U.S. patent application number 17/025224 was filed with the patent office on 2021-01-07 for localized panel stiffener.
The applicant listed for this patent is Zephyros, Inc.. Invention is credited to Mark Coldren, David Kosal, Keith Madaus, Dean Quaderer.
Application Number | 20210001600 17/025224 |
Document ID | / |
Family ID | |
Filed Date | 2021-01-07 |
United States Patent
Application |
20210001600 |
Kind Code |
A1 |
Madaus; Keith ; et
al. |
January 7, 2021 |
LOCALIZED PANEL STIFFENER
Abstract
A device (10) comprising a carrier material (14) and a matrix
material (12) deposited onto the carrier material in a pattern that
leaves a predetermined amount of space (18) between each deposition
of matrix material.
Inventors: |
Madaus; Keith; (Richmond,
MI) ; Kosal; David; (Richmond, MI) ; Quaderer;
Dean; (Livonia, MI) ; Coldren; Mark; (West
Bloomfield, MI) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Zephyros, Inc. |
Romeo |
MI |
US |
|
|
Appl. No.: |
17/025224 |
Filed: |
September 18, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15573334 |
Nov 10, 2017 |
10780672 |
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PCT/US2016/032710 |
May 16, 2016 |
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17025224 |
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62161523 |
May 14, 2015 |
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62164224 |
May 20, 2015 |
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Current U.S.
Class: |
1/1 |
International
Class: |
B32B 7/02 20060101
B32B007/02; B32B 5/02 20060101 B32B005/02; B32B 7/14 20060101
B32B007/14; B32B 15/18 20060101 B32B015/18; B29C 65/46 20060101
B29C065/46; B29C 65/00 20060101 B29C065/00; B29C 65/02 20060101
B29C065/02; B29C 65/14 20060101 B29C065/14; B32B 15/14 20060101
B32B015/14; B32B 15/02 20060101 B32B015/02; B32B 15/20 20060101
B32B015/20; B32B 7/12 20060101 B32B007/12; B60R 13/00 20060101
B60R013/00; B32B 15/04 20060101 B32B015/04; B29C 70/00 20060101
B29C070/00; B29C 70/74 20060101 B29C070/74; B32B 3/16 20060101
B32B003/16; B32B 3/18 20060101 B32B003/18; B32B 15/085 20060101
B32B015/085 |
Claims
1. A device comprising: a carrier material; and a matrix material
deposited onto the carrier material in a pattern that leaves a
predetermined amount of space between each deposition of matrix
material.
2. The device of claim 1, wherein each deposition of matrix
material is about 0.5 mm or more in diameter and about 10 mm or
less in diameter.
3. The device of claim 1, wherein the device is capable of bending
without breaking.
4. The device of claim 1, wherein the device will bend under its
own weight when held at its end.
5. The device of claim 1, wherein the matrix material is an
activatable material and the volumetric activation of the matrix
material is at least about 100% and less than about 300%.
6. The device of claim 1, wherein the matrix material includes a
structural adhesive material.
7. The device of claim 1, wherein the matrix material includes a
sealant material.
8. The device of claim 1, wherein each deposition of matrix
material is about 1 mm or more in diameter and about 4 mm in
diameter or less.
9. The device of claim 1, wherein the carrier is free of any sharp
corners and includes only rounded corners.
10. The device of claim 1, wherein the predetermined amount of
space between each deposition of matrix material is at least about
0.5 mm, at least about 1 mm, at least about 2 mm or even at least
about 5 mm.
11. The device of claim 1, including an elastic material deposited
onto the carrier material in a pattern that leaves a predetermined
amount of space between each deposition of elastic material.
12. The device of claim 11, wherein the matrix material and the
elastic material are deposited in an alternating pattern onto the
carrier.
13. The device of claim 1, wherein the matrix material is deposited
onto only one surface of the carrier.
14. The device of claim 1, wherein the carrier is substantially
free of any film material.
15. A device comprising: a carrier material; and a matrix material
deposited onto the carrier material and intended for direct contact
with a sheet metal surface, wherein the coefficient of thermal
expansion of the matrix material is substantially the same as the
coefficient of thermal expansion of the sheet metal.
16. The device of claim 15, wherein the sheet metal is steel.
17. The device of claim 15, wherein the coefficient of thermal
expansion is at least about 5.times.10.sup.-6 m/mK.
18. The device of claim 15, wherein the coefficient of thermal
expansion is at least about 10.times.10.sup.-6 m/mK.
19. The device of claim 15, wherein the matrix material is
deposited onto only one surface of the carrier.
20. The device of claim 15, wherein the carrier is substantially
free of any film material.
Description
TECHNICAL FIELD
[0001] The present teachings relate generally to a reinforcement
member that includes a matrix material and a carrier material.
BACKGROUND
[0002] The automotive industry is emphasizing efforts to reduce
overall vehicle weight in order to obtain improved fuel efficiency.
One common way to reduce vehicle weight is to reduce the thickness
of the sheet metal. Frequently, the areas of the vehicle that form
vehicle closures will be made with a thinner gauge metal. These
vehicle closures include doors, trunks, hoods and liftgates. One
area of particular interest is with vehicle doors. The thickness of
the metal used for doors is sufficiently thin such that it is
highly susceptible to buckling from even the smallest amounts of
pressure. To prevent such buckling, localized stiffness in selected
areas of the door is increased by the use of thermosetting panel
stiffeners. These panel stiffeners are typically glass reinforced
with an epoxy matrix. However, as the gauge of metal continues to
thin, these typical panel stiffeners are causing the thin metal to
deform (commonly referred to as read-through). Therefore there is a
need for an improved panel stiffener that provides stiffness to
thin sheet metal yet does not result in deformation of the
metal.
SUMMARY OF THE INVENTION
[0003] In a first aspect the present teachings contemplate a device
comprising a carrier material and a matrix material deposited onto
the carrier material in a pattern that leaves a predetermined
amount of space between each deposition of matrix material.
[0004] Each deposition of matrix material may be at least about 0.5
mm in diameter and less than about 10 mm in diameter. The device
may be flexible (e.g., capable of easily bending without breaking).
The device may bend under its own weight when held at its end. The
matrix material may be an activatable material and the volumetric
activation of the matrix material is at least about 100% and less
than about 300%. The matrix material may include a structural
adhesive material. The matrix material may include a sealant
material. Each deposition of matrix material may be at least about
1 mm in diameter and less than about 4 mm in diameter. The carrier
may be free of any sharp corners and includes only rounded corners.
The predetermined amount of space between each deposition of matrix
material may be at least about 0.5 mm, at least about 1 mm, at
least about 2 mm or even at least about 5 mm. The device may
include an elastic material deposited onto the carrier material in
a pattern that leaves a predetermined amount of space between each
deposition of elastic material. The matrix material and the elastic
material may be deposited in an alternating pattern onto the
carrier.
[0005] The teachings herein further provide for a device comprising
a carrier material and a matrix material deposited onto the carrier
material and intended for direct contact with a sheet metal
surface, wherein the coefficient of thermal expansion of the matrix
material is substantially the same as the coefficient of thermal
expansion of the sheet metal.
[0006] The sheet metal may be steel. The coefficient of thermal
expansion may be at least about 5.times.10.sup.-6 m/mK. The
coefficient of thermal expansion may be at least about
10.times.10.sup.-6 m/mK.
[0007] The teachings herein contemplate a device for the structural
reinforcement of body stampings with a matrix material and
associated carrier, whereby the matrix material is deposited in a
pattern with spaces in between the depositions of matrix material.
The device disclosed herein may allow for effective reinforcing of
a panel while producing substantially no deformation of the
panel.
DESCRIPTION OF THE DRAWINGS
[0008] FIG. 1 shows a top-down view of an illustrative example of a
device in accordance with the present teachings.
[0009] FIG. 2 shows a top-down view of an illustrative example of a
device in accordance with the present teachings.
[0010] FIG. 3 shows a top-down view of an illustrative example of a
device in accordance with the present teachings.
[0011] FIG. 4 shows a top-down view of an illustrative example of a
device in accordance with the present teachings.
[0012] FIG. 5 shows a top-down view of an illustrative example of a
device in accordance with the present teachings.
DETAILED DESCRIPTION
[0013] The explanations and illustrations presented herein are
intended to acquaint others skilled in the art with the teachings,
its principles, and its practical application. Those skilled in the
art may adapt and apply the teachings in its numerous forms, as may
be best suited to the requirements of a particular use.
Accordingly, the specific embodiments of the present teachings as
set forth are not intended as being exhaustive or limiting of the
teachings. The scope of the teachings should, therefore, be
determined not with reference to the above description, but should
instead be determined with reference to the appended claims, along
with the full scope of equivalents to which such claims are
entitled. The disclosures of all articles and references, including
patent applications and publications, are incorporated by reference
for all purposes. Other combinations are also possible as will be
gleaned from the following claims, which are also hereby
incorporated by reference into this written description.
[0014] This application claims the benefit of the filing date of
U.S. Provisional Application No. 62/161,523, filed May 14, 2015;
and U.S. Provisional Application No. 62/164,224, filed May 20,
2015, the contents of these applications being hereby incorporated
by reference for all purposes.
[0015] The devices described herein include a carrier and a matrix
material deposited thereon. The nature of both the carrier and the
matrix material are such that they can be easily applied to a very
thin gauge metal part while avoiding read-through on the surface
(e.g., a class-A surface) of the metal part. The spaces in between
the depositions of matrix material are integral to avoiding
read-through, in that if the matrix material were to be applied as
a full sheet onto a thin gauge metal part (e.g., in a constant
sheet with no spaces in between) the activation of the matrix
material would likely result in read-through.
[0016] The matrix material may be located onto only one surface of
the carrier. The device may thus be incapable of bonding two
surfaces together. The device may be formed as a patch for
providing localized stiffness to a metallic panel.
[0017] The matrix material may be located onto the carrier in any
shape or pattern such that predetermined spaces exist between each
deposition of matrix material. The matrix material may be deposited
in plots, which may have rounded edges. The sizes of the plots may
be consistent or may vary along the carrier. The matrix material
may be deposited in strips, where the distance between each strip
may be consistent oalong the carrier. Alternatively, the distance
between each strip may be vary along the carrier. The strips may
all be deposited in one direction such that the strips run parallel
to one another. The strips may be deposited such that a first strip
may be located in a skew or even a perpendicular relationship with
a second strip. The carrier may include a single deposition of
matrix material or a plurality of depositions of matrix
material.
[0018] The matrix material of the present invention may be an
epoxy-based material and may be activatable to form an epoxy-based
adhesive material upon activation. The matrix material may be at
least partially tacky at room temperature (e.g., about 23.degree.
C.) and may also be tacky at temperatures between about 0.degree.
C. and about 80.degree. C. The matrix material may alternatively be
dry to the touch at room temperature. Additionally, the matrix
material preferably exhibits reinforcement characteristics (e.g.,
imparts rigidity, stiffness, strength or a combination thereof to a
member upon which it is located). It is also preferable for the
matrix material to be activated (by heat, UV light, induction
heating, or the like) to expand or otherwise activate and wet
surfaces which the matrix material contacts. After activation
(which may or may not include expansion), the matrix material
preferably cures, hardens and adheres to the surfaces that it
contacts. For application purposes, it is often preferable that the
matrix material exhibit flexibility, particularly when the matrix
material is to be applied to a contoured surface of a vehicle body.
Once applied, however, it is typically preferable for the matrix
material to be activatable to soften, expand (e.g., foam), cure,
harden or a combination thereof. For example, and without
limitation, a typical matrix material will include a polymeric
material, such as an epoxy resin or ethylene-based polymer which,
when compounded with appropriate ingredients (typically a blowing
and curing agent), expands and cures in a reliable and predicable
manner upon the application of heat or the occurrence of a
particular ambient condition. From a chemical standpoint for a
thermally-activated material, the matrix material may be initially
processed as a flowable material before curing. Thereafter, the
material preferably cross-links upon curing, which makes the
material substantially incapable of further flow.
[0019] The epoxy may be aliphatic, cycloaliphatic, aromatic or the
like. The epoxy may be supplied as a solid (e.g., as pellets,
chunks, pieces or the like) or a liquid. The epoxy may include an
ethylene copolymer or terpolymer that may possess an alpha-olefin.
As a copolymer or terpolymer, the polymer is composed of two or
three different monomers, i.e., small molecules with high chemical
reactivity that are capable of linking up with similar molecules.
One exemplary epoxy resin may be a phenolic resin, which may be a
novalac type or other type resin. Other preferred epoxy containing
materials may include a bisphenol-A epichlorohydrin ether polymer,
or a bisphenol-A epoxy resin which may be modified with butadiene
or another polymeric additive. Examples of suitable epoxy-based
materials, which may be used as in the matrix material are sold
under the product designations L5020, L5010, L5224, L8000, L5001
and are commercially available from L&L Products, Romeo, Mich.
According to preferred formulations, the base material can include
up to about 50% by weight epoxy resins, more preferably, up to
about 65% by weight epoxy resins, and even more preferably up to
about 80% by weight epoxy resins.
[0020] Advantageously, the matrix material of the present invention
may be formed or otherwise processed in a variety of ways. For
example, preferred matrix materials can be processed by injection
molding, extrusion, compression molding or with a robotically
controlled extruder such as a mini-applicator. A controlled
extruder may allow for precise placement of one or more of the
matrix material and elastic material.
[0021] The elastic material may be a material that provides
vibration damping to the sheet metal. The elastic material may also
be an activatable and may be capable of expansion, similar to the
matrix material.
[0022] The matrix material and/or the elastic material may be
formulated to have a desired coefficient of thermal expansion. This
coefficient of thermal expansion may be selected so that it is
similar to that of a metal to which the matrix material will be
applied during use of the device. A filler material may be
specifically selected to assist in matching the coefficient of
thermal expansion of the matrix material to that of the sheet
metal.
[0023] The carrier material for receiving the matrix material may
be a glass material (e.g., a fiberglass material), which may be a
glass mesh material. The carrier may include non-conductive threads
or wire (e.g., elongated filament, fibrous, or fabric material),
which may be applied as a mat, a cloth, a roving, a netting, a
mesh, a scrim, or the like. In such embodiments, the carrier
material may be composed, for example, of woven or unwoven fibers,
filaments or the like of cotton, glass (e.g., E-glass or S-glass),
fiberglass, Mylar, nylon, polyester, carbon, aramid, plastics,
polymers (e.g., thermoplastics such as polyamides (e.g., nylon),
PET (e.g., Mylar), polycarbonate, polyethylene, polypropylene,
polybutylene (e.g., polybutylene terephthalate), polystyrene,
polyurethane, vinyl, or any combination thereof, or other
materials. As used herein, "threads," or "wire" connotes a single
filament of material, a braided bundle of filaments, or an
unbraided bundle of filaments. The carrier material may be
aluminum. The carrier may comprise a metallic material. The carrier
may be substantially thicker than any film material. The carrier
may be free of any film material. The carrier may be substantially
rigid or may have a minimal amount of flexibility. The carrier may
be less flexible than a film material.
[0024] In other applications, it may appreciable that the mesh
material may be bead-like particles, aggregates, hollow material
(e.g., hollow particle), or otherwise, or any combination thereof.
In such embodiments, the strengthening material may be composed,
for example, of particles or the like of glass (e.g., E-glass or
S-glass), fiberglass, nylon, polyester, carbon, aramid, plastics,
polymers (e.g., thermoplastics such as polyamides (e.g., nylon),
polycarbonate, polyethylene, polypropylene, polybutylene (e.g.,
polybutylene terephthalate), polystyrene, polyurethane, vinyl, or
any combination thereof), or other materials.
[0025] FIG. 1 shows the device 10 having a matrix material 12. A
carrier 14 is located in planar contact with the matrix material
layer 12. The carrier 14 and matrix material 12 are formed having
curved corners 16.
[0026] FIG. 2 shows the device 10 including a carrier 14 having a
plurality of portions of matrix material 12 deposited onto the
carrier. A plurality of spaces 18 are located in between the matrix
material 12.
[0027] FIG. 3 shows the device 10 including a carrier 14 having a
plurality of portions of matrix material 12 deposited onto the
carrier and also a plurality of portions of elastic material 20
deposited onto the carrier. A plurality of spaces 18 are located in
between the matrix material 12 and the elastic material 20.
[0028] FIG. 4 shows the device 10 including a carrier 14 having a
plurality of portions of matrix material 12 deposited onto the
carrier. A plurality of spaces 18 are located in between the matrix
material 12.
[0029] FIG. 5 shows the device 10 including a carrier 14 having a
plurality of portions of matrix material 12 deposited in
substantially straight lines onto the carrier. A plurality of
spaces 18 are located in between the matrix material 12.
[0030] The devices disclosed herein provide added stiffness for
thin gauge metal panels without the issues related to read-through.
Read-through issues are substantially avoided by providing spaces
in between depositions of activatable material. Issues are further
avoided by providing carriers with curved edges (e.g., carriers
that are substantially free of any corners having right (or near
right angles). The devices are preferably formed having matrix
material on only one surface of the carrier. The depositions of
matrix material may be substantially less than full coverage of a
carrier.
[0031] Any numerical values recited herein include all values from
the lower value to the upper value in increments of one unit
provided that there is a separation of at least 2 units between any
lower value and any higher value. As an example, if it is stated
that the amount of a component or a value of a process variable
such as, for example, temperature, pressure, time and the like is,
for example, from 1 to 90, preferably from 20 to 80, more
preferably from 30 to 70, it is intended that values such as 15 to
85, 22 to 68, 43 to 51, 30 to 32 etc. are expressly enumerated in
this specification. For values which are less than one, one unit is
considered to be 0.0001, 0.001, 0.01 or 0.1 as appropriate. These
are only examples of what is specifically intended and all possible
combinations of numerical values between the lowest value and the
highest value enumerated are to be considered to be expressly
stated in this application in a similar manner. As can be seen, the
teaching of amounts expressed as "parts by weight" herein also
contemplates the same ranges expressed in terms of percent by
weight. Thus, an expression in the Detailed Description of the
Invention of a range in terms of at "`x` parts by weight of the
resulting polymeric blend composition" also contemplates a teaching
of ranges of same recited amount of "x" in percent by weight of the
resulting polymeric blend composition."
[0032] Unless otherwise stated, all ranges include both endpoints
and all numbers between the endpoints. The use of "about" or
"approximately" in connection with a range applies to both ends of
the range. Thus, "about 20 to 30" is intended to cover "about 20 to
about 30", inclusive of at least the specified endpoints.
[0033] The disclosures of all articles and references, including
patent applications and publications, are incorporated by reference
for all purposes. The term "consisting essentially of" to describe
a combination shall include the elements, ingredients, components
or steps identified, and such other elements ingredients,
components or steps that do not materially affect the basic and
novel characteristics of the combination. The use of the terms
"comprising" or "including" to describe combinations of elements,
ingredients, components or steps herein also contemplates
embodiments that consist essentially of the elements, ingredients,
components or steps. By use of the term "may" herein, it is
intended that any described attributes that "may" be included are
optional.
[0034] Plural elements, ingredients, components or steps can be
provided by a single integrated element, ingredient, component or
step. Alternatively, a single integrated element, ingredient,
component or step might be divided into separate plural elements,
ingredients, components or steps. The disclosure of "a" or "one" to
describe an element, ingredient, component or step is not intended
to foreclose additional elements, ingredients, components or
steps.
[0035] It is understood that the above description is intended to
be illustrative and not restrictive. Many embodiments as well as
many applications besides the examples provided will be apparent to
those of skill in the art upon reading the above description. The
scope of the invention should, therefore, be determined not with
reference to the above description, but should instead be
determined with reference to the appended claims, along with the
full scope of equivalents to which such claims are entitled. The
disclosures of all articles and references, including patent
applications and publications, are incorporated by reference for
all purposes. The omission in the following claims of any aspect of
subject matter that is disclosed herein is not a disclaimer of such
subject matter, nor should it be regarded that the inventors did
not consider such subject matter to be part of the disclosed
inventive subject matter.
* * * * *