumes to suspend generation of electromagnetic
interference when in the electromagnetic interference suppression
compromised state illustrated in FIG. 1.2. By doing so, the first
data processing device (104) may provide electromagnetic
interference management services when the first data processing
device (104) is in an electromagnetic interference suppression
compromised state. All, or a portion, of the data processing
devices of a system in accordance with embodiments of the invention
may provide similar electromagnetic interference management
services.
[0060] Similar to FIG. 1.2, FIG. 1.3 shows a diagram of the example
system of FIG. 1.1 in a second configuration (i.e., after a
reconfiguration from the configuration illustrated in FIG. 1.1)
where a top door (112) of the second data processing device (106)
has been opened after translating the second data processing device
(106) with respect to the frame. The top door (112) may be all, or
a portion, of the chassis that may be reversibly moved to enable
access to internal volumes of the first data processing device
(104).
[0061] Open the top door (112), for example, the second data
processing device (106) may be mounted to the frame (100) via rails
that enable the second data processing device (106) to translate
with respect to the frame (100) via application of physical force.
Once translated to a predetermined location, the top door (112) may
be opened by application of physical force by a user.
[0062] By opening the top door (112), physical access to the
internal volumes of the second data processing device (106) may be
provided. Consequently, the internal configuration of the internal
volumes of the second data processing device (106) may be modified.
For example, electromagnetic interference emitting devices may be
removed from and/or added to the internal volumes of the second
data processing device (106). Similarly, computing devices may be
added to and/or removed from the internal volumes of the second
data processing device (106).
[0063] However, in the state illustrated in FIG. 1.3, the ability
of the second data processing device (106) to limit propagation of
and/or attenuate electromagnetic interference generated by
electromagnetic interference emitting devices disposed within the
second data processing device (106) may be compromised. In other
words, the second data processing device (106) may be in an
electromagnetic interference suppression compromised state that
allows electromagnetic interference within internal volumes of the
second data processing device (106) to propagate to the ambient
environment around the second data processing device (106) without
attenuation. In contrast, in the state illustrated in FIG. 1.1, the
first data processing device (104) may be in an electromagnetic
interference suppressed state (i.e., electromagnetic interference
generated by the electromagnetic interference emitting devices may
be contained within the internal volumes and/or attenuated by
greater than 90 decibels when propagating out of the internal
volumes).
[0064] In some embodiments of the invention, the second data
processing device (106) automatically causes all, or a portion, of
the electromagnetic interference emitting devices disposed within
its internal volumes to suspend generation of electromagnetic
interference when in the electromagnetic interference suppression
compromised state illustrated in FIG. 1.3. By doing so, the second
data processing device (106) may provide electromagnetic
interference management services when the second data processing
device (106) is in an electromagnetic interference suppression
compromised state. All, or a portion, of the data processing
devices of a system in accordance with embodiments of the invention
may provide similar electromagnetic interference management
services (e.g., automatically terminating and/or resuming the
electromagnetic interference generation depending on the
electromagnetic interference suppression state of the data
processing device).
[0065] Thus, as illustrated in FIGS. 1.1-1.3, a system in
accordance with embodiments of the invention may provide
electromagnetic interference management and/or thermal management
services to devices disposed with the data processing devices when
the data processing devices are in an electromagnetic interference
suppression compromised state or an electromagnetic interference
suppressed state.
[0066] As discussed above, a system in accordance with one or more
embodiments of the invention may include one or more data
processing devices. FIGS. 2.1-2.6 show diagrams of data processing
devices in accordance with embodiments of the invention.
[0067] FIG. 2.1 shows a diagram of the second data processing
device (106) in accordance with one or more embodiments of the
invention. As discussed above, the second data processing device
(106) may provide electromagnetic interference management and/or
thermal management services for electromagnetic interference
emitting devices (and/or other types of devices) disposed within
the second data processing device (106). In addition to
electromagnetic interference management and/or thermal management
services, the second data processing device (106) may provide power
management services and communications services. The aforementioned
services may be provided to electromagnetic interference emitting
devices and/or computing devices and/or other types of devices
disposed within the second data processing device (106).
[0068] To do so, the second data processing device (106) may
include a chassis (198).
[0069] The chassis (198) may be a structure that is mountable to a
frame. By being mountable to a frame, the chassis (198) may be
usable in a high density environment. For example, the chassis
(198) may be a rail mount chassis. The chassis (198) may be
mountable via other methods (e.g., using mechanical features other
than rails such as bolts, screws, pins, etc.).
[0070] The chassis (198) may include a front vent (200), a rear
vent (204), a support module (208), and a payload module (210). In
some embodiments of the invention, the chassis (198) may not
include any vents proximate to the payload module (210). For
example, as will be discussed in greater detail below, the payload
module (210) may be completely sealable electromagnetically and/or
hydraulically (e.g., gas flows) from other portions of the second
data processing device and/or an ambient environment proximate to
the second data processing device. Each of these components of the
second data processing device (106) is discussed below.
[0071] The front vent (200) may be a physical device for (i)
enabling gas flow through the second data processing device (106)
and (ii) limiting the propagation of electromagnetic interference
from an internal volume of the second data processing device (106)
and/or attenuating electromagnetic interference that propagates
from an internal volume of the second data processing device (106)
to an ambient environment around the second data processing device
(106) via the front vent (200).
[0072] In one or more embodiments of the invention, the front vent
(200) reflects and/or attenuates electromagnetic radiation that is
propagating from the internal volume (214) to an ambient
environment through the front vent (200) by at least 90 decibels
(or another suitable level such as, for example, 30 decibels, 45
decibels, 60 decibels, 75 decibels, etc.). By doing so, the front
vent (200) may delineate one of the walls of the internal volume
(214) to enable the internal volume (214) to be electromagnetically
suppressed and/or isolated by 90 decibels (or another suitable
level of suppression/isolation) from the ambient environment and/or
other portions of the chassis (e.g., the support module (208)).
[0073] In one or more embodiments of the invention, the front vent
(200) is a rectangular structure formed with holes (202) that
enable gasses to flow between the ambient environment surrounding
the second data processing device (106) and an internal volume of
the second data processing device (106). By doing so, the second
data processing device (106) may provide thermal management
services to components disposed within the second data processing
device (106) by controlling the flow of gasses from the ambient
environment through the second data processing device (106).
[0074] For example, the second data processing device (106) may be
used in a high-density computing environment in which a source of
cool gas is supplied to a first side of the second data processing
device (106). In such an environment, the second data processing
device (106) may cause the cool gas to flow into the second data
processing device (106) via the front vent (200) and exhaust gas
out a second side of the second data processing device (106) (e.g.,
out of the support module (208)). Alternatively, the second data
processing device (106) may cause a reverse gas flow, with respect
to the gas flow discussed above, if the source of cool gas is
supplied proximate to the support module (208) rather than
proximate to the front vent (200).
[0075] The structure of the front vent (200) may also be adapted to
limit propagation of electromagnetic radiation through the front
vent (200) and/or attenuate electromagnetic radiation that
propagates through the front vent (200). For example, the size,
position, number, shape, and/or other characteristics of the holes
(202) through the front vent may be adapted to (i) limit
propagation of electromagnetic radiation and/or (ii) attenuate
propagating electromagnetic radiation. In another example, the
thickness and material choice of the front vent (200) may be
adapted to (i) limit propagation of electromagnetic radiation
and/or (ii) attenuate propagating electromagnetic radiation. By
being so adapted, the front vent (200) may attenuate
electromagnetic radiation that propagates through the front vent
(200) by at least 90 decibels or another desirable quantity (e.g.,
30 decibels, 45 decibels, 60 decibels, 75 decibels, 120 decibels,
etc.).
[0076] To facilitate the flow of gas between the ambient
environment and the internal volume of the second data processing
device (106), the size, position, number, shape, and/or other
characteristics of the holes (202) may be selected to meet gas flow
requirements for thermal management purposes while providing
electromagnetic interference suppression characteristics.
[0077] In one or more embodiments of the invention, the rear vent
(204) is similar to the front vent (200). For example, the rear
vent (204) may provide similar attenuation and/or restriction of
propagation of electromagnetic radiation while enabling gasses to
flow between internal volumes of the second data processing device.
The rear vent (204) may have a similar structure to that of the
front vent (200). However, the structure (e.g., different hole
pattern, thickness, hole type, etc.) and/or electromagnetic (e.g.,
attenuation and/or reflection of electromagnetic radiation) and/or
hydrodynamic (e.g., impedance to fluid flow) characteristics of the
rear vent (204) may be different from the front vent (200) without
departing from the invention.
[0078] While the vents (e.g., 200, 204) have been described as
facilitating gas flow through an internal volume of the second data
processing device (106), the vents may facilitate the flow of gas
through other portions of the second data processing device without
departing from the invention. For example, the vents may be used to
facilitate gas flows through channels or other structures proximate
to, but separate from, the payload module (210) in which an
internal volume may be disposed. The channels and internal volume
may be separated by a wall that facilitates thermal exchange
between the internal volume (and/or components disposed in the
internal volume) and the gas flow. For additional details regarding
such an implementation, refer to FIG. 3.
[0079] The payload module (210) may be a physical device for (i)
housing electromagnetic interference devices (and/or other types of
devices), (ii) limiting propagation of electromagnetic interference
from internal volumes of the second data processing device (106) to
the ambient environment surrounding the second data processing
device (106), and (iii) thermally managing devices disposed within
the payload module (210). For additional details regarding the
payload module (210), refer to FIGS. 2.2-2.6.
[0080] The support module (208) may be a physical device for
housing devices that provide services to devices disposed within
the payload module (210). For example, the support module (208) may
house one or more power supplies (e.g., a power system), fans
(e.g., a thermal management system), networking devices (e.g., a
communication system), and/or computing devices. The aforementioned
devices may provide corresponding services to devices disposed in
other portions of the second data processing device (106) and/or
devices located in other locations (i.e., external to the second
data processing device (106)).
[0081] In one or more embodiments of the invention, the support
module (208) does not provide electromagnetic interference
management services to devices disposed within the support module
(208), in contrast to the payload module (210). For example, the
support module (208) may not intentionally isolate electromagnetic
interference generated by devices disposed within the support
module (208) from the ambient environment surrounding the second
data processing device (106). Intentionally isolating
electromagnetic interference means that the structure of a physical
structure is adapted to provide such isolation. While many types of
physical structures may provide some degree of electromagnetic
interference isolation as an inherent consequence of their
existence, the electromagnetic interference isolation is not
intended. Rather, the physical structures may exist for their other
properties such as mechanical strength while providing some degree
(albeit low) of electromagnetic interference isolation. Thus, while
the support module (208) may to some degree electromagnetically
separate devices disposed within the support module (208) from the
ambient environment, the support module (208) does not provide
electromagnetic interference management services. Providing
electromagnetic interference management services may refer to
providing at least 20 decibels of attenuation.
[0082] In one or more embodiments of the invention, providing
electromagnetic interference management services means reducing the
strength of electromagnetic radiation by at least 20 decibels when
the electromagnetic radiation propagates from an internal volume of
a data processing device to an ambient environment outside of the
data processing device.
[0083] The one or more power supplies may supply power to other
devices. For example, the power supplies may provide power to
electromagnetic interference emitting devices disposed within the
payload module (210), other types of devices (e.g., computing
device) disposed within the payload module, and/or devices disposed
in other areas (of the second data processing device and/or remote
areas).
[0084] The one or more power fans may provide thermal management
services to other devices. For example, the fans may regulate the
flow of gasses through the second data processing device and,
consequently, manage the thermal state of electromagnetic
interference emitting devices and/or other types of devices
disposed in the payload module (210) and/or the support module
(208). For additional details regarding providing thermal
management services, refer to FIG. 2.2.
[0085] The one or more power networking devices may provide
communication services to other devices (e.g., providing network
services). For example, the networking devices may manage network
interfaces that enable the second data processing device (106)
(and/or devices disposed within the second data processing device
(106)) to communicate with other devices (e.g., computing devices
that may be controlling the operation of the electromagnetic
interference emitting devices).
[0086] The one or more computing devices may manage the operations
of the other entities of the second data processing device (106).
For example, the computing devices may send messages to the
electromagnetic interference emitting devices to perform
predetermined functionality. Such messages, when received by the
electromagnetic interference emitting devices may cause the
electromagnetic interference emitting devices to stop and/or start
emitting electromagnetic interference (and/or perform other
actions).
[0087] The computing devices may send such instructions when (or
around the time when) the electromagnetic interference suppression
state of the second data processing device (106) is changed (i.e.,
when portions of the second data processing device (106) are
physically reconfigured). The computing devices may make such
determinations based on any number of sensors (not shown) that
monitor the physical configuration of the second data processing
device (106). The sensors may be disposed, for example, in the
payload module, on the vents, or at other locations such that
measurements by the sensors indicate the thermal state of
components of the second data processing device for which thermal
management services (e.g., monitoring the thermal state of
components and taking actions such as modifying the rate of gas
flow to manage the thermal state of the components) are being
provided.
[0088] In another example, the computing devices may send messages
to fan controllers (not shown) or other devices that manage the
operation of gas flow control devices disposed within the second
data processing device (106). The computing devices may send such
messages based on the thermal state (i.e., temperature) of one or
more devices disposed within the second data processing device
(106). The computing devices may monitor such thermal states using
any number of sensors (not shown) and/or based on messages received
from the one or more devices disposed within the second data
processing device (106).
[0089] In response to receipt of such messages, the fan controllers
or other devices may modify the operational state of the gas flow
control devices. By doing so, the computing devices may change the
thermal state of devices disposed within the second data processing
device (106) by controlling the flow of gasses through the second
data processing device (106).
[0090] To further clarify aspects of embodiments of the invention,
a cross section diagram of the second data processing device (106)
in accordance with one or more embodiments of the invention is
shown in FIG. 2.2. In FIG. 2.2, the cross section is taken along
the X-Y plane illustrated in FIG. 2.1.
[0091] As seen from FIG. 2.2, the payload module (210) may include
an internal volume (214). The internal volume (214) may be used to
house devices such as electromagnetic interference emitting
devices, supports for such devices, and/or other devices that may
provide services to the electromagnetic interference emitting
devices and/or other devices.
[0092] The internal volume (214) may be bounded, on six sides, by
portions of the payload module (210). For example, the internal
volume (214) may be bounded by a top door (212), a bottom (218), a
first side (216), a second side (not shown), a dissipation wall
(205), and a front wall (215). These six portions of the payload
module (210) may define a rectangular shape of the internal volume
(214). The internal volume (214) may have other shapes without
departing from the invention.
[0093] The dissipation wall (205) may be a physical structure
adapted to facilitate dissipation of thermal energy from the
internal volume (214). For example, the dissipation wall (205) may
be a sheet of thermally conductive material, such as brass or
aluminum, that facilitates transmission of thermal energy out of
the internal volume (214). In one or more embodiments of the
invention, the dissipation wall (205) may be a fluid driven heat
sink. That is, cooled fluids may be pumped through the dissipation
wall (205) to improve the rate of thermal transport from devices
disposed within the internal volume (214) to the dissipation wall.
In such a scenario, the dissipation wall (205) may be hydraulically
connected to a heat exchanger (not shown) disposed in the support
module (208) or at another location.
[0094] While illustrated in FIG. 2.2 as being a single wall, the
dissipation wall (205) may extend to any number of walls that bound
the internal volume (214) without departing from the invention.
Further, while illustrated as encompassing all of a side of a
rectangular volume, the dissipation wall (205) may only encompass a
portion of a wall (e.g., half of a wall) without departing from the
invention. Additionally, while the dissipation wall (205) is
illustrated in FIG. 2.2 as separating the payload module (210) from
the support module (208), the dissipation wall (205) may be
disposed on other walls that bound a portion of the internal volume
(214) without departing from the invention.
[0095] As discussed above, the second data processing device may
provide thermal management services to devices disposed within the
second data processing device. To do so, the second data processing
device may include a thermal management system (220).
[0096] The thermal management system (220) may dissipate thermal
energy from devices disposed within the internal volume (214). By
doing so, the thermal state of the devices may be managed (e.g.,
maintained within a predetermined temperature range). To do so, the
thermal management system (220) may (i) obtain thermal energy from
the devices, (ii) exchange the thermal energy with a gas flow to
heat the gas flow, and/or (iii) exhaust the heated gas flow from
the second data processing device.
[0097] The thermal management system (220) may obtain the thermal
energy from the devices via any method without departing from the
invention. To obtain the thermal energy, the thermal management
system (220) may utilize heat transfer mechanisms such as
conduction, convection, and/or radiation. For example, the thermal
management system (220) may include thermal buses between the
devices and the thermal management system (220) that facilitates
transport thermal energy from the devices to the thermal management
system (220). For additional details regarding thermal buses, refer
to FIG. 2.3.
[0098] The thermal management system (220) may exchange the thermal
energy with the gas flow via any method without departing from the
invention. For example, the thermal management system (220) may
include thermal exchangers that are disposed proximate to the gas
flow. Consequently, thermal energy obtained by the thermal
management system (220) may be exchanged with the gas flow.
[0099] The thermal management system (220) may exhaust the heated
gas flow from the second data processing device via any method
without departing from the invention. For example, the thermal
management system (220) may include gas flow controllers such as
fans that direct the heated gas flow out of the second data
processing device.
[0100] To manage the aforementioned process, the thermal management
system (220) may include a controller that may operate the flow
control devices and/or other components of the thermal management
system (220) based on temperature information obtained from the
temperature sensors and/or temperature information obtained from
other devices (e.g., from electromagnetic interference emitting
devices). For example, the controller may increase the flow rate of
a gas flow adjacent to thermal exchanges to manage the thermal
state of one or more devices within a predetermined range.
[0101] The second data processing device may also include a power
system (222). The power system may provide power to any number
and/or types of devices disposed within the second data processing
device. For example, the power system (222) may provide power to
electromagnetic interference emitting devices disposed within the
payload module (210), the thermal management system (220), a
communication system (224), and/or computing devices (e.g.,
226).
[0102] To do so, the power system (222) may include, for example,
one or more power supplies, regulators, controllers, and/or other
types of components for providing power. The aforementioned
components may identify components to which power is to be
supplied, identify a quantity of power to supply to each of the
components, and/or provide the power to each of the respective
components. As will be discussed in greater detail below, the power
system (222) may provide power using an interconnect (230).
[0103] The second data processing device may further include a
communication system (224). The communication system may provide
communication services to any number of devices of the second data
processing device.
[0104] To do so, the communication system (224) may include, for
example, one or more transceivers, communication processors, and/or
other types of components for providing communication services. The
aforementioned components may provide the communication services.
The communication services may include, for example, exchanging
network data units with electromagnetic interference emitting
devices disposed in the payload module, a computing device (226)
disposed in the support module (208), and/or other devices disposed
outside of the second data processing device. By doing so, the
aforementioned devices may communicate with one another via
information included in the exchanged network data units even when
electromagnetically isolated by being disposed within the internal
volume. A network data unit may be a communication supported by a
communication protocol that enables information to be transmitted.
A network data unit may be, for example, a packet in the vent that
an internet protocol is utilized. As will be discussed in greater
detail below, the communication system (224) may provide the
communication services using the interconnect (230).
[0105] The computing device (226) may manage the operation of the
components of the second data processing device. For example, the
computing device (226) may manage the thermal management system
(220), the power system (222), the communication system (224),
and/or other components (such as electromagnetic interference
emitting devices or other types of devices) disposed within the
second data processing device. To manage the other devices, the
computing device (226) may use the communication services provided
by the communication system (224) as well as the interconnect
(230).
[0106] The interconnect (230) may be a physical device for
providing operable connections between devices disposed within the
second data processing device. The interconnect (230) may support
distribution of power by the power system (222) to any number of
devices disposed within the payload module (210), the support
module (208), and/or other locations.
[0107] For example, the interconnect (230) may include a set of
wires that physically interconnects devices disposed within the
second data processing device.
[0108] In one or more embodiments of the invention, the
interconnect (230) facilitates distribution of power to
electromagnetic interference emitting devices disposed within the
payload module (210) while the electromagnetic interference
emitting devices are isolated. By doing so, the electromagnetic
interference emitting devices may be provided power without
negatively impacting the operation of other devices due to
electromagnetic interference generated by the electromagnetic
interference emitting devices.
[0109] To do so, the second data processing device may include a
backplane (232). The back-plane may electromagnetically isolate the
interconnect (230) from the internal volume of the payload module
(210). For example, the backplane (232) may be a metal sheet of
sufficient thickness to prevent electromagnetic interference from
penetrating through the backplane (232).
[0110] The backplane (232) may include any number of feedthroughs
(234). The feedthroughs (234) may be physical devices that enable
the interconnect (230) to physically connect to any number of
devices disposed within the payload module (210).
[0111] The interconnect (230) may also facilitate communications
between devices disposed in the internal volume (214) and other
devices while the devices disposed in the internal volume are
electromagnetically isolated while disposed in the internal volume.
For example, the interconnect (230) may include transmission lines
(e.g., coaxial lines, twisted pairs, etc.) that support high speed
communications. Such transmission lines may interconnect the
devices disposed in the internal volume (214) and the communication
system (224) disposed in the support module (208). Thus, while
electromagnetically isolated, the devices disposed in the internal
volume (214) may be operably connected to the communication system
(224) via physical connections and, in turn, operably connected to
any number of other devices via operable connections
(wired/wireless) between the communication system (224) and the
other devices.
[0112] While the second data processing device has been illustrated
as including a limited number of specific components in a specific
arrangement, a data processing device in accordance with
embodiments of the invention may include fewer, additional, and/or
different components disposed in a similar or different arrangement
without departing from the invention. For example, FIG. 3 shows
another diagram of a data processing device in accordance with
embodiments of the invention that has a substantially different
arrangement than that illustrated in FIG. 2.2.
[0113] To further clarify the operation of the second data
processing device, FIG. 2.3 shows a second cross section diagram,
similar to that of FIG. 2.2, but including a thermal bus (240), an
electromagnetic interference isolator (242), and a device
(246).
[0114] The thermal bus (240) may be a physical structure adapted to
facilitate transmission of thermal energy to a dissipation wall
(205). The thermal bus (240) may be formed from a thermally
conductive material such as brass, aluminum, or another thermal
conductor. The thermal bus (240) may have any shape. The shape of
the thermal bus (240) may be adapted to facilitate the transmission
of the thermal energy. The thermal energy may be generated by one
or more devices disposed in the internal volume (214).
[0115] The electromagnetic interference isolator (242) may be a
physical device for subdividing the internal volume (214) into any
number of portions (e.g., 244) and a thermal management portion
(245). Each of the portions of the internal volume may be
electromagnetically isolated from one another by the
electromagnetic interference isolator (242). Similarly, each of the
portions of the internal volume may be electromagnetically isolated
from the thermal management portion (245). For example, while the
internal volume (214) is illustrated as including a single
electromagnetic interference isolator (242), the internal volume
(214) may include multiple electromagnetic interference isolators
which subdivide the internal volume (214) into a corresponding
number of portions, within each of the electromagnetic interference
isolators, and the thermal management portion (245). The portion of
the internal volume (244) may be adapted to house devices (e.g.,
246) while the thermal management portion (245) may be adapted to
house other components such as a thermal bus (240) that may not
benefit from electromagnetic interference isolation provided by the
electromagnetic interference isolators (242).
[0116] In one or more embodiments of the invention, the
electromagnetic interference isolator (242) is a Faraday cage. For
example, electromagnetic interference isolator (242) may be a
plastic bag (or other suitable material) that is metallized. The
metallization disposed on the plastic bag may form the Faraday cage
that prevents electromagnetic radiation from propagating outside of
each of the portions of the internal volume (e.g., 244).
[0117] In one or more embodiments of the invention, the
electromagnetic interference isolator (242) is adapted to be
attached to one of the walls of the internal volume or another
structure that may complete the formation of a Faraday cage. For
example, electromagnetic interference isolator (242) may be adapted
to attach to the backplane (232, FIG. 2.2).
[0118] The electromagnetic interference isolator (242) may be
adapted to attach to one of the walls of the internal volume or
another structure and may be any mechanism without departing from
the invention. For example, electromagnetic interference isolator
(242) may include snaps, bolts, pins, zippers, or any other type of
physical interconnection mechanism. The aforementioned physical
interconnection mechanisms may be adapted to reversibly attach the
electromagnetic interference isolator (242) to other components of
the second data processing device.
[0119] As seen from FIG. 2.3, and the device (246) is disposed in
the portion of the internal volume (244), the device (246) may
physically connect to the interconnect (230, FIG. 2.2). By
physically connecting to the interconnect, the device (246) may
receive power and/or may communicate with the communication system
(224) via the interconnect.
[0120] To further clarify aspects of embodiments of the disclosed
technology, a third cross-section view of the second data
processing device in accordance with one or more embodiments of the
invention is shown in FIG. 2.4. FIG. 2.4 shows an expanded view of
FIG. 2.3 near the device (246).
[0121] As seen from FIG. 2.4, when the device (246) is disposed
within the electromagnetic interference isolator (242), the device
(246) may be physically isolated within the internal volume. When
operating, the device (246) may generate thermal energy. To provide
thermal management services to the device (246), the
electromagnetic interference isolator (242) may be thermally
coupled to the device (246), the thermal bus (240), and/or a
thermal sink (248). By being thermally coupled, thermal energy
generated by the device (246) may be transported to the thermal bus
(240). Consequently, the device (246) may be thermally managed by
dissipating the thermal energy generated by the device (246) via
the thermal bus (240).
[0122] To facilitate transport of thermal energy generated by the
device (246) into the thermal bus (240), the second data processing
device may include the thermal sink (248). In one or more
embodiments of the invention, the thermal sink (248) is a physical
device for facilitating thermal transport between the device (246)
and the thermal bus (240). For example, the thermal sink (248) may
be a heatsink disposed on the electromagnetic interference isolator
(242).
[0123] The thermal sink (248) may be, for example, a thermal
conductor such as a metal or another thermally conductive material.
The thermal sink (248) may be an active thermal transport device
without departing from the invention. For example, the thermal sink
(248) may be a Peltier cooler that is a cool side disposed on
electromagnetic interference isolator (242) and a hot side disposed
on the thermal bus (240).
[0124] The thermal sink (248) may have a shape that is
complementary to a shape of the device (246) such that the device
(246) may be disposed directly on the electromagnetic interference
isolator (242) which is, in turn, directly disposed on the thermal
sink (248). For example, the thermal sink (248) may have a shape
that is adapted to cradle a portion of the device (246).
[0125] Thus, the thermal sink (248) may facilitate and/or enhance
transport of thermal energy from the device (246) into the thermal
bus (240).
[0126] As noted above, when thermal energy is disposed in the
thermal bus (240), the thermal bus (240) may facilitate dissipation
of the thermal energy. For example, the thermal bus (240) may be a
thermally conductive material that facilitates thermal transport of
thermal energy to a dissipation wall.
[0127] The thermal bus (240) may be, for example, a thermal
conductor such as a metal or another thermally conductive material.
The thermal bus (240) may be an active thermal transport device
without departing from the invention. For example, the thermal bus
(240) may be a liquid cooling system that recirculates liquid
throughout the thermal bus (240) to facilitate thermal transport of
thermal energy away from the device (246).
[0128] In some embodiments of the invention, the thermal bus (240)
may include separate liquid lines associated with different
electromagnetic interference isolators. To modify a rate of thermal
transport of thermal energy away from devices disposed in each of
the respective electromagnetic interference isolators, the flow of
liquid corresponding in liquid lines associated with corresponding
electromagnetic interference isolators may be modified. Thus, the
rate of thermal transport of thermal energy for the devices
disposed in the internal volume may be managed on a granular (e.g.,
per device level) or macro (e.g., for all of the devices)
level.
[0129] In one or more embodiments of the invention, the device
(246) is an electromagnetic interference emitting device. All, or a
portion, of the electromagnetic interference emitted by the device
(246) may correspond to a wireless communication scheme employed by
the device (246). In some embodiments of the invention, it may be
preferred that the device (246) communicate, at least in part,
using the wireless communication scheme.
[0130] FIG. 2.5 shows a fourth cross-section view of the second
data processing device in accordance with one or more embodiments
of the invention. FIG. 2.5 shows a cross section similar to that of
FIG. 2.4 but includes a wireless system (256) and multiple
connectors (e.g., 252, 254).
[0131] The connectors (252, 254) may operably connect the device
(246) and the wireless system (256) to the interconnect (230). In
turn, the interconnect (230) may operably connect the device (246)
and the wireless system (256) to other components such as a power
system communication system, as discussed above.
[0132] The wireless system (256) may be a physical device for
facilitating the use of the wireless communication scheme employed
by the device (246). In one or more embodiments of the invention,
the wireless system (256) includes a wireless transceiver and
antenna adapted to facilitate communications between the device
(246) and a communication system. By doing so, the device (246) may
utilize its wireless communication scheme to operably connect to
any number of other devices via the wireless system (256) and/or
the communication system.
[0133] Thus, as illustrated in FIG. 2.5, a device (246) disposed
within the electromagnetic interference isolator (242) may be able
to communicate with other devices using its wireless communication
scheme while being electromagnetically isolated from the other
devices with which the device (246) communicates.
[0134] To further clarify aspects of embodiments of the invention,
a fifth cross-section diagram in accordance with one or more
embodiments of the invention is shown in FIG. 2.6. The fifth cross
section diagram may be similar to that illustrated in FIG. 2.3 but
includes multiple portions of the internal volume (262) delineated
by corresponding electromagnetic interference isolators. Devices
(260) may be disposed within each of the multiple portions of the
internal volume (262).
[0135] Each of the devices (260) may be thermally coupled to the
thermal bus (240). Similarly, each of the devices (260) may be
operably connected to the communication system (224). Thus, as
illustrated in FIG. 2.6, a data processing device in accordance
with embodiments of the invention may include an internal volume
(214) that is subdivided into any number of portions of the
internal volume (262) that are electromagnetically isolated from
each other. While the devices (260) are disposed in the portions of
the internal volume (262), the devices (260) may be operably
connected to each other and the communication system (224) while
being electromagnetically isolated from each other.
[0136] Additionally, each of the devices (260) may be thermally
coupled to the thermal bus (240). By being thermally coupled to the
thermal bus (240) thermal energy generated by the devices (260) may
be transported away from the devices (260) via the thermal bus
(240). For example, the thermal bus (240) may transport the thermal
energy generated by the devices (260) to a dissipation wall
(205).
[0137] The dissipation wall (205) may be thermally coupled to a
thermal management system (220). The thermal management system may
dissipate thermal energy obtained from the dissipation wall (205).
For example, the thermal management system (220) may use a gas flow
as illustrated by the arrow with a dashed tail to transport the
thermal energy obtained from the dissipation wall (205) into an
ambient environment surrounding the second data processing device.
Specifically, cool gas may be pulled into the support module (208),
across heat exchangers of the thermal management system (220), and
out of the support module (208).
[0138] However, a data processing device in accordance with
embodiments of the invention may be arranged in a different manner
to provide similar functionality. FIG. 3 shows a six cross-section
diagram in accordance with one or more embodiments of the
invention. In the sixth cross-section diagram, the arrangement of
the internal configuration of the second data processing device may
be different from that illustrated in FIG. 2.6.
[0139] As seen from FIG. 2.6, a gas flow channel (300) is made to
be disposed adjacent to the dissipation wall (205) that defines a
top wall of the internal volume (214). The thermal bus (240) may be
disposed between the dissipation wall (205) and electromagnetic
interference isolators that subdivide the internal volume (214)
into different portions for housing devices (260).
[0140] The gas flow channel (300) may facilitate a gas flow as
illustrated by the arrow having a dashed tail. The rate of the flow
of the gas flow may be controlled by the thermal management system
(220). Consequently, the rate of dissipation of thermal energy from
the dissipation wall (205) may be controlled by the thermal
management system (220) by modulating the rate of the gas flow.
[0141] The gas flow facilitated by the gas flow channel (300) may
be directed into the second data processing device from a first
side of the data processing device, through the gas flow channel
(300), through the support module (208), and out of a second side
of the data processing device proximate to the support module
(208). The aforementioned gas flow may be compatible with many
high-density computing environments that utilize gas intake on a
first side of data processing devices and gas exhaust on a second
side of the data processing devices.
[0142] As discussed above, embodiments of the invention may be
implemented using computing devices. FIG. 4 shows a diagram of a
computing device in accordance with one or more embodiments of the
invention. The computing device (400) may include one or more
computer processors (402), non-persistent storage (404) (e.g.,
volatile memory, such as random access memory (RAM), cache memory),
persistent storage (406) (e.g., a hard disk, an optical drive such
as a compact disk (CD) drive or digital versatile disk (DVD) drive,
a flash memory, etc.), a communication interface (412) (e.g.,
Bluetooth interface, infrared interface, network interface, optical
interface, etc.), input devices (410), output devices (408), and
numerous other elements (not shown) and functionalities. Each of
these components is described below.
[0143] In one embodiment of the invention, the computer
processor(s) (402) may be an integrated circuit for processing
instructions. For example, the computer processor(s) may be one or
more cores or micro-cores of a processor. The computing device
(400) may also include one or more input devices (410), such as a
touchscreen, keyboard, mouse, microphone, touchpad, electronic pen,
or any other type of input device. Further, the communication
interface (412) may include an integrated circuit for connecting
the computing device (400) to a network (not shown) (e.g., a local
area network (LAN), a wide area network (WAN) such as the Internet,
mobile network, or any other type of network) and/or to another
device, such as another computing device.
[0144] In one embodiment of the invention, the computing device
(400) may include one or more output devices (408), such as a
screen (e.g., a liquid crystal display (LCD), a plasma display,
touchscreen, cathode ray tube (CRT) monitor, projector, or other
display device), a printer, external storage, or any other output
device. One or more of the output devices may be the same or
different from the input device(s). The input and output device(s)
may be locally or remotely connected to the computer processor(s)
(402), non-persistent storage (404), and persistent storage (406).
Many different types of computing devices exist, and the
aforementioned input and output device(s) may take other forms.
[0145] Embodiments of the invention may provide a method, system,
and device for managing electromagnetic interference and thermal
energy. A system in accordance with embodiments of the invention
may manage electromagnetic interference at a device level. That is,
each device may be electromagnetically isolated from other devices
and an ambient environment surrounding the devices. By doing so,
such data processing devices that house any number of devices may
be used in a high-density environment without negatively impacting
the functionality of the high-density environment due to
electromagnetic interference.
[0146] Additionally, embodiments of the invention may provide a
method for managing the generation of thermal energy by devices
that also emit electromagnetic interference. Specifically,
embodiments of the invention may provide a method for extracting
thermal energy from devices while maintaining electromagnetic
isolation of the devices. By doing so, such devices may be utilized
in a high density environment without negatively impacting the
operation of the devices due to thermal energy buildup (and
potential thermal failure due to the thermal energy buildup).
[0147] Thus, embodiments of the invention may address the problem
of management of electromagnetic interference within a high-density
environment. Specifically, embodiments of the invention may provide
a solution that facilitates granular electromagnetic isolation of
devices within a high-density environment while also facilitating
extraction of thermal energy from the devices.
[0148] The problems discussed above should be understood as being
examples of problems solved by embodiments of the invention
disclosed herein and the invention should not be limited to solving
the same/similar problems. The disclosed invention is broadly
applicable to address a range of problems beyond those discussed
herein.
[0149] One or more embodiments of the invention may be implemented
using instructions executed by one or more processors of the data
management device. Further, such instructions may correspond to
computer readable instructions that are stored on one or more
non-transitory computer readable mediums.
[0150] While the invention has been described above with respect to
a limited number of embodiments, those skilled in the art, having
the benefit of this disclosure, will appreciate that other
embodiments can be devised which do not depart from the scope of
the invention as disclosed herein. Accordingly, the scope of the
invention should be limited only by the attached claims.
* * * * *