U.S. patent application number 16/507033 was filed with the patent office on 2021-01-14 for cushion structure for stopping temperature conduction.
The applicant listed for this patent is Tsung Hsi Liu. Invention is credited to Tsung Hsi Liu.
Application Number | 20210007504 16/507033 |
Document ID | / |
Family ID | 1000004241646 |
Filed Date | 2021-01-14 |
United States Patent
Application |
20210007504 |
Kind Code |
A1 |
Liu; Tsung Hsi |
January 14, 2021 |
CUSHION STRUCTURE FOR STOPPING TEMPERATURE CONDUCTION
Abstract
A cushion structure for stopping temperature conduction
contains: a covering layer which is hollow, a first body
accommodated in an upper portion of the covering layer, a second
body accommodated below the first body, and a gluing layer defined
between the first body and the second body. The gluing layer is
configured to adhere the first body with the second body so as to
stop air flowing into the cushion structure and to prevent a
temperature of the second body conducting to the first body via the
air. Thereby, when the cushion structure is fixed on a ground, a
temperature conduction of the ground is stopped below the gluing
layer and does not pass upward via the air, thus stopping the
temperature conduction effectively.
Inventors: |
Liu; Tsung Hsi; (Yilan
County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Liu; Tsung Hsi |
Yilan County |
|
TW |
|
|
Family ID: |
1000004241646 |
Appl. No.: |
16/507033 |
Filed: |
July 10, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A47C 27/081 20130101;
A47C 27/088 20130101; A47C 27/18 20130101 |
International
Class: |
A47C 27/08 20060101
A47C027/08 |
Claims
1. A cushion structure for stopping temperature conduction
comprising: a covering layer which is hollow, a first body
accommodated in an upper portion of the covering layer, a second
body accommodated below the first body, and a gluing layer defined
between the first body and the second body; wherein the gluing
layer is configured to adhere the first body with the second body
so as to stop air flowing into the cushion structure, and wherein
each of the first body and the second body has a plurality of
protrusions, and each of the protrusions is approximately formed in
hemispherical shape.
2. The cushion structure as claimed in claim 1, wherein the
covering layer is made of air-impermeable material.
3. The cushion structure as claimed in claim 1, wherein the first
body and the second body are made of polyurethane (PU) foaming
material.
4. The cushion structure as claimed in claim 1, wherein a top of
the first body is wavy.
5. The cushion structure as claimed in claim 1, wherein a bottom of
the second body is wavy.
6. The cushion structure as claimed in claim 1, wherein an airbag
portion is accommodated in the cushion structure so as to inflate
or discharge the air into or out of the cushion structure.
7. The cushion structure as claimed in claim 2, wherein an airbag
portion is accommodated in the cushion structure so as to inflate
or discharge the air into or out of the cushion structure.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a cushion structure which
prevents a temperature of a second body conducting to a first body
via air.
BACKGROUND OF THE INVENTION
[0002] A conventional cushion structure is arranged in a sleeping
pad or an inflatable bed so as to stop a temperature of a ground
conducting to user's body and to enhance using comfort.
[0003] However, the temperature of the ground cannot be stopped by
the conventional cushion structure effectively.
[0004] The present invention has arisen to mitigate and/or obviate
the afore-described disadvantages.
SUMMARY OF THE INVENTION
[0005] The primary aspect of the present invention is to provide a
cushion structure for stopping temperature conduction which
prevents a temperature of a second body conducting to a first body
via air.
[0006] Further aspect of the present invention is to provide a
cushion structure for stopping temperature conduction which stops a
temperature conduction of the ground below the gluing layer, and
the temperature conduction does not pass upward via the air, thus
stopping the temperature conduction effectively.
[0007] Another aspect of the present invention is to provide a
cushion structure for stopping temperature conduction which
enhances using comfort of the cushion structure by using an airbag
portion accommodated in the cushion structure.
[0008] To obtain above-mentioned aspects, a cushion structure for
stopping temperature provided by the present invention contains: a
covering layer which is hollow, a first body accommodated in an
upper portion of the covering layer, a second body accommodated
below the first body, and a gluing layer defined between the first
body and the second body.
[0009] The gluing layer is configured to adhere the first body with
the second body so as to stop air flowing into the cushion
structure.
[0010] Preferably, the covering layer is made of air-impermeable
material.
[0011] Preferably, the first body and the second body are made of
polyurethane (PU) foaming material.
[0012] Preferably, a top of the first body is wavy.
[0013] Preferably, a bottom of the second body is wavy.
[0014] Preferably, an airbag portion is accommodated in the cushion
structure so as to inflate or discharge the air into or out of the
cushion structure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 is a perspective view showing the assembly of a
cushion structure for stopping temperature conduction according to
a preferred embodiment of the present invention.
[0016] FIG. 2 is a cross sectional view showing the assembly of the
cushion structure for stopping temperature conduction according to
the preferred embodiment of the present invention.
[0017] FIG. 3 is an amplified cross-sectional view showing the
assembly of the cushion structure for stopping temperature
conduction according to the preferred embodiment of the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] With reference to FIGS. 1-3, a cushion structure for
stopping temperature conduction according to a preferred embodiment
of the present invention comprises: a covering layer 1 which is
hollow, a first body 2 accommodated in an upper portion of the
covering layer 1, a second body 3 accommodated below the first body
2, and a gluing layer 4 defined between the first body 2 and the
second body 3, wherein the gluing layer 4 is configured to adhere
the first body 2 with the second body 3 so as to stop air flowing
into the cushion structure.
[0019] The covering layer 1 is made of air-impermeable material,
and the first body 2 and the second body 3 are made of polyurethane
(PU) foaming material. The covering layer 1 is configured to stop
the temperature conduction, and the first body 2 and the second
body 3 are applied to stop the temperature conduction further.
Preferably, the gluing layer 4 is defined between the first body 2
and the second body 3, and the gluing layer 4 is configured to
adhere the first body 2 with the second body 3 so as to stop the
air flowing into the cushion structure and to prevent a temperature
of the second body 3 conducting to the first body 2 via the air.
Thereby, when the cushion structure is fixed on a ground, a
temperature conduction of the ground is stopped below the gluing
layer 4 and does not pass upward via the air, thus stopping the
temperature conduction effectively.
[0020] In another embodiment, a top of the first body 2 and a
bottom of the second body 3 are wavy so as to decrease a weight of
the cushion structure, thus carrying the cushion structure
easily.
[0021] To enhance using comfort of the cushion structure, an airbag
portion is accommodated in the cushion structure so as to inflate
or discharge the air into or out of the cushion structure.
[0022] While the preferred embodiments of the invention have been
set forth for the purpose of disclosure, modifications of the
disclosed embodiments of the invention as well as other embodiments
thereof may occur to those skilled in the art. Accordingly, the
appended claims are intended to cover all embodiments which do not
depart from the spirit and scope of the invention.
* * * * *